Aggregate sheet, and method for manufacturing aggregate sheet

Abstract

To provide an aggregate sheet capable of further reinforcing a frame, and to provide a method of manufacturing the same.SOLUTION: An aggregate sheet 1 comprises a wiring circuit board 2, a frame 3, and a reinforcement part 4. The wiring circuit board 2 has a support layer 11, a base insulating layer 12, and a conductor pattern 13. The frame 3 supports the wiring circuit board 2. The reinforcement part 4 is arranged on the frame 3 to reinforce the frame 3. The reinforcement part 4 has a first layer 41 formed of a metal and a second layer 42 formed of a metal.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to an aggregate sheet and a method for manufacturing the aggregate sheet.

Background Art

[0002] Conventionally, an aggregate sheet having a plurality of suspension substrates with circuits, a frame supporting the plurality of suspension substrates with circuits, and a reinforcing portion (reinforcing insulating layer and reinforcing conductor layer) disposed on the frame has been known (see, for example, Patent Document 1 below).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the aggregate sheet as described in Patent Document 1, there is a desire to further reinforce the frame.

[0005] The present invention provides an aggregate sheet capable of further reinforcing a frame and a method for manufacturing the aggregate sheet.

Means for Solving the Problems

[0006] The present invention [1] includes a wiring circuit board having a support layer, an insulating layer disposed on one surface of the support layer in the thickness direction, and a conductor pattern disposed on one surface of the insulating layer in the thickness direction, a frame supporting the wiring circuit board, and a reinforcing portion disposed on the frame in the thickness direction and reinforcing the frame. The reinforcing portion has a first layer made of metal and a second layer made of metal disposed on the first layer in the thickness direction.

[0007] According to such a configuration, the reinforcing portion has a first layer made of metal and a second layer made of metal.

[0008] Therefore, the thickness of the metal layer in the reinforcing portion can be increased.

[0009] As a result, further reinforcement of the frame can be achieved.

[0010] The present invention [2] includes the aggregate sheet of [1] above, wherein the reinforcing portion is disposed on one surface of the frame in the thickness direction.

[0011] The present invention [3] includes the aggregate sheet described in [2] above, further comprising a second reinforcing portion disposed on the other surface of the frame in the thickness direction.

[0012] According to such a configuration, reinforcing portions can be provided on both surfaces of the frame.

[0013] As a result, the frame can be reinforced more effectively.

[0014] The present invention [4] includes the aggregate sheet of any one of [1] to [3] above, wherein at least a part of the conductor pattern is thinner than the reinforcing portion in the thickness direction.

[0015] According to such a configuration, while improving the degree of freedom in the design of the conductor pattern, a reinforcing portion can be formed.

[0016] The present invention [5] is the aggregate sheet of any one of [1] to [3] above, wherein the conductor pattern has a terminal and a wiring connected to the terminal, at least a part of the wiring has a first conductor layer made of metal and a second conductor layer made of metal and at least a part of which is in contact with the first conductor layer, the first layer of the reinforcing portion is made of the same metal as the first conductor layer, and the second layer of the reinforcing portion is made of the same metal as the second conductor layer.

[0017] According to such a configuration, the reinforcing portion can be formed by using the step of forming the first conductor layer and the step of forming the second conductor layer.

[0018] Therefore, it is possible to improve the degree of freedom in the design of the conductor pattern, and to form the reinforcing portion while suppressing an increase in man-hours.

[0019] In the present invention [6], the conductor pattern includes a first wiring made of metal, a second wiring made of metal and arranged apart from the first wiring, and a second insulating layer arranged between the first wiring and the second wiring. The first layer of the reinforcing portion is made of the same metal as the first wiring, and the second layer of the reinforcing portion is made of the same metal as the second wiring. The aggregate sheet according to any one of the above [1] to [3].

[0020] According to such a configuration, the reinforcing portion can be formed by using the step of forming the first wiring and the step of forming the second wiring.

[0021] Therefore, it is possible to improve the degree of freedom in the design of the conductor pattern, and to form the reinforcing portion while suppressing an increase in man-hours.

[0022] The present invention [7] includes the aggregate sheet according to any one of the above [1] to [6], wherein the frame is made of a metal foil having a thickness of 50 μm or less.

[0023] According to such a configuration, when the frame is made of a thin metal foil, further reinforcement of the frame can be achieved.

[0024] The present invention [8] includes the aggregate sheet according to the above [7], wherein when the thickness of the frame is 100%, the thickness of the reinforcing portion is 50% or more and 300% or less.

[0025] The present invention [9] is a method for manufacturing an aggregate sheet of any one of the above [1] to [8], and includes a pattern step of forming the insulating layer, the conductor pattern, and the reinforcing portion on the metal foil drawn from a first roll which is a roll of metal foil to manufacture a second roll having a plurality of the aggregate sheets, and a cutting step of cutting each of the plurality of the aggregate sheets from the second roll.

[0026] According to such a configuration, the reinforcing portion can be formed while the metal foil is stretched between the first roll and the second roll.

[0027] Therefore, when handling the cut aggregate sheet, it is possible to suppress the formation of wrinkles in the aggregate sheet by the reinforcing portion.

[0028] As a result, it is possible to improve the handleability of the cut aggregate sheet.

[0029] The present invention

[10] further includes a plating step of plating the terminals of the conductor pattern of the cut aggregate sheet, and includes the method for manufacturing the aggregate sheet of the above [9].

[0030] According to such a configuration, it is possible to suppress the formation of wrinkles in the aggregate sheet during the plating step.

Effect of the Invention

[0031] According to the aggregate sheet and the method for manufacturing the aggregate sheet of the present invention, further reinforcement of the frame can be achieved.

Brief Description of the Drawings

[0032]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

BEST MODE FOR CARRYING OUT THE INVENTION

[0033] 1. Assembly Sheet As shown in FIG. 1, the assembly sheet 1 has a sheet shape extending in a first direction and a second direction. The second direction is orthogonal to the first direction. The assembly sheet 1 includes a plurality of wiring circuit boards 2, a frame 3, and a reinforcing portion 4.

[0034] (1) Wiring circuit board A plurality of wiring circuit boards 2 are arranged side by side at intervals in the first direction and also arranged side by side at intervals in the second direction. Each of the plurality of wiring circuit boards 2 has the same structure. Therefore, one of the plurality of wiring circuit boards 2 will be described, and the description of the other wiring circuit boards 2 will be omitted.

[0035] The wiring circuit board 2 extends in the first direction and the second direction. In this embodiment, the wiring circuit board 2 has a substantially rectangular shape. Note that the shape of the wiring circuit board 2 is not limited.

[0036] As shown in FIG. 2A, the wiring circuit board 2 has a support layer 11, a base insulating layer 12 as an example of an insulating layer, a conductor pattern 13, and a cover insulating layer 14.

[0037] (1-1) Support layer The support layer 11 supports the base insulating layer 12, the conductor pattern 13, and the cover insulating layer 14. In this embodiment, the support layer 11 is made of a metal foil. Examples of the metal include a stainless alloy and a copper alloy.

[0038] The thickness of the metal foil, that is, the thickness of the support layer 11, is, for example, 50 μm or less, preferably 30 μm or less, and, for example, 10 μm or more, preferably 15 μm or more.

[0039] (1-2) Base insulating layer The base insulating layer 12 is disposed on the support layer 11 in the thickness direction of the aggregate sheet 1. The thickness direction is orthogonal to the first direction and the second direction. Specifically, the base insulating layer 12 is disposed on one surface S1 of the support layer 11 in the thickness direction. The base insulating layer 12 is disposed between the support layer 11 and the conductor pattern 13 in the thickness direction. The base insulating layer 12 insulates the support layer 11 and the conductor pattern 13. The base insulating layer 12 is made of a resin. Examples of the resin include polyimide.

[0040] The thickness of the base insulating layer 12 is, for example, 30 μm or less, preferably 15 μm or less, and, for example, 1 μm or more, preferably 3 μm or more.

[0041] (1-3) Conductor pattern The conductor pattern 13 is disposed on the base insulating layer 12 in the thickness direction. Specifically, the conductor pattern 13 is disposed on one surface S11 of the base insulating layer 12 in the thickness direction. The conductor pattern 13 is disposed on the opposite side of the support layer 11 with respect to the base insulating layer 12 in the thickness direction. The conductor pattern 13 is made of metal. Examples of the metal include copper. The shape of the conductor pattern 13 is not limited.

[0042] In the present embodiment, as shown in FIG. 1, the conductor pattern 13 has a plurality of terminals 131A, 131B, 131C, 131D, a plurality of terminals 132A, 132B, 132C, 132D, and a plurality of wirings 133A, 133B, 133C, 133D. Note that the number of terminals and the number of wirings are not limited.

[0043] (1-3-1) Terminal The terminals 131A, 131B, 131C, 131D are disposed at one end of the wiring circuit board 2 in the second direction. In the present embodiment, the terminals 131A, 131B, 131C, 131D are arranged side by side in the first direction with a space therebetween. Each of the terminals 131A, 131B, 131C, 131D has a square land shape.

[0044] As shown in FIG. 2A, the terminal 131A has a conductor layer 1311 and a plating layer 1312.

[0045] The conductor layer 1311 is the main body portion of the terminal 131A. The conductor layer 1311 is disposed on one surface S11 of the base insulating layer 12 in the thickness direction.

[0046] The thickness of the conductor layer 1311 is, for example, 3 μm or more, preferably 5 μm or more, and, for example, 50 μm or less, preferably 30 μm or less.

[0047] The plating layer 1312 covers the surface of the conductor layer 1311. The plating layer 1312 suppresses the corrosion of the conductor layer 1311. The plating layer 1312 is made of metal. Examples of the metal include nickel, gold, and tin. The plating layer 1312 may be composed of one layer or a plurality of layers. When the plating layer 1312 is composed of a plurality of layers, each of the plurality of layers may be made of a different metal from each other.

[0048] The thickness of the plating layer 1312 is, for example, 0.1 μm or more, preferably 0.2 μm or more, and, for example, 5 μm or less, preferably 4 μm or less.

[0049] The thickness T1 of the terminal 131A is the sum of the thickness of the conductor layer 1311 and the thickness of the plating layer 1312. The thickness T1 of the terminal 131A is thinner than the thickness T12 of the reinforcing portion 4. That is, a part of the conductor pattern 13 is thinner than the reinforcing portion 4 in the thickness direction. The thickness T12 of the reinforcing portion 4 will be described later.

[0050] The thickness T1 of the terminal 131A is, for example, 6 μm or more, preferably 8 μm or more, and, for example, 100 μm or less, preferably 60 μm or less.

[0051] The terminals 131B, 131C, and 131D have the same structure as the terminal 131A. Therefore, the description of the terminals 131B, 131C, and 131D is omitted.

[0052] As shown in FIG. 1, the terminals 132A, 132B, 132C, and 132D are arranged at the other end of the wiring circuit board 2 in the second direction. In the present embodiment, the terminals 132A, 132B, 132C, and 132D are arranged side by side in the first direction with a space therebetween. Each of the terminals 132A, 132B, 132C, and 132D has a corner land shape.

[0053] The terminals 132A, 132B, 132C, and 132D have the same structure as the terminal 131A. Therefore, the description of the terminals 132A, 132B, 132C, and 132D is omitted.

[0054] (1-3-2) Wiring One end of wiring 133A is connected to terminal 131A. The other end of wiring 133A is connected to terminal 132A. Wiring 133A electrically connects terminal 131A and terminal 132A.

[0055] One end of wiring 133B is connected to terminal 131B. The other end of wiring 133B is connected to terminal 132B. Wiring 133B electrically connects terminal 131B and terminal 132B.

[0056] One end of wiring 133C is connected to terminal 131C. The other end of wiring 133C is connected to terminal 132C. Wiring 133C electrically connects terminal 131C and terminal 132C.

[0057] One end of wiring 133D is connected to terminal 131D. The other end of wiring 133D is connected to terminal 132D. Wiring 133D electrically connects terminal 131D and terminal 132D.

[0058] In the present embodiment, as shown in FIG. 2B, wiring 133A has a first conductor layer 1331 and a second conductor layer 1332.

[0059] The first conductor layer 1331 is disposed on one surface S11 of the base insulating layer 12 in the thickness direction. In the present embodiment, the first conductor layer 1331 is made of the same metal as the conductor layer 1311 of the terminal 131A. The thickness of the first conductor layer 1331 is, for example, 3 μm or more, preferably 5 μm or more, and, for example, 50 μm or less, preferably 30 μm or less.

[0060] The second conductor layer 1332 is disposed on the first conductor layer 1331 in the thickness direction. At least a part of the second conductor layer 1332 is in contact with the first conductor layer 1331. In other words, the second conductor layer 1332 is electrically connected to the first conductor layer 1331. The thickness of the second conductor layer 1332 is, for example, 3 μm or more, preferably 5 μm or more, and, for example, 50 μm or less, preferably 30 μm or less.

[0061] In the following description, each of the plurality of terminals 131A, 131B, 131C, 131D is referred to as a terminal 131, each of the plurality of terminals 132A, 132B, 132C, 132D is referred to as a terminal 132, and each of the plurality of wirings 133A, 133B, 133C, 133D is referred to as a wiring 133.

[0062] (1 - 4) Cover insulating layer As shown in FIG. 1, the cover insulating layer 14 covers all the wirings 133. The cover insulating layer 14 is disposed on the base insulating layer 12 in the thickness direction. Note that the cover insulating layer 14 does not cover the terminals 131 and the terminals 132. The cover insulating layer 14 is made of resin. Examples of the resin include polyimide.

[0063] The thickness of the cover insulating layer 14 is, for example, 30 μm or less, preferably 15 μm or less, and for example, 1 μm or more, preferably 3 μm or more.

[0064] (2) Frame The frame 3 is disposed on the outer periphery of the aggregate sheet 1. The frame 3 surrounds the plurality of wiring circuit boards 2. In the present embodiment, the frame 3 has a frame shape. Specifically, the frame 3 includes a first frame 3A, a second frame 3B, a third frame 3C, and a fourth frame 3D.

[0065] The first frame 3A is disposed at one end of the aggregate sheet 1 in the first direction. The first frame 3A extends in the second direction.

[0066] The second frame 3B is disposed at the other end of the aggregate sheet 1 in the first direction. The second frame 3B is disposed away from the first frame 3A in the first direction. The plurality of wiring circuit boards 2 are disposed between the first frame 3A and the second frame 3B in the first direction. The second frame 3B extends in the second direction.

[0067] The third frame 3C is disposed at one end of the aggregate sheet 1 in the second direction. The third frame 3C extends in the first direction. One end of the third frame 3C in the first direction is connected to one end of the first frame 3A in the second direction. The other end of the third frame 3C in the first direction is connected to one end of the second frame 3B in the second direction.

[0068] The fourth frame 3D is disposed at the other end of the aggregate sheet 1 in the second direction. The fourth frame 3D is disposed away from the third frame 3C in the second direction. The plurality of wiring circuit boards 2 are disposed between the third frame 3C and the fourth frame 3D in the second direction. The fourth frame 3D extends in the first direction. One end of the fourth frame 3D in the first direction is connected to the other end of the first frame 3A in the second direction. The other end of the fourth frame 3D in the first direction is connected to the other end of the second frame 3B in the second direction.

[0069] As shown in FIG. 2A, the frame 3 is made of a metal foil. The frame 3 is made of the same metal foil as the support layer 11 of the wiring circuit board 2. Examples of the metal include a stainless alloy and a copper alloy. The thickness of the metal foil, that is, the thickness T11 of the frame 3 is, for example, 50 μm or less, preferably 30 μm or less, and for example, 10 μm or more, preferably 15 μm or more.

[0070] Here, since the thickness of the metal foil is equal to or less than the above upper limit value, the rigidity of the frame 3 is low. Therefore, when handling the aggregate sheet 1, there is a possibility that wrinkles may occur on the aggregate sheet 1. Therefore, it is difficult to handle the aggregate sheet 1.

[0071] Examples of the scene where it is difficult to handle the aggregate sheet 1 include a scene of carrying the aggregate sheet 1 and a plating process in the manufacturing method of the aggregate sheet 1 described later.

[0072] In addition, in the present embodiment, the aggregate sheet 1 has notches 5 between the frame 3 and the wiring circuit board 2 and between two wiring circuit boards 2. Therefore, the rigidity of the entire aggregate sheet 1 is further reduced. Therefore, it is more difficult to handle the aggregate sheet 1.

[0073] Note that the aggregate sheet 1 has a connecting portion 6A that connects the frame 3 and the wiring circuit board 2, and a connecting portion 6B that connects two wiring circuit boards 2 to each other. The plurality of wiring circuit boards 2 are supported by the frame 3 via the connecting portion 6A while being connected to each other via the connecting portion 6B.

[0074] (3) Reinforcing portion As shown in FIG. 1, the reinforcing portion 4 is disposed on the frame 3. Specifically, the reinforcing portion 4 is disposed on one surface S21 (see FIG. 2) of the frame 3 in the thickness direction. In the present embodiment, it has a frame shape. Specifically, the reinforcing portion 4 has a first reinforcing portion 4A, a second reinforcing portion 4B, a third reinforcing portion 4C, and a fourth reinforcing portion 4D.

[0075] The first reinforcing portion 4A is disposed on the first frame 3A. The first reinforcing portion 4A reinforces the first frame 3A. The first reinforcing portion 4A extends in the second direction. In other words, the first reinforcing portion 4A extends in the direction in which the first frame 3A extends.

[0076] The second reinforcing portion 4B is disposed on the second frame 3B. The second reinforcing portion 4B reinforces the second frame 3B. The second reinforcing portion 4B extends in the second direction. In other words, the second reinforcing portion 4B extends in the direction in which the second frame 3B extends.

[0077] The third reinforcing portion 4C is disposed on the third frame 3C. The third reinforcing portion 4C reinforces the third frame 3C. The third reinforcing portion 4C extends in the first direction. In other words, the third reinforcing portion 4C extends in the direction in which the third frame 3C extends. One end portion of the third reinforcing portion 4C in the first direction is connected to one end portion of the first reinforcing portion 4A in the second direction. The other end portion of the third reinforcing portion 4C in the first direction is connected to one end portion of the second reinforcing portion 4B in the second direction.

[0078] The fourth reinforcing part 4D is disposed on the fourth frame 3D. The fourth reinforcing part 4D reinforces the fourth frame 3D. The fourth reinforcing part 4D extends in the first direction. In other words, the fourth reinforcing part 4D extends in the direction in which the fourth frame 3D extends. One end of the fourth reinforcing part 4D in the first direction is connected to the other end of the first reinforcing part 4A in the second direction. The other end of the fourth reinforcing part 4D in the first direction is connected to the other end of the second reinforcing part 4B in the second direction.

[0079] As shown in FIG. 2, the reinforcing part 4 has a first layer 41 and a second layer 42.

[0080] The first layer 41 is disposed on the frame 3 in the thickness direction. Specifically, the first layer 41 is disposed on one surface S21 of the frame 3 in the thickness direction. The first layer 41 is made of metal. Preferably, the first layer 41 is made of the same metal as the first conductor layer 1331 of the wiring 133A of the wiring circuit board 2. If the first layer 41 and the first conductor layer 1331 are made of the same metal, the first layer 41 can be formed using the process of forming the first conductor layer 1331.

[0081] The thickness of the first layer 41 is, for example, 3 μm or more, preferably 5 μm or more, and, for example, 50 μm or less, preferably 30 μm or less.

[0082] The second layer 42 is disposed on the first layer 41 in the thickness direction. The second layer 42 is made of metal. Preferably, the second layer 42 is made of the same metal as the second conductor layer 1332 of the wiring 133A of the wiring circuit board 2. If the second layer 42 and the second conductor layer 1332 are made of the same metal, the second layer 42 can be formed using the process of forming the second conductor layer 1332.

[0083] The thickness of the second layer 42 is, for example, 3 μm or more, preferably 5 μm or more, and, for example, 50 μm or less, preferably 30 μm or less.

[0084] The thickness T12 of the reinforcing portion 4 is the sum of the thickness of the first layer 41 and the thickness of the second layer 42. The thickness of the reinforcing portion 4 is, for example, 6 μm or more, preferably 10 μm or more, and, for example, 100 μm or less, preferably 60 μm or less.

[0085] When the thickness T11 of the frame 3 is taken as 100%, the thickness T12 of the reinforcing portion 4 is, for example, 50% or more, preferably 80% or more, more preferably 100% or more, still more preferably 110% or more, and, for example, 300% or less, preferably 250% or less, more preferably 200% or less.

[0086] When the thickness T12 of the reinforcing portion 4 is equal to or greater than the above lower limit when the thickness T11 of the frame 3 is taken as 100%, the strength of the frame 3 can be further improved. When the thickness T12 of the reinforcing portion 4 is equal to or less than the above upper limit when the thickness T11 of the frame 3 is taken as 100%, the reinforcing portion 4 can be formed by utilizing the step of forming the conductor pattern 13.

[0087] The sum of the thickness T11 of the frame 3 and the thickness T12 of the reinforcing portion 4 is, for example, 16 μm or more, preferably 25 μm or more, more preferably 50 μm or more, and, for example, 200 μm or less, preferably 150 μm or less.

[0088] 2. Method for manufacturing the aggregate sheet Next, the method for manufacturing the above-described aggregate sheet 1 will be described.

[0089] In the present embodiment, the aggregate sheet 1 is manufactured by a semi-additive method. The aggregate sheet 1 may be manufactured by an additive method. The method for manufacturing the aggregate sheet 1 includes a patterning step (see FIGS. 3A to 3E), a cutting step (see FIG. 4A), and a plating step (see FIG. 4B).

[0090] (1) Patterning step As shown in FIGS. 3A to 3E, in the patterning process, on the metal foil M drawn from the first roll R1 (not shown) which is a roll of metal foil, a base insulating layer 12 (see FIG. 3A), a conductor pattern 13 (see FIGS. 3B and 3C), and a reinforcing portion 4 (see FIGS. 3B and 3C) are formed to manufacture a second roll R2 (see FIG. 4A) having a plurality of aggregate sheets 1. During the patterning process, the metal foil M is stretched between the first roll R1 and the second roll R2.

[0091] Specifically, to form the base insulating layer 12, first, a solution (varnish) of photosensitive resin is applied onto the metal foil M and dried to form a coating film of the photosensitive resin. Next, the coating film of the photosensitive resin is exposed and developed.

[0092] Thereby, as shown in FIG. 3A, the base insulating layer 12 is formed on the metal foil M.

[0093] The conductor pattern 13 and the reinforcing portion 4 are formed by electroplating.

[0094] To form the conductor pattern 13 and the reinforcing portion 4 by electroplating, first, a seed layer is formed on the surfaces of the base insulating layer 12 and the metal foil M. The seed layer is formed, for example, by sputtering. Examples of the material of the seed layer include chromium, copper, nickel, titanium, and alloys thereof.

[0095] Next, a plating resist is bonded onto the base insulating layer 12 and the metal foil M, and the plating resist is exposed in a state where the portions where the conductor layer 1311 (see FIG. 2A), the first conductor layer 1331 (see FIG. 2A), and the first layer 41 (see FIG. 2A) are formed are shielded from light.

[0096] Next, develop the exposed plating resist. Then, the plating resist in the shaded areas is removed, and the seed layer is exposed at the portions where the conductor layer 1311, the first conductor layer 1331, and the first layer 41 are to be formed. Note that the plating resist in the exposed areas, i.e., the portions where the conductor layer 1311, the first conductor layer 1331, and the first layer 41 are not formed, remains.

[0097] Next, form the conductor layer 1311, the first conductor layer 1331, and the first layer 41 by electrolytic plating on the exposed seed layer. After the electrolytic plating is completed, peel off the plating resist. Then, remove the seed layer covered by the plating resist by etching.

[0098] Thereby, as shown in FIG. 3B, the conductor layer 1311 and the first conductor layer 1331 are formed on the base insulating layer 12, and the first layer 41 is formed on the metal foil M.

[0099] Next, as shown in FIG. 3C, in the same manner as the formation of the conductor layer 1311, the first conductor layer 1331, and the first layer 41, form the second conductor layer 1332 on the first conductor layer 1331 and form the second layer 42 on the first layer 41 by electrolytic plating. Thereby, the formation of the conductor pattern 13 and the reinforcing portion 4 is completed.

[0100] Next, as shown in FIG. 3D, form the cover insulating layer 14 on the base insulating layer 12 and the conductor pattern 13 in the same manner as the formation of the base insulating layer 12.

[0101] Next, as shown in FIG. 3E, etch the metal foil M to form the notch 5 between the frame 3 and the wiring circuit board 2 and between the two wiring circuit boards 2.

[0102] Thus, the second roll R2 having a plurality of aggregate sheets 1 is manufactured.

[0103] (2) Cutting process Next, after the patterning process, perform the cutting process.

[0104] As shown in FIG. 4A, in the cutting process, each of the plurality of aggregate sheets 1 is cut from the second roll R2. Specifically, the aggregate sheet 1 fed out from the second roll R2 is cut out by a cutter. The cutting method is not limited. Thereby, a plurality of aggregate sheets 1 independent of each other are obtained.

[0105] (3) Plating process Next, after the cutting process, a plating process is performed.

[0106] In the plating process, the conductor layers 1311 of all the terminals 131 of the cut aggregate sheet 1 and the conductor layers 1311 of all the terminals 132 are plated. In the plating process, the conductor layer 1311 is plated by electroless plating. Thereby, a plating layer 1312 (see FIG. 2A) is formed on the surface of the conductor layer 1311.

[0107] Specifically, as shown in FIG. 4B, the cut aggregate sheet 1 is placed in a basket B and the basket B is immersed in a plating solution. The basket B has a plurality of accommodating portions 100. Each of the plurality of accommodating portions 100 is partitioned from each other. One aggregate sheet 1 is accommodated in one accommodating portion 100.

[0108] At this time, the frame 3 of the cut aggregate sheet 1 is reinforced by the reinforcing portion 4. Therefore, it is possible to suppress the occurrence of wrinkles in the aggregate sheet 1 during the plating process.

[0109] 3. Operational effects (1) According to the aggregate sheet 1, as shown in FIGS. 2A and 2B, the reinforcing portion 4 has a first layer 41 made of metal and a second layer 42 made of metal.

[0110] Therefore, the thickness of the metal layer in the reinforcing portion 4 can be increased.

[0111] As a result, further reinforcement of the frame 3 can be achieved.

[0112] (2) According to the aggregate sheet 1, as shown in FIG. 2A, the terminal 131, which is a part of the conductor pattern 13, is thinner than the reinforcing portion 4 in the thickness direction.

[0113] Therefore, while improving the degree of freedom in the design of the conductor pattern 13, the reinforcing portion 4 can be formed.

[0114] (3) According to the aggregate sheet 1, as shown in FIG. 2B, at least a part of the wiring 133 has a first conductor layer 1331 and a second conductor layer 1332. The first conductor layer 1331 is made of the same metal as the first layer 41. The second conductor layer 1332 is made of the same metal as the second layer 42.

[0115] Therefore, the reinforcing portion 4 can be formed by using the step of forming the first conductor layer 1331 and the step of forming the second conductor layer 1332.

[0116] As a result, the degree of freedom in the design of the conductor pattern 13 can be improved, and the reinforcing portion 4 can be formed while suppressing an increase in man-hours.

[0117] (4) According to the aggregate sheet 1, the frame 3 is made of a metal foil having a thickness of 50 μm or less.

[0118] Thus, according to the aggregate sheet 1, when the frame 3 made of a thin metal foil is provided, further reinforcement of the frame 3 can be achieved.

[0119] (5) According to the manufacturing method of the aggregate sheet 1, as shown in FIGS. 3B and 3C, the reinforcing portion 4 can be formed in a state where the metal foil M is stretched between the first roll R1 and the second roll R2.

[0120] Therefore, as shown in FIG. 4A, when handling the cut aggregate sheet 1, it is possible to suppress the aggregate sheet 1 from being wrinkled by the reinforcing portion 4.

[0121] As a result, the handleability of the cut aggregate sheet 1 can be improved.

[0122] (6) According to the manufacturing method of the assembly sheet 1, as shown in FIG. 4B, in the plating process, the terminals 131 and 132 of the cut assembly sheet 1 are plated.

[0123] Here, the frame 3 of the cut assembly sheet 1 is reinforced by the reinforcing portion.

[0124] Therefore, during the plating process, it is possible to suppress the occurrence of wrinkles in the assembly sheet 1.

[0125] 4. Modification Next, with reference to FIGS. 5 to 12, the modification will be described. In the modification, the same members as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0126] (1) As shown in FIG. 5, the frame 3 may be between the two wiring circuit boards 2. In this case, the reinforcing portion 4 may also be provided on the frame 3 between the two wiring circuit boards 2.

[0127] (2) As shown in FIG. 6, each of the first reinforcing portion 4A, the second reinforcing portion 4B, the third reinforcing portion 4C, and the fourth reinforcing portion 4D may be separated from each other.

[0128] (3) As shown in FIG. 7, the reinforcing portion 4 may be disposed on the other surface S22 of the frame 3 in the thickness direction.

[0129] (4) As shown in FIG. 8, the assembly sheet 1 may include a reinforcing portion 4 disposed on one surface S21 of the frame 3 in the thickness direction and a second reinforcing portion 20 disposed on the other surface S22 of the frame 3 in the thickness direction. The second reinforcing portion 20 may have a first layer 201 and a second layer 202. The first layer 201 may be made of the same metal as the first layer 41 of the reinforcing portion 4. The second layer 202 may be made of the same metal as the second layer 42 of the reinforcing portion 4.

[0130] According to such a configuration, reinforcing portions (reinforcing portion 4 and second reinforcing portion 20) can be provided on both sides of the frame 3.

[0131] As a result, the frame 3 can be reinforced more.

[0132] (5) As shown in FIG. 9, the reinforcing portion 30 may have a third layer 301 made of the same resin as the base insulating layer 12. The third layer 301 may be disposed between the frame 3 and the first layer 41. In other words, the first layer 41 may not be disposed on one surface S21 of the frame 3. The first layer 41 may be separated from one surface S21 of the frame 3.

[0133] Also, the reinforcing portion 30 may have a fourth layer 302 made of the same resin as the cover insulating layer 14.

[0134] (6) As shown in FIG. 10, the conductor pattern 13 may have a first wiring 401, a second wiring 402, and an intermediate insulating layer 403 as an example of the second insulating layer.

[0135] The first wiring 401 is disposed on the base insulating layer 12. The first wiring 401 is formed by electrolytic plating, similarly to the first conductor layer 1331 described above.

[0136] The second wiring 402 is disposed away from the first wiring 401. In other words, the second wiring 402 is not electrically connected to the first wiring 401. The second wiring 402 is disposed on the intermediate insulating layer 403. The second wiring 402 is formed by electrolytic plating, similarly to the second conductor layer 1332 described above.

[0137] The intermediate insulating layer 403 is disposed between the first wiring 401 and the second wiring 402. The intermediate insulating layer 403 insulates between the first wiring 401 and the second wiring 402. The intermediate insulating layer 403 is formed on the first wiring 401 and the base insulating layer 12 in the same manner as the base insulating layer 12.

[0138] The first layer 41 may be made of the same metal as the first wiring 401. The second layer 42 may be made of the same metal as the second wiring 402.

[0139] According to such a configuration, the reinforcing portion 4 can be formed by using the process of forming the first wiring 401 and the process of forming the second wiring 402.

[0140] Therefore, it is possible to improve the degree of freedom in the design of the conductor pattern 13, and to form the reinforcing portion 4 while suppressing an increase in the number of man-hours.

[0141] (7) As shown in FIG. 11, the conductor pattern 13 may not have the second conductor layer 1332 (see FIG. 2B) or the second wiring 402 (see FIG. 10). All of the conductor pattern 13 may be thinner than the reinforcing portion 4 in the thickness direction.

[0142] (8) As shown in FIG. 12, the terminal 131 or the terminal 132 may further have a second conductor layer 1313 disposed on the conductor layer 1311. The second layer 42 may be made of the same metal as the second conductor layer 1313.

[0143] (9) The above-described embodiments and each modification can be combined with each other.

Description of Reference Numerals

[0144] 1 Aggregate sheet 2 Wiring circuit board 3 Frame S21 One surface of the frame S22 The other surface of the frame 4 Reinforcing portion 41 First layer 42 Second layer 11 Support layer S1 One surface of the support layer 12 Base insulating layer S11 One surface of the base insulating layer 13 Conductor pattern 131A Terminal 133A Wiring 1331 First Conductor Layer 1332 Second Conductor Layer M Metal Foil R1 First Roll R2 Second Roll 20 Second Reinforcing Portion 401 First Wiring 402 Second Wiring 403 Intermediate Insulation Layer

Claims

1. A wiring circuit board having a support layer, an insulating layer disposed on one surface of the support layer in the thickness direction, and a conductor pattern disposed on one surface of the insulating layer in the thickness direction; a frame for supporting the wiring circuit board; a reinforcing portion disposed on the frame in the thickness direction and reinforcing the frame and comprising: The conductor pattern has a terminal and a wiring connected to the terminal, at least one of the terminal and the wiring has a first conductor layer made of metal, and a second conductor layer made of metal and at least partially in contact with the first conductor layer and having: The reinforcing portion has a first layer made of the same metal as the first conductor layer, and a second layer disposed on the first layer in the thickness direction and made of the same metal as the second conductor layer, which is an aggregate sheet.

2. A wiring circuit board having a support layer, an insulating layer disposed on one surface of the support layer in the thickness direction, and a conductor pattern disposed on one surface of the insulating layer in the thickness direction; a frame for supporting the wiring circuit board; a reinforcing portion disposed on the frame in the thickness direction and reinforcing the frame and comprising: The conductor pattern has a first wiring made of metal, a second wiring made of metal and separated from the first wiring, and a second insulating layer disposed between the first wiring and the second wiring and having: The reinforcing portion has a first layer made of the same metal as the first wiring, and a second layer disposed on the first layer in the thickness direction and made of the same metal as the second wiring, which is an aggregate sheet.

3. A wiring circuit board having a support layer, an insulating layer disposed on one surface of the support layer in the thickness direction, and a conductor pattern disposed on one surface of the insulating layer in the thickness direction; a frame for supporting the wiring circuit board; a reinforcing portion disposed on the frame in the thickness direction and reinforcing the frame and comprising: The reinforcing portion has a first layer made of copper and having a thickness of 3 μm or more, and a second layer disposed on the first layer in the thickness direction and made of copper and having a thickness of 3 μm or more, which is an aggregate sheet.

4. The reinforcing portion is an aggregate sheet according to any one of Claims 1 to 3, disposed on one surface of the frame in the thickness direction.

5. The aggregate sheet according to Claim 4, further comprising a second reinforcing portion disposed on the other surface of the frame in the thickness direction.

6. The aggregate sheet according to any one of claims 1 to 5, wherein at least a part of the conductor pattern is thinner than the reinforcing portion in the thickness direction.

7. The aggregate sheet according to any one of claims 1 to 6, wherein the frame is made of a metal foil having a thickness of 50 μm or less.

8. The aggregate sheet according to claim 7, wherein when the thickness of the frame is taken as 100%, the thickness of the reinforcing portion is 50% or more and 300% or less.

9. A method for manufacturing an aggregate sheet, wherein the aggregate sheet has a wiring circuit board including a support layer, an insulating layer disposed on one surface of the support layer in the thickness direction, and a conductor pattern disposed on one surface of the insulating layer in the thickness direction, a frame that supports the wiring circuit board, and a reinforcing portion disposed on the frame in the thickness direction and reinforcing the frame, wherein the reinforcing portion has a first layer made of metal, and a second layer made of metal disposed on the first layer in the thickness direction, wherein the support layer and the frame are made of metal foil, and the method for manufacturing the aggregate sheet includes a patterning step of forming the insulating layer, the conductor pattern, and the reinforcing portion on the metal foil drawn from a first roll that is a roll of the metal foil to manufacture a second roll having a plurality of the aggregate sheets, and a cutting step of cutting each of the plurality of aggregate sheets from the second roll The method for manufacturing an aggregate sheet.

10. The method for manufacturing an aggregate sheet according to claim 9, further including a plating step of plating terminals of the conductor pattern of the cut aggregate sheet. ​

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