Photocatalytic air treatment

Abstract

To provide a photocatalytic reactor configured to receive one or more airborne contaminants.SOLUTION: The photocatalytic reactor includes a photo-catalyst 2004 for photocatalytic degradation of one or more of the contaminants disposed on a substrate, and a light-emitting diode circuit board comprising a circuit board with one or more first light-emitting diodes 2009 mounted on a first side 2006 and one or more second light-emitting diodes 2010 mounted on a second side 2007. The substrate 2003 is arranged to be illuminated by both the one or more first light-emitting diodes and the one or more second light-emitting diodes in order to facilitate photocatalytic degradation.SELECTED DRAWING: Figure 2B

Description

[Technical field]

[0001] The present invention relates to a photocatalytic reactor for treating an air stream and an air treatment system comprising a photocatalytic reactor. Regarding the device. [Background technology]

[0002] Air treatment devices treat the air to remove contaminants. Conventional air treatment devices are large, High-efficiency particulate filters are used alone to physically capture airborne particles by excluding them. Air (HEPA) filters remove at least 99.97% of 0.3 μm particles Some air treatment systems use activated carbon filters to filter out volatile chemicals from the air. When used to purify air, activated carbon removes pollutants by adsorption, so there is a limited As a result, activated carbon filters have a limited removal capacity and therefore need to be replaced if they are to maintain filtration performance. Rather than capturing pollutants, technologies such as photocatalytic oxidation (PCO) are needed to Photocatalytic oxidation can be used to destroy certain air pollutants. To oxidize air pollutants into less harmful compounds, e.g., volatile organic compounds (VO C) to carbon dioxide and water. This reaction occurs by the absorption of a photon The reaction is catalyzed by a catalytic surface that is activated by the Reactive substances other than contaminants provide the hydrogen and oxygen atoms necessary for progression. No chemicals are consumed. Summary of the Invention

[0003] According to a first aspect of the present invention, a light source configured to receive one or more airborne contaminants is provided. A catalytic reactor is provided. The photocatalytic reactor is disposed on a substrate and photocatalytically decomposes one or more contaminants with light a photocatalyst for photocatalytically decomposing, and a circuit board having one or more first light-emitting diodes attached to a first side and one or more second light-emitting diodes attached to a second side. The substrate is disposed so as to be illuminated by both one or more first light-emitting diodes and one or more second light-emitting diodes in order to promote photocatalytic decomposition.

[0004] The substrate may be disposed so as to block the light-emitting diode circuit board. The substrate may be disposed so that the light emitted from the light-emitting diode circuit board collides with the substrate. The substrate may be disposed so as to surround the light-emitting diode circuit board. The light-emitting diode circuit board may be disposed concentrically within the substrate.

[0005] The photocatalytic reactor includes an air inlet and an air outlet, and may be disposed so that an air flow passing between the air inlet and the air outlet contacts the photocatalyst.

[0006] The circuit board may include either a double-sided circuit board or a multilayer circuit board. The substrate may include a surface. The substrate may include a surface and one or more protrusions or projections extending from the surface toward the light-emitting diode circuit board.

[0007] According to a second aspect of the present invention, an air treatment apparatus including the photocatalytic reactor according to the first aspect is provided.

[0008] According to a third aspect of the present invention, a photocatalytic reactor disposed to receive one or more airborne contaminants is provided. The photocatalytic reactor is disposed on a substrate and photocatalytically decomposes one or more of the contaminants with light. ​​​​​​​​​​A photocatalyst for catalytic decomposition, and one or more light sources for irradiating the photocatalyst to promote catalytic decomposition, and at least two layers of a transmissive material disposed between the one or more light sources and separating the one or more light sources, are provided.

[0009] The at least two layers of transmissive material may comprise a first layer of transmissive material separated from the transmissive material of the second layer by a gap. The transmissive material may be impermeable to air. The at least two layers of transmissive material may separate the photocatalytic reactor into a first part containing the photocatalyst and a second part containing the one or more light sources. The first part may be arranged to receive an air stream containing one or more air pollutants, and the second part may be arranged to receive an air stream that contacts the one or more light sources to provide air cooling. The one or more light sources may comprise one or more light emitting diodes, and preferably comprise one or more light emitting diodes mounted on a circuit board.

[0010] The at least two layers of transmissive material may be arranged concentrically around the one or more light sources and may comprise at least two conduits separating the one or more light sources from the photocatalyst, with at least a part of each conduit comprising a transmissive material. One or more of the at least two conduits may comprise a conduit of transmissive material.

[0011] According to a fourth aspect of the present invention, an air treatment apparatus comprising a photocatalytic reactor according to the third aspect is provided.

[0012] According to a fifth aspect of the present invention, an air treatment apparatus comprising a photocatalytic reactor arranged to receive one or more air pollutants is provided. The photocatalytic reactor is arranged on a substrate and has a photocatalyst for photocatalytically decomposing one or more pollutants, and one or more first light emitting diodes ​​​​​​​​ mounted on the first side, with one or more second light-emitting diodes mounted on the second side A light-emitting diode circuit board including a circuit board, and is provided with. The substrate is by both one or more first light-emitting diodes and one or more second light-emitting diodes so as to be illuminated arranged. The photocatalytic reactor is arranged between the light-emitting diode circuit board and the photocatalyst, and further includes at least two layers of transmissive materials that separate the light-emitting diode circuit board from the photocatalyst .

[0013] According to a sixth aspect of the present invention, an air treatment device including the photocatalytic reactor according to the fifth aspect is provided.

[0014] Of course, it should be understood that the features described in connection with one aspect of the present invention can be incorporated into other aspects of the present invention .

Brief Description of the Drawings

[0015]

Figure 1A

Figure 1B

Figure 2A

Figure 2B

Figure 3A

Figure 3B

Figure 4

Figure 5A

Figure 5B

DETAILED DESCRIPTION OF THE INVENTION

[0016] Here, an example of an improved photocatalytic reactor will be described with reference to FIGS. 1A and 1B as mere examples. The photocatalytic reactor is generally designated by reference numeral 1000. The photocatalytic reactor 1000 is arranged to receive an air flow containing one or more air pollutants, and includes a reaction chamber 10 01 and a photocatalyst 1004 for photocatalytic decomposition of one or more pollutants. The photocatalyst 1004 is disposed on a substrate 1003 provided by the reaction chamber 1001. The photocatalytic reactor 1000 further includes a light emitting diode printed circuit board ("LED PCB") 1012 having a plurality of light emitting diodes 1009 attached to a first side surface 1006 of a printed circuit board 1008. The photocatalytic reactor 1 000 is arranged such that the substrate 1003 is illuminated by the light emitting diodes 1009 to promote photocatalytic decomposition. In particular, the substrate 1003 is arranged to block the LED PCB 1012 so that the light emitted from the light emitting diodes 1009 of the LED PCB 1012 impinges on the substrate 1003. 000. Specifically, the substrate 1003 is arranged to block the LED PCB 1012 so that the light emitted from the light emitting diodes 1009 of the LED PCB 1012 collides with the substrate 1003.

[0017] In the example shown in FIGS. 1A and 1B, the photocatalytic reactor 1000 includes an elongated reaction chamber 1 001 surrounding an elongated LED PCB 1012 extending along the length of the reaction chamber 1001. The reaction chamber 1001 has a reaction chamber inlet (not shown) at a first end of the reaction chamber 1001 and a reaction chamber outlet (not shown) at a second end of the reaction chamber 1001. The air flow passing between the reaction chamber inlet and the reaction chamber outlet is the substrate 001. The reaction chamber 1001 includes a reaction chamber inlet (not shown) at a first end of the reaction chamber 1001 and a reaction chamber outlet (not shown) at a second end of the reaction chamber 1001. The air flow passing between the reaction chamber inlet and the reaction chamber outlet passes through the substrate ​​​ It contacts the photocatalyst 1004 disposed on 1003. Next, the partition / wall 1005A, 10 05B separates the reaction chamber of the photocatalyst 1004 from the LED PCB 1012, and at least a part of the partition 1 005A, 1005B is permeable to the radiation emitted by the light-emitting diode 1009, so that the photocatalyst 1004 can be illuminated by the light-emitting diode 1009. Next, the plurality of light-emitting diodes 1009 of the LED PCB 1012 are spaced apart and longitudinally aligned along the first side surface 1006 of the length of the LED PCB 1012, and thereby provide a light source along the entire length of the photocatalytic reactor 1000. In the example shown in FIGS. 1A and 1B, the substrate 1003 of the reaction chamber 1001 has a plurality of protrusions, and these plurality of protrusions are provided by the fins 1011A, 1011B and extend inwardly away from the inner surface of the reaction chamber 1001, and the photocatalyst 1004 is disposed on at least one surface of each of the fins 101 1A, 1011B. These fins 1011A, 1 011B provide a high surface area for the photocatalytic decomposition of pollutants. Each fin 1011A

[0018] In the example shown in FIGS. 1A and 1B, the substrate 1003 of the reaction chamber 1001 has a plurality of protrusions, and these plurality of protrusions are provided by the fins 1011A, 1011B and extend inwardly away from the inner surface of the reaction chamber 1001, and the photocatalyst 1004 is disposed on at least one surface of each of the fins 101 1A, 1011B. These fins 1011A, 1 011B provide a high surface area for the photocatalytic decomposition of pollutants. Each fin 1011A 1A, 1011B is elongated and has a length L along the length of the elongated reaction chamber 1001 and a height H defined by how far the fins 1011A, 1011B extend inwardly away from the respective inner surfaces of the reaction chamber 1001. Therefore, the fins 1011 A, 1011B are in an elongated shape, and the longitudinal axis of each fin 1011A, 1011B is perpendicular to the optical axis of the light-emitting diode 1009. Therefore, the fins 1011A, 1 011B are for the flow of air from the air inlet to the air outlet along the length of the reaction chamber 1001. In the example shown in FIGS. 1A and 1B, the substrate 1003 of the reaction chamber 1001 has a plurality of protrusions, and these plurality of protrusions are provided by the fins 1011A, 1011B and extend inwardly away from the inner surface of the reaction chamber 1001, and the photocatalyst 1004 is disposed on at least one surface of each of the fins 101 1A, 1011B. These fins 1011A, 1011B provide a high surface area for the photocatalytic decomposition of pollutants. Each fin 1011A A, 1011B are in an elongated shape, and the longitudinal axis of each fin 1011A, 1011B is perpendicular to the optical axis of the light-emitting diode 1009. Therefore, the fins 1011A, 1 011B are for the flow of air from the air inlet to the air outlet along the length of the reaction chamber 1001. In the example shown in FIGS. 1A and 1B, the substrate 1003 of the reaction chamber 1001 has a plurality of protrusions, and these plurality of protrusions are provided by the fins 1011A, 1011B and extend inwardly away from the inner surface of the reaction chamber 1001, and the photocatalyst 1004 is disposed on at least one surface of each of the fins 101 Define a channel 1002 that extends along between fins 1011A and 1011B. As shown in the figure In the example shown, each fin 1011A, 1011B has a cross-section that is partially curved along its height (i.e., the profile of the fin). However, in another arrangement, each fin 1011A 、1011B may have a straight cross-section.

[0019] Fins 1011A, 1011B comprise a first set of fin groups 1011A and a second set of fin groups 1011B, and the photocatalyst 1004 is disposed on each fin. The first set of fin groups 1011A and the second set of fin groups 1011B are arranged such that light from the light-emitting diode 1009 illuminates at least a part of the length of the surface 1013 of each fin 1011A, 1011B along the entire height of the surface 1013. In other words, each light-emitting diode 1009 illuminates the entire height of at least one surface 1013 of each fin 1011A, 1011B without being affected by the shadow from adjacent fins. That said, in order to illuminate the entire length of fins 1011A 、1011B, a plurality of light-emitting diodes (e.g., a plurality of light-emitting diodes distributed longitudinally ) 1009 may be required. The light-emitting diodes 1009 are distributed to illuminate different but overlapping portions of the length of at least one surface 1013 of each fin 1011A, 1011B respectively. In the example shown in FIGS. 1A and 1B, each of the first set of fin groups 1011A has a line (e.g.,

[0020] a line that extends from the base end 1015 of the fin 1011A through the tip 1016 of the fin, for example, a line that extends along the height of the fin and is similar to the chord line) that converges at a first convergence point or intersection point through the tip 1016 of the fin from the base end 1015 of the fin 1011A (e.g., a line that extends along the height of the fin and is similar to the chord line) that converges at a first convergence point or intersection point along the height of the fin and is similar to the chord line) that converges at a first convergence point or intersection point ​It is arranged to face F1. Then, each of the second set of fin groups 1011B is arranged such that a line extending from the base end 1015 of the fin 1011B through the tip 1016 of the fin 1011B is directed towards the second convergence point F2. The first convergence point F1, unlike the second convergence point F2, is offset with respect to the position of the light-emitting diode 1009, and both the first convergence point F1 and the second convergence point F2 are offset with respect to the position of the light-emitting diode 1009. The first set of fin groups 1011A extends inwardly from the first inner surface 1018A of the reaction chamber 1001, and the second set of fin groups 1011B extends inwardly from the second inner surface 1018B of the reaction chamber 1001. The first inner surface 1018A and the second inner surface 1018B generally face the light-emitting diode 1009. The first inner surface 1018A and the second inner surface 1018B are symmetrically arranged around the optical axis O of the light-emitting diode. As a result, the first set of fin groups 1011A is arranged to be illuminated by the first half of each light-emitting diode 1009, and the second set of fin groups 1011B is arranged to be illuminated by the second half of each light-emitting diode 1009. In the examples shown in FIGS. 1A and 1B, the photocatalyst 1004 is also arranged on both the first inner surface 1018A and the second inner surface 1018B of the reaction chamber 1001. The first inner surface 1018A and the second inner surface 1018B have separate arc-shaped contours (i.e., their cross-sections are curved segments with different foci), and the contour of the first inner surface 1018A is a mirror image of the contour of the second inner surface 1018B. In other words, the first inner surface is offset with respect to the position of the light-emitting diode 1009.

[0021] The first set of fin groups 1011A extends inwardly from the first inner surface 1018A of the reaction chamber 1001 The second set of fin groups 1011B extends inwardly from the second inner surface 1018B of the reaction chamber 1001. The first inner surface 1018A and the second inner surface 1018B generally face the light-emitting diode 1009. The first inner surface 1018A and the second inner surface 1018B are symmetrically arranged around the optical axis O of the light-emitting diode. As a result, the first set of fin groups 1011A is arranged to be illuminated by the first half of each light-emitting diode 1009, and the second set of fin groups 1011B is arranged to be illuminated by the second half of each light-emitting diode 1009. In the examples shown in FIGS. 1A and 1B, the photocatalyst 1004 is also arranged on both the first inner surface 1018A and the second inner surface 1018B of the reaction chamber 1001. The first inner surface 1018A and the second inner surface 1018B have separate arc-shaped contours (i.e., their cross-sections are curved segments with different foci), and the contour of the first inner surface 1018A is a mirror image of the contour of the second inner surface 1018B. In other words, the first inner surface The first inner surface 1018A and the second inner surface 1018B generally face the light-emitting diode 1009. The first inner surface 1018A and the second inner surface 1018B are symmetrically arranged around the optical axis O of the light-emitting diode. As a result, the first set of fin groups 1011A is arranged to be illuminated by the first half of each light-emitting diode 1009, and the second set of fin groups 1011B is arranged to be illuminated by the second half of each light-emitting diode 1009. In the examples shown in FIGS. 1A and 1B, the photocatalyst 1004 is also arranged on both the first inner surface 1018A and the second inner surface 1018B of the reaction chamber 1001. The first inner surface 1018A and the second inner surface 1018B are symmetrically arranged around the optical axis O of the light-emitting diode, and as a result, the first set of fin groups 1011A is arranged to be illuminated by the first half of each light-emitting diode 1009, and the second set of fin groups 1011B is arranged to be illuminated by the second half of each light-emitting diode 1009. In the examples shown in FIGS. 1A and 1B, the photocatalyst 1004 is also arranged on both the first inner surface 1018A and the second inner surface 1018B of the reaction chamber 1001. The first set of fin groups 1011A is arranged to be illuminated by the first half of each light-emitting diode 1009, and the second set of fin groups 1011B is arranged to be illuminated by the second half of each light-emitting diode 1009. In the examples shown in FIGS. 1A and 1B, the photocatalyst 1004 is also arranged on both the first inner surface 1018A and the second inner surface 1018B of the reaction chamber 1001. The second set of fin groups 1011B is arranged to be illuminated by the second half of each light-emitting diode 1009. In the examples shown in FIGS. 1A and 1B, the photocatalyst 1004 is also arranged on both the first inner surface 1018A and the second inner surface 1018B of the reaction chamber 1001. The second set of fin groups 1011B is arranged to be illuminated by the second half of each light-emitting diode 1009. In the examples shown in FIGS. 1A and 1B, the photocatalyst 1004 is also arranged on both the first inner surface 1018A and the second inner surface 1018B of the reaction chamber 1001. In the examples shown in FIGS. 1A and 1B, the photocatalyst 1004 is also arranged on both the first inner surface 1018A and the second inner surface 1018B of the reaction chamber 1001. In the examples shown in FIGS. 1A and 1B, the photocatalyst 1004 is also arranged on both the first inner surface 1018A and the second inner surface 1018B of the reaction chamber 1001.

[0022] The first inner surface 1018A and the second inner surface 1018B have separate arc-shaped contours (i.e., their cross-sections are curved segments with different foci), and the contour of the first inner surface 1018A is a mirror image of the contour of the second inner surface 1018B. In other words, the first inner surface The first inner surface 1018A and the second inner surface 1018B have separate arc-shaped contours (i.e., their cross-sections are curved segments with different foci), and the contour of the first inner surface 1018A is a mirror image of the contour of the second inner surface 1018B. In other words, the first inner surface The first inner surface 1018A and the second inner surface 1018B have separate arc-shaped contours (i.e., their cross-sections are curved segments with different foci), and the contour of the first inner surface 1018A is a mirror image of the contour of the second inner surface 1018B. In other words, the first inner surface The first inner surface 1018A and the second inner surface 1018B are reflections of each other, and as a result, they together have mirror / reflection symmetry. The first inner surface 1018A and the second inner surface 1018B can each have either an arcuate contour or a parabolic contour.

[0023] In the examples shown in FIGS. 1A and 1B, the partition walls 1005A, 1005B are provided with two layers of transmissive material disposed between the light-emitting diode 1009 and the photocatalyst 1004 and separating them. These two layers of transmissive material include a first layer of transmissive material 1005A separated from the second layer of transmissive material 1005B by a gap. These layers of transmissive material 1005A, 1005B are impermeable to air and permeable to the radiation emitted by the light-emitting diode 1009. In the examples shown in FIGS. 1A and 1B, the two layers of transmissive material 1005A, 1005B are tubular and are disposed concentrically around the LED PCB 1012, and the innermost of these tubes is positioned such that the LED PCB 1012 is located therein and an air flow can pass through a conduit provided to be arranged so as to cool the light-emitting diode 1009. By providing a double-layer partition wall between the light-emitting diode 1009 and the photocatalyst 1004, the heat loss between the first portion 1019 of the reaction chamber 1001 arranged to receive an air flow containing contaminants and the second portion 1020 housing the LED PCB 1012 is reduced, thereby improving the energy efficiency. This reduction in heat loss is particularly beneficial when actively cooling the light-emitting diode 1009. 1009. is provided.

[0024] By providing a double-layer partition wall between the light-emitting diode 1009 and the photocatalyst 1004, the heat loss between the first portion 1019 of the reaction chamber 1001 arranged to receive an air flow containing contaminants and the second portion 1020 housing the LED PCB 1012 is reduced, thereby improving the energy efficiency. This reduction in heat loss is particularly beneficial when actively cooling the light-emitting diode 1009. 1009.

[0025] Figures 2A and 2B show further examples of an improved photocatalytic reactor. The photocatalytic reactor is generally indicated by reference numeral 2000. The photocatalytic reactor 2000 includes a reaction chamber 2001 arranged to receive an air stream containing one or more airborne pollutants, and a photocatalyst 2004 for photocatalytically decomposing one or more pollutants. The photocatalyst 2004 is disposed on a substrate 2003 provided by the reaction chamber 2001. The photocatalytic reactor 2000 is very similar to that described above with reference to FIGS. 1A and 1B, and therefore, corresponding reference numerals are used for similar or corresponding parts or features of these embodiments. In particular, the photocatalytic reactor 2000 includes an elongated reaction chamber 2001 surrounding an elongated LED PCB 2012 extending along the length of the reaction chamber 2001. The reaction chamber 2 001 includes a reaction chamber inlet (not shown) at a first end of the reaction chamber 2001 and a reaction chamber outlet (not shown) at a second end of the reaction chamber 2001. The air stream passing between the reaction chamber inlet and the reaction chamber outlet contacts the photocatalyst 2 004 disposed on the substrate 2003. Next, a partition / barrier 2005 separates the reaction chamber 2001 from the LED PCB 2012, and at least a portion of this partition 2005 is transparent to the radiation emitted by the light-emitting diodes 200

[0026] In the example shown in FIGS. 2A and 2B, the LED PCB 2012 has two sides. Thus, the LED PCB 2012 is attached to a first side surface 2006 of the printed circuit board A plurality of first light-emitting diodes 2009 obtained and on the second side 2007 of the printed circuit board A printed circuit board 200 having a plurality of second light-emitting diodes 2010 attached thereto 8 is provided. Therefore, the LED PCB 2012 comprises either a double-sided circuit board or a multi-layer circuit board The first light-emitting diodes 2009 of the LED PCB 2012 are spaced apart and are longitudinally aligned along the first side 2006 of the length of the LED PCB 2012, and the first The second light-emitting diodes 2010 are spaced apart and are longitudinally aligned along the second side 2 007 of the length of the LED PCB 2012, thereby providing a light source along the entire length of the photocatalytic reactor 2000 to provide.

[0027] Next, in order to promote photocatalytic decomposition, the substrate 2003 is irradiated by both the first light-emitting diodes 2009 and the second light-emitting diodes 2010, and the photocatalytic reactor 20 00 is arranged. In particular, the substrate 2003 is arranged so as to block the LED PCB 2012 and the light emitted from the light-emitting diodes 2009 and 2010 of the LED PCB 2012 collides with the substrate 2003. For this purpose, the substrate 2003 is arranged so as to surround the LED PCB 2012 is arranged.

[0028] In the example shown in FIGS. 2A and 2B, the reaction chamber 2001 of the photocatalytic reactor 2000 also has two sides. Therefore, the reaction chamber 2001 comprises a first side 2001A and a second side 2001B, and the first side 2001A is arranged to be illuminated by the first side 2006 of the printed circuit board 2008 and the first light-emitting diodes 20 09 provided on the second side 2001B, and the second side 200 of the printed circuit board 2008 0 is arranged to be illuminated by the first light-emitting diodes 2009 provided on the second side 2007 of the printed circuit board 2008 It is arranged to be illuminated by the second light-emitting diode 2010 provided at 7.

[0029] By providing a double-sided photocatalytic reactor, the length of the reactor can be shortened without sacrificing the overall volume. This is particularly important when integrating the photocatalytic reactor into a household air treatment device, and it reduces the cost of materials, especially the costs associated with the partition walls 2005A, 2005B and the printed circuit board 2008.

[0030] Next, the first side 2001A and the second side 2001B of the reaction chamber 2001 each replicate the finned arrangement of the reaction chamber 1001 shown in FIGS. 1A and 1B. Specifically, the first side 2001A of the reaction chamber 2001 includes a first set of fin groups 2011A and a second set of fin groups 2011B, and the second side 2001B of the reaction chamber 2001 includes a third set of fin groups 2011C and a fourth set of fin groups 2011D. The photocatalyst 2004 is disposed on at least one surface 2013 of each fin 2011. The first set of fin groups 2011A and the second set of fin groups 2001B are arranged such that the light from the first light-emitting diode 2009 illuminates at least a part of the length of the surface 2013 of each fin 2011A, 2011B along the entire height of the surface 2013. Next, the third set of fin groups 2011C and the fourth set of fin groups 2011D are arranged such that the light from the second light-emitting diode 2010 illuminates at least a part of the length of the surface 2013 of each fin 2011C, 2011D along the entire height of the surface 2013.

[0031] On the first side 2001A of the reaction chamber 2001, the first set of fin groups 2011 Each of A extends from the base end 2015 of the fin 2011A through the tip 2016 of the fin The line (for example, the line extending along the height of the fin and similar to the chord line) extending through is directed towards the first convergence point or intersection point F1. Then, each of the second set of fin groups 2 011B is arranged such that the line extending from the base end 2015 of the fin 2011B through the tip 201 6 of the fin 2011B is directed towards the second convergence point F2. The first convergence point F1 is different from the second convergence point F2, and both the first convergence point F1 and the second convergence point F2 are offset with respect to the position of the first light-emitting diode 2009.

[0032] Correspondingly, on the second side 2001B of the reaction chamber 2001, each of the third set of fin groups 2011C is arranged such that the line extending from the base end 2015 of the fin 2011C through the tip 2016 of the fin is directed towards the third convergence point or intersection point F3. Next, each of the fourth set of fin groups 2011D is arranged such that the line extending from the base end 2015 of the fin 2011D through the tip 2016 of the fin 2011D is directed towards the fourth convergence point F4 . The third convergence point F3 is different from the fourth convergence point F4, and both the third convergence point F3 and the fourth convergence point F4 are offset with respect to the position of the second light-emitting diode 2010. Set off.

[0033] The first set of fin groups 2011A extends inwards from the first inner surface 2018A on the first side 2001A of the reaction chamber 2001 , and the second set of fin groups 2011B extends inwards from the second inner surface 2018B on the first side 2001B of the reaction chamber 2001 and extends inwards from the second inner surface 2018B on the first side 2001B of the reaction chamber 2001​ and the first inner surface 2018A and the second inner surface 2018B generally face the first light emitting diode 2009. The third set of fin groups 2011C extends inwardly from the third inner surface 2018C on the second side surface 2001B of the reaction chamber 2001, and the fourth set of fin groups 2011D extends inwardly from the fourth inner surface 2018D on the second side surface 2001B of the reaction chamber 2001. The third inner surface 2018C and the fourth inner surface 2018D generally face the second light emitting diode 2010. As can be seen from FIGS. 2A and 2B, the LED PCB 2012 is located at the center within the space volume defined by the substrate 2003. Then, the partition wall 2005 is disposed between the light emitting diodes 2 009, 2010 and the photocatalyst 2004 and comprises a single layer of transmissive material that separates them. This layer of transmissive material is impermeable to air and transmits the radiation emitted by the light emitting diodes 2009

[0034] , 2010. In the example shown in FIGS. 2A and 2B, the single layer of transmissive material 2005 is tubular and is disposed concentrically around the LED PCB 3012. The tube of this transmissive material 2005 has the LED PCB 1012 located therein and provides a conduit through which an air flow can pass for cooling the light emitting diodes 2009 , 2010. Those skilled in the art will understand that it is possible to combine the important features of the photocatalytic reactors of FIGS. 1A, 1B, 2A and 2B. Accordingly, a further example of an improved photocatalytic reactor will now be described with reference to FIGS. 3A and 3B. The photocatalytic reactor generally has reference numerals

[0035]

[0035] ​​​is indicated by reference numeral 3000. The photocatalytic reactor 3000 receives an air stream containing one or more air pollutants and includes a reaction chamber 3001 arranged to receive the air stream and a photocatalyst 3004 for photocatalytically decomposing the one or more pollutants. The photocatalyst 3004 is disposed on a substrate 3003 provided by the reaction chamber 3001. The photocatalytic reactor 3000 is very similar to that described above with reference to FIGS. 2A and 2B, and accordingly, corresponding reference numerals are used for similar or corresponding parts or features of these embodiments. In particular, the photocatalytic reactor 3000 includes an elongated reaction chamber 3001 surrounding an elongated LED PCB 3012 extending along the length of the reaction chamber 3001. The reaction chamber 3001 has a reaction chamber inlet (not shown) at a first end of the reaction chamber 3001 and a reaction chamber outlet (not shown) at a second end of the reaction chamber 3001, and the air stream passing between the reaction chamber inlet and the reaction chamber outlet contacts the photocatalyst 3004 disposed on the substrate 3003. Next, the partition walls / barriers 3005A, 3005B separate the reaction chamber 3001 from the LED PCB 3012, and at least a portion of these partition walls 3005A, 3005B is permeable to the radiation emitted by the light emitting

[0036] diodes 3009, 3010, so that the photocatalyst 3004 can be illuminated by the light emitting diodes 3009, 3010. In the example shown in FIGS. 3A and 3B, both the LED PCB 3012 and the reaction chamber 3001 have two sides. However, unlike the example shown in The two layers of transparent material are separated by a gap from the second layer. A first layer of transparent material 3005A separated from a first layer of transparent material 3005B. The transparent materials 3005A and 3005B are impermeable to air, and the light emitting diodes 3 3A and 3B. In the example shown, the two layers of transparent material 3005A, 3005B are tubular and the LED P Arranged concentrically around the CB3012, the innermost of these tubes contains the LEDs The PCB 3012 is located and airflow is provided to cool the light emitting diodes 3009 and 3010. A conduit is provided that is positioned to allow passage therethrough.

[0037] A further example of an improved photocatalytic reactor is described with reference to Figure 4. The photocatalytic reactor comprises: The photocatalytic reactor 400 is generally designated by reference numeral 4000 and is shown in cross section in FIG. 0 has three counters arranged to receive an air stream containing one or more airborne contaminants, Reaction chambers 4001, 4101, 4201 and a photocatalytic decomposition system for one or more pollutants and a photocatalyst 4004, the photocatalyst 4004 being provided in the reaction chambers 4001, 4101, 4 201. The photocatalytic reactor 4000 is disposed on a substrate 4003 provided by each of the photocatalytic reactors 201. , a light emitting diode printed circuit within each of the reaction chambers 4012, 4112, 4212 The LEDs further include substrates ("LED PCBs") 4012, 4112, and 4212. PCBs 4012, 4112, and 4212 are attached to a first side of the printed circuit board 4008. The light emitting device includes a printed circuit board 4008 having a plurality of light emitting diodes 4009 attached thereto. The photocatalytic reactor 4000 includes reaction chambers 4001, 410 for facilitating photocatalytic decomposition. 1. The substrate 4003 provided by each of 4201 is disposed corresponding to the LED PCB 401 2. It is arranged to be illuminated by the light emitting diodes 4009 of 4112 and 4212 . In particular, the substrate 40 03 provided by each of the reaction chambers 4012, 4112, and 4212 is disposed to block the corresponding LED PCBs 4012, 4112, and 4212, and the light emitted from the light emitting diodes 4009 of the LED PCBs 4012, 4112, and 4212 impinges on the substrate 4003.

[0038] In the example shown in FIG. 4, each of the reaction chambers 4001, 4101, and 4201 is elongated and surrounds respective elongated LED PCBs 4012, 4112, and 4212 that extend along the length of the reaction chambers 4001, 4101, and 4201. Each of the reaction chambers 4001, 41 01, and 4201 has a reaction chamber inlet (not shown) at a first end of the reaction chamber and a reaction chamber outlet (not shown) at a second end of the reaction chamber, and the air flow passing between the reaction chamber inlet and the reaction chamber outlet contacts the photocatalyst 400 4 disposed on the substrate 4003. Next, the partition / barrier 4005 separates the photocatalyst 4004 from each of the LED PCBs 40 12, 4112, and 4212, and at least a portion of the partition 4005 is transparent to the radiation emitted by the light emitting diodes 4009, and the photocatalyst 4004 can be illuminated by the light emitting diodes 4009. Next, the plurality of light emitting diodes 4009 of each of the LED PCBs 4012, 4112, and 4212 are spaced apart and longitudinally aligned along a first side of the length of the printed circuit board 4008, thereby providing a light source along the entire length of each of the reaction chambers 4001 , 4101, and 4201. 4212. The plurality of light emitting diodes 4009 of each of the LED PCBs 4012, 4112, and 4212 are spaced apart and longitudinally aligned along a first side of the length of the printed circuit board 4008, thereby providing a light source along the entire length of each of the reaction chambers 4001 , 4101, and 4201. . A light source is provided along the entire length of each of the reaction chambers 4001, 4101, and 4201.

[0039] In the example shown in FIG. 4, the substrates 4003 of the reaction chambers 4001, 4101, 4201 each have a plurality of protrusions, and the plurality of protrusions are provided by fins 4011A, 4011B extending inwardly away from the inner surfaces of the reaction chambers 4001A, 4001B, 4001C, respectively. The photocatalyst 4004 is disposed on at least one surface of each of the fins 4011A, 4011B. These fins 4011A, 4011B provide a high surface area for photocatalytic decomposition of contaminants. Each of the fins 4011A, 4011B is elongated and has a length along the length of the elongated reaction chambers 4 001A, 4001B, 4001C and a height defined by how far the fins 4011A, 4011 B extend inwardly away from the respective inner surfaces of the reaction chambers 4001, 4101, 4201. Accordingly, the fins 4011A, 4011B are longitudinally shaped, and the longitudinal axis of each of the fins 4011A, 4011B is perpendicular to the optical axis of the light-emitting diode 4009. Accordingly, the fins 4011A, 401 11B define channels 4002 extending along the length of their respective reaction chambers 4001 , 4101, 4201 for the flow of air from the air inlet to the air outlet therebetween. In the example shown, each of the fins 4011A, 4011B has a linear cross-section along its height ( i.e., the profile of the fin). However, in another arrangement, each of the fins 4011A, 40 11B may have a curved cross-section.

[0040] The fins 4011A, 4011B in each of the reaction chambers 4001, 4101, 4201 comprise a first set of fin groups 4011A and a second set of fin groups 4011B, and the light The catalyst 1004 is disposed on each fin. The first set of fin groups 4011A and the second set of fin groups 4011B are arranged such that light from the corresponding light-emitting diodes 4009 illuminates at least a part of the length of the surface 4013 of each fin 4011A, 4011B along the entire height of the surface 4013. In other words, within the reaction chambers 4001, 4101, 4 201, each light-emitting diode 4009 illuminates the entire height of at least one surface 4013 of each fin 4011A, 4011B without being shaded by adjacent fins. That is to say, a plurality of light-emitting diodes 4009 (for example, a plurality of light-emitting diodes distributed in the longitudinal direction ) may be necessary to illuminate the entire length of the fins 4011A, 4011B. Within each reaction chamber 4001, 4101, 4201, the light-emitting diodes 4009 are distributed to illuminate different but possibly overlapping portions of the length of at least one surface 4013 of each fin 4011A, 4011B, respectively. In the example shown in FIG. 4, within each reaction chamber 4001, 4101, 4201, each of the first set of fin groups 4011A is arranged such that a line (for example, a line extending along the height of the fin and similar to the chord line) extending from the base end 4015 of the fin 4011A through the tip 4016 of the fin is directed towards a first convergence point or intersection point F1. Then, each of the second set of fin groups 4011B is arranged such that a line extending from the base end 4015 of the fin 4011B through the tip 4016 of the fin 4011B is directed towards a second convergence point F2. The first convergence point F1 is different from the second convergence point F2, and both the first convergence point F1 and

[0041] the second convergence point F2 are offset with respect to the position of the light-emitting diodes 4009. ​​​​​​​​

[0042] The first set of fin groups 4011A extends inwardly from the first inner surface 4018A of each of the reaction chambers 4001, 4101, 4201, and the second set of fin groups 4011 B extends inwardly from the second inner surface 4018B of each of the reaction chambers 4001, 4101, 4201, and the first inner surface 4018A and the second inner surface 4018B generally face the light-emitting diode 4009. The first inner surface 4018A and the second inner surface 4018B are symmetrically arranged around the optical axis of the light-emitting diode, and as a result, the first set of fin groups 401 1A is arranged to be illuminated by the first half of each light-emitting diode 4009, and the second set of fin groups 4011B is arranged to be illuminated by the second half of each light-emitting diode 4009. In the example shown in FIG. 4, the photocatalyst 4004 is also disposed on both the first inner surface 4018A and the second inner surface 4018B of each reaction chamber 4001, 4101, 4201. 21. In each of the reaction chambers 4001, 4101, 4201, the first inner surface 4018A and the second inner surface 4018B have separate arcuate contours (i.e., their cross-sections are curved segments with different foci ), and the first inner surface

[0043] 4018A has a contour that is a mirror image of the contour of the second inner surface 4018B. In other words, the first inner surface 4018A and the second inner surface 401 8B are reflections of each other and thus have mirror / reflection symmetry together. The first inner surface 401 8A and the second inner surface 4018B may each have either an arcuate contour or a parabolic contour. 8A and the second inner surface 4018B have the contour of the first inner surface 4018A that is a mirror image of the contour of the second inner surface 4018B. That is, the first inner surface 4018A and the second inner surface 401 8B are reflections of each other, and as a result, they have mirror / reflection symmetry together. The first inner surface 401 8A and the second inner surface 4018B may each have either an arcuate contour or a parabolic contour.

[0044] As can be seen from FIG. 4, the reaction chambers 4001, 4101, and 4201 are distributed around a common axis. In particular, the three reaction chambers 4001, 4101, and 4201 are arranged to have three-fold rotational symmetry around the common axis. The three reaction chambers 4001, 4101, and 4201 are also arranged continuously so as to define the volume of the space within the substrates 4003 of the reaction chambers 4001, 4101, and 4201 wherein the LED PCBs 4012, 4112, and 4212 are located. The partition wall 4005 is arranged between the LED PCBs 4012, 4112, and 4212 and comprises a single-layer permeable material that separates them from the photocatalyst 4004. This layer of permeable material is impermeable to air and permeable to the radiation emitted by the light-emitting diodes 4009. In the example shown in FIG. 4, the single-layer permeable material 400 5 has the form of a manifold and is arranged concentrically around the LED PCBs 4012, 4112, and 4212. This manifold permeable material 4005 has the LED PCBs 4012 located therein and provides ducts arranged such that an air flow can pass through the ducts to cool the light-emitting diodes 4009.

[0045] The photocatalytic reactor 4000 described above comprises three reaction chambers. One skilled in the art will understand that the photocatalytic reactor 4000 may comprise any number of reaction chambers. The photocatalytic reactor 4000 described above is elongated. One skilled in the art will understand that this is not necessarily the case.

[0046] All of the photocatalytic reactors of FIGS. 1A, 1B, 2A, 2B, 3A, 3B, and 4 are arranged to maximize the irradiated surface area and thereby maximize the efficiency of the photocatalytic reactor. ​​​​​​​​In so doing, this arrangement also ensures that the absence of shadows is eliminated by each light-emitting diode. To optimize the illuminated surface area, the number of LEDs needed to illuminate the fins is Keep it to a minimum.

[0047] The photocatalytic reactors in Figures 1A, 1B, 2A, 2B, 3A, 3B and 4 all have a photocatalytic ratio The device includes fins that provide a relatively large surface area. An alternative improvement is one that does not include such fins. An example of a photocatalytic reactor is described with reference to Figures 5A and 5B. The photocatalytic reactors 5000 are each shown in FIG. Two reaction chambers 5001, 5101 arranged to receive an air flow including and a photocatalyst 5004 for photocatalytically decomposing one or more pollutants, the photocatalyst 5004 being , on the substrates 5003, 5103 provided by the reaction chambers 5001, 5101, respectively. In the example shown in Figures 5A and 5B, the photocatalytic reactor 5000 is a two-sided light emitting Further included is a diode printed circuit board ("LED PCB") 5012. The LED PCB 5012 is attached to a first side 5006 of the printed circuit board 5008. a first side of the printed circuit board 5008 and a second side of the printed circuit board 5008; and a plurality of second light emitting diodes 5010 attached to the surface 5007. The LED PCB 5012 is therefore a double-sided circuit board and and a multilayer circuit board.

[0048] Next, the photocatalytic reactor 5000 is configured such that the substrate 5003 in the first reaction chamber 5001 is A first light emitting diode 50 is attached to a first side 5006 of a support circuit board 5008. is arranged to be illuminated by 09, while the substrate 51 of the second reaction chamber 5101 03 is arranged to be illuminated by the second light-emitting diode 5010 attached to the second side surface 5007 of the printed circuit board 5008. In particular, the substrate 5003 of the first reaction chamber 50 01 is arranged to block the LED PCB 5012, and the light emitted from the first light-emitting diode 5009 collides with the substrate 5003. On the other hand, the substrate 5103 of the second reaction chamber 5101 is arranged to block the LED PCB 5012, and the light emitted from the second light-emitting diode 5010 collides with the substrate 5103.

[0049] In the examples shown in FIGS. 5A and 5B, the photocatalytic reactor 5000 is elongated, and the first and second reaction chambers 5001, 5101 are distributed around the axis of the photocatalytic reactor 5000, and the arrangement is , having two-fold rotational symmetry around the axis. Also, the reaction chambers 5001, 5101 are arranged continuously such that the substrates 5003, 5103 of the reaction chambers 5001, 5101 define a spatial volume within which the LED PCB 5012 is located. In particular, the LED PCB 50 12 is elongated, axially aligned within the elongated photocatalytic reactor 5000, and extends along the length of the reaction chambers 500 1, 5101. The first light-emitting diodes 5009 of the LED PCB 5012 are spaced apart and longitudinally aligned along the first side surface 5006 of the length of the LED PCB 5012, and the second light-emitting diodes 5010 are spaced apart and longitudinally aligned along the second side surface 5007 of the length of the LED PCB 5012, thereby providing a light source along the entire length of the photocatalytic reactor 500 0.

[0050] Next, reaction chambers 5001 and 5101 each have a reaction chamber inlet (not shown) at a first end of reaction chambers 5001 and 5101, and a reaction chamber outlet (not shown) at a second end of reaction chambers 5001 and 5101. An air flow passing between the reaction chamber inlet and the reaction chamber outlet contacts photocatalyst 5004 disposed on respective substrates 5003 and 5103. Next, partition / barrier 5005 separates reaction chambers 5001 and 5101 from LED PCB 5012, and at least a portion of this partition 5005 is transparent to radiation emitted by light emitting diodes 5009 and 5010, and photocatalyst 5004 can be illuminated by light emitting diodes 5009 and 5010. In the example shown in FIGS. 5A and 5B, partition 5005 is tubular and comprises a single layer of transparent material disposed concentrically around LED PCB 5012. The tube of this transparent material has LED PCB 5012 located therein and provides a conduit through which an air flow can pass to cool light emitting diodes 5009 and 5010. At a first end, a reaction chamber inlet (not shown), and at a second end of reaction chambers 5001 and 5101, a reaction chamber outlet (not shown). An air flow passing between the reaction chamber inlet and the reaction chamber outlet contacts photocatalyst 5004 disposed on respective substrates 5003 and 5103. Next, partition / barrier 5005 separates reaction chambers 5001 and 5101 from LED PCB 5012, and at least a portion of this partition 5005 is transparent to radiation emitted by light emitting diodes 5009 and 5010, and photocatalyst 5004 can be illuminated by light emitting diodes 5009 and 5010. In the example shown in FIGS. 5A and 5B, partition 5005 is tubular and comprises a single layer of transparent material disposed concentrically around LED PCB 5012. The tube of this transparent material has LED PCB 5012 located therein and provides a conduit through which an air flow can pass to cool light emitting diodes 5009 and 5010. In the example shown in FIGS. 5A and 5B, each of reaction chambers 5001 and 5101 has a first inner surface 5018A, 5118A and a second inner surface 5018B, 5118B, and photocatalyst 5004 is disposed on both the first inner surface 5018A, 5118A and the second inner surface 5018B, 5118B. The first inner surface 5018A, 5118A and the second inner surface 5018B, 5118B have separate parabolic-shaped contours which are curved segments having different foci and which means that the contour of the second inner surface 5018B, 5118B is a mirror image of the contour of the first inner surface 5018A, 5118A. Next, the photocatalytic reactor In the example shown in FIGS. 5A and 5B, each of reaction chambers 5001 and 5101 has a first inner surface 5018A, 5118A and a second inner surface 5018B, 5118B, and photocatalyst 5004 is disposed on both the first inner surface 5018A, 5118A and the second inner surface 5018B, 5118B. The first inner surface 5018A, 5118A and the second inner surface 5018B, 5118B have separate parabolic-shaped contours which are curved segments having different foci and which means that the contour of the second inner surface 5018B, 5118B is a mirror image of the contour of the first inner surface 5018A, 5118A. Next, the photocatalytic reactor

[0051] In the example shown in FIGS. 5A and 5B, each of reaction chambers 5001 and 5101 has a first inner surface 5018A, 5118A and a second inner surface 5018B, 5118B, and photocatalyst 5004 is disposed on both the first inner surface 5018A, 5118A and the second inner surface 5018B, 5118B. The first inner surface 5018A, 5118A and the second inner surface 5018B, 5118B have separate parabolic-shaped contours which are curved segments having different foci and which means that the contour of the second inner surface 5018B, 5118B is a mirror image of the contour of the first inner surface 5018A, 5118A. Next, the photocatalytic reactor The first inner surface 5018A, 5118A and the second inner surface 5018B, 5118B have separate parabolic-shaped contours which are curved segments having different foci and which means that the contour of the second inner surface 5018B, 5118B is a mirror image of the contour of the first inner surface 5018A, 5118A. Next, the photocatalytic reactor The first inner surface 5018A, 5118A and the second inner surface 5018B, 5118B have separate parabolic-shaped contours which are curved segments having different foci and which means that the contour of the second inner surface 5018B, 5118B is a mirror image of the contour of the first inner surface 5018A, 5118A. Next, the photocatalytic reactor 5000, the light-emitting diodes on the corresponding surfaces 5006, 5007 of the LED PCB 5012 5009, 5010 are arranged to illuminate both the first inner surfaces 5018A, 5118A and the second inner surfaces 5018B, 51 18B. In particular, for each reaction chamber 5001, 5101 the first inner surfaces 5018A, 5118A and the second inner surfaces 5018B, 5118B correspond to the light axes O of the corresponding light-emitting diodes 5009, 5010 and are symmetrically arranged around them. As a result, the first inner surfaces 5018A, 5118A are illuminated by the first halves of the light-emitting diodes 5009, 5010 and the second inner surfaces 5018B, 5118B are arranged to be illuminated by the second halves of the light-emitting diodes 5009, 50 10. The first inner surfaces 5018A, 5118A and the second inner surfaces 5018B, 5118B of each reaction chamber 5001, 51 01 are also continuous. Moreover, they are continuous.

[0052] In the arrangements of FIGS. 5A and 5B, due to the lack of surface features (e.g., fins or other protrusions), the total surface area of the photocatalyst 5004 is reduced compared to the arrangements shown in FIGS. 1A, 1B, 2A, 2B, 3A, 3B and 4, while the substrates 5003, 510 3 carrying the photocatalyst 5004 are arranged as close as possible to the light sources 5009, 5010 in order to maximize the irradiance of the photocatalyst 5004. However, in order for air to pass through the photocatalytic reactor 5000 a gap is required between the partition wall 5005 and the substrates 5003, 5103, and by optimizing the separation distance between the partition wall 500 5 and the substrates 5003, 5103, a thinner air layer is provided that optimizes the cleaning and mixing of the air in the reaction chambers 5001, 5101. In the example shown in FIGS. 5A and 5B, the partition wall 5005 has a diameter D of approximately 35 mm, and the substrates 5003, 5103 are arranged as close as possible to the light sources 5009, 5010 in order to maximize the irradiance of the photocatalyst 5004. However, in order for air to pass through the photocatalytic reactor 5000 a gap is required between the partition wall 5005 and the substrates 5003, 5103, and by optimizing the separation distance between the partition wall 500 5 and the substrates 5003, 5103, a thinner air layer is provided that optimizes the cleaning and mixing of the air in the reaction chambers 5001, 5101. In the example shown in FIGS. 5A and 5B, the partition wall 5005 has a diameter D of approximately 35 mm, The separation distance S between the outer surface of the partition 5005 and the substrates 5003, 5013 has a maximum of about 3 mm However, the separation distance S can be at most 10 mm or less, preferably 7 mm or less, more preferably 1 mm to 7 mm.

[0053] It is also desirable to create a uniform irradiance across the entire catalyst surface so that the air within the photocatalytic reactor is evenly treated. However, LEDs do not emit light in a cylindrically symmetric manner, but rather emit light in a Lambertian distribution. Conventional photocatalytic reactors that utilize LED light sources typically have a cylindrical substrate, and thus require a lens to be placed between the LED and the substrate in order to evenly distribute the light emitted by the LED across the entire surface of the substrate. The mounting of the lens adds cost and size to the LED package. To overcome this problem, the applicant has discovered that by providing a substrate whose cross-sectional shape is defined by two separate parabolic arcs, a more uniform irradiance of the substrate can be obtained. In particular, the use of such a parabolic profile facilitates the shaping of the inner surface having the catalyst in order to take into account the local irradiance provided by the LED light source. Such an inner surface having a parabolic profile makes it possible to reduce the difference in irradiance on the inner surface as a function of the angle α, and provides greater irradiance uniformity on the inner surface provided with the photocatalyst. In this regard, the cross-sectional profile shape of each of the first inner surfaces 5018A, 5118A and the second inner surfaces 5018B, 5118B can be defined by a Bézier curve, particularly a quadratic Bézier curve. Thus, the cross-sectional profile of each of the first 5018A, 5118A and the second 5018B, 5118B can be defined by a three-point Bézier curve defined by the following equation. The applicant has discovered that by providing a substrate whose cross-sectional shape is defined by two separate parabolic arcs, a more uniform irradiance of the substrate can be obtained. In particular, the use of such a parabolic profile facilitates the shaping of the inner surface having the catalyst in order to take into account the local irradiance provided by the LED light source. Such an inner surface having a parabolic profile makes it possible to reduce the difference in irradiance on the inner surface as a function of the angle α, and provides greater irradiance uniformity on the inner surface provided with the photocatalyst. In this regard, the cross-sectional profile shape of each of the first inner surfaces 5018A, 5118A and the second inner surfaces 5018B, 5118B can be defined by a Bézier curve, particularly a quadratic Bézier curve. Thus, the cross-sectional profile of each of the first 5018A, 5118A and the second 5018B, 5118B can be defined by a three-point Bézier curve defined by the following equation. Such an inner surface having a parabolic profile makes it possible to reduce the difference in irradiance on the inner surface as a function of the angle α, and provides greater irradiance uniformity on the inner surface provided with the photocatalyst. In this regard, the cross-sectional profile shape of each of the first inner surfaces 5018A, 5118A and the second inner surfaces 5018B, 5118B can be defined by a Bézier curve, particularly a quadratic Bézier curve. Thus, the cross-sectional profile of each of the first 5018A, 5118A and the second 5018B, 5118B can be defined by a three-point Bézier curve defined by the following equation.

[0054]

Number

[0055] Here, P0 is the starting point of the curve, P2 is the ending point of the curve, and P1 is the control point of the curve. The use of Bézier curves can provide a more uniform irradiance on the photocatalyst surface as a function of the angle α.

[0056] As described above, those skilled in the art will understand that the above-mentioned photocatalyst reactor can be used in place of the conventional photocatalyst reactor in the air treatment device.

[0057] In the foregoing description, when an integer or element having known, obvious or foreseeable equivalents is mentioned, such equivalents are incorporated into this specification as if they were individually described. Reference should be made to the claims to determine the true scope of the present invention, and the claims should be construed to include such equivalents. Also, it should be understood by the reader that the components or features of the present invention described as preferred, advantageous, convenient, etc. are optional and do not limit the scope of the independent claims. Furthermore, although such optional integers or features may be beneficial in some embodiments of the present invention, they may not be desirable and thus may not exist in other embodiments. ​​​​​

Claims

1. A photocatalytic reactor arranged to receive one or more air pollutants, comprising: a photocatalyst disposed on a substrate for photocatalytically decomposing one or more of the pollutants; one or more light sources for irradiating the photocatalyst to promote photocatalytic decomposition; at least two layers of a transmissive material disposed between the photocatalyst and the one or more light sources to separate them; and the at least two layers of transmissive material comprise a first layer of transmissive material separated from a second layer of transmissive material by a gap, the photocatalytic reactor.

2. The photocatalytic reactor comprises a first portion including the photocatalyst and a second portion including the one or more light sources, and the at least two layers of transmissive material separate the first portion from the second portion, the photocatalytic reactor according to claim 1.

3. The first portion is arranged to receive an air stream containing one or more air pollutants, and the second portion is arranged to receive an air stream that contacts the one or more light sources to provide air cooling, the photocatalytic reactor according to claim 2.

4. The one or more light sources comprise one or more light emitting diodes, the photocatalytic reactor according to any one of claims 1 to 3.

5. The one or more light sources comprise one or more plural light emitting diodes mounted on a circuit board, the photocatalytic reactor according to any one of claims 1 to 4.

6. The at least two layers of transmissive material comprise at least two conduits arranged concentrically around the one or more light sources, and at least a part of each conduit comprises the transmissive material, the photocatalytic reactor according to any one of claims 1 to 5.

7. An air treatment apparatus comprising the photocatalytic reactor according to any one of claims 1 to 6.

8. A photocatalytic reactor arranged to receive one or more air pollutants, comprising: a photocatalyst disposed on a substrate for photocatalytically decomposing one or more of the pollutants; a light emitting diode circuit board comprising a circuit board on which one or more first light emitting diodes are mounted on a first side and one or more second light emitting diodes are mounted on a second side; and the substrate is arranged to be illuminated by both the one or more first light emitting diodes and the one or more second light emitting diodes, and at least two layers of transmissive material are disposed between the light emitting diode circuit board and the photocatalyst to separate them. The at least two layers of the transmissive material comprise a first layer of the transmissive material separated from the second layer of the transmissive material by a gap. Photocatalytic reactor. Claim 9 An air treatment apparatus comprising the photocatalytic reactor according to claim 8.

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