Phased Array Antenna

Abstract

To suppress a decrease in the efficiency of heat transfer of heat generated in a block to a heat medium.SOLUTION: A phased-array antenna 1 includes a front plate 12, a frame 11 defining one surface of the front plate 12 and having a heat medium flow path therein, a block 13 arranged in a space defined by the frame 11 and equipped with a transmission module, a thermally conductive material 16 disposed between the frame 11 and the block 13 and having electrical conductivity, and a lid portion 14 that regulates the spread of the thermally conductive material 16 in the direction opposite to the front plate 12, and the thermally conductive material 16 is a metal having a melting point of less than 100°C or an alloy thereof, and is charged between the frame 11 and the block 13 in a fluid state.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a phased array antenna.

Background Art

[0002] A general phased array antenna is configured to include electronic components such as element antennas, power supply circuits, and transmission modules, and an antenna housing such as a front plate and a frame. Conventionally, in order to stably operate electronic components such as element antennas, power supply circuits, and transmission modules included in a phased array antenna at a temperature below a specified temperature, there is a technique of thermally transporting heat generated by the electronic components to a refrigerant for cooling.

[0003] Patent Document 1 describes that heat generated in block 2 is thermally transported to a refrigerant by bringing block 2 on which a plurality of transmission modules 21 are mounted into contact with a front plate 1 having a refrigerant flow path inside. However, there are fine irregularities on the surface of block 2 and / or the surface of front plate 1. The thermal conductivity of the air present in the gaps of these irregularities is smaller than the thermal conductivity of block 2 and front plate 1. Therefore, the air present in the gaps of the irregularities becomes a resistance to the thermal transport from block 2 to the refrigerant. Such a resistance to thermal transport at the contact surface is called contact thermal resistance.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] As in Patent Document 1, just by bringing the block 10 into contact with the front plate 1 having a refrigerant flow path inside, there is a problem that the efficiency of heat transfer from the heat generated in the block 10 to the refrigerant decreases due to the contact thermal resistance between the front plate 1 and the block 10.

[0006] The phased array antenna according to this disclosure includes a front plate, a frame that partitions one surface of the front plate and has a flow path for a heat medium inside, a block that is disposed in the space partitioned by the frame and on which a transmission module is mounted, and a conductive heat conductive material that is disposed between the frame and the block, a temperature control unit that adjusts the temperature of the heat medium; and a circulation unit that circulates the heat medium whose temperature has been adjusted by the temperature control unit into the flow path and a lid portion that regulates the spread of the heat conductive material in a direction facing the front plate. containing Ga, In, Sn, or Bi It is characterized by the above. The temperature control unit heats the heat medium so as to be equal to or higher than the melting point of the heat conductive material

Means for Solving the Problems

[0007] The phased array antenna according to this disclosure includes a front plate, a frame that partitions one surface of the front plate and has a flow path for a heat medium inside, a block that is disposed in the space partitioned by the frame and on which a transmission module is mounted, a conductive heat conductive material that is disposed between the frame and the block, and a lid portion that regulates the spread of the heat conductive material in a direction facing the front plate. The heat conductive material is a metal having a melting point of less than 100°C or an alloy thereof, and is characterized by being filled between the frame and the block in a state having fluidity.

Effects of the Invention

[0008] According to the present invention, there is an effect that it is possible to provide a phased array antenna that suppresses a decrease in the efficiency of heat transfer from the heat generated in the block to the heat medium due to the contact thermal resistance of the air layer existing between the frame and the block.​

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Figure 17

Figure 18

Embodiment for Carrying Out the Invention

[0010] Hereinafter, the phased array antenna according to the present disclosure will be described in detail with reference to the drawings.

[0011] · Embodiment 1. FIG. 1 is a diagram showing the configuration of the phased array antenna 1 according to Embodiment 1. In this specification, for ease of understanding, the height direction (upward direction of the paper surface) of the phased array antenna 1 is defined as the +Y axis direction, the width direction (right direction of the paper surface) is defined as the +X axis direction, and the depth direction (direction perpendicular to the +Y axis direction and the +X axis direction) is defined as the +Z axis direction for explanation.

[0012] The phased array antenna 1 includes a frame 11, a front plate 12, a block 13, a seal member 15, a heat conductive material 16, and a lid portion 14. An element power supply layer having a plurality of antenna elements is provided on the surface of the front plate 12 in the +Z axis direction. Also, a lattice-shaped frame 11 is provided on one surface (-Z axis direction surface) of the front plate 12. The block 13 is attached to the phased array antenna 1 by being inserted into the space partitioned by the frame 11 along the direction indicated by the arrow A (+Z axis direction). At least an electronic component including a transmission module is mounted on the block 13. A heat conductive material 16 having conductivity and a seal member 15 that restricts the spread of the heat conductive material 16 are provided between the frame 11 and the block 13. The lid portion 14 has a seal member 142 and a lid 141. The seal member 142 of the lid portion 14 restricts the spread of the heat conductive material 16 in the direction facing the front plate 12. The lid 141 of the lid portion 14 is fixed to the frame 11 by, for example, tightening with a screw 143 into a screw hole 147.

[0013] FIG. 2 is a diagram showing the configuration of the frame 11. Frame 11 partitions one surface of the front plate 12 and has a flow path 113 (distribution flow path 113a, temperature control flow path 113b, and collection flow path 113c) for the heat medium inside. In FIG. 2, the distribution flow path 113a indicated by the long dashed line distributes the heat medium 114 flowing in from the inlet portion 115 to the temperature control flow path 113b. In FIG. 2, the temperature control flow path 113b indicated by the dash-dotted line exchanges heat between the heat medium 114 distributed from the distribution flow path 113a and the block 13. The temperature control flow path 113b cools the block 13, for example, by transferring heat from the block 13 to the heat medium 114. Also, the temperature control flow path 113b may heat the heat conduction material 16 between the block 13 and the frame 11, for example, by transferring heat from the heat medium 114 to the block 13. In FIG. 2, the collection flow path 113c indicated by the double-dashed line collects the heat medium 114 that has passed through the temperature control flow path 113b. Also, the collection flow path 113c leads to the outlet portion 116. A circulation portion 117 and a temperature control portion 118 are provided between the inlet portion 115 and the outlet portion 116. The temperature control portion 118 adjusts the temperature of the heat medium 114. Specifically, the temperature control portion 118 cools and / or heats the heat medium 114. Also, the temperature control portion 118 heats the heat medium 114 to be equal to or higher than the melting point of the heat conduction material 16. The circulation portion 117 circulates the heat medium 114 with adjusted temperature within the flow path 113. Specifically, as indicated by the arrow in the figure, the circulation portion 117 circulates the heat medium 114 to the inlet portion 115, the distribution flow path 113a, the temperature control flow path 113b, the collection flow path 113c, the outlet portion 116, and the temperature control portion 118.

[0014] FIG. 3 is a diagram showing the heat transport path of the heat generated inside the block 13. Block 13 includes a housing 131, a transmission module 132, and a heat spreader 133. The transmission module 132 is mounted on the +Y-axis direction surface of the heat spreader 133. The transmission module 132 only needs to have at least a transmission function, and may also have a transmission and reception function. The heat spreader 133 has a plate-like shape with a thickness in the Y-axis direction thinner than the thickness in the Y-axis direction and the thickness in the Z-axis direction. Also, the heat spreader 133 is formed of a material with high thermal conductivity. The material of the heat spreader 133 only needs to have a conductivity higher than that of air at least. The -Y-axis direction surface of the heat spreader 133 constitutes the -Y-axis direction surface of the housing 131. Also, the -Y-axis direction surface of the heat spreader 133 is in contact with the heat conductive material 16 and / or the frame 11. With such a configuration, the heat generated by the transmission module 132 is thermally transported, that is, exhausted heat, to the heat medium inside the frame 11 via the heat spreader 133, the heat conductive material 16, and the frame 11.

[0015] Block 13 may include not only one transmission module 132 but also a plurality of transmission modules 132. Also, block 13 may include not only the transmission module 132 but also electronic components such as a power supply circuit.

[0016] By the way, generally, there are fine irregularities on the surface of block 13 (the -Y-axis direction surface of the heat spreader 133) and / or the surface of the frame 11. The thermal conductivity of the air existing in the gaps of these fine irregularities is smaller than the thermal conductivity of block 13 and the frame 11. Therefore, the air existing in the gaps of the fine irregularities becomes a resistance when thermally transporting heat from block 13 to the heat medium. Such a resistance to heat transport at the contact surface is called contact thermal resistance.

[0017] In the present disclosure, in order to reduce the contact thermal resistance, a heat conductive material 16 in a fluid state is filled between the frame 11 and the block 13. The heat conductive material 16 in a fluid state penetrates into the fine uneven gaps between the frame 11 and the block 13, and reduces the amount of air present in the fine uneven gaps. The heat conductive material 16 is a material having a higher thermal conductivity than air and being conductive. The heat conductive material 16 is, for example, a metal material (hereinafter referred to as a low melting point metal) such as gallium (melting point 29.76 degrees, thermal conductivity 40 W / mK). Further, the heat conductive material 16 may be, for example, an alloy (an alloy having a melting point of less than 100 °C; hereinafter referred to as a low melting point alloy) in which two or more of gallium, indium, tin, or bismuth are combined. That is, the heat conductive material 16 may be a low melting point metal having a melting point of less than 100 °C or a low melting point alloy thereof. With such a configuration, the contact thermal resistance between the block 13 and the frame 11 can be reduced.

[0018] The heat conduction material 16 only needs to be in a state with fluidity when the block 13 is detached or attached, and may be in a state without fluidity, that is, in a solid state, except when it is detached or attached. Further, the heat conduction material 16 may be heated until it reaches a temperature (melting point) at which it melts and has fluidity when the block 13 is detached or attached. For example, the temperature adjustment unit 118 may heat the heat medium 114 until it reaches a temperature equal to or higher than the melting point of the heat conduction material 16. Then, the circulation unit 117 may circulate the heated heat medium 114 to the inlet unit 115, the distribution flow path 113a, the temperature adjustment flow path 113b, the collection flow path 113c, and the outlet unit 116. Thereby, the heat conduction material 16 can maintain a state with fluidity when the block 13 is detached or attached. As a result, the heat conduction material 16 easily penetrates into the fine uneven gaps between the frame 11 and the block 13, reducing the amount of air present in the fine uneven gaps, that is, reducing the contact thermal resistance between the block 13 and the frame 11. Also, since the heat conduction material 16 does not fix the frame 11 and the block 13, it is possible to suppress a decrease in workability when the block 13 is detached or attached. Here, the melting point of the heat conduction material 16 only needs to be within the range of the guaranteed temperature when the phased array antenna 1 is not operating. The range of the guaranteed temperature is a temperature range that does not adversely affect the electronic components etc. mounted on the block 13. The range of the guaranteed temperature is desirably less than 100°C and may be appropriately determined at the design stage. Here, since the heat conduction material 16 is a low melting point metal or its low melting point alloy with a melting point less than 100°C, even if it is filled between the frame 11 and the block 13 in a state heated to the melting point, it will not adversely affect the electronic components etc. mounted on the block 13.

[0019] FIG. 4 is a cross-sectional view of the frame 11 in the Y1 direction shown in FIG. 2. FIG. 5 is a cross-sectional view of the frame 11 in the Z1 direction shown in FIG. 4. FIG. 6 is a cross-sectional view of the frame 11 in the X1 direction shown in FIG. 4. The phased array antenna 1 includes seal members 15L, 15D, 15R (hereinafter referred to as seal member 15 when it is not necessary to distinguish them separately) that regulate the spread of the heat conductive material 16 having fluidity. The seal member 15 is interposed between the horizontal frame 111 and the block 13, and is arranged to surround the heat conductive material 16 filled between the horizontal frame 111 and the block 13. The seal members 15L and 15R are arranged in the intersecting region of the horizontal frame 111 and the vertical frame 112. Further, the seal member 15D is arranged in the intersecting region of the horizontal frame 111 and the front plate 12. With such a configuration, the seal member 15 can regulate the heat conductive material 16 filled in a certain section from spreading outside the certain section. That is, according to the configuration of the present disclosure, it is possible to suppress a decrease in the cooling performance of the block 13 and a decrease in workability due to the outflow of the heat conductive material 16 as compared with the case where the seal member 15 is not provided.

[0020] FIG. 7 is a cross-sectional view of the frame 11 shown in FIG. 4 in the X1 direction after the block 13 is attached. The lid 141 of the lid portion 14 has a plate-like shape with a thickness in the Z-axis direction thinner than the thicknesses in the X-axis direction and the Y-axis direction. Further, the lid 141 of the lid portion 14 brings the seal member 142 into close contact with the frame 11, the block 13, and the heat conductive material 16. The seal member 142 of the lid portion 14 regulates the spread of the heat conductive material 16 filled between the block 13 and the frame 11 (horizontal frame 111) in the direction facing the front plate 12. According to the configuration of the present disclosure, it is possible to regulate the heat conductive material 16 filled in a certain section from spreading outside the certain section. That is, according to the configuration of the present disclosure, it is possible to suppress a decrease in the cooling performance of the block 13 and a decrease in workability due to the outflow of the heat conductive material 16 as compared with the case where the lid portion 14 is not provided.

[0021] FIG. 8 is a view showing the Z direction of the frame 11 after the block 13 is attached. The lid 141 of the lid portion 14 is detachably provided to the frame 11 using a member such as a screw 143. According to the configuration of the present disclosure, as compared with the case where the lid 141 is not detachably provided, there is an effect that it becomes easier to fill or remove the heat conductive material 16 between the block 13 and the frame 11.

[0022] By the way, when using the lid portion 14 shown in FIG. 8, when filling or removing the heat conductive material 16, it is necessary to remove the lid portion 14 from the frame 11, and the operator may feel bothered. Therefore, the lid 141 may have an opening 144 for filling or removing the heat conductive material 16 between the block 13 and the frame 11.

[0023] FIG. 9 is a diagram showing the lid portion 14 having the opening 144. The opening 144 communicates the outside of the phased array antenna 1 with the gap between the block 13 and the frame 11. Further, a regulating member 145 for regulating the outflow of the heat conductive material 16 to the outside of the phased array antenna 1 may be provided in the opening 144. The regulating member 145 may be a member that regulates the flow of the heat conductive material 16 in one direction, such as a check valve, or a member that regulates the flow of the heat conductive material 16 itself, such as a cap. Further, the regulating member 145 may have a mechanism that closes when receiving pressure from the inside (block 13 side) and opens when receiving pressure from the outside. According to the configuration of the present disclosure, as compared with the case where the lid portion 14 does not have the opening 144 and the regulating member 145, it becomes easier to fill or remove the heat conductive material 16, so that a decrease in workability can be suppressed.

[0024] By the way, when using the lid portion 14 shown in FIG. 8, when attaching and detaching the lid portion 14, it is necessary to tighten or loosen the screw 143, and the operator may feel bothered. Therefore, the lid portion 14 may have a hinge 146 that supports the lid 141 and enables it to open and close with respect to the frame 11.

[0025] FIG. 10 is a diagram showing the lid portion 14 having the hinge 146. The hinge 146 connects the -Y-axis end of the lid portion 14 and the -Z-axis end of the frame 11. Further, the hinge 146 is provided on the frame 11 (horizontal frame 111) so as to be rotatable about the -Z-axis direction of the lid portion 14, for example. Note that the location where the hinge 146 is fixed may be any location on the lid portion 14 or the frame 11, as long as it can at least rotatably support the lid portion 14 with respect to the frame 11. According to the configuration of the present disclosure, compared with the case where the lid portion 14 does not have the hinge 146, it is not necessary to attach and detach the lid portion 14, so that a decrease in workability can be suppressed.

[0026] Next, the process of attaching the block 13 to the frame 11 will be described. Here, the front plate 12, the frame 11, and the block 13 are described as being assembled by well-known techniques, and the description thereof is omitted.

[0027] FIG. 11 is a flowchart of the process of attaching the block 13 to the frame 11. A seal member 15 is provided in the intersecting region of the horizontal frame 111 and the vertical frame 112 and in the intersecting region of the horizontal frame 111 and the front plate 12 (the intersecting region of the frame 11) (step ST11).

[0028] The block 13 is inserted into the space defined by the frame 11 (step ST12). The block 13 is disposed in the +Y-axis direction (upward) of the seal member 15 provided in step ST11. Further, the block 13 may be fixed so as to be pressed against the frame 11 located in the -Y-axis direction by inserting a wedge mechanism or the like between the block 13 and the frame 11 located in the +Y-axis direction.

[0029] Between the block 13 disposed in step ST12 and the frame 11, and in the region surrounded by the seal member 15 disposed in step ST11, a heat conductive material 16 in a fluid state is injected (step ST13). The heat conductive material 16 is injected, for example, into the gap between the block 13 and the frame 11 using a syringe or the like. Here, the heat conductive material 16 may be heated until it reaches a temperature (melting point) at which it melts and has fluidity. Further, the temperature adjustment unit 118 may heat the heat medium 114 until it reaches a temperature equal to or higher than the melting point of the heat conductive material 16. Then, the circulation unit 117 may circulate the heated heat medium 114 through the inlet portion 115, the distribution flow path 113a, the temperature adjustment flow path 113b, the collection flow path 113c, and the outlet portion 116.

[0030] A lid portion 14 is disposed at a position in contact with the block 13 disposed in step ST12 and the frame 11 (step ST14). Here, the order of steps ST13 and ST14 may be interchanged. In this case, a lid portion 14 having an opening 144 is employed, and the heat conductive material 16 may be injected through the opening 144.

[0031] Next, an example of the steps when removing the block 13 from the frame 11 will be described. FIG. 12 is a flowchart of the steps for removing the block 13 from the frame 11.

[0032] The heat conductive material 16 between the block 13 and the frame 11 is heated until it reaches a temperature (melting point) at which it melts and has fluidity (step ST21). Here, the circulation unit 117 may circulate the heat medium 114 heated by the temperature adjustment unit 118 until it reaches a temperature equal to or higher than the melting point of the heat conductive material 16 through the inlet portion 115, the distribution flow path 113a, the temperature adjustment flow path 113b, the collection flow path 113c, and the outlet portion 116. Note that when removing the block 13 from the frame 11, if the heat conductive material 16 has fluidity, step ST21 may be omitted.

[0033] Remove the heat conductive material 16 that has melted between the block 13 and the frame 11 (step ST22). The removal of the heat conductive material 16 may be performed, for example, by removing the lid portion 14 from the frame 11, or by sucking it out with a syringe or the like through the opening 144 of the lid portion 14.

[0034] Pull out the block 13 from the space partitioned by the frame 11 in the direction opposite to the arrow A in FIG. 1 (step ST23).

[0035] According to the configuration of the present disclosure, the heat conductive material 16 in a fluid state easily enters the fine uneven gaps between the frame 11 and the block 13. Therefore, compared with the case where the heat conductive material 16 does not have fluidity, it is possible to reduce the amount of air present in the fine uneven gaps, that is, to reduce the contact thermal resistance between the block 13 and the frame 11. Further, since the heat conductive material 16 in a fluid state does not fix the frame 11 and the block 13, it is possible to suppress a decrease in workability when attaching and detaching the block 13 compared with the case where the heat conductive material 16 does not have fluidity.

[0036] ·Embodiment 2. In the first embodiment, the temperature control flow path 113b is provided only in the horizontal frame 111, but it may also be provided in the vertical frame 112. FIG. 13 is a diagram showing the configuration of the frame 11a. Frame 11a partitions one surface of the front plate 12 and has flow paths 113 (temperature control flow paths 113b1, 113b2, 113b3) of the heat medium 114 inside. In Fig. 13, the temperature control flow path 113b1 indicated by the long dashed line distributes the heat medium 114 flowing in from the inlet portion 115 to the temperature control flow path 113b2. Also, the temperature control flow path 113b1 exchanges heat between the heat medium 114 and the block 13. In Fig. 13, the temperature control flow path 113b2 indicated by the dash-dotted line exchanges heat between the heat medium 114 distributed from the temperature control flow path 113b1 and the block 13. In Fig. 13, the temperature control flow path 113b3 indicated by the double dash-dotted line exchanges heat between the heat medium 114 and the block 13. Also, the temperature control flow path 113b3 collects the heat medium 114 that has passed through the temperature control flow path 113b2. Further, the temperature control flow path 113b3 communicates with the outlet portion 116. A circulation portion 117 and a temperature control portion 118 are provided between the inlet portion 115 and the outlet portion 116.

[0037] Fig. 14 is a cross-sectional view of the frame 11a shown in Fig. 13 in the Y1 direction. Fig. 15 is a cross-sectional view of the frame 11a shown in Fig. 14 in the X1 direction. Fig. 16 is a cross-sectional view of the frame 11a shown in Fig. 14 in the Z1 direction. The phased array antenna 1 includes seal members 15L, 15D, 15R (hereinafter, unless otherwise distinguished, collectively referred to as the seal member 15) that regulate the spread of the heat conductive material 16 having fluidity. The seal members 15L, 15R have an L-shaped cross section in the short side direction. The seal members 15L, 15R are arranged in a region where the horizontal frame 111a and the vertical frame 112a intersect at the connection portion between one side and the other side of the L shape. Then, the seal member 15L1 constituting one side of the seal member 15L is arranged on the horizontal frame 111a, and the seal member 15L2 constituting the other side of the seal member 15L is arranged on the vertical frame 112a. Similarly, the seal member 15R1 constituting one side of the seal member 15R is arranged on the horizontal frame 111a, and the seal member 15R2 constituting the other side of the seal member 15L is arranged on the vertical frame 112a. Further, the seal member 15 includes seal members 15DM, 15DL, 15DR. The seal member 15DM is arranged in a region where the horizontal frame 111a and the front plate 12 intersect. The seal members 15DL, 15DR are arranged in a region where the vertical frame 112a and the front plate 12 intersect. The seal member 15 is interposed between the frame 11a and the block 13 and is arranged so as to surround the heat conductive material 16 filled between the frame 11a and the block 13. With such a configuration, the seal member 15 can regulate the heat conductive material 16 filled in a certain section from spreading outside the certain section. That is, according to the configuration of the present embodiment, it is possible to suppress a decrease in the cooling performance of the block 13 and a decrease in workability due to the outflow of the heat conductive material 16 as compared with the case where the seal member 15 is not provided.

[0038] FIG. 17 is a cross-sectional view of the frame 11a shown in FIG. 14 in the Z1 direction after the block 13 is attached. In the present embodiment, in order to reduce the contact thermal resistance, the heat conductive material 16 in a fluid state is filled not only between the horizontal frame 111a and the block 13 but also between the vertical frame 112a and the block 13. As a result, the heat generated in the block 13 is thermally transported not only to the heat medium inside the horizontal frame 111a but also to the heat medium inside the vertical frame 112a. By providing this configuration, compared with the configuration of the first embodiment, it becomes possible to thermally transport heat to a larger number of heat media, so that it becomes possible to suppress a decrease in the efficiency of thermally transporting the heat generated in the block to the heat medium.

[0039] ·Embodiment 3. In the first and second embodiments, one block 13 is attached to the phased array antenna 1 by being inserted into one space partitioned by the frame 11. However, a plurality of blocks 13 may be attached to the phased array antenna 1 by being inserted into one space partitioned by the frame 11.

[0040] FIG. 18 is a diagram showing the Z direction of the frame 11 with two blocks 13 attached to one space partitioned by the frame 11. The block 13 is arranged such that the heat spreader 133 faces the temperature control flow path 113b indicated by the dashed line. Therefore, the heat spreader 133 is arranged on the surface of the block 13a in the +Y axis direction, and the heat spreader 133 is arranged on the surface of the block 13b in the -Y axis direction.

[0041] In the present embodiment, compared with the configuration of the first embodiment, it becomes possible to thermally transport the heat generated in the block 13 by a larger number of heat media, so that it becomes possible to suppress a decrease in the efficiency of thermally transporting the heat generated in the block to the heat medium.

[0042] ·Other application examples In Embodiments 1 and 2, a seal member 15 is disposed between the block 13 and the frame 11. As a result, the distance for heat transfer of the heat generated in the block 13 increases by the thickness of the seal member 15, and the efficiency of heat transfer decreases by the increased amount. Therefore, in order to suppress the decrease in heat transfer efficiency, a recess may be provided on the surface of the block 13 that contacts the seal member 15, the height of which is less than the thickness of the seal member 15 and the width of which is the same as the width of the seal member 15. With such a configuration, the distance for heat transfer of the heat generated in the block 13 becomes shorter by the height of the recess, so that it is possible to suppress the decrease in the efficiency of heat transfer by that amount.

[0043] In Embodiments 1 and 2, when inserting the block 13 into the space partitioned by the frame 11, it is necessary to remove or rotate the lid portion 14 from the frame 11, which may cause annoyance to the operator. Therefore, the height H1 in the Y-axis direction of the space partitioned by the frame 11 may be configured to be higher than the sum of the height H2 in the Y-axis direction of the block 13 and the height H3 in the Y-axis direction of the lid portion 14 (H1 > H2 + H3). With such a configuration, it becomes possible to insert the block 13 from between the frame 11 and the lid portion 14 arranged in the +Y-axis direction of the space, so that it is possible for the operator to reduce annoyance. Further, by making the frame 11 and the lid portion 14 arranged in the -Y-axis direction of the space into an integral structure, it becomes possible to simplify the structure of the phased array antenna 1.

[0044] In the above, the case of using a phased array antenna has been described, but the present invention is not limited thereto, and it may be applied to an electronic device to which a heat medium is supplied for cooling the mounted electronic components. Further, the heat medium may be a liquid or a gas.

[0045] The configurations shown in the above embodiments are examples of the content of the present invention, and it is possible to combine them with other known technologies, and it is also possible to omit or change a part of the configuration without departing from the gist of the present invention.

Explanation of Reference Numerals

[0046] 1 Phased Array Antenna, 11 Frame, 111 Horizontal Frame, 112 Vertical Frame, 114 Heat Medium, 113 Flow Path, 12 Front Plate, 13 Block, 131 Housing, 132 Transmission Module, 133 Heat Spreader, 14 Cover Part, 141 Cover, 144 Opening, 142 Seal Member, 143 Screw, 144 Opening, 145 Regulation Member, 147 Screw Hole, 15 Seal Member, 16 Heat Conductive Material.

Claims

1. A front plate, a frame that partitions one surface of the front plate and has a flow path for a heat medium inside, a temperature adjustment unit that adjusts the temperature of the heat medium, a circulation unit that circulates the heat medium whose temperature has been adjusted by the temperature adjustment unit in the flow path, a block disposed in the space partitioned by the frame and on which a transmission module is mounted, a conductive heat conductive material containing Ga, In, Sn, or Bi, disposed between the frame and the block, and a lid portion that restricts the spread of the heat conductive material in a direction facing the front plate, wherein the temperature adjustment unit heats the heat medium so as to be equal to or higher than the melting point of the heat conductive material characterizing the phased array antenna.

2. The lid portion is detachably provided with respect to the frame characterizing the phased array antenna according to Claim 1.

3. The lid portion has an opening for filling the heat conductive material between the block and the frame characterizing the phased array antenna according to Claim 1 or 2.

4. In the opening, a restricting member is provided to restrict the outflow of the heat conductive material filled between the block and the frame characterizing the phased array antenna according to Claim 3.

Images