Substrate and package substrate including the same

Abstract

A substrate is provided that includes a glass substrate, the glass substrate including a first surface, a second surface, an edge region connecting the first surface and the second surface, a groove formed from a portion of the edge region toward an interior of the glass substrate, and a protection device formed in the groove, the groove penetrating the first surface and the second surface.

Description

Technical Field

[0001] [Cross - Reference to Related Applications] This application claims the priority of U.S. Provisional Patent Application No. 63 / 235,847, filed on August 23, 2021, the entire disclosure of which is incorporated herein by reference for all purposes.

[0002] The present disclosure relates to a substrate and a package substrate including the same.

Background Art

[0003] In a packaging process of attaching a glass substrate to a large panel used in a conveying operation, processing, etc., the glass substrate may be impacted. Due to this influence, problems such as process losses and defects may occur, but not limited to this.

[0004] Means used for conveying, processing, etc. of the glass substrate may generally include materials with high rigidity, which may cause defects and cracks in the glass substrate, leading to the breakage of the entire glass substrate.

[0005] Therefore, a solution that can minimize the occurrence of damage, defects, and cracks in processes such as conveying and processing of the glass substrate is beneficial.

Summary of the Invention

[0006] This summary is provided to introduce some of the concepts that will be described in more detail in the detailed description of the invention. This summary is not intended to identify the key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

[0007] In a first aspect of the present invention, there is provided a substrate comprising a glass substrate including a first surface, a second surface, and an edge region connecting the first surface and the second surface, and a protection device, wherein the protection device is disposed on at least a part of the edge region, and the minimum thickness of the protection device is 5 μm or more.

[0008] The substrate further includes a groove portion that penetrates the first surface and the second surface toward the inside of the glass substrate, and the protection device may be disposed in the groove portion.

[0009] At least one of the first surface and the second surface of the glass substrate is configured to have a shape ranging from a quadrilateral to an octagon. The glass substrate includes a through via that penetrates the first surface and the second surface, and the glass substrate includes at least one of a conductive wire and a conductive layer in a part thereof.

[0010] The protection device may include a first protection device and a second protection device that are distinguishable from each other. The first protection device is disposed in an edge region in contact with a first side of the first surface, and the second protection device is disposed in an edge region in contact with a second side of the first surface. The first side and the second side face each other.

[0011] The groove portion may include a first groove portion and a second groove portion that are distinguishable from each other. The first groove portion and the second groove portion are disposed to face each other with the first surface or the second surface therebetween.

[0012] The protection device may include a polymer layer having a total light transmittance of 87% or more.

[0013] The polymer layer may be an elastic layer, and the adhesion strength between the protection device and the glass substrate according to ASTM D3359 may be 5B.

[0014] Even if an impact with a pressure of 1.1 bar is applied three times so as to directly contact the protection device with a pin having a cross section corresponding to the cross section of the groove portion, substantially no damage occurs to the glass substrate of the substrate.

[0015] Even if an impact with a pressure of 1.1 bar is applied 50 times so as to directly contact the protection device with a pin having a cross section corresponding to the cross section of the groove portion, substantially no damage occurs to the glass substrate of the substrate.

[0016] The groove portion may have a shape corresponding to any one of the circumferences of a circle or an ellipse and arcs, and the distance from at least one point of the groove portion to the edge region may be 1 mm to 15 mm.

[0017] The protection device may have a pencil hardness of HB or higher according to ASTM D3363.

[0018] The polymer layer may contain an ultraviolet (UV) curable resin.

[0019] The glass substrate may include a cavity unit disposed on a part of the glass substrate.

[0020] The thickness between the first surface and the second surface of the cavity unit may be thinner than the thickness between the first surface and the second surface of the glass substrate.

[0021] The glass substrate may include an upper rewiring layer on the first surface and a lower rewiring layer under the second surface.

[0022] A semiconductor substrate including the substrate and a semiconductor element mounted on the substrate is provided.

[0023] Other features and aspects will be apparent from the following detailed description, drawings, and claims.

Brief Description of the Drawings

[0024]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Best Mode for Carrying Out the Invention

[0025] The following detailed description is provided to assist the reader in comprehensively understanding the methods, apparatuses, and / or systems described herein. However, upon understanding the present disclosure, various changes, modifications, and equivalents of the methods, apparatuses, and / or systems described herein will become apparent. For example, the order of operations described herein is merely illustrative and not limited to what is described herein, and may be changed as will be apparent upon understanding the present disclosure, except when the operations must be performed in a certain order. Also, upon understanding the content of the present disclosure, descriptions of well-known features may be omitted to enhance clarity and conciseness, but note that the omission of features and their descriptions is not intended to acknowledge their general knowledge.

[0026] The features described in this specification can be embodied in different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein are provided merely to illustrate some of the many possible ways of implementing the methods, apparatuses, and / or systems described herein that will become apparent after understanding the present disclosure.

[0027] In this specification, terms such as "first", "second", and "third" are used to describe various members, components, regions, layers, or sections, but these members, components, regions, layers, or sections are not limited. Rather, these terms are used only to distinguish one member, component, region, layer, or section from another. Thus, a first member, component, region, layer, or section referred to in the examples described herein may also be referred to as a second member, component, region, layer, or section without departing from the teachings of the examples.

[0028] In the specification, when an element such as a layer, region, or substrate is described as being "on" another element, "connected" or "coupled" to another element, it is either directly "on", "connected", or "coupled" to the other element, or there is one or more other elements intervening therebetween. On the other hand, when an element is described as being "directly on", "directly connected" to, or "directly coupled" to another element, there are no other elements intervening therebetween. Similarly, expressions such as "between", "exactly between", "adjacent to", and "directly adjacent to" can be interpreted as described above.

[0029] The terms used in this specification are for the purpose of describing specific examples only and are not used to limit the present disclosure. As used herein, the singular forms are intended to include the plural forms as well, unless the context clearly dictates otherwise. The term "and / or" as used herein includes any one of the associated listed items and any combination of any two or more of them. The terms "comprising," "including," and "having" as used herein identify the presence of the described features, numbers, operations, elements, components, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, numbers, operations, elements, components, and / or combinations thereof. As used herein, the term "may" in an example or embodiment (e.g., with respect to what an example or embodiment may include or may implement) means that there is at least one example or embodiment in which such a feature is included or implemented. However, all examples are not limited thereto.

[0030] Unless otherwise defined, all terms, including technical and scientific terms used herein, shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains after understanding the present disclosure. Terms defined as in a commonly used dictionary shall be interpreted to have a meaning that coincides with the meaning in the context of the relevant art and the present disclosure, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined as such herein.

[0031] In this application, terms such as "first," "second," "A," or "B" are used to distinguish the same terms.

[0032] As used in this application, the singular forms are intended to include the plural forms as well, unless the context clearly dictates otherwise.

[0033] One or more embodiments can provide a substrate that can prevent impacts or damages generated in processes such as the conveyance and processing of a glass substrate in a packaging process.

[0034] In one or more embodiments, a protection device can be provided within the substrate, thereby preventing excessive impact from being applied to the interior of the glass substrate during transportation, processing, etc. in the packaging process.

[0035] Substrate 100 Referring to FIGS. 1 and 2, in one or more embodiments, the substrate 100 may include a glass substrate 10 including a first surface 11, a second surface 12, and an edge region 13 connecting the first surface 11 and the second surface 12, and a protection device 20. In a non-limiting embodiment, the protection device 20 may be disposed at least in part in the edge region 13. In one embodiment, the protection device 20 may include a polymer layer having a total light transmittance of about 87% or more.

[0036] The glass substrate 10 may further include a groove portion 14 protruding toward the interior of the glass substrate 10. The groove portion 14 may penetrate the first surface 11 and the second surface 12. The groove portion 14 may be disposed in a part of the edge region 13 and may be connected to the edge region 13. In a non-limiting example, the protection device 20 may be disposed on the groove portion 14.

[0037] In a non-limiting example, when viewed from above, the glass substrate 10 may have a shape that is octagonal instead of square excluding the groove portion 14. The glass substrate 10 may have four sides and four edge regions.

[0038] In one example, the protection device 20 may include a first protection device and a second protection device that are distinguishable from each other and may be spatially separated from each other. The first protection device is disposed in an edge region in contact with a first side of the first surface 11, and the second protection device is disposed in an edge region in contact with a second side of the first surface 11. The first side and the second side may face each other.

[0039] The groove portion 14 may include a first groove portion and a second groove portion that are distinguishable from each other. The first groove portion and the second groove portion may be arranged to face each other with the first surface 11 or the second surface 12 therebetween.

[0040] As shown in FIG. 6, the groove portion 14 and the protection device 20 formed on the groove portion 14 may include a first edge region of the glass substrate 10 and a second edge region opposite to the first edge region. A plurality of the groove portions and the protection devices may be formed, and they may be formed in a number from 1 to 10 based on one edge region of the glass substrate.

[0041] The substrate 100 may have a protection device 20 formed to extend over any one or more regions of an edge region of the glass substrate 10 connected to the groove portion 14, a first surface 11 connected to the groove portion 14, and a second surface 12 connected to the groove portion 14. The protection device 20 may extend by 10 μm to 500 μm. As shown in FIG. 1, the protection device 20 may be formed to extend in an edge region excluding the groove portion 14.

[0042] As shown in FIG. 2, the groove portion 14 may have a shape that is recessed by a predetermined length from the edge region 13 in the central direction of the first surface 11 or the second surface 12. The protection device 20 may be formed on the inner peripheral surface of the groove portion. The maximum recess length of the groove portion 14 may be 2.5 mm or less, 1 mm or less, or 0.8 mm or less. The recess length of the groove portion may be 0.2 mm or more. By having such a fine length, the substrate 100 can obtain convenience in conveyance and processing through a conveyance device that contacts the groove portion.

[0043] The groove portion 14 may have substantially the same grooves on the first surface 11 and the second surface 12, and may have a through shape. When the cross-section of the groove portion 14 is viewed from above the first surface 11 of the glass substrate 10 or from below the second surface 12, it may be a cut circle or a cut ellipse, and may include the circumferences and arcs of an ellipse or a circle, and may include curves. Further, the distance from at least one point of the groove portion to the edge region may be 1 mm to 15 mm.

[0044] The cross-section of the groove portion 14 may include circumferences and arcs of a circle or a semi-circular shape having a diameter of 1 mm to 5 mm. By having such a shape, the protection device 20 can be formed more stably, and the impact applied through a conveying device or the like can be minimized.

[0045] As shown in FIG. 3, the protection device 20 may be formed in contact with the groove portion 14 or on the groove portion 14, and may have substantially the same shape along the circumferential direction of the groove portion 14.

[0046] In one example, the protection device 20 may have a thickness of at least 5 μm or more, 10 μm to 1000 μm, 50 μm to 1000 μm, or 100 μm to 400 μm with respect to the external direction perpendicular to the thickness of the glass substrate 10 from the edge region 13 of the glass substrate 10. By having such a thickness, the protection device 20 can minimize the impact applied through a conveying device or the like.

[0047] The protection device 20 may be formed by uniformly applying a raw material composition to the groove portion 14 and performing ultraviolet (UV) irradiation and / or heat treatment. In one example, the raw material composition may include siloxane, acetate, acetal, urethane, or amide-based monomers, base oligomers, or prepolymers, and may also include a curing agent, a curing catalyst, a photoinitiator, a solvent, and the like. Examples of siloxane-based prepolymers include polydimethylsiloxane, polydiphenylsiloxane, and polyphenylmethylsiloxane. As the curing agent, an isocyanate or an amine-based compound can be used. The raw material composition may optionally include a reinforcing agent, an adhesion enhancer, a chain extender, and the like.

[0048] The raw material composition may be a first composition containing a polydimethylsiloxane prepolymer, a curing agent, and a curing catalyst, or alternatively, the raw material composition may be a composition containing a polydimethylsiloxane prepolymer and a curing catalyst and a second composition obtained by mixing a polydimethylsiloxane prepolymer, a curing catalyst, and other additives at a certain ratio.

[0049] The polymer layer of the protection device 20 may be an elastic layer, may include a UV-cured polymer resin, or may include a polymer resin having acid resistance and heat resistance. In one example, the polymer resin may include a siloxane-based polymer, polyvinyl acetate, polyvinyl acetal, polyvinyl butyral, polyurethane, polyether block amide, and the like. Examples of the siloxane-based polymer may include polydimethylsiloxane, polydiphenylsiloxane, and polyphenylmethylsiloxane. Polyvinyl acetate may have vinyl acetate at 20% to 50% by weight. The polyvinyl butyral may be a soft one containing a plasticizer. The polyurethane may be a thermosetting, thermoplastic, or foamed polyurethane.

[0050] According to the standard of ASTM D3359, the adhesion strength between the protection device 20 and the groove 14 of the glass substrate 10 may be 5B. 5B means that no peeling area occurs when the adhesion test according to ASTM D3359 is substantially performed. Also, the protection device 20 may have a pencil hardness of HB or more, or H or less according to ASTM D3363. By having such adhesion strength and hardness, peeling of the protection device 20 can be effectively prevented, and the glass substrate 10 can be stably protected during the conveyance of the substrate 100.

[0051] The protection device 20 may have an elastic modulus of 0.5 MPa to 4 MPa, or 1.8 MPa to 4 MPa.

[0052] The protection device 20 may have a thermal conductivity of 0.1 W / mk to 0.37 W / mk.

[0053] The protection device 20 may have an insulation resistance of 14 kV / mm to 24 kV / mm.

[0054] The protection device 20 may have a dielectric constant of 2 to 4 at 100 kHz.

[0055] The protection device 20 may have a coefficient of thermal expansion of 220 ppm / °C to 460 ppm / °C.

[0056] The protection device 20 may have a tensile strength of 5.5 MPa to 7.9 MPa.

[0057] Based on a thickness of 20 μm, the protection device 20 may have a total light transmittance of 87% or more, or 89% or more with respect to visible light. The total light transmittance may be 95% or less. By having such a total light transmittance, problems such as the occurrence of interference due to the addition of the protection device can be prevented.

[0058] When performing 3 to 10 damage tests on the protection device 20 in contact with a pin having a cross-section corresponding to the cross-section of the groove portion 14 by applying a pressure of 1.1 bar for 1 second, the substrate 100 may not cause substantial damage to the glass substrate 10. The substrate 100 may not have substantial damage to the glass substrate and may not break even after performing at least 50 damage tests. Here, the degree of damage or breakage means a state where no cracks or fractures occur when the glass substrate is observed with the naked eye. A substrate having such characteristics can minimize the impact that may occur during transportation or processing via a transportation device such as a pin, and prevent breakage and the like.

[0059] Referring to FIG. 4, the substrate 100 may further include a third groove portion formed along the circumferential direction of the edge region in the edge region excluding the groove portion 14, and may further include a third protection device (not shown) formed on the third groove portion. In one example, the third groove portion may have a shape recessed in the central direction of the first surface 11 or the second surface 12 in the edge region excluding the groove portion.

[0060] When the glass substrate 10 is applied as a substrate for a package, the wiring length between the element and the printed circuit board can be shortened.

[0061] Examples of glass applicable as the glass substrate 10 include, but are not limited to, tempered glass, borosilicate glass, and alkali-free glass. The glass substrate 10 may not substantially contain an organic substrate.

[0062] There may be substantially no separate adhesive or the like between the glass substrate 10 and the protection device 20.

[0063] The glass substrate 10 may have a thickness of 2000 μm or less, 100 μm to 1500 μm, or 100 μm to 1000 μm. A glass substrate having such a thickness can further improve the efficiency of electrical signal transmission and maintain appropriate mechanical properties in a state where the protection device 20 is disposed.

[0064] The glass substrate 10 may further include a plurality of vias having some paths formed in the thickness direction and other vias having paths formed in a direction substantially perpendicular to the thickness direction.

[0065] The glass substrate 10 may include a through via penetrating the first surface 11 and the second surface 12.

[0066] The glass substrate 10 may include a conductive wire or a conductive layer disposed on at least a part of the glass substrate 10, and may include a conductive layer that electrically connects the first surface 11 and the second surface 12 via core vias, vias, etc.

[0067] The first surface 11 and / or the second surface 12 of the glass substrate 10 may include a circuit pattern, and the surface opposite to the surface on which the elements are disposed may be electrically connected to a printed circuit board via an electrical connection device such as a lead frame or a solder ball.

[0068] The glass substrate 10 may include a separately prepared cavity device, and the cavity device may be disposed in the empty space inside the glass substrate.

[0069] A passive element may be disposed inside the glass substrate 10, and the passive element may be disposed in a cavity inside the glass substrate 10.

[0070] The substrate 100 may include an upper rewiring layer on one surface 11 and may include a lower rewiring layer under the other surface 12.

[0071] The substrate 100 may have a groove portion 14 and a protection device 20 disposed across the edge region 13, the first surface 11, and the second surface 12, thereby reinforcing the durability of the relatively fragile edges during processes such as conveyance and processing in the packaging process and further improving productivity.

[0072] Package substrate In one example, the package substrate according to one or more embodiments may include the above-described substrate 100 and elements disposed on one surface 11 of the substrate.

[0073] The package substrate may further include a lead frame that protects the elements from the external environment and assists in the heat dissipation treatment of the first surface 11. A thermally conductive filler may be filled between the element and the lead frame, and the bonding surface between the element and the lead frame may be treated by soldering.

[0074] Method for manufacturing a substrate In one or more embodiments, the method for manufacturing a substrate according to the embodiment may include the steps of preparing a glass substrate including a first surface, a second surface, and an edge region connecting the first surface and the second surface; forming a groove portion from a part of the edge region toward the inner direction of the glass substrate; and applying a raw material composition on the groove portion and performing a curing treatment.

[0075] The step of forming the groove portion 14 may form the groove portion 14 so as to penetrate the first surface and the second surface, and the groove portion may be formed by cutting, laser processing, chemical etching after laser processing, or the like.

[0076] Note that the specific shape of the groove portion 14 formed by the step of forming the groove portion 14 is the same as the description of the above-described substrate 1100, so redundant descriptions are omitted.

[0077] The curing treatment step may be performed by applying a raw material composition on the groove portion to a predetermined thickness and then performing heat treatment and / or ultraviolet irradiation.

[0078] In the curing treatment operation step, the raw material may have a viscosity of 10000 cPs or less, or 1000 cPs or more, and preferably may have a viscosity of 2000 cPs to 5000 cPs. Any viscosity within the viscosity range that is easy to penetrate into the internal region of the package and does not cause contamination is applicable.

[0079] The materials that can be included in the raw materials of the curing treatment stage are the same as those described for the substrate above, so duplicate descriptions are omitted.

[0080] The heat treatment in the curing treatment stage may be carried out at a temperature of 20°C to 180°C. Also, it may be carried out at a temperature of 150°C to 180°C for 5 minutes to 30 minutes, or at a temperature of 100°C to 150°C for about 10 minutes to 50 minutes.

[0081] The UV irradiation in the curing treatment stage may irradiate with UV having a wavelength range of 320 nm to 380 nm at an energy density of 800 mJ / mm 2 ~1400 mJ / mm 2 or at an energy density of 1000 mJ / mm 2 ~1200 mJ / mm 2 By performing the photocuring treatment under such conditions, a protective device with good adhesive strength and physical properties can be formed.

[0082] The UV irradiation in the curing treatment stage may be 10 seconds or more and 3 minutes or less, preferably 20 seconds to 1 minute, but the conditions are not necessarily limited to this. Furthermore, additional UV irradiation may be performed after the heat treatment. By such UV irradiation, the generation of dust and impurities after curing can be minimized. Also, when a material with weak ultraviolet resistance is included in the semiconductor package process, UV irradiation may be excluded from the process.

[0083] Hereinafter, the examples will be described in more detail with reference to the examples, but it should be noted that the examples are not limited thereto.

[0084] Example - Substrate A rectangular glass substrate 10 with a thickness of 500 μm was prepared. As shown in FIG. 6, on the first edge of the glass substrate and the second edge opposite thereto, a groove portion 14 having a semi-circular cross-section with a diameter of 1.5 mm was formed by laser etching. SYLGARD 184, which is a raw material composition containing a polydimethylsiloxane prepolymer with a viscosity of 3500 cPs or less obtained from DOW CHEMICAL, was uniformly applied onto the groove portion to a thickness of 270 μm, and heat treatment was performed at a temperature of 150 °C for 10 minutes. Then, the coated portion was irradiated with UV having a wavelength of 350 nm and an energy density of 1100 mJ / mm 2 for 1 minute for photocuring treatment, and a protective element 20 containing polydimethylsiloxane (PDMS) was formed as shown in FIG. 9.

[0085] Comparative Example - Substrate without Protective Device A glass substrate excluding the protective device 20 from the above-described example was prepared.

[0086] Experimental Example - Damage Test of Groove Portion A damage test was conducted on the groove portions of the glass substrate 100 manufactured in the above example and the glass substrate manufactured in the comparative example by applying a pressure of 1.1 bar for 1 second with a stainless steel pin having a diameter of 1.5 mm having the same cross-section as the groove portion and contacting the groove portion.

[0087] In the example in which the protective device 20 is provided in the groove portion 14, as shown in FIG. 8, it was confirmed that no damage occurred even when the damage test was performed 50 times. In the comparative example without the protective device, as shown in FIG. 7, it was confirmed that cracks occurred around the groove portion after 3 damage tests.

[0088] Experimental Example - Adhesion, Hardness, and Transmittance Tests of Protective Device for Substrate The adhesive strength of the shock prevention device for the glass substrate 10 manufactured in the examples was measured as follows using a system for measuring adhesive strength manufactured by KTA-TARTO in accordance with ASTM D3359-97: Six lines were drawn in the width direction and six lines were drawn in the length direction on the first surface of the protection device to form a grid. After attaching a test tape onto this grid, the test tape was peeled off at 180°, and the degree of peeling between the protection device and the test tape was confirmed. Also, the pencil hardness of the shock prevention protection device for the glass substrate was measured using a pencil hardness tester manufactured by KIPAE E&T and a pressure-proofed hi-density lead pencil manufactured by Mitsubishi Corporation.

[0089] Specifically, the protection device was fixed on the glass substrate of the pencil hardness tester facing upward, and after installing the Mitsubishi pencil so as to form a 45° angle with the surface of the protection device, the hardness was judged based on the presence or absence of scratches when the surface of the protection device was scratched five times with 1 kgf applied. In one example, the pencil hardness value when no scratches occurred was used as the test value, and the total light transmittance of visible light of the protection device was measured.

[0090] As a measurement result, the adhesive strength between the protection device and the glass substrate was 5B (no loss occurred), the pencil hardness of the protection device was HB, and the total light transmittance of the protection device was 89%.

[0091] This disclosure includes specific embodiments. After understanding the disclosure of this application, it will be apparent to those skilled in the art that various changes in form and detail can be made in these embodiments without departing from the spirit and scope of the claims and their equivalents. The embodiments described herein should be considered in an illustrative sense only and not for purposes of limitation. The description of features or aspects in each embodiment is to be regarded as applicable to similar features or aspects in other embodiments. Appropriate results may be achieved if the described techniques are performed in a different order and / or if the components in the described system, architecture, device, or circuit are combined in a different manner and / or if they are replaced or supplemented with other components or their equivalents.

[0092] Accordingly, the scope of this disclosure is defined not by the detailed description but by the claims and their equivalents, and all changes within the scope of the claims and their equivalents are to be construed as being included in this disclosure.

Claims

1. A substrate, comprising: a glass substrate including a first surface, a second surface, and an edge region connecting the first surface and the second surface; and a protection device, further comprising a groove portion penetrating the first surface and the second surface toward the inside of the glass substrate, wherein the groove portion is configured to form an arc having a constant diameter over the entire surface of the groove portion when the first surface is viewed from above or the second surface is viewed from below, the protection device is disposed at least in part in the edge region and in the groove portion, and a minimum thickness of the protection device is 5 μm or more. A substrate characterized by the above.

2. At least one of the first surface and the second surface of the glass substrate is configured to have a shape from a quadrilateral to an octagon, the glass substrate includes a through via penetrating the first surface and the second surface, and the glass substrate includes at least one of a conductive wire and a conductive layer in a part thereof. The substrate according to claim 1, characterized by the above.

3. The protection device includes a first protection device and a second protection device that are distinguishable from each other, the first protection device is disposed in an edge region in contact with a first side of the first surface, the second protection device is disposed in an edge region in contact with a second side of the first surface, and the first side and the second side face each other. The substrate according to claim 1, characterized by the above.

4. The groove portion includes a first groove portion and a second groove portion that are distinguishable from each other, and the first groove portion and the second groove portion are disposed to face each other with the first surface or the second surface therebetween. The substrate according to claim 1, characterized by the above.

5. The protection device includes a polymer layer having a total light transmittance of 87% or more. The substrate according to claim 1, characterized by the above.

6. The polymer layer is an elastic layer, and an adhesion strength between the protection device and the glass substrate according to ASTM D3359 is 5B. The substrate according to claim 5, characterized by the above.

7. Even when an impact with a pressure of 1.1 bar is applied three times so as to directly contact the protection device with a pin having a cross section corresponding to a cross section of the groove portion, substantially no damage occurs to the glass substrate of the substrate. The substrate according to claim 1, characterized by the above.

8. Even if an impact with a pressure of 1.1 bar is applied 50 times so as to directly contact the protection device with a pin having a cross-section corresponding to the cross-section of the groove portion, the glass substrate of the substrate is not substantially damaged. The substrate according to claim 1, characterized in that.

9. The groove portion has a shape corresponding to either one of the circumferences of a circle or an ellipse and an arc. The distance from at least one point of the groove portion to the edge region is 1 mm to 15 mm. The substrate according to claim 1, characterized in that.

10. The protection device has a pencil hardness of HB or more according to ASTM D3363. The substrate according to claim 1, characterized in that.

11. The polymer layer contains an ultraviolet (UV) curable resin. The substrate according to claim 5, characterized in that.

12. The glass substrate includes a cavity unit disposed on a part of the glass substrate. The thickness between the first surface and the second surface of the cavity unit is thinner than the thickness between the first surface and the second surface of the glass substrate. The substrate according to claim 1, characterized in that.

13. The glass substrate includes an upper rewiring layer on the first surface. The substrate according to claim 1, characterized in that it includes a lower rewiring layer under the second surface.

14. A semiconductor substrate, A semiconductor substrate comprising the substrate according to claim 1 and a semiconductor element mounted on the substrate.

Images