Light-emitting device, method for manufacturing the same, light source device, and luminaire

Abstract

To provide a light-emitting device that has high-precision and long-life, suppresses positional misalignment and optical axis misalignment between a light-emitting element and an optical element, has high-precision light distribution characteristics, and has high lens adhesion against temperature changes, a manufacturing method of the light-emitting device, a light source device, and a lamp.SOLUTION: A light-emitting device includes a substrate 12 having a circuit wiring, a semiconductor light emitting element 15 mounted on the substrate, a frame 21 erected in an annular or oval shape on the substrate so as to surround the semiconductor light emitting element, and a sealing portion 23 that seals the inner wall of the frame, the upper surface of the substrate inside the frame, and the semiconductor light emitting element. The sealing portion includes a first resin portion 23A having a concave surface composed of at least one surface of rotation about the central axis of the frame, and a second resin portion 23B provided to cover the concave surface of the first resin portion and having a convex outer surface, and has an outer surface in which the outer surface of the first resin portion and the outer surface of the second resin portion are integrated.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a light-emitting device, a method for manufacturing a light-emitting device, a light source device, and a lighting fixture.

Background Art

[0002] Conventionally, a light source unit provided with a light-emitting element and a lens and used, for example, in a vehicle lighting fixture is known.

[0003] For example, Patent Document 1 discloses a light source unit including a light-emitting module disposed in a socket housing, a sealing portion that seals a light-emitting element and a conductive portion on a substrate, and a lens portion formed by curing a molding resin on the sealing portion.

[0004] Further, Patent Document 2 discloses a vehicle lighting device including a frame portion provided on a substrate to surround a light-emitting element, an optical element, and a sealing portion made of a resin supplied to a space surrounded by an inner wall of the frame portion, the optical element, and the substrate.

[0005] Further, Patent Document 3 discloses a vehicle lighting device including a light-emitting element provided on a substrate, a frame portion surrounding the light-emitting element, a sealing portion provided inside the frame portion to cover the light-emitting element, and an optical element provided on the sealing portion.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0007] However, when molding the lens by injecting resin, there has been a problem that due to displacement during molding, the lens is displaced relative to the light-emitting element, and the desired light distribution cannot be obtained.

[0008] Also, in the prior art, there have been problems with adhesion such as peeling occurring due to the difference in the coefficient of thermal expansion between the sealing resin and the lens.

[0009] The present invention has been made in view of the above points, and aims to provide a light-emitting device, a method for manufacturing a light-emitting device, a light source device, and a lighting fixture that suppress displacement and optical axis deviation between a light-emitting element and an optical element, have high-precision light distribution characteristics, and also have high adhesion of the sealing portion and the lens against temperature changes, with high precision and long life.

Means for Solving the Problems

[0010] A light-emitting device according to an embodiment of the present invention includes: a substrate having circuit wiring; a semiconductor light-emitting element mounted on the substrate; a frame body erected in an annular or oval shape on the substrate so as to surround the semiconductor light-emitting element; a sealing portion that seals the inner wall of the frame body, the upper surface of the substrate inside the frame body, and the semiconductor light-emitting element; the sealing portion includes a first resin portion having a concave surface formed of at least one rotating surface with the central axis of the frame body as the rotation axis, and a second resin portion provided to cover the concave surface of the first resin portion and having a convex outer surface; the sealing portion has an outer surface in which the outer surface of the first resin portion and the outer surface of the second resin portion are integrated.

Brief Description of the Drawings

[0011]

Fig. 1A

Fig. 1B

Fig. 1C

Fig. 2A

Fig. 2B

Fig. 3

Fig. 4

Fig. 5

Fig. 6

Fig. 7

Fig. 8

Fig. 9A

Fig. 9B

Embodiments for Carrying Out the Invention

[0012] Hereinafter, preferred embodiments of the present invention will be described, but these may be appropriately modified and combined. Also, in the following description and the accompanying drawings, substantially the same or equivalent parts will be denoted by the same reference numerals for description. [First Embodiment] FIG. 1A is a plan view schematically showing the upper surface of a light source device 10 according to a first embodiment of the present invention. FIG. 1B is a plan view schematically showing the internal structure of a light emitting device 11 provided in the light source device 10. Further, FIG. 1C is a cross-sectional view schematically showing a cross-section of the light emitting device 11 taken along line A-A of FIG. 1B.

[0013] As shown in FIG. 1A, the light source device 10 is, for example, a ceramic substrate, and includes a light emitting device 11 provided on a substrate 12 having a wiring circuit, and electronic components 18 provided on the substrate 12. The electronic components 18 are, for example, resistors R1 to R5 (hereinafter collectively referred to as resistor R), capacitors C1 and C2 (hereinafter collectively referred to as capacitor C), and a diode Di1 (hereinafter collectively referred to as Di). Note that these electronic components 18 do not necessarily have to be provided.

[0014] As shown in FIGS. 1B and 1C, the light emitting device 11 has circuit wirings 13 on the substrate 12. The circuit wirings 13 are composed of a circuit wiring 13A and a circuit wiring 13B, and have an LED (light emitting diode) 15 which is a light emitting element joined by a metal bonding layer 14 such as AuSn (gold-tin) on the circuit wiring 13A. The upper surface of the LED 15 is a light emitting surface.

[0015] The LED 15 is electrically connected to the circuit wiring 13B by a bonding wire 17 such as Au (gold). In FIG. 1C, for the sake of clarity of the figure and the description, the bonding wire 17 provided at the back of the A-A cross-section is schematically shown. Further, one of the circuit wirings 13A and 13B is an anode and the other is a cathode, and when not particularly distinguished hereinafter, they will be described collectively as the circuit wiring 13.

[0016] The light emitting device 11 has a frame (resin dam) 21 formed upright on the substrate 12 so as to incline inward. The frame 21 is arranged so as to surround the LED 15 inside thereof.

[0017] The frame body 21 has a bottom surface of the substrate 12 in an annular shape, and has a shape that is rotationally symmetric with respect to the central axis CX passing through the center O of the annulus and perpendicular to the substrate 12 (z direction). Further, the frame body 21 has a top portion with a rounded and curved upper edge.

[0018] In the present embodiment, the light emitting device 11 is provided with four LEDs 15. It is sufficient that at least one LED 15 is provided in the light emitting device 11. When a plurality of LEDs 15 are provided, it is preferable that the plurality of LEDs 15 are arranged at positions rotationally symmetric with respect to the center of the light emitting device 11 (point O in FIG. 1B), that is, the central axis CX of the frame body 21 on the substrate 12. Further, it is preferable that the plurality of LEDs 15 arranged at rotationally symmetric positions have the same light distribution characteristics.

[0019] On the frame body 21, a sealing portion 23 made of a sealing resin is formed. The LED 15 and the bonding wire 17 are encapsulated in the sealing portion 23. The sealing portion 23 is composed of a first resin portion 23A and a second resin portion 23B, and the sealing portion 23 functions as a lens which is an optical element.

[0020] FIG. 2A corresponds to FIG. 1C and is an optical microscope image of a cross-section of the light emitting device 11. Further, FIG. 2B is a diagram in which the boundary between the first resin portion 23A and the second resin portion 23B in FIG. 2A is indicated by a broken line.

[0021] As shown in FIG. 2B, the first resin portion 23A is formed so as to cover at least a part of the top portion of the frame body 21, the substrate 12, and the surface of the LED 15. The second resin portion 23B is formed so as to cover the entire upper surface of the first resin portion 23A. That is, the first resin portion 23A and the second resin portion 23B are formed in close contact with each other, and the inside of the frame body 21 is filled with the sealing portion 23.

[0022] Further, as shown in FIG. 2B, the boundary line BR between the first resin portion 23A and the second resin portion 23B is above the top of the frame body 21 and inside the outer peripheral edge of the frame body 21. As can be seen from the height of the left and right frame bodies 21 in FIG. 2B, there is a difference in the height of the frame body 21, but this difference is compensated for by the first resin portion 23A. upright Therefore, the boundary line BR is formed as a circle having the same height from the substrate 12 within a plane perpendicular to the central axis CX.

[0023] The second resin portion 23B is formed in the shape of an oblate spheroid (a flattened sphere) on the first resin portion 23A. Also, the outer surfaces of the first resin portion 23A and the second resin portion 23B are continuous, and the first resin portion 23A and the second resin portion 23B have a common outer surface of an oblate spheroid. That is, the outer surface of the sealing portion 23 composed of the first resin portion 23A and the second resin portion 23B is formed as a single rotationally symmetric oblate spheroid surface, and the cross-section in a plane including the central axis CX has an elliptical shape.

[0024] FIG. 3 is a schematic cross-sectional view for explaining the interface between the first resin portion 23A and the second resin portion 23B and the shape of the surface of the sealing portion 23. Also, FIG. 4 is an optical microscope image with an ellipse (broken line) fitted to the interface between the first resin portion 23A and the second resin portion 23B and the surface of the sealing portion 23.

[0025] As shown in FIG. 3, the first resin portion 23A and the second resin portion 23B have two concave interfaces: a first interface (center-side interface) between the LEDs 15 facing each other across the center O of the light-emitting device 11, and a second interface (outer peripheral-side interface) from the upper surface of the LED 15 to the outer surface of the sealing portion 23.

[0026] More specifically, as shown in FIG. 4 and referring also to FIGS. 2A and 2B, it can be understood that the first interface between the LEDs 15 is fitted by the surface of the first oblate spheroid ES1, and the second interface from the upper surface of the LED 15 to the outer surface of the sealing portion 23 is fitted by the surface of the second oblate spheroid ES2.

[0027] Also, it is understood that the outer surface of the sealing portion 23 is fitted by the surface of the third oblate spheroid ES3.

[0028] More specifically, the surface of the first resin portion 23A (that is, the interface with the second resin portion 23B) is at least one concave oblate spherical surface coaxial with the central axis CX of the frame body 21. That is, the oblate spheroid is a rotating body (ellipsoid) obtained by rotating an ellipse with the central axis CX as the rotation axis. In the case shown in FIGS. 3 and 4, the oblate spheroid has the shape of a rotating body when rotated about the minor axis of the ellipse as the rotation axis.

[0029] Also, the concave surface of the first resin portion 23A is composed of at least one oblate spherical surface according to the number and arrangement of the LEDs 15 (light emitting elements) placed inside the frame body 21. On the other hand, the sealing portion 23 is formed as one oblate spheroid, that is, its outer surface is one convex oblate spherical surface.

[0030] Therefore, as shown in FIGS. 3 and 4, the first to third oblate spheroids ES1 to ES3 are oblate spheroids coaxial with the central axis CX of the light emitting device 11 perpendicular (z direction) to the substrate 12.

[0031] Here, when the surface or a part of the surface of the first resin portion 23A can be regarded as an oblate spherical surface, it is preferable that the curvature of the concave surface of the first resin portion 23A satisfies the following conditions.

[0032] That is, flat When the major axis radius of the cross section (ellipse) of the sphere is a and the minor axis radius is b, flat the ratio (b / a) in the oblateness = 1 - (b / a) of the sphere is defined as the flat curvature CV of the spherical surface. When the curvatures CV1, CV2, and CV3 of the first to third oblate spheroids ES1, ES2, and ES3 are CV1 < CV3, CV2 < CV3 ··· Equation (1) it is preferable that.

[0033] In other words, the curvature of the third oblate spheroid ES3 is larger than the curvature of the oblate spheroid surface on the concave surface of the first resin portion 23A. That is, the degree of bending (radius of curvature) of the third oblate spheroid surface is the largest.

[0034] Although the case where the surface (interface) of the first resin portion 23A is composed of at least one oblate spheroid surface has been described, it is not limited thereto. The surface of the first resin portion 23A may be formed as a concave surface composed of at least one rotating surface having the central axis CX as the rotation axis.

[0035] Therefore, generally, when the surface of the first resin portion 23A is composed of the at least one rotating surface, it is preferable that the curvature of the outer surface of the second resin portion 23B is larger than the curvature of any of the at least one rotating surfaces on the concave surface of the first resin portion 23A.

[0036] As described above, since the first resin portion 23A and the second resin portion 23B are rotationally symmetric with respect to the central axis CX, respectively, the sealing portion 23 composed of the first resin portion 23A and the second resin portion 23B is formed as an optical element (lens) that is rotationally symmetric with respect to the central axis CX of the light-emitting device 11. Therefore, an optical element (lens) with no deviation of the optical axis or with an extremely small deviation is formed. Also, the spherical accuracy as an optical element such as a lens is extremely high.

[0037] As shown in FIGS. 2A, 2B, 3, etc., the bonding wire 17 connecting the circuit wiring 13 and the LED 15 is not completely embedded by the first resin portion 23A. That is, the bonding wire 17 is embedded so as to reach into the second resin portion 23B. However, the entire bonding wire 17 may be configured to be embedded by the first resin portion 23A. (Number and arrangement of light-emitting elements (LEDs) 15) When one light-emitting element (LED) 15 is provided, it is preferable that the central axis of the LED 15 is arranged to be common with the central axis CX of the light-emitting device 11.

[0038] Also, when a plurality of LEDs 15 are provided, it is preferable that the plurality of LEDs 15 are arranged at positions rotationally symmetric with respect to the central axis CX of the light emitting device 11. (Shape of the frame 21 and the sealing portion 23) In the above-described embodiment, the case where the frame 21 is an annular body having an annular bottom surface which is a contact surface with the substrate 12 and the sealing portion 23 is an oblate spheroid has been described, but the present invention is not limited thereto.

[0039] For example, the frame 21 may be an annular body having an elliptical annular bottom surface. In this case, the sealing portion 23 has an ellipsoidal shape with the major axis, minor axis, and central axis CX of the frame 21 as diameters. Also, the first interface and the second interface between the first resin portion 23A and the second resin portion 23B are elliptical surfaces coaxial with the central axis CX. Therefore, a light emitting device having a high-precision optical element (lens) with no deviation of the optical axis is formed. Note that, in this specification, the term "elliptical ring" includes an oval-shaped ring including an oval-shaped annular ring. (Materials of the frame 21, the first resin portion 23A, and the second resin portion 23B) The frame 21 is formed of, for example, a silicone resin and is formed as a reflective white resin containing titanium oxide particles or the like. A resin having high affinity with the resin of the first resin portion 23A, having a higher viscosity than the first resin portion 23A, and having a viscosity capable of forming the frame is used.

[0040] As the resin of the first resin portion 23A (the first resin), for example, a silicone resin is used. As the first resin, a resin having fluidity and low viscosity and having cohesiveness is used. For example, a resin having a viscosity of about 1 to 2 Pa·s is used. Also, a resin having high chemical affinity with the resins of the frame 21 and the second resin portion 23B is used. By using a low-viscosity resin as the first resin, there is an advantage that air bubbles are not entrapped. Also, it can have a shape complementary to the shapes of the frame 21 and the second resin portion 23B.

[0041] As the resin (second resin) of the second resin portion 23B, for example, a silicone resin is used. That is, as the second resin, a resin having higher viscosity or higher cohesiveness than the first resin is used. For example, a resin having a viscosity of about 17 to 26 Pa·s is used. For example, a filler of nanosilica is added to form a highly cohesive structure with a three-dimensional network structure.

[0042] It is preferable that the same type of resin, for example, a silicone resin, is used for the first resin portion 23A and the second resin portion 23B. In particular, it is preferable that the difference in the coefficient of thermal expansion is small or the same resin is used. That is, an optical element with peeling prevented can be formed. Also, it is preferable that the difference in refractive index is small or the same resin is used. This is because it facilitates the control of the directivity characteristics of the light emitted from the light-emitting device 11 through the sealing portion 23 from the light emitted from the LED 15. (Manufacturing method of the light-emitting device 11 method) STEP1: The manufacturing method of the light-emitting device 11 will be described with reference to FIG. 5. First, the LED 15 is joined to the circuit wiring 13A by the AuSn bonding layer 14. Wire bonding is performed between the electrode 16 of the LED 15 and the circuit wiring 13B to connect them.

[0043] STEP2: Apply the dam resin (frame resin) in an annular shape with a predetermined thickness.

[0044] STEP3: Inject the first resin so as to fill the inside of the dam (frame 21).

[0045] STEP4: Inject the second resin onto the first resin.

[0046] STEP5: Subsequently, perform a curing treatment on the resin. Heat treatment is performed in an electric furnace to simultaneously cure the dam resin (frame resin), the first resin, and the second resin, thereby forming the sealing portion 23 composed of the frame 21, the first resin portion 23A, and the second resin portion 23B. That is, in STEP2 and 3, only resin injection is performed and curing is not performed. Through the above steps, the light-emitting device 11 is manufactured.

[0047] Note that the curing process in STEP5 is preferably performed such that the frame resin cures to form the frame 21 inclined inward with respect to the central axis CX (inclination axis AT). Alternatively, in STEP2, the applied frame resin may be heat-treated to cure. In this case, it is preferable to perform the heat treatment so that the frame resin cures while inclining inward. Thus, by making the shape of the frame resin inclined inward, it is possible to prevent the light reflected from the inner surface of the frame 21 from exiting as stray light from the light-emitting device 11. (Mechanism) Next, with reference to FIG. 6, the mechanism by which the second resin injected onto the first resin becomes an oblate spheroid will be described. FIG. 6 schematically shows the state change of the first resin and the second resin injected into the frame 21.

[0048] The second resin has a higher viscosity or higher cohesiveness than the first resin. The second resin injected onto the first resin moves while deforming in the first resin (arrow in the figure) and stabilizes at the center by self-alignment (solid line in the figure). At this time, the entire surface of the second resin and the first resin becomes a flattened spherical surface so that the internal energy is minimized. Further, the surfaces of the first resin and the second resin are integrated to form a common oblate spherical surface.

[0049] Therefore, the displacement of the position and the optical axis between the light-emitting element and the optical element is suppressed. Also, the spherical accuracy of the obtained optical element is high. Therefore, a light-emitting device having high-precision light distribution characteristics can be obtained. (Modification of the First Embodiment) In the light-emitting device 11 of the first embodiment described above, a phosphor may be added to the first resin portion 23A. For example, when the LED 15 is a blue LED, a yellow phosphor or an amber phosphor may be added.

[0050] Alternatively, a phosphor may be added to the second resin portion 23B. Or, a phosphor may be added to both the first resin portion 23A and the second resin portion 23B.

[0051] According to this modification example, in addition to obtaining high-precision light distribution characteristics with suppressed positional deviation and optical axis deviation, a light-emitting device with suppressed color unevenness is realized. [Second Embodiment] FIG. 7 is a cross-sectional view schematically showing a cross-section in a plane including the central axis of the light-emitting device 41 of the second embodiment.

[0052] The point that the sealing portion 23 of the light-emitting device 41 has the first resin portion 23A and the second resin portion 23B is the same as that of the light-emitting device 11 of the first embodiment described above. The interface between the first resin portion 23A and the second resin portion 23B is the surface of the concave oblate spheroid ES.

[0053] In the second embodiment, one LED 15 is arranged at the center O of the light-emitting device 41. Further, a phosphor plate 32 is placed on the upper surface (i.e., the light-emitting surface) of the LED 15.

[0054] As described above, in this embodiment as well, high-precision light distribution characteristics with suppressed positional deviation and optical axis deviation are obtained. Further, a light-emitting device with suppressed color unevenness is realized even when a phosphor is used. [Third Embodiment] FIG. 8 is a cross-sectional view schematically showing a cross-section in a plane including the central axis of the light-emitting device 45 of the third embodiment.

[0055] In the third embodiment, one LED 15 is arranged at the center O of the light-emitting device 41. Further, a phosphor-containing layer 33 is formed so as to embed the LED 15. The phosphor-containing layer 33 contains phosphor particles in the resin.

[0056] In this embodiment as well, high-precision light distribution characteristics with suppressed positional deviation and optical axis deviation are obtained. Further, a light-emitting device with suppressed color unevenness is realized even when a phosphor is used.

[0057] In addition, in the above-described second and third embodiments, the first resin portion 23A can also be made of a light-reflective resin. Further, in the above-described first embodiment, a phosphor plate can be disposed on the upper surface of each LED 15, and the LED 15 can also be embedded in a phosphor-containing layer. [Fourth Embodiment] FIG. 9A is a perspective view showing a lighting fixture 50 according to the fourth embodiment. FIG. 9B is an exploded view of the lighting fixture 50. The lighting fixture 50 is, for example, a lighting fixture for a vehicle.

[0058] As shown in FIG. 9A, the lighting fixture 50 is configured by mounting a light source device 10 on an LED socket (hereinafter simply referred to as a socket) 51. More specifically, the socket 51 includes a light source mounting portion 51A, a mounting portion 51B formed of a bayonet for mounting the lighting fixture 50 on a vehicle or the like, a flange 51C, and heat radiation fins 51D.

[0059] The configuration of the lighting fixture 50 will be described below with reference to FIG. 9B. The socket 51 of the lighting fixture 50 is configured by integrally molding (insert molding) a socket main body portion 51M, a heat sink 52, and a terminal base 53. The terminal base 53 is electrically connected to the light source device 10.

[0060] The light source device 10 is mounted on the heat sink 52 via a thermal conduction grease 54. A cover or the like can be attached to the socket 51 via an O-ring 55.

[0061] The lighting fixture 50 of the present embodiment has high-precision light distribution characteristics with suppressed optical axis deviation. Further, according to the present embodiment, a lighting fixture with high precision and long life is provided.

[0062] As described in detail above, a light-emitting device, a light source device, and a lighting fixture are provided in which displacement of the light-emitting element and the optical element and optical axis deviation are suppressed, and which have high-precision light distribution characteristics. Further, a light-emitting device, a light source device, and a lighting fixture are provided in which the sealing portion and the lens have high adhesion even with respect to temperature changes, and which have high precision and long life.

Description of Reference Numerals

[0063] 10: Light source device, 11, 41, 45: Light emitting device, 12: Substrate, 13: Circuit wiring, 14: Bonding layer, 15: Light emitting element, 17: Bonding wire, 18: Electronic component, 21: Frame, 23: Sealing part, 23A: First resin part, 23B: Second resin part, 50: Lighting fixture, 51: Socket, CX: Central axis, ES1 to ES3: First to third oblate spheroids

Claims

1. A substrate having circuit wiring, A semiconductor light-emitting element mounted on the substrate, A frame erected in an annular or oval shape on the substrate so as to surround the semiconductor light-emitting element, A sealing portion for sealing the inner wall of the frame, the upper surface of the substrate inside the frame, and the semiconductor light-emitting element, The sealing portion includes a first resin portion having a concave surface formed of at least one rotating surface with the central axis of the frame as the rotation axis, and a second resin portion provided to cover the concave surface of the first resin portion and having a convex outer surface, The resin of the second resin portion has a higher viscosity than the resin of the first resin portion, The sealing portion has an outer surface in which the outer surface of the first resin portion and the outer surface of the second resin portion are integrated, The first resin portion is formed to cover the top of the frame, and the boundary between the first resin portion and the second resin portion on the outer surface of the sealing portion is above the top of the frame and inside the outer peripheral edge of the frame, a light-emitting device.

2. The concave surface is composed of at least one oblate spherical surface or ellipsoidal surface coaxial with the central axis of the frame, the light-emitting device according to claim 1.

3. The outer surface of the sealing portion forms a common oblate spherical surface or ellipsoidal surface in which the outer surface of the first resin portion and the outer surface of the second resin portion are integrated, the light-emitting device according to claim 1 or 2.

4. The frame is erected so as to incline inward, the light-emitting device according to any one of claims 1 to 3.

5. The curvature of the outer surface of the second resin portion is greater than the curvature of the concave surface of the first resin portion, the light-emitting device according to any one of claims 1 to 4.

6. The light-emitting device according to any one of claims 1 to 5, wherein the first resin portion and the second resin portion are formed of the same type of resin.

7. The light-emitting device according to any one of claims 1 to 6, wherein a filler of nanosilica is added to the second resin portion.

8. The light-emitting device according to any one of claims 1 to 7, wherein a plurality of semiconductor light-emitting elements are arranged on the substrate at rotationally symmetric positions with respect to the central axis of the frame.

9. A light source device including the light-emitting device according to any one of claims 1 to 8, wherein the substrate extends to the outside of the frame and has the circuit wiring connected to the semiconductor light-emitting element and electronic components mounted on the substrate and mounted on the circuit wiring.

10. The light source device according to claim 9, and a lamp having a socket to which the light source device is attached and having terminals electrically connected to the light source device.

11. (a) a step of mounting a semiconductor light-emitting element on a substrate having circuit wiring; (b) a step of applying a frame resin in an annular or oval shape on the substrate so as to surround the semiconductor light-emitting element; (c) a step of forming a sealing portion for sealing the inner wall of the frame resin, the upper surface of the substrate inside the frame resin, and the semiconductor light-emitting element, The step (c) of forming the sealing portion includes (c1) a step of injecting a first resin inside the frame resin; (c2) a step of injecting a second resin having a higher viscosity than the first resin on the first resin. (c3) performing resin curing to simultaneously cure the first resin and the second resin, to form a first resin portion formed by curing of the first resin, the first resin portion having a concave surface formed of at least one rotating surface with the central axis of the frame resin as the rotation axis, and a second resin portion formed by curing of the second resin, the second resin portion covering the concave surface of the first resin portion and having a convex outer surface; The outer surface of the sealing portion has an outer surface in which the outer surface of the first resin portion and the outer surface of the second resin portion are integrated. The first resin portion is formed to cover the top of the frame resin, and a boundary between the first resin portion and the second resin portion on the outer surface of the sealing portion is above the top of the frame resin and inside the outer peripheral edge of the frame resin. A method of manufacturing a light-emitting device.

12. The step (c3) of performing the resin curing to simultaneously cure the first resin and the second resin is executed so as to cure the applied frame resin. The method of manufacturing a light-emitting device according to claim 11.

13. The step (c3) of performing the resin curing is executed so that the frame resin cures while inclining inward. The method of manufacturing a light-emitting device according to claim 12.

14. The step (b) of applying the frame resin includes a step (b1) of curing the applied frame resin. The method of manufacturing a light-emitting device according to claim 13.

15. The step (b1) of curing the applied frame resin is executed so that the frame resin cures while inclining inward. The method of manufacturing a light-emitting device according to claim 14.

16. The outer surface of the sealing portion has a common oblate spherical surface or elliptical surface in which the outer surface of the first resin portion and the outer surface of the second resin portion are integrated. The method of manufacturing a light-emitting device according to any one of claims 11 to 15.

Images