Electronic device

Abstract

To provide an electronic device that can suppress the temperature rise of a heat-generating component and make it smaller.SOLUTION: An imaging apparatus 1 includes an imaging element substrate 113 on which an imaging element 101 and a first connector 114 are mounted, a main substrate 104 on which a control IC 103 and a second connector 115 are mounted, and a cable 106, which is connected to the first connector 114 and the second connector 115. The main substrate 104 has an L-shaped portion 117, which delimits the main substrate 104 into a first area 118 and a second area 119. The cable 106 is inserted into the L-shaped portion 117. In the main substrate 104, the second connector 115 is mounted in the first area 118, and the control IC 103 is mounted in the second area.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to an electronic device, and particularly to a technique for suppressing the temperature rise of electronic components disposed inside the electronic device.

Background Art

[0002] In electronic devices such as digital cameras, the processing capabilities of various ICs (integrated circuits) such as imaging elements and driver ICs have been enhanced in order to achieve higher functionality and performance. Along with this, the power consumption of ICs and the like increases, and the amount of heat generated by ICs and the like also increases. Therefore, in order to suppress the local rise in the exterior temperature of the electronic device due to the heat generation of ICs and the like, and also to suppress the performance degradation due to the temperature rise of the electronic components, a technique for controlling the heat flow inside the electronic device is required. For example, Patent Document 1 describes a digital camera in which a first path for connecting to a second circuit board on which a heat-generating component is mounted and a second path for radiating heat to a metal housing are provided on a first circuit board on which an imaging element, which is a heat-generating component, is mounted. In this digital camera, the heat generated by the imaging element is made to flow to the metal housing through the second path, thereby suppressing the heat transfer to the second circuit board on which the heat-generating component is mounted while suppressing the temperature rise of the imaging element.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the technique described in Patent Document 1 above, in order to control the heat flow, a second path that is unnecessary for the control of the imaging element is provided on the first circuit board, which causes a problem that the miniaturization of the imaging element is hindered.

[0005] An object of the present invention is to provide an electronic device capable of suppressing temperature rise and miniaturizing a heat-generating component.

Means for Solving the Problems

[0006] An electronic device according to the present invention includes a first substrate on which a first connector is mounted, an electronic component that generates heat during operation, a second substrate on which a second connector is mounted, and a cable having one end connected to the first connector and the other end connected to the second connector. The second substrate has a hole portion that defines the second substrate into a first region and a second region, and the cable is inserted through the hole portion. and routed to the surface of the second substrate opposite to the surface facing the first substrate, In the second substrate, the second connector is mounted in the first region, and the electronic component is mounted in the second region.

Effects of the Invention

[0007] According to the present invention, it is possible to provide an electronic device capable of suppressing temperature rise and miniaturizing a heat-generating component.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Embodiments for Carrying Out the Invention

[0009] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1(a) is an external perspective view showing the imaging device 1 according to an embodiment of the present invention as seen obliquely from the front, and FIG. 1(b) is an external perspective view showing the imaging device 1 as seen obliquely from the rear. FIG. 2 is a block diagram showing a schematic configuration of the imaging device 1.

[0010] For convenience of explanation, a three-dimensional orthogonal coordinate system shown in FIG. 1 is set. It is assumed that the X direction is the left-right direction of the imaging device 1, the Y direction is the up-down direction of the imaging device 1, and the Z direction is the front-back direction of the imaging device 1. Also, the upward direction is the +Y direction, the forward direction is the +Z direction, and the right direction when viewed from the +Z direction is the +X direction.

[0011] The imaging device 1 includes a fixed part 10, a first movable part 20, and a second movable part 30. The first movable part 20 is attached to the fixed part 10 so as to be rotatable about a pan rotation axis P (shown by a dashed line in FIG. 1(a)) parallel to the Y axis. The second movable part 30 is held by the first movable part 20 so as to be rotatable about a tilt rotation axis T (shown by a dashed line in FIG. 1(a)) orthogonal to the Y axis. Thus, the imaging device 1 is configured such that the second movable part 30 can rotate with respect to the fixed part 10 having degrees of freedom of the pan rotation axis P and the tilt rotation axis T1.

[0012] The second movable part 30 has an imaging element 101 and a lens barrel unit 102, and the lens barrel unit 102 includes an imaging optical system 125. The imaging element 101 is a CCD image sensor, a CMOS image sensor, or the like that photoelectrically converts an optical image to generate an image signal. The imaging optical system 125 is composed of various lenses, diaphragms, etc. that form a subject image on the imaging element 101, and the lens barrel unit 102 holds various components that make up the imaging optical system 125. By the rotation of the first movable part 20 around the pan rotation axis P and the rotation of the second movable part 30 around the tilt axis T, the optical axis direction of the imaging optical system 125, that is, the imaging direction, can be changed.

[0013] As shown in FIG. 1, the fixed part 10 is provided with a power button 107, an operation button 108, a display window 109, an external connection connector cover 111, and a recording medium connector cover 112. Also, as shown in FIG. 2, the fixed part 10 includes a control IC 103, an external connection connector 110, a light emitting element 120, a power supply unit 121, a recording medium connector 122, a storage unit 210, a power switch 123, and an operation switch 124.

[0014] The control IC 103 controls the overall operation of the imaging device 1, including the function of processing the image signal generated by the imaging element 101 to generate image data. The image signal generated by the imaging element 101 is transmitted to the main board 104 (see FIG. 3) through the cable 106 (see FIG. 3). Various electronic components and electrical components are mounted on the main board 104, including the control IC 103. The image data generated by the control IC 103 is stored in the storage unit 210. The storage unit 210 is, for example, a semiconductor storage device capable of storing and erasing, such as an EEPROM, but is not limited thereto.

[0015] The power supply unit 121 supplies the necessary power to the control IC 103, the imaging element 101, etc. When the push-button switch type power button 107 provided on the right side surface of the fixing unit 10 is pressed, the operation is detected by the power switch 123 built in the fixing unit 10. The control IC 103 switches the power-off state and the power-on state of the imaging device 1 according to the detection result of the power switch 123. Further, when the push-button switch type operation button 108 provided on the right side surface of the fixing unit 10 is pressed while the imaging device 1 is in the power-on state, the operation is detected by the operation switch 124 built in the fixing unit 10. The control IC 103 switches the operation state of the imaging device 1 according to the detection result of the operation switch 124.

[0016] The display window 109 is a transparent or translucent member and is provided on the front surface of the fixing portion 10. The light emitting element 120 is, for example, an LED or the like, and is disposed at a position facing the display window 109 inside the imaging device 1. The user can visually recognize the light emitting state of the light emitting element 120 from the outside of the imaging device 1 through the display window 109. For example, the control IC 103 causes the light emitting element 120 to emit light during video recording by the imaging device 1. Thereby, the user can recognize that the imaging device 1 is in the video recording operation by confirming the light emission of the light emitting element 120 through the display window 109. In the present embodiment, the display window 109 is disposed on the front surface of the fixing portion 10 in consideration of visibility from the user, but the display window 109 may be provided at another position in consideration of the installation location and usage mode of the imaging device 1.

[0017] The external connection connector cover 111 is provided on the left side surface of the fixing portion 10 and is configured to be movable between a position where it covers the external connection connector 110 when not in use and a position where it is exposed in the appearance during use. The recording medium connector cover 112 is provided on the back side of the fixing portion 10 and is configured to be movable between a position where it covers the recording medium connector 122 when not in use and a position where it is exposed in the appearance during use.

[0018] FIG. 3(a) is a perspective view of the main members incorporated in the imaging device 1, and FIG. 3(b) is a perspective view of the main members incorporated in the imaging device 1 as viewed from a direction different from that of FIG. 3(a). The imaging element 101 is mounted on one surface of the imaging element substrate 113, and the first connector 114 is mounted on the surface of the imaging element substrate 113 opposite to the surface on which the imaging element 101 is mounted. The imaging element substrate 113 is fixed to a chassis (frame) (not shown) that constitutes the second movable portion 30. Therefore, the imaging element substrate 113 moves integrally with the second movable portion 30 with respect to the fixing portion 10.

[0019] On the main board 104 on which the control IC 103 is mounted, an external connection connector 110 and a second connector 115 are further mounted. As shown in FIG. 3(b), the second connector 115 and the control IC 103 are mounted on the same surface of the main board 104, on the surface opposite to the surface facing the imaging element substrate 113. On the other hand, the external connection connector 110 is mounted on the surface of the main board 104 opposite to the surface on which the control IC 103 is mounted. Note that the main board 104 is fixed to a chassis (frame), not shown, which constitutes the fixing portion 10.

[0020] One end of a cable 106 for transmitting the image signal generated by the imaging element 101 to the main board 104 is connected to the first connector 114 mounted on the imaging element substrate 113. The other end of the cable 106 is connected to the second connector 115 mounted on the main board 104. A main board hole 116 is provided in the main board 104 so as to penetrate the main board 104 in the thickness direction, and the cable 106 is arranged so as to pass through the main board hole 116. Since the cable 106 has flexibility, even if the second movable portion 30 moves with respect to the fixing portion 10 and the relative positional relationship between the imaging element substrate 113 and the main board 104 changes, the electrical connection via the cable 106 between the imaging element substrate 113 and the main board 104 is maintained.

[0021] Next, the control of the heat flow generated inside the imaging device 1 will be described. FIG. 4 is a plan view of the main board 104, showing the surface on which the control IC 103 is mounted.

[0022] When the temperature of the imaging element 101 rises too much, the noise contained in the image signal increases (the S / N ratio decreases). Therefore, the imaging element 101 is one of the electronic components for which the temperature rise should be suppressed as much as possible. In addition, the control IC 103 is not only an electronic component that processes the image signal generated by the imaging element 101, but also an electronic component that controls various functions of the imaging device 1, and has the largest heat generation amount among the electronic components mounted on the main board 104. And when the temperature of the control IC 103 rises too much, its processing ability decreases. Therefore, the control IC 103 is one of the electronic components for which the temperature rise should be suppressed as much as possible.

[0023] In the imaging device 1, among the heat generated by the control IC 103, the heat flowing into the second connector 115 flows from the second connector 115 to the imaging element substrate 113 via the cable 106 and the first connector 114. Therefore, if too much heat generated by the control IC 103 flows into the second connector 115, there is a possibility of accelerating the temperature rise of the imaging element 101 mounted on the imaging element substrate 113. In addition, since the external connection connector 110 mounted on the main board 104 is a component that the user may directly touch, if the temperature rises too much, the user may feel discomfort. For these reasons, it is necessary to reduce as much as possible the amount of heat generated by the control IC 103 with a large heat generation amount flowing into the second connector 115 and the external connection connector 110. In the present embodiment, the main board 104 is configured as follows to solve this problem.

[0024] That is, the main board hole 116 has a substantially T-shaped shape having a portion (hereinafter referred to as the "L-shaped portion 117") formed in a substantially L-shape as shown by the broken line in FIG. 4. In addition, the control IC 103 has a substantially rectangular shape when viewed from the thickness direction of the main board 104. And the two linear hole portions constituting the L-shaped portion 117 are respectively opposed to two sides (continuous) of the control IC 103 that are substantially orthogonal to each other.

[0025] Here, the center lines of the two linear hole portions constituting the L-shaped portion 117 define lines (hereinafter referred to as "region defining lines L1, L2") extending to the side opposite to the intersection of these two linear hole portions. The region defining lines L1, L2 are, in other words, straight lines from the intersection of the two linear hole portions to their respective end points, and are shown by the dashed-dotted line in FIG. 4. The main board 104 is defined into a first region 118 and a second region 119 by the region defining lines L1, L2.

[0026] In the main board 104, the control IC 103, which is the main heat source, is mounted in the second region 119, and the second connector 115 and the external connection connector 110 that need to suppress the temperature rise are in the first region Region 1It is arranged at 18. The two linear hole portions that constitute the L-shaped portion 117 face two consecutive sides (two orthogonal sides) of the IC 103 respectively. Therefore, the two linear hole portions of the L-shaped portion 117 reduce the heat flow from the second region 119 where the control IC 103 is mounted to the first region 118 where the second connector 115 and the external connection connector 110 are mounted. Thus, it is possible to suppress the temperature rise of the second connector 115 and the external connection connector 110.

[0027] The second connector 115 is mounted on the main board 104 such that its longitudinal direction is parallel to the region defining line L2. At this time, further, the second connector 115 is mounted on the main board 104 with the center of the second connector 115 shifted by a predetermined distance d1 from the center of the control IC 103 toward the region defining line L1 side (the right side in FIG. 4) in the length direction of the region defining line L2 (the left-right direction in FIG. 4). In other words, the center of the second connector 115 is shifted by a distance d1 from the center of the control IC 103 in the length direction of the linear hole portion intervening between the second connector 115 and the control IC 103 and toward the intersection side of the two linear hole portions. Thus, by mounting the second connector 115 on the main board 104 so as not to face the control IC 103 without sandwiching the L-shaped portion 117 of the main board hole 116, the heat transfer from the control IC 103 to the second connector 115 can be more effectively suppressed.

[0028] Furthermore, in the imaging device 1, it is possible to insert the cable 106 through the main board hole 116 provided in the main board 104 and route the cable 106 to the surface of the main board 104 opposite to the surface facing the imaging element substrate 113. Therefore, the second connector 115 is mounted on the surface of the main board 104 opposite to the surface facing the imaging element substrate 113. Thereby, by increasing the connection length of the cable 106 from the second connector 115 to the imaging element substrate 113 and increasing the heat dissipation amount from the cable 106, the heat transfer from the second connector 115 to the imaging element substrate 113 can be suppressed.

[0029] The external connection connector 110 is mounted on the main board 104 such that its longitudinal direction is parallel to the region defining line L1. Also, the external connection connector 110 is mounted on the main board 104 with its center shifted by a predetermined distance d2 from the center of the control IC 103 toward the region defining line L2 side (the upper side in FIG. 4) in the length direction of the region defining line L1 (the vertical direction in FIG. 4). Thus, by mounting the external connection connector 110 on the main board 104 without sandwiching the L-shaped portion 117 of the main board hole 116 and so as not to face the control IC 103, heat transfer from the control IC 103 to the external connection connector 110 can be more effectively suppressed. Also, the external connection connector 110 and the control IC 103 are mounted on different surfaces of the main board 104. Therefore, heat transfer from the control IC 103 to the external connection connector 110 can be more effectively suppressed.

[0030] As described above, the present invention has been described in detail based on its preferred embodiments. However, the present invention is not limited to these specific embodiments, and various forms within the scope not departing from the gist of this invention are also included in the present invention. For example, although an imaging device has been taken up as an embodiment of the electronic device according to the present invention, the present invention is not limited to being applicable to an imaging device, and can be applied to various electronic devices including a board on which electronic components (heat-generating components) that generate heat during operation are mounted. In particular, the present invention is suitable for an electronic device that needs to connect a plurality of boards on which heat-generating components are mounted by a cable, and an electronic device that incorporates a board on which a heat-generating component is mounted and a connector or the like that a user accesses from the outside is mounted.

Explanation of Reference Numerals

[0031] 1 Imaging device 101 Image sensor 104 Main board 106 Cable 110 External connection connector 113 Image sensor board 114 First connector 115 Second connector 116 Main board hole 117 L-shaped part 118 First region 119 Second region

Claims

1. a first substrate on which a first connector is mounted; an electronic component that generates heat during operation, and a second substrate on which a second connector is mounted; an electronic device comprising a cable having one end connected to the first connector and the other end connected to the second connector, wherein the second substrate has a hole that defines the second substrate into a first region and a second region; the cable is inserted through the hole and routed to a surface of the second substrate opposite to the surface facing the first substrate; in the second substrate, the second connector is mounted in the first region, and the electronic component is mounted in the second region.

2. The electronic device according to claim 1, wherein a plurality of electronic components are mounted on the second substrate, and the electronic component has the largest amount of heat generation among the plurality of electronic components.

3. The electronic device according to claim 1 or 2, wherein the second connector is mounted on a surface of the second substrate opposite to the surface facing the first substrate.

4. the hole has a first linear hole and a second linear hole, at least a part of which is formed in a substantially L shape; In the second substrate, the first region and the second region are defined by straight lines extending from the intersection of the first linear hole and the second linear hole to their respective end points. The electronic device according to any one of claims 1 to 3.

5. when viewed from the thickness direction of the second substrate, the electronic component has a substantially rectangular shape; The electronic device according to claim 4, wherein the first linear hole and the second linear hole face two sides of the electronic component that are substantially orthogonal to each other.

6. The electronic component and the second connector are mounted on the same surface of the second substrate with the first linear hole interposed therebetween. The electronic device according to claim 5, wherein the center of the second connector is displaced by a predetermined distance from the center of the electronic component in the length direction of the first linear hole and toward the intersection side of the first linear hole and the second linear hole. **Claim 7** The electronic device according to claim 6, wherein the first linear hole, the second linear hole, and the third linear hole formed by extending the first linear hole, which are formed in a substantially L shape, are integrally formed as a substantially T shape as the hole. **Claim 8** It has a third connector mounted on the second substrate. The electronic device according to any one of claims 5 to 7, wherein the third connector is mounted in the first region. **Claim 9** The second linear hole is interposed between the electronic component and the third connector. The electronic device according to claim 8, wherein the center of the third connector is displaced by a predetermined distance from the center of the electronic component in the length direction of the second linear hole and toward the intersection side of the first linear hole and the second linear hole. **Claim 10** The electronic device according to claim 8 or 9, wherein the third connector is mounted on the surface of the second substrate opposite to the surface on which the electronic component is mounted. **Claim 11** The electronic device according to any one of claims 4 to 10, wherein the second region is a substantially rectangular region defined by two sides thereof by the first linear hole and the second linear hole and the other two sides by the outer periphery of the second substrate. **Claim 12** The electronic device according to any one of claims 1 to 11, wherein the hole has a size through which the cable can be inserted. **Claim 13** The electronic device is an imaging device, an imaging element is mounted on the first substrate, The electronic component is a control IC that controls the operation of the imaging device, and the electronic device according to any one of claims 1 to 12, characterized in that.

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