Measuring Fixture and Processing Method

Abstract

To provide a measuring jig for measuring conditions within an apparatus and a processing method.SOLUTION: A measuring jig 101 used in a substrate processing system includes a substrate 110, front cameras 121 to 136, a plurality of rear cameras, a level 140, vibration sensors 151, 152, a jig controller 160, and a battery 170. The substrate 110 is formed as a disc having the same diameter as a semiconductor wafer. As a result, the measuring jig 101 can be accommodated in a carrier or a wafer boat like a semiconductor wafer, and the carrier accommodating the measuring jig 101 can be transferred by a carrier transfer mechanism. Also, the measurement jig 101 can be transferred by a wafer transfer device.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present disclosure relates to a measurement jig and a processing method.

Background Art

[0002] Patent Document 1 discloses a position teaching device including a disk having the same size as a wafer and a camera that enables visual recognition of the lower side through a through hole provided in the disk.

Prior Art Document

Patent Document

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, when a wafer is transported by a transport device, due to mechanical differences such as mechanical errors and installation, it is impossible to perform transportation at the designed value. For this reason, a jig for sensing the designed value and the actual mechanical difference is required.

[0005] On one aspect, the present disclosure provides a measurement jig and a processing method for measuring the state inside the device.

Means for Solving the Problems

[0006] In order to solve the above problems, according to one aspect, there is provided a measurement jig including a substrate, a back surface camera provided on the back surface side of the substrate, and a control unit that controls the back surface camera. , the back camera is disposed at the center of the back surface of the substrate and has a camera for imaging the base side of the fork.

Effects of the Invention

[0007] According to one aspect, it is possible to provide a measurement jig and a processing method.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Embodiments for Carrying Out the Invention

[0009] Hereinafter, embodiments for carrying out the present disclosure will be described with reference to the drawings. In each drawing, the same reference numerals are assigned to the same components, and redundant descriptions may be omitted.

[0010] <Substrate Processing System> First, a substrate processing system 100 according to an embodiment will be described with reference to FIG. 1. FIG. 1 is a configuration diagram of the substrate processing system 100 according to an embodiment. The substrate processing system 100 includes a measurement jig 101, an analysis controller 102, an apparatus controller 103, and a substrate processing apparatus 104.

[0011] The measurement fixture 101 is configured to be capable of wireless data communication with the analysis controller 102. Further, the measurement fixture 101 is configured to be transportable by a transport device (wafer transport device 60 described later) of a substrate processing apparatus 104 that transports a semiconductor wafer (hereinafter referred to as "wafer W" (see FIG. 2 described later)), which is a substrate. The measurement fixture 101 has functions of detecting data by various sensors (surface cameras 121 to 126, back cameras 131 to 135, level 140, vibration sensors 151, 152 described later), performing primary analysis of the data by a built-in controller (fixture controller 160 described later), performing primary storage of the data, and transmitting the data to the analysis controller 102.

[0012] The analysis controller 102 is communicably connected to the measurement fixture 101 and the device controller 103. The analysis controller 102 performs data analysis, operation instructions to the device controller 103, data storage, operation instructions to the measurement fixture 101, analysis start instructions, analysis end instructions, etc. Further, the analysis controller 102 is configured as a Digital Twin system and realizes a CPS (Cyber Physical System).

[0013] The device controller 103 is communicably connected to the analysis controller 102 and the substrate processing apparatus 104. The device controller 103 is a device that performs overall control (operation instructions) of the substrate processing apparatus 104 based on operation instructions from the analysis controller 102. Further, it has a function of transmitting data of the substrate processing apparatus 104 to the analysis controller 102.

[0014] The substrate processing apparatus 104 is a device that performs a predetermined process (for example, heat treatment) on the wafer W (see FIG. 2 described later).

[0015] In the configuration shown in FIG. 1, the analysis controller 102 and the device controller 103 have been described by taking the configuration where they are provided separately as an example, but it is not limited to this, and the device controller 103 may hold the functions of the analysis controller 102.

[0016] Next, a configuration example of the substrate processing apparatus 104 included in the substrate processing system 100 of one embodiment will be described with reference to FIGS. 2 and 3. FIG. 2 is an example of a cross-sectional view showing the configuration of the substrate processing apparatus 104 included in the substrate processing system 100 according to one embodiment. FIG. 3 is an example of a plan view showing the configuration of the substrate processing apparatus 104 included in the substrate processing system 100 according to one embodiment.

[0017] The substrate processing apparatus 104 is configured to be housed in a housing 2 that constitutes the exterior of the apparatus. Inside the housing 2, a carrier transfer region S1 and a wafer transfer region S2 are formed. The carrier transfer region S1 and the wafer transfer region S2 are partitioned by a partition wall 4. The partition wall 4 is provided with a transfer port 6 for communicating the carrier transfer region S1 and the wafer transfer region S2 and transferring the wafer W. The transfer port 6 is opened and closed by a door mechanism 8 according to the FIMS (Front-Opening Interface Mechanical Standard) standard. A drive mechanism of the lid opening / closing device 7 is connected to the door mechanism 8, and the door mechanism 8 is configured to be movable in the front-rear direction and the vertical direction by the drive mechanism, and the transfer port 6 is opened and closed.

[0018] Hereinafter, the arrangement direction of the carrier transfer region S1 and the wafer transfer region S2 is the front-rear direction (corresponding to the second horizontal direction in FIG. 3), and the horizontal direction perpendicular to the front-rear direction is the left-right direction (corresponding to the first horizontal direction in FIG. 3).

[0019] The carrier transfer region S1 is a region under an atmospheric atmosphere. The carrier transfer region S1 is a region for transferring the carrier C in which the wafer W is stored between elements described later in the substrate processing apparatus 104, loading it from the outside into the substrate processing apparatus 104, or unloading it from the substrate processing apparatus 104 to the outside. The carrier C may be, for example, a FOUP (Front-Opening Unified Pod). By maintaining the cleanliness inside the FOUP at a predetermined level, it is possible to prevent foreign matter from adhering to the surface of the wafer W and the formation of a natural oxide film. The carrier transfer region S1 is composed of a first transfer region 10 and a second transfer region 12 located behind the first transfer region 10 (on the wafer transfer region S2 side).

[0020] In the first transfer area 10, as an example, there are two levels vertically (see Fig. 2), and two load ports 14 are provided on each side in the left - right direction (see Fig. 3). The load port 14 is a mounting table for receiving the carrier C when the carrier C is carried into the substrate processing apparatus 104. The load port 14 is provided at a location where the wall of the housing 2 is open, enabling access from the outside to the substrate processing apparatus 104. Specifically, by a transfer device (not shown) provided outside the substrate processing apparatus 104, the carrier C can be carried onto and placed on the load port 14, and the carrier C can be carried out from the load port 14 to the outside. Also, since there are, for example, two levels of load ports 14 vertically, the carrier C can be carried in and out from both of them. A stocker 16 may be provided below the lower load port 14 to enable storage of the carrier C. On the surface of the load port 14 for placing the carrier C, positioning pins 18 for positioning the carrier C are provided at, for example, three locations. Also, in a state where the carrier C is placed on the load port 14, the load port 14 may be configured to be movable in the front - rear direction.

[0021] Below the second transfer area 12, two FIMS ports 24 are arranged side - by - side in the vertical direction (see Fig. 2). The FIMS port 24 is a holding table for holding the carrier C when loading and unloading the wafer W in the carrier C to and from a heat treatment furnace 80 (described later) in the wafer transfer area S2. The FIMS port 24 is configured to be movable in the front - rear direction. On the surface of the FIMS port 24 for placing the carrier C, positioning pins 18 for positioning the carrier C are also provided at three locations, similar to the load port 14.

[0022] Above the second transfer area 12, a stocker 16 for storing the carrier C is provided. The stocker 16 is composed of, for example, three - tier shelves, and two or more carriers C can be placed on each shelf in the left - right direction. Also, a configuration may be adopted in which the stocker 16 is arranged in an area below the second transfer area 12 where the carrier mounting table is not arranged.

[0023] Between the first transfer region 10 and the second transfer region 12, a carrier transfer mechanism 30 for transferring the carrier C among the load port 14, the stocker 16, and the FIMS port 24 is provided.

[0024] The carrier transfer mechanism 30 includes a first guide 31, a second guide 32, a moving part 33, an arm part 34, and a hand part 35. The first guide 31 is configured to extend in the vertical direction. The second guide 32 is connected to the first guide 31 and is configured to extend in the left - right direction (the first horizontal direction). The moving part 33 is configured to move in the left - right direction while being guided by the second guide 32. The arm part 34 has one joint and two arm parts and is provided on the moving part 33. The hand part 35 is provided at the tip of the arm part 34. At three positions on the hand part 35, pins 18 for positioning the carrier C are provided.

[0025] The wafer transfer region S2 is a region for taking out the wafer W from the carrier C and performing various processes. The wafer transfer region S2 is set in an inert gas atmosphere, for example, a nitrogen (N2) gas atmosphere, in order to prevent the formation of an oxide film on the wafer W. In the wafer transfer region S2, a vertical heat treatment furnace 80 with a lower end opened as a furnace port is provided.

[0026] The heat treatment furnace 80 has a quartz cylindrical processing container 82 capable of accommodating the wafer W and for performing heat treatment on the wafer W. A cylindrical heater 81 is arranged around the processing container 82, and heat treatment of the accommodated wafer W is performed by heating of the heater 81. Below the processing container 82, a shutter (not shown) is provided. The shutter is a door for covering the lower end of the heat treatment furnace 80 while the wafer boat 50 is carried out from the heat treatment furnace 80 and until the next wafer boat 50 is carried in. Below the heat treatment furnace 80, a wafer boat 50, which is a substrate holder, is placed on the cover body 54 via a heat - insulating cylinder 52. In other words, the cover body 54 is provided integrally with the wafer boat 50 below the wafer boat 50.

[0027] The wafer boat 50 is made of, for example, quartz and is configured to hold a large-diameter wafer W (for example, with a diameter of 300 mm or 450 mm) substantially horizontally with a predetermined interval in the vertical direction. The number of wafers W accommodated in the wafer boat 50 is not particularly limited, but may be, for example, 50 to 200. The lid 54 is supported by a lifting mechanism (not shown), and the wafer boat 50 is carried into or out of the heat treatment furnace 80 by the lifting mechanism. A wafer transfer device 60 is provided between the wafer boat 50 and the transfer port 6.

[0028] The wafer transfer device 60 transfers the wafer W between the carrier C held on the FIMS port 24 and the wafer boat 50. The wafer transfer device 60 includes a guide mechanism 61, a moving body 62, a fork 63, a lifting mechanism 64, and a rotating mechanism 65. The guide mechanism 61 is in the shape of a rectangular parallelepiped. The guide mechanism 61 is attached to the lifting mechanism 64 extending in the vertical direction, and is configured to be movable in the vertical direction by the lifting mechanism 64 and rotatable by the rotating mechanism 65. The moving body 62 is provided on the guide mechanism 61 so as to be movable forward and backward along the longitudinal direction. The fork 63 is a transfer device attached via the moving body 62, and a plurality of (for example, five) forks 63 are provided. By having a plurality of forks 63, a plurality of wafers W can be transferred simultaneously, so that the time required for transferring the wafer W can be shortened. However, the fork 63 may be single.

[0029] A filter unit (not shown) may be provided on the ceiling or side wall of the wafer transfer area S2. Examples of the filter unit include a HEPA filter (High Efficiency Particulate Air Filter) and a ULPA filter (Ultra-Low Penetration Air Filter). By providing the filter unit, clean air can be supplied to the wafer transfer area S2.

[0030] <Measuring jig> Next, the measurement jig 101 will be described with reference to FIGS. 4 and 5. FIG. 4 is an example of a perspective view of the measurement jig 101 as seen from the front side. FIG. 5 is an example of a perspective view of the measurement jig 101 as seen from the back side. Note that FIGS. 4 and 5 show the measurement jig 101 accommodated in the slots 201 to 203 of the carrier C (see FIG. 2) placed on the FIMS port 24 (see FIG. 2), and illustrate the state where the fork 63 of the wafer transfer device 60 (see FIG. 2) is inserted into the carrier C. In the following description, the insertion and extraction direction of the fork 63 will be described as the front-rear direction, and the width direction of the fork 63 will be described as the left-right direction.

[0031] The measurement jig 101 includes a substrate 110, surface cameras 121 to 126, back cameras 131 to 135, a level 140, vibration sensors 151 and 152, a jig controller 160, and a battery 170.

[0032] The substrate 110 is formed as a disk having the same diameter as the wafer W. As a result, the measurement jig 101 can be accommodated in the carrier C and the wafer boat 50 in the same manner as the wafer W. In the example shown in FIGS. 4 and 5, the measurement jig 101 is accommodated in the slot 201 provided on the front inner wall surface of the carrier C, the slot 202 provided on the right inner wall surface of the carrier C, and the slot 203 provided on the left inner wall surface of the carrier C. Further, the carrier C accommodating the measurement jig 101 can be transported by the carrier transport mechanism 30. Also, the measurement jig 101 can be transported by the wafer transfer device 60.

[0033] A plurality of surface cameras 121 to 126 are arranged on the surface of the substrate 110. Here, the surface of the substrate 110 is the upward-facing surface in the direction of gravity of the substrate 110. Also, the surface of the substrate 110 is the surface that does not come into contact with the wafer boat 50 or the carrier C when the substrate 110 is placed on the wafer boat 50 or the carrier C. Further, the surface of the substrate 110 is the surface that does not come into contact with the fork 63 when the substrate 110 is placed on the fork 63 and transported.

[0034] For example, the front camera 121 is disposed on the front side of the substrate 110 and images the front (the insertion direction of the fork 63, the direction of viewing the slot 201 from the front). The front camera 122 is disposed on the front side of the substrate 110 and images the right side (the direction of viewing the slot 201 from the side). The front camera 123 is disposed on the right side of the substrate 110 and images the right side (the direction of viewing the slot 202 from the front). The front camera 124 is disposed on the right side of the substrate 110 and images the front (the insertion direction of the fork 63, the direction of viewing the slot 202 from the side). The front camera 125 is disposed on the left side of the substrate 110 and images the left side (the direction of viewing the slot 203 from the front). The front camera 125 is disposed on the left side of the substrate 110 and images the front (the insertion direction of the fork 63, the direction of viewing the slot 203 from the side).

[0035] A plurality of back cameras 131 to 135 are disposed on the back surface of the substrate 110. Here, the back surface of the substrate 110 is the surface facing downward in the direction of gravity of the substrate 110. Also, the back surface of the substrate 110 is the surface that comes into contact with the wafer boat 50 or the carrier C when the substrate 110 is placed on the wafer boat 50 or the carrier C. Further, the back surface of the substrate 110 is the surface that comes into contact with the fork 63 when the substrate 110 is placed on the fork 63 and transported.

[0036] For example, the back camera 131 is disposed on the front side of the substrate 110 and images the front (the insertion direction of the fork 63, the direction of viewing the slot 201 from the front). The back camera 132 is disposed on the front side of the substrate 110 and images the right side (the direction of viewing the slot 201 from the side). The back camera 133 is disposed on the right side of the substrate 110 and images the right side (the direction of viewing the slot 202 from the front). The back camera 134 is disposed on the left side of the substrate 110 and images the left side (the direction of viewing the slot 203 from the front). The back camera 135 is disposed at the center of the substrate 110 and images the rear (the removal direction of the fork 63).

[0037] Here, the fork 63 has a base 631 and bifurcated portions 632 and 633 that bifurcate from the base 631. When inserting the fork 63 under the measurement jig 101 and when lifting and transporting the measurement jig 101 with the fork 63, the back cameras 131 to 135 are arranged at positions where they do not interfere with the fork 63.

[0038] The front cameras 121 to 126 and the back cameras 131 to 135 can be used for confirming the teaching positions during teaching described later, detecting the inclination (e.g., horizontal, vertical, etc.) at each teaching position, detecting the deviation from the design data on the CPS, and the like.

[0039] Note that the front cameras 121 to 126 and the back cameras 131 to 135 may be provided with light sources that emit auxiliary light.

[0040] The level 140 is arranged on the surface of the substrate 110 and detects the inclination angle of the substrate 110. As the level 140, for example, a sensor that measures the three-axis inclination angle can be used.

[0041] The level 140 can be used for detecting the relative angular deviation at the teaching position during teaching described later, detecting the contact position when lifting the measurement jig 101 with the fork 63, detecting the swing angle with respect to the swing of the wafer boat 50 when transferring the measurement jig 101 from the fork 63 to the wafer boat 50 or receiving the measurement jig 101 from the wafer boat 50 with the fork 63, and the like.

[0042] The vibration sensors 151 and 152 are arranged on the surface of the substrate 110 and detect the vibration of the substrate 110. As the vibration sensors 151 and 152, for example, acceleration sensors can be used. Also, the vibration sensor 151 is arranged in front of the center of the substrate 110, and the vibration sensor 152 is arranged behind the center of the substrate 110.

[0043] The vibration sensors 151 and 152 can be used for pre-detecting failures of the substrate processing apparatus 104, determining the appropriate speed of transporting the measurement jig 101, and the like.

[0044] The jig controller 160 is arranged on the surface of the substrate 110. The jig controller 160 receives the image data captured by the surface cameras 121 to 126, the image data captured by the back cameras 131 to 135, the data obtained by the level 140, and the data obtained by the vibration sensors 151 and 152. Also, the jig controller 160 has a function of analyzing the input data. Also, the jig controller 160 has a function of performing image processing on the image data. Also, the jig controller 160 has a function of storing the input data. Also, the jig controller 160 has a function of communicating with the analysis controller 102.

[0045] The battery 170 is arranged on the surface of the substrate 110 and supplies power for operating the surface cameras 121 to 126, the back cameras 131 to 135, the level 140, the vibration sensors 151 and 152, and the jig controller 160.

[0046] Here, the substrate processing system 100 shown in FIG. 1 has an analysis controller 102 that realizes a CPS (Cyber Physical System). The analysis controller 102 holds the design data of the substrate processing system 100 as data on the Cyber side and holds the position information based on the design data.

[0047] However, in an actual device, due to differences in the parts of the device and installation differences, etc., conveyance at the design value cannot be performed. In the substrate processing system 100 according to the present embodiment, teaching can be performed by performing an operation considering actual differences using the measurement jig 101 on the premise of the design value.

[0048] <FIMS Teaching> Next, the teaching process using the measurement jig 101 will be described with reference to FIG. 6. FIG. 6 is an example of a flowchart of FIMS teaching.

[0049] Here, the operation when receiving the wafer W (measurement jig 101) from the carrier C held at the FIMS port 24 is taught.

[0050] Before starting the flow of FIG. 6, the carrier C is placed on the FIMS port 24, and the measurement jig 101 is accommodated in the carrier C.

[0051] In step S101, the fork 63 is moved to the designed position. Here, the apparatus controller 103 controls the wafer transfer device 60 to move the fork 63 to the designed position before inserting it into the carrier C.

[0052] In step S102, the position of the fork 63 before inserting it into the carrier C is adjusted.

[0053] First, the jig controller 160 controls the back camera 135 to image the substrate 110 and the fork 63, and transmits the captured image data to the analysis controller 102. The analysis controller 102 performs image processing on the image captured by the back camera 135 to measure the center position of the fork 63 in the width direction (left - right direction). Also, the analysis controller 102 performs image processing on the image captured by the back camera 135 to measure the insertion height of the fork 63 (the height from the upper surface of the fork 63 to the lower surface of the substrate 110).

[0054] Then, the analysis controller 102 teaches the position of the fork 63 before inserting it into the carrier C based on the designed position before inserting the fork 63 into the carrier C, the measured center position of the fork 63 in the width direction, and the insertion height of the fork 63. Then, the analysis controller 102 instructs the taught position to the apparatus controller 103. The apparatus controller 103 controls the wafer transfer device 60 to move the fork 63 to the taught position.

[0055] In step S103, the fork 63 is inserted into the carrier C, and the horizontality of the fork 63 is adjusted.

[0056] First, the device controller 103 controls the wafer transfer device 60 to move the fork 63 forward and inserts the fork 63 below the measurement jig 101. Here, the jig controller 160 controls the back camera 132 to image the tip of the branch portion 633 of the substrate 110 and the fork 63. Also, the jig controller 160 controls the back camera 135 to image the base portion 631 of the substrate 110 and the fork 63. Further, the device controller 103 transmits the captured image data to the analysis controller 102. The analysis controller 102 performs image processing on the images captured by the back camera 132 and the back camera 135 to measure the position of the fork 63 in the forward direction.

[0057] Then, when the position of the fork 63 in the forward direction reaches a predetermined position, the analysis controller 102 stops the forward movement of the fork 63 via the device controller 103. Also, the analysis controller 102 teaches the forward position of the fork 63.

[0058] Next, the jig controller 160 controls the back camera 135 to image the base portion 631 of the substrate 110 and the fork 63. Also, the jig controller 160 controls the back camera 132 to image the tip of the branch portion 633 of the substrate 110 and the fork 63. Further, the device controller 103 transmits the captured image data to the analysis controller 102. The analysis controller 102 performs image processing on the image captured by the back camera 135 to measure the insertion height of the fork 63 on the rear side of the fork 63. Also, the analysis controller 102 performs image processing on the image captured by the back camera 132 to measure the insertion height of the fork 63 on the front side of the fork 63. The analysis controller 102 measures the sag amount (pitch angle) of the fork 63 based on the difference between the insertion height of the fork 63 on the front side and the insertion height of the fork 63 on the front side.

[0059] Then, based on the measured sag amount of the fork 63, the analysis controller 102 instructs the device controller 103 of the offset amount such that the fork 63 becomes horizontal. The device controller 103 controls the pitch angle of the wafer transfer device 60 with the offset amount instructed from the analysis controller 102. Thereby, the fork 63 is made horizontal with respect to the substrate 110.

[0060] In step S104, the fork 63 is raised to detect the contact surface where the fork 63 and the measurement jig 101 come into contact.

[0061] First, the device controller 103 controls the wafer transfer device 60 to gradually raise the fork 63. The analysis controller 102 combines and uses the data of the surface cameras 121 to 126, the back cameras 131 to 135, the level 140, and the vibration sensors 151 and 152 transmitted from the jig controller 160 to accurately detect the contact surface. For example, based on the images of the slot 201 and the substrate 110 captured by the surface camera 121 and the back camera 131, the contact surface is detected. Also, based on the images of the fork 63 and the substrate 110 captured by the back cameras 132 and 134, the contact surface is detected. Further, by detecting the vibration of the substrate 110 when the fork 63 comes into contact with the measurement jig 101 using the vibration sensors 151 and 152, the contact surface is detected. Also, by detecting the inclination of the substrate 110 when the fork 63 comes into contact with the measurement jig 101 and the measurement jig 101 is lifted by the fork 63 using the level 140, the contact surface is detected.

[0062] In addition, based on the images of the fork 63 and the substrate 110 captured by the back cameras 132 and 134, the analysis controller 102 confirms that the substrate 110 is correctly placed at a predetermined position on the fork 63.

[0063] In step S105, the measurement jig 101 is lifted to the center position of the slot. Continuing from step S104, the apparatus controller 103 controls the wafer transfer apparatus 60 to gradually raise the fork 63. The jig controller 160 images the position of the substrate 110 in the slot S201 with the front camera 121 and the back camera 131. Similarly, the front camera 123 and the back camera 133 image the position of the substrate 110 in the slot S202. Similarly, the front camera 125 and the back camera 134 image the position of the substrate 110 in the slot S203. The analysis controller 102 performs image processing on the images transmitted from the jig controller 160 to detect the clearances of the respective slots 201 to 203. When the analysis controller 102 determines that the substrate 110 has been lifted to the center positions of the slots 201 to 203, it stops the raising of the fork 63 via the apparatus controller 103. Further, the analysis controller 102 teaches the position of the fork 63.

[0064] At this time, the jig controller 160 checks the level of the horizontal alignment between the FIMS port 24 and the fork 63 based on the data of the level gauge 140. If the level of the horizontal alignment exceeds the threshold value, an alarm may be issued to perform adjustment of the horizontal alignment.

[0065] As described above, the teaching at the FIMS port 24 is completed. Thereby, when taking out the wafer W accommodated in the carrier C, the apparatus controller 103 moves the fork 63 to the position taught in step S102, advances the fork 63 to the position taught in step S103, raises the fork 63 to the position taught in step S105, and then retracts the fork 63, whereby the wafer W can be taken out.

[0066] <Port Teaching> Next, another teaching process using the measurement jig 101 will be described with reference to FIG. 7. FIG. 7 is an example of a flowchart of port teaching.

[0067] Here, the operation when delivering the wafer W (measurement jig 101) to the wafer boat 50 is taught. Note that before starting the flow of FIG. 7, the measurement jig 101 is placed on the fork 63.

[0068] In step S201, the fork 63 on which the measurement jig 101 is placed is moved to the designed position. Here, the apparatus controller 103 controls the wafer transfer device 60 to move the fork 63 to the designed position before inserting it into the wafer boat 50.

[0069] In step S202, the position of the fork 63 before inserting it into the wafer boat 50 is adjusted.

[0070] First, the jig controller 160 images the slots of the wafer boat 50 with the front surface cameras 121, 124, 126 and the back surface cameras 131, 133, 134 that image the front, and transmits the images to the analysis controller 102. Based on the captured images, the analysis controller 102 adjusts the height position and the left - right position of the fork 63 so that the measurement jig 101 can be inserted into the slot of the wafer boat 50 without contacting it when the fork 63 is advanced. Thereby, the analysis controller 102 teaches the adjusted position of the fork 63.

[0071] In step S203, the fork 63 is inserted into the wafer boat 50, and the position of the fork 63 is adjusted.

[0072] Here, based on the images of the slots 201 - 203 of the wafer boat 50 captured by the front surface camera 121 and the back surface camera 131 that image the front and are provided in front of the substrate 110, and the front surface cameras 124, 126 that image the front and are provided on the left and right of the substrate 110, the analysis controller 102 adjusts the left - right position of the measurement jig 101.

[0073] Further, the analysis controller 102 adjusts the vertical position so that the substrate 110 does not come into contact with the slot based on images of the slot 201 of the wafer boat 50 captured by the front surface camera 121 and the back surface camera 131 provided in front of the substrate 110 and imaging the front.

[0074] Further, the analysis controller 102 adjusts the position of the front-rear axis for inserting the measurement jig 101 into the slot based on the horizontal (radial) distance between the slot 201 imaged by the front surface camera 122 or the back surface camera 132 and the substrate 110, the horizontal (radial) distance between the slot 202 imaged by the front surface camera 124 and the substrate 110, and the horizontal (radial) distance between the slot 203 imaged by the front surface camera 126 and the substrate 110.

[0075] Further, the analysis controller 102 detects the vertical clearance between the slots 201 to 203 and the substrate 110 using the front surface cameras 121, 123, 125 and the back surface cameras 131, 133, 134, and adjusts the position of the vertical axis so that the clearance is maximized.

[0076] Thereby, the analysis controller 102 teaches the adjusted position of the fork 63.

[0077] In step S204, the fork 63 is lowered to detect the contact surface where the wafer boat 50 and the measurement jig 101 come into contact. Here, similarly to step S104, the analysis controller 102 combines and uses the data of the front surface cameras 121 to 126, the back surface cameras 131 to 135, the level 140, and the vibration sensors 151 and 152 transmitted from the jig controller 160 to detect the contact surface.

[0078] In step S205, the fork 63 is lowered to adjust the horizontal level of the fork 63. Here, similarly to step S103, the jig controller 160 obtains the difference in the insertion height of the fork 63 based on the images captured by the back surface camera 135 and the back surface camera 132, and measures the sag amount (pitch angle) of the fork 63.

[0079] At this time, the jig controller 160 checks the level of the horizontal movement of the wafer boat 50 and the fork 63 based on the data of the level gauge 140. If the level of the horizontal movement exceeds the threshold value, an alarm may be issued to adjust the horizontal movement.

[0080] As described above, the teaching in the wafer boat 50 is completed. Thereby, when transporting the wafer W to the slot of the wafer boat 50, the apparatus controller 103 moves the fork 63 to the position taught in step S202, advances the fork 63 to the position taught in step S203, and moves the fork 63 downward below the contact surface detected in step S204. Then, by retracting the fork 63, the wafer W can be accommodated in the wafer boat 50.

[0081] <Adjustment of Wafer Transfer Speed> Next, another teaching process using the measurement jig 101 will be described with reference to FIG. 8. FIG. 8 is an example of a flowchart for adjusting the transfer speed of the wafer.

[0082] In step S301, the measurement jig 101 is acquired by the fork 63 of the wafer transfer apparatus 60. The apparatus controller 103 acquires the measurement jig 101 from the carrier C held at the FIMS port 24 by moving the fork 63 according to the taught position.

[0083] In step S302, the jig controller 160 starts recording the vibration sensors 151, 152 and the level gauge 140.

[0084] In step S303, the apparatus controller 103 moves the fork 63 and transports the measurement jig 101 to the wafer boat 50 at a safe speed. Here, the safe speed is a speed at which the measurement jig 101 can be normally transported to the wafer boat 50.

[0085] In step S304, after the conveyance is completed and the vibration of the wafer boat 50 has subsided, the jig controller 160 ends the recording. Then, the jig controller 160 transmits the recorded data to the analysis controller 102. Note that the end of the recording may be determined by the analysis controller 102.

[0086] In step S305, the analysis controller 102 inputs the information on the waveforms of the vibration data and the sway waveform into the DT model, and calculates the optimum value of the speed limit from the simulation. Here, the maximum vibration angle of the wafer boat 50 when the wafer W is transferred to the wafer boat 50 and the time until the sway of the wafer boat 50 converges are calculated, and the maximum transfer speed at which the wafer W can be transferred without being impacted is calculated.

[0087] In step S306, the apparatus controller 103 transfers the measurement jig 101 at the calculated speed, and the jig controller 160 measures the sway and the like with the level 140 and the vibration sensors 151 and 152. Note that the transfer speed may be a speed assuming the difference in weight between the measurement jig 101 and the wafer W.

[0088] In step S307, the analysis controller 102 determines whether the sway and the impact are within the assumed values. If they are not within the assumed values (S307·No), the process returns to step S305 and the simulation is redone. If they are within the assumed values (S307·Yes), the process ends.

[0089] Thereby, when transferring the wafer W to the wafer boat 50, it is possible to set a transfer speed that can prevent scratches from occurring on the wafer W.

[0090] <Wafer Boat Distortion Judgment and Transfer Method> Next, another teaching process using the measurement jig 101 will be described with reference to FIG. 9. FIG. 9 is an example of a flowchart for detecting the distortion of the wafer boat 50 and adjusting the transfer method of the wafer W.

[0091] In step S401, the device controller 103 moves the fork 63 and transports the measurement jig 101 to a designated slot of the wafer boat 50. At this time, the teaching of that slot is performed simultaneously, and the measurement jig 101 is placed at an accurate transport position.

[0092] In step S402, the jig controller 160 detects the three-dimensional inclination of the slot transported by the level 140.

[0093] In step S403, it is determined whether or not the repetition for the designated slots has been completed. If the repetition for the designated slots has not been completed (S403·No), the measurement jig 101 is transported to the next slot (S401) until the detection of the inclination of the designated slot is completed, and the inclination is detected (S402). If the repetition for the designated slots has been completed (S403·Yes), the process proceeds to step S404.

[0094] In step S404, the analysis controller 102 inserts the actual three-dimensional measurement values measured by the measurement jig 101 into the design data of the wafer boat 50 stored in advance, and calculates the clearance of each slot.

[0095] In step S405, the analysis controller 102 determines, based on the calculated clearance, a slot that can be transported by five blades, a slot that can only be transported by one blade, and a slot that is too deformed to be transported.

[0096] In step S406, the device controller 103 transports the wafer W to the wafer boat 50 based on the determination result of step S405. Also, the analysis controller 102 adjusts the teaching position based on the measured distortion of the wafer boat 50, and the device controller 103 performs the transport of the wafer W based on the adjusted teaching position.

[0097] Accordingly, when the wafer boat 50 is distorted during high-temperature heat treatment or the like, it is possible to objectively determine the slots of the wafer boat 50 that are not suitable for use. Further, according to the state of each slot, the number of wafers W to be transported simultaneously can be adjusted.

[0098] <Pre-detection of failure> Next, the pre-detection of the failure of the substrate processing apparatus 104 using the measurement jig 101 will be described.

[0099] At a predetermined cycle (for example, about once a month), the measurement jig 101 is placed in the substrate processing apparatus 104, and vibration information when the drive shafts of each apparatus are operated by the vibration sensors 151 and 152 and the level 140 is acquired, and pre-detection of failure is performed by the analysis controller 102.

[0100] For example, in the carrier transport mechanism 30, with the measurement jig 101 placed in the carrier C, each movable shaft (vertical shaft, horizontal shaft, front-back shaft) is operated one by one, and vibration and the like at that time are acquired. Further, in the wafer transport device 60, the measurement jig 101 is placed on the fork 63, and each movable shaft (vertical shaft, rotation shaft, pitch shaft, front-back shaft of each fork) is operated one by one, and vibration and the like at that time are acquired. Further, in a boat transporter (not shown) that transports the wafer boat 50, with the measurement jig 101 placed in the wafer boat 50, each movable shaft (vertical shaft, rotation shaft, front-back shaft) is operated one by one, and vibration and the like at that time are acquired. Further, in a boat elevator (not shown) that raises and lowers the wafer boat 50, with the measurement jig 101 placed in the wafer boat 50, each movable shaft (vertical shaft, rotation shaft) is operated one by one, and vibration and the like at that time are acquired.

[0101] The analysis controller 102 performs pre-detection of failure based on the measured vibration and the like. Accordingly, since it is possible to pre-detect the possibility of failure before the apparatus fails, a repair plan can be made in advance, and the downtime of the substrate processing apparatus 104 can be reduced.

[0102] In addition, in the measuring jig 101, vibration sensors 151 and 152 are respectively provided in the front-rear direction. Here, when the fork 63 that is cantilever-supported vibrates, the vibration is large at the tip side of the fork 63 and small at the base side of the fork 63. Therefore, by calculating the difference between the detected values of the vibration sensors 151 and 152 provided in the front-rear direction, it is possible to separate the two vibrations, namely the vibration of the main body of the wafer transfer device 60 and the vibration of the fork 63 alone, and obtain vibration information. As a result, a wide range of fault detection can be performed. For example, the difference between these two vibrations is also accumulated and held as data. When the difference becomes large, it is considered that there is a poor attachment of the fork 63 itself of the wafer transfer device 60 that holds the wafer W (for example, loosening of a screw or a crack), so it can also be used for pre-detection of poor attachment of the fork 63.

[0103] In addition, as for the pre-prediction of faults by the vibration sensors 151 and 152 and the level gauge 140, for example, it can be applied to the prediction of grease running out of the vertical axis of the wafer transfer device 60 or the boat elevator, the prediction of grease running out or breakage of each part bearing, the prediction of particle generation due to grease running out or belt loosening, the prediction of particle generation due to a defective seal part of the boat elevator rotation shaft, the prediction of the wear degree and particle generation of the rack & pinion mechanism of the carrier transfer mechanism 30, the prediction of loosening of the linear rail from the horizontal change of each axis, and the loosening of the fork 63 of the wafer transfer device 60, etc.

[0104] Note that the analysis controller 102 predicts the vibration of each part in the simulation on the CPS by means of Digital Twin, and detects a fault by the difference between the vibration of the simulation and the vibration detected by the measuring jig 101. In addition, the analysis controller 102 may grasp the feature amount for detecting a fault and predict a fault by a statistical method based on the vibration detected by the measuring jig 101.

[0105] Also, automatic teaching may be periodically performed using the measurement jig 101, and the correction error from the design value may be accumulated and recorded to detect a failure at the teaching location in advance. For example, automatic teaching is performed simultaneously with the failure detection by the vibration sensors 151 and 152 of the measurement jig 101. At this time, the correction amount from the design value by automatic teaching is recorded, and it may be determined that the location where the correction amount is increasing or the corresponding axis may have a possibility of failure (such as loosening of the screw, distortion of the linear rail, bearing damage, etc.) in the future.

[0106] In addition, conventional maintenance operations such as failure detection and teaching had to stop the production (processing of the wafer W) by the substrate processing apparatus 104, switch to the maintenance mode, and be manually performed by the operator. On the other hand, by using the measurement jig 101, it is possible to automatically perform self-diagnosis and automatic teaching of the substrate processing apparatus 104 using the idle time of the substrate processing apparatus 104. Note that the timing of performing self-diagnosis and automatic teaching during production may be instructed by, for example, a higher-level control device (not shown), or may be determined by the scheduler in the device controller 103 at the timing when the wafer W of the production lot is not in the substrate processing apparatus 104.

[0107] In addition, the analysis controller 102 constantly simulates on the Cyber side the change in vibration with respect to the travel distance and usage time of the drive unit by means of CPS using Digital Twin. As a result, a device that accurately simulates the movement, usage time, cumulative weight, the amount of wafers W and carriers C transported, etc. of the drive unit in parallel with the actual device is reproduced on the simulator of Digital Twin. After considering this actual usage amount, by comparing the simulated vibration data with the actual vibration data, if a deviation exceeding the tolerance is found, it can be determined as abnormal and a failure can be detected in advance.

[0108] Also, when installing each device inside the substrate processing apparatus 104, by using the measurement jig 101, the installation error can be objectively determined. As a result, the mounting positions of the respective devices can be brought closer to the designed positions, and highly accurate mounting can be achieved. For example, while the measurement jig 101 is mounted on the device to which it is to be mounted, the accuracy of the mounting position can be obtained by adjusting the position of the device to be mounted. Further, by holding the data at the end of the final adjustment, it can be used as a basis for error determination with the design data. Further, by using the measurement results of the measurement jig 101, an inspection certificate at the end of the installation of the device can be automatically issued at the end of the installation work.

[0109] Also, the measurement jig 101 is housed in the carrier C of the stocker 16, and by photographing the inside of the substrate processing apparatus 104 with the measurement jig 101 as needed, various scan sensors can be substituted. Further, when an abnormality occurs inside the substrate processing apparatus 104, the inside can be imaged with the measurement jig 101.

[0110] Also, conventional teaching operations and operation confirmation had to be performed during maintenance. In contrast, by using this measurement jig 101, information on the production plan of the substrate processing apparatus 104 is obtained from the upper management device, and auto-teaching and pre-detection of failures are automatically executed at the timing when the substrate processing apparatus 104 becomes idle. The timing, frequency, conditions, etc. of automatic execution can be set in advance by the operator or the upper management device. At this time, the measurement jig 101 may request the upper management device to carry it into the substrate processing apparatus 104, or it may be taken out from the stocker inside the substrate processing apparatus 104. Since the diagnosis and re-teaching of the device can be performed during normal production without waiting for the maintenance timing, the failure rate and troubles of the substrate processing apparatus 104 can be reduced, and autonomous control, extension of available time, and suppression of scratches and particles of the substrate processing apparatus 104 become possible.

[0111] As described above, the substrate processing system 100 has been described. However, the present disclosure is not limited to the above-described embodiments and the like, and various modifications and improvements are possible within the scope of the gist of the present disclosure described in the claims.

Explanation of Symbols

[0112] 100 Substrate Processing System 101 Measuring Fixture 102 Analysis Controller 103 Device Controller 104 Substrate Processing Apparatus 101 Measuring Fixture 110 Substrate 121 - 126 Surface Cameras 131 - 135 Backside Cameras 140 Leveler 151, 152 Vibration Sensors 160 Fixture Controller 170 Battery 201 - 203 Slots 631 Base 632, 633 Branch Parts 632 Branch Part 633 Branch Part W Wafer C Carrier 24 FIMS Ports 30 Carrier Transfer Mechanism 60 Wafer Transfer Device

Claims

1. A substrate, a back camera provided on the back side of the substrate, and a control unit for controlling the back camera, wherein the back camera is disposed at the center of the back surface of the substrate and has a camera for imaging the base side of the fork, a measuring jig.

2. Taking the direction in which the substrate is inserted into and removed from the slot as the front-rear direction, further comprising a camera disposed in front of the back surface of the substrate for imaging the tip side of the fork, the measuring jig according to claim 1.

3. The back surface of the substrate is the surface facing downward in the direction of gravity of the substrate, the measuring jig according to claim 1 or claim 2.

4. The back surface of the substrate is the surface that contacts the boat when the substrate is placed on the boat, the measuring jig according to claim 1 or claim 2.

5. Taking the direction in which the substrate is inserted into and removed from the slot as the front-rear direction, wherein the back camera is disposed at the center of the back surface of the substrate and has a camera for imaging the rear, the measuring jig according to any one of claims 1 to 4.

6. further comprising at least one of a front surface camera, a vibration sensor, and an inclination sensor controlled by the control unit, the measuring jig according to any one of claims 1 to 5.

7. A step of imaging the fork before insertion with a back camera provided on the back surface of the substrate of the measuring jig and adjusting the width direction position and height of the fork based on the imaging result; and a step of inserting the fork under the substrate and adjusting the horizontal of the fork based on the difference between the distance between the tip of the fork and the substrate and the distance between the base of the fork and the substrate, a processing method.

Images