Electronic connection assembly

Abstract

To provide an electronic connection assembly.SOLUTION: The disclosure relates to an apparatus for connecting an electronic component to a conductor. A housing includes at least one slot and defines at least one component chamber for carrying the electronic component. A liquid coolant can pass through the housing. A pair of conductive members extends from the housing through the at least one slot and can be releasably inserted into a channel defined in a support assembly. The support assembly facilitates an electrical connection between the conductive members and corresponding conductive contact members connected to a corresponding power supply or electrical load. The support assembly can provide an inward sealing force to a seal on the housing circumscribing the pair of conductive members.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] Cross - Reference to Related Applications This application claims the benefit of U.S. Patent Application No. 17 / 846,711, filed Jun. 22, 2022, which is hereby incorporated by reference in its entirety.

[0002] Description of Research and Development Sponsored by the Federal Government This invention was made with government support under Contract No. W911NF1820101 awarded by the U.S. Government. The U.S. Government has certain rights in this invention.

[0003] The present disclosure generally relates to electronic assemblies, and more particularly to enclosures having insertable interconnect arrangements for power module components and structures for conductor support.

Background Art

[0004] Conventional power systems manage the supply of power from a power source, such as a generator, to an electrical load. In one example, a gas turbine engine is used for the propulsion of an aircraft and typically provides mechanical power that ultimately powers several different accessories, such as a generator, a starter / generator, a permanent magnet alternator (PMA), a fuel pump, and a hydraulic pump, for equipment for functions other than the propulsion required in the aircraft. For example, modern aircraft require power for avionics, motors, and other electrical equipment. A generator coupled to a gas turbine engine converts the mechanical power of the engine into electrical energy, which is distributed throughout the aircraft by electrically coupled nodes of the power distribution system.

[0005] The increasing demand for power electronic devices to manage high power density in such power systems has led to the development of power electronic modules or power modules. A power module is an assembly typically containing several power components, such as power semiconductor devices interconnected to perform a power conversion function. Power modules are used in industrial motor drives, uninterruptible power supplies, and power conversion equipment such as inverters. A power module provides packaging or physical containment for a set of power semiconductor components. Power semiconductors (or "dies") are typically soldered or sintered onto a power electronic substrate that supports the power semiconductors and provides electrical and thermal contact, as needed, as well as electrical insulation. More recently, power modules are increasingly adopting power-overlay (POL) module-style packaging and interconnection systems. Such POL modules use multiple layers of conductive and insulating materials to support power semiconductor devices, provide electrical interconnections between the semiconductor devices and external circuits, and manage the heat generated during normal operation.

Summary of the Invention

Means for Solving the Problems

[0006] A complete and enabling disclosure, including the best mode contemplated by one of ordinary skill in the art, is set forth in this specification with reference to the accompanying figures.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

[0008] Aspects of the present disclosure are directed to methods for connecting and cooling electrical components. For purposes of illustration, the present disclosure is described in the context of one exemplary environment of an aircraft power system. It will be understood that aspects of the present disclosure may have general applicability to applications other than aircraft, such as any power system, as well as other mobile and non-mobile industrial applications, commercial applications, and residential applications.

[0009] A typical power electronics device chip is generally interconnected with fragile wire bonding or ribbon bonding that extends above the device surface on one side and defines a major heat extraction path from the chip to the other side of the device. Conventional wire-bonded or ribbon-bonded devices have not allowed for easy two-sided cooling or stacking of power modules. This has led to a two-dimensional or planar "tiling" device configuration that attaches to a separate planar cooling plate. Such cooling plates have additional thermal resistance in the heat transfer path and have lower thermal performance relative to direct-contact forced convection in the device itself.

[0010] Also, the performance of the cooling fluid varies for different types of fluids. Electrically insulating cooling fluids (e.g., oil) generally have lower thermal performance for a given pump power compared to other less insulating cooling fluids (e.g., water) for direct-contact cooling.

[0011] Some prior art power electronic devices and systems use cooling by direct liquid impingement on multiple sides of the device. For example, electronic components such as power overlay (POL) packaging and interconnection device modules (“tiles”) are fabricated in a wire-bondless configuration that provides a compact planar form factor. Such POL modules can be inserted into a housing that provides direct contact or impingement jets of cooling liquid positioned directly adjacent to a portion of the POL module that requires cooling, such as a silicon carbide (SiC) chip or bus bar. Such a housing requires a leak-free feed-through through which the POL module can be inserted and electrical connections to other devices.

[0012] The various aspects of the POL modules disclosed herein are described and depicted as including specific arrangements of semiconductor devices, electrical interconnections, and electronic package terminals, but alternative arrangements and configurations may be implemented, and thus it is understood that the aspects are not limited only to the devices and arrangements clearly illustrated. That is, the aspects described herein can include additional electronic components and, additionally or alternatively, can encompass electronic equipment packages that can include semiconductor devices of one or more alternative device types, including, for example, acoustic devices, microwave devices, millimeter devices, RF communication devices, and microelectromechanical (MEMS) devices.

[0013] Aspects of POL modules and module devices as disclosed herein may contemplate a semiconductor device module or power module that provides interconnection and physical support or housing for one or more semiconductor devices that define a topology. The aspects described herein may also include one or more resistors, capacitors, inductors, filters, switches, similar devices, and combinations thereof. As used herein, the terms "electrical component" and "electronic component" are to be understood to encompass not only any of the various types of semiconductor devices described above, but also resistors, capacitors, inductors, filters, similar passive devices, and energy storage components.

[0014] Conventional POL modules provide physical support for power components, including power semiconductor devices. These power semiconductors or dies are typically soldered or sintered to a power electronics substrate that supports the power semiconductor and provides electrical contact, thermal contact, and electrical insulation, thereby enabling a higher power density than discrete power components. One notable feature of conventional POL component architectures is the planar copper interconnection structure. Instead of conventional wire bonding, in a typical POL interconnection arrangement, devices are connected directly to device connection pads where passive elements (e.g., resistors, capacitors, and inductors) are installed or constructed, using vias formed through an insulating polyimide adhesive layer.

[0015] The conventional POL module manufacturing process typically begins with the placement of one or more power semiconductor devices on a dielectric layer using an adhesive. Next, metal interconnects (e.g., copper interconnects) are electroplated onto the dielectric layer using vias defined through the dielectric layer to form direct metal connections to the power semiconductor devices. The metal interconnects provide the formation of an input / output (I / O) system for the power semiconductor devices. Next, the POL components are soldered to an insulated metal substrate (e.g., a direct bond copper (DBC) substrate) using soldered interconnects for electrical and thermal connectivity. The gap around the semiconductor device between the dielectric layer and the ceramic substrate can be filled using a dielectric organic material.

[0016] The insulated metal substrate often consists of three layers, namely, a metal upper layer, a metal lower layer, and a ceramic insulating layer sandwiched therebetween. The insulating layer of the insulated metal substrate electrically insulates the metal upper layer from the metal lower layer. The metal layers are either directly adhered or brazed to the ceramic layer. The insulated metal substrate of metal can typically be soldered to a base plate on the opposite side (e.g., the lower side). In many cases, the base plate is formed of copper and is attached to the metal layer under the insulated metal substrate using soldering. The base plate is typically often mounted on a conventional heat sink. The conventional insulated metal substrate of metal is commonly used in POL modules for its thermal conductivity and rigidity to support semiconductor devices while providing an electrical interconnect configuration. The rigidity of the base plate provides additional structural support to the POL module. The insulating layer (intermediate) portion of the insulated metal substrate of metal can also provide electrical insulation between the semiconductor device and the heat sink or chassis.

[0017] Conventional POL modules are often used in power conversion devices, such as in AC drive and flexible AC transmission systems. A power conversion device is a circuit for power supply or power processing that converts an input voltage waveform into a specific output voltage waveform. A control device associated with the power conversion device manages the operation of the power conversion device by selectively controlling the conduction period of the switches used in the power conversion device. The switches used in the power conversion device are typically semiconductor switching devices (e.g., MOSFETs, IGBTs, etc.).

[0018] In combination with a control device, a drive circuit (e.g., a gate drive circuit) has conventionally been used to selectively provide drive signals to the control terminals (e.g., gate terminals) of each semiconductor switch so as to control the operation of the semiconductor switch in response to command signals (e.g., pulse width modulation (PWM) signals) from the control device.

[0019] For ease of description and understanding, it should be understood that the accompanying drawings are not necessarily drawn to scale and may be depicted schematically. For example, a particular element in the drawings may be larger or smaller than illustrated relative to other elements depicted in the drawings.

[0020] All references to directions (e.g., radial, axial, upward, downward, upwardly, downwardly, left, right, lateral, front, rear, top, bottom, above, below, vertical, horizontal, clockwise, counterclockwise) are used for purposes of identification only to assist the reader's understanding of the present disclosure and do not create limitations, particularly with respect to position, orientation, or its use. References to connections (e.g., attachment, coupling, connection, and linkage) are to be construed broadly and may include intermediate members between assemblies of elements and relative movement between elements unless otherwise indicated. Thereby, a reference to a connection does not necessarily imply that two elements are directly connected and in a fixed relationship to each other. In non-limiting examples, a connection or disconnection may be selectively configured to provide, enable, or disable an electrical connection between respective elements, etc.

[0021] "Sets" of various elements are described, and it is understood that a "set" can include any number of each element, including only one element. Also, terms such as "voltage", "current", and "power" may be used in this specification, and it will be apparent to those skilled in the art that these terms may be interchangeable when describing electrical circuits or aspects of circuit operation.

[0022] The present disclosure can be implemented in an electrical circuit environment. One non-limiting example of an electrical circuit environment that can include aspects of the present disclosure can include the architecture of an aircraft power system, which enables the generation of power from at least one spool of a turbine engine, such as a gas turbine engine, and sends the power to a set of electrical loads through at least one solid-state switch, such as a solid-state power control device (SSPC) switching device. One non-limiting example of an SSPC can be a metal-oxide-semiconductor field-effect transistor (MOSFET), such as a high-power switch based on silicon carbide (SiC) or gallium nitride (GaN). SiC or GaN can be selected based on their solid material structure, ability to handle large voltages and large power levels in a smaller and lighter form factor, and their high-speed switching ability. Additional switching devices or additional silicon-based power switches can be included.

[0023] The exemplary drawings are for illustrative purposes only, and the dimensions, positions, orders, and relative sizes reflected in the drawings attached to this specification may vary.

[0024] FIG. 1 is a partially exploded and simplified schematic view of an exemplary connection assembly 10 (hereinafter, "connection assembly 10") for an electronic component according to various aspects described herein. The connection assembly 10 enables an electrical connection between an electronic component 14 and an external conductor or electrical circuit. The electronic component 14 is herein represented in an exemplary form of a conventional power over lay POL module 14 for ease of description and understanding, but other aspects of the present disclosure are not so limited. In other non-limiting aspects, the electronic component 14 can be any suitable electronic component, including a printed circuit board (PCB) card or a PCB module, without departing from the scope of the present disclosure herein.

[0025] The connection assembly 10 may comprise a set of housings 12 that can be coupled to the support assembly 22. The set of housings 12 may be integrally coupled to form a single body or housing 12. Each of the housings 12 can carry a corresponding POL module 14. Each POL module 14 can extend from its respective first end 16 (e.g., output end) to its respective second end 18 (e.g., input end). The POL module 14 can be partially positioned therein with its respective first end 16 extending through an opening (not visible in FIG. 1) from inside the corresponding housing 12. In a non-limiting aspect, while the first end 16 can define a conductive member portion 70 extending from the housing 12, the second end 18 can define an electrical device portion 69 (not visible in FIG. 1) received within the housing 12. The conductive member portion 70 can comprise a first conductive member 71 and a second conductive member 72. For example, in one aspect, the first conductive member 71 and the second conductive member 72 can be rigid and conductive busbars or blades. In a non-limiting aspect, an electrical insulation layer 73 can be disposed between the first conductive member 71 and the second conductive member 72. The electrical insulation layer 73 can electrically insulate the first conductive member 71 from the second conductive member 72. In this way, in a non-limiting aspect, the conductive member portion 70 can define a substrate, the first conductive member 71 is the first layer of the substrate, the second conductive member 72 is the second layer of the substrate, and the first conductive member 71 and the second conductive member 72 are separated by the insulation layer 73 of the substrate.

[0026] In a non-limiting aspect, the support assembly 22 may comprise an insulating base 43. In some aspects, the insulating base 43 may comprise a first insulating base 43a and a second insulating base 43b. The first insulating base 43a may be attachable to the second insulating base 43b. The support assembly 22 may define an input portion 22a and an output portion 22b. The input portion 22a may be disposed between a set of the housing 12 and the output portion 22b. For example, in a non-limiting aspect, the input portion 22a can comprise the first insulating base 43a and the output portion 22b can comprise the second insulating base 43b. The first insulating base 43a may comprise a housing interface surface 21 disposed to face the set of the housing 12 and an opposite first interface surface 54 disposed to face the output portion 22b. The second insulating base 43b may comprise a second interface surface 59 disposed to face the input portion 22a. Although FIG. 1 depicts the input portion 22a and the output portion 22b as having separate structures (i.e., the first insulating base 43a and the second insulating base 43b), it is understood that in other non-limiting aspects, the input portion 22a and the output portion 22b can be formed as an integral structure or base 43. In such an aspect, the first interface surface 54 may be omitted.

[0027] The input portion 22a of the support assembly 22 can define a set of first input openings 23. Each first input opening 23 can correspond to each of the first conductive member 71, the second conductive member 72, or both, and can be sized and arranged to accept through itself each of the first conductive member 71, the second conductive member 72, or both insertably. Also, the input portion 22a can define a set of first output openings (not shown) corresponding to each of the first input openings 23. Each first output opening can also correspond to the first conductive member 71, the second conductive member 72, or both, and can be sized to accept through itself each of the first conductive member 71, the second conductive member 72, or both insertably. In a non-limiting aspect, the output portion 22b of the support assembly 22 can define a set of second input openings 27. Each second input opening 27 can correspond to each of the first conductive member 71, the second conductive member 72, or both, and can be sized and arranged to accept through itself each of the first conductive member 71, the second conductive member 72, or both insertably.

[0028] In operation, the set of housing 12 can be moved in a first direction 75 to insert each first conductive member 71 and second conductive member 72 extending from housing 12 through the corresponding first input opening 23, through the input portion 22a, through the corresponding second input opening 27, and into the output portion 22b. In this way, each first conductive member 71 and second conductive member 72 can be operably inserted into the support assembly 22 and electrically coupled to corresponding conductors (not shown) disposed in the support assembly 22. In a non-limiting aspect, the corresponding conductors can also be fixedly and electrically coupled to respective AC output conductors 33 such as bus bars, terminals, conductors, or protrusions of the output of an external circuit or device disposed outside the output portion 22b. Also, the corresponding conductors can alternatively be electrically coupled to respective conductive DC input members (not shown) such as bus bars, terminals, conductors, or protrusions of the input of an external circuit or device disposed outside the output portion 22b.

[0029] In a non-limiting aspect, the connection assembly 10 can be in the form of a modular assembly. In the example shown, one housing 12 and one POL module 14 can collectively define a module unit 20. Additionally, or alternatively, the module unit 20 can be defined by a single housing 12 that receives a plurality of POL modules 14. Each module unit 20 can be integrally fastened, stacked, or otherwise coupled to extend in at least two directions, such as horizontally and vertically, in a non-limiting example. In this approach, the connection assembly 10 can have a plurality of modular units integrally coupled and arranged along a plurality of directions to form a multi-dimensional assembly with an increased power density to meet the power demand.

[0030] In one non-limiting example, the connection assembly 10 may include one or more fluid connectors 15 (schematically shown in dashed lines). Such fluid connectors 15 can provide, in non-limiting examples, a fluid inlet to the module unit 20, a fluid outlet to the module unit 20, or a fluid connection between two module units 20.

[0031] In operation, a power signal or a communication signal such as a gate drive signal may be provided to the POL module 14 via a pin array connector (not shown) electrically coupled to the POL module 14 at the second end 18. In a non-limiting aspect, the POL module 14 may be provided with a DC electrical input and be capable of providing an AC electrical output. For example, in operation, the POL module 14 may be supplied with DC power at the first end 16 via one of the first conductive member 71 or the second conductive member 72, such as via a battery, a DC-DC converter, or other power source (not shown). The POL module 14 may be configured to convert DC power to AC power in a known manner. The POL module 14 can switchably send the AC power to a connected device (not shown) via the other of the first conductive member 71 or the second conductive member 72 at the first end 16. In this way, in a non-limiting aspect, DC power can be provided to one of the first conductive member 71 or the second conductive member 72 of each POL module 14 via a DC bus member, and the AC power can be sent from each POL module 14, through the other of the first conductive member 71 or the second conductive member 72, to each AC output conductor 33, and then to a connected electrical circuit (not shown).

[0032] Figure 2 shows an exemplary module unit 20 with a housing 12, and shows a POL module 14 that can be utilized in a non - limiting aspect of the connection assembly 10. The POL module can, in itself, support a set of electrical devices 24. The housing 12 includes an outer wall 57 that defines the boundary of an inner portion 36. Thus, the outer wall 57 can also define an outer portion 41. In one aspect, the housing can include at least one fluid inlet 42 and a fluid outlet 44. At least one insertion opening in the form of a first slot 38 can extend through the outer wall 57 into the inner portion 36. In one aspect, the first slot 38 can extend from the outer portion 41 through the outer wall 57 into the inner portion 36. The POL module 14 can be inserted into the housing 12 through the first slot 38 as shown.

[0033] In a non - limiting aspect, the housing 12 can define a first sealing surface 31a that surrounds the first slot 38. Additionally, or alternatively, the housing 12 can define a second sealing surface 31b that surrounds the first slot 38. In a non - limiting aspect, the first sealing surface 31a and the second sealing surface 31b can be arranged orthogonal to each other.

[0034] In a non - limiting aspect, the conductive member portion 70 can protrude from the housing 12. For example, a first conductive member 71 and a second conductive member 72 can extend from the first slot 38 with an insulating layer 73 disposed between the first conductive member 71 and the second conductive member 72. In a non - limiting aspect, the electrical device portion 69 can be received within the inner portion 36. The second end 18 of the POL module can optionally protrude from the opposite side of the housing 12. As shown, the second end 18 can include a pin - array connector 26 for connection to other electrical devices, if desired.

[0035] Optionally, an insulator or dielectric coating 25 may be provided on any part of the POL module 14, including over a set of electrical devices 24 or over the entire POL module 14. Such a coating 25 may include any suitable insulating material, including silicone or parylene in non-limiting examples.

[0036] A set of sealing elements 28 may be provided to the connection assembly 10. In a non-limiting aspect, the set of sealing elements 28 may comprise a first seal 30 and a second seal 32. As shown, the first seal 30 can be disposed proximal to the first end 16 and the second seal 32 can be disposed proximal to the second end 18. In the example shown, the first seal 30 is coupled to the POL module 14. For example, the first seal 30 can engageably surround or enclose a portion of the POL module 14 to form a seal therebetween. Additionally or alternatively, the sealing element 28 can be coupled to either or both of the housing 12 or the POL module 14. For example, the first seal 30 can include a first surface 35 of the sealing element and a second surface 34 of the sealing element. In the example shown in FIG. 2, the first surface 35 of the sealing element can be arranged to sealingly engage with a first sealing surface 31a and the second surface 34 of the sealing element can be arranged to sealingly engage with a second sealing surface 31b.

[0037] The sealing element 28 can be formed from any suitable material including, but not limited to, rubber, silicone, dielectric material, polymer material, composite material, glass fiber material, etc., or combinations thereof. Also, although shown as including a pair of seals, the set of sealing elements 28 can include any number of seals, including just one, or three or more. In other non-limiting examples, the sealing element 28 can be formed as a single entity that is coupled to the POL module 14 at multiple locations, such as a U-shaped seal body that is coupled to the POL module 14 at its distal end. Still further, although the sealing element 28 is shown generally as a rectangular annular element, this is for purposes of visual clarity only and the design, size, and shape of the sealing element 28 are not limited thereto. The sealing element 28 can have not only any suitable geometric profile, but also other components including, as is technically known, a locking mechanism or fastener, etc. Any suitable method or process of manufacture can be utilized when forming the connection assembly 10, including casting, machining, or additive manufacturing.

[0038] As used herein, "additive manufacturing" (AM) refers to a process in which components are built layer by layer by the continuous deposition of material. AM is an appropriate name to represent a technology for building three-dimensional (3D) objects by adding layer upon layer of material, whether the material be plastic or metal. AM technology can utilize computers, 3D modeling software (computer-aided design or CAD), machinery, and layer-forming materials. Once a CAD schematic is created, the AM device can read the data from the CAD file and place or add successive layers of liquid, powder, sheet material, or other materials in a layer-upon-layer fashion to fabricate the 3D object. The term "additive manufacturing" encompasses many technologies, including subsets such as 3D printing, rapid prototyping (RP), direct digital manufacturing (DDM), layer manufacturing, and solid freeform fabrication. Non-limiting examples of additive manufacturing that can be utilized to form additively manufactured components include powder bed fusion, vat photopolymerization, binder jetting, material extrusion, directed energy deposition, material jetting, or sheet lamination.

[0039] Figure 3 shows a schematic cross-section of the housing 12 with the POL module 14 attached thereto. For visual clarity, the coating 25 is not shown in Figure 3. It is understood that any part of the POL module 14 may include the coating 25.

[0040] The housing 12 may comprise a second slot 40 that passes through an outer wall 57 extending into the inner portion 36. In the illustrated example, the second slot 40 is in registry with the first slot 38, although this is not necessarily the case. The first end 16 of the POL module 14 is positioned adjacent to the first slot 38. The second end 18 of the POL module 14 is positioned adjacent to the second slot 40. In this approach, the second end 18 may be received by, or extend through, the second slot 40 via movement of the POL module 14 in, for example, the second direction 76. The second end 18 may extend from the housing 12 to provide external access to the pin array connector 26. In other examples, the second end 18 may remain within the housing 12 when the POL module 14 is inserted through the first slot 38 without the need for a second slot 40.

[0041] The POL module 14 may include a conductive substrate 8. The POL module 14 may further include an upper conductive layer 9 (e.g., a metallization layer) disposed on a first side (e.g., the upper side in the figure) of the dielectric layer 5 that is electrically insulating or non-conductive. The upper conductive layer 9 may include or define a set of conductive traces. The dielectric layer 5 may include a second side opposite the first side (e.g., the lower side of the figure). The dielectric layer 5 may define a set of openings (not shown) that extend through itself from the first side to the second side. In an aspect, the upper conductive layer 9 may extend through the openings to define a set of vias 7 that extend through the dielectric layer 5. A set of electrical devices 24 may be disposed on the second side of the dielectric layer 5. As shown, the POL module 14 may define a substantially planar arrangement of a set of electrical devices 24 disposed in the dielectric layer 5 and defining a first planar footprint. The upper conductive layer 9 may be electrically coupled to the set of electrical devices 24. For example, in one aspect, the upper conductive layer 9 may be electrically connected to the set of electrical devices 24 using a set of vias 7 defined through the dielectric layer 5. In a non-limiting aspect, a first conductive member 71 may be at least partially disposed within the housing 12 and may be electrically coupled to the upper conductive layer 9. A second conductive member 72 may be partially disposed within the housing 12 and may be electrically coupled to the conductive substrate 8.

[0042] The set of electrical devices 24 can include a semiconductor switching device 24, such as, for example, a MOSFET-type switch. In such an embodiment, the semiconductor switching device 24 can comprise terminals for each gate ("G"), source ("S"), and drain ("D") (not shown). In a non-limiting embodiment, the semiconductor switching device 24 can include a first side (e.g., the upper side in the figure) and an opposite second side (e.g., the lower side in the figure). In a non-limiting embodiment, the gate terminal G and the drain terminal D of the semiconductor switch can be disposed on both sides of each semiconductor switching device 24. In a non-limiting embodiment, the source terminal S and the gate terminal G can be disposed on the first side of each semiconductor switching device 24, and the drain terminal D can be disposed on the opposite second side of each semiconductor switching device 24. For example, in one embodiment, the upper conductive layer 9 of the POL module 14 can be electrically coupled to the set of semiconductor switches (e.g., to the source terminal S and the gate terminal G) using conductive vias.

[0043] In a non-limiting aspect, the conductive substrate 8 may comprise an insulated metal substrate such as a conventional DBC substrate. The conductive substrate 8 may define a first conductive layer 8a (e.g., the upper layer) and a second conductive layer 8b of opposite conductivity (e.g., the lower layer). The first layer 8a and the second layer 8b of the conductive substrate 8 may be made of a conductive material (e.g., copper). An electrically insulating layer 8c may be disposed between the first layer 8a and the second layer 8b of the conductive substrate 8 to electrically insulate the first layer 8a from the second layer 8b. The first layer 8a may be electrically coupled (e.g., soldered) to a set of electrical devices 24. For example, in a non-limiting aspect, the first layer 8a may be electrically coupled to each of one or more drain terminals D of a semiconductor switch. In a non-limiting aspect, the first layer 8a of the conductive substrate 8 can be electrically coupled to the upper conductive layer 9 using vias 7. The conductive substrate 8 may be arranged to support the electrical devices 24 while simultaneously providing an electrical interconnect structure. In a non-limiting aspect, the conductive substrate 8 can extend from the first end 16 of the housing 12. Further, as shown, the first layer 8a can provide a connection surface for electrically coupling the second conductive member 72 to the conductive substrate 8.

[0044] The set of electrical devices 24 may include solid switching devices, gate devices configured to operate the gates of the respective solid switching devices, rectifying components such as diodes, power storage devices such as batteries, or combinations thereof. For example, the set of electrical devices 24 may further include a set of gate driver devices (e.g., MOSFET gate driver devices) that are electrically coupled to semiconductor switches and configured to selectively operate the respective gates of the semiconductor switches, such as by providing a gate drive signal (not shown) in a known manner.

[0045] It is further contemplated that the housing 12 can provide liquid impingement cooling of the POL module 14. More specifically, the outer wall 57 of the housing 12 can define at least one fluid inlet 42 and a fluid outlet 44. A plurality of fluid inlets 42 and a plurality of fluid outlets 44 can be provided, but this is not necessarily the case. The first fluid passage 46 and the second fluid passage 48 can be positioned within the housing 12 and can be fluidly coupled to at least one fluid inlet 42.

[0046] The component chamber 52 in the form of an impingement chamber can be positioned between the first fluid passage 46 and the second fluid passage 48 and can be fluidly coupled to the fluid outlet 44. The first inner wall 61 divides the first fluid passage 46 from the component chamber 52. The second inner wall 58 divides the second fluid passage 48 from the component chamber 52. In this approach, the first inner wall 61 can form the first side of the component chamber 52 and the second inner wall 58 can form the second side of the component chamber 52.

[0047] The first impinging atomizer 66 and the second impinging atomizer 68 direct the impinging streams towards the POL module 14. The impinging atomizers can be positioned on opposite sides sandwiching the POL module 14, or on opposite sides sandwiching the component chamber 52. As shown, one possible implementation is to incorporate the first impinging atomizer 66 and the second impinging atomizer 68 into respective first inner wall 61 and second inner wall 58. In the example shown, the first impinging atomizer 66 is in the form of a first set 67 of impinging holes extending through the first inner wall 61, and the second impinging atomizer 68 is in the form of a second set 69 of impinging holes extending through the second inner wall 58. The first impinging atomizer 66 and the second impinging atomizer 68 can have any suitable form, including, in non-limiting examples, circular holes, rectangular holes, injection nozzles, or shower head nozzles. In other non-limiting examples, either or both of the first impinging atomizer 66 and the second impinging atomizer 68 can comprise an atomizer body or nozzle coupled to a liquid supply pipe. Either or both of the first impinging atomizer 66 or the second impinging atomizer 68 can also fluidly couple respective first fluid passage 46 and second fluid passage 48 to the central component chamber 52, as shown. In this approach, the first inner wall 61 and the second inner wall 58 can at least partially define the component chamber 52.

[0048] Several impingement sprayers can be provided. Also, any number of impingement holes can be provided in a first set 67 of impingement holes and a second set 69 of impingement holes. In the illustrated example, the first set 67 of impingement holes includes fewer impingement holes than the second set 69 of impingement holes, although this need not necessarily be the case. For example, the POL module 14 may have separate or local heated regions or “hot spots” during operation. In such cases, an impingement sprayer or group of impingement holes can be positioned adjacent to or facing such regions to provide local impingement cooling. The number and positioning of the impingement sprayers can be adapted to the power overlay module for improved cooling and efficiency. Further, the relative size, positioning, and arrangement of the impingement sprayers can be adjusted or adapted based on the velocity of fluid flow through the liquid supply piping. In one non-limiting example, the supply piping and impingement sprayers can be configured to provide a fluid velocity or injection velocity through the impingement sprayers between 0.1 m / s and 1 m / s, between 1 m / s and 3 m / s, or greater than 3 m / s.

[0049] When the POL module 14 is inserted into the component chamber 52, such as by moving the POL module 14 in a second direction 76, the seals 30, 32 can abut or contact corresponding inner surfaces of the housing 12. In a non-limiting aspect, the second direction 76 can be opposite the first direction 75. In the illustrated example, the first seal 30 abuts a first sealing surface 31a adjacent the first slot 38 and the second seal 32 abuts a second surface 78 adjacent the second slot 40, although this need not necessarily be the case. The sealing element 28 can provide a fluid seal for the component chamber 52 and prevent leakage through the first slot 38 or the second slot 40. In this manner, the first inner wall 61, the second inner wall 58, and the seals 30, 32 (sealing element 28) can at least partially define the component chamber 52.

[0050] Referring generally to FIGS. 1 - 3, heat can be generated by a set of electrical devices 24 in the POL module 14 during operation. A liquid coolant 90, such as water, water - ethylene glycol, oil, or a dielectric fluid, can flow into the housing 12 through at least one fluid inlet 42. In a non - limiting example where the POL module 14 includes a dielectric coating 25, water can be used as the liquid coolant 90 while maintaining the electrical insulation of the components in the POL module 14.

[0051] More specifically, the liquid coolant 90 can enter the first fluid passage 46 and the second fluid passage 48, flow through the first and second impingement sprayers 66, 68, impinge on both sides of the POL module 14 within the component chamber 52, and then exit the housing 12 through the fluid outlet 44. In this approach, the liquid coolant circuit 92 can pass through the housing 12 from at least one fluid inlet 42 to at least one of the first fluid passage 46 or the second fluid passage 48, to at least one of the first impingement sprayer 66 or the second impingement sprayer 68, to the component chamber 52, and to the fluid outlet 44. The supply pipe 94 can be at least partially defined by the at least one fluid inlet 42 and one or both of the first and second impingement sprayers 66, 68. The return pipe 96 can be at least partially defined by the component chamber 52 and the fluid outlet 44. The supply pipe 94 and the return pipe 96 can at least partially form the liquid coolant circuit 92. In this approach, the housing 12 can provide liquid impingement cooling on at least two sides of the inserted POL module 14.

[0052] In one possible implementation, it is also contemplated that the liquid coolant 90 can be recirculated between the return pipe 96 and the supply pipe 94. In the example shown, the liquid coolant 90 can be pumped from the reservoir 91 by the pump 93. The pump 93 can direct the liquid coolant 90 towards the supply pipe 94 for collision cooling of the POL module 14. The return pipe 96 can direct the liquid coolant 90 out of the housing 12 and towards a heat exchanger 95 or other cooling mechanism for removing the excess heat contained in the coolant from the POL module 14. The cooled liquid coolant 90 can then be directed to return to the supply pipe 94 for further or continued collision cooling of the POL module 14 within the housing 12. The reservoir 91, the pump 93, and the heat exchanger 95 are shown along a common portion of the liquid coolant circuit 92 for visual clarity. As is technically known, it is understood that the liquid coolant circuit 92 can include not only other parts or branches, etc., but also other components such as valves or switches.

[0053] FIG. 4 depicts another exemplary aspect of the connection assembly 10 in a partial cross-section. In this example, the housing 12 includes a pair of POL modules 14 (i.e., a first POL module 14 and a second POL module 14) disposed in respective component chambers 52. Each POL module 14 includes first and second conductive members 71, 72 extending therethrough from the first slot 38, respectively. As depicted, in a non-limiting aspect, each of the first and second conductive members 71, 72 can extend through its respective first slot 38. The support assembly 22 can include an insulating base 43 having a set of support passages 60 defined therethrough and sized and arranged to receive the respective first conductive member 71 and second conductive member 72. The support assembly 22 can include a set of first contact members 37a and a set of second contact members 37b. In a non-limiting aspect, the set of first contact members 37a can be associated with a DC electrical circuit (not shown) to define a set of DC contact members 37a, and the set of second contact members 37b can be associated with an AC electrical circuit (not shown) to define a set of AC contact members 37b. In a non-limiting aspect, the set of DC contact members 37a and the set of AC contact members 37b can be supportably held by the insulating base 43. A set of biasing members 39 can be arranged to cooperate with the respective DC contact members 37a or the respective AC contact members 37b to electrically couple the DC contact members 37a or the AC contact members 37b to the respective first conductive member 71 or second conductive member 72. A conductive first DC bus member 81 and a conductive second DC bus member 82 can be electrically coupled to the respective DC contact members 37a. In one aspect, the first and second DC bus members 81, 82 can be disposed within the insulating base 43. The set of AC contact members 37b can be arranged to be electrically coupled to respective AC output conductors 33 (e.g., single-phase AC output conductors).

[0054] The support assembly 22 may include an input portion 22a and an output portion 22b. The input portion 22a can include a first insulating base 43a, and the output portion 22b can include a second insulating base 43b. A set of first passages 29 may be defined through the first insulating base 43a, and a corresponding set of second passages 51 may be defined through the second insulating base 43b. In a non-limiting aspect, each first passage 29 can cooperate with a corresponding second passage 51 to define respective support passages 60 that pass through the support assembly 22 by being aligned or juxtaposed. Each first passage 29 and the corresponding second passage 51 can be sized and arranged to acceptably receive respective first conductive members 71 and second conductive members 72 therethrough.

[0055] In a non-limiting aspect, the DC contact member 37a and the AC contact member 37b can be formed of copper or other conductive material. The DC contact member 37a and the AC contact member 37b can be firmly fixed within one of the first insulating base 43a and the second insulating base 43b. The DC contact member 37a and the AC contact member 37b are arranged to electrically couple respective first conductive members 71 and second conductive members 72 to respective ones of the DC contact member 37a and the AC contact member 37b by slidably receiving one of each of the first conductive members 71 and the second conductive members 72 within respective passages 60. Each biasing member 39 can cooperate with the respective DC contact member 37a or the respective AC contact member 37b to increase the contact force between the DC contact member 37a or the AC contact member 37b and the respective first conductive member 71 or the second conductive member 72. The DC contact member 37a can be electrically coupled to one of each of the first DC bus member 81 and the second DC bus member 82. The AC contact member 37b can be electrically coupled (e.g., fastened) to respective AC output conductors 33 via respective bolts 50. The bolts 50 can extend through an opening (not shown) defined through the second insulating base 43b.

[0056] In a non-limiting aspect, the biasing member 39 can be a spring element such as a leaf spring or a coil spring. In certain non-limiting aspects, the biasing member 39 can be formed from copper, steel, or other conductive materials. In other non-limiting aspects, the biasing member 39 can be formed from non-conductive materials.

[0057] In a non-limiting aspect, one or more of the biasing members 39 can cooperate with respective DC contact members 37a or respective AC contact members 37b to apply or exert a first force 47a in a third direction 77 (e.g., upward). Also, one or more of the biasing members 39 can cooperate with respective DC contact members 37a or respective AC contact members 37b to apply a second force 49a in a fourth direction 79 (e.g., downward).

[0058] The input portion 22a can define a set of first output openings 45 defined therethrough corresponding to each of the first input openings 23. Each of the first passages 29 can be aligned with and extend between a corresponding first input opening 23 and first output opening 45. Each of the first passages 29, the corresponding first input opening 23, and the first output opening 45 can correspond to respective first conductive members 71 and second conductive members 72. Each of the first passages 29, the corresponding first input opening 23, and the first output opening 45 can be sized and arranged to cooperatively receive respective first conductive members 71 and second conductive members 72 therethrough in a first direction 75. For example, the first insulating base 43a can have a set of first passages 29 sized to define therethrough and extend between the first input opening 23 and the first output opening 45 and operably receive respective first conductive members 71 and second conductive members 72 therethrough.

[0059] The output portion 22b of the support assembly 22 may define a set of second input openings 27 (see FIG. 1) and corresponding second passages 51. Each second passage 51 can be aligned with a corresponding second input opening 27. In a non-limiting aspect, each second passage 51 can be at least partially aligned with a respective contact member 37. Each second passage 51 and second input opening 27 can correspond to respective first conductive members 71 and second conductive members 72. Each second passage 51 and second input opening 27 can be sized and arranged to cooperate to receive respective first conductive members 71 and second conductive members 72 therethrough in a first direction 75.

[0060] For example, the second insulating base 43b can be defined through itself to enable an electrical connection between respective first conductive members 71 or second conductive members 72 and one or more respective DC contact members 37a and AC contact members 37b, and can have a set of second passages 51 sized to operably receive respective first conductive members 71 and second conductive members 72.

[0061] In a non-limiting aspect, each first passage 29 can cooperate to define respective support passages 60 by being aligned or juxtaposed with a corresponding second passage 51. In a non-limiting aspect, each respective first conductive member 71 and second conductive member 72 can be supported by at least one of respective DC contact members 37a, AC contact members 37b, and respective biasing members 39 disposed in the support passages 60.

[0062] In a non-limiting aspect, the support assembly 22 can be more advantageously arranged to operably provide a sealing force 80 to the sealing element 28 (e.g., seal 30). For example, the housing boundary surface 21 (see FIG. 1) of the first insulating base 43a can define one or more sealing surfaces 53. In a non-limiting aspect, the sealing surface 53 can be defined by protrusions 53a on opposite sides sandwiching the passage 60. The sealing surface 53 can be configured to be received in the first slot 38 on each side of the first and second conductive members 71, 72. The sealing surface 53 can be arranged to be aligned or engaged with the corresponding first seal 30 of the housing 12 when the set of first conductive members 71 is fully inserted into the support assembly 22. The sealing surface 53 can operably apply the sealing force 80 to the respective first seals 30 in a second direction 76. As shown, in one aspect, the second direction 76 can be an inward direction with respect to the housing 12. In a non-limiting aspect, at least one of a third direction 77 and a fourth direction 79 can be substantially orthogonal to the second direction 76. By the sealing surface 53, the sealing force 80 applied to the corresponding first seal 30 can provide improved fluid sealing of the corresponding component chamber 52.

[0063] FIG. 5 shows a simplified schematic view, in part in cross-section, of another non-limiting embodiment of the connection assembly 10 with the first and second conductive members 71, 72 inserted into respective support passages 60 defined in the base 43. One notable difference between the connection assembly of FIG. 5 and the connection assembly shown in FIG. 4 is that the example of FIG. 5 does not include the sealing element 28 or the liquid coolant 90. As shown, the housing 12 partially surrounds respective POL modules 14 disposed in the housing 12 with the respective first and second conductive members 71, 72 extending from the housing 12. Each pair of the first and second conductive members 71, 72 is receivable for insertion into respective support passages 60 defined in the insulating base 43 at respective second ends. As an example of the support shown, for each respective POL module 14, the respective first conductive member 71 can be electrically coupled to one of the upper conductive layer 9 or the conductive first layer 8a of the respective substrate 8, and the respective second conductive member 72 can be electrically coupled to the other of the upper conductive layer 9 or the conductive first layer 8a of the respective substrate 8.

[0064] The first DC bus member 81 can be coupled to a DC power source (not shown), such as a bus battery, a DC-DC converter, or other power source, disposed external to the insulating base 43 to receive a positive DC voltage V+. Similarly, in a non-limiting embodiment, the second DC bus member 82 can be coupled to a DC power source (not shown), such as a bus battery, a DC-DC converter, or other power source, disposed external to the insulating base 43 to receive a negative DC voltage V-. In a non-limiting embodiment, the first DC bus member 81 can be electrically coupled to respective DC contact members 37a, and the second DC bus member 82 can be electrically coupled to other respective DC contact members 37a. A set of AC contact members 37b can be coupled to corresponding AC output conductors 33.

[0065] As shown, the DC contact member 37a and the AC contact member 37b can be electrically coupled to one of each of the first conductive member 71 and the second conductive member 72. In a non-limiting aspect, each of the first conductive member 71 and the second conductive member 72 can be supported by one of the DC contact member 37a or the AC contact member 37b disposed on the insulating base 43. For example, in the non-limiting aspect shown in FIG. 5, the uppermost first conductive member 71 protruding from the housing 12 (i.e., in the upper portion of the housing 12 when looking at the figure) is shown to be electrically coupled to the uppermost DC contact member 37a, thereby electrically coupling the uppermost first conductive member 71 to the first DC bus member 81. Also, the uppermost second conductive member 72 protruding from the housing 12 (i.e., in the upper portion of the housing 12 when looking at the figure) is shown to be electrically coupled to the AC contact member 37b, thereby electrically coupling the uppermost second conductive member 72 to the AC output conductor 33. Further, as depicted in FIG. 5, the other or lowermost first conductive member 71 protruding from the housing 12 is shown to be electrically coupled to the AC contact member 37b, thereby electrically coupling the lowermost first conductive member 71 to the AC output conductor 33. Also, the other or lowermost second conductive member 72 protruding from the housing 12 is shown to be electrically coupled to the lowermost DC contact member 37a, thereby electrically coupling the lowermost second conductive member 72 to the second DC bus member 82.

[0066] In a non-limiting aspect, one or more of the biasing members 39 can cooperate with respective DC contact members 37a or AC contact members 37b to apply or exert a first force 47a in a third direction 77 (e.g., upward) on respective first conductive members 71 or second conductive members 72. Also, other ones of the biasing members 39 can cooperate with respective other DC contact members 37a or AC contact members 37b to apply a second force 49a in a fourth direction 79 (e.g., downward) on respective first conductive members 71 or second conductive members 72. In one aspect, the first force 47a and the second force 49a applied by respective biasing members 39 act to releasably hold respective first conductive members 71 or second conductive members 72 within the support assembly 22. In one aspect, the first force 47a and the second force can further act to increase the contact pressure between respective first conductive members 71 or second conductive members 72 and corresponding DC contact members 37a or AC contact members 37b.

[0067] In a non-limiting aspect, the biasing member 39 can be supported or held by respective DC contact members 37a or AC contact members 37b. For example, in a non-limiting aspect, respective cuts or first grooves 55 can be defined in respective DC contact members 37a, respective AC contact members 37b, or both. The first groove 55 can be sized to receive respective biasing members 39. Similarly, respective second grooves 56 can be defined in respective DC contact members 37a, respective AC contact members 37b, or both. The second groove 56 can be sized to receive respective biasing members 39. The biasing members 39 disposed in respective first grooves 55 can be arranged to apply a first force 47a in a third direction 77 to respective first conductive members 71 or second conductive members 72. The biasing members 39 disposed in respective second grooves 56 can be arranged to apply a second force 49a in a fourth direction 79 to respective first conductive members 71 or second conductive members 72. In an aspect, the third direction 77 can be opposite the fourth direction 79 such that the second force 49a is opposite the first force 47a. The first force 47a and the second force 49a can be of respective predetermined magnitudes to effect an increase in the contact pressure between respective first conductive members 71 or second conductive members 72 and corresponding DC contact members 37a or AC contact members 37b.

[0068] An increase in the contact pressure between the first conductive member 71 or the second conductive member 72 and the corresponding DC contact member 37a or AC contact member 37b reduces the electrical resistance therebetween, and as a result, results in a reduction in heating according to the current passing through each of the first conductive member 71 or the second conductive member 72, which is understood. Additionally, or alternatively, the first force 47a and the second force 49a can each be of a predetermined magnitude to effect an increased retention of the respective first conductive member 71 or second conductive member 72 within the support assembly 22. In a non-limiting aspect, the first force 47a and the second force 49a can be made substantially equal. In other aspects, the first force 47a and the second force 49a can each include any desired magnitude without departing from the scope of the present disclosure herein.

[0069] FIG. 6 shows a non-limiting aspect of a method 600 for cooling an electronic component 14 having a set of electrical devices 24 coupled to a substrate 19. In a non-limiting aspect, the electronic component 14 can comprise a POL module 14. For ease of understanding and description, method 600 is described with reference to non-limiting aspects as disclosed herein and depicted in FIGS. 1-4.

[0070] Method 600 begins at step 610 by placing POL module 14 in component chamber 52 defined within housing 12 having an inner portion 36 and an outer portion 41. In a non-limiting aspect, housing 12 may comprise an outer wall 57 that defines a boundary of inner portion 36. Outer wall 57 may also define outer portion 41. Inner portion 36 may define component chamber 52. Housing 12 may further define an opening or first slot 38 defined through outer wall 57 extending into inner portion 36. In one aspect, first slot 38 may extend from outer portion 41 through outer wall 57 into inner portion 36. POL module 14 may be placed into component chamber 52 by inserting POL module 14 through first slot 38 in a first direction 75. Each POL module 14 may extend from respective first end 16 (e.g., output end) to respective second end 18 (e.g., input end). In a non-limiting aspect, while first end 16 may define a conductive member portion 70 extending from housing 12, second end 18 may define an electrical device portion 69 received within housing 12. Conductive member portion 70 may comprise a first conductive member 71 and a second conductive member 72. In a non-limiting aspect, a portion of conductive member portion 70 of POL module 14 may project from housing 12. For example, first conductive member 71 and second conductive member 72 may extend from first slot 38 with an insulating layer 73 disposed between first conductive member 71 and second conductive member 72. In a non-limiting aspect, electrical device portion 69 may be received within inner portion 36.

[0071] In step 620, the first conductive member 71 and the second conductive member 72 can be electrically coupled to the POL module 14 at their respective second ends 18. The first and second conductive members 71, 72 can extend to the outer portion 41 of the housing 12 through the first slot 38 at their respective opposite first ends 16. For example, in a non-limiting aspect, the POL module 14 can be inserted into the housing 12 through the first slot 38. The first and second conductive members 71, 72 have at least partially their respective second ends 18 within the inner portion 36 of the housing 12 and can be positioned extending in a second direction 76 from the housing 12, for example, with their respective first ends 16 extending from the housing 12 through the first slot 38 to the outer portion 41. In a non-limiting aspect, the first slot 38 can cover the first conductive member 71 and the second conductive member 72. In a non-limiting aspect, the housing 12 can define a first sealing surface 31a surrounding the first slot 38. Additionally, or alternatively, the housing 12 can define a second sealing surface 31b surrounding the first slot 38. For example, the first sealing surface 31a and the second sealing surface 31b can be arranged orthogonal to each other.

[0072] The method may include, at step 630, placing the seal 30 of the sealing element 28 into the first slot 38 to fluidly seal the component chamber 52. For example, the seal 30 of the sealing element 28 may be arranged to surround a portion of the POL module 14 to form a seal between the POL module 14 and at least one of the first sealing surface 31a and the second sealing surface 31b. Additionally or alternatively, the seal 30 of the sealing element 28 can be sealingly coupled to either or both of the housing 12 or the POL module 14. For example, the seal 30 of the sealing element 28 may be arranged to sealingly engage the first sealing surface 31a and the second sealing surface 31b. In a non-limiting aspect, the sealing element 28 may comprise a first seal 30 and a second seal 32. The first seal 30 can be arranged proximal to the first end 16, and the second seal 32 can be arranged proximal to the second end 18. The sealing element 28 can at least partially surround a portion of the first conductive member 71 and the second conductive member 72 and fluidly seal the component chamber 52.

[0073] During operation of the POL module 14, it has been considered that heat can be generated by a set of electrical devices 24. The method can continue, at step 640, by placing a liquid coolant 90 into the component chamber 52 to cool the electrical devices 24. The liquid coolant 90 can be in thermal communication with the POL module 14. For example, in a non-limiting aspect, the liquid coolant 90 can be in thermal communication with one or more of the electrical devices 24. In a non-limiting aspect, the liquid coolant 90 can include water, water-ethylene glycol, oil, or a dielectric fluid.

[0074] Method 600 may include, at step 650, inserting first ends 16 of first and second conductive members 71, 72 into a support assembly 22. The support assembly 22 may comprise an electrically insulating base 43 that is coupleable to the housing 12. The insulating base 43 may define a set of support passages 60. Each support passage 60 may be configured to receive a respective first end 16 of the first and second conductive members 71, 72. For example, a first set of passages 29 may be defined through a first insulating base 43a, and a corresponding second set of passages 51 may be defined through a second insulating base 43b. Each first passage 29 may cooperate to define a respective support passage 60 by being aligned or juxtaposed with a corresponding second passage 51.

[0075] The support assembly 22 may include a set of conductive DC contact members 37a and a set of AC contact members 37b supported by the insulating base 43. Each DC contact member 37a and AC contact member 37b may be arranged to be electrically coupled to a respective first conductive member 71 or second conductive member 72. In a non-limiting aspect, a set of biasing members 39 may be supported by the insulating base 43. For example, each first biasing member 39 may be coupled to a respective DC contact member 37a or AC contact member 37b. The first biasing member 39 may be arranged to operably apply a first force 47a to the first conductive member 71 in a third direction 77. Also, the second biasing member 39 may be arranged to operably apply a second force 49a to the first end 16 of the second conductive member in a fourth direction 79. In an aspect, the fourth direction 79 may be opposite to the third direction 77. In a non-limiting aspect, at least one of the third direction 77 and the fourth direction 79 may be substantially orthogonal to the second direction 76. In a non-limiting aspect, the magnitude of the first force 47a may be substantially equal to the magnitude of the second force 49a.

[0076] The method may include, at step 660, providing or applying a sealing force 80 to a sealing element 28 (e.g., seal 30) via a support assembly 22. For example, the base 43 can define a sealing surface 53 that is operably engaged with the seal 30 of the sealing element 28 and is arranged to apply the sealing force 80 to the seal 30. In a non-limiting aspect, the sealing force 80 can be applied in a second direction 76. In some aspects, the second direction 76 can be substantially orthogonal to a third direction 77, a fourth direction 79, or both.

[0077] The method may include, at step 670, flowing a liquid coolant 90 through a supply pipe to first and second impinging sprayers 66, 68 positioned on opposite sides sandwiching an electronic component 14, and at step 680, spraying or discharging an impinging spray of the liquid coolant 90 from the first and second impinging sprayers 66, 68 onto at least two opposite faces of the electronic component 14 within the component chamber 52. The method may further include, at step 690, directing the sprayed liquid coolant out of the component chamber 52 through a return pipe fluidly coupled to the component chamber 52.

[0078] It is understood that steps or portions of the method can proceed in a different theoretical order, additional or intervening portions may be included, the described portions of the method may be divided into multiple portions, or the described portions of the method may be omitted without impairing the described method. Thus, the depicted flow is for illustrative purposes only and is not intended to limit method 600 in any way.

[0079] Aspects of the present disclosure provide various benefits. The liquid-cooled assemblies described herein can include replaceable building blocks or modules having substantially similar basic form factors (e.g., footprint, or common connections), which can provide low-cost manufacturability and an interactive arrangement to POL module assemblies or other power module assemblies. A common or reusable form factor can further result in higher process or manufacturing throughput and can result in different module configurations without significant design changes. Also, the described assemblies provide improved repairability because a given power overlay module can be easily removed, replaced, or serviced as needed. The sealed modular housing provides a compact, ultra-high power density assembly of multiple devices to a power electronics system. The housing designs described herein enable replaceable or permanently installed and sealed power electronics devices.

[0080] The use of direct liquid impingement or spray provides improved cooling of the power overlay module compared to conventional designs that utilize a heat spreader or conduction plate, etc. Multiple sides of the power overlay module, including both sides of the module, can be simultaneously cooled by direct liquid contact, thereby reducing the cooling time and improving the performance of the power overlay assembly. In examples where a dielectric coating is utilized on the module surface, the design of the power overlay module enables the use of a non-insulating cooling fluid (e.g., water), which has better cooling performance compared to an insulating fluid (e.g., oil), including in examples where an insulating coating is provided across the POL module.

[0081] More compact and efficient cooling techniques are needed for the future design of power electronics systems with higher power densities. Forced convection cooling with direct contact on two sides of the power electronics device can provide more efficient heat extraction on a shorter time scale compared to conventional methods. Forced convection using jet impingement or spraying can further enhance this heat extraction when locally higher heat transfer rates that can be directly targeted are present on both sides of each of the components generating internal heat. The enclosed modular housing as described herein enables a three-dimensional configuration with a higher power density that is better suited to meet high power demands. Also, aspects as disclosed herein can additionally provide increased sealing reliability by providing a structure for imparting additional sealing force to the sealing elements of the enclosed modular housing compared to conventional methods.

[0082] In addition to those shown in the previous figures, many other possible aspects and configurations are contemplated by this disclosure.

[0083] To the extent not yet described, different features and structures of the various aspects can be used in combination with each other as desired. One feature not shown in all aspects is not meant to be construed as not being included and is done for the sake of brevity of the description. Thus, the various features of different aspects can be mixed and matched as desired to form new aspects of this disclosure, whether or not new aspects are explicitly described. All combinations or permutations of the features described herein are covered by this disclosure.

[0084] This written description uses examples to disclose aspects of the present disclosure, including the best mode, and to enable one of ordinary skill in the art to practice aspects of the present disclosure, including making and using any devices or systems and performing any incorporated methods. The patentable scope of the present disclosure is defined by the claims and may include other examples that occur to one of ordinary skill in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims or if they have equivalent structural elements with insubstantial differences from the literal language of the claims.

[0085] The various features, aspects, and advantages of the present disclosure, which are not limited but may include, for example, the following technical solutions as defined in the enumerated aspects, may be embodied in any alternative of the aspects of the present disclosure.

[0086] 1. An electronic component (14) comprising a conductive member portion (70) at a first end (16) of the electronic component (14) and an electrical device portion (69) at a second end (18) of the electronic component (14), wherein the conductive member portion (70) comprises a first conductive member (71) and a second conductive member (72); a housing (12) defining an inner portion (36), wherein the electrical device portion (69) is received in the inner portion (36) and the conductive member portion (70) extends from the housing (12); a support assembly (22) configured to couple to the housing (12), the support assembly (22) comprising a passageway (60) configured to receive the conductive member portion (70) extending from the housing (12), the passageway (60) comprising a first contact member (37a) configured to electrically couple to the first conductive member (71) when the conductive member portion (70) is received in the passageway (60) and a second contact member (37b) configured to electrically couple to the second conductive member (72) when the conductive member portion (70) is received in the passageway (60).

[0087] 2. The electrical device part (69) is a connection assembly (10) of any preceding clause, comprising an upper conductive layer (9) and a conductive substrate (8).

[0088] 3. The connection assembly (10) of any preceding clause further comprises a sealing element (28) including a first seal (30), and the first seal (30) is configured to seal the electrical device part (69) in the housing (12).

[0089] 4. When the support assembly (22) is coupled to the housing (12), the first seal (30) is disposed between the support assembly (22) and the housing (12). The connection assembly (10) of any preceding clause.

[0090] 5. The first seal (30) is configured to close the first slot (38). The connection assembly (10) of any preceding clause.

[0091] 6. The sealing element (28) further includes a second seal (32), and the electrical device part (69) is between the first seal (30) and the second seal (32). The connection assembly (10) of any preceding clause.

[0092] 7. When the support assembly (22) is coupled to the housing (12), the first seal (30) is disposed between the support assembly (22) and the housing (12). The connection assembly (10) of any preceding clause.

[0093] 8. The support assembly is electrically insulating. The connection assembly (10) of any preceding clause.

[0094] 9. The connection assembly (10) of any preceding clause further comprises a liquid coolant (90) in the inner part (36) of the housing (12).

[0095] 10. A first biasing member (39) supported by a support assembly (22), the first biasing member (39) being arranged to apply a first force (47a) to a first conductive member (71) in a first direction (77) when a conductive member portion (70) is received in a passage (60); and a second biasing member supported by the support assembly (22), the second biasing member being arranged to apply a second force (49a) to a second conductive member (72) in a second direction (79) when the conductive member portion (70) is received in the passage (60), the connection assembly (10) of any preceding clause further comprising the second biasing member.

[0096] 11. The connection assembly (10) of any preceding clause, wherein the first contact member (37a) is an AC contact member and the second contact member (37b) is a DC contact member.

[0097] 12. The connection assembly (10) of any preceding clause, wherein the conductive member portion (70) is a substrate, the first conductive member (71) is a first layer of the substrate, the second conductive member (72) is a second layer of the substrate, and the first conductive member (71) and the second conductive member (72) are separated by an insulating layer of the substrate.

[0098] 13. The connection assembly (10) of any preceding clause further comprising a set of electronic components (14), each having an inner portion (36) disposed in the housing (12) and a respective conductive member portion (70) extending from the housing (12) at the second end (18), the support assembly (22) further comprising a set of passages (60) configured to receive the respective conductive member portions (70).

[0099] 14. A support assembly (22) configured to be coupled to a housing (12), the support assembly (22) comprising a passageway (60) configured to receive a conductive member portion (70) extending from the housing (12), the passageway (60) including a first contact member (37a) configured to electrically couple to a first conductive member (71) when the conductive member portion (70) is received in the passageway (60), and a second contact member (37b) configured to electrically couple to a second conductive member (72) when the conductive member portion (70) is received in the passageway (60).

[0100] 15. The support assembly (22) is the support assembly (22) of any preceding clause that is electrically insulating.

[0101] 16. The support assembly (22) is the support assembly (22) of any preceding clause, further comprising a protrusion (53a) on opposite sides sandwiching the passageway (60).

[0102] 17. The protrusion (53a) is the support assembly (22) of any preceding clause, configured to be received in a first slot (38) defined in the housing (12) on each side of the conductive member portion (70).

[0103] 18. The support assembly (22) of any preceding clause further comprises a first biasing member (39) supported by an insulating base and arranged to apply a first force (47a) to the first conductive member (71) in a first direction (77) when the conductive member portion (70) is received in the passageway (60), and a second biasing member supported by the insulating base and arranged to apply a second force (49a) to the second conductive member (72) in a second direction (79) when the conductive member portion (70) is received in the passageway (60).

[0104] 19. The support assembly (22) of any preceding clause, wherein the first contact member (37a) is an AC contact member and the second contact member (37b) is a DC contact member.

[0105] A set of electronic components (14), each having a respective conductive member portion (70) extending from the housing (12), is disposed on the housing (12), and the support assembly (22) further comprises a set of passages (60) configured to receive the respective conductive member portions, the support assembly (22) of any preceding clause.

[0106] 21. A method (600) for cooling an electronic component (14), the method comprising: placing the electronic component (14) in a chamber (52) defined within a housing (12) having an inner portion (36) and an outer portion (41), wherein the inner portion (36) defines a component chamber and the housing (12) further defines at least one slot (38) extending through itself from the outer portion (41) to the inner portion (36); electrically coupling a first conductive member (71) to the electronic component (14) at each first end (16), extending through at least one slot (38), and electrically coupling to the outer portion (41) of the housing (12) at an opposite second end (18); electrically coupling a second conductive member (72) to the first electronic component (14) at each first end (16), extending through at least one slot (38), and electrically coupling to the exterior of the housing (12) at an opposite second end (18); inserting the first conductive member (71) and the second conductive member (72) into a support assembly (22), the support assembly (22) comprising an electrically insulating base (43) connectable to the outer portion (41) of the housing (12), the electrically insulating base (43) defining a passageway (60) configured to receive the first conductive member (71) and the second conductive member (72) insertably therethrough, a first contact member (37a) supported by the insulating base (43) and electrically connectable to the first conductive member, a second contact member (37b) electrically supported by the insulating base (43) and connectable to the second end (18) of the second conductive member (72), a first biasing member (39) supported by the insulating base (43) and arranged to apply a first force (47a) to the first conductive member (71) in a first direction (77), and a second biasing member (39) supported by the insulating base (43) and arranged to apply a second force (49a) to the second end (18) of the second conductive member (72) in a second direction (79).

[0107] Step of disposing a liquid coolant (90) within a component chamber in thermal communication with an electronic component (14), step of disposing a sealing element (28) within at least one slot (38) to fluidly seal the component chamber, and step of providing a sealing force (80) to the sealing element (28) via an electrically insulating base (43), the method of any preceding clause further comprising these steps.

[0108] A further aspect of the present invention is provided by the subject matter of the following clauses.

[0109] [Clause 1] A connection assembly, An electronic component comprising a conductive member portion at a first end of the electronic component and an electrical device portion at a second end of the electronic component, the conductive member portion comprising a first conductive member, and a second conductive member the electronic component, a housing defining an inner portion, the electrical device portion being received within the inner portion and the conductive member portion extending from the housing, the housing, a support assembly configured to couple to the housing, a passage configured to receive the conductive member portion extending from the housing, a first contact member configured to electrically couple to the first conductive member when the conductive member portion is received within the passage, and a second contact member configured to electrically couple to the second conductive member when the conductive member portion is received within the passage the passage, the support assembly, the connection assembly.

[0110] [Clause 2] The connection assembly according to any preceding clause, wherein the electrical device portion comprises an upper conductive layer and a conductive substrate.

[0111] [Item 3] The connection assembly according to any of the preceding items, further comprising a sealing element including a first seal, the first seal being configured to seal the electrical device portion in the housing.

[0112] [Item 4] The connection assembly according to any of the preceding items, wherein when the support assembly is coupled to the housing, the first seal is disposed between the support assembly and the housing.

[0113] [Item 5] The connection assembly according to any of the preceding items, wherein the first seal is configured to close a first slot.

[0114] [Item 6] The connection assembly according to any of the preceding items, wherein the sealing element further includes a second seal, and the electrical device portion is between the first seal and the second seal.

[0115] [Item 7] The connection assembly according to any of the preceding items, wherein when the support assembly is coupled to the housing, the first seal is disposed between the support assembly and the housing.

[0116] [Item 8] The connection assembly according to any of the preceding items, wherein the support assembly is electrically insulating.

[0117] [Item 9] The connection assembly according to any of the preceding items, further comprising a liquid coolant inside the inner portion of the housing.

[0118] [Item 10] A first biasing member supported by the support assembly, the first biasing member being arranged to apply a first force to a first conductive member in a first direction when a conductive member portion is received in the passage, and A second biasing member supported by the support assembly, the second biasing member being arranged to apply a second force to a second conductive member in a second direction when a conductive member portion is received in the passage The connection assembly according to any of the preceding items, further comprising.

[0119] [Item 11] The connection assembly according to any of the preceding items, wherein the first contact member is an AC contact member and the second contact member is a DC contact member.

[0120] [Item 12] The conductive member portion is a substrate, the first conductive member is the first layer of the substrate, the second conductive member is the second layer of the substrate, and the first conductive member and the second conductive member are separated by an insulating layer of the substrate. The connection assembly according to any preceding item.

[0121] [Item 13] Further comprising a set of electronic components each having an inner portion disposed in the housing and each having a conductive member portion extending from the housing at the second end, and the support assembly further comprising a set of passages configured to receive each conductive member portion. The connection assembly according to any preceding item.

[0122] [Item 14] A support assembly configured to couple to a housing, A passage configured to receive a conductive member portion extending from the housing, A first contact member configured to electrically couple to the first conductive member when the conductive member portion is received in the passage, and A second contact member configured to electrically couple to the second conductive member when the conductive member portion is received in the passage Comprising the passage Comprising the support assembly.

[0123] [Item 15] The support assembly is electrically insulating. The support assembly according to any preceding item.

[0124] [Item 16] The support assembly further comprises protrusions on opposite sides sandwiching the passage. The support assembly according to any preceding item.

[0125] [Item 17] The protrusions are configured to be received in first slots defined in the housing on each side of the conductive member portion. The support assembly according to any preceding item.

[0126] [Item 18] A first biasing member supported by an insulating base, the first biasing member being arranged to apply a first force to a first conductive member in a first direction when a conductive member portion is received in a passage. A second biasing member supported by an insulating base, the second biasing member being arranged to apply a second force to a second conductive member in a second direction when a conductive member portion is received in a passage. The support assembly according to any one of the preceding items, further comprising the second biasing member.

[0127] [Item 19] The support assembly according to any one of the preceding items, wherein the first contact member is an AC contact member and the second contact member is a DC contact member.

[0128] [Item 20] A set of electronic components each having a respective conductive member portion extending from a housing is disposed in the housing, and the support assembly further comprises a set of passages configured to receive the respective conductive member portions. The support assembly according to any one of the preceding items.

Description of Reference Numerals

[0129] 5 Dielectric layer 7 Via 8 Conductive substrate 8a First conductive layer 8b Second conductive layer 8c Electrically insulating layer 9 Upper conductive layer 10 Connection assembly 12 Housing 14 Electronic component, power overlay POL module 15 Fluid coupler 16 First end 18 Second end 19 Substrate 20 Module unit 21 Housing interface 22 Support assembly 22a Input portion 22b Output portion 23 First input opening 24 Electrical device, semiconductor switching device 25 Insulating or dielectric coating 26 Pin array connector 27 Second input opening 29 First passage 30 First seal 32 Second seal 31a First sealing surface 31b Second sealing surface 33 AC output conductor 34 Second surface of the sealing element 35 First surface of the sealing element 36 Inner part 37a First contact member, DC contact member 37b Second contact member, AC contact member 38 First slot 39 Biasing member 40 Second slot 41 Outer part 42 Fluid inlet 43 Electrically insulating base 43a First insulating base 43b Second insulating base 44 Fluid outlet 45 First output opening 46 First fluid passage 47a First force 48 Second fluid passage 50 Bolt 51 Second passage 52 Component chamber 53 Sealing surface 53a Protrusion 54 First boundary surface 55 Notch, first groove 56 Second groove 57 Outer wall 58 Second inner wall 59 Second boundary surface 60 Support passage 61 First inner wall 66 First impinging atomizer 67 First set of impinging holes 68 Second collision atomizer 69 Electric device part 69 Second set of collision holes 71 First conductive member 72 Second conductive member 73 Electrical insulation layer 75 First direction 76 Second direction 77 Third direction, upward direction 78 Second surface 81 First DC bus member 82 Second DC bus member 90 Liquid coolant 91 Reservoir 92 Liquid coolant circuit 93 Pump 94 Supply pipe 95 Heat exchanger 96 Return pipe

Claims

1. An electronic component, comprising a conductive member portion at a first end of the electronic component and an electrical device portion at a second end of the electronic component, wherein the conductive member portion comprises a first conductive member, and a second conductive member, wherein the conductive member portion is a substrate, the first conductive member is a first layer of the substrate, the second conductive member is a second layer of the substrate, and the first conductive member and the second conductive member are separated by an insulating layer of the substrate, the second conductive member An electronic component comprising a housing defining an inner portion, wherein the electrical device portion is received in the inner portion and the conductive member portion extends from the housing, the housing and a support assembly configured to couple to the housing, a passage configured to receive the conductive member portion extending from the housing, a first contact member configured to electrically couple to the first conductive member when the conductive member portion is received in the passage, and a second contact member configured to electrically couple to the second conductive member when the conductive member portion is received in the passage, comprising wherein the first contact member is an AC contact member and the second contact member is a DC contact member, the passage A support assembly comprising A connection assembly comprising.

2. The connection assembly according to claim 1, wherein the electrical device portion comprises an upper conductive layer and a conductive substrate.

3. The connection assembly according to claim 1, further comprising a sealing element including a first seal, the first seal being configured to seal the electrical device portion in the housing.

4. The connection assembly according to claim 3, wherein when the support assembly is coupled to the housing, the first seal is disposed between the support assembly and the housing.

5. The connection assembly according to claim 4, wherein the first seal is configured to close a first slot.

6. The connection assembly according to claim 3, wherein the sealing element further includes a second seal, and the electrical device portion is between the first seal and the second seal.

7. The connection assembly according to claim 6, wherein when the support assembly is coupled to the housing, the first seal is disposed between the support assembly and the housing.

8. The connection assembly according to claim 1, wherein the support assembly is electrically insulating.

9. The connection assembly according to claim 1, further comprising a liquid coolant in the inner portion of the housing.

10. A first biasing member supported by the support assembly and arranged to apply a first force to the first conductive member in a first direction when the conductive member portion is received in the passageway, A second biasing member supported by the support assembly and arranged to apply a second force to the second conductive member in a second direction when the conductive member portion is received in the passageway, The connection assembly according to claim 1, further comprising the above.

11. The connection assembly according to claim 1, further comprising a set of electronic components each having an inner portion disposed in the housing and a respective conductive member portion extending from the housing at the second end, and the support assembly further comprising a set of passageways configured to receive the respective conductive member portions.

12. A support assembly configured to be coupled to a housing, A passage configured to receive a conductive member portion extending from the housing, A first contact member configured to be electrically coupled to a first conductive member when the conductive member portion is received in the passage, A second contact member configured to be electrically coupled to a second conductive member when the conductive member portion is received in the passage, A passage comprising, Comprising, The first contact member is an AC contact member, and the second contact member is a DC contact member, The conductive member portion is a substrate, the first conductive member is a first layer of the substrate, the second conductive member is a second layer of the substrate, and the first conductive member and the second conductive member are separated by an insulating layer of the substrate. Support assembly.

13. The support assembly is electrically insulating, the support assembly according to claim 12.

14. The support assembly further comprises protrusions on opposite sides sandwiching the passage, the support assembly according to claim 12.

15. The protrusion is configured to be received in a first slot defined in the housing on each side of the conductive member portion, the support assembly according to claim 14.

16. A first biasing member supported by an insulating base, the first biasing member being arranged to apply a first force to the first conductive member in a first direction when the conductive member portion is received in the passage, A second biasing member supported by the insulating base, the second biasing member being arranged to apply a second force to the second conductive member in a second direction when the conductive member portion is received in the passage, The support assembly according to claim 12, further comprising. Claim 17 A set of electronic components, each having a respective conductive member portion extending from the housing, is disposed in the housing, and the support assembly further includes a set of passages configured to receive the respective conductive member portions. The support assembly according to claim 12.

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