Surface material for foam insulation board and foam insulation board

Abstract

To provide a surfacing material for a foam insulation board that has high adhesion to concrete, can maintain the insulation performance of a foam insulator, and can also maintain excellent interlayer bonding.SOLUTION: The present invention provides a surfacing material for a foam insulation board fixed to concrete, which comprises mixed paper 2 comprising a component for improving adhesion to the concrete, and a gas barrier layer 3, and comprises no metal layer.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a surface material for a foamed heat insulating board and a foamed heat insulating board using the same.

Background Art

[0002] In recent years, in buildings using reinforced concrete, a rigid heat insulating board containing a foamed heat insulating material has been used to enhance heat insulation performance. In this case, for example, a method is performed in which concrete is placed in a formwork, and after the concrete has hardened, the formwork is removed to construct a concrete body part such as a concrete slab or a concrete wall, and a rigid heat insulating board is attached to the concrete body part using an adhesive or the like. On the other hand, in order to improve construction costs and construction periods, a foamed heat insulating board that also serves as a concrete formwork has been proposed (for example, Patent Document 1).

[0003] The foamed heat insulating material contained in the heat insulating board is for the purpose of improving heat insulation performance, and a heat insulating gas other than air is enclosed in the internal bubbles. Conventionally, in some cases, a metal foil such as aluminum foil having high gas barrier performance is attached to the surface of such a foamed heat insulating material in order not to leak the internal gas to the outside.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] As described above, when foam insulation boards are used in concrete buildings, good adhesion between the concrete and the foam insulation board is required. For this reason, foam insulation boards are known in which a mixed paper containing calcium carbonate or other ingredients, which has excellent adhesion to concrete, is bonded to the foam insulation material. However, because the mixed paper has poor gas barrier properties, the insulating gas contained in the foam insulation material may escape to the outside, which may prevent the insulation performance of the foam insulation material from being maintained.

[0006] Foam insulation boards are known in which a surface material containing a metal layer, such as aluminum foil, is attached to a foam insulation material to maintain the insulating performance of the foam insulation material. However, alkaline components in concrete can corrode the metal layer, generating gases that can reduce the adhesion between the layers constituting the surface material and between the foam insulation board and concrete.

[0007] The present disclosure has been made in consideration of the above circumstances, and aims to provide a surface material for foam insulation boards that has good adhesion to concrete, can maintain the insulating performance of the foam insulation material, and can maintain good interlayer adhesion. [Means for solving the problem]

[0008] One embodiment of the present disclosure is a surface material for a foam insulation board to be fixed to concrete, the surface material having a mixed paper containing a component that improves adhesion to the concrete, and a gas barrier layer, and no metal layer is disposed thereon.

[0009] One embodiment of the present disclosure is a foam insulation board comprising a foam insulation material and the above-mentioned foam insulation board surface material arranged on at least one side of the foam insulation material, wherein the foam insulation board surface material is arranged so that the mixed paper is on the opposite side to the foam insulation material. [Effects of the Invention]

[0010] The present disclosure can provide a surface material for a foamed heat-insulating board that has good adhesion to concrete, can maintain the heat-insulating performance of the foamed heat-insulating material, and can maintain good interlayer adhesion.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Embodiments for Carrying Out the Invention

[0012] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings and the like. However, the present disclosure can be implemented in many different modes and is not to be construed as being limited to the description of the embodiments exemplified below. Also, the drawings may schematically represent the width, thickness, shape, etc. of each part compared to the actual form for the purpose of making the explanation clearer, but this is merely an example and does not limit the interpretation of the present disclosure. Further, in this specification and each figure, elements that are the same as those described above with respect to the previously presented figures may be denoted by the same reference numerals, and detailed descriptions may be appropriately omitted.

[0013] In this specification, when describing a mode in which another component is placed on a certain component, the terms "above" or "below" are used, unless otherwise specified, to include both a case in which another component is placed directly above or below a certain component so as to be in contact with the component, and a case in which another component is placed above or below a certain component with another component interposed therebetween. Also, in this specification, when describing a mode in which another component is placed on the surface of a certain component, the terms "on the surface side" or "on the surface" are used, unless otherwise specified, to include both a case in which another component is placed directly above or below a certain component so as to be in contact with the component, and a case in which another component is placed above or below a certain component with another component interposed therebetween.

[0014] Figure 6 is a schematic cross-sectional view of a foam insulation board using a conventional foam insulation board facing material. Foam insulation board facing material 51 in foam insulation board 100 shown in Figure 6 includes mixed paper 52, such as calcium carbonate mixed paper, and adhesive layer 53, with mixed paper 52 positioned opposite foam insulation material 61. When fixing foam insulation board 100 to concrete, mixed paper 52 of foam insulation board facing material 51 is positioned so that it comes into contact with the concrete.

[0015] Such surface materials for foam insulation boards have excellent adhesion to concrete because they use mixed paper containing calcium carbonate, but because the mixed paper has poor gas barrier properties, the insulating gas sealed in the foam insulation material may leak to the outside, making it impossible to maintain its insulating performance.

[0016] 7 is a schematic cross-sectional view of a foam insulation board using another conventional foam insulation board facing material. Foam insulation board facing material 71 in foam insulation board 101 shown in FIG. 7 includes, in this order, mixed paper 72 such as mixed paper containing calcium carbonate, adhesive layer 73, metal layer 74 such as aluminum foil, and adhesive layer 75, with mixed paper 72 facing away from foam insulation material 81.

[0017] Such a foam insulation board surface material contains a metal layer with excellent gas barrier properties, allowing the foam insulation material to maintain its insulating performance. However, alkaline components in the concrete may seep into the mixed paper, corroding the metal layer. The gas generated by the corrosion reaction of the metal layer may reduce the adhesion between the layers constituting the surface material and between the foam insulation board and the concrete. Furthermore, differences in thermal expansion and contraction may cause cracks in the layer that adheres to the metal layer, resulting in a loss of adhesion to the metal layer. Furthermore, the inclusion of a metal layer results in a high incineration ash content, which places a heavy burden on the environment.

[0018] The inventors, faced with such problems, have conducted extensive research and have found the following surface material for foam insulation boards, thereby solving the above problems. The foam insulation board surface material and foam insulation board according to the present disclosure will be described in detail below.

[0019] A. Surface material for foam insulation board The surface material for a foam insulation board disclosed herein is a surface material for a foam insulation board that is fixed to concrete, and is characterized by having a mixed paper containing a component that improves adhesion to the concrete, a gas barrier layer, and no metal layer.

[0020] In this specification, the term "metal layer" refers to a metal layer in which the constituent metal atoms are bonded to each other by metallic bonds. Examples of the metal layer include metal foils such as aluminum, nickel, stainless steel, iron, copper, and titanium, and thin metal films (e.g., metal vapor deposition films).

[0021] Fig. 1 is a schematic cross-sectional view showing an example of a foam insulation board surface material of the present disclosure. As shown in Fig. 1, the foam insulation board surface material 1 of the present disclosure has a mixed paper 2 containing a component for improving adhesion to concrete and a reinforcing material, and a gas barrier layer 3, but does not have a metal layer.

[0022] Figure 2 is a schematic cross-sectional view showing an example of a foam insulation board comprising a foam insulation board facing material of the present disclosure. As shown in Figure 2, foam insulation board 10 comprises foam insulation material 11 and the foam insulation board facing material 1 described above disposed on at least one side of foam insulation material 11, with foam insulation board facing material 1 disposed so that the gas barrier layer 3 faces the foam insulation board 11. When fixing foam insulation board 10 to concrete, mixed paper 2 of foam insulation board facing material 1 is disposed so that it contacts the concrete directly or via an adhesive or the like.

[0023] In the surface material for a foam insulation board of the present disclosure, the gas barrier layer 3 preferably has an inorganic compound film 3a and a resin substrate 3b supporting the inorganic compound film 3a, as shown in Figure 3. In this case, the inorganic compound film 3a is preferably disposed on the mixed paper 2 side.

[0024] The foam insulation board surface material of the present disclosure has good adhesion to concrete due to the presence of a mixed paper containing a component for improving adhesion to concrete. Furthermore, by having a gas barrier layer and not having a metal layer, the insulating performance of the foam insulation material can be maintained, and gas generation caused by corrosion of the metal layer can be suppressed, maintaining good interlayer adhesion and good adhesion to concrete. Furthermore, because the foam insulation board surface material of the present disclosure does not have a metal layer, it has the advantage of reducing incineration ash content and reducing environmental impact.

[0025] Hereinafter, each configuration of the surface material for foam insulation board in the present disclosure will be described.

[0026] 1. Gas barrier layer The gas barrier layer in the present disclosure is a layer other than a metal layer such as a metal foil or a metal thin film, and examples thereof include an inorganic compound film, a film having an MOP bond (where M represents a metal atom, O represents an oxygen atom, and P represents a phosphorus atom), a film containing a polyvalent metal salt of a polycarboxylic acid polymer, and a mixed compound film containing a metal element, an oxygen element, and a hydrophilic group-containing resin. In the present disclosure, the gas barrier layer preferably has an inorganic compound film, and more preferably has a metal oxide film.

[0027] Examples of inorganic compounds constituting the inorganic compound film include oxides, oxynitrides, nitrides, oxide carbides, and oxide carbonitrides of metal or nonmetal elements such as silicon, aluminum, magnesium, calcium, potassium, tin, sodium, titanium, boron, yttrium, zirconium, cerium, and zinc. Specific examples include silicon oxides such as SiO2, aluminum oxides such as Al2O3, magnesium oxide, titanium oxide, tin oxide, silicon-zinc alloy oxides, indium alloy oxides, silicon nitride, aluminum nitride, titanium nitride, silicon oxide nitride, and zinc silicon oxide. Metal oxides, especially aluminum oxide (alumina) and silicon oxide (silica), are particularly preferred. The inorganic compounds may be used alone or in any combination.

[0028] The inorganic compound film can be formed by a conventionally known method such as a coating method, a physical vapor deposition method such as a vacuum deposition method, a sputtering method, or an ion plating method, a chemical vapor deposition method such as a plasma chemical vapor deposition method, a thermal chemical vapor deposition method, or a photochemical vapor deposition method, or a pressure bonding method. Among these, a vapor deposition film is preferred from the viewpoint of exhibiting high gas barrier performance. When the film is a vapor deposition film, it may be formed by a single vapor deposition or by multiple vapor depositions.

[0029] The thickness of the inorganic compound film is not particularly limited, but may be, for example, 5 nm to 500 nm, 8 nm to 200 nm, or 15 nm to 100 nm. By setting the thickness of the inorganic layer within the above range, sufficient flexibility can be maintained and barrier breakdown is less likely to occur.

[0030] Examples of the film having the MOP bond (where M represents a metal atom, O represents an oxygen atom, and P represents a phosphorus atom) include a film containing a reaction product of a metal oxide and a phosphorus compound.

[0031] Examples of the metal oxide include oxides of metals with a valence of 2 or higher. Specifically, metals in Group 2 of the periodic table such as magnesium and calcium; metals in Group 12 of the periodic table such as zinc; metals in Group 13 of the periodic table such as aluminum; metals in Group 14 of the periodic table such as silicon; and oxides of transition metals such as titanium and zirconium can be mentioned. Among them, aluminum oxide (alumina) is preferred.

[0032] Examples of the phosphorus compound include phosphoric acid, polyphosphoric acid, phosphorous acid, phosphonic acid, and their derivatives. Among them, phosphoric acid is preferred. Regarding the reaction product of a specific metal oxide and a phosphorus compound, it can be made the same as the reaction product disclosed in, for example, JP-A-2011-226644.

[0033] The presence of the M-O-P bond can be confirmed by the appearance of a maximum infrared absorption peak in the range of 800 cm -1 to 1400 cm -1 or less in the infrared absorption spectrum (measurement frequency range). Regarding the method for measuring the infrared absorption spectrum, it is not particularly limited, and for example, a measurement method by the total reflection measurement method (ATR method), a method of scraping a sample from the inorganic layer of the surface material and measuring its infrared absorption spectrum by the KBr method, a method of measuring the collected sample by microscopic infrared spectroscopy, etc. can be used. -1 to 1130 cm -1 or less in the infrared absorption spectrum (measurement frequency range). Regarding the method for measuring the infrared absorption spectrum, it is not particularly limited, and for example, a measurement method by the total reflection measurement method (ATR method), a method of scraping a sample from the inorganic layer of the surface material and measuring its infrared absorption spectrum by the KBr method, a method of measuring the collected sample by microscopic infrared spectroscopy, etc. can be used.

[0034] The gas barrier layer in the present disclosure preferably has a resin substrate that supports the above-described inorganic compound film, a film having the above M-O-P bond, etc. In this case, it is preferable that the above-described inorganic compound film or the like is disposed on the side of the mixed pulp paper. When a foamed heat insulating boat is used, the resin substrate is disposed on the side of the foamed heat insulating material, and the adhesion between the foamed heat insulating material and the surface material becomes good.

[0035] As such a resin base material, for example, a resin film or the like is preferably used. When the resin base material is a resin film, the resin film may be unstretched, or may be uniaxially or biaxially stretched. The resin base material may or may not have transparency.

[0036] The resin used for the resin base material is not particularly limited. For example, polyolefin resins such as polyethylene and polypropylene, polyester resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate (PBT), polyamide resins such as various nylons, ethylene-vinyl alcohol copolymer (EVOH resin), cyclic polyolefin resin, polystyrene resin, acrylonitrile-styrene copolymer (AS resin), acrylonitrile-butadiene-styrene copolymer (ABS resin), poly(meth)acrylic resin, polycarbonate resin, ethylene-vinyl ester copolymer and its saponified product, polyimide resin, polyurethane resin, acetal resin, cellulose resin and other various resins can be used.

[0037] In the present disclosure, among the above resins, PET, nylon, and EVOH resin are more preferably used. This is because PET has high strength and excellent versatility. Also, the EVOH resin is excellent in oxygen barrier properties. Furthermore, nylon is excellent in puncture strength and can suppress breakage when attaching lumber or interior materials to the heat insulation board.

[0038] The resin base material may contain various plastic compounding agents, additives, and the like. Examples of the additives include lubricants, crosslinking agents, antioxidants, ultraviolet absorbers, light stabilizers, fillers, reinforcing agents, antistatic agents, pigments, modifying resins, and the like.

[0039] The resin substrate may be subjected to a surface treatment, which can improve adhesion to the gas barrier layer. Examples of the surface treatment include oxidation treatment, surface roughening treatment, and easy-adhesion coating treatment, as disclosed in JP-A-2014-180837.

[0040] The thickness of the resin substrate is not particularly limited, but is, for example, within a range of 6 μm to 200 μm, more preferably 9 μm to 100 μm. The resin substrate may be a single layer, or may be a multilayer body formed by laminating multiple resin layers. In the multilayer body, each resin layer may be made of a different resin or the same resin. In the present disclosure, a laminate of multiple layers of the above resin substrate and inorganic compound film can also be used.

[0041] 2. Mixed paper The mixed paper of the present disclosure contains a component that improves adhesion to concrete, such as calcium carbonate or aluminum hydroxide.

[0042] The mixed paper in the present disclosure is made by mixing the adhesion improving component with pulp and making paper, for example, a mixed paper made by making a slurry containing pulp and the adhesion improving component, followed by dehydration and drying.

[0043] The mixed paper of the present disclosure preferably contains the adhesion improving component in an amount of 50% by weight or more, in order to ensure improved adhesion to concrete, whereas the amount is, for example, 60% by weight or less.

[0044] Examples of pulp include natural pulp such as wood pulp, cotton pulp, and vegetable fiber pulp. The pulp content in the mixed paper is, for example, 20% by weight or more, and, for example, 30% by weight or less.

[0045] In the mixed paper of the present disclosure, in addition to pulp and adhesion improving components, optional components such as a reinforcing material and a binder may be included. Examples of the reinforcing material include glass fibers. The content of the reinforcing material in the mixed paper is preferably 5% by weight or more. This is because the strength of the mixed paper can be increased. Also, for example, it is 15% by weight or less. Examples of the binder component include acrylic synthetic resins and acrylamide synthetic resins. The content of the binder component in the mixed paper, together with the water repellent, is, for example, 5% by weight or more. Also, for example, it is 15% by weight or less.

[0046] The thickness of the mixed paper is not particularly limited, but for example, it is 100 μm or more, and preferably 150 μm or more. This is because the strength of the mixed paper can be increased. On the other hand, for example, it is 400 μm or less, and preferably 300 μm or less. This is because an increase in weight and cost can be suppressed.

[0047] 3. Others The surface material for the foamed heat insulating board of the present disclosure may include a gas barrier layer and layers other than the mixed paper. FIG. 4 is a schematic cross-sectional view showing another example of the surface material for the foamed heat insulating board of the present disclosure. As shown in FIG. 4, in the surface material 1 for the foamed heat insulating board of the present disclosure, an adhesive layer 4 may be disposed between the mixed paper 2 and the gas barrier layer 3. In FIG. 4, the gas barrier layer 3 has an inorganic compound film 3a and a resin base material 3b. Also, an anchor coat layer 5 may be disposed between the adhesive layer 4 and the gas barrier layer 3.

[0048] FIG. 5 is a schematic cross-sectional view showing an example of a foamed heat insulating board provided with the surface material for the foamed heat insulating board of the present disclosure shown in FIG. 4. The foamed heat insulating board 10 shown in FIG. 4 includes a foamed heat insulating material 11 and the above-described surface material 1 for the foamed heat insulating board disposed on at least one surface of the foamed heat insulating material 11, and the resin base material 3b of the gas barrier layer 3 of the surface material 1 for the foamed heat insulating board is disposed so as to face the foamed heat insulating material 11 side.

[0049] (1) Adhesive layer The surface material for the foamed heat-insulating board of the present disclosure may be provided with an adhesive layer for adhering the mixed pulp paper and the gas barrier layer. Such an adhesive layer can use conventionally known adhesives, for example, pressure-sensitive adhesives, thermoplastic adhesives, and curable adhesives.

[0050] The adhesive constituting the adhesive layer is usually a two-component curable adhesive containing a main agent and a curing agent, but is not limited thereto. For example, a one-component curable adhesive obtained by mixing a main agent and a latent curing agent blocked by a known method so as not to react even when mixed with the main agent, or a one-component curable adhesive obtained by mixing a curing agent and a latent main agent blocked by a known method so as not to react even when mixed with the curing agent may be used.

[0051] Examples of the adhesive constituting the adhesive layer include epoxy adhesives, polyvinyl acetate adhesives, polyacrylate adhesives, cyanoacrylate adhesives, ethylene copolymer adhesives, cellulose adhesives, polyester adhesives, polyamide adhesives, polyimide adhesives, amino resin adhesives, phenol resin adhesives, polyurethane adhesives, reactive (meth)acrylic acid adhesives, inorganic rubber adhesives, silicone adhesives, and inorganic adhesives such as alkali metal silicates or low-melting glasses.

[0052] In addition, a polyolefin resin can be used as the adhesive layer. Specific examples of the polyolefin resin include low-density polyethylene (LDPE), medium-density polyethylene (MDPE), high-density polyethylene (HDPE), polypropylene (PP), linear (linear) low-density polyethylene (LLDPE), ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene-acrylic acid copolymer, ethylene-methacrylic acid copolymer, ethylene-methyl methacrylate copolymer, ethylene-propylene copolymer, etc. and mixtures of these resins.

[0053] An adhesive layer using the above-mentioned polyolefin-based resin is formed, for example, by extruding a composition for the adhesive layer that has been melted by heating onto a gas barrier film that constitutes the gas barrier layer, and then placing a mixed paper on top of the melted composition, thereby impregnating a portion of the composition into the mixed paper, and then pressing and cooling the mixture.

[0054] (2) Anchor coat layer The surface material for a foam insulation board of the present disclosure may be provided by forming an anchor coat layer between the gas barrier layer and the adhesive layer, if necessary. As the anchor coat layer, a conventionally known one can be used.

[0055] (3) Barrier Coat Layer When the gas barrier layer of the foam insulation board surface material of the present disclosure has an inorganic compound film and a resin substrate, the surface material may have a barrier coating layer on the side of the inorganic compound film opposite the resin substrate side. The provision of a barrier coating layer can improve the gas barrier performance of the foam insulation board surface material. The material for the barrier coating layer can be a common material used as a barrier coating agent or an overcoat agent.

[0056] 4. Characteristics (1) Gas barrier properties The surface material for a foam insulation board of the present disclosure has a gas barrier layer and therefore has gas barrier performance. In this disclosure, gas barrier performance refers to oxygen barrier performance defined by oxygen permeability and water vapor barrier performance defined by water vapor permeability.

[0057] The surface material for foam insulation boards in this disclosure has an oxygen permeability of 5.0 cc / (m 2 ·day·atm) or less, and 1.0cc / (m 2 It is particularly preferable that the water vapor permeability is 5.0 g / m 2 ·day or less. As a method for measuring the oxygen permeability and water vapor permeability, for example, the method described in the Examples can be adopted.

[0058] (2) Ash content Since the surface material for the foam insulation board of the present disclosure does not contain a metal layer, the incineration ash can be reduced. The ash content of the surface material for the foam insulation board of the present disclosure is preferably 25% by mass or more and 35% by mass or less when heated up to 600°C. In the present disclosure, the ash content of the constituent members constituting at least a part of the surface material for the foam insulation board may be within the above range when heated up to 600°C.

[0059] The constituent member is a member having at least a mixed paper and a gas barrier layer, and may be (i) a mixed paper and a gas barrier layer, (ii) a mixed paper, a gas barrier layer, and an adhesive layer, or (iii) a mixed paper, a gas barrier layer, an adhesive layer, and an anchor coat layer. As a method for measuring the ash content, for example, the method described in the examples can be adopted.

[0060] (3) Puncture strength The surface material for the foam insulation board of the present disclosure preferably has a puncture strength of 7 N or more, more preferably 10 N or more. This is because when attaching a wooden beam or an interior material to the insulation board, the destruction of the surface material can be suppressed. As a method for measuring the puncture strength, for example, the method described in the examples can be adopted.

[0061] 5. Concrete The surface material for the foam insulation board of the present disclosure has excellent adhesion to concrete. In this specification, concrete is a solidified paste obtained by adding water to cement and mixing it, and may contain fine aggregates such as sand and coarse aggregates such as gravel as aggregates.

[0062] Specific examples of concrete in the present disclosure include cement obtained by mixing and solidifying cement with water, mortar obtained by mixing and solidifying cement with water and fine aggregate (sand), and concrete obtained by mixing and solidifying cement with water and aggregate (fine aggregate (sand) and coarse aggregate (gravel)). Examples of cement include those used in ordinary concrete structures, such as Portland cements specified in JIS R 5210, including ordinary Portland cement, high-early-strength Portland cement, ultra-high-early-strength Portland cement, and moderate-heat Portland cement, as well as blended cements such as blast-furnace cement, fly ash cement, and silica cement.

[0063] B. Foam insulation board The foam insulation board of the present disclosure comprises a foam insulation material and the above-mentioned foam insulation board surface material arranged on at least one side of the foam insulation material, and the foam insulation board surface material is arranged so that the mixed paper is on the opposite side to the foam insulation material.

[0064] Figures 2 and 5 are schematic cross-sectional views showing an example of a foam insulation board according to the present disclosure. Figures 2 and 5 have already been explained in the section "A. Surface material for foam insulation board" above, so further explanation will be omitted here.

[0065] The foam insulation board of the present disclosure has the above-mentioned foam insulation board surface material, which allows it to maintain good adhesion to concrete and good interlayer adhesion of the surface material, while also maintaining thermal insulation performance. Each component of the foam insulation board of the present disclosure will be described below.

[0066] 1. Surface material for foam insulation board The surface material for the foam insulation board in the present disclosure may be arranged on at least one side of the foam insulation board, for example, it may be arranged on one side of the foam insulation board or on both sides of the foam insulation board.

[0067] Since the surface material for the foamed heat-insulating board has been described in detail in the section of "A. Surface material for the foamed heat-insulating board" above, the description here is omitted.

[0068] 2. Foamed heat-insulating material The foamed heat-insulating material in the present disclosure is composed of a rigid material having heat-insulating properties. As the foamed heat-insulating material, generally, the foamed heat-insulating material commonly used for heat-insulating boards can be used, and examples thereof include rigid urethane foam, phenolic foam, and the like. Examples of the heat-insulating gas enclosed in the internal air bubbles include fluorocarbon-based gases such as CFC (chlorofluorocarbon), HCFC (hydrochlorofluorocarbon), and HFC (hydrofluorocarbon).

[0069] Rigid urethane foam is mainly formed by the reaction of a hydroxyl group (OH group) and an isocyanate group, and includes isocyanurate foam generally included in the definition of rigid urethane foam. Rigid urethane foam can be formed, for example, using a polyol compound having a hydroxyl group (OH group), an isocyanate compound having an isocyanate group, a foaming agent, and the like. The polyol compound is not particularly limited, and for example, polyether polyol, polyester polyol, polyether ester polyol, and the like can be used. The polyol compound may be used alone or in combination of two or more. As the isocyanate compound, for example, an aliphatic or aromatic polyisocyanate having two or more isocyanate groups, a mixture thereof, and a modified polyisocyanate obtained by modifying them can be used.

[0070] Phenolic foam can be formed, for example, using a phenolic resin, a foaming agent, a curing agent, and the like.

[0071] The foaming agent may be, for example, a fluorine-based foaming agent. Specifically, a fluorocarbon material with low thermal conductivity, particularly a hydrofluorocarbon (HFC) material, may be used. The raw materials for the foam insulation may contain, for example, a catalyst, an additive, a flame retardant, etc.

[0072] The thickness of the foam insulation is, for example, 5 mm or more and 500 mm or less, and may be 10 mm or more and 200 mm or less.

[0073] The shape of the foamed heat insulating material in plan view is not particularly limited, and it can be cut into any shape, such as a rectangle, a polygon, or a circle, for use.

[0074] 3. Other configurations In the foam insulation board of the present disclosure, it is sufficient that the foam insulation board facing material described above is disposed on at least one side of the foam insulation material, and for example, the foam insulation board facing material described above may be disposed on both sides of the foam insulation material, or the foam insulation board facing material described above may be disposed on one side of the foam insulation material with the other side exposed, or the foam insulation board facing material described above may be disposed on one side of the foam insulation material with another facing material disposed on the other side of the foam insulation material.

[0075] As the other surface materials, surface materials generally used for heat insulating boards can be used, such as glass paper, plastic sheets, moisture-proof paper, calcium carbonate paper, resin-impregnated paper, coated paper, nonwoven fabric, etc.

[0076] 4.Other As the method for manufacturing the above-mentioned foam heat-insulating board, a general method for manufacturing a heat-insulating board can be used. For example, using a mold (foaming mold) composed of a lower mold and an upper mold, in which a cavity for a foam heat-insulating material with a target thickness is formed, the surface material for the foam heat-insulating board of the present disclosure is placed on the bottom surface of the cavity of the lower mold with the resin base material facing upward, and the surface material for the back surface is arranged. Then, for example, in a state where the temperature is adjusted to 120 °C, the foam heat-insulating material composition is injected into the cavity. And then, the upper mold of the mold in which the other surface material is set so that the resin base material faces downward is covered on the lower mold of the mold to close the mold. After the foam heat-insulating material composition is foamed in the cavity, the molded product is demolded. The closed-cell ratio is preferably 10 to 40%. Note that the closed-cell ratio in the present invention is a value measured according to ASTM D 2856.

[0077] The rigid urethane foam used for the foam heat-insulating body has self-adhesiveness and adheres to the surface material by the above-mentioned integrated foaming method. Also, for the purpose of improving the adhesion, a general adhesive may be used on the surface of the surface material that contacts the foam heat-insulating material.

[0078] The foam heat-insulating board of the present disclosure can be used, for example, in reinforced concrete buildings such as houses and factories. In particular, since at least one surface of the foam heat-insulating board of the present disclosure is a mixed pulp paper with excellent adhesion to concrete, it has excellent adhesion to concrete. Therefore, it can be suitably used as a formwork combined heat-insulating board that also serves as a concrete formwork.

[0079] Note that the present disclosure is not limited to the above-mentioned embodiments. The above-mentioned embodiments are examples, and any configuration that has substantially the same configuration as the technical idea described in the claims of the present disclosure and exhibits the same operational effects is included in the technical scope of the present disclosure.

Examples

[0080] Examples and comparative examples are shown below to explain the present disclosure in more detail.

[0081] [Example 1] A 200 μm-thick calcium carbonate-blended paper was prepared. A gas barrier film was also prepared, consisting of a 12 μm-thick PET substrate with an aluminum oxide (AlOx) vapor-deposited film formed on one side. The calcium carbonate-blended paper and the vapor-deposited film side of the gas barrier film were bonded together via an adhesive layer (a 15 μm-thick polyethylene layer) and an anchor coat layer. A foam insulation board surface material was produced by laminating the calcium carbonate-blended paper (200 μm), polyethylene layer (15 μm), anchor coat layer, aluminum oxide vapor-deposited film, and PET (12 μm) in this order.

[0082] [Example 2] Except for using 200 μm thick aluminum hydroxide-mixed paper instead of calcium carbonate-mixed paper, a surface material for a foam insulation board was produced in the same manner as in Example 1. The resulting surface material for a foam insulation board was composed of aluminum hydroxide-mixed paper (200 μm), a polyethylene layer (15 μm), an anchor coat layer, an aluminum oxide vapor-deposited film, and PET (12 μm) laminated in this order.

[0083] [Example 3] Except for using a gas barrier film in which a silicon oxide vapor deposition film (SiOx) was formed on one side of a 12 μm-thick PET substrate, a surface material for a foam insulation board was produced in the same manner as in Example 1. The resulting surface material for a foam insulation board was composed of calcium carbonate-blended paper (200 μm), a polyethylene layer (15 μm), an anchor coat layer, a silicon oxide vapor deposition film, and PET (12 μm) laminated in this order.

[0084] [Example 4] Except for using a gas barrier film in which a silicon oxide vapor deposition film (SiOx) was formed on one side of a 15 μm-thick nylon substrate, a surface material for a foam insulation board was produced in the same manner as in Example 1. The resulting surface material for a foam insulation board was composed of calcium carbonate-blended paper (200 μm), a polyethylene layer (15 μm), an anchor coat layer, a silicon oxide vapor deposition film, and nylon (15 μm) laminated in this order.

[0085] [Comparative Example 1] A surface material for foam insulation board was produced, consisting of a 200 μm thick calcium carbonate mixed paper and a 15 μm thick polyethylene layer.

[0086] Comparative Example 2 A surface material for foam insulation board was produced, consisting of a 200 μm thick aluminum hydroxide mixed paper and a 15 μm thick polyethylene layer.

[0087] Comparative Example 3 A surface material for foam insulation board was produced by laminating, in this order, a 200 μm thick calcium carbonate mixed paper, a 15 μm thick polyethylene layer, a 6 μm thick aluminum foil, and a 15 μm thick polyethylene layer.

[0088] Comparative Example 4 A surface material for foam insulation board was manufactured by laminating, in this order, a 200 μm thick calcium carbonate-blended paper, a 15 μm thick polyethylene layer, a 6 μm thick aluminum foil, a 15 μm thick polyethylene layer, and a 12 μm thick PET layer.

[0089] Comparative Example 5 A surface material for foam insulation board was manufactured by laminating a 200 μm thick calcium carbonate mixed paper, a 15 μm thick polyethylene layer, an anchor coat layer, and a 12 μm thick PET layer in this order.

[0090] Comparative Example 6 A surface material for foam insulation board was produced by laminating a 200 μm thick aluminum hydroxide mixed paper, a 15 μm thick polyethylene layer, an anchor coat layer, and a 12 μm thick PET layer in this order.

[0091] <Oxygen permeability and water vapor permeability evaluation> The oxygen permeability and water vapor permeability of the resulting foam insulation board surface material were measured as follows. The results are shown in Tables 1 and 2.

[0092] Oxygen permeability is based on JIS K7126-2:2006 (Plastics - Films and Sheets) Togas Permeability Test Method - Part 2: Isobaric Method, Annex A: Test Method for Oxygen Gas Permeability by Electrolytic Sensor Method Based on (Test method for oxygen gas permeability by electrolytic sensor method), measurement was carried out using an oxygen gas permeability measuring device. As the oxygen gas permeability measuring device, "OXTRAN" manufactured by MOCON, USA was used. The measurement was carried out by mounting the surface material cut into a desired size in the above device so that the surface of the mixed paper was in contact with oxygen gas, with a permeation area of about 50 cm 2 (Permeation area: circular with a diameter of 8 cm), and the measurement was carried out under the conditions of a carrier gas and a test gas at a temperature of 23°C and a humidity of 60%RH.

[0093] During the above measurement, a carrier gas was supplied into the above device at a flow rate of 10 cc / min for 60 minutes or more for purging. As the above carrier gas, nitrogen gas containing about 5% hydrogen was used. After purging, a test gas was flowed into the above device, and measurement was carried out after ensuring 12 hours as the time from the start of flowing until reaching the equilibrium state. As the test gas, at least 99.5% dry oxygen was used. The measurement of oxygen permeability was carried out for at least 3 samples under one condition, and the average of those measured values was taken as the value of oxygen permeability under that condition.

[0094] The water vapor permeability was measured using a water vapor permeability measuring device in accordance with JIS K 7129-2:2019 Plastics - Films and Sheets - Methods of Test for Water Vapor Transmission - Part 2: Infrared Sensor Method. As the water vapor permeability measuring device, PERMATRAN-w 3 / 33 manufactured by MOCON was used. The measurement was carried out under the conditions of a temperature of 40°C and a relative humidity difference of 90%RH as follows. First, a sample of the surface material cut into a desired size was mounted between the upper chamber and the lower chamber of the above device so that the layer of the mixed paper was on the high humidity side (water vapor supply side), with a permeation area of about 50 cm 2 (Permeation area: circular with a diameter of 8 cm), and the measurement was carried out under the conditions of a temperature of 40°C and a relative humidity difference of 90%RH.

[0095] <Ash Residue Evaluation> The resulting foam insulation board surface material was measured for ash residue when heated to 600°C using the following method. The results are shown in Tables 1 and 2. For the environmental impact assessment, an ash residue of 35% or less was marked with a ◯, and an ash residue of more than 35% was marked with an ×. The mass of the sample was measured using a simultaneous thermogravimetry / differential thermal analyzer (TG-DTA). After measuring the mass, the sample was heated from room temperature to 600°C at a rate of 10°C / min in an aluminum pan under air, and then heated at 600°C for 30 minutes to incinerate the sample. The post-heating mass was expressed as a percentage of the pre-heating mass. The thermogravimetry / differential thermal analyzer used was a TG8120 manufactured by Rigaku Corporation.

[0096] <Piercing test> The puncture strength of the resulting foam insulation board surface material was measured using the following method. The results are shown in Tables 1 and 2. The puncture strength was determined in accordance with JIS Z 1707, General Rules for Food Packaging Plastic Films, 7.4, Puncture Strength Test. First, a 50mm x 50mm test piece was cut out from an integrated surface material and foam insulation material (rigid urethane foam). The test piece was fixed in place, and a semicircular needle with a diameter of 1.0mm and a tip radius of 0.5mm was pierced into the center at a speed of 50±5mm per minute, and the maximum stress until the needle penetrated was measured.

[0097] [Insulation board manufacturing] A foam molding mold (foam molding die) consisting of a lower and upper molds and containing a cavity for the foam insulation material of the desired thickness was used. The resulting foam insulation board facing material was placed on the bottom of the cavity in the lower mold, with the resin substrate facing upward. The temperature was adjusted to 120°C, and a foam insulation composition (polyol compound, isocyanate compound, and fluorine-based blowing agent) for forming a rigid urethane foam was poured into the cavity. Then, another foam insulation board facing material was prepared, and the upper mold was set with the resin layer facing downward. The upper mold was placed over the lower mold and closed. The foam insulation composition was foamed in the cavity, and the molded product was demolded to obtain an insulation board. The resulting insulation board was evaluated as follows. The results are shown in Tables 1 and 2.

[0098] <Evaluation of Adhesion to Concrete> For the obtained heat insulation board, the adhesion to concrete was evaluated by the following method. · Evaluation method In the structure of the general driving method, concrete was poured between the wooden frame and the obtained heat insulation board. After the concrete was sufficiently dried, the wooden frame was removed, and a tensile jig was adhered to the heat insulation board and concrete with a strong adhesive. A tensile test was performed using an Instron universal testing machine to obtain the material fracture strength and evaluated according to the following evaluation criteria.

[0099] · Evaluation criteria 〇: 10 N / cm 2 or more ×: 10 N / cm 2 or less

[0100] <Evaluation of Maintenance of Heat Insulation Performance> For the obtained heat insulation board, the initial thermal conductivity and the thermal conductivity after the following evaluation time were measured and evaluated by the following method. The thermal conductivity is the value measured in accordance with JIS A 9511. · Evaluation condition / time 60°C / 20 days · Evaluation criteria Performance degradation from the initial state 〇: 8% or less △: 8 - 10% ×: 10% or more

[0101] <Evaluation of Maintenance of Adhesion> For the obtained heat insulation board, it indicates whether there is a possibility that the adhesion between the first layer and the second layer is lost due to the corrosion of the aluminum foil. 〇: No possibility ×: A structure in which the strong alkaline concrete reacts with the aluminum foil and there is a possibility that the adhesion is lost due to the corrosion of the aluminum foil surface

[0102]

Table 1

[0103]

Table 2

[0104] As shown in Tables 1 and 2, the foam insulation boards using the foam insulation board surfacing materials of Examples 1 to 4 were able to maintain their thermal insulation performance. They also had good adhesion to concrete. Furthermore, there was no risk of a decrease in interlayer adhesion between the first and second layers constituting the surfacing material. On the other hand, the foam insulation board surfacing materials of Comparative Examples 1 and 2 lacked a gas barrier layer and therefore had poor gas barrier properties, making it impossible to maintain their thermal insulation performance. Furthermore, the foam insulation board surfacing materials of Comparative Examples 3 and 4 were able to maintain their thermal insulation performance, but there was a possibility that the interlayer adhesion between the first and second layers would be lost due to corrosion of the aluminum foil. Furthermore, due to the presence of aluminum foil, there was more ash residue than in the Examples. Furthermore, Comparative Examples 5 and 6 used PET as the second layer, but had poor gas barrier properties and were unable to maintain their thermal insulation performance. [Explanation of symbols]

[0105] 1. Surface material for foam insulation board 2 … Mixed paper 3...Gas barrier layer 4 … Adhesive layer 5... Anchor coat layer 10...Insulation board 3a … Inorganic compound film 3b…Resin base material

Claims

1. A surface material for a foamed heat-insulating board fixed to concrete, comprising a mixed paper containing an adhesion-improving component for the concrete and a gas barrier layer, wherein the gas barrier layer has an inorganic compound film, A surface material for a foamed heat-insulating board in which no metal layer is disposed.

2. The surface material for a foamed heat-insulating board according to Claim 1, wherein the mixed paper contains a reinforcing material.

3. The surface material for a foamed heat-insulating board according to Claim 1 or Claim 2, wherein the inorganic compound film contains at least one of aluminum oxide and silicon oxide.

4. The gas barrier layer further has a resin base material that supports the inorganic compound film, The surface material for a foamed heat-insulating board according to any one of Claims 1 to 3, wherein the inorganic compound film is disposed so as to be on the mixed paper side.

5. The surface material for a foamed heat-insulating board according to Claim 4, wherein the resin base material is composed of polyethylene terephthalate, nylon, and an ethylene-vinyl alcohol copolymer.

6. The oxygen permeability is 5.0 cc / (m ２ ·day·atm) or less, and the water vapor permeability is 5.0 g / m ２ ·day or less, the surface material for a foamed heat insulating board according to any one of claims 1 to 5.

7. The surface material for a foamed heat-insulating board according to any one of Claims 1 to 6, wherein the adhesion-improving component contains at least one of calcium carbonate and aluminum hydroxide.

8. The surface material for a foamed heat-insulating board according to any one of Claims 1 to 7, characterized in that the ash content when heated to 600 °C is 25% by mass or more and 35% by mass or less.

9. A foamed heat-insulating material and a surface material for a foamed heat-insulating board according to any one of Claims 1 to 8 disposed on at least one surface side of the foamed heat-insulating material, A foamed heat-insulating board, wherein the surface material for a foamed heat-insulating board is disposed so that the mixed paper is on the side opposite to the foamed heat-insulating material side.

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