Multi - processing machine

Abstract

A combined processing machine according to the present invention is provided with: a holding section capable of holding a workpiece; a removal processing section that performs removal processing on the workpiece held by the holding section and that is capable of performing hard material removal processing; an additional manufacturing section that deposits a hard material on a surface of the workpiece held by the holding section by supplying the hard material to the surface and melting the hard material; and a control unit that controls the combined processing machine. The control unit controls the additional manufacturing section to form an additional part made of the hard material on the surface of the workpiece held by the holding section, and controls the removal processing section to cause removal processing to be performed on the additional part formed on the workpiece held by the holding section.

Description

Technical Field

[0001] The present disclosure relates to a composite processing machine.

Background Art

[0002] In the technology of Patent Document 1, build-up processing by laser metal deposition (LMD) is performed on a cylindrical base material, and the formed build-up portion is ground. As a result, a hard metal film composed of tungsten carbide or chromium is formed on the surface of the cylindrical base material.

[0003] Grinding of the hard metal coating is not easy. For this reason, conventionally, a dedicated grinding machine has been used for grinding the hard metal coating. In the technology of Patent Document 1, the following processes are executed in order. A cylindrical base material is attached to an apparatus that executes LMD. While the cylindrical base material is rotated, LMD is executed on the base material. The cylindrical base material is removed from the apparatus that executes LMD. The cylindrical base material is attached to a dedicated grinding machine for grinding the hard metal coating. In the grinding machine, while the cylindrical base material is rotated, grinding is performed on the surface of the build-up portion of the base material.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the above-described technology, the base material is attached to the apparatus that executes LMD, removed from the apparatus that executes LMD, and attached to a dedicated grinding machine. Therefore, during this period, transportation of the base material between the processing apparatuses and setup work are required. Thus, the process of forming an additional part on the surface of the workpiece and shaping the additional part by removal processing cannot be efficiently performed.

Means for Solving the Problem

[0006] The present disclosure can be realized in the following forms.

[0007] (1) According to one aspect of the present disclosure, a composite processing machine is provided. This composite processing machine includes a holding unit capable of holding a workpiece, a removal processing unit that performs removal processing on the workpiece held by the holding unit, the removal processing unit being capable of performing removal processing of a hard material, and an additive manufacturing unit that adheres the hard material to the surface of the workpiece held by the holding unit by melting the hard material while supplying the hard material to the surface, and a control unit that controls the composite processing machine. The control unit controls the additive manufacturing unit to form an additional part made of the hard material on the surface of the workpiece held by the holding unit, and controls the removal processing unit to perform removal processing on the additional part formed on the workpiece held by the holding unit. With such an aspect, it is possible to form an additional part of a hard material on the surface of the workpiece and perform removal processing on the additional part without removing and reattaching the workpiece. For this reason, compared with an aspect in which the formation of the additional part on the surface of the workpiece and the removal processing on the additional part are performed by different apparatuses, the process of forming an additional part on the surface of the workpiece and shaping the additional part by removal processing can be efficiently performed. (2) In the composite processing machine of the above-described embodiment, the additive manufacturing unit includes a material supply unit that supplies cemented carbide powder as the hard material, a first beam irradiation unit that irradiates a first light beam for melting the cemented carbide powder, and a second beam irradiation unit that irradiates a second light beam. The control unit controls the additive manufacturing unit to supply the powder to the material supply unit and irradiate the first light beam toward the powder by the first beam irradiation unit, thereby adhering the melted cemented carbide to the surface as the added portion. By irradiating the second light beam toward the melted cemented carbide by the second beam irradiation unit, the rate of temperature decrease of the melted cemented carbide can be reduced. With such an embodiment, it is possible to reduce the possibility of thermal cracking occurring in the added portion formed on the workpiece as compared with an embodiment in which the second light beam is not irradiated toward the melted cemented carbide. (3) In the composite processing machine of the above-described embodiment, the control unit controls the additive manufacturing unit to irradiate the second light beam toward the melted cemented carbide by the second beam irradiation unit, so that the rate of decrease is maintained at 540 °C / second or less. With such an embodiment, an added portion of cemented carbide can be formed on the surface of the workpiece without causing thermal cracking in the added portion formed on the workpiece, and machining for removing the added portion can be performed on the added portion. An added portion with high shape accuracy made of cemented carbide can be formed on the surface of the workpiece. (4) In the composite processing machine of the above-described embodiment, an added layer as the added portion is formed by adhering the hard material to the surface of the workpiece held by the holding unit. The machining unit for removing includes a grinding wheel, and grinding is performed by bringing the grinding wheel into contact with the workpiece held by the holding unit while rotating the grinding wheel. With such an embodiment, by performing grinding on the formed added layer, an added layer with high shape accuracy can be formed on the surface of the workpiece. (5) In the composite processing machine of the above-described embodiment, the control unit may be configured to control the additive manufacturing unit to form the additive layer on the surface of the workpiece with a thickness that can withstand the removal processing by the removal processing unit. With such an embodiment, it is not necessary to prepare a workpiece having a hardness such that the additive layer can support it in the removal processing. Therefore, as the workpiece, it is possible to prepare a workpiece having a hardness along with the purpose of use of the workpiece regardless of the content of the removal processing in the manufacturing process. (6) In the composite processing machine of the above-described embodiment, the control unit may be configured to control the additive manufacturing unit to form the additive layer on the surface of the workpiece with a thickness that can withstand the assumed value of the maximum load when the workpiece is used as a product. With such an embodiment, it is not necessary to prepare a workpiece having a hardness such that the additive layer can support it when the workpiece is used as a product and receives a load. Therefore, as the workpiece, it is possible to prepare a workpiece having a hardness along with the purpose of use of the workpiece. (7) In the composite processing machine of the above-described embodiment, the control unit may be configured not to perform heat treatment of the workpiece before the removal processing of the additive layer. With such an embodiment, the time required to form the additive layer on the surface of the workpiece can be shortened as compared with an embodiment in which heat treatment is performed on the workpiece by the first beam irradiation unit or the second beam irradiation unit before the removal processing. (8) In the composite processing machine of the above-described embodiment, the control unit may be configured to control at least one of the first beam irradiation unit and the second beam irradiation unit of the additive manufacturing unit after the formation of the additive layer to melt a part of the surface of the additive layer, thereby repairing a defect on the surface of the additive layer. With such an embodiment, the surface properties of the workpiece can be improved. Therefore, it is possible to form an additive layer with high shape accuracy made of cemented carbide on the surface of the workpiece. The present disclosure can also be implemented in various forms other than a composite processing machine. For example, it can be implemented in the form of a processing device, a manufacturing method of a processing device, a control method of a processing device, a computer program for realizing the control method, a non-transitory recording medium recording the computer program, and the like.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Modes for Carrying Out the Invention

[0009] A. Embodiment: FIG. 1 is an explanatory diagram showing the composite grinding machine 1 of the embodiment. FIG. 1 corresponds to a plan view. However, FIG. 1 does not accurately represent the dimensions and shapes of the configurations of each part. Also, for ease of understanding of the technology, in FIG. 1, the illustration of some configurations included in the composite grinding machine 1 is omitted.

[0010] The composite grinding machine 1 can perform additive manufacturing (AM) and grinding, which is a machining process of removing material, on a cylindrical workpiece WP. The composite grinding machine 1 includes a holding unit 100, a grinding unit 200, an additive manufacturing unit 300, a coolant supply unit 400, a protection unit 500, a detection unit 38, a bed 800, and a control unit 900.

[0011] The holding unit 100 can hold the workpiece WP (see the lower part of FIG. 1). The holding unit 100 can further rotate the held workpiece WP. The holding unit 100 is provided so as to be movable in the horizontal direction with respect to the bed 800. The holding unit 100 includes a table 12, a spindle headstock 13, and a tailstock 14.

[0012] The table 12 is provided on the bed 800. The table 12 is provided so as to be movable in the horizontal direction with respect to the bed 800. The direction in which the table 12 moves is referred to as the X-axis direction in this specification. In FIG. 1, the movement of the holding unit 100 is indicated by an arrow Ax1 (see the lower right part of FIG. 1).

[0013] The spindle headstock 13 is provided on the table 12. The spindle headstock 13 includes a chuck 15. The chuck 15 holds one end of the cylindrical workpiece WP. The spindle headstock 13 can rotate the chuck 15.

[0014] The tailstock 14 is provided on the table 12. The tailstock 14 includes a center 16. The center 16 supports the other end of the cylindrical workpiece WP. The workpiece WP is supported at both ends by the chuck 15 of the spindle headstock 13 and the center 16 of the tailstock 14, and is rotated by the spindle headstock 13 about a rotation axis parallel to the X-axis direction. The rotation axis of the spindle headstock 13 is indicated by a one-dot chain line parallel to the X-axis direction in FIGS. 1 and 3 to 5.

[0015] The grinding unit 200 functions to grind the workpiece WP held by the holding unit 100 (see the right part in the middle row of FIG. 1). Specifically, the grinding unit 200 performs grinding by bringing the grinding wheel 21 into contact with the workpiece WP rotated by the holding unit 100 while rotating the grinding wheel 21. By performing grinding on the additional layer Md formed on the surface Sw of the workpiece WP by the additive manufacturing unit 300 using the grinding unit 200, an additional layer Md with high shape accuracy is formed on the surface Sw of the workpiece WP.

[0016] The grinding unit 200 can grind hard materials. In this specification, "hard materials" include one or more materials selected from the group consisting of diamond, silicon carbide, boron carbide, titanium carbide, tungsten carbide, cubic boron nitride, titanium nitride, silicon nitride, aluminum nitride, and alumina. Specifically, "hard materials" include cemented carbide, high-speed steel, and ceramics.

[0017] In this specification, "cemented carbide" is an alloy obtained by sintering and bonding one or more kinds of powders of carbides of metals in Groups IVa, Va, and VIa (Groups 4, 5, and 6) of the periodic table, such as TI, Zr, Hf, V, Nb, Ta, Cr, Mo, and W, and powders of iron-group metals such as Fe, Co, and Ni.

[0018] In this specification, "high-speed steel" refers to high-carbon steel containing 0.7 to 1.6% carbon, to which 3.8 to 4.5% of Cr, 1 to 5% of V, and 17 to 22% of W are added, or high-carbon steel containing 0.7 to 1.6% carbon, to which 3.8 to 4.5% of Cr, 1 to 5% of V, 5.5 to 11.0 of W, and 4.5 to 6.2% of Mo are added. High-speed steel includes, for example, HSS defined by ISO, as well as SKH2, SKH3, SKH4, SKH10, SKH40, SKH50, SKH51, SKH52, SKH53, SKH54, SKH55, SKH56, SKH57, SKH58, and SKH59 defined by JIS G4403 (2015).

[0019] The grinding unit 200 includes a grinding table 20, a grinding wheel 21, a grinding wheel drive motor 22, a grinding wheel shaft 23, and a belt transmission mechanism 24.

[0020] The grinding table 20 is provided on the bed 800. The grinding table 20 is provided so as to be movable in the horizontal direction with respect to the bed 800. The direction in which the grinding table 20 moves is perpendicular to the direction in which the table 12 moves. The direction in which the grinding table 20 moves is referred to as the Z-axis direction in this specification. In FIG. 1, the movement of the grinding unit 200 is indicated by an arrow Az2 (see the right part in the middle of FIG. 1). Also, in this specification, the vertically upward direction is defined as the positive Y-axis direction. FIG. 1 shows a rectangular coordinate system composed of the X-axis, Y-axis, and Z-axis.

[0021] The grinding wheel shaft 23 is supported by the grinding table 20 so as to be rotatable about a direction parallel to the X-axis. The grinding wheel 21 is a disk-shaped grinding wheel. The grinding wheel 21 is connected to the grinding wheel shaft 23 such that the central axis of the disk coincides with the central axis of the grinding wheel shaft 23. The grinding wheel 21 has a cylindrical grinding surface 21a parallel to the X-axis direction on the outer peripheral surface of the disk.

[0022] The grinding wheel drive motor 22 is supplied with power and outputs a rotational output. The grinding wheel drive motor 22 is fixed to the grinding table 20. The belt transmission mechanism 24 transmits the rotational output of the grinding wheel drive motor 22 to the grinding wheel shaft 23. That is, the grinding unit 200 rotates the grinding wheel 21 by the grinding wheel drive motor 22 via the belt transmission mechanism 24.

[0023] While the workpiece WP is rotated by the holding unit 100, the cylindrical grinding surface 21a of the rotating grinding wheel 21 is pressed against the surface Sw of the workpiece WP by the grinding unit 200, whereby the surface of the columnar workpiece WP is ground.

[0024] The grinding unit 200 can move in the Z-axis direction with respect to the holding unit 100 by means of the grinding table 20 (see Az2 in the middle right part of FIG. 1). On the other hand, the holding unit 100 can move in the X-axis direction while rotating the workpiece WP (see Ax1 in the lower right part of FIG. 1). Therefore, traverse grinding as a removal process can be executed on the workpiece WP held by the holding unit 100 by the grinding unit 200 and the holding unit 100 controlled by the control unit 900.

[0025] The coolant supply unit 400 supplies the coolant CL to the contact part CP where the workpiece WP held by the holding unit 100 and the grinding wheel 21 come into contact (see the lower right part of FIG. 1). The coolant supply unit 400 is fixed to the grinding unit 200. However, in FIG. 1, for ease of understanding of the technology, the coolant supply unit 400 is shown independently of the grinding unit 200. The coolant supply unit 400 includes a tank for storing the coolant CL and a pump for sending the coolant CL in the tank to the contact part CP where the workpiece WP and the grinding wheel 21 come into contact.

[0026] FIG. 2 is a diagram showing in detail a part of the configuration of the additive manufacturing unit 300. The additive manufacturing unit 300 has a function of performing additive manufacturing on the surface Sw of the workpiece WP held by the holding unit 100 (see the central part of FIG. 1). More specifically, the additive manufacturing unit 300 forms an additive layer Md on the surface Sw of the workpiece WP by adhering the hard material Mx to the surface Sw of the workpiece WP rotated by the holding unit 100. The additive manufacturing unit 300 can move in the Z-axis direction with respect to the holding unit 100. In FIG. 1, the movement of the additive manufacturing unit 300 is indicated by an arrow Az3 (see the interrupted left part of FIG. 1). The additive manufacturing unit 300 includes a first beam irradiation unit 32, a material supply unit 33, and a second beam irradiation unit 39.

[0027] The first beam irradiation unit 32 irradiates the first optical beam LB1 outside the additive manufacturing unit 300. The first beam irradiation unit 32 includes an oscillation unit 34 and an optical system 35. The oscillation unit 34 emits an optical beam. The optical system 35 converges the optical beam emitted by the oscillation unit 34 to a focal point at a predetermined position with respect to the first beam irradiation unit 32. The first optical beam LB1 melts the cemented carbide powder Mf on the surface Sw of the workpiece WP in the vicinity of the focal point. For the sake of easy understanding of the technology, in FIG. 2, the optical system 35 is shown in the shape of a single convex lens. The first beam irradiation unit 32 including the optical system 35 is an optical device used for the adhesion of materials to the surface Sw of the workpiece WP.

[0028] The material supply unit 33 supplies the cemented carbide powder Mf containing tungsten carbide and cobalt as a binder outside the additive manufacturing unit 300. The injection direction of the first optical beam LB1 by the first beam irradiation unit 32 and the injection direction of the cemented carbide powder Mf by the material supply unit 33 intersect at the focal point of the first optical beam LB1. As a result, the cemented carbide powder Mf supplied by the material supply unit 33 is melted by the first optical beam LB1. That is, the additive manufacturing unit 300 can adhere the material to the surface Sw of the workpiece WP by supplying the cemented carbide powder Mf as a material to the surface Sw of the workpiece WP held by the holding unit 100 while melting the material. As a result, an additional part made of cemented carbide can be formed at a desired part of the surface Sw of the workpiece WP. The additive manufacturing unit 300 performs a Directed Energy Deposition (DED). More specifically, the additive manufacturing unit 300 performs Laser Metal Deposition (LMD).

[0029] In this specification, the material in a powder state is referred to as "powder Mf". The structure formed by melting the powder Mf and adhering it to the surface Sw of the workpiece WP is referred to as "additional part Md" or "additional layer Md". When collectively referring to the powder Mf and the material constituting the additional layer Md, it is referred to as "material Mx" or "hard material Mx".

[0030] The second beam irradiation unit 39 irradiates the second light beam LB2 to the outside of the additive manufacturing unit 300. The second beam irradiation unit 39 has a configuration corresponding to each configuration of the first beam irradiation unit 32. However, the irradiation range of the second light beam LB2 on the surface Sw of the workpiece WP is wider than the irradiation range of the first light beam LB1 on the surface Sw of the workpiece WP. The additive manufacturing unit 300 is configured such that the irradiation range of the second light beam LB2 with respect to the hard material Mx on the surface Sw of the workpiece WP includes the irradiation range of the first light beam LB1 with respect to the hard material Mx on the surface Sw of the workpiece WP.

[0031] A part of the second light beam LB2 preheats the carbide powder Mf on the surface Sw of the workpiece WP prior to melting by the first light beam LB1. Another part of the second light beam LB2 is used to control the rate of temperature decrease of the melted carbide on the surface Sw of the workpiece WP. The operation of the second beam irradiation unit 39 will be described later.

[0032] While the workpiece WP is rotated by the holding unit 100, the additive manufacturing unit 300 adheres the material Mx to the surface Sw of the workpiece WP, thereby forming an annular addition part Md centered on the central axis of the workpiece WP on the surface Sw of the cylindrical workpiece WP.

[0033] The additive manufacturing unit 300 can move in the Z-axis direction with respect to the holding unit 100 (see Az3 in the middle left part of FIG. 1). On the other hand, the holding unit 100 can move in the X-axis direction while rotating the workpiece WP (see Ax1 in the lower right part of FIG. 1). Therefore, by the additive manufacturing unit 300 and the holding unit 100 controlled by the control unit 900, the carbide is adhered to the surface Sw of the workpiece WP held and rotated by the holding unit 100, thereby forming an addition layer Md on the surface Sw of the workpiece WP. However, the surface of the addition layer Md is not flat and has peaks and valleys substantially parallel to the circumferential direction of the cylindrical workpiece WP.

[0034] The detection unit 38 is an infrared camera (refer to the central part of FIG. 1). The detection unit 38 is fixed to the additive manufacturing unit 300. The detection unit 38 can acquire the state of the workpiece WP. For example, the detection unit 38 can detect the coolant CL adhering to the surface Sw of the workpiece WP. Also, the detection unit 38 can acquire the state of the workpiece WP irradiated with the first light beam LB1. The detection unit 38 is an optical device used for the adhesion of materials to the surface Sw of the workpiece WP.

[0035] The bed 800 supports the holding unit 100, the grinding unit 200, the additive manufacturing unit 300, the coolant supply unit 400, the protection unit 500, and the detection unit 38. The holding unit 100 can move in the X-axis direction on the bed 800 (refer to Ax1 in the lower right part of FIG. 1). The additive manufacturing unit 300 and the detection unit 38 fixed to the additive manufacturing unit 300 can move integrally in the Z-axis direction on the bed 800 (refer to Az3 in the central part of FIG. 1). The grinding unit 200 and the coolant supply unit 400 fixed to the grinding unit 200 can move integrally in the Z-axis direction (refer to Az2 in the lower right part of FIG. 1).

[0036] The control unit 900 controls the holding unit 100, the grinding unit 200, the additive manufacturing unit 300, the coolant supply unit 400, the protection unit 500, and the detection unit 38. The control unit 900 is a computer equipped with a display 970 that functions as an output device and a keyboard 980 that functions as an input device (refer to FIG. 1). The control unit 900 further includes a CPU 940 that is a processor, a RAM 950, and a ROM 960. By loading and executing the computer program stored in the ROM 960 into the RAM 950, the control unit 900 realizes various functions for the holding unit 100, the grinding unit 200, the additive manufacturing unit 300, the coolant supply unit 400, the protection unit 500, and the detection unit 38.

[0037] The control unit 900 controls each part as follows, for example. The control unit 900 controls the additive manufacturing unit 300 to form an additive part Md made of a hard material Mx on the surface Sw of the workpiece WP held by the holding unit 100. The control unit 900 controls the grinding unit 200 to perform a removal process on the additive part Md formed on the workpiece WP held by the holding unit 100.

[0038] As a result, without removing and reattaching the workpiece WP, in the composite grinding machine 1, it is possible to form an additive part Md of a hard material on the surface Sw of the workpiece WP and perform grinding as a removal process on the additive part Md. Therefore, the displacement of the position in multiple attachments of the workpiece WP does not affect the shape and dimensional accuracy of the additive part Md formed on the surface Sw of the workpiece WP. Thus, compared to the mode in which the formation of the additive part Md on the surface Sw of the workpiece WP and the removal process on the additive part Md are performed by different devices, in the additive part Md formed on the surface Sw of the workpiece WP, it is possible to reduce the portion exceeding the required thickness of the product, so-called machining allowance.

[0039] FIG. 3 is an explanatory diagram showing the configuration and operation of the protection unit 500 and the additive manufacturing unit 300. FIGS. 3 to 5 correspond to plan views. Note that FIGS. 3 to 5 do not accurately represent the dimensions and shapes of the configurations of each part. Also, in order to facilitate the understanding of the technology, in FIGS. 3 to 5, the illustration of some configurations included in the composite grinding machine 1 is omitted. For example, in FIGS. 3 to 5, the illustration of the material supply unit 33 and the second beam irradiation unit 39 (see FIG. 2) of the additive manufacturing unit 300 is omitted.

[0040] The protection unit 500 prevents the adhesion of the coolant CL to the first beam irradiation unit 32, the second beam irradiation unit 39, and the detection unit 38 (see the upper central part of FIG. 3). The protection unit 500 includes a cover 51 and a pressurizing unit 57.

[0041] The cover 51 covers the first beam irradiation unit 32, the second beam irradiation unit 39, and the detection unit 38. The cover 51 has an opening 53 and a lid portion 52. The lid portion 52 can open and close the opening 53. The protection unit 500 can selectively arrange the lid portion 52 at the open position Po and the closed position Pc.

[0042] FIG. 4 is an explanatory diagram showing the states of the protection unit 500 and the additive manufacturing unit 300 when the workpiece WP held by the holding unit 100 is being ground by the grinding wheel 21 of the grinding unit 200. When the workpiece WP held by the holding unit 100 is being ground by the grinding wheel 21 of the grinding unit 200, the grinding unit 200 moves to a position closer to the rotation axis of the spindle headstock 13 than in the state of FIG. 3 (see Az2 in FIG. 4).

[0043] When the workpiece WP held by the holding unit 100 is being ground by the grinding wheel 21 of the grinding unit 200, the lid portion 52 is arranged at the closed position Pc (see the central portion in FIG. 4). In this state, the additive manufacturing unit 300 is inside the cover 51. That is, the first beam irradiation unit 32, the second beam irradiation unit 39, and the detection unit 38 are covered by the cover 51. Therefore, the first beam irradiation unit 32 cannot irradiate the first light beam LB1 onto the surface Sw of the workpiece WP. The second beam irradiation unit 39 cannot irradiate the second light beam LB2 onto the surface Sw of the workpiece WP. The detection unit 38 cannot acquire the state of the workpiece WP.

[0044] FIG. 5 is an explanatory diagram showing the states of the protection unit 500 and the additive manufacturing unit 300 when the additive manufacturing unit 300 adheres the material Mx to the surface Sw of the workpiece WP. When the additive manufacturing unit 300 adheres the material Mx to the surface Sw of the workpiece WP, the grinding unit 200 moves to a position farther from the rotation axis of the spindle headstock 13 than in the state of FIG. 4 (see Az2 in FIG. 5).

[0045] When the additive manufacturing unit 300 adheres the material Mx to the surface Sw of the workpiece WP, the lid portion 52 is arranged at the open position Po (see the central portion of FIG. 5). When the lid portion 52 is at the open position Po, the opening 53 of the cover 51 is opened. At this time, the lid portion 52 has moved upward, that is, in the positive Y-axis direction, from the position closing the opening of the cover 51 shown in FIG. 4. Note that in FIG. 5, the lid portion 52 that has been retracted upward is not shown. The additive manufacturing unit 300 moves along the Z-axis direction to a position closer to the rotation axis of the spindle headstock 13 than in the state of FIG. 4 through the opening of the cover 51 (see Az3 in the left part of the middle stage of FIG. 5). That is, the first beam irradiation unit 32, the second beam irradiation unit 39, and the detection unit 38 are not covered by the cover 51.

[0046] In this state, the first beam irradiation unit 32 injects the first light beam LB1 onto the surface Sw of the workpiece WP through the opening 53. The second beam irradiation unit 39 injects the second light beam LB2 onto the surface Sw of the workpiece WP through the opening 53. The material supply unit 33 supplies the carbide powder Mf onto the surface Sw of the workpiece WP through the opening 53. The detection unit 38 takes in the light reflected by the workpiece WP through the opening 53.

[0047] With such a configuration, in the compound grinding machine 1 including the grinding unit 200 and the additive manufacturing unit 300, the coolant CL scattered by the rotating grinding wheel 21 and the rotating workpiece WP adheres to the first beam irradiation unit 32, the second beam irradiation unit 39, and the detection unit 38, and the possibility of a decrease in the accuracy of adhering the material Mx to the surface Sw by the additive manufacturing unit 300 can be reduced. Further, the coolant CL adheres to the first beam irradiation unit 32, the second beam irradiation unit 39, and the detection unit 38, and the possibility of failure of the first beam irradiation unit 32, the second beam irradiation unit 39, and the detection unit 38 can be reduced.

[0048] More specifically, even when droplets of coolant CL scattered by the rotating grinding wheel 21 and the rotating workpiece WP fly toward the first beam irradiation unit 32, the second beam irradiation unit 39, and the detection unit 38, the droplets adhere to the cover 51 that closes the lid portion 52 and covers the first beam irradiation unit 32, the second beam irradiation unit 39, and the detection unit 38. For this reason, the possibility of the coolant CL adhering to the first beam irradiation unit 32, the second beam irradiation unit 39, and the detection unit 38 can be reduced.

[0049] The pressurizing unit 57 can increase the pressure in the space within the cover 51 that houses the first beam irradiation unit 32, the second beam irradiation unit 39, and the detection unit 38. Specifically, the pressurizing unit 57 is a compressor. By compressing external air and supplying it into the cover 51, the pressurizing unit 57 maintains the pressure in the space within the cover 51 with the opening 53 closed at a level higher than the pressure around the cover 51.

[0050] With such a configuration, even when there are minute droplets of coolant CL floating around the composite grinding machine 1, the droplets can enter the space within the cover 51 through the gaps around the lid portion 52, reducing the possibility of the droplets adhering to the first beam irradiation unit 32, the second beam irradiation unit 39, and the detection unit 38.

[0051] FIG. 6 is a flowchart showing the processing of the workpiece WP. First, as a workpiece WP in a cylindrical shape before processing is prepared as a material to be processed (see the right part of FIG. 6). In this specification, both the object before the processing of FIG. 6 is performed and the object after the processing of FIG. 6 are both referred to as the workpiece WP.

[0052] In step S10, the workpiece WP is transported to a cutting machine different from the composite grinding machine 1 and attached to the chuck of the cutting machine.

[0053] In step S20, turning and drilling are performed on the workpiece WP using a cutting machine. In step S30, the workpiece WP is removed from the cutting machine. Then, the workpiece WP is transported to the compound grinding machine 1 of the present embodiment and attached to the spindle headstock 13 of the compound grinding machine 1 (see the lower part of FIG. 1).

[0054] In step S40, additive manufacturing and grinding, which is a removal process, are performed on the workpiece WP using the compound grinding machine 1. Step S40 includes steps S42, S43, S44, S46, and S48. While steps S42, S43, S44, S46, and S48 are being performed, the workpiece WP is not removed from the spindle headstock 13 and the center rest 14 and continues to be held by the spindle headstock 13 and the center rest 14.

[0055] In step S42, rough grinding is performed on the workpiece WP. More specifically, the control unit 900 controls the holding unit 100 to rotate the workpiece WP, and controls the grinding unit 200 to perform grinding, which is a removal process, on the workpiece WP. As a result, the grinding unit 200 contacts the workpiece WP rotated by the holding unit 100 while rotating the grinding wheel 21, thereby performing rough grinding. The coolant supply unit 400 supplies the coolant CL to the contact portion CP where the workpiece WP held by the holding unit 100 and the grinding wheel 21 contact each other.

[0056] At this time, the grinding wheel 21 for rough grinding in step S42 is attached to the grinding unit 200. The lid portion 52 of the protection unit 500 is arranged at the closed position Pc (see the central portion of FIG. 4). The first beam irradiation unit 32, the second beam irradiation unit 39, and the detection unit 38 are covered by the cover 51 of the protection unit 500. The functional unit of the CPU 940 that controls each part of the compound grinding machine 1 to perform rough grinding in step S42 is shown as the first rough grinding unit 942 in FIG. 1.

[0057] After rough grinding is completed, the grinding unit 200 moves to a position farther from the rotation axis of the spindle head 13 than the state shown in FIG. 4 (see Az2 in FIG. 5). The lid portion 52 of the protection unit 500 is arranged at the open position Po (see the central portion of FIG. 5). Then, the additive manufacturing unit 300 is controlled by the control unit 900 to move to a position closer to the rotation axis of the spindle head 13 than the state shown in FIG. 4 through the opening of the cover 51 (see Az3 in FIG. 5).

[0058] Thereafter, the rough grinding grinding wheel of step S42 attached to the grinding unit 200 is replaced with the rough grinding grinding wheel of step S46.

[0059] In step S43, build-up machining of a hard material is performed. More specifically, an additive layer Md made of cemented carbide is formed on the surface Sw of the workpiece WP by the additive manufacturing unit 300 (see FIG. 2).

[0060] In step S43, the control unit 900 first detects the coolant CL adhering to the surface Sw of the workpiece WP by the detection unit 38. Then, based on the detection result by the detection unit 38, the control unit 900 controls the output of the first light beam LB1 and the second light beam LB2 at the time of adhesion of the material Mx to the surface Sw so as to realize the functions described later.

[0061] By performing such processing, when the coolant CL remains on the surface Sw of the workpiece WP by the additive manufacturing unit 300, the outputs of the first light beam LB1 and the second light beam LB2 can be increased in consideration of the influence of the coolant CL. Therefore, it is possible to reduce the possibility that the accuracy of adhesion of the material Mx to the surface Sw by the additive manufacturing unit 300 is reduced due to the coolant CL adhering to the workpiece WP.

[0062] The control unit 900 controls the additive manufacturing unit 300 to function as follows. The material supply unit 33 supplies the powder Mf, which is the material, to the surface Sw of the workpiece WP. The first beam irradiation unit 32 irradiates the powder Mf with the first light beam LB1. As a result, the melted cemented carbide is adhered to the surface Sw of the workpiece WP as the added part Md (see FIG. 2). The second beam irradiation unit 39 irradiates the melted cemented carbide with the second light beam LB2. As a result, the rate of temperature decrease of the melted cemented carbide is reduced compared to the mode in which the second light beam LB2 is not irradiated. More specifically, the control unit 900 controls the output of the second light beam LB2 so that the rate of temperature decrease of the melted cemented carbide is maintained at 540 ° C. / second or less at the freezing point of cobalt that functions as a binder. The second beam irradiation unit 39 also irradiates the powder Mf of the cemented carbide before being melted with the second light beam LB2 (see FIG. 2). As a result, the powder Mf of the cemented carbide is preheated prior to melting by the first light beam LB1.

[0063] If the temperature of the cemented carbide adhered to the surface Sw of the workpiece WP rapidly decreases, quench cracking may occur in the formed added part Md due to the shrinkage of the cemented carbide accompanying the temperature decrease. On the other hand, when the rate of temperature decrease of the cemented carbide is low, the strain caused by the shrinkage of the cemented carbide is evenly distributed over a wide range of the added part Md. That is, large strain does not concentrate on a part of the added part Md. For this reason, quench cracking is less likely to occur in the added part Md.

[0064] In the present embodiment, by maintaining the rate of temperature decrease of the melted cemented carbide at 540 ° C. / second or less, the added part Md of the cemented carbide can be formed on the surface Sw of the workpiece WP without causing quench cracking in the added part Md formed on the workpiece WP, and post-removal processing can be performed on the added part Md later. That is, an added part Md with high shape accuracy by the cemented carbide can be formed on the surface Sw of the workpiece WP.

[0065] In step S43, the control unit 900 controls the additive manufacturing unit 300 to form an additional layer Md on the surface Sw of the workpiece WP with a thickness Th that the additional layer Md can withstand the grinding by the grinding unit 200 in steps S46 and S48 (see FIG. 2). In this specification, the "thickness that can withstand X" for a certain layer means that the layer is not destroyed even after passing through X. The thickness Th of the formed additional layer Md is set in advance based on the material of the additional layer Md, the temperature at which the material of the additional layer Md reaches by the first light beam LB1 and the second light beam LB2, the curvature of the surface Sw of the workpiece WP, and the like. In this embodiment, the material of the additional layer Md is cemented carbide. Therefore, by forming the additional layer Md with an appropriate thickness Th, the deformation amount of the additional layer Md in steps S46 and S48 can be suppressed to such an extent that the additional layer Md itself can be ground with sufficient accuracy in grinding.

[0066] In this embodiment, the additional layer Md is formed with a thickness Th having rigidity that can withstand the grinding by the grinding unit 200 in steps S46 and S48. Therefore, it is not necessary to prepare a workpiece WP having a hardness such that the additional layer Md can be supported in the grinding in steps S46 and S48. Thus, regardless of the content of the grinding in steps S46 and S48, a workpiece WP having a hardness along the intended use of the workpiece WP as a product can be prepared. Also, it is not necessary to perform surface treatment on such a workpiece WP so as to have a hardness such that the additional layer Md can be supported in the grinding prior to the grinding in steps S46 and S48.

[0067] In addition, in the present embodiment, an additional layer Md is formed on the surface of the workpiece WP with a thickness that realizes rigidity capable of withstanding the assumed value of the maximum load when the workpiece WP is used as a product. Therefore, it is not necessary to prepare a workpiece WP having a hardness such that the additional layer can support the workpiece when the workpiece is used as a product and receives a load. Also, it is not necessary to perform surface treatment on such a workpiece WP so that it has a hardness such that the additional layer Md can support the workpiece when the workpiece is used as a product. The functional part of the CPU 940 that controls each part in step S43 to perform build-up machining is shown as a build-up part 943 in FIG. 1.

[0068] In step S44 of FIG. 6, hole filling processing is performed on the workpiece WP. More specifically, the control unit 900 controls the first beam irradiation unit 32 of the additive manufacturing unit 300 to melt a part of the surface of the workpiece WP on which the additional layer Md was formed in step S43, thereby repairing defects such as cracks, voids, and chipping generated during the formation of the additional layer Md. That is, the first optical beam LB1 is irradiated onto the surface defects of the additional layer Md and its surroundings, and a part of the material constituting the surface melts and flows into the defects to fill the defects. At this time, the material supply unit 33 does not supply the carbide powder Mf. Also, the second beam irradiation unit 39 does not irradiate the second optical beam LB2.

[0069] By performing such processing, even when defects such as cracks and chipping occur on the surface of the additional layer Md in the build-up machining of the hard material in step S43, the surface properties of the additional layer Md can be improved. Therefore, through the subsequent processing of steps S46 and S48, an additional layer Md with high shape accuracy made of carbide can be formed on the surface Sw of the workpiece WP. The functional part of the CPU 940 that controls each part in step S44 to perform hole filling processing is shown as a hole filling part 944 in FIG. 1.

[0070] After the hole filling process, the additive manufacturing unit 300 is controlled by the control unit 900 to move into the cover 51 (see Az3 in FIG. 4). Thereafter, the lid portion 52 of the protection unit 500 is arranged at the closed position Pc (see the central portion in FIG. 4). When the lid portion 52 is at the closed position Pc, the opening 53 of the cover 51 is closed by the lid portion 52. The grinding unit 200 moves to a position closer to the rotation axis of the spindle head 13 than in the state of FIG. 5 (see Az2 in FIG. 4).

[0071] In step S46, rough grinding is performed on the workpiece WP. More specifically, the grinding unit 200 rotates the grinding wheel 21 while bringing it into contact with the workpiece WP rotated by the holding unit 100, thereby performing rough grinding on the additive layer Md formed on the workpiece WP. The coolant supply unit 400 supplies the coolant CL to the contact portion CP where the workpiece WP held by the holding unit 100 and the grinding wheel 21 are in contact. As a result, the peaks formed on the surface of the additive layer Md are roughly removed. At this time, the rough grinding wheel 21 for step S46 is attached to the grinding unit 200. The lid portion 52 of the protection unit 500 is arranged at the closed position Pc (see the central portion in FIG. 4). The first beam irradiation unit 32, the second beam irradiation unit 39, and the detection unit 38 are covered by the cover 51 of the protection unit 500 (see FIG. 4). The functional unit of the CPU 940 that controls each unit in step S46 to perform rough grinding is shown as the second rough grinding unit 946 in FIG. 1.

[0072] In this embodiment, in step S43, the control unit 900 controls the additive manufacturing unit 300 to form an additive portion Md made of a hard material Mx on the surface Sw of the workpiece WP held by the holding unit 100. Thereafter, in step S46, the control unit 900 controls the grinding unit 200 to perform a removal process on the additive portion Md formed on the workpiece WP held by the holding unit 100. That is, on the composite grinding machine 1, without removing and reattaching the workpiece WP, the formation of the additive portion Md of the hard material on the surface Sw of the workpiece WP and the grinding of the additive portion Md are performed. For this reason, compared with a mode in which the formation of the additive portion Md on the surface Sw of the workpiece WP and the grinding of the additive portion Md are performed by different apparatuses, the process of forming the additive portion Md on the surface Sw of the workpiece WP and shaping the additive portion Md by the removal process can be efficiently performed.

[0073] After the rough grinding is completed, the grinding unit 200 moves to a position farther from the rotation axis of the spindle head 13 than the state shown in FIG. 4 (see Az2 in FIG. 5). The grinding wheel carriage for rough grinding in step S46 attached to the grinding unit 200 is replaced with the grinding wheel carriage for finish grinding in step S48. Thereafter, the grinding unit 200 moves to a position closer to the rotation axis of the spindle head 13 than the state shown in FIG. 5 (see Az2 in FIG. 4).

[0074] In step S48, finish grinding is performed on the workpiece WP. More specifically, the grinding unit 200 rotates the grinding wheel 21 while bringing it into contact with the workpiece WP rotated by the holding unit 100, thereby performing finish grinding on the additional layer Md formed on the workpiece WP. The coolant supply unit 400 supplies coolant CL to the contact portion CP where the workpiece WP held by the holding unit 100 and the grinding wheel 21 are in contact. As a result, the surface of the additional layer Md is processed to be flat with high precision. At this time, the grinding wheel 21 for finish grinding in step S48 is attached to the grinding unit 200. The lid portion 52 of the protection unit 500 is arranged at the closed position Pc (see the central portion of FIG. 4). The first beam irradiation unit 32, the second beam irradiation unit 39, and the detection unit 38 are covered by the cover 51 of the protection unit 500 (see FIG. 4). The functional unit of the CPU 940 that controls each unit in step S48 to perform finish grinding is shown as a finish grinding unit 948 in FIG. 1.

[0075] As described above, according to the compound grinding machine 1 of the present embodiment, the processes from the formation of the hard film to the finish grinding can be executed without using other processing machines (see S40 in FIG. 6). After the completion of the finish grinding, the grinding unit 200 moves to a position farther from the rotation axis of the spindle headstock 13 than the state shown in FIG. 4 (see Az2 in FIG. 5).

[0076] In step S50, the workpiece WP is removed from the spindle headstock 13 of the compound grinding machine 1 (see the lower part of FIG. 1) and transported to a predetermined finished product storage area. Through the above processes, the processing of the workpiece WP is completed.

[0077] FIG. 7 is a flowchart showing a conventional process for processing the workpiece WP. First, similar to the process of FIG. 6, a cylindrical workpiece WP before processing is prepared as a material to be processed (see the right part of FIG. 7).

[0078] In step S110, the workpiece WP is transported to a composite machining machine capable of performing additive manufacturing and cutting, and is attached to the chuck of the composite machining machine. Note that this composite machining machine can perform additive manufacturing on steels other than high-speed steel. This composite machining machine cannot perform additive manufacturing of hard materials. Also, this composite machining machine can perform cutting on aluminum and steels other than high-speed steel. This composite machining machine cannot perform cutting and grinding of hard materials.

[0079] In step S120, turning and drilling are performed on the workpiece WP using the composite machining machine. In step S125, build-up machining is performed. More specifically, an additional part is formed on the surface Sw of the workpiece WP by additive manufacturing using the composite machining machine.

[0080] In step S134, the workpiece WP is removed from the composite machining machine. Then, the workpiece WP is transported to a quenching device and housed therein. In step S135, a quenching process, which is a heat treatment, is performed on the workpiece WP using the quenching device.

[0081] On the other hand, in the process of the present embodiment shown in FIG. 6, before grinding the additional layer Md in steps S46 and S48, heat treatment of the workpiece WP by the first beam irradiation unit 32 or the second beam irradiation unit 39 is not performed. Therefore, compared with the mode of FIG. 7 in which the heat treatment of step S135 in FIG. 7 is performed on the workpiece WP before grinding the additional layer, the time required to form the additional layer Md on the surface Sw of the workpiece WP can be shortened. Also, compared with the mode in which heat treatment of the workpiece WP by the first beam irradiation unit 32 or the second beam irradiation unit 39 is performed before grinding the additional layer Md, the time required to form the additional layer Md on the surface Sw of the workpiece WP can be shortened.

[0082] In step S136, the workpiece WP is taken out of the quenching device. Then, the workpiece WP is transported to a conventional grinding machine and attached to the spindle headstock of the grinding machine.

[0083] In step S142, rough grinding is performed on the workpiece WP on the grinding machine. At this time, a grinding wheel 21 for rough grinding in step S142 is attached to the grinding machine.

[0084] After rough grinding, the grinding wheel for rough grinding in step S142 attached to the grinding machine is replaced with the grinding wheel for rough grinding in step S146.

[0085] In step S143, the workpiece WP is removed from the grinding machine. Then, the workpiece WP is transported to the plating tank and immersed in the plating solution in the plating tank.

[0086] In step S144, electroplating is performed on the surface Sw of the workpiece WP using hexavalent chromium. As a result, a hard chromium plating layer as an additional layer made of cemented carbide is formed on the surface Sw of the workpiece WP. However, since the process in step S144 is performed by electroplating, the thickness of the additional layer formed in step S144 is 1 mm or less.

[0087] On the other hand, in the process of the present embodiment shown in FIG. 6, instead of plating, an additional layer Md is formed on the surface Sw of the workpiece WP by DED (see S43 in FIG. 6). According to DED, it is possible to form an additional layer Md having a thickness of about 3 mm on the surface Sw of the workpiece WP. Therefore, the additional layer Md can be formed on the surface Sw of the workpiece WP with a thickness Th having a rigidity and yield stress large enough for the additional layer Md to withstand the grinding by the grinding unit 200 in steps S46 and S48. Further, in the process of the present embodiment shown in FIG. 6, it is not necessary to use hexavalent chromium. Therefore, the treatment and management of hexavalent chromium are unnecessary.

[0088] In step S145, the workpiece WP is taken out from the plating bath. Then, the workpiece WP is transported to a conventional grinding machine, and the workpiece WP is attached to the spindle headstock of the grinding machine (see the lower part of FIG. 1). Since processing of the hard metal coating is not easy, the grinding machine used in steps S146 and S148 is a dedicated grinding machine capable of grinding the hard metal coating. However, the same grinding machine is also used in step S142 of FIG. 7.

[0089] In step S146, rough grinding is performed on the workpiece WP. At this time, a grinding wheel 21 for rough grinding in step S146 is attached to the grinding machine.

[0090] In step S147, the grinding wheel for rough grinding in step S146 attached to the grinding machine is replaced with a grinding wheel for finish grinding in step S148.

[0091] In step S148, finish grinding is performed on the workpiece WP. At this time, a grinding wheel 21 for finish grinding in step S48 is attached to the grinding unit 200.

[0092] In step S150, the workpiece WP is removed from the spindle headstock of the grinding machine and transported to a predetermined finished product storage area. Through the above processing, the conventional processing of the workpiece WP is completed.

[0093] In the conventional processing, while steps S120 to S148 are being performed, the workpiece WP is successively attached to the machining center, the grinding machine, the quenching device, the plating bath, and the grinding machine. In the attachment of the workpiece WP to the machining center, the first attachment to the grinding machine, and the second attachment to the grinding machine, the attachment position of the workpiece WP to each processing machine and, as a result, the rotation center of the workpiece WP in each processing machine are shifted from each other. For this reason, in addition to the plating process, in the processing of the workpiece WP using the conventional machining center and grinding machine, it is necessary to set a relatively large machining allowance.

[0094] In contrast, in steps S42, S43, S44, S46, and S48 of the present embodiment, the hybrid grinding machine 1 is used to perform additive manufacturing and grinding, which is a subtractive process, on the workpiece WP (see S40 in FIG. 6). Therefore, during this period, there is no need for transfer and attachment work between the processing apparatuses of the workpiece WP. Thus, according to the hybrid grinding machine 1, the time required for processing the workpiece WP can be shortened compared to the process of FIG. 7. In other words, the hybrid grinding machine 1 can efficiently perform the process of forming the additional part Md on the surface Sw of the workpiece WP and shaping the additional part Md by subtractive processing. As a result, the processing cost of the workpiece WP can also be reduced.

[0095] In the present embodiment, additive manufacturing and grinding, which is a subtractive process, are performed by one hybrid grinding machine 1 (see S40 in FIG. 6). Therefore, compared to the mode of FIG. 7 using a conventional hybrid processing machine, a plating bath, and a grinding machine, the space required for those processes in the factory can be reduced.

[0096] The hybrid grinding machine 1 in the present embodiment is also referred to as a "hybrid processing machine". The grinding unit 200 is also referred to as a "subtractive processing unit". The grinding wheel carriage 21 is also referred to as a "grinding wheel".

[0097] B. Other Embodiments: B1. Other Embodiment 1: (1) In the above embodiment, the first beam irradiation unit 32 and the second beam irradiation unit 39 of the additive manufacturing unit 300 irradiate a laser beam. However, the additive manufacturing unit may heat and melt the material by irradiating an arc plasma or an electron beam instead of the laser beam.

[0098] (2) In the above-described embodiment, the material supply unit 33 supplies the powder Mf of cemented carbide containing tungsten and cobalt to the outside of the additive manufacturing unit 300. However, as the material of the additive layer Md, various materials such as Fe-based alloys, Ni-based alloys, Co-based alloys, Cu-based alloys, Al-based alloys, and ceramics can be adopted. Those alloys can be alloys added with chromium, cobalt, vanadium, etc.

[0099] Also, as the material of the workpiece, various materials such as carbon steel, bearing steel, stainless steel, and aluminum can be adopted.

[0100] (3) In the above-described embodiment, the material supply unit 33 supplies the powder Mf of cemented carbide to the outside of the additive manufacturing unit 300. However, the material supply unit can also supply the material in the form of a wire. Further, the material supplied by the material supply unit can be high-speed steel in addition to cemented carbide.

[0101] (4) In the above-described embodiment, the grinding unit 200 and the additive manufacturing unit 300 move in the Z-axis direction, and the holding unit 100 moves in the X-axis direction. However, one of the grinding unit and the holding unit may be configured to be movable in two directions perpendicular to each other. That is, the compound grinding machine only needs to be configured such that the grinding unit can take an arbitrary position in the plane relative to the holding unit. Also, one of the additive manufacturing unit and the holding unit may be configured to be movable in two directions perpendicular to each other. That is, the compound grinding machine only needs to be configured such that the additive manufacturing unit can take an arbitrary position in the plane relative to the holding unit.

[0102] (5) In the above-described embodiment, the cover 51 covers the entire first beam irradiation unit 32, the second beam irradiation unit 39, and the detection unit 38. However, the cover can be in a mode that does not cover a part of the optical device, such as a part on the opposite side of the part where the window portion 32w through which the first light beam LB1 passes is provided in the first beam irradiation unit 32, or a part on the opposite side of the part where the window portion through which external light taken into the detection unit 38 passes is provided.

[0103] (6) In the above embodiment, the detection unit 38 is an infrared camera. However, the detection unit may have other configurations, such as a digital still camera that records visible light or a camera that can record videos. As long as the detection unit can detect the coolant adhering to the surface of the workpiece.

[0104] (7) In the above embodiment, the holding unit 100 and the grinding unit 200 realize the function as a cylindrical grinding machine. However, the holding unit and the grinding unit may constitute a surface grinding machine that grinds the surface of the workpiece held by the holding unit by relatively moving the holding unit and the grinding unit in two directions along the outer peripheral surface direction of the grinding wheel.

[0105] B2. Other Embodiment 2: In the above embodiment, the control unit 900 controls the output of the second light beam LB2 so that the temperature decrease rate of the melted cemented carbide is maintained at 540 °C / second or less (see FIG. 2). However, such control may not be performed, and the second light beam may be emitted at a constant output. Further, the composite processing machine may be configured to include a first beam irradiation unit and not include a second beam irradiation unit.

[0106] B3. Other Embodiment 3: In the above embodiment, the grinding unit 200 of the composite grinding machine 1 performs grinding by bringing the grinding wheel 21 into contact with the workpiece WP while rotating the grinding wheel 21 (see FIG. 4). However, the composite processing machine may be configured to include a cutting machine that can cut the workpiece instead of the grinding unit 200. For example, cutting is also possible for hard materials softer than Vickers hardness 900.

[0107] In addition, in the additional shaping of the workpiece, it is preferable to form the additional layer with a thickness that can withstand the removal process by such removal processes as grinding and cutting. Note that the "thickness that can withstand the removal process by the removal processing section" means that in the removal process by the removal processing section, the additional layer does not crack, and the additional layer causes elastic deformation to such an extent that it can be processed with the required dimensional and shape accuracy.

[0108] B4. Other Embodiment 4: In step S43 of the above embodiment, the control unit 900 controls the additive manufacturing unit 300 to form the additional layer Md with a thickness Th that can be withstood by the additional layer Md itself against the grinding by the grinding unit 200 in steps S46 and S48 (see FIG. 2). However, the composite processing machine can also be configured not to form the additional layer Md with such a thickness. In such an embodiment, it is preferable to prepare a workpiece having a hardness sufficient to support the additional layer during grinding.

[0109] B5. Other Embodiment 5: In the above embodiment, before grinding the additional layer Md in steps S46 and S48 of FIG. 6, the heat treatment of the workpiece WP by the first beam irradiation unit 32 or the second beam irradiation unit 39 is not performed. However, prior to additive manufacturing, heat treatment such as quenching can be performed on the surface of the workpiece by the first beam irradiation unit and / or the second beam irradiation unit as the heating means of the additive manufacturing unit. Also, prior to additive manufacturing in the composite processing machine, the workpiece may be transported to a heat treatment device different from the composite processing machine, and the heat treatment of the workpiece may be performed in that heat treatment device. By performing such a process, a configuration can be realized in which, during grinding, the additional layer does not crack and the additional layer causes elastic deformation to such an extent that it can be processed with the required dimensional and shape accuracy, by the base material and the additional layer of the workpiece.

[0110] B6. Other Embodiment 6: In step S44 of the above-described embodiment, the control unit 900 controls the first beam irradiation unit 32 of the additive manufacturing unit 300 to melt a part of the surface of the additive layer Md, thereby repairing defects such as cracks and chips on the surface of the additive layer Md (see FIG. 6). However, the hybrid processing machine may be configured not to perform such processing. In additive manufacturing, by supplying a hard material with sufficient accuracy and controlling the output of the beam irradiation unit to provide an additive layer, it is possible to form an additive layer Md with sufficiently few defects such as cracks, voids, and chips on the surface Sw of the workpiece WP.

[0111] The present disclosure is not limited to the above-described embodiments, and can be implemented in various configurations without departing from the gist thereof. For example, the technical features of the embodiments corresponding to the technical features in each form described in the summary of the invention can be appropriately replaced or combined in order to solve some or all of the above-described problems or to achieve some or all of the above-described effects. Further, if the technical feature is not described as essential in this specification, it can be appropriately deleted.

Description of Reference Numerals

[0112] 1... Compound grinding wheel, 12... Table, 13... Spindle headstock, 14... Center rest, 15... Chuck, 16... Center, 20... Grinding wheel table, 21... Grinding wheel, 21a... Cylindrical grinding surface, 22... Grinding wheel drive motor, 23... Grinding wheel shaft, 24... Belt transmission mechanism, 32... First beam irradiation unit, 32w... Window portion, 33... Material supply unit, 34... Oscillator unit, 35... Optical system, 38... Detection unit, 39... Second beam irradiation unit, 51... Cover, 52... Lid portion, 53... Opening, 57... Pressurizing unit, 100... Holding unit, 200... Grinding unit, 300... Additive manufacturing unit, 400... Coolant supply unit, 500... Protective unit, 800... Bed, 900... Control unit, 940... CPU, 942... First rough grinding unit, 943... Build-up welding portion, 944... Filling portion, 946... Second rough grinding unit, 948... Grinding unit, 950... RAM, 960... ROM, 970... Display, 980... Keyboard, Ax1... Arrow indicating the movement of the holding unit 100, Az2... Arrow indicating the movement of the grinding unit 200, Az3... Arrow indicating the movement of the additive manufacturing unit 300, CL... Coolant, CP... Portion where the workpiece WP and the grinding wheel 21 are in contact, LB1... First optical beam, LB2... Second optical beam, Md... Additive layer, Mf... Powder, Mx... Hard material, Pc... Closed position of the lid portion 52, Po... Open position of the lid portion 52, Sw... Surface of the workpiece WP, Th... Thickness of the additive layer Md, WP... Workpiece

Claims

1. A composite processing machine, comprising a holding part capable of holding a workpiece, a removal processing part that performs removal processing on the workpiece held by the holding part, the removal processing part being capable of performing removal processing of a hard material, an additive manufacturing part that adheres the hard material to the surface by melting the hard material while supplying the hard material to the surface of the workpiece held by the holding part, and a control part that controls the composite processing machine, wherein the control part, controls the additive manufacturing part to form an additive part made of the hard material on the surface of the workpiece held by the holding part, controls the removal processing part to perform removal processing on the additive part formed on the workpiece held by the holding part, wherein the additive manufacturing part, comprises a material supply part that supplies a powder of cemented carbide as the hard material, a first beam irradiation part that irradiates a first light beam for melting the powder of cemented carbide, and a second beam irradiation part that irradiates a second light beam, wherein the control part controls the additive manufacturing part, causes the powder to be supplied to the material supply part, and irradiates the first light beam toward the powder by the first beam irradiation part, thereby adhering the melted cemented carbide to the surface as the additive part, and irradiates the second light beam toward the melted cemented carbide by the second beam irradiation part, thereby reducing the temperature drop rate of the melted cemented carbide. A composite processing machine.

2. The composite processing machine according to claim 1, wherein the control part controls the additive manufacturing part to irradiate the second light beam toward the melted cemented carbide by the second beam irradiation part, thereby keeping the drop rate at 540 °C / second or less. A composite processing machine.

3. The composite processing machine according to claim 1 or 2, wherein the additive manufacturing unit forms an additive layer as the additive portion by adhering the hard material to the surface of the workpiece held by the holding unit, and the removal processing unit includes a grinding wheel and performs grinding by bringing the grinding wheel into contact with the workpiece held by the holding unit while rotating the grinding wheel. The composite processing machine.

4. The composite processing machine according to claim 3, wherein the control unit controls the additive manufacturing unit to form the additive layer on the surface of the workpiece with a thickness that can withstand the removal processing by the removal processing unit. The composite processing machine.

5. The composite processing machine according to claim 3, wherein the control unit controls the additive manufacturing unit to form the additive layer on the surface of the workpiece with a thickness that can withstand an assumed value of the maximum load when the workpiece is used as a product. The composite processing machine.

6. The composite processing machine according to claim 4 or 5, wherein the control unit does not perform heat treatment on the workpiece before the removal processing of the additive layer. The composite processing machine.

7. The composite processing machine according to any one of claims 3 to 6, wherein the control unit, after the formation of the additive layer, controls at least one of the first beam irradiation unit and the second beam irradiation unit of the additive manufacturing unit to melt a part of the surface of the additive layer, so that defects on the surface of the additive layer can be repaired. The composite processing machine.

Images