Peeling device for angular wire coated resin layer and method for peeling angular wire coated resin layer

Abstract

This detachment device for a coating-resin layer of a rectangular wire obtained by coating the outside of a metal conductor having rectangular cross-sectional shape with the coating-resin layer, includes: a processing blade that detaches the coating-resin layer; a jig that holds the rectangular wire; and a position detection means that detects the position of the edge of the processing blade with respect to a surface of the metal conductor. The detachment device for the rectangular wire coating-resin layer causes the edge of the processing blade to enter the coating-resin layer so as to reach a predetermined thickness position therein, causes the processing blade and the rectangular wire to move relative to each other in the longitudinal direction of the rectangular wire without any contact with the metal conductor, and performs a detachment process on the coating-resin layer.

Description

Technical Field

[0001] The present invention relates to a peeling device for a square wire coated resin layer and a method for peeling a square wire coated resin layer.

Background Art

[0002] The conductor material used in conventional motors is a round wire in which an insulating resin is attached to the outer periphery of a metal conductor having a round cross-section. For peeling the insulating resin, a device called a stripper has generally been used. The stripper is configured to include, for example, a processing blade and a jig for holding the round wire. With the development of in-vehicle motor technology and the progress of the development of small and high-efficiency motors, the demand for square wires with a conductor part cross-section having a polygonal shape with an improved coil occupancy rate is increasing. Different from round wires, square wires have planes and corners, making it difficult to process them with existing strippers. Therefore, a technique of punching out a resin part using a mold (punch and die) (see Patent Document 1) has been developed and is generally used.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The resin peeling technique using a mold has the advantages that high-speed and high-precision resin peeling processing can be performed on the processed part, and the shape forming of the conductor part can also be performed simultaneously. However, the cutting blade may hit the conductor wire and damage the conductor wire. In addition, when processing a plurality of square wires simultaneously due to the configuration using a mold and a press machine, the equipment becomes large and the equipment cost becomes high. Furthermore, in mold processing, it becomes difficult to peel the resin from the same location on the entire surface simultaneously due to the relationship of the pressing direction. There are also technical problems such as the square wire to be processed needs to be straight and in a state before forming (such as bending). An object of the present invention is to provide a peeling device for a square wire coated resin layer and a method for peeling a square wire coated resin layer, which can peel the coated resin layer without damaging the surface of the metal conductor by a processing blade.

Means for Solving the Problems

[0005] The above problems of the present invention have been solved by the following means. [1] A peeling device for a coated resin layer of a square wire in which a coated resin layer is coated on the outside of a metal conductor having a square cross section, comprising: a processing blade for peeling the coated resin layer; a jig for holding the square wire; position detecting means for detecting the position of the cutting edge of the processing blade with respect to the surface of the metal conductor, and the cutting edge of the processing blade is advanced to a predetermined thickness position of the coated resin layer, brought into contact with the metal conductor without contacting the metal conductor, and the processing blade and the square wire are relatively moved in the longitudinal direction of the square wire to perform the peeling process of the coated resin layer. A peeling device for a coated resin layer of a square wire. [2] The peeling device for a coated resin layer of a square wire according to [1], wherein a plurality of the processing blades for simultaneously peeling the coated resin layers of a plurality of square wires are provided. [3] The peeling device for a coated resin layer of a square wire according to [1] or [2], wherein the cutting edge angle of the processing blade is 10° to 80°. [4] The peeling device for a coated resin layer of a square wire according to [3], wherein the cutting edge entry angle of the processing blade, which is defined by the angle formed by the line indicating half of the cutting edge angle of the processing blade and the moving direction of the square wire in a state where the cutting edge of the processing blade is in contact with the surface to be processed of the square wire, has a range of 5° to 85°. [5] The peeling device for a coated resin layer of a square wire according to any one of [1] to [4], wherein the jig has a wall surface for holding the square wire, and the longitudinal end surface on the tip side of the square wire is pressed against the wall surface and held. [6] The coating resin layer is a thermoplastic resin, and the peeling device for the angular wire coating resin layer according to any one of [1] to [5] includes heating means for heating the cutting edge of the processing blade to a temperature equal to or higher than the softening point and lower than the melting point of the coating resin layer. [7] The position detection means is a load-displacement sensor, and the peeling device for the angular wire coating resin layer according to any one of [1] to [6]. [8] The position detection means is an eddy current displacement sensor, and the peeling device for the angular wire coating resin layer according to any one of [1] to [6]. [9] The position detection means includes a conduction sensor for detecting the presence or absence of electrical conduction between the metal conductor and the processing blade. The conduction sensor detects the cutting edge position of the processing blade based on the change position of the presence or absence of electrical conduction between the metal conductor and the processing blade detected by the movement of the processing blade, and the peeling device for the angular wire coating resin layer according to any one of [1] to [6].

[10] The jig includes a pair of clamping rolls, and while sandwiching the angular wire between the pair of clamping rolls and feeding it out, the peeling device for the angular wire coating resin layer according to any one of [1] to [9] straightens the angular wire.

[11] A method for peeling a coating resin layer of an angular wire in which a coating resin layer is coated on the outside of a metal conductor having a rectangular cross-section. When peeling the coating resin layer with a processing blade. The angular wire is held by a jig. The position of the cutting edge of the processing blade with respect to the surface of the metal conductor is detected by a position detection means. The cutting edge of the processing blade is advanced to a predetermined thickness position of the coating resin layer, brought into contact with the metal conductor, and the processing blade and the angular wire are relatively moved in the longitudinal direction of the angular wire, leaving at least a part of the coating resin layer on the surface side of the metal conductor in a layer form, and a peeling process for the coating resin layer other than the remaining layer is performed. A method for peeling an angular wire coating resin layer.

[12] The method for peeling a corner wire coating resin layer according to any one of [1] to

[10] , using the apparatus for peeling a corner wire coating resin layer according to

[11] .

Advantages of the Invention

[0006] The apparatus for peeling a corner wire coating resin layer of the present invention can accurately detect the position of the cutting edge of the cutting tool by the position detecting means. Therefore, without damaging the surface of the metal conductor, the coating resin layer can be peeled off except for the state where the coating resin layer remains in layers on the surface of the metal conductor by the cutting tool. In addition, miniaturization of the peeling equipment becomes possible. The method for peeling a corner wire coating resin layer of the present invention can accurately detect the position of the cutting edge of the cutting tool, and without damaging the surface of the metal conductor, the coating resin layer can be peeled off except for the state where the coating resin layer remains in layers on the surface of the metal conductor.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Embodiments for Carrying Out the Invention

[0008] A preferred embodiment of the apparatus for peeling the coating resin layer of the square bar of the present invention will be described below with reference to the drawings. As shown in FIG. 1, the apparatus 1 for peeling the coating resin layer of the square bar of the present invention has a processing blade 11 for peeling the coating resin layer 53 covering the metal conductor 52 of the square bar 51. It also has a jig 21 (see FIG. 4) for holding the square bar 51. Further, it includes a position detecting means 31 for detecting the position of the cutting edge 12 of the processing blade 11 with respect to the surface 52SA of the metal conductor.

[0009] The metal conductor 52 has, for example, a rectangular cross-sectional shape (e.g., a flat rectangular shape), and is made of copper, a copper alloy, aluminum, an aluminum alloy, or the like. The term "rectangular" means a metal conductor having a polygonal cross-section (a triangle or more), surrounded by a plurality of planes and the corners between the planes, and including those with chamfered corners. For example, as shown in the figure, the square wire 51 is covered by a coating resin layer 53 including at least one or more insulating resin layers (two coating resin layers 53A and 53B in the drawing) on the outside of the metal conductor 52 having a square cross-section (a chamfered rectangle). The coating resin layer 53 may have a multi-layer structure or a single-layer structure. When the coating resin layer 53 has a multi-layer structure, the layer on the metal conductor 52 side is preferably an insulating and thermoplastic resin. If the thickness of the coating resin layer 53 is uniform, the square wire 51, like the metal conductor 52, is surrounded by a plurality of planes and the corners between the planes. The plane of the above square wire 51 means a plane area of the square wire 51, which is a region sandwiched by corners and extending in the longitudinal direction of the square wire 51. That is, it is the part excluding the corners. In other words, in the cross-section of the square wire 51 (a cross-section perpendicular to the longitudinal direction), it means the part forming the sides excluding the corners of the polygon showing the cross-section. The corners may or may not be chamfered.

[0010] As shown in FIG. 2, it is preferable that the cutting edge angle β of the cutting blade 11 is 10° to 80°. Also, in a state where the cutting edge 12 of the cutting blade 11 is in contact with the surface 51SA of the square wire 51 (the surface 53SA of the coating resin layer), the cutting edge entry angle α of the cutting blade 11, which is defined as the angle formed by the line L indicating half of the cutting edge angle β of the cutting blade 11 and the surface 51SA of the square wire 51 in the moving direction (arrow A) of the square wire 51, preferably has a range of 5 to 85°. Thereby, the coating resin layer 53 other than the remaining one can be peeled off while leaving the coating resin layer 53 on the surface of the metal conductor 52. From this viewpoint, the cutting edge entry angle α is more preferably 20° to 70°, and even more preferably 35° to 55°. Also, the blade width of the processing blade 11 is preferably longer than the width of the corner line 51. In this way, by setting the blade width of the processing blade 11, the coating resin layer 53 on one side of the corner line 51 can be peeled off at once by a single peeling operation. Furthermore, although not shown in the figure, it is also preferable that a plurality of processing blades 11 are provided in parallel, and the coating resin layers 53 of the respective plurality of corner lines 51 are simultaneously peeled off by each processing blade 11.

[0011] The coating resin layer 53 is preferably a thermoplastic resin, and preferably includes a heating means (not shown) for heating the cutting edge 12 of the processing blade 11 to a temperature equal to or higher than the softening point and lower than the melting point of the coating resin layer 53. In this way, if it is a thermoplastic resin, it does not thermoset when heated, and good cutting becomes possible. Further, when the coating resin layer 53 has a plurality of layers, it is preferable that the cutting edge 12 is heated to a temperature equal to or higher than the softening point and lower than the melting point of the layer cut by the cutting edge 12 of the processing blade 11. In addition, when heating the cutting edge 12 of the processing blade 11, if the coating resin layer 53 is a thermosetting resin, when heat is applied to the coating resin layer 53 by the cutting edge 12, it may harden and the cuttability may decrease. Therefore, when heating the cutting edge 12, the coating resin layer 53 is preferably a thermoplastic resin. The heating means for heating the cutting edge 12 is not shown in the figure, but for example, it can be appropriately selected and adopted from various heating methods such as a method of attaching a heater to the cutting edge and heating, a method of blowing hot air onto the cutting edge 12, and a method of irradiating heat rays. Also, instead of heating the cutting edge 12, it is also preferable to heat the processing position of the coating resin layer 53 by the same method as the heating method of the cutting edge 12. It is also preferable to heat both the cutting edge 12 and the processing position of the coating resin layer 53 by the above method. The surface to be peeled may be one of the plurality of surfaces of the corner line 51, or may be two or more surfaces. The case of peeling a plurality of surfaces simultaneously will be described later.

[0012] As shown in FIG. 3, the penetration depth d of the cutting edge 12 of the cutting blade 11 into the surface 53SA of the coating resin layer is obtained as follows. First, while measuring the measured distance D from the surface 52SA of the metal conductor to the cutting edge 12 of the cutting blade 11 by the position detection means 31 so that the distance from the surface 52SA of the metal conductor to the cutting edge 12 of the cutting blade 11 becomes the set distance, the position of the cutting edge 12 is determined so that [measured distance D]=[set distance]. The set distance corresponds to the thickness of the coating resin layer 53 remaining on the surface 52SA of the metal conductor after cutting the coating resin layer 53. Therefore, the penetration depth d of the cutting edge 12 of the cutting blade 11 is obtained by [penetration depth d]=[thickness T of the coating resin layer 53]-[measured distance D]. In this way, since the penetration depth d of the cutting edge 12 into the coating resin layer 53 can be precisely set, for example, the coating resin layer 53A can be left thin on the surface 52SA of the metal conductor, and the coating resin layer 53 other than the remaining one can be peeled off. Therefore, when the coating resin layer 53 is peeled off, the surface 52SA of the metal conductor is not damaged.

[0013] As shown in FIG. 4, it is preferable that the jig 21 includes a jig 21A that holds the end portion of the square wire 51 and jigs 21B and 21C that hold the opposing side surfaces in the longitudinal direction of the square wire 51. The jig 21A determines the position of the end face 51E of the square wire 51 when the square wire 51 is installed in the peeling device. For example, the longitudinal end face 51E on the tip side of the square wire 51 can be pressed against the wall surface of the jig 21A and held. Alternatively, a recess (not shown) may be formed according to the cross-sectional shape of the square wire 51. In such a case, it is also preferable to fit the end portion of the square wire 51 into the recess. The jigs 21B and 21C preferably hold the opposing side surfaces (for example, the corner line surfaces 51SA and 51SB) of the corner line 51 in the longitudinal direction of the corner line by the holding surfaces 21BS and 21CS of the jigs, pressing against and holding these side surfaces. For this reason, it is preferable that the jig 21B is movable in the direction of arrow B and the jig 21C is movable in the direction of arrow C. Also, it is preferable that the jigs 21B and 21C can move linearly, for example, in the direction of arrow A, sandwiching the side surface of the corner line 51. In order to linearly move the jigs 21B and 21C, it is also preferable to movably arrange the jigs 21B and 21C on a rail (not shown) linearly provided in the direction of arrow A. Each moving means of the above-mentioned jigs 21B and 21C may be manual, electric, or other moving means. Note that FIG. 4 shows the state before the coating resin layer 53 is peeled off. Also, as shown in FIG. 5, the jig 21 preferably includes a pair of clamp rolls 22 and 23. The pair of clamp rolls 22 and 23 sandwich the corner line 51 therebetween, and by rotating the clamp roll 22 in the direction of arrow C1 and the clamp roll 23 in the direction of arrow C2, the corner line 51 is fed in the moving direction of arrow A and the corner line 51 can be straightened. In this way, by straightening the corner line 51 after the coating resin layer 53 is peeled off, the handling of the corner line 51 after peeling becomes easier.

[0014] The position detection means 31 shown in FIG. 1 above is preferably a load displacement sensor. The load displacement sensor utilizes the difference in hardness between the metal conductor 52 and the coating resin layer 53, and preferably detects the position of the cutting edge of the cutting tool 11 with respect to the surface 52SA of the metal conductor based on the change in the load sensed by the load displacement sensor due to the resistance when the cutting tool 11 is inserted into the coating resin layer 53 of the corner line 51.

[0015] The position detection means 31 may also preferably be an eddy current displacement sensor. The eddy current displacement sensor preferably generates an alternating magnetic field using a high-frequency current, generates an eddy current due to the change in magnetic flux inside the conductor surface, and measures the position of the cutting edge and the surface 52SA of the metal conductor based on the generated eddy current value.

[0016] The position detection means 31 is preferably a conduction sensor that detects the presence or absence of electrical conduction between the metal conductor 52 and the cutting blade 11. The conduction sensor detects the position of the cutting edge 12 of the cutting blade 11 based on the position where conduction is started according to the presence or absence of electrical conduction between the metal conductor 52 and the cutting blade 11 detected by the movement of the cutting blade 11 in the direction of the metal conductor 52.

[0017] When peeling the coating resin layer 53, after detecting the surface position of the metal conductor 52 by the position detection means 31, the cutting edge 12 is separated slightly from the metal conductor surface 52SA, and then the coating resin layer 53 is peeled. The distance for separating the cutting edge 12 from the metal conductor surface 52SA can be set as appropriate. Also, the position detection means 31 can also detect the position of the cutting edge 12 of the cutting blade 11 with respect to the metal conductor surface 52SA even during the peeling process, enabling control.

[0018] The peeling device 1 causes the cutting edge 12 of the cutting blade 11 to enter to a predetermined penetration depth of the coating resin layer 53, makes the cutting blade 11 and the angular line 51 move relative to each other in the longitudinal direction of the angular line 51 without contacting the metal conductor 52, and performs the peeling process of the coating resin layer. Here, "moving relative to each other in the longitudinal direction of the angular line 51" means moving either one or both of the cutting blade 11 and the angular line 51 in the longitudinal direction, and moving the cutting blade 11 by a predetermined length from the predetermined penetration depth. When moving both the cutting blade 11 and the angular line 51, the cutting blade 11 and the angular line 51 are moved in opposite directions along the longitudinal direction of the angular line 51.

[0019] Also, the surface to be peeled may be one plane among the plurality of surfaces of the angular line 51, or may be at least two or more opposing surfaces. When peeling a plurality of surfaces, it is preferable to peel the coating resin layer 53 at the same position from the end surfaces of the angular line 51 of the opposing surfaces (for example, the upper and lower surfaces). The upper and lower surfaces refer to the upper surface (one surface) and the lower surface (the surface opposing this surface) when the angular line 51 is arranged on the jig 21. By installing a cutting blade on each peeling surface of the coating resin layer 53, it is possible to peel a plurality of coating resin layers simultaneously. For example, as shown in FIG. 6, it is possible to cut the coating resin layers 53 on a plurality of surfaces of the corner line 51, for example, two surfaces on the upper surface side and the lower surface side. That is, the cutting blade 12A is directed toward the coating resin layer 53 on the upper surface side of the corner line 51, and the cutting blade 11A is arranged. At this time, it is preferable to arrange the cutting blade 11B with the cutting edge 12B directed toward the coating resin layer 53 at a position facing the cutting blade 11A on the lower surface side of the corner line 51. The position detection means 31 is preferably arranged on one of the cutting blades 11 (for example, the cutting blade 11A). Of course, the position detection means 31 may be arranged on both of the cutting blades 11A and 11B. On the other hand, when the position detection means 31 is on one side, it is preferable to interlock the penetration depths of the cutting blades into the coating resin layer 53 (in the drawing, the cutting blade 11A and the cutting blade 11B). In this way, by arranging the cutting blades 11 (11A, 11B) on the upper and lower sides with the coating resin layer 53 interposed therebetween, as shown in FIG. 7, it is possible to peel the coating resin layers 53 on the upper surface side and the lower surface side of the metal conductor 52.

[0020] In this way, in the peeling device 1, since the cutting blade 11 can penetrate into the coating resin layer 53 to a predetermined penetration depth, it is possible to perform the peeling process of the coating resin layer 53 without damaging the surface of the metal conductor 52. It is also preferable to detect the penetration depth of the cutting edge 12 of the cutting blade 11 with respect to the coating resin layer 53 by the position detection means 31 and perform the peeling process while controlling the penetration depth. It is preferable that a coating resin layer 53S remains on the surface of the metal conductor 52 from which the coating resin layer 53 has been peeled, thinly, for example, with a thickness of about 5 μm. Note that the thickness of the remaining coating resin layer 53 can be set as appropriate. For example, the remaining coating resin layer 53S may be the lower layer side or all of the layer directly covering the metal conductor 52.

[0021] As shown in Fig. 8, it is possible to cut the four surfaces on the upper surface side, lower surface side, right side surface side, and left side surface side of the coating resin layer 53. That is, the cutting blade 11A is arranged on the upper surface side of the coating resin layer 53 with the cutting edge 12A facing the coating resin layer 53 side. At this time, it is preferable to arrange the cutting blade 11B with the cutting edge 12B facing the coating resin layer 53 side at a position facing the cutting blade 12A on the lower surface side of the angular line 51. Further, it is preferable to arrange the cutting blades 11C and 11D on the left and right side surfaces of the angular line 51 with their respective cutting edges facing the coating resin layer 53 side. The position detection means 31 may be arranged on at least one of the cutting blades 11 (for example, the cutting blade 11A). When there is one position detection means 31, it is preferable to interlock the penetration depths of the respective cutting blades into the coating resin layer 3. Of course, the position detection means 31 may also be arranged on the cutting blade 11C, or the position detection means 31 may be arranged on all the cutting blades 11. In this way, by arranging the cutting blades 11 on the upper and lower surface sides and the left and right side surface sides with the coating resin layer 53 interposed therebetween, as shown in Fig. 9, it is possible to peel the coating resin layer 53 from the four surfaces on the upper and lower surface sides and the left and right side surface sides of the metal conductor 52. In this case, on each surface, the coating resin layer 53S is left in the same form as shown in Fig. 7 described above.

[0022] Also, although not shown in the figure, it is also preferable to peel the coating resin layer 53 covering the chamfered corners of the metal conductor 52. In this case, as shown in Fig. 10, it is preferable to arrange the cutting blades 11E to 11H at an angle corresponding to the chamfered portion of the metal conductor 52 (for example, in a state where the cutting edge is inclined by 45° in the blade width direction). In this case, even if a part of the chamfered portion of the metal conductor 52 is cut by the cutting blades 11E to 11H, since the cutting amount is a small amount, there is no problem. Therefore, the coating resin layer 53 may be cut so as to expose a part of the metal conductor 52 at the chamfered corner. In this way, as shown in Fig. 11, the coating resin layer at the chamfered corner of the metal conductor 52 is removed, and the peeling process of the coating resin layer 53 is performed without damaging the metal conductors 52 on the upper and lower surface sides and the left and right side surface sides of the angular line 51, so that the coating resin layer at the corner can be peeled off.

[0023] As shown in FIG. 12, the angled wire 51 is fixed by the jig described with reference to FIG. 4 above. The machining blades 11A and 11B are arranged on both sides of the angled wire fixed by this jig. The machining blades 11A and 11B are arranged on the upper surface side (the left side of the angled wire in the drawing) and the lower surface side (the right side of the angled wire in the drawing) of the angled wire 51. Each of the machining blades 11A and 11B is preferably held by machining blade holders 41A and 41B respectively. The machining blade holders 41A and 41B can be positioned in the direction of the angled wire 51 respectively. Therefore, the distance between the cutting edges 12A of the machining blade 11A, the cutting edges 12B of the machining blade 11B and the metal conductor surface 52SA (see FIG. 1) of the angled wire 51 can be measured by a position detection means 31 (not shown). Then, based on the measured value, it is preferable that the machining blade holders 41A and 41B are moved in a direction perpendicular to the longitudinal direction of the angled wire so that the positions of the respective cutting edges 12A and 12B from the surface of the metal conductor (not shown) are at a desired distance. The positions of the machining blade holders 41A and 41B can be adjusted so that the positions of the respective cutting edges 12A and 12B are arranged at an appropriate distance (for example, 5 μm apart) from the metal conductor surface. The machining blade holders 41A and 41B are preferably connected and fixed by a holder connecting portion 42 so that the machining blades 11A and 11B move simultaneously.

[0024] Then, as shown in FIG. 13, the angled wire 51 is moved downward in the drawing. That is, with the respective cutting edges 12A and 12B cut into the coating resin layer (not shown) of the angled wire 51, the angled wire 51 and the respective machining blades 11A and 11B are relatively moved in the longitudinal direction of the angled wire 51 to peel off the coating resin layer. At that time, it is preferable that the coating resin layer is peeled off so that the respective machining blades 11A and 11B do not contact the metal conductor 52. That is, it is preferable that the coating resin layer is peeled off so that the coating resin layer does not completely peel off from the surface of the metal conductor (not shown), but a thin layer of the coating resin layer remains on the surface of the metal conductor (see FIGS. 6 to 9).

[0025] As shown in FIGS. 10, 12, etc. above, in the peeling device 1 of the corner wire coating resin layer of the present invention, each of the processing blades 11A to 11H is fixed and arranged on a processing blade holder movable in the direction of the coating resin layer, so that the peeling device can be configured compactly. Further, since the position of the cutting edge of the processing blade can be detected by the position detection means attached to the processing blade, the peeling device 1 is also configured compactly in this regard. For example, a size that allows manual peeling treatment is preferable, and the peeling device may be operable in a state where it is placed on a table or in a state where the peeling device is suspended. By suspending the peeling device, the weight of the peeling device borne by the operator is reduced, and the peeling operation becomes easier. The peeling device can be configured to have a size of about 20 to 50 cm × 20 to 50 cm × 20 to 50 cm and a weight of about 15 to 30 kg. Therefore, the peeling device 1 can be miniaturized.

[0026] Next, the method for peeling the coating resin layer of the present invention will be described below. The method for peeling the coating resin layer of the present invention is a method for peeling the coating resin layer 53 of the corner wire 51 in which the coating resin layer 53 is coated on the outside of the metal conductor 52 having a rectangular cross section. When peeling the coating resin layer 53 with the processing blade 11, the corner wire 51 is held by the jig 21, and the position of the cutting edge 12 of the processing blade 11 with respect to the surface 52SA of the metal conductor is detected by the position detection means 31. Then, the cutting edge 12 of the processing blade 11 is advanced to a predetermined thickness position of the coating resin layer 53, and without contacting the metal conductor 52, the processing blade 11 and the corner wire 51 are relatively moved in the longitudinal direction of the corner wire 51 to perform the peeling treatment of the coating resin layer 53 on the surface side of the metal conductor 52. For example, at least a part of the coating resin layer 53 is left in a layer form, and the coating resin layer 53 other than the remaining layer is peeled off. Relatively moving means that the corner wire 51 may be moved, the processing blade 11 may be moved, or both may be moved. At this time, it is preferable to detect the distance between the cutting edge 12 of the cutting blade 11 and the metal conductor 52 by the position detecting means 31 and always maintain a constant desired distance. As a result, it becomes possible to peel the coating resin layer 53 while leaving the coating resin layer 53 thin (for example, to a thickness of about 5 μm) on the surface 52SA of the metal conductor without damaging the surface 52SA of the metal conductor. The thickness of the coating resin layer 53 remaining on the surface of the metal conductor 52 is set as appropriate. In this way, by peeling so as to leave the coating resin layer 53 thin, damage to the surface 52SA of the metal conductor by the cutting blade 11 can be prevented in the peeling process of the coating resin layer.

[0027] For example, a preferred example of peeling the coating resin layer 53 on the upper and lower surfaces, left and right side surfaces, and corners of the metal conductor 52 will be described below with reference to FIG. 14. For example, the case of coating the coating resin layer 53 from the middle of the corner line 51 to the tip of the corner line 51 will be described. As shown in FIG. 14(A), the corner line 51 is disposed between the cutting blades 11A and 11B, between the cutting blades 11C and 11D, and between the cutting blades 11E to 11H. Then, by the position detecting means, for example, the penetration depth of the cutting edge 12A of the cutting blade 11A is set. At the same time, the penetration depth of the cutting edge 12B of the cutting blade 11B is also set. At the set penetration depth, the coating resin layer 53 on the upper and lower surfaces of the corner line 51 is peeled off. Then, as shown in FIG. 14(B), when the peeling start position is located at the cutting edge positions of the cutting blades 11C and 11D, the penetration depths of the cutting blades 11C and 11D are set for the coating resin layer 53 covering the left and right sides of the metal conductor 52 (not shown). At the set penetration depth, the coating resin layer 53 on the left and right side surfaces of the corner line 51 is peeled off. Further, as shown in FIG. 14(C), when the peeling start position is located at the cutting edge positions of the cutting blades 11E to 11H, the penetration depths of the cutting blades 11E to 11H are set for the coating resin layer 53 covering the corners of the metal conductor 52 (not shown). As shown in FIG. 14(D), at the set penetration depth, the coating resin layer 53 at the corners of the corner line 51 is peeled off. In this way, the coated resin layer at the desired position of the angular line 51 can be peeled off without damaging the surface 52SA of the metal conductor (see FIG. 1). The angular line 51 from which the coated resin layer 53 has been peeled off can be used by directly welding the peeled portion or the like.

[0028] In the above peeling method, it is preferable to use the peeling device 1 for the coated resin layer of the present invention to leave at least a part of the coated resin layer 53 in a layer on the surface side of the metal conductor 52 and peel off the coated resin layer other than the remaining layer.

[0029] The present invention will be described in more detail based on examples, but the present invention is not limited to these forms.

Example

[0030] [Example 1] A square metal conductor (copper square wire) with a cross-sectional shape of 2×3 mm was prepared, and a square wire 51 coated with an insulating resin layer with a thickness of 200 μm as a coating resin layer 53 was coated on the four upper, lower, left, and right surfaces of the cross-section. The coating resin layer 53 shown in Fig. 15 used an insulating resin layer with a two-layer structure of an enamel resin layer with a thickness of 50 μm: coating resin layer 53A (lower layer side: refer to Fig. 1 etc. for example) and a polyether ether ketone (PEEK) resin layer with a thickness of 150 μm: coating resin layer 53B (upper layer side: refer to Fig. 1 etc. for example). This square wire was used to peel the coating resin layer using the square wire coating resin layer peeling device 1 shown in Fig. 10. First, the square wire was positioned using the holding surface of the jig of the peeling device. Then, using an eddy current displacement sensor as the position detection means, the position of the cutting edge of the cutting tool with respect to the position of the surface of the metal conductor was confirmed. As the eddy current displacement sensor, EX-305V (trade name) manufactured by Keyence Corporation was used. The cutting edge of the cutting tool with a cutting edge angle of 50° was set to a cutting edge entry angle of 45° with respect to the square wire, and the cutting edge was advanced 5 μm above the surface of the metal conductor. Then, by moving the square wire in the longitudinal direction with a force of 150 N or more, the coating resin layer of the square wire into which the cutting tool was inserted was peeled leaving a thickness of 5 μm. The force of 150 N or more was measured using FGPX-100 (trade name) manufactured by Nidec Shimpo Corporation. At that time, since a coating resin layer with a thickness of 5 μm was left on the surface of the metal conductor, the surface of the metal conductor was not damaged. [Example 2] In Example 2, except that a jig having a holding surface capable of holding a plurality of square wires was used for the jig of the peeling device 1 of the coating resin layer, the same processing as in Example 1 was performed, and a plurality of square wires were simultaneously peeled leaving a coating resin layer with a thickness of 5 μm on the surface of the metal conductor and peeling the other coating resin layers. At that time, since a coating resin layer with a thickness of 5 μm was left on the surface of the metal conductor, the surface of the metal conductor was not damaged.

[0031] Although the present invention has been described together with its embodiments, we do not intend to limit our invention in any detail of the description unless otherwise specified, and we believe that it should be interpreted broadly without departing from the spirit and scope of the invention shown in the appended claims.

[0032] This application claims priority based on Japanese Patent Application No. 2020-165521 filed in Japan on September 30, 2020, the contents of which are incorporated herein by reference as part of the description of this specification.

Explanation of Signs

[0033] 1 Diagonal wire coating resin layer peeling device, peeling device 11 Processing blade 12 Blade tip 21 Fixture 22, 23 Clamping roll 31 Position detection means 51 Diagonal wire 52 Metal conductor 52SA Metal conductor surface 53 Coating resin layer α Blade tip entry angle β Blade tip angle

Claims

1. A device for peeling a coating resin layer of a square wire, in which a coating resin layer is coated on the outside of a metal conductor having a square cross-section and chamfered corners, comprising: The peeling device is: A processing blade for peeling the coating resin layer; A jig for holding the square wire; Position detecting means for detecting the position of the cutting edge of the processing blade with respect to the surface of the metal conductor, and The cutting edge of the processing blade is advanced to a predetermined thickness position of the coating resin layer and brought into contact with the metal conductor, and the processing blade and the square wire are relatively moved in the longitudinal direction of the square wire to perform the peeling process of the coating resin layer. The processing blade is: A pair of upper and lower processing blades arranged opposite to the upper and lower surfaces of the square wire; A pair of left and right processing blades arranged opposite to the left and right surfaces of the square wire behind the pair of upper and lower processing blades; And four chamfering processing blades arranged opposite to the respective chamfered portions of the square wire behind the pair of left and right processing blades. A device for peeling a coating resin layer of a square wire.

2. The device for peeling a coating resin layer of a square wire according to claim 1, wherein a plurality of the processing blades for simultaneously peeling the coating resin layers of a plurality of square wires are provided.

3. The device for peeling a coating resin layer of a square wire according to claim 1 or 2, wherein the cutting edge angle of the processing blade is 10° to 80°.

4. The device for peeling a coating resin layer of a square wire according to claim 3, wherein in a state where the cutting edge of the processing blade is in contact with the surface to be processed of the square wire, the cutting edge entry angle of the processing blade, which is defined by the angle formed by a line indicating an angle of 1 / 2 of the cutting edge angle of the processing blade and the moving direction of the square wire, has a range of 5° to 85°.

5. The device for peeling a coating resin layer of a square wire according to any one of claims 1 to 4, wherein the jig has a wall surface for holding the square wire, and the longitudinal end surface on the tip side of the square wire is pressed against the wall surface for holding.

6. The device for peeling a coating resin layer of a square wire according to any one of claims 1 to 5, wherein the coating resin layer is a thermoplastic resin, and heating means for heating the cutting edge of the processing blade to a temperature equal to or higher than the softening point and lower than the melting point of the coating resin layer is included.

7. The device for peeling a coating resin layer of a square wire according to any one of claims 1 to 6, wherein the position detecting means is a load displacement sensor.

8. The device for peeling a coating resin layer of a square wire according to any one of claims 1 to 6, wherein the position detecting means is an eddy current displacement sensor.

9. The position detecting means includes a conduction sensor for detecting the presence or absence of electrical conduction between the metal conductor and the processing blade. The continuity sensor detects the tip position of the cutting blade based on the change position of the presence or absence of electrical continuity between the metal conductor detected by the movement of the cutting blade and the cutting blade. The peeling device for a square wire coated resin layer according to any one of claims 1 to 6.

10. The jig includes a pair of clamping rolls, feeds the square wire while sandwiching the square wire between the pair of clamping rolls, and straightens the square wire. The peeling device for a square wire coated resin layer according to any one of claims 1 to 9.

11. A method of peeling the coated resin layer of a square wire in which a coated resin layer is coated on the outside of a metal conductor having a square cross-section and chamfered corners, using the peeling device for a square wire coated resin layer according to any one of claims 1 to 10, comprising: When peeling the coated resin layer with the cutting blade, holding the square wire with the jig, detecting the position of the cutting edge of the cutting blade with respect to the surface of the metal conductor by the position detecting means, causing the cutting edge of the cutting blade to enter up to a predetermined thickness position of the coated resin layer, contacting the metal conductor without contacting it, relatively moving the cutting blade and the square wire in the longitudinal direction of the square wire, leaving at least a part of the coated resin layer on the surface side of the metal conductor in a layer form, and performing a peeling process on the coated resin layer other than the remaining layer. A method for peeling a square wire coated resin layer.

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