Inductor component, and method for manufacturing inductor component

Abstract

To prevent the interface between an inductor component and another electric component.SOLUTION: The distance from a first end surface 11C to a surface of a first coating electrode 71 in a direction vertical to the first end surface 11C is the thickness of the first coating electrode 71. The part where the first coating electrode 71 is the thickest on a second virtual line VL2, which extends through the geometric center C of the first end surface 11C and is vertical to a first main surface 11A, is displaced from the geometric center C of the first end surface 11C to the first main surface 11A.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to an inductor component and a method for manufacturing the inductor component.

Background Art

[0002] The inductor component described in Patent Document 1 includes a body, an inductor wiring, a first coated electrode, and a second coated electrode. The body is in the shape of a rectangular parallelepiped having six outer surfaces. The inductor wiring extends inside the body. The body has a first electrode and a second electrode. The first electrode is connected to the first end of the inductor wiring. The second electrode is connected to the second end of the inductor wiring. One of the outer surfaces of the body is defined as the main surface, one of the surfaces perpendicular to the main surface is defined as the first end surface, the surface parallel to the first end surface is defined as the second end surface, and one of the surfaces perpendicular to both the main surface and the first end surface is defined as the bottom surface. In this case, the first electrode is exposed outside the body in the region from the bottom surface to the first end surface. The second electrode is exposed outside the body in the region from the bottom surface to the second end surface. And the first coated electrode covers the surface of the first electrode. The second coated electrode covers the surface of the second electrode.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An inductor component as described in Patent Document 1 is arranged on a substrate adjacent to other electronic components. Here, the thickness of the first coated electrode is not necessarily uniform on the first end face, and the first coated electrode may partially protrude in the direction facing the first end face. And if the first coated electrode protrudes excessively, it may interfere with other electronic components arranged to face the first end face. In order to avoid such interference, a considerable space must be secured between the inductor component and other electronic components. Therefore, it hinders the high-density mounting of the inductor component and other electronic components.

Means for Solving the Problems

[0005] To solve the above problems, one aspect of the present invention includes a rectangular parallelepiped-shaped element having six outer surfaces, an inductor wiring extending inside the element, a first coated electrode covering a bottom surface which is one of the outer surfaces and electrically connected to a first end of the inductor wiring, and a second coated electrode covering the bottom surface and electrically connected to a second end of the inductor wiring. Among the six outer surfaces of the element, when one of the surfaces perpendicular to the bottom surface is defined as the main surface and the surfaces perpendicular to both the bottom surface and the main surface are defined as the first end face and the second end face, the first coated electrode and the second coated electrode cover a part of a first virtual line passing through the geometric center of the bottom surface and perpendicular to the first end face. The first coated electrode covers the first end face, and the second coated electrode covers the second end face. When the distance from the first end face to the surface of the first coated electrode in the direction perpendicular to the first end face is defined as the thickness of the first coated electrode, at a position on a second virtual line passing through the geometric center of the first end face and perpendicular to the main surface, the position where the thickness of the first coated electrode is the maximum is shifted toward the main surface side from the geometric center of the first end face. This is the inductor component.

[0006] For example, as another electronic component arranged adjacent to the first end face of the inductor component, there is one in which electrodes are plated over the entire end face of a rectangular parallelepiped body. In such an electronic component, the thickness of the electrode is large at the center of the end face. That is, in this type of electronic component, the center of the end face of the body is in a bulged shape. Also, in the current situation where the outer diameter size of the electronic component is substantially being standardized, for high-density mounting, the land patterns on the substrate where each electronic component is arranged are aligned. That is, when viewed from a direction perpendicular to the main surface of the substrate, the geometric center of the first end face of the inductor component and the geometric center of the end face of another adjacent electronic component often line up adjacent to each other in a straight line.

[0007] According to the above configuration, the location where the thickness of the first coating electrode is maximum is shifted toward the main surface side from the geometric center of the first end face. Therefore, even when the inductor component and the above other electronic component are arranged at adjacent positions on the aligned land patterns on the substrate, since the location where the thickness of the first coating electrode of the inductor component is maximum and the location where the thickness of the electrode of the above other electronic component is maximum are shifted, it is difficult for the electrodes of the two components to interfere with each other. Therefore, it can contribute to high-density mounting of components on the substrate.

[0008] To solve the above problems, another aspect of the present invention uses an insulating paste and a conductive paste containing metal powder to form a pattern of the conductive paste that extends spirally inside the insulating paste, a first conductive portion of the conductive paste that is connected to the first end of the pattern and exposed from the insulating paste, and a second conductive portion of the conductive paste that is connected to the second end of the pattern and exposed from the insulating paste, to form a rectangular parallelepiped-shaped laminate; a firing step of firing the laminate to form a green body having a first embedded electrode in which the first conductive portion is sintered and a second embedded electrode in which the second conductive portion is sintered; and a plating step of plating the surfaces of the first embedded electrode and the second embedded electrode exposed on the surface of the green body to form a first coating electrode that covers the surface of the first embedded electrode and a second coating electrode that covers the surface of the second embedded electrode. Among the six outer surfaces of the green body, when one surface is defined as the bottom surface, one surface perpendicular to the bottom surface is defined as the main surface, and the surfaces perpendicular to both the bottom surface and the main surface are defined as the first end surface and the second end surface, the first embedded electrode and the second embedded electrode are exposed outside the green body on the bottom surface, the first embedded electrode has an end surface electrode portion that is exposed outside the green body on the first end surface, and in the plating step, the geometric center of the first end surface is covered with an insulating cover, and a method for manufacturing an inductor component is provided, in which, on a virtual line passing through the geometric center of the first end surface and perpendicular to the main surface, a portion on the main surface side with respect to the geometric center is exposed from the cover and plated.

[0009] According to the above configuration, when electroplating the end surface electrode portion, no current flows through the cover at the geometric center, so electroplating does not occur. Therefore, by electroplating only the portion on the main surface side with respect to the geometric center on the virtual line, a first coating electrode can be formed only on the portion on the main surface side with respect to the geometric center on the end surface electrode portion. As a result, the location where the thickness of the first coating electrode is maximum is shifted to the main surface side from the geometric center of the first end surface.

Advantages of the Invention

[0010] Interference between the inductor component and other electronic components can be suppressed.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Figure 17

Modes for Carrying Out the Invention

[0012] <Regarding the First Embodiment> Hereinafter, a first embodiment of the inductor component will be described. Note that, for ease of understanding, the components may be shown enlarged in the drawings. The dimensional ratios of the components may be different from the actual ones or those in another drawing.

[0013] (Overall Configuration of Inductor Component) As shown in FIG. 1, the inductor component 10 includes a rectangular parallelepiped-shaped base body 11. Also, as shown in FIGS. 2 and 3, the inductor component 10 includes an inductor wiring 30 extending inside the base body 11. The base body 11 has a first embedded electrode 40 connected to the first end of the inductor wiring 30 and a second embedded electrode 50 connected to the second end of the inductor wiring 30.

[0014] As shown in FIG. 2, the base body 11 has a structure in which a plurality of plate-like layers are laminated as a whole. Also, each layer is rectangular in plan view. And since the base body 11 is rectangular parallelepiped-shaped, it has six planar outer surfaces. As shown in FIG. 1, of these six outer surfaces, one surface is taken as the bottom surface 11E. Also, of the six outer surfaces, one surface of the surface perpendicular to the bottom surface 11E is taken as the first main surface 11A. Also, the surface parallel to the first main surface 11A is taken as the second main surface 11B. And one surface of the surface perpendicular to both the bottom surface 11E and the first main surface 11A is taken as the first end surface 11C. Also, the surface parallel to the first end surface 11C is taken as the second end surface 11D. Also, the surface parallel to the bottom surface 11E is taken as the top surface 11F.

[0015] In the following description, the axis along the stacking direction of a plurality of layers, that is, the axis perpendicular to the first main surface 11A, is defined as the first axis X. The axis perpendicular to the first end surface 11C is defined as the second axis Y. Further, the axis perpendicular to the bottom surface 11E is defined as the third axis Z. Among the directions along the first axis X, the direction in which the first main surface 11A faces is defined as the first positive direction X1, and the direction opposite to the first positive direction X1 is defined as the first negative direction X2. Among the directions along the second axis Y, the direction in which the first end surface 11C faces is defined as the second positive direction Y1, and the direction opposite to the second positive direction Y1 is defined as the second negative direction Y2. Further, among the directions along the third axis Z, the direction in which the top surface 11F faces is defined as the third positive direction Z1, and the direction opposite to the third positive direction Z1 is defined as the third negative direction Z2.

[0016] As shown in FIG. 2, the base body 11 has the first layer L1 to the ninth layer L9. The first layer L1 to the ninth layer L9 are arranged in this order in the first negative direction X2. The thicknesses of the first layer L1 to the ninth layer L9, that is, the dimensions in the direction along the X axis, are all substantially the same. As shown in FIG. 3, the first layer L1 is composed of a first electrode portion 41, a second electrode portion 51, a first wiring portion 31, and a first insulating portion 21.

[0017] The first electrode portion 41 is made of a conductive material such as silver. When the first layer L1 is viewed in the first negative direction X2, the first electrode portion 41 is L-shaped as a whole. When the first layer L1 is viewed in the first negative direction X2, the first electrode portion 41 is located on the second positive direction Y1 side and the third negative direction Z2 side with respect to the center of the first layer L1. More specifically, when the first layer L1 is viewed in the first negative direction X2, the first electrode portion 41 is located at a position including the corner on the second positive direction Y1 side and the third negative direction Z2 side of the first layer L1.

[0018] The second electrode portion 51 is made of a conductive material such as silver. The second electrode portion 51 is rod-shaped. The second electrode portion 51 extends along the bottom surface 11E. The end on the second negative direction Y2 side of the second electrode portion 51 is located on the second end surface 11D. The end on the second positive direction Y1 side of the second electrode portion 51 is located on the second negative direction Y2 side with respect to the center in the direction along the second axis Y on the bottom surface 11E.

[0019] The first wiring portion 31 is made of a conductive material such as silver. When viewing the first layer L1 facing the first negative direction X2, the first wiring portion 31 extends in a spiral shape with the center of the first layer L1 as the approximate center as a whole. Specifically, the first end portion 31A of the first wiring portion 31 is connected to the end portion on the first positive direction Z1 side in the direction along the third axis Z of the first electrode portion 41. Note that the first end portion 31A is a portion deviated from the circumferential path formed by overlapping the wiring portions of the first layer L1 to the ninth layer L9 when viewed facing the first negative direction X2. That is, the first end portion 31A is the first end of the inductor wiring 30. The wiring width of the first wiring portion 31 is substantially constant except for the second end portion 31B. The position of the second end portion 31B of the first wiring portion 31 in the direction along the third axis Z is on the first positive direction Z1 side from the center of the first layer L1 in the direction along the third axis Z. Also, the position of the second end portion 31B of the first wiring portion 31 in the direction along the second axis Y is on the second positive direction Y1 side from the center of the first layer L1 in the direction along the second axis Y. And when viewing the first wiring portion 31 facing the first negative direction X2, the first wiring portion 31 extends clockwise from the first end portion 31A toward the second end portion 31B.

[0020] The second end portion 31B of the first wiring portion 31 functions as a pad for connecting to a via 32 described later. When viewing the first layer L1 facing the first negative direction X2, the second end portion 31B has a substantially circular shape. Also, the wiring width of the second end portion 31B of the first wiring portion 31 is larger than other portions of the first wiring portion 31.

[0021] In the first layer L1, the portion excluding the first electrode portion 41, the second electrode portion 51, and the first wiring portion 31 is the first insulating portion 21. The first insulating portion 21 is made of a non-magnetic insulator such as glass, resin, and alumina.

[0022] As shown in FIG. 2, the second layer L2 is laminated on the main surface of the first layer L1 facing the first negative direction X2. When viewing the second layer L2 facing the first negative direction X2, the second layer L2 has the same rectangular shape as the first layer L1. The second layer L2 is composed of a third electrode portion 42, a fourth electrode portion 52, a via 32, and a second insulating portion 22.

[0023] The third electrode portion 42 is made of the same material as the first electrode portion 41. The third electrode portion 42 is rod-shaped. The third electrode portion 42 extends along the bottom surface 11E. The end of the third electrode portion 42 on the second positive direction Y1 side is located on the first end surface 11C. The end of the third electrode portion 42 on the second negative direction Y2 side coincides with the end of the first electrode portion 41 on the second negative direction Y2 side. Therefore, when viewing the second layer L2 facing the first negative direction X2, the third electrode portion 42 is located at a portion extending along the bottom surface 11E of the first electrode portion 41. Thus, the third electrode portion 42 is laminated on the surface of the first electrode portion 41 facing the first negative direction X2.

[0024] The fourth electrode portion 52 is made of the same material as the second electrode portion 51. The fourth electrode portion 52 is rod-shaped with the same dimensions as the second electrode portion 51. Also, when viewing the second layer L2 facing the first negative direction X2, the fourth electrode portion 52 is located at the same location as the second electrode portion 51. Therefore, the fourth electrode portion 52 is laminated on the surface of the second electrode portion 51 facing the first negative direction X2.

[0025] The via 32 is made of the same material as the first wiring portion 31. The via 32 is columnar and extends in the direction along the first axis X. The via 32 is laminated on the surface of the second end portion 31B of the first wiring portion 31 facing the first negative direction X2. Therefore, the via 32 is electrically connected to the second end portion 31B of the first wiring portion 31. And the via 32 extends from the second end portion 31B of the first wiring portion 31 in the first negative direction X2.

[0026] In the second layer L2, the portion excluding the third electrode portion 42, the fourth electrode portion 52, and the via 32 is the second insulating portion 22. The second insulating portion 22 is made of a non-magnetic insulator of the same material as the first insulating portion 21.

[0027] The third layer L3 is laminated on the main surface of the second layer L2 facing the first negative direction X2. When viewing the third layer L3 facing the first negative direction X2, the third layer L3 has the same rectangular shape as the first layer L1. The third layer L3 is composed of a fifth electrode portion 43, a sixth electrode portion 53, a second wiring portion 33, and a third insulating portion 23.

[0028] The fifth electrode portion 43 is made of the same material as the first electrode portion 41. The fifth electrode portion 43 is in the shape of a rod having the same dimensions as the third electrode portion 42. Also, when viewing the third layer L3 facing the first negative direction X2, the fifth electrode portion 43 is located at the same position as the third electrode portion 42. Therefore, the fifth electrode portion 43 is laminated on the surface of the third electrode portion 42 facing the first negative direction X2.

[0029] The sixth electrode portion 53 is made of the same material as the second electrode portion 51. The sixth electrode portion 53 is in the shape of a rod having the same dimensions as the fourth electrode portion 52. Also, when viewing the third layer L3 facing the first negative direction X2, the sixth electrode portion 53 is located at the same position as the fourth electrode portion 52. Therefore, the sixth electrode portion 53 is laminated on the surface of the fourth electrode portion 52 facing the first negative direction X2.

[0030] The second wiring portion 33 is made of the same material as the first wiring portion 31. When viewing the third layer L3 facing the first negative direction X2, the second wiring portion 33 extends in a spiral shape with the center of the third layer L3 as the approximate center as a whole. Specifically, the position of the first end portion 33A of the second wiring portion 33 is on the surface of the via 32 facing the first negative direction X2. Therefore, the first end portion 33A of the second wiring portion 33 is connected to the via 32. The wiring width of the second wiring portion 33 is substantially constant except for the first end portion 33A and the second end portion 33B. The position of the second end portion 33B of the second wiring portion 33 in the direction along the third axis Z is on the third negative direction Z2 side from the center of the third layer L3 in the direction along the third axis Z. Also, the position of the second end portion 33B of the second wiring portion 33 in the direction along the second axis Y is on the second positive direction Y1 side from the center of the third layer L3 in the direction along the second axis Y. Further, the position of the second end portion 33B of the second wiring portion 33 in the direction along the second axis Y is on the center side in the direction along the second axis Y from the position of the second end portion 31B of the first wiring portion 31 in the direction along the second axis Y. And when viewing the second wiring portion 33 facing the first negative direction X2, the second wiring portion 33 extends clockwise from the first end portion 33A toward the second end portion 33B.

[0031] In the third layer L3, the portion excluding the fifth electrode portion 43, the sixth electrode portion 53, and the second wiring portion 33 is the third insulating portion 23. The third insulating portion 23 is made of a non-magnetic insulator of the same material as the first insulating portion 21.

[0032] The fourth layer L4 is laminated on the main surface of the third layer L3 facing the first negative direction X2. When the fourth layer L4 is viewed facing the first negative direction X2, the fourth layer L4 has the same rectangular shape as the first layer L1. The fourth layer L4 is composed of a seventh electrode portion 44, an eighth electrode portion 54, a via 34, and a fourth insulating portion 24.

[0033] The seventh electrode portion 44 is made of the same material as the first electrode portion 41. The seventh electrode portion 44 has a rod shape with the same dimensions as the fifth electrode portion 43. Also, when the fourth layer L4 is viewed facing the first negative direction X2, the seventh electrode portion 44 is located at the same position as the fifth electrode portion 43. Therefore, the seventh electrode portion 44 is laminated on the surface of the fifth electrode portion 43 facing the first negative direction X2.

[0034] The eighth electrode portion 54 is made of the same material as the second electrode portion 51. The eighth electrode portion 54 has a rod shape with the same dimensions as the sixth electrode portion 53. Also, when the fourth layer L4 is viewed facing the first negative direction X2, the eighth electrode portion 54 is located at the same position as the sixth electrode portion 53. Therefore, the eighth electrode portion 54 is laminated on the surface of the sixth electrode portion 53 facing the first negative direction X2.

[0035] The via 34 is made of the same material as the first wiring portion 31. The via 34 has a columnar shape extending in the direction along the first axis X. The via 34 is laminated on the surface of the second end portion 33B of the second wiring portion 33 facing the first negative direction X2. Therefore, the via 34 is electrically connected to the second end portion 33B of the second wiring portion 33. And the via 34 extends from the second end portion 33B of the second wiring portion 33 in the first negative direction X2.

[0036] In the fourth layer L4, the portion excluding the seventh electrode portion 44, the eighth electrode portion 54, and the via 34 is the fourth insulating portion 24. The fourth insulating portion 24 is made of a non-magnetic insulator of the same material as the first insulating portion 21.

[0037] The fifth layer L5 is laminated on the main surface of the fourth layer L4 facing the first negative direction X2. When the fifth layer L5 is viewed facing the first negative direction X2, the fifth layer L5 has the same rectangular shape as the first layer L1. The fifth layer L5 is composed of a ninth electrode portion 45, a tenth electrode portion 55, a third wiring portion 35, and a fifth insulating portion 25.

[0038] The ninth electrode portion 45 is made of the same material as the first electrode portion 41. The ninth electrode portion 45 has a rod shape with the same dimensions as the seventh electrode portion 44. Also, when the fifth layer L5 is viewed facing the first negative direction X2, the ninth electrode portion 45 is located at the same position as the seventh electrode portion 44. Therefore, the ninth electrode portion 45 is laminated on the surface of the seventh electrode portion 44 facing the first negative direction X2.

[0039] The tenth electrode portion 55 is made of the same material as the second electrode portion 51. The tenth electrode portion 55 has a rod shape with the same dimensions as the eighth electrode portion 54. Also, when the fifth layer L5 is viewed facing the first negative direction X2, the tenth electrode portion 55 is located at the same position as the second electrode portion 51. Therefore, the tenth electrode portion 55 is laminated on the surface of the eighth electrode portion 54 facing the first negative direction X2.

[0040] The third wiring portion 35 is made of the same material as the first wiring portion 31. When viewing the fifth layer L5 facing the first negative direction X2, the third wiring portion 35 extends in a spiral shape with the center of the fifth layer L5 as the approximate center as a whole. Specifically, the position of the first end portion 35A of the third wiring portion 35 is on the surface facing the first negative direction X2 of the via 34. Therefore, the first end portion 35A of the third wiring portion 35 is connected to the via 34. The wiring width of the third wiring portion 35 is substantially constant except for the first end portion 35A and the second end portion 35B. The position of the second end portion 35B of the third wiring portion 35 in the direction along the third axis Z is on the third negative direction Z2 side from the center of the fifth layer L5 in the direction along the third axis Z. Also, the position of the second end portion 35B of the third wiring portion 35 in the direction along the second axis Y is on the second negative direction Y2 side from the center of the fifth layer L5 in the direction along the second axis Y. And when viewing the third wiring portion 35 facing the first negative direction X2, the third wiring portion 35 extends clockwise from the first end portion 35A toward the second end portion 35B.

[0041] In the fifth layer L5, the portion excluding the ninth electrode portion 45, the tenth electrode portion 55, and the third wiring portion 35 is the fifth insulating portion 25. The fifth insulating portion 25 is made of a non-magnetic insulator of the same material as the first insulating portion 21.

[0042] The sixth layer L6 is laminated on the main surface of the fifth layer L5 facing the first negative direction X2. When viewing the sixth layer L6 facing the first negative direction X2, the sixth layer L6 has the same rectangular shape as the first layer L1. The sixth layer L6 is composed of an eleventh electrode portion 46, a twelfth electrode portion 56, a via 36, and a sixth insulating portion 26.

[0043] The eleventh electrode portion 46 is made of the same material as the first electrode portion 41. The eleventh electrode portion 46 is in a rod shape with the same dimensions as the ninth electrode portion 45. Also, when viewing the sixth layer L6 facing the first negative direction X2, the eleventh electrode portion 46 is located at the same position as the ninth electrode portion 45. Therefore, the eleventh electrode portion 46 is laminated on the surface of the ninth electrode portion 45 facing the first negative direction X2.

[0044] The 12th electrode portion 56 is made of the same material as the 2nd electrode portion 51. The 12th electrode portion 56 is rod-shaped with the same dimensions as the 10th electrode portion 55. Also, when viewing the 6th layer L6 facing the first negative direction X2, the 12th electrode portion 56 is located at the same position as the 10th electrode portion 55. Therefore, the 12th electrode portion 56 is laminated on the surface of the 10th electrode portion 55 facing the first negative direction X2.

[0045] The via 36 is made of the same material as the first wiring portion 31. The via 36 is columnar and extends along the first axis X. The via 36 is laminated on the surface of the second end portion 35B of the third wiring portion 35 facing the first negative direction X2. Therefore, the via 36 is electrically connected to the second end portion 35B of the third wiring portion 35. And the via 36 extends from the second end portion 35B of the third wiring portion 35 in the first negative direction X2.

[0046] In the 6th layer L6, the portion excluding the 11th electrode portion 46, the 12th electrode portion 56, and the via 36 is the 6th insulating portion 26. The 6th insulating portion 26 is made of a non-magnetic insulator of the same material as the first insulating portion 21.

[0047] The 7th layer L7 is laminated on the main surface of the 6th layer L6 facing the first negative direction X2. When viewing the 7th layer L7 facing the first negative direction X2, the 7th layer L7 has the same rectangular shape as the 1st layer L1. The 7th layer L7 is composed of a 13th electrode portion 47, a 14th electrode portion 57, a fourth wiring portion 37, and a 7th insulating portion 27.

[0048] The 13th electrode portion 47 is made of the same material as the first electrode portion 41. The 13th electrode portion 47 is rod-shaped with the same dimensions as the 11th electrode portion 46. Also, when viewing the 7th layer L7 facing the first negative direction X2, the 13th electrode portion 47 is located at the same position as the 11th electrode portion 46. Therefore, the 13th electrode portion 47 is laminated on the surface of the 11th electrode portion 46 facing the first negative direction X2.

[0049] The 14th electrode portion 57 is made of the same material as the 2nd electrode portion 51. The 14th electrode portion 57 is rod-shaped with the same dimensions as the 12th electrode portion 56. Also, when viewing the 7th layer L7 facing the first negative direction X2, the 14th electrode portion 57 is located at the same position as the 12th electrode portion 56. Therefore, the 14th electrode portion 57 is laminated on the surface of the 12th electrode portion 56 facing the first negative direction X2.

[0050] The 4th wiring portion 37 is made of the same material as the 1st wiring portion 31. When viewing the 7th layer L7 facing the first negative direction X2, the 4th wiring portion 37 extends in a spiral shape with the center of the 7th layer L7 generally as the center as a whole. Specifically, the position of the first end portion 37A of the 4th wiring portion 37 is on the surface of the via 36 facing the first negative direction X2. Therefore, the first end portion 37A of the 4th wiring portion 37 is connected to the via 36. The wiring width of the 4th wiring portion 37 is substantially constant except for the first end portion 37A and the second end portion 37B. The position of the second end portion 37B of the 4th wiring portion 37 in the direction along the third axis Z is on the third positive direction Z1 side from the center of the 7th layer L7 in the direction along the third axis Z. Also, the position of the second end portion 37B of the 4th wiring portion 37 in the direction along the second axis Y is on the second negative direction Y2 side from the center of the 7th layer L7 in the direction along the second axis Y. Further, the position of the second end portion 37B of the 4th wiring portion 37 in the direction along the second axis Y is on the second negative direction Y2 side from the position of the first end portion 37A in the direction along the second axis Y. And when viewing the 4th wiring portion 37 facing the first negative direction X2, the 4th wiring portion 37 extends clockwise from the first end portion 37A toward the second end portion 37B. Also, the 4th wiring portion 37 is rotationally symmetric with the 2nd wiring portion 33 with the axis in the direction along the third axis Z passing through the center in the extending direction of the inductor wiring 30 as the rotation axis.

[0051] In the 7th layer L7, the portion excluding the 13th electrode portion 47, the 14th electrode portion 57, and the 4th wiring portion 37 is the 7th insulating portion 27. The 7th insulating portion 27 is made of a non-magnetic insulator of the same material as the 1st insulating portion 21.

[0052] The eighth layer L8 is laminated on the main surface of the seventh layer L7 facing the first negative direction X2. When viewing the eighth layer L8 facing the first negative direction X2, the eighth layer L8 has the same rectangular shape as the first layer L1. The eighth layer L8 is composed of a fifteenth electrode portion 48, a sixteenth electrode portion 58, a via 38, and an eighth insulating portion 28.

[0053] The fifteenth electrode portion 48 is made of the same material as the first electrode portion 41. The fifteenth electrode portion 48 has a rod shape with the same dimensions as the thirteenth electrode portion 47. Also, when viewing the eighth layer L8 facing the first negative direction X2, the fifteenth electrode portion 48 is located at the same position as the thirteenth electrode portion 47. Therefore, the fifteenth electrode portion 48 is laminated on the surface of the thirteenth electrode portion 47 facing the first negative direction X2.

[0054] The sixteenth electrode portion 58 is made of the same material as the second electrode portion 51. The sixteenth electrode portion 58 has a rod shape with the same dimensions as the fourteenth electrode portion 57. Also, when viewing the eighth layer L8 facing the first negative direction X2, the sixteenth electrode portion 58 is located at the same position as the fourteenth electrode portion 57. Therefore, the sixteenth electrode portion 58 is laminated on the surface of the fourteenth electrode portion 57 facing the first negative direction X2.

[0055] The via 38 is made of the same material as the first wiring portion 31. The via 38 has a cylindrical shape extending in the direction along the first axis X. The via 38 is laminated on the surface of the second end portion 37B of the fourth wiring portion 37 facing the first negative direction X2. Therefore, the via 38 is electrically connected to the second end portion 37B of the fourth wiring portion 37. And the via 38 extends from the second end portion 37B of the fourth wiring portion 37 in the first negative direction X2.

[0056] In the eighth layer L8, the portion excluding the fifteenth electrode portion 48, the sixteenth electrode portion 58, and the via 38 is the eighth insulating portion 28. The eighth insulating portion 28 is made of a non-magnetic insulator of the same material as the first insulating portion 21.

[0057] The ninth layer L9 is laminated on the main surface of the eighth layer L8 facing the first negative direction X2. When viewing the ninth layer L9 facing the first negative direction X2, the ninth layer L9 has the same rectangular shape as the first layer L1. The ninth layer L9 is composed of a seventeenth electrode portion 49, an eighteenth electrode portion 59, a fifth wiring portion 39, and a ninth insulating portion 29.

[0058] The seventeenth electrode portion 49 is made of the same material as the first electrode portion 41. The seventeenth electrode portion 49 has a rod shape with the same dimensions as the fifteenth electrode portion 48. Also, when viewing the ninth layer L9 facing the first negative direction X2, the seventeenth electrode portion 49 is located at the same position as the fifteenth electrode portion 48. Therefore, the seventeenth electrode portion 49 is laminated on the surface of the fifteenth electrode portion 48 facing the first negative direction X2.

[0059] The eighteenth electrode portion 59 is made of the same material as the second electrode portion 51. When viewing the ninth layer L9 facing the first negative direction X2, the eighteenth electrode portion 59 is L-shaped as a whole. The eighteenth electrode portion 59 is located on the second negative direction Y2 side and the third negative direction Z2 side of the center of the ninth layer L9 when viewing the ninth layer L9 facing the first negative direction X2. That is, the eighteenth electrode portion 59 is located at a position including the corner on the second negative direction Y2 side and the third negative direction Z2 side of the center of the ninth layer L9 when viewing the first layer L1 facing the first negative direction X2. Therefore, the eighteenth electrode portion 59 is laminated on the surface of the sixteenth electrode portion 58 facing the first negative direction X2.

[0060] The fifth wiring portion 39 is made of the same material as the first wiring portion 31. When viewing the ninth layer L9 facing the first negative direction X2, the fifth wiring portion 39 extends in a spiral shape with the center of the ninth layer L9 as the approximate center as a whole. Specifically, the position of the first end portion 39A of the fifth wiring portion 39 is on the surface facing the first negative direction X2 of the via 38. Therefore, the first end portion 39A of the fifth wiring portion 39 is connected to the via 38. The wiring width of the fifth wiring portion 39 is substantially constant except for the first end portion 39A. The second end portion 39B of the fifth wiring portion 39 is connected to the end portion on the positive third direction Z1 side in the direction along the third axis Z of the eighteenth electrode portion 59. And when viewing the fifth wiring portion 39 facing the first negative direction X2, the fifth wiring portion 39 extends clockwise from the first end portion 39A to the second end portion 39B. Incidentally, the second end portion 39B of the fifth wiring portion 39 is the second end of the inductor wiring 30. Incidentally, the second end portion 39B is a portion outside the circumferential path formed by overlapping the wiring portions of the first layer L1 to the ninth layer L9 when viewed facing the first negative direction X2. Further, the fifth wiring portion 39 is rotationally symmetric with the first wiring portion 31 with the axis along the third axis Z passing through the center in the extending direction of the inductor wiring 30 as the rotation axis.

[0061] In the ninth layer L9, the portion excluding the seventeenth electrode portion 49, the eighteenth electrode portion 59, and the fifth wiring portion 39 is the ninth insulating portion 29. The ninth insulating portion 29 is made of an insulator of the same material as the first insulating portion 21.

[0062] The element body 11 has a first coating insulating layer 61 and a second coating insulating layer 62. When viewing the first coating insulating layer 61 facing the first negative direction X2, the first coating insulating layer 61 has the same rectangular shape as the first layer L1. The first coating insulating layer 61 is laminated on the main surface of the first layer L1 facing the first positive direction X1. When viewing the second coating insulating layer 62 facing the first positive direction X1, the second coating insulating layer 62 has the same rectangular shape as the first layer L1. The second coating insulating layer 62 is laminated on the main surface of the ninth layer L9 facing the first negative direction X2.

[0063] The above-described first insulating part 21 to ninth insulating part 29, first coating insulating layer 61, and second coating insulating layer 62 are integrated. Therefore, there is no physical boundary between them. Hereinafter, when there is no need to distinguish them, they are collectively referred to as insulating part 20. Note that the first insulating part 21 to ninth insulating part 29, first coating insulating layer 61, and second coating insulating layer 62 do not have to be integrated. That is, there may be a physical boundary between them.

[0064] Also, the first wiring part 31, second wiring part 33, third wiring part 35, fourth wiring part 37, fifth wiring part 39, via 32, via 34, via 36, and via 38 are integrated. Therefore, there is no physical boundary between them. Hereinafter, when there is no need to distinguish them, they are collectively referred to as inductor wiring 30. And the inductor wiring 30 is wound in a spiral shape as a whole. The central axis when the inductor wiring 30 is wound is an axis extending along the first axis X. Note that the first wiring part 31, second wiring part 33, third wiring part 35, fourth wiring part 37, fifth wiring part 39, via 32, via 34, via 36, and via 38 do not have to be integrated. That is, there may be a physical boundary between them.

[0065] Furthermore, the above-described first electrode part 41, third electrode part 42, fifth electrode part 43, seventh electrode part 44, ninth electrode part 45, eleventh electrode part 46, thirteenth electrode part 47, fifteenth electrode part 48, and seventeenth electrode part 49 are integrated. And these are combined to form the first embedded electrode 40.

[0066] Similarly, the above-described second electrode part 51, fourth electrode part 52, sixth electrode part 53, eighth electrode part 54, tenth electrode part 55, twelfth electrode part 56, fourteenth electrode part 57, sixteenth electrode part 58, and eighteenth electrode part 59 are integrated. And these are combined to form the second embedded electrode 50.

[0067] In this embodiment, the body 11 of the inductor component 10 is composed of an insulating portion 20, a first embedded electrode 40, and a second embedded electrode 50. As a result of laminating the first layer L1 to the ninth layer L9, the first coating insulating layer 61, and the second coating insulating layer 62, as shown in FIG. 1, the body 11 is generally rectangular parallelepiped-shaped.

[0068] And the inductor wiring 30 extends inside the body 11. Note that the inductor wiring 30, the first embedded electrode 40, and the second embedded electrode 50 may be integrated. That is, there may be no physical boundary between the inductor wiring 30 and the first embedded electrode 40, or between the inductor wiring 30 and the second embedded electrode 50.

[0069] (Bottom electrode portion and protruding portion) As shown in FIG. 3, the first embedded electrode 40 is exposed outside the body 11 in the region from the first end face 11C to the bottom face 11E. The first embedded electrode 40 has a first bottom electrode portion 40A and a first end face electrode portion 40B.

[0070] The first bottom electrode portion 40A is exposed outside the body 11 on the bottom face 11E. The first bottom electrode portion 40A is plate-shaped. When viewing the bottom face 11E facing the third positive direction Z1, the first bottom electrode portion 40A is square-shaped. The face on the second positive direction Y1 side of the first bottom electrode portion 40A constitutes a part of the first end face 11C of the body 11.

[0071] The first end face electrode portion 40B is exposed outside the body 11 on the first end face 11C. The first end face electrode portion 40B is rod-shaped. The first end face electrode portion 40B exists only in the first layer L1. The first end face electrode portion 40B extends from the end on the second positive direction Y1 side of the first bottom electrode portion 40A toward the third positive direction Z1.

[0072] Similar to the first embedded electrode 40, as shown in FIG. 2, the second embedded electrode 50 is exposed outside the base body 11 in the region from the second end face 11D to the bottom face 11E. As shown in FIGS. 2 and 3, the second embedded electrode 50 has a second bottom electrode portion 50A and a second end face electrode portion 50B.

[0073] The second bottom electrode portion 50A is exposed outside the base body 11 on the bottom face 11E. The second bottom electrode portion 50A is plate-shaped. When viewing the bottom face 11E facing the third positive direction Z1, the second bottom electrode portion 50A is square-shaped. The surface of the second bottom electrode portion 50A on the second negative direction Y2 side constitutes a part of the second end face 11D of the base body 11.

[0074] The second end face electrode portion 50B is exposed outside the base body 11 on the second end face 11D. The second end face electrode portion 50B is rod-shaped. The second end face electrode portion 50B exists only in the ninth layer L9. The second end face electrode portion 50B extends from the end of the second bottom electrode portion 50A on the second positive direction Y1 side toward the third positive direction Z1.

[0075] (Coating electrode) As shown in FIG. 1, the inductor component 10 includes a first coating electrode 71 and a second coating electrode 72. The first coating electrode 71 and the second coating electrode 72 cover a part on a first virtual line VL1 passing through the geometric center of the bottom face 11E and perpendicular to the first end face 11C. The first coating electrode 71 covers the surface of the first embedded electrode 40 that is exposed outside the base body 11. Therefore, the first coating electrode 71 is electrically connected to the first end of the inductor wiring 30. Also, the first coating electrode 71 partially covers the first end face 11C. The first coating electrode 71 has a two-layer structure of nickel plating and tin plating, although not shown in the figure. In FIGS. 2 and 3, the illustration of the first coating electrode 71 is omitted.

[0076] In addition, "exposed outside the base body 11" means being exposed from the base body 11, rather than being exposed outside the inductor component 10. Therefore, even if it is covered by other members such as the first covering electrode 71, as long as it is exposed from the base body 11, it does not have to be exposed outside the inductor component 10.

[0077] The distance from the first end face 11C to the surface of the first covering electrode 71 in the direction perpendicular to the first end face 11C is defined as the thickness of the first covering electrode 71. That is, the distance from the first end face 11C to the surface of the first covering electrode 71 in the direction along the second axis Y is the thickness of the first covering electrode 71.

[0078] As shown in FIGS. 4 and 5, on the second virtual line VL2 passing through the geometric center C of the first end face 11C and perpendicular to the first main face 11A, the thickness of the first covering electrode 71 is maximum on the first main face 11A side with respect to the geometric center C. Specifically, when viewing the first end face 11C facing the second negative direction Y2, the geometric center C of the first end face 11C is located in the fifth layer L5. And the first covering electrode 71 intersects the second virtual line VL2 only in the first layer L1. As described above, the first layer L1 is located on the first positive direction X1 side of the fifth layer L5. Therefore, on the second virtual line VL2, the position where the thickness of the first covering electrode 71 is maximum is shifted to the first main face 11A side with respect to the geometric center C of the first end face 11C. Specifically, on the second virtual line VL2, the thickness of the first covering electrode 71 is maximum in the first layer L1 on the first main face 11A side with respect to the geometric center C.

[0079] On the other hand, within the range from the geometric center C on the second virtual line VL2 to the location where the thickness of the first covering electrode 71 is maximum, the thickness of the first covering electrode 71 is minimum at the geometric center C. Specifically, on the second virtual line VL2, the first covering electrode 71 exists only in the first layer L1. Therefore, on the second virtual line VL2, the first covering electrode 71 does not exist in the range from the second layer L2 to the fifth layer L5. That is, at the geometric center C, the thickness of the first covering electrode 71 is zero. Thus, within the range from the first layer L1 to the fifth layer L5 on the second virtual line VL2, the thickness of the first covering electrode 71 is minimum at the fifth layer L5 where the geometric center C is located. Note that the location where the thickness of the first covering electrode 71 is minimum includes the case where the thickness of the first covering electrode 71 is zero. That is, it also includes the case where the first covering electrode 71 does not exist at the geometric center C of the first end face 11C.

[0080] On the first end face 11C, the dimension of the first covering electrode 71 in the direction perpendicular to the bottom face 11E is defined as the height of the first covering electrode 71. That is, on the first end face 11C, the dimension of the first covering electrode 71 in the direction along the third axis Z is the height of the first covering electrode 71.

[0081] The location where the height of the first covering electrode 71 is maximum is shifted toward the first main face 11A side from the geometric center C of the first end face 11C. Specifically, in the first layer L1, the first covering electrode 71 extends in the positive third direction Z1 compared with the second layer L2 to the ninth layer L9. The upper end of the first covering electrode 71 in the first layer L1 is located on the top face 11F side with respect to the second virtual line VL2. Within the range of the second layer L2 to the ninth layer L9, the upper end of the first covering electrode 71 is located on the bottom face 11E side with respect to the second virtual line VL2. Also, within the range of the second layer L2 to the ninth layer L9, the height of the first covering electrode 71 is constant. Note that being constant in height allows a variation of about 10%.

[0082] As shown in FIG. 2, the first wiring portion 31 extends parallel to the first main surface 11A from the first end of the inductor wiring 30. Among the plurality of wiring portions, the wiring portion that extends parallel to the first main surface 11A from the first end of the inductor wiring 30 is defined as the first end wiring portion. In the present embodiment, the first wiring portion 31 is the first end wiring portion. At this time, the thickness of the first coating electrode 71 on the second virtual line VL2 is maximum within the range of the first layer L1 where the first wiring portion 31 exists in the direction along the first axis X.

[0083] Also, as shown in FIG. 1, the second coating electrode 72 covers the surface of the second embedded electrode 50 that is exposed to the outside from the element body 11. Therefore, the second coating electrode 72 is electrically connected to the second end of the inductor wiring 30. Also, the second coating electrode 72 partially covers the second end surface 11D. Although not shown, the second coating electrode 72 has a two-layer structure of nickel plating and tin plating. In FIGS. 2 and 3, the illustration of the second coating electrode 72 is omitted.

[0084] On the virtual line passing through the geometric center of the second end surface 11D and perpendicular to the second main surface 11B, the thickness of the second coating electrode 72 is maximum on the second main surface 11B side with respect to the geometric center of the second end surface 11D. Specifically, when viewing the second end surface 11D facing the second positive direction Y1, the geometric center of the second end surface 11D is located in the fifth layer L5. And the second coating electrode 72 intersects with the virtual line only in the ninth layer L9. As described above, the ninth layer L9 is located on the first negative direction X2 side of the fifth layer L5. Therefore, on the virtual line, the thickness of the second coating electrode 72 is maximum in the ninth layer L9 on the second main surface 11B side of the geometric center of the second end surface 11D. Thus, the location where the thickness of the second coating electrode 72 is maximum on the virtual line is shifted to the second main surface 11B side from the geometric center of the second end surface 11D. Specifically, on the virtual line, the thickness of the second coating electrode 72 is maximum in the ninth layer L9 on the side opposite to the first main surface 11A from the geometric center of the second end surface 11D.

[0085] On the other hand, within the range from the geometric center of the second end face 11D on the virtual line to the location where the thickness of the second covering electrode 72 is maximum, the thickness of the second covering electrode 72 is minimum at the geometric center of the second end face 11D. Specifically, on the virtual line, the second covering electrode 72 exists only in the ninth layer L9. Therefore, on the virtual line, the second covering electrode 72 does not exist in the range from the fifth layer L5 to the eighth layer L8. That is, at the geometric center of the second end face 11D, the thickness of the second covering electrode 72 is zero. Thus, within the range from the fifth layer L5 to the ninth layer L9 on the virtual line, the thickness of the second covering electrode 72 is minimum at the fifth layer L5 where the geometric center of the second end face 11D is located.

[0086] The location where the height of the second covering electrode 72 is maximum is shifted toward the second main face 11B side from the geometric center of the second end face 11D. Specifically, in the ninth layer L9, the second covering electrode 72 extends in the positive third direction Z1 compared to the first layer L1 to the eighth layer L8. The upper end of the second covering electrode 72 in the ninth layer L9 is located on the top face 11F side with respect to the virtual line passing through the geometric center of the second end face 11D and perpendicular to the second main face 11B. Within the range of the first layer L1 to the eighth layer L8, the upper end of the second covering electrode 72 is located on the bottom face 11E side with respect to the virtual line. Also, within the range of the first layer L1 to the eighth layer L8, the height of the second covering electrode 72 is constant.

[0087] The fifth wiring portion 39 extends parallel to the first main face 11A from the second end of the inductor wiring 30. Among the plurality of wiring portions, the wiring portion that extends parallel to the second main face 11B from the second end of the inductor wiring 30 is defined as the second end wiring portion. In this embodiment, the fifth wiring portion 39 is the second end wiring portion. At this time, the thickness of the second covering electrode 72 on the virtual line passing through the geometric center of the second end face 11D and perpendicular to the second main face 11B is maximum within the range of the ninth layer L9 where the fifth wiring portion 39 exists in the direction along the first axis X.

[0088] (Manufacturing Method of Inductor Component) Next, the manufacturing method of the inductor component 10 will be described. As shown in FIG. 6, the method for manufacturing the inductor component 10 includes a laminate forming step S100, a firing step S200, and a plating step S300.

[0089] First, the laminate forming step S100 is performed. The laminate forming step S100 is a step of forming a laminate in a state before sintering of the green body 11. In the laminate forming step S100, the first coating insulating layer 61, the first layer L1 to the ninth layer L9, and the second coating insulating layer 62 are laminated in this order to form a laminate. Note that the first coating insulating layer 61, the second coating insulating layer 62, and the first layer L1 to the ninth layer L9 in the laminate forming step S100 are strictly the layers before their sintering, and may be different from the respective layers in the inductor component 10. However, for simplicity of explanation, the same names are used. In this regard, the inductor wiring 30, the first embedded electrode 40, and the second embedded electrode 50 are also strictly in the state before their sintering, and may be different from the respective members in the inductor component 10. However, for simplicity of explanation, the same names are used.

[0090] Specifically, the laminate forming step S100 includes a first coating insulating layer coating step S10, a first layer coating step S11 to a ninth layer coating step S19, and a second coating insulating layer coating step S20. In the laminate forming step S100, these steps are performed in this order.

[0091] In the first coating insulating layer coating step S10, screen printing is performed using an insulating insulating paste. Then, by repeating the coating by screen printing, an insulating paste layer corresponding to the first coating insulating layer 61 is formed. The insulating paste is, for example, an insulating paste mainly composed of borosilicate glass.

[0092] Next, in the first layer coating step S11, in addition to the insulating paste, a conductive conductive paste containing metal powder is used to form a layer corresponding to the first layer L1. The metal powder is, for example, silver. Specifically, on the surface of the insulating paste layer corresponding to the first coating insulating layer 61 facing the first negative direction X2, a conductor layer is formed on the portions corresponding to the first wiring portion 31, the first electrode portion 41, and the second electrode portion 51 using the conductive paste by photolithography. Also, an insulator layer is formed on the portion corresponding to the first insulating portion 21 using the insulating paste by photolithography.

[0093] Next, in the second layer coating step S12 to the ninth layer coating step S19, in the same manner as the first layer coating step S11, layers corresponding to the second layer L2 to the ninth layer L9 are formed using the insulating paste and the conductive paste. Thereby, a pattern of the conductive paste extending spirally inside the insulating paste is formed. Also, a first conductive portion of the conductive paste exposed from the insulating paste and connected to the first end of the pattern of the conductive paste is formed. Further, a second conductive portion of the conductive paste exposed from the insulating paste and connected to the second end of the pattern of the conductive paste is formed.

[0094] Then, screen printing is performed using the insulating paste. And by repeating the application by screen printing, a layer corresponding to the second coating insulating layer 62 is formed. Thereafter, by cutting to a desired size, a laminate in a state before sintering of the element body 11 is formed.

[0095] In this way, in the laminate forming step S100, a rectangular parallelepiped laminate having a pattern of the conductive paste extending spirally inside the insulating paste, the first conductive portion, and the second conductive portion is formed.

[0096] Next, the firing process S200 is performed. The firing process S200 is a process of forming the green body 11 by firing the laminate. Specifically, the laminate is fired by heating it at a predetermined temperature. As a result, each paste is fired, so that the insulating paste becomes the insulating portion 20, the pattern of the inductor wiring 30 becomes the inductor wiring 30, the first conductive portion becomes the first embedded electrode 40, and the second conductive portion becomes the second embedded electrode 50. That is, the first bottom electrode portion 40A and the first end face electrode portion 40B in the first embedded electrode 40 are formed. Also, the second bottom electrode portion 50A and the second end face electrode portion 50B in the second embedded electrode 50 are formed. As a result, the green body 11 is formed.

[0097] Next, the plating process S300 is performed. The green body 11 is placed in a plating solution and electroplating is performed. As a result, a first coating electrode 71 is formed on the surface of the green body 11 that is exposed outside the first embedded electrode 40. Also, a second coating electrode 72 is formed on the surface of the green body 11 that is exposed outside the second embedded electrode 50.

[0098] In electroplating, the first coating electrode 71 is formed only on the surface of the first embedded electrode 40 that is exposed outside. Therefore, as shown in FIG. 4, the first coating electrode 71 is not formed on the geometric center C of the first end face 11C. On the other hand, the first coating electrode 71 is formed within the range of the first layer L1 of the first end face 11C. Therefore, the thickness of the first coating electrode 71 is zero at the geometric center C and is maximum within the range of the first layer L1. That is, on the second virtual line VL2, the location where the thickness of the first coating electrode 71 is maximum is shifted toward the first main surface 11A side from the geometric center C. Note that although the first coating electrode 71 is formed only on the surface of the first embedded electrode 40 that is exposed outside the green body 11, due to some plating growth or the influence of external forces during measurement or packaging, etc., it may be formed around the surface of the first embedded electrode 40 that is exposed outside the green body 11.

[0099] (Effects of the First Embodiment) According to the inductor component 10 in the above-described first embodiment, the following effects can be achieved. Hereinafter, the effects related to the first coating electrode 71 will be described as a representative, but the second coating electrode 72 also has the same effects.

[0100] (1-1) For example, as another electronic component arranged adjacent to the first end face 11C of the inductor component 10, there is one in which an electrode is plated over the entire end face of a rectangular parallelepiped-shaped element body. In such an electronic component, the thickness of the electrode is large at the center of the end face. That is, in this type of electronic component, the center of the end face of the element body has a bulged shape. Also, in the current situation where the outer diameter size of the electronic component is substantially being standardized, for high-density mounting, the land patterns on the substrate where each electronic component is arranged are aligned. That is, when viewed from a direction perpendicular to the main surface of the substrate, the geometric center C of the first end face 11C of the inductor component 10 and the geometric center of the end face of another adjacent electronic component often line up adjacent to each other in a straight line.

[0101] According to the inductor component 10 in the first embodiment, the location where the thickness of the first coating electrode 71 is maximum is shifted toward the first main surface 11A side from the geometric center C of the first end face 11C. Now, assume that the inductor component 10 and the above-mentioned other electronic component are arranged at adjacent positions on the aligned land patterns on the substrate. Even in this case, the location where the thickness of the first coating electrode 71 of the inductor component 10 is maximum and the location where the thickness of the electrode of the above-mentioned other electronic component is maximum are shifted. Therefore, it becomes difficult for the electrodes of the two components to interfere with each other. Thus, it can contribute to the high-density packaging of components on the substrate.

[0102] (1-2) According to the inductor component 10 in the first embodiment, the location where the height of the first coating electrode 71 is maximum is shifted toward the first main surface 11A from the geometric center C of the first end surface 11C. Suppose that the position of the upper end of the first coating electrode 71 may be located on the top surface 11F side with respect to the second virtual line VL2 in all ranges in the direction along the first axis X. Compared with this case, in the center in the direction along the first axis X on the first end surface 11C, the range in which the first coating electrode 71 covers the inductor wiring 30 becomes smaller. Therefore, the parasitic capacitance generated when current flows through the inductor wiring 30 can be reduced.

[0103] (1-3) According to the inductor component 10 in the first embodiment, the thickness of the first coating electrode 71 on the second virtual line VL2 is maximum within the range of the first layer L1 where the first wiring portion 31 that extends parallel to the first main surface 11A from the first end of the inductor wiring 30 exists. That is, in the direction along the first axis X, the thickness of the first coating electrode 71 is maximum at a location away from the geometric center C. Therefore, it is possible to more preferably suppress the first coating electrode 71 from interfering with other electronic components.

[0104] <Regarding the second embodiment> Hereinafter, the second embodiment will be described with reference to the drawings. The inductor component 110 of the second embodiment has different shapes of the first coating electrode 71 and the second coating electrode 72 compared with the inductor component 10 of the first embodiment. In the following, the description will focus on the differences compared with the inductor component 10 in the first embodiment, and the description of the same points will be simplified or omitted. Also, regarding the second coating electrode 72, the description of the same points as the first coating electrode 71 will be simplified or omitted.

[0105] (End surface electrode portion and coating electrode) As shown in FIG. 7, the shapes of the second electrode portions 51 to the seventeenth electrode portions 49 of the inductor component 110 are different from those of the first embodiment. Specifically, the third electrode portion 42 to the seventeenth electrode portion 49 are L-shaped with the same size and the same shape as the first electrode portion 41. Also, the second electrode portion 51 to the sixteenth electrode portion 58 are L-shaped with the same size and the same shape as the eighteenth electrode portion 59. Therefore, when viewing the first end face 11C facing the second negative direction Y2, the first end face electrode portion 40B is square-shaped. Similarly, when viewing the second end face 11D facing the second positive direction Y1, the second end face electrode portion 50B is square-shaped.

[0106] Also, the first embedded electrode 40 is a sintered body composed of metal and glass. And the electrical resistance value at the geometric center C of the first end face 11C in the first end face electrode portion 40B is larger than the electrical resistance value at the location where the thickness of the first coating electrode 71 is maximum. In the present embodiment, among the first end face electrode portion 40B, the electrical resistance value at the position identical to the geometric center C in the direction along the first axis X is larger than the electrical resistance value at the location closest to the first main surface 11A in the first end face electrode portion 40B. Specifically, among the first end face electrode portion 40B, the metal density at the geometric center C of the first end face 11C is coarser than the metal density at the location where the thickness of the first coating electrode 71 is maximum on the second virtual line VL2. In the present embodiment, among the first end face electrode portion 40B, the metal density at the position identical to the geometric center C in the direction along the first axis X is coarser than the metal density at the location closest to the first main surface 11A in the first end face electrode portion 40B. In the present embodiment, among the first embedded electrode 40, the first electrode portion 41 and the seventeenth electrode portion 49 have a denser metal structure than the third electrode portion 42 to the fifteenth electrode portion 48.

[0107] As shown in FIG. 8, the first covering electrode 71 that covers the surface of the first end face electrode portion 40B also has a rectangular shape when the inductor component 110 is viewed facing the second negative direction Y2. Further, the height of the first covering electrode 71 is the same throughout the entire range in the direction along the first axis X. Note that the height of the first covering electrode 71 may be slightly higher at the geometric center C than at other locations in the direction along the first axis X, or may be slightly lower than at other locations in the first layer L1 and the ninth layer L9.

[0108] Then, as shown in FIG. 9, the thickness of the first covering electrode 71 on the second virtual line VL2 does not reach its maximum at the geometric center C. Specifically, the thickness of the first covering electrode 71 on the second virtual line VL2 reaches its maximum in the first layer L1 and the ninth layer L9. Note that in the present embodiment, the first covering electrode 71 also exists on the geometric center C of the first end face 11C. Therefore, the thickness of the first covering electrode 71 at the geometric center C is not zero. The thickness of the first covering electrode 71 from the second layer L2 to the eighth layer L8 is the minimum within the range of the first layer L1 to the ninth layer L9. That is, the thickness of the first covering electrode 71 at the geometric center C is the minimum within the range from the geometric center C to the first layer L1.

[0109] Also, similar to the first embedded electrode 40, the second embedded electrode 50 is a sintered body composed of metal and glass. And, similar to the first end face electrode portion 40B, the electrical resistance value at the geometric center of the second end face 11D in the second end face electrode portion 50B is larger than the electrical resistance value at the location where the thickness of the second coating electrode 72 is maximum. In the present embodiment, among the second end face electrode portion 50B, the electrical resistance value at the position identical to the geometric center of the second end face 11D in the direction along the first axis X is larger than the electrical resistance value at the location closest to the second main face 11B in the second end face electrode portion 50B. Specifically, among the second end face electrode portion 50B, the density of the metal at the geometric center of the second end face 11D is coarser than the density of the metal at the location where the thickness of the first coating electrode 71 is maximum on the virtual line passing through the geometric center of the second end face 11D and perpendicular to the second main face 11B. In the present embodiment, among the second end face electrode portion 50B, the density of the metal at the position identical to the geometric center of the second end face 11D in the direction along the first axis X is sparser than the density of the metal at the location closest to the second main face 11B in the second end face electrode portion 50B. In the present embodiment, among the second embedded electrode 50, the second electrode portion 51 and the eighteenth electrode portion 59 have a denser metal structure than the fourth electrode portion 52 to the sixteenth electrode portion 58.

[0110] Although not shown, similar to the first coating electrode 71, the second coating electrode 72 that covers the surface of the second end face electrode portion 50B also has a square shape when the inductor component 110 is viewed facing the second positive direction Y1. Also, the height of the second coating electrode 72 is the same throughout the entire range in the direction along the first axis X.

[0111] And the thickness of the second covering electrode 72 on the virtual line passing through the geometric center of the second end face 11D and parallel to the first axis X is maximum in the first layer L1 and the ninth layer L9. In this embodiment, the second covering electrode 72 also exists on the geometric center of the second end face 11D. Therefore, the thickness of the second covering electrode 72 at the geometric center of the second end face 11D is not zero. The thickness of the second covering electrode 72 from the second layer L2 to the eighth layer L8 is minimum within the range of the first layer L1 to the ninth layer L9. That is, the thickness of the second covering electrode 72 at the geometric center of the second end face 11D is minimum within the range from the geometric center of the second end face 11D to the ninth layer L9.

[0112] (Method for manufacturing an inductor component) Next, a method for manufacturing the inductor component 110 will be described. Compared with the method for manufacturing the inductor component 10 of the first embodiment, in the second embodiment, the material of the conductive paste used is partially different.

[0113] Specifically, the conductive paste used in the second layer coating step S12 to the eighth layer coating step S18 in the laminate forming step S100 contains a sintering inhibitor. The sintering inhibitor is glass powder. Note that the conductive paste used in the first layer coating step S11 and the ninth layer coating step S19 does not contain a sintering inhibitor.

[0114] In the firing step S200, the conductive paste containing the sintering inhibitor is less likely to be sintered than the conductive paste not containing the sintering inhibitor. When the paste containing metal powder is sintered, the grains change to approach each other. In the portion where sintering is difficult, the metal structure formed into a sintered body is less likely to be densified. That is, the density of the metal in the second layer L2 to the eighth layer L8 of the first embedded electrode 40 is lower than the density of the metal in the first layer L1 and the ninth layer L9 of the first embedded electrode 40.

[0115] In the plating step S300, electroplating is performed on the surface of the first embedded electrode 40. In electroplating, the amount of plating is affected by the electrical resistance value of the surface of the first embedded electrode 40 to be plated. Specifically, when more current flows per unit time, more plating is performed. On the other hand, when less current flows per unit time, less plating is performed. Therefore, since the film formation rate of plating changes depending on the magnitude of the electrical resistance value, the amount of plating also changes even with the same plating time. In the present embodiment, the surfaces of the second layer L2 to the eighth layer L8 of the first embedded electrode 40 have a lower metal density than the surfaces of the first layer L1 and the ninth layer L9. When the metal density is low, the contact points between the metals are reduced, so the electrical resistance value becomes larger. Therefore, the surfaces of the second layer L2 to the eighth layer L8 of the first embedded electrode 40 are plated more than the surfaces of the first layer L1 and the ninth layer L9. As a result, the thickness of the first coating electrode 71 is smaller in the second layer L2 to the eighth layer L8 than in the first layer L1 and the ninth layer L9.

[0116] (Effect of the Second Embodiment) According to the second embodiment described above, in addition to the effects of (1-1) and (1-3) of the first embodiment, the following effects are achieved. In the following, the effects related to the first coating electrode 71 are described as a representative, but the second coating electrode 72 also exhibits the same effects.

[0117] (2-1) According to the second embodiment described above, the electrical resistance value at the geometric center C of the first end face 11C in the first end face electrode portion 40B is larger than the electrical resistance value at the location where the thickness of the first coating electrode 71 is maximum. Therefore, in the plating step S300, it is difficult to perform electroplating at the geometric center C. Thus, it is easy to form the first coating electrode 71 having different thicknesses at each location on the first end face electrode portion 40B.

[0118] (2-2) According to the second embodiment, when electroplating the first end face electrode portion 40B, reflecting the fact that the density of the metal is sparse, current hardly flows at the center of the first end face electrode portion 40B in the direction along the first axis X. Therefore, even for a sintered body composed of the same metal and glass, the electrical resistance value can be changed due to the difference in the density of the metal.

[0119] <Regarding Other Embodiments> Each of the above embodiments can be implemented with the following modifications. Each of the above embodiments and the following modification examples can be implemented in combination within a technically non - conflicting range. Note that the points common to the first coating electrode 71 and the second coating electrode 72 are described by representing the first coating electrode 71, and the description of the second coating electrode 72 is omitted.

[0120] · In the first embodiment, the thicknesses of the first layer L1 to the ninth layer L9 were all substantially the same, but they may be different from each other. That is, the thicknesses of the first layer L1 to the ninth layer L9, that is, the dimensions in the direction along the first axis X, do not have to be all the same. All the thicknesses may be different from each other, or the thicknesses of some layers may be different from those of other layers.

[0121] · The element body 11 may be a rectangular parallelepiped that is long in the direction along the first axis X, or may be a rectangular parallelepiped that is long in the direction along the third axis Z. Also, the element body 11 may be a rectangular parallelepiped in which the dimensions in the direction along the first axis X, the dimensions in the direction along the second axis Y, and the dimensions in the direction along the third axis Z are equal. For example, regarding the dimensions of the element body 11 along each axis, the dimension in the direction along the first axis X may be equal to the dimension in the direction along the third axis Z, and the dimension in the direction along the second axis Y may be larger than the dimension in the direction along the first axis X. Also, for example, regarding the dimensions of the element body 11 along each axis, the dimension in the direction along the second axis Y may be larger than the dimension in the direction along the third axis Z, and the dimension in the direction along the third axis Z may be larger than the dimension in the direction along the first axis X. Also, for example, the dimension in the direction along the second axis Y may be larger than the dimension in the direction along the first axis X, and the dimension in the direction along the first axis X may be larger than the dimension in the direction along the third axis Z.

[0122] · Also, the stacking direction of each layer of the base body 11 is not limited to the examples of the above embodiments. Each layer of the base body 11 may be stacked along the second axis Y or may be stacked along the third axis Z. · The material of the insulating portion 20 is not limited to the examples of the above embodiments and may be any insulator. For example, the material of the insulating portion 20 may be a magnetic insulator. Also, a part of the insulating portion 20 may be a non-magnetic or magnetic insulator different from other parts.

[0123] · The first coating insulating layer 61 may have a structure in which a plurality of insulating layers are stacked. Also, when the first coating insulating layer 61 is composed of a plurality of insulating layers, some of the insulating layers may be colored. This also applies to the second coating insulating layer 62.

[0124] · The configuration of the inductor wiring 30 is not limited to the examples of the above embodiments. It only needs to extend inside the base body 11 and may be appropriately changed, such as the shape and length, according to the required characteristics. In each embodiment, the inductor wiring 30 had a shape wound around an axis parallel to the bottom surface 11E, but it may also have a shape wound around an axis perpendicular to the bottom surface 11E. Also, it may have a shape wound around an axis parallel to the bottom surface 11E and perpendicular to the first end surface 11C.

[0125] · Also, the number of turns of each layer of the inductor wiring 30 is not limited to less than one turn. The inductor wiring 30 may be wound one or more times in each layer. That is, the structure of the inductor wiring 30 may be a spiral structure.

[0126] · In the first embodiment, the wiring width of the first wiring portion 31 may be substantially constant including the second end portion 31B. This also applies to the wiring widths of other wiring portions. · The positions of the ends of the respective wiring portions in the inductor wiring 30 are not limited to the positions of the above embodiments. The positions of the ends of the respective wiring portions in the inductor wiring 30 may be appropriately changed.

[0127] · In the first embodiment, the tip of the L-shaped first electrode portion 41 on the third positive direction Z1 side may be located on the third positive direction Z1 side with respect to the center of the first layer L1. The same applies to the eighteenth electrode portion 59 in this regard.

[0128] · In the first embodiment, the fifth electrode portion 43 may have dimensions different from those of the third electrode portion 42. The same applies to other electrode portions in this regard. · The shape of the first covering electrode 71 is not limited to the example of the above embodiment. When viewing the inductor component 10 facing the second negative direction Y2, the shape of the first covering electrode 71 may be changed in accordance with the exposed range of the first end face electrode portion 40B of the first embedded electrode 40. For example, in the first embodiment, the first covering electrode 71 in the first layer L1 protrudes in a rectangular parallelepiped shape, but it may also protrude in a curved surface shape. Further, for example, the thickness and height may change in a gentle curved surface shape or a tapered shape from the first layer L1 to the second layer L2 and the third layer L3.

[0129] · When the inductor component 210 of the modification shown in FIG. 10 is viewed with the inductor component 110 facing the second negative direction Y2, the shape of the first coating electrode 71 is different from that of the inductor component 10 of the first embodiment. In the first coating electrode 71 of the inductor component 210, the height of the first coating electrode 71 in the fifth layer L5 is minimized. And the upper end of the first coating electrode 71 in the fifth layer L5 is located on the bottom surface 11E side with respect to the geometric center C. Also, the height of the first coating electrode 71 in the fourth layer L4 and the sixth layer L6 is greater than the height of the first coating electrode 71 in the fifth layer L5. Furthermore, the height of the first coating electrode 71 in the third layer L3 and the seventh layer L7 is greater than the height of the first coating electrode 71 in the fourth layer L4 and the sixth layer L6. And the height of the first coating electrode 71 in the second layer L2, the eighth layer L8, and the ninth layer L9 is greater than the height of the first coating electrode 71 in the third layer L3 and the seventh layer L7. Moreover, the height of the first coating electrode 71 in the first layer L1 is the largest among the first layer L1 to the ninth layer L9. Thus, the height of the first coating electrode 71 may gradually change from the first layer L1 to the fifth layer L5. In this modification, the first coating electrode 71 does not exist on the geometric center C of the first end face 11C. Therefore, the thickness of the first coating electrode 71 on the second virtual line VL2 is the smallest on the geometric center C.

[0130] In addition, on the second virtual line, if the location where the thickness of the first coating electrode 71 is maximum is shifted toward the first main surface 11A side from the geometric center C of the first end face 11C, the thickness of the first coating electrode 71 does not necessarily have to be the smallest on the geometric center C. Also, on the second virtual line, if the location where the thickness of the first coating electrode 71 is maximum is shifted toward the first main surface 11A side from the geometric center C of the first end face 11C, the thickness of the first coating electrode 71 does not necessarily have to be the largest in the first layer L1 or the ninth layer L9.

[0131] Also, the first coating electrode 71 may be smoothly connected between layers. That is, when the inductor component 110 is viewed facing the second negative direction Y2, the outer edge of the first coating electrode 71 may not have corners and may be curved. Furthermore, the surface of the first coating electrode 71 covering the first end face 11C may be a curved surface.

[0132] · The inductor component 310 of the modification example shown in FIG. 11 has a different height of the first coating electrode 71 in the second layer L2 compared to the inductor component 10 of the first embodiment. Specifically, the height of the first coating electrode 71 in the second layer L2 is larger than the height of the first coating electrode 71 in the first layer L1. Also, the upper end of the first coating electrode 71 in the second layer L2 is located on the top surface 11F side with respect to the second virtual line VL2. Even in this case, in the direction along the first axis X, on the first main surface 11A side of the geometric center C, the height of the first coating electrode 71 is the maximum.

[0133] · The inductor component 410 of the modification example shown in FIG. 12 has a different height of the first coating electrode 71 in the ninth layer L9 compared to the inductor component 10 of the first embodiment. Specifically, the height of the first coating electrode 71 in the ninth layer L9 is equal to the height of the first coating electrode 71 in the first layer L1. Therefore, in the range from the geometric center C to the positive first direction X1 side and the range to the negative first direction X2 side in the direction along the first axis X, at the locations where the distances from the geometric center C are the same, the heights of the first coating electrode 71 are equal. In this case, when mounting the inductor component 410 on the substrate, the stability in the direction along the first axis X is likely to be improved.

[0134] · The inductor component 510 of the modification example shown in FIG. 13 has a height of the first covering electrode 71 in the fifth layer L5 that is not the minimum compared to the inductor component 10 of the first embodiment. Specifically, in the inductor component 510, the heights of the first covering electrode 71 in the third layer L3, the fifth layer L5, the seventh layer L7, and the ninth layer L9 are different compared to the inductor component 10 of the first embodiment. The heights of the first covering electrode 71 in the third layer L3, the fifth layer L5, the seventh layer L7, and the ninth layer L9 of the inductor component 510 are greater than the height of the first covering electrode 71 in the second layer L2. Also, the heights of the first covering electrode 71 in the third layer L3, the fifth layer L5, the seventh layer L7, and the ninth layer L9 of the inductor component 510 are smaller than the height of the first covering electrode 71 in the first layer L1. Therefore, when the inductor component 510 is viewed facing the second negative direction Y2, the first covering electrode 71 in the second layer L2 to the ninth layer L9 is in a comb shape.

[0135] · The inductor component 610 of the modification example shown in FIG. 14 has different heights of the first covering electrode 71 in the first layer L1 and the second layer L2 compared to the inductor component 10 of the first embodiment. Specifically, the height of the first covering electrode 71 in the second layer L2 of the inductor component 610 is the maximum, and the height of the first covering electrode 71 in the first layer L1 is equal to the height of the first covering electrode 71 in the fifth layer L5. That is, in the inductor component 610, the thickness of the first covering electrode 71 on the second virtual line VL2 is the maximum outside the range of the first layer L1 where the first wiring portion 31, which is the first end wiring portion, exists.

[0136] · The inductor component 710 of the modification example shown in Fig. 15 has a different range where the first coated electrode 71 exists compared to the inductor component 10 of the first embodiment. Specifically, in the inductor component 710, the first coated electrode 71 exists only in the first layer L1 on the first end face 11C. That is, in the second layer L2 to the eighth layer L8, the first coated electrode 71 does not exist on the first end face 11C. For example, if the first bottom electrode portion 40A and the first end face electrode portion 40B exist only in the first layer L1, then, in this way, the first coated electrode 71 exists only in the first layer L1. In order to make the stray capacitance on the first end face 11C smaller, it is preferable to reduce the range of the first coated electrode 71 existing on the first end face 11C.

[0137] · The inductor component 810 of the modification example shown in Fig. 16 has a different existing range in the direction along the third axis Z of the first coated electrode 71 compared to the inductor component 710 of the modification example. Specifically, in the inductor component 810, compared to the inductor component 710, a part including the end on the negative third direction Z2 side is omitted. That is, the first coated electrode 71 is divided into a portion covering the first end face electrode portion 40B and a portion covering the first bottom electrode portion 40A. Even in this case, on the second virtual line VL2, the thickness of the first coated electrode 71 in the first layer L1 may be the maximum.

[0138] · The inductor component 910 of the modification example shown in Fig. 17 has a different range where the first coated electrode 71 exists compared to the inductor component 10 of the first embodiment. Specifically, in the inductor component 910, compared to the inductor component 10, a part including the end on the negative third direction Z2 side of the range of the first coated electrode 71 covering the first end face electrode portion 40B is omitted. Therefore, the first coated electrode 71 is divided into two parts on the first end face 11C.

[0139] · In the inductor component 110 of the second embodiment, the composition of the sintered body of the first end face electrode portion 40B in the first layer L1 and the ninth layer L9 may be different from the composition of the sintered body of the first end face electrode portion 40B in the second layer L2 to the eighth layer L8. For example, the material of the first end face electrode portion 40B in the first layer L1 and the ninth layer L9 may be silver, and the material of the first end face electrode portion 40B in the second layer L2 to the eighth layer L8 may be gold. In this case, the electrical resistance value of gold is larger than that of silver. Therefore, by electroplating, the first coating electrode 71 with different thicknesses can be formed at each location on the first end face electrode portion 40B. Also, for example, the combination of metals with different electrical resistance values is not limited to gold and silver, and may be silver and copper, or copper and gold. Also, for example, the difference in electrical resistance value may be realized by varying the composition ratio of the alloy.

[0140] · In the inductor component 110 of the second embodiment, the thickness of the first coating electrode 71 in the second layer L2 to the eighth layer L8 may be zero. That is, the thickness of the first coating electrode 71 may be zero on the geometric center C of the first end face 11C. That is, in the second layer L2 to the eighth layer L8, the first end face electrode portion 40B may be exposed to the outside of the element body 11 without being covered by the first coating electrode 71. In this case, in the plating step S300 in the manufacturing method of the inductor component 110 of the second embodiment, the surface of the first end face electrode portion 40B in the second layer L2 to the eighth layer L8 may be covered with an insulating cover and then electroplated. That is, the geometric center C of the first end face electrode portion 40B may be covered with the cover, and the portion of the first end face electrode portion 40B on the first main surface 11A side with respect to the geometric center C on the second virtual line VL2 may be exposed from the cover and electroplated.

[0141] · The first embedded electrode 40 only needs to have at least the first end face electrode portion 40B. That is, the first bottom face electrode portion 40A of the first embedded electrode 40 may be omitted. · The first embedded electrode 40 may be omitted. In this case, it is only necessary that the first coating electrode 71 is electrically connected to the first end of the inductor wiring 30.

[0142] · If the first covering electrode 71 covers a part of the bottom surface 11E on the first virtual line VL1, the range covering the bottom surface 11E may be appropriately changed. · The shape of the second covering electrode 72 when viewing the inductor component 10 facing the second positive direction Y1 may be different from the shape of the first covering electrode 71 when viewing the inductor component 10 facing the second negative direction Y2.

[0143] The technical ideas that can be grasped from the above embodiments and modification examples will be described. <1> A rectangular parallelepiped-shaped element having six outer surfaces, An inductor wiring extending inside the element, A first covering electrode that covers a bottom surface which is one of the outer surfaces and is electrically connected to the first end of the inductor wiring, A second covering electrode that covers the bottom surface and is electrically connected to the second end of the inductor wiring, Comprising, Among the six outer surfaces of the element, when one surface perpendicular to the bottom surface is defined as the main surface and the surfaces perpendicular to both the bottom surface and the main surface are defined as the first end surface and the second end surface, The first covering electrode and the second covering electrode cover a part of a first virtual line passing through the geometric center of the bottom surface and perpendicular to the first end surface, The first covering electrode covers the first end surface and the second covering electrode covers the second end surface, When the distance from the first end surface to the surface of the first covering electrode in the direction perpendicular to the first end surface is defined as the thickness of the first covering electrode, On a second virtual line passing through the geometric center of the first end surface and perpendicular to the main surface, the location where the thickness of the first covering electrode is maximum is shifted toward the main surface side from the geometric center of the first end surface Inductor component.

[0144] <2> When the dimension of the first covering electrode in the direction perpendicular to the bottom surface on the first end surface is defined as the height of the first covering electrode, The location where the height of the first coated electrode is maximum is shifted toward the main surface side from the geometric center of the first end face. The inductor component according to <1>.

[0145] <3> The inductor wiring has a plurality of wiring portions arranged in a direction perpendicular to the main surface, and vias connecting the adjacent wiring portions in the direction perpendicular to the main surface. Among the plurality of wiring portions, when the wiring portion extending parallel to the main surface from the first end is defined as the first end wiring portion, The thickness of the first coated electrode on the second virtual line is maximum within the range where the first end wiring portion exists in the direction perpendicular to the main surface. The inductor component according to <1> or <2>.

[0146] <4> The element body has a first embedded electrode connected to the first end of the inductor wiring and directly contacting the first coated electrode. The first embedded electrode has an end face electrode portion exposed to the outside of the element body at the first end face and covered by the first coated electrode. The inductor component according to any one of <1> to <3>.

[0147] <5> The electrical resistance value at the geometric center of the first end face among the end face electrode portions is larger than the electrical resistance value at the location where the thickness of the first coated electrode is maximum. The inductor component according to <4>.

[0148] <6> The end face electrode portion is a sintered body composed of metal and glass. Among the end face electrode portions, the density of the metal at the geometric center of the first end face is coarser than the density of the metal at the location where the thickness of the first coated electrode is maximum on the second virtual line. The inductor component according to <5>.

[0149] <7> The end face electrode part is a sintered body, Among the end face electrode parts, the composition of the sintered body at the geometric center of the first end face is different from the composition of the sintered body at the position where the thickness of the first coating electrode is maximum on the second virtual line. The inductor component according to <5>.

[0150] <8> The thickness of the first coating electrode is zero at the geometric center of the first end face. The inductor component according to any one of <1> to <7>.

[0151] <9> Using an insulating paste and a conductive paste containing metal powder, a pattern of the conductive paste extending spirally inside the insulating paste, a first conductive part of the conductive paste connected to the first end of the pattern and exposed from the insulating paste, and a second conductive part of the conductive paste connected to the second end of the pattern and exposed from the insulating paste, a laminate forming step of forming a rectangular parallelepiped laminate having; A firing step of firing the laminate to form a base body having a first embedded electrode in which the first conductive part is sintered and a second embedded electrode in which the second conductive part is sintered; A plating step of plating the surfaces of the first embedded electrode and the second embedded electrode exposed on the surface of the base body to form a first coating electrode covering the surface of the first embedded electrode and a second coating electrode covering the surface of the second embedded electrode; Comprising, Among the six outer surfaces of the base body, when one surface is used as the bottom surface, one surface perpendicular to the bottom surface is used as the main surface, and the surfaces perpendicular to both the bottom surface and the main surface are used as the first end face and the second end face, The first embedded electrode and the second embedded electrode are exposed to the outside of the base body on the bottom surface, The first embedded electrode has an end face electrode part exposed to the outside of the base body on the first end face, In the plating step, Cover the geometric center of the first end face with an insulating cover, and Of the end face electrode portions, on a virtual line passing through the geometric center of the first end face and perpendicular to the main surface, the portion on the main surface side with respect to the geometric center is exposed from the cover and plated. Method for manufacturing an inductor component.

Explanation of reference numerals

[0152] 10, 110, 210, 310, 410, 510, 610, 710, 810, 910... Inductor components 11... Element body 20... Insulating portion 30... Inductor wiring 31... First wiring portion 32, 34, 36, 38... Via 33... Second wiring portion 35... Third wiring portion 37... Fourth wiring portion 39... Fifth wiring portion 40... First embedded electrode 40A... First bottom face electrode portion 40B... First end face electrode portion 50... Second embedded electrode 50A... Second bottom face electrode portion 50B... Second end face electrode portion 61... First coating layer 62... Second coating layer 71... First coated electrode 72... Second coated electrode

Claims

1. A rectangular parallelepiped-shaped base body having six outer surfaces, an inductor wiring extending inside the base body, a first covering electrode covering a bottom surface which is one of the outer surfaces and being electrically connected to a first end of the inductor wiring, a second covering electrode covering the bottom surface and being electrically connected to a second end of the inductor wiring, comprising: Among the six outer surfaces of the base body, when one surface perpendicular to the bottom surface is defined as a main surface and surfaces perpendicular to both the bottom surface and the main surface are defined as a first end surface and a second end surface, the first covering electrode and the second covering electrode cover a part on a first virtual line passing through the geometric center of the bottom surface and perpendicular to the first end surface, the first covering electrode covers the first end surface and the second covering electrode covers the second end surface, when a distance from the first end surface to a surface of the first covering electrode in a direction perpendicular to the first end surface is defined as a thickness of the first covering electrode, at a position on a second virtual line passing through the geometric center of the first end surface and perpendicular to the main surface, a position where the thickness of the first covering electrode is maximum is shifted toward the main surface side from the geometric center of the first end surface, the base body has a first embedded electrode connected to the first end of the inductor wiring and directly contacting the first covering electrode, the first embedded electrode has an end surface electrode portion exposed to the outside of the base body at the first end surface and covered by the first covering electrode, an electrical resistance value at the geometric center of the first end surface among the end surface electrode portions is larger than an electrical resistance value at a position where the thickness of the first covering electrode is maximum. An inductor component.

2. The end surface electrode portion is a sintered body composed of a metal and glass, among the end surface electrode portions, a density of the metal at the geometric center of the first end surface is coarser than a density of the metal at a position on the second virtual line where the thickness of the first covering electrode is maximum. The inductor component according to Claim 1.

3. The end surface electrode portion is a sintered body, among the end surface electrode portions, a composition of the sintered body at the geometric center of the first end surface is different from a composition of the sintered body at a position on the second virtual line where the thickness of the first covering electrode is maximum. The inductor component according to Claim 1.

4. Using an insulating paste having insulating properties and a conductive paste containing metal powder, a pattern of the conductive paste extending spirally inside the insulating paste, a first conductive portion of the conductive paste connected to a first end of the pattern and exposed from the insulating paste, and a second conductive portion of the conductive paste connected to a second end of the pattern and exposed from the insulating paste, a laminate forming step of forming a rectangular parallelepiped laminate having the above; A firing step of firing the laminate to form a body having a first embedded electrode in which the first conductive portion is sintered and a second embedded electrode in which the second conductive portion is sintered; A plating step of plating the surfaces of the first embedded electrode and the second embedded electrode exposed on the surface of the body to form a first covering electrode covering the surface of the first embedded electrode and a second covering electrode covering the surface of the second embedded electrode; Comprising; Among the six outer surfaces of the body, when one surface is used as the bottom surface, one surface perpendicular to the bottom surface is used as the main surface, and the surfaces perpendicular to both the bottom surface and the main surface are used as the first end surface and the second end surface, The first embedded electrode and the second embedded electrode are exposed to the outside of the body on the bottom surface; The first embedded electrode has an end face electrode portion exposed to the outside of the body at the first end face; In the plating step, Covering the geometric center of the first end face with an insulating cover, and Among the end face electrode portions, plating by exposing a portion on the main surface side with respect to the geometric center on a virtual line passing through the geometric center of the first end face and perpendicular to the main surface from the cover; A method for manufacturing an inductor component.

Images