Resin sheet, container, carrier tape, and electronic component package

Abstract

This resin sheet is used for molding, and is such that the impact strength in a DuPont impact test is 1.0 J or higher and the value obtained through integration from an origin point up to a strain occurring during fracture in a reaction strain curve obtained through a tension test is 80 N / m2 or less. This carrier tape 100 is a molded body 16 of the resin sheet, and is provided with an accommodating part 20 that is capable of accommodating an article.

Description

Technical Field

[0001] The present invention relates to a resin sheet, a container, a carrier tape, and an electronic component package.

Background Art

[0002] For packaging containers of intermediate products of industrial products such as electronic devices and automobiles, vacuum forming trays, embossed carrier tapes, etc. obtained by thermoforming a resin sheet are used. And as a sheet for packaging containers of ICs that dislike static electricity and various components having an IC, a laminated sheet in which a surface layer containing a thermoplastic resin and a conductive material such as carbon black is laminated on a base material layer made of a thermoplastic resin is used (for example, see Patent Documents 1 to 3 below). When producing a carrier tape, a slit product obtained by slitting a raw sheet as necessary is used. In an embossed carrier tape, feed holes and the like used for conveyance in the encapsulation process of various electronic components such as ICs are provided (for example, see Patent Document 4).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Patent Document 4

Summary of the Invention

Problems to be Solved by the Invention

[0004] In recent years, with the miniaturization of electronic components such as ICs, as the performance of carrier tapes and the like, it is required that burrs generated on the cross section are small when slitting a raw sheet or punching feed holes and the like.

[0005] On the other hand, in the resin sheet for forming the embossed carrier tape, not only is it difficult for burrs to occur due to punching or slitting, but it is also necessary to have sufficient folding strength so that cracks are less likely to occur even by known sheet forming methods such as vacuum forming, pressure air forming, and press forming. Further, in an embossed carrier tape or the like, a housing portion for housing components is provided by embossing or the like. If the thickness variation on the side surface or bottom surface of the housing portion is large, cracks are likely to occur. Therefore, the resin sheet is required to have formability capable of sufficiently suppressing the thickness variation of the molded body.

[0006] An object of the present invention is to provide a resin sheet having sufficient folding strength and formability, and being less likely to generate burrs due to punching or slitting, as well as a container, a carrier tape, and an electronic component package obtained by using the same.

Means for Solving the Problems

[0007] In order to solve the above problems, one aspect of the present invention is a resin sheet for molding, wherein the impact strength in the DuPont impact test is 1.0 J or more, and in the stress-strain curve obtained by the tensile test, the value obtained by integrating up to the strain when breaking from the origin is 80 N / m 2 or less, and a resin sheet is provided.

[0008] The resin sheet can contain at least one of a polycarbonate resin and an ABS resin.

[0009] The resin sheet includes a base material layer and a surface layer laminated on at least one surface of the base material layer, the base material layer includes at least one of a polycarbonate resin and an ABS resin and an inorganic filler, and the surface layer can include at least one of a polycarbonate resin and an ABS resin and a conductive material.

[0010] In the above resin sheet, the content of the inorganic filler in the base material layer is preferably 0.3 to 28% by mass based on the total amount of the base material layer.

[0011] Also, the average primary particle diameter of the inorganic filler is preferably 10 nm to 5.0 μm.

[0012] Also, the base material layer can contain carbon black as the inorganic filler.

[0013] Also, the content of the conductive material in the surface layer is preferably 10 to 30% by mass based on the total amount of the surface layer.

[0014] Also, the thickness of the base material layer is preferably 70 to 97% of the thickness of the entire resin sheet.

[0015] Another aspect of the present invention provides a container which is a molded body of the above resin sheet.

[0016] Another aspect of the present invention provides a carrier tape which is a molded body of the above resin sheet and is provided with a storage portion capable of storing an article.

[0017] Another aspect of the present invention provides an electronic component package including the above carrier tape, an electronic component stored in the storage portion of the carrier tape, and a cover film adhered to the carrier tape as a lid material.

Advantages of the Invention

[0018] According to the present invention, it is possible to provide a resin sheet having sufficient flexural strength and moldability and being less likely to generate burrs by punching or slitting, and a container, a carrier tape, and an electronic component package obtained by using the same.

Brief Description of the Drawings

[0019]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

[0020] Hereinafter, preferred embodiments of the present invention will be described in detail.

[0021] [Resin Sheet] The resin sheet of this embodiment is a resin sheet for molding, and may be a single-layer sheet composed of one layer, or may be a laminated sheet in which a plurality of layers are laminated.

[0022] Examples of the single-layer sheet include those made of a base material layer containing a thermoplastic resin. The base material layer may further contain an inorganic filler.

[0023] The above single-layer sheet can be used for molding a carrier tape or an electronic component packaging container. In addition, a single-layer sheet containing a conductive material such as carbon black as an inorganic filler can be used for molding an electronic component packaging container, and is particularly suitable for molding packaging containers for ICs that dislike static electricity and various components having ICs.

[0024] Examples of the laminated sheet include a base material layer and a surface layer laminated on at least one surface of the base material layer. The base material layer contains a first thermoplastic resin and an inorganic filler, and the surface layer can contain a second thermoplastic resin and a conductive material. Note that the first thermoplastic resin and the second thermoplastic resin may be the same resin or different resins from each other.

[0025] The above laminated sheet can be used for molding a carrier tape or an electronic component packaging container, and is particularly suitable for molding packaging containers for ICs that dislike static electricity and various components having ICs.

[0026] FIG. 1 is a schematic cross-sectional view showing an embodiment of the resin sheet of the present embodiment. The resin sheet 10 shown in FIG. 1(a) is a single-layer sheet composed of a base material layer 1, and the resin sheet 12 shown in FIG. 1(b) is a laminated sheet including the base material layer 1 and a surface layer 2 laminated on one surface of the base material layer. The resin sheet 14 shown in FIG. 1(c) is a laminated sheet including the base material layer 1, a surface layer 2 laminated on one surface of the base material layer, and a surface layer 3 laminated on the other surface of the base material layer. The surface layer 2 and the surface layer 3 may have the same composition or different compositions.

[0027] <Base material layer> Examples of the thermoplastic resin (the first thermoplastic resin in the laminated sheet) contained in the base material layer include styrene resins, polycarbonate resins, and polyester resins (PET, PBT, etc.). These thermoplastic resins can be used alone or in combination of two or more.

[0028] Examples of the styrene resin include copolymers (AS, ABS, AES, MS, etc.) of monomers such as acrylonitrile, butadiene, ethylene-propylene-diene, butadiene, and methyl methacrylate with styrene.

[0029] Examples of the aromatic vinyl monomer constituting the styrene resin include styrene, vinyltoluene, o-methylstyrene, p-methylstyrene, p-tert-butylstyrene, 1,3-dimethylstyrene, α-methylstyrene, vinylnaphthalene, vinylanthracene, 1,1-diphenylethylene, etc. Among these aromatic vinyl monomers, styrene, vinyltoluene, o-methylstyrene, etc. can be used, and styrene is preferably used.

[0030] Examples of the polycarbonate resin include aromatic polycarbonate resins, aliphatic polycarbonate resins, and aromatic-aliphatic polycarbonates. Aromatic polycarbonate resins are usually classified as engineering plastics, and those obtained by polycondensation of general bisphenol A and phosgene or polycondensation of bisphenol A and a carbonate ester can be used. Aromatic polycarbonate resins are preferred in terms of mechanical strength.

[0031] As the polyester resin, a resin obtained by a polycondensation reaction of a dicarboxylic acid and a diol can be used. Examples of the dicarboxylic acid include phthalic acid, isophthalic acid, terephthalic acid, 2-methylterephthalic acid, 4,4'-diphenyldicarboxylic acid, 5-sulfoisophthalic acid, 2,6-naphthalenedicarboxylic acid, malonic acid, succinic acid, glutaric acid, adipic acid, maleic acid, and maleic anhydride. These can be used alone or in combination of two or more. Examples of the diol include ethylene glycol, diethylene glycol, polyethylene glycol, propylene glycol, polypropylene glycol, and 1,3-propanediol. These can be used alone or in combination of two or more.

[0032] The base material layer preferably contains at least one of a polycarbonate resin, an ABS resin, and an AS resin, and preferably contains at least one of a polycarbonate resin and an ABS resin.

[0033] As long as the resin sheet of this embodiment has the above impact strength and stress integral value, the base material layer may contain one or more thermoplastic resins such as polystyrene resin (GPPS), impact-resistant polystyrene resin (rubber-modified styrene resin, HIPS), and olefin resin.

[0034] From the perspective of achieving both burr suppression and high flexural strength and formability, the thickest layer (for example, the base material layer) of the resin sheet of this embodiment contains at least one of polycarbonate resin, ABS resin, and AS resin, and the total content thereof may be 80% by mass or more, 90% by mass or more, or 95% by mass or more based on the total amount of the layer.

[0035] From the perspective of achieving both burr suppression and high flexural strength and formability, the thickest layer (for example, the base material layer) of the resin sheet of this embodiment contains at least one of polycarbonate resin and ABS resin, and the total content thereof may be 85% by mass or more, or 95% by mass or more based on the total amount of the resin components contained in the thickest layer.

[0036] Examples of the inorganic filler contained in the base material layer include carbon black, graphite, CNT, graphite, calcium carbonate, talc, silica, etc. These inorganic fillers can be used alone or in combination of two or more.

[0037] The inorganic filler may be surface-modified by oxidation treatment, coating, etc. in order to improve its compatibility and dispersibility with the thermoplastic resin.

[0038] The shape of the inorganic filler is not particularly limited, and it may be spherical, needle-like, plate-like, or scaly.

[0039] From the perspective of achieving both burr suppression and high flexural strength and formability at a high level, the average primary particle diameter of the inorganic filler is preferably 10 nm to 5.0 μm, more preferably 25 nm to 100 nm, and even more preferably 25 nm to 55 nm.

[0040] Note that the average primary particle diameter of the inorganic filler is determined by the following method. First, using an ultrasonic disperser, a sample of the inorganic filler is dispersed in chloroform for 10 minutes under the conditions of 150 kHz and 0.4 kW to prepare a dispersed sample. This dispersed sample is sprinkled and fixed on a carbon-reinforced support film, and this is photographed with a transmission electron microscope (manufactured by JEOL, JEM-2100). From an image magnified 50,000 to 200,000 times, the particle diameters (the maximum diameter in the case of non-spherical shapes) of more than 1000 inorganic filler particles are randomly measured using Endter's device, and the average value is taken as the average primary particle diameter.

[0041] The content of the inorganic filler in the base material layer can be 0.3 to 28% by mass based on the total amount of the base material layer. The single-layer sheet and the laminated sheet provided with such a base material layer can have sufficient folding resistance and can be less likely to generate burrs by punching or slitting. From the viewpoint of further suppressing burrs, the content of the inorganic filler is preferably 0.9 to 28% by mass, more preferably 6 to 28% by mass based on the total amount of the base material layer. From the viewpoint of increasing the folding resistance, the content of the inorganic filler is preferably 0.3 to 25% by mass, more preferably 0.3 to 10% by mass based on the total amount of the base material layer.

[0042] From the same viewpoints as above, the content of the inorganic filler in the base material layer may be 0.3 to 28% by mass, may be 0.9 to 28% by mass, may be 6 to 28% by mass, may be 0.3 to 25% by mass, or may be 0.3 to 10% by mass based on the total mass of the thermoplastic resin or the total mass of the first thermoplastic resin and the inorganic filler.

[0043] Various additives such as a plasticizer, a processing aid, and a conductive material can be added to the base material layer.

[0044] The base material layer may contain recycled materials. Examples of recycled materials include, for example, materials obtained by pulverizing both ends of a laminated sheet in which a base material layer and a surface layer are laminated, and end materials during the manufacturing process. The blending ratio of the recycled material in the base material layer can be 2 to 30% by mass, may be 2 to 20% by mass, or may be 2 to 15% by mass based on the total amount of the base material layer.

[0045] When the resin sheet is a laminated sheet, the base material layer may contain the same type of thermoplastic resin as the second thermoplastic resin contained in the surface layer as the first thermoplastic resin, and may contain an inorganic filler made of the same material as the conductive material contained in the surface layer as the inorganic filler. Such a base material layer can be formed by blending the above-mentioned recycled materials. In this case, the blending amount of the recycled material can be appropriately set so that the content of the inorganic filler in the base material layer is within the above-mentioned range.

[0046] When the resin sheet is a single-layer sheet containing a conductive material as an inorganic filler, examples of the conductive material include carbon black, graphite, CNT, graphite, ketjen black, etc. These conductive materials can be used alone or in combination of two or more. In this case, the surface resistivity of the resin sheet (base material layer) is preferably 10 2 ~10 10 Ω / square. When the surface resistivity of the resin sheet is within this range, it becomes easy to prevent the destruction of electronic components due to static electricity or the destruction of electronic components due to the inflow of electricity from the outside.

[0047] The average primary particle size of the conductive material may be 10 nm to 5.0 μm, or may be 20 to 50 nm. The average primary particle size of the conductive material is determined in the same manner as the average primary particle size of the above-mentioned inorganic filler.

[0048] <Surface layer> When the resin sheet is a laminated sheet, as the second thermoplastic resin contained in the surface layer, the same resin as the above-mentioned first thermoplastic resin can be used.

[0049] The surface layer preferably contains one or more of styrene resin, polycarbonate resin, and polyester resin.

[0050] Examples of the conductive material contained in the surface layer include carbon black, graphite, CNT, graphite, ketjen black, etc. These conductive materials can be used alone or in combination of two or more.

[0051] The conductive material may be in the form of particles. In that case, the average primary particle size of the conductive material may be 10 nm to 5.0 μm, or may be 20 to 50 nm. The average primary particle size of the conductive material is determined in the same manner as the average primary particle size of the inorganic filler described above.

[0052] The content of the conductive material in the surface layer can be 10 to 30% by mass, or may be 20 to 30% by mass based on the total amount of the surface layer.

[0053] The surface layer has a surface resistivity of 10 2 ~10 10 Ω / square, which is preferable. When the surface resistivity of the surface layer is within this range, it becomes easy to prevent the destruction of electronic components due to static electricity or the destruction of electronic components due to the inflow of electricity from the outside.

[0054] Various additives such as lubricants, plasticizers, and processing aids can be added to the surface layer.

[0055] The thickness of the resin sheet can be appropriately set according to the application, and can be 100 μm to 1.0 mm. When used for a packaging container or carrier tape of a miniaturized electronic component, for example, it can be 100 to 300 μm.

[0056] When the resin sheet is a single-layer sheet, the thickness of the base material layer (i.e., the thickness of the resin sheet) may be 100 to 300 μm.

[0057] When the resin sheet is a laminated sheet, the thickness of the base material layer may be 100 to 300 μm. The thickness of the base material layer (T1 in FIG. 2) can be 70 to 97% with respect to the thickness of the entire resin sheet (T 10 )). When the surface layers are provided on both sides of the base material layer, the thickness of the base material layer is preferably 70 to 94% with respect to the thickness of the entire resin sheet. When the surface layer is provided on only one side of the base material layer as in the resin sheet 12 shown in FIG. 1(b), the thickness of the base material layer is preferably 85 to 97% with respect to the thickness of the entire resin sheet.

[0058] The thickness of the surface layer may be 10 to 100 μm. When the surface layers are provided on both sides of the base material layer as in the resin sheet 14 shown in FIG. 1(c), the thickness of each surface layer (T 2、 T3) may be the same or different.

[0059] The resin sheet of this embodiment has an impact strength of 1.0 J or more in the DuPont impact test, and in the stress-strain curve obtained by the tensile test, the value obtained by integrating up to the strain when breaking from the origin (hereinafter, also referred to as the "stress-strain curve integral value") is 80 N / m 2 or less. By having such impact strength and stress-strain curve integral value, the resin sheet of this embodiment can have sufficient folding resistance and formability, and is less likely to generate burrs by punching or slitting.

[0060] The impact strength in the DuPont impact test refers to the 50% impact fracture energy value (unit: J) of JIS-K-7211 measured at an environmental temperature of 23°C using a 1 / 2-inch hemispherical striker on a DuPont impact tester manufactured by Toyo Seiki Seisakusho, with a load of 100 g to 1 kg and a height from the striker to the test sample of 100 to 1000 mm. Note that since the 50% impact fracture energy value is calculated from the load and height at the 50% impact fracture of the resin sheet, the load and height during measurement are appropriately adjusted within the above range depending on the resin sheet.

[0061] The stress-strain curve integral value refers to the value obtained by integrating from the origin to the strain (fracture strain) when fractured in the stress-strain curve obtained from the following tensile test. (Tensile test) In accordance with JIS-K-7127 (1999), using a Strograph VE-1D manufactured by Toyo Seiki Seisakusho, measure under the condition of a tensile speed of 5 mm / min with test piece type 5 sampled with the flow direction of the sheet as the length direction.

[0062] By performing a tensile test on the resin sheet, for example, a stress-strain curve as shown in FIG. 3 can be obtained. In FIG. 3, A indicates the origin (zero stress), B indicates the yield point, C indicates the fracture point, and D indicates the fracture strain. The area S in FIG. 3 indicates the stress-strain curve integral value.

[0063] From the perspective of achieving both suppression of burrs and fold resistance strength and formability, the resin sheet of this embodiment may have an impact strength of 1.0 J or more, 1.5 J or more, or 2.0 J or more in the DuPont impact test.

[0064] From the perspective of achieving both suppression of burrs and fold resistance strength and formability, the stress-strain curve integral value of the resin sheet of the embodiment is 0 to 80 N / m 2 and may be 10 to 70 N / m 2 and may be 30 to 60 N / m 2 and may be acceptable.

[0065] The resin sheet of this embodiment may be an unprocessed original sheet or may be one subjected to predetermined processing such as a slit product.

[0066] The resin sheet of this embodiment can be formed into a shape according to the application by a known thermoforming method such as a vacuum forming method, a pressure air forming method, or a press forming method.

[0067] The resin sheet of this embodiment can be used as a material for packaging containers for active components such as ICs, components equipped with ICs, passive components such as capacitors and connectors, and mechanical components, and is preferably used for vacuum forming trays, magazines, carrier tapes provided with embosses (embossed carrier tapes), etc.

[0068] According to the resin sheet of this embodiment, burrs are less likely to occur during punching or slitting. Therefore, in the slit product, the burrs generated during slitting can be made extremely small, and in the embossed carrier tape, the burrs generated on the cross-section when punching feed holes, etc. can be made extremely small. Further, according to the resin sheet of this embodiment, since it has sufficient folding strength and formability, the occurrence of cracks in the molded body can be suppressed.

[0069] [Manufacturing method of resin sheet] The resin sheet according to this embodiment can be manufactured by a general method. For example, when the resin sheet is a single-layer sheet, as a composition for forming a base material layer, pellets obtained by kneading and pelletizing the raw materials constituting the base material layer using a known method such as an extruder are prepared, and using these pellets, it can be manufactured by forming a single-layer sheet by a known method such as an extruder. Further, when the resin sheet is a laminated sheet, as a composition for forming a base material layer, pellets obtained by kneading and pelletizing the raw materials constituting the base material layer using a known method such as an extruder, and as a composition for forming a surface layer, pellets obtained by kneading and pelletizing the raw materials constituting the surface layer using a known method such as an extruder are prepared, and using these pellets, it can be manufactured by forming a laminated sheet by a known method such as an extruder. The extruder temperature can be set, for example, at 200 to 280°C.

[0070] The base material layer and the surface layer may be formed into sheets or films separately using the composition for forming the base material layer and the composition for forming the surface layer in separate extruders, and then laminated step by step by methods such as the thermal lamination method, the dry lamination method, and the extrusion lamination method. Alternatively, a surface layer made of the composition for forming the surface layer may be laminated on one or both sides of the base material layer sheet previously formed from the composition for forming the base material layer by a method such as extrusion coating.

[0071] In addition, the laminated sheet can be manufactured by a multilayer coextrusion method such as extrusion molding using a multilayer T-die having a multi-manifold or T-die method extrusion molding using a feed block, in which the raw materials (for example, the above pellets) constituting the base material layer and the surface layer are respectively supplied to individual extruders. This method is preferable in that a laminated sheet can be obtained in one step.

[0072] When a recycled material is blended into the base material layer, the raw material of the base material layer and the recycled material can be supplied to the extruder for forming the base material layer. In this case, the blending amount of the raw material supplied to the extruder is appropriately adjusted according to the type and blending amount of the recycled material so as to obtain a predetermined composition of the base material layer.

[0073] [Container, Carrier Tape, and Electronic Component Package] The container of the present embodiment is a molded body of the resin sheet according to the present embodiment described above. The container can be obtained by molding the resin sheet according to the present embodiment into a shape according to the application. As the molding method, known thermoforming methods such as the vacuum forming method, the pressure air forming method, and the press forming method can be used.

[0074] The molding temperature may be 100 to 500°C.

[0075] The carrier tape of this embodiment is a molded body of the resin sheet according to the above-described embodiment, and is provided with a storage portion capable of storing an article. FIG. 4 is a perspective view showing an embodiment of the carrier tape. The carrier tape 100 shown in FIG. 4 is an embossed carrier tape made of a molded body 16 of a resin sheet according to this embodiment in which a storage portion 20 is provided by embossing. The molded body 16 is provided with feed holes 30 that can be used for conveyance in the encapsulation process of various electronic components such as ICs. A hole 22 for electronic component inspection may be provided at the bottom of the storage portion 20.

[0076] The feed holes 30 can be provided, for example, by punching. Since the resin sheet according to this embodiment can make the burrs generated on the punched cross-section extremely small, even when the diameter of the feed holes 30 is small, the influence of foreign matter mixing into the components due to burr detachment and the accompanying short circuit during mounting can be made sufficiently small. Therefore, the carrier tape of this embodiment is suitable as a packaging container for miniaturized electronic components.

[0077] In the carrier tape of this embodiment, the punching burr ratio in the feed holes having the above shape can be set to 7.0% or less, preferably less than 5%. Here, the punching burr ratio means the ratio of the area of the burrs to a predetermined punching area where no burrs occur as viewed from the punching direction. For example, when the punching shape is a perfect circle, the punching area refers to the area of the perfect circle without burrs.

[0078] The carrier tape of this embodiment can be wound into a reel shape.

[0079] The carrier tape of this embodiment is suitable as a packaging container for electronic components. Examples of the electronic components include ICs, LEDs (light-emitting diodes), resistors, liquid crystals, capacitors, transistors, piezoelectric element resistors, filters, crystal oscillators, crystal resonators, diodes, connectors, switches, potentiometers, relays, inductors, etc. The electronic components may be intermediate products using the above components or final products.

[0080] The electronic component package of this embodiment includes the carrier tape of the above-described embodiment, an electronic component housed in the housing portion of the carrier tape, and a cover film adhered to the carrier tape as a lid material. FIG. 5 is a partially cutaway perspective view showing an embodiment of the electronic component package. The electronic component package 200 shown in FIG. 5 includes an embossed carrier tape made of a molded body 16 of a resin sheet according to this embodiment provided with a housing portion 20 and a feed hole 30, an electronic component 40 housed in the housing portion 20, and a cover film 50 adhered to the embossed carrier tape.

[0081] Examples of the cover film include those disclosed in Japanese Patent No. 4630046 and Japanese Patent No. 5894578.

[0082] The cover film can be adhered to the upper surface of the embossed carrier tape containing the electronic component by heat sealing.

[0083] The electronic component package of this embodiment can be used for storing and transporting electronic components as a carrier tape body wound in a reel shape.

Example

[0084] Hereinafter, the present invention will be described more specifically with reference to Examples and Comparative Examples, but the present invention is not limited to the following Examples.

[0085] [Production of Resin Sheet] (Examples 1 to 18 and Comparative Examples 1 to 6: Single-layer Sheet) The raw materials shown in Tables 1 to 3 were each weighed so as to have the composition ratios (mass %) shown in the same tables, uniformly mixed by a high-speed mixer, kneaded using a φ45 mm vented twin-screw extruder, pelletized by the strand cut method, and a resin composition for forming a base material layer was obtained. Using this composition, a single-layer sheet made of a base material layer was produced by a φ30 mm extruder (L / D = 28). The thickness of the single-layer sheet was 200 μm.

[0086] (Examples 19 to 30 and Comparative Examples 7 to 8: Laminated Sheet) The raw materials shown in Tables 4 and 5 were each weighed so as to have the composition ratios (mass %) shown in the same tables, uniformly mixed by a high-speed mixer, kneaded using a φ45 mm vented twin-screw extruder, pelletized by the strand cut method, and a resin composition for forming a surface layer and a resin composition for forming a base layer were obtained, respectively. Using these compositions, a laminated sheet having a laminated structure of surface layer / base layer / surface layer was produced by the feed block method using a φ65 mm extruder (L / D = 28), a φ40 mm extruder (L / D = 26), and a 500 mm wide T-die. The thickness of the laminated sheet was 200 μm, and the ratio of the thicknesses of the surface layer / base layer / surface layer was 1:18:1.

[0087] The details of the raw materials shown in Tables 1 to 5 are as follows. PC: Polycarbonate resin (manufactured by Teijin Chemicals, product name "Panlite L-1225L") ABS: Acrylonitrile-butadiene-styrene copolymer (manufactured by Denka, product name "SE-10") AS: Acrylonitrile-styrene copolymer (manufactured by Denka, product name "GR-ATR") GPPS: Polystyrene resin (manufactured by Toyo Styrene, product name "G200C") HIPS: High impact polystyrene resin (manufactured by Toyo Styrene, product name "E640N") HDPE: High density polyethylene (manufactured by Japan Polyethylene, product name "HF313") LLDPE: Linear low density polyethylene (manufactured by Ube Maruzen Polyethylene, product name "Novaduran 5010R8M") PBT: Polybutylene terephthalate resin (manufactured by Mitsubishi Engineering Plastics, product name "Novaduran 5010R8M") Carbon black: Acetylene black (manufactured by Denka, product name "Denka Black Granular", average primary particle diameter 35 nm)

[0088] The average primary particle diameter of the inorganic filler was determined by the following method. First, using an ultrasonic disperser, a sample of the inorganic filler was dispersed in chloroform for 10 minutes under the conditions of 150 kHz and 0.4 kW to prepare a dispersed sample. This dispersed sample was sprinkled onto a carbon-reinforced support film and fixed, and then photographed with a transmission electron microscope (manufactured by JEOL, JEM-2100). From the images magnified 50,000 to 200,000 times, the particle diameters (the maximum diameter in the case of non-spherical shapes) of more than 1000 inorganic filler particles were randomly measured using Endter's apparatus, and the average value was taken as the average primary particle diameter.

[0089] [Properties of Resin Sheet] Samples were taken in the extrusion direction of the resin sheet, and the DuPont impact strength and the integral value of the stress-strain curve were determined by the methods shown below. These results are summarized in Tables 1 to 5.

[0090] (DuPont Impact Strength) The impact strength in the DuPont impact test was measured at an environmental temperature of 23°C using a DuPont type impact tester manufactured by Toyo Seiki Seisakusho Co., Ltd. with a 1 / 2-inch hemispherical striker, in the range of load: 100 g to 1 kg, height from the striker to the test sample: 100 to 1000 mm, and the 50% impact fracture energy value (unit: J) of JIS-K-7211 was measured. Since the 50% impact fracture energy value is calculated from the load and height at 50% impact fracture of the resin sheet, the load and height during measurement are appropriately adjusted within the above range depending on the resin sheet. In Examples 1 to 18, the 50% impact fracture energy value could be calculated in the range of set load 300 to 500 g, and in Comparative Examples 1 to 6, in the range of set load 100 to 300 g.

[0091] (Integral Value of Stress-Strain Curve) The stress-strain curve was obtained in the following tensile test. The value obtained by integrating from the origin to the strain at break (break strain) in the obtained stress-strain curve was calculated. (Tensile Test) In accordance with JIS-K-7127 (1999), using a Strograph VE-1D manufactured by Toyo Seiki Seisakusho Co., Ltd., the test piece type 5 sampled with the flow direction of the sheet as the length direction was measured under the condition of a tensile speed of 5 mm / min.

[0092] [Evaluation of Resin Sheet] Sampling was carried out in the extrusion direction of the resin sheet, and evaluation was performed by the method shown below. These results are summarized in Tables 1 to 5.

[0093] (1) Punching Burr Ratio Punching holes were provided in the sheet sample left standing for 24 hours in an atmosphere of 23°C and 50% relative humidity using a vacuum rotary molding machine (CT8 / 24) manufactured by Muehlbauer in an atmosphere of 23°C and 50% relative humidity. The punching was performed at a speed of 240 m / h using a punching device equipped with a cylindrical punching pin with a tip diameter of 1.5 mm for the sprocket hole and a die hole with a diameter of 1.58 mm.

[0094] The sheet punching holes formed above were photographed using a microscope measuring instrument (manufactured by Mitutoyo, product name "MF-A1720H (Image Unit 6D)") in a light source environment with 0% epi-illumination, 40% transmission, and 0% ring. The photographed image was processed using Adobe Photoshop Elements 14 (Adobe, product name) with a threshold value of 128 specified by a two-tone filter so that only the sprocket hole part became white. The number of pixels corresponding to the size of a 1.5 mm diameter hole was defined as the "number of white pixels of the sprocket hole without burrs". The number of white pixels was recorded, and the punching burr ratio was determined from the following formula. Punching Burr Ratio (%) = (1 - (recorded number of white pixels) / (number of white pixels of the sprocket hole without burrs)) × 100

[0095] Also shown together are the results of determination based on the following criteria using the punching burr ratio obtained above. [Judgment Criteria] A: Burr ratio is less than 5% B: Burr ratio is 5% or more and 7% or less C: Burr ratio exceeds 7%

[0096] (2) Flexural Strength From the sheet sample, a test piece with a length of 150 mm, a width of 15 mm, and a thickness of 0.25 mm in the sheet extrusion direction was prepared in accordance with JIS-P-8115 (2001). After leaving this test piece in an atmosphere of 23°C and 50% relative humidity for 24 hours, the MIT folding strength was measured using a MIT folding fatigue tester manufactured by Toyo Seiki Seisaku-sho, Ltd. in an atmosphere of 23°C and 50% relative humidity. The measurement was carried out under the conditions of a folding angle of 135 degrees, a folding speed of 175 times per minute, and a measurement load of 250 g. When this measurement was repeated, the number of folding times when the test piece broke was evaluated as the folding strength.

[0097] Also shown together are the results of determination based on the following criteria based on the number of folding times obtained above. <Determination Criteria> A: The number of folding times is 30 or more B: The number of folding times is 10 or more and less than 30 C: The number of folding times is less than 10

[0098] (3) Formability Under the condition of a heater temperature of 210°C, a 24-mm-wide carrier tape with pockets sized 15 mm in the flow direction, 11 mm in the width direction, and 5 mm in the depth direction was created by a pressure-air forming machine. The bottom surface and two side surfaces (the first side surface and the second side surface) of the pockets of this carrier tape were each cut out, and formability evaluation by thickness measurement was performed using a shape measurement laser microscope manufactured by Keyence Corporation.

[0099] Taking the average value of the thickness of the first side surface and the thickness of the second side surface as the side surface thickness, the thickness difference between the bottom surface and the side surface was obtained, the ratio R (%) of the thickness difference was calculated according to the following formula, and the formability was evaluated according to the following criteria. R = (Δt / tA) × 100 [In the formula, Δt represents the thickness difference between the bottom surface and the side surface, and tA represents the average value of the thicknesses of the bottom surface, the first side surface, and the second side surface.] <Determination Criteria> A: R is less than 10% B: R is 10% or more and 20% or less C: R exceeds 20%

[0100] [Table 1]

[0101] [Table 2]

[0102] [Table 3]

[0103] [Table 4]

[0104] [Table 5]

[0105] As shown in Tables 1, 2, 4, and 5, the resin sheets of Examples 1 to 30, in which the Dupont impact strength is 1.0 J or more and the stress-strain curve integral value is 80 N / m 2 below, were confirmed to have a judgment of B or A in all of the punching burr ratio, folding strength, and moldability.

[0106] On the other hand, the resin sheets of Comparative Examples 1 to 8, in which the Dupont impact strength is less than 1.0 J or the stress-strain curve integral value exceeds 80 N / m 2 were judged to be C in one or more of the punching burr ratio, folding strength, and moldability.

Description of Signs

[0107] 1... Substrate layer, 2, 3... Surface layer, 10, 12, 14... Resin sheet, 16... Molded body, 20... Accommodating portion, 22... Hole, 30... Feed hole, 40... Electronic component, 50... Cover film, 100... Carrier tape, 200... Electronic component package.

Claims

1. A resin sheet for molding, comprising: a base material layer and a surface layer laminated on at least one surface of the base material layer, wherein the base material layer contains at least one of a polycarbonate resin, an ABS resin, and an AS resin (however, excluding a base material layer containing 21 to 87% by mass of a polycarbonate resin, 7 to 68% by mass of a polyalkylene terephthalate resin, and 3 to 30% by mass of carbon black, and a base material layer consisting only of an ABS resin), the surface layer contains a polycarbonate resin, a polyester resin, and a conductive material, and the impact strength in the DuPont impact test is 1.0 J or more. In the stress-strain curve obtained from the tensile test, the resin sheet is such that the integrated value from the origin to the strain at break is 80 N / m ２ as follows.

2. The resin sheet according to claim 1, wherein the base material layer further contains an inorganic filler.

3. The resin sheet according to claim 2, wherein the content of the inorganic filler in the base material layer is 0.3 to 28% by mass based on the total amount of the base material layer.

4. The resin sheet according to claim 2 or 3, wherein the average primary particle diameter of the inorganic filler is 10 nm to 5.0 μm.

5. The resin sheet according to any one of claims 2 to 4, wherein the base material layer contains carbon black as the inorganic filler.

6. The resin sheet according to any one of claims 1 to 5, wherein the content of the conductive material in the surface layer is 10 to 30% by mass based on the total amount of the surface layer.

7. The resin sheet according to any one of claims 1 to 6, wherein the thickness of the base material layer is 70 to 97% of the thickness of the entire resin sheet.

8. A resin sheet for molding, comprising: the resin sheet is a single-layer sheet with a thickness of 100 to 300 μm, the resin sheet is a single-layer sheet containing a polycarbonate resin, an ABS resin, and an inorganic filler, a single-layer sheet containing a polycarbonate resin, an ABS resin, an AS resin, and an inorganic filler, a single-layer sheet containing an ABS resin and an AS resin, or a single-layer sheet containing an ABS resin, an AS resin, and an inorganic filler, and the impact strength in the DuPont impact test is 1.0 J or more. In the stress-strain curve obtained from the tensile test, the resin sheet is one where the integrated value from the origin to the strain at break is 80 N / m. ２ The resin sheet is as follows.

9. A container which is a molded body of the resin sheet according to any one of claims 1 to 8.

10. A carrier tape which is a molded body of the resin sheet according to any one of claims 1 to 8 and is provided with a storage portion capable of storing an article.

11. An electronic component package comprising: the carrier tape according to claim 10; an electronic component housed in the housing portion of the carrier tape; and a cover film adhered to the carrier tape as a lid material.

Images