Adhesive formulation for manufacturing a press material molded body

Abstract

The present invention relates to a chemically curable, aqueous, two-component adhesive formulation for forming press material bodies, in particular press material plates. Component A of the adhesive formulation comprises an aqueous phase of 20 to 100% by weight of a reactive resin functionalized with epoxy groups or a mixture of reactive resins functionalized with epoxy groups. Component B of the adhesive formulation comprises an aqueous phase of 30 to 100% by weight of a curing agent having functional amine groups or a mixture of curing agents having functional amine groups. The present invention also relates to a method for forming press material bodies, in particular press material plates, using such adhesive formulations.

Description

[Technical Field]

[0001] The present invention relates to a chemically curable, aqueous, two-component adhesive formulation for producing pressed material bodies, in particular pressed material plates, and to a method for producing pressed material bodies, in particular pressed material plates, by continuous or discontinuous compression of a mixture of the adhesive formulation and chip or fiber material, or by compressing layers of the adhesive formulation and chip or fiber material. [Background technology]

[0002] The term "pressed material molding" generally refers to a molding formed by bonding a material containing chip material and / or fiber material while curing a mixed adhesive compound, applying pressure, and optionally heating. The most common use of such moldings is in the form of plates. Thus, the term "pressed material molding" includes, for example, chipboard, especially coarse chipboard (also known as oriented strand board; OSB), medium-density (wood) fiberboard (also known as MDF board), high-density (wood) fiberboard (also known as HDF board), and also laminated or layer-bonded board structures such as plywood.

[0003] Thus, the chip material or fiber material includes very common materials, such as recycled materials like waste paper and sawmill waste, fibers including wood fibers or cellulose fibers such as those from recycled building materials, other natural - derived fibers such as straw, bamboo, etc., and also synthetic fibers such as, for example, polyester fibers. Of course, materials containing mixtures of fibers of various properties are also included in the chip material or fiber material. The chip material or fiber material can have completely different shapes and different degrees of fragmentation. That is, the chip material or fiber material can already exist in a formed shape and thus, for example, as a fiber composite like the veneer plywood described above. However, the chip material or fiber material can be provided in various degrees of comminution and in a more or less scattered form. For example, with a relatively low degree of comminution like that of the so - called chips in chipboard or OSB mentioned above, or also, for example, with a relatively high degree of comminution like that of the so - called wood flour, such as that melted, in MDF board and HDF board mentioned above, in a scattered form.

[0004] Regardless of the type of chip material or fiber material, what is common to the (various) methods of manufacturing a press - material formed body is that the chip material and / or fiber material having an adhesive formulation is pressed in a mold under pressure and sometimes also heat.

[0005] Adhesive formulations for the above-mentioned applications are generally known, and these known adhesive formulations must, of course, be adapted to the type of molding or plate to be produced and, accordingly, to the process to be applied. In some cases, chemically very different adhesive formulations are used for various processes. For example, when producing so-called fiberboards, mainly urea-formaldehyde resins, also known as UF resins, and to a lesser extent isocyanate-based resins, are used, while phenolic resins are mainly used for bonding or gluing veneer layers. This need to adapt the adhesive formulation to a given process and / or product can have economical disadvantages.

[0006] Furthermore, the adhesive formulations currently used in the methods for producing pressed material bodies have in common the fact that they release harmful substances, especially during the curing process. Examples of such pollutants include volatile components and decomposition products, especially of formaldehyde- and isocyanate-based formulations. Although attempts have already been made to at least reduce the amount of pollutants that can be released in the adhesive formulations that are currently used, other problems, especially process engineering problems, often arise in the formulation of such low-pollutant formulations.

[0007] For example, when manufacturing a press material formed piece, in order to economically implement the method, the working time must be made sufficiently short. Therefore, in the methods mainly used today, the pressing of the chip material or fiber material and the adhesive is carried out at a high temperature. The production of chip board or fiber board is generally carried out at a temperature of 200°C to 250°C. Therefore, this high temperature is necessary, especially to obtain sufficient and as complete curing as possible within the core of the press mixture. This is because, for example, the heating of the press cake composed of the chip material or fiber material and the adhesive is carried out from the side, and the heat must be transmitted into the inner core. Of course, this high temperature can often cause damage to the formed body, such as cracking of the formed body, in the currently used adhesive formulations, including modified examples that reduce harmful substances, and thus result in a high rate of defective products. Patent Document 1 discloses an aqueous two-component adhesive formulation that is chemically curable based on a resin component and a curing agent component. The resin component that can be disclosed in Patent Document 1 has an aqueous emulsion having an acrylic polymer functionalized with an epoxy group and a wetting agent. The curing agent component of Patent Document 1 has an aqueous phase having hexamethylenetetramine as a curing agent and a low molecular weight alcohol, particularly methanol, and a thickening agent. [Prior Art Documents] [Patent Documents] [Patent Document 1] Japanese Patent Application Laid-Open No. 6-172733 [Summary of the Invention] [Problems to be Solved by the Invention]

[0008] The problem of the present invention is to overcome the drawbacks of the prior art, and to be able to manufacture the formed body with the highest possible reliability, reduce the amount of contaminants during the process while avoiding a large number of defective products, and at the same time, provide an adhesive formulation that can be used as universally as possible in various manufacturing methods for press material formed bodies. Furthermore, the problem of the present invention is to provide a method for manufacturing a press material formed body using this type of adhesive formulation. [Means for Solving the Problems]

[0009] This problem is solved on the one hand by a chemically curable aqueous two-component adhesive formulation for producing pressed material bodies, in particular pressed material plates, by continuously or discontinuously compressing a mixture of the adhesive formulation and chip material or fiber material, or by compressing a laminate of the adhesive formulation and fiber material plates.

[0010] The chemically curable, two-part, aqueous adhesive formulation has a first, aqueous, component A, which contains at least one chemically curable reactive resin. Additionally, the chemically curable, two-part, aqueous adhesive formulation contains a second, aqueous, component B, which contains at least one curing agent for the chemically curable reactive resin of component A. Components A and B are prepared to form the chemically curable, two-part adhesive formulation by mixing components A and B. In other words, the curable, two-part adhesive formulation is formed by mixing the two components A and B, or the curable, two-part adhesive formulation is formed by mixing the two components A and B. Mixing of components A and B is preferably performed immediately prior to use, thus, can be performed immediately prior to bonding chip or fiber material or immediately prior to bonding chip or fiber material plates, as described in more detail below.

[0011] Component A comprises 20 to 100% by weight of an aqueous phase having a resin content of 30 to 70% by weight of a reactive resin functionalized with epoxy groups or a mixture of reactive resins functionalized with epoxy groups, and component B comprises 20 to 100% by weight of an aqueous phase having a hardener content of 30 to 70% by weight of a hardener containing amine groups or a mixture of hardeners containing amine groups.

[0012] Preferably, component A can have an aqueous phase of 30% to 100% by weight, particularly 40% to 100% by weight, of a reactive resin functionalized with a functional epoxy group or a mixture consisting of a reactive resin functionalized with a functional epoxy group. Preferably, the resin content of the aqueous phase of component A can be 40% to 65% by weight, particularly 40% to 60% by weight.

[0013] Component B can preferably have an aqueous phase of 35% to 100% by weight, particularly 40% to 100% by weight, of a curing agent having a functional amine group or a mixture consisting of a curing agent having a functional amine group. Preferably, the aqueous phase of component B can have a curing agent content of 40% to 65% by weight, particularly 40% to 60% by weight.

[0014] In this case, the aqueous two-component adhesive formulation consists of 20% to 80% by weight of component A and 20% to 80% by weight of component B. In other words, the two-component adhesive formulation is formed by mixing 20% to 80% by weight of component A and 20% to 80% by weight of component B. In particular, the two-component adhesive formulation may consist of 30% to 70% by weight of component A and 30% to 70% by weight of component B.

[0015] The aqueous phases of components A and B are interpreted as an aqueous dispersion and / or an aqueous suspension and / or an aqueous emulsion and / or an aqueous solution of this reactive substance, respectively, depending on the type of reactive substance used, and thus depending on the reactive resin and the crosslinking agent / curing agent, respectively. Here, the remainder can be formed mainly by water, in weight%, and thus up to 100% by weight of the aqueous phase. However, the aqueous phases of components A and B can also have other components, such as, for example, a dispersion aid and / or a suspension aid or its stabilizer, an emulsifier, an antifoaming agent, etc.

[0016] Furthermore, in addition to the aforementioned aqueous phase, Components A and B can have other components, substances, or additives, such as pigments for example. Examples of preferred additives that Components A and B can have will be further described in detail below. As long as Component A and / or Component B further have other components, especially additives, those skilled in the art must appropriately select a proportion less than 100% by weight of the aqueous phase of the reactive resin or curing agent with respect to the corresponding component (A or B) from a specific weight % range. When Component A and / or Component B have further additives, within the described weight % range, the weight % ratio of Component A to Component B must also be adapted.

[0017] The adhesive formulation or two-component adhesive formulation can also be referred to as a paste (Leimformulierung), as is customary in the adhesive preparation, sizing agent, or in the terminology of the relevant technical field. In particular, the two-component adhesive formulation can be intended for use in the manufacture of chipboard, fiberboard, and laminated board structures such as veneer plywood lumber boards, for example.

[0018] The two-component adhesive formulation having the described features is characterized, on the one hand, by the fact that it can be used without releasing harmful substances. As experiments show, in the described adhesive formulation, in particular, no formaldehyde and isocyanate are released when curing the adhesive formulation during the process of manufacturing the press material molded body. Thereby, for example, when mainly using a wood fiber-based fiber material, the formaldehyde release can be restricted or reduced, at least compared to the amount of formaldehyde released from the wood fiber material itself, compared to conventional adhesive formulations. This means, in the subsequent result, advantages regarding the release of harmful substances during the manufacture of the press material molded body or press material molded plate and the associated significant improvement of, for example, working conditions.

[0019] Surprisingly, it has also been shown that the two-component adhesive formulation of a particular composition can be universally used in the technical field of producing pressed material moldings without the need for substantial adaptation.Therefore, for example, this two-component adhesive formulation can be used to produce chipboard, MDF board, HDF board and OSB plate, as well as chipboard or plywood, or similar production methods can be carried out using the two-component adhesive formulation.

[0020] Furthermore, it has been demonstrated that when using this two-component adhesive formulation, the temperature during the pressing process can be significantly reduced compared to conventional adhesive formulations according to the prior art. In experiments, for example, when producing MDF boards, the temperature during the pressing process can be reduced to approximately 160°C or less when using this two-component adhesive formulation. This is in comparison to the temperatures of over 200°C that are usually required when using conventional adhesive formulations. This, in principle, also leads to a reduction in energy costs and, therefore, to a reduction in production costs.

[0021] In this context, the two-component adhesive formulation has also proven advantageous in terms of the production of pressed material molded bodies without or at least with reduced rejects. Apparently, when using the two-component adhesive formulations described, on the one hand, good heat conduction from the outer regions of a press cake, consisting of, for example, chip material or fiber material and adhesive formulation, is achieved, so that a sufficiently high core temperature can be achieved in the core region during the pressing of such a press cake, allowing for as complete a hardening as possible. This is particularly evident from the mechanical properties that can be achieved, such as the mechanical bending strength and / or transverse tensile strength of the molded body produced as a plate, which clearly fall within or exceed the standardized requirements for the respective plate, for example, MDF board or HDF board. On the other hand, the relatively low temperatures required during the pressing process to harden the adhesive formulation of the invention as completely as possible seem to prevent damage during the pressing process and the resulting rejects.

[0022] Two-component adhesive formulation to In the component A, the aqueous phase of the epoxy-functionalized reactive resin or mixture of epoxy-functionalized reactive resins has an epoxy equivalent weight of 200 g / mol to 1500 g / mol. 。

[0023] It has been found that the amount of epoxy groups within the specified range is particularly suitable for the curing reaction of the reactive resin of component A with the curing agent having amine groups of component B. Preferably, the aqueous phase of the epoxy-functionalized reactive resin of component A, or of the mixture of epoxy-functionalized reactive resins, can have an epoxy equivalent weight of 450 g / mol to 1100 g / mol.

[0024] The aqueous phase of component B, of the curing agent having an amine group, or of the mixture consisting of the curing agent having an amine group, can have an amine active hydrogen equivalent of from 200 g / mol to 700 g / mol. Preferably, the aqueous phase of component B, of the curing agent having an amine group, or of the mixture consisting of the curing agent having an amine group, can have an amine active hydrogen equivalent of from 250 g / mol to 600 g / mol.

[0025] In particular, with respect to the amine active hydrogen equivalent of the aqueous phase of the curing agent having a functional amine group of component B, or of the mixture consisting of the curing agent having a functional amine group, the ratio of the epoxy equivalent of the aqueous phase of the reactive resin functionalized by the functional epoxy group of component A, or of the mixture consisting of the reactive resin functionalized by the functional epoxy group, can be from 3:1 to 1:2.

[0026] It has been clarified that the equivalent ratio is advantageous for the curing of the two-component adhesive formulation in the course of the pressing process within the specified range, and is also advantageous for the mechanical properties achievable by the pressed material molded body accordingly.

[0027] As is known per se, the concept of a functionalized resin can generally be understood as a chemical substance in which each functional group, in this case the epoxy group of the reactive resin of component A or the amine group of the curing agent of component B, is chemically bonded and present on an oligomer or polymer carrier or hydrocarbon backbone. The nature of the carrier can basically be of various natures.

[0028] Preferably, the reactive resin functionalized by an epoxy group or the mixture consisting of the reactive resin functionalized by the epoxy group of component A can be selected from the group consisting of a functionalized acrylate resin, a functionalized styrene acrylate resin, a functionalized acrylic acid copolymer, a functionalized (meth)acrylate-copolymer, a functionalized acrylate-urethane-copolymer and a functionalized cationic polyester.

[0029] Depending on the type of resin(s) and / or polymer(s) functionalized with epoxy groups used, the aqueous phase of component A can be in the form of an aqueous dispersion, suspension or emulsion. Particularly in the case of cationic systems, the aqueous phase of component A can also be formed by an aqueous solution. Examples of suitable aqueous phases for component A include Evonik's product, Ancarez® AR555.

[0030] The curing agent having a functional amine group of component B or a mixture consisting of a curing agent having a functional amine group can be a functional acrylate, functional acrylate-polymer, functional acrylate-copolymer, polyamine attached adducts, functional acrylate-urethane-copolymers, functional styrene-acrylate resins and cationic epoxy amines attached and can be selected from the group consisting of.

[0031] An example of a suitable aqueous phase for component B is here Evonik's Anquamin® 728.

[0032] In a preferred embodiment, component A or component B may contain 0.1 wt% to 20 wt% of one or more polyhydric alcohols.

[0033] By using one or more polyhydric alcohols within a specific weight percentage range, it is possible to effectively prevent or delay, particularly if necessary, the premature or extremely rapid curing of a two-component adhesive formulation after mixing of the components. The polyhydric alcohol acts as a reaction retarder in specific reactive resins or curing agents / crosslinking agents of the two-component adhesive formulation. That is, the necessary mixing with the chip material or fiber material and / or the coating of the board containing the chip material or fiber material can be carried out without the high risk of overly rapid curing. This feature is particularly meaningful in the process of carrying out the mixing of the two-component adhesive formulation with the chip material or fiber material at an elevated temperature, for example, as in the so-called blow line. It has been demonstrated that it is particularly effective when component A or component B has one or more polyhydric alcohols in an amount from 1 wt% to 17 wt%. As the polyhydric alcohol, glycols such as butyl diglycol can be used.

[0034] Component A and B can each have a pH value from 7 to 10.

[0035] From such a perspective, when using a polyhydric alcohol as a reaction retarder, it is meaningful to adjust the pH value of the polyhydric alcohol to a pH value that is at least approximately equivalent to the pH value of the component, for example, adjusted to a pH value from 7 to 10, and then add the polyhydric alcohol to the component when forming the component by adding the polyhydric alcohol. By this measure, particularly, the undesirable aggregation of the components of component A or component B can be prevented.

[0036] In a further embodiment, the two-component adhesive formulation may contain from 0.2 wt% to 10 wt% of an anionic wax or a neutral wax, or a mixture of similar waxes.

[0037] This in particular improves the adhesion of chip or fibrous materials and therefore the blending of chip or fibrous materials and the lamination of chip or fibrous boards. Preferably, component A or component B of the two-component adhesive formulation may contain 1 to 6% by weight of an anionic or neutral wax or a similar wax mixture. A suitable wax or wax mixture is, for example, the product Hydrowax A 18 from Sasol.

[0038] As an alternative to one or more waxes as components A or B, solid waxes can also be added during the process of adhering chip or fiber materials by adhesive mixing, as will be explained in more detail below using the method for producing pressed material compacts.

[0039] In other embodiments of the two-part adhesive formulation, either Component A or Component B may contain from 0.1% to 50% by weight of one or more fillers and / or pigments.

[0040] By means of fillers and / or pigments, it is finally possible to adjust the mechanical properties and / or the color of the pressed material body.

[0041] Additionally, it may be effective for either Part A or Part B of the two-part adhesive formulation to have from 0.1% to 12% by weight of one or more wetting agents or surfactants.

[0042] This feature makes it possible, in particular, to improve the handling of the aqueous phase of the ingredients and to improve the adhesion properties of two-component adhesive formulations. A suitable wetting agent is, for example, Disperbyk 190 from Byk.

[0043] Additionally, Component A or Component B may contain 0.1% to 15% by weight of one or more antifoaming agents.

[0044] This feature can, in particular, have an advantageous effect on the pressing process, for example to prevent the formation of air bubbles, during the process of manufacturing a pressed material compact. Examples of suitable defoamers include, for example, Surfynol 420 or Surfynol DF 75 from Evonik.

[0045] Component A or component B of the two-component adhesive formulation can further have from 0.1% to 15% by weight of one or more thickeners.

[0046] Examples of suitable thickeners include Rheolate 310D from Elemenis and / or Acrysol RM 8W from Dow. By using this type of thickener, the rheology and, in particular, the processing characteristics of the two-component adhesive formulation can be adjusted or adapted to requirements. Specifically, the adhesive formulation having a thickener is particularly suitable for forming a coating film, for example by roller coating.

[0047] The object of the present invention is also solved by a first method for manufacturing a pressed material compact, in particular a pressed material plate.

[0048] This method has the following steps: - preparing a chip material or a fiber material or a mixture of chip material and fiber material; - preparing a chemically curable adhesive formulation; - mixing the chip material or fiber material or mixture of chip material and fiber material with the adhesive formulation to form a press cake; - continuously compressing the press cake while curing the adhesive formulation, or manufacturing press cake pieces and discontinuously compressing the press cake pieces in a press mold while curing the adhesive formulation.

[0049] In this method, as the adhesive formulation, plea Claim 13It is important that a chemically curable, water-based, two-component adhesive formulation is used, as defined in, in which the presscake or presscake pieces have a weight percentage of chip or fiber material or a mixture of chip or fiber material of 77% to 98.5% by weight and a weight percentage of the adhesive formulation of 1% to 20% by weight.

[0050] The advantages of this type of process, and of the use of specific two-component adhesive formulations, have already been described in connection with the above description of two-component adhesive formulations. The two-component adhesive formulation can be formed in the manufacturing process by combining two components A and B. The combining or mixing of the two components can be carried out before or even during the step of mixing the chip or fiber material and / or the chip or fiber material mixture with the adhesive formulation to produce a press cake.

[0051] Chip or fibrous materials are materials containing fibers such as wood or cellulose fibers, including, for example, fibers from waste paper, other recycled materials such as sawdust or recycled construction wood, other naturally occurring fibers such as straw, bamboo, etc., and also synthetic fibers such as polyester fibers. Chip or fibrous materials and / or chip or fibrous material mixtures can be quite different in form, in particular, quite different in degree of grinding. Chip or fibrous materials and / or chip or fibrous material mixtures can be provided with various degrees of grinding, for example, with a relatively small degree of grinding, such as so-called chips, for example in the above-mentioned chipboards or OSB, or with a relatively high degree of grinding, such as fused so-called wood flour, for example in the above-mentioned MDF and HDF boards.

[0052] In a further embodiment of the method, 0.1 wt% to 3 wt% of a solid wax can be added during the process of mixing the chip material or the fiber material or a mixture of chip materials or a mixture of fiber materials with the adhesive formulation.

[0053] Thereby, in particular, the adhesion of the chip material or the fiber material or a mixture of chip materials or a mixture of fiber materials, and thus the mixing of the adhesive formulation with the chip material or the fiber material or a mixture of chip materials or a mixture of fiber materials, can be improved.

[0054] Finally, however, the problem of the present invention is also solved by other methods of manufacturing the press material plate. This other method has the following steps: - Prepare a plate having a number of chip materials or fiber materials, - Coat at least one surface of the plate provided for coupling with another plate with the adhesive formulation, - Stack the coated plates to form a plate stack, - Compress the plate stack in a press mold while curing the adhesive formulation.

[0055] In this further method, as the water-soluble two-component adhesive formulation, plea Claims 15 It is again important that a chemically curable adhesive formulation as defined in the claims is used. Here, the weight ratio of the plates in the plate stack is 80 wt% to 99 wt%, and the weight ratio of the adhesive formulation in the plate stack is 1 wt% to 20 wt%.

[0056] To better understand the present invention, the present invention and the method of forming a press material plate will be described in detail below using non-limiting examples and with the aid of figures.

[0057] Within the framework of the present invention, an example of the composition of a chemically curable, water-soluble two-component adhesive formulation is as follows: Component A Ancarez (Registered Trademark) AR555; Evonik; 45.66 wt%, butyldiglycol; 5 wt%, Hydrowax A 18; Sasol; 1 wt%; Component B Anquamine (Registered Trademark) 728; Evonik; 48.34 wt%.

[0058] In the described examples, the weight percentage ratios of the individual components of the two-component adhesive formulation are based on 100 wt% of the two-component adhesive formulation consisting of Component A and Component B. Thus, in the described examples, Component A consists of 88.38 wt% Ancarez (Registered Trademark) AR555, 9.68 wt% butyldiglycol and 1.94 wt% Hydrowax A 18, based on 100 wt% of Component A. In the described examples, Component B consists of 100 wt% Anquamine (Registered Trademark) 728. In this example, the two-component adhesive formulation is composed of 51.66 wt% Component A and 48.34 wt% Component B.

[0059] Ancarez (Registered Trademark) AR555 is an aqueous phase or dispersion of a non-ionic reactive resin functionalized with epoxy groups, having a solids content of approximately 55 wt% and an epoxy equivalent of 550 g / mol.

[0060] Anquamine (Registered Trademark) 728 is an aqueous phase of a curing agent having an amine group, having a solids content of approximately 55 wt% and an amine active hydrogen equivalent (H-aktiv AEquivalentgewicht) (AHEW) of 250 g / mol, and is an aqueous phase of a curing agent having a functional amine group.

[0061] It has been proven that a particular two-component adhesive formulation is basically good and universally suitable for use in known methods for manufacturing press material moldings.

[0062] However, the specific two-component adhesive formulations should be regarded as examples only, and adapted or other formulations or recipes can be used instead of the adhesive formulations described above, depending on the specific requirements of the respective method for producing the pressed material compacts.

[0063] Thus, for example, the product Ancarez® AR555 can replace and / or be mixed with other aqueous phases of epoxy-functionalized reactive resins or mixtures of epoxy-functionalized reactive resins. Preferably, the epoxy-functionalized reactive resins or mixtures of epoxy-functionalized reactive resins of component A can be selected from the group consisting of functionalized acrylate resins, functionalized styrene acrylate resins, functionalized acrylic acid copolymers and (meth)acrylate copolymers, functionalized acrylate-urethane copolymers and functionalized cationic polyesters.

[0064] Similarly, the product Anquamine® 728 can replace or be mixed with other aqueous phases of functional amine-containing curing agents or mixtures of functional amine-containing curing agents, preferably component B, which are functionalized acrylates, functionalized acrylate polymers, functionalized acrylate copolymers, polyamines, etc. attached Additives, functionalized acrylate-urethane copolymers, functionalized styrene-acrylate resins and cationic epoxy amines attached The compound may be selected from the group consisting of:

[0065] Those skilled in the art will generally know products similar to those mentioned in the examples.

[0066] The butyl diglycol described in the above embodiments can also be replaced by other polyhydric alcohols, glycols, or mixtures of polyhydric alcohols, or can be mixed with them. Depending on the type of method for forming the press material molded body or according to process control, all of the polyhydric alcohols or mixtures of polyhydric alcohols as either component A or B can also be omitted. The same applies to the Hydro Wax A 18 described in the embodiments.

[0067] Furthermore, for component B, as shown for butyl diglycol and Hydro Wax A 18 in the above embodiments, each additive can be similarly added in place of component A.

[0068] Depending on the respective requirements or process control, it can also be effective for component A or component B of the two-component adhesive formulation to have other additives different from the additives described in the above embodiments, namely, butyl diglycol and Hydro Wax A 18. For example, component A or component B can have, for example, from 0.1 wt% to 50 wt% of one or more fillers and / or pigments, from 0.1 wt% to 12 wt% of one or more wetting agents, from 0.1 wt% to 15 wt% of one or more defoaming agents and / or from 0.1 wt% to 15 wt% of one or more thickeners. Furthermore, component A or component B can have from 0.1 wt% to 20 wt% of one or more polyhydric alcohols and from 0.2 wt% to 10 wt% of an anionic wax or a neutral wax.

[0069] Depending on the type and amount of each additive or according to the general requirements and process control of the method for forming the press material molded body, the weight percentage ratios of the components of component A and B of the adhesive formulation, namely, the aqueous phase, polyhydric alcohols, and various additives, can of course be adapted. In that case, the appropriate adaptation of the weight ratios of the components can be carried out by those skilled in the art within the weight percentage ranges described above for the individual components. Of course, the weight ratio of component A to component B of the two-component adhesive formulation can also be appropriately adjusted within the specified weight percentage range.

[0070] In particular, component A of the two-component adhesive formulation comprises 20 to 100% by weight of an aqueous phase of a reactive resin functionalized with epoxy groups or a mixture of reactive resins functionalized with epoxy groups, with a resin content of 30 to 70% by weight. Furthermore, component B of the two-component adhesive formulation comprises 30 to 100% by weight of an aqueous phase of a curing agent containing amine groups or a mixture of curing agents containing amine groups, with a curing agent content of 30 to 70% by weight. In this case, the aqueous two-component adhesive formulation comprises 30 to 70% by weight of component A and 30 to 70% by weight of component B.

[0071] The aqueous phase of the epoxy-functionalized reactive resin or mixture of epoxy-functionalized reactive resins (Component A) can have an epoxy equivalent weight of 200 g / mol to 1500 g / mol. The aqueous phase of the amine-functionalized curing agent or mixture of amine-functionalized curing agents (Component B) can have an amine active hydrogen equivalent weight of 200 g / mol to 700 g / mol. In this case, the ratio of the amine active hydrogen equivalent weight of the aqueous phase of the amine-functionalized curing agent or mixture of amine-functionalized curing agents (Component B) to the epoxy equivalent weight of the aqueous phase of the epoxy-functionalized reactive resin or mixture of epoxide-functionalized reactive resins (Component A) can be 3:1 to 1:2.

[0072] Additionally, components A and B may each have a pH value of 7 to 10.

[0073] In the following, an example embodiment of a method for producing a pressing material plate is further explained with the aid of the figures, which are each highly simplified, schematic representations. [Brief explanation of the drawings]

[0074] [FIG. 1]Figure 1 shows an embodiment of a continuous pressing process of a press cake for forming a press material plate. [FIG. 2] Figure 2 shows an example of a discontinuous pressing process for laminating a layer composed of a plate having a fiber material and a two-component adhesive formulation.

Embodiments for Carrying Out the Invention

[0075] A method for forming a press material molded body, particularly a press material plate, basically has the following steps: - Prepare a chip material or a fiber material or a mixture of a chip material and a fiber material. - Prepare a chemically curable adhesive formulation. - While forming a press cake, mix the chip material or the fiber material or the mixture of the chip material and the fiber material with the adhesive formulation. - Continuously press the press cake while curing the adhesive formulation, or produce press cake pieces and discontinuously compress the press cake pieces in a press mold while curing the adhesive formulation.

[0076] In this case, as the adhesive formulation, a chemically curable aqueous two-component adhesive formulation as described above and defined in the corresponding claims can be used.

[0077] Mixing a chip material or a fiber material or a mixture of a chip material and a fiber material with a two - component adhesive formulation, also referred to as gluing in specialized terminology, as is known per se, may be carried out in various ways. In this regard, as the most widespread methods, mechanical gluing or mixing in a mixing device, so - called gluing using a roller line, and, although rare, dry gluing (Trockenbeleimung) are carried out. Since these gluing or mixing methods are known to those skilled in the art, a detailed description can be omitted here. In this case, instead of the examples for two - component adhesive formulations containing wax (hydro wax A 18), during the process of mixing a chip material or a fiber material or a mixture of a chip material and a fiber material with an adhesive formulation, 0.1 wt% to 3 wt% of solid wax may be mixed.

[0078] Manufacturing a two - component adhesive formulation by mixing components A and B can be carried out, for example, before mixing with a chip material or a fiber material or also during the process of mixing with a chip material or a fiber material.

[0079] After or by mixing a chip material or a fiber material or a mixture of a chip material and a fiber material with a two - component adhesive formulation, a so - called press cake is formed or obtained, and then the press cake is compressed.

[0080] Figure 1 shows an embodiment of a continuous pressing process for a press cake 1. This kind of continuous pressing process of the press cake 1 can be carried out using a double-belt press 2 in the embodiment shown in Figure 1. The double-belt press 2 shown in the embodiment of Figure 1 has an so-called under-belt 3 on which the press cake 1 is applied and transferred, and an over-belt 4 as a pressing member. As shown in Figure 1, the press cake 1 is guided between the under-belt 3 and the over-belt 4 of the double-belt press 2, and is compressed or pressed at a desired pressing pressure by relatively adjusting the under-belt 3 and the over-belt 4. In the process of compressing the press cake 1, the two-component adhesive formulation is also cured, and the curing of the two-component adhesive formulation can be initiated or promoted, for example, by the heating means 5 shown in Figure 1.

[0081] Figure 1 shows only one possible embodiment for continuously pressing the press cake 1, but other continuously operating press systems, such as a press equipped with press rollers, or a press having a combination of belts and rollers, or a so-called calendar press, etc., are known per se and commonly used in the field of manufacturing press material moldings. In the case of continuous pressing, as shown in Figure 1, a press material strand 6 is obtained, which can then be separated by being cut into press material moldings, particularly press material plates.

[0082] For example, as is apparent from using the embodiment shown in Figure 1, instead of continuous compression, in this method, press cake pieces formed in a desired manner in advance, which can be obtained, for example, by dividing continuously discharged press cake, can be discontinuously pressed onto the press material molding while curing the two-component adhesive formulation. Such discontinuous compression can be carried out, for example, in a press mold having a displaceable press stamp.

[0083] Whether the process is carried out by continuously or discontinuously compressing the presscake or presscake pieces, the presscake or presscake pieces have a weight percentage of chip material or fiber material or a mixture of chip material or fiber material of from 77% to 98.5% by weight and a weight percentage of two-component adhesive formulation of from 1% to 20% by weight.

[0084] FIG. 2 shows a simplified and schematic representation of an alternative embodiment of a method for producing pressed material bodies, in particular pressed material plates, in which the two-component adhesive formulation according to the invention can also be used.

[0085] - providing a number of plates, in particular plywood, with chip or fiber material, - coating at least one surface of the plate intended for joining with other plates with an adhesive compound, - stacking the coated plates to form a plate stack, - Compressing the plate stack in a press mold while the adhesive compound cures.

[0086] 2 shows a corresponding plate stack 7, in which plates 8 with chip or fiber material are stacked together with a layer of a two-component adhesive compound 9, each of which is arranged between two plates 8. The plate stack 7, shown roughly diagrammatically in FIG. 2, can be compressed, for example, by means of a press stamp 10, possibly also in a press mold not shown in FIG. 2. Before being compressed, the plates 8 can be coated or glued with the adhesive compound 9, so that essentially one surface 11 of the plates, or at least both surfaces 11 of the inner plates 8, are also coated with the adhesive compound 9.

[0087] In the process control by compression of the plate laminate 7 shown in FIG. 2 as well, as the adhesive formulation, the above-described two-component adhesive formulation 9 can be used, and the weight ratio of the plates in the plate laminate is from 80% to 99% by weight, and the weight ratio of the adhesive formulation in the plate laminate is from 1% to 20% by weight.

[0088] It should be noted at this point that the embodiments show possible implementation variations, whereby the present invention is not limited to the specifically shown implementation variations.

[0089] The protection scope is defined by the claims. However, the description and the drawings should be used to consider the claims. Individual features or combinations of features of the various embodiments shown and described can represent independent inventive solutions in themselves. The problems underlying the independent inventive solutions can be read from the description.

[0090] All descriptions of value ranges within the specific description include any sub-ranges and all sub-ranges together. For example, the description from 1 to 10 includes all sub-ranges starting from the lower limit of 1 and the upper limit of 10, that is, all sub-ranges starting from 1 or more and ending at 10 or less, for example, from 1 to 1.7, or from 3.2 to 8.1, or from 5.5 to 10.

[0091] Finally, formally noted is that, for ease of understanding the structure, the members are not shown exactly to scale and are shown enlarged and / or reduced and / or. Note that as embodiments of the present invention, there are those shown below. [Aspect 1] A chemically curable aqueous two-component adhesive formulation for producing a press material molded body, particularly a press material plate, by continuously or discontinuously compressing a mixture of an adhesive formulation and a chip material and / or a fiber material, or by compressing a laminate of an adhesive formulation and a chip material and / or a fiber material, comprising: a first aqueous component A having at least one chemically curable reactive resin; a second aqueous component B having at least one curing agent for the chemically curable reactive resin of component A; and the components A and B are prepared to form a two-component adhesive formulation that is chemically curable by mixing the components A and B. In the case of the component A has an aqueous phase having a resin content of 30% to 70% by weight of a reactive resin functionalized with an epoxy group or a mixture consisting of a reactive resin functionalized with an epoxy group, and has 20% to 100% by weight; and the component B has an aqueous phase having a curing agent content of 30% to 70% by weight of a curing agent having an amine group or a mixture consisting of a curing agent having an amine group, and has 30% to 100% by weight; the aqueous two-component adhesive formulation consists of 20% to 80% by weight of the component A and 20% to 80% by weight of the component B. A chemically curable aqueous two-component adhesive formulation characterized by the above. [Aspect 2] The adhesive formulation according to Aspect 1, wherein the aqueous phase of the reactive resin functionalized with an epoxy group of the component A or the mixture consisting of the reactive resin functionalized with an epoxy group has an epoxy equivalent of 200 g / mol to 1500 g / mol. [Aspect 3] The aqueous phase of component B, the curing agent having an amine group, or the mixture composed of the curing agent having an amine group has an amine active hydrogen equivalent of 200 g / mol to 700 g / mol, and the adhesive formulation according to aspect 1 or 2, characterized in that. [Aspect 4] The ratio of the epoxy equivalent of the aqueous phase of component A, the reactive resin functionalized with an epoxy group, or the mixture composed of the reactive resin functionalized with an epoxy group to the amine active hydrogen equivalent of the aqueous phase of component B, the curing agent having an amine group, or the mixture composed of the curing agent having an amine group is 3:1 to 1:2, and the adhesive formulation according to any one of aspects 1 to 3, characterized in that. [Aspect 5] The reactive resin functionalized with the epoxy group of component A or the mixture composed of the reactive resin functionalized with the epoxy group is selected from the group consisting of a functionalized acrylate resin, a functionalized styrene acrylate resin, a functionalized acrylic acid copolymer and a functionalized (meth)acrylate copolymer, a functionalized acrylate-urethane-copolymer and a functionalized cationic polyester, and the adhesive formulation according to any one of aspects 1 to 4, characterized in that. [Aspect 6] The curing agent having an amine group of component B or the mixture composed of the curing agent having an amine group is selected from the group consisting of a functionalized acrylate, a functionalized acrylate polymer, a functionalized acrylate-copolymer, a polyamine additive, a functionalized acrylate-urethane-copolymer, a functionalized styrene-acrylate resin and a cationic epoxyamine additive. The adhesive formulation according to any one of aspects 1 to 5, characterized in that. [Aspect 7] Component A or component B has 0.1% by weight to 20% by weight of one or more polyhydric alcohols, and the adhesive formulation according to any one of aspects 1 to 6, characterized in that. [Aspect 8] Components A and B each have a pH value of 7 to 10, and the adhesive formulation according to any one of aspects 1 to 7, characterized in that. [Aspect 9] Component A or component B has 0.2% by weight to 10% by weight of an anionic wax, a neutral wax, or a mixture composed of these waxes, and the adhesive formulation according to any one of aspects 1 to 8, characterized in that. [Aspect 10] The adhesive composition according to any one of aspects 1 to 9, wherein the component A or the component B contains 0.1% by weight to 50% by weight of one or more fillers and / or pigments. [Aspect 11] The adhesive composition according to any one of aspects 1 to 10, wherein the component A or the component B contains 0.1% by weight to 12% by weight of one or more wetting agents. [Aspect 12] The adhesive composition according to any one of aspects 1 to 11, wherein the component A or the component B contains 0.1% by weight to 15% by weight of one or more defoaming agents. [Aspect 13] The adhesive composition according to any one of aspects 1 to 12, wherein the component A or the component B contains 0.1% by weight to 15% by weight of one or more thickeners. [Aspect 14] A method for forming a press material molded body, particularly a press material plate, comprising: - preparing a chip material and / or a fiber material or a mixture of a chip material and / or a fiber material; - preparing a chemically curable adhesive composition; - mixing the chip material and / or the fiber material or the mixture of the chip material and / or the fiber material with the adhesive composition to produce a press cake; - continuously compressing the press cake while curing the adhesive composition, or producing the press cake pieces and discontinuously compressing the press cake pieces in a mold while curing the adhesive composition; In the method having: As the adhesive composition, a chemically curable aqueous two-component adhesive composition according to any one of aspects 1 to 12 is used; The press cake or the press cake pieces have a weight ratio of 77% by weight to 98.5% of the chip material and / or the fiber material or the mixture of the chip material and / or the fiber material, and 1% by weight to 20% by weight of the adhesive composition; A method characterized by this. [Aspect 15] The method according to aspect 14, wherein 0.1% by weight to 3% by weight of a solid wax is mixed in the process of mixing the chip material and / or the fiber material or the mixture of the chip material and / or the fiber material with the adhesive composition. [Aspect 16] A method for forming a press material plate, comprising: - preparing a number of plates having a chip material and / or a fiber; - coating at least one surface of the plate intended for bonding to other plates with an adhesive compound; - stacking the coated plates to form a plate stack; - compressing the plate stack in a press while the adhesive formulation cures; 1. A method comprising: as the adhesive formulation, a chemically curable, water-based, two-component adhesive formulation according to any one of aspects 1 to 12 is used; The weight percentage of the plates in the plate stack is 80% to 99% by weight, and the weight percentage of the adhesive compound in the plate stack is 1% to 20% by weight. A method characterized by:

Description of Symbols

[0092] 1 Press Cake 2 Double Belt Press 3 Under Belt 4 Over Belt 5 Heating Means 6 Press Material Strand 7 Plate Laminate 8 Plate 9 Adhesive Composition 10 Press Stamp

Claims

1. A chemically curable two-component aqueous adhesive composition for producing a pressed material molded body by continuously or discontinuously compressing a mixture of an adhesive composition and a chip material and / or a fiber material, or by compressing a laminate of an adhesive composition and a chip material and / or a fiber material, comprising: a first aqueous component A having at least one chemically curable reactive resin; a second aqueous component B having at least one curing agent for the chemically curable reactive resin of component A; and having components A and B are provided to form a two-component adhesive composition that is chemically curable by mixing components A and B; component A consists of an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one reactive resin functionalized with an epoxy group, or a mixture of a plurality of reactive resins functionalized with an epoxy group, or component A consists of an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one reactive resin functionalized with an epoxy group, or a mixture of a plurality of reactive resins functionalized with an epoxy group, and other components or additives; the proportion of the aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one reactive resin functionalized with an epoxy group, or a mixture of a plurality of reactive resins functionalized with an epoxy group in component A is 20 to 100% by weight; the proportion of one reactive resin functionalized with an epoxy group, or a mixture of a plurality of reactive resins functionalized with an epoxy group in the aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one reactive resin functionalized with an epoxy group, or a mixture of a plurality of reactive resins functionalized with an epoxy group in component A is 30 to 70% by weight; and component B consists of an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one curing agent having an amine group, or a mixture of a plurality of curing agents having an amine group, or component B consists of an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one curing agent having an amine group, or a mixture of a plurality of curing agents having an amine group, and other components or additives; The proportion of the aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one curing agent having the amine group or a mixture composed of a plurality of curing agents having the amine group in the component B is 20 to 100% by weight, In the aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one curing agent having the amine group or a mixture composed of a plurality of curing agents having the amine group, the proportion of one curing agent having the amine group or a mixture composed of a plurality of curing agents having the amine group is 30 to 70% by weight, The aqueous two-component adhesive formulation consists of 20% to 80% by weight of the component A and 20% to 80% by weight of the component B, In the case of One reactive resin functionalized by the epoxy group of the component A or a mixture composed of a plurality of reactive resins functionalized by the epoxy group has an epoxy equivalent of 200 g / mol to 1500 g / mol, One reactive resin functionalized by the epoxy group of the component A or a mixture composed of a plurality of reactive resins functionalized by the epoxy group is selected from the group consisting of a functionalized acrylate resin, a functionalized styrene acrylate resin, a functionalized acrylic acid copolymer and a functionalized (meth)acrylate copolymer, a functionalized acrylate-urethane-copolymer and a functionalized cationic polyester, A chemically curable aqueous two-component adhesive formulation, characterized in that.

2. The mixture composed of one curing agent having the amine group or a plurality of curing agents having the amine group in the component B has an amine active hydrogen equivalent of 200 g / mol to 700 g / mol. The adhesive formulation according to claim 1, characterized in that.

3. The ratio of the epoxy equivalent of one reactive resin functionalized by the epoxy group of the component A or a mixture composed of a plurality of reactive resins functionalized by the epoxy group to the amine active hydrogen equivalent of the mixture composed of one curing agent having the amine group or a plurality of curing agents having the amine group in the component B is 3:1 to 1:

2. The adhesive formulation according to claim 1 or 2, characterized in that.

4. The mixture composed of one curing agent having the amine group of the component B or a plurality of curing agents having the amine group is selected from the group consisting of a functionalized acrylate, a functionalized acrylate polymer, a functionalized acrylate-copolymer, a polyamine adduct, a functionalized acrylate-urethane-copolymer, a functionalized styrene-acrylate resin, and a cationic epoxyamine adduct. The adhesive formulation according to any one of claims 1 to 3, characterized in that.

5. The component A or the component B contains 0.1% by weight to 20% by weight of one or more polyhydric alcohols. The adhesive formulation according to any one of claims 1 to 4, characterized in that.

6. The component A and B each have a pH value of 7 to 10. The adhesive formulation according to any one of claims 1 to 5, characterized in that.

7. The component A or the component B contains 0.2% by weight to 10% by weight of an anionic wax, a neutral wax, or a mixture of these waxes. The adhesive formulation according to any one of claims 1 to 6, characterized in that.

8. The component A or the component B contains 0.1% by weight to 50% by weight of one or more fillers and / or pigments. The adhesive formulation according to any one of claims 1 to 7, characterized in that.

9. The component A or the component B contains 0.1% by weight to 12% by weight of one or more wetting agents. The adhesive formulation according to any one of claims 1 to 8, characterized in that.

10. The component A or the component B contains 0.1% by weight to 15% by weight of one or more defoaming agents. The adhesive formulation according to any one of claims 1 to 9, characterized in that.

11. The component A or the component B contains 0.1% by weight to 15% by weight of one or more thickeners. The adhesive formulation according to any one of claims 1 to 10, characterized in that.

12. A method for forming a press material molded body, comprising: - A step of preparing a chip material and / or a fiber material or a chip material and / or a fiber material mixture; - A step of preparing a chemically curable adhesive formulation; - A step of mixing the chip material and / or the fiber material or the chip material and / or the fiber material mixture with the adhesive formulation to produce a press cake; - While curing the adhesive composition, continuously compress the press cake, or produce press cake pieces, and discontinuously compress the press cake pieces in a mold while curing the adhesive composition; in a method having; as the adhesive composition, a chemically curable aqueous two-component adhesive composition is used; the two-component adhesive composition includes a first aqueous component A containing at least one chemically curable reactive resin; and a second aqueous component B containing at least one curing agent for the chemically curable reactive resin of component A; components A and B are prepared to form the two-component adhesive composition that is chemically curable by mixing components A and B; component A consists of an aqueous dispersion, aqueous suspension, aqueous emulsion, or aqueous solution of one reactive resin functionalized with epoxy groups, or a mixture of multiple reactive resins functionalized with epoxy groups, or component A consists of an aqueous dispersion, aqueous suspension, aqueous emulsion, or aqueous solution of one reactive resin functionalized with epoxy groups, or a mixture of multiple reactive resins functionalized with epoxy groups, and other components or additives; the proportion of the aqueous dispersion, aqueous suspension, aqueous emulsion, or aqueous solution of one reactive resin functionalized with epoxy groups, or a mixture of multiple reactive resins functionalized with epoxy groups, in component A is 20 - 100% by weight; the proportion of one reactive resin functionalized with epoxy groups, or a mixture of multiple reactive resins functionalized with epoxy groups, in the aqueous dispersion, aqueous suspension, aqueous emulsion, or aqueous solution of one reactive resin functionalized with epoxy groups, or a mixture of multiple reactive resins functionalized with epoxy groups, is 30 - 70% by weight; component B consists of an aqueous dispersion, aqueous suspension, aqueous emulsion, or aqueous solution of one curing agent having an amine group, or a mixture of multiple curing agents having an amine group, or component B consists of an aqueous dispersion, aqueous suspension, aqueous emulsion, or aqueous solution of one curing agent having an amine group, or a mixture of multiple curing agents having an amine group, and other components or additives; The proportion of the aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one curing agent having the amine group or a mixture composed of a plurality of curing agents having the amine group in the component B is 20 to 100% by weight, In the aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one curing agent having the amine group or a mixture composed of a plurality of curing agents having the amine group, the proportion of one curing agent having the amine group or a mixture composed of a plurality of curing agents having the amine group is 30 to 70% by weight, The aqueous two-component adhesive formulation consists of 20% to 80% by weight of the component A and 20% to 80% by weight of the component B, A mixture composed of one reactive resin functionalized by the epoxy group of the component A or a plurality of reactive resins functionalized by the epoxy group is selected from the group consisting of a functionalized acrylate resin, a functionalized styrene acrylate resin, a functionalized acrylic acid copolymer and a functionalized (meth)acrylate copolymer, a functionalized acrylate-urethane-copolymer and a functionalized cationic polyester, The press cake or the press cake piece has the chip material and / or the fiber material or the chip material and / or the fiber material mixture at a weight ratio of 77% to 98.5% by weight and the adhesive formulation at a weight ratio of 1% to 20% by weight, A method characterized by this.

13. In the process of mixing the chip material and / or the fiber material or the chip material and / or the fiber material mixture with the adhesive formulation, 0.1% to 3% by weight of solid wax is mixed. The method according to claim 12, characterized by this.

14. A method of forming a press material plate, comprising: - A step of preparing a number of plates having a chip material and / or a fiber, - A step of coating at least one surface provided for bonding to another plate of the plate with an adhesive formulation, - A step of laminating the coated plates to form a plate laminate, - A step of compressing the plate laminate in a press mold while curing the adhesive formulation, In the method having, As the adhesive formulation, a chemically curable aqueous two-component adhesive formulation is used, The two-component adhesive composition includes a first aqueous component A containing at least one chemically curable reactive resin, and a second aqueous component B containing at least one curing agent for the chemically curable reactive resin of component A, wherein components A and B are prepared to form the two-component adhesive composition that is chemically curable by mixing components A and B, wherein component A is composed of an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one reactive resin functionalized with an epoxy group or a mixture of a plurality of reactive resins functionalized with an epoxy group, or component A is composed of an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one reactive resin functionalized with an epoxy group or a mixture of a plurality of reactive resins functionalized with an epoxy group and other components or additives, the proportion of the aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one reactive resin functionalized with an epoxy group or a mixture of a plurality of reactive resins functionalized with an epoxy group in component A is 20 to 100% by weight, the proportion of one reactive resin functionalized with an epoxy group or a mixture of a plurality of reactive resins functionalized with an epoxy group in the aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one reactive resin functionalized with an epoxy group or a mixture of a plurality of reactive resins functionalized with an epoxy group is 30 to 70% by weight, component B is composed of an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one curing agent having an amine group or a mixture of a plurality of curing agents having an amine group, or component B is composed of an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one curing agent having an amine group or a mixture of a plurality of curing agents having an amine group and other components or additives, the proportion of the aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one curing agent having an amine group or a mixture of a plurality of curing agents having an amine group in component B is 20 to 100% by weight. In an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one curing agent having the amine group or a mixture composed of a plurality of curing agents having the amine group, the proportion of one curing agent having the amine group or the mixture composed of a plurality of curing agents having the amine group is 30 to 70% by weight, The aqueous two-component adhesive composition consists of 20% to 80% by weight of the component A and 20% to 80% by weight of the component B, One reactive resin functionalized by the epoxy group of the component A or a mixture composed of a plurality of reactive resins functionalized by the epoxy group is selected from the group consisting of a functionalized acrylate resin, a functionalized styrene acrylate resin, a functionalized acrylic acid copolymer and a functionalized (meth)acrylate copolymer, a functionalized acrylate-urethane-copolymer and a functionalized cationic polyester, The weight ratio of the plate of the plate laminate is 80% to 99% by weight, and the weight ratio of the adhesive composition of the plate laminate is 1% to 20% by weight, A method characterized by this.

15. A chemically curable aqueous two-component adhesive composition for producing a press material molded body by continuously or discontinuously compressing a mixture composed of an adhesive composition and a chip material and / or a fiber material, or by compressing a laminate composed of an adhesive composition and a chip material and / or a fiber material, A first aqueous component A having at least one chemically curable reactive resin, A second aqueous component B having at least one curing agent for the chemically curable reactive resin of the component A And having The components A and B are prepared to form a two-component adhesive composition that can be chemically cured by mixing the components A and B, The component A consists of an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one reactive resin functionalized by an epoxy group or a mixture composed of a plurality of reactive resins functionalized by an epoxy group, or The component A consists of an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one reactive resin functionalized by an epoxy group or a mixture composed of a plurality of reactive resins functionalized by an epoxy group, and other components or additives, The proportion of an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one kind of reactive resin functionalized with the epoxy group or a mixture composed of a plurality of kinds of reactive resins functionalized with the epoxy group in the component A is 20 to 100% by weight, The proportion of one kind of reactive resin functionalized with the epoxy group or a mixture composed of a plurality of kinds of reactive resins functionalized with the epoxy group in an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one kind of reactive resin functionalized with the epoxy group or a mixture composed of a plurality of kinds of reactive resins functionalized with the epoxy group is 30 to 70% by weight, and the component B is composed of an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one kind of curing agent having an amine group or a mixture composed of a plurality of kinds of curing agents having an amine group, or the component B is composed of an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one kind of curing agent having an amine group or a mixture composed of a plurality of kinds of curing agents having an amine group and other components or additives, The proportion of an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one kind of curing agent having an amine group or a mixture composed of a plurality of kinds of curing agents having an amine group in the component B is 20 to 100% by weight, The proportion of one kind of curing agent having an amine group or a mixture composed of a plurality of kinds of curing agents having an amine group in an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one kind of curing agent having an amine group or a mixture composed of a plurality of kinds of curing agents having an amine group is 30 to 70% by weight, the aqueous two-component adhesive formulation is composed of 20% to 80% by weight of the component A and 20% to 80% by weight of the component B, wherein, one kind of reactive resin functionalized with the epoxy group of the component A or a mixture composed of a plurality of kinds of reactive resins functionalized with the epoxy group has an epoxy equivalent of 200 g / mol to 1500 g / mol, The mixture composed of one curing agent having the amine group of the component B or a plurality of curing agents having the amine group is selected from the group consisting of a functionalized acrylate, a functionalized acrylate polymer, a functionalized acrylate-copolymer, a polyamine adduct, a functionalized acrylate-urethane-copolymer, a functionalized styrene-acrylate resin, and a cationic epoxyamine adduct, characterizing the chemically curable aqueous two-component adhesive formulation.

16. A method for forming a pressed material compact, comprising: - preparing a chip material and / or a fiber material or a mixture of a chip material and / or a fiber material; - preparing a chemically curable adhesive formulation; - mixing the chip material and / or the fiber material or the mixture of the chip material and / or the fiber material with the adhesive formulation to produce a press cake; - continuously compressing the press cake while curing the adhesive formulation, or producing press cake pieces and discontinuously compressing the press cake pieces in a press mold while curing the adhesive formulation; In the method having, a chemically curable aqueous two-component adhesive formulation is used as the adhesive formulation, the two-component adhesive formulation includes a first aqueous component A containing at least one chemically curable reactive resin, and a second aqueous component B containing at least one curing agent for the chemically curable reactive resin of the component A, the components A and B are prepared to form the two-component adhesive formulation that is chemically curable by mixing the components A and B, the component A consists of an aqueous dispersion, an aqueous suspension, an aqueous emulsion, or an aqueous solution of one reactive resin functionalized with an epoxy group or a mixture of a plurality of reactive resins functionalized with an epoxy group, or the component A consists of an aqueous dispersion, an aqueous suspension, an aqueous emulsion, or an aqueous solution of one reactive resin functionalized with an epoxy group or a mixture of a plurality of reactive resins functionalized with an epoxy group, and other components or additives. The proportion of an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one kind of reactive resin functionalized by the epoxy group or a mixture composed of a plurality of kinds of reactive resins functionalized by the epoxy group in the component A is 20 to 100% by weight, In the aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one kind of reactive resin functionalized by the epoxy group or a mixture composed of a plurality of kinds of reactive resins functionalized by the epoxy group, the proportion of one kind of reactive resin functionalized by the epoxy group or a mixture composed of a plurality of kinds of reactive resins functionalized by the epoxy group is 30 to 70% by weight, The component B is composed of an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one kind of curing agent having an amine group or a mixture composed of a plurality of kinds of curing agents having an amine group, or The component B is composed of an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one kind of curing agent having an amine group or a mixture composed of a plurality of kinds of curing agents having an amine group and other components or additives, The proportion of an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one kind of curing agent having an amine group or a mixture composed of a plurality of kinds of curing agents having an amine group in the component B is 20 to 100% by weight, In the aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one kind of curing agent having an amine group or a mixture composed of curing agents having an amine group, the proportion of one kind of curing agent having an amine group or a mixture composed of curing agents having an amine group is 30 to 70% by weight, The aqueous two-component adhesive formulation is composed of 20% to 80% by weight of the component A and 20% to 80% by weight of the component B, The mixture composed of one kind of curing agent having an amine group or a plurality of kinds of curing agents having an amine group in the component B is selected from the group consisting of functionalized acrylate, functionalized acrylate polymer, functionalized acrylate-copolymer, polyamine adduct, functionalized acrylate-urethane-copolymer, functionalized styrene-acrylate resin and cationic epoxyamine adduct, The press cake or the press cake pieces have the chip material and / or the fiber material or a mixture of the chip material and / or the fiber material in a weight ratio of 77% to 98.5% by weight, and the adhesive formulation in a weight ratio of 1% to 20% by weight. A method characterized by this.

17. A method of forming a press material plate, comprising: - Preparing a number of plates having a chip material and / or a fiber; - Coating at least one surface provided for bonding to other plates of the plates with an adhesive formulation; - Stacking the coated plates to form a plate stack; - Compressing the plate stack in a press mold while curing the adhesive formulation. In the method having, As the adhesive formulation, a chemically curable aqueous two-component adhesive formulation is used. The two-component adhesive formulation includes a first aqueous component A containing at least one chemically curable reactive resin, And a second aqueous component B containing at least one curing agent for the chemically curable reactive resin of the component A. The components A and B are prepared to form the two-component adhesive formulation that is chemically curable by mixing the components A and B. The component A consists of an aqueous dispersion, an aqueous suspension, an aqueous emulsion or an aqueous solution of one reactive resin functionalized with epoxy groups, or a mixture of a plurality of reactive resins functionalized with epoxy groups, or The component A consists of an aqueous dispersion, an aqueous suspension, an aqueous emulsion or an aqueous solution of one reactive resin functionalized with epoxy groups, or a mixture of a plurality of reactive resins functionalized with epoxy groups, and other components or additives. The proportion of the aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one reactive resin functionalized with epoxy groups, or a mixture of a plurality of reactive resins functionalized with epoxy groups in the component A is 20 to 100% by weight. In an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one kind of reactive resin functionalized by the epoxy group or a mixture composed of a plurality of kinds of reactive resins functionalized by the epoxy group, the proportion of one kind of reactive resin functionalized by the epoxy group or a mixture composed of a plurality of kinds of reactive resins functionalized by the epoxy group is 30 to 70% by weight, Component B is composed of an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one kind of curing agent having an amine group or a mixture composed of a plurality of kinds of curing agents having an amine group, or Component B is composed of an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one kind of curing agent having an amine group or a mixture composed of a plurality of kinds of curing agents having an amine group and other components or additives, In Component B, the proportion of an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one kind of curing agent having an amine group or a mixture composed of a plurality of kinds of curing agents having an amine group is 20 to 100% by weight, In an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one kind of curing agent having an amine group or a mixture composed of a plurality of kinds of curing agents having an amine group, the proportion of one kind of curing agent having an amine group or a mixture composed of a plurality of kinds of curing agents having an amine group is 30 to 70% by weight, The aqueous two-component adhesive formulation is composed of 20% to 80% by weight of Component A and 20% to 80% by weight of Component B, The mixture composed of one kind of curing agent having an amine group or a plurality of kinds of curing agents having an amine group in Component B is selected from the group consisting of functionalized acrylate, functionalized acrylate polymer, functionalized acrylate-copolymer, polyamine adduct, functionalized acrylate-urethane-copolymer, functionalized styrene-acrylate resin and cationic epoxyamine adduct, The weight ratio of the plate in the plate laminate is 80% to 99% by weight, and the weight ratio of the adhesive formulation in the plate laminate is 1% to 20% by weight, A method characterized by the above.

Images