Two-component (2K) curable adhesive composition

Abstract

The present invention is directed to a curable, peelable two-part (2K) adhesive composition comprising: i) a first component comprising: a) an epoxy resin; b) an electrolyte; and c) optionally a solubilizing agent; and ii) a second component comprising: a) a curing agent consisting of at least one compound having at least two epoxide-reactive groups per molecule; and b) an accelerator; wherein the composition further comprises an electrically non-conductive filler and, optionally, a toughening agent.

Description

Technical Field

[0001] The present invention is directed to an adhesive composition that can be peeled from a specific substrate coated with the adhesive composition. More particularly, the present invention relates to a curable and peelable two-component (2K) adhesive composition.

Background Art

[0002] Adhesive bonding and polymer coating are generally used in the assembly and finishing of manufactured products. These are used as an alternative to mechanical fasteners such as screws, bolts, and rivets, reducing machining costs and providing a more adaptable bond in the manufacturing process. Bonding with adhesives distributes stress evenly, reduces the possibility of fatigue, and shields the joint from corrosive species.

[0003] While adhesives thus offer many advantages over mechanical fasteners, when practically required, it tends to be difficult to disassemble articles joined by adhesion. Removal of adhesives by mechanical processes such as sandblasting or wire brushing is often excluded because, among other things, the adhesive is disposed between the substrates and thus cannot be accessed or polished without damaging the substrate surface. Decomposition by application of chemicals and / or high temperatures, as disclosed in U.S. Patent No. 4,171,240 (Wong) and U.S. Patent No. 4,729,797 (Linde et al.), may be effective but is time-consuming and can be complex to implement. Moreover, the required aggressive chemicals and harsh conditions can damage the substrates being separated and render them unsuitable for subsequent applications.

[0004] With such problems in mind, certain authors have attempted to develop a peelable adhesive composition in which a cured composition acts to break the adhesion at the interface between the adhesive and the substrate when an electric current is passed through.

[0005] U.S. Patent No. 7,465,492 (Gilbert) describes a peelable composition comprising a matrix functionality including a monomer selected from the group consisting of acrylic, methacrylic, and combinations thereof; a free radical initiator; and an electrolyte, wherein the electrolyte imparts sufficient ionic conductivity to the composition to assist a Faraday reaction in a bond formed between the composition and a conductive surface, thereby enabling the composition to be peeled from the surface.

[0006] U.S. Patent Application Publication 2007 / 0269659 (Gilbert) describes an adhesive composition peelable at two interfaces, comprising (i) a polymer and an electrolyte; (ii) facilitating the joining of two surfaces; and (iii) peeling from both the anode interface and the cathode interface in response to a voltage applied across both surfaces so as to form an anode interface and a cathode interface.

[0007] U.S. Patent Application Publication 2008 / 0196828 (Gilbert) describes a hot melt adhesive composition comprising a thermoplastic component; and an electrolyte, wherein the electrolyte provides sufficient ionic conductivity to the composition to enable a Faraday reaction in a bond formed between the composition and a conductive surface, thereby enabling the composition to be peeled from the surface.

[0008] International Application Publication 2017 / 133864 (Henkel AG & Co. KGaA) is a method for reversibly joining a first and a second substrate, wherein at least the first substrate is an electrically non-conductive substrate, comprising: a) coating the surface of the electrically non-conductive substrate with a conductive ink; b) applying an electrically peelable hot melt adhesive composition to the surface of the first substrate and / or the second substrate coated with the conductive ink; c) bringing the first substrate into contact with the second substrate such that the electrically peelable hot melt adhesive composition is interposed between the two substrates; d) forming an adhesive bond between the two substrates to provide a joined substrate; and e) applying a voltage to the adhesive substrate, thereby substantially weakening the adhesion at one interface between the electrically peelable hot melt adhesive composition and the substrate surface.

Prior Art Documents

Patent Documents

[0009]

Patent Document 1

Patent Document 2

Patent Document 3

Patent Document 4

Patent Document 5

Patent Document 6

Summary of the Invention

Problems to be Solved by the Invention

[0010] There is still a technical need to provide an adhesive composition that can be easily applied to the surface of a substrate to be bonded and can provide an effective bond within a composite structure including the substrate upon curing, but can be effectively peeled from those substrates by easily applying a potential to the cured adhesive.

Means for Solving the Problems

[0011] According to a first aspect of the present invention, a) an epoxy resin; b) an electrolyte; c) optionally, a solubilizer; a first component comprising, and a) a curing agent comprising at least one compound having at least two epoxide-reactive groups per molecule; and b) an accelerator; a second component comprising A curable and peelable two-component (2K) adhesive composition is provided, which contains The composition further includes an electrically non-conductive filler and optionally a reinforcing agent.

[0012] In an important embodiment of the present invention, the two-component (2K) adhesive composition, based on the weight of the composition, · 30 to 70 wt%, preferably 35 to 60 wt% of the epoxy resin; · 2 to 25 wt%, preferably 5 to 20 wt% of the electrolyte; · 0 to 15 wt%, preferably 1.5 to 10 wt% of the solubilizer; · 0.1 to 15 wt%, preferably 1 to 15 wt% of the accelerator; · 1 to 50 wt%, preferably 2 to 25 wt% of the electrically non-conductive filler; and · 0 to 10 wt%, preferably 0.1 to 5 wt% of the electrically conductive filler is included.

[0013] In the first component of the adhesive composition, the electrolyte is 1-ethyl-3-methylimidazolium methanesulfonate, 1-ethyl-3-methylimidazolium methylsulfate, 1-hexyl-3-methylimidazolium 2-(2-fluoroanilino)-pyridinate, 1-hexyl-3-methylimidazolium imide, 1-butyl-1-methylpyrrolidinium 2-(2-fluoroanilino)-pyridinate, 1-butyl-1-methyl-pyrrolidinium imide, trihexyl(tetradecyl)phosphonium 2-(2-fluoroanilino)-pyridinate, cyclohexyltrimethylammonium bis(trifluoromethylsulfonyl)imide, di(2-hydroxyethyl)ammonium trifluoroacetate, N,N-dimethyl(2-hydroxyethyl)ammonium octanoate, methyltrioctylammonium bis(trifluoromethylsulfonyl)imide, N-ethyl-N-N-N-N-tetramethylguanidinium trifluoromethanesulfonate, guanidinium trifluoromethanesulfonate, 1-butyl-4-methylpyridinium bromide, 1-butyl-3-methylpyridinium tetrafluoroborate, 1-butyl-3-hydroxymethylpyridinium ethylsulfate, 1-butyl-1-methylpyrrolidinium bis(trifluoromethylsulfonyl)imide, 1-butyl-methylpyrrolidinium tris(pentafluoroethyl)trifluorophosphate, 3-methylimidazolium ethylsulfate, 1-ethyl-3-methylimidazolium chloride, 1-ethyl-3-ethyl-methylimidazolium bromide, 1-butyl-3-methylimidazolium chloride, 1-hexyl-3-methylimidazolium chloride, 1-octyl-3-methylimidazolium chloride, 1-methyl-3-octylimidazolium chloride, 1-propyl-3-methylimidazolium iodide, 1-butyl-3-methylimidazolium tetrafluoroborate, 1-butyl-3-methylimidazolium trifluoromethanesulfonate, 1-butyl-3-methylimidazolium hexafluorophosphate, 1-butyl-2,3-dimethylimidazolium tetrafluoroborate, 1-butyl-2,It is preferably selected from the group consisting of 3-dimethylimidazolium hexafluorophosphate, 1-butylimidazole, 1-methylimidazolium tetrafluoroborate, tetrabutylphosphonium tris(pentafluoroethyl) trifluorophosphate, trihexyl(tetradecyl)phosphonium tetrafluoroborate, and mixtures thereof. It is particularly preferable to use at least one of 1-ethyl-3-methylimidazolium methanesulfonate and 1-ethyl-3-methylimidazolium methyl sulfate.,

[0014] Apart from or in addition to the above-mentioned reference to the selection of the electrolyte in this first component, the composition preferably contains a solubilizing agent selected from polyphosphazene; polymethylene sulfide; polyoxyalkylene glycol; polyethyleneimine; silicone surfactant and fluorinated silicone surfactant; copolymer of functionalized polyalkylsisiloxane and epoxy resin; polyhydric alcohol; and sugar.

[0015] In the second component of the composition, the curing agent contains at least one polyamine having at least two amine hydrogens reacting with epoxy groups, and the polyamine further contains primary amine groups and / or secondary amine groups, and preferably has an equivalent weight of 150 g / eq or less per primary amine group or secondary amine group. In this regard, the use of an ether group-containing aliphatic primary polyamine can be said to be particularly preferable.

[0016] Apart from or in addition to the above-mentioned reference to the selection of the curing agent in the second component of the composition, it is preferable that the accelerator is selected from the group consisting of tertiary amines, quaternary ammonium salts, amidines, guanidines, and mixtures thereof. It is noted that it is particularly preferable to employ at least one accelerator selected from imidazole, methylimidazole, benzyldimethylamine, 1,8-diazabicyclo[5.4.0]undec-7-ene, and 1,4-diazabicyclo(2,2,2)octane.

[0017] According to a second aspect of the present invention, · a first material layer having a conductive surface; and · a second material layer having a conductive surface are included, and an adhesive structure is provided in which a cured and peelable two-component (2K) adhesive composition defined herein and in the appended claims is disposed between the first material layer and the second material layer.

[0018] According to a third aspect of the present invention, a method of peeling the adhesive structure defined herein and in the appended claims, comprising: i) applying a voltage across both surfaces to form an anode interface and a cathode interface; and ii) peeling the both surfaces is provided. Step i) of this method preferably a) has an applied voltage of 0.5 to 200 V; and b) a voltage applied for 1 second to 120 minutes, preferably 1 second to 60 minutes is characterized by at least one of them.

Brief Description of the Drawings

[0019]

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DETAILED DESCRIPTION OF THE INVENTION

[0020] <Definition> As used herein, the singular forms "a", "an", and "the" include plural reference terms unless the context clearly dictates otherwise.

[0021] As used herein, the term "comprising" (including "comprising", "comprises", and "comprised of") is synonymous with "including" (including "including", "includes", "containing", or "contains"), is inclusive or open-ended, and does not exclude additional, unrecited members, elements, or method steps.

[0022] As used herein, the term "consisting of" excludes elements, components, members, or method steps that are not specified.

[0023] When quantities, concentrations, dimensions, and other parameters are expressed in the form of ranges, preferred ranges, upper limit values, lower limit values, or preferred upper limit and limit values, any range obtained by combining any upper limit value or preferred value with any lower limit value or preferred value should be understood to be specifically disclosed, whether or not the resulting range is explicitly recited in the context.

[0024] Furthermore, in accordance with standard understanding, a weight range expressed as "0 to x" specifically includes 0 weight %. The component defined by the range may not be present in the composition or may be present in an amount up to x weight % in the composition.

[0025] The terms "preferred", "preferably", "desirable", and "especially" are frequently used herein to refer to embodiments of the present disclosure that may provide certain advantages under certain circumstances. However, the description of one or more preferred, preferable, desirable, or specific embodiments does not mean that other embodiments are not useful, nor is it intended to exclude those other embodiments from the scope of the present disclosure.

[0026] In this application, the word "may" is used in a permissive sense (i.e., meaning there is a possibility), not an obligatory sense.

[0027] As used herein, room temperature is 23 °C plus or minus 2 °C. As used herein, "ambient conditions" means the surrounding temperature and pressure where the composition is placed, or where the coating layer or the substrate of said coating layer is placed.

[0028] In the context of the present invention, a "two-component (2K) composition" is understood to be a composition in which the first component (A) and the second component (B) must be stored in separate containers due to their (high) reactivity. The two components are mixed only immediately before application and then react, typically without additional activation, to form bonds, thereby forming a polymer network. Here, a higher temperature may be applied to accelerate the cross-linking reaction.

[0029] As used herein, the term "removable" means that after the adhesive has cured, applying a voltage of 10 V to 75 V for 1 second to 60 minutes reduces the adhesive strength by at least 50%. The curable adhesive is applied between two substrates adhered by said adhesive such that current can flow through the adhesive bond line. The adhesive strength is measured by a tensile lap shear (TLS) test in accordance with EN1465:2009 (German version) for the measurement of the tensile lap shear strength of adhesive-bonded assemblies, which is carried out at room temperature. The overlap of the adhesive is 25 mm × 10 mm and the thickness of the adhesive is about 150 μm.

[0030] As used herein, the term "monomer" means a substance that can undergo a polymerization reaction to contribute a structural unit to the chemical structure of a polymer. As used herein, the term "monofunctional" means having one polymerizable site. The term "polyfunctional" as used herein means having two or more polymerizable sites.

[0031] As used herein, the term "equivalent (eq.)" relates to the relative number of reactive groups present during a reaction, as is normal in chemical notation.

[0032] The term "electrolyte" is used herein in accordance with its standard meaning in the art as a substance containing free ions that can conduct electricity by the movement of charged charge carrier species. This term is intended to encompass molten electrolytes, liquid electrolytes, semi-solid electrolytes, and solid electrolytes in which at least one of the cationic or anionic components of the electrolyte structure is essentially free to move and thus acts as a charge carrier.

[0033] The curable adhesive composition of the present invention and the cured adhesive obtained therefrom have "electrolyte functionality" in that the adhesive material enables the conduction of ions, anions, cations, or both. The electrolyte functionality is understood to be derived from the ability of the composition and the cured adhesive to solvate at least one polar ion.

[0034] As used herein, "(meth)acrylic" is an abbreviation referring to "acrylic" and / or "methacrylic". Thus, the term "(meth)acrylamide" refers collectively to acrylamide and methacrylamide.

[0035] As used herein, "C 1- C nThe term "alkyl" refers to a monovalent group containing 1 to n carbon atoms, which is a group of alkanes and includes linear and branched organic groups. Thus, "C 1- C 30 alkyl" refers to a monovalent group containing 1 to 30 carbon atoms, which is a group of alkanes and includes linear and branched organic groups. Examples of alkyl groups include, but are not limited to, methyl; ethyl; propyl; isopropyl; n-butyl; isobutyl; sec-butyl; tert-butyl; n-pentyl; n-hexyl; n-heptyl; and 2-ethylhexyl. In the present invention, such an alkyl group may be unsubstituted or substituted with one or more substituents such as halo, nitro, cyano, amide, amino, sulfonyl, sulfinyl, sulfanyl, sulfoxy, urea, thiourea, sulfamoyl, sulfamide and hydroxy. When applicable, the selection for a given substituent is described herein. However, generally, attention should be paid to the selection for an alkyl group containing 1 to 18 carbon atoms (C 1- C 18 alkyl)-for example, an alkyl group containing 1 to 12 carbon atoms (C 1- C 12 alkyl) or an alkyl group containing 1 to 6 carbon atoms (C 1- C6 alkyl)-.

[0036] The term "C 1- C 18 hydroxyalkyl" used herein refers to an HO-(alkyl) group having 1 to 18 carbon atoms, the bonding point of the substituent is through an oxygen atom, and the alkyl group is as defined above.

[0037] "alkoxy group" refers to a monovalent group represented by -OA where A is an alkyl group, and non-limiting examples thereof are a methoxy group, an ethoxy group, and an isopropyloxy group. The term "C 1- C 18"Alkoxyalkyl" has an alkoxy substituent as defined above and refers to a (alkyl-O-alkyl)alkyl group containing a total of 1 to 18 carbon atoms. Such groups include methoxymethyl (-CH2OCH3), 2-methoxyethyl (-CH2CH2OCH3), 2-ethoxyethyl, and the like.

[0038] As used herein, the term "C" 2- "C4 alkylene" is defined as a saturated divalent hydrocarbon group having 2 to 4 carbon atoms.

[0039] The term "C" 3- C 30 "Cycloalkyl" is understood to mean an optionally substituted, saturated hydrocarbon group, monocyclic hydrocarbon group, bicyclic hydrocarbon group or tricyclic hydrocarbon group having 3 to 30 carbon atoms. Generally, a cycloalkyl group (C 3- C 18 cycloalkyl group) containing 3 to 18 carbon atoms is preferably selected. Examples of cycloalkyl groups include cyclopropyl; cyclobutyl; cyclopentyl; cyclohexyl; cycloheptyl; cyclooctyl; adamantane; and norbornane.

[0040] As used herein, the "C" 6- C 18 "aryl" group, used alone or as part of a larger moiety such as an "aralkyl group", means an optionally substituted monocyclic ring system, bicyclic ring system or tricyclic ring system in which the monocyclic ring system is aromatic or at least one of the rings of the bicyclic or tricyclic ring system is aromatic. The bicyclic and tricyclic ring systems include 2- to 3-membered carbocyclic rings fused to benzene. Exemplary aryl groups include phenyl; (C 1- C4)alkylphenyl such as tolyl and ethylphenyl; indenyl; naphthalenyl, tetrahydronaphthyl, tetrahydroindenyl; tetrahydroanthracenyl; and anthracenyl. The selection of a phenyl group may be noted.

[0041] As used herein, "C" 2- C 20 "alkenyl" means a hydrocarbyl group having 2 to 20 carbon atoms and at least one unit of ethylenic unsaturation. The alkenyl group can be straight-chain, branched, or cyclic and can be optionally substituted. The term "alkenyl" also includes, as understood by those skilled in the art, groups having "cis" and "trans" configurations, or alternatively, "E" and "Z" configurations. However, generally, preference is given to the selection of unsubstituted alkenyl groups containing 2 to 10 (C 2-10 ) or 2 to 8 (C 2-8 ) carbon atoms. The C 2- C 12 Examples of alkenyl groups include, but are not limited to, -CH=CH2; -CH=CHCH3; -CH2CH=CH2; -C(=CH2)(CH3); -CH=CHCH2CH3; -CH2CH=CHCH3; -CH2CH2CH=CH2; -CH=C(CH3)2; -CH2C(=CH2)(CH3); -C(=CH2)CH2CH3; -C(CH3)=CHCH3; -C(CH3)CH=CH2; -CH=CHCH2CH2CH3; -CH2CH=CHCH2CH3; -CH2CH2CH=CHCH3; -CH2CH2CH2CH=CH2; -C(=CH2)CH2CH2CH3; -C(CH3)=CHCH2CH3; -CH(CH3)CH=CHCH; -CH(CH3)CH2CH=CH2; -CH2CH=C(CH3)2; 1-cyclopent-1-enyl; 1-cyclopent-2-enyl; 1-cyclopent-3-enyl; 1-cyclohex-1-enyl; 1-cyclohex-2-enyl; and 1-cyclohex-3-enyl.

[0042] As used herein, "alkylaryl" means an alkyl-substituted aryl group, and "substituted alkylaryl" means an alkylaryl group further having one or more substituents as defined above. Further, "aralkyl" as used herein means an alkyl group substituted with an aryl group as defined above.

[0043] As used herein, the term "hetero" refers to a group or moiety containing one or more heteroatoms such as N, O, Si, and S. Thus, for example, "heterocyclic" refers to a cyclic group having, for example, N, O, Si, or S as part of the ring structure. "Heteroalkyl", "heterocycloalkyl", and "heteroaryl" moieties mean alkyl groups, cycloalkyl groups, and aryl groups as defined herein, each containing N, O, Si, or S as part of their structure, respectively.

[0044] As used herein, the term "epoxide" refers to a compound characterized by the presence of at least one cyclic ether group, i.e., a group in which an ether oxygen atom is bonded to two adjacent carbon atoms, thereby forming a cyclic structure. This term is intended to encompass monoepoxide compounds, polyepoxide compounds (having two or more epoxy groups), and epoxy-terminated prepolymers. The term "monoepoxide compound" is intended to denote an epoxide compound having one epoxy group. The term "polyepoxide compound" means an epoxide compound having at least two epoxy groups. The term "diepoxide compound" means an epoxide compound having two epoxy groups.

[0045] Epoxides may be unsubstituted or may be inertly substituted. Exemplary inert substituents include chlorine, bromine, fluorine, and phenyl.

[0046] As used herein, "primary amino group" refers to an NH2 group bonded to an organic group, and "secondary amino group" refers to an NH group bonded to two organic groups, which may also be part of a ring together. Thus, the term "tertiary amine" refers to a nitrogen having a site where the nitrogen atom is not bonded to a hydrogen atom. As used herein, the term "amine hydrogen" refers to the hydrogen atoms of primary and secondary amino groups.

[0047] As used herein, the term "equivalent weight" means the molecular weight divided by the number of said functions. Therefore, "epoxy equivalent weight" (EEW) represents the weight of the resin containing 1 equivalent of epoxy in grams.

[0048] "Amine equivalent weight" is a calculated value (g / eq.) determined from the amine value. The amine value is determined by titrating amine acetate ions with a dilute, typically 1N hydrochloric acid solution. In the case of a pure substance, the amine value can be calculated using the molecular weight of the pure compound and KOH (56.1 g / mol).

[0049] As used herein, the term "Lewis acid" refers to a molecule or ion - often called an electrophile - that can bond to another molecule or ion by forming a covalent bond with two electrons from a second molecule or ion. Thus, a Lewis acid is an electron acceptor.

[0050] The molecular weights referred to herein can be measured by gel permeation chromatography (GPC) using polystyrene calibration standards in accordance with ASTM 3536.

[0051] Unless otherwise specified, the viscosities of the compositions described herein were measured using an Anton Paar viscometer, model MCR301, under standard conditions of 25°C and 50% relative humidity (RH). The viscometer is calibrated once a year and inspected by service. The calibration is performed using specific oils of known viscosities that vary from 5,000 cps to 50,000 cps (parallel plate PP25, 23°C, shear rate 1 (1 / s)). The measurements of the compositions according to the invention are performed using parallel plate PP20 at different shear rates from 1.5 (1 / s) to 100 (1 / s).

[0052] <Detailed Description of the Invention> <First Component of the Two - Component (2K) Composition> The first component of the two - component (2K) composition comprises an epoxy resin; and an electrolyte; a solubilizer; and a filler.

[0053] <Epoxy resin> The first component of the composition includes an epoxy resin that is typically present in an amount of 30 to 70% by weight based on the weight of the composition. The epoxy resin preferably constitutes 35 to 60% by weight of the composition, such as 40 to 60% by weight or 47 to 57% by weight.

[0054] If the amount of the epoxy resin is more than 70%, it may be disadvantageous to the lap shear strength and the peeling effect. On the other hand, if it is mainly less than 30%, the adhesiveness may decrease. Therefore, the above amount of the epoxy resin is preferred.

[0055] The epoxy resin used herein may include monofunctional epoxy resins, polyfunctional (multi, or poly) epoxy resins, and combinations thereof. The epoxy resin may be a pure compound, but may also be a mixture of epoxy-functional compounds, including a mixture of compounds having different numbers of epoxy groups per molecule. The epoxy resin may be saturated or unsaturated, aliphatic, alicyclic, aromatic or heterocyclic, and may be substituted. Further, the epoxy resin may be a monomer or a polymer.

[0056] While not intended to limit the present invention, exemplary monoepoxide compounds include the following. Alkylene oxides; epoxy-substituted alicyclic hydrocarbons such as cyclohexene oxide, vinylcyclohexene monooxide, (+)-cis-limonene oxide, (+)-cis,trans-limonene oxide, (-)-cis,trans-limonene oxide, cyclooctene oxide, cyclododecene oxide and α-pinene oxide; epoxy-substituted aromatic hydrocarbons; monoepoxy-substituted alkyl ethers of monohydric alcohols or phenols such as glycidyl ethers of aliphatic, alicyclic and aromatic alcohols; monoepoxy-substituted alkyl esters of monocarboxylic acids such as glycidyl esters of aliphatic, alicyclic and aromatic monocarboxylic acids; monoepoxy-substituted alkyl esters of polycarboxylic acids in which other carboxy groups are esterified with alkanols; alkyl and alkenyl esters of epoxy-substituted monocarboxylic acids; epoxyalkyl ethers of polyhydric alcohols in which other OH groups are esterified or etherified with carboxylic acids or alcohols; and monoesters of polyhydric alcohols and epoxy monocarboxylic acids in which other OH groups are esterified or etherified with carboxylic acids or alcohols.

[0057] By way of example, the following glycidyl ethers may be mentioned as monoepoxide compounds particularly suitable for use herein. Methyl glycidyl ether; ethyl glycidyl ether; propyl glycidyl ether; butyl glycidyl ether; pentyl glycidyl ether; hexyl glycidyl ether; cyclohexyl glycidyl ether; octyl glycidyl ether; 2-ethylhexyl glycidyl ether; aryl glycidyl ether; benzyl glycidyl ether; phenyl glycidyl ether; 4-tert-butylphenyl glycidyl ether; 1-naphthyl glycidyl ether; 2-naphthyl glycidyl ether; 2-chlorophenyl glycidyl ether; 4-chlorophenyl glycidyl ether; 4-bromophenyl glycidyl ether; 2,4,6-trichlorophenyl glycidyl ether; 2,4,6-tribromophenyl glycidyl ether; pentafluorophenyl glycidyl ether; o-cresyl glycidyl ether; m-cresyl glycidyl ether; and p-cresyl glycidyl ether.

[0058] In one embodiment, the monoepoxide compound has the following formula (I): TIFF0007709974000001.tif26160[wherein R w , R x , R y and R z may be the same or different and are independently hydrogen, a halogen atom, a C 1- -C8 alkyl group, a C 3- -C 10 cycloalkyl group, a C 2- -C 12 alkenyl group, a C 6- -C 18 aryl group or a C 7- -C 18 aralkyl group, provided that at least one of R y and R z is not hydrogen] in accordance with.

[0059] R w , R x and Ry is hydrogen, and R z is preferably a phenyl group or a C 1- C8 alkyl group, more preferably a C 1- C4 alkyl group.

[0060] Regarding this embodiment, exemplary monoepoxides include: ethylene oxide; 1,2-propylene oxide (propylene oxide); 1,2-butylene oxide; cis-2,3-epoxybutane; trans-2,3-epoxybutane; 1,2-epoxypentane; 1,2-epoxyhexane; 1,2-heptylene oxide; decene oxide; butadiene oxide; isoprene oxide; and styrene oxide.

[0061] In the present invention, it is mentioned that at least one monoepoxide compound selected from the group consisting of ethylene oxide; propylene oxide; cyclohexene oxide; (+)-cis-limonene oxide; (+)-cis,trans-limonene oxide; (-)-cis,trans-limonene oxide; cyclooctene oxide; and cyclododecene oxide is used.

[0062] Here too, although there is no intention to limit the present invention, suitable polyepoxide compounds may be liquids, solids, or solutions in solvents. Further, such polyepoxide compounds should have an epoxy equivalent of 100 to 700 g / eq, for example 120 to 320 g / eq. Further, generally, diepoxide compounds having an epoxy equivalent of less than 500 g / eq, and further less than 400 g / eq are preferred. This is mainly from the perspective of cost because in their production, low molecular weight epoxy resins require more limited treatment in purification.

[0063] Examples of types or groups of polyepoxide compounds that can be polymerized in the present invention include: glycidyl ethers of polyhydric alcohols and polyhydric phenols; glycidyl esters of polycarboxylic acids; and epoxidized polyethylene unsaturated hydrocarbons, esters, ethers, and amides.

[0064] Suitable diglycidyl ether compounds may be essentially aromatic, aliphatic or alicyclic and are derivable as such from dihydric phenols and dihydric alcohols. And useful classes of such diglycidyl ethers are the diglycidyl ethers of aliphatic and alicyclic diols such as 1,2-ethanediol, 1,4-butanediol, 1,6-hexanediol, 1,8-octanediol, 1,12-dodecanediol, cyclopentanediol and cyclohexanediol; bisphenol A-based diglycidyl ethers; bisphenol F diglycidyl ethers; diglycidyl o-phthalate, diglycidyl isophthalate and diglycidyl terephthalate; polyalkylene glycol-based diglycidyl ethers, especially polypropylene glycol diglycidyl ether; and polycarbonate diol-based glycidyl ethers. Other suitable diepoxides that may be mentioned are diepoxides of double unsaturated fatty acid C 1- C 18 alkyl esters; butadiene diepoxide; polybutadiene diglycidyl ether; vinylcyclohexene diepoxide; and limonene diepoxide.

[0065] Further exemplary polyepoxide compounds include, but are not limited to, glycerol polyglycidyl ether; trimethylolpropane polyglycidyl ether; pentaerythritol polyglycidyl ether; diglycerol polyglycidyl ether; polyglycerol polyglycidyl ether; and sorbitol polyglycidyl ether.

[0066] And examples of very preferred polyepoxide compounds include the following. DER TM 331, DER TM 330 and DER TM 383 and other bisphenol A epoxy resins; DER TM 354 and other bisphenol F epoxy resins; DER TMBisphenol A / F epoxy resin blends such as 353; DER TM Aliphatic glycidyl ethers such as 736; DER TM Polypropylene glycol diglycidyl ethers such as 732; DER TM 661 and DER TM Solid bisphenol A epoxy resins such as 664UE; DER TM Solutions of bisphenol A solid epoxy resins such as 671-X75; DEN TM Epoxy novolac resins such as 438; DER TM Brominated epoxy resins such as 542; ERISYS TM Castor oil triglycidyl ethers such as GE-35H; ERISYS TM Polyglycerol-3-polyglycidyl ethers such as GE-38; and ERISYS TM Sorbitol glycidyl ethers such as GE-60.

[0067] Separately from the above, the first component of the composition may, in certain embodiments, be of the formula: TIFF0007709974000002.tif1466 [wherein, each R is independently selected from methyl or ethyl; and, n is from 1 to 10] and may include glycidoxyalkylalkoxysilanes having

[0068] Exemplary silanes include, but are not limited to, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxyethyltrimethoxysilane, γ-glycidoxymethyltrimethoxysilane, γ-glycidoxymethyltriethoxysilane, γ-glycidoxyethyltriethoxysilane, γ-glycidoxypropyltriethoxysilane; and 8-glycidoxyoctyltrimethoxysilane. When present, the epoxide-functional silane preferably constitutes less than 20 wt%, preferably less than 10 wt% or less than 5 wt% based on the total weight of the epoxide compound.

[0069] The present invention also does not prevent the first component of the curable composition from further comprising one or more cyclic monomers selected from the group consisting of oxetane; cyclic carbonate; cyclic anhydride; and lactone. The disclosures of the following cited documents may be beneficial in disclosing suitable cyclic carbonate functional compounds. U.S. Patent No. 3,535,342; U.S. Patent No. 4,835,289; U.S. Patent No. 4,892,954; British Patent Application Publication No. 1,485,925; and European Patent Application Publication No. 0 119 840. However, such cyclic comonomers preferably constitute less than 20% by weight, more preferably less than 10% by weight or less than 5% by weight, based on the total weight of the epoxide compound.

[0070] <Electrolyte> The first component of the composition contains 2 to 25% by weight of an electrolyte, based on the weight of the composition. The electrolyte may preferably constitute 4 to 23% by weight, for example 5 to 20% by weight, of the composition.

[0071] Although amounts exceeding 25% may result in a good peeling effect, they may cause incomplete curing and adversely affect the initial adhesion properties. On the other hand, small amounts, mainly less than 2%, may lead to a lack of peeling effect. Therefore, the above amounts of the electrolyte are preferred.

[0072] The electrolyte is preferably JPEG0007709974000003.jpg138168[wherein R 1 , R 2 , R 3 , R 4 , R 5 and R 6 are independently hydrogen, C 1- C 18 alkyl, C 3- C 18 cycloalkyl, C 6- C 18 aryl, C 7- C 24 aralkyl, C 2- C 20 alkenyl, -C(O)R q, selected from -C(O)OH, -CN and -NO2, R q is C 1- C6 alkyl] comprises at least one salt having a formula selected from the group consisting of

[0073] To complete, C 1- C 18 alkyl, C 3- C 18 cycloalkyl, C 6- C 18 aryl, C 7- C 24 aralkyl, C 2- C 20 The term alkenyl explicitly includes a group in which one or more hydrogen atoms are replaced by a halogen atom (e.g., C 1- C 18 haloalkyl) or a group replaced by a hydroxyl group (e.g., C 1- C 18 hydroxyalkyl). In particular, R 1 , R 2 , R 3 , R 4 , R 5 and R 6 are independently preferably selected from hydrogen, C 1- C 12 alkyl, C 1- C 12 haloalkyl, C 1- C 12 hydroxyalkyl and C 3- C 12 cycloalkyl. For example, R 1 , R 2 , R 3 , R 4 , R 5 and R 6 are independently preferably selected from hydrogen, C 1- C6 alkyl, C 1- C6 haloalkyl and C 1- C6 hydroxyalkyl.

[0074] The counteranion (X -There is no particular intention to limit (it). Exemplary anions can be selected from the following. · Halides; · The formula PF6 - 、CF3SO3 - 、(CF3SO3)2N - 、CF3CO2 - and CCl3CO2 - pseudohalides and halogen-containing compounds of; · CN - 、SCN - and OCN - ; · Phenates; · The general formula SO4 2- 、HSO4 - 、SO3 2- 、HSO3 - 、R a OSO3 - 、and R a SO3 - sulfates, sulfites, and sulfonates of; · The general formula PO4 3- 、HPO4 2- 、H2PO4 - 、R a PO4 2- 、HR a PO4 - and R a R b PO4 - phosphates of; · The general formula R a HPO3 - 、R a R b PO2 - and R a R b PO3 - phosphonates and phosphinates of; · The general formula PO3 3- 、HPO3 2- 、H2PO3 - 、R a PO3 2- 、R a HPO3 - and R a Rb PO3 - phosphite; · General formula R a R b PO2 - 、R a HPO2 - 、R a R b PO - 、and R a HPO - phosphonites and phosphinites; · General formula R a COO - carboxylate anion; · Hydroxycarboxylate anions and saccharate anions; · Saccharinate (salt of o-benzoic sulfimide); · General formula BO3 3- 、HBO3 2- 、H2BO3 - 、R a R b BO3 - 、R a HBO3 - 、R a BO3 2- 、B(OR a )(OR b )(OR C )(OR d ) - 、B(HSO4) - and B(R a SO4) - borates; · General formula R a BO2 2- and R a R b BO - boronates; · General formula HCO3 - 、CO3 2- and R a CO3 - carbonates and carbonic esters; · General formula SiO4 4- 、HSiO4 3- 、H2SiO4 2- 、H3SiO4- , R a SiO4 3- , R a R b SiO4 2- , R a R b R c SiO4 - , HR a SiO4 2- , H2R a SiO4 - and HR a R b SiO4 - silicates and silicic acid esters of; · General formula R a SiO3 3- , R a R b SiO2 2- , R a R b R c SiO - , R a R b R c SiO3 - , R a R b R c SiO2 - and R a R b SiO3 2- alkyl silanolates and aryl silanolates of; · Pyridinates and pyrimidinates; · General formula: Carboxylic acid imides, bis(sulfonyl)imides and sulfonylimides of TIFF0007709974000004.tif2993; · General formula Methides of TIFF0007709974000005.tif2826; · General formula R a O - alkoxides and aryloxides of; and, · General formula S 2- , HS - , [S v 2- , [HS v ​​- and [R a S] - sulfides, hydrogen sulfide, polysulfides, hydrogen polysulfides and thiolates [wherein the general formula v is a positive integer from 2 to 10. R a , R b , R c and R d are independently hydrogen, C 1- C 12 alkyl, C 5- C 12 cycloalkyl, C 5- C 12 heterocycloalkyl, C 6- C 18 aryl and C 5- C 18 heteroaryl.]

[0075] Based on the definitions in the above list, preferred anions are halides; pseudohalides and halogen-containing compounds as defined above; carboxylate anions, especially formate, acetate, propionate, butyrate and lactate; hydroxycarboxylate anions; pyridinates and pyrimidinates; carboxylic acid imides, bis(sulfonyl)imides and sulfonylimides; sulfates, especially methyl sulfate and ethyl sulfate; sulfites; sulfonates, especially methanesulfonate; and phosphates, especially dimethyl-phosphate, diethyl-phosphate and di-(2-ethylhexyl)-phosphate, selected from the group consisting of.

[0076] The electrolyte of the first component is preferably 1-ethyl-3-methylimidazolium methanesulfonate, 1-ethyl-3-methylimidazolium methyl sulfate, 1-hexyl-3-methylimidazolium 2-(2-fluoroanilino)-pyridinate, 1-hexyl-3-methylimidazolium imide, 1-butyl-1-methylpyrrolidinium 2-(2-fluoroanilino)-pyridinate, 1-butyl-1-methyl-pyrrolidinium imide, trihexyl(tetradecyl)phosphonium 2-(2-fluoroanilino)-pyridinate, cyclohexyltrimethylammonium bis(trifluoromethylsulfonyl)imide, di(2-hydroxyethyl)ammonium trifluoroacetate, N,N-dimethyl(2-hydroxyethyl)ammonium octanoate, methyltrioctylammonium bis(trifluoromethylsulfonyl)imide, N-ethyl-N-N-N-N-tetramethylguanidinium trifluoromethanesulfonate, guanidinium trifluoromethanesulfonate, 1-butyl-4-methylpyridinium bromide, 1-butyl-3-methylpyridinium tetrafluoroborate, 1-butyl-3-hydroxymethylpyridinium ethyl sulfate, 1-butyl-1-methylpyrrolidinium bis(trifluoromethylsulfonyl)imide, 1-butyl-methylpyrrolidinium tris(pentafluoroethyl)trifluorophosphate, 3-methylimidazolium ethyl sulfate, 1-ethyl-3-methylimidazolium chloride, 1-ethyl-3-ethyl-methylimidazolium bromide, 1-butyl-3-methylimidazolium chloride, 1-hexyl-3-methylimidazolium chloride, 1-octyl-3-methylimidazolium chloride, 1-methyl-3-octylimidazolium chloride, 1-propyl-3-methylimidazolium iodide, 1-butyl-3-methylimidazolium tetrafluoroborate, 1-butyl-3-methylimidazolium trifluoromethanesulfonate, 1-butyl-3-methylimidazolium hexafluorophosphate, 1-butyl-2,3-dimethylimidazolium tetrafluoroborate, 1-butyl-2,It is selected from the group consisting of 3-dimethylimidazolium hexafluorophosphate, 1-butylimidazole, 1-methylimidazolium tetrafluoroborate, tetrabutylphosphonium tris(pentafluoroethyl) trifluorophosphate, trihexyl(tetradecyl)phosphonium tetrafluoroborate, and mixtures thereof. It is particularly preferable to use at least one of 1-ethyl-3-methylimidazolium methanesulfonate and 1-ethyl-3-methylimidazolium methylsulfate.,

[0077] The above electrolyte is preferable because it provides good stability and good initial adhesion strength to the composition and a good peeling effect when subjected to potential treatment.

[0078] The first component of the two-component (2K) composition may contain a solubilizer typically present in an amount of 0.5 to 15% by weight, based on the weight of the composition. Preferably, the solubilizer constitutes 1.5 to 10% by weight, for example 3 to 10% by weight, of the composition. <Solubilizer>

[0079] When the amount of the solubilizer exceeds 15%, it may have an adverse effect on adhesion and curability. On the other hand, when the amount is mainly less than 0.5%, the composition becomes more viscous / solid and may thus inhibit the mixing of the components. Therefore, the amounts of these solubilizers are preferable.

[0080] The solubilizer has the function of promoting the miscibility of the electrolyte in the adhesive composition formed upon mixing its two components. The solubilizer may or may not form part of the polymer matrix formed upon curing of the adhesive composition, but it plays a role in promoting ion migration therein. The solubilizer is thus preferably a polar compound and desirably should be liquid at room temperature.

[0081] Suitable classes of solubilizers include polyphosphazenes; polymethylene sulfides; polyoxyalkylene glycols; polyethyleneimine; silicone surfactants and fluorinated silicone surfactants, such as fluorinated polysilanes, polyalkylsiloxanes and polyoxyalkylene-modified polydimethylsiloxanes; copolymers of functionalized polyalkylsiloxanes and epoxy resins, such as copolymers of polydimethylsiloxane (PDMS) and epoxy resins; polyhydric alcohols; and saccharides.

[0082] Ethylene glycol, 1,3-propanediol, cyclohexanediol, hydroquinone, catechol, resorcinol, phloroglucinol, pyrogallol, hydroxyhydroquinone, tris(hydroxymethyl)benzene, tris(hydroxymethyl)benzene with three methyl or ethyl substituents bonded to the remaining carbon atoms of benzene, isosorbide, isomannide, isoidide, glycerol, cyclohexane-1,2,4-triol, 1,3,5-cyclohexanetriol, pentane-1,2,3-triol, hexane-1,3,5-triol, erythritol, 1,2,4,5-tetrahydroxybenzene, threitol, arabitol, xylitol, ribitol, mannitol, sorbitol, inositol, fructose, glucose, mannose, lactose, 1,1,1-tris(hydroxymethyl)propane, 1,1,1-tris(hydroxymethyl)ethane, di(trimethylolpropane), trimethylolpropane ethoxylate, 2-hydroxymethyl-1,3-propanediol, pentaerythritol aryl ether and pentaerythritol and other polyhydric alcohols and saccharides.

[0083] Among the polyoxyalkylene glycols, the use of polyoxy(C 2- C3) alkylene glycols having a weight average molecular weight of 200 to 10,000 g / mol, for example 200 to 2,000 g / mol, may be particularly preferred.

[0084] <The second component of the two-component (2K) composition> The second component of the two-component composition necessarily contains a curing agent and an accelerator.

[0085] <Curing agent> The curing agent necessarily consists of at least one compound having at least two epoxide-reactive groups per molecule. The curing agent particularly includes: i) at least one polyamine having at least two amine hydrogens that react with an epoxy group; ii) at least one mercapto compound having at least two mercapto groups that react with an epoxy group; and iii) it may include one or more of at least one Mannich base.

[0086] At least one polyamine having at least two amine hydrogens that react with an epoxy group particularly includes a primary amine group and / or a secondary amine group, and desirably has an equivalent weight of 150 g / eq. or less, more preferably 125 g / eq. or less, per primary amine group or secondary amine group.

[0087] Suitable polyamines that can be used alone or in combination include, but are not limited to, the following. i) The following examples may be mentioned: aliphatic primary diamines, cycloaliphatic primary diamines or arylaliphatic primary diamines: 2,2-dimethyl-1,3-propanediamine; 1,3-pentanediamine (DAMP); 1,5-pentanediamine; 1,5-diamino-2-methylpentane (MPMD); 2-butyl-2-ethyl-1,5-pentanediamine (C11-neodiamine); 1,6-hexanediamine (hexamethylenediamine, HMDA); 2,5-dimethyl-1,6-hexanediamine; 2,2,4- and / or 2,4,4-trimethylhexamethylenediamine; 1,7-heptanediamine; 1,8-octanediamine; 1,9-nonanediamine; 1,10-decanediamine; 1,11-undecanediamine; 1,12-dodecanediamine; 1,2-, 1,3- and 1,4-diaminocyclohexane; bis(4-aminocyclohexyl)methane; bis(4-amino-3-methylcyclohexyl)methane; bis(4-amino-3-ethylcyclohexyl)methane; bis(4-amino-3,5-dimethylcyclohexyl)methane; bis(4-amino-3-ethyl-5-methylcyclohexyl)methane; 1-amino-3-aminomethyl-3,5,5-trimethylcyclohexane (isophoronediamine, IPDA); 2- and / or 4-methyl-1,3-diaminocyclohexane; 1,3-bis(aminomethyl)cyclohexane; 1,4-bis(aminomethyl)cyclohexane; 2,5(2,6)-bis(aminomethyl)bicyclo[2.2.1]heptane (norbornanediamine, NBDA); 3(4),8(9)-bis(aminomethyl)tricyclo[5.2.1.0(2,6)]-decane (TCD-diamine); 1,4-diamino-2,2,6-trimethylcyclohexane (TMCDA); 1,8-menthanediamine; 3,9-bis(3-aminopropyl)-2,4,8,10-tetraoxaspiro[5.5]undecane; and 1,3-bis(aminomethyl)benzene (MXDA). ii) Tertiary amine group-containing polyamines having two or three primary aliphatic amine groups, of which the following specific examples may be mentioned: N,N'-bis(aminopropyl)-piperazine; N,N-bis(3-aminopropyl)methylamine; N,N-bis(3-aminopropyl)ethylamine; N,N-bis(3-aminopropyl)propylamine; N,N-bis(3-aminopropyl)cyclohexylamine; N,N-bis(3-aminopropyl)-2-ethylhexylamine; tris(2-aminoethyl)amine; tris(2-aminopropyl)amine; tris(3-aminopropyl)amine; and products from double cyanoethylation of fatty amines derived from natural fatty acids and subsequent reduction, such as N,N-bis(3-aminopropyl)dodecylamine and N,N-bis(3-aminopropyl)tallow alkylamine, etc., commercially available as Triameen® Y12D and Triameen® YT (manufactured by Akzo Nobel). iii) Ether group-containing aliphatic primary polyamines, specific examples of which may be mentioned: bis(2-aminoethyl) ether; 3,6-dioxaoctane-1,8-diamine; 4,7-dioxadecane-1,10-diamine; 4,7-dioxadecane-2,9-diamine; 4,9-dioxadodecane-1,12-diamine; 5,8-dioxadodecane-3,10-diamine; 4,7,10-trioxatridecane-1,13-diamine and higher oligomers of these diamines; bis(3-aminopropyl) polytetrahydrofuran and other polytetrahydrofuran diamines; alicyclic ether group-containing diamines obtained from the propoxylation of 1,4-dimethylolcyclohexane and subsequent amination, such as materials commercially available as Jeffamine® RFD-270 (manufactured by Huntsman); polyoxyalkylene diamines or polyoxyalkylene triamines obtained as products from the amination of polyoxyalkylene diols and polyoxyalkylene triols, which are commercially available under the name Jeffamine® (manufactured by Huntsman), the name Polyetheramine (manufactured by BASF) or the name PC Amines® (manufactured by Nitroil). The use of Jeffamine® D-230, Jeffamine® D-400, Jeffamine® D-600, Jeffamine® D-2000, Jeffamine® D-4000, Jeffamine® T-403, Jeffamine® T-3000, Jeffamine® T-5000, Jeffamine® EDR-104, Jeffamine® EDR-148 and Jeffamine® EDR-176, as well as the corresponding amines from BASF or Nitroil, may be mentioned as being particularly preferred. iv) Primary diamines having a secondary amine group, which may be mentioned in the following examples: 3-(2-aminoethyl)aminopropylamine, bis(hexamethylene)triamine (BHMT); diethylenetriamine (DETA); triethylenetetramine (TETA); tetraethylenepentamine (TEPA); pentaethylenehexamine (PEHA); higher homologues of linear polyethyleneamines such as polyethylene polyamines having 5 to 7 ethyleneamine units (so-called "higher ethylene polyamines" HEPA); dipropylenetriamine (DPTA), N-(2-aminoethyl)-1,3-propanediamine (N3-amine), N,N'-bis(3-aminopropyl)ethylenediamine (N4-amine), N,N'-bis(3-aminopropyl)-1,4-diaminobutane, N5-(3-aminopropyl)-2-methyl-1,5-pentanediamine, N3-(3-aminopentyl)-1,3-pentanediamine, N5-(3-amino-1-ethylpropyl)-2-methyl-1,5-pentanediamine or N,N'-bis(3-amino-1-ethylpropyl)-2-methyl-1,5-pentanediamine, products from multiple cyanoethylation or cyanobutylation of primary diamines and primary polyamines having at least two primary amine groups and subsequent hydrogenation. v) Polyamines having one primary and at least one secondary amino group, which may be mentioned in the following examples: N-butyl-1,2-ethanediamine; N-hexyl-1,2-ethanediamine; N-(2-ethylhexyl)-1,2-ethanediamine; N-cyclohexyl-1,2-ethanediamine; 4-aminomethyl-piperidine; N-(2-aminoethyl)piperazine; N-methyl-1,3-propanediamine; N-butyl-1,3-propanediamine; N-(2-ethylhexyl)-1,3-propanediamine; N-cyclohexyl-1,3-propanediamine; 3-methylamino-1-pentylamine; 3-ethylamino-1-pentylamine; 3-cyclohexylamino-1-pentylamine; aliphatic diamines such as N-cocoalkyl-1,3-propanediamine; products from Michael type addition reactions in which a primary aliphatic diamine is reacted with acrylonitrile, maleic acid diester or fumaric acid diester, citraconic acid diester, acrylic acid ester and methacrylic acid ester, acrylamide and methacrylamide, and itaconic acid diester in a molar ratio of 1:1; products from partial reductive alkylation of primary polyamines with aldehydes or ketones, in particular pre-group polyamines having two primary amine groups, in particular 1,6-hexanediamine, 1,5-diamino-2-methylpentane, 1,3-bis(aminomethyl)cyclohexane, 1,4-bis(aminomethyl)cyclohexane, 1,3-bis(aminomethyl)benzene, BHMT, DETA, TETA, TEPA, DPTA, N3-amine and N4-amine N-monoalkylation products, where the preferred alkyl groups are benzyl, isobutyl, hexyl and 2-ethylhexyl; and partially styrenated polyamines as commercially available as Gaskamine® 240 (manufactured by Mitsubishi Gas Chemical Company). vi) the secondary diamine and, in particular, said polyamine having two primary amine groups, in particular 1,6 - hexanediamine, 1,5 - diamino - 2 - methylpentane, 1,3 - bis(aminomethyl)cyclohexane, 1,4 - bis(aminomethyl) - cyclohexane, 1,3 - bis(aminomethyl)benzene, BHMT, DETA, TETA, TEPA, DPTA, the N,N'-dialkylation products of N3 - amine or N4 - amine, where the preferred alkyl groups are 2 - phenylethyl group, benzyl group, isobutyl group, hexyl group and 2 - ethylhexyl group. vii) The following aromatic polyamines that may be mentioned: m- and p-phenylenediamine; 4,4’-, 2,4’ and 2,2’-diaminodiphenylmethane; 3,3’-dichloro-4,4’-diaminodiphenylmethane (MOCA); 2,4- and 2,6-tolylenediamine; a mixture of 3,5-dimethylthio-2,4-tolylenediamine and 3,5-dimethylthio-2,6-tolylenediamine (available from Albermarle as Ethacure® 300); a mixture of 3,5-diethyl-2,4-tolylenediamine and 3,5-diethyl-2,6-tolylenediamine (DETDA); 3,3’,5,5’-tetraethyl-4,4’-diaminodiphenylmethane (M-DEA); 3,3’,5,5’-tetraethyl-2,2’-dichloro-4,4’-diaminodiphenylmethane (M-CDEA); 3,3’-diisopropyl-5,5’-dimethyl-4,4’-diaminodiphenylmethane (M-MIPA); 3,3’,5,5’-tetraisopropyl-4,4’-diaminodiphenylmethane (M-DIPA); 4,4’-diaminodiphenyl-sulfone (DDS); 4-amino-N-(4-aminophenyl)benzenesulfonamide; 5,5’-methylenedianthranilic acid; dimethyl-(5,5’-methylenedianthranilate); 1,3-propylene-bis(4-aminobenzoate); 1,4-butylene-bis(4-aminobenzoate); polytetramethylene oxide-bis(4-aminobenzoate) (available from Air Products as Versalink®); 1,2-bis(2-aminophenylthio)ethane, 2-methylpropyl-(4-chloro-3,5-diaminobenzoate); and Tert. butyl-(4-chloro-3,5-diaminobenzoate). viii) The polyamideamine contains reaction products of indicative members with monovalent or polyvalent carboxylic acids or their esters or anhydrides (especially dimer fatty acids) and aliphatic polyamines, alicyclic polyamines or aromatic polyamines, such as polyalkyleneamines like DETA or TETA. Commercially available polyamideamines include Versamid® 100, 125, 140 and 150 (manufactured by Cognis); Aradur® 223, 250 and 848 (manufactured by Huntsman); Euretek® 3607 and 530 (manufactured by Huntsman); and Beckopox® EH651, EH654, EH655, EH661 and EH663 (manufactured by Cytec).

[0088] Among the polyamines having at least two primary aliphatic amine groups, preferred ones are isophoronediamine (IPDA); hexamethylenediamine (HMDA); 1,3-bis(aminomethyl)cyclohexane; 1,4-bis(aminomethyl)cyclohexane; bis(4-aminocyclohexyl)methane; bis(4-amino-3-methylcyclohexyl)methane; NBDA; and ether group-containing polyamines having a number average molecular weight (Mn) of at most 500 g / mol. Particularly preferred among the ether group-containing polyamines are Jeffamine® D-230 and D-600 (available from Huntsman).

[0089] As described above, the composition of the present invention may optionally contain at least one compound having at least two reactive mercapto groups per molecule. Suitable mercapto group-containing compounds that can be used alone or in combination include, but are not limited to, the following. · Liquid mercaptan-terminated polysulfide polymers, and as commercial examples, Thiokol® polymers (available from Morton Thiokol), especially those types LP-3, LP-33, LP-980, LP-23, LP-55, LP-56, LP-12, LP-31, LP-32 and LP-2; and, Thioplast® polymers (manufactured by Akzo Nobel), especially those types G10, G112, G131, G1, G12, G21, G22, G44 and G4. · Mercaptan-terminated polyoxyalkylene ethers obtained by reacting polyoxyalkylene diols and polyoxyalkylene triols with epichlorohydrin or alkylene oxides, followed by reacting with sodium hydrogen sulfide. · Mercaptan-terminated compounds in the form of polyoxyalkylene derivatives known by the trade name Capcure® (manufactured by Cognis), especially those types WR-8, LOF and 3-800. · Specific examples, pentaerythritol tetramercaptoacetate (PETMP); trimethylolpropane trimercaptoacetate (TMPMP); glycol dimercaptoacetate; and, polyesters of thiocarboxylic acids such as esterification products of polyoxyalkylene diols and triols, ethoxylated trimethylolpropane and polyester diols with thiocarboxylic acids such as thioglycolic acid and 2- or 3-mercaptopropionic acid. · 2,4,6-trimercapto-1,3,5-triazine, 2,2'-(ethylenedioxy)-diethanethiol (triethylene glycol dimercaptan) and / or ethanedithiol.

[0090] The use of polyesters of thiocarboxylic acids, especially the use of at least one of pentaerythritol tetramercaptoacetate (PETMP), trimethylolpropane trimercaptoacetate (TMPMP) and glycol dimercaptoacetate is recognized as being preferred.

[0091] As described above, the hardener may contain at least one Mannich base. Such compounds may be characterized by containing at least one phenalkamine, and in particular, phenalkamines obtained from the condensation of cardanol (CAS number: 37330-39-5), an aldehyde, and an amine. The reactant amine in the condensation reaction is preferably ethylenediamine or diethyltriamine.

[0092] Mannich bases and phenalkamines are known in the art, and suitable examples include commercially available phenalkamines such as Cardolite® NC-541, NC-557, NC-558, NC-566, Lite2001, and Lite2002 (available from Cardolite), Aradur® 3440, 3441, 3442, and 3460 (available from Huntsman), and Beckopox® EH614, EH621, EH624, EH628, and EH629 (available from Cytec).

[0093] <Accelerator> Suitable accelerators are substances that promote the reaction between an epoxy group and an epoxy-reactive group, such as the reaction between an amine group or a thiol group and an epoxy group. A specific example relates to the use of amine accelerators that function by deprotonating the reactive thiol group (-SH) present to form a thiolate (-S″), and this thiolate reacts with the epoxy group by nucleophilic ring-opening polymerization.

[0094] Although there is no intention to limit the accelerators used in the present invention, the following suitable accelerators can be mentioned. i) Acids or compounds hydrolyzable to acids, in particular a) organic carboxylic acids such as acetic acid, benzoic acid, salicylic acid, 2-nitrobenzoic acid and lactic acid; b) organic sulfonic acids such as methanesulfonic acid, p-toluenesulfonic acid and 4-dodecylbenzenesulfonic acid; c) sulfonic acid esters; d) inorganic acids such as phosphoric acid; e) Lewis acid compounds such as BF3 amine complexes, SbF6 sulfonium compounds, bisarene iron complexes; f) Bronsted acid compounds such as pentafluoroantimonic acid complexes; and e) mixtures of the above acids and acid esters; ii) Tertiary amines such as 2 piperazin-1-yl ethanamine, 1,4-diazabicyclo[2.2.2]octane, benzyldimethylamine, α-methylbenzyldimethylamine, triethanolamine, dimethylaminopropylamine, imidazole (including N-methylimidazole, N-vinylimidazole and 1,2-dimethylimidazole) and salts of such tertiary amines; iii) Quaternary ammonium salts such as benzyltrimethylammonium chloride; iv) Amidines such as 1,8-diazabicyclo[5.4.0]undec-7-ene; v) Guanidines such as 1,1,3,3-tetramethylguanidine; vi) Phenols, especially bisphenol; vii) Phenolic resins; and viii) Phosphites such as diphenyl phosphite and triphenyl phosphite.

[0095] Those skilled in the art will recognize that the choice of accelerator is not simply a matter of adding the fastest accelerator. Other decisive factors in the choice of accelerator include cost; toxicity; solubility; processing effects such as working time, early gelation, thermal decomposition, expansion and gas evolution; final properties such as glass transition temperature (Tg), modulus of elasticity, strength, elongation at break and chemical resistance; regulatory matters; and ease of use.

[0096] In the present invention, it is preferable to employ an accelerator comprising at least one tertiary amine, at least one amidine, or a mixture thereof, or consisting of the same. More specifically, the accelerator is desirably selected from the group consisting of imidazole, methylimidazole, benzyldimethylamine, 1,8-diazabicyclo[5.4.0]undec-7-ene, 1,4-diazabicyclo(2,2,2)octane, and mixtures thereof.

[0097] Typically, the accelerator is desirably present in the composition in an amount of 0.1 to 15% by weight, based on the weight of the composition. The accelerator may preferably constitute 1 to 10% by weight, for example, 5 to 10% by weight of the composition.

[0098] When the amount of the accelerator exceeds 15%, the accelerator in the composition becomes excessive, which may adversely affect the curing process and adhesion properties. On the other hand, when the amount is mainly less than 0.1%, the physical effect may disappear. Therefore, these amounts of the accelerator are preferable.

[0099] <Electrically non-conductive filler> The two-component (2K) composition of the present invention is characterized by the presence of an electrically non-conductive filler. To be complete, these fillers may be used in one or both components of the composition. Since the composition of the electrically non-conductive filler in each component is determined independently, it may be the same or different in each component.

[0100] Generally, there is no particular intention to limit the shape of the particles employed as the non-conductive filler, and particles such as acicular, spherical, elliptical, columnar, bead-shaped, cubic, or plate-shaped may be used alone or in combination. Furthermore, it is assumed that aggregates of two or more types of particles may be used. Similarly, there is no particular intention to limit the size of the particles employed as the non-conductive filler. Conventionally, however, such non-conductive fillers have an average volume particle diameter of 0.1 to 1500 μm, for example, 1 to 1000 μm, or 1 to 500 μm, measured by the laser diffraction / scattering method.

[0101] Exemplary non-conductive fillers include, but are not limited to, calcium carbonate, calcium oxide, calcium hydroxide (lime powder), precipitated and / or pyrogenic silica, zeolite, bentonite, wollastonite, magnesium carbonate, diatomaceous earth, barium sulfate, alumina, clay, talc, sand, quartz, flint, mica, glass beads, glass powder, fumed silica, and other minerals. It is also possible to add short fibers such as glass fibers, glass filaments, polyacrylonitrile, carbon fibers, or polyethylene fibers. Pyrogenic and / or precipitated silica preferably has a BET surface area of 10 - 90 m 2 / g. When they are used, they do not cause a further increase in the viscosity of the composition according to the invention, but contribute to the strengthening of the cured composition.

[0102] Hydrophobicity may be required in order for electrolytes to dissolve in the composition and avoid phase separation. Non-conductive fillers, especially fumed silica, impart the necessary hydrophobicity to the composition, thus improving the solubility of electrolytes and preventing phase separation. Furthermore, technical data shows that the presence of non-conductive fillers improves the initial adhesion properties of the composition.

[0103] It is also conceivable to use pyrogenic and / or precipitated silica having a larger BET surface area, preferably 100 - 250 m 2 / g. Due to the larger BET surface area, the effect of strengthening the cured composition is achieved with a lower weight ratio of silica.

[0104] Also suitable as non-conductive fillers are hollow spheres having a mineral or plastic shell. These may be, for example, hollow glass spheres commercially available under the trade name Glass Bubbles®. Plastic-based hollow spheres such as Expancel® or Dualite® may also be used, as described in European Patent Application Publication No. 0 520 426. These are composed of inorganic or organic substances and have a diameter of 1 mm or less, preferably 500 μm or less, and preferably 100 to 200 μm each.

[0105] Non-conductive fillers that impart thixotropy to the composition may be preferred in many applications. Such fillers are also described as rheology aids, for example, hardened castor oil, fatty acid amides, or swelling plastics such as PVC.

[0106] In a highly preferred embodiment, the composition according to the invention contains fumed silica as an electrically non-conductive filler.

[0107] The desired viscosities of the individual components of the composition and the desired viscosity of the curable composition formed when the two components are combined can determine the amount of filler used. Considering the latter consideration, the total amount of fillers (both electrically conductive and non-conductive) present in the composition should not prevent the composition from being easily extruded from a suitable dispensing device such as a tube. Conventionally, such extrudable curable compositions desirably have a viscosity of 3000 to 150,000 mPas, preferably 40,000 to 80,000 mPas, and more preferably 50,000 to 60,000 mPas.

[0108] Apart from the above viscosity conditions, the electrically non-conductive filler is preferably present in an amount of 1 to 50% by weight, preferably 2 to 25% by weight, more preferably 3 to 10% by weight, based on the total weight of the composition.

[0109] If the amount of the electrically non-conductive filler is more than 50%, the adhesion properties may be insufficient. On the other hand, if it is mainly less than 1%, the adhesion properties may be insufficient and viscosity problems may occur. Therefore, the amount of the above-mentioned electrically non-conductive filler is preferable.

[0110] <Electrically conductive filler> As described above, the two-component (2K) composition of the present invention may contain an electrically conductive filler, and this filler may be used in one or both components of the composition. Since the presence, identity, and amount of the electrically conductive filler in each component are determined independently, they may be the same or different for each component.

[0111] Generally, there is no particular intention to limit the shape of the particles employed as the conductive filler, and acicular, spherical, elliptical, columnar, bead-shaped, cubic, or plate-shaped particles may be used alone or in combination. Furthermore, it is assumed that aggregates of two or more types of particles may be used. Similarly, there is no particular intention to limit the size of the particles employed as the conductive filler. Conventionally, however, such conductive fillers have an average volume particle diameter of 1 to 500 μm, for example 1 to 200 μm, measured by the laser diffraction / scattering method.

[0112] Exemplary conductive fillers include silver; copper; gold; palladium; platinum; nickel; gold-coated nickel or silver-coated nickel; carbon black; carbon fiber; graphite; aluminum; indium tin oxide; silver-coated copper; silver-coated aluminum; metal-coated glass spheres; metal-coated fillers; metal-coated polymers; silver-coated fibers; silver-coated spheres; antimony-doped tin oxide; conductive nanospheres; nano silver; nano aluminum; nano copper; nano nickel; carbon nanotubes; and mixtures thereof, but are not limited thereto. It is preferable to use particulate silver and / or carbon black as the conductive filler.

[0113] In certain important embodiments, the electrically conductive filler is desirably included in the composition in an amount of 0.05 to 10% by weight, based on the total weight of the composition. Preferably, the composition comprises 0.1 to 5% by weight, such as 0.5 to 4% by weight or 1 to 3% by weight, of the electrically conductive filler, based on the total weight of the composition.

[0114] When the amount of the electrically conductive particles is more than 10%, the conductivity increases, but at the same time, the adhesion and peeling properties may be adversely affected. On the other hand, when the amount is mainly less than 0.05%, there is no physical effect and the amount of the electrolyte cannot be reduced. Therefore, the above amount of the electrically conductive particles is preferred.

[0115] <Reinforcing agent> The presence of a reinforcing agent in one or both components of the composition of the present invention can be advantageous. In particular, the first component of the composition of the present invention preferably comprises at least one reinforcing agent selected from: an epoxy - elastomer adduct; and a reinforcing rubber in the form of core - shell particles dispersed in an epoxy resin matrix.

[0116] The elastomer - containing adducts may be used alone or in combination of two or more specific adducts. Further, each adduct may independently be selected from a solid adduct or a liquid adduct at a temperature of 23°C. Typically, useful adducts are characterized in that the weight ratio of epoxy to elastomer is 1:5 to 5:1, such as 1:3 to 3:1. And a useful document regarding suitable epoxy / elastomer adducts is U.S. Patent Application Publication No. 2004 / 0204551. Further, exemplary commercially available epoxy / elastomer adducts for use herein include, but are not limited to, HYPDX RK8 - 4 commercially available from CVC Chemical; and B - Tough A3 available from Croda Europe Limited.

[0117] The term "core-shell rubber" or CSR refers to a rubber particle core formed by a polymer containing an elastomer or rubber-like polymer as a main component, and a shell layer formed by a polymer graft-polymerized to the core, and is used according to its standard meaning in the art. The shell layer partially or entirely covers the surface of the rubber particle core in the graft polymerization process. By weight, the core desirably constitutes at least 50% by weight of the core-shell rubber particles.

[0118] The polymer material of the core desirably has a glass transition temperature (Tg) of 0 °C or lower, preferably a glass transition temperature (Tg) of -20 °C or lower, more preferably -40 °C or lower, and even more preferably -60 °C or lower. The polymer of the shell is a non-elastomer, thermoplastic or thermosetting polymer having a glass transition temperature (Tg) above room temperature, preferably above 30 °C, more preferably above 50 °C.

[0119] Although not intended to limit the present invention, the core may include diene homopolymers, such as homopolymers of butadiene or isoprene; diene copolymers, such as copolymers of butadiene or isoprene and one or more ethylenically unsaturated monomers, such as vinyl aromatic monomers, (meth)acrylonitrile or (meth)acrylate; polymers based on (meth)acrylate monomers, such as polybutyl acrylate; and polysiloxane elastomers, such as polydimethylsiloxane and crosslinked polydimethylsiloxane.

[0120] While not intending to limit the present invention, the shell may be composed of a polymer or copolymer of one or more monomers selected from (meth)acrylates such as methyl methacrylate; vinyl aromatic monomers such as styrene; vinyl cyanide such as acrylonitrile; unsaturated acids and anhydrides such as acrylic acid; and (meth)acrylamides. The polymer or copolymer used for the shell may have ionically crosslinked acid groups by forming metal carboxylates, particularly salts of divalent metal cations. Also, the shell polymer or copolymer may be covalently crosslinked by monomers having two or more double bonds per molecule.

[0121] Some of the included core-shell rubber particles preferably have an average particle diameter (d50) of 10 nm to 300 nm, for example 50 nm to 250 nm. The particle diameter represents the diameter or the maximum dimension of the particles in the particle distribution and is measured via dynamic light scattering. To be complete, this application does not exclude the presence of two or more types of core-shell rubber (CSR) particles having different particle size distributions in the composition in order to provide a balance of the main properties including the shear strength, peel strength, and resin fracture toughness of the resulting cured product.

[0122] The core-shell rubber can be selected from commercially available products, examples of which include Paraloid EXL 2650A, EXL 2655, and EXL2691 A (manufactured by Dow Chemical Company); Clearstrength® XT100 (manufactured by Arkema Inc.); Kane Ace® MX series, particularly MX 120, MX 125, MX 130, MX 136, MX 551, MX553 (manufactured by Kaneka Corporation); and METABLEN SX-006 (manufactured by Mitsubishi Rayon Co., Ltd.).

[0123] The reinforcing agent is preferably contained in the composition in an amount of 0 to 15% by weight, for example 1 to 10% by weight, based on the total weight of the composition. In an alternative expression of the selection that is not intended to be mutually exclusive with the above, the reinforcing agent preferably constitutes 0 to 20% by weight, preferably 2 to 15% by weight of the first component of the composition.

[0124] When the amount of the reinforcing agent exceeds 15%, the adhesion properties may become insufficient. On the other hand, when the amount is mainly less than 1%, the peeling effect may become insufficient, and the composition may become too soft. Therefore, the above amount of the reinforcing agent is preferred.

[0125] <Additives and Auxiliary Components> The composition obtained in the present invention will typically further contain auxiliaries and additives that can impart improved properties to these compositions. For example, the auxiliaries and additives may impart one or more of improved elastic properties; improved elastic recovery; longer effective treatment time; faster curing time; and lower residual tack. Such auxiliaries and additives (which may be contained in one or both components of a two-component (2K) composition independently of each other) include: plasticizers; stabilizers including ultraviolet stabilizers; antioxidants; reactive diluents; desiccants; adhesion promoters; bactericides; flame retardants; rheology aids; coloring pigments or coloring pastes; and / or optionally, a small amount of a non-reactive diluent.

[0126] Such auxiliaries and additives can be used in desired combinations and proportions as long as they do not adversely affect the properties and essential characteristics of the composition. Although there are exceptions in some cases, these auxiliaries and additives should not exceed 50% by weight of the entire composition in total, and preferably it is not desirable to contain more than 20% by weight of the composition.

[0127] To be complete, it should be noted that auxiliary materials and additives having reactive groups are generally incorporated into the appropriate components of a two-component (2K) composition to ensure their storage stability. Non-reactive materials may be incorporated into either one or both of the two components.

[0128] For the purposes of the present invention, a "plasticizer" is a substance that reduces the viscosity of the composition and thus facilitates its processability. Here, the plasticizer can constitute up to 10% by weight or up to 5% by weight, based on the total weight of the composition, and is preferably diurethane; ethers of monofunctional, linear or branched C4-C16 alcohols, such as Cetiol OE (manufactured by Cognis Deutschland GmbH, Duesseldorf); esters of abietic acid, butyric acid, thiobutyric acid, acetic acid, propionic acid and citric acid; esters consisting of nitrocellulose and polyvinyl acetate; fatty acid esters; dicarboxylic acid esters; esters of OH group-containing or epoxidized fatty acids; glycolic acid esters; benzoic acid esters; phosphate esters; sulfonic acid esters; trimellitic acid esters; polyether plasticizers, such as end-capped polyethylene glycol or polypropylene glycol, etc.; polystyrene; hydrocarbon plasticizers; chlorinated paraffins; and mixtures thereof. In principle, phthalic acid esters can be used as plasticizers, but it is noted that these are not preferred due to their toxicological potential.

[0129] For the purposes of the present invention, a "stabilizer" is understood to be an antioxidant, a UV stabilizer, a heat stabilizer or a hydrolysis stabilizer. Here, the stabilizer may altogether constitute up to 10% by weight or up to 5% by weight, based on the total weight of the composition. Standard commercially available examples of stabilizers suitable for use herein include sterically hindered phenols; thioethers; benzotriazoles; benzophenones; benzoates; cyanoacrylates; acrylates; amines of the hindered amine light stabilizer (HALS) type; phosphorus; sulfur; and mixtures thereof.

[0130] To further improve the shelf life, it is often recommended to further stabilize the composition of the present invention with respect to the penetration of moisture by using a desiccant. There is also sometimes a need to reduce the viscosity of the adhesive composition or sealant composition according to the present invention for specific applications by using a reactive diluent. The total amount of the reactive diluent present is typically 0 to 15% by weight, for example 0 to 5% by weight, based on the total weight of the composition.

[0131] The presence of solvents and non-reactive diluents in the compositions of the present invention is also not excluded when they can usefully adjust their viscosities. For example, by way of illustration only, the composition can include one or more of the following. Xylene; 2-methoxyethanol; dimethoxyethanol; 2-ethoxyethanol; 2-propoxyethanol; 2-isopropoxyethanol; 2-butoxyethanol; 2-phenoxyethanol; 2-benzyloxyethanol; benzyl alcohol; ethylene glycol; ethylene glycol dimethyl ether; ethylene glycol diethyl ether; ethylene glycol dibutyl ether; ethylene glycol diphenyl ether; diethylene glycol; diethylene glycol monomethyl ether; diethylene glycol monoethyl ether; diethylene glycol mono-n-butyl ether; diethylene glycol dimethyl ether; diethylene glycol diethyl ether; diethylene glycol di-n-butyryl ether; propylene glycol butyl ether; propylene glycol phenyl ether; dipropylene glycol; dipropylene glycol monomethyl ether; dipropylene glycol dimethyl ether; dipropylene glycol di-n-butyl ether; N-methylpyrrolidone; diphenylmethane; diisopropylnaphthalene; petroleum fractions, for example Solvesso® products (manufactured by Exxon); alkylphenols, such as tert-butylphenol, nonylphenol, dodecylphenol and 8,11,14-pentadecatrienylphenol, etc.; styrenated phenol; bisphenol; aromatic hydrocarbon resins, especially those containing phenolic groups, such as ethoxylated phenol or propoxylated phenol, etc.; adipate; sebacate; phthalate; benzoate; organic phosphates or sulfonic acid esters; and sulfonamides, etc.

[0132] Separately from the above, it is preferred that the non-reactive diluent constitutes in total less than 10% by weight, particularly less than 5% by weight or less than 2% by weight, based on the total weight of the composition.

[0133] <Exemplary embodiments of two-component (2K) compositions> In an exemplary embodiment of the present invention, a two-component (2K) adhesive composition comprises Based on the weight of the composition, 30 to 70 wt%, preferably 35 to 60 wt% of the epoxy resin; 2 to 25 wt%, preferably 5 to 20 wt% of the electrolyte, where the electrolyte is selected from 1-ethyl-3-methylimidazolium methanesulfonate, 1-ethyl-3-methylimidazolium methyl sulfate, and mixtures thereof; and, 0 to 15 wt%, preferably 1.5 to 10 wt% of a solubilizer, where the solubilizer is a polyoxy(C 2- C3) alkylene glycol having a weight average molecular weight of 200 to 10000 g / mol, for example 200 to 2000 g / mol; a first component comprising; and, a curing agent comprising at least one compound having at least two epoxy-reactive groups per molecule, the curing agent comprising at least one polyamine having at least two amine hydrogens that react with epoxy groups, the polyamine further comprising a primary amine group and / or a secondary amine group, and characterized in that the equivalent per primary amine group and / or secondary amine group is 150 g / eq or less; 1 to 15 wt% of an accelerator based on the weight of the composition, where the accelerator is selected from the group consisting of tertiary amines, quaternary ammonium salts, amidines, guanidines, and mixtures thereof; a second component comprising; further characterized in that the composition comprises 1 to 50 wt%, preferably 2 to 25 wt% of an electrically non-conductive filler.

[0134] <Method and Application> To form a defined two - component (2K) curable composition, the reactive components are brought together and mixed in a manner that induces their curing. The reactive compounds are preferably mixed under sufficient shear force to obtain a homogeneous mixture. It is believed that this can be achieved without special conditions or special equipment. However, suitable mixing devices can include static mixing devices; magnetic stir bar devices; wire whisk devices; augers; speed mixers; batch mixers; planetary mixers; C.W. Brabender or Banburry® style mixers; and high - shear mixers such as blade - style blenders and rotating impellers, among others.

[0135] For small - scale applications where generally less than 2 liters of volume is used, a preferred packaging for the two - component (2K) composition is a side - by - side double cartridge or a co - axial cartridge, where typically two tubular chambers of equal volume are arranged side - by - side or one inside the other and sealed by pistons. The driving of these pistons enables the extrusion of the components from the cartridge and advantageously through a closely attached static or dynamic mixer. For large - volume applications, the two components of the composition are preferably stored in drums or pails. In this case, the two components are extruded by a hydraulic press, particularly a follower plate, and supplied via a pipeline to a mixing device that can ensure fine and highly homogeneous mixing of the two components. In any case, for any package, it is important that the components are placed in an airtight and moisture - free sealed state, whereby both components can be stored for a long period, ideally for more than 12 months.

[0136] Non - limiting examples of two - component dispensing devices and methods suitable for the present invention include those described in U.S. Patent No. 6,129,244 and U.S. Patent No. 8,313,006.

[0137] The first and second components of the composition are usually mixed in a weight ratio that achieves the desired ratio of epoxy groups to epoxy-reactive groups. By way of example, the weight ratio of the first component to the second component may be in the range of 12:1 to 2:1, preferably 10:1 to 2:1, such as 8:1 to 3:1 or 7:1 to 5:1.

[0138] When applicable, the two-component (2K) curable composition is desirably prepared such that the initial viscosity, measured, for example, within 2 minutes after mixing, is less than 200,000 mPa·s at 25°C, such as less than 100,000 mPa·s. Apart from or in addition to the viscosity characteristic, the two-component (2K) composition is desirably prepared to be free of bubbles (foam) during mixing and subsequent curing.

[0139] According to the broadest process aspect of the present invention, the above composition is applied to a material layer and then cured in place. Before applying the composition, it is often desirable to pretreat the relevant surface to remove foreign matter therefrom. When applicable, this step can promote the subsequent adhesion of the composition thereto. Such treatment is known in the art and can be carried out, for example, in a one-step or multi-step process consisting of one or more of the following uses: etching treatment with an acid suitable for the substrate and optionally an oxidizing agent; ultrasonic treatment; plasma treatment, including, for example, chemical plasma treatment, corona treatment, atmospheric pressure plasma treatment, and flame plasma treatment; immersion in an aqueous alkaline degreasing bath; treatment with an aqueous cleaning emulsion; treatment with a cleaning solvent such as carbon tetrachloride or trichloroethylene; and rinsing with water, preferably deionized water or pure water. Among these examples, when using an aqueous alkaline degreasing bath, it is desirable to remove the degreasing agent remaining on the surface by rinsing the substrate surface with deionized water or pure water.

[0140] Next, the composition is preferably applied to the surface of the pre-treated substrate by conventional coating methods as follows. Brushing; for example, roll coating using a 4-roll coater when the composition is solvent-free, or a 2-roll coater when the composition contains a solvent; doctor blade coating; printing methods; and, without limitation, spray methods such as air atomizing spray, air-assisted spray, airless spray, and high volume low pressure spray.

[0141] As described above, the present invention includes a first material layer having a conductive surface; and a second material layer having a conductive surface, and provides an adhesive structure in which a cured and peelable two-component (2K) adhesive composition defined herein and in the appended claims is disposed between the first material layer and the second material layer. To manufacture such a structure, the adhesive composition may be applied to at least one inner surface of the first material layer and / or the second material layer, and subsequently the two layers may be brought into contact, optionally under pressure, such that an electrically peelable hot melt adhesive composition is interposed between the two layers.

[0142] The composition is preferably applied to the surface with a wet film thickness of 10 - 500 μm. Applying a thinner layer within this range is more economical and results in a reduced likelihood of harmful thick cured regions. However, when applying a thinner coating or layer, excellent control must be exercised to avoid the formation of a discontinuous cured film.

[0143] The curing of the coating composition of the present invention typically occurs at a temperature in the range of 40°C to 200°C, preferably 50°C to 175°C, particularly 75°C to 175°C. The appropriate temperature depends on the specific compounds present and the desired curing rate, and can be determined on a case-by-case basis by those skilled in the art using simple preliminary tests as necessary. Of course, curing at a lower temperature within the above range is advantageous as it eliminates the need to substantially heat or cool the mixture from the normal ambient temperature. However, when applicable, the temperature of the mixture formed from each component of a two-component (2K) composition may be raised above the mixing temperature and / or the application temperature using conventional methods including microwave induction.

[0144] The present invention will be described with reference to the following accompanying drawings.

[0145] As shown in the attached Figure 1a, an adhesive structure is provided in which a layer (10) of cured adhesive is disposed between two conductive substrates (11). A layer (12) of non-conductive material may be disposed on the conductive substrate (11) to form a more complex adhesive structure as depicted in Figure 1b. Each layer of the conductive substrate (11) is in electrical contact with a power source (13) which may be a battery or an AC drive source for direct current (DC). The positive and negative terminals of the power source (13) are shown in one fixed position, but those skilled in the art will of course recognize that the polarity of the system can be reversed.

[0146] The two conductive substrates (11) are shown in the form of layers that can be constituted by, in particular, a metal film; a metal mesh or grid; vapor-deposited metal particles; a resin material made conductive by conductive elements disposed in the resin material; or a conductive oxide layer. Exemplary conductive elements include silver filaments, single-walled carbon nanotubes, and multi-walled carbon nanotubes. Exemplary conductive oxides include doped indium oxide such as indium tin oxide (ITO); doped zinc oxide; antimony tin oxide; cadmium stannate, and zinc stannate. Apart from the selection of the conductive material, those skilled in the art will recognize that if the conductive substrate (11) is in the form of a grid or mesh that limits contact with the layer (10) of cured adhesive, the effectiveness of the peeling operation may be reduced.

[0147] As shown in FIGS. 2a and 2b, delamination occurs at the anode interface, which is the interface between the adhesive composition (10) and the conductive surface (11) in electrical contact with the anode. By reversing the direction of the current before separating the substrates, the adhesive bond can be weakened at the interface of both substrates.

[0148] However, it is noted that the composition of the adhesive layer (10) can be adjusted such that delamination occurs either from one or both of the plus or minus interfaces, or simultaneously from both. In some embodiments, when a voltage is applied across both surfaces to form an anode interface and a cathode interface, delamination occurs simultaneously at both the anode and cathode adhesive / substrate interfaces. In another embodiment, when the composition does not react to direct current at both interfaces, reverse polarity can be used to delaminate both substrate / adhesive interfaces simultaneously. The current can apply any suitable waveform provided that sufficient total time at each polarity is allowed for delamination to occur. In that case, sine waves, square waves, and triangular waves are suitable and can be applied from a controlled voltage source or a controlled current source. Without intending to limit the present invention, it is considered that the delamination operation can be effectively performed when at least one, preferably both, of the following conditions occur. a) An applied voltage of 0.5 to 200 V; and, b) A voltage applied for a period of 1 second to 120 minutes, such as 1 second to 60 minutes or 1 second to 30 minutes. When delamination of the conductive substrate from the cured adhesive is facilitated, for example, by the application of force via a weight or a spring, only an application of a potential on the order of a few seconds may be required.

[0149] The following examples illustrate the present invention and are not intended to limit the scope of the present invention in any way.

Example

[0150] In the examples, the following materials were employed. Cab-O-Sil 720: Fumed silica surface-treated with polydimethylsiloxane (PDMS) (available from Cabot Corporation). Casiflux G20: Granular wollastonite (available from Sibelco). KBM-4803: 8-Glycidyloxyoctyltrimethoxysilane (available from Shinetsu). EMIM-MS: 1-Ethyl-3-methylimidazolium methanesulfonate (available from TCI America Inc.). B-Tough A3: Epoxy-silicone elastomer adduct (available from Croda Europe Limited). DER 330EL: Low-viscosity bisphenol A epoxy resin (available from Olin). ) DER 337: Intermediate epoxy equivalent semi-solid resin based on bisphenol A epoxy (available from Olin). DER 337-X80: Intermediate epoxy equivalent semi-solid resin based on bisphenol A epoxy in xylene (available from Olin). Jeffamine® D-230: Ether group-containing aliphatic primary polyamine (available from Huntsman). PEG400: Polyethylene glycol (available from Sigma Aldrich). 2-Piperazin-1-ylethanamine: Tertiary amine (available from Acros Organics).

[0151] <Example 1> The (A) and (B) components of the two-component (2K) composition were prepared independently according to Table 1 below.

[0152]

Table 1

[0153] The individual components (A, B) were loaded into separate compartments of a 50 g cartridge and sealed at both ends. Then the cartridge was loaded into a cartridge gun and a mixing tip was attached to the front end. By applying a constant pressure to the trigger, the two components were extruded into the mixing tip and thoroughly mixed before being applied to a predetermined substrate.

[0154] The substrates were aluminum (AA6016) and stainless steel (1.4301), with aluminum having a thickness of 1.25 mm, steel having a thickness of 1.5 mm, and copper having a thickness of 1 mm, respectively. The substrates were cut into a size of 2.5 cm × 10 cm (1 inch × 4 inches) for the tensile test. The tensile lap shear (TLS) test was carried out according to the test method described on page 5.

[0155] The applied two-component (2K) adhesive composition was cured in the overlapping area by applying a temperature of 65 °C for 120 minutes. Then, it was stored in a constant temperature chamber at 25 °C and a humidity of 20%.

[0156] For each substrate, the tensile lap shear strength was investigated both before and after applying a constant voltage of 50 V for 20 minutes across the adhesive layer after the 24-hour storage period. The results are described in Table 2 below.

[0157]

Table 2

[0158] <Example 2> For the adhered aluminum substrate (AA6016), the lap shear strength (MPa) was investigated under two conditions: a) when a constant voltage (75 V) was applied across the overlapping adhesive area for 120 minutes, and b) when different voltages were applied across the overlapping adhesive area for a fixed time (30 minutes) at each applied voltage. The results of these investigations are shown in the attached Figures 3a and 3b.

[0159] <Example 3> For the composition of Example 1, a stability test was carried out. For this test, normal lap shear samples were prepared and cured at 65 °C for 120 minutes. Aluminum and steel substrates were used. Then, the samples were stored in a constant temperature chamber at 25 °C and a humidity of 20%.

[0160] After 1 day, 7 days, 14 days, 21 days, and 30 days, the lap shear was measured. The results are described in Table 3 below.

[0161]

Table 3

[0162] The results of the stability are shown in Fig. 4. Fig. 4 shows the adhesion characteristics and peeling effect on aluminum and steel. The test results indicate that the composition according to the present invention has good initial adhesion characteristics and does not impair them over time. Also, the composition according to the present invention has a good initial peeling effect and maintains it over time.

[0163] <Example 4> According to Table 4 below, the (A) component and the (B) component of the two-component (2K) composition were independently prepared.

[0164]

Table 4

[0165] The composition and the samples were prepared as described in Example 1. The results are described in Table 5 below.

[0166]

Table 5

[0167] From the above description and examples, it will be apparent to those skilled in the art that modifications equivalent thereto can be made without departing from the scope of the claims.

[0168] <Example 5> According to Table 6 below, the (A) component and the (B) component of the two-component (2K) composition were independently prepared.

[0169]

Table 6

[0170] The composition and the samples were prepared as described in Example 1. The results are described in Table 7 below.

[0171]

Table 7

[0172] <Example 6> According to Table 8 below, the components (A) and (B) of the two-component (2K) composition were independently prepared.

[0173]

Table 8

[0174] The composition and the samples were prepared as described in Example 1. The results are shown in Table 9 below.

[0175]

Table 9

[0176] From the above description and examples, it will be apparent to those skilled in the art that modifications equivalent thereto can be made without departing from the scope of the claims.

[0177] <Example 7> Two two-component (2K) compositions having the difference that Composition 1a contains an electrically non-conductive filler (fumed silica) while Composition 1b does not contain an electrically non-conductive filler were independently prepared according to Table 10 below.

[0178]

Table 10

[0179] The composition and the samples were prepared as described in Example 1. The results are shown in Table 11 below.

[0180]

Table 11

[0181] This result shows that the use of non-conductive fillers, particularly fumed silica, improves the initial strength and the peeling effect. This result is also shown in Figure 5.

[0182] From the above description and examples, it will be apparent to those skilled in the art that modifications equivalent thereto can be made without departing from the scope of the claims. Preferred embodiments of the present specification include at least the following. [1] a) An epoxy resin; b) An electrolyte; c) Optionally, a solubilizer; A first component containing a) A curing agent composed of at least one compound having at least two epoxide-reactive groups per molecule; and b) An accelerator; A second component containing and A curable and peelable two-component (2K) adhesive composition further containing an electrically non-conductive filler and optionally a reinforcing agent. [2] The epoxy resin is selected from the group consisting of bisphenol A epoxy resin, bisphenol F epoxy resin, a mixture of bisphenol A epoxy resin and bisphenol F epoxy resin, alicyclic epoxy resin, and mixtures thereof, preferably the epoxy resin is bisphenol A epoxy resin, the curable and peelable two-component adhesive composition according to [1]. [3] The epoxy resin is present in an amount of 30 to 70% by weight, preferably 35 to 60% by weight, more preferably 40 to 60% by weight, even more preferably 47 to 57% by weight of the composition, the curable and peelable two-component adhesive composition according to [1] or [2]. [4] The electrolyte is 1-ethyl-3-methylimidazolium methanesulfonate, 1-ethyl-3-methylimidazolium methyl sulfate, 1-hexyl-3-methylimidazolium 2-(2-fluoroanilino)-pyridinate, 1-hexyl-3-methylimidazolium imide, 1-butyl-1-methylpyrrolidinium 2-(2-fluoroanilino)-pyridinate, 1-butyl-1-methyl-pyrrolidinium imide, trihexyl(tetradecyl)phosphonium 2-(2-fluoroanilino)-pyridinate, cyclohexyltrimethylammonium bis(trifluoromethylsulfonyl)imide, di(2-hydroxyethyl)ammonium trifluoroacetate, N,N-dimethyl(2-hydroxyethyl)ammonium octanoate, methyltrioctylammonium bis(trifluoromethylsulfonyl)imide, N-ethyl-N-N-N-N-tetramethylguanidinium trifluoromethanesulfonate, guanidinium trifluoromethanesulfonate, 1-butyl-4-methylpyridinium bromide, 1-butyl-3-methylpyridinium tetrafluoroborate, 1-butyl-3-hydroxymethylpyridinium ethyl sulfate, 1-butyl-1-methylpyrrolidinium bis(trifluoromethylsulfonyl)imide, 1-butyl-methylpyrrolidinium tris(pentafluoroethyl)trifluorophosphate, 3-methylimidazolium ethyl sulfate, 1-ethyl-3-methylimidazolium chloride, 1-ethyl-3-ethyl-methylimidazolium bromide, 1-butyl-3-methylimidazolium chloride, 1-hexyl-3-methylimidazolium chloride, 1-octyl-3-methylimidazolium chloride, 1-methyl-3-octylimidazolium chloride, 1-propyl-3-methylimidazolium iodide, 1-butyl-3-methylimidazolium tetrafluoroborate, 1-butyl-3-methylimidazolium trifluoromethanesulfonate, 1-butyl-3-methylimidazolium hexafluorophosphate, 1-butyl-2,3-dimethylimidazolium tetrafluoroborate, 1-butyl-2,A curable and peelable two-component adhesive composition according to any one of [1] to [3], selected from the group consisting of 3-dimethylimidazolium hexafluorophosphate, 1-butylimidazole, 1-methylimidazolium tetrafluoroborate, tetrabutylphosphonium tris(pentafluoroethyl)trifluorophosphate, trihexyl(tetradecyl)phosphonium tetrafluoroborate and mixtures thereof, preferably selected from 1-ethyl-3-methylimidazolium methanesulfonate, 1-ethyl-3-methylimidazolium methylsulfate and mixtures thereof., [5] The electrolyte is present in an amount of 2 to 25% by weight, preferably 4 to 23% by weight, more preferably 5 to 20% by weight based on the total weight of the composition, the curable and peelable two-component adhesive composition according to any one of [1] to [4]. [6] The electrically non-conductive filler is selected from the group consisting of calcium carbonate, calcium oxide, talcum, fumed silica, silica, wollastonite, barium sulfate, glass beads, and mixtures thereof, the curable and peelable two-component adhesive composition according to any one of [1] to [5]. [7] The filler is present in an amount of 1 to 50% by weight, preferably 2 to 25% by weight, more preferably 3 to 10% by weight based on the total weight of the composition, the curable and peelable two-component adhesive composition according to any one of [1] to [6]. [8] The solubilizer is included in an amount of 0.5 to 15% by weight, preferably 1.5 to 10% by weight, more preferably 3 to 7% by weight based on the total weight of the composition, the curable and peelable two-component adhesive composition according to any one of [1] to [7]. [9] The solubilizing agent is selected from polyphosphazene; polymethylene sulfide; polyoxyalkylene glycol; polyethyleneimine; silicone surfactant and fluorinated silicone surfactant; copolymer of functionalized polyalkylsiloxane and epoxy resin; polyhydric alcohol; and sugar, and is the curable and peelable two-component adhesive composition according to [8].

[10] The curable and peelable two-component adhesive composition according to any one of [1] to [9], further comprising conductive particles selected from the group consisting of carbon black, silver, and mixtures thereof.

[11] The curable and peelable two-component adhesive composition according to any one of [1] to

[10] , wherein the conductive particles are included in an amount of 0.05 to 10% by weight, preferably 0.1 to 5% by weight, more preferably 0.5 to 4% by weight, still more preferably 1 to 3% by weight based on the total weight of the composition.

[12] The curing agent contains at least one polyamine having at least two amine hydrogens that react with an epoxide group, and the polyamine further contains a primary amine group and / or a secondary amine group, and has an equivalent weight of 150 g / eq or less per primary amine group or secondary amine group, and is the curable and peelable two-component adhesive composition according to any one of [1] to

[11] .

[13] The accelerator is selected from the group consisting of tertiary amines, quaternary ammonium salts, amidines, guanidines, and mixtures thereof, and the accelerator is preferably selected from the group consisting of imidazole, methylimidazole, benzyldimethylamine, 1,8-diazabicyclo[5.4.0]undec-7-ene, 1,4-diazabicyclo(2,2,2)octane, and mixtures thereof, and is the curable and peelable two-component adhesive composition according to any one of [1] to

[12] .

[14] The accelerator is present in an amount of 0.1 to 15% by weight, preferably 1 to 15% by weight, more preferably 5 to 15% by weight based on the total weight of the composition, and is the curable and peelable two-component adhesive composition according to any one of [1] to

[13] .

[15] A first material layer having a conductive surface; A second material layer having a conductive surface; comprising An adhesive structure, wherein the cured and peelable two-component adhesive composition according to any one of [1] to

[14] is disposed between the first material layer and the second material layer.

[16] 1) A step of applying a voltage across both surfaces to form an anode interface and a cathode interface, and 2) A step of peeling the both surfaces comprising The voltage applied in step 1 is preferably 0.5 to 200 V, and the voltage is preferably applied for 1 second to 120 minutes, more preferably 1 second to 60 minutes. A method for peeling the adhesive structure described in

[15] .

Claims

1. a) an epoxy resin; b) an electrolyte; c) a solubilizing agent for solubilizing the electrolyte; a first component comprising, and a) a curing agent consisting of at least one compound having at least two epoxide-reactive groups per molecule; and b) a reaction accelerator for the reaction between an epoxy group and an epoxide-reactive group; a second component comprising and the solubilizing agent is present in an amount of 0.5 to 15% by weight based on the total weight of the composition, a curable and peelable two-component (2K) adhesive composition further comprising an electrically non-conductive filler and optionally a reinforcing agent.

2. The curable and peelable two-component adhesive composition according to claim 1, wherein the epoxy resin is selected from the group consisting of bisphenol A epoxy resin, bisphenol F epoxy resin, a mixture of bisphenol A epoxy resin and bisphenol F epoxy resin, alicyclic epoxy resin, and mixtures thereof.

3. The curable and peelable two-component adhesive composition according to claim 1 or 2, wherein the epoxy resin is present in an amount of 30 to 70% by weight of the composition.

4. The electrolyte is 1-ethyl-3-methylimidazolium methanesulfonate, 1-ethyl-3-methylimidazolium methylsulfate, 1-hexyl-3-methylimidazolium 2-(2-fluoroanilino)-pyridinate, 1-hexyl-3-methylimidazolium imide, 1-butyl-1-methylpyrrolidinium 2-(2-fluoroanilino)-pyridinate, 1-butyl-1-methyl-pyrrolidinium imide, trihexyl(tetradecyl)phosphonium 2-(2-fluoroanilino)-pyridinate, cyclohexyltrimethylammonium bis(trifluoromethylsulfonyl)imide, di(2-hydroxyethyl)ammonium trifluoroacetate, N,N-dimethyl(2-hydroxyethyl)ammonium octanoate, methyltrioctylammonium bis(trifluoromethylsulfonyl)imide, N-ethyl-N-N-N-N-tetramethylguanidinium trifluoromethanesulfonate, guanidinium trifluoromethanesulfonate, 1-butyl-4-methylpyridinium bromide, 1-butyl-3-methylpyridinium tetrafluoroborate, 1-butyl-3-hydroxymethylpyridinium ethylsulfate, 1-butyl-1-methylpyrrolidinium bis(trifluoromethylsulfonyl)imide, 1-butyl-methylpyrrolidinium tris(pentafluoroethyl)trifluorophosphate, 3-methylimidazolium ethylsulfate, 1-ethyl-3-methylimidazolium chloride, 1-ethyl-3-ethyl-methylimidazolium bromide, 1-butyl-3-methylimidazolium chloride, 1-hexyl-3-methylimidazolium chloride, 1-octyl-3-methylimidazolium chloride, 1-methyl-3-octylimidazolium chloride, 1-propyl-3-methylimidazolium iodide, 1-butyl-3-methylimidazolium tetrafluoroborate, 1-butyl-3-methylimidazolium trifluoromethanesulfonate, 1-butyl-3-methylimidazolium hexafluorophosphate, 1-butyl-2,3-dimethylimidazolium tetrafluoroborate, 1-butyl-2,The curable and peelable two-component adhesive composition according to any one of claims 1 to 3, selected from the group consisting of 3-dimethylimidazolium hexafluorophosphate, 1-butylimidazole, 1-methylimidazolium tetrafluoroborate, tetrabutylphosphonium tris(pentafluoroethyl) trifluorophosphate, trihexyl(tetradecyl)phosphonium tetrafluoroborate, and mixtures thereof.,

5. The curable and peelable two-component adhesive composition according to any one of claims 1 to 4, wherein the electrolyte is present in an amount of 2 to 25% by weight based on the total weight of the composition.

6. The curable and peelable two-component adhesive composition according to any one of claims 1 to 5, wherein the electrically non-conductive filler is selected from the group consisting of calcium carbonate, calcium oxide, talcum, fumed silica, silica, wollastonite, barium sulfate, glass beads, and mixtures thereof.

7. The curable and peelable two-component adhesive composition according to any one of claims 1 to 6, wherein the filler is present in an amount of 1 to 50% by weight based on the total weight of the composition.

8. The curable and peelable two-component adhesive composition according to any one of claims 1 to 7, comprising the solubilizing agent in an amount of 1.5 to 10% by weight based on the total weight of the composition.

9. The curable and peelable two-component adhesive composition according to any one of claims 1 to 8, wherein the solubilizing agent is selected from polyphosphazene; polymethylene sulfide; polyoxyalkylene glycol; polyethyleneimine; silicone surfactant and fluorinated silicone surfactant; a copolymer of a functionalized polyalkylsiloxane and an epoxy resin; polyhydric alcohol; and sugar.

10. The curable and peelable two-component adhesive composition according to any one of claims 1 to 9, further comprising conductive particles selected from the group consisting of carbon black, silver, and mixtures thereof.

11. The curable and peelable two-component adhesive composition according to any one of claims 1 to 10, wherein the conductive particles are included in an amount of 0.05 to 10% by weight based on the total weight of the composition.

12. The curable and peelable two-component adhesive composition according to any one of claims 1 to 11, wherein the curing agent includes at least one polyamine having at least two amine hydrogens that react with an epoxide group, the polyamine further includes a primary amine group and / or a secondary amine group, and has an equivalent weight of 150 g / eq or less per primary amine group or secondary amine group.

13. The curable and peelable two-component adhesive composition according to any one of claims 1 to 12, wherein the accelerator is selected from the group consisting of a tertiary amine, a quaternary ammonium salt, an amidine, a guanidine, and mixtures thereof.

14. The curable and peelable two-component adhesive composition according to any one of claims 1 to 13, wherein the accelerator is present in an amount of 0.1 to 15% by weight based on the total weight of the composition.

15. A first material layer having a conductive surface; A second material layer having a conductive surface; comprising, An adhesive structure in which the cured and peelable two-component adhesive composition according to any one of claims 1 to 14 is disposed between the first material layer and the second material layer.

16. 1) A step of applying a voltage across both surfaces to form an anode interface and a cathode interface, and 2) A step of peeling the both surfaces comprising, A method for peeling the adhesive structure according to claim 15, wherein the voltage applied in step 1 is 0.5 to 200 V, and the voltage is applied for 1 second to 120 minutes.

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