Disassembly method of a photoelectric conversion module

Abstract

To provide a method for disassembling a photoelectric conversion module which can remove a frame with comparatively small force while suppressing deterioration of a resin material in a panel as much as possible.SOLUTION: A photoelectric conversion module has a panel 100, frames 220 and 230 provided along the side part of the panel, and adhesive materials 229 and 239 for mutually bonding the panel and the frames. A method for disassembling a photoelectric conversion module includes a heating step of heating at least a part of the adhesive materials to a temperature of 100°C or lower, and a frame separation step of applying external force to the frames.SELECTED DRAWING: Figure 7

Description

Technical Field

[0001] The present invention relates to a method for disassembling a photoelectric conversion module.

Background Art

[0002] With measures to reduce carbon dioxide emissions, an increase in the spread of photoelectric conversion modules such as solar cell modules, which are one of the renewable energies, is expected. Currently, it is being considered that solar cell modules are disassembled and recycled at the time of disposal.

[0003] A solar cell module generally includes a flat solar cell panel (photoelectric conversion panel) that converts light energy into electrical energy, and a frame provided at the outer peripheral end of the solar cell panel (see also Patent Document 1 below). The frame has a fitting portion into which the outer peripheral end of the solar cell panel is fitted. The solar cell panel is firmly adhered to the frame by filling a thermoplastic resin-based adhesive (sealing material) into the fitting portion of the frame into which the outer peripheral portion of the solar cell panel is fitted.

[0004] Patent Document 1 discloses removing the frame from the solar cell module when disassembling the solar cell module. In the column of "Summary of the Invention" in Patent Document 1, it is described that when removing the frame, the adhesive that adheres the solar cell panel and the frame to each other is heated to make the adhesive semi-liquid. When the adhesive is butyl rubber, the adhesive is heated to 200°C.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] When the adhesive that bonds the photoelectric conversion panel and the frame is heated until it becomes semi-liquid during disassembly of the photoelectric conversion module, resin materials inside the photoelectric conversion panel, such as ethylene vinyl acetate (EVA) and olefin-based materials, are deteriorated. Due to the deterioration of the resin materials inside the photoelectric conversion panel, a difference occurs in the recyclability between the portion where heat is not applied and the portion where heat is applied in the process of recycling the photoelectric conversion panel, which may lead to a decrease in the recycling rate.

[0007] Therefore, a disassembly method of a photoelectric conversion module is desired that can remove the frame with a relatively small force by controlling the adhesiveness of the portion where the frame and the photoelectric conversion panel are bonded while suppressing deterioration of the resin materials inside the photoelectric conversion panel as much as possible.

Means for Solving the Problems

[0008] A disassembly method of a photoelectric conversion module according to one aspect relates to a method of disassembling a photoelectric conversion module having a panel, a frame provided along a side portion of the panel, and an adhesive that bonds the panel and the frame to each other. This method includes a heating step of heating at least a part of the adhesive to a temperature of 100°C or lower, and a frame separation step of applying an external force to a region of the frame that is adjacent to at least the heated adhesive.

Effects of the Invention

[0009] According to the above aspect, it is possible to provide a disassembly method of a photoelectric conversion module that can suppress deterioration of the resin materials inside the photoelectric conversion panel as much as possible and remove the frame with a relatively small force.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Mode for Carrying Out the Invention

[0011] Hereinafter, embodiments will be described with reference to the drawings. In the following drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the ratios of each dimension etc. may be different from the actual ones.

[0012] [Photoelectric Conversion Module] FIG. 1 is a perspective view of a photoelectric conversion module according to one aspect. FIG. 2 is a cross-sectional view of the photoelectric conversion module taken along line 2A-2A of FIG. 1. FIG. 3 is a perspective view of a first frame included in the photoelectric conversion module. FIG. 4 is a cross-sectional view of the photoelectric conversion module taken along line 4A-4A of FIG. 1. FIG. 5 is a perspective view of a second frame included in the photoelectric conversion module. FIG. 6 is an enlarged view of region 6A of FIG. 1.

[0013] The photoelectric conversion module 10 may be, for example, a solar cell module that converts light energy into electrical energy. Such a solar cell module may be installed outdoors, for example, on the roof or wall surface of a building.

[0014] The photoelectric conversion module 10 has a flat panel 100 and a frame structure 200. The panel 100 may include a photoelectric conversion element that mutually converts light energy and electrical energy. In the present embodiment, the panel 100 is substantially rectangular when viewed from a direction (height direction) orthogonal to the surface of the panel 100. The height direction corresponds to the Z direction in the figure.

[0015] The frame structure 200 is attached around the panel 100 and is provided along the side portion of the panel 100. The frame structure 200 may have at least a first frame 220 and a second frame 230 connected to each other. The first frame 220 and the second frame 230 are each provided along the edge of the panel 100. In the present embodiment, the first frame 220 extends in a first direction (hereinafter, also referred to as the "lateral direction") along the first edge of the panel 100. The lateral direction corresponds to the X direction in the figure.

[0016] The second frame 230 may extend in a second direction (hereinafter, also referred to as the "longitudinal direction") along the second edge adjacent to the first edge of the panel 100. Here, the first direction (lateral direction) and the second direction (longitudinal direction) may be directions that intersect each other, and preferably may be directions that are orthogonal to each other. In the present embodiment, the longitudinal direction corresponds to the Y direction in the figure.

[0017] In the aspect shown in FIG. 1, the panel 100 is generally rectangular, and a pair of first frames 220 are provided along a pair of long sides of the panel 100. Similarly, a pair of second frames 230 are provided along a pair of short sides of the panel 100.

[0018] The first frame 220 may have a first holding portion 221, a first leg portion 222, a first side wall portion 223, a first flange 224, and a first panel receiving portion 225 (see particularly FIG. 3). The first side wall portion 223 is located outside the edge of the panel 100 and extends in a plane defined by a direction (Z direction) intersecting the surface of the panel 100 and a lateral direction (X direction). The first side wall portion 223 connects the first holding portion 221 and the first flange 224 and may be integrally formed therewith.

[0019] The first flange 224 protrudes from the upper part of the first side wall portion 223 toward the inside of the panel 100 and covers the surface of the end portion of the panel 100. The first flange 224 may extend along the edge of the panel 100 extending in the lateral direction. Also, the first flange 224 does not have to reach the edge of the wall portion 222a of the first leg portion 222 in the lateral direction (X direction) (see FIG. 3).

[0020] The first holding portion 221 protrudes from the first side wall portion 223 toward the inside of the panel 100 and faces the first flange 224. The first holding portion 221 is configured to support the end portion of the panel 100 from below. The first holding portion 221 may extend along the lateral direction.

[0021] The first panel receiving portion 225 may be constituted by the first holding portion 221, the first side wall portion 223, and the first flange 224. Specifically, the first panel receiving portion 225 has a generally "C" shape in a cross section orthogonal to the extending direction (lateral direction) of the first frame 220 (see FIG. 2). Thereby, the first panel receiving portion 225 is configured to be able to receive the end portion of the panel 100.

[0022] Inside the first panel receiving portion 225, the first adhesive 229 may be filled. Thereby, the first panel receiving portion 225 can hold the panel 100 in a state where the end portion of the panel 100 is received. In other words, the first holding portion 221 is adhered to the panel 100 and supports the end portion of the panel 100.

[0023] The first adhesive 229 may be provided over the entire first panel receiving portion 225 in the lateral direction, or may be provided only in a partial region of the first panel receiving portion 225 in the lateral direction. The first adhesive 229 may be an adhesive containing a thermoplastic resin. Examples of such adhesives include silicone-based adhesives and butyl rubber-based adhesives.

[0024] The panel 100 does not have to be inserted all the way to the back of the first panel receiving portion 225 in the longitudinal direction. Specifically, as shown in FIG. 2, in the longitudinal direction (Y direction), the first adhesive 229 may be provided between the panel 100 and the first side wall portion 223.

[0025] The first leg portion 222 may extend from the first holding portion 221 in a direction away from the panel 100. In the present embodiment, the first leg portion 222 may include a wall portion 222a extending in a direction orthogonal to the surface of the panel 100 and an end portion 222b bent along the surface of the panel at the farthest point from the panel 100. In FIGS. 2 and 3, the wall portion 222a of the first leg portion 222 is constituted by a portion continuously extending from the intersection of the first side wall portion 223 and the first holding portion 221. Also, the outer surface of the wall portion 222a of the first leg portion 222 is flush with the outer surface of the first side wall portion 223. Instead of this, the wall portion 222a of the first leg portion 222 may be connected to a portion of the first holding portion 221 that is away from the first side wall portion 223.

[0026] The first holding part 221, the first leg part 222, the first side wall part 223, and the first flange 224 may each extend in the extending direction of the first frame 220. The first holding part 221, the first leg part 222, the first side wall part 223, and the first flange 224 may be integrally formed.

[0027] The wall part 222a of the first leg part 222 abuts against the second frame 230 at both ends of the first frame 220 in the lateral direction (see FIGS. 1 and 6). The wall part 222a of the first leg part 222 may have first hole parts 226 through which fastening members such as bolts can be inserted near both ends in the lateral direction. In the present embodiment, two first hole parts 226 are arranged side by side in the height direction. Instead of this, only one first hole part 226 may be provided in the height direction. The first hole parts 226 are provided to allow fastening members for connecting the second frame 230 to the first frame 220 to be inserted therethrough.

[0028] In the first embodiment, the ends 222b of the first holding part 221 and the first leg part 222 do not reach the edge of the wall part 222a of the first leg part 222 in the lateral direction (X direction) (see FIG. 3). In other words, the wall part 222a of the first side wall part 223 extends outward beyond the ends 222b of the first holding part 221 and the first leg part 222 in the lateral direction. Thereby, the ends 222b of the first holding part 221 and the first leg part 222 of the first frame 220 are configured not to interfere with the ends 232b of the second holding part 231 and the second leg part 232 of the second frame 230 described later. The first hole parts 226 may be provided in a portion of the wall part 222a of the first leg part 222 that extends outward beyond the first holding part 221.

[0029] The second frame 230 may have a second holding part 231, a second leg part 232, a second side wall part 233, a second flange 234, and a second panel receiving part 235. The second side wall part 233 extends on a plane stretched by the direction (Z direction) intersecting the surface of the panel 100 and the lateral direction (Y direction) outside the panel 100. The second side wall part 233 connects the second holding part 231 and the second flange 234, and may be integrally formed with these.

[0030] The second flange 234 protrudes from the upper part of the second side wall portion 233 toward the inside of the panel 100 and covers the surface of the end portion of the panel 100. The second flange 234 may extend along the edge of the panel 100 along the longitudinal direction. The second flange 234 may reach the edge of the second side wall portion 233 in the longitudinal direction (Y direction) (see FIGS. 5 and 6).

[0031] The second holding portion 231 protrudes from the second side wall portion 233 toward the inside of the panel 100 and faces the second flange 234. The second holding portion 231 is configured to support the end portion of the panel 100 from below.

[0032] The second panel receiving portion 235 may be constituted by the second holding portion 231, the second side wall portion 233, and the second flange 234. Specifically, the second panel receiving portion 235 has a substantially "C" shape in a cross section orthogonal to the extending direction (longitudinal direction) of the second frame 230 (see FIG. 4). Thereby, the second panel receiving portion 235 is configured to be able to receive the end portion of the panel 100.

[0033] The inside of the second panel receiving portion 235 may be filled with the second adhesive 239 (see FIG. 4). Thereby, the second panel receiving portion 235 can hold the panel 100 in a state where the end portion of the panel 100 is received. In other words, the second holding portion 231 is adhered to the panel 100 and supports the end portion of the panel 100.

[0034] The second adhesive 239 may be provided over the entire second panel receiving portion 235 in the longitudinal direction, or may be provided only in a partial region of the second panel receiving portion 235 in the longitudinal direction. The second adhesive 239 may be an adhesive containing a thermoplastic resin. Examples of such an adhesive include silicone-based adhesives and butyl rubber-based adhesives.

[0035] The panel 100 may not be inserted all the way to the back of the second panel receiving portion 235 in the horizontal direction. Specifically, as shown in FIG. 4, in the horizontal direction (X direction), the second adhesive 239 may be provided between the panel 100 and the second side wall portion 233.

[0036] The upper surface of the second holding portion 231 may have a plurality of grooves 231b. The plurality of grooves 231b may be arranged substantially parallel to each other. Each groove 231b may extend along the extending direction of the second frame 230.

[0037] The second leg portion 232 may extend from the second holding portion 231 in a direction away from the panel 100. In the present embodiment, the second leg portion 232 may include a wall portion 232a extending in a direction perpendicular to the surface of the panel 100 and an end portion 232b bent along the surface of the panel at the farthest point from the panel 100. In FIGS. 4 and 5, the wall portion 232a of the second leg portion 232 is constituted by a portion continuously extending from the intersection of the second side wall portion 233 and the second holding portion 231. Further, the outer surface of the wall portion 232a of the second leg portion 232 is flush with the outer surface of the second side wall portion 233. Instead of this, the wall portion 232a of the second leg portion 232 may be connected to a portion of the second holding portion 231 that is away from the second side wall portion 233.

[0038] The second holding portion 231, the second leg portion 232, the second side wall portion 233, and the second flange 234 may each extend in the extending direction of the second frame 230. The second holding portion 231, the second leg portion 232, the second side wall portion 233, and the second flange 234 may be integrally formed.

[0039] The second holding portion 231, the second leg portion 232, and the C-shaped wall portion 237 described later may reach the edge of the second side wall portion 233 in the vertical direction (Y direction) (see FIG. 5). Thereby, the second holding portion 231, the second leg portion 232, and the C-shaped wall portion 237 described later abut against the first leg portion 222 or the first side wall portion 223 of the first frame 220.

[0040] The wall portion 232a of the second leg portion 232 may be in contact with the first frame 220 at both ends of the second frame 230 in the vertical direction (see FIGS. 1 and 6). The second holding portion 231 and / or the second leg portion 232 may be formed with a second hole portion 236 through which a fastening member such as a bolt can be inserted. The second hole portion 236 is surrounded by a C-shaped wall portion 237 in a cross-sectional view. In the present embodiment, the C-shaped wall portion 237 is provided at the lower part of the second holding portion 231 and the upper part of the end portion 232b of the second leg portion 232. The C-shaped wall portion 237 extends along the extending direction of the second frame 230. Therefore, the C-shaped wall portion 237 has a substantially cylindrical shape.

[0041] The second hole portion 236 of the second frame 230 is aligned with the first hole portion 226 of the first frame 220. A fastening member such as a bolt passes through both the first hole portion 226 of the first frame 220 and the second hole portion 236 of the second frame 230. Thereby, the first frame 220 and the second frame 230 are fastened to each other. Therefore, the first frame 220 and the second frame 230 are fastened to each other by a fastening member extending from the first hole portion 226 toward the second hole portion 236.

[0042] The photoelectric conversion panel 100 generally has a sealing material (not shown) for sealing an element that performs photoelectric conversion. Such a sealing material is composed of a resin material such as ethylene vinyl acetate (EVA) or an olefin-based material, for example.

[0043] The configuration of the photoelectric conversion module has been described with reference to the drawings. It should be noted that the configuration of the photoelectric conversion module is not limited to the above-described configuration, and can be variously changed as long as the following disassembly method can be applied.

[0044] [Disassembly Method of Photoelectric Conversion Module] [First Embodiment] Next, referring to FIGS. 7 to 11, a method for disassembling a photoelectric conversion module will be described. FIG. 7 is a schematic diagram for explaining a heating step according to the first embodiment. In FIG. 7, the arrangement of the heater is shown as viewed from a direction orthogonal to the surface of the panel 100 constituting the photoelectric conversion module. FIG. 8 is a schematic diagram as viewed from the direction of arrow 8A in FIG. 7. FIG. 9 is a schematic diagram for explaining a frame separation step according to the first embodiment. FIG. 10 is a schematic diagram for explaining the state following FIG. 9. FIG. 11 is a schematic diagram for explaining an example of the position where an external force is applied to the frame in the frame separation step.

[0045] The method for disassembling the photoelectric conversion module may include a pre-treatment step, a heating step, and a frame separation step, which are executed as necessary. The configuration of the photoelectric conversion module is as described above.

[0046] (Pre-treatment step) First, prepare the photoelectric conversion module to be disassembled. Accessories such as the terminal box provided in the photoelectric conversion module may be removed in advance as necessary. Also, the fastening members that connect the first frame 220 and the second frame 230 to each other may be removed in advance. Alternatively, the steps described below may be executed without removing the fastening members.

[0047] (Heating step) In the heating step, at least a part of the adhesive materials 229 and 239 that bond the panel 100 and the frames 220 and 230 to each other is heated to a temperature of 100°C or lower. Preferably, at least a part of the adhesive materials 229 and 239 is heated to a temperature of 50°C or higher and 90°C or lower.

[0048] By heating the adhesive materials 229 and 239 to, for example, 50°C or higher, the adhesive force of the adhesive materials 229 and 239 decreases. Therefore, in the frame separation step described below, the frames 220 and 230 can be separated from the panel 100 with a smaller external force compared to the case where no heating is performed.

[0049] Since the temperature of the adhesives 229 and 239 in the heating step is 100°C or lower, it is possible to prevent the adhered panel 100 from being damaged or the resin materials within the panel 100, such as ethylene vinyl acetate (EVA) or olefin-based materials, from deteriorating. By suppressing the deterioration of the resin materials within the panel 100, in the process of recycling the panel 100 separated from the frames 220 and 230, it becomes difficult for a difference to occur in the recyclability between the unheated portions and the heated portions. As a result, it is possible to suppress a decrease in the recycling rate of the panel 100.

[0050] Also, in the heating step, at least a part of the adhesives 229 and 239 may be heated to a temperature lower than the melting temperature, softening temperature, or heat resistance limit temperature of the adhesives 229 and 239. It should be noted that if the temperature of the adhesives 229 and 239 is higher than the glass transition temperature, even at a temperature lower than the melting temperature, softening temperature, or heat resistance limit temperature, the force required to remove the frames 220 and 230 from the panel 100 decreases due to the heating of the adhesives 229 and 239. Further, it is possible to suppress the adhesives 229 and 239 from becoming liquid or semi-liquid, and it is also possible to prevent the adhesives 229 and 239 from adhering to a disassembling device, such as a pressing unit described later, during disassembly.

[0051] Here, the "glass transition temperature" is defined for thermoplastic adhesives. In this specification, the "glass transition temperature" is determined using a differential scanning calorimeter (DSC). Specifically, it is defined by the endothermic peak temperature (Tg) observed when a sample made of a cured thermoplastic adhesive is measured under a temperature increase condition of 5°C / min from room temperature.

[0052] In the heating step, the temperature of the adhesives 229 and 239 may be lower than the melting temperature or softening temperature of the resin material inside the panel 100, such as ethylene vinyl acetate (EVA) or an olefin-based material. Thereby, the alteration of the resin material inside the panel 100 can be further suppressed. Here, the "melting temperature" is obtained using a differential scanning calorimeter (DSC) by the method specified in JIS K 7121. Specifically, the melting temperature is defined by the endothermic peak temperature (Tm1) observed when a sample made of the cured resin material is measured under a temperature increase condition of 20 °C / min from room temperature. In this specification, the "softening temperature" can be defined by the Vicat softening temperature. The Vicat softening temperature can be measured by the B50 method specified in ISO 306 (JIS K7206).

[0053] For example, it is known that ethylene vinyl acetate (EVA) undergoes a gradual elimination of the acetoxy group even at 105 to 145 °C. Also, it is known that the oxygen absorption rate of EVA increases rapidly in the range of 160 °C to 180 °C, and it is known that the elimination reaction of the acetoxy group of EVA mainly occurs at a temperature of 180 °C or higher. When recycling the panel 100, if the EVA of the panel 100 is excessively modified, the EVA may adhere to the members inside the panel 100, such as the substrate glass, leading to a decrease in the recycling rate of the panel 100. Also, in the case of an olefin-based resin material, for example, the modification tends to progress at a high temperature exceeding 100 °C. From these viewpoints, when the panel 100 contains an EVA or an olefin-based resin material, in order to suppress the excessive modification of the EVA or olefin-based resin material inside the panel 100 in the above heating step, as described above, it is preferable to heat at least a part of the adhesives 229 and 239 to a temperature of 100 °C or lower, preferably 90 °C or lower.

[0054] In the first embodiment, the heating step may include heating the adhesive materials 229 and 239 provided at the corners of the frames 220 and 230 to the above-described temperature by the heater 300 locally arranged at a position facing the corners of the frames 220 and 230 (see FIG. 7). When the frames 220 and 230 are removed from the panel 100 by applying an external force near the corners of the frames 220 and 230 as described later, the corners of the frames 220 and 230 close to the location where the external force is applied can be locally heated. Since local heating is sufficient, the energy required for heating can be reduced.

[0055] In the heating step, the frames 220 and 230 with high thermal conductivity, for example, aluminum frames, may be directly heated, and the heat may be conducted from the frames 220 and 230 to the adhesive materials 229 and 239 to heat the adhesive materials 229 and 239. Thereby, the degree of bonding between the frames 220 and 230 and the panel 100 is reduced, and the bonding between the frames 220 and 230 and the panel 100 is released. Therefore, it becomes possible to disassemble only by the stress of the mechanical bonding strength of the frames 220 and 230 themselves.

[0056] The heating step preferably includes simultaneously heating the adhesive materials 229 and 239 provided on the plurality of photovoltaic conversion modules 10 in a state where the plurality of photovoltaic conversion modules 10 are stacked on top of each other in the height direction. In the example shown in FIG. 8, the plurality of photovoltaic conversion modules 10 are stacked in a state where they are stacked on top of each other in the height direction. The above-described heater 300 may have a height exceeding the height of the entire stack formed by the photovoltaic conversion modules 10 stacked on top of each other. Thereby, the heater 300 can simultaneously heat the adhesive materials 229 and 239 provided on the plurality of photovoltaic conversion modules 10 stacked on top of each other in the height direction. Thereby, while the frame separation step is being applied to a certain photovoltaic conversion module 10, the heating step can be continuously applied to another photovoltaic conversion module 10. Therefore, the number of disassembled units per unit time can be improved.

[0057] (Frame separation step) The frame separation step includes applying an external force F to at least the regions of the frames 220, 230 adjacent to the heated adhesive materials 229, 239. Specifically, an external force F is applied to the frames 220, 230 in a direction away from the panel 100 such that the holding portions 221, 231 of the frames 220, 230 receive a force directed away from the panel 100. The external force F is applied to the regions adjacent to the adhesive materials 229, 239 heated in the heating step. Since the adhesive materials 229, 239 become somewhat soft due to heating, the frames 220, 230 can be detached from the panel 100 with a relatively small force.

[0058] Here, the second frame 230 may be removed after removing the first frame 220, or the first frame 220 may be removed after removing the second frame 230. Depending on the shape, structure, etc. of the first frame 220 and the second frame 230, it suffices to determine which of the frames 220, 230 to remove first.

[0059] The method of removing the first frame 220 from the panel 100 and the method of removing the second frame 230 from the panel 100 are substantially the same as each other. Therefore, it should be noted that the method of removing the first frame 220 from the panel 100 and the method of removing the second frame 230 from the panel 100 will be described together below. In FIGS. 9 and 10, the shape of the first frame is depicted as an example. However, since the method shown in FIGS. 9 and 10 is also applicable to the second frame, it should be noted that both the reference numerals related to the first frame and the reference numerals related to the second frame are shown in FIGS. 9 and 10.

[0060] FIGS. 9 and 10 show how an external force F is applied to the frames 220, 230 using a disassembling device 400. The disassembling device may have, for example, a pressing portion 410 that presses the frames 220, 230 outward.

[0061] As shown in FIGS. 9 and 10, the pressing portion 410 moves outward from the center of the photoelectric conversion module 10 and abuts against the inner sides of the leg portions 222, 232 of the frames 220, 230. The pressing portion 410 further moves outward from the center of the photoelectric conversion module 10 and presses the leg portions 222, 232 of the frames 220, 230 outward. Due to this external force F, the frames 220, 230 are detached from the panel 100 (see FIG. 10). Note that the pressing portion 410 may be manually operated or automatically operated.

[0062] In the frame separation step, it is preferable that the external force F is applied at a position closer to the panel receiving portions 225, 235 of the leg portions 222, 232 than the middle between the end portions 222b, 232b of the leg portions 222, 232 that are the farthest from the panel 100 and the panel receiving portions 225, 235 of the leg portions 222, 232 in the direction orthogonal to the panel 100.

[0063] If the external force is applied near the end portions 222b, 232b of the leg portions 222, 232 that are the farthest from the panel 100, the frames 220, 230 receive a force to rotate about the vicinity of the panel receiving portions 225, 235. As a result, the panel 100 near the panel receiving portions 225, 235 receives a force in a direction to be bent from the flanges 224, 234 of the frames 220, 230. Therefore, the panel 100 may crack and a part of the panel 100 may remain in the panel receiving portions 225, 235. In the above-described aspect, since the external force F is applied near the panel receiving portions 225, 235 of the leg portions 222, 232, cracking of the panel 100 is suppressed and the material of the panel 100 is easily and neatly separated from the frames 220, 230. This is effective for recycling the materials constituting the photoelectric conversion module 10.

[0064] Instead of the above-described aspect, when the panel 100 is difficult to crack, the external force F may be applied near the end portions 222b, 232b of the leg portions 222, 232 that are the farthest from the panel 100, or may be applied near the center of the leg portions 222, 232 in the height direction.

[0065] In the frame separation step, the external force F may be applied to the inner surfaces of the legs 222, 232 while the outer surfaces of the legs 222, 232 are held by the back plate 480. As shown in FIGS. 9 and 10, the back plate 480 may be in contact with at least the outer surfaces of the legs 222, 232. The back plate 480 may have a substantially U-shaped configuration along the ends 222b, 232b and the flanges 224, 234 of the legs 222, 232 (see FIGS. 9 and 10).

[0066] The back plate 480 is used to suppress the rotation of the frames 220, 230 due to the external force F by supporting the frames 220, 230 from the outside. That is, the back plate 480 suppresses the panel 100 near the panel receiving portions 225, 235 from receiving a force in the direction in which the panel 100 is bent from the flanges 224, 234 of the frames 220, 230. Accordingly, cracking of the panel 100 is suppressed, and the material of the panel 100 is easily separated cleanly from the frames 220, 230.

[0067] Instead of the above-described aspect, when the panel 100 is less likely to crack, the back plate 480 is unnecessary in the frame separation step.

[0068] Next, an example of the position where an external force is applied to the frames 220, 230 in the frame separation step will be described with reference to FIG. 11. In the frame separation step, the external force F is preferably applied at a position closer to the end of the frames 220, 230 than the middle between the center of the frames 220, 230 and the end of the frames 220, 230 in the extending direction of the frames 220, 230. In other words, the external force F is preferably applied in a range of a length of 1 / 4 of the length of the frames 220, 230 from the ends of the frames 220, 230 (regions denoted by reference numerals L1 and L2 in the figure). In this case, the external force F acts near the ends of the frames 220, 230.

[0069] The external force F may be applied near one end of the frames 220 and 230 and then near the other end of the frames 220 and 230. In this case, after one end of the frames 220 and 230 comes off the panel 100, the other end of the frames 220 and 230 comes off the panel 100. Alternatively, the external force F may be applied simultaneously near both ends of the frames 220 and 230.

[0070] If the external force F is applied near the center of the frames 220 and 230 in the extending direction of the frames, the vicinity of the center of the frames 220 and 230 comes off the panel 100 and bends outward. When the first frame 220 and the second frame 230 are firmly connected to each other, for example, when the vicinity of the center of the first frame 220 bends, a pair of second frames 230 connected to both ends of the first frame 220 are pulled inward. Due to this influence, the panel 100 bends and the panel 100 may crack. When the panel 100 cracks, a part of the cracked panel 100 may remain in the second panel receiving portion 235 of the second frame 230.

[0071] In order to prevent such cracking of the panel 100, as described above, it is preferable that the external force F is applied near the ends of the frames 220 and 230 in the extending direction of the frames. In particular, in the frame that is removed from the panel 100 first among the first frame 220 and the second frame 230, it is preferable that the external force F is applied near the end of the frame.

[0072] [Second Embodiment] Next, a method for disassembling the photoelectric conversion module according to the second embodiment will be described with reference to FIG. 12. FIG. 12 is a schematic diagram for explaining the heating step according to the second embodiment. In FIG. 12, the arrangement of the heaters is shown as viewed from a direction perpendicular to the surface of the panel 100 constituting the photoelectric conversion module. Note that the same reference numerals are given to the same configurations as those in the first embodiment. It should be noted that the description of the same configurations as those in the first embodiment may be omitted.

[0073] In the second embodiment, the heating step includes heating the adhesives 229 and 239 provided on one side of the frames 220 and 230 by the heater 300 disposed entirely along at least one side of the frames 220 and 230 (see FIG. 12). The temperature range for heating is the same as that in the first embodiment.

[0074] In the second embodiment, since the entire adhesives 229 and 239 provided on the frames 220 and 230 are heated, the frames 220 and 230 can be more easily removed from the panel 100 in the frame separation step.

[0075] In the second embodiment, since the entire adhesives 229 and 239 are heated, the external force F may be applied at any position in the extending direction of the frames 220 and 230 in the frame separation step. Therefore, the external force F may be applied near the center of the frames 220 and 230 in the extending direction of the frames. However, from the viewpoint of suppressing cracking of the panel 100, similar to the first embodiment, it is preferable that the external force F is applied near the ends of the frames 220 and 230 in the extending direction of the frames 220 and 230 in the frame separation step.

[0076] [Third Embodiment] Next, a method for disassembling the photoelectric conversion module according to the third embodiment will be described with reference to FIG. 13. FIG. 13 is a schematic diagram for explaining the heating step and the frame separation step according to the third embodiment. Note that the same reference numerals are assigned to the same configurations as those in the first embodiment. It should be noted that the description of the same configurations as those in the first embodiment may be omitted.

[0077] In the third embodiment, the frame separation step is carried out simultaneously with the heating step. In other words, the application of the external force F to the frames 220 and 230 in the frame separation step is carried out while heating the frames 220 and 230.

[0078] In a preferred example, the heater 300 for heating the adhesives 229 and 239 is provided in the pressing part 410 of the disassembling device 400. The heating step can be carried out by bringing the heater 300 provided in the pressing part 410 of the disassembling device 400 close to the adhesives 229 and 239. The heating temperature is as described in the first embodiment.

[0079] Next, in the frame separation step, the pressing part 410 presses the frames 220 and 230 outward, applying an external force F to the frames 220 and 230. The position where the external force F is applied is as described in the first embodiment.

[0080] In the third embodiment, since the time required for the transition from the heating step to the frame separation step can be omitted, the time required for disassembly is reduced. Also, if the heater 300 is provided in the pressing part 410 of the disassembling device 400, it is possible to reduce the size of the entire disassembling device 400.

[0081] [Fourth Embodiment] Next, a method for disassembling the photoelectric conversion module according to the fourth embodiment will be described with reference to FIG. 14. FIG. 14 is a schematic diagram for explaining the heating step according to the fourth embodiment. Note that the same reference numerals are given to the same configurations as those in the first embodiment. It should be noted that the description of the same configurations as those in the first embodiment may be omitted.

[0082] In the fourth embodiment, the heating step is carried out by the heater 300 disposed inside the frames 220 and 230. The heater 300 may have an outlet 310 for blowing hot air. The heater 300 may be provided with one or more outlets 310. The outlets 310 may be arranged side by side in the extending direction of the frames 220 and 230 so that hot air can be blown onto the entire frames 220 and 230. Also, the outlet 310 may be a single opening extending in the extending direction of the frames 220 and 230 so that hot air can be blown onto the entire frames 220 and 230.

[0083] In the fourth embodiment, it is possible to uniformly heat the entire frames 220 and 230 by heating with hot air. The heating temperature of the adhesives 229 and 239 is as described in the first embodiment.

[0084] In the fourth embodiment, the frame separation step can be carried out in the same manner as the method described in the first embodiment.

[0085] As described above, the content of the present invention has been disclosed through the embodiments. However, the descriptions and drawings that form a part of this disclosure should not be understood as limiting the present invention. Various alternative embodiments, examples, and operation techniques will be apparent to those skilled in the art from this disclosure. Therefore, the technical scope of the present invention is defined only by the invention-specific matters according to the appropriate claims based on the above description.

Explanation of Reference Numerals

[0086] 10 Photoelectric conversion module 100 Panel 220 First frame 229 First adhesive 230 Second frame 239 Second adhesive 300 Heater

Claims

1. A method for disassembling a photoelectric conversion module, comprising a panel, a frame provided along a side portion of the panel, and an adhesive for adhering the panel and the frame to each other, wherein: a heating step of heating at least a part of the adhesive to a temperature of 100°C or lower and lower than the melting temperature, softening temperature, or heat resistance limit temperature of the adhesive; a frame separation step of applying an external force to the frame.

2. The method for disassembling a photoelectric conversion module according to claim 1, wherein the temperature is 50°C or higher and 90°C or lower.

3. The method for disassembling a photoelectric conversion module according to claim 1 or 2, wherein, in the frame separation step, the external force is applied to at least a region adjacent to the adhesive heated in the heating step.

4. The method for disassembling a photoelectric conversion module according to any one of claims 1 to 3, wherein the adhesive is an adhesive containing a thermoplastic resin.

5. The method for disassembling a photoelectric conversion module according to any one of claims 1 to 4, wherein the heating step includes heating the adhesive provided at the corner of the frame to the temperature by a heater locally disposed at a position facing the corner of the frame.

6. The method for disassembling a photoelectric conversion module according to any one of claims 1 to 4, wherein the heating step includes heating the adhesive provided at one side of the frame to the temperature by a heater disposed entirely along at least one side of the frame.

7. The method for disassembling a photoelectric conversion module according to any one of claims 1 to 6, wherein the heating step includes simultaneously heating the adhesives provided on a plurality of the photoelectric conversion modules in a state where the plurality of photoelectric conversion modules are stacked on top of each other in the height direction.

8. The method for disassembling a photoelectric conversion module according to any one of claims 1 to 7, wherein, in the frame separation step, the external force is applied to a position closer to the end of the frame than the middle between the center and the end of the frame in the extending direction of the frame.

9. The frame has a panel receiving portion configured to receive an end portion of the panel and a leg portion extending away from the panel. In the frame separation step, the external force is applied at a position closer to the panel receiving portion of the leg than the middle between the end portion of the leg farthest from the panel and the panel receiving portion of the leg in a direction orthogonal to the panel. The method for disassembling a photoelectric conversion module according to any one of claims 1 to 8.

10. The frame has a panel receiving portion configured to receive an end portion of the panel, and a leg portion extending away from the panel. In the frame separation step, the external force is applied to the inner surface of the leg portion while the outer surface of the leg portion is held by a back plate. The method for disassembling a photoelectric conversion module according to any one of claims 1 to 9.

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