Connector with semiconductor cooling device and motor vehicle

Abstract

The present invention provides a connector with a semiconductor cooling device and an automobile. The connector includes a conductor 22, a terminal 23 having one end connected to the conductor 22 and the other end configured to be connected to an external electrical structure, and a semiconductor cooling device 30. The semiconductor cooling device 30 has a cooling section 31 that absorbs heat from the terminal, and a heat dissipation section 32. The present invention can alleviate the problem that a large amount of heat is generated at the connection point between the conductor and the terminal, and the connection point often burns out.

Description

Technical Field

[0001] Related Applications This application claims the priority of a Chinese patent application with the application number CN202110821575.X, the filing date of July 20, 2021, and the title of the invention "Connector with Semiconductor Cooling Device and Automobile".

[0002] Technical Field The present invention relates to the technical field of electrical devices, and particularly to a connector with a semiconductor cooling device and an automobile.

Background Art

[0003] When an automobile starts, the starting current is relatively large, sometimes reaching 150A - 250A, and the requirements for the current-carrying capacity of the wire and the connector are relatively high. The operating and charging currents of electric vehicles are also relatively large, and the requirements for the current-carrying capacity of the wire and the connector are also relatively high. Usually, the wire has a predetermined rated current, and the amount of heat generated is relatively stable. By using a wire whose rated current meets the requirements, the conveyance of current can be realized.

[0004] However, at the connection point between the wire and the terminal, the contact resistance is high, and a large voltage drop may occur between the terminal and the wire. Therefore, at the connection point between the wire and the terminal, generally the amount of heat generated is large, and the connection point often burns out, which may lead to serious safety accidents.

[0005] For this reason, in the technical field of electrical devices, there is an urgent need for a connector that can alleviate the problem that the amount of heat generated at the connection point between the wire and the terminal is large and the connection point often burns out.

Summary of the Invention

Problems to be Solved by the Invention

[0006] An object of the present invention is to provide a connector with a semiconductor cooling device and an automobile that can alleviate the problem that the amount of heat generated at the connection point between the wire and the terminal is large and the connection point often burns out.

Means for Solving the Problem

[0007] The above object of the present invention can be achieved by the following technical solutions.

[0008] The present invention provides a connector with a semiconductor cooling device. The connector includes a conducting wire, a terminal having one end connected to the conducting wire and the other end configured to be connected to an external electrical structure, and a semiconductor cooling device. The semiconductor cooling device has a cooling part for absorbing the heat of the terminal and a heat radiating part.

[0009] The present invention provides an automobile including the above connector with a semiconductor cooling device.

[0010] The features and advantages of the present invention are as follows.

[0011] The external electrical structure is connected to the connector with the semiconductor cooling device via the terminal and is electrically connected to the conducting wire, thereby realizing the conveyance of electrical energy. Usually, a large contact resistance exists between the external electrical structure and the terminal, and heat continues to be generated during the connection process. In this connector, since the semiconductor cooling device is electrically connected to the conducting wire, it is possible to obtain electrical energy from the conducting wire. Then, when the semiconductor cooling device starts operating, heat is transferred from the cooling part to the heat radiating part, the heat in the heat radiating part is released to the outside, and the temperature of the cooling part gradually decreases. Therefore, the cooling part absorbs the heat of the terminal, maintains the terminal and the external electrical structure at a safe and stable temperature, realizes stable temperature control, and can reduce safety accidents such as burnout at the connection point. By using this connector, it is possible to solve the problem that the temperature at the connection point is too high when the charging current of an electric vehicle becomes large, and it can contribute to realizing rapid charging with a large current in the charging harness of an electric vehicle.

[0012] In this connector, no refrigerant is used, no moving mechanism is provided, and a semiconductor cooling device is used to cool down the terminals. This can avoid the generation of excessive vibration and noise, maintain a safe and stable state, and extend the service life. In this connector, it is possible to supply electrical energy to the semiconductor cooling device by the current shunt in the conducting wire, without the need for a separate power supply device, without the need to arrange or replace the power storage box, excellent in convenience and durability, easy to realize continuous operation, and capable of reducing the maintenance man-hours.

Brief Description of the Drawings

[0013] The following drawings are only intended to schematically illustrate and interpret the present invention and do not limit the scope of the present invention.

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Figure 17

Figure 18

Figure 19

Figure 20

Figure 21

Embodiments for Carrying Out the Invention

[0014] To more clearly understand the technical features, objects, and effects of the present invention, specific embodiments of the present invention will be described with reference to the drawings. In the description of the present invention, unless otherwise specified, "a plurality" means two or more.

[0015] Example 1 The present invention provides a connector with a semiconductor cooling device. As shown in FIG. 1, the connector includes a conducting wire 22, a terminal 23, and a semiconductor cooling device 30. The conducting wire 22 is connected to the terminal 23, and the terminal 23 is configured to be connected to an external electrical structure. The semiconductor cooling device 30 has a cooling part 31 that absorbs the heat of the terminal 23 and a heat dissipation part 32, and is electrically connected to the conducting wire 22.

[0016] Specifically, the semiconductor cooling device 30 is, in principle, a tool for heat transfer. When an electric current flows through a thermocouple formed by joining one N-type semiconductor material and one P-type semiconductor material, heat transfer occurs between both ends, heat moves from one end to the other end, thereby generating a temperature difference and forming a cold and a hot end. The semiconductor cooling device 30 described in this specification further has a heat dissipation end provided opposite to the cooling end in addition to the cooling end. The semiconductor cooling device 30 may use an existing semiconductor cooling device in the prior art, or may be customized according to the size of the conductor.

[0017] The external electrical structure is connected to the connector via the terminal 23 and is electrically connected to the conducting wire 22, thereby realizing the conveyance of electrical energy. Usually, a large contact resistance exists between the external electrical structure and the terminal 23, and heat continues to be generated during the connection process. In this connector, the semiconductor cooling device 30 is electrically connected to the conducting wire 22, enabling the acquisition of electrical energy from the conducting wire 22. Then, when the semiconductor cooling device 30 starts operating, heat is transferred from the cooling part 31 to the heat dissipation part 32, the heat in the heat dissipation part 32 is released to the outside, and the temperature of the cooling part 31 gradually decreases. Therefore, the cooling part 31 absorbs the heat of the terminal 32, maintains the terminal 23 and the external electrical structure at a safe and stable temperature, realizes stable temperature control, and can reduce safety accidents such as burnout at the connection point. By using this connector, the problem that the temperature at the connection point is too high when the charging current of an electric vehicle becomes large can be solved, contributing to the realization of rapid charging with a large current in the charging harness of an electric vehicle.

[0018] In this connector, refrigerant is not used and no moving mechanism is provided. Instead, the semiconductor cooling device 30 is used to cool down the terminal 23. This can avoid the generation of excessive vibration and noise, maintain a safe and stable state, and extend the service life. In this connector, it is possible to supply electrical energy to the semiconductor cooling device 30 by the shunt of the current in the conducting wire 22, without the need for a separate power supply device, eliminating the need to arrange or replace a power storage box. It is excellent in convenience and durability, easy to achieve continuous operation, and can reduce the number of maintenance man-hours.

[0019] In one embodiment, the connector further includes a protection structure device 10. As shown in FIG. 2, the terminal 23 is provided inside the protection structure device 10. In some high-current environments, it is necessary to provide insulation protection for the terminal 23. By providing the protection structure device 10 on the outer periphery of the terminal 23, insulation against the external environment of the terminal 23 can be achieved. Also, when the number of terminals 23 is large, when connecting to an external electrical structure, since it is necessary to insert and connect the terminals 23 one by one correspondingly, the operation becomes complicated and time-consuming. By arranging a plurality of terminals 23 at intervals inside the protection structure device 10 and inserting the protection structure device 10 and the external electrical structure correspondingly, it is possible to realize corresponding insertion for each internal terminal 23, making the operation simple and reducing the occurrence of situations where the terminals are inserted incorrectly, thus guaranteeing the accuracy and safety of the circuit. The protection structure device 10 may be a sheath.

[0020] In one embodiment, the connector includes a rectifying device 51. One end of the rectifying device 51 is electrically connected to the semiconductor cooling device 30 via a connecting wire 54, and the other end is electrically connected to the conducting wire 22 via the connecting wire 54. The rectifying device 51 may be electrically connected to the conducting wire 22 by being electrically connected to the connecting portion 21 via the connecting wire 54. By the shunt of the current in the conducting wire 22, power is supplied to the semiconductor cooling device 30. The rectifying device 51 adjusts the current and voltage to match the operating current and voltage of the semiconductor cooling device 30, guaranteeing the stability of the operation of the semiconductor cooling device 30.

[0021] Furthermore, the control unit 50 of the connector is connected to a rectifier device 51 and has a control device 52 for adjusting and controlling the current flowing through the semiconductor cooling device 30 via the rectifier device 51. By adjusting the current of the semiconductor cooling device 30 by the control device 52, the temperature of the cooling part 31 of the semiconductor cooling device 30 is adjusted, and the temperature of the connection part 21 is adjusted. Specifically, one end of the rectifier device 51 is electrically connected to the conducting wire 22, and the other end is electrically connected to the control device 52 and the semiconductor cooling device 30 respectively, thereby supplying power to the control device 52 and the semiconductor cooling device 30.

[0022] As shown in FIG. 3, the connector includes a temperature sensor 53 connected to the control device 52. The temperature sensor 53 is in contact with and connected to the terminal 23 and / or in contact with and connected to the cooling part 31. The temperature of the connector is detected by the temperature sensor 53, and a temperature signal is transmitted to the control device 52. Then, based on the detected temperature, the control device 52 controls the rectifier device 51 to adjust the power supply current of the semiconductor cooling device 30, thereby adjusting the temperature of the cooling part 31 of the semiconductor cooling device 30 and ensuring the stable operating temperature of the connection part 21. For example, when it is detected that the temperature has risen, the control device 52 controls the rectifier device 51 so that the power supply current increases, and speeds up the heat dissipation efficiency to the outside by the semiconductor cooling device 30. On the other hand, when it is detected that the temperature has dropped, the control device 52 controls the rectifier device 51 so that the power supply current decreases, and slows down the heat dissipation efficiency to the outside by the semiconductor cooling device 30. The temperature sensor 53 and the control device 52 cooperate with the rectifier device 51 to adjust the current of the semiconductor cooling device 30, thereby realizing constant temperature of the connector and avoiding the temperature change of the connector caused by the current change in the conducting wire 22. It is preferable that the temperature sensor 53 is in contact with and connected to the connection part 21 to detect the temperature of the connection part 21.

[0023] The control device 52 can adopt a mechanical control device, and the mechanical control device has at least two alloy pieces with different temperature expansion coefficients. After the temperature changes, the alloy pieces are bent and deformed to open and close the contacts, thereby realizing the energization and power cut-off of the mechanical control device. The control device 52 can adopt an electronic control device, and the electronic control device receives the electrical signal of the temperature sensor 53 and performs analysis by a chip to control the energization and power cut-off of the semiconductor cooling device 30.

[0024] The rectifying device 51 can realize continuous and stable power supply by matching the unstable large current in the conducting wire 22 to a stable small current that can be used by the control device 52 and the temperature sensor 53 through a combination of a resistor, a diode, and other electronic elements.

[0025] The temperature sensor 53 may be a contact type temperature sensor. Specifically, it may be a bimetal thermometer, a pressure type thermometer, a resistance thermometer, a thermistor, or a thermocouple. The temperature sensor 53 can convert the real-time temperature of the connection part 21 or the cooling part 31 into an electrical signal and transmit it to the control device 52.

[0026] In one embodiment, a plurality of semiconductor cooling devices 30 are provided. In order to accurately control the temperature of each semiconductor cooling device 30, for the plurality of semiconductor cooling devices 30, the rectifying device 51 is electrically connected in parallel, so that the power supply current of each semiconductor cooling device 30 can be controlled individually.

[0027] Furthermore, when the model numbers and powers of the plurality of semiconductor cooling devices 30 are exactly the same, the plurality of semiconductor cooling devices 30 are electrically connected in series with the rectifying device 51 to make the power supply current of each semiconductor cooling device 30 the same.

[0028] Furthermore, the semiconductor cooling device 30 is fitted into the side wall of the protection structure device 10. The cooling part 31 is located inside the side wall of the protection structure device 10, and at least a part of the surface of the heat dissipation part 32 is exposed outside the protection structure device 10. Thereby, the cooling part 31 of the semiconductor cooling device 30 can contribute to absorbing heat from the terminal 23 and releasing the heat to the outside through the heat dissipation part 32.

[0029] In one embodiment, the heat of the terminal 23 is transferred to the cooling part 31 by radiation. In another embodiment, the cooling part 31 is connected to the terminal 23 to absorb the heat of the terminal.

[0030] As shown in FIGS. 2-5, by contacting and connecting the cooling part 31 to the terminal 23, the heat at the terminal 23 is quickly transferred to the cooling part 31, the heat is quickly released to the outside, the heat generated at the terminal 23 is sufficiently removed, the temperature is lowered, and a rapid temperature drop can be achieved.

[0031] Furthermore, a receiving concave groove 311 is provided in the cooling part 31, and at least a part of the terminal 23 is fitted inside the receiving concave groove 311. The receiving concave groove 311 is formed in a shape along the outer contour shape of the terminal 23. By the terminal 23 contacting the inner wall of the receiving concave groove 311 and making the cooling part 31 and the terminal 23 in close contact, it is advantageous to increase the contact area and transfer the heat of the terminal 23 to the cooling part 31. Preferably, as shown in FIG. 4, the receiving concave groove 311 is semi-cylindrical.

[0032] As shown in FIGS. 6, 7, and 18, the connector includes a heat transfer part 41 that is in contact with and connected to the terminal 23. The cooling part 31 is in contact with and connected to the heat transfer part 41. Heat in the connection part 21 is transmitted to the cooling part 31 through the heat transfer part 41. The heat transfer part 41 is advantageous for maintaining close contact between the terminal 23, the heat transfer part 41, and the cooling part 31. Thereby, the heat generated in the terminal 23 can be quickly transmitted to the cooling part 31, the temperature can be reduced, the heat dissipation performance can be improved, the purpose of rapid temperature reduction can be achieved, and the temperature of the terminal 23 can be kept constant. The heat transfer part 41 may adopt a material that conducts heat but does not conduct electricity. In addition, the heat transfer part 41 may be formed by a method of filling a material that conducts heat but does not conduct electricity between the terminal 23 and the cooling part 31. The material of the heat transfer part 41 may be one or a combination of a plurality of types selected from thermally conductive silicone grease, thermally conductive mica sheet, thermally conductive ceramic sheet, and thermally conductive silicone sheet.

[0033] Furthermore, the heat transfer part 41 surrounds the terminal 23, and the cooling part 31 contacts the terminal 23 through the heat transfer part 41. The heat transfer part 41 may be arranged in a cylindrical shape so as to easily absorb heat generated at different positions of the terminal 23. In some cases, the connector includes a plurality of terminals 23, and for these, a plurality of heat transfer parts 41 may be provided respectively. The heat transfer part 41 is fitted outside the terminal 23 in a one-to-one correspondence with the terminal 23, and a plurality of heat transfer parts 41 are all in contact with and connected to the cooling part 31 of one semiconductor cooling device 30. One heat transfer part 41 may surround a plurality of terminals 23, whereby the heat of the plurality of terminals 23 is transmitted to the cooling part 31 through the heat transfer part 41.

[0034] In an embodiment of the present invention, the connector includes at least two semiconductor cooling devices 30. The at least two semiconductor cooling devices 30 are arranged on both sides of the terminal 23, absorb heat from both sides of the terminal 23, and improve the temperature reduction efficiency. As shown in FIGS. 5 and 7, the two semiconductor cooling devices 30 may be arranged on opposite sides of the terminal 23.

[0035] As shown in FIG. 8, the connector includes a plurality of terminals 23, and conductive wires 22 are respectively connected to the connection portions 21 of each terminal 23. The connector includes a plurality of semiconductor cooling devices 30. The plurality of semiconductor cooling devices 30 include a first cooling device 301 and a second cooling device 302. The first cooling device 301, the plurality of connection portions 21, and the second cooling device 302 are sequentially arranged. In one embodiment, the plurality of terminals 23 are sequentially arranged along the left - right direction. The first cooling device 301 is arranged at the left end, and the second cooling device 302 is arranged at the right end. Further, semiconductor cooling devices 30 are respectively provided above and below the terminals 23.

[0036] In one embodiment, a receiving hole 312 is provided in the cooling portion 31, and the terminal 23 is inserted into the receiving hole 312. By accommodating the terminal 23 in the receiving hole 312, the contact connection between the cooling portion 31 and the terminal 23 is realized, the spatial arrangement method of the terminal 23 and the conductive wire 22 is improved, the contact area is increased, which is advantageous for heat transfer from the terminal 23 to the cooling portion 31. In particular, when the connector includes a plurality of terminals 23 and conductive wires 22, it is easy to be arranged in a small space, and heat dissipation of each terminal 23 can be ensured.

[0037] Furthermore, the semiconductor cooling device 30 includes a plurality of heat - dissipating portions 32, and the plurality of heat - dissipating portions 32 are arranged surrounding the cooling portion 31, which is advantageous for releasing heat to the outside. As shown in FIG. 19, a plurality of receiving holes 312 are provided in the cooling portion 31. The connector includes a plurality of terminals 23, and the terminals 23 are inserted into the receiving holes 312 in a one - to - one correspondence. Preferably, the cooling portion 31 is formed in a square shape as a whole, and the heat - dissipating portions 32 are arranged on the four side surfaces of the cooling portion 31.

[0038] In one embodiment, the cooling part 31 is provided with a plurality of accommodation holes 312, the connector includes a plurality of terminals 23, and the terminals 23 are inserted into the accommodation holes 312 in a one-to-one correspondence. As shown in FIG. 19, the terminals 23 are inserted into the inside of the cooling part 31, and the heat dissipation part 32 is fitted to the outside of the cooling part 31. This is advantageous for sufficient contact between the cooling part 31 and the terminals 23, enabling the heat in the terminals 23 to be efficiently transmitted to the heat dissipation part 32 through the cooling part 31, improving compactness, and facilitating the arrangement of the plurality of terminals 23 and the semiconductor cooling device 30.

[0039] In one embodiment, both the cooling part 31 and the heat dissipation part 32 are cylindrical. As shown in FIG. 20, the terminals 23 are inserted into the inside of the cooling part 31, and the heat dissipation part 32 is fitted to the outside of the cooling part 31. The cylindrical cooling part 31 and heat dissipation part 32 are both easy to process, and moreover, the contact area is large, making it easier to transmit the heat of the terminals 23 to the heat dissipation part. Furthermore, both the cooling part 31 and the heat dissipation part 32 are cylindrical.

[0040] In one embodiment, the terminal 23 has a terminal portion 231 and a connection portion 21. The terminal portion 231 is configured to be connected to an external electrical structure, and the connection portion 21 is configured to be connected to the conducting wire 22. The shape of the connection portion 21 is not limited to one type. For example, as shown in FIG. 9, the initial shape of the connection portion 21 is U-shaped, having a U-shaped groove, and the conducting wire 22 is provided in the U-shaped groove. As shown in FIG. 10, by bending the side wall of the U-shaped groove inward, the conducting wire 22 can be pressed to realize the connection between the terminal 23 and the conducting wire 22. As shown in FIGS. 11-14, the connection portion 21 may be a cylindrical body, and the conducting wire 22 is provided inside the hole of the cylindrical body. As shown in FIGS. 15-17, the connection portion 21 may be plate-shaped, and the conducting wire 22 is arranged on one side of the connection portion 21. The conducting wire 22 and the connection portion 21 may be fixed by welding or crimping. The terminal portion 231 and the connection portion 21 may be of an integral structure or a separate structure, and the two may be fixed by welding. Preferably, the connection portion 21 is used as the connection location between the terminal 23 and the cooling portion 31, whereby it is advantageous for the cooling portion 31 to absorb the heat of the terminal 23.

[0041] Furthermore, the contact area between the cooling portion 31 and the connection portion 21 occupies at least 3% of the surface area of the connection portion 21 to ensure the heat absorption efficiency.

[0042] In order to verify the influence of the ratio range of the contact area between the cooling portion 31 and the connection portion 21 in the surface area of the connection portion 21 on the temperature rise of the terminal 23, the inventor selected 11 sets of conducting wires 22 with the same cross-sectional area, the same material, and the same length, and the same terminals 23, passed the same current, adopted connectors with different ratios of the contact area between the cooling portion 31 and the connection portion 21 in the surface area of the connection portion 21, read the corresponding temperature rise values respectively, and recorded them in Table 1.

[0043] As an experimental method, in a sealed environment, the same current was passed through connectors with different ratios of the contact area between the cooling part 31 and the connection part 21 to the surface area of the connection part 21. The temperature before energization and the temperature when the temperature stabilized after energization were recorded, and the absolute value of the difference between them was taken. In this embodiment, a temperature rise of less than 50 K was set as the pass value.

[0044] Table 1: Influence of the ratio of the contact area between the cooling part 31 and the connection part 21 to the surface area of the connection part 21 on the temperature rise of the connector

Table 1

[0045] As can be seen from Table 1, when the ratio of the contact area between the cooling part 31 and the connection part 21 to the surface area of the connection part 21 was less than 3%, the temperature rise value of the connector was less than the pass value. Since the temperature rise value becomes smaller as the ratio of the connection area increases, the inventor set the ratio of the contact area between the cooling part 31 and the connection part 21 to the surface area of the connection part 21 to at least 3%.

[0046] The wire 22 has an internal conductor 221 and an insulating layer 222 that wraps the conductor 221, and the terminal of the conductor 221 is connected to the terminal 23. The semiconductor cooling device 30 is fixed to the protection structure device 10, the cooling part 31 faces inward, the heat dissipation part 32 faces outward, and the surface of the cooling part 31 is provided on the surface of the protection structure device 10 or outside the protection structure device 10. The external electrical structure may be a harness cable or a terminal that is compatible with the terminal 23.

[0047] In one embodiment of the present invention, as shown in FIG. 21, the semiconductor cooling device 30 has an alumina substrate 1011, a waterproof protection layer 1012, a semiconductor P / N layer 1013, and a power interface 1014.

[0048] The alumina substrate 1011, the waterproof protection layer 1012, and the semiconductor P / N layer 1013 are provided in sequence. The power interface 1014 is electrically connected to the semiconductor P / N layer 1013.

[0049] The alumina substrate 1011 constitutes the heat dissipation part 32 which is the heat dissipation end of the semiconductor cooling device 30. The semiconductor P / N layer 1013 constitutes the cooling part 31 which is the cooling end of the semiconductor cooling device 30.

[0050] In this embodiment, by using the alumina substrate 1011 as the surface of the semiconductor cooling device 30, the thermal conductivity can be improved, the heat conduction speed can be made faster, and the cooling time can be made shorter. Also, it has high strength and can be flexibly connected, can be better attached to the conductor, effectively absorbs the surface stress at the bent part of the conductor, and is less likely to crack during mounting and use. The core part of the semiconductor cooling device 30 employs a P-N junction made of a special semiconductor material. When an electric current flows through a thermocouple formed by joining one N-type semiconductor material and one P-type semiconductor material, heat transfer occurs between both ends, heat moves from one end to the other end, thereby generating a temperature difference and forming a cold and a hot end. That is, cooling control can be realized by controlling the direct current.

[0051] In one embodiment of the present invention, the cooling speed of the semiconductor cooling device 30 is 0.05 K / s - 5 K / s.

[0052] In order to verify the influence of the cooling speed of the semiconductor cooling device 30 on the temperature rise of the connector, the inventor selected 10 conducting wires 22 with the same cross-sectional area, the same material, and the same length, and the same terminals 23, passed the same electric current, cooled the connector using semiconductor cooling devices 30 with different cooling speeds, read the corresponding temperature rise values, and recorded them in Table 2. Table 2: Influence of the semiconductor cooling device 30 with different cooling speeds on the temperature rise of the connector

Table 2

[0053] As an experimental method, in a sealed environment, the same current was passed through connectors with different cooling rates of the semiconductor cooling device 30, the temperature before energization and the temperature when the temperature stabilized after energization were recorded, and the absolute value of the difference between them was taken. In this embodiment, a temperature rise of less than 50 K was set as the passing value.

[0054] As can be seen from Table 2, when the cooling rate of the semiconductor cooling device 30 was less than 0.05 K / s, the temperature rise value of the connector was less than the passing value. The greater the cooling rate of the semiconductor cooling device 30, the smaller the temperature rise value. However, when the cooling rate of the semiconductor cooling device 30 was greater than 5 K / s, due to the influence of the heat generation amount of the connector itself and the power of the semiconductor cooling device 30 itself, the decrease in the temperature rise value was not significant, but since the power of the semiconductor cooling device 30 increased, it was inferior in terms of economy. Therefore, the inventor set the cooling rate of the semiconductor cooling device 30 to 0.05 K / s - 5 K / s.

[0055] In one embodiment of the present invention, the connector includes a heat dissipation device 42 connected to the heat dissipation part 32. Thereby, the heat dissipation effect can be improved, which is advantageous for discharging the heat of the heat dissipation part 32 of the semiconductor cooling device 30 to the outside and ensuring rapid temperature drop. Specifically, the heat dissipation device 42 may be a fan, a heat exchanger, or a liquid cooling device. As shown in FIGS. 3 and 4, the heat dissipation device 42 may be a heat dissipation fin 421, and the heat dissipation fin 421 is preferably made of metal.

[0056] The connector has the following advantages (1)-(5): (1) The cooling time is short. When the temperature of the connection part 21 rises, the temperature of the connection part 21 can be decreased in a short time. (2) The temperature of the connector can be controlled relatively stably, preventing the connection point from being burned out due to overload and reducing safety accidents. (3) By decreasing the temperature of the connection point, it is not necessary to design a larger wire diameter for the cable. When designing the cable, the wire diameter in the heat generation curve at the rated current can be used, and there is no need to consider increasing the wire diameter of the cable to reduce the resistance of the connection part during design, thus the cable diameter can be reduced and the cost of the cable can be decreased. (4) By using this connector, the problem that the temperature of the connection point is too high when the charging current of the electric vehicle increases can be solved, contributing to realizing rapid charging with a large current in the charging harness of the electric vehicle. (5) Other members that require heating can be connected to the heat dissipation part 32 of the semiconductor cooling device 30, improving the utilization rate of energy.

[0057] Embodiment 2 The present invention provides an automobile equipped with the above connector with a semiconductor cooling device. The connector in the automobile has the above structure, function and beneficial effects, and the description thereof is omitted here.

[0058] The above are only exemplary embodiments of the present invention and do not limit the scope of the present invention. Any equivalent changes and modifications made without departing from the concept and principle of the present invention by those skilled in the art shall fall within the protection scope of the present invention.

Explanation of Reference Numerals

[0059] 10 Protection Structure Device 21 Connection Part 22 Conductive Wire 23 Terminal 30 Semiconductor Cooling Device 31 Cooling Part 32 Heat Dissipation Part 41 Heat Transfer Part 42 Heat Dissipation Device 50 Control Unit 51 Rectifying Device 52 Control device 53 Temperature sensor 54 Connection wire 221 Conductor 222 Insulation layer 231 Terminal part 301 First cooling device 302 Second cooling device 311 Accommodation concave groove 312 Accommodation hole 421 Heat dissipation fin 1011 Alumina substrate 1012 Waterproof protection layer 1013 Semiconductor P / N layer 1014 Power interface

Claims

1. A conductor, a terminal configured such that one end is connected to the conductor and the other end is connected to an external electrical structure, and a semiconductor cooling device, wherein the semiconductor cooling device has a cooling part that absorbs heat from the terminal and a heat dissipation part, the semiconductor cooling device includes a plurality of the heat dissipation parts, and the plurality of the heat dissipation parts are arranged to surround the cooling part A connector with a semiconductor cooling device.

2. A conductor, a terminal configured such that one end is connected to the conductor and the other end is connected to an external electrical structure, and a semiconductor cooling device, wherein the semiconductor cooling device has a cooling part that absorbs heat from the terminal and a heat dissipation part, both the cooling part and the heat dissipation part are cylindrical, the terminal is inserted into the interior of the cooling part, and the heat dissipation part is fitted onto the outside of the cooling part A connector with a semiconductor cooling device.

3. The semiconductor cooling device is electrically connected to the conductor, The connector according to claim 1 or 2.

4. Comprising a protection structure device, wherein the terminal is provided inside the protection structure device The connector according to claim 1 or 2.

5. Comprising a rectifying device having one end electrically connected to the semiconductor cooling device and the other end electrically connected to the conductor The connector according to claim 1 or 2.

6. Comprising a control device connected to the rectifying device for regulating and controlling the current flowing through the semiconductor cooling device via the rectifying device The connector according to claim 5.

7. Comprising a temperature sensor connected to the control device, wherein the temperature sensor is in contact with and connected to the terminal and / or is in contact with and connected to the cooling part The connector according to claim 6.

8. A plurality of the semiconductor cooling devices are provided, and the plurality of the semiconductor cooling devices are electrically connected to the rectifying device The connector according to claim 5.

9. The semiconductor cooling device is fitted into the side wall of the protection structure device, the cooling part is located inside the side wall of the protection structure device, and at least a part of the surface of the heat dissipation part is exposed outside the protection structure device The connector according to claim 4.

10. The cooling part is in contact with and connected to the terminal The connector according to claim 1 or 2.

11. The heat of the terminal is transferred to the cooling part by radiation The connector according to claim 1 or 2.

12. A receiving concave groove is provided in the cooling part At least a part of the terminal is fitted inside the accommodating concave groove. The connector according to claim 1.

13. It includes a heat transfer part that is in contact with and connected to the terminal. The cooling part is in contact with and connected to the heat transfer part. The material of the heat transfer part is one or a combination of a plurality of types among thermally conductive silicone grease, thermally conductive mica sheet, thermally conductive ceramic sheet, and thermally conductive silicone sheet. There is. The connector according to claim 1 or 2.

14. The heat transfer part surrounds the terminal. The connector according to claim 13.

15. It includes at least two of the semiconductor cooling devices arranged on both sides of the terminal. The connector according to claim 1.

16. The cooling part is provided with an accommodating hole through which the terminal is inserted. The connector according to claim 2.

17. The cooling part is provided with a plurality of the accommodating holes. The connector includes a plurality of the terminals. The terminals are inserted one-to-one corresponding to the accommodating holes. The connector according to claim 16.

18. Both the cooling part and the heat dissipation part are cylindrical. The connector according to claim 2.

19. The terminal has a terminal part and a connection part for connecting to the conducting wire. The cooling part is connected to the connection part. The connector according to claim 1 or 2.

20. The contact area between the cooling part and the connection part occupies at least 3% of the area of the entire surface of the connection part. The connector according to claim 19.

21. The semiconductor cooling device has an alumina substrate, a waterproof protective layer, a semiconductor P / N layer, and a power interface. The alumina substrate, the waterproof protective layer, and the semiconductor P / N layer are provided in sequence. The power interface is electrically connected to the semiconductor P / N layer. The connector according to claim 1 or 2.

22. The cooling rate of the semiconductor cooling device is 0.05 K / s - 5 K / s. The connector according to claim 21.

23. It includes a heat dissipation device connected to the heat dissipation part. The connector according to claim 1 or 2.

24. An automobile equipped with the connector with a semiconductor cooling device according to claim 1 or 2.

Images