Cable assembly and method for manufacturing the cable assembly

Abstract

The present invention relates to the field of cable technology and provides a cable assembly and a manufacturing method for the cable assembly for solving the problem of the immaturity of cable connection structures. The cable assembly according to the present invention includes a first cable and a second cable. The first cable has a first cable core covered with a first protective layer on its outer periphery and a first shielding layer provided on the outside of the first protective layer, and the second cable has a second cable core covered with a second protective layer on its outer periphery and a second shielding layer provided on the outside of the second protective layer. By electrically connecting the first shielding layer and the second shielding layer, the continuity of the electromagnetic shielding structure between the first cable and the second cable is realized, and the electromagnetic shielding effect of the cable assembly is effectively improved.

Description

Technical Field

[0001] The present invention relates to the field of cable technology, and particularly to a cable assembly and a method for manufacturing the cable assembly.

Background Art

[0002] With the continuous development and popularization of new energy technologies, more and more vehicles are beginning to use batteries as power sources. In vehicles equipped with batteries, electronic devices such as motors and in-vehicle personal computers need to be connected to the battery via cables, and the electrical energy in the battery is transmitted to the electronic devices via the cables, enabling each electronic device to perform its functions. In actual applications, the cable for connecting the battery and the electrical device is not a single complete cable, but a plurality of cables connected sequentially.

[0003] Specifically, generally, a cable includes a cable core and a shield mesh covering the outside of the cable core. The main function of the cable core is to realize power transmission, and the main function of the shield mesh is to provide a good shielding effect for the cable to prevent the occurrence of electromagnetic interference caused by the current in the cable core to external electrical components.

[0004] Currently, when two cables are butted and connected, if the adopted connection structure is not mature, at the butted connection location of the cables, a stable and effective connection cannot be realized between the shield meshes of the two cables, which is disadvantageous for ensuring the electromagnetic shielding effect of the cables.

Summary of the Invention

[0005] The present invention provides a shielded cable assembly and a method for manufacturing the cable assembly that can effectively improve the electromagnetic shielding effect between cables.

[0006] One aspect of the present invention provides a cable assembly including a first cable and a second cable. The first cable has a first cable core covered with a first protective layer on its outer periphery and a first shield layer provided outside the first protective layer. The second cable has a second cable core covered with a second protective layer on its outer periphery and a second shield layer provided outside the second protective layer. By connecting the free end of the first cable core and the free end of the second cable core, an electrical connection between the first cable core and the second cable core can be achieved. By connecting the free end of the first shield layer and the free end of the second shield layer, an electrical connection between the shield layers of the first cable and the second cable is realized, ensuring the continuity of the electromagnetic shielding structure of the cable assembly and effectively improving the electromagnetic shielding effect of the cable assembly.

[0007] The connection point between the first shield layer and the second shield layer is provided to be symmetrically connected.

[0008] When the connection point between the first shield layer and the second shield layer is a single connection, a large current flows through the connection point, generating a magnetic field. This magnetic field combines with the magnetic field generated by the cable core, resulting in significant radiation throughout the connection point of the cable, which greatly affects the operating state of other electronic devices. When the connection point between the first shield layer and the second shield layer is provided symmetrically, the directions of the magnetic fields generated at the connection point are opposite, canceling each other out and reducing the combined electric field, thereby reducing the radiation at the cable connection point, effectively reducing the magnetic field generated by the cable core, and reducing the impact on other electronic devices.

[0009] The connection point between the first shield layer and the second shield layer is provided over 360°.

[0010] While the connection points between the first shield layer and the second shield layer are provided symmetrically, the connection points between the first shield layer and the second shield layer are provided over 360°, resulting in a large shielding and cancellation effect against the radiation generated from the cable core of the cable and the radiation generated from the shield layer itself, and optimizing the shielding effect at the cable connection point.

[0011] When connecting the free ends of the first shield layer and the second shield layer, in order to improve the convenience during connection, butt connection or overlapping connection may be used.

[0012] Also, in order to improve the connection strength between the first shield layer and the second shield layer, a fixed connection between the first shield layer and the second shield layer may be realized by welding.

[0013] The cable assembly further includes a conductive device. The conductive device is provided on the outer periphery of a part of the first cable core and the second cable core. The first end of the conductive device is connected to the free end of the first shield layer, and the second end of the conductive device is connected to the free end of the second shield layer. When the connection length between the first shield layer and the second shield layer is not sufficient, relay connection can be performed using the conductive device, and the shielding effect at the connection point can also be ensured.

[0014] As an example, the connection point between the first end of the conductive device and the free end of the first shield layer is provided symmetrically, and the connection point between the second end of the conductive device and the free end of the second shield layer is provided symmetrically.

[0015] When the connection point between the conductive device and the shield layer is a single - point connection, a large current flows through the connection point, generating a magnetic field. This magnetic field combines with the magnetic field generated by the cable core, resulting in significant radiation throughout the cable connection point, thus greatly affecting the operating states of other electronic devices. When the connection points between the conductive device and the shield layer are provided symmetrically, the directions of the magnetic fields generated at the connection points are opposite, canceling each other out and reducing the combined electric field, reducing the radiation at the cable connection point, effectively reducing the magnetic field generated in the cable core, and reducing the impact on other electronic devices.

[0016] As an example, the connection point between the first end of the conductive device and the free end of the first shield layer is provided over 360°, and the connection point between the second end of the conductive device and the free end of the second shield layer is provided over 360°.

[0017] While the connection points between the conductive device and the shield layer are provided symmetrically, by providing the connection points between the conductive device and the shield layer over 360°, a great shielding and canceling effect is achieved on the radiation generated from the cable core of the cable and the radiation generated from the shield layer itself, optimizing the shielding effect at the cable connection point.

[0018] To improve the connection effect between the first shield layer and the second shield layer and the conductive device, when connecting the free end of the first shield layer and the free end of the second shield layer via the conductive device, the connection between the conductive device and the first shield layer may be a butting connection or an overlapping connection. Correspondingly, the connection between the conductive device and the second shield layer may be a butting connection or an overlapping connection.

[0019] Also, to improve the connection strength between the conductive device and the first shield layer, a fixed connection between the conductive device and the first shield layer may be realized by welding. Correspondingly, to improve the connection strength between the conductive device and the second shield layer, a fixed connection between the conductive device and the second shield layer may be realized by welding.

[0020] As an example, in order to improve the insulation reliability of the cable assembly and prevent electrical contact from occurring between the first shielding layer, the second shielding layer, and the conductive device and an external conductor, an insulating protective layer may be provided on the outer peripheries of the first shielding layer, the second shielding layer, and the conductive device.

[0021] As an example, the first cable core has an overhanging portion protruding from the first protective layer, and the second cable core has an overhanging portion protruding from the second protective layer. Thereby, the first cable core and the second cable core can be easily electrically connected.

[0022] As an example, in order to achieve a good insulation protection effect on the connection location between the first cable core and the second cable core, an isolation sleeve is further provided outside the connection location between the first cable core and the second cable core. The isolation sleeve may be provided on the outer peripheries of the overhanging portion of the first cable core and the overhanging portion of the second cable core.

[0023] As an example, the thickness of the isolation sleeve is greater than at least one of the thickness of the first protective layer and the thickness of the second protective layer.

[0024] As an example, one end of the isolation sleeve may be butt - connected to the first protective layer, and the other end may be butt - connected to the second protective layer. Thereby, the first cable core and the second cable core can be hermetically protected.

[0025] As an example, the free end of the first cable core and the free end of the second cable core may be butt - connected or may be overlapped and connected.

[0026] For example, the end face of the free end of the first cable core and the end face of the free end of the second cable core are butt-connected. When specifically implemented, in order to ensure the connection stability between the first cable core and the second cable core, the end face of the free end of the first cable core and the end face of the free end of the second cable core may be welded by laser welding, ultrasonic welding, resistance welding, pressure diffusion welding or brazing. Here, the specific welding process is not limited in this application.

[0027] In addition, the free end of the first cable core and the free end of the second cable core may further have a partial overlapping region so as to be overlapped and connected. When specifically implemented, in order to ensure the connection stability between the first cable core and the second cable core, the free end of the first cable core and the free end of the second cable core (i.e., the overlapping region between the first cable core and the second cable core) can be welded by laser welding, ultrasonic welding, resistance welding, pressure diffusion welding or brazing. The specific welding process is not limited in this application.

[0028] As an example, the minimum cross-sectional area at the overlapping connection or butt connection location between the first cable core and the second cable core may be equal to or greater than the minimum cross-sectional area of the first cable core and the second cable core. Thereby, it can be avoided that the resistance of the cable is too large due to the small cross-sectional area at the overlapping connection location or butt connection location between the first cable core and the second cable core, and the temperature rise value exceeds the standard requirements when an electric current flows.

[0029] As an example, the thicknesses of the first shielding layer, the second shielding layer and the conductive device may be 0.003 mm to 27 mm.

[0030] As an example, the minimum cross-sectional area at the overlapping connection or butt connection location between the free end of the first shielding layer and the free end of the second shielding layer is 60% to 260% of the minimum cross-sectional area of the first shielding layer and the second shielding layer. Thereby, the connection effect between the free end of the first shielding layer and the free end of the second shielding layer can be ensured.

[0031] As an example, the minimum cross-sectional area at the overlapping connection point or abutting connection point between the conductive device and the first shield layer or the second shield layer is 60% to 260% of the minimum cross-sectional area of the first shield layer and the second shield layer. Thereby, the connection effect between the conductive device and the first shield layer or the second shield layer can be ensured.

[0032] As an example, the impedance at the connection point between the first shield layer and the second shield layer is less than 13.7 mΩ.

[0033] As a preferred example, the impedance at the connection point between the first shield layer and the second shield layer is less than 12.5 mΩ.

[0034] As an example, the impedance at the connection point between the first end of the conductive device and the free end of the first shield layer is less than 13.7 mΩ, and the impedance at the connection point between the second end of the conductive device and the free end of the second shield layer is less than 13.7 mΩ.

[0035] As a preferred example, the impedance at the connection point between the first end of the conductive device and the free end of the first shield layer is less than 12.5 mΩ, and the impedance at the connection point between the second end of the conductive device and the free end of the second shield layer is less than 12.5 mΩ.

[0036] The impedance at the connection point between the first shield layer and the second shield layer, and the impedance at the connection point between the conductive device and the shield layer need to be made as small as possible. By doing so, the current generated in the shield layer can flow back to the energy source or the grounding point without hindrance. If the impedance at the connection point between the first shield layer and the second shield layer and the impedance at the connection point between the conductive device and the shield layer are large, a large current will be generated at the connection point between the first shield layer and the second shield layer and the connection point between the conductive device and the shield layer, thereby causing large radiation at the connection point of the cable.

[0037] As an example, the first cable further has a third protective layer, and the second cable further has a fourth protective layer. The third protective layer is provided outside the first shielding layer, and the fourth protective layer is provided outside the second shielding layer. The third protective layer can effectively improve the use safety and structural strength of the first cable. Accordingly, the fourth protective layer can effectively improve the use safety and structural strength of the second cable.

[0038] In another aspect, the present invention further provides a method for manufacturing a cable assembly. The manufacturing method includes providing a first cable having a first cable core, a first protective layer provided outside the first cable core, and a first shielding layer provided outside the first protective layer; peeling the first shielding layer and the first protective layer at the first end of the first cable to expose the first cable core; providing a second cable having a second cable core, a second protective layer provided outside the second cable core, and a second shielding layer provided outside the second protective layer; peeling the second shielding layer and the second protective layer at the first end of the second cable to expose the second cable core; connecting the free end of the first cable core and the free end of the second cable core; and connecting the free end of the first shielding layer and the free end of the second shielding layer.

[0039] As an example, connecting the free end of the first cable core and the free end of the second cable core specifically includes connecting the free end of the first cable core and the free end of the second cable core by a welding or crimping process.

[0040] As an example, electrically connecting the free end of the first shielding layer and the free end of the second shielding layer specifically includes connecting the free end of the first shielding layer and the free end of the second shielding layer by a welding process.

[0041] As an example, connecting the free end of the first shield layer and the free end of the second shield layer specifically includes providing a conductive device and disposing the conductive device on the outer periphery of a part of the first cable core and the second cable core, and connecting the first end of the conductive device and the free end of the first shield layer by a welding process, and connecting the second end of the conductive device and the free end of the second shield layer.

[0042] As an example, before providing the first end of the conductive device on the outer periphery of the first cable core and providing the second end of the conductive device on the outer periphery of the second cable core, the manufacturing method further includes providing an isolation sleeve on the outer periphery of the connection portion between the first cable core and the second cable core.

[0043] The beneficial effects according to the embodiments of the present invention are as follows. In the cable assembly according to the present invention, the first shield layer and the second shield layer may be connected in a direct connection manner or may be connected by a conductive device, thereby improving flexibility and convenience. Also, the continuity of the electromagnetic shielding between the first shield layer and the second shield layer can be effectively ensured.

Brief Description of the Drawings

[0044]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Description of Reference Numerals

[0045] 10 - First cable, 11 - First cable core, 12 - First protective layer, 13 - First shield layer, 14 - Third protective layer, 20 - Second cable, 21 - Second cable core, 22 - Second protective layer, 23 - Second shield layer, 24 - Fourth protective layer, 30 - Isolation sleeve, 31 - Conductive device, 32 - Insulating protective layer.

Embodiments for Carrying Out the Invention

[0046] For those skilled in the art to better understand the technical solution of the present invention, the embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0047] Example 1

[0048] This example provides a technical solution in which cable shield meshes are directly connected to each other.

[0049] As shown in FIG. 1, the embodiment of the present invention provides a cable assembly including a first cable 10 and a second cable 20. By electrically connecting the electromagnetic shield structures in the first cable 10 and the second cable 20, the continuity of the electromagnetic shield structure between the first cable 10 and the second cable 20 is realized, and the electromagnetic shielding effect of the cable assembly is effectively improved.

[0050] Specifically, in the embodiment according to the present invention, the first cable 10 has a first cable core 11 and a first shield layer 13. A first protective layer 12 is coated on the outer periphery of the first cable core 11, and the first shield layer 13 is provided outside the first protective layer 12.

[0051] The main role of the first cable core 11 is for the transmission of electrical energy. When specifically arranged, the first cable core 11 may be manufactured from a material with excellent electrical conductivity such as copper or aluminum.

[0052] The first protective layer 12 can provide a good protective effect on the first cable core 11 by covering the outside of the first cable core 11. When specifically arranged, the first protective layer 12 may be manufactured from an insulating material that is one or a combination of one or more of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, and polyethylene. Thereby, good electrical insulation can be provided for the first cable core 11.

[0053] The first shield layer 13 is provided outside the first protective layer 12 and is used to provide an electromagnetic shielding effect for the first cable core 11. When an electric current flows through the first cable core 11, an electromagnetic signal may be generated. At this time, the first shield layer 13 can exert a shielding effect on the electromagnetic signal and prevent the electromagnetic signal from being transmitted to the external environment. When specifically arranged, the first shield layer 13 may be formed by braiding metal wires so as to have good flexibility.

[0054] The second cable 20 has a second cable core 21 and a second shield layer 23. A second protective layer 22 is coated on the outer periphery of the second cable core 21, and the second shield layer 23 is provided outside the second protective layer 22.

[0055] The main role of the second cable core 21 is for the transmission of electrical energy. When specifically arranging it, the second cable core 21 may be manufactured from a material with excellent electrical conductivity such as copper or aluminum.

[0056] The second protective layer 22 can provide a good protective effect on the second cable core 21 by covering the outside of the second cable core 21. When specifically arranging it, the second protective layer 22 may be manufactured from one or a combination of insulating materials such as polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, or polyethylene. Thereby, good electrical insulation can be provided for the second cable core 21.

[0057] The second shield layer 23 is provided outside the second protective layer 22 and is used to provide an electromagnetic shielding effect for the second cable core 21. When an electric current flows through the second cable core 21, an electromagnetic signal is generated. At this time, the second shield layer 23 can have a shielding effect on the electromagnetic signal and prevent the electromagnetic signal from being transmitted to the external environment. When specifically arranging it, the second shield layer 23 may be formed by braiding metal wires so as to have good flexibility.

[0058] By connecting the free end of the first cable core 11 and the free end of the second cable core 21, an electrical connection between the first cable core 11 and the second cable core 21 is realized. By connecting the free end of the first shield layer 13 and the free end of the second shield layer 23, an electrical connection between the shield layers of the first cable 10 and the second cable 20 is realized, ensuring the continuity of the electromagnetic shielding structure of the cable assembly and effectively improving the electromagnetic shielding effect of the cable assembly.

[0059] This will be described with reference to FIGS. 1, 6, and 7. Here, the connection locations of the first shield layer 13 and the second shield layer 23 are provided symmetrically.

[0060] A description will be given with reference to FIGS. 8 and 9. When the connection point between the first shield layer 13 and the second shield layer 23 is a single-point connection, a large current flows through the connection point, generating a magnetic field. This magnetic field combines with the magnetic field generated by the cable core, resulting in significant radiation throughout the cable connection point, which will greatly affect the operating state of other electronic devices. When the connection points between the first shield layer 13 and the second shield layer 23 are provided symmetrically, the directions of the magnetic fields generated at the connection points are opposite, canceling each other out and reducing the combined magnetic field, reducing the radiation at the cable connection point, effectively reducing the magnetic field generated in the cable core, and reducing the impact on other electronic devices.

[0061] Here, the connection points between the first shield layer 13 and the second shield layer 23 are provided over 360°.

[0062] While the connection points between the first shield layer 13 and the second shield layer 23 are provided symmetrically, by providing the connection points between the first shield layer 13 and the second shield layer 23 over 360°, the first cable core 11 is completely covered in the radial direction by the first shield layer 13, and the second cable core 21 is completely covered in the radial direction by the second shield layer 23. In this case, the entire outer periphery in the radial direction of the cable core is covered by the shield layer, thereby achieving a large shielding and canceling effect on the radiation generated from the cable core of the cable and the radiation generated from the shield layer itself, and optimizing the shielding effect at the cable connection point.

[0063] As a test method, the test equipment outputs one signal value (this value is the test value 2) to the first cable 10 or the second cable 20, and a detection device is provided outside the cable assembly. This detection device detects one signal value (this value is the test value 1). Shielding performance value = test value 2 - test value 1.

[0064] Table 1 shows the influence of the arrangement method of the connection points between the first shield layer and the second shield layer on the shielding performance.

[0065]

Table 1

[0066] The above table shows the data obtained by selecting and testing cables with specific wire diameters. Here, the specification requirement is that the shielding performance value at the connection point between the first shielding layer and the second shielding layer is greater than 60 dB.

[0067] Assuming that the dimensions of the connection points between the first shielding layer 13 and the second shielding layer 23 are the same, when they are provided asymmetrically, the shielding performance value at the connection point between the first shielding layer 13 and the second shielding layer 23 is less than 60 dB, failing to meet the specification requirements. When they are provided symmetrically, even if they are not completely connected, the electromagnetic radiation is canceled out, so the shielding performance value at the connection point between the first shielding layer 13 and the second shielding layer 23 still meets the specification requirements. Preferably, the connection point between the first shielding layer 13 and the second shielding layer 23 is provided over 360°. In this case, the shielding performance at the cable connection point is better.

[0068] When specifically implemented, the free end of the first shielding layer 13 and the free end of the second shielding layer 23 are overlapped and connected, or butted and connected.

[0069] Continuing with reference to FIG. 1 for explanation. In an embodiment according to the present invention, the free end of the first shielding layer 13 and the free end of the second shielding layer 23 are butted and connected.

[0070] Specifically, the free end (the right end in the figure) of the first shielding layer 13 has a turned-back portion, and the free end (the left end in the figure) of the second shielding layer 23 also has a turned-back portion. By butting the turned-back portion of the first shielding layer 13 and the turned-back portion of the second shielding layer 23, the connection between the first shielding layer 13 and the second shielding layer 23 can be realized.

[0071] Here, in order to ensure the connection stability between the first shield layer 13 and the second shield layer 23, the turned-back portion of the first shield layer 13 and the turned-back portion of the second shield layer 23 may be fixedly connected by welding. For example, welding can be performed by laser welding, ultrasonic welding, resistance welding, pressure diffusion welding, or brazing. Here, the specific welding process is not limited in this application.

[0072] Alternatively, as shown in FIG. 2, the first shield layer 13 and the second shield layer 23 may be connected by overlapping connection.

[0073] Specifically, the free end of the first shield layer 13 may be provided on the outer periphery of the free end of the second shield layer 23 so as to realize the overlapping connection between the first shield layer 13 and the second shield layer 23.

[0074] Here, in order to ensure the connection stability between the first shield layer 13 and the second shield layer 23, the overlapping connection portion between the first shield layer 13 and the second shield layer 23 may be fixedly connected by welding. For example, welding can be performed by laser welding, ultrasonic welding, resistance welding, pressure diffusion welding, or brazing. Here, the specific welding process is not limited in this application.

[0075] In addition, in order to improve the insulation reliability of the cable assembly and prevent conductive contact from occurring between the first shield layer 13 and the second shield layer 23 and an external conductor, an insulation protection layer 32 may be provided on the outer periphery of the first shield layer 13 and the second shield layer 23. When specifically arranging, the insulation protection layer 32 may be a structural member with excellent insulation properties such as a heat shrinkable tube, and the specific material and type of the insulation cover can be adaptively selected according to actual needs, and are not specifically limited in this application.

[0076] When specifically arranging, the first cable core 11 has an overhanging portion protruding from the first protection layer 12, and the second cable core 21 has an overhanging portion protruding from the second protection layer 22. Thereby, the electrical connection between the first cable core 11 and the second cable core 21 becomes easy.

[0077] In addition, in order to achieve a good protective effect on the connection portion between the first cable core 11 and the second cable core 21, in the embodiment according to the present invention, an isolation sleeve 30 is further provided outside the connection portion between the first cable core 11 and the second cable core 21. The isolation sleeve 30 may be provided on the outer periphery of the protruding portion of the first cable core 11 and the protruding portion of the second cable core 21.

[0078] When specifically arranging, the thickness of the isolation sleeve 30 is greater than at least one of the thickness of the first protective layer 12 and the thickness of the second protective layer 22.

[0079] When specifically arranging, the isolation sleeve 30 may be a heat shrinkable tube, or an insulating material made of one or a combination of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, polyethylene, which is injection molded outside the butt joint connection portion.

[0080] Here, the left end of the isolation sleeve 30 can be butted and connected to the first protective layer 12 of the first cable 10, and the right end of the isolation sleeve 30 can be butted and connected to the second protective layer 22 of the second cable 20. Thereby, a good protective effect is achieved on the first cable core 11 and the second cable core 21.

[0081] When specifically arranging, the free end of the first cable core 11 and the free end of the second cable core 21 may be butt-joint connected or overlapped and connected.

[0082] For example, as shown in FIGS. 1 and 2, the end face of the free end of the first cable core 11 and the end face of the free end of the second cable core 21 are butt-connected. When specifically implementing, in order to ensure the connection stability between the first cable core 11 and the second cable core 21, the end face of the free end of the first cable core 11 and the end face of the free end of the second cable core 21 may be connected by laser welding, ultrasonic welding, resistance welding, pressure diffusion welding, brazing or crimping. Here, the specific welding or crimping process is not limited in this application.

[0083] As shown in FIG. 3, the free end of the first cable core 11 and the free end of the second cable core 21 may be overlapped and connected. That is, the right end of the first cable core 11 and the left end of the second cable core 21 have an overlapping area. When specifically implementing, in order to ensure the connection stability between the first cable core 11 and the second cable core 21, the free end of the first cable core 11 and the free end of the second cable core 21 (that is, the overlapping area between the first cable core 11 and the second cable core 21) can be welded by laser welding, ultrasonic welding, resistance welding, pressure diffusion welding, brazing or crimping. Here, the specific welding or crimping process is not limited in this application.

[0084] The minimum cross-sectional area at the overlapping connection location or the butt connection location between the first cable core 11 and the second cable core 21 may be equal to or greater than the minimum cross-sectional area of the first cable core 11 and the second cable core 21 in order to avoid the resistance of the cable being too large due to the small cross-sectional area at the overlapping connection location or the butt connection location between the first cable core and the second cable core, and the temperature rise value when passing current exceeding the standard requirements.

[0085] Here, the thickness of the first shielding layer 13 and the second shielding layer 23 may be 0.003 mm to 27 mm.

[0086] As a test method, the test equipment outputs one signal value (this value is the test value 2) to the first cable 10 or the second cable 20, a detection device is provided outside the cable assembly, and this detection device detects one signal value (this value is the test value 1). Shield performance value = test value 2 - test value 1.

[0087] Table 2 shows the influence of the thickness of the shield layer and the conductive device on the shield performance and the increased value of the bending radius.

[0088]

Table 2

[0089] The above table shows the test data selected for cables with a specific wire diameter. Here, the specification requirement is that the shield performance value at the connection point between the conductive device 31 and the shield layer is greater than 60 dB.

[0090] As can be seen from the test results shown in the table, when the thickness of the first shield layer 13 and the second shield layer 23 is 0.003 mm to 27 mm, the shield performance of the first cable 10 and the second cable 20 increases with the increase in thickness. However, when the thickness of the first shield layer 13 and the second shield layer 23 exceeds 27 mm, the change in the shield performance of the first cable 10 and the second cable 20 is small, and no significant improvement is seen. When the thickness of the first shield layer 13 and the second shield layer 23 is 0.003 mm to 27 mm, the increased value of the bending radius of the first cable 10 and the second cable 20 increases with the increase in thickness. However, when the thickness of the first shield layer 13 and the second shield layer 23 exceeds 27 mm, the increased value of the bending radius of the first cable 10 and the second cable 20 exceeds 200 mm, which is disadvantageous for actual processing. Therefore, it is preferable that the thickness of the first shield layer 13 and the second shield layer 23 is 0.003 mm to 27 mm.

[0091] In addition, the minimum cross-sectional area at the overlapping connection point or abutting connection point between the free end of the first shield layer 13 and the free end of the second shield layer 23 is 60% to 260% of the minimum cross-sectional area of the first shield layer 13 and the second shield layer 23. Thereby, the connection effect between the free end of the first shield layer 13 and the free end of the second shield layer 23 can be ensured.

[0092] The main function of the first shield layer 13 and the second shield layer 23 is to avoid the generation of electromagnetic interference by grounding the eddy current generated when current is conducted in the cable core. The larger the cross-sectional area of the cable core, the larger the current that can be conducted, and the larger the eddy current generated in the shield layer. When the minimum cross-sectional area at the connection point between the first shield layer 13 and the second shield layer 23 is smaller than that specified in the standard requirements, local heating occurs at the connection point. In severe cases, the connection point between the first shield layer 13 and the second shield layer 23 will be burned out, resulting in a decrease in the shielding performance of the cable and ultimately the failure of the shielding performance.

[0093] Table 3 shows the influence of the ratio of the minimum cross-sectional area at the connection point between the first shield layer and the second shield layer to the minimum cross-sectional area of the first shield layer and the second shield layer on the temperature rise value between the shield layers.

[0094]

Table 3

[0095] The above table shows the test data selected for cables with a specific wire diameter. Here, the standard requirement is that the temperature rise value between the first shield layer 13 and the second shield layer 23 is less than 50°C.

[0096] As can be seen from the above table, when the ratio of the minimum cross-sectional area at the connection point between the first shield layer 13 and the second shield layer 23 to the minimum cross-sectional area of the first shield layer 13 and the second shield layer is less than 60%, the temperature rise value between the shield layers does not meet the standard requirements.

[0097] When the ratio of the minimum cross-sectional area at the connection location between the first shield layer 13 and the second shield layer 23 to the minimum cross-sectional area in the first shield layer 13 and the second shield layer 23 is greater than 260%, since the cross-sectional areas of the first shield layer 13 and the second shield layer 23 are much larger than the minimum conduction area of eddy currents, the temperature rise value between the first shield layer 13 and the second shield layer 23 is almost the same as when the ratio is 260%, but the cost and processing cycle become higher.

[0098] Therefore, it is preferable that the minimum cross-sectional area at the overlapping connection location or the butting connection location between the free end of the first shield layer 13 and the free end of the second shield layer 23 is 60% - 260% of the minimum cross-sectional area in the first shield layer 13 and the second shield layer 23.

[0099] When specifically arranging, the impedance at the connection location between the first shield layer 13 and the second shield layer 23 is less than 13.7 mΩ.

[0100] As a preferred embodiment, the impedance at the connection location between the first shield layer 13 and the second shield layer 23 is less than 12.5 mΩ.

[0101] It is necessary to make the impedance at the connection location between the first shield layer 13 and the second shield layer 23 as small as possible. By doing so, the current generated in the shield layer can flow back to the energy source or the grounding location without hindrance. If the impedance at the connection location between the first shield layer 13 and the second shield layer 23 is large, a large current will be generated at the connection location between the first shield layer 13 and the second shield layer 23, thereby generating a large radiation at the connection location of the cable.

[0102] Table 4 shows the influence of the impedance at the connection location between the first shield layer and the second shield layer on the shielding performance.

[0103]

Table 4

[0104] As shown in the above table, it is the data obtained by selecting and testing cables with a specific wire diameter. The specification requirement is that the shielding performance value at the connection between the first shielding layer 13 and the second shielding layer 23 is less than 6 dB, and the shielding performance value at the connection between the first shielding layer 13 and the second shielding layer 23 is less than 4 dB.

[0105] When the impedance at the connection between the first shielding layer 13 and the second shielding layer 23 is greater than 13.7 mΩ, the shielding performance value at the connection between the first shielding layer 13 and the second shielding layer 23 is greater than 6 dB, and the radio frequency interference resistance at the connection between the first shielding layer 13 and the second shielding layer 23 is greater than 4 dB, which does not meet the specification requirements. Also, when the impedance at the connection between the first shielding layer 13 and the second shielding layer 23 is less than 12.5 mΩ, the shielding performance at the connection between the first shielding layer 13 and the second shielding layer 23 and the shielding performance at the connection between the first shielding layer 13 and the second shielding layer 23 do not change significantly. Therefore, the impedance at the connection between the first shielding layer 13 and the second shielding layer 23 is assumed to be less than 13.7 mΩ.

[0106] As a preferred embodiment, the impedance at the connection between the first shielding layer 13 and the second shielding layer 23 is less than 12.5 mΩ.

[0107] In actual applications, the first cable 10 may usually further have a third protective layer 14 (which may be understood as an outer sheath), and the second cable 20 may usually further have a fourth protective layer 24 (which may be understood as an outer sheath).

[0108] Specifically, the third protective layer 14 is provided outside the first shielding layer 13, and by preventing conductive contact between the first shielding layer 13 and other members, the use safety of the first cable 10 can be improved, and the waterproof, dustproof and other performances of the entire first cable 10 can also be improved.

[0109] When specifically implemented, the third protective layer 14 may be made of an insulating material that is one or a combination of one or more of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, and polyethylene.

[0110] Accordingly, in the second cable 20, the fourth protective layer 24 is provided outside the second shielding layer 23, and by preventing conductive contact between the second shielding layer 23 and other members, the use safety of the second cable 20 can be improved, and the performance such as waterproof and dustproof of the entire second cable 20 can also be improved.

[0111] When specifically implemented, the fourth protective layer 24 may be made of an insulating material that is one or a combination of one or more of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, and polyethylene.

[0112] Embodiment 2

[0113] This embodiment provides a technical solution for connecting a cable shield mesh through a conductive device.

[0114] In this embodiment, the first shielding layer 13 and the second shielding layer 23 may be connected by an additional conductive device 31.

[0115] The cable assembly further includes a conductive device 31. The conductive device 31 is provided on a part of the outer periphery of the first cable core 11 and the second cable core 21. The first end of the conductive device 31 is connected to the free end of the first shielding layer 13, and the second end of the conductive device 31 is connected to the free end of the second shielding layer 23. When the connection length between the first shielding layer 13 and the second shielding layer 23 is not sufficient, relay connection can be performed using the conductive device 31, and the shielding effect at the connection location can also be ensured.

[0116] Here, the connection points between the first end of the conductive device 31 and the free end of the first shield layer 13 are provided symmetrically, and the connection points between the second end of the conductive device 31 and the free end of the second shield layer 23 are provided symmetrically.

[0117] When the connection point between the conductive device 31 and the shield layer is a single - point connection, a large current flows through the connection point, generating a magnetic field. This magnetic field combines with the magnetic field generated by the cable core, resulting in significant radiation throughout the cable connection point, which will greatly affect the operating states of other electronic devices. When the connection points between the conductive device 31 and the shield layer are provided symmetrically, the directions of the magnetic fields generated at the connection points are opposite, canceling each other out and reducing the combined magnetic field, reducing the radiation at the cable connection point, effectively reducing the magnetic field generated in the cable core, and reducing the impact on other electronic devices.

[0118] Here, the connection point between the first end of the conductive device 31 and the free end of the first shield layer 13 is provided over 360°, that is, the first end of the conductive device 31 and the free end of the first shield layer 13 are completely butted and connected. The connection point between the second end of the conductive device 31 and the free end of the second shield layer 23 is provided over 360°, that is, the second end of the conductive device 31 and the free end of the second shield layer 23 are completely butted and connected.

[0119] When the connection points between the conductive device 31 and the shield layer are provided symmetrically, and when the connection points between the conductive device 31 and the shield layer are provided over 360°, it has a great shielding and canceling effect on the radiation generated from the cable core of the cable and the radiation generated from the shield layer itself, and the shielding prevention effect at the cable connection point is optimized.

[0120] As a test method, the test equipment outputs one signal value (this value is the test value 2) to the first cable 10 or the second cable 20, and a detection device is provided outside the cable assembly. This detection device detects one signal value (this value is the test value 1). Shield performance value = test value 2 - test value 1.

[0121] Table 5 shows the influence of the arrangement method of the connection position between the conductive device and the shield layer on the shield performance.

[0122]

Table 5

[0123] The above table shows the test data selected for cables with a specific wire diameter. Here, the specification requirement is that the shield performance value at the connection position between the conductive device and the shield layer is greater than 60 dB.

[0124] Assuming that the dimensions of the connection position between the conductive device 31 and the shield layer are the same, when provided asymmetrically, the shield performance value at the connection position between the conductive device 31 and the shield layer is less than 60 dB and does not meet the specification requirements. When provided symmetrically, even if it is not completely connected, the electromagnetic radiation is canceled out, so the shield performance value at the connection position between the conductive device 31 and the shield layer still meets the specification requirements. Preferably, the connection position between the conductive device 31 and the shield layer is provided over 360°. In this case, the shield performance at the cable connection position is better.

[0125] When the free end of the first shield layer 13 and the free end of the second shield layer 23 are connected by the conductive device 31, between the conductive device 31 and the first shield layer 13, it may be butted or overlapped. Accordingly, between the conductive device 31 and the second shield layer 23, it may be butted or overlapped. Thereby, the connection effect between the first shield layer 13 and the second shield layer 23 can be improved.

[0126] Regarding the connection between the first end of the conductive device 31 and the free end of the first shield layer 13, or the connection between the second end of the conductive device 31 and the free end of the second shield layer 23, welding can be performed by laser welding, ultrasonic welding, resistance welding, pressure diffusion welding, or brazing, similar to the connection between the first shield layer 13 and the second shield layer 23.

[0127] Also, when specifically implementing, an insulating protection layer 32 may be provided at the location where the first shield layer 13, the conductive device 31, and the second shield layer 23 are connected to each other, and on the outer periphery of the conductive device 31. To improve the reliability of the cable assembly, the left end of the insulating protection layer 32 may be butt-connected or fitted-connected to the third protection layer 14 of the first cable 10, and the right end of the insulating protection layer 32 may be butt-connected or fitted-connected to the fourth protection layer 24 of the second cable 20. There is conductive contact between the first shield layer 13, the conductive device 31, and the second shield layer 23 and an external conductor. When specifically arranging, the insulating protection layer 32 may be a structural member with excellent insulation properties such as a heat shrinkable tube, and the specific material and type of the insulating protection layer 32 can be adaptively selected according to actual needs, and are not specifically limited in this application.

[0128] For example, as shown in FIG. 4, in another embodiment according to the present invention, the first shield layer 13 and the second shield layer 23 are connected by the conductive device 31.

[0129] When connecting, the first shield layer 13 and the conductive device 31 may be butt-connected, and the second shield layer 23 and the conductive device 31 may be butt-connected.

[0130] Specifically, the free end of the first shield layer 13 has a turned-back portion, and the first end (the left end in the figure) of the conductive device 31 also has a turned-back portion. By butting the turned-back portion of the first shield layer 13 against the turned-back portion at the left end of the conductive device 31, the connection between the first shield layer 13 and the conductive device 31 can be realized. The free end of the second shield layer 23 has a turned-back portion, and the second end (the right end in the figure) of the conductive device 31 also has a turned-back portion. By butting the turned-back portion of the second shield layer 23 against the turned-back portion at the right end of the conductive device 31, the connection between the second shield layer 23 and the conductive device 31 can be realized.

[0131] To ensure the connection stability between the first shield layer 13 and the conductive device 31, the turned-back portion of the first shield layer 13 and the turned-back portion of the conductive device 31 may be fixedly connected by welding. For example, they can be welded by laser welding, ultrasonic welding, resistance welding, pressure diffusion welding or brazing. Here, the specific welding process is not limited in this application. Also, to ensure the connection stability between the second shield layer 23 and the conductive device 31, the turned-back portion of the second shield layer 23 and the turned-back portion of the conductive device 31 may be fixedly connected by welding. For example, they can be welded by laser welding, ultrasonic welding, resistance welding, pressure diffusion welding or brazing. Here, the specific welding process is not limited in this application.

[0132] Alternatively, as shown in FIG. 5, the first shield layer 13 and the conductive device 31 may be overlapped and connected, and the second shield layer 23 and the conductive device 31 may be overlapped and connected.

[0133] Specifically, the free end of the first shield layer 13 may be provided on the outer periphery of the left end of the conductive device 31 so as to realize the overlapping connection between the first shield layer 13 and the conductive device 31. The free end of the second shield layer 23 may be provided on the outer periphery of the right end of the conductive device 31 so as to realize the overlapping connection between the second shield layer 23 and the conductive device 31.

[0134] To ensure the connection stability between the first shield layer 13 and the conductive device 31, the overlapping connection portion between the first shield layer 13 and the conductive device 31 may be fixedly connected by welding. For example, it can be welded by laser welding, ultrasonic welding, resistance welding, pressure diffusion welding or brazing. Here, the specific welding process is not limited in this application. Also, to ensure the connection stability between the second shield layer 23 and the conductive device 31, the overlapping connection portion between the second shield layer 23 and the conductive device 31 may be fixedly connected by welding. For example, it can be welded by laser welding, ultrasonic welding, resistance welding, pressure diffusion welding or brazing. Here, the specific welding process is not limited in this application.

[0135] The thicknesses of the first shield layer 13, the second shield layer 23 and the conductive device 31 may be 0.003 mm to 27 mm.

[0136] As can be seen from the test results shown in Table 1, when the thicknesses of the first shield layer 13, the second shield layer 23 and the conductive device 31 are 0.003 mm to 27 mm, the shielding effects of the first cable 10 and the second cable 20, that is, the shielding performance, increase with the increase in thickness. However, when the thicknesses of the first shield layer 13, the second shield layer 23 and the conductive device 31 exceed 27 mm, the change in the shielding ability of the first cable 10 and the second cable 20 is small, and no significant improvement is seen. When the thicknesses of the first shield layer 13, the second shield layer 23 and the conductive device 31 are 0.003 mm to 27 mm, the increase in the bending radius of the first cable 10 and the second cable 20 increases with the increase in thickness. However, when the thicknesses of the first shield layer 13, the second shield layer 23 and the conductive device 31 exceed 27 mm, the increase in the bending radius of the first cable 10 and the second cable 20 exceeds 200 mm, which is disadvantageous for actual processing. Therefore, it is preferable that the thicknesses of the first shield layer 13, the second shield layer 23 and the conductive device 31 are 0.003 mm to 27 mm.

[0137] In addition, the minimum cross-sectional area at the overlapping connection or abutting connection location between the conductive device 31 and the first shield layer 13 or the second shield layer 23 is 60% to 260% of the minimum cross-sectional area of the first shield layer 13 and the second shield layer 23. Thereby, the connection effect between the conductive device 31 and the first shield layer 13 or the second shield layer 23 can be ensured.

[0138] The main function of the first shield layer 13 and the second shield layer 23 is to avoid the generation of electromagnetic interference by grounding the eddy current generated when current is conducted in the cable core. The larger the cross-sectional area of the cable core, the larger the current that can be conducted, and the larger the eddy current generated in the shield layer. When the minimum cross-sectional area at the connection location between the conductive device 31 and the first shield layer 13 or the second shield layer 23 is smaller than that specified in the standard requirements, local heating will occur at the connection location. In severe cases, the connection location between the conductive device 31 and the first shield layer 13 or the second shield layer 23 will be burned out, resulting in a decrease in the shielding performance of the cable and ultimately the failure of the shielding performance.

[0139] Table 6 shows the influence of the ratio of the minimum cross-sectional area at the connection location between the conductive device and the first shield layer or the second shield layer to the minimum cross-sectional area of the first shield layer or the second shield layer on the temperature rise value between the conductive device and the first shield layer or the second shield layer.

[0140]

Table 6

[0141] The above table shows the test data selected for a cable with a specific wire diameter. Here, the standard requirement is that the temperature rise value between the conductive device and the first shield layer 13 and the second shield layer 23 is less than 50°C.

[0142] As can be seen from the above table, when the ratio of the minimum cross-sectional area at the connection point between the conductive device 31 and the first shield layer 13 or the second shield layer 23 to the minimum cross-sectional area in the first shield layer 13 and the second shield layer 23 is less than 60%, the temperature rise between the conductive device 31 and the first shield layer 13 or the second shield layer 23 does not meet the standard requirements.

[0143] When the ratio of the minimum cross-sectional area at the connection point between the conductive device 31 and the first shield layer 13 or the second shield layer 23 to the minimum cross-sectional area in the first shield layer 13 and the second shield layer 23 is greater than 260%, since the cross-sectional areas of the first shield layer 13 and the second shield layer 23 are much larger than the minimum conduction area of the eddy current, the temperature rise value between the conductive device 31 and the first shield layer 13 or the second shield layer 23 is almost the same as when the above ratio is 260%, but the cost and processing cycle are higher.

[0144] Therefore, it is preferable that the ratio of the minimum cross-sectional area at the overlapping connection point or the butting connection point between the conductive device 31 and the first shield layer 13 or the second shield layer 23 to the minimum cross-sectional area in the first shield layer 13 and the second shield layer 23 is 60% - 260%.

[0145] Specifically, when arranging, the impedance at the connection point between the first end of the conductive device and the free end of the first shield layer is less than 13.7 mΩ, and the impedance at the connection point between the second end of the conductive device and the free end of the second shield layer is less than 13.7 mΩ.

[0146] In a preferred form, the impedance at the connection point between the first end of the conductive device and the free end of the first shield layer is less than 12.5 mΩ, and the impedance at the connection point between the second end of the conductive device and the free end of the second shield layer is less than 12.5 mΩ.

[0147] It is necessary to minimize the impedance at the connection point between the conductive device and the shield layer. By doing so, the current generated in the shield layer can flow back to the energy source or the grounding point without any problem. If the impedance at the connection point between the conductive device and the shield layer is large, a large current will occur at the connection point between the conductive device and the shield layer, thereby causing a large radiation at the connection point of the cable.

[0148] As a test method, the test equipment outputs one signal value (this value is the test value 2) to the first cable or the second cable, and a detection device is provided outside the cable assembly, and this detection device detects one signal value (this value is the test value 1). Shield performance value = test value 2 - test value 1.

[0149] Table 7 shows the influence of the impedance at the connection point between the conductive device and the shield layer on the shield performance.

[0150]

Table 7

[0151] The above table shows the test data selected for cables with a specific wire diameter. Here, the specification requirement is that the shield performance value at the connection point between the conductive device and the shield layer is greater than 60 dB.

[0152] When the impedance at the connection point between the first end of the conductive device and the free end of the first shield layer is greater than 13.7 mΩ, and the impedance at the connection point between the second end of the conductive device and the free end of the second shield layer is greater than 13.7 mΩ, the shield performance value at the connection point between the conductive device and the shield layer is less than 60 dB, not meeting the specification requirements. Also, when the impedance at the connection point between the first end of the conductive device and the free end of the first shield layer is less than 12.5 mΩ, and the impedance at the connection point between the second end of the conductive device and the free end of the second shield layer is less than 12.5 mΩ, the shield performance value at the connection point between the conductive device and the shield layer does not change significantly. Therefore, the inventors of the present invention made the impedance at the connection point between the first end of the conductive device and the free end of the first shield layer less than 13.7 mΩ, and the impedance at the connection point between the second end of the conductive device and the free end of the second shield layer less than 13.7 mΩ.

[0153] Preferably, the impedance at the connection point between the first end of the conductive device and the free end of the first shield layer is less than 12.5 mΩ, and the impedance at the connection point between the second end of the conductive device and the free end of the second shield layer is less than 12.5 mΩ.

[0154] In actual applications, the first cable 10 may usually further have a third protective layer 14 (which may be understood as an outer sheath), and the second cable 20 may usually further have a fourth protective layer 24 (which may be understood as an outer sheath).

[0155] Specifically, the third protective layer 14 is provided outside the first shield layer 13 to prevent conductive contact between the first shield layer 13 and other members. Thereby, the use safety of the first cable 10 can be improved, and the waterproof, dustproof and other performance of the entire first cable 10 can be improved.

[0156] When specifically implemented, the third protective layer 14 can be manufactured from an insulating material that is one or a combination of one or more of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, and polyethylene.

[0157] Accordingly, in the second cable 20, the fourth protective layer 24 is provided outside the second shield layer 23 in order to prevent conductive contact between the second shield layer 23 and other members. Thereby, the use safety of the second cable 20 can be improved, and the performance such as waterproof and dustproof of the entire second cable 20 can also be improved.

[0158] When specifically implemented, the fourth protective layer 24 can be manufactured from an insulating material that is one or a combination of one or more of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, and polyethylene.

[0159] When manufacturing, the conductive device 31 may be a cylindrical structure made of a conductive material such as copper, aluminum, graphene, etc., or may be a cylindrical structure knitted with metal wires so as to have a certain flexibility. Thereby, the application range and performance such as earthquake resistance can be improved. The material and manufacturing method of the conductive device 31 are not limited to the present invention.

[0160] Example 3

[0161] This example provides a method for manufacturing a cable assembly.

[0162] When manufacturing a cable assembly, the following steps can be adopted.

[0163] Referring to FIGS. 1, 2, and 10, the manufacturing method may include the following steps.

[0164] In S10, a first cable 10 is provided. The first cable 10 has a first cable core 11, a first protective layer 12, and a first shield layer 13. The first protective layer 12 is provided outside the first cable core 11, and the first shield layer 13 is provided outside the first protective layer 12.

[0165] In S11, the first shield layer 13 and the first protective layer 12 at the free end of the first cable 10 (the right end of the first cable 10 in FIG. 1) are peeled off to expose the first cable core 11.

[0166] In S20, a second cable 20 is provided. The second cable 20 has a second cable core 21, a second protective layer 22, and a second shield layer 23. The second protective layer 22 is provided outside the second cable core 21, and the second shield layer 23 is provided outside the second protective layer 22.

[0167] In S21, the second shield layer 23 and the second protective layer 22 at the free end of the second cable 20 (the left end of the second cable 20 in FIG. 1) are peeled off to expose the second cable core 21.

[0168] In S22, the free end of the first cable core 11 and the free end of the second cable core 21 are connected to realize an electrical connection between the first cable core 11 and the second cable core 21.

[0169] In S23, the free end of the first shield layer 13 and the free end of the second shield layer 23 are connected.

[0170] Here, the first cable core 11 and the second cable core 21 may be connected by laser welding, ultrasonic welding, resistance welding, pressure diffusion welding, soldering, or crimping, etc. Thereby, the connection strength between the first cable core 11 and the second cable core 21 can be improved.

[0171] Further, the first shield layer 13 and the second shield layer 23 may be connected by laser welding, ultrasonic welding, resistance welding, pressure diffusion welding, brazing, or the like. This improves the connection strength between the first shield layer 13 and the second shield layer 23.

[0172] As can be understood, when specifically implemented, the first cable core 11 and the second cable core 21 may be connected by other means so as to achieve electrical connection and mechanical connection between the first cable core 11 and the second cable core 21. Further, by connecting the first shield layer 13 and the second shield layer 23 by other means, electrical connection and mechanical connection between the first shield layer 13 and the second shield layer 23 may be achieved.

[0173] Further, before step S23, the manufacturing method may further include providing an isolation sleeve 30 on the outer periphery of the connection portion between the first cable core 11 and the second cable core 21. This can prevent problems such as electrical contact from occurring between this connection portion and the conductive device 31.

[0174] The isolation sleeve 30 may be a heat shrinkable tube, or may be another insulating layer directly injection molded outside the connection portion.

[0175] Further, in some embodiments, when the third protection layer 14 is provided outside the first cable 10, when performing step S11, the step further includes peeling the third protection layer 14 of the first cable 10. Correspondingly, when the fourth protection layer 24 is provided outside the second cable 20, when performing step S21, the step further includes peeling the fourth protection layer 24 of the second cable 20.

[0176] Further, as shown in FIG. 11, the embodiment of the present invention further provides a manufacturing method for another cable assembly. In this manufacturing method, steps S30 and S31 are added.

[0177] Specifically, with reference to FIGS. 4, 5, and 11, the manufacturing method further includes the following steps.

[0178] In S30, a conductive device 31 is provided and disposed on the outer periphery of a part of the first cable core 11 and the second cable core 21.

[0179] In S31, one end of the conductive device 31 (the left end in FIG. 5) is connected to the free end of the first shield layer 13 (the right end in FIG. 5), and the other end of the conductive device 31 (the right end in FIG. 5) is connected to the free end of the second shield layer 23 (the left end in FIG. 5).

[0180] The conductive device 31 and the first shield layer 13 may be welded by laser welding, ultrasonic welding, resistance welding, pressure diffusion welding, brazing, or the like. Thereby, the connection strength between the conductive device 31 and the first shield layer 13 can be improved. Correspondingly, the conductive device 31 and the second shield layer 23 may be welded by laser welding, ultrasonic welding, resistance welding, pressure diffusion welding, brazing, or the like. Thereby, the connection strength between the conductive device 31 and the second shield layer 23 can be improved.

[0181] As can be understood, when specifically implemented, in other ways, the conductive device 31 may be connected to the first shield layer 13, and the conductive device 31 may be connected to the second shield layer 23.

[0182] Also, before step S31, the manufacturing method may further include providing an isolation sleeve 30 on the outer periphery of the connection location between the first cable core 11 and the second cable core 21. Thereby, it is possible to prevent problems such as conductive contact from occurring between this connection location and the conductive device 31.

[0183] The isolation sleeve 30 may be a heat - shrinkable tube, or may be another insulating layer directly injection - molded on the outside of the connection location.

[0184] Also, in some embodiments, when the third protective layer 14 is provided outside the first cable 10, when performing step S11, the step further includes peeling the third protective layer 14 of the first cable 10. Correspondingly, when the fourth protective layer 24 is provided outside the second cable 20, when performing step S21, the step further includes peeling the fourth protective layer 24 of the second cable 20.

[0185] As can be understood, when manufacturing the cable assembly, the manufacturing order can be adaptively adjusted according to the actual situation, and some steps can also be added or omitted, which is not specifically limited in this application.

[0186] It is obvious that those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention belong to the claims of the present invention and its equivalent technical scope, the present invention is intended to include these modifications and variations.

Claims

1. A first cable having a first cable core coated with a first protective layer on its outer periphery and a first shield layer provided outside the first protective layer; A second cable having a second cable core coated with a second protective layer on its outer periphery and a second shield layer provided outside the second protective layer; Comprising: The free end of the first cable core is connected to the free end of the second cable core, and the free end of the first shield layer is connected to the free end of the second shield layer. The free end of the first shield layer has a turned-back portion, the free end of the second shield layer has a turned-back portion, the turned-back portion of the free end of the first shield layer and the turned-back portion of the free end of the second shield layer abut against each other and are fixedly connected by welding, and the minimum cross-sectional area at the abutting connection portion between the free end of the first shield layer and the free end of the second shield layer is 60% to 260% of the minimum cross-sectional area of the first shield layer and the second shield layer. A cable assembly characterized by the above.

2. A first cable having a first cable core coated with a first protective layer on its outer periphery and a first shield layer provided outside the first protective layer; A second cable having a second cable core coated with a second protective layer on its outer periphery and a second shield layer provided outside the second protective layer; Comprising: The free end of the first cable core is connected to the free end of the second cable core, and the free end of the first shield layer is connected to the free end of the second shield layer via a conductive device. The conductive device is provided on the outer circumferences of a part of the first cable core and the second cable core. The free end of the first shield layer has a turned-back portion, the free end of the second shield layer has a turned-back portion, the first end and the second end of the conductive device have turned-back portions, the turned-back portion of the first end of the conductive device abuts against the turned-back portion of the free end of the first shield layer and is fixedly connected by welding, the turned-back portion of the second end of the conductive device abuts against the turned-back portion of the free end of the second shield layer and is fixedly connected by welding, and the minimum cross-sectional area at the butting connection location between the conductive device and the first shield layer or the second shield layer is 60% to 260% of the minimum cross-sectional area of the first shield layer and the second shield layer. A cable assembly, characterized in that.

3. The connection location between the first shield layer and the second shield layer is provided symmetrically with respect to the axial center line of the cable assembly. The cable assembly according to claim 1 or 2, characterized in that.

4. The connection location between the first shield layer and the second shield layer is provided over 360°. The cable assembly according to claim 1, characterized in that.

5. The connection location between the first end of the conductive device and the free end of the first shield layer is provided symmetrically with respect to the axial center line of the cable assembly, and the connection location between the second end of the conductive device and the free end of the second shield layer is provided symmetrically with respect to the axial center line of the cable assembly. The cable assembly according to claim 2, characterized in that.

6. The connection location between the first end of the conductive device and the free end of the first shield layer is provided over 360°, and the connection location between the second end of the conductive device and the free end of the second shield layer is provided over 360°. The cable assembly according to claim 2, characterized in that.

7. An insulating protection layer is provided on the outer periphery of the first shield layer, the second shield layer, and the conductive device. The cable assembly according to claim 2, characterized in that.

8. The first cable core has an overhanging portion protruding from the first protective layer. The second cable core has an overhanging portion protruding from the second protective layer. The cable assembly according to claim 1 or 2, characterized in that.

9. The cable assembly further comprises an isolation sleeve provided on the outer periphery of the overhanging portion of the first cable core and the overhanging portion of the second cable core. The cable assembly according to claim 8, characterized in that.

10. The thickness of the isolation sleeve is greater than at least one of the thickness of the first protective layer and the thickness of the second protective layer. The cable assembly according to claim 9, characterized in that.

11. One end of the isolation sleeve is butt-connected to the first protective layer, and the other end of the isolation sleeve is butt-connected to the second protective layer. The cable assembly according to claim 9, characterized in that.

12. The free end of the first cable core and the free end of the second cable core are overlapped and connected or butt-connected. The cable assembly according to claim 1 or 2, characterized in that.

13. The minimum cross-sectional area at the overlapping connection location or the butt connection location is equal to or greater than the minimum cross-sectional area of the first cable core and the second cable core. The cable assembly according to claim 12, characterized in that.

14. The first shielding layer or the second shielding layer is made of woven metal wires, and the thickness of the first shielding layer or the second shielding layer is 0.003 mm to 27 mm. The cable assembly according to claim 1, characterized in that.

15. The first shielding layer, the second shielding layer or the conductive device is made of woven metal wires, and the thickness of the first shielding layer, the second shielding layer or the conductive device is 0.003 mm to 27 mm. The cable assembly according to claim 2, characterized in that.

16. The impedance at the connection point between the first shielding layer and the second shielding layer is less than 13.7 mΩ. The cable assembly according to claim 1, characterized in that.

17. The impedance at the connection point between the first shielding layer and the second shielding layer is less than 12.5 mΩ. The cable assembly according to claim 1, characterized in that.

18. The impedance at the connection point between the first end of the conductive device and the free end of the first shielding layer is less than 13.7 mΩ, and the impedance at the connection point between the second end of the conductive device and the free end of the second shielding layer is less than 13.7 mΩ. The cable assembly according to claim 2, characterized in that.

19. The impedance at the connection point between the first end of the conductive device and the free end of the first shielding layer is less than 12.5 mΩ, and the impedance at the connection point between the second end of the conductive device and the free end of the second shielding layer is less than 12.5 mΩ. The cable assembly according to claim 2, characterized in that.

20. The first cable further has a third protective layer. The second cable further has a fourth protective layer. The third protective layer is provided outside the first shield layer, and the fourth protective layer is provided outside the second shield layer. The cable assembly according to claim 1 or 2, characterized in that.

21. Providing a first cable having a first cable core, a first protective layer provided outside the first cable core, and a first shield layer provided outside the first protective layer; Peeling off the first shield layer and the first protective layer at the first end of the first cable to expose the first cable core; Providing a second cable having a second cable core, a second protective layer provided outside the second cable core, and a second shield layer provided outside the second protective layer; Peeling off the second shield layer and the second protective layer at the first end of the second cable to expose the second cable core; Connecting the free end of the first cable core and the free end of the second cable core; Connecting the free end of the first shield layer and the free end of the second shield layer, including: The free end of the first shield layer has a turned-back portion, and the free end of the second shield layer has a turned-back portion. When connecting the free end of the first shield layer and the free end of the second shield layer, the turned-back portions of the free ends of the first shield layer and the second shield layer are butted against each other and fixedly connected by welding. The minimum cross-sectional area at the butting portion of the free ends of the first shield layer and the second shield layer is 60% to 260% of the minimum cross-sectional area of the first shield layer and the second shield layer. A method for manufacturing a cable assembly, characterized in that.

22. Providing a first cable having a first cable core, a first protective layer provided outside the first cable core, and a first shield layer provided outside the first protective layer; Peeling off the first shielding layer and the first protective layer at the first end of the first cable to expose the first cable core; Providing a second cable having a second cable core, a second protective layer provided outside the second cable core, and a second shielding layer provided outside the second protective layer; Peeling off the second shielding layer and the second protective layer at the first end of the second cable to expose the second cable core; Connecting the free end of the first cable core and the free end of the second cable core; Connecting the free end of the first shielding layer and the free end of the second shielding layer through a conductive device, including: The conductive device is provided on the outer periphery of a part of the first cable core and the second cable core. The free end of the first shielding layer has a turned-back portion, the free end of the second shielding layer has a turned-back portion, and the first end and the second end of the conductive device have turned-back portions; When connecting the free end of the first shielding layer and the free end of the second shielding layer through the conductive device, the turned-back portion of the first end of the conductive device and the turned-back portion of the free end of the first shielding layer are butted and fixedly connected by welding. The turned-back portion of the second end of the conductive device and the turned-back portion of the free end of the second shielding layer are butted and fixedly connected by welding. The minimum cross-sectional area at the butting position between the conductive device and the first shielding layer or the second shielding layer is 60% - 260% of the minimum cross-sectional area of the first shielding layer and the second shielding layer; A method for manufacturing a cable assembly, characterized by the above.

23. Connecting the free end of the first cable core and the free end of the second cable core includes connecting the free end of the first cable core and the free end of the second cable core by welding or crimping. The manufacturing method according to claim 21 or 22, characterized by the above.

24. Before connecting the first end of the conductive device to the free end of the first shield layer and connecting the second end of the conductive device to the free end of the second shield layer, further comprising providing an isolation sleeve on the outer periphery of the connection location between the first cable core and the second cable core, The manufacturing method according to claim 22, characterized by the above.

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