Apparatus, System, and Method for Detecting a Kissing Bond of a Joining Joint

Abstract

To provide apparatuses, systems and methods for detecting kissing bonds in bonded joints.SOLUTION: Disclosed herein is a detection assembly for detecting kissing bonds in a bonded joint of a part. The detection assembly comprises an electromagnetic shockwave generator that is configured to generate an electromagnetic shockwave through a target portion of the bonded joint. The electromagnetic shockwave has intensity sufficient to induce a separation of a kissing bond in the target portion of the bonded joint and insufficient to induce separation of a healthy bond adjacent to the kissing bond in the target portion. The detection assembly also comprises an ultrasonic sensor that is configured to generate a transmitted ultrasonic pulse, direct the transmitted ultrasonic pulse into the target portion of the bonded joint, and receive a received ultrasonic pulse from the target portion of the bonded joint in response to the electromagnetic shockwave generator generating the electromagnetic shockwave through the target portion of the bonded joint.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure generally relates to non-destructive inspection of components, and more specifically, to an apparatus, system, and method for detecting kissing bonds in component joints.

Background Art

[0002] Within a component joint, a kissing bond is one where the bond is in close proximity to or in direct contact with the bonding layer, but is not bonded to one or both of the bonding layers, or the bond strength of the bond is below an acceptable level. In many conventional inspection techniques, a kissing bond appears like a sound bond. However, the bonding performance of a kissing bond is inferior to that of a sound bond. Therefore, detecting a kissing bond in a component is desirable to ensure that the component functions as expected.

Summary of the Invention

Problems to be Solved by the Invention

[0003] Conventional systems and methods for detecting kissing bonds in joints are inaccurate, complex, expensive, or destructive for commercial use. For example, the detection results of kissing bonds by shearography and mechanical testing are verified by destructive testing of components. In other examples, thermography tests do not yield effective results in thick parts or parts with a metal core, the lamb wave testing method is less affected by kissing bonds and gives inconsistent and non-reproducible results, the non-linear ultrasonic method uses two-sided access points, has low accuracy, and is difficult to implement on actual components, and laser bond inspection technology is large-scale and costly to set up. Therefore, an inspection technology that can accurately, simply, inexpensively, and non-destructively detect kissing bonds is desired.

Means for Solving the Problems

[0004] The subject matter of the present application has been developed to address the current state of the art, and in particular, to address the drawbacks of conventional systems and methods for detecting kissing bonds in component joints that are not yet fully resolved by currently available technologies. Accordingly, the subject matter of the present application has been developed to provide an apparatus, system, and method for detecting kissing bonds in component joints that overcome at least some of the above-mentioned drawbacks of the prior art.

[0005] The following is a non-exhaustive list of examples of the subject matter disclosed herein that may or may not be claimed in the patent.

[0006] Disclosed herein is a detection assembly for detecting kissing bonds in a component joint. The detection assembly includes an electromagnetic shockwave generator configured to generate an electromagnetic shockwave passing through a target portion of the joint. The electromagnetic shockwave is sufficient to induce separation of the kissing bond at the target portion of the joint and has an intensity insufficient to induce separation of a sound bond adjacent to the kissing bond at the target portion. The detection assembly also includes an ultrasonic sensor configured to generate a transmitted ultrasonic pulse in response to the electromagnetic shockwave generator generating an electromagnetic shockwave passing through the target portion of the joint, direct the transmitted ultrasonic pulse towards the target portion of the joint, and receive a received ultrasonic pulse from the target portion of the joint. The foregoing subject matter of this paragraph characterizes Example 1 of the present disclosure.

[0007] The detection assembly is movable along the component. The foregoing subject matter of this paragraph characterizes Example 2 of the present disclosure, and Example 2 also includes the subject matter according to Example 1 above.

[0008] The electromagnetic shockwave generator and the ultrasonic sensor are fixedly immovable relative to each other. The foregoing subject matter of this paragraph characterizes Example 3 of the present disclosure, and Example 3 also includes the subject matter according to Example 2 above.

[0009] The ultrasonic sensor is integrated with the electromagnetic shock wave generator. The foregoing subject matter of this paragraph characterizes Example 4 of the present disclosure, and Example 4 includes the subject matter according to Example 3 above.

[0010] The electromagnetic shock wave generator comprises an electromagnetic dent remover. The foregoing subject matter of this paragraph characterizes Example 5 of the present disclosure, and Example 5 includes the subject matter according to any one of Examples 1 to 4 above.

[0011] When the electromagnetic shock wave generator generates an electromagnetic shock wave and when the ultrasonic sensor generates a transmitted ultrasonic pulse, the electromagnetic shock wave generator can be in direct contact with the component, direct the transmitted ultrasonic pulse towards the target portion of the joint, and receive the received ultrasonic pulse from the target portion of the joint. The foregoing subject matter of this paragraph characterizes Example 6 of the present disclosure, and Example 6 includes the subject matter according to any one of Examples 1 to 5 above.

[0012] Further disclosed herein is a system for detecting kissing bonds in a joint of a component. The system comprises a detection assembly including an electromagnetic shock wave generator. The electromagnetic shock wave generator is configured to generate an electromagnetic shock wave passing through the target portion of the joint. The electromagnetic shock wave is sufficient to induce separation of the kissing bond at the target portion of the joint and has an intensity insufficient to induce separation of a sound bond adjacent to the kissing bond at the target portion. The detection assembly also comprises an ultrasonic sensor configured to generate a transmitted ultrasonic pulse in response to the electromagnetic shock wave generator generating an electromagnetic shock wave passing through the target portion of the joint, direct the transmitted ultrasonic pulse towards the target portion of the joint, and receive a received ultrasonic pulse from the target portion of the joint. The system also comprises a controller configured to synchronize the generation of the transmitted ultrasonic pulse with the generation of the electromagnetic shock wave. The foregoing subject matter of this paragraph characterizes Example 7 of the present disclosure.

[0013] The controller comprises an EM shock wave module and an ultrasonic sensing module. The EM shock wave module is configured to send a shock wave command to an electromagnetic shock wave generator. The electromagnetic shock wave generator is configured to generate an electromagnetic shock wave in response to receiving the shock wave command. The ultrasonic sensing module is configured to automatically send an ultrasonic command to an ultrasonic sensor in response to the transmission of the shock wave command by the EM shock wave module. The ultrasonic sensor is configured to generate a transmitted ultrasonic pulse in response to receiving the ultrasonic command. The foregoing subject matter of this paragraph characterizes Example 8 of the present disclosure, and Example 8 also includes the subject matter according to Example 7 above.

[0014] The ultrasonic sensor is further configured to transmit ultrasonic data corresponding to one or more characteristics of the received ultrasonic pulse received by the ultrasonic sensor. The ultrasonic sensing module is further configured to detect a kissing bond of the joint at least based on the ultrasonic data. The foregoing subject matter of this paragraph characterizes Example 9 of the present disclosure, and Example 9 also includes the subject matter according to Example 8 above.

[0015] The electromagnetic shock wave generator and the ultrasonic sensor form a probe head. This system further comprises a robot. The probe head is fixed to a component by the robot and is movable along the component. The foregoing subject matter of this paragraph characterizes Example 10 of the present disclosure, and Example 10 also includes the subject matter according to any one of Examples 7-9 above.

[0016] Further disclosed herein is a method for detecting kissing bonds in a component joint. The method includes generating an electromagnetic shock wave passing through a target portion of the joint. The electromagnetic shock wave is sufficient to induce separation of the kissing bond at the target portion of the joint and has an intensity insufficient to induce separation of a sound bond adjacent to the kissing bond at the target portion. The method also includes generating a transmitted ultrasonic pulse in response to generating an electromagnetic shock wave passing through a target portion of the joint, directing the transmitted ultrasonic pulse toward the target portion of the joint, and receiving a received ultrasonic pulse from the target portion of the joint. The foregoing subject matter of this paragraph characterizes Example 11 of the present disclosure.

[0017] The method further includes identifying at least one characteristic of the received ultrasonic pulse, performing a comparison between at least one characteristic of the received ultrasonic pulse and at least one predetermined characteristic, and determining the presence or absence of a kissing bond in the target portion of the joint based on the comparison. The foregoing subject matter of this paragraph characterizes Example 12 of the present disclosure, and Example 12 also includes the subject matter according to Example 11 above.

[0018] At least one characteristic of the received ultrasonic pulse includes the measured signal response of the received ultrasonic pulse. The at least one predetermined characteristic includes a predetermined signal response. If the measured signal response is equal to the predetermined signal response, it is determined that no kissing bond is present. If the measured signal response is not equal to the predetermined signal response, it is determined that a kissing bond is present. The foregoing subject matter of this paragraph characterizes Example 13 of the present disclosure, and Example 13 also includes the subject matter according to Example 12 above.

[0019] The component is made of a conductive material. The foregoing subject matter of this paragraph characterizes Example 14 of the present disclosure, and Example 14 also includes the subject matter according to any one of Examples 11 - 13 above.

[0020] Electromagnetic shock waves are generated by an electromagnetic shock wave generator. When the electromagnetic shock wave generator generates an electromagnetic shock wave and when a transmitted ultrasonic pulse is generated, the electromagnetic shock wave generator is in direct contact with the component, the transmitted ultrasonic pulse is directed towards the target portion of the joint, and the received ultrasonic pulse is received from the target portion of the joint. The foregoing subject matter of this paragraph characterizes Example 15 of the present disclosure, and Example 15 also includes the subject matter according to any one of Examples 11 to 14 above.

[0021] The method further includes determining the intensity of the electromagnetic shock wave sufficient to induce separation of the kissing bond at the target portion of the joint by generating a test electromagnetic shock wave passing through the target portion of the joint of the test component and incrementally increasing the intensity of each of the test electromagnetic shock waves while monitoring the test component for visual signs of anomalies. The foregoing subject matter of this paragraph characterizes Example 16 of the present disclosure, and Example 16 also includes the subject matter according to any one of Examples 11 to 15 above.

[0022] The step of determining the intensity of the electromagnetic shock wave sufficient to induce separation of the kissing bond at the target portion of the joint further includes measuring the temperature of the test component each time the intensity of the test electromagnetic shock wave is increased and waiting to generate the next one of the test electromagnetic shock waves until the temperature of the test component is below a predetermined threshold temperature. The foregoing subject matter of this paragraph characterizes Example 17 of the present disclosure, and Example 17 also includes the subject matter according to Example 16 above.

[0023] The step of determining the intensity of the electromagnetic shock wave sufficient to induce separation of the kissing bond at the target portion of the joint further includes inspecting the test portion for structural anomalies. The foregoing subject matter of this paragraph characterizes Example 18 of the present disclosure, and Example 18 also includes the subject matter according to any one of Examples 16 to 17 above.

[0024] Electromagnetic shock waves are generated by an electromagnetic shock wave generator. Transmission ultrasonic pulses are generated by an ultrasonic sensor. The transmission ultrasonic pulses are directed by the ultrasonic sensor. Received ultrasonic pulses are received by the ultrasonic sensor. The method further includes moving an electromagnetic shock wave generator and an ultrasonic sensor together to a position where the electromagnetic shock wave is in direct contact with a target portion of the joint. The foregoing subject matter of this paragraph characterizes Example 19 of the present disclosure, and Example 19 also includes the subject matter according to any one of Examples 11-18 above.

[0025] The joint of the component includes a first layer joined to a second layer by a bond. The bond within the target portion of the joint includes a kissing bond. The electromagnetic shock wave separates the first layer from the second layer at the kissing bond to form a void between the first layer and the second layer. Although the first layer and the second layer are separated by the electromagnetic shock wave, at least a part of the transmission ultrasonic pulse is reflected by the void to form a received ultrasonic pulse. The foregoing subject matter of this paragraph characterizes Example 20 of the present disclosure, and Example 20 also includes the subject matter according to any one of Examples 11-19 above.

[0026] The described forms, structures, advantages, and / or characteristics of the subject matter of the present disclosure can be combined in any suitable way in one or more examples and / or implementations. In the following description, many specific details are provided to give a complete understanding of the examples of the subject matter of the present disclosure. Those skilled in the relevant art will recognize that the subject matter of the present disclosure can be implemented without using one or more of the specific forms, details, components, materials, and / or methods of a specific example or implementation. In other examples, additional forms and advantages may be recognized in specific examples and / or implementations where they may not be present in all examples or implementations. Further, in some cases, well-known structures, materials, or operations are not shown in detail or described in order to avoid obscuring aspects of the subject matter of the present disclosure. The forms and advantages of the subject matter of the present disclosure will become more fully apparent from the following description and the appended claims, or may be learned by practicing the subject matter described below.

[0027] To make it easier to understand the advantages of the subject matter, a more specific description of the subject matter briefly described above is provided by reference to specific examples shown in the accompanying drawings. These drawings are not necessarily drawn to scale and show only specific examples of the subject matter and are therefore not to be considered as limiting its scope, and the subject matter is described using the drawings with additional specificity and detail.

Brief Description of the Drawings

[0028]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Mode for Carrying Out the Invention

[0029] Throughout this specification, references to "an example", "example", or similar language mean that a particular form, structure, or characteristic described in connection with the example is included in at least one example of the disclosure. The appearances of the phrases "in one example" and "in an example", and similar language throughout this specification, may, but do not necessarily, all refer to the same example. Similarly, the use of the term "implementation" means an implementation having a particular form, structure, or characteristic described in connection with one or more examples of the disclosure, but an implementation may be associated with one or more examples where there is no clear correlation indicating otherwise.

[0030] The detection assemblies, systems, and methods disclosed herein enable the detection of kissing bonds in a joint. Current systems and methods used to detect kissing bonds in joints are inaccurate, complex, expensive, or destructive for commercial use. The systems and methods of this application provide an accurate, simple, inexpensive, and non-destructive technique for detecting kissing bonds in joints. Accordingly, the systems and methods of this application facilitate a wider use of bonding, particularly adhesive bonding, in high-precision and high-performance industries such as the aerospace industry.

[0031] Referring to FIG. 1, according to one example, a system 100 for detecting a kissing bond 148 within a joint 136 of a component 130 is shown. The component 130 can be any of a variety of components of any of a variety of structures. In some examples, the component 130 forms all or part of a vehicle such as an aircraft, a motor vehicle, a ship, a spacecraft, etc. According to other examples, the component 130 forms all or part of a non-mobile structure such as a building, a bridge, a tower, etc. The joint 136 of the component 130 includes a first layer 132, a second layer 134, and a bond 138 between the first layer 132 and the second layer 134. The bond 138 joins the first layer 132 to the second layer 134 or vice versa. Generally, the bond 138 defines a bond line between the first layer 132 and the second layer 134. In a particular example, the bond 138 is configured to permanently join the first layer 132 and the second layer 134. In one example, the bond 138 is an adhesive bond made of an adhesive material such as epoxy, resin, or an adhesive. In another example, the bond 138 is a thermal bond or weld consisting of the molten materials of the first layer 132 and the second layer 134 and optionally a filler material. Thus, the bond 138 can be made of the same material or a different material than the materials of the first layer 132 and the second layer 134.

[0032] The first layer 132 and the second layer 134 are made of a conductive material. As used herein, a conductive material is a material that enables the transmission of an electromagnetic shock wave through the material. In some examples, the first layer 132 and / or the second layer 134 are made at least in part of a metallic material. In other examples, the first layer 132 and / or the second layer 134 are made at least in part of a graphite fiber reinforced polymer material such as a carbon fiber reinforced polymer material or a metal fiber reinforced polymer material.

[0033] As used herein, a kissing bond 148 is a part of a bond 138 where the bond 138 is in close proximity to or in direct contact with the first layer 132 and the second layer 134, but (1) is not joined to one or both of the first layer 132 and the second layer 134; or (2) the bond strength of the bond 138 is below an acceptable level. In other words, in many conventional inspection techniques, the kissing bond 148 appears to be a sound bond. However, the bonding performance of the kissing bond 148 is inferior to that of a sound bond. For this reason, in order to facilitate the expected performance of a component, a manufacturer is encouraged to detect the presence of a kissing bond in a new component before operating the new component, and an operator of an already operating component is encouraged to detect the presence of a kissing bond in such an in-use component.

[0034] System 100 is configured to detect the presence of a kissing bond in a component joint in an accurate, simple, and inexpensive manner. System 100 includes a detection assembly 110 and a controller 120. The detection assembly 110 includes an electromagnetic shock wave generator 114 and an ultrasonic sensor 116. The electromagnetic shock wave generator 114 and the ultrasonic sensor 116 cooperate to create and detect a void 135 (e.g., a small air gap) within the joint 136. Detection of the void 135 by the detection assembly 110 indicates the presence of a kissing bond 148 within the joint 136 at the location of the void 135. When a kissing bond 148 is detected by the detection assembly 110, in some examples, the joint 136 is shaved or repaired.

[0035] Referring to FIG. 2, the electromagnetic shock wave generator 114 is configured to generate an electromagnetic shock wave 150 through a target portion 131 of the joint 136. The target portion 131 of the joint 136 is any target portion of the joint 136 where inspection of the kissing bond is desired. The target portion 131 occupies a corresponding target region on the first surface 140 or the second surface 142 of the joint 136. The target portion 131 is identified in the figure between the virtual dashed lines.

[0036] In some examples, the electromagnetic shock wave generator 114 is an electric device that can generate an electromagnetically shock wave with a selectively controllable intensity passing through the joint 136. According to one example, the electromagnetic shock wave generator 114 generates an electromagnetic shock wave 150 using electricity by utilizing an electromagnetic field as a force field to generate a tensile force. Thus, in some examples, the electromagnetic shock wave generator 114 includes an electromagnetic dent remover designed to remove dents in a metal panel.

[0037] The basic operating procedure of the electromagnetic shock wave generator 114 (e.g., dent remover) includes discharging two capacitor banks of the electromagnetic shock wave generator 114 into the coil of the electromagnetic shock wave generator 114. During operation, two capacitors (a low-speed bank and a high-speed bank) are charged, the coil is positioned relative to the target structure, and the capacitors are activated by a series of triggers. During the activation process, the low-speed bank generates a magnetic field in the material. After about 2 milliseconds, the high-speed bank capacitor is dumped (activated) into the coil circuit in the opposite direction. Thus, since the low-speed bank tries to stop the current flow or instantaneously change the current flow, the magnetic fields of the coil and the material are removed. The magnetic field is instantaneously cut in half inside and on the surface of the coil. According to the principle of steady-state energy, the material generates its own eddy currents to maintain the current energy state. As a result, a differential magnetic field (force) is generated from the front coil to the rear of the material (see, for example, FIG. 1), and thus a tension pulse is generated toward the coil surface, thereby pulling the first layer 132 (e.g., dent).

[0038] Thus, the electromagnetic shock wave 150 includes electrical components and magnetic components. The electromagnetic shock wave 150 is generated and transmitted as a relatively short pulse. Thus, the electromagnetic shock wave generator 114 does not generate a continuous electromagnetic shock wave. Rather, the electromagnetic shock wave 150 is, in some examples, an electromagnetic pulse with a short duration, such as between 1 millisecond and 3 milliseconds.

[0039] The electromagnetic shock wave generator 114 is controlled to generate an electromagnetic shock wave 150 that is sufficient to induce separation of the kissing bond 148 at the target portion 131 and has an intensity insufficient to induce separation of the sound bond 149 adjacent to the kissing bond 148 at the target portion 131. An electromagnetic shock wave 150 having such an intensity temporarily separates the kissing bond 148 in the target portion 131 to form a void 135 while keeping the sound bond 149 intact and unaffected. In some examples, the intensity of the electromagnetic shock wave 150 is proportional to the voltage of the pulse of power supplied to the electromagnetic shock wave generator 114. Thus, the intensity of the electromagnetic shock wave 150 can be adjusted by adjusting the voltage of the supplied power pulse. The separation of the kissing bond 148 is caused by the tensile force generated by the electromagnetic shock wave 150 as the electromagnetic shock wave 150 passes through the target portion 131, acting on the kissing bond 148 to effectively pull it apart. The tensile force is generated in response to the electromagnetic shock wave 150 that electromagnetically interacts with the conductive materials of the first layer 132 and the second layer 134. Further, the tensile force is proportional to the intensity of the electromagnetic shock wave 150.

[0040] The separation of the kissing bond 148 to form the void 135 can occur in several ways. In one example, the kissing bond 148 separates at the bond interface between the bond 138 and the first layer 132, and as a result, the void 135 is directly defined between the bond 138 and the first layer 132. In another example, as shown in FIG. 2, the kissing bond 148 separates at the bond interface between the bond 138 and the second layer 134, and as a result, the void 135 is directly defined between the bond 138 and the second layer 134. According to another example, if the bond 138 contains internal weakness or anomalies, the kissing bond 148 separates from within the bond 138, thus creating two separated portions of the bond 138, and as a result, the void 135 is directly defined between the separated portions of the bond 138.

[0041] Referring to FIG. 3, the ultrasonic sensor 116 of the detection assembly 110 generates a transmitted ultrasonic pulse 152 in response to the electromagnetic shock wave generator 114 generating an electromagnetic shock wave 150 passing through the target portion 131 of the joint 136, directs the transmitted ultrasonic pulse 152 towards the target portion 131 of the joint 136, and is configured to receive a received ultrasonic pulse 154 from the target portion 131 of the joint 136. Thus, the ultrasonic sensor 116 includes an ultrasonic pulse generator and an ultrasonic pulse detector. In some examples, the ultrasonic pulse generator and the ultrasonic pulse detector are physically separated transducers from each other. For example, the ultrasonic pulse generator can be a stand-alone ultrasonic transmitter, and the ultrasonic pulse detector can be a stand-alone ultrasonic receiver. However, in other examples, the ultrasonic pulse generator and the ultrasonic pulse detector are integrated into the same transducer. For example, the ultrasonic sensor 116 can include an ultrasonic transceiver. In a particular example, the ultrasonic sensor 116 includes an array of ultrasonic pulse generators (e.g., transducers) and an array of ultrasonic pulse detectors (e.g., transducers).

[0042] Regardless of whether there is one or a plurality of ultrasonic pulse generators, each ultrasonic pulse generator is configured to convert power into transmitted ultrasonic pulse 152, and regardless of whether there is one or a plurality of ultrasonic pulse detectors, each ultrasonic pulse detector is configured to convert received ultrasonic pulse 154 into an electrical signal. In some examples, each ultrasonic pulse generator and / or receiver is a piezoelectric transducer or a capacitive transducer. A piezoelectric transducer for generating transmitted ultrasonic pulse 152 includes one or more piezoelectric crystals that change size and / or shape when power is applied, whereby the crystals vibrate and transmitted ultrasonic pulse 152 is generated. In contrast, a piezoelectric transducer for detecting received ultrasonic pulse 154 includes one or more piezoelectric crystals that generate a voltage when acted upon (e.g., vibrated) by received ultrasonic pulse 154. In some examples, as described, the crystals of one or more piezoelectric transducers vibrate to generate transmitted ultrasonic pulse 152 or vibrate in the presence of received ultrasonic pulse 154 to detect received ultrasonic pulse 154.

[0043] As shown in FIGS. 3 and 4, ultrasonic sensor 116 is, in some examples, a pulse echo (PE) ultrasonic sensor. Thus, the ultrasonic pulse detector of ultrasonic sensor 116 is disposed on the same side as the ultrasonic pulse generator of component 130 (e.g., adjacent to the first surface 140 of component 130). When kiss bond 148 is present, at least a portion of transmitted ultrasonic pulse 152 directed toward target portion 131 is reflected by void 135 formed when kiss bond 148 is separated. The portion of transmitted ultrasonic pulse 152 reflected by void 135, which can be defined as an ultrasonic echo, becomes received ultrasonic pulse 154. The remaining portion of transmitted ultrasonic pulse 152 passes through the remaining portion of target portion 131 of joint 136 of component 130. The ultrasonic pulse detector of ultrasonic sensor 116 on the same side as the ultrasonic pulse generator of component 130 is positioned to receive and detect received ultrasonic pulse 154.

[0044] As shown in FIG. 5, in some examples, the ultrasonic sensor 116 is a transmission type ultrasonic (TTU) sensor. Thus, the ultrasonic sensor 116 includes a transmission portion 117A disposed adjacent to the first surface 140 of the component 130 and a detection portion 117B disposed on the opposite side of the component 130 (e.g., adjacent to the second surface 142 of the component 130). When a kissing bond 148 is present, at least a part of the transmitted ultrasonic pulse 152 directed toward the target portion 131 is reflected by the void 135 formed when the kissing bond 148 is separated, or blocked by the void 135. The portion of the transmitted ultrasonic pulse 152 that is not blocked by the void 135 and passes through the void 135 becomes the received ultrasonic pulse 154. The detection portion 117B of the ultrasonic sensor 116 on the side opposite to the transmission portion 117A of the ultrasonic sensor 116 of the component 130 is at a position to receive and detect the received ultrasonic pulse 154 passing through the component 130.

[0045] According to some examples, the electromagnetic shock wave generator 114 can be in direct contact with the component 130 when the electromagnetic shock wave generator 114 generates the electromagnetic shock wave 150 and when the ultrasonic sensor 116 generates the transmitted ultrasonic pulse 152, direct the transmitted ultrasonic pulse 152 toward the target portion 131 of the joint 136, and receive the received ultrasonic pulse 154 from the target portion 131 of the joint 136. In one example, the tensile force for separating the kissing bond 148 is generated by utilizing the contact between the electromagnetic shock wave generator 114 and the component 130. The ultrasonic sensor 116 does not necessarily have to be in direct contact with the component 130 to generate and direct the ultrasonic pulse 152 toward the component 130, but in certain examples, both the electromagnetic shock wave generator 114 and the ultrasonic sensor 116 are in direct contact with the component 130.

[0046] In some examples, the detection assembly 110 is movable along the component 130. As used herein, the detection assembly 110 is movable along the component 130 when the detection assembly 110 is not permanently fixed to the component 130 (e.g., not clamped or adhered to the component 130), and can freely move from one location to the next along the component 130, enabling the detection of the kissing bond 148 at multiple locations along the component 130.

[0047] In some examples, the detection assembly 110 is manually movable, such as by being moved by an operator's hand. In such examples, the detection assembly 110 includes a handle that can be grasped by the operator to move the detection assembly 110 relative to the component 130.

[0048] In other examples, the detection assembly 110 is movable in an automated manner. Referring to FIG. 4, the system 100 further includes a robot 170 and a probe head 160 that is fixed to the robot 170 and movable by the robot 170. The robot 170 can be any of a variety of programmable robots, such as a robotic arm having a plurality of links or segments that are independently articulable. The robot 170 is programmed to move the probe head 160 from one location to the next along the component 130. In these examples, the detection assembly 110 forms at least a portion of the probe head 160 such that the robot 170 is configured to move the detection assembly 110 from one location to the next along the component 130. At each location, the detection assembly 110 can detect the presence of the kissing bond 148 within the component 130 before being moved to another location to perform the same kissing bond detection process.

[0049] In some examples, the electromagnetic shock wave generator 114 and the ultrasonic sensor 116 of the detection assembly 110 are fixedly immovable relative to each other. In other words, in some examples, the ultrasonic sensor 116 only moves with the movement of the electromagnetic shock wave generator 114. In one example, as shown in FIG. 4, the ultrasonic sensor 116 is integrated with the electromagnetic shock wave generator 114, such as by coupling the ultrasonic sensor 116 to the housing of the electromagnetic shock wave generator 114.

[0050] According to other examples, the electromagnetic shock wave generator 114 and the ultrasonic sensor 116 of the detection assembly 110 are movable relative to each other. Thus, the electromagnetic shock wave generator 114 and the ultrasonic sensor 116 can move independently of each other to predetermined positions at locations for detecting the kissing bond 148 within the component 130. The separate movements of the electromagnetic shock wave generator 114 and the ultrasonic sensor 116 can be performed manually or autonomously.

[0051] The controller 120 of the system 100 is configured to synchronize the generation of the transmitted ultrasonic pulse 152 with respect to the generation of the electromagnetic shock wave 150. In some examples, the controller 120 is integrated (e.g., mounted) with the detection assembly 110 such that the controller 120 moves with the detection assembly 110. However, in other examples, the controller 120 is physically separated from or remote from the detection assembly 110 such that the controller 120 does not necessarily move when the detection assembly 110 moves. For example, the controller 120 can form part of a stand-alone computer system communicatively coupled to the detection assembly 110 via a wired or wireless connection.

[0052] The controller 120 includes an electromagnetic (EM) shock wave module 122 and an ultrasonic sensing module 124. Generally, the EM shock wave module 122 controls the operation of the electromagnetic shock wave generator 114, and the ultrasonic sensing module 124 controls the operation of the ultrasonic sensor 116.

[0053] More specifically, as shown in FIG. 2, the EM shock wave module 122 is configured to transmit a shock wave command 144 to the electromagnetic shock wave generator 114, and the electromagnetic shock wave generator 114 is configured to generate an electromagnetic shock wave 150 in response to receiving the shock wave command 144. The shock wave command 144 includes desired characteristics of the electromagnetic shock wave 150, such as intensity (e.g., voltage) and pulse duration. In response to the shock wave command 144, the electromagnetic shock wave generator 114 generates an electromagnetic shock wave 150 having the desired characteristics.

[0054] As shown in FIG. 3, the ultrasonic sensing module 124 is configured to automatically transmit an ultrasonic command 146 to the ultrasonic sensor 116 in response to the transmission of the shock wave command 144 by the EM shock wave module 122, and the ultrasonic sensor 116 is configured to generate a transmitted ultrasonic pulse 152 in response to receiving the ultrasonic command 146. The ultrasonic command 146 includes desired characteristics of the transmitted ultrasonic pulse 152, such as amplitude and frequency. In response to the ultrasonic command 146, the ultrasonic sensor 116 generates a transmitted ultrasonic pulse 152 having the desired characteristics.

[0055] Referring to FIGS. 3 and 5, in a particular example, after the ultrasonic pulse detector of ultrasonic sensor 116 receives received ultrasonic pulse 154, ultrasonic sensor 116 transmits ultrasonic data 162 to ultrasonic sensing module 124 of controller 120. Ultrasonic data 162 includes information corresponding to one or more characteristics of received ultrasonic pulse 154. According to some examples, one or more characteristics of received ultrasonic pulse 154 include a signal response (e.g., amplitude, frequency, intensity, phase (timing), etc.) measured by the ultrasonic pulse detector of ultrasonic sensor 116. In another example, corresponding to a PE ultrasonic sensor, one or more characteristics of received ultrasonic pulse 154 include the depth within bonding joint 136 where received ultrasonic pulse 154 is generated in the form of a pulse echo. Ultrasonic sensing module 124 is further configured to detect kissing bond 148 of bonding joint 136 based at least on ultrasonic data 162. Some examples of method 200 for detecting kissing bond 148 employed by ultrasonic sensing module 124 are described below.

[0056] As shown in FIG. 6, according to some examples, method 200 includes a step (block 202) of generating electromagnetic shock wave 150 passing through target portion 131 of bonding joint 136. According to method 200, electromagnetic shock wave 150 is sufficient to induce separation of kissing bond 148 at target portion 131 and has an intensity insufficient to induce separation of sound bond 149 adjacent to kissing bond 148 at target portion 131. In a particular example, method 200 further includes a step (block 216) of determining the intensity of electromagnetic shock wave 150 sufficient to induce separation of kissing bond 148 at target portion 131 of bonding joint 136.

[0057] According to one example, the intensity of the electromagnetic shock wave 150 sufficient to induce separation of the kissing bond 148 is determined at block 216 by generating a test electromagnetic shock wave through the target portion of the joint of the test part and incrementally increasing the intensity of each test electromagnetic shock wave while monitoring the test part for abnormal visual signs. The test part replicates the part 130 to provide a physical copy of the part 130. The test electromagnetic shock wave begins with an initial test electromagnetic shock wave having an initial intensity (e.g., an initial voltage). After the initial test electromagnetic shock wave has passed through the test part, the test part is inspected for abnormal visual signs. The transmission of the electromagnetic shock wave through the part generates heat within the part. If the generated heat is too high, there may be burns or heat abnormalities in the part that are normally visible to the inspector. Thus, in a particular implementation, the test part is inspected for heat abnormalities. If there are heat abnormalities in the test part, the intensity of the electromagnetic shock wave is too high to detect the kissing bond 148 within the part 130. If there are no heat abnormalities in the test part, a new electromagnetic shock wave of increased intensity passes through the test part and the test part is inspected again for heat abnormalities.

[0058] The incremental increase in the intensity of the test electromagnetic shock wave continues until there are abnormal visual signs or the intensity reaches a predetermined threshold intensity corresponding to the tensile resistance limit of the sound bond 149 within the part 130. The intensity of the test electromagnetic shock wave immediately preceding the test electromagnetic shock wave that resulted in abnormal visual signs is initially selected as the intensity of the electromagnetic shock wave 150 sufficient to induce separation of the kissing bond 148.

[0059] In certain examples, the intensity of the electromagnetic shock wave 150 sufficient to induce separation of the kissing bond 148 is further determined at block 216 by measuring the temperature of the test part each time the intensity of the test electromagnetic shock wave increases. Further, according to some examples, block 216 further includes a step of waiting to generate the next one of the test electromagnetic shock waves until the temperature of the test part is below a predetermined threshold temperature. In one example, the predetermined threshold temperature is 120°F or depends on the material of the test part. Since the test electromagnetic shock wave generates heat within the test part without waiting for the test part to cool, heat accumulates and the test part can be brought to a temperature that the material of the test part cannot withstand without destroying the properties of the material.

[0060] In certain examples, the intensity of the electromagnetic shock wave 150 sufficient to induce separation of the kissing bond 148 is further determined at block 216 by inspecting the test part for structural anomalies. After initially selecting the intensity of the test electromagnetic shock wave to ensure that the intensity sufficient to induce separation of the kissing bond 148 does not cause visible structural anomalies in the part 130, the test part is subjected to a structural test (e.g., a tensile test, a compression test, etc.). If the test part passes the structural test, the initially selected intensity is determined at 216 as the electromagnetic shock wave 150 sufficient to induce separation of the kissing bond 148.

[0061] If the intensity of the electromagnetic shock wave 150 sufficient to induce separation of the kissing bond 148 is lower than the intensity associated with a predetermined tensile resistance limit of a sound bond 149 (e.g., the maximum tensile force that a sound bond 149 can withstand before breaking and separating), it is insufficient to induce separation of the sound bond 149. This predetermined maximum tensile force of the bond 138 is based on the known properties of the bond 138 of the joint 136, the first layer 132, and the second layer 134 and can be determined by a tensile test of the test part.

[0062] Still referring to FIG. 6, according to some examples, method 200 includes generating a transmitted ultrasonic pulse 152 (block 204), directing the transmitted ultrasonic pulse 152 toward a target portion 131 of the joint 136 (block 206), and receiving a received ultrasonic pulse 154 from the target portion 131 of the joint 136 (block 208). Blocks 204-208 of method 200 are performed in response to generating a shock wave 150 passing through the target portion 131 of the joint 136 at block 202. In some examples, the steps of blocks 204-208 are performed simultaneously with the step of block 202. In other words, there is at least some temporal overlap between the step of block 202 and the steps of blocks 204-208. In one example, the step of block 202 is performed first, and the steps of blocks 204-208 are performed sequentially after the step of block 202 is started. The delay in performing block 204 after performing block 202 depends on the thickness and type of the material of the joint 136 of the component 130. In some implementations, the step of block 204 is performed after the step of block 202 to provide sufficient time for the kissing bond 148 to separate before generating the transmitted ultrasonic pulse 152 and directing the transmitted ultrasonic pulse 152 toward the target portion 131 of the joint 136.

[0063] According to some examples, method 200 further includes identifying at least one characteristic of the received ultrasonic pulse 154 (block 210), performing a comparison between at least one characteristic of the received ultrasonic pulse 154 and at least one predetermined characteristic (block 212), and determining the presence or absence of a kissing bond 148 in the target portion 131 of the joint 136 based on the comparison (block 214). The comparison at block 212 is performed by the ultrasonic sensing module 124 based on ultrasonic data 162 received from the ultrasonic sensor 116 in some examples.

[0064] In one example, at least one characteristic of the received ultrasonic pulse 154 includes the measured signal response of the received ultrasonic pulse 154. The measured signal response includes one or more of the measured frequency, measured amplitude, and measured phase (e.g., measured timing) of the received ultrasonic pulse 154. Similarly, the at least one predetermined characteristic includes a predetermined signal response, which can be one or more of a predetermined frequency, a predetermined amplitude, and a predetermined phase (e.g., a predetermined timing). The predetermined characteristic is associated with the expected characteristic of the received ultrasonic pulse 154 under a predetermined bonding condition at the target portion 131 of the joint 136 of the component 130. In one example, the predetermined bonding condition includes only a sound bond 149 within the target portion 131 of the joint 136, such that when all bonds 138 at the target portion 131 are sound, the predetermined signal response becomes the expected signal response. Thus, if the measured signal response of the received ultrasonic pulse 154 does not correlate (e.g., is not equal) with the predetermined signal response, the comparison leads to the determination that a kissing bond 148 is present, and vice versa. Of course, in some examples, the reverse may be true, and the predetermined bonding condition is that at least one kissing bond is present at the target portion 131, such that if the measured signal response of the received ultrasonic pulse 154 correlates with the predetermined signal response, the comparison leads to the determination that a kissing bond 148 is present, and vice versa.

[0065] In one example related to a PE ultrasonic sensor as shown in FIGS. 2 and 3, the measured characteristic of the received ultrasonic pulse 154 is the measured depth within the joint 136 where the received ultrasonic pulse 154 is initiated (e.g., reflected from the void 135). Similarly, the predetermined characteristic is the overall thickness of the target portion 131 of the joint 136 of the component 130. The absence of the kissing bond 148 is determined at block 214 when the measured depth is equal to the overall thickness of the target portion 131 of the joint 136 of the component 130. In contrast, the presence of the kissing bond 148 is determined at block 214 when the measured depth is less than the overall thickness of the target portion 131 of the joint 136 of the component 130.

[0066] According to some examples, method 200 further includes moving the electromagnetic shock wave generator 114 and the ultrasonic sensor 116 together to a position where the electromagnetic shock wave 150 directly contacts the target portion 131 of the joint 136. After moving the electromagnetic shock wave generator 114 and the ultrasonic sensor 116 together in this way, the electromagnetic shock wave generator 114 can generate an electromagnetic shock wave 150 passing through the target portion 131, and the ultrasonic sensor 116 can generate a transmitted ultrasonic pulse 152 to the target portion 131. Subsequently, method 200 includes moving the electromagnetic shock wave generator 114 and the ultrasonic sensor 116 together to another position where the electromagnetic shock wave 150 directly contacts a different target portion 131 of the joint 136. After moving the electromagnetic shock wave generator 114 and the ultrasonic sensor 116 together in this way, the electromagnetic shock wave generator 114 can generate an electromagnetic shock wave 150 passing through the different target portion 131, and the ultrasonic sensor 116 can generate a transmitted ultrasonic pulse 152 to the different target portion 131. This sequence can be repeated until a desired amount of the target portion of the joint 136 has been inspected for the kissing bond.

[0067] In the above description, certain terms such as "upper", "lower", "upper part", "lower part", "horizontal", "vertical", "left", "right", "upper side", "lower side", etc. may be used. These terms, when applicable, are used to clarify the description when dealing with relative relationships. However, these terms are not intended to mean absolute relationships, positions, and / or orientations. For example, with respect to an object, simply turning the object over can make the "upper" surface the "lower" surface. Nevertheless, it is still the same object. Further, the terms "include", "comprise", "have", and their variations mean "include but are not limited to" unless otherwise specified. A listed list of items does not mean that some or all of the items are mutually exclusive and / or mutually inclusive unless otherwise specified. The terms "a", "an", and "the" also refer to "one or more" unless otherwise specified. Further, the term "plurality" can be defined as "at least two". Further, unless otherwise stated, as defined herein, a plurality of specific forms do not necessarily mean all specific forms of a particular set or class of specific forms.

[0068] Further, examples herein where an element is "coupled" to another element can include direct coupling and indirect coupling. Direct coupling can be defined as one element being coupled to another element and in contact with the other element. Indirect coupling can be defined as a coupling between two elements that are not in direct contact with each other but have one or more additional elements between the coupled elements. Further, as used herein, fixing an element to another element can include direct fixing and indirect fixing. Further, as used herein, "adjacent" does not necessarily mean in contact. For example, an element can be adjacent to another element without contacting that element.

[0069] As used herein, the phrase "at least one" when used with a list of items means that one or more different combinations of the listed items are used and only one of the listed items may be required. An item can be a particular object, thing, or category. In other words, "at least one" means that any combination of items or number of items from the list can be used, but not all of the items in the list are required. For example, "at least one of item A, item B, and item C" can mean item A; item A and item B; item B; item A, item B, and item C; or item B and item C. In some cases, "at least one of item A, item B, and item C" can mean, for example, but not limited to, 2 of item A, 1 of item B, and 10 of item C; 4 of item B and 7 of item C; or other suitable combinations.

[0070] Unless otherwise indicated, terms such as "first", "second", etc. are used merely as labels and are not intended to impose any order, position, or hierarchical requirements on the items they refer to. Further, a reference to, for example, a "second" item does not require or exclude the existence of, for example, a "first" or lower numbered item, and / or a "third" or higher numbered item.

[0071] As used herein, a system, apparatus, structure, article, element, component, or hardware that is “configured to” perform a particular function is not merely one that has the potential to perform the particular function after further modification, but rather one that can perform the particular function without further modification. In other words, a system, apparatus, structure, article, element, component, or hardware that is “configured to” perform a particular function has been specifically selected, created, implemented, utilized, programmed, and / or designed for the purpose of performing that particular function. As used herein, “configured to” means that the system, apparatus, structure, article, element, component, or hardware has existing characteristics that enable it to perform the particular function without further modification. For purposes of this disclosure, a system, apparatus, structure, article, element, component, or hardware described as “configured to” perform a particular function may additionally or alternatively be described as “adapted to” and / or “operable to” perform that function.

[0072] The schematic flowcharts included in this specification are generally shown as logical flowcharts. As such, the presented order and labeled steps represent an example of the presented method. One or more steps of the illustrated method, or portions thereof, and other steps and methods with equivalent functions, logic, or effects may be contemplated. Further, it is understood that the format and symbols used are provided to explain the logical steps of the method and do not limit the scope of the method. In flowchart diagrams, various types of arrows and lines can be used, but it is understood that they do not limit the scope of the corresponding method. In fact, some arrows or other connectors may be used only to indicate the logical flow of the method. For example, an arrow may indicate a waiting or monitoring period of an unspecified duration between the listed steps of the depicted method. Further, the order in which a particular method occurs may or may not strictly follow the order of the corresponding steps shown. The blocks represented by dashed lines represent alternative operations and / or portions thereof. If there are dashed lines connecting various blocks, it represents alternative dependencies of the operations or portions thereof. It will be understood that not all dependencies between the various disclosed operations are necessarily represented.

[0073] Many of the functional units described in this specification are labeled as modules in order to particularly emphasize implementation independence. For example, a module may be implemented as a hardware circuit comprising a custom VLSI circuit or gate array, off-the-shelf semiconductors such as logic chips, transistors, or other individual components. A module may also be implemented in a programmable hardware device such as a field programmable gate array, programmable array logic, programmable logic device, etc.

[0074] The module can also be implemented in code and / or software for execution on various types of processors. The identified module of code can include, for example, one or more physical or logical blocks of executable code, which can be organized, for example, as objects, procedures, or functions. Nevertheless, the executable code of the identified module need not be physically located together, but can include different instructions stored in different locations that logically combine to form the module and achieve the specified purpose of the module.

[0075] In fact, a module of code can be a single instruction or a number of instructions and can be distributed among several different code segments, different programs, and several memory devices. Similarly, operational data can be identified and illustrated within the modules herein, embodied in any suitable form, and organized within any suitable type of data structure. Operational data can be collected as a single data set or can be distributed among various locations including various computer-readable storage devices. When a module or a portion of a module is implemented in software, the software portion is stored in one or more computer-readable storage devices.

[0076] Any combination of one or more computer-readable media can be utilized. A computer-readable medium can be a computer-readable storage medium. A computer-readable storage medium can be a storage device that stores code. The storage device can be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, holographic, micro-mechanical, or semiconductor system, apparatus, or device, or any suitable combination of the foregoing.

[0077] More specific examples (non-exhaustive list) of a memory device can include an electrical connection having one or more wirings, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a portable compact disk read-only memory (CD-ROM), an optical memory device, a magnetic memory device, or any suitable combination of the foregoing. In the context of the present disclosure, a computer-readable storage medium can include any suitable tangible medium that can be used by or can include or store a program associated with an instruction execution system, apparatus, or device.

[0078] Code for performing the operations of the examples can be described in any combination of one or more programming languages, including object-oriented programming languages such as Python, Ruby, Java, Smalltalk, C++, and conventional procedural programming languages such as the "C" programming language, and / or machine languages such as assembly language. The code can be executed entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer, or entirely on a remote computer or server. In the latter scenario, the remote computer can be connected to the user's computer via any type of network including a local area network (LAN) or a wide area network (WAN), or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0079] The forms, structures, or characteristics of the described examples can be combined in any suitable way. In the above description, many specific details such as examples of programming, software modules, user selections, network transactions, database queries, database structures, hardware modules, hardware circuits, and hardware chips are provided for a complete understanding of the examples. However, those skilled in the relevant art will recognize that the examples can be implemented without one or more of the specific details, or using other methods, components, materials, etc. In other examples, well-known structures, materials, or operations are not shown in detail or not described in order to avoid obscuring the aspects of the examples.

[0080] Aspects of the examples have been described above with reference to schematic flowchart diagrams and / or schematic block diagrams of example methods, apparatuses, systems, and program products. It will be understood that each block of the schematic flowchart diagrams and / or schematic block diagrams, and combinations of blocks in the schematic flowchart diagrams and / or schematic block diagrams, can be implemented by code. These codes are provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing apparatus to manufacture a machine, and the instructions executed via the processor of the computer or other programmable data processing apparatus create means for implementing the functions / operations specified in one or more blocks of the schematic flowchart diagrams and / or schematic block diagrams.

[0081] The code can also be stored in a storage device that can direct a computer, other programmable data processing apparatus, or other device to function in a specific way, so that the instructions stored in the storage device manufacture a product including instructions for implementing the functions / operations specified in one or more blocks of the schematic flowchart diagrams and / or schematic block diagrams.

[0082] It is also possible to load the code into a computer, other programmable data processing apparatus, or other devices to cause a series of operational steps to be executed on the computer, other programmable apparatus, or other devices, thereby generating a computer-implemented process. As a result, the code executed on the computer or other programmable apparatus provides a process for performing the functions / operations specified in one or more blocks of the flowchart and / or block diagram.

[0083] The schematic flowchart diagrams and / or schematic block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of apparatus, systems, methods, and program products according to various examples. In this regard, each block of the schematic flowchart diagrams and / or schematic block diagrams may represent a module, segment, or portion of code that includes one or more executable instructions for implementing a particular logical function.

[0084] The present subject matter may be implemented in other specific forms without departing from its spirit or essential characteristics. The described examples are to be considered in all respects only as illustrative and not restrictive. All changes within the meaning and range of equivalents of the claims are to be embraced within their scope.

[0085] Furthermore, the present disclosure includes embodiments according to the following clauses:

[0086] Clause 1. A detection assembly (110) for detecting a kissing bond (148) within a joint (136) of a component (130), the detection assembly (110) comprising an electromagnetic shock wave generator (114) that generates an electromagnetic shock wave (150) passing through a target portion (131) of the joint (136), the electromagnetic shock wave (150) being sufficient to induce separation of the kissing bond (148) at the target portion (131) of the joint (136) and having an intensity insufficient to induce separation of a sound bond (149) adjacent to the kissing bond (148) at the target portion (131), the electromagnetic shock wave generator (114) In response to the electromagnetic shock wave generator (114) generating an electromagnetic shock wave (150) that passes through the target portion (131) of the joint (136), an ultrasonic transmission pulse (152) is generated, the ultrasonic transmission pulse (152) is directed towards the target portion (131) of the joint (136), and an ultrasonic sensor (116) that receives an ultrasonic reception pulse (154) from the target portion (131) of the joint (136) and A detection assembly (110) comprising.

[0087] Clause 2. The detection assembly (110) according to clause 1, wherein the detection assembly (110) is movable along the component (130).

[0088] Clause 3. The detection assembly (110) according to clause 2, wherein the electromagnetic shock wave generator (114) and the ultrasonic sensor (116) are fixedly immovable relative to each other.

[0089] Clause 4. The detection assembly (110) according to clause 3, wherein the ultrasonic sensor (116) is integrated with the electromagnetic shock wave generator (114).

[0090] Clause 5. The detection assembly (110) according to any one of clauses 1 to 4, wherein the electromagnetic shock wave generator (114) comprises an electromagnetic dent remover.

[0091] Clause 6. When the electromagnetic shock wave generator (114) generates an electromagnetic shock wave (150) and when the ultrasonic sensor (116) generates an ultrasonic transmission pulse (152), the electromagnetic shock wave generator (114) can be in direct contact with the component (130), the ultrasonic transmission pulse (152) is directed towards the target portion (131) of the joint (136), and the ultrasonic reception pulse (154) is received from the target portion (131) of the joint (136). The detection assembly (110) according to any one of clauses 1 to 5.

[0092] Clause 7. A system (100) for detecting a kissing bond (148) within a joint (136) of a component (130), the system (100) comprising An electromagnetic shock wave generator (114) that generates an electromagnetic shock wave (150) passing through a target portion (131) of a joint (136), wherein the electromagnetic shock wave (150) is sufficient to induce separation of a kissing bond (148) at the target portion (131) of the joint (136) and has an intensity insufficient to induce separation of a sound bond (149) adjacent to the kissing bond (148) at the target portion (131), the electromagnetic shock wave generator (114), In response to the electromagnetic shock wave generator (114) generating an electromagnetic shock wave (150) passing through the target portion (131) of the joint (136), a transmitted ultrasonic pulse (152) is generated, the transmitted ultrasonic pulse (152) is directed towards the target portion (131) of the joint (136), and an ultrasonic sensor (116) that receives a received ultrasonic pulse (154) from the target portion (131) of the joint (136), A detection assembly (110) comprising: A controller (120) that synchronizes the generation of the transmitted ultrasonic pulse (152) with the generation of the electromagnetic shock wave (150) A system (100) comprising.

[0093] Clause 8. The controller (120) comprises an EM shock wave module (122) and an ultrasonic sensing module (124), The EM shock wave module (122) is configured to transmit a shock wave command (144) to the electromagnetic shock wave generator (114), The electromagnetic shock wave generator (114) is configured to generate an electromagnetic shock wave (150) in response to receiving the shock wave command (144), The ultrasonic sensing module (124) is configured to automatically transmit an ultrasonic command (146) to the ultrasonic sensor (116) in response to the transmission of the shock wave command (144) by the EM shock wave module (122), The ultrasonic sensor (116) is configured to generate a transmitted ultrasonic pulse (152) in response to receiving the ultrasonic command (146), The system (100) according to clause 7.

[0094] Clause 9. The ultrasonic sensor (116) is further configured to transmit ultrasonic data (162) corresponding to one or more characteristics of the received ultrasonic pulse (154) received by the ultrasonic sensor (116). The ultrasonic sensing module (124) is further configured to detect a kissing bond (148) within the joint (136) based at least on the ultrasonic data (162). The system (100) according to clause 8.

[0095] Clause 10. The electromagnetic shock wave generator (114) and the ultrasonic sensor (116) form a probe head (160). The system (100) further comprises a robot (170). The probe head (160) is fixed to the component (130) by the robot (170) and is movable along the component (130). The system (100) according to any one of clauses 7 to 10.

[0096] Clause 11. A method (200) for detecting a kissing bond (148) within a joint (136) of a component (130), the method (200) comprising: generating an electromagnetic shock wave (150) passing through a target portion (131) of the joint (136), the electromagnetic shock wave (150) being sufficient to induce separation of the kissing bond (148) at the target portion (131) of the joint (136) and having an intensity insufficient to induce separation of a sound bond (149) adjacent to the kissing bond (148) at the target portion (131); in response to generating the electromagnetic shock wave (150) passing through the target portion (131) of the joint (136), generating a transmitted ultrasonic pulse (152); directing the transmitted ultrasonic pulse (152) towards the target portion (131) of the joint (136); receiving a received ultrasonic pulse (154) from the target portion (131) of the joint (136); The method (200) comprising the above steps.

[0097] Step 12. Identifying at least one characteristic of the received ultrasonic pulse (154); Performing a comparison between at least one characteristic of the received ultrasonic pulse (154) and at least one predetermined characteristic; Based on the comparison, determining the presence or absence of a kissing bond (148) in the target portion (131) of the joint (136); The method (200) according to clause 11, further comprising the above steps.

[0098] Clause 13. At least one characteristic of the received ultrasonic pulse (154) includes the measured signal response of the received ultrasonic pulse (154); At least one predetermined characteristic includes a predetermined signal response; The absence of the kissing bond (148) is determined when the measured signal response is equal to the predetermined signal response; The presence of the kissing bond (148) is determined when the measured signal response is not equal to the predetermined signal response. The method (200) according to clause 12.

[0099] Clause 14. The method (200) according to any one of clauses 11 to 13, wherein the component (130) is made of a conductive material.

[0100] Clause 15. The electromagnetic shock wave (150) is generated by an electromagnetic shock wave generator (114); When the electromagnetic shock wave generator (114) generates the electromagnetic shock wave (150) and when the transmitted ultrasonic pulse (152) is generated, the electromagnetic shock wave generator (114) is in direct contact with the component (130), the transmitted ultrasonic pulse (152) is directed towards the target portion (131) of the joint (136), and the received ultrasonic pulse (154) is received from the target portion (131) of the joint (136). The method (200) according to any one of clauses 11 to 14.

[0101] Clause 16. Generating a test electromagnetic shock wave passing through the target portion of the joint of the test component, while monitoring the test component for visual signs of damage, by increasing the intensity of each of the test electromagnetic shock waves step by step, determining the intensity of the electromagnetic shock wave (150) sufficient to induce separation of the kissing bond (148) at the target portion (131) of the joint (136) The method (200) according to any one of Clauses 11 to 15, further comprising.

[0102] Clause 17. The step of determining the intensity of the electromagnetic shock wave (150) sufficient to induce separation of the kissing bond (148) at the target portion (131) of the joint (136) is measuring the temperature of the test component each time the intensity of the test electromagnetic shock wave increases, and waiting to generate the next one of the test electromagnetic shock waves until the temperature of the test component is below a predetermined threshold temperature The method (200) according to Clause 16, further comprising.

[0103] Clause 18. The step of determining the intensity of the electromagnetic shock wave (150) sufficient to induce separation of the kissing bond (148) at the target portion (131) of the joint (136) further comprises inspecting the test portion for structural damage, the method (200) according to Clause 16 or 17.

[0104] Clause 19. The electromagnetic shock wave (150) is generated by an electromagnetic shock wave generator (114), the transmitted ultrasonic pulse (152) is generated by an ultrasonic sensor (116), the transmitted ultrasonic pulse (152) is directed by an ultrasonic sensor (116), the received ultrasonic pulse (154) is received by an ultrasonic sensor (116), The method (200) further comprises moving the electromagnetic shock wave generator (114) and the ultrasonic sensor (116) together to a position where the electromagnetic shock wave (150) is in direct contact with the target portion (131) of the joint (136). The method (200) according to any one of clauses 11 to 18.

[0105] Clause 20. The joint (136) of the component (130) includes a first layer (132) joined to a second layer (134) by a bond (138). The bond (138) within the target portion (131) of the joint (136) includes a kissing bond (148). The electromagnetic shock wave (150) separates the first layer (132) from the second layer (134) at the kissing bond (148), forming a void (135) between the first layer (132) and the second layer (134). The first layer (132) and the second layer (134) are separated by the electromagnetic shock wave (150), but at least a part of the transmitted ultrasonic pulse (152) is reflected by the void (135) to form a received ultrasonic pulse (154). The method (200) according to any one of clauses 11 to 19.

Explanation of symbols

[0106] 100 System 110 Detection assembly 114 Electromagnetic shock wave generator 116 Ultrasonic sensor 117A Transmission part 117B Detection part 120 Controller 122 Electromagnetic (EM) shock wave module 124 Ultrasonic sensing module 130 Component 131 Target portion 132 First layer 134 Second layer 135 Void 136 Joint 138 Bond 140 First surface 142 Second surface 144 Shock wave command 146 Ultrasonic command 148 Kissing bond 149 Sound bond 150 Electromagnetic shock wave 152 Transmitted ultrasonic pulse 154 Received ultrasonic pulse 160 Probe head 162 Ultrasonic data 170 Robot

Claims

1. A detection assembly (110) for detecting a kissing bond (148) within a joint (136) of a component (130), the detection assembly (110) comprising: An electromagnetic shock wave generator (114) that generates an electromagnetic shock wave (150) passing through a target portion (131) of the joint (136), the electromagnetic shock wave (150) being sufficient to induce separation of the kissing bond (148) at the target portion (131) of the joint (136) and having an intensity insufficient to induce separation of a sound bond (149) adjacent to the kissing bond (148) at the target portion (131); and An ultrasonic sensor (116) that generates a transmitted ultrasonic pulse (152) in response to the electromagnetic shock wave generator (114) generating the electromagnetic shock wave (150) passing through the target portion (131) of the joint (136), directs the transmitted ultrasonic pulse (152) towards the target portion (131) of the joint (136), and receives a received ultrasonic pulse (154) from the target portion (131) of the joint (136). Comprising: The detection assembly (110) is configured such that generation of the transmitted ultrasonic pulse (152) is synchronized with generation of the electromagnetic shock wave (150).

2. The detection assembly (110) according to claim 1, wherein the detection assembly (110) is movable along the component (130).

3. The detection assembly (110) according to claim 1 or 2, wherein the electromagnetic shock wave generator (114) comprises an electromagnetic dent remover.

4. The detection assembly (110) according to any one of claims 1 to 3, wherein when the electromagnetic shock wave generator (114) generates the electromagnetic shock wave (150) and when the ultrasonic sensor (116) generates the transmitted ultrasonic pulse (152), the electromagnetic shock wave generator (114) can be in direct contact with the component (130), directs the transmitted ultrasonic pulse (152) towards the target portion (131) of the joint (136), and receives the received ultrasonic pulse (154) from the target portion (131) of the joint (136).

5. A system (100) for detecting a kissing bond (148) within a joint (136) of a component (130), the system (100) comprising: An electromagnetic shock wave generator (114) that generates an electromagnetic shock wave (150) passing through a target portion (131) of the joint (136), wherein the electromagnetic shock wave (150) is sufficient to induce separation of the kissing bond (148) at the target portion (131) of the joint (136), and has an intensity insufficient to induce separation of a sound bond (149) adjacent to the kissing bond (148) at the target portion (131), the electromagnetic shock wave generator (114), An ultrasonic sensor (116) that generates a transmitted ultrasonic pulse (152) in response to the electromagnetic shock wave generator (114) generating the electromagnetic shock wave (150) passing through the target portion (131) of the joint (136), directs the transmitted ultrasonic pulse (152) toward the target portion (131) of the joint (136), and receives a received ultrasonic pulse (154) from the target portion (131) of the joint (136), A detection assembly (110) comprising: A controller (120) that synchronizes generation of the transmitted ultrasonic pulse (152) with generation of the electromagnetic shock wave (150) A system (100) comprising.

6. The controller (120) comprises an EM shock wave module (122) and an ultrasonic sensing module (124), The EM shock wave module (122) is configured to transmit a shock wave command (144) to the electromagnetic shock wave generator (114), The electromagnetic shock wave generator (114) is configured to generate the electromagnetic shock wave (150) in response to receiving the shock wave command (144), The ultrasonic sensing module (124) is configured to automatically transmit an ultrasonic command (146) to the ultrasonic sensor (116) in response to the transmission of the shock wave command (144) by the EM shock wave module (122), The ultrasonic sensor (116) is configured to generate the transmitted ultrasonic pulse (152) in response to receiving the ultrasonic command (146). The system (100) according to claim 5.

7. The ultrasonic sensor (116) is further configured to transmit ultrasonic data (162) corresponding to one or more characteristics of the received ultrasonic pulse (154) received by the ultrasonic sensor (116), The ultrasonic sensing module (124) is further configured to detect a kissing bond (148) within the joint (136) based at least on ultrasonic data (162). The system (100) according to claim 6.

8. A method (200) for detecting a kissing bond (148) within a joint (136) of a component (130), the method (200) comprising: generating an electromagnetic shock wave (150) passing through a target portion (131) of the joint (136), the electromagnetic shock wave (150) being sufficient to induce separation of the kissing bond (148) at the target portion (131) of the joint (136) and having an intensity insufficient to induce separation of a sound bond (149) adjacent to the kissing bond (148) at the target portion (131); in response to generating the electromagnetic shock wave (150) passing through the target portion (131) of the joint (136), generating a transmitted ultrasonic pulse (152); directing the transmitted ultrasonic pulse (152) towards the target portion (131) of the joint (136); receiving a received ultrasonic pulse (154) from the target portion (131) of the joint (136); comprising a method (200) in which generation of the transmitted ultrasonic pulse (152) is synchronized with generation of the electromagnetic shock wave (150).

9. identifying at least one characteristic of the received ultrasonic pulse (154); performing a comparison between at least one characteristic of the received ultrasonic pulse (154) and at least one predetermined characteristic; determining the presence or absence of a kissing bond (148) at the target portion (131) of the joint (136) based on the comparison The method (200) according to claim 8, further comprising.

10. The method (200) according to claim 9, wherein the component (130) is made of a conductive material.

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