Substrate for electro-optical device, electro-optical device, electronic apparatus, method for manufacturing electro-optical device, and inspection circuit

Abstract

To provide a substrate for an electro-optical device, an electro-optical device, an electronic apparatus, a method for manufacturing an electro-optical device, and an inspection circuit that, when a terminal connected with a sensor element is electrically connected to a short-circuit wire, can properly inspect the electrical characteristics of the sensor element.SOLUTION: A substrate for an electro-optical device has a first mounting terminal M1 and a second mounting terminal M2 connected with a sensor element 160. The substrate for an electro-optical device has a first resistance element R1 connected between the first mounting terminal M1 and the second mounting terminal M2, a second resistance element R2 connected between the first resistance element R1 and the second mounting terminal M2, and a third mounting terminal M3 connected between the first resistance element R1 and the second resistance element R2. An inspection circuit 40 has an energization circuit 41 that energizes the first mounting terminal M1, a voltage setting unit 42 that applies the same voltage as that of the first mounting terminal M1 to the third mounting terminal M3, and a detection circuit 43 that detects the voltage or current of the first mounting terminal M1.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a substrate for an electro-optical device provided with a sensor element, an electro-optical device, a method for manufacturing an electro-optical device, and an inspection circuit.

Background Art

[0002] In electro-optical devices such as liquid crystal devices and organic electroluminescence display devices, a sensor element may be provided on a substrate constituting an electro-optical panel included in the electro-optical device. For example, in an electro-optical device used as a light valve in a projection display device, since the illumination light is high-intensity and irradiates the electro-optical panel, the temperature of the electro-optical panel tends to rise. In such a case, the modulation characteristics and response characteristics of the liquid crystal layer change. Therefore, while providing a diode element as a temperature detection sensor element on the substrate used for the electro-optical panel, a constant current circuit is provided on a circuit board electrically connected to the mounting terminals of the substrate, and based on the voltage of the sensor element when a constant current is applied from the constant current circuit to the sensor element, a technique for controlling a cooling fan or the like has been proposed (see Patent Document 1).

[0003] On the other hand, in the manufacturing process of an electro-optical device, a plurality of substrates constituting an electro-optical panel are provided on a large substrate called a mother substrate, and are divided into individual substrates in the final scribing process. At that time, for the purpose of protecting circuit elements formed on the substrate from static electricity, and for removing charges due to causes such as baking after the electro-optical panel is formed, a configuration in which mounting terminals are electrically connected by a resistance element has been proposed (see Patent Document 2).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] When a temperature detection circuit described in Patent Document 1 is provided for a large substrate described in Patent Document 2, the anode terminal and the cathode terminal of the diode element constituting the temperature detection circuit are electrically connected via a resistance element. Therefore, when a current is passed from the anode terminal to inspect the electrical characteristics of the diode element, there will be a current path to the diode element and a current path via the resistance element. Therefore, there is a problem that the electrical characteristics of the diode element provided on the large substrate or the electro-optical device substrate composed of the divided large substrate cannot be properly measured. Such a problem also occurs when a sensor element other than the temperature detection diode element is provided as the sensor element.

Means for Solving the Problems

[0006] In order to solve the above problems, the electro-optical device substrate according to the present invention includes Equipped with a diode element Temperature sensor obtained and Said temperature sensor a first terminal electrically connected to one electrode of Said temperature sensor a second terminal electrically connected to the other electrode of a short-circuit line electrically connected to the first terminal and the second terminal described above, and one end of the first resistance element electrically connected to the first terminal a second resistance element having one end electrically connected to the other end of the first resistance element and the other end electrically connected to the short-circuit line a third resistance element having one end electrically connected to the second terminal and the other end electrically connected to the short-circuit line, and a third terminal electrically connected to the other end of the first resistance element and one end of the second resistance element, characterized in that it has.

[0007] The substrate for an electro-optical device according to the present invention includes a first region corresponding to a first substrate constituting the electro-optical device and a second region between adjacent first regions. The first terminal, the second terminal, the third terminal, the first resistance element, and the second resistance element may be provided in the first region. Such a substrate for an electro-optical device has a part corresponding to the first region after division and is used in the electro-optical device. In this case, the electro-optical device has a circuit board electrically connected to the part, and a sensor driving circuit provided on the circuit board. The sensor driving circuit includes a power supply circuit for supplying power to the first terminal, a voltage setting unit for applying a voltage corresponding to the voltage of the first terminal to the third terminal, and a detection circuit for detecting the voltage or current of the first terminal. Said temperature sensor the first end The first terminal, the second terminal, the third terminal, the first resistance element, and the second resistance element may be provided in the first region. Such a substrate for an electro-optical device has a part corresponding to the first region after division and is used in the electro-optical device. corresponding to the first region after division Said first substrate is used in the electro-optical device. In this case, the electro-optical device , Said first substrate has a circuit board electrically connected to the part, and a sensor driving circuit provided on the circuit board. The sensor driving circuit includes a power supply circuit for supplying power to the first terminal, a voltage setting unit for applying a voltage corresponding to the voltage of the first terminal to the third terminal, and a detection circuit for detecting the voltage or current of the first terminal. The sensor driving circuit includes a power supply circuit for supplying power to the first terminal, a voltage setting unit for applying a voltage corresponding to the voltage of the first terminal to the third terminal, and a detection circuit for detecting the voltage or current of the first terminal. The first terminal, the second terminal, the third terminal, the first resistance element, and the second resistance element may be provided in the first region. Such a substrate for an electro-optical device has a part corresponding to the first region after division and is used in the electro-optical device. In this case, the electro-optical device has a circuit board electrically connected to the part, and a sensor driving circuit provided on the circuit board. The sensor driving circuit includes a power supply circuit for supplying power to the first terminal, a voltage setting unit for applying a voltage corresponding to the voltage of the first terminal to the third terminal, and a detection circuit for detecting the voltage or current of the first terminal. is provided with a power supply circuit for supplying power to the first terminal, a voltage setting unit for applying a voltage corresponding to the voltage of the first terminal to the third terminal, and a detection circuit for detecting the voltage or current of the first terminal.

[0008] The substrate for an electro-optical device according to the present invention includes a first region corresponding to a first substrate constituting the electro-optical device and a second region between adjacent first regions. The first region and a second region between adjacent first regions, and at least Said temperature sensor the first terminal , said second terminal, and the first 3 terminal are provided in the first region, and the first resistance element and the second resistance element is may be provided in the second region. Such a substrate for an electro-optical device has a part corresponding to the first region after division Said first substrate and is used in an electro-optical device. In this case, the electro-optical device Said first substrate has a circuit board electrically connected to the part, and a sensor driving circuit provided on the circuit board. The sensor driving circuit includes a power supply circuit for supplying power to the first terminal, and a detection A circuit and... are provided.

[0009] The electro-optical device according to the present invention is used in an electronic device, and in such an electronic device, based on the detection result of the sensor element, the driving conditions, cooling conditions, or heating conditions of the electro-optical device are adjusted.

[0010] In the present invention, an inspection circuit for inspecting a sensor element in a state of a substrate for an electro-optical device includes a power supply circuit for applying power to the first terminal, a voltage setting unit for applying a voltage corresponding to the voltage of the first terminal to the third terminal, and a detection circuit for detecting the voltage or current of the first terminal.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Embodiments for Carrying Out the Invention

[0012] Referring to the drawings, embodiments of the present invention will be described. In the drawings referred to in the following description, in order to make each member etc. recognizable on the drawing, the scales of the respective members are made different and the number of members is reduced.

[0013] In the electro-optical panel 100 described below, a sensor element 160 is provided on a first substrate 10 on which a pixel electrode 170 is provided. Such a sensor element 160 is inspected in the state of a large substrate 90 as a mother substrate on which a plurality of first substrates 10 are arranged during the manufacturing process.

[0014] Here, the large substrate 90 includes a plurality of first regions 91 to be divided as the first substrate 10, and a second region 92 corresponding to a scribe region scribed when dividing the plurality of first substrates 10 from the large substrate 90 into individual small substrates 95. In the first region 91, all of the first resistance element R1, the second resistance element R2, etc. used for inspecting the sensor element 160 may be arranged. The form in such a case will be described as the first embodiment.

[0015] Also, in the large substrate 90, at least one of the first resistance element R1 and the second resistance element R2 used for inspecting the sensor element 160 may be formed in the second region 92 adjacent to the first region 91. The form in such a case will be described as the second embodiment.

[0016] [First Embodiment] 1-1. Basic Configuration of Electro-Optical Device 1 FIG. 1 is an explanatory diagram showing one aspect of an electro-optical device 1 to which the present invention is applied. In FIG. 1, each direction is represented using a rectangular coordinate system composed of the x-axis, the y-axis, and the z-axis. The z-axis direction is the thickness direction of the electro-optical panel 100, the y-axis direction is the extending direction of the circuit board 60 connected to the electro-optical panel 100, and the x-axis direction is the width direction orthogonal to the extending direction of the circuit board 60.

[0017] In FIG. 1, the electro-optical device 1 is a liquid crystal device and includes a liquid crystal panel as the electro-optical panel 100. The electro-optical panel 100 includes a plurality of pixel electrodes 170 formed on the first substrate 10, a common electrode (not shown) formed on the second substrate 20, and an electro-optical layer (not shown) composed of a liquid crystal layer provided between the pixel electrode 170 and the common electrode. In this embodiment, the first substrate 10 includes two sides 101 and 102 extending in the x-axis direction and two sides 103 and 104 extending in the y-axis direction. The pixel electrode 170 constitutes a pixel 17 by facing the common electrode through the electro-optical layer, and the region where the pixels 17 are arranged in the x-axis direction and the y-axis direction is the pixel region 11. The first substrate 10 and the second substrate 20 are bonded together by a frame-shaped sealing material (not shown), and the electro-optical layer is provided in the region surrounded by the sealing material. A pixel switching element (not shown) electrically connected to the pixel electrode 170 is provided in the pixel 17. Further, an auxiliary capacitor (not shown) having one electrode electrically connected to the pixel electrode 170 is provided in the pixel 17, and a common voltage is applied to the other electrode of the auxiliary capacitor.

[0018] The electro-optical panel 100 of this embodiment is a transmissive liquid crystal panel. Therefore, the substrate body 19 of the first substrate 10 and the substrate body 29 of the second substrate 20 are made of a light-transmissive substrate such as heat-resistant glass or a quartz substrate, and the pixel electrode 170 and the common electrode are made of a conductive film such as light-transmissive ITO (Indium Tin Oxide). In the transmissive electro-optical panel 100, for example, the illumination light incident from one of the first substrate 10 and the second substrate 20 is modulated while passing through to the other substrate side and is emitted as display light. In this embodiment, the illumination light incident from the second substrate 20 is modulated while passing through to the first substrate 10 and is emitted as display light.

[0019] The first substrate 10 has an overhanging portion 105 that projects in the y-axis direction from the end of the second substrate 20. The overhanging portion 105 is provided with a mounting terminal region 14 in which a plurality of mounting terminals M are arranged at a predetermined pitch along the first side 101. The electro-optical device 1 has a flexible first circuit board 60 connected to the mounting terminals M, and the first circuit board 60 extends in the y-axis direction so as to be separated from the first substrate 10. A second circuit board 70 is connected to the opposite side of the first circuit board 60 from the electro-optical panel 100. A driving IC 61 is provided on the first circuit board 60, and the driving IC 61 outputs signals generated based on signals input via the second circuit board 70 to the electro-optical panel 100. A sensor driving circuit 50 for driving a sensor circuit 16, which will be described later with reference to FIGS. 2 and 3, is provided on the second circuit board 70.

[0020] 1-2. Configuration of the first substrate 10 FIG. 2 is an explanatory view of a large substrate 90 for manufacturing the electro-optical device 1 according to the first embodiment of the present invention. FIG. 2 shows a state in which the sensor element 160 is inspected in the state of the large substrate 90 for manufacturing the first substrate 10. In this embodiment, the large substrate 90 corresponds to the "substrate for electro-optical device" according to the present invention.

[0021] As shown in FIG. 2, the large substrate 90 includes a plurality of first regions 91 where the first substrate 10 is disposed. The large substrate 90 includes a second region 92 that is scribed when dividing the small substrate 95 as the first substrate 10 from the large substrate 90 between adjacent first regions 91, and the first region 91 and the second region 92 are adjacent to each other. On the first substrate 10, a scan line driving circuit 12 is provided at a position adjacent in the x-axis direction to the pixel region 11, and a data line driving circuit 13 is provided between the pixel region 11 and a mounting terminal region 14 where a plurality of mounting terminals M are arranged. The scan line driving circuit 12 supplies a scan signal to the pixel switching element of each pixel via a scan line (not shown). The data line driving circuit 13 supplies an image signal to the pixel electrode 170 via a data line (not shown) and a pixel switching element. Therefore, the mounting terminal region 14 includes the mounting terminals M that are directly electrically connected to the pixel region 11. Further, the mounting terminal region 14 includes the mounting terminals M that are electrically connected to the pixel region 11 via the scan line driving circuit 12 or the data line driving circuit 13.

[0022] The plurality of mounting terminals M and the wirings extending from the plurality of mounting terminals M respectively correspond to the following signals and voltages. Note that the illustrated signals and power supplies are representative examples, and in actuality, the image signal is input from a large number of terminals, the waveform of the scan signal output by the scan line driving circuit 12 is shaped by an output control signal (not shown), and the supply timing signal of the image signal to the data line by the data line driving circuit 13 is shaped. Clock signal VCLK for the scan line driving circuit Inverted clock signal VCLKB with respect to the clock signal VCLK Start pulse VSP for the scan line driving circuit Image signal VID Clock signal HCLK for the data line driving circuit Inverted clock signal HCLKB with respect to the clock signal HCLK Start pulse HSP for the data line driving circuit High voltage VDD Low voltage VSS Common voltage LCCOM

[0023] In this embodiment, a short - circuit line 15 extending in the x - axis direction is provided between the mounting terminal region 14 and the data - line driving circuit 13. The short - circuit line 15 is electrically connected to a mounting terminal M corresponding to the low voltage VSS. Among the plurality of mounting terminals M corresponding to the above - mentioned signals and voltages, a plurality of mounting terminals M other than the mounting terminal M corresponding to the low voltage VSS are each electrically connected to the short - circuit line 15 via a resistance element R. The resistance value of the resistance element R is, for example, 1 MΩ. In addition, a mounting terminal M of a dummy DUM is also provided in the mounting terminal region 14. There is no wiring provided for the mounting terminal M of the dummy DUM, and the mounting terminal M of the dummy DUM is not electrically connected to the short - circuit line 15.

[0024] On the first substrate 10, a sensor circuit 16 including a sensor element 160 is provided outside the pixel region 11. In this embodiment, the sensor element 160 is a temperature - sensor element composed of a diode element. Although one diode element is shown in FIG. 2, it is preferable to electrically connect a plurality of diode elements in series in order to enhance the sensitivity to temperature. For example, five diode elements are electrically connected in series. Such diode elements are formed using a process for forming switching elements and the like in the pixel region 11, the scanning - line driving circuit 12, and the data - line driving circuit 13.

[0025] In the sensor circuit 16, when the diode element is driven with a constant current, the forward voltage of the diode element has a negative correlation with temperature and has good linearity from room temperature to 80°C. For example, when five diode elements are electrically connected in series and driven with a constant current of, for example, 0.7 μA, the temperature - detection sensitivity is approximately - 10 mV / °C. Therefore, since a general - purpose A / D converter can sufficiently detect the change in the forward voltage, the temperature of the electro - optical panel 100 can be detected with high sensitivity.

[0026] In the first substrate 10, in the mounting terminal region 14, a first mounting terminal M1 electrically connected to one electrode of the sensor element 160 and a second mounting terminal M2 electrically connected to the other electrode of the sensor element 160 are provided. The first circuit board 60 shown in FIG. 1 is also electrically connected to the first mounting terminal M1 and the second mounting terminal M2. In this embodiment, the sensor element 160 is a diode element. One electrode of the sensor element 160 corresponds to the anode of the diode element, and the other electrode of the sensor element 160 corresponds to the cathode of the diode element. Therefore, the first mounting terminal M1 is electrically connected to the anode of the diode element, and the second mounting terminal M2 is electrically connected to the cathode of the diode element.

[0027] Here, on the first substrate 10, outside the pixel region 11, a first resistance element R1 electrically connected between the first mounting terminal M1 and the second mounting terminal M2, a second resistance element R2 electrically connected between the first resistance element R1 and the second mounting terminal M2, and a third mounting terminal M3 electrically connected between the first resistance element R1 and the second resistance element R2 are provided.

[0028] One end of the first resistance element R1 is electrically connected to the first mounting terminal M1, and the other end is electrically connected to one end of the second resistance element R2. The other end of the second resistance element R2, which is opposite to the one end electrically connected to the first resistance element R1, is electrically connected to the short-circuit line 15. Therefore, the first resistance element R1 and the second resistance element R2 are electrically connected in series between the first mounting terminal M1 and the short-circuit line 15, and the second resistance element R2 is electrically connected to the second mounting terminal M2 via the short-circuit line 15. Here, on the first substrate 10, in the mounting terminal region 14, the second mounting terminal M2, the first mounting terminal M1, and the third mounting terminal M3 are arranged in this order.

[0029] Thus, the first substrate 10 of this embodiment is provided with a first mounting terminal M1, a second mounting terminal M2, and a third mounting terminal M3. These mounting terminals correspond to the "first terminal", "second terminal", and "third terminal" in the present invention as shown below. First terminal = First mounting terminal M1 The second terminal = the second mounting terminal M2 The third terminal = the third mounting terminal M3

[0030] Also, on the first substrate 10, a third resistor element R3 having one end electrically connected to the second mounting terminal M2 is provided, and the other end of the third resistor element R3 is electrically connected to the short - circuit line 15. Therefore, the second resistor element R2 is electrically connected to the second mounting terminal M2 via the short - circuit line 15 and the third resistor element R3. The resistance value of the third resistor element R3 is 1 MΩ, similar to the resistor element R. The resistance values of the first resistor element R1 and the second resistor element R2 are 1 MΩ, similar to the resistor element R.

[0031] According to such a configuration, after forming all the components such as the pixel region 11 and the mounting terminal M shown in FIG. 2 on the large - sized substrate 90, even if static electricity enters the mounting terminal M when the first substrate 10 is divided from the large - sized substrate 90 as the small - sized substrate 95, the static - electricity charge can be absorbed by the large capacitor body including the short - circuit line 15. Therefore, circuit elements such as switching elements provided in the pixel region 11, the scanning - line driving circuit 12, the data - line driving circuit 13, etc. can be protected from static electricity.

[0032] Similarly, even if static electricity enters the first mounting terminal M1 and the second mounting terminal M2, the static electricity can be absorbed by using the first resistor element R1, the second resistor element R2, the third resistor element R3, and the short - circuit line 15. Also, even if static electricity enters the third mounting terminal M3, the static electricity can be absorbed by using the second resistor element R2 into the large capacitor body including the short - circuit line 15. Therefore, the sensor element 160 provided in the sensor circuit 16 can be protected from static electricity.

[0033] Although details will be described later, when driving the sensor element 160 composed of a diode element with a constant current, it is desired to suppress the current I2 flowing through the first resistor element R1. Also, it is desired to efficiently discharge the static electricity that has entered from the third mounting terminal M3 to the short-circuit line 15 via the second resistor element R2. Therefore, regarding the resistance value, it is preferable that the first resistor element R1 > the second resistor element R2. Note that for the first resistor element R1, the second resistor element R2, and the third resistor element R3, when using a semiconductor film or a gate electrode film when forming circuit elements on the first substrate 10, since the sheet resistance value is large, the resistor elements can be formed with good area efficiency.

[0034] 1-3. Inspection of the sensor element 160 in the state of the large substrate 90 As shown in FIG. 2, when inspecting the sensor element 160 on the first substrate 10 in the state of the large substrate 90, an inspection circuit 40 separate from the first substrate 10 is used. The inspection circuit 40 includes a first probe P1, a second probe P2, and a third probe P3. By bringing the first probe P1, the second probe P2, and the third probe P3 into contact with the first mounting terminal M1, the second mounting terminal M2, and the third mounting terminal M3, respectively, electrical measurement of the sensor element 160 on the first substrate 10 is performed.

[0035] Here, the inspection circuit 40 includes a power supply circuit 41 that energizes the first mounting terminal M1 with the voltage of the second mounting terminal M2 fixed, a voltage setting unit 42 that makes the voltage VF2 of the third mounting terminal M3 the same as the voltage corresponding to the voltage VF1 of the first mounting terminal M1, and a detection circuit 43 that detects the voltage or current of the first mounting terminal M1. For example, the voltage setting unit 42 makes the difference between the voltage VF2 of the third mounting terminal M3 and the voltage VF1 of the first mounting terminal M1 a constant voltage. In this embodiment, the voltage setting unit 42 makes the voltage VF2 of the third mounting terminal M3 the same as the voltage VF1 of the first mounting terminal M1. Such a configuration can be realized by making the output voltage of a voltage follower to which the voltage VF1 is input the voltage VF2. Also, the power supply circuit 41 and the voltage setting unit 42 may each be a separate power supply, and such a configuration can be realized by a general semiconductor analysis device.

[0036] In this embodiment, the first probe P1 is electrically connected to the energization circuit 41 via the detection circuit 43. The energization circuit consists of a voltage output circuit. The detection circuit 43 consists of an ammeter disposed between the energization circuit 41 and the first probe P1. The second probe P2 is set to the ground voltage GND. The third probe P3 is electrically connected to the voltage setting unit 42. Therefore, when inspecting the sensor element 160, the energization circuit 41 sets the voltage of the cathode of the sensor element 160 to the ground voltage GND via the second probe P2 and the second mounting terminal M2, while applying the voltage VF1 to the anode of the sensor element 160 via the first mounting terminal M1, and the detection circuit 43 detects the current I1 flowing through the first mounting terminal M1. At this time, the voltage setting unit 42 maintains the voltage VF2 of the third mounting terminal M3 via the third probe P3 under the following conditions. VF1 = VF2

[0037] For this reason, the voltage VF2 (= VF1) is applied to the connection node between the first resistance element R1 and the second resistance element R2. Therefore, since the same voltage is applied to both terminals of the first resistance element R1, the current I2 flowing through the first resistance element R1 becomes zero. Therefore, the current I1 flowing from the first mounting terminal M1 directly becomes the current I4 flowing through the sensor element 160. Thus, even when the first mounting terminal M1 and the second mounting terminal M2 are electrically connected via the short-circuit wire 15, the electrical characteristics of the sensor element 160 can be accurately measured based on the voltage VF1 and the current I1 of the first mounting terminal M1.

[0038] Here, when generating the voltage VF2 from the voltage follower that inputs the voltage VF1, there may be a deviation of several mV, for example, 5 mV, due to the offset voltage of the operational amplifier. In that case, the current I2 flowing through the first resistance element R1 = 5 mV / 1 MΩ = 5 nA. It is appropriate to determine the quality of the diode element based on the operating point current. Therefore, if the operating point current is, for example, 0.7 μA, the influence by the current I2 is 1% or less. A larger resistance value of the first resistance element R1 is preferable for measuring the current II1 because it is easier to eliminate the influence of the offset voltage and the like.

[0039] Also, the first resistor R1 and the second resistor R2 are formed using, for example, a semiconductor film or the like that constitutes a switching element of a liquid crystal panel. Its sheet resistance varies due to variations in the impurity implantation process and the annealing process. Even in such a case, since only a minute voltage is generated between both terminals of the first resistor R1, the variation in the current I2 is extremely small compared to the operating point current. Of course, regarding the current I2, if the inspection apparatus is sufficiently adjusted to make VF1 = VF2, it can be made almost zero.

[0040] Also, a current I3 flowing toward the second mounting terminal M2 through the short - circuit line 15 and the third resistor R3 flows through the second resistor R2. For example, if VF1 = VF2 = 3V at room temperature, then I3 = 3V / 2MΩ = 1.5μA. For a minute current of this level, it can be sufficiently supplied from the operational amplifier that constitutes the voltage follower, so it does not pose a significant problem. Also, the connection wiring from the third mounting terminal M3 to the connection node between the first resistor R1 and the second resistor R2 is formed with a resistance value sufficiently smaller than that of the first resistor R1. For example, if the connection wiring is formed with a resistance value of 1kΩ, the voltage of the connection node is as follows, so the current I2 can be almost ignored. The connection wiring can be formed of a wiring layer mainly composed of aluminum that constitutes a gate electrode film when forming circuit elements on the first substrate 10, or a source electrode, a drain electrode, or a wiring for supplying a common voltage or the like. Alternatively, a light - shielding layer using tungsten silicide that reduces the incident light to the switching element of the pixel 17 may be used, or a transparent conductive film such as ITO may be used. (1MΩ / (1MΩ + 1kΩ))×VF1 =0.999×VF1

[0041] Note that the voltage follower that outputs the voltage VF2 has a large capacitive load (the node of the short - circuit line 15) via the second resistor R2. Therefore, it is advisable to also bring the fourth probe P4 into contact with the mounting terminal M corresponding to the low voltage VSS electrically connected to the short - circuit line 15 and apply the ground voltage GND to the short - circuit line 15 as well.

[0042] In addition, in this embodiment, it is an electro-optical panel with a phase development drive system. For this reason, since the number of mounting terminals M is small, the terminal width of the mounting terminal M is relatively large. Therefore, at the time of inspection, the first probe P1, the second probe P2, the third probe P3, and the fourth probe P4 can be directly brought into contact to apply a desired signal or voltage.

[0043] When electrically connecting the inspection circuit 40 and the first substrate 10, a connector may be provided on the substrate on which the inspection circuit 40 is provided, and the electro-optical panel 100 having the first circuit board 60 may be mounted on the connector.

[0044] 1-4. Temperature Detection during Driving of the Electro-optical Device 1 FIG. 3 is an explanatory diagram showing a state of detecting the temperature of the electro-optical panel 100 shown in FIG. 1. FIG. 3 shows a state of detecting the temperature of the electro-optical panel 100 in the state of the electro-optical device 1. The first substrate 10 in which the sensor element 160 was inspected in the state of the substrate alone in the inspection process described with reference to FIG. 2 is used for the electro-optical panel 100 of the electro-optical device 1 shown in FIG. Here, as shown in FIG. 3, in the electro-optical device 1, a sensor drive circuit 50 that drives the sensor circuit 16 is provided on the second circuit board 70. The sensor drive circuit 50 drives the sensor circuit 16 using a first terminal formed of a first mounting terminal M1, a second terminal formed of a second mounting terminal M2, and a third terminal formed of a third mounting terminal M3.

[0045] However, even in the state where the electro-optical device 1 is configured, on the first substrate 10, the first mounting terminal M1 is electrically connected to the short-circuit line 15 via the first resistance element R1 and the second resistance element R2, and the second mounting terminal M2 is electrically connected to the short-circuit line 15 via the third resistance element R3. Even in this case, on the first substrate 10, there is a third mounting terminal M3 that is electrically connected to the connection node between the first resistance element R1 and the second resistance element R2.

[0046] Therefore, in this embodiment, the sensor drive circuit 50 is substantially the same as the inspection circuit 40 shown in FIG. 1. It includes a power supply circuit 51 that energizes the first mounting terminal M1 with the voltage of the second mounting terminal M2 fixed, a voltage setting unit 52 that makes the voltage VF2 of the third mounting terminal M3 correspond to the voltage of the first mounting terminal M1, and a detection circuit 53 that detects the voltage VF1 or current of the first mounting terminal M1.

[0047] In this embodiment, the power supply circuit 51 is a constant current circuit 510 that supplies a constant current (current I1) to the sensor element 160 via the first mounting terminal M1. The voltage setting unit 52 makes the voltage VF2 of the third mounting terminal M3 correspond to the voltage of the first mounting terminal M1. For example, the voltage setting unit 52 makes the voltage VF2 of the third mounting terminal M3 a voltage with a constant difference from the voltage of the first mounting terminal M1. In this embodiment, the voltage setting unit 52 makes the voltage VF2 of the third mounting terminal M3 the same as the voltage of the first mounting terminal M1. More specifically, the voltage setting unit 52 is constituted by, for example, a voltage follower 520. The input terminal of the voltage follower 520 is electrically connected to the first mounting terminal M1, and the output terminal is electrically connected to the third mounting terminal M3. The detection circuit 53 is an A / D converter 530 that converts the voltage VF1 of the first mounting terminal M1, which is the anode voltage of the sensor element 160 when the current I1 is supplied to the first mounting terminal M1 from the constant current circuit 510, into a digital signal. Further, the sensor drive circuit 50 includes a stabilization capacitor 542 between the ground wiring and the output line of the anode voltage VF1 of the sensor element 160, and a stabilization capacitor 541 between the ground wiring and the output line of the voltage follower 520.

[0048] Also, in the sensor drive circuit 50, the A / D converter 530 digitizes the voltage VF2 output from the voltage follower 520 that has received the voltage VF1 at the anode of the sensor element 160, and outputs it to the central control unit 55. Therefore, since the voltage VF1 at the first mounting terminal M1 when the current I1 output from the constant current circuit 510 is applied to the sensor element 160 has a negative correlation with the temperature of the electro-optical panel 100, if the voltage VF1 is detected by the detection circuit 53, such a detection result is output to the central control unit 55 as a temperature signal corresponding to the temperature of the electro-optical panel 100.

[0049] When detecting the temperature, since the same voltage is applied to both terminals of the first resistance element R1, the current I2 flowing through the first resistance element R1 becomes zero. Therefore, the current I1 flowing from the first mounting terminal M1 directly becomes the current I4 flowing through the sensor element 160. For this reason, the sensor element 160 can be properly driven, and the temperature of the electro-optical panel 100 can be accurately detected. Therefore, in an electronic device equipped with the electro-optical device 1, the driving conditions and the like of the electro-optical device 1 can be adjusted under the control of the central control unit 55, so that high display quality can be maintained. For example, in an electronic device, under the control of the central control unit 55, the cooling conditions of the cooling fan for the electro-optical panel 100, the heating conditions of the heater as a countermeasure for a low-temperature environment, or image signal correction can be properly performed, so that high display quality can be maintained.

[0050] Here, the slew rate of the operational amplifier that constitutes the voltage follower 520 has a margin with respect to the change in the forward voltage VF1 of the sensor element 160 accompanying the temperature change of the electro-optical panel 100. Specifically, since the temperature rise of the electro-optical panel 100 when the projection display device is lit is about several °C / second, there is no problem with the followability of the voltage follower 520. Therefore, the voltage VF1 and the voltage VF2 are maintained at equal values. Also, even if the voltage VF1 and the voltage VF2 deviate by several mV due to the offset voltage of the operational amplifier, the deviation is slight, and the resistance value of the first resistance element R1 is 1 MΩ, which is sufficiently large. Therefore, the current I2 is a minute current. Further, since the change in the forward voltage VF1 of the sensor element 160 composed of a diode element is slight with respect to the change in the current I1 (= I4), it functions sufficiently for temperature detection.

[0051] [Modification Example 1 of the First Embodiment] FIG. 4 is an explanatory view of the electro-optical device 1 according to Modification Example 1 of the first embodiment of the present invention. FIG. 4 shows a state of detecting the temperature of the electro-optical panel 100 in the electro-optical device 1. Since the basic configuration of this embodiment is the same as that of the first embodiment, the same reference numerals are given to the common parts and their explanations are omitted.

[0052] In the first embodiment, the second mounting terminal M2 electrically connected to the cathode of the sensor element 160, the first mounting terminal M1 electrically connected to the anode of the sensor element 160, and the third mounting terminal M3 to which the same voltage VF2 as the voltage VF1 of the first mounting terminal M1 is applied are arranged in this order. In this embodiment, as shown in FIG. 4, the first mounting terminal M1, the third mounting terminal M3, and the second mounting terminal M2 are arranged in this order, and the third mounting terminal M3 is arranged between the first mounting terminal M1 and the second mounting terminal M2.

[0053] More specifically, when the first mounting terminal M1 and the second mounting terminal M2 are adjacent to each other, for example, if there is a high-resistance short circuit near the mounting terminal M of the first circuit board 60 or the first board 10, a part of the current I1 that drives the sensor element 160 leaks to the node (GND) of the first mounting terminal M1, resulting in an error in temperature detection. In some cases, it may be difficult to detect a high-resistance short circuit as a defect. Even if it is detected and determined to be a good product, when placed in a high-humidity environment, the leakage current component may increase due to corrosion of the wiring metal material or the like.

[0054] In contrast, in this embodiment, since the third mounting terminal M3 is arranged between the first mounting terminal M1 and the second mounting terminal M2, the wiring adjacent to the wiring electrically connected to the anode of the sensor element 160 is the wiring extending from the third mounting terminal M3. Here, since the voltage VF1 of the first mounting terminal M1 and the voltage VF2 of the third mounting terminal M3 are in the relationship of the input voltage and the output voltage of the voltage follower 520, the leakage current between the wiring electrically connected to the anode of the sensor element 160 and the wiring extending from the third mounting terminal M3 can be made almost zero. Therefore, the constant current drive of the sensor element 160 can be properly maintained. Further, as shown in FIG. 4, if one mounting terminal M adjacent to the first mounting terminal M1 is the third mounting terminal M3 and the other adjacent mounting terminal M is the mounting terminal M of the dummy DUM that is electrically floating, the reliability of temperature detection can be further improved. Also, the voltage VF2 may be supplied to the mounting terminal M of the dummy DUM in the same manner as the third mounting terminal M3.

[0055] [Modification Example 2 of the First Embodiment] In the first embodiment, on the large substrate 90, all the first resistance elements R1, the second resistance elements R2, etc. used for inspecting the sensor element 160 are arranged in a plurality of first regions 91 divided as the first substrate 10. Therefore, the inspection of the sensor element 160 may be performed in a state where the first substrate 10 is divided from the large substrate 90. In this case, the first substrate 10 itself corresponds to the "substrate for an electro-optical device" according to the present invention.

[0056] [Second Embodiment] 2-1. Configuration of Large Substrate 90 FIG. 5 is an explanatory diagram of a large substrate 90 for manufacturing the electro-optical device 1 according to the second embodiment of the present invention. FIG. 5 shows a state in which the sensor element 160 is inspected in the state of the large substrate 90 for manufacturing the first substrate 10. Since the basic configuration of this embodiment is the same as that of the first embodiment, the same reference numerals are given to the common parts and their descriptions are omitted.

[0057] In this embodiment, the large substrate 90 includes a plurality of first regions 91 where the first substrate 10 is disposed, and between adjacent first regions 91, there are provided second regions 92 corresponding to scribe regions 98 and 99 that are scribed when the first substrate 10 is divided into individual substrates. In the second embodiment, the first region 91 of the large substrate 90 is divided into small substrates 95 as the first substrate 10, and in the second region 92 of the large substrate 90, a first resistor element R1, a second resistor element R2, a third resistor element R3, a first short-circuit line 151, a resistor element R, and connection lines connecting the respective parts are arranged. In this embodiment, the large substrate 90 corresponds to the "substrate for electro-optical device" in the present invention.

[0058] As shown in FIG. 5, also in this embodiment, similar to the first embodiment, a plurality of mounting terminals M are arranged in the mounting terminal region 14 of the first substrate 10, and the plurality of mounting terminals M and the wirings extending from the plurality of mounting terminals M each correspond to the following signals and voltages. In this embodiment, in the optical device, a plurality of data lines extending in the display region of the substrate are blocked, and the image signals supplied from the image signal wirings provided corresponding to each block are distributed to the data lines by a demultiplexer. For this reason, a plurality of mounting terminals M corresponding to the selection signal SEL and mounting terminals M corresponding to the image signals VIDeven and VIDodd are provided, but in FIG. 5, only one mounting terminal M corresponding to the selection signal SEL and mounting terminals M corresponding to the image signals VIDeven and VIDodd are shown as an abbreviated notation. Note that the illustrated signals and power supplies are representative examples, and actually, the waveform of the scanning signal output from the scanning line driving circuit 12 is shaped by an output control signal (not shown). Clock signal VCLK for scanning line driving circuit Inverted clock signal VCLKB with respect to the clock signal VCLK Start pulse VSP for the scanning line drive circuit Selection signal SE Image signal VIDeven of the even series Image signal VIDodd of the odd series High voltage VDD Low voltage VSS Common voltage LCCOM

[0059] In this embodiment, since the number of image signal terminals is larger than that in the phase development drive method, the terminal width of the mounting terminal M in the mounting terminal area 14 is small. For this reason, it is difficult to bring the inspection probe into contact with the mounting terminal M. Therefore, an inspection terminal area 18 is provided between the mounting terminal area 14 and the data line drive circuit 13 so as to be parallel to the mounting terminal area 14, and inspection terminals T are provided in the inspection terminal area 18 corresponding to the mounting terminals M. Such inspection terminals T are used for inspections such as the operation of the scanning line drive circuit, a short circuit between adjacent image signal lines, or conduction / disconnection of a predetermined signal line.

[0060] Also, in the inspection terminal area 18, a first inspection terminal T1 electrically connected to the first mounting terminal M1, a second inspection terminal T2 electrically connected to the second mounting terminal M2, and a third inspection terminal T3 are provided. Therefore, in this embodiment, the "first terminal", "second terminal" and "third terminal" in the present invention are constituted by the first mounting terminal M1, the second mounting terminal M2, the third mounting terminal M3, the first inspection terminal T1, the second inspection terminal T2, and the third inspection terminal T3. First terminal = First mounting terminal M1 + First inspection terminal T1 Second terminal = Second mounting terminal M2 + Second inspection terminal T2 Third terminal = Third inspection terminal T3

[0061] Also, in this embodiment as well, similar to the first embodiment, a sensor circuit 16 having a sensor element 160 is provided on the first substrate 10 outside the pixel area 11. In this embodiment, the sensor element 160 is a temperature detection element composed of a diode element.

[0062] Inspection of Sensor Element 160 in the State of Large Substrate 90 with Dimensions 2-2 In this embodiment, when inspecting the sensor element 160 of the first substrate 10, as shown in FIG. 5, the inspection is performed in the state of the large substrate 90 having a plurality of first regions 91 where the first substrate 10 is disposed. Here, scribe regions 98 and 99 exist in the second region 92 between adjacent first regions 91. In FIG. 5, the scribe center lines 980 and 990 of the scribe regions 98 and 99 are indicated by dashed-dotted lines. The second region 92 is cut away when dividing a plurality of first substrates 10 from the large substrate 90 into individual substrates, and most of it is lost. Further, the first region 91 to be divided as the first substrate 10 is adjacent to the second region 92 via the division planned lines 981 and 991 when divided into small substrates 95 in the scribe regions 98 and 99.

[0063] In this embodiment, in the second region 92, a first short-circuit line 151 extending in the x-axis direction along the end of the first substrate 10 and a second short-circuit line 152 extending in the y-axis direction along the end of the first substrate 10 are provided, and the first region 91 is surrounded by the first short-circuit line 151 and the second short-circuit line 152. The first short-circuit line 151 and the second short-circuit line 152 are electrically connected to each other and constitute a guard ring surrounding the first region 91 to be divided as the first substrate 10. The first short-circuit line 151 and the second short-circuit line 152 are formed of a conductive layer such as a gate electrode film, for example.

[0064] The mounting terminal M is electrically connected to the first short-circuit line 151 via a resistance element R provided in the scribe region 98. Therefore, a circuit electrically connected to the mounting terminal M can be protected from static electricity during the manufacturing process. However, the mounting terminals M corresponding to the image signals VIDeven and VIDodd are not structured to be electrically connected to the first short-circuit line 151 via a resistance element R because the leakage current becomes an obstacle to inspection. Also, the image signals VIDeven and VIDodd are electrically connected to the inspection terminal T via wirings provided in the scribe region 98. Therefore, it is possible to easily inspect whether there is a short circuit between the wirings extending from the respective mounting terminals M of the image signals VIDeven and VIDodd into the first substrate 10.

[0065] Also, in the scribe region 98, a first resistance element R1 electrically connected between the first mounting terminal M1 and the second mounting terminal M2, and a second resistance element R2 electrically connected between the first resistance element R1 and the second mounting terminal M2 are provided. Further, on the first substrate 10, outside the pixel region 11, a third inspection terminal T3 electrically connected between the first resistance element R1 and the second resistance element R2 is provided. Also in this embodiment, similar to the first embodiment, one end of the first resistance element R1 is electrically connected to the first mounting terminal M1, and the other end is electrically connected to one end of the second resistance element R2. The other end of the second resistance element R2 is electrically connected to the first short-circuit line 151. Therefore, the first resistance element R1 and the second resistance element R2 are electrically connected in series between the first mounting terminal M1 and the first short-circuit line 151, and the second resistance element R2 is electrically connected to the second mounting terminal M2 via the first short-circuit line 151.

[0066] Also, in the scribe region 98, a third resistor element R3 having one end electrically connected to the second mounting terminal M2 is provided, and the other end of the third resistor element R3 is electrically connected to the first short-circuit line 151. Therefore, the circuits electrically connected to the first mounting terminal M1 and the second mounting terminal M2 can be protected from static electricity during the manufacturing process. Here, the resistor element R, the first resistor element R1, the second resistor element R2, and the third resistor element R3 all have the same resistance value. For example, the resistor element R, the first resistor element R1, the second resistor element R2, and the third resistor element R3 all have a resistance value of 1 MΩ.

[0067] When inspecting the sensor element 160 in the first region 91 divided as the first substrate 10 in the large substrate 90 configured as described above, the inspection circuit 40 is used in the same manner as in the first embodiment. More specifically, the three first probes P1, second probes P2, and third probes P3 of the inspection circuit 40 are brought into contact with the first terminal, the second terminal, and the third terminal. At this time, although not shown in the figure, it is preferable to also bring probes into contact with other inspection terminals T at the same time, for example, to apply a ground voltage GND voltage. Note that the inspection circuit 40 in FIG. 5 is a separate device outside the large substrate 90.

[0068] In this embodiment, as shown below, among the first mounting terminal M1, the second mounting terminal M2, the first inspection terminal T1, the second inspection terminal T2, and the third inspection terminal T3, the three first probes P1, second probes P2, and third probes P3 of the inspection circuit 40 are brought into contact with the first inspection terminal T1, the second inspection terminal T2, and the third inspection terminal T3. Therefore, during inspection, the "first terminal", "second terminal", and "third terminal" in the present invention are constituted by the first inspection terminal T1, the second inspection terminal T2, and the third inspection terminal T3. First terminal = First inspection terminal T1 Second terminal = Second inspection terminal T2 Third terminal = Third inspection terminal T3

[0069] Therefore, the energization circuit 41 applies a voltage VF1 to the first inspection terminal T1 with the cathode voltage of the sensor element 160 being the ground voltage GND via the second probe P2 and the second inspection terminal T2, and the detection circuit 43 detects the current I1 flowing through the first inspection terminal T1. At this time, the voltage setting unit 42 maintains the following conditions for the voltage VF2 applied to the third inspection terminal T3 via the third probe P3. VF1 = VF2

[0070] For this reason, a voltage VF2 (= VF1) is applied to the connection node between the first resistor element R1 and the second resistor element R2. Therefore, since the same voltage is applied to both terminals of the first resistor element R1, the current I2 flowing through the first resistor element R1 becomes zero. Therefore, the current I1 flowing from the first mounting terminal M1 directly becomes the current I4 flowing through the sensor element 160. Thus, the electrical characteristics of the sensor element 160 can be accurately measured based on the voltage VF1 and the current I1 of the first mounting terminal M1.

[0071] 2-3. Temperature Detection during Driving of the Electro-Optical Device 1 FIG. 6 is an explanatory diagram of the electro-optical device 1 according to the second embodiment of the present invention. In the inspection process described with reference to FIG. 5, after the large substrate 90 on which the sensor element 160 is inspected in the state of the substrate alone is divided into the first substrate 10 as the small substrate 95, the first substrate 10 is used for the electro-optical panel 100 of the electro-optical device 1 shown in FIG. 1. Therefore, as shown in FIG. 6, in the state of the electro-optical device 1, on the first substrate 10, the first short-circuit line 151, the second short-circuit line 152, the resistor element R, the first resistor element R1, the second resistor element R2, and the third resistor element R3 are typically not present because they are destroyed by the scribing process. Some may remain. Note that the third inspection terminal T3 remains on the first substrate 10, and the wiring extending from the third inspection terminal T3 reaches the side 101 of the first substrate 10. Further, the first circuit board 60 is electrically connected to the mounting terminal M, the first mounting terminal M1, and the second mounting terminal M2. Therefore, during temperature detection, the "first terminal" and the "second terminal" in the present invention are constituted by the first inspection terminal T1 and the second inspection terminal T2. First terminal = First mounting terminal M1 Second terminal = Second mounting terminal M2

[0072] Further, the sensor drive circuit 50 includes a power supply circuit 51 that supplies power to the first mounting terminal M1 with the voltage of the second mounting terminal M2 fixed, and a detection circuit 53 that detects the voltage of the first mounting terminal M1.

[0073] The power supply circuit 51 is a constant current circuit 510 that sets the second mounting terminal M2 to the ground voltage GND and supplies a current I1 consisting of a constant current to the first mounting terminal M1. The detection circuit 53 is an A / D converter 530 that converts the voltage VF2 output from the voltage follower 560 to which the voltage VF1 is input into a digital signal. The voltage VF1 is the anode voltage of the sensor element 160 when the current I1 is supplied from the constant current circuit 510 to the first mounting terminal M1. Note that the sensor drive circuit 50 includes a stabilization capacitor 540 between the wiring extending from the power supply circuit 51 to the second mounting terminal M2 and the wiring extending from the voltage follower 560 to the first mounting terminal M1.

[0074] According to such a configuration, after the first substrate 10 is divided from the large substrate 90, the first substrate 10 does not have the first short-circuit line 151, the second short-circuit line 152, the resistance element R, the first resistance element R1, the second resistance element R2, and the third resistance element R3. Therefore, the current I1 flowing from the first mounting terminal M1 directly becomes the current I4 flowing to the sensor element 160. Thus, the sensor element 160 can be properly driven. Accordingly, since the voltage VF1 of the first mounting terminal M1 when the current I1 is applied to the sensor element 160 has a negative correlation with the temperature of the electro-optical panel 100, if the detection circuit 53 detects the voltage VF2 corresponding to the voltage VF1, such a detection result is output by the detection circuit 53 to the central control unit 55 as a temperature signal corresponding to the temperature of the electro-optical panel 100. Therefore, in the electro-optical device 1, under the control of the central control unit 55, the control of the cooling fan for the electro-optical panel 100, the control of the heater as a countermeasure for a low-temperature environment, or the correction of the image signal can be performed. In this embodiment, although both the first resistance element R1 and the second resistance element R2 are provided in the second region 72, it can also be applied when only one of the first resistance element R1 and the second resistance element R2 is provided in the second region 72. For example, the first resistance element R1 may be disposed between the first mounting terminal M1 and the mounting terminal M of the dummy DUM adjacent to the first mounting terminal M1. In this case, the first resistance element R1 remains on the first substrate 10.

[0075] [Modification Example 1 of the Second Embodiment] FIG. 7 is an explanatory diagram of Modification Example 1 of the second embodiment of the present invention. FIG. 7 shows a large substrate 90 for manufacturing the first substrate 10. Since the basic configuration of this embodiment is the same as that of the second embodiment, the same reference numerals are given to the common parts and their descriptions are omitted. In this embodiment, the large substrate 90 corresponds to the "substrate for electro-optical device" in the present invention.

[0076] As shown in FIG. 7, also in this embodiment, similar to the second embodiment, a plurality of mounting terminals M are arranged in the mounting terminal region 14 of the first substrate 10, and each of the plurality of mounting terminals M and the wirings extending from the plurality of mounting terminals M corresponds to the following signals and voltages. Note that the illustrated signals and power supplies are representative examples as in the second embodiment, and are not limited thereto. Clock signal VCLK for scanning line driving circuit Inverted clock signal VCLKB with respect to clock signal VCLK Start pulse VSP for scanning line driving circuit Selection signal SEL Image signal VIDeven of even series Image signal VIDodd of odd series High voltage VDD Low voltage VSS Common voltage LCCOM

[0077] When the pixel pitch of the electro-optical panel 100 is relatively large, the terminal width of the mounting terminal M can be increased, so that the inspection probe may be able to be brought into contact. In this embodiment, since the mounting terminal M is relatively large, the inspection terminals T, the first inspection terminal T1, the second inspection terminal T2, and the third inspection terminal T3 shown in FIG. 5 are not provided. Therefore, in this embodiment, the "first terminal", "second terminal", and "third terminal" in the present invention are constituted by the first mounting terminal M1, the second mounting terminal M2, and the third mounting terminal M3. First terminal = First mounting terminal M1 Second terminal = Second mounting terminal M2 Third terminal = Third mounting terminal M3

[0078] Also, in this embodiment, similar to the second embodiment, a first short-circuit line 151, a second short-circuit line 152, a first resistor element R1, a second resistor element R2, and a third resistor element R3 are provided in the scribe regions 98 and 99. Therefore, similar to the second embodiment, the first mounting terminal M1, the second mounting terminal M2, and the third mounting terminal M3 can be used as the first terminal, the second terminal, and the third terminal, respectively, to properly inspect the sensor element 160 by the inspection circuit 40. Also, in the state of the electro-optical device 1, on the first substrate 10, the first short-circuit line 151, the second short-circuit line 152, the resistor element R, the first resistor element R1, the second resistor element R2, and the third resistor element R3 are typically not present because they are destroyed in the scribing process. Further, the third mounting terminal M3 remains on the first substrate 10, and the wiring extending from the third mounting terminal M3 reaches the side 101 of the first substrate 10. Therefore, similar to the second embodiment, the first mounting terminal M1 and the second mounting terminal M2 can be used as the first terminal and the second terminal, respectively, to detect the temperature by the sensor drive circuit 50.

[0079] [Modification Example 2 of the Second Embodiment] FIG. 8 is an explanatory diagram of Modification Example 2 of the second embodiment of the present invention. FIG. 8 shows a large substrate 90 for manufacturing the first substrate 10. Since the basic configuration of this embodiment is the same as that of the second embodiment, the same reference numerals are given to the common parts and their descriptions are omitted. In this embodiment, the large substrate 90 corresponds to the "substrate for electro-optical device" in the present invention.

[0080] As shown in FIG. 8, also in this embodiment, similar to the second embodiment, a plurality of mounting terminals M are arranged in the mounting terminal region 14 of the first substrate 10, and the plurality of mounting terminals M and the wiring extending from the plurality of mounting terminals M each correspond to the following signals and voltages. Note that the illustrated signals and power supplies are representative examples as in the second embodiment and are not limited thereto. Clock signal VCLK for the scanning line drive circuit Inverted clock signal VCLKB with respect to the clock signal VCLK Start pulse VSP for the scanning line drive circuit Selection signal SEL Image signal VIDeven of the even series Image signal VIDodd of the odd series High voltage VDD Low voltage VSS Common voltage LCCOM

[0081] Also, in this embodiment, an inspection terminal T, a first inspection terminal T1, a second inspection terminal T2, and a third inspection terminal T3 are provided. Therefore, in this embodiment, the "first terminal", "second terminal", and "third terminal" in the present invention are constituted by the first mounting terminal M1, the second mounting terminal M2, the third mounting terminal M3, the first inspection terminal T1, the second inspection terminal T2, and the third inspection terminal T3. First terminal = First mounting terminal M1 + First inspection terminal T1 Second terminal = Second mounting terminal M2 + Second inspection terminal T2 Third terminal = Third mounting terminal M3 + Third inspection terminal T3

[0082] Also, in this embodiment, similar to the second embodiment, a first short - circuit line 151, a second short - circuit line 152, a first resistance element R1, a second resistance element R2, and a third resistance element R3 are provided in the scribe regions 98, 99. Therefore, the three first probes P1, second probes P2, and third probes P3 can be brought into contact with the first inspection terminal T1, the second inspection terminal T2, and the third inspection terminal T3, and the sensor element 160 can be properly inspected by the inspection circuit 40.

[0083] Here, the third resistor element R3 electrically connected to the second mounting terminal M2 and the second inspection terminal T2 is not directly electrically connected to the first short-circuit line 151, but is connected to the wiring portion 961 in the scribe region 98. Also, the first resistor element R1 is not directly electrically connected to the second resistor element R2, but is connected to the wiring portion 961 in the scribe region 98. Further, the wiring portion 961 is electrically connected to the first short-circuit line 151 via the third mounting terminal M3 and the second resistor element R2. The third inspection terminal T3 is electrically connected to the third mounting terminal M3. In FIG. 8, the third inspection terminal T3 and the third mounting terminal M3 are electrically connected within the first substrate 10, but they may be electrically connected in the scribe region 98. Also, in FIG. 8, the third inspection terminal T3 and the third mounting terminal M3 are electrically connected at the long side portion of the terminal electrode forming the rectangular shape of the third mounting terminal M3, but they may be electrically connected at the short side portion on the inner side of the first substrate 10.

[0084] When arranged in this way, the first resistor element R1, the second resistor element R2, and the third resistor element R3 will be arranged in the array direction (x-axis direction) of the mounting terminals M, so it becomes easy to arrange resistor elements with the same layout as other resistor elements R, etc. In the second embodiment shown in FIG. 5, since the first resistor element R1 and the second resistor element R2 are arranged in the y-axis direction, it is necessary to have a different layout from other resistor elements R, etc., increasing the manufacturing management man-hours of the resistor elements. Also, depending on the variations during the scribing process, after being divided into the first substrate 10, the first mounting terminal M1 and the third inspection terminal T3 may remain electrically connected via the first resistor element R1. In that case, it is not preferable because it will increase the electrostatic intrusion path to the sensor circuit 16.

[0085] In addition, a first mounting terminal M1 and a second mounting terminal M2 that are electrically connected to the sensor circuit 16 are electrically connected by a first resistor element R1, a wiring portion 961 in the scribe region 98, and a third resistor element R3. Further, the wiring portion 961 is electrically connected to the first short-circuit line 151 via a third mounting terminal M3 and a second resistor element R2. Therefore, the effect of protecting the sensor circuit 16 from electrostatic breakdown during the manufacturing process can also be obtained. Also, in this embodiment, since the second resistor element R2 has a sufficiently large resistance value, a voltage VF2 (= VF1) is applied to the connection node between the first resistor element R1 and the second resistor element R2.

[0086] Also, in the state of the electro-optical device 1, the first short-circuit line 151, the second short-circuit line 152, the resistor element R, the first resistor element R1, the second resistor element R2, and the third resistor element R3 are typically not present because they are destroyed by the scribing process on the first substrate 10. Also, the third mounting terminal M3 remains on the first substrate 10, and the wiring extending from the third mounting terminal M3 reaches the side 101 of the first substrate 10 via the dummy mounting terminal M. Therefore, similar to the second embodiment, the temperature can be detected by the sensor drive circuit 50 using the first mounting terminal M1 and the second mounting terminal M2 as the first terminal and the second terminal, respectively.

[0087] [Modification Example 3 of the Third Embodiment] FIG. 9 is an explanatory diagram of Modification Example 3 of the second embodiment of the present invention. FIG. 8 shows a large substrate 90 for manufacturing the first substrate 10. Since the basic configuration of this embodiment is the same as that of Modification Example 2 of the second embodiment, the same reference numerals are given to the common parts and their descriptions are omitted. In this embodiment, the large substrate 90 corresponds to the "substrate for electro-optical device" in the present invention.

[0088] As shown in FIG. 9, also in this embodiment, in addition to the plurality of mounting terminals M, inspection terminals T, a first inspection terminal T1, a second inspection terminal T2, and a third inspection terminal T3 are provided. Therefore, in this embodiment, the "first terminal", "second terminal", and "third terminal" in the present invention are constituted by the first mounting terminal M1, the second mounting terminal M2, the first inspection terminal T1, the second inspection terminal T2, and the third inspection terminal T3. First terminal = First mounting terminal M1 + First inspection terminal T1 Second terminal = Second mounting terminal M2 + Second inspection terminal T2 Third terminal = Third inspection terminal T3

[0089] Here, the third inspection terminal T3 is in the first region 91 adjacent in the y-axis direction on the large substrate 90. That is, when looking at the first substrate 10, on the side 102 side of the first substrate 10, there is a third inspection terminal T3 corresponding to the adjacent first region 91, and there is a wiring portion 962 extending from the third inspection terminal T3 toward the side 102 of the first substrate 10.

[0090] With such a configuration, the degree of freedom in arranging the third inspection terminal T3 is increased. For example, when attempting to arrange the third inspection terminal T3 near the other inspection terminals T, the first inspection terminal T1, and the second inspection terminal T2, it is possible to avoid reducing the display quality by causing problems in driving due to narrowing the wiring widths of various signal lines and power supply wirings on the first substrate 10.

[0091] Also, the first mounting terminal M1 and the second mounting terminal M2 electrically connected to the sensor circuit 16 are electrically connected by the first resistance element R1, the wiring portion 963 in the scribe region 98, and the third resistance element R3. Further, the wiring portion 963 is electrically connected to the first short-circuit line 151 via the second resistance element R2. Therefore, an effect of protecting the sensor circuit 16 from electrostatic breakdown during the manufacturing process is also obtained. Similar to the second embodiment, the first inspection terminal T1, the second inspection terminal T2, and the third inspection terminal T3 can be used as the first terminal, the second terminal, and the third terminal, respectively, to properly inspect the sensor element 160 by the inspection circuit 40.

[0092] Also, in the state of the electro-optical device 1, the first short-circuit line 151, the second short-circuit line 152, the resistance element R, the first resistance element R1, the second resistance element R2, and the third resistance element R3 on the first substrate 10 are typically absent because they are destroyed by the scribing process. Further, on the first substrate 10, the third inspection terminal T3 corresponding to the adjacent first region 91 remains, and the wiring portion 962 extending from the third inspection terminal T3 reaches the side 102 of the first substrate 10. Therefore, similar to the second embodiment, there is no unintended short-circuit path other than the sensor circuit 16 between the first mounting terminal M1 and the second mounting terminal M2. Therefore, similar to the second embodiment, the temperature can be detected by the sensor drive circuit 50 using the first mounting terminal M1 and the second mounting terminal M2 as the first terminal and the second terminal, respectively.

[0093] [Other Embodiments] In the above embodiment, at least a part of circuits such as the constant current circuit 510 and the voltage follower 520 shown in FIG. 3 may be provided on the first circuit board 60. For example, in the second embodiment shown in FIG. 6, a part of the stabilization capacitor 540 may be provided on the first circuit board 60. The stabilization capacitor 540 is, for example, 0.1 μF to 1 μF. Although the sensor circuit 16 is provided with an electrostatic protection circuit, it is difficult to provide a strong protection circuit to suppress the leakage current accompanying the temperature rise of the electro-optical panel 100. Here, when a part of the stabilization capacitor 540 is provided on the first circuit board 60, the protection of the sensor circuit 16 against electrostatic can be strengthened when electrostatic enters from the connection terminal on the second circuit board 70 side of the first circuit board 60.

[0094] In the above-described first embodiment, although the voltage setting unit 52 makes the voltage VF2 the same as the voltage VF1 of the first mounting terminal M1, the voltages VF1 and VF2 may be different as long as the voltage VF2 corresponds to the voltage VF1 of the first mounting terminal M1. That is, since the current I2 flowing through the first resistor element R1 is (VF1 - VF2) / R1, if the difference between the voltages VF1 and VF2 is constant, constant current driving by (current I1 - current I2) is possible. In this case, the voltage setting unit 52 is not constituted by the voltage follower 520, but is constituted by an addition circuit or a subtraction circuit with a stable reference voltage or the like.

[0095] In the above embodiment, the diode may be configured by connecting a transistor in a diode connection. Also, in the above embodiment, although the sensor element 160 was for temperature detection, the sensor element 160 may be for light detection. For example, by detecting the illuminance of the environment with the sensor element 160, the driving conditions of the electro-optical device 1, the illuminance of the lighting device of the electronic device, etc. may be controlled corresponding to the illuminance of the environment.

[0096] In that case, for example, in FIG. 2, the cathode of the diode element (sensor element 160) is electrically connected to the first mounting terminal M1, and the anode of the diode element is electrically connected to the second mounting terminal M2 to detect the reverse bias current of the diode element on the cathode side. The detection circuit 43 is an ammeter. If there is a short-circuit path by a resistor element between the anode and the cathode of the diode element, the electrical characteristics cannot be measured appropriately. However, according to the configuration of the present invention, the same voltage VF2 as the voltage VF1 applied to the first mounting terminal M1 is applied to the third mounting terminal M3. Therefore, the current I2 flowing through the first resistor element R1 can be ignored. That is, the electrical characteristics of the diode element can be measured appropriately.

[0097] Also, another configuration is possible. For example, in FIG. 2, the anode of the diode element (sensor element 160) is electrically connected to the first mounting terminal M1, and the cathode of the diode element is electrically connected to the second mounting terminal M2 to detect the reverse bias current of the diode element on the anode side. An independent positive voltage is applied to the second mounting terminal M2 instead of the ground voltage GND. The inspection circuit 40 detects the current I1 as the suction current with the ammeter of the detection circuit 43. Even in this case, the same voltage VF2 as the voltage VF1 applied to the first mounting terminal M1 is applied to the third mounting terminal M3. Therefore, the current I2 flowing through the first resistance element R1 can be ignored. That is, the electrical characteristics of the diode element can be appropriately measured.

[0098] In the above embodiment, in the inspection circuit 40, the sensor element 160 was inspected by detecting the current I1 when the voltage VF1 consisting of a constant voltage was applied by the energization circuit 41 with the detection circuit 43, but the sensor element 160 may be inspected by detecting the voltage VF1 when the current I1 consisting of a constant current is energized by the energization circuit 41 with the detection circuit 43. Of course, the output voltage or output current of the energization circuit 41 may be swept and measured. Also, in the above embodiment, in the sensor drive circuit 50, the temperature of the electro-optical panel 100 was detected by detecting the voltage VF1 when the current I1 consisting of a constant current was energized by the energization circuit 51 with the detection circuit 53, but the temperature or the like may be detected by detecting the current I1 when the voltage VF1 consisting of a constant voltage is applied by the energization circuit 51 with the detection circuit 53.

[0099] In the above embodiment, the electro-optical device 1 was a transmissive liquid crystal device, but the present invention may be applied when the electro-optical device 1 is a reflective liquid crystal device or when the electro-optical device 1 is a display device using a light-emitting element such as an organic electroluminescence device. Also, for the pixel, a configuration employing a display element (MEMS device) such as a DMD (Digital Micromirror Device) may be used.

[0100] [Configuration Example of Electronic Device] FIG. 10 is a schematic configuration diagram of an electronic device 2100 to which the present invention is applied. FIG. 10 shows a projection display device including an electro-optical device 1 to which the present invention is applied as an example of the electronic device 2100 to which the present invention is applied. In FIG. 10, illustration of optical elements such as polarizing plates arranged on the incident side and the emission side of the electro-optical device 1 is omitted.

[0101] In FIG. 10, the electronic device 2100 is a projection display device, and a lamp unit 2102 having a white light source such as a halogen lamp is provided as a light source unit. The projection light emitted from the lamp unit 2102 is separated into light of three primary colors, red r, green g, and blue b, by three mirrors 2106 and two dichroic mirrors 2108 arranged inside. The separated light is respectively guided to electro-optical devices 1(r), 1(g), and 1(b) corresponding to each color. The electro-optical devices 1(r), 1(g), and 1(b) are all transmissive liquid crystal devices. Since the optical path of the blue b light is longer than that of the other red r and green g lights, in order to prevent its loss, it is guided through a relay lens system 2121 having an incident lens 2122, a relay lens 2123, and an emission lens 2124.

[0102] In the electronic device 2100, after image signals specifying gradation levels of respective colors are each supplied from an external upper circuit to the electronic device 2100, they are processed by a processing circuit of the electronic device 2100 and then supplied to the electro-optical devices 1(r), 1(g), and 1(b). Then, the electro-optical devices 1(r), 1(g), and 1(b) modulate incident light based on the image signals. The modulated light emitted from the electro-optical devices 1(r), 1(g), and 1(b) enters the dichroic prism 2112 from three directions. In the dichroic prism 2112, the red r light and the blue b light are reflected at 90 degrees, and the green g light is transmitted. Therefore, after the modulated lights of respective colors are combined by the dichroic prism 2112, they are projected as a color image onto a projection member such as a screen 2120 by the projection optical system 2114. Note that, for a projection display device, as a light source unit, an LED light source or the like that emits lights of respective colors may be used, and the color lights emitted from such an LED light source or the like may be supplied to the electro-optical devices 1(r), 1(g), and 1(b) respectively to configure it.

[0103] In the electronic device 2100 configured as described above, when the temperature of the electro-optical panel 100 is detected, the driving conditions of the electro-optical device 1 can be switched under the control of the central control unit 55 shown in FIG. 3 and the like, so that high display quality can be maintained. For example, in the electronic device 2100, under the control of the central control unit 55, control of a cooling fan for the electro-optical panel 100, control of a heater as a countermeasure for a low-temperature environment, or correction of a video signal can be appropriately performed, so that high display quality can be maintained.

[0104] [Other electronic devices] The electronic device including the electro-optical device 1 to which the present invention is applied is not limited to the electronic device 2100 of the above embodiment. For example, it may be used in electronic devices such as a projection type HUD (Head-Up Display), a direct-view type HMD (Head-Mounted Display), a personal computer, a digital still camera, and a liquid crystal television.

Explanation of Reference Numerals

[0105] 1…Electro-optical device, 10…First substrate, 11…Pixel region, 12…Scanning line drive circuit, 13…Data line drive circuit, 14…Mounting terminal region, 15…Short-circuit line, 16…Sensor circuit, 17…Pixel, 18…Inspection terminal region, 19…Substrate body, 20…Second substrate, 40…Inspection circuit, 41, 51…Power supply circuit, 42, 52…Voltage setting unit, 43, 53…Detection circuit, 50…Sensor drive circuit, 55…Central control unit, 61…Drive IC, 95…Region, 90…Large substrate, 91…First region, 92…Second region, 95…Small substrate, 98, 99…Scribe region, 100…Electro-optical panel, 105…Overhang portion, 151…First short-circuit line, 152…Second short-circuit line, 160…Sensor element, 170…Pixel electrode, 510…Constant current circuit, 520, 560…Voltage follower, 530…A / D converter, 961, 962, 963…Wiring portion, 980, 990…Scribe center line, 981, 991…Division planned line, 2100…Electronic device, 2102…Lamp unit, 2106…Mirror, 2108…Dichroic mirror, 2112…Dichroic prism, 2114…Projection optical system, 2120…Screen, 2121…Relay lens system, 2122…Incident lens, 2123…Relay lens, 2124…Exit lens, M…Mounting terminal, M1…First mounting terminal, M2…Second mounting terminal, M3…Third mounting terminal, P1…First probe, P2…Second probe, P3…Third probe, P4…Fourth probe, R…Resistance element, R1…First resistance element, R2…Second resistance element, R3…Third resistance element, T…Inspection terminal, T1…First inspection terminal, T2…Second inspection terminal, T3…Third inspection terminal.

Claims

1. A temperature sensor including a diode element, a first terminal electrically connected to one electrode of the temperature sensor, a second terminal electrically connected to the other electrode of the temperature sensor, a short-circuit wire electrically connected to the first terminal and the second terminal, a first resistor element having one end electrically connected to the first terminal, a second resistor element having one end electrically connected to the other end of the first resistor element and the other end electrically connected to the short-circuit wire, a third resistor element having one end electrically connected to the second terminal and the other end electrically connected to the short-circuit wire, and a third terminal electrically connected to the other end of the first resistor element and one end of the second resistor element. A substrate for an electro-optical device, characterized by comprising the above components.

2. In the substrate for an electro-optical device according to Claim 1, the third terminal is disposed between the first terminal and the second terminal. A substrate for an electro-optical device, characterized by this structure.

3. In the substrate for an electro-optical device according to Claim 1 or 2, a first region corresponding to a first substrate constituting the electro-optical device, and a second region between adjacent first regions. The temperature sensor, the first terminal, the second terminal, the third terminal, the first resistor element, and the second resistor element are provided in the first region. A substrate for an electro-optical device, characterized by this structure.

4. In the substrate for an electro-optical device according to Claim 1 or 2, a first region corresponding to a first substrate constituting the electro-optical device, and a second region between adjacent first regions. At least the temperature sensor, the first terminal, the second terminal, and the third terminal are provided in the first region, and the first resistor element and the second resistor element are provided in the second region. A substrate for an electro-optical device, characterized by this structure.

5. An electro-optical device including the first substrate after dividing the substrate for an electro-optical device according to Claim 3, a circuit board electrically connected to the first substrate, and a sensor drive circuit provided on the circuit board. The sensor drive circuit includes a power supply circuit for supplying power to the first terminal, a voltage setting unit for applying a voltage corresponding to the voltage of the first terminal to the third terminal, and a detection circuit for detecting the voltage or current of the first terminal. An electro-optical device, characterized by this structure.

6. An electro-optical device including the first substrate after dividing the substrate for an electro-optical device according to Claim 4, a circuit board electrically connected to the first substrate, and ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ A circuit board electrically connected to the first substrate, A sensor drive circuit provided on the circuit board, And having, The sensor drive circuit includes a power supply circuit that supplies power to the first terminal, and the voltage or An electro-optical device characterized by comprising a detection circuit that detects current.

7. In the electro-optical device according to claim 5 or 6, The power supply circuit is a constant current circuit, An electro-optical device characterized in that the detection circuit detects the voltage of the first terminal.

8. In the electro-optical device according to claim 5, The voltage setting unit applies the same voltage as the voltage of the first terminal to the third terminal. An electro-optical device characterized by this.

9. In the electro-optical device according to claim 8, The voltage setting unit is a voltage follower, The first terminal is electrically connected to the input terminal of the voltage follower, An electro-optical device characterized in that the output terminal of the voltage follower is electrically connected to the third terminal.

10. An electronic device including the electro-optical device according to any one of claims 5 to 9, Based on the output from the detection circuit, the driving conditions, cooling conditions or heating of the electro-optical device An electronic device characterized by adjusting conditions.

11. In the method for manufacturing an electro-optical device using the substrate for an electro-optical device according to claim 3 or 4, In, Manufacturing an electro-optical device using the first substrate after dividing the substrate for the electro-optical device. A method for manufacturing an electro-optical device, characterized by this.

12. An inspection circuit for inspecting the temperature sensor of the substrate for an electro-optical device according to any one of claims 1 to 4, That is, A power supply circuit that supplies power to the first terminal, A voltage setting unit that applies a voltage corresponding to the voltage of the first terminal to the third terminal, A detection circuit that detects the voltage or current of the first terminal, An inspection circuit characterized by having.

13. In the inspection circuit according to claim 12, The voltage setting unit applies the same voltage as the voltage of the first terminal to the third terminal. An inspection circuit characterized by this.

14. In the inspection circuit according to claim 13, The voltage setting unit is a voltage follower, The first terminal is electrically connected to the input terminal of the voltage follower, An inspection circuit characterized in that the output terminal of the voltage follower is electrically connected to the third terminal. ​

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