Detection system, detection method, and storage medium

Abstract

To enable a substrate for detection, which is provided with a state detection unit such as an imaging device for detecting the state of a structure in the processing space of a substrate processing device, to be more effectively utilized.SOLUTION: A detection system provided with a substrate processing device to process a substrate, for detecting the state of a structure in the processing space of the substrate processing device, is provided. The detection system comprises: a substrate for detection in which a state detection unit for detecting the state of the structure is provided; a conveyance device which is constructed so as to carry a substrate to be processed and the substrate for detection into and out of the processing space of the substrate processing device; and a control device. The substrate for detection is further provided with an acceleration detection unit for detecting acceleration with regard to each of two mutually intersecting directions in plane of the substrate surface. The control device estimates the bearing of the state detection unit on the substrate for detection in the processing space, on the basis of the results of detection by the acceleration detection unit when the substrate for detection has moved in the carry-in or -out direction when the substrate for detection is carried into or out of the processing space.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present disclosure relates to a detection system, a detection method, and a storage medium.

Background Art

[0002] In the apparatus disclosed in Patent Document 1, a predetermined jig is held on the transfer arm of a substrate transfer robot instead of a substrate. In this state, the nozzle is moved to the discharge position and approaches the jig until a predetermined relative positional relationship is established between the nozzle and the jig. Then, in this proximity state, the substrate transfer robot operates in the X direction and the Y direction, and the jig moves in the X direction and the Y direction. Along with this movement, there is a position where the light from the light projecting unit attached to the jig is blocked by the nozzle, so an operation is performed based on the output obtained from the light receiving unit attached to the jig, and the nozzle position is specified.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The technology according to the present disclosure enables more effective utilization of a detection substrate provided with a state detection unit such as an imaging device that detects the state of a structure within the processing space of a substrate processing apparatus.

Means for Solving the Problems

[0005] One aspect of the present disclosure provides a substrate processing apparatus for processing a substrate, and a detection system for detecting the state of a structure within a processing space of the substrate processing apparatus. The detection system includes a detection substrate provided with a state detection unit for detecting the state of the structure, a transfer device configured to transfer a substrate to be processed and the detection substrate into and out of the processing space of the substrate processing apparatus, and a control device. The detection substrate is further provided with an acceleration detection unit for detecting acceleration in two directions intersecting each other within the substrate surface. The control device estimates the orientation of the state detection unit on the detection substrate within the processing space based on the detection results of the acceleration detection unit when the detection substrate moves in the loading / unloading direction during loading / unloading of the detection substrate with respect to the processing space.

Advantages of the Invention

[0006] According to the present disclosure, the convenience of a detection substrate provided with a state detection unit such as an imaging device for detecting the state of a structure within a processing space of a substrate processing apparatus can be utilized more user-friendly.

Brief Description of the Drawings

[0007]

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Embodiments for Carrying Out the Invention

[0008] In a manufacturing process of a semiconductor device or the like, predetermined processing is performed to form a resist pattern on a substrate such as a semiconductor wafer (hereinafter referred to as "wafer"). The above-mentioned predetermined processing is, for example, a resist coating process in which a resist solution is supplied onto a substrate to form a resist film. Further, a process (EBR (Edge Bead Removal) process) of supplying a solvent from a solvent discharge nozzle disposed above the peripheral portion of the substrate on which the resist film is formed to remove the resist film at the peripheral portion of the substrate may be performed. Predetermined processing such as resist coating processing and EBR processing is performed by a substrate processing apparatus.

[0009] In order to obtain the desired EBR processing results, it is necessary to appropriately adjust the height of the solvent discharge nozzle relative to the substrate surface (hereinafter, sometimes abbreviated as "solvent discharge nozzle height") within the processing space of the substrate processing apparatus where the EBR processing is performed. Therefore, the height of the solvent discharge nozzle is measured or detected when the apparatus is started up or during maintenance.

[0010] It is also considered that a detection substrate equipped with an imaging device for detecting the height of the solvent discharge nozzle is transported into the processing space of the substrate processing apparatus by a substrate transport device, the solvent discharge nozzle is imaged by the imaging device on this detection substrate, and the height of the solvent discharge nozzle is detected based on the image results.

[0011] However, when the detection substrate is loaded into the processing space of the substrate processing apparatus by the substrate transport device, the orientation of the imaging device on the detection substrate is not constant. Therefore, it may be necessary to rotate the detection substrate within the processing space before capturing an image so that the solvent discharge nozzle located above the periphery of the detection substrate is within the field of view of the imaging device on the detection substrate. In this case, depending on the orientation of the imaging device when the detection substrate is loaded into the processing space, the detection substrate may be rotated approximately one full rotation. Furthermore, when rotating the detection substrate, if a tall member is provided on the peripheral surface of the detection substrate, there is a risk that the tall member will interfere with the solvent discharge nozzle located above the periphery of the detection substrate. Therefore, when the detection substrate may be rotated approximately one full rotation depending on the orientation of the imaging device as described above, it is not possible to provide any tall member at all on the peripheral edge of the detection substrate. The same applies to a detection substrate provided with a state detection unit for detecting the state of a structure in the processing space other than the imaging device for detecting the height of the solvent discharge nozzle.

[0012] Therefore, the technology according to the present disclosure improves the convenience of a detection substrate provided with a state detection unit such as an imaging device that detects the state of a structure within a processing space of a substrate processing apparatus.

[0013] Hereinafter, the detection system and detection method according to this embodiment will be described with reference to the drawings. In the present specification and drawings, elements having substantially the same functional configuration are denoted by the same reference numerals, and redundant description is omitted.

[0014] <Wafer processing system> FIG. 1 is an explanatory diagram showing an outline of the internal configuration of a wafer processing system 1 as a detection system. FIGS. 2 and 3 are diagrams schematically showing the outlines of the internal configurations of the front side and the back side of the wafer processing system 1, respectively. In the following example, the wafer processing system 1 is a coating and developing processing system that performs coating and developing processing on a wafer W.

[0015] As shown in FIG. 1, the wafer processing system 1 includes a cassette station 10 into which a cassette C containing a plurality of wafers W as substrates is loaded and unloaded, and a processing station 11 including a plurality of various processing apparatuses that perform predetermined processing on the wafers W. Then, the wafer processing system 1 has a configuration in which an interface station 13 that transfers the wafer W among the cassette station 10, the processing station 11, and an exposure apparatus 12 adjacent to the processing station 11 is integrally connected.

[0016] The cassette station 10 is provided with a cassette mounting table 20. The cassette mounting table 20 is provided with a plurality of cassette mounting plates 21 on which the cassette C is mounted when the cassette C is loaded and unloaded with respect to the outside of the wafer processing system 1. Further, in one embodiment, in any one of the cassettes C, in addition to the wafers W, a detection wafer Wj described later is also accommodated.

[0017] The cassette station 10 is provided with a wafer transfer device 23 that is movable on a transfer path 22 extending in the A direction in the figure. The wafer transfer device 23 is also movable in the vertical direction and around the vertical axis (θ direction), and can transfer the wafer W and the detection wafer Wj between the cassette C on each cassette mounting plate 21 and a transfer device of a third block G3 of the processing station 11 described later.

[0018] The processing station 11 is provided with a plurality of, for example, four blocks G1, G2, G3, and G4 equipped with various devices. For example, a first block G1 is provided on the front side of the processing station 11 (the negative A-direction side in FIG. 1), and a second block G2 is provided on the back side of the processing station 11 (the positive A-direction side in FIG. 1). Also, a third block G3 is provided on the cassette station 10 side of the processing station 11 (the negative B-direction side in FIG. 1), and a fourth block G4 is provided on the interface station 13 side of the processing station 11 (the positive B-direction side in FIG. 1).

[0019] As shown in FIG. 2, a plurality of liquid processing devices, for example, a development processing device 30 and a resist coating device 31, are arranged in this order from the bottom in the first block G1. The development processing device 30 develops the wafer W, and the resist coating device 31 applies a resist solution to the wafer W to form a resist film.

[0020] For example, the development processing device 30 and the resist coating device 31 are each provided side by side in the vertical and horizontal directions. Note that the number and arrangement of these development processing device 30 and resist coating device 31 can be arbitrarily selected.

[0021] In these development processing device 30 and resist coating device 31, for example, a predetermined processing liquid is supplied onto the wafer W by a spin coating method. In the spin coating method, for example, the processing liquid is discharged onto the wafer W from a discharge nozzle, and the wafer W is rotated to spread the processing liquid on the surface of the wafer W.

[0022] As shown in FIG. 3, the second block G2 is provided with a heat treatment device 40 that performs heat treatment such as heating and cooling of the wafer W, and an adhesion device 41 for enhancing the adhesion between the resist solution and the wafer W. These heat treatment device 40 and adhesion device 41 are provided side by side in the vertical and horizontal directions, and the number and arrangement thereof can be arbitrarily selected.

[0023] For example, in the third block G3, a plurality of transfer devices 50, 51, 52, 53, 54, and 55 are provided in this order from the bottom up, and in the fourth block G4, a plurality of transfer devices 60, 61, and 62 are provided in this order from the bottom up.

[0024] 1, a wafer transfer area D serving as a substrate transfer area is formed in an area surrounded by the first block G1 to the fourth block G4. In the wafer transfer area D, a wafer transfer device 70 serving as a transfer device is disposed.

[0025] The wafer transfer device 70 has a transfer arm 70a that is movable in, for example, directions A, B, and θ, and in the vertical direction. The wafer transfer device 70 moves within the wafer transfer region D and can transfer the wafer W and the detection wafer Wj to predetermined devices in the surrounding first block G1, second block G2, third block G3, and fourth block G4. A plurality of wafer transfer devices 70 are arranged one above the other, for example, as shown in FIG. 3, and can transfer the wafer W and the detection wafer Wj to predetermined devices at approximately the same height in each of the blocks G1 to G4.

[0026] In addition, the wafer transfer region D is provided with a shuttle transfer device 80 that transfers the wafer W linearly between the third block G3 and the fourth block G4.

[0027] Shuttle transfer device 80 is movable linearly, for example, in the direction B in Fig. 3. Shuttle transfer device 80 moves in the direction B while supporting a wafer W, and can transfer the wafer W between delivery device 52 in the third block G3 and delivery device 62 in the fourth block G4.

[0028] 1, a wafer transfer device 90 is provided adjacent to the third block G3 on the positive side in the X direction. The wafer transfer device 90 has a transfer arm 90a that is movable in, for example, the X direction, the θ direction, and the up-and-down direction. The wafer transfer device 90 moves up and down while supporting a wafer W, and can transfer the wafer W to each delivery device in the third block G3.

[0029] The interface station 13 is provided with a wafer transfer device 95 and a delivery device 96. The wafer transfer device 95 has a transfer arm 95a that is movable, for example, in the Y direction, the θ direction, and up and down directions. The wafer transfer device 95 supports the wafer W and the detection wafer Wj on, for example, the transfer arm 95a, and can transfer the wafer W and the detection wafer Wj between each delivery device in the fourth block G4, the delivery device 96, and the exposure device 12.

[0030] The wafer processing system 1 described above is provided with a control device U, as shown in FIG. 1. The control device U is configured, for example, by a computer equipped with a CPU, memory, etc., and has a program storage unit (not shown). The program storage unit stores a program for controlling wafer processing in the wafer processing system 1. The program storage unit also stores a program for detecting the state of structures located in the processing space of a processing device, such as the resist coating device 31, based on detection results using the detection wafer Wj (described below). That is, the program storage unit stores a program that runs on the computer of the control device U that controls the wafer processing system 1 to cause the wafer processing system 1 to execute a detection process using the detection wafer Wj. The program may be recorded on a computer-readable storage medium M and installed into the control device U from the storage medium M. The storage medium M may be temporary or non-temporary. Furthermore, part or all of the program may be implemented by dedicated hardware (circuit board).

[0031] <Resist coating device 31> Next, a description will be given of the configuration of the above-mentioned coating apparatus 31. Figures 4 and 5 are a longitudinal sectional view and a transverse sectional view, respectively, showing the outline of the configuration of the resist coating apparatus 31. As shown in FIGS. 4 and 5, the resist coating apparatus 31 has a processing container 100 that has a processing space 100s inside and can be sealed inside. On the side surface of the processing container 100 on the wafer transfer device 70 side, a loading / unloading port (not shown) for the wafer W is formed, and an opening / closing shutter (not shown) is provided at the loading / unloading port.

[0032] In the central part of the processing container 100, a spin chuck 110 is provided as a substrate holding part. The spin chuck 110 holds the wafer W and is configured to be rotatable. Further, the spin chuck 110 has a horizontal upper surface, and on the upper surface, for example, a suction port (not shown) for sucking the wafer W is provided. By suction from this suction port, the wafer W can be adsorbed and held on the spin chuck 110. This spin chuck 110 can also rotate while adsorbing and holding the detection wafer Wj.

[0033] Below the spin chuck 110, a chuck drive unit 111 is provided as a rotation mechanism. The chuck drive unit 111 includes, for example, a motor or the like, and can rotate the spin chuck 110 at a desired speed, whereby the wafer W held by the spin chuck 110 can be rotated at a desired speed. Further, the chuck drive unit 111 is provided with a lifting drive source such as a cylinder or the like, whereby the spin chuck 110 can be lifted and lowered.

[0034] [[ID=I2]]Around the spin chuck 110, a cup 112 is provided to receive and collect the liquid scattered or dropped from the wafer W. A discharge pipe 113 for discharging the collected liquid and an exhaust pipe 114 for evacuating the atmosphere in the cup 112 are connected to the lower surface of the cup 112.

[0035] As shown in FIG. 5, on the negative A-direction side (the downward direction in FIG. 5) of the cup 112, rails 120 and 121 extending along the B-direction (the left-right direction in FIG. 5) are formed. The rails 120 and 121 are formed, for example, from the outside on the negative B-direction side (the left direction in FIG. 5) of the cup 112 to the outside on the positive B-direction side (the right direction in FIG. 5) of the cup 112. A first arm 122 and a second arm 123 are respectively attached to the rails 120 and 121.

[0036] As shown in FIGS. 4 and 5, a resist discharge nozzle 124 for discharging a resist liquid and supplying it onto the wafer W is supported by the first arm 122. The first arm 122 is movable on the rail 120 by a nozzle drive unit 125 shown in FIG. 5. Thereby, the resist discharge nozzle 124 can move from a standby unit 126 installed outside the positive Y-direction side of the cup 112 to above the central portion of the wafer W in the cup 112. Further, the first arm 122 can be moved up and down by the nozzle drive unit 125, and the height of the resist discharge nozzle 124 can be adjusted.

[0037] A supply source (not shown) of the resist liquid is connected to the resist discharge nozzle 124. Further, a supply device group including a valve for controlling the flow of the resist liquid, a flow rate adjustment unit, etc. is provided in a supply pipe (not shown) between the resist discharge nozzle 124 and the above-mentioned resist liquid supply source.

[0038] As shown in FIGS. 4 and 5, a solvent discharge nozzle 127 is supported by the second arm 123. The solvent discharge nozzle 127 is an example of a structure, and discharges the solvent of the resist film as a removal liquid for removing the peripheral portion of the resist film formed on the surface of the wafer W and supplies it onto the wafer W. The second arm 123 is movable on the rail 121 by a nozzle drive unit 128. Thereby, the solvent discharge nozzle 127 can move from a standby unit 129 installed outside the negative Y-direction side of the cup 112 to above the peripheral region of the wafer W in the cup 112. Further, the second arm 123 can be moved up and down by the nozzle drive unit 128, and the height of the solvent discharge nozzle 127 can be adjusted.

[0039] A solvent supply source (not shown) is connected to the solvent discharge nozzle 127. Further, a group of supply devices including a valve for controlling the flow of the solvent, a flow rate adjustment unit, etc. is provided in a supply pipe (not shown) between the solvent discharge nozzle 127 and the solvent supply source.

[0040] <Detection wafer> In the wafer processing system 1 including the resist coating apparatus 31 as described above, at the time of apparatus startup or maintenance, the height of the solvent discharge nozzle 127 (hereinafter abbreviated as "the height of the solvent discharge nozzle 127") with respect to the wafer W held by the spin chuck 110 is detected. In the present embodiment, a detection wafer Wj as a detection substrate is used for detecting the height of the solvent discharge nozzle 127.

[0041] FIG. 6 is a side view and a plan view showing an outline of an example of the detection wafer Wj. The detection wafer Wj has a main body 200 formed in the same shape as the wafer W. A camera 210 and an acceleration sensor 220 are provided on the surface of the detection wafer Wj (specifically, the upper surface of the main body 200).

[0042] The camera 210 is an example of a state detection unit and an example of an imaging unit, and is for detecting the height of the solvent discharge nozzle 127, and images the solvent discharge nozzle 127 and the like.

[0043] The acceleration sensor 220 is an example of an acceleration detection unit, and detects acceleration in each of a first direction and a second direction that are two mutually intersecting directions within the surface of the detection wafer Wj. In the present embodiment, the first and second directions are the X direction and the Y direction in FIG. 6 that are perpendicular to each other, respectively.

[0044] In addition, in the present embodiment, the camera 210 is located on a straight line parallel to the X direction in the plan view of the detection wafer Wj, that is, the center in the plan view of the main body 200, and is provided on the positive side in the X direction. Further, the camera 210 is provided at a position closer to the center of the wafer so as not to interfere with the solvent discharge nozzle 127 when the solvent discharge nozzle 127 is located above the peripheral portion of the detection wafer Wj.

[0045] Furthermore, a member 230 higher than the height of the solvent discharge nozzle 127 may be provided on the upper surface of the peripheral portion of the main body 200 for the detection wafer Wj. The above-mentioned high member 230 is, for example, another detection unit that detects the state of structures in the processing space 100s other than the solvent discharge nozzle 127.

[0046] In addition, the detection wafer Wj has a power source (not shown) and a control unit (not shown). The control unit of the detection wafer Wj has a processor and a storage means, and controls the execution of a program stored in the storage means so that the imaging result by the camera 210 and the detection result by the acceleration sensor 220 are transmitted to the control device U by wireless communication or the like.

[0047] <Principle of estimating the orientation of the camera 210 on the detection wafer Wj> In the present embodiment, when detecting the height of the solvent discharge nozzle 127 using the detection wafer Wj, the detection wafer Wj is carried into the processing container 100, that is, the processing space 100s, by the wafer transfer device 70 as shown in FIG. 7. Then, prior to the detection of the height of the solvent discharge nozzle 127, the orientation of the camera 210 on the detection wafer Wj in the processing space 100s after loading is estimated.

[0048] Hereinafter, first, the principle of estimating the orientation of the camera 210 (that is, the position of the camera in the circumferential direction) on the detection wafer Wj in the processing space 100s in the present embodiment will be described with reference to FIGS. 8 and 9. In the present embodiment, the "circumferential direction" means the circumferential direction centered on the rotation center of the spin chuck 110.

[0049] As described above, when detecting the height of the solvent discharge nozzle 127, the test wafer Wj is loaded into the processing space 100s by the wafer transfer device 70. At this time, the test wafer Wj moves linearly from a predetermined position outside the processing space 100s to a position directly above the spin chuck 110 within the processing space 100s. Furthermore, at this time, the speed history of the test wafer Wj is not complex; for example, the speed gradually increases from zero, reaches a predetermined value, and then gradually decreases and returns to zero.

[0050] Therefore, a correlation occurs between the orientation of the detection wafer Wj when it is being moved in the loading / unloading direction (specifically, the loading direction) by the wafer transport device 70 (hereinafter referred to as the "orientation of the detection wafer Wj during transport") and the detection result by the acceleration sensor 220, as shown in Figures 8 and 9.

[0051] 8, when the orientation of the detection wafer Wj during transfer is such that the carry-in direction and the positive X direction are aligned, the acceleration in the X direction detected by the acceleration sensor 220 during transfer gradually increases, then decreases, and then increases again. On the other hand, the acceleration in the Y direction detected by the acceleration sensor 220 is always zero during transfer. 9, when the orientation of the detection wafer Wj during transfer is such that the carry-in direction and the positive Y direction are the same, the Y-direction acceleration detected by the acceleration sensor 220 during transfer gradually increases, then decreases, and then increases again. On the other hand, the X-direction acceleration detected by the acceleration sensor 220 is always zero during transfer. 8, when the orientation of the detection wafer Wj during transfer is such that the positive X direction forms an angle of 135° with the carry-in direction, the acceleration in the X direction detected by the acceleration sensor 220 during transfer gradually decreases, then increases, and then decreases again. The same is true for the acceleration in the Y direction detected by the acceleration sensor 220 during transfer. 9, when the orientation of the detection wafer Wj during transfer is such that the positive X direction forms an angle of 315° with the carry-in direction, the acceleration in the X direction detected by the acceleration sensor 220 during transfer gradually increases, then decreases, and then increases again. The same is true for the acceleration in the Y direction detected by the acceleration sensor 220 during transfer.

[0052] There is a fixed relationship between the orientation of the detector wafer Wj during transfer and the orientation of the camera 210 on the detector wafer Wj in the processing space 100s after it has been loaded (hereinafter referred to as "the orientation of the camera 210 in the processing space 100s"). Therefore, in this embodiment, the control device U estimates the orientation of the camera 210 within the processing space 100s based on the detection result by the acceleration sensor 220 when the detector wafer Wj moves in the loading direction when the detector wafer Wj is loaded into the processing space 100s. A specific estimation method will be described later.

[0053] <Detecting the height of the solvent discharge nozzle 127> Next, an example of a process for detecting the height of the solvent discharge nozzle 127 using a detector wafer Wj in the wafer processing system 1 will be described with reference to FIGS. 10 to 13. FIG. 10 is a diagram showing an example of a pattern that can be obtained from the acceleration history when the detector wafer Wj is loaded. FIG. 11 is a diagram showing an example of a table used to estimate the orientation of the camera 210 within the processing space 100s. FIG. 12 is a diagram showing an example of the positional relationship between the solvent discharge nozzle 127 and the detector wafer Wj during a process for detecting the height of the solvent discharge nozzle 127. FIG. 13 is a flowchart for explaining an example of the detection process in step S4, which will be described later.

[0054] (Step S1: Loading and acceleration detection) First, under the control of the control device U, the test wafer Wj is loaded into the processing space 100s of the resist coating device 31 by the wafer transfer device 70, and the acceleration of the test wafer Wj at the time of loading is detected by the acceleration sensor 220.

[0055] Specifically, first, under the control of the control device U, the test wafer Wj is removed from the cassette C on the cassette mounting table 20 and held by the transfer arm 70a of the wafer transfer device 70. Then, under the control of the control device U, the test wafer Wj held by the transfer arm 70a moves linearly along the carry-in direction from a predetermined position outside the resist coating device 31 to a position directly above the spin chuck 110 in the processing space 100s of the resist coating device 31. Next, under the control of the control device U, the test wafer Wj is transferred from the transfer arm 70a to the spin chuck 110. After the transfer, the transfer arm 70a is removed from the resist coating device 31.

[0056] During the linear movement in the above-mentioned carry-in direction, the acceleration sensors 220 on the detector wafers Wj detect the accelerations of the detector wafers Wj in the X and Y directions. The acceleration detection results are transmitted to the control device U via wireless communication.

[0057] (Step S2: Estimation of the orientation of the camera 210 in the processing space 100s) Next, the control device U estimates the orientation of the camera 210 within the processing space 100s based on the acceleration detection result in step S1.

[0058] Specifically, possible patterns of the acceleration history during linear movement in the loading direction are classified in advance, and information for the classification (hereinafter referred to as "classification information") is stored in a storage unit (not shown). Then, based on the classification information, the control device U determines which of the above patterns the acceleration history detected by the acceleration sensor 220 corresponds to for each of the X and Y directions, and estimates the orientation of the camera 210 within the processing space 100s based on the determination result. That is, the control device U determines, for each of the X and Y directions, which of the pre-classified patterns that the acceleration history detected by the acceleration sensor 220 can take during movement in the loading / unloading direction, and estimates the orientation of the camera 210 within the processing space 100s based on the determination result.

[0059] Further, the control device U determines which of the above patterns the history of the acceleration detected by the acceleration sensor 220 corresponds to based on, for example, the magnitude relationship between the acceleration in the first half during linear movement in the loading direction and the acceleration in the second half during linear movement in the loading direction.

[0060] The following will be described more specifically. Here, an index A indicating the history of the acceleration in the first half during the above movement and an index B indicating the history of the acceleration in the second half during the above movement are defined as follows. A = αf - αt B = αb - αt αf: The average of the acceleration in the first half during the above movement αb: The average of the acceleration in the second half during the above movement αt: The overall average during linear movement in the loading direction

[0061] The control device U determines which of the following patterns (1) to (3) the history of the acceleration detected by the acceleration sensor 220 corresponds to based on the index A and the index B. When the absolute value of A - B is less than or equal to a predetermined value, it is determined that it corresponds to the following pattern (2). (1) A > B pattern (as shown in the center of FIG. 10) (2) A ≒ B pattern (as shown in the upper part of FIG. 10) (3) A < B pattern (as shown in the lower part of FIG. 10)

[0062] Then, the control device U estimates the orientation of the camera 210 within the processing space 100s (specifically, the range of the orientation of the camera 210 within the processing space 100s) based on, for example, the determination result related to the above pattern and the table T in FIG. 11. The table T is an example of information showing the correspondence relationship between the pattern of the history of the acceleration in the X direction, the pattern of the history of the acceleration in the Y direction, and the orientation of the camera 210 within the processing space 100s.

[0063] For example, when the history of the acceleration detected in the X direction is in pattern (1) where A > B, and the history of the acceleration detected in the Y direction is in pattern (2) where A ≒ B, the control device U estimates the range of the orientation of the camera 210 within the processing space 100s to be 0° ± 45° based on the table T in FIG. 11.

[0064] Note that, as patterns of the history of the acceleration detected by the acceleration sensor 220, instead of the combinations of the above-mentioned patterns (1), (2), and (3), combinations of the following patterns (1a), (2a), (3a) or combinations of patterns (1b), (2b), (3b) may be used.

[0065] (1a) Pattern where A > threshold value Th (as shown in the center of FIG. 10) (2a) Pattern where A ≒ threshold value Th (as shown in the upper part of FIG. 10) (3a) Pattern where A < threshold value Th (as shown in the lower part of FIG. 10)

[0066] (1b) Pattern where B < threshold value Th (as shown in the center of FIG. 10) (2b) Pattern where B ≒ threshold value Th (as shown in the upper part of FIG. 10) (3b) Pattern where B > threshold value Th (as shown in the lower part of FIG. 10)

[0067] In this case, the control device U determines whether the history of the acceleration detected by the acceleration sensor 220 corresponds to any of the patterns (1a), (2a), (3a) or any of the patterns (1b), (2b), (3b). Then, the control device U estimates the orientation of the camera 210 within the processing space 100s based on the determination result and a table similar to the table in FIG. 11.

[0068] (Step S3: Correction of the orientation of the camera 210 within the processing space 100s) After estimating the orientation of the camera 210 within the processing space 100s, the control device U rotates the spin chuck 110 holding the wafer Wj for detection based on the estimation result and the information on the circumferential position of the solvent discharge nozzle 127 within the processing space 100s, and corrects the orientation of the camera 210 to the orientation corresponding to the solvent discharge nozzle 127. For example, as shown in FIG. 12(A), the control device U corrects the orientation of the camera 210 so that the portion corresponding to the maximum value of the range R of the orientation of the camera 210 on the wafer Wj for detection faces the solvent discharge nozzle 127. Note that the control device U may correct the orientation of the camera 210 so that the portion corresponding to the minimum value of the range R of the orientation of the camera 210 on the wafer Wj for detection faces the solvent discharge nozzle 127.

[0069] Also, as shown in FIG. 12(A), the correction of the orientation of the camera 210 is performed in a state where the solvent discharge nozzle 127 is retracted from the region overlapping the wafer Wj for detection in plan view. This is to avoid interference between the solvent discharge nozzle 127 and the aforementioned high member 230 during the correction.

[0070] (Step S4: Detection of the height of the solvent discharge nozzle 127) Next, as shown in FIG. 12(B), after the solvent discharge nozzle 127 is moved to the region overlapping the wafer Wj for detection under the control of the control device U, the height of the solvent discharge nozzle 127 is detected.

[0071] Specifically, in step S4, first, as shown in FIG. 13, imaging is performed by the camera 210 under the control of the control device U (step S4a). The imaging result is output to the control device U.

[0072] Next, the control device U determines whether the solvent discharge nozzle 127 is within the detection range of the camera 210, that is, whether the solvent discharge nozzle 127 is within the image captured by the camera 210 (step S4b).

[0073] If it is not within the range (NO), the detection wafer Wj held on the spin chuck 110 is rotated by a predetermined angle (e.g., 10°) under the control of the control device U (step S4c). After that, the process returns to step S4a, and an image is captured by the camera again under the control of the control device U. That is, the detection wafer Wj is rotated stepwise until the solvent discharge nozzle 127 falls within the detection range of the camera 210.

[0074] Then, if the result of the judgment in step S4b is that the solvent discharge nozzle 127 is within the detection range of the camera 210, i.e., within the image captured by the camera (YES), the control device U detects the height of the solvent discharge nozzle 127 based on the image captured by the camera 210 (step S4c).

[0075] <Another example of acceleration detection timing> In the above, when the detector wafer Wj is loaded into the processing space 100s, the acceleration is detected by the acceleration sensor 220, and the detection result is used to estimate the orientation of the camera 210 within the processing space 100s. Alternatively, the detector wafer Wj may be loaded into the processing space 100s, then unloaded from the processing space 100s, and then returned to the processing space 100s. The acceleration sensor 220 may detect the linear acceleration of the detector wafer Wj in the loading / unloading direction during unloading, and the detection result may be used to estimate the orientation of the camera 210.

[0076] <Major Effects of This Embodiment> As described above, in this embodiment, the acceleration sensor 220 is provided on the detection wafer Wj, which is provided with the camera 210 used to detect the height of the solvent discharge nozzle 127. In this embodiment, the orientation of the camera 210 within the processing space 100s is estimated based on the detection result by the acceleration sensor 220 when the detection wafer Wj moves linearly in the transfer direction during transfer of the detection wafer Wj into or out of the processing space 100s. Therefore, according to this embodiment, the orientation of the camera 210 within the processing space 100s can be corrected based on the estimation result before detecting the height of the solvent discharge nozzle 127. As a result, the amount of rotation of the detection wafer Wj to adjust the orientation of the camera 210 relative to the position of the solvent discharge nozzle 127 can be reduced. Therefore, even if the tall member 230 is provided as described above, it does not interfere with the solvent discharge nozzle 127 located above the peripheral portion of the detection wafer Wj. Therefore, according to this embodiment, the detection wafer Wj can be more effectively utilized.

[0077] Furthermore, according to this embodiment, the detection wafer Wj can be shared among different resist coating apparatuses 31. Therefore, it is not necessary to provide a unit for detecting the orientation of the camera 210 in the processing space 100s in each resist coating apparatus 31. Therefore, an increase in the cost of the entire wafer processing system 1 can be suppressed.

[0078] <Another Example 1 of the Method for Estimating the Orientation of the Camera 210 in the Processing Space 100s Based on the Acceleration Detection Result> In the above example, one acceleration sensor 220 is provided on the detection wafer Wj, but in addition to this acceleration sensor 220, an acceleration sensor 220A that detects acceleration in a direction different from that of the acceleration sensor 220 may be provided on the detection wafer Wj, as shown in Fig. 14. The acceleration sensor 220A detects, for example, acceleration in the Xa direction that forms an angle of +22.5° with respect to the X direction, and acceleration in the Ya direction that forms an angle of +22.5° with respect to the Y direction.

[0079] 15, the control device U newly estimates the range RB of the orientation of the camera 210, which is the range R of the orientation of the camera 210 estimated based on the detection result by the acceleration sensor 220 and the range RA of the orientation of the camera 210 estimated based on the detection result by the acceleration sensor 220A. For example, the accuracy of the orientation of the camera 210 estimated based on the detection result by one acceleration sensor 220 is ±45°, but as described above, by using two acceleration sensors 220, 220A, the accuracy of the orientation of the camera can be increased to ±25°.

[0080] <Another Example 2 of the Method for Estimating the Orientation of the Camera 210 in the Processing Space 100s Based on the Acceleration Detection Result> The orientation of the camera 210 in the processing space 100s may be estimated based on the acceleration detection result as follows. In this estimation method, as shown in FIG. 16, a plane having axes defined by the acceleration αx applied in the X direction and the acceleration αy applied in the Y direction is defined as an acceleration plane PL. Then, the control device U estimates the orientation of the camera 210 within the processing space 100s based on at least one of the following points C and D on the acceleration plane PL.

[0081] Point C(αx1, αy1) Point D(αx2, αy2)

[0082] αx1 is the acceleration applied in the X direction during the first half of linear movement in the carry-in direction, and more specifically, for example, is the aforementioned index A indicating the history of acceleration applied in the X direction during the first half of the movement. αy1 is the acceleration applied in the Y direction during the first half of the movement, and more specifically, for example, is the aforementioned index B indicating the history of the acceleration applied in the Y direction during the first half of the movement. αx2 is the acceleration applied in the X direction during the latter half of the movement, and more specifically, for example, is the aforementioned index A indicating the history of the acceleration applied in the X direction during the latter half of the movement. αy2 is the acceleration applied in the Y direction during the latter half of the movement, and more specifically, is, for example, the aforementioned index B indicating the history of the acceleration applied in the Y direction during the latter half of the movement.

[0083] Then, the control device U estimates, for example, the angle θ that the vector from the origin toward point C makes with the positive direction of the αx axis on the acceleration plane PL as the orientation of the camera 210 in the processing space 100s.

[0084] <Other Examples of Targets Detected by Camera 210> In the above, the height of the solvent discharge nozzle 127 is detected based on the image capturing results of the camera 210. In addition to this, for example, the height of a predetermined portion of the cup 112 may be detected based on the image capturing results of the camera 210. This detection is performed, for example, at multiple locations (e.g., six locations) spaced apart from one another in the circumferential direction. A camera for detecting the height of a predetermined portion of the cup 112 may be provided on the detection wafer Wj separately from the camera 210.

[0085] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive, and the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0086] 1. Wafer Processing System 31 Resist coating device 70 Wafer transport device 127 Solvent discharge nozzle 210 Camera 220 Acceleration Sensor 220A Accelerometer U Control Device W wafer Wj detection wafer

Claims

1. A detection system comprising a substrate processing apparatus for processing a substrate, the detection system detecting a state of a structure within a processing space of the substrate processing apparatus, a detection substrate provided with a state detection unit for detecting the state of the structure, a transfer device configured to transfer the substrate to be processed and the detection substrate into and out of the processing space of the substrate processing apparatus, and a control device, wherein the detection substrate is further provided with acceleration detection units for detecting acceleration in two mutually intersecting directions within the substrate surface, the control device estimating an orientation of the state detection unit on the detection substrate within the processing space based on a detection result of the acceleration detection unit when the detection substrate moves in the loading / unloading direction when being loaded into and unloaded from the processing space.

2. Patterns in which an acceleration history during movement in the loading / unloading direction can be obtained are pre-classified, the control device determining, for each of the mutually intersecting directions, which of the patterns the acceleration history detected by the acceleration detection unit corresponds to, and estimating the orientation based on the determination result. The detection system according to Claim 1.

3. The control device determines which of the patterns the acceleration history detected by the acceleration detection unit corresponds to based on a magnitude relationship between the acceleration in the first half of the movement in the loading / unloading direction and the acceleration in the second half of the movement in the loading / unloading direction. The detection system according to Claim 2.

4. Two acceleration detection units are provided on the detection substrate, each of the two acceleration detection units measuring acceleration applied in a different direction, the control device newly estimating, as the range of the orientation, a range that overlaps between a range of the orientation estimated based on a detection result of one acceleration detection unit and a range of the orientation estimated based on a detection result of the other acceleration detection unit. The detection system according to any one of Claims 1 to 3.

5. The two mutually intersecting directions are a first direction and a second direction, when a plane with the acceleration applied in the first direction and the acceleration applied in the second direction as axes is defined as an acceleration plane, The detection system according to claim 1, wherein the control device estimates the orientation based on at least one of the position of a point represented by the acceleration in the first direction during the first half of the movement and the acceleration in the second direction during the first half of the movement in the acceleration plane, or the position of a point represented by the acceleration in the first direction during the second half of the movement and the acceleration in the second direction during the second half of the movement in the acceleration plane.

6. The detection system according to any one of claims 1 to 5, further comprising a rotation mechanism for rotating the detection substrate.

7. The detection system according to claim 6, wherein the control device rotates the detection substrate based on the estimation result of the orientation and corrects the orientation so as to be in the orientation corresponding to the structure to be detected by the state detection unit.

8. The detection system according to claim 6 or 7, wherein after the orientation is set to the orientation corresponding to the structure to be detected by the state detection unit, the control device rotates the detection substrate step by step until the structure to be detected is within the detection range of the state detection unit, and detects the state of the structure to be detected based on the output from the state detection unit when the structure to be detected is within the detection range.

9. A detection method for detecting the state of a structure in a processing space of a substrate processing apparatus, comprising: a step of loading and unloading a detection substrate provided with a state detection unit for detecting the state of the structure and an acceleration detection unit for detecting acceleration in two mutually intersecting directions in the substrate surface into and out of the processing space; a step of estimating the orientation of the state detection unit on the detection substrate in the processing space based on the detection result by the acceleration detection unit when the detection substrate moves in the loading and unloading direction during the loading and unloading step.

10. Patterns in which the history of acceleration during movement in the loading and unloading direction can be obtained are classified in advance, In the step of estimating the orientation, it is determined for each of the mutually intersecting directions which pattern the history of acceleration detected by the acceleration detection unit corresponds to, and the orientation is estimated based on the determination result. The detection method according to claim 9.

11. The step of estimating the orientation determines which pattern the history of the acceleration detected by the acceleration detection unit corresponds to based on the magnitude relationship between the acceleration in the first half during movement in the loading / unloading direction and the acceleration in the second half during movement in the loading / unloading direction, according to the detection method of claim 10.

12. Two acceleration detection units are provided on the detection substrate. Each of the two acceleration detection units measures the acceleration applied in a different direction. The step of estimating the orientation includes a step of estimating the range of the orientation. The step of estimating the range of the orientation newly estimates, as the range of the orientation, the overlapping range between the range of the orientation estimated based on the detection result of one of the acceleration detection units and the range of the orientation estimated based on the detection result of the other acceleration detection unit, according to the detection method of any one of claims 9 to 11.

13. The two intersecting directions are the first direction and the second direction. When the planes with the acceleration applied in the first direction and the acceleration applied in the second direction as axes are defined as acceleration planes, The step of estimating the orientation estimates the orientation based on at least one of the position of the point represented by the acceleration in the first direction in the first half during movement and the acceleration in the second direction in the first half during movement in the acceleration plane, or the position of the point represented by the acceleration in the first direction in the second half during movement and the acceleration in the second direction in the second half during movement, according to the detection method of claim 9.

14. The detection method according to any one of claims 9 to 13 further includes a step of rotating the detection substrate based on the estimated result of the orientation and correcting the orientation so that it becomes the orientation corresponding to the structure to be detected by the state detection unit.

15. After the orientation is set to the orientation corresponding to the structure to be detected by the state detection unit, the detection substrate is rotated step by step until the structure to be detected is within the detection range of the state detection unit, and the state of the structure to be detected is detected based on the output from the state detection unit when the structure to be detected is within the detection range. The detection method according to any one of claims 9 to 14 further includes this step.

16. A readable computer storage medium storing a program that operates on a computer of a control device that controls the detection method in order to cause a detection system to execute the detection method according to any one of claims 9 to 15.

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