Photosensitive Composition, Optical Filter, Image Display Device, and Solid-State Image Sensor

Abstract

To provide a photosensitive composition by which a cured film having line width stability of patterns, excellent adhesion property, also excellent solvent resistance even by low-temperature post-bake, high-temperature and high-humidity resistance can be formed.SOLUTION: The problem is solved by a photosensitive composition including a coloring agent (A), a binder resin (B), a polymerizable compound (C) and a photopolymerization initiator (D), where the binder resin (B) includes a binder resin (B1) having a block isocyanate group-containing monomer unit (b1) and a hydroxyl group-containing monomer unit (b2), and the polymerizable compound (C) includes a polymerizable compound (C1) having two (meth)acryloyl groups and a condensed ring structure.SELECTED DRAWING: None

Description

Technical Field

[0001] The present invention relates to a photosensitive composition and its uses.

Background Art

[0002] A color filter, which is a type of optical filter, is used in image display devices, solid-state imaging devices, and the like. When a color filter is manufactured by photolithography, post-baking is performed at a temperature of about 200 to 250°C for about 10 to 60 minutes after the development process. However, when replacing a conventional glass substrate with a flexible plastic substrate or forming a color filter on an organic semiconductor device such as an organic electroluminescence display device (organic EL), post-baking at a high temperature is not possible because the heat resistance of these members is low. On the other hand, when post-baking is performed at a low temperature, there is a problem that the curing of the coating film is insufficient and the solvent resistance and high-temperature and high-humidity resistance of the cured film are reduced.

[0003] To solve the above problems, for example, Patent Document 1 discloses a coloring composition containing a coloring agent containing a red coloring agent, a resin having a repeating unit containing a blocked isocyanate group, a polymerizable compound, and a photopolymerization initiator, and defining the ratio of the maximum value to the minimum value of the absorbance at a specific wavelength.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, the composition described in Patent Document 1 could not satisfy all of the solvent resistance and high-temperature and high-humidity resistance of the cured film at a certain level or higher with low-temperature post-baking. There was also a problem of low line width stability and adhesion in which the line width of the pattern changed when the exposure amount was changed.

[0006] The present invention aims to provide a photosensitive composition capable of forming a cured film excellent in pattern line width stability, adhesion, solvent resistance even with low-temperature post-baking, and high-temperature and high-humidity resistance.

Means for Solving the Problems

[0007] The present invention is a photosensitive composition containing a colorant (A), a binder resin (B), a polymerizable compound (C), and a photopolymerization initiator (D), wherein the binder resin (B) includes a binder resin (B1) having a blocked isocyanate group-containing monomer unit (b1) and a hydroxyl group-containing monomer unit (b2), and the polymerizable compound (C) relates to a photosensitive composition containing a polymerizable compound (C1) having two (meth)acryloyl groups and a condensed ring structure.

Effects of the Invention

[0008] According to the present invention described above, a photosensitive composition capable of forming a cured film excellent in pattern line width stability, adhesion, solvent resistance even with low-temperature post-baking, and high-temperature and high-humidity resistance can be provided. Further, the present invention can provide an optical filter, an image display device, and a solid-state imaging device.

Modes for Carrying Out the Invention

[0009] Hereinafter, modes for carrying out the photosensitive composition of the present invention will be described in detail. It should be noted that the present invention is not limited to the following embodiments and can be implemented with modifications within the scope capable of solving the problems.

[0010] In this specification, unless otherwise specified, “(meth)acryloyl”, “(meth)acrylic”, “(meth)acrylic acid”, “(meth)acrylate”, or “(meth)acrylamide” means “acryloyl and / or methacryloyl”, “acrylic and / or methacrylic”, “acrylic acid and / or methacrylic acid”, “acrylate and / or methacrylate”, or “acrylamide and / or methacrylamide”, respectively. Also, “C.I.” means Color Index (C.I.; published by The Society of Dyers and Colourists). The polymerizable unsaturated group is an ethylenically unsaturated double bond. Regarding the molecular weight of the compounds in the present invention, for low molecular weight compounds whose molecular weight can be specified, it is the value calculated by calculation (formula weight) or the molecular weight measured by ESI-MS (electrospray ionization mass spectrometry). For compounds having a molecular weight distribution, it is the weight average molecular weight in terms of polystyrene measured by gel permeation chromatography using tetrahydrofuran as a solvent. A monomer is a compound that forms a resin by polymerization. A monomer is in an unreacted state, and a monomer unit is a state where the monomer forms a resin after polymerization. A condensed ring structure means a structure in which two or more rings share sides one by one. A structure in which at least one ring is an aromatic ring is called an aromatic condensed ring structure, and a structure in which all rings are aliphatic rings is called an aliphatic condensed ring structure.

[0011] <Photosensitive Composition> The photosensitive composition of the present invention is a photosensitive composition containing a colorant (A), a binder resin (B), a polymerizable compound (C), and a photopolymerization initiator (D), wherein the binder resin (B) contains a binder resin (B1) having a blocked isocyanate group-containing monomer unit (b1) and a hydroxyl group-containing monomer unit (b2), and the polymerizable compound (C) is characterized by containing a polymerizable compound (C1) having two (meth)acryloyl groups and a condensed ring structure.

[0012] Although the mechanism by which the photosensitive composition having the above-described configuration can solve the problems of the present invention is not clear, it is presumed as follows.

[0013] The binder resin (B1) having the block isocyanate group-containing monomer unit (b1) and the hydroxyl group-containing monomer unit (b2) has the hydroxyl group-containing monomer unit (b2), so that even when heated at a relatively low temperature, the protecting group (blocking agent) is detached from the block isocyanate group and the isocyanate group is easily generated. Thereafter, it is presumed that the isocyanate group and the hydroxyl group react to obtain a sufficiently cured cured film. And, since the polymerizable compound (C1) having two (meth)acryloyl groups and a condensed ring structure has two functional groups, compared with the penta- or hexa-functional (meth)acrylate widely used in the color filter field, there are fewer crosslinking sites and the reaction is gentle. Even when the exposure amount is increased, it is presumed that the reaction hardly proceeds to the portion covered with the mask and a pattern with a desired line width can be obtained. Further, since it has a rigid, hydrophobic and highly heat-resistant condensed ring structure, it is presumed that a pattern with high adhesion can be obtained.

[0014] [Colorant (A)] The photosensitive composition of the present invention contains a colorant (A).

[0015] The colorant (A) is not particularly limited and may be either a pigment or a dye, and they can be used in combination. From the viewpoints of light resistance, heat resistance and solvent resistance, the colorant (A) is preferably a pigment.

[0016] (Pigment) The pigment is not particularly limited, and examples thereof include compounds classified as pigments in the Color Index. Hereinafter, pigments will be exemplified.

[0017] Red pigments include, for example, C.I. Pigment Red 1, 2, 3, 4, 5, 6, 7, 8, 9, 12, 14, 15, 16, 17, 21, 22, 23, 31, 32, 37, 38, 41, 47, 48, 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 50:1, 52:1, 52:2, 53, 53:1, 53:2, 53:3, 57, 57:1, 57:2, 58:4, 60, 63, 63:1, 63:2, 64, 64:1, 68, 69, 81, 81:1, 81:2, 81:3, 81:4, 83, 88, 90:1, 101, 101:1, 104, 108, 108:1, 109, 112, 113, 114, 122, 123, 144, 146, 147, 149, 151, 166, 168, 169, 170, 172, 173, 174, 175, 176, 177, 178, 179, 181, 184, 185, 187, 188, 190, 193, 194, 200, 202, 206, 207, 208, 209, 210, 214, 216, 220, 221, 224, 230, 231, 232, 233, 235, 236, 237, 238, 239, 242, 243, 245, 247, 249, 250, 251, 253, 254, 255, 256, 257, 258, 259, 260, 262, 263, 264, 265, 266, 267, 268, 269, 270, 271, 272, 273, 274, 275, 276, 277, 278, 279, 280, 281, 282, 283, 284, 285, 286, 287, 291, 295, 296, the pigments described in JP-A No. 2014-134712, the pigments described in Patent No. 6368844, etc. Among these, from the viewpoints of heat resistance, light resistance, and transmittance, C.I. Pigment Red 48:1, 122, 177, 224, 242, 269, 254, 291, 295, 296, the pigments described in JP-A No. 2014-134712, and the pigments described in Patent No. 6368844 are preferable, and C.I. Pigment Red 177, 254, 291, 295, 296, the pigments described in JP-A No. 2014-134712, and the pigments described in Patent No. 6368844 are particularly preferable.

[0018] Orange pigments include, for example, C.I. Pigment Orange 36, 38, 43, 64, 71, 73, etc.

[0019] Yellow pigments include, for example, C.I. Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 12, 13, 14, 15, 16, 17, 18, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 126, 127, 128, 129, 138, 139, 147, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170, 171, 172, 173, 174, 175, 176, 177, 179, 180, 181, 182, 185, 187, 188, 192, 193, 194, 196, 198, 199, 213, 214, 231, 233, and pigments described in JP-A-2012-226110. Among these, C.I. Pigment Yellow 138, 139, 150, 185, 231, 233, and the pigments described in JP-A-2012-226110 are preferred.

[0020] Green pigments include, for example, C.I. Pigment Green 1, 2, 4, 7, 8, 10, 13, 14, 15, 17, 18, 19, 26, 36, 37, 45, 48, 50, 51, 54, 55, 58, 59, 62, 63, etc. Among these, C.I. Pigment Green 36, 58, 59, 62, 63 are preferred.

[0021] Blue pigments include, for example, C.I. Pigment Blue 1, 1:2, 9, 14, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 17, 19, 25, 27, 28, 29, 33, 35, 36, 56, 56:1, 60, 61, 61:1, 62, 63, 66, 67, 68, 71, 72, 73, 74, 75, 76, 78, 79, etc. Among these, C.I. Pigment Blue 15, 15:1, 15:2, 15:3, 15:4, 15:6 are preferred.

[0022] Examples of the purple pigment include C.I. Pigment Violet 1, 1:1, 2, 2:2, 3, 3:1, 3:3, 5, 5:1, 14, 15, 16, 19, 23, 25, 27, 29, 31, 32, 37, 39, 42, 44, 47, 49, 50, etc. Among these, C.I. Pigment Violet 19 and 23 are preferred.

[0023] Examples of the black pigment include C.I. Pigment Black 1, 6, 7, 12, 20, 31, etc. In addition, compounds described in Japanese Patent Publication No. 2010-534726, Japanese Patent Publication No. 2012-515233, Japanese Patent Publication No. 2012-515234, Japanese Unexamined Patent Application Publication No. 1-170601, Japanese Unexamined Patent Application Publication No. 2-34664, etc. are also included.

[0024] Examples of the inorganic pigment include titanium oxide, barium sulfate, zinc white, lead sulfate, yellow lead, zinc yellow, red iron oxide (III), cadmium red, ultramarine blue, dark blue, chromium oxide green, cobalt green, amber, synthetic iron black, etc.

[0025] (Dye) Examples of the dye include acid dyes, direct dyes, basic dyes, salt-forming dyes, oil-soluble dyes, disperse dyes, reactive dyes, mordant dyes, building dyes, sulfur dyes, etc. In addition, derivatives thereof or lake pigments obtained by lake-forming the dye may also be used.

[0026] The acid dye preferably has an acidic group such as a sulfonic acid or a carboxylic acid. In addition, a salt-forming compound which is a salt of an acid dye and a nitrogen-containing compound such as a quaternary ammonium salt compound, a tertiary amine compound, a secondary amine compound, or a primary amine compound is preferred. In addition, a salt-forming compound which is a salt of a resin component having these functional groups and an acid dye is also preferred. In addition, the salt-forming compound is likely to obtain a photosensitive composition excellent in resistance (light resistance, solvent resistance) by sulfonamidation and modification into a sulfonic acid amide compound. In addition, a salt-forming compound of an acid dye and a compound having an onium base is also preferred because of its excellent resistance (light resistance, solvent resistance). The compound having an onium base is preferably a resin having a cationic group.

[0027] Basic dyes preferably form salt-forming compounds with organic acids, perchloric acid or its metal salts. The salt-forming compounds of basic dyes are preferred because of their excellent resistance (light resistance, solvent resistance) and affinity for pigments. In addition, in the salt-forming compounds of basic dyes, the anionic components acting as counterions are organic sulfonic acids, organic sulfuric acids, fluorine group-containing phosphorus anion compounds, fluorine group-containing boron anion compounds, cyano group-containing nitrogen anion compounds, anion compounds having a conjugate base of an organic acid having a halogenated hydrocarbon group, and salt-forming compounds formed by salting with acid dyes. Note that the salt-forming compound has better resistance when it contains a polymerizable group in the molecule.

[0028] In addition, when the dye skeleton has a polymerizable unsaturated group, the durability of the dye is improved.

[0029] The chemical structure of the dye includes, for example, azo dyes, disazo dyes, azomethine dyes (such as indoaniline dyes, indophenol dyes, etc.), dipyrromethene dyes, quinone dyes (such as benzoquinone dyes, naphthoquinone dyes, anthraquinone dyes, anthrapyridone dyes, etc.), carbonium dyes (such as diphenylmethane dyes, triphenylmethane dyes, xanthene dyes, acridine dyes, etc.), quinoneimine dyes (such as oxazine dyes, thiazine dyes, etc.), azine dyes, polymethine dyes (such as oxonol dyes, merocyanine dyes, arylidene dyes, styryl dyes, cyanine dyes, squarylium dyes, croconium dyes, etc.), quinophthalone dyes, phthalocyanine dyes, subphthalocyanine dyes, perinone dyes, indigo dyes, thioindigo dyes, quinoline dyes, nitro dyes, nitroso dyes, rhodamine dyes, and dye skeletons derived from dyes selected from metal complex dyes thereof, etc., but are not particularly limited thereto.

[0030] Among these dye structures, from the viewpoint of color characteristics such as hue, color separation property, and color unevenness, a dye structure derived from a dye selected from azo dyes, xanthene dyes, cyanine dyes, triphenylmethane dyes, anthraquinone dyes, dipyrromethene dyes, squarylium dyes, quinophthalone dyes, phthalocyanine dyes, and subphthalocyanine dyes is preferred, and a dye structure derived from a dye selected from xanthene dyes, cyanine dyes, triphenylmethane dyes, anthraquinone dyes, dipyrromethene dyes, and phthalocyanine dyes is more preferred.

[0031] The colorant (A) can be used alone or in combination of two or more.

[0032] The content of the colorant (A) is preferably 5 to 70% by mass, more preferably 10 to 60% by mass, in 100% by mass of the non-volatile matter of the photosensitive composition.

[0033] (Micronization of organic pigments) The organic pigment is preferably used after being micronized. The micronization method is not particularly limited, and for example, any of wet grinding, dry grinding, and solvent precipitation methods can be used. Among these, salt milling treatment by the kneader method, which is a type of wet grinding, is preferred. The average primary particle diameter determined by TEM (transmission electron microscope) of the micronized pigment is preferably 5 to 90 nm. From the viewpoints of dispersibility and contrast ratio, the average primary particle diameter is more preferably 10 to 70 nm.

[0034] The salt milling treatment is a treatment in which a mixture of a pigment, a water-soluble inorganic salt, and a water-soluble organic solvent is mechanically kneaded while heating using a kneader such as a kneader, a two-roll mill, a three-roll mill, a ball mill, an attritor, or a sand mill, and then the water-soluble inorganic salt and the water-soluble organic solvent are removed by washing with water.

[0035] For the salt milling process, resin may be added as needed. By adding resin, the pigment is coated with the resin, improving stability, light resistance, etc. The type of the resin is not particularly limited, and examples include natural resins, modified natural resins, synthetic resins, synthetic resins modified with natural resins, etc. Among these, those that are solid at room temperature, preferably water-insoluble, and preferably partially soluble in the above organic solvent are preferred. The addition amount of the resin is preferably 2 to 200 parts by mass with respect to 100 parts by mass of the pigment.

[0036] [Binder resin (B)] (Binder resin (B1) having blocked isocyanate group-containing monomer unit (b1) and hydroxyl group-containing monomer unit (b2)) The photosensitive composition of the present invention contains, as the binder resin (B), a binder resin (B1) having a blocked isocyanate group-containing monomer unit (b1) and a hydroxyl group-containing monomer unit (b2) (hereinafter, also simply referred to as binder resin (B1)). Thereby, even in post-baking at low temperature, the release of the blocking agent is promoted, and the resistance of the cured film is improved.

[0037] [Blocked isocyanate group-containing monomer unit (b1)] The blocked isocyanate group-containing monomer is a monomer in which the isocyanate group of the isocyanate group-containing monomer is protected with a compound that desorbs by heat (hereinafter, also referred to as a blocking agent). The desorption temperature of the blocking agent is preferably 60 to 160°C, more preferably 80 to 140°C.

[0038] Isocyanate group-containing monomers include, for example, 2-isocyanatoethyl (meth)acrylate, 2-isocyanatopropyl (meth)acrylate, 3-isocyanatopropyl (meth)acrylate, 2-isocyanato-1-methylethyl (meth)acrylate, 2-isocyanato-1,1-dimethylethyl (meth)acrylate, 4-isocyanatocyclohexyl (meth)acrylate, methacryloyl isocyanate, and the like. Also, an equimolar reaction product of 2-hydroxyalkyl (meth)acrylate and a diisocyanate compound can be used. Among these, 2-isocyanatoethyl (meth)acrylate and 2-isocyanatopropyl (meth)acrylate are preferred.

[0039] Blocking agents include oxime compounds, lactam compounds, phenol compounds, alcohol compounds, amine compounds, active methylene compounds, pyrazole compounds, mercaptan compounds, imidazole compounds, imide compounds, urea compounds, imine compounds, and bisulfite compounds, and the like.

[0040] Examples of oxime compounds include formaldehyde oxime, acetaldehyde oxime, acetone oxime, methyl ethyl ketone oxime, methyl isobutyl ketone oxime, cyclohexanone oxime, benzophenone oxime, and the like, and methyl ethyl ketone oxime is preferred. Examples of lactam compounds include ε-caprolactam, δ-valerolactam, γ-butyrolactam, β-propiolactam, and the like. Examples of phenol compounds include phenol, cresol, 2,6-xylenol, 3,5-xylenol, ethylphenol, p-tert-butylphenol, nonylphenol, methyl 2-hydroxybenzoate, methyl 4-hydroxybenzoate, p-naphthol, p-nitrophenol, and the like, and 3,5-xylenol, methyl 2-hydroxybenzoate, and methyl 4-hydroxybenzoate are preferred. The alcohol compounds include, for example, methanol, ethanol, propanol, butanol, ethylene glycol, methyl cellosolve, butyl cellosolve, methyl carbitol, benzyl alcohol, phenyl cellosolve, and furfuryl alcohol. The amine compounds include, for example, diphenylamine, phenylnaphthylamine, aniline, carbazole, etc. The active methylene compounds include, for example, dimethyl malonate, diethyl malonate, methyl acetoacetate, ethyl acetoacetate, acetylacetone, etc., and diethyl malonate is preferred. The pyrazole compounds include, for example, pyrazole, methylpyrazole, 3,5-dimethylpyrazole, etc., and 3,5-dimethylpyrazole is preferred. The mercaptan compounds include, for example, butyl mercaptan, thiophenol, tert-dodecyl mercaptan, etc. The imidazole compounds include, for example, imidazole, 2-methylimidazole, 2-ethylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, etc. The imide compounds include, for example, succinimide, maleimide, maleic imide, phthalimide, etc. The urea compounds include, for example, urea, thiourea, ethylene urea, etc. The imine compounds include, for example, ethylene imine, polyethylene imine, etc. The bisulfite compounds include, for example, sodium bisulfite, potassium bisulfite, etc. These blocking agents can be used alone or in combination of two or more.

[0041] The blocking agent is preferably at least one selected from the group consisting of an oxime compound, a lactam compound, a phenol compound, an alcohol compound, an amine compound, an active methylene compound, a pyrazole compound, a mercaptan compound, an imidazole compound, and an imide compound. From the viewpoints of the protection reaction and the deprotection reaction, at least one selected from the group consisting of an oxime compound, a phenol compound, an active methylene compound, and a pyrazole compound is more preferable.

[0042] Examples of the blocked isocyanate group-containing monomer include the following compounds. However, the present invention is not limited thereto.

[0043]

Chemical formula

[0044] Examples of commercially available products of the blocked isocyanate group-containing monomer include Karenz MOI-DEM (desorption temperature of the blocking agent: 85 to 95 °C), MOI-BP (desorption temperature of the blocking agent: 105 to 115 °C), MOI-BM (desorption temperature of the blocking agent: 125 to 135 °C), etc. manufactured by Showa Denko K.K.

[0045] 〔Hydroxyl group-containing monomer unit (b2)〕 Examples of the hydroxyl group-containing monomer include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 2,3-dihydroxypropyl (meth)acrylate, glycerol mono(meth)acrylate, cyclohexanedimethanol mono(meth)acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-acryloyloxyethyl-2-hydroxyethyl phthalate, etc.

[0046] The total content of the block isocyanate group-containing monomer unit (b1) and the hydroxyl group-containing monomer unit (b2) is preferably 10 to 60 mol%, more preferably 20 to 50 mol% in all the constituent units of the binder resin (B1) from the viewpoints of solvent resistance in low-temperature post-baking, high-temperature and high-humidity resistance, and storage stability of the photosensitive composition.

[0047] The molar ratio of the block isocyanate group-containing monomer unit (b1) and the hydroxyl group-containing monomer unit (b2) is preferably 10:90 to 50:50, more preferably 15:85 to 45:55 from the viewpoints of solvent resistance in low-temperature post-baking and high-temperature and high-humidity resistance.

[0048] The binder resin (B1) may have monomer units other than the block isocyanate group-containing monomer unit (b1) and the hydroxyl group-containing monomer unit (b2). For example, an aliphatic condensed ring structure-containing monomer unit (b3), an acidic group-containing monomer unit (b4), an epoxy group-containing monomer unit (b5), a polymerizable unsaturated group-containing monomer unit (b6), and other monomer units (b7) can be mentioned. Among these, from the viewpoints of solvent resistance in low-temperature post-baking and high-temperature and high-humidity resistance, it is preferable to have an aliphatic condensed ring structure-containing monomer unit (b3), and from the viewpoint of developability, it is preferable to have an acidic group-containing monomer unit (b4).

[0049] 〔Aliphatic condensed ring structure-containing monomer unit (b3)〕 Examples of the aliphatic condensed ring structure-containing monomer include isobornyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentanyloxyethyl (meth)acrylate, dicyclopentenyl oxyethyl (meth)acrylate, adamantyl (meth)acrylate, and the like. Among these, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, and dicyclopentanyloxyethyl (meth)acrylate are preferable.

[0050] The content of the aliphatic condensed ring structure-containing monomer unit (b3) is preferably 1 to 40 mol%, more preferably 5 to 30 mol%, based on all the constituent units of the binder resin (B1), from the viewpoints of solvent resistance and high-temperature and high-humidity resistance in low-temperature post-baking.

[0051] Examples of the acidic group-containing monomer include (meth)acrylic acid, crotonic acid, propiolic acid, cinnamic acid, itaconic acid, itaconic anhydride, maleic acid, monomethyl maleate, monoethyl maleate, monoisopropyl maleate, maleic anhydride, fumaric acid, 2-methacryloyloxyethyl succinic acid, 2-acryloyloxyethyl phthalic acid, 2-acryloyloxyethyl hexylhydrophthalic acid, p-styrenesulfonic acid, vinylsulfonic acid, 2-acrylamido-2-methylpropanesulfonic acid, tert-butylacrylamidosulfonic acid, 2-(meth)acryloyloxyethyl acid phosphate, and the like.

[0052] The content of the acidic group-containing monomer unit (b4) is preferably 1 to 40 mol%, more preferably 5 to 30 mol%, based on all the constituent units of the binder resin (B1), from the viewpoint of developability.

[0053] Examples of the epoxy group-containing monomer include oxiranyl (meth)acrylate, glycidyl (meth)acrylate, 2-methylglycidyl (meth)acrylate, 2-ethylglycidyl (meth)acrylate, 2-oxiranylethyl (meth)acrylate, 2-glycidyloxyethyl (meth)acrylate, 3,4-epoxycyclohexyl (meth)acrylate, 3,4-epoxycyclohexylmethyl (meth)acrylate, 2-(3,4-epoxycyclohexyl)ethyl (meth)acrylate, 2-(3,4-epoxycyclohexylmethyloxy)ethyl (meth)acrylate, 3-(3,4-epoxycyclohexylmethyloxy)propyl (meth)acrylate, and the like.

[0054] ​​​ The polymerizable unsaturated group-containing monomer unit (b6) includes, for example, units introduced by the following methods (i) to (iii).

[0055] <Method (i)> There is a method (i) in which the above-mentioned epoxy group-containing monomer is added to the acidic group of a resin having an acidic group-containing monomer unit (b4).

[0056] <Method (ii)> There is a method (ii) in which the above-mentioned acidic group-containing monomer is added to the epoxy group of a resin having an epoxy group-containing monomer unit (b5).

[0057] In addition, those obtained by reacting an acid anhydride with the hydroxyl group generated by the reactions of methods (i) and (ii) are also preferable as the polymerizable unsaturated group-containing monomer unit (b6).

[0058] Examples of the acid anhydride include tetrahydrophthalic anhydride, phthalic anhydride, hexahydrophthalic anhydride, succinic anhydride, maleic anhydride, and the like.

[0059] <Method (iii)> There is a method (iii) in which the isocyanate group of an isocyanate group-containing monomer is reacted with the hydroxyl group of a resin having a hydroxyl group-containing monomer unit (b2).

[0060] Examples of the isocyanate group-containing monomer include 2-(meth)acryloylethyl isocyanate, 2-(meth)acryloyloxyethyl isocyanate, 1,1-bis[methacryloyloxy]ethyl isocyanate, and the like.

[0061] 〔Other monomer unit (b7)〕 Other monomers include, for example, acrylic esters such as methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, lauryl (meth)acrylate, cyclohexyl (meth)acrylate, benzyl (meth)acrylate, phenoxyethyl (meth)acrylate, phenoxydiethylene glycol (meth)acrylate, ethylene oxide (EO) modified (meth)acrylate of phenol, EO or propylene oxide (PO) modified (meth)acrylate of nonylphenol, EO or PO modified (meth)acrylate of paracumylphenol, dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate; Aromatic vinyl compounds such as styrene, α-methylstyrene, p-vinyltoluene, p-chlorostyrene, vinylnaphthalene; (Meth)acrylamides such as (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N,N-diethyl(meth)acrylamide, N-isopropyl(meth)acrylamide, diacetone(meth)acrylamide, or acryloylmorpholine; Vinyl ethers such as ethyl vinyl ether, n-propyl vinyl ether, isopropyl vinyl ether, n-butyl vinyl ether, or isobutyl vinyl ether; Vinyl fatty acids such as vinyl acetate or vinyl propionate; N-substituted maleimides such as phenylmaleimide, methylmaleimide, ethylmaleimide, 1,2-bismaleimideethane, 1,6-bismaleimidehexane, 3-maleimidepropionic acid, 6,7-methylenedioxy-4-methyl-3-maleimidecoumarin, 4,4'-bismaleimidodiphenylmethane, bis(3-ethyl-5-methyl-4-maleimidophenyl)methane, N,N'-1,3-phenylenedimaleimide, N,N'-1,4-phenylenedimaleimide, N-(1-pyrenyl)maleimide, N-(2,4,6-trichlorophenyl)maleimide, N-(4-aminophenyl)maleimide, N-(4-nitrophenyl)maleimide, N-benzylmaleimide, N-bromomethyl-2,3-dichloromaleimide, N-succinimidyl-3-maleimidebenzoate, N-succinimidyl-3-maleimidepropionate, N-succinimidyl-4-maleimidebutyrate, N-succinimidyl-6-maleimidehexanoate, N-[4-(2-benzimidazolyl)phenyl]maleimide, 9-maleimidoacridine; Examples include dimethyl 2,2'-[oxybis(methylene)]bis-2-propenoate, diethyl 2,2'-[oxybis(methylene)]bis-2-propenoate, di(n-propyl) 2,2'-[oxybis(methylene)]bis-2-propenoate, di(isopropyl) 2,2'-[oxybis(methylene)]bis-2-propenoate, di(2-ethylhexyl) 2,2'-[oxybis(methylene)]bis-2-propenoate, etc. These monomers can be used alone or in combination of two or more.

[0062] The weight average molecular weight (Mw) of the binder resin (B1) is preferably 4,000 to 40,000, more preferably 4,000 to 35,000.

[0063] The acid value of the binder resin (B1) is preferably 30 to 200 mgKOH / g, more preferably 40 to 180 mgKOH / g.

[0064] The binder resin (B1) can be used alone or in combination of two or more.

[0065] From the viewpoints of solvent resistance and high-temperature and high-humidity resistance in low-temperature post-baking, the content of the binder resin (B1) is preferably 50 to 100% by mass in 100% by mass of the binder resin (B).

[0066] (Binder resin (B2)) The photosensitive composition of the present invention can contain, as the binder resin (B), a binder resin other than the binder resin (B1) (hereinafter simply referred to as the binder resin (B2)).

[0067] The binder resin (B2) is not particularly limited, and known resins can be used. For example, acrylic resins having acidic groups, α-olefin / (anhydrous) maleic acid copolymers, styrene / styrene sulfonic acid copolymers, ethylene / (meth)acrylic acid copolymers, or isobutylene / (anhydrous) maleic acid copolymers, etc. can be mentioned.

[0068] The content of the binder resin (B) is preferably 1 to 60% by mass, more preferably 5 to 50% by mass, in 100% by mass of the non-volatile content of the photosensitive composition.

[0069] [Polymerizable compound (C)] (Polymerizable compound (C1) having two (meth)acryloyl groups and a condensed ring structure) The photosensitive composition of the present invention contains, as the polymerizable compound (C), a polymerizable compound (C1) having two (meth)acryloyl groups and a condensed ring structure (hereinafter simply referred to as the polymerizable compound (C1)).

[0070] The condensed ring structure of the polymerizable compound (C1) may be either an aliphatic condensed ring structure or an aromatic condensed ring structure, but from the viewpoints of line width stability and adhesion of the pattern, an aliphatic condensed ring structure is preferred.

[0071] The polymerizable compound (C1) includes, for example, tricyclodecane dimethanol di(meth)acrylate, dicyclopentenyl di(meth)acrylate, dicyclopentanyl di(meth)acrylate, 1,3-adamantanediol di(meth)acrylate, 5,7-dimethyl-1,3-adamantanediol di(meth)acrylate, 9,9-bis[4-(2-acryloyloxyethoxy)phenyl]fluorene, 9,9-bis[4-(2-methacryloyloxyethoxy)phenyl]fluorene, 9,9-bis[4-(2-methacryloyloxyethoxy)-3-methylphenyl]fluorene, and the like. Among these, tricyclodecane dimethanol di(meth)acrylate is preferred.

[0072] Commercially available products of the polymerizable compound (C1) include, for example, NK Ester A-DCP, DCP manufactured by Shin-Nakamura Chemical Co., Ltd., OGSOL EA-0200, EA-0300, GA-5060P, GA-2800 manufactured by Osaka Gas Chemical Co., Ltd., Miramer HR6060, HR6100, HR6200 manufactured by Miwon Specialty Chemical Co., Ltd., and the like.

[0073] The polymerizable compound (C1) can be used alone or in combination of two or more.

[0074] From the viewpoints of line width stability and adhesion of the pattern, the content of the polymerizable compound (C1) is preferably 50 to 100% by mass, more preferably 60 to 100% by mass in 100% by mass of the polymerizable compound (C).

[0075] (Polymerizable compound (C2)) The photosensitive composition of the present invention can contain, as the polymerizable compound (C), a polymerizable compound (C2) other than the polymerizable compound (C1) (hereinafter, also simply referred to as the polymerizable compound (C2)) as long as the effects of the present invention are not impaired.

[0076] The polymerizable compound (C2) is, for example, a polymerizable compound having one (meth)acryloyl group such as methyl (meth)acrylate, ethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, cyclohexyl (meth)acrylate, phenol EO-modified (meth)acrylate, 2-ethylhexyl EO-modified (meth)acrylate, N-acryloyloxyethylhexahydrophthalimide, dicyclopentenyl (meth)acrylate, dicyclopentyloxyethyl (meth)acrylate, dicyclopentanyl (meth)acrylate, benzyl (meth)acrylate, phenoxyethyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, phthalic acid monohydroxyethyl (meth)acrylate, etc.; a polymerizable compound having two (meth)acryloyl groups such as 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, EO-modified bisphenol A di(meth)acrylate, EO-modified bisphenol F di(meth)acrylate, isocyanuric acid EO-modified di(meth)acrylate, dioxane glycol di(meth)acrylate, etc.; a polymerizable compound having three (meth)acryloyl groups such as trimethylolpropane tri(meth)acrylate, trimethylolpropane EO-modified tri(meth)acrylate, trimethylolpropane PO-modified tri(meth)acrylate, pentaerythritol tri(meth)acrylate, isocyanuric acid EO-modified tri(meth)acrylate, etc.; a polymerizable compound having four (meth)acryloyl groups such as ditrimethylolpropane tetra(meth)acrylate, pentaerythritol tetra(meth)acrylate, etc.; Polymerizable compounds having five (meth)acryloyl groups such as dipentaerythritol penta(meth)acrylate; Examples thereof include polymerizable compounds having six (meth)acryloyl groups such as dipentaerythritol hexa(meth)acrylate. In addition, polymerizable compounds having an acidic group, polymerizable compounds having a urethane bond, polymerizable compounds having a dendrimer structure or a hyperbranched structure, lactone-modified polymerizable compounds, and the like can also be mentioned. Among these, from the viewpoint of the line width stability of the pattern, a polymerizable compound having two (meth)acryloyl groups is preferable, and a polymerizable compound having two (meth)acryloyl groups and a linear aliphatic structure is more preferable.

[0077] Examples of the polymerizable compound having two (meth)acryloyl groups and a linear aliphatic structure include 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, polytetramethylene glycol di(meth)acrylate, and the like. Among these, 1,4-butanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, and 1,6-hexanediol di(meth)acrylate are preferable.

[0078] Commercially available products of the polymerizable compound having two (meth)acryloyl groups and a linear aliphatic structure include, for example, NK Ester A-HD-N, A-NOD-N, A-DOD-N, A-NPG, A-200, APG-200, NPG manufactured by Shin-Nakamura Chemical Co., Ltd.

[0079] The polymerizable compound (C) can be used alone or in combination of two or more.

[0080] The content of the polymerizable compound (C) is preferably 5 to 70% by mass, more preferably 10 to 60% by mass, based on 100% by mass of the non-volatile content of the photosensitive composition.

[0081] [Photoinitiator (D)] The photosensitive composition of the present invention contains a photoinitiator (D). Thereby, the photosensitive composition can be cured by irradiation with active energy rays to form a cured film.

[0082] Examples of the photoinitiator (D) include acetophenone-based compounds such as 4-phenoxydichloroacetophenone, 4-t-butyldichloroacetophenone, diethoxyacetophenone, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-(dimethylamino)-1-[4-(4-morpholino)phenyl]-2-(phenylmethyl)-1-butanone, or 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone; Triazine-based compounds such as 2,4,6-trichloros-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-piperonyl-4,6-bis(trichloromethyl)-s-triazine, 2,4-bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphthalen-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphthalen-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2,4-trichloromethyl-(piperonyl)-6-triazine, or 2,4-trichloromethyl-(4'-methoxystyryl)-6-triazine; Oxime-based compounds such as 1,2-octanedione, 1-[4-(phenylthio)phenyl]-, 2-(O-benzoyloxime), or ethanol, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1-(O-acetoxime); Acylphosphine compounds such as bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide or diphenyl-2,4,6-trimethylbenzoylphosphine oxide; Quinone compounds such as 9,10-phenanthrenequinone, camphorquinone, and ethylanthraquinone; borate compounds; carbazole compounds; imidazole compounds; or titanocene compounds, etc. can be mentioned.

[0083] In commercially available products, as acetophenone compounds, Omnirad 907, 369E, 379EG manufactured by IGM Resins; as acylphosphine compounds, Omnirad 819, TPO manufactured by IGM Resins; as oxime compounds, IRGACURE OXE-01, 02, 03, 04 manufactured by BASF Japan, N-1919, NCI-730, 831, 930 manufactured by ADEKA, TRONLY TR-PBG-301, 304, 305, 309, 314, 345, 358, 380, 365, 610, 3054, 3057 manufactured by Changzhou Qiangli New Materials Co., Ltd., Omnirad 1312, 1314, 1316 manufactured by IGM Resins, SPI-02, 03, 04, 05, 06, 07 manufactured by Samyang Corporation, DFI-020, 306, EOX-01 manufactured by Daito Chemicals, etc. can be mentioned. In addition, acetophenone compounds described in Japanese Patent Application Laid-Open No. 2019-507108, Japanese Patent Application Laid-Open No. 2019-528331, etc., oxime compounds described in Japanese Patent Application Laid-Open No. 2007-210991, Japanese Patent Application Laid-Open No. 2009-179619, Japanese Patent Application Laid-Open No. 2010-037223, Japanese Patent Application Laid-Open No. 2010-215575, Japanese Patent Application Laid-Open No. 2011-020998, International Publication No. 2015 / 036910, International Publication No. 2021 / 175855, etc. can also be mentioned.

[0084] The photopolymerization initiator (D) can be used alone or in combination of two or more.

[0085] From the viewpoint of photocurability, the content of the photopolymerization initiator (D) is preferably 1 to 100 parts by mass, more preferably 3 to 50 parts by mass with respect to 100 parts by mass of the polymerizable compound (C).

[0086] [Dispersed resin (E)] From the viewpoint of storage stability, the photosensitive composition of the present invention preferably contains a dispersed resin (E).

[0087] The dispersed resin (E) has an affinity site having a property of adsorbing to the colorant (A) and a site compatible with the binder resin (B), and it may be any resin that adsorbs to the colorant (A) and functions to stabilize the dispersion in the binder resin (B), and known resins can be used. As is well known, the dispersed resin (E) is used in the production of a dispersion of the colorant (A) which is a precursor of the photosensitive composition, and is distinguished from the binder resin (B).

[0088] The dispersed resin (E) preferably has at least one of a basic group and an acidic group as a group that adsorbs to the colorant (A).

[0089] Examples of the basic group include groups containing a nitrogen atom such as a primary amino group, a secondary amino group, a tertiary amino group, a quaternary ammonium base, and a nitrogen-containing heterocyclic ring, etc.

[0090] Examples of the acidic group include a carboxyl group, a phosphoric acid group, a sulfonic acid group, etc.

[0091] Examples of the resin type of the dispersed resin (E) include urethane resins, polycarboxylic acid esters such as polyacrylates, unsaturated polyamides, polycarboxylic acids, polycarboxylic acid (partial) amine salts, polycarboxylic acid ammonium salts, polycarboxylic acid alkylamine salts, polysiloxanes, long-chain polyamino amidine phosphates, hydroxyl group-containing polycarboxylic acid esters, and modified products thereof, amides formed by the reaction of poly(lower alkyleneimine) and a polyester having a free carboxyl group and salts thereof, etc., (meth)acrylic acid-styrene copolymers, (meth)acrylic acid-(meth)acrylate copolymers, styrene-maleic acid copolymers, water-soluble resins and water-soluble polymer compounds such as polyvinyl alcohol, polyvinyl pyrrolidone, polyester-based, modified polyacrylate-based, ethylene oxide / propylene oxide addition compounds, phosphate ester-based, etc.

[0092] The structure of the dispersion resin (E) includes, for example, a random structure, a block structure, a graft structure, a comb structure, a star structure, etc. Among these, from the viewpoint of dispersion stability, a block structure or a comb structure is preferred.

[0093] Commercially available products of the dispersion resin (E) include, for example, Disperbyk-101, 103, 107, 108, 110, 111, 116, 130, 140, 154, 161, 162, 163, 164, 165, 166, 167, 168, 170, 171, 174, 180, 181, 182, 183, 184, 185, 190, 2000, 2001, 2009, 2010, 2020, 2025, 2050, 2070, 2095, 2150, 2155, 2163, 2164, or Anti-Terra-U203, 204, or BYK-P104, P104S, 220S, or Lactimon, Lactimon-WS, or Bykumen, etc., manufactured by Big Chemie Japan; SOLSPERSE-3000, 9000, 13000, 13240, 13650, 13940, 16000, 17000, 18000, 20000, 21000, 24000, 26000, 27000, 28000, 31845, 32000, 32500, 32550, 33500, 32600, 34750, 35100, 36600, 38500, 41000, 41090, 53095, 55000, 56000, 76500, etc., manufactured by Lubrizol Japan; EFKA-46, 47, 48, 452, 4008, 4009, 4010, 4015, 4020, 4047, 4050, 4055, 4060, 4080, 4400, 4401, 4402, 4403, 4406, 4408, 4300, 4310, 4320, 4330, 4340, 450, 451, 453, 4540, 4550, 4560, 4800, 5010, 5065, 5066, 5070, 7500, 7554, 1101, 120, 150, 1501, 1502, 1503, etc., manufactured by BASF Japan; Ajisuper PA111, PB711, PB821, PB822, PB824, etc., manufactured by Ajinomoto Fine-Techno Co., Inc.

[0094] The dispersion resin (E) preferably has a polymerizable unsaturated group from the viewpoints of solvent resistance in low-temperature post-baking and high-temperature and high-humidity resistance. Examples of the dispersion resin having a polymerizable unsaturated group include the resins described in paragraph numbers 0317 to 0321 of JP-A-2019-78878, the resin described in paragraph number 0083 of WO 2018 / 139534, the resins described in paragraph numbers 0167 to 0191 of WO 2019 / 163505, the resins described in paragraph numbers 0299 to 0310 of WO 2021 / 131927, and the like.

[0095] From the viewpoint of storage stability, the content of the dispersion resin (E) is preferably 3 to 200 parts by mass, more preferably 5 to 100 parts by mass, based on 100 parts by mass of the colorant (A).

[0096] [Thiol-based chain transfer agent (F)] The photosensitive composition of the present invention preferably contains a thiol-based chain transfer agent (F) from the viewpoints of pattern line width stability, adhesion, solvent resistance in low-temperature post-baking, and high-temperature and high-humidity resistance. When the thiol-based chain transfer agent (F) is used in combination with the photoinitiator (D), a thiyl radical that is less susceptible to polymerization inhibition by oxygen is generated during radical polymerization after light irradiation, and the photosensitivity of the photosensitive composition is improved.

[0097] The thiol-based chain transfer agent (F) is preferably a polyfunctional thiol having two or more thiol groups (SH groups), more preferably a polyfunctional thiol having four or more thiol groups. As the number of functional groups increases, photocuring becomes easier from the surface to the deepest part of the film.

[0098] The polyfunctional thiols include, for example, hexanedithiol, decanedithiol, 1,4-butanediol bisthiopropionate, 1,4-butanediol bisthioglycolate, ethylene glycol bisthioglycolate, ethylene glycol bisthiopropionate, trimethylolpropane tristthioglycolate, trimethylolpropane tristthiopropionate, trimethylolpropane tris(3-mercaptobutyrate), pentaerythritol tetrakisthioglycolate, pentaerythritol tetrakisthiopropionate, tris(2-hydroxyethyl) isocyanurate trimercaptopropionate, 1,4-dimethylmercaptobenzene, 2,4,6-trimercapto-s-triazine, 2-(N,N-dibutylamino)-4,6-dimercapto-s-triazine, etc. Preferably, ethylene glycol bisthiopropionate, trimethylolpropane tristthiopropionate, pentaerythritol tetrakisthiopropionate, etc. are included.

[0099] The thiol-based chain transfer agent (F) can be used alone or in combination of two or more.

[0100] From the viewpoints of line width stability of the pattern, adhesion, solvent resistance at low-temperature post-baking, and high-temperature and high-humidity resistance, the content of the thiol-based chain transfer agent (F) is preferably 0.1 to 1.0% by mass, more preferably 0.2 to 0.8% by mass, in 100% by mass of the non-volatile content of the photosensitive composition.

[0101] [Thermosetting compound (G)] The photosensitive composition of the present invention preferably contains a thermosetting compound (G). Thereby, the thermosetting compound (G) crosslinks during post-baking, and the solvent resistance and high-temperature and high-humidity resistance of the cured film are further improved.

[0102] The thermosetting compound (G) may be a low-molecular compound or a high-molecular compound such as a resin. Examples of the thermosetting compound (G) include an epoxy compound, an oxetane compound, a benzoguanamine compound, a rosin-modified maleic acid compound, a rosin-modified fumaric acid compound, a melamine compound, a urea compound, and a phenol compound. Among these, from the viewpoint of suppressing foreign substances, an epoxy compound and an oxetane compound are preferred, and an epoxy compound is more preferred.

[0103] (Epoxy compound) The epoxy compound is preferably a compound having an aromatic ring and / or an aliphatic ring, and more preferably a compound having an aliphatic ring from the viewpoints of solvent resistance and high-temperature and high-humidity resistance. The epoxy group is preferably bonded to the aromatic ring and / or the aliphatic ring via a single bond or a linking group. Examples of the linking group include an alkyl group, an arylene group, -O-, -NR- (R represents a hydrogen atom, an alkyl group which may have a substituent, or an aryl group which may have a substituent), -SO2-, -CO-, -O-, -S-. In the case of a structure having an aliphatic ring, it is more preferable that the epoxy group is bonded to the aliphatic ring via a single bond.

[0104] From the viewpoints of solvent resistance and high-temperature and high-humidity resistance, the epoxy compound is preferably a compound having 5 to 50 epoxy groups in the molecule, and more preferably a compound having 10 to 30 epoxy groups.

[0105] Epoxy compounds include, for example, polycondensates of bisphenols (such as bisphenol A, bisphenol F, bisphenol S, biphenol, bisphenol AD, etc.), phenols (such as phenol, alkyl-substituted phenols, aromatic-substituted phenols, naphthol, alkyl-substituted naphthol, dihydroxybenzene, alkyl-substituted dihydroxybenzene, dihydroxynaphthalene, etc.) and various aldehydes (such as formaldehyde, acetaldehyde, alkyl aldehydes, benzaldehyde, alkyl-substituted benzaldehyde, hydroxybenzaldehyde, naphthaldehyde, glutaraldehyde, phthalaldehyde, crotonaldehyde, cinnamaldehyde, etc.), polymers of phenols and various diene compounds (such as dicyclopentadiene, terpenes, vinylcyclohexene, norbornadiene, vinylnorbornene, tetrahydroindene, divinylbenzene, divinylbiphenyl, diisopropenylbiphenyl, butadiene, isoprene, etc.), polycondensates of phenols and ketones (such as acetone, methyl ethyl ketone, methyl isobutyl ketone, acetophenone, benzophenone, etc.), polycondensates of phenols and aromatic dimethanols (such as benzenedimethanol, α,α,α’,α’-benzenedimethanol, biphenyldimethanol, α,α,α’,α’-biphenyldimethanol, etc.), polycondensates of phenols and aromatic dichloromethyls (such as α,α’-dichloroxylene, bischloromethylbiphenyl, etc.), polycondensates of bisphenols and various aldehydes, glycidyl ether-based epoxy resins obtained by glycidylating alcohols, etc., alicyclic epoxy resins, heterocyclic epoxy resins, aliphatic epoxy resins, glycidylamine-based epoxy resins, glycidyl ester-based epoxy resins, and the like.

[0106] Commercially available products include, for example, Epicoat 807, 815, 825, 827, 828, 190P, 191P manufactured by Yuka Shell Epoxy Co., Ltd., TECHMORE VG3101L manufactured by Mitsui Chemicals, Inc., EPPN-201, 501H, 502H manufactured by Nippon Kayaku Co., Ltd., EOCN-102S, 103S, 104S manufactured by Nippon Kayaku Co., Ltd., Epicoat 1004, 1256 manufactured by Japan Epoxy Resins Co., Ltd., JER1032H60, 157S65, 157S70, 152, 154 manufactured by Japan Epoxy Resins Co., Ltd., Celloxide 2021, EHPE-3150 manufactured by Daicel Chemical Industries, Ltd., Denacol EX-211, 212, 252, 313, 314, 321, 411, 421, 512, 521, 611, 612, 614, 614B, 622, 711, 721 manufactured by Nagase ChemteX Corporation, TEPIC-L, H, S, etc. manufactured by Nissan Chemical Industries, Ltd.

[0107] From the viewpoints of solvent resistance and high-temperature and high-humidity resistance in low-temperature post-baking, the content of the epoxy compound is preferably 0.5 to 20% by mass, more preferably 1 to 10% by mass, based on 100% by mass of the non-volatile content of the photosensitive composition.

[0108] (Oxetane compound) The oxetane compound is a known compound having an oxetane group. Examples of the oxetane compound include monofunctional oxetane compounds, difunctional oxetane compounds, and trifunctional or higher oxetane compounds.

[0109] Examples of the monofunctional oxetane compound include (3-ethyloxetan-3-yl)methyl acrylate, (3-ethyloxetan-3-yl)methyl methacrylate, 3-ethyl-3-hydroxymethyloxetane, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-(phenoxymethyl)oxetane, 3-ethyl-3-(2-methacryloxymethyl)oxetane, 3-ethyl-3-{[3-(triethoxysilyl)propoxy]methyl}oxetane, and the like.

[0110] Commercially available products include, for example, OXE-10, 30 manufactured by Osaka Organic Chemical Industry Co., Ltd., OXT-101, 212 manufactured by Toagosei Co., Ltd., and the like.

[0111] The bifunctional oxetane compounds include, for example, 4,4'-bis[(3-ethyl-3-oxetanyl)methoxymethyl]biphenyl, 1,4-bis[(3-ethyl-3-oxetanyl)methoxymethyl]benzene, 1,4-bis{[(3-ethyl-3-oxetanyl)methoxy]methyl}benzene, di[1-ethyl(3-oxetanyl)]methyl ether, 3-ethyl-3-hydroxymethyloxetane, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-(2-phenoxymethyl)oxetane, 3,7-bis(3-oxetanyl)-5-oxa-nonane, 1,2-bis[(3-ethyl-3-oxetanylmethoxy)methyl]ethane, 1,3-bis[(3-ethyl-3-oxetanylmethoxy)methyl]propane, ethylene glycol bis(3-ethyl-3-oxetanylmethyl)ether, dicyclopentenyl bis(3-ethyl-3-oxetanylmethyl)ether, triethylene glycol bis(3-ethyl-3-oxetanylmethyl)ether, tetraethylene glycol bis(3-ethyl-3-oxetanylmethyl)ether, 1,4-bis(3-ethyl-3-oxetanylmethoxy)butane, 1,6-bis(3-ethyl-3-oxetanylmethoxy)hexane, polyethylene glycol bis(3-ethyl-3-oxetanylmethyl)ether, ethylene oxide (EO) modified bisphenol A bis(3-ethyl-3-oxetanylmethyl)ether, propylene oxide (PO) modified bisphenol A bis(3-ethyl-3-oxetanylmethyl)ether, EO modified hydrogenated bisphenol A bis(3-ethyl-3-oxetanylmethyl)ether, PO modified hydrogenated bisphenol A bis(3-ethyl-3-oxetanylmethyl)ether, EO modified bisphenol F (3-ethyl-3-oxetanylmethyl)ether, etc.

[0112] Commercially available products include, for example, OXBP and OXTP manufactured by Ube Industries, Ltd., and OXT-121 and 221 manufactured by Toagosei Co., Ltd.

[0113] Oxetane compounds having three or more functional groups include, for example, pentaerythritol tris(3-ethyl-3-oxetanylmethyl) ether, pentaerythritol tetrakis(3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol hexa(3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol pentakis(3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol tetrakis(3-ethyl-3-oxetanylmethyl) ether, caprolactone-modified dipentaerythritol hexa(3-ethyl-3-oxetanylmethyl) ether, caprolactone-modified dipentaerythritol pentakis(3-ethyl-3-oxetanylmethyl) ether, ditrimethylolpropane tetrakis(3-ethyl-3-oxetanylmethyl) ether, resins containing oxetane groups (for example, oxetane-modified phenol novolak resins described in Patent No. 3783462, etc.), and polymers obtained by radical polymerization of (meth)acrylic monomers such as the aforementioned OXE-30.

[0114] From the viewpoints of solvent resistance in low-temperature post-baking and high-temperature and high-humidity resistance, the content of the oxetane compound is preferably 0.5 to 20% by mass, more preferably 1 to 10% by mass, based on 100% by mass of the non-volatile content of the photosensitive composition.

[0115] The thermosetting compound (G) can be used alone or in combination of two or more.

[0116] [Hardener (hardening accelerator)] In order to assist the curing of the thermosetting compound (G), a curing agent (curing accelerator) can be used in combination with the photosensitive composition of the present invention. Examples of the curing agent include amine compounds, acid anhydrides, active esters, carboxylic acid compounds, sulfonic acid compounds, and the like. Examples of the curing agent include amine compounds (e.g., dicyandiamide, benzyldimethylamine, 4-(dimethylamino)-N,N-dimethylbenzylamine, 4-methoxy-N,N-dimethylbenzylamine, 4-methyl-N,N-dimethylbenzylamine, etc.), quaternary ammonium salt compounds (e.g., triethylbenzylammonium chloride, etc.), blocked isocyanate compounds (e.g., dimethylamine, etc.), imidazole derivatives, bicyclic amidine compounds and their salts (e.g., imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 4-phenylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-(2-cyanoethyl)-2-ethyl-4-methylimidazole, etc.), phosphorus compounds (e.g., triphenylphosphine, etc.), S-triazine derivatives (e.g., 2,4-diamino-6-methacryloyloxyethyl-S-triazine, 2-vinyl-2,4-diamino-S-triazine, 2-vinyl-4,6-diamino-S-triazine·isocyanuric acid adduct, 2,4-diamino-6-methacryloyloxyethyl-S-triazine·isocyanuric acid adduct, etc.), and the like.

[0117] The curing agent can be used alone or in combination of two or more.

[0118] The content of the curing agent is preferably 0.01 to 15 parts by mass with respect to 100 parts by mass of the thermosetting compound (G).

[0119] [Dye Derivative (H)] The photosensitive composition of the present invention can contain a dye derivative (H).

[0120] The pigment derivative (H) is not particularly limited, and known compounds can be used. For example, compounds having a structure in which a part of the pigment is substituted with an acidic group, a basic group, a neutral group, etc. can be mentioned. Specifically, compounds having an acidic substituent such as a sulfo group, a carboxy group, a phosphoric acid group, and amine salts thereof, compounds having a basic substituent such as a sulfonamide group or a tertiary amino group at the terminal, and compounds having a neutral substituent such as a phenyl group or a phthalimidoalkyl group can be mentioned. Examples of the pigment include diketopyrrolopyrrole compounds, phthalocyanine compounds, anthraquinone compounds, quinacridone compounds, dioxazine compounds, perinone compounds, perylene compounds, thiazine indigo compounds, triazine compounds, benzimidazolone compounds, benzisoindole compounds, isoindoline compounds, isoindolinone compounds, quinophthalone compounds, naphthol compounds, squarylium compounds, threne compounds, naphthalocyanine compounds, etc.

[0121] Specifically, examples of the pyrrolopyrrole-based pigment derivatives include those described in JP-A No. 2001-220520, WO 2009 / 081930, WO 2011 / 052617, WO 2012 / 102399, JP-A No. 2017-156397, WO 2018 / 101189; examples of the phthalocyanine-based pigment derivatives include those described in JP-A No. 2007-226161, WO 2016 / 163351, JP-A No. 2017-165820, Patent No. 5753266; examples of the anthraquinone-based pigment derivatives include those described in JP-A No. 63-264674, JP-A No. 09-272812, JP-A No. 10-245501, JP-A No. 10-265697, JP-A No. 2007-079094, WO 2009 / 025325; examples of the quinacridone-based pigment derivatives include those described in JP-A No. 48-54128, JP-A No. 03-9961, JP-A No. 2000-273383; examples of the dioxazine-based pigment derivatives include those described in JP-A No. 2011-162662; examples of the thiazine indigo-based pigment derivatives include those described in JP-A No. 2007-314785; examples of the triazine-based pigment derivatives include those described in JP-A No. 61-246261, JP-A No. 11-199796, JP-A No. 2003-165922, JP-A No. 2003-168208, JP-A No. 2004-217842, JP-A No. 2007-314681; examples of the benzisoindole-based pigment derivatives include those described in JP-A No. 2009-57478; examples of the quinophthalone-based pigment derivatives include those described in JP-A No. 2003-167112, JP-A No. 2006-291194, JP-A No. 2008-31281, JP-A No. 2012-226110; examples of the naphthol-based pigment derivatives include those described in JP-A No. 2012-208329, JP-A No. 2014-5439; examples of the squarylium-based pigment derivatives include those described in WO 2020 / 054718; examples of the azo-based pigment derivatives include those described in JP-A No. 2001-172520, JP-A No. 2012-172092; examples of the acidic substituents include those described in JP-A No. 2004-307854; examples of the basic substituents include those described in JP-A No. 2002-201377, JP-A No. 2003-171594, JP-A No. 2005-181383, JP-A No. 2005-213404, etc. Known pigment derivatives are exemplified.In these documents, they may be described as derivatives, pigment derivatives, dispersants, dispersion aids, pigment dispersants, or simply compounds, etc., but they are synonymous with the dye derivative (H).

[0122] The dye derivative (H) can be used alone or in combination of two or more kinds.

[0123] The content of the dye derivative (H) is preferably 1 to 20 parts by mass, more preferably 2 to 10 parts by mass, based on 100 parts by mass of the colorant (A).

[0124] [Sensitizer (I)] The photosensitive composition of the present invention can contain a sensitizer (I).

[0125] Examples of the sensitizer (I) include chalcone compounds, unsaturated ketones typified by dibenzalacetone, 1,2-diketone compounds typified by benzyl and camphorquinone, benzoin compounds, fluorene compounds, naphthoquinone compounds, anthraquinone compounds, xanthene compounds, thioxanthene compounds, xanthone compounds, thioxanthone compounds, coumarin compounds, ketocoumarin compounds, polymethine dyes such as cyanine compounds, merocyanine compounds, oxonol compounds, acridine compounds, azine compounds, thiazine compounds, oxazine compounds, indoline compounds, azulene compounds, azulenium compounds, squarylium compounds, porphyrin compounds, tetraphenylporphyrin compounds, triarylmethane compounds, tetrabenzoporphyrin compounds, tetrapyrazinoporphyrazine compounds, phthalocyanine compounds, tetraazaporphyrazine compounds, tetraquinoxalyloporphyrazine compounds, naphthalocyanine compounds, subphthalocyanine compounds, pyrylium compounds, thiopyrylium compounds, tetraphyllin compounds, annulene compounds, spiropyran compounds, spirooxazine compounds, thiospiropyran compounds, metal arene complexes, organoruthenium complexes, or benzophenone compounds, etc. Among these, from the viewpoint of pattern formation, thioxanthone compounds and benzophenone compounds are preferred.

[0126] Examples of the thioxanthone-based compound include 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2,4-dichlorothioxanthone, 2-isopropylthioxanthone, 4-isopropylthioxanthone, 1-chloro-4-propoxythioxanthone, etc. Among these, 2,4-diethylthioxanthone is preferred.

[0127] Examples of the benzophenone-based compound include 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 2-aminobenzophenone, etc. Among these, 4,4'-bis(diethylamino)benzophenone is preferred.

[0128] The sensitizer (I) can be used alone or in combination of two or more.

[0129] The content of the sensitizer (I) is preferably 10 to 400 parts by mass, more preferably 20 to 300 parts by mass, based on 100 parts by mass of the photopolymerization initiator (D).

[0130] [Polymerization inhibitor (J)] The photosensitive composition of the present invention can contain a polymerization inhibitor (J).

[0131] The polymerization inhibitor (J) is, for example, alkylcatechol compounds such as catechol, resorcinol, 1,4-hydroquinone, 2-methylcatechol, 3-methylcatechol, 4-methylcatechol, 2-ethylcatechol, 3-ethylcatechol, 4-ethylcatechol, 2-propylcatechol, 3-propylcatechol, 4-propylcatechol, 2-n-butylcatechol, 3-n-butylcatechol, 4-n-butylcatechol, 2-t-butylcatechol, 3-t-butylcatechol, 4-t-butylcatechol, 3,5-di-t-butylcatechol; alkylresorcinol compounds such as 2-methylresorcinol, 4-methylresorcinol, 2-ethylresorcinol, 4-ethylresorcinol, 2-propylresorcinol, 4-propylresorcinol, 2-n-butylresorcinol, 4-n-butylresorcinol, 2-t-butylresorcinol, 4-t-butylresorcinol; alkylhydroquinone compounds such as methylhydroquinone, ethylhydroquinone, propylhydroquinone, t-butylhydroquinone, 2,5-di-t-butylhydroquinone; phosphine compounds such as tributylphosphine, trioctylphosphine, tricyclohexylphosphine, triphenylphosphine, tribenzylphosphine; phosphine oxide compounds such as trioctylphosphine oxide, triphenylphosphine oxide; phosphite compounds such as triphenylphosphite, trisnonylphenylphosphite; pyrogallol, phloroglucin, and the like.

[0132] The content of the polymerization inhibitor (J) is preferably 0.01 to 0.4% by mass in 100% by mass of the non-volatile components of the photosensitive composition.

[0133] [Ultraviolet absorber (K)] The photosensitive composition of the present invention can contain an ultraviolet absorber (K).

[0134] The ultraviolet absorber (K) is an organic compound having an ultraviolet absorption function, and examples thereof include benzotriazole-based organic compounds, triazine-based organic compounds, benzophenone-based organic compounds, salicylic acid ester-based organic compounds, cyanoacrylate-based organic compounds, and salicylate-based organic compounds.

[0135] Benzotriazole compounds include, for example, 2-(5-methyl-2-hydroxyphenyl)benzotriazole, 2-(2-hydroxy-5-t-butylphenyl)-2H-benzotriazole, 2-[2-hydroxy-3,5-bis(α,α-dimethylbenzyl)phenyl]-2H-benzotriazole, 2-(3-t-butyl-5-methyl-2-hydroxyphenyl)-5-chlorobenzotriazole, 2-(2'-hydroxy-5'-t-octylphenyl)benzotriazole, a mixture of 5% 2-methoxy-1-methylethyl acetate and 95% benzenepropanoic acid, 3-(2H-benzotriazol-2-yl)-(1,1-dimethylethyl)-4-hydroxy, C7-9 side chain and straight-chain alkyl ester, 2-(2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol, 2-(2H-benzotriazol-2-yl)-6-(1-methyl-1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol, the reaction product of methyl 3-(3-(2H-benzotriazol-2-yl)-5-t-butyl-4-hydroxyphenyl)propionate / polyethylene glycol 300, 2-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol, 2,2'-methylenebis[6-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol], 2-(2H-benzotriazol-2-yl)-p-cresol, 2-(5-chloro-2H-benzotriazol-2-yl)-6-t-butyl-4-methylphenol, 2-(3,5-di-t-amyl-2-hydroxyphenyl)benzotriazole, 2-[2-hydroxy-5-[2-(methacryloyloxy)ethyl]phenyl]-2H-benzotriazole, octyl 3-[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl)phenyl]propionate, 2-ethylhexyl 3-[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl)phenyl]propionate.

[0136] Commercially available products include, for example, TINUVIN P, PS, 234, 326, 329, 384-2, 900, 928, 99-2, 1130 manufactured by BASF Japan Ltd., Adeka Stub LA-29, LA-31RG, LA-32, LA-36 manufactured by ADEKA Corporation, KEMISORB 71, 73, 74, 79, 279 manufactured by Chemipro Kasei Co., Ltd., RUVA-93 manufactured by Otsuka Chemical Co., Ltd., and the like.

[0137] Triazine compounds include, for example, 2,4-bis(2,4-dimethylphenyl)-6-(2-hydroxy-4-n-octyloxyphenyl)-1,3,5-triazine, 2-[4,6-bis(2,4-dimethylphenyl)-1,3,5-triazin-2-yl]-5-[3-(dodecyloxy)-2-hydroxypropoxy]phenol, the reaction product of 2-(2,4-dihydroxyphenyl)-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine and (2-ethylhexyl)-glycidic acid ester, 2,4-bis[2-hydroxy-4-butoxyphenyl]-6-(2,4-dibutoxyphenyl)-1,3,5-triazine, 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-(hexyloxy)phenol, 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-[2-(2-ethylhexanoyloxy)ethoxy]phenol, 2,4,6-tris(2-hydroxy-4-hexyloxy-3-methylphenyl)-1,3,5-triazine, and the like.

[0138] Commercially available products include, for example, KEMISORB 102 manufactured by Chemipro Kasei Co., Ltd., TINUVIN 400, 405, 460, 477, 479, 1577ED manufactured by BASF Japan Ltd., Adeka Stub LA-46, LA-F70 manufactured by ADEKA Corporation, CYASORB UV-1164 manufactured by Sankyo Chemical Co., Ltd., and the like.

[0139] Benzophenone compounds include, for example, 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-methoxybenzophenone 5-sulfonic acid-3 water temperature, 2-hydroxy-4-n-octoxybenzophenone, 2,2'-dihydroxy-4-methoxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 4-dodecyloxy-2-hydroxybenzophenone, 2-hydroxy-4-octadecyloxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 2,2',4,4'-tetrahydroxybenzophenone, 2-hydroxy-4-methoxy-2'-carboxybenzophenone, and the like.

[0140] Commercially available products include, for example, KEMISORB 10, 11, 11S, 12, 111 manufactured by Chemipro Kasei Co., Ltd., SEESORB 101, 107 manufactured by Shipro Kasei Co., Ltd., Adeka Stab 1413 manufactured by ADEKA Corporation, UV-12 manufactured by Sankyo Chemical Co., Ltd., and the like.

[0141] Salicylic acid ester compounds include, for example, phenyl salicylate, p-octylphenyl salicylate, p-tert-butylphenyl salicylate, and the like.

[0142] The content of the ultraviolet absorber (K) is preferably 5 to 70% by mass in a total of 100% by mass of the photopolymerization initiator (D) and the ultraviolet absorber (K).

[0143] [Antioxidant (L)] The photosensitive composition of the present invention can contain an antioxidant (L). The antioxidant (L) prevents the photopolymerization initiator (D) and the thermosetting compound (G) in the photosensitive coloring composition from being oxidized and yellowed by the heat treatment during thermosetting or ITO annealing.

[0144] The antioxidant (L) includes, for example, hindered phenol-based, hindered amine-based, phosphorus-based, sulfur-based, and hydroxylamine-based compounds, etc. Among these, hindered phenol-based antioxidants, hindered amine-based antioxidants, phosphorus-based antioxidants, and sulfur-based antioxidants are preferred.

[0145] Hindered phenolic antioxidants include, for example, 1,3,5-tris(3,5-di-t-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 1,1,3-tris-(2'-methyl-4'-hydroxy-5'-t-butylphenyl)-butane, 4,4'-butylidene-bis-(2-t-butyl-5-methylphenol), stearyl 3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, pentaerythritol tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 3,9-bis[2-[3-(3-t-butyl-4-hydroxy-5-methylphenyl)propionyloxy]-1,1-dimethylethyl]-2,4,8,10-tetraoxaspiro[5.5] Undecane, 1,3,5-tris(3,5-di-t-butyl-4-hydroxyphenylmethyl)-2,4,6-trimethylbenzene, 1,3,5-tris(3-hydroxy-4-t-butyl-2,6-dimethylbenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 2,2'-methylenebis(6-t-butyl-4-ethylphenol), 2,2'-thiodiethylbis-(3,5-di-t-butyl-4-hydroxyphenyl)-propionate, N,N-hexamethylenebis(3,5-di-t-butyl-4-hydroxy-hydrocinnamide), i-octyl 3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 4,6-bis(dodecylthiomethyl)-o-cresol, calcium salt of 3,5-di-t-butyl-4-hydroxybenzylphosphonic acid monoethyl ester, 4,6-bis(octylthiomethyl)-o-cresol, bis[3-(3-methyl-4-hydroxy-5-t-butylphenyl)propionic acid] ethylenebisoxybisethylene, 1,6-hexanediol bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 2,4-bis-(n-octylthio)-6-(4-hydroxy-3,5-di-t-butylanilino)-1,3,5-triazine, 2,2'-thio-bis-(6-t-butyl-4-methylphenol), 2,5-di-t-amyl-hydroquinone, 2,6-di-t-butyl-4-nonylphenol, 2,2'-isobutylidene-bis-(4,6-dimethyl-phenol), 2,2'-methylene-bis-(6-(1-methyl-cyclohexyl)-p-cresol), 2,4-dimethyl-6-(1-methyl-cyclohexyl)-phenol, and the like can be mentioned.

[0146] Commercially available products include, for example, Adeka Stab AO-20, AO-30, AO-40, AO-50, AO-60, AO-80, AO-330 manufactured by ADEKA, KEMINOX 101, 179, 76, 9425 manufactured by Chemipro, IRGANOX 1010, 1035, 1076, 1098, 1135, 1330, 1726, 1425WL, 1520L, 245, 259, 3114, 5057, 565 manufactured by BASF Japan, and Cyanox CY-1790, CY-2777 manufactured by Sankyo Chemical, etc.

[0147] Hindered amine antioxidants include, for example, tetrakis(1,2,2,6,6-pentamethyl-4-piperidyl)-1,2,3,4-butanetetracarboxylate, tetrakis(2,2,6,6-tetramethyl-4-piperidyl)1,2,3,4-butanetetracarboxylate, bis(1,2,2,6,6-pentamethyl-4-piperidyl) sebacate, bis(2,2,6,6-tetramethyl-4-piperidyl) sebacate, bis(1-undecanoxy-2,2,6,6-tetramethylpiperidin-4-yl) carbonate, 1,2,2,6,6-pentamethyl-4-piperidyl methacrylate, 2,2,6,6-tetramethyl-4-piperidyl methacrylate, the polycondensate of dimethyl succinate and 1-(2-hydroxyethyl)-4-hydroxy-2,2,6,6-tetramethylpiperidine, poly[[6-[(1,1,3,3-tetramethylbutyl)amino]-s-triazine-2,4-diyl]-[(2,2,6,6-tetramethyl-4-piperidyl)imino]-hexamethylene-[(2,2,6,6-tetramethyl-4-piperidyl)imino]], the ester of 4-hydroxy-2,2,6,6-tetramethyl-1-piperidineethanol and 3,5,5-trimethylhexanoic acid, N,N’-4,7-tetrakis〔4,6-bis{N-butyl-N-(1,2,2,6,6-pentamethyl-4-piperidyl)amino}-1,3,5-triazine-2-yl〕-4,7-diazadecane-1,10-diamine, bis(2,2,6,6-tetramethyl-1-(octyloxy)-4-piperidinyl) decanedioate, the reaction product of 1,1-dimethylethyl hydroperoxide and octane, bis(1,2,2,6,6-pentamethyl-4-pyrperidyl)[[3,5-bis(1,1dimethylethyl)-4-hydroxyphenyl]methyl]butyl malonate methyl 1,2,2,6,6-pentamethyl-4-pyrperidyl sebacate, poly[[6-morpholino-s-triazine-2,4-diyl]-[(2,2,6,6-tetramethyl-4-piperidyl)imino]-hexamethylene-[(2,2,6,6-tetramethyl-4-piperidyl)imino]], 2,2,6,6-tetramethyl-4-piperidyl-C12-21 and C18 unsaturated fatty acid esters, N,N’-bis(2,2,6,6-tetramethyl-4-piperidyl)-1,Examples include 1,6 - hexamethylenediamine, 2 - methyl - 2 - (2,2,6,6 - tetramethyl - 4 - piperidyl) amino - N - (2,2,6,6 - tetramethyl - 4 - piperidyl) propionamide, etc.

[0148] Commercially available products include, for example, AdekaStab LA - 52, LA - 57, LA - 63P, LA - 68, LA - 72, LA - 77Y, LA - 77G, LA - 81, LA - 82, LA - 87, LA - 402F, LA - 502XP manufactured by ADEKA Corporation; KAMISTAB 29, 62, 77, 94 manufactured by Chemipro Kasei Co., Ltd.; Tinuvin 111FDL, 123, 144, 249, 292, 5100 manufactured by BASF Japan Ltd.; and Cyasorb - UV - 3346, UV - 3529, UV - 3853 manufactured by Sankyo Chemical Co., Ltd., etc.

[0149] Phosphorus-based antioxidants include, for example, bis(2,6-di-t-butyl-4-methylphenyl)pentaerythritol diphosphite, distearyl pentaerythritol diphosphite, 2,2'-methylenebis(4,6-di-t-butylphenyl) 2-ethylhexyl phosphite, tris(2,4-di-t-butylphenyl) phosphite, tris(nonylphenyl) phosphite, tetra(C12-C15 alkyl)-4,4'-isopropylidenediphenyldiphosphite, diphenyl mono(2-ethylhexyl) phosphite, diphenylisodecyl phosphite, tris(isodecyl) phosphite, triphenyl phosphite, tetrakis(2,4-di-t-butylphenyl)-4,4-biphenyldiphosphonite, tris(tridecyl) phosphite, phenyl isooctyl phosphite, phenyl isodecyl phosphite, phenyl di(tridecyl) phosphite, diphenyl isooctyl phosphite, diphenyl tridecyl phosphite, 4,4'-isopropylidenediphenol alkyl phosphite, trisnonylphenyl phosphite, trisdinonylphenyl phosphite, tris(biphenyl) phosphite, bis(2,4-di-t-butylphenyl)pentaerythritol diphosphite, bis(nonylphenyl)pentaerythritol diphosphite, phenyl bisphenol A pentaerythritol diphosphite, tetratridecyl 4,4'-butylidenebis(3-methyl-6-t-butylphenol) diphosphite, hexatridecyl 1,1,3-tris(2-methyl-4-hydroxy-5-t-butylphenyl)butane triphosphite, 3,5-di-t-butyl-4-hydroxybenzyl phosphite diethyl ester, sodium bis(4-t-butylphenyl) phosphite, sodium-2,2-methylenebis(4,6-di-t-butylphenyl) phosphite, 1,3-bis(diphenoxyphosphonyloxy)-benzene, ethyl bis(2,4-di-t-butyl-6-methylphenyl) phosphite, etc.

[0150] Commercially available products include, for example, Adeka Stab PEP-36, PEP-8, HP-10, 2112, 1178, 1500, C, 135A, 3010, TPP manufactured by ADEKA Corporation; IRGAFOS 168 manufactured by BASF Japan Ltd.; Hostanox P-EPQ manufactured by Clariant Chemicals, etc.

[0151] Examples of sulfur-based antioxidants include 2,2-bis{[3-(dodecylthio)-1-oxopropoxy]methyl}propane-1,3-diyl bis[3-(dodecylthio)propionate], ditridecyl 3,3'-thiobispropionate, 2,2'-thio-diethylenebis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], 2,4-bis[(octylthio)methyl]-o-cresol, 2,4-bis[(laurylthio)methyl]-o-cresol, etc.

[0152] Commercially available products include, for example, Adeka Stab AO-412S, AO-503 manufactured by ADEKA Corporation; Keminox PLS manufactured by Chemipro Kasei Co., Ltd., etc.

[0153] The antioxidant (L) can be used alone or in combination of two or more.

[0154] The content of the antioxidant (L) is preferably 0.5 to 5.0% by mass in 100% by mass of the non-volatile components of the photosensitive composition. When contained in an appropriate amount, the transmittance, spectral characteristics, and sensitivity are improved.

[0155] [Leveling agent (M)] The photosensitive composition of the present invention can contain a leveling agent (M). Thereby, the wettability and drying property with respect to the substrate during coating are further improved. Examples of the leveling agent (M) include silicone-based surfactants, fluorine-based surfactants, nonionic surfactants, cationic surfactants, anionic surfactants, amphoteric surfactants, etc.

[0156] Examples of the silicone-based surfactants include linear polymers composed of siloxane bonds and modified siloxane polymers having organic groups introduced into the side chains or terminals.

[0157] Commercially available products include, for example, BYK-300, 306, 310, 313, 315N, 320, 322, 323, 330, 331, 333, 342, 345, 346, 347, 348, 349, 370, 377, 378, 3455, UV3510, 3570 manufactured by BYK-Chemie GmbH; FZ-7002, 2110, 2122, 2123, 2191, 5609 manufactured by Toray Dow Corning Co., Ltd.; X-22-4952, X-22-4272, X-22-6266, KF-351A, KF-354L, KF-355A, KF-945, KF-640, KF-642, KF-643, X-22-4515, KF-6004, KP-341 manufactured by Shin-Etsu Chemical Co., Ltd.

[0158] Examples of the fluorosurfactant include a surfactant or a leveling agent having a fluorocarbon chain.

[0159] Commercially available products include, for example, Surflon S-242, 243, 420, 611, 651, 386 manufactured by AGC Seimi Chemical Co., Ltd.; Megafac F-253, 477, 551, 552, 555, 558, 560, 570, 575, 576, R-40-LM, R-41, RS-72-K, DS-21 manufactured by DIC Corporation; FC-4430, 4432 manufactured by Sumitomo 3M Limited; EF-PP31N09, EF-PP33G1, EF-PP32C1 manufactured by Mitsubishi Materials Electronic Chemicals Co., Ltd.; and Fugenol 602A manufactured by Neos Co., Ltd.

[0160] Nonionic surfactants include, for example, polyoxyethylene lauryl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene alkyl ether, polyoxyethylene myristyl ether, polyoxyethylene octyldodecyl ether, polyoxyalkylene alkyl ether, polyoxyphenylene distyrylphenyl ether, polyoxyethylene tribenzylphenyl ether, polyoxyethylene polyoxypropylene glycol, polyoxyalkylene alkenyl ether, polyoxyethylene nonylphenyl ether, polyoxyethylene alkyl ether phosphate ester, sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan distearate, sorbitan tristearate, sorbitan monooleate, sorbitan trioleate, sorbitan sesquioleate, polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monopalmitate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan tristearate, polyoxyethylene sorbitan monooleate, polyoxyethylene sorbitan triisostearate, polyoxyethylene sorbitol tetraoleate, glycerol monostearate, glycerol monooleate, polyethylene glycol monolaurate, polyethylene glycol monostearate, polyethylene glycol distearate, polyethylene glycol monooleate, polyoxyethylene hydrogenated castor oil, polyoxyethylene alkylamine, alkylalkanolamide, alkylimidazoline, and the like.

[0161] Commercially available products include, for example, Kao's Emulgen 103, 104P, 106, 108, 109P, 120, 123P, 130K, 147, 150, 210P, 220, 306P, 320P, 350, 404, 408, 409PV, 420, 430, 705, 707, 709, 1108, 1118S-70, 1135S-70, 1150S-60, 2020G-HA, 2025G, LS-106, LS-110, LS-114, MS-110, A-60, A-90, B-66, PP-290, Latemul PD-420, PD-430, PD-430S, PD-450, Leodol SP-L10, SP-P10, SP-S10V, SP-S20, SP-S30V, SP-O10V, SP-O30V, Super SP-L10, AS-10V, AO-10V, AO-15V, TW-L120, TW-L106, TW-P120, TW-S120V, TW-S320V, TW-O120V, TW-O106V, TW-IS399C, Super TW-L120, 430V, 440V, 460V, MS-50, MS-60, MO-60, MS-165V, Emanon 1112, 3199V, 3299V, 3299RV, 4110, CH-25, CH-40, CH-60(K), Amite 102, 105, 105A, 302, 320, Aminone PK-02S, L-02, Homogenol L-95, ADEKA's Adekaplonic (registered trademark) L-23, 31, 44, 61, 62, 64, 71, 72, 101, 121, TR-701, 702, 704, 913R, copolymer of (meth)acrylic acid made by Kyoeisha Chemical Co., Ltd., Polyflow - No.75, No.90, No.95, etc.

[0162] Examples of cationic surfactants include alkylamine salts, alkyl quaternary ammonium salts such as lauryltrimethylammonium chloride, stearyltrimethylammonium chloride, cetyltrimethylammonium chloride, and ethylene oxide adducts thereof.

[0163] Commercially available products include, for example, Kao's Acetamine 24, Cotamine 24P, 60W, 86P Conc, etc.

[0164] Anionic surfactants include, for example, polyoxyethylene alkyl ether sulfates, sodium dodecylbenzenesulfonate, alkali salts of styrene-acrylic acid copolymers, sodium alkylnaphthalenesulfonate, sodium alkyl diphenyl ether disulfonate, lauryl sulfate monoethanolamine, lauryl sulfate triethanolamine, ammonium lauryl sulfate, stearic acid monoethanolamine, sodium stearate, sodium lauryl sulfate, monoethanolamine of styrene-acrylic acid copolymer, polyoxyethylene alkyl ether phosphate esters, and the like.

[0165] Commercially available products include, for example, Ftergent 100, 150 manufactured by Neos Co., Ltd., ADEKA Hope YES-25 manufactured by ADEKA Corporation, ADEKA Coll TS-230E, PS-440E, EC-8600, etc.

[0166] Amphoteric surfactants include, for example, alkyl betaines such as lauric acid amidopropyl betaine, lauryl betaine, cocoamidopropyl betaine, stearyl betaine, alkyl dimethylaminoacetic acid betaine, and alkylamine oxides such as lauryl dimethylamine oxide.

[0167] Commercially available products include Anhtol 20AB, 20BS, 24B, 55AB, 86B, 20Y-B, 20N, etc. manufactured by Kao Corporation.

[0168] The leveling agent (M) can be used alone or in combination of two or more.

[0169] The content of the leveling agent (M) is preferably 0.001 to 2.0% by mass, more preferably 0.005 to 1.0% by mass, in 100% by mass of the non-volatile content of the photosensitive composition. When contained in an appropriate amount, the balance between the coatability and adhesion of the photosensitive composition is further improved.

[0170] [Storage stabilizer (N)] The photosensitive composition of the present invention can contain a storage stabilizer (N). Thereby, the viscosity of the photosensitive composition over time is stabilized. Examples of the storage stabilizer (N) include quaternary ammonium chlorides such as benzyltrimethyl chloride and diethylhydroxyamine, organic acids such as lactic acid and oxalic acid and their methyl ethers, organic phosphines such as t-butylpyrocatechol, tetraethylphosphine, and tetraphenyl, and phosphites, etc.

[0171] The content of the storage stabilizer (N) is preferably 0.05 to 5% by mass in 100% by mass of the nonvolatile content of the photosensitive composition.

[0172] [Adhesion improver (O)] The photosensitive composition of the present invention can contain an adhesion improver (O). Thereby, the adhesion is improved. Also, it becomes easier to form a pattern with a narrow width by the photolithography method.

[0173] The adhesion promoter (O) includes, for example, silane coupling agents. Examples of silane coupling agents include vinyl silanes such as vinyltrimethoxysilane and vinyltriethoxysilane; (meth)acrylic silanes such as 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, and 3-acryloxypropyltrimethoxysilane; epoxy silanes such as 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, and 3-glycidoxypropyltriethoxysilane; amino silanes such as N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethyl-butylidene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane, and the hydrochloride of N-(vinylbenzyl)-2-aminoethyl-3-aminopropyltrimethoxysilane; mercapto silanes such as 3-mercaptopropylmethyldimethoxysilane and 3-mercaptopropyltrimethoxysilane; styryl silanes such as p-styryltrimethoxysilane; ureido silanes such as 3-ureidopropyltriethoxysilane; sulfide silanes such as bis(triethoxysilylpropyl)tetrasulfide; and isocyanate silanes such as 3-isocyanatopropyltriethoxysilane.

[0174] The adhesion promoter (O) can be used alone or in combination of two or more.

[0175] The content of the adhesion promoter (O) is preferably 0.05 to 5% by mass in 100% by mass of the non-volatile content of the photosensitive composition.

[0176] [Organic solvent (P)] The photosensitive composition of the present invention can contain an organic solvent (P).

[0177] The organic solvent (P) is not particularly limited as long as it satisfies the solubility of each component of the photosensitive composition of the present invention and the coatability, and known compounds can be used.

[0178] The organic solvent (P) is, for example, 1,2,3-trichloropropane, 1-methoxy-2-propanol, ethyl lactate, 1,3-butanediol, 1,3-butylene glycol, 1,3-butylene glycol diacetate, 1,4-dioxane, 2-heptanone, 2-methyl-1,3-propanediol, 3,5,5-trimethyl-2-cyclohexen-1-one, 3,3,5-trimethylcyclohexanone, ethyl 3-ethoxypropionate, 3-methyl-1,3-butanediol, 3-methoxy-3-methyl-1-butanol, 3-methoxy-3-methylbutyl acetate, 3-methoxybutanol, 3-methoxybutyl acetate, 4-heptanone, m-xylene, m-diethylbenzene, m-dichlorobenzene, N,N-dimethylacetamide, N,N-dimethylformamide, n-butyl alcohol, n-butylbenzene, n-propyl acetate, N-methylpyrrolidone, o-xylene, toluene, o-chlorotoluene, benzene, o-diethylbenzene, o-dichlorobenzene, p-chlorotoluene, p-diethylbenzene, sec-butylbenzene, tert-butylbenzene, γ-butyrolactone, isobutyl alcohol, isophorone, ethylene glycol diethyl ether, ethylene glycol dibutyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monoethyl ether, ethylene glycol monoethyl ether acetate, ethylene glycol monotertiary butyl ether, ethylene glycol monobutyl ether, ethylene glycol monobutyl ether acetate, ethylene glycol monopropyl ether, ethylene glycol monohexyl ether, ethylene glycol monomethyl ether, ethylene glycol monomethyl ether acetate, diisobutyl ketone, diethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol monoisopropyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate, diethylene glycol monomethyl ether, cyclohexanol, cyclohexanol acetate, cyclohexanone, dipropylene glycol dimethyl ether,Dipropylene glycol methyl ether acetate, dipropylene glycol monoethyl ether, dipropylene glycol monobutyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monomethyl ether, diacetone alcohol, triacetin, tripropylene glycol monobutyl ether, tripropylene glycol monomethyl ether, propylene glycol diacetate, propylene glycol phenyl ether, propylene glycol monoethyl ether, propylene glycol monoethyl ether acetate, propylene glycol monobutyl ether, propylene glycol monopropyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether propionate, benzyl alcohol, methyl isobutyl ketone, methylcyclohexanol, n-amyl acetate, n-butyl acetate, isoamyl acetate, isobutyl acetate, propyl acetate, dibasic acid esters, and the like can be mentioned. Among these, from the viewpoints of solubility in resin and coatability, glycol acetates such as ethyl lactate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, alcohols such as diacetone alcohol, and ketones such as cyclohexanone are preferable.,

[0179] From the environmental aspect, it is preferable that the photosensitive composition of the present invention substantially does not contain organic solvents that are aromatic hydrocarbons (such as toluene, xylene, benzene, chlorobenzene, etc.). Substantially not containing means that it is 50 mass ppm or less in the photosensitive composition, preferably 30 mass ppm or less, and more preferably 10 mass ppm or less.

[0180] The organic solvent (P) can be used alone or in combination of two or more.

[0181] The content of the organic solvent (P) is preferably an amount such that the non-volatile content of the photosensitive composition is about 5 to 50% by mass.

[0182] [Method for Producing Photosensitive Composition] The photosensitive composition of the present invention can be produced, for example, by adding a colorant (A), a dispersion resin (E), an organic solvent (P), etc., and performing a dispersion treatment to produce a dispersion. Then, a binder resin (B), a polymerizable compound (C), a photopolymerization initiator (D), etc. are blended and mixed with the dispersion. Note that the timing of blending each material is arbitrary. Also, the dispersion step can be performed multiple times.

[0183] Examples of the disperser for performing the dispersion treatment include a two-roll mill, a three-roll mill, a ball mill, a horizontal sand mill, a vertical sand mill, an annular bead mill, or an attritor.

[0184] The average dispersed particle diameter (secondary particle diameter) of the colorant (A) in the dispersion is preferably 30 to 200 nm, more preferably 40 to 200 nm. A photosensitive composition with high dispersion stability is easily obtained when it has an appropriate particle diameter.

[0185] As a method for measuring the average dispersed particle diameter (secondary particle diameter), for example, using the Microtrac UPA-EX150 of Nikkiso Co., Ltd. that employs the dynamic light scattering method (FFT power-spectrum method), the particle permeability is set to the absorption mode, the particle shape is set to non-spherical, and the D50 particle diameter is set as the average diameter. As the dilution solvent for measurement, the organic solvent used for dispersion is used respectively, and when measuring the sample processed by ultrasonic immediately after sample preparation, results with less variation are easily obtained and are preferable.

[0186] The photosensitive composition is preferably subjected to removal of coarse particles of 5 μm or more, preferably 1 μm or more, more preferably 0.5 μm or more, and mixed dust by means such as centrifugation, filtration through a sintered filter or a membrane filter. The photosensitive composition of the present invention preferably does not substantially contain particles of 0.5 μm or more, and more preferably does not contain particles of 0.3 μm or less.

[0187] [Optical Filter] The optical filter of the present invention includes a substrate and a cured film formed from a photosensitive composition. It is preferable to form a pattern on the cured film by a photolithography method.

[0188] [Manufacturing method of optical filter] The manufacturing method of the optical filter is not particularly limited. For example, it can be manufactured by performing the following steps: (1) a step of applying a photosensitive composition on a substrate to form a layer of the composition; (2) a step of exposing the layer in a pattern through a mask; (3) a step of developing unexposed portions with an alkali to form a patterned cured film; and (4) a step of heat-treating (post-baking) the pattern. In the present invention, it is preferable to perform the production of the optical filter at a temperature of 130°C or lower, and more preferably at a temperature of 100°C or lower, throughout all steps.

[0189] Hereinafter, the manufacturing method of the optical filter will be described in detail.

[0190] (Step (1)) In the step (1) of forming a layer of the composition, the photosensitive composition is applied on the substrate by a method such as spin coating, roll coating, slit coating, casting coating, or inkjet coating, and dried (pre-baked) at a temperature of 50 to 100°C for 10 to 120 seconds using an oven, hot plate, etc., if necessary. Examples of the substrate include a glass substrate, a resin substrate, and a silicon substrate. Examples of the resin substrate include a polycarbonate substrate, a polyester substrate, an aromatic polyamide substrate, a polyamideimide substrate, and a polyimide substrate. An organic light-emitting layer may be formed on these substrates. The silicon substrate may have, for example, an imaging element such as a CCD or CMOS formed on its surface. Further, a primer layer may be provided on the substrate, if necessary, for improving adhesion to an upper layer, preventing diffusion of substances, and flattening the substrate surface. The film thickness of the layer is preferably 0.05 to 10.0 μm, and more preferably 0.3 to 5.0 μm.

[0191] (Step (2)) In the exposure process, the layer obtained in step (1) is exposed to a specific pattern through a mask using an exposure apparatus such as a stepper, etc. Thereby, a cured film is obtained. Examples of the radiation used for exposure include ultraviolet rays such as g-line (wavelength 436 nm), h-line (wavelength 405 nm), i-line (wavelength 365 nm), etc. Also, light with a wavelength of 300 nm or less can be used. Examples of light with a wavelength of 300 nm or less include KrF line (wavelength 248 nm), ArF (wavelength 193 nm), etc. Also, during exposure, the light may be continuously irradiated for exposure, or the light irradiation and pause may be repeated in a short cycle (for example, at the millisecond level or less) for exposure (pulse exposure).

[0192] (Step (3)) The cured film obtained in step (2) is subjected to an alkali development process, whereby the layer of the composition in the unexposed portion is eluted into the alkaline aqueous solution, and only the cured portion remains to obtain a patterned cured film. Examples of the developer include alkaline compounds such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, aqueous ammonia, ethylamine, diethylamine, dimethylethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, choline, pyrrole, piperidine, 1,8-diazabicyclo-[5.4.0]-7-undecene, etc. The concentration of the alkaline developer is preferably 0.001 to 10% by mass, and more preferably 0.01 to 1% by mass. The pH of the alkaline developer is preferably 11 to 13, and more preferably 11.5 to 12.5. When used at an appropriate pH, roughness and peeling of the pattern are suppressed, and the residual film rate after development is improved.

[0193] Examples of the development method include the dip method, spray method, paddle method, etc. The development temperature is preferably 15 to 40°C. After alkali development, it is preferably washed with pure water.

[0194] (Step (4)) The heat treatment (post-baking) fully cures the patterned cured film obtained in step (3) by heating. The post-baking heating temperature is preferably 130°C or lower, more preferably 100°C or lower. The lower limit of the heating temperature is not particularly limited as long as curing can be promoted, but is preferably 50°C or higher. Also, the heating time is preferably 5 minutes to 2 hours, more preferably 5 minutes to 1 hour.

[0195] The optical filter of the present invention can be used for various applications. For example, an antireflection filter, a color filter, a black matrix, an infrared transmission filter, a light-shielding filter, etc. can be mentioned.

[0196] <Image display device> The image display device of the present invention includes the optical filter of the present invention. Examples of the image display device include a liquid crystal display, an organic EL display, etc. The form used in the image display device only needs to function as an image display device and is not particularly limited. For example, the configurations described in "Next-generation liquid crystal display technology (written by Tatsuo Uchida, published by Kogyo Chosa Kai, Inc., in 1994)" can be mentioned. Regarding the definition of the image display device and the details of each image display device, they are described in, for example, "Electronic display device (written by Akio Sasaki, published by Kogyo Chosa Kai, Inc., in 1990)", "Display device (written by Junsho Ibuki, published by Sangyo Tosho Co., Ltd., in 1989)", etc.

[0197] <Solid-state imaging device> The solid-state imaging device of the present invention includes the optical filter of the present invention. The form used for the solid-state imaging device is not particularly limited. For example, on a substrate, it has a plurality of photodiodes constituting the light-receiving area of the solid-state imaging device (CCD image sensor, CMOS image sensor, etc.) and transfer electrodes made of polysilicon or the like. It has a light-shielding film with an opening only in the light-receiving part of the photodiode on the photodiode and the transfer electrodes, and has a device protection film made of silicon nitride or the like formed so as to cover the entire surface of the light-shielding film and the light-receiving part of the photodiode. On the device protection film, it has a configuration with a filter. Further, a configuration having condensing means (for example, a microlens, etc.; the same applies hereinafter) on the device protection film and below the filter (the side closer to the substrate), or a configuration having condensing means on the filter may be used. Also, the filter may have a structure in which a cured film forming each colored pixel is embedded in a space partitioned, for example, in a lattice shape by partition walls. In this case, the partition walls preferably have a low refractive index with respect to each colored pixel. The imaging device provided with the solid-state imaging device of the present invention can be used for various applications such as, for example, a digital camera, an electronic device having an imaging function (mobile phone, smartphone, etc.), an in-vehicle camera, a surveillance camera, and an optical sensor.

Example

[0198] Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited thereto. Note that "parts" means "parts by mass" and "%" means "% by mass". In the present invention, the non-volatile content or the non-volatile content concentration refers to the mass residue after standing in an oven at 230 °C for 30 minutes.

[0199] Prior to the examples, each measurement method will be described.

[0200] The measurement of the weight average molecular weight (Mw), number average molecular weight (Mn), and acid value (mgKOH / g) of the resin is as follows.

[0201] (Average molecular weight of resin) The number-average molecular weight (Mn) and weight-average molecular weight (Mw) of the resin were measured by gel permeation chromatography (GPC) equipped with an RI detector. Using HLC-8220GPC (manufactured by Tosoh Corporation) as the apparatus, two separation columns were connected in series, and for both packing materials, two "TSK-GEL SUPER HZM-N" were connected in series and used. The measurement was carried out at an oven temperature of 40 °C, using a tetrahydrofuran (THF) solution as the eluent, and at a flow rate of 0.35 ml / min. The sample was dissolved in a solvent consisting of 1 mass% of the above eluent and 20 microliters were injected. The molecular weight is in terms of polystyrene conversion value.

[0202] (Acid value of the resin) To 0.5 - 1 g of the resin solution, 80 ml of acetone and 10 ml of water were added and stirred until uniformly dissolved. Using a 0.1 mol / L aqueous KOH solution as the titrant, titration was carried out using an automatic titrator ("COM-555" manufactured by Hiranuma Sangyo Co., Ltd.), and the acid value (mgKOH / g) was measured. Then, from the acid value of the resin solution and the non-volatile content concentration of the resin solution, the acid value per non-volatile content of the resin was calculated.

[0203] (Production of colorant (A)) (Colorant (A-1)) 100 parts of C.I. Pigment Red 254, 1,200 parts of sodium chloride, and 120 parts of diethylene glycol were charged into a 1-gallon stainless-steel kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded at 60 °C for 6 hours. This mixture was poured into 3,000 parts of warm water, stirred with a high-speed mixer for 1 hour while heating to about 80 °C to form a slurry, and after repeating filtration and washing with water to remove sodium chloride and diethylene glycol, it was dried at 80 °C for one day and night and pulverized to obtain the refined colorant (A-1).

[0204] (Colorant (A-2)) 100 parts of C.I. Pigment Blue 15:6, 1,000 parts of sodium chloride, and 100 parts of diethylene glycol were charged into a 1-gallon stainless steel kneader (manufactured by Inoue Seisakusho), and kneaded at 50 °C for 12 hours. This mixture was poured into 3,000 parts of warm water, stirred with a high-speed mixer for about 1 hour while heating to about 80 °C to form a slurry, and after repeating filtration and washing with water to remove sodium chloride and diethylene glycol, it was dried at 80 °C for a whole day and night and pulverized to obtain a refined colorant (A-2).

[0205] (Colorant (A-3)) 100 parts of C.I. Pigment Yellow 150, 700 parts of sodium chloride, and 180 parts of diethylene glycol were charged into a 1-gallon stainless steel kneader (manufactured by Inoue Seisakusho), and kneaded at 80 °C for 6 hours. This mixture was poured into 3,000 parts of warm water, stirred with a high-speed mixer for 1 hour while heating to about 80 °C to form a slurry, and after repeating filtration and washing with water to remove sodium chloride and diethylene glycol, it was dried at 80 °C for a whole day and night and pulverized to obtain a refined colorant (A-3). (Production of Binder Resin (B)) (Binder Resin (B1-1) Solution) After placing 100 parts of propylene glycol monomethyl ether acetate (hereinafter referred to as PGMAc) in a flask equipped with a stirring device, a dropping funnel, a condenser, a thermometer, and a gas introduction tube, the mixture was stirred while purging with nitrogen and heated to 78°C. Next, 25.2 parts of Carens MOI-DEM (2-[[[[(2-methyl-1-oxo-2-propenyl)oxy]ethyl]amino]carbonyl]-1,3-diethyl ester of malonic acid, a block isocyanate group-containing monomer manufactured by Showa Denko KK), 31.2 parts of 2-hydroxyethyl methacrylate, a hydroxyl group-containing monomer, 37.5 parts of dicyclopentanyl methacrylate, an aliphatic condensed ring structure-containing monomer, 20.7 parts of methacrylic acid, an acidic group-containing monomer, and 27.0 parts of methyl methacrylate of other monomer units, and a mixture of 12.0 parts of 2,2'-azobis(2,4-dimethylvaleronitrile) (polymerization initiator) dissolved in 50 parts of PGMAc were each dropped into the flask from the dropping funnel. After completion of the dropping, the mixture was stirred at 78°C for 3 hours. Thereafter, PGMAc was added so that the nonvolatile content became 40% by mass to adjust a binder resin (B1-1) solution. The binder resin (B1-1) had an acid value of 74 mgKOH / g and a weight average molecular weight of 8,000.

[0206] (Binder resin (B1-2) to (B1-10) solutions, binder resins (B2-1) and (B2-2) solutions) Binder resins (B1-2) to (B1-10), binder resins (B2-1) and (B2-2) were synthesized so as to have a molar ratio with each of the constituent components described in Tables 1-1 and 1-2, and PGMAc was added to make the nonvolatile content 40% by mass.

[0207]

Table 1-1

[0208]

Table 1-2

[0209] The curens MOI-BP described in Table 1-1 is 2-(3,5-diethylpyrazol-1-yl)carbonylaminoethyl methacrylate manufactured by Showa Denko K.K., and the curens MOI-BM is 2-[O-(1'-methylpropylideneamino)carboxyamino]ethyl methacrylate manufactured by Showa Denko K.K.

[0210] <Production of Dispersion Resin (E)> (Dispersion Resin (E-1) Solution) Into a reaction vessel equipped with a gas introduction tube, thermometer, condenser, and stirrer, 108 parts of 1-thioglycerol, 174 parts of pyromellitic dianhydride, 650 parts of PGMAc, and 0.2 part of monobutyltin oxide as a catalyst were charged. After purging with nitrogen gas, the mixture was reacted at 120 °C for 5 hours (first step). It was confirmed by measuring the acid value that 95% or more of the acid anhydride was half-esterified. Next, 160 parts of the compound obtained in the first step in terms of non-volatile content, 200 parts of 2-hydroxypropyl methacrylate, 200 parts of ethyl acrylate, 150 parts of tert-butyl acrylate, 200 parts of 2-methoxyethyl acrylate, 200 parts of methyl acrylate, 50 parts of methacrylic acid, and 663 parts of PGMAc were charged. The inside of the reaction vessel was heated to 80 °C, 1.2 parts of 2,2'-azobis(2,4-dimethylvaleronitrile) was added, and the mixture was reacted for 12 hours (second step). It was confirmed by measuring the non-volatile content that 95% had reacted. Finally, 500 parts of a 50% PGMAc solution of the compound obtained in the second step, 27.0 parts of 2-methacryloyloxyethyl isocyanate (MOI), and 0.1 part of hydroquinone were charged, and the reaction was carried out until the disappearance of the peak at 2270 cm -1 based on the isocyanate group was confirmed by IR (third step). After confirming the disappearance of the peak, the reaction solution was cooled, and the non-volatile content was adjusted with PGMAc to obtain a dispersion resin (E-1) solution having a polymerizable unsaturated group with a non-volatile content of 30% by mass. The dispersion resin (E-1) having a polymerizable unsaturated group had an acid value of 68 mgKOH / g and a weight average molecular weight of 13,000.

[0211] (Dispersion Resin (E-2) Solution) According to paragraph number 0300 of International Publication No. 2021 / 131927, a dispersion resin (E-2) solution having a polymerizable unsaturated group was obtained. The dispersion resin (E-2) having a polymerizable unsaturated group had an acid value of 70 mgKOH / g and a weight average molecular weight of 17,200.

[0212] (Dispersion resin (E-3) solution) Into a reaction vessel equipped with a gas introduction tube, a temperature controller, a condenser, and a stirrer, 10 parts of methacrylic acid, 100 parts of methyl methacrylate, 70 parts of i-butyl methacrylate, 20 parts of benzyl methacrylate, and 50 parts of PGMAc were charged and replaced with nitrogen gas. The inside of the reaction vessel was heated and stirred at 50 °C, and 12 parts of 3-mercapto-1,2-propanediol were added. The temperature was raised to 90 °C, and a solution prepared by adding 0.1 part of 2,2'-azobisisobutyronitrile to 90 parts of propylene glycol monomethyl ether acetate (hereinafter referred to as PGMAc) was added while reacting for 7 hours. It was confirmed by non-volatile content measurement that 95% had reacted. 19 parts of pyromellitic dianhydride, 50 parts of PGMAc, 50 parts of cyclohexanone, and 0.4 part of 1,8-diazabicyclo-[5.4.0]-7-undecene as a catalyst were added and reacted at 100 °C for 7 hours. It was confirmed by acid value measurement that 98% or more of the acid anhydride was half-esterified, and the reaction was terminated. PGMAc was added and diluted to a non-volatile content of 30% by mass to obtain a dispersion resin (E-3) solution. The dispersion resin (E-3) had an acid value of 70 mgKOH / g and a weight average molecular weight of 8,500.

[0213] <Production of dispersion> (Dispersion 1) After stirring and mixing the following raw materials to be uniform, they were dispersed using zirconia beads with a diameter of 0.5 mm for 3 hours with an Eye mill (Mini Model M-250 MKII manufactured by Eye Japan Co., Ltd.), and then filtered through a filter with a pore size of 1.0 μm to prepare Dispersion 1. The organic solvent (P-1) is PGMAc. Colorant (A-1): 12.0 parts Colorant (A-2): 0.8 part Colorant (A-3): 2.2 parts Dispersion resin (E-1) solution: 17.5 parts Organic solvent (P-1): 67.6 parts

[0214] (Dispersions 2 and 3) Dispersions 2 and 3 were prepared in the same manner as Dispersion 1, except that the raw materials and amounts described in Table 2 were changed.

[0215]

Table 2

[0216] <Production of photosensitive composition> [Example 1] (Photosensitive composition 1) The following raw materials were mixed, stirred, and filtered through a filter with a pore size of 1.0 μm to obtain Photosensitive composition 1. Dispersion 1: 40.0 parts Binder resin (B1-1) solution: 3.75 parts Polymerizable compound (C1-1): 4.50 parts Photopolymerization initiator (D-1): 0.30 part Thiol-based chain transfer agent (F-1): 0.05 part Thermosetting compound (G-1): 0.70 part Leveling agent (M): 1.00 part Organic solvent (P): 49.7 parts

[0217] [Examples 2 to 24, Comparative Examples 1 to 4] (Photosensitive compositions 2 to 28) Photosensitive compositions 2 to 28 were prepared in the same manner as Example 1, except that the raw materials and amounts described in Tables 3-1 to 3-3 were changed.

[0218]

Table 3-1

[0219]

Table 3-2

[0220]

Table 3-3

[0221] Regarding each of the raw materials described in Tables 3-1 to 3-3, it is as follows.

[0222] [Polymerizable Compound (C)] (Polymerizable Compound (C1)) C1-1: Tricyclodecane dimethanol diacrylate C1-2: 1,3-Adamantanediol diacrylate C1-3: 9,9-Bis[4-(2-acryloyloxyethoxy)phenyl]fluorene

[0223] (Polymerizable Compound (C2)) C2-1: Neopentyl glycol diacrylate C2-2: EO-modified bisphenol A diacrylate (EO number: 4) C2-3: Mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate

[0224] [Photoinitiator (D)] D-1: Irgacure OXE-04 (manufactured by BASF Japan Ltd.) D-2: Omnirad907 (manufactured by IGM Resins)

[0225] [Thiol-based chain transfer agent (F)] F-1: Pentaerythritol tetrakis(3-mercaptopropionate)

[0226] [Thermosetting compound (G)] G-1: EHPE-3150 (manufactured by Daicel Corporation, a compound having an aliphatic ring with about 15 epoxy groups)

[0227] [Leveling agent (M)] M-1: BYK-330 (manufactured by BYK Chemie) M-2: Megafac F-554 (manufactured by DIC Corporation) Above, (M-1) and (M-2) were each mixed in one part and dissolved in 98 parts of PGMAc to obtain a mixed solution, which was used as the leveling agent (M).

[0228] [Organic solvent (P)] P-1: 30 parts of propylene glycol monomethyl ether acetate P-2: 30 parts of cyclohexanone P-3: 10 parts of ethyl 3-ethoxypropionate P-4: 10 parts of propylene glycol monomethyl ether P-5: 10 parts of cyclohexanol acetate P-6: 10 parts of dipropylene glycol methyl ether acetate Above, (P-1) to (P-6) were each mixed in the above parts by mass to obtain the organic solvent (P).

[0229] [Evaluation of photosensitive composition] The following evaluations were performed on the obtained photosensitive compositions 1 to 28 (Examples 1 to 24, Comparative Examples 1 to 4). The evaluation results are shown in Table 4.

[0230] [Line width stability evaluation] The obtained photosensitive composition was spin-coated on a glass substrate (Eagle 2000 manufactured by Corning) with a length of 100 mm, a width of 100 mm, and a thickness of 0.7 mm so that the film thickness after drying was 2.0 μm, and dried on a hot plate at 70°C for 1 minute. Then, after cooling this substrate to room temperature, using a high-pressure mercury lamp, the illuminance was 30 mW / cm 2 , and the exposure dose was 50 mJ / cm 2 and 100 mJ / cm 2 at two levels, and exposed through a photomask with a 100-μm-wide stripe pattern. Then, this substrate was spray-developed using an aqueous developer containing 0.12% of a nonionic surfactant and 0.04% of potassium hydroxide at 23°C, washed with ion-exchanged water, and air-dried. The obtained substrate was post-baked in a clean oven at 100°C for 60 minutes to obtain a substrate for evaluation. The obtained evaluation substrate was observed using an ECLIPSE LV100POL Model optical microscope manufactured by Nikon Corporation at an exposure dose of 50 mJ / cm 2 for the line width (CD 50 ) and at 100 mJ / cm 2 for the line width (CD 100 ). The difference in line width (ΔCD) due to the difference in exposure dose was determined from the following formula (1). The evaluation criteria are as follows, and a value of 3 or more is considered practical. Formula (1): ΔCD = CD 100 − CD 50 5: ΔCD is less than 2 μm 4: ΔCD is 2 μm or more and less than 3 μm 3: ΔCD is 3 μm or more and less than 5 μm 2: ΔCD is 5 μm or more and less than 6 μm 1: ΔCD is 6 μm or more

[0231] [Adhesion Evaluation] The obtained photosensitive composition was spin-coated onto a glass substrate (Eagle 2000 manufactured by Corning Inc.) with a length of 100 mm, a width of 100 mm, and a thickness of 0.7 mm so that the film thickness after drying was 2.0 μm, and then dried on a hot plate at 70°C for 1 minute. Next, after cooling this substrate to room temperature, using a high-pressure mercury lamp, it was exposed through a photomask with a stripe pattern having a width ranging from 5 to 25 μm in 5-μm increments at an illuminance of 30 mW / cm 2 and 50 mJ / cm 2 . Then, this substrate was spray-developed using an aqueous developer containing 0.12% by mass of a nonionic surfactant and 0.04% by mass of potassium hydroxide at 23°C, washed with ion-exchanged water, air-dried, and post-baked in a clean oven at 100°C for 60 minutes. The spray development was performed for each film of the photosensitive composition for the shortest time capable of forming a pattern without any remaining development. For the patterns with widths of 5, 10, 15, 20, and 25 μm on the obtained substrate, they were observed with an optical microscope, and the minimum line width of the remaining patterns was confirmed. The evaluation criteria are as follows, and a value of 3 or more is considered practical. 5: Fine lines of 10 μm or less remain. Thin lines of 4: 15 μm or more remain. Thin lines of 3: 20 μm or more remain. Thin lines of 2: 25 μm remain. 1: No thin lines remain.

[0232] [Solvent Resistance Evaluation (1)] The obtained photosensitive composition was applied by spin coating onto a glass substrate (Eagle 2000 manufactured by Corning) with a length of 100 mm, a width of 100 mm, and a thickness of 0.7 mm so that the film thickness after drying was 2.0 μm, and dried on a hot plate at 70 °C for 1 minute. Next, after cooling this substrate to room temperature, using a high-pressure mercury lamp, with an illuminance of 30 mW / cm 2 , 50 mJ / cm 2 , ultraviolet light was irradiated through a photomask with a 100 μm wide stripe pattern. Further, after cooling this substrate to room temperature, it was spray-developed using an aqueous developer containing 0.12% of a nonionic surfactant and 0.04% of potassium hydroxide at 23 °C, then washed with ion-exchanged water and air-dried. Thereafter, it was post-baked in a clean oven at 130 °C for 60 minutes to obtain a substrate for evaluation. The obtained substrate for evaluation was immersed in propylene glycol monomethyl ether acetate at room temperature for 15 minutes, then washed with ion-exchanged water and air-dried, and the 100 μm wide stripe pattern portion was observed using an optical microscope. The evaluation criteria are as follows, and 3 or more is considered practical. 5: There is no change in appearance or color. 4: Slight wrinkles or the like occur, but there is no change in color. 3: Wrinkles or the like occur in part, but there is no change in color. 2: Wrinkles or the like occur over the entire surface and it fades slightly. 1: Peeling or fading occurs.

[0233] [Solvent Resistance Evaluation (2)] The obtained photosensitive composition was applied onto a glass substrate (Eagle 2000 manufactured by Corning Inc.) measuring 100 mm in length × 100 mm in width and 0.7 mm in thickness by the spin coating method so that the film thickness after drying was 2.0 μm, and then dried on a hot plate at 70°C for 1 minute. Subsequently, after cooling this substrate to room temperature, ultraviolet light was irradiated through a photomask with a 100-μm-wide stripe pattern using a high-pressure mercury lamp, with an illuminance of 30 mW / cm 2 ² and an exposure dose of 50 mJ / cm 2 ². Further, after cooling this substrate to room temperature, it was spray-developed using an aqueous developer containing 0.12% of a nonionic surfactant and 0.04% of potassium hydroxide at 23°C, and then washed with ion-exchanged water and air-dried. Thereafter, it was post-baked in a clean oven at 100°C for 60 minutes to obtain a substrate for evaluation. The obtained substrate for evaluation was immersed in propylene glycol monomethyl ether acetate at room temperature for 15 minutes, then washed with ion-exchanged water and air-dried, and the stripe pattern portion with a width of 100 μm was observed using an optical microscope. The evaluation criteria are as follows, and a score of 3 or more is considered practical. 5: No change in appearance or color. 4: Slight wrinkles or the like occur, but there is no change in color. 3: Wrinkles or the like occur in part, but there is no change in color. 2: Wrinkles or the like occur over the entire surface, and it fades slightly. 1: Peeling or fading occurs.

[0234] [High Temperature and High Humidity Resistance Evaluation] The obtained photosensitive composition was applied onto a glass substrate (Eagle 2000 manufactured by Corning Inc.) measuring 100 mm in length × 100 mm in width and 0.7 mm in thickness using a spin coater so that the dry film thickness was 2.0 μm, and then dried on a hot plate at 70°C for 1 minute. Subsequently, using an ultra-high pressure mercury lamp, with an illuminance of 30 mW / cm 2 ² and an exposure dose of 50 mJ / cm 2Then, ultraviolet light was irradiated through a photomask with a 100-μm-wide stripe pattern. Further, after cooling this substrate to room temperature, it was spray-developed using an aqueous developer containing 0.12% of a nonionic surfactant and 0.04% of potassium hydroxide at 23°C, washed with ion-exchanged water, and air-dried. The obtained substrate was post-baked in a clean oven at 100°C for 60 minutes to form a stripe-shaped pattern on the substrate. The obtained substrate was stored for 200 hours under the conditions of a temperature of 85°C and a humidity of 85%. After storage, the number of foreign substances on the pattern was measured using an optical microscope. The evaluation criteria are as follows, and 3 or more is considered practical. 5: The number of foreign substances is less than 5 4: The number of foreign substances is 5 or more and less than 10 3: The number of foreign substances is 10 or more and less than 15 2: The number of foreign substances is 15 or more and less than 20 1: The number of foreign substances is 20 or more

[0235] [Evaluation of Storage Stability of Photosensitive Composition] The obtained photosensitive composition was put into a sealed container and stored at 40°C for 1 week. The change rate of viscosity before and after storage was calculated by the following formula and evaluated. The viscosity was measured using an E-type viscometer (manufactured by Toki Sangyo Co., Ltd., "ELD-type viscometer") at 25°C under the condition of a rotation speed of 50 rpm. The evaluation criteria are as follows, and 2 or more is considered practical. [Viscosity Change Rate over Time] = |([Initial Viscosity] - [Viscosity over Time]) / [Initial Viscosity]| × 100 3: Those with a change rate of less than 5% 2: Those with a change rate of 5% or more and less than 10% 1: Those with a change rate of 10% or more

[0236]

Table 4

Claims

1. A photosensitive composition comprising a colorant (A), a binder resin (B), a polymerizable compound (C), a photopolymerization initiator (D), and a dispersion resin (E), wherein the binder resin (B) includes a binder resin (B1) having a blocked isocyanate group-containing monomer unit (b1) and a hydroxyl group-containing monomer unit (b2), the polymerizable compound (C) includes a polymerizable compound (C1) having two (meth)acryloyl groups and a condensed ring structure, and the dispersion resin (E) is a photosensitive composition having a polymerizable unsaturated group.

2. The photosensitive composition according to Claim 1, wherein the total content of the blocked isocyanate group-containing monomer unit (b1) and the hydroxyl group-containing monomer unit (b2) is 10 to 60 mol% in all the constituent units of the binder resin (B1).

3. The photosensitive composition according to Claim 1 or 2, wherein the molar ratio of the blocked isocyanate group-containing monomer unit (b1) to the hydroxyl group-containing monomer unit (b2) is 10:90 to 50:

50.

4. The photosensitive composition according to any one of Claims 1 to 3, wherein the binder resin (B1) further has an aliphatic condensed ring structure-containing monomer unit (b3).

5. The photosensitive composition according to any one of Claims 1 to 4, wherein the content of the polymerizable compound (C1) having two (meth)acryloyl groups and a condensed ring structure is 50 to 100% by mass in 100% by mass of the polymerizable compound (C).

6. The photosensitive composition according to any one of Claims 1 to 5, further comprising a thiol-based chain transfer agent (F).

7. An optical filter having a substrate and a cured film formed from the photosensitive composition according to any one of Claims 1 to 6.

8. An image display device having the optical filter according to Claim 7.

9. A solid-state imaging device having the optical filter according to Claim 7.

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