Copper removal device for conductive belt

Abstract

The present invention provides a copper removal device for a conductive belt, comprising a plating copper removal tank and a conductive belt transport mechanism, the plating copper removal tank for containing a plating copper removal solution and having a first elongated hole and a second elongated hole through which the conductive belt passes laterally, the conductive belt transport mechanism for transporting the conductive belt, the conductive belt passes laterally through the plating copper removal tank via the first elongated hole and the second elongated hole, and is immersed in the plating copper removal solution and charged with anode electricity, and a cathode plate connected to a negative pole of a power source and located above and / or below the conductive belt is provided in the plating copper removal tank. In the present invention, when the conductive belt enters the plating copper removal tank, the copper layer on the surface of the conductive belt is ionized by the action of the cathode plate immersed in the plating copper removal solution, generating copper ions that can freely move in the plating copper removal solution, and the copper layer on the surface of the conductive belt is removed.

Description

Technical Field

[0001] The present invention relates to the technical field of electroplating, and specifically to a copper removal device for a conductive belt.

Background Art

[0002] With the development of technology, in industrial production, electroplating is usually performed on a flexible film substrate using electroplating equipment. In electroplating with water, usually, the function of electroplating the substrate is realized by conducting electricity to the substrate using a conductive roller. Due to inherent deficiencies in the design of the conductive roller, a copper plating layer is likely to be formed on the surface of the conductive roller during production, and the copper plating layer may break through or scratch the film, resulting in a significant reduction in the yield rate of conductive film products and having a serious impact on the overall production efficiency of the enterprise. Currently, in the industry, a conductive belt is used to achieve the conduction of the cathode, omitting the structural design of the conductive roller, and avoiding the occurrence of copper deposits during the copper plating of the conductive roller, which may cause breakthrough or scratching of the plating film. For example, in the invention with the application number CN113249770A and the name of an electroplating equipment used for electroplating processing on the surface of a flexible film substrate, a conductive belt is used instead of a conductive roller to provide electricity for the cathode. However, when this method is adopted, if the conductive belt is immersed in the plating solution for a long time, a copper layer will be plated, and the copper layer will compress the film, resulting in a poor plating effect on the flexible film substrate.

Summary of the Invention

Problems to be Solved by the Invention

[0003] In view of the above, an embodiment of the present invention aims to provide a copper removal device for a conductive belt to solve the technical problem of the prior art that when the conductive belt is immersed in the plating solution for a long time, a copper layer is plated, and the copper layer compresses the film.

Means for Solving the Problems

[0004] To achieve the above object, an embodiment of the present invention includes a copper plating removal tank and a conductive belt conveying mechanism. The copper plating removal tank is for containing a copper plating removal solution. In the copper plating removal tank, a first elongated hole and a second elongated hole through which the conductive belt passes in the lateral direction are provided. The conductive belt conveying mechanism is for conveying the conductive belt. The conductive belt passes through the copper plating removal tank in the lateral direction through the first elongated hole and the second elongated hole, is immersed in the copper plating removal solution, and is charged with the electricity of the anode. Provided is a copper removal device for a conductive belt, in which a cathode plate connected to the negative electrode of a power source and located above and / or below the conductive belt is provided in the copper plating removal tank.

[0005] In some possible embodiments, it further includes an anode conductive roller provided outside the copper plating removal tank and connected to the positive electrode of a power source. The anode conductive roller contacts the conductive belt and conducts the electricity of the anode to the conductive belt.

[0006] In some possible embodiments, the conductive belt conveying mechanism includes a first internal limit roller and a second internal limit roller respectively located at the first end and the second end in the copper plating removal tank, pressing down the conductive belt, and immersing the conductive belt in the copper plating removal solution.

[0007] In some possible embodiments, the conductive belt conveying mechanism further includes a plurality of first external limit rollers and a plurality of second external limit rollers respectively located at the front end and the rear end of the copper plating removal tank. The plurality of first external limit rollers are for carrying the conductive belt into the copper plating removal tank, and the plurality of second external limit rollers are for carrying the conductive belt out of the copper plating removal tank.

[0008] In some possible embodiments, a first liquid retaining plate and a second liquid retaining plate are provided at positions corresponding to the first elongated hole and the second elongated hole on the side wall of the copper plating removal tank.

[0009] In some possible embodiments, a first water washing tank is provided at the front end of the copper plating removal tank. A third elongated hole through which the conductive belt passes is provided on the side wall of the first water washing tank. Inside the first water washing tank, first upper and lower side water washing spray pipes for washing dirt and dust on both sides of the conductive belt are provided.

[0010] In some possible embodiments, a first transfer tank is provided between the copper plating removal tank and the first water washing tank. A fourth elongated hole through which the conductive belt passes is provided on the side wall of the first transfer tank.

[0011] In some possible embodiments, a second water washing tank is provided at the rear end of the copper plating removal tank. A fifth elongated hole through which the conductive belt passes is provided on the side wall of the second water washing tank. Inside the second water washing tank, second upper and lower side water washing spray pipes for washing the copper plating removal solution on both sides of the conductive belt are provided.

[0012] In some possible embodiments, a second transfer tank is provided between the rear end of the copper plating removal tank and the second water washing tank. A sixth elongated hole through which the conductive belt passes is provided on the side wall of the second transfer tank.

[0013] In some possible embodiments, an acid washing spray tank is provided at the rear end of the second water washing tank. The acid washing spray tank is provided with a seventh elongated hole through which the conductive belt passes. Inside the acid washing spray tank, upper and lower side acid washing spray pipes for ejecting an acidic solution that reacts with the copper plating removal solution on both sides of the conductive belt are provided.

Advantages of the Invention

[0014] The above technical solution has the following beneficial technical effects. Embodiments of the present invention include a copper plating removal tank and a conductive belt conveying mechanism. The copper plating removal tank is for containing a copper plating removal solution. The copper plating removal tank is provided with a first elongated hole and a second elongated hole through which the conductive belt passes horizontally. The conductive belt conveying mechanism is for conveying the conductive belt. The conductive belt passes horizontally through the copper plating removal tank through the first elongated hole and the second elongated hole, is immersed in the copper plating removal solution, and is charged with the electricity of the anode. In the copper plating removal tank, a cathode plate connected to the negative electrode of the power supply and located above and / or below the conductive belt is provided, providing a copper removal device for the conductive belt. In the embodiments of the present invention, when the conductive belt enters the copper plating removal tank, due to the action of the cathode plate immersed in the copper plating removal solution, the copper layer on the surface of the conductive belt is ionized, copper ions that can freely move in the copper plating removal solution are generated, and the copper layer on the surface of the conductive belt is removed.

[0015] To more clearly explain the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments will be briefly described below. However, the drawings described below are only a part of the embodiments of the present invention, and it is obvious that those skilled in the art can obtain other drawings from these drawings without creative effort.

Brief Description of the Drawings

[0016]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Embodiments for Carrying Out the Invention

[0017] Hereinafter, the features and exemplary embodiments of various aspects of the present invention will be described in detail. In the following detailed description, many specific details are provided in order to fully understand the present invention. However, it will be apparent to those skilled in the art that the present invention can be practiced without some of these specific details. The following description of the embodiments is only intended to provide a better understanding of the present invention by showing an example of the present invention. In the drawings and the following description, at least a part of the known structures and techniques is not shown in order to avoid unnecessary obscurity of the present invention. Further, for clarity, the size of a part of the structure may be enlarged. Furthermore, the features, structures, or characteristics described below can be incorporated into one or more embodiments in any suitable manner.

[0018] FIG. 1 is a schematic structural diagram of the entire copper removal device for a conductive belt according to an embodiment of the present invention. As shown in FIG. 1, the copper removal device for a conductive belt according to an embodiment of the present invention includes a copper plating removal tank 1 and a conductive belt conveying mechanism. The copper plating removal tank 1 is for accommodating a copper plating removal solution. In the copper plating removal tank 1, a first elongated hole 12 and a second elongated hole 13 through which the conductive belt 3 passes horizontally are provided. That is, the first elongated hole 12 and the second elongated hole 13 are provided in the horizontal wall of the copper plating removal tank 1. The conductive belt conveying mechanism is for conveying the conductive belt 3. The conductive belt 3 passes horizontally through the first elongated hole 12 of the copper plating removal tank 1, enters the copper plating removal solution, and then exits the copper plating removal tank 1 through the second elongated hole 13. The anode conductive roller 21 is provided outside the copper plating removal tank 1, is connected to the positive electrode of the power supply, contacts the conductive belt 3, and conducts the anode electricity to the conductive belt 3. Inside the copper plating removal tank 1, cathode plates 11 connected to the negative electrode of the power supply and located above and / or below the conductive belt 3 and respectively attached to the side walls of the copper plating removal tank 1 are provided. Also, the copper removal device for a conductive belt according to an embodiment of the present invention further includes a frame. The copper plating removal tank 1 is provided inside the frame, and the conductive belt conveying mechanism is attached to the frame. For example, the anode conductive roller 21 is rotatably attached to the frame. In the copper plating removal tank 1, due to the action of the copper plating removal solution and the anode conductive roller 21, the copper layer on the surface of the conductive belt 3 is ionized, and copper ions that can freely move in the copper plating removal solution are generated. Thereby, the copper layer on the surface of the conductive belt 3 is removed and enters the copper plating removal solution. At this time, there are copper ions in the copper plating removal solution, and an electric current sequentially flows through the conductive belt 3, the copper plating removal solution, and the cathode plate 11. The copper plating removal solution functions as an electrolyte, and the copper ions in the electrolyte move to the cathode plate 11 and react with electrons near the cathode plate 11 to generate copper.

[0019] In an embodiment of the present invention, when the conductive belt 3 enters the copper plating removal tank 1, due to the action of the cathode plate 11 immersed in the copper plating removal solution, the copper layer on the surface of the conductive belt 3 is ionized, and copper ions that can freely move in the copper plating removal solution are generated. As a result, the copper on the surface of the conductive belt 3 is ionized and enters the copper plating removal solution, and the copper layer on one of the surfaces of the conductive belt 3 is removed.

[0020] Figure 2 is a schematic structural diagram of the entire copper removal device for another conductive belt according to an embodiment of the present invention. As shown in Figure 2, in an embodiment of the present invention, it is also possible to remove the copper layers on both sides of the conductive belt 3 simultaneously. In this case, two anode conductive rollers 21 that are rotatably attached to the frame vertically and contact the first surface and the second surface of the conductive belt 3 respectively are provided. Two cathode plates 11 are also provided, which are respectively provided above and below the conductive belt 3. The copper layer on the first surface of the conductive belt 3 is removed by the upper anode conductive roller 21 and the cathode plate 11 of the conductive belt 3, and the copper layer on the second surface of the conductive belt 3 is removed by the lower anode conductive roller 21 and the cathode plate 11 of the conductive belt 3. In an embodiment of the present invention, the number of the anode conductive rollers 21 and the cathode plates 11 may be flexibly arranged according to the surface that needs to remove the copper removal layer from the conductive belt 3, so the production cost is reduced.

[0021] FIG. 3 is a schematic diagram of an example of the conductive belt conveying mechanism according to an embodiment of the present invention. As shown in FIG. 3, in some embodiments, the conductive belt conveying mechanism may further include a first internal limit roller 22 and a second internal limit roller 23, which are respectively located at the first end and the second end in the copper plating removal tank 1 and are rotatably attached to the side wall of the copper plating removal tank 1. A part or all of the first internal limit roller 22 and the second internal limit roller 23 are immersed in the copper plating removal solution, pressing the conductive belt 3 downward to immerse the conductive belt 3 in the copper plating removal solution. For example, in order to prevent the copper plating removal solution in the copper plating removal tank 1 from leaking from the first elongated hole 12 and the second elongated hole 13, the first elongated hole 12 and the second elongated hole 13 may be provided above the copper plating removal solution. In this case, when the conductive belt 3 passes through the copper plating removal tank 1 in the lateral direction, since the conductive belt 3 does not exist in the plating solution, the first internal limit roller 22 and the second internal limit roller 23 are provided at the first end and the second end in the copper plating removal tank 1, and the conductive belt 3 is pressed downward by the first internal limit roller 22 and the second internal limit roller 23, so that it is immersed in the copper plating removal solution.

[0022] FIG. 4 is a schematic diagram of another conductive belt conveying mechanism according to an embodiment of the present invention. As shown in FIG. 4, in some embodiments, the conductive belt conveying mechanism may further include a plurality of first external limit rollers 24 and a plurality of second external limit rollers 25. The plurality of first external limit rollers 24 are respectively located at the front end of the copper plating removal tank 1, and the conveying path of the conductive belt 3 is guided by the plurality of first external limit rollers 24, whereby the conductive belt 3 enters the copper plating removal tank 1 through the first elongated hole 12. The plurality of second external limit rollers 25 are located at the rear end of the copper plating removal tank 1, and the conductive belt 3 is carried out from the second elongated hole 13 of the copper plating removal tank 1 by the plurality of second external limit rollers 25.

[0023] FIG. 5 is a schematic diagram when a liquid retaining plate is provided in the copper plating removal tank of the embodiment of the present invention. As shown in FIG. 5, first liquid retaining plates 14 and second liquid retaining plates 15 are provided at positions corresponding to the first elongated holes 12 and the second elongated holes 13 on the side walls of the copper plating removal tank 1. Optionally, the first liquid retaining plates 14 and the second liquid retaining plates 15 may be in the form of elongated plates, the lengths of which coincide with the lengths of the first elongated holes 12 and the second elongated holes 13 respectively, and are provided on the wall of the copper plating removal tank 1 by pasting. However, the first liquid retaining plates 14 and the second liquid retaining plates 15 may also be fixed to the wall of the copper plating removal tank 1 by screws or the like. In the embodiment of the present invention, by the first liquid retaining plates 14 and the second liquid retaining plates 15 closing the first elongated holes 12 and the second elongated holes 13 respectively, the outflow of the copper plating removal solution in the copper plating removal tank 1 is avoided.

[0024] FIG. 6 is a schematic structural diagram of the first water washing tank of the embodiment of the present invention. As shown in FIG. 6, a first water washing tank 4 is provided between the front end of the copper plating removal tank 1 and a plurality of first external limit rollers 24, and a third elongated hole 41 through which the conductive belt 3 passes is provided on the side wall of the first water washing tank 4. The conductive belt 3 passes through the third elongated hole 41 in the lateral direction and enters the first water washing tank 4. In the first water washing tank 4, a first upper and lower side water washing spray pipe 42 is provided, and the conductive belt 3 passes between the upper and lower side water washing spray pipes 42. In the embodiment of the present invention, by the first upper and lower side water washing spray pipe 42 spraying the washing liquid to wash the dirt and dust on both sides of the conductive belt 3, the quality of copper removal from the conductive belt 3 is improved.

[0025] Figure 7 is a schematic structural diagram of the first transfer tank according to an embodiment of the present invention. As shown in Figure 7, in some embodiments, a first transfer tank 5 is provided between the copper plating removal tank 1 and the first water washing tank 4, and a fourth elongated hole 51 through which the conductive belt 3 passes is provided on the side wall of the first transfer tank 5. After coming out of the first water washing tank, the conductive belt 3 does not directly enter the copper plating removal tank 1, but enters the first transfer tank 5 through the fourth elongated hole 51, thereby avoiding the washing liquid in the first water washing tank 4 being carried to the copper plating removal tank 1 by the conveyance of the conductive belt 3. In the embodiment of the present invention, by isolating the copper plating removal tank 1 and the first water washing tank 4 with the first transfer tank 5, it is avoided that the copper plating removal solution and the aqueous solution are mixed, which adversely affects the concentration of the copper plating removal solution and reduces the copper removal efficiency.

[0026] Figure 8 is a schematic structural diagram of the second water washing tank according to an embodiment of the present invention. As shown in Figure 8, in some embodiments, a second water washing tank 6 is provided between the rear end of the copper plating removal tank 1 and a plurality of second external limit rollers 25, a fifth elongated hole 61 through which the conductive belt 3 passes is provided on the side wall of the second water washing tank 6, and a second upper and lower side water washing spray pipe 62 is provided in the second water washing tank 6. In the embodiment of the present invention, the second upper and lower side water washing spray pipe 62 sprays the washing liquid to wash the copper plating removal solution on both sides of the conductive belt 3.

[0027] Figure 9 is a schematic structural diagram of the second transfer tank according to an embodiment of the present invention. As shown in Figure 9, in some embodiments, a second transfer tank 7 is provided between the rear end of the copper plating removal tank 1 and the second water washing tank 6, a sixth elongated hole 71 through which the conductive belt 3 passes is provided on the side wall of the second transfer tank 7, and the second transfer tank 7 is provided. Thereby, it is avoided that the copper plating removal solution in the copper plating removal tank 1 enters the second water washing tank 6 and the copper plating removal solution and the washing liquid are mixed, which impairs the washing effect.

[0028] Figure 10 is a schematic structural diagram of the pickling spray tank according to an embodiment of the present invention. As shown in Figure 10, in some embodiments, a pickling spray tank 8 is provided at the rear end of the second water washing tank 6. The pickling spray tank 8 is provided with a seventh elongated hole 81 through which the conductive belt 3 passes, and upper and lower pickling spray pipes 82 are provided in the pickling spray tank 8. In the embodiment of the present invention, the upper and lower pickling spray pipes 82 are for ejecting an acidic solution. The acidic solution reacts with the unreacted copper plating removal solution on both sides of the conductive belt 3, thereby avoiding the copper plating removal solution from being mixed into the plating solution for subsequent electroplating.

[0029] As shown in Figures 7 to 10, in some embodiments, a third liquid stop plate 43 is provided at the location of the third elongated hole 41 on the side wall in the first water washing tank 4. Optionally, the third liquid stop plate 43 may be in the shape of an elongated plate, and its length coincides with the length of the third elongated hole 41 respectively, and it is provided on the wall of the first water washing tank 4 by pasting. However, the third liquid stop plate 43 may also be fixed to the wall of the first water washing tank 4 by screws or the like. In the embodiment of the present invention, by the third liquid stop plate 43 blocking the third elongated hole 41, it is avoided that the washing liquid in the first water washing tank 4 and the copper plating removal solution in the copper plating removal tank 1 are mixed.

[0030] In some embodiments, a fourth liquid retaining plate 63 and a fifth liquid retaining plate 64 are provided at the location of the fifth elongated hole 61 on the side wall inside the second water washing tank 6. Optionally, the fourth liquid retaining plate 63 and the fifth liquid retaining plate 64 may be in the shape of elongated plates, and their lengths respectively coincide with the lengths of the second elongated hole 13 and the third elongated hole 41. The fourth liquid retaining plate 63 is provided corresponding to the second elongated hole 13, and the fifth liquid retaining plate 64 is provided corresponding to the fifth elongated hole 61. Also, optionally, the fourth liquid retaining plate 63 and the fifth liquid retaining plate 64 may be provided on the inner wall of the second water washing tank 6 by pasting, or the fourth liquid retaining plate 63 and the fifth liquid retaining plate 64 may be fixed to the wall of the second water washing tank 6 by screws or the like. In the embodiments of the present invention, by the fourth liquid retaining plate 63 closing the second elongated hole 13 and the fifth liquid retaining plate 64 closing the fifth elongated hole 61, it is avoided that the copper removal solution in the copper removal tank 1 enters the second water washing tank 6, and when the conductive belt 3 is conveyed, it is also possible to avoid the washing liquid in the second water washing tank 6 being carried outside from the fifth elongated hole 61.

[0031] In some embodiments, a sixth liquid retaining plate 83 is provided at the location of the seventh elongated hole 81 on the side wall inside the pickling spray tank 8. The sixth liquid retaining plate 83 may be in the shape of an elongated plate, and its length is the same as the length of the fifth elongated hole 61, and it is for stopping the washing liquid carried from the fifth elongated hole 61 by the conductive belt 3. Also, optionally, the sixth liquid retaining plate 83 is provided on the inner wall body of the pickling spray tank 8 by pasting, but the sixth liquid retaining plate 83 may also be fixed to the wall of the pickling spray tank 8 by screws or the like. In the embodiments of the present invention, the washing liquid carried by the conductive belt 3 from the fifth elongated hole 61 may be blocked by the sixth liquid retaining plate 83, and it is avoided that the washing liquid in the second water washing tank 6 and the sulfuric acid solution in the pickling spray tank 8 are mixed.

[0032] The operating principle of the copper removal device for the conductive belt according to the embodiments of the present invention is as follows.

[0033] When operating, the anode conductive roller 21 is controlled to be connected to the positive electrode of the power supply, and the cathode plate 11 is controlled to be connected to the negative electrode of the power supply. For the conductive belt 3, the anode electricity is conducted to the first surface and / or the second surface of the conductive belt 3 by the anode conductive roller 21. The conductive belt 3 enters the copper removal tank 1 through the first long hole 12 of the copper removal tank 1 while being restricted by the first external limit roller 24, and is pressed into the copper removal solution by the first internal limit roller 22 and the second internal limit roller 23. In the copper removal tank 1, due to the action of the copper removal solution and the anode conductive roller 21, the copper layer on the surface of the conductive belt 3 is ionized, and copper ions that can freely move in the copper removal solution are generated. Thereby, the copper layer on the surface of the conductive belt 3 is removed and enters the copper removal solution. At this time, since there are copper ions in the copper removal solution, the current sequentially flows through the conductive belt 3, the copper removal solution, and the cathode plate 11. The copper removal solution functions as an electrolyte, and the copper ions in the electrolyte move to the cathode plate 11 and react with electrons near the cathode plate 11 to generate copper.

[0034] In some embodiments, the conductive belt 3 may first enter the first water washing tank 4 and be sprayed with washing liquid by the first upper and lower side spray pipes 42 to wash away dirt, dust, and plating solution. Also, the third liquid stop plate 43 avoids the intrusion of water into the copper removal tank 1 as much as possible.

[0035] In some embodiments, in order to better avoid the mixing of the washing liquid in the first water washing tank 4 and the copper removal solution in the copper removal tank 1, the conductive belt 3 may also enter the copper removal tank 1 after passing through the first transfer tank 5.

[0036] In some embodiments, for the conductive belt 3, after electrolyzing the copper layer in the copper removal tank 1, the washing liquid may be sprayed by the second upper and lower side washing spray pipes 62 in the second water washing tank 6, and the copper removal solution on the conductive belt 3 may be washed away.

[0037] In some embodiments, in order to avoid mixing the copper plating removal solution in the copper plating removal tank 1 with the washing liquid in the second washing tank 6, the conductive belt 3 may enter the second transfer tank 7 before the second washing tank 6.

[0038] In some embodiments, in order to avoid the intrusion of the copper plating removal solution into the subsequent electroplating solution, the conductive belt 3 washed in the second washing tank 6 enters the pickling spray tank 8, and the acidic solution ejected from the upper and lower pickling spray pipes 82 in the pickling spray tank 8 reacts with the unreacted copper plating removal solution on both sides of the conductive belt 3, thereby avoiding the intrusion of the copper plating removal solution into the subsequent electroplating solution.

[0039] The beneficial effects of the embodiments of the present invention are as follows.

[0040] In the embodiment of the present invention, when the conductive belt 3 enters the copper plating removal tank 1, due to the action of the cathode plate 11 immersed in the copper plating removal solution, the copper layer on the surface of the conductive belt 3 is ionized, and copper ions that can freely move in the copper plating removal solution are generated. Thereby, the copper on the surface of the conductive belt 3 is ionized and enters the copper plating removal solution, and the copper layer on one side of the conductive belt 3 is removed.

[0041] In the embodiment of the present invention, it is also possible to remove the copper layers on both sides of the conductive belt 3 at the same time. In this case, two anode conductive rollers 21 that are rotatably attached to the frame up and down and respectively contact the first surface and the second surface of the conductive belt 3 are provided. Two cathode plates 11 are also provided, which are respectively provided above and below the conductive belt 3. The copper layer on the first surface of the conductive belt 3 is removed by the upper anode conductive roller 21 and the cathode plate 11 of the conductive belt 3, and the copper layer on the second surface of the conductive belt 3 is removed by the lower anode conductive roller 21 and the cathode plate 11 of the conductive belt 3. In the embodiment of the present invention, the number of the anode conductive rollers 21 and the cathode plates 11 may be flexibly arranged according to the surfaces that need to remove the copper removal layer from the conductive belt 3, so the production cost is reduced.

[0042] In an embodiment of the present invention, by providing the first internal limit roller 22 and the second internal limit roller 23, the conductive belt 3 may be completely immersed in the copper plating removal solution.

[0043] In an embodiment of the present invention, by closing the first liquid stop plate 14 and the second liquid stop plate 15 to the first elongated hole 12 and the second elongated hole 13 respectively, the outflow of the copper plating removal solution in the copper plating removal tank 1 is avoided.

[0044] In an embodiment of the present invention, the first upper and lower side water washing spray pipe 42 sprays the washing liquid to clean the dirt and dust on both sides of the conductive belt 3, thereby improving the quality of copper removal of the conductive belt 3.

[0045] In an embodiment of the present invention, the second upper and lower side water washing spray pipe 62 sprays the washing liquid to wash the copper plating removal solution on both sides of the conductive belt 3.

[0046] In an embodiment of the present invention, the upper and lower side pickling spray pipe 82 is for ejecting an acidic solution. The acidic solution reacts with the copper plating removal solution that has not completely reacted on both sides of the conductive belt 3, thereby avoiding the intrusion of the copper plating removal solution into the plating solution for electroplating later.

[0047] Also, in an embodiment of the present invention, a blocking plate may be provided to block the liquid carried by the conveyance of the conductive belt 3.

[0048] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention. The directions or positional relationships indicated by terms such as "upper, lower, inner, and outer" are based on the directions or positional relationships described in the drawings, and are used only for facilitating the description of the present invention and simplifying the description, and are not intended to indicate or imply that the relevant device or device must have a specific direction, be configured or operate in a specific direction, and should not be understood as limiting the present invention. Furthermore, the terms "first, second, or third" are used only for the purpose of description and should not be understood as indicating or suggesting relative importance.

[0049] In the embodiments of the present invention, unless otherwise clearly defined and limited, the terms "attach, connect, couple" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection, or it may be a mechanical connection, an electrical connection, a direct connection, an indirect connection through an intermediate medium, or a communication inside two components. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to the situation.

[0050] The present invention has been described with reference to the preferred embodiments. However, various improvements can be made without departing from the scope of the present invention, and its components can be exchanged with equivalents. In particular, as long as there is no structural contradiction, each technical feature described in each embodiment may be combined in any manner. The present invention is not limited to the specific embodiments disclosed in this specification, but includes all technical solutions included within the scope of the claims.

[0051] The copper removal device for a conductive belt of the present invention includes a copper removal tank for plating copper removal solution and a conductive belt conveying mechanism for conveying the conductive belt. The copper removal tank for plating is provided with a first elongated hole and a second elongated hole through which the conductive belt passes in the lateral direction. The conductive belt passes through the copper removal tank for plating in the lateral direction through the first elongated hole and the second elongated hole, is immersed in the copper removal solution for plating, and is charged with the electricity of the anode. In the copper removal tank for plating, a cathode plate connected to the negative electrode of the power supply and located above and / or below the conductive belt is provided. When the conductive belt enters the copper removal tank for plating, due to the action of the cathode plate immersed in the copper removal solution for plating, the copper layer on the surface of the conductive belt is ionized, copper ions that can freely move in the copper removal solution for plating are generated, and the copper layer on the surface of the conductive belt is removed. Thereby, when the conductive belt is immersed in the plating solution for a long time, a copper layer is plated, and the technical problem that the plating effect of the flexible film substrate deteriorates is solved. Therefore, the copper removal device for a conductive belt of the present invention has practicality.

Explanation of Signs

[0052] 1 Copper removal tank for plating 11 Cathode plate 12 First elongated hole 13 Second elongated hole 14 First liquid stop plate 15 Second liquid stop plate 21 Anode conductive roller 22 First internal limit roller 23 Second internal limit roller 24 First external limit roller 25 Second external limit roller 3 Conductive belt 4 First water washing tank 41 Third elongated hole 42 First upper and lower side water washing spray pipe 43 Third liquid stop plate 5 First transfer tank 51 Fourth elongated hole 6 Second water washing tank 61 Fifth elongated hole 62 Second upper and lower side washing spray pipe 63 Fourth liquid stop plate 64 Fifth liquid stop plate 7 Second transfer tank 71 Sixth long hole 8 Pickling spray tank 81 Seventh long hole 82 Upper and lower side pickling spray pipe 83 Sixth liquid stop plate

Claims

1. A copper removal device for a conductive belt, comprising: a copper plating removal tank (1) and a conductive belt conveying mechanism, wherein the copper plating removal tank (1) is for containing a copper plating removal solution, and the copper plating removal tank (1) is provided with a first elongated hole (12) and a second elongated hole (13) through which the conductive belt (3) passes horizontally. The conductive belt conveying mechanism is for conveying the conductive belt (3), and the conductive belt (3) passes horizontally through the copper plating removal tank (1) through the first elongated hole (13) and the second elongated hole (14), and is immersed in the copper plating removal solution so as to be charged with the electricity of the anode. Inside the copper plating removal tank (1), a cathode plate (11) located above the conductive belt (3) and a cathode plate (11) located below are provided and connected to the negative electrode of the power source. Outside the copper plating removal tank (1), a first anode conductive roller (21) and a second anode conductive roller (21) connected to the positive electrode of the power source are provided. The first anode conductive roller (21) contacts the first surface above the conductive belt (3), and the second anode conductive roller (21) contacts the second surface below the conductive belt (3) to conduct the electricity of the anode to the conductive belt (3). A copper removal device for a conductive belt, characterized in that.

2. The conductive belt conveying mechanism includes a first internal limit roller (22) and a second internal limit roller (23) respectively located at the first end and the second end inside the copper plating removal tank (1) for pressing down the conductive belt (3) to immerse the conductive belt (3) in the copper plating removal solution. The copper removal device for a conductive belt according to Claim 1, characterized in that.

3. The conductive belt conveying mechanism further includes a plurality of first external limit rollers (24) and a plurality of second external limit rollers (25) respectively located at the front end and the rear end of the copper plating removal tank (1). The plurality of first external limit rollers (24) are for carrying the conductive belt (3) into the copper plating removal tank (1), and the plurality of second external limit rollers (25) are for carrying the conductive belt (3) out of the copper plating removal tank (1). The copper removal device for a conductive belt according to Claim 2, characterized in that.

4. At positions corresponding to the first elongated hole (12) and the second elongated hole (13) on the side wall of the copper plating removal tank (1), a first liquid stop plate (14) and a second liquid stop plate (15) are provided. The copper removal device for a conductive belt according to claim 1, characterized in that.

5. A first water washing tank (4) is provided at the front end of the copper plating removal tank (1). A third elongated hole (41) through which the conductive belt (3) passes is provided on the side wall of the first water washing tank (4). In the first water washing tank (4), a first upper and lower side water washing spray pipe (42) for washing dirt and dust on both sides of the conductive belt (3) is provided. The copper removal device for a conductive belt according to any one of claims 1 to 4, characterized in that.

6. A first transfer tank (5) is provided between the copper plating removal tank (1) and the first water washing tank (4). A fourth elongated hole (51) through which the conductive belt (3) passes is provided on the side wall of the first transfer tank (5). The copper removal device for a conductive belt according to claim 5, characterized in that.

7. A second water washing tank (6) is provided at the rear end of the copper plating removal tank (1). A fifth elongated hole (61) through which the conductive belt (3) passes is provided on the side wall of the second water washing tank (6). In the second water washing tank (6), a second upper and lower side water washing spray pipe (62) for washing the copper plating removal solution on both sides of the conductive belt (3) is provided. The copper removal device for a conductive belt according to any one of claims 1 to 4, characterized in that.

8. A second transfer tank (7) is provided between the rear end of the copper plating removal tank (1) and the second water washing tank (6). A sixth elongated hole (71) through which the conductive belt (3) passes is provided on the side wall of the second transfer tank (7). The copper removal device for a conductive belt according to claim 7, characterized in that.

9. An acid washing spray tank (8) is provided at the rear end of the second water washing tank (6). A seventh elongated hole (81) through which the conductive belt (3) passes is provided in the acid washing spray tank (8). In the acid washing spray tank (8), an upper and lower side acid washing spray pipe (82) for ejecting an acidic solution that reacts with the copper plating removal solution on both sides of the conductive belt (3) is provided. The copper removal device for a conductive belt according to claim 7, characterized in that.

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