Semiconductor manufacturing apparatus, coating apparatus, and method of manufacturing semiconductor device

Abstract

To provide a technique capable of reducing variation in at least one of an application position and an application amount.SOLUTION: A semiconductor manufacturing device which has a syringe with a nozzle at the tip and in which paste is stored, a first stage, a second stage that supports a substrate to which the paste is applied, an imaging device to capture images of the paste applied to the first stage, and a control unit configured to adjust an application position or an application amount of a syringe after a replacement thereof, based on a recognition result of a first paste applied to the first stage by the syringe before the replacement and a second paste applied to the first stage by the syringe after the replacement.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present disclosure relates to a semiconductor manufacturing apparatus, and is applicable to, for example, a die bonder using a resin paste as a bonding material.

Background Art

[0002] As one step in the manufacturing process of a semiconductor device, a die separated from a wafer may be picked up and bonded to a substrate coated with a resin paste by a syringe. Here, the resin paste is a liquid adhesive, for example, a silver paste such as silver epoxy or silver acrylic. Hereinafter, the resin paste is simply referred to as a paste.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When the syringe is replaced, the application position or the application amount of the paste applied by the syringe after replacement may change with respect to the paste applied by the syringe before replacement.

[0005] The present disclosure aims to provide a technique capable of reducing variations in at least one of the application position and the application amount of the paste. Other problems and novel features will become apparent from the description of this specification and the accompanying drawings.

Means for Solving the Problems

[0006] The outline of a typical example of the present disclosure will be briefly described as follows. That is, the semiconductor manufacturing apparatus includes a syringe having a nozzle at its tip for storing paste, a first stage, a second stage for supporting a substrate on which the paste is to be applied, an imaging device for imaging the paste applied to the first stage, and a control device configured to adjust the application position or application amount of the syringe after replacement based on the recognition result of the first paste applied to the first stage by the syringe before replacement and the recognition result of the second paste applied to the first stage by the syringe after replacement.

Advantages of the Invention

[0007] According to the present disclosure, it is possible to reduce the variation in at least one of the application position and application amount of the paste.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

[0009] Hereinafter, embodiments and modifications will be described with reference to the drawings. However, in the following description, the same reference numerals may be given to the same components and repeated descriptions may be omitted. Note that, for the purpose of making the description clearer, the drawings may schematically represent the widths, thicknesses, shapes, etc. of each part compared to the actual aspect, but this is merely an example and does not limit the interpretation of the present disclosure.

[0010] The configuration of a die bonder as an aspect of a semiconductor manufacturing apparatus will be described with reference to FIGS. 1 to 3. FIG. 1 is a schematic top view showing a configuration example of the die bonder in the embodiment. FIG. 2 is a diagram for explaining the schematic configuration when viewed from the direction of arrow A in FIG. 1. FIG. 3 is a side view showing the schematic of the preform portion shown in FIG. 1.

[0011] The die bonder 1 generally includes a wafer supply unit 10, a pickup unit 20, an intermediate stage unit 30, a preform unit 90, a bonding unit 40, a transfer unit 50, a substrate supply unit 60, a substrate carry-out unit 70, and a control unit (control device, controller) 80. The Y direction is the front-rear direction of the die bonder 1, the X direction is the left-right direction, and the Z direction is the up-down direction. The wafer supply unit 10 is arranged on the front side of the die bonder 1, and the bonding unit 40 is arranged on the rear side.

[0012] The wafer supply unit 10 includes a wafer cassette lifter 11, a wafer holding stage 12, a peeling unit 13, and a wafer recognition camera 14.

[0013] The wafer cassette lifter 11 moves up and down a wafer cassette (not shown) in which a plurality of wafer rings WR are stored to the wafer transfer height. Alignment of the wafer ring WR supplied from the wafer cassette lifter 11 is performed by a wafer correction chute (not shown). A wafer extractor (not shown) takes out the wafer ring WR from the wafer cassette and supplies it to the wafer holding table 12, or takes it out from the wafer holding table 12 and stores it in the wafer cassette.

[0014] A wafer W is adhered (stuck) on a dicing tape DT, and the wafer W is divided into a plurality of dice D. The dicing tape DT is held by the wafer ring WR. The wafer W is, for example, a semiconductor wafer or a glass wafer, and the die D is a semiconductor chip or a glass chip.

[0015] The wafer holding table 12 is moved in the XY direction by an XY table and a drive unit (not shown), and moves the die D to be picked up to the position of the peeling unit 13. The wafer holding table 12 rotates the wafer ring WR in the XY plane by a drive unit (not shown). The peeling unit 13 moves in the vertical direction by a drive unit (not shown). The peeling unit 13 peels the die D from the dicing tape DT.

[0016] The wafer recognition camera 14 grasps the pickup position of the die D picked up from the wafer W or inspects the surface of the die D.

[0017] The pickup unit 20 includes a pickup head 21 and a Y drive unit 23. The pickup head 21 is provided with a collet 22 that sucks and holds the peeled die D at its tip. The pickup head 21 picks up the die D from the wafer supply unit 10 and places it on the intermediate stage 31. The Y drive unit 23 moves the pickup head 21 in the Y-axis direction. The pickup unit 20 has drive units (not shown) that move the pickup head 21 up and down, rotate it, and move it in the X direction.

[0018] The intermediate stage portion 30 includes an intermediate stage 31 on which the die D is placed, and a stage recognition camera 34 for recognizing the die D on the intermediate stage 31. The intermediate stage 31 is provided with suction holes for sucking the placed die D. The placed die D is temporarily held by the intermediate stage 31.

[0019] The preform portion 90 includes a syringe 91, a drive unit 93, a preform camera 94 as an imaging device, a preform stage 96 as a second stage, and a discard stage 100 as a first stage. The syringe 91 has a nozzle 92 at the lower tip. The syringe 91 applies paste to the substrate S that has been transported to the preform stage 96 by the transport unit 50. The drive unit 93 moves the syringe 91 in the X direction, Y direction, and vertical direction. The substrate S is, for example, a wiring board, a lead frame formed of a metal thin plate, a glass substrate, or the like.

[0020] The preform camera 94 grasps the position of the paste applied to the substrate S by the syringe 91. The preform stage 96 rises when applying the paste to the substrate S and supports the substrate S from below. The preform stage 96 has suction holes (not shown) for vacuum-sucking the substrate S and can fix the substrate S. Further, the preform camera 94 photographs the paste applied to a predetermined area of the discard stage 100.

[0021] The discard stage 100 is arranged on one side of a pair of transport lanes 52 in the Y direction with respect to the preform stage 96, sandwiching one of the transport lanes 52. The discard stage 100 is provided within the movement range of the syringe 91 and the preform camera 94. Here, the syringe 91 and the preform camera 94 move in the Y direction. Details of the discard stage 100 will be described later.

[0022] The bonding unit 40 includes a bond head 41, a Y drive unit 43, a substrate recognition camera 44, and a bond stage 46. A collet 42 for sucking and holding the die D at its tip is provided on the bond head 41. The Y drive unit 43 moves the bond head 41 in the Y-axis direction. The substrate recognition camera 44 images a position recognition mark (not shown) in the package area P of the substrate S to recognize the bonding position. Here, on the substrate S, a plurality of product areas (hereinafter referred to as package areas P), which ultimately become one package, are formed. The position recognition marks are provided for each package area P. When the die D is placed on the substrate S, the bond stage 46 is raised to support the substrate S from below. The bond stage 46 has a suction port (not shown) for vacuum-sucking the substrate S and can fix the substrate S. The bond stage 46 has a heating unit (not shown) for heating the substrate S. The bonding unit 40 has drive units (not shown) for raising and lowering, rotating, and moving the bond head 41 in the X direction.

[0023] With such a configuration, the bond head 41 corrects the pickup position and posture based on the imaging data of the stage recognition camera 34 and picks up the die D from the intermediate stage 31. Then, based on the imaging data of the substrate recognition camera 44, the bond head 41 bonds (places and adheres) the die D onto the package area P where the paste of the conveyed substrate S is applied.

[0024] The conveyance unit 50 includes conveyance claws 51 for gripping and conveying the substrate S and a pair of conveyance lanes 52 along which the substrate S moves. The substrate S moves in the X direction by being driven by a ball screw (not shown) provided along the conveyance lane 52 with nuts (not shown) of the conveyance claws 51 provided on the conveyance lane 52. With such a configuration, the substrate S moves from the substrate supply unit 60 along the conveyance lane 52 to the bonding position, and after bonding, moves to the substrate discharge unit 70 and delivers the substrate S to the substrate discharge unit 70.

[0025] The substrate supply unit 60 takes out the substrate S stored in the transfer jig and carried in, and supplies it from the transfer jig to the transfer unit 50. The substrate unloading unit 70 stores the substrate S conveyed by the transfer unit 50 in the transfer jig.

[0026] The control system of the die bonder 1 will be described with reference to FIG. 4. FIG. 4 is a block diagram showing the schematic configuration of the control system of the die bonder shown in FIG. 1.

[0027] The control system 8 includes a control unit 80, a drive unit 86, a signal unit 87, and an optical system 88. The control unit 80 mainly includes a control and arithmetic device 81 mainly composed of a CPU (Central Processing Unit), a storage device 82, an input / output device 83, a bus line 84, and a power supply unit 85. The storage device 82 includes a main storage device 82a and an auxiliary storage device 82b. The main storage device 82a is composed of a RAM (Random Access Memory) that stores processing programs and the like. The auxiliary storage device 82b is composed of an HDD (Hard Disk Drive), an SSD (Solid State Drive), etc. that store control data, image data, etc. necessary for control.

[0028] The input / output device 83 includes a monitor 83a that displays the device state, information, etc. of the die bonder 1, a touch panel 83b for inputting the operator's instructions, a mouse 83c for operating the monitor 83a, and an image capture device 83d for capturing image data from the optical system 88. The input / output device 83 further includes a motor control device 83e, an I / O signal control device 83f, and a focus control device 83g. The motor control device 83e controls the drive unit 86 such as the XY table of the wafer supply unit 10 and the ZY drive shaft of the bond head table of the bonding unit 40. The I / O signal control device 83f takes in signals from the signal unit 87 and controls the signal unit 87. The signal unit 87 includes various sensors, a switch for controlling the brightness of lighting devices, a volume, etc. The control and arithmetic device 81 takes in necessary data via the bus line 84, performs calculations, controls the pick-up head 21, etc., and sends information to the monitor 83a, etc.

[0029] The control and arithmetic unit 81 stores the image data captured by the optical system 88 via the image capture device 83d in the storage device 82. The optical system 88 includes a wafer recognition camera 14, a stage recognition camera 34, a substrate recognition camera 44, and a preform camera 94. The cameras used in the optical system 88 digitize the light intensity and color. Based on the stored image data, the control and arithmetic unit 81 performs positioning of the die D and the substrate S, inspection of the paste application pattern, and surface inspection of the die D and the substrate S by software programmed accordingly. The control and arithmetic unit 81 moves the drive unit 86 via the motor control device 83e by software based on the calculated positions of the die D and the substrate S. Through this process, the control and arithmetic unit 81 positions the die D on the wafer W and operates the drive units of the wafer supply unit 10, the pickup unit 20, and the bonding unit 40 to bond the die D onto the package area P of the substrate S.

[0030] A bonding process (a method for manufacturing a semiconductor device), which is one process in the manufacturing process of a semiconductor device using the die bonder 1, will be described with reference to FIG. 5. FIG. 5 is a flowchart showing the method for manufacturing a semiconductor device using the die bonder shown in FIG. 1. In the following description, the operations of each part constituting the die bonder 1 are controlled by the control unit 80.

[0031] (Wafer loading process (process S1)) The wafer ring WR is supplied to the wafer cassette of the wafer cassette lifter 11. The supplied wafer ring WR is supplied to the wafer holding table 12.

[0032] (Substrate loading process (process S2)) The transfer jig storing the substrate S is supplied to the substrate supply unit 60. The substrate S is taken out from the transfer jig in the substrate supply unit 60 and fixed to the transfer claw 51.

[0033] (Pickup process (process S3)) After process S1, the wafer holding stage 12 is moved so that the desired die D can be picked up from the dicing tape DT. The die D is photographed by the die recognition camera 14, and based on the image data obtained by the photographing, positioning and surface inspection of the die D are performed. By image-processing the image data, the deviation amounts (in the X, Y, and θ directions) of the die D on the wafer holding stage 12 from the die position reference point of the die bonder are calculated and positioning is performed. The die position reference point is held in advance as a predetermined position of the wafer holding stage 12 in the initial setting of the apparatus. By image-processing the image data, surface inspection of the die D is performed.

[0034] The positioned die D is peeled off from the dicing tape DT by the peeling unit 13 and the pickup head 21. The die D peeled off from the dicing tape DT is adsorbed and held by the collet 22 provided on the pickup head 21, and is transported to and placed on the intermediate stage 31.

[0035] The die D on the intermediate stage 31 is photographed by the stage recognition camera 34, and based on the image data obtained by the photographing, positioning and surface inspection of the die D are performed. By image-processing the image data, the deviation amounts (in the X, Y, and θ directions) of the die D on the intermediate stage 31 from the die position reference point of the die bonder 1 are calculated and positioning is performed. The die position reference point is held in advance as a predetermined position of the intermediate stage 31 in the initial setting of the apparatus. By image-processing the image data, surface inspection of the die D is performed.

[0036] The pickup head 21 that has transported the die D to the intermediate stage 31 is returned to the wafer supply unit 10. According to the procedure described above, the next die D is peeled off from the dicing tape DT, and thereafter, the die Ds are peeled off one by one from the dicing tape DT according to the same procedure.

[0037] (Preform process (process S4)) After the S2 process, the substrate S is transported to the preform stage 96 by the transport unit 50. The surface of the substrate S before coating is photographed by the preform camera 94, and the surface on which the paste is to be applied is confirmed based on the image data obtained by the photographing. If there is no problem with the surface to be coated, the position where the paste of the substrate S supported by the preform stage 96 is to be applied is confirmed and positioned. The positioning is performed by pattern matching or the like in the same manner as in the bonding unit 40.

[0038] The paste is ejected from the nozzle 92 at the tip of the syringe 91 and applied to the substrate S according to a preset locus of the nozzle 92.

[0039] The paste applied is photographed by the preform camera 94. Based on the image obtained by the photographing, it is confirmed whether the paste is accurately applied, and an inspection (appearance inspection) of the applied paste is performed. That is, in the appearance inspection, it is confirmed whether the applied paste is applied in a predetermined shape and a predetermined amount at a predetermined position on the substrate S. The inspection contents are, for example, the presence or absence of the paste, the coating area, the coating shape (deficiency, overhang), etc. The inspection is performed by a method of counting the number of pixels after separating the area of the paste by binarization processing, as well as a method of comparing by difference and a method of comparing scores by pattern matching.

[0040] (Bonding process (process S5)) If there is no problem with the coating, the substrate S is transported to the bond stage 46 by the transport unit 50. The substrate S placed on the bond stage 46 is photographed by the substrate recognition camera 44, and image data is obtained by the photographing. By subjecting the image data to image processing, the amount of deviation (in the X, Y, and θ directions) of the substrate S from the substrate position reference point of the die bonder is calculated. The substrate position reference point is held in advance as a predetermined position of the bonding unit 40 in the initial setting of the apparatus.

[0041] Based on the deviation amount of the die D on the intermediate stage 31 calculated in step S3, the adsorption position of the bonding head 41 is corrected, and the die D is adsorbed by the collet 42. The die D is bonded to a predetermined position on the substrate S supported by the bonding stage 46 by the bonding head 41 that has adsorbed the die D from the intermediate stage 31. The die D bonded to the substrate S is photographed by the substrate recognition camera 44, and an inspection is performed based on the image data obtained by the photographing to determine whether the die D is bonded to the desired position.

[0042] The bonding head 41 that has bonded the die D to the substrate S is returned to the intermediate stage 31. According to the above-described procedure, the next die D is picked up from the intermediate stage 31 and bonded to the substrate S. This is repeated until the die D is bonded to all the package areas P of the substrate S.

[0043] (Substrate unloading process (process S6)) The substrate S to which the die D is bonded is conveyed to the substrate unloading unit 70. The substrate S is taken out from the conveying claws 51 in the substrate unloading unit 70 and stored in a conveying jig. The conveying jig storing the substrate S is unloaded from the die bonder 1.

[0044] As described above, the die D is mounted on the substrate S and unloaded from the die bonder 1. Thereafter, for example, the conveying jig storing the substrate S on which the die D is mounted is conveyed to the wire bonding process, and the electrodes of the die D are electrically connected to the electrodes of the substrate S via an Au wire or the like. Then, the substrate S is conveyed to the molding process, and the die D and the Au wire are sealed with a molding resin (not shown), thereby completing the semiconductor package.

[0045] The application of the paste in the preform section will be described with reference to FIG. 6. FIG. 6 is a block diagram showing a configuration example of the preform section.

[0046] The preform section 90 includes a syringe 91, a drive unit 93, a preform camera 94, a syringe holder 95, a preform stage 96, a dispenser 97, and a pipe 98 for supplying air pressure.

[0047] When applying the paste stored in the syringe 91 to the substrate S, the control unit 80 supplies a pressurized gas such as air from the upper part of the syringe 91 for a certain period of time from the dispenser 97 of the air pulse method to discharge a predetermined amount of paste. The control unit 80 performs a two-dimensional one-stroke scan (drawing operation) of the syringe 91 in the XY plane (generally starting from the center and returning to the center) with the nozzle 92 in a state close to the substrate.

[0048] The dispenser 97 includes a compressed air supply port 97a connected to a positive pressure source, a vacuum exhaust port 97b connected to a negative pressure source, an exhaust port 97c for exhausting the compressed air supplied to the syringe, and an air control output port 97d.

[0049] The operation of the dispenser 97 will be described. The compressed air introduced from the compressed air supply port 97a is adjusted to an appropriate pressure by a discharge regulator (not shown) and sent out from the air control output port 97d via a valve unit (not shown). Inside the air control output port 97d, there is a pressure sensor 97e for monitoring the output. The compressed air supplied to the syringe 91 is forcibly exhausted from the exhaust port 97c via a valve unit (not shown). Also, when not discharging, it is necessary to supply a weak vacuum so that dripping does not occur due to the weight of the paste. This vacuum is discharged from the vacuum exhaust port 97b by adjusting the compressed air from the compressed air supply port 97a to an appropriate pressure (negative pressure) via a vacuum regulator (not shown). This negative pressure is controlled by a valve unit (not shown) and connected to the air control output port 97d. Note that the discharge pressure can be measured by a pressure signal (PRS) output by the dispenser 97. The discharge time can be measured by measuring a discharge signal (DSC) output by the dispenser 97.

[0050] The paste ejection process will be described. The paste is stored in the syringe 91. First, according to the instruction of the control unit 80, the driving unit 93 lowers the syringe holder 95, so that the tip of the nozzle 92 descends from a relatively high position and reaches a predetermined height (nozzle height (Hn)) from the upper surface of the substrate S at the ejection start timing. The nozzle height (Hn) is, for example, from 100 to 200 μm. Here, when compressed air is supplied from the dispenser 97 through the pipe 98 according to the instruction of the control unit 80, the air pressure in the syringe 91 rises rapidly, and ejection gradually starts. Synchronously therewith, the drawing operation starts. That is, specifically, the driving unit 93 moves the syringe holder 95 according to the instruction of the control unit 80, so that the nozzle 92 moves horizontally two-dimensionally. The nozzle 92 generally returns to the writing position and ends the drawing operation. Synchronously therewith, when the supply of compressed air from the dispenser 97 is stopped according to the instruction of the control unit 80, the air pressure in the syringe 91 drops rapidly, but the ejection gradually weakens and stops. Almost simultaneously when it stops, the driving unit 93 raises the nozzle 92 according to the instruction of the control unit 80.

[0051] Next, the discard stage 100 will be described with reference to FIG. 7. FIG. 7 is a top view showing the discard stage on which the paste is applied before syringe replacement.

[0052] As shown in FIG. 7, the discard stage 100 has an application area 101 and a discard area 102. The application area 101 is an area where the paste is applied when replacing the syringe 91 together with the nozzle 92 or when replacing only the syringe 91.

[0053] In addition, when the remaining amount of the paste in the syringe 91 is small, the syringe 91 is replaced in advance so that the paste does not run out during the next application operation. Also, the syringe 91 may be replaced according to the type of die.

[0054] The discard area 102 is an area where the paste is discarded when coating has not been performed for a predetermined time or longer. When coating has not been performed for a predetermined time or longer, a phenomenon occurs in which the coating amount at the start of coating becomes unstable due to the influence of thixotropy. Therefore, for example, a preliminary operation of discarding the paste is performed before coating the first package area P of the substrate S. The three squares shown in the discard area 102 are the discarded paste Ps. The syringe 91, the preform camera 94, the preform stage 96, and the discard stage 100 constitute a coating apparatus.

[0055] Next, the adjustment of the coating position and coating amount using the discard stage 100 will be described with reference to FIGS. 7 to 9. FIG. 8 is a top view showing the discard stage on which the paste has been coated after syringe replacement. FIG. 9 is a flowchart showing a method for adjusting the coating position or coating amount.

[0056] (Step S11) As shown in FIG. 7, when replacing the syringe 91, prior thereto, the control unit 80 coats the paste onto the coating area 101 of the discard stage 100 using the syringe 91 and the nozzle 92. Here, the pattern of the paste to be coated is the same as the pattern to be coated on the package area P of the substrate S.

[0057] (Step S12) Then, the control unit 80 photographs the coated paste Pb with the preform camera 94. Then, the control unit 80 acquires and recognizes (measures) the photographed image (reference image) and stores (registers) the measurement result in the storage device 82.

[0058] The measurement results to be stored are the X coordinate (coating position X) and Y coordinate (coating position Y) of the coating position (center of gravity position of the area) of the paste Pb, and the area of the paste Pb (coating area). The measurement is at least one of the coating position of the paste Pb and the area of the paste Pb, and only one of the measurement results of the coating position of the paste Pb and the area of the paste Pb may be stored.

[0059] The above measurement results are calculated by the control unit 80 through image processing on the acquired reference image. The application position (Cb) of the paste Pb is the centroid position of the pixel, and the application area (CAb) of the paste Pb is the number of pixels.

[0060] (Step S13) Next, the operator replaces the syringe 91. Also, the operator removes the paste applied to the application area 101 of the discard stage 100.

[0061] (Step S14) As shown in FIG. 8, after replacing the syringe 91, the control unit 80 applies the paste to the application area 101 of the discard stage 100. Here, the pattern of the paste to be applied is the same as the pattern applied to the application area 101 of the discard stage 100 before replacing the syringe 91.

[0062] (Step S15) Then, the control unit 80 photographs the applied paste Pa with the preform camera 94. Then, the control unit 80 acquires and recognizes (measures) the photographed image (target image) and stores (registers) the measurement result in the storage device 82.

[0063] The measurement results to be stored are the X coordinate (application position X) and Y coordinate (application position Y) of the application position (centroid position of the area) of the paste Pa, and the area (application area) of the paste Pa. The inspection is at least one of the application position of the paste Pa and the area of the paste Pa, and the measurement results of the application position of the paste Pa and the area of the paste Pa may be stored for only one of them.

[0064] The above measurement results are calculated by the control unit 80 through image processing on the acquired target image. The application position (Ca) of the paste Pa is the centroid position of the pixel, and the application area (CAa) of the paste Pa is the number of pixels.

[0065] (Step S16) The control unit 80 corrects the positions of the syringe 91 and the nozzle 92 after replacement based on the application position (Cb) of the paste Pb measured in step S12 and the application position (Ca) of the paste Pa measured in step S15. Note that if the application position is not adjusted, step S16 is not executed.

[0066] (Step S17) Also, the control unit 80 corrects at least one of the discharge pressure and the discharge time of the dispenser 97 based on the application area (CAb) of the paste Pb measured in step S12 and the application area (CAa) of the paste Pa measured in step S15. Note that if the application amount is not adjusted, step S17 is not executed.

[0067] According to the embodiment, at least one of the following effects can be obtained.

[0068] (a) Since the paste applied to the disposable stage 100 by the preform camera 94 can be recognized to calculate the application position and the application amount, it becomes possible to adjust the application position and the application amount.

[0069] (b) Since it is possible to adjust the application position and the application amount of the paste on the disposable stage 100, it becomes possible to save production members compared to the case of applying the paste to a production member such as the substrate S and adjusting the application position and the like.

[0070] (c) Since it is possible to adjust the application position and the application amount of the paste on the disposable stage 100, it becomes possible to eliminate the influence of variations in production members.

[0071] (d) Since it is possible to adjust the application position and the application amount using image recognition, the influence of operation variations for each operator is eliminated. Thereby, it becomes possible to reduce the product defect rate.

[0072] <Modification Example> Hereinafter, some representative modifications of the embodiments will be exemplified. In the description of the following modifications, the same reference numerals as those in the above-described embodiments may be used for parts having the same configurations and functions as those described in the above-described embodiments. And for the description of such parts, within a technically consistent range, the description in the above-described embodiments may be appropriately incorporated. Also, a part of the above-described embodiments and all or part of a plurality of modifications may be appropriately and combinatorially applied within a technically consistent range.

[0073] (First Modification) The preform part in the first modification will be described with reference to FIG. 10. FIG. 10 is a side view showing the configuration of the preform part in the first modification.

[0074] The discard stage 100 in the first modification is made of a material that is transparent to visible light such as glass. The under-vision camera (imaging device) 104 in the first modification is disposed below the discard stage 100. The control unit 80 applies paste onto the discard stage 100 with the syringe 91. Then, the control unit 80 photographs the paste applied to the discard stage 100 from the back side (downward) of the discard stage 100 to confirm the application position and application area of the paste. Since the photographing surface of the paste is flat, it is possible to more accurately recognize the shape of the paste.

[0075] (Second Modification) The discard stage in the second modification will be described with reference to FIG. 11. FIG. 11 is a top view showing the discard stage in the second modification.

[0076] The discard stage 100 in the second modification is movable, for example, movable in the X direction. Thereby, it becomes possible to provide a plurality of application regions 101 on the discard stage 100, and it becomes possible to expand the application area of the paste.

[0077] As described above, the disclosure made by the present inventors has been specifically described based on embodiments and modifications. However, it goes without saying that the present disclosure is not limited to the above embodiments and modifications and can be variously changed.

[0078] For example, in the embodiment, an example in which the paste applied to the discard stage 100 is photographed by the preform camera 94 has been described. However, the paste may be photographed by a camera different from the preform camera 94.

[0079] Also, in the embodiment, an example in which paste is applied to the substrate S has been described. However, paste may be applied to a die that has already been bonded.

[0080] Also, in the embodiment, an intermediate stage portion 30 is provided between the wafer supply unit 10 and the bonding unit 40, the die D picked up from the wafer supply unit 10 by the pickup head 21 is placed on the intermediate stage 31, and the die D is picked up again from the intermediate stage 31 by the bond head 41 and bonded to the transported substrate S. However, the die D picked up from the wafer supply unit 10 by the bond head 41 may be bonded to the substrate S.

Explanation of Reference Numerals

[0081] 1 ··· Die bonder (semiconductor manufacturing apparatus) 80 ··· Control unit (control device) 91 ··· Syringe 92 ··· Nozzle 94 ··· Preform camera (imaging device) 96 ··· Preform stage (second stage) 100 ··· Discard stage (first stage)

Claims

1. A syringe having a nozzle at its tip and containing paste, a first stage where the paste is applied by the syringe, a second stage for supporting a substrate on which the paste is applied by the syringe, an imaging device for recognizing the paste applied to the first stage, a control device configured to adjust the application position or application amount of the syringe after replacement based on the recognition result of the first paste applied to the first stage by the syringe before replacement and the recognition result of the second paste applied to the first stage by the syringe after replacement, comprising: The control device is photographing the first paste by the imaging device, recording the first application position or the first application area calculated from the photographed image in a storage device, photographing the second paste by the imaging device, and recording the second application position or the second application area calculated from the photographed image in the storage device, A semiconductor manufacturing apparatus configured to correct the position of the syringe after replacement based on the first application position and the second application position, or correct the discharge amount of the syringe after replacement based on the first application area and the second application area.

2. In the semiconductor manufacturing apparatus according to Claim 1, The control device is configured to apply the first paste and the second paste to a predetermined area of the first stage. A semiconductor manufacturing apparatus.

3. In the semiconductor manufacturing apparatus according to Claim 1, Furthermore, it includes a driving unit for moving the syringe, The control device is configured to move the syringe by the driving unit based on the first application position and the second application position to adjust the application position. A semiconductor manufacturing apparatus.

4. In the semiconductor manufacturing apparatus according to Claim 1, Furthermore, it includes a dispenser for supplying pressurized gas to the syringe, The control device is configured to adjust the application amount by changing the pressure of the dispenser based on the first application area and the second application area. A semiconductor manufacturing apparatus.

5. A syringe having a nozzle at its tip and containing paste, a first stage where the paste is applied by the syringe, a second stage for supporting a substrate on which the paste is applied by the syringe, an imaging device for recognizing the paste applied to the first stage, A control device configured to adjust the application position or application amount of the syringe after replacement based on the recognition result of the first paste applied to the first stage by the syringe before replacement and the recognition result of the second paste applied to the first stage by the syringe after replacement. Comprising The first stage is composed of a member that is transparent in visible light. The paste is applied to the upper surface of the first stage. The imaging device is a semiconductor manufacturing apparatus disposed below the first stage.

6. In the semiconductor manufacturing apparatus according to claim 1, The first stage is a semiconductor manufacturing apparatus configured to be movable.

7. In the semiconductor manufacturing apparatus according to claim 1, The control device is a semiconductor manufacturing apparatus configured to photograph the substrate and the paste applied to the substrate by the imaging device.

8. In the semiconductor manufacturing apparatus according to claim 1, Furthermore, a semiconductor manufacturing apparatus comprising a bond head for placing a die on the substrate to which the paste is applied.

9. A syringe having a nozzle at its tip and storing the paste, A first stage, A second stage for supporting the substrate to which the paste is applied, An imaging device for imaging the paste applied to the first stage, A control device configured to adjust the application position or application amount of the syringe after replacement based on the recognition result of the first paste applied to the first stage by the syringe before replacement and the recognition result of the second paste applied to the first stage by the syringe after replacement. Comprising The control device Photographs the first paste by the imaging device, records the first application position or the first application area calculated from the photographed image in a storage device, Photographs the second paste by the imaging device, and records the second application position or the second application area calculated from the photographed image in the storage device. An application device configured to correct the position of the syringe after replacement based on the first application position and the second application position, or to correct the discharge amount of the syringe after replacement based on the first application area and the second application area.

10. A syringe having a nozzle at its tip and storing paste, a first stage, a second stage supporting a substrate on which the paste is to be applied, an imaging device for imaging the paste applied to the first stage, and a control device configured to adjust the application position or application amount of the syringe after replacement based on the recognition result of the first paste applied to the first stage by the syringe before replacement and the recognition result of the second paste applied to the first stage by the syringe after replacement. The control device photographs the first paste with the imaging device, records the first application position or the first application area calculated from the photographed image in a storage device, photographs the second paste with the imaging device, and records the second application position or the second application area calculated from the photographed image in the storage device. A step of loading a substrate into a semiconductor manufacturing apparatus configured to correct the position of the syringe after replacement based on the first application position and the second application position, or correct the discharge amount of the syringe after replacement based on the first application area and the second application area. A step of applying paste to the substrate supported by the second stage. A method of manufacturing a semiconductor device having the above.

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