Multilayer ceramic electronic components

Abstract

To provide a multilayer ceramic electronic component that is excellent in moisture resistance reliability.SOLUTION: A multilayer ceramic electronic component 100 includes: a ceramic main body that includes a laminate which has first and second surfaces opposed to each other in a first direction, third and fourth surfaces opposed to each other in a second direction, and fifth and sixth surfaces opposed to each other in a third direction and which includes a dielectric layer 111, and a first internal electrode 121 and a second internal electrode 122 laminated in a third direction while interposing the dielectric layer therebetween; a first coupling part arranged on the first surface of the laminate; and a second coupling part arranged on the second surface of the laminate. The first coupling part includes a first extraction electrode 141a coupled with the first internal electrode and a first ceramic layer 141b arranged on the first extraction electrode. The second coupling part includes a second extraction electrode 142a coupled with the second internal electrode and a second ceramic layer 142b arranged on the second extraction electrode. The first extraction electrode and the second extraction electrode are extracted to any one surface in the third direction of the first coupling part and the second coupling part.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a multilayer ceramic electronic component. [Background technology]

[0002] An electronic component using a ceramic material, such as a capacitor, inductor, piezoelectric element, varistor, or thermistor, comprises a ceramic body made of a ceramic material, an internal electrode formed inside the body, and an external electrode disposed on the surface of the ceramic body so as to be connected to the internal electrode.

[0003] The external electrodes can be formed by applying an external electrode paste containing a conductive metal to the fired ceramic body and firing the applied paste, or by preparing an external electrode paste containing a conductive metal and a base resin, applying the paste to both end surfaces of the fired ceramic body, and then curing the paste.

[0004] However, when forming external electrodes using this method, there are problems such as the need to re-fire the already sintered ceramic body to form the external electrodes, or the need for a hardening process, which complicates the process steps and reduces productivity.

[0005] Furthermore, with the recent trend toward miniaturization of electrical appliances, there is a demand for multilayer ceramic electronic components to be smaller and have higher capacitance. However, when the external electrodes of multilayer ceramic electronic components are made thinner in order to achieve the miniaturization and higher capacitance of the multilayer ceramic electronic components, there is a problem in that external moisture and the like can easily penetrate the electrodes.

[0006] In particular, when a plating layer is formed on an external electrode for mounting on a substrate, the penetration of a plating solution during the plating process can cause defects in the electrode terminal and the internal structure of the element. This can cause problems with the reliability of the final product, particularly deterioration of characteristics and failure during high temperature / high voltage operation. Summary of the Invention [Problem to be solved by the invention]

[0007] One of the various objects of the present invention is to provide a multilayer ceramic electronic component having excellent moisture resistance reliability.

[0008] One of the various objects of the present invention is to provide a multilayer ceramic electronic component that can be produced using a simplified production process.

[0009] One of the various objects of the present invention is to provide a multilayer ceramic electronic component that can be miniaturized. [Means for solving the problem]

[0010] According to an embodiment of the present invention, there is provided a multilayer ceramic electronic component including: a laminate including first and second surfaces facing in a first direction, third and fourth surfaces facing in the second direction, and fifth and sixth surfaces facing in the third direction, the laminate including a dielectric layer and first internal electrodes and second internal electrodes stacked in the third direction with the dielectric layer sandwiched therebetween; a ceramic body including a first margin portion disposed on the third surface of the laminate and a second margin portion disposed on the fourth surface of the laminate; a first connecting portion disposed on the first surface of the laminate; and a second connecting portion disposed on the second surface of the laminate, wherein the first connecting portion includes a first extension electrode connected to the first internal electrode and a first ceramic layer disposed on the first extension electrode; the second connecting portion includes a second extension electrode connected to the second internal electrode and a second ceramic layer disposed on the second extension electrode; and the first and second extension electrodes are extended to either one of the first and second connecting portions in the third direction.

[0011] Another embodiment of the present invention may provide a multilayer ceramic electronic component including: a laminate including first and second surfaces facing in a first direction, third and fourth surfaces facing in the second direction, and fifth and sixth surfaces facing in the third direction, the laminate including a dielectric layer and first internal electrodes and second internal electrodes stacked in the second direction with the dielectric layer sandwiched therebetween; a ceramic body including a first margin portion disposed on the third surface of the laminate and a second margin portion disposed on the fourth surface of the laminate; a first connecting portion disposed on the first surface of the laminate; and a second connecting portion disposed on the second surface of the laminate, wherein the first connecting portion includes a first extension electrode connected to the first internal electrode and a first ceramic layer disposed on the first extension electrode, and the second connecting portion includes a second extension electrode connected to the second internal electrode and a second ceramic layer disposed on the second extension electrode, and the first and second extension electrodes are extended to either one surface of the first connecting portion and the second connecting portion in the third direction. [Effects of the Invention]

[0012] One of the various effects of the present invention is that it can provide a multilayer ceramic electronic component with excellent moisture resistance reliability.

[0013] One of the various effects of the present invention is that it can provide a multilayer ceramic electronic component that can improve process efficiency by simplifying the production process.

[0014] One of the various effects of the present invention is that it can provide a multilayer ceramic electronic component that allows for product miniaturization.

[0015] However, the various beneficial advantages and effects of the present invention are not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Brief explanation of the drawings]

[0016] [Figure 1] 1 is a perspective view schematically showing a multilayer ceramic electronic component according to one embodiment of the present invention. [Figure 2] FIG. 2 is a cross-sectional view taken along line II' in FIG. [Figure 3] FIG. 2 is a perspective view schematically illustrating the ceramic body of FIG. [Figure 4] FIG. 4 is a perspective view schematically illustrating the laminate of FIG. 3. [Figure 5] FIG. 4 is a front view of FIG. 3 as seen from the X direction. [Figure 6] 2 is a view showing the inside of the first connecting portion of FIG. 1; [Figure 7a] FIG. 3 is an enlarged view of region A in FIG. 2. [Figure 7b] 7b shows a variation of FIG. 7a. [Figure 8a] 7b shows a variation of FIG. 7a. [Figure 8b] 7b shows a variation of FIG. 7a. [Figure 9] 7b shows a variation of FIG. 7a. [Figure 10] FIG. 10 is a perspective view schematically showing a multilayer ceramic electronic component according to another embodiment of the present invention. [Figure 11] 11 is a cross-sectional view taken along line II-II' in FIG. 10. FIG. [Figure 12] 11 is a view showing the inside of the first connecting portion of FIG. 10. [Figure 13a] FIG. 12 is an enlarged view of region B in FIG. [Figure 13b] 13b shows a variation of FIG. 13a. [Figure 14a] 13b shows a variation of FIG. 13a. [Figure 14b] 13b shows a variation of FIG. 13a. [Figure 15] 13b shows a variation of FIG. 13a. [Figure 16] FIG. 10 is a perspective view schematically showing a multilayer ceramic electronic component according to still another embodiment of the present invention. [Figure 17] FIG. 17 is a cross-sectional view taken along line III-III' in FIG. 16. [Figure 18] FIG. 17 is a perspective view schematically illustrating the ceramic body of FIG. 16. [Figure 19] FIG. 19 is a perspective view schematically illustrating the laminate of FIG. 18. [Figure 20] 17 is a view showing the inside of the first connecting portion of FIG. 16. [Figure 21a] FIG. 18 is an enlarged view of region C in FIG. [Figure 21b] 21b shows a variation of FIG. 21a. [Figure 22a] 21b shows a variation of FIG. 21a. [Figure 22b] 21b shows a variation of FIG. 21a. [Figure 23] 21b shows a variation of FIG. 21a. [Figure 24] FIG. 10 is a perspective view schematically showing a multilayer ceramic electronic component according to still another embodiment of the present invention. [Figure 25] FIG. 25 is a cross-sectional view taken along line IV-IV′ in FIG. 24. [Figure 26] 25 is a view showing the inside of the first connecting portion of FIG. 24. [Figure 27a] FIG. 26 is an enlarged view of region D in FIG. 25. [Figure 27b] 27b shows a variation of FIG. 27a. [Figure 28a] 27b shows a variation of FIG. 27a. [Figure 28b] 27b shows a variation of FIG. 27a. [Figure 29] 27b shows a variation of FIG. 27a. [Figure 30] FIG. 10 is a perspective view schematically showing a multilayer ceramic electronic component according to still another embodiment of the present invention. [Figure 31] 31 is a cross-sectional view taken along line VV' in FIG. 30. FIG. [Figure 32] FIG. 31 is a perspective view schematically illustrating the ceramic body of FIG. 30. [Figure 33] FIG. 33 is a perspective view schematically illustrating the laminate of FIG. 32. [Figure 34] 31 is a view showing the inside of the first connecting portion of FIG. 30. [Figure 35a]FIG. 32 is an enlarged view of region E in FIG. 31. [Figure 35b] 35b is a diagram showing a variation of FIG. 35a. [Figure 36a] 35b is a diagram showing a variation of FIG. 35a. [Figure 36b] 35b is a diagram showing a variation of FIG. 35a. [Figure 37] 35b is a diagram showing a variation of FIG. 35a. [Figure 38] FIG. 10 is a perspective view schematically showing a multilayer ceramic electronic component according to still another embodiment of the present invention. [Figure 39] 39 is a cross-sectional view taken along line VI-VI' in FIG. 38. [Figure 40] 39 is a view showing the inside of the first connecting portion of FIG. 38. [Figure 41a] FIG. 40 is an enlarged view of region F in FIG. 39. [Figure 41b] FIG. 41b shows a variation of FIG. 41a. [Figure 42a] FIG. 41b shows a variation of FIG. 41a. [Figure 42b] FIG. 41b shows a variation of FIG. 41a. [Figure 43] FIG. 41b shows a variation of FIG. 41a. [Figure 44] FIG. 10 is a perspective view schematically showing a multilayer ceramic electronic component according to still another embodiment of the present invention. [Figure 45] 45 is a cross-sectional view taken along line VII-VII' in FIG. 44. [Figure 46] FIG. 45 is a perspective view schematically illustrating the ceramic body of FIG. 44. [Figure 47] FIG. 47 is a perspective view schematically illustrating the laminate of FIG. 46. [Figure 48] 45 is a view showing the inside of the first connecting portion of FIG. 44. [Figure 49a] FIG. 46 is an enlarged view of region G in FIG. 45. [Figure 49b] FIG. 49b shows a variation of FIG. 49a. [Figure 50a] FIG. 49b shows a variation of FIG. 49a. [Figure 50b]FIG. 49b shows a variation of FIG. 49a. [Figure 51] FIG. 49b shows a variation of FIG. 49a. [Figure 52] FIG. 10 is a perspective view schematically showing a multilayer ceramic electronic component according to still another embodiment of the present invention. [Figure 53] 53 is a cross-sectional view taken along line VIII-VIII' in FIG. 52. [Figure 54] 53 is a view showing the inside of the first connecting portion of FIG. 52. [Figure 55a] FIG. 54 is an enlarged view of region H in FIG. 53. [Figure 55b] FIG. 55b shows a variation of FIG. 55a. [Figure 56a] FIG. 55b shows a variation of FIG. 55a. [Figure 56b] FIG. 55b shows a variation of FIG. 55a. [Figure 57] FIG. 55b shows a variation of FIG. 55a. [Figure 58] 1 is a graph showing the moisture absorption rates of multilayer ceramic electronic components according to an embodiment of the present invention and a comparative example; DETAILED DESCRIPTION OF THE INVENTION

[0017] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. This should be understood as not limiting the technology described herein to a specific embodiment, but including various modifications, equivalents, and / or alternatives of the embodiments of the present invention. In connection with the description of the drawings, similar reference numerals may be used for similar components.

[0018] In the drawings, in order to clearly explain the present invention, parts that are not relevant to the explanation are omitted, thicknesses are shown exaggerated to clearly represent multiple layers and regions, and components that have the same function within the same concept may be described using the same reference symbols.

[0019] In this specification, the terms "have," "can have," "include," or "can include" refer to the presence of a given feature (e.g., a value, function, operation, or component such as a part) and do not exclude the presence of additional features.

[0020] As used herein, expressions such as "A and / or B," "at least one of A and B," or "one or more of A and B" may include all possible combinations of the items listed together. For example, "A and / or B," "at least one of A and B," or "one or more of A and B" may refer to (1) at least one A, (2) at least one B, or (3) both at least one A and at least one B.

[0021] In the drawings, the X direction can be defined as the first direction, L direction or length direction, the Y direction can be defined as the second direction, W direction or width direction, and the Z direction can be defined as the third direction, T direction or thickness direction.

[0022] The present invention relates to a multilayer ceramic electronic component 100. Figures 1 to 9 are diagrams that schematically show a multilayer ceramic electronic component 100 according to one embodiment of the present invention. 1 to 9, a multilayer ceramic electronic component 100 according to the present invention includes a laminate 120 having first and second surfaces (S1, S2) facing each other in a first direction (X direction), third and fourth surfaces (S3, S4) facing each other in a second direction (Y direction), and fifth and sixth surfaces (S5, S6) facing each other in a third direction (Z direction), and includes a dielectric layer 111 and a first internal electrode 121 and a second internal electrode 122 stacked in the third direction (Z direction) with the dielectric layer 111 sandwiched therebetween; a ceramic body 110 including a first margin portion 131 disposed on the third surface (S3) of the laminate 120 and a second margin portion 132 disposed on the fourth surface (S4) of the laminate 120; a first connecting portion 141 disposed on the first surface of the laminate 120; and a second connecting portion 142 disposed on the second surface of the laminate 120.

[0023] In this case, the first connecting part 141 may include a first extension electrode 141a connected to the first internal electrode 121 and a first ceramic layer 141b disposed on the first extension electrode 141a, and the second connecting part 142 may include a second extension electrode 142a connected to the second internal electrode 122 and a second ceramic layer 142b disposed on the second extension electrode 142a. In addition, the first extension electrode 141a and the second extension electrode 142a may be extended to any one surface in a third direction (Z direction) of the first connecting part 141 and the second connecting part 142. The surface from which the first extension electrode 141a and the second extension electrode 142a are extended may be a fifth surface (S5) direction or a sixth surface (S6) direction of the laminate 120.

[0024] That is, the multilayer ceramic electronic component 100 according to this embodiment may have a structure in which electrodes are drawn out only on one of the six external surfaces in the third direction (Z direction).Alternatively, when viewing the multilayer ceramic electronic component 100 according to this embodiment, no drawn-out electrodes are visible on the five surfaces, and only the ceramic is observed, with an electrode drawn out to the outside being visible only on one surface in the third direction (Z direction).

[0025] Referring to FIG. 2, the first and second extraction electrodes 141a and 142a may be extracted to one surface (sixth surface, S6) in the third direction (Z direction) of the laminate 120, and the first and second extraction electrodes 141a and 142a may be spaced apart from each other with the ceramic body 110 sandwiched therebetween. Conventional multilayer ceramic electronic components use a structure in which external electrodes connected to internal electrodes are disposed to cover the top surface of the ceramic body. This structure has problems such as gaps between the ceramic body and the external electrodes or moisture penetration between the ceramic body and the external electrodes. The above embodiment of the present invention can effectively prevent moisture penetration from the outside by minimizing the electrodes exposed to the outside, thereby achieving excellent moisture resistance reliability.

[0026] Furthermore, in the case of conventional technologies, differences in shrinkage behavior between the external electrodes and the ceramic body can result in residual internal stress, which can reduce the mechanical strength of the electronic component itself. The multilayer ceramic electronic component according to the present invention can improve the mechanical strength of the component itself by simultaneously firing the ceramic body and electrodes in a single sintering process, as described below, without forming separate external electrodes. Furthermore, the absence of separate external electrodes can enable the component itself to be miniaturized.

[0027] The first connecting part 141 of the multilayer ceramic electronic component 100 according to the present invention may include a first lead electrode 141a and a first ceramic layer 141b, and the second connecting part 142 may include a second lead electrode 142a and a second ceramic layer 142b.

[0028] In one example of the present invention, the first ceramic layer 141b of the multilayer ceramic electronic component 100 may be arranged to cover at least a portion of the first extraction electrode 141a, and the second ceramic layer 142b may be arranged to cover at least a portion of the second extraction electrode 142a. "Arrangement of the ceramic layers to cover at least a portion of the extraction electrodes" refers to a state in which ceramic layers are arranged on at least a portion of both surfaces in the first direction (X direction) of the first extraction electrode 141a and the second extraction electrode 142a arranged in the laminate 120 of the multilayer ceramic electronic component 100 according to the present invention, and may refer to a state in which the first extraction electrode 141a and the second electrode 142a are arranged in contact with at least a portion of the ceramic layers.

[0029] In another example, the first ceramic layer 141b of the multilayer ceramic electronic component 100 may be arranged to cover the first extraction electrode 141a, and the second ceramic layer 142b may be arranged to cover the second extraction electrode 142a. "The ceramic layers are arranged to cover the extraction electrodes" may mean that, when the multilayer ceramic electronic component 100 according to the present invention is viewed from a first direction (X direction), only the ceramic layers are visible, and the extraction electrodes are hidden by the ceramic layers. That is, the first ceramic layer 141b may be arranged so as not to expose the first extraction electrode 141a in the first direction, and the second ceramic layer 142b may be arranged so as not to expose the second extraction electrode 142a in the first direction (X direction). Arranging the first ceramic layer 141b to cover the first extraction electrode 141a and the second ceramic layer 142b to cover the second extraction electrode 142a in this manner reduces the area of the extraction electrodes exposed to the outside, thereby minimizing the path for moisture penetration from the outside.

[0030] Furthermore, the first ceramic layer 141b of the multilayer ceramic electronic component 100 according to one embodiment of the present invention may be arranged to cover the first surface (S1) of the multilayer body 120, and the second ceramic layer 142b may be arranged to cover the second surface (S2) of the multilayer body 120. Thus, the first extension electrode 141a may be arranged in contact with the first surface (S1) of the multilayer body 120, and the first ceramic layer 141b may be arranged to cover the first extension electrode 141a. Furthermore, the second extension electrode 142a may be arranged in contact with the second surface (S2) of the multilayer body 120, and the second ceramic layer 142b may be arranged to cover the second extension electrode 142a. That is, the first extraction electrode 141a may be arranged on the first surface (S1) of the laminate 120 and connected to the first internal electrode 121, and the second extraction electrode 142a may be arranged on the second surface (S2) of the laminate 120 and connected to the second internal electrode 122.

[0031] In one embodiment of the present invention, the maximum value of the width in the second direction (Y direction) of the first lead electrode 141a and / or the second lead electrode 142a of the multilayer ceramic electronic component 100 may be smaller than the maximum value of the width in the second direction (Y direction) of the ceramic body 110. FIG. 6 schematically shows a cross section of the first connecting portion 141 according to one embodiment of the present invention. In this specification, the description of the first connecting portion 141 in FIG. 6 is similarly applicable to the second connecting portion 142. Referring to FIGS. 1 and 6, the maximum value (W2) of the width in the second direction (Y direction) of the first lead electrode 141a of the first connecting portion 141 and / or the second lead electrode 142a of the second connecting portion 142 may be smaller than the maximum value (W1) of the width in the second direction (Y direction) of the ceramic body 110. That is, the relationship of W2 < W1 can be satisfied. When the maximum value of the width in the second direction (Y direction) of the first lead electrode 141a and / or the second lead electrode 142a is smaller than the maximum value of the width in the second direction (Y direction) of the ceramic body 110, the first lead electrode 141a and / or the second lead electrode 142a in the second direction (Y direction) of the multilayer ceramic electronic component 100 according to the present invention can be prevented from being exposed, and the moisture resistance can be further improved.

[0032] At this time, as described above, when the first ceramic layer 141b is arranged to cover the first lead electrode 141a and the second ceramic layer 142b is arranged to cover the second lead electrode 142a, the width in the second direction (Y direction) of the first ceramic layer 141b and / or the second ceramic layer 142b may be the same as the maximum value (W1) of the width in the second direction (Y direction) of the ceramic body 110. That is, the first ceramic layer 141b and the second ceramic layer 142b may be arranged on both surfaces in the first direction of the ceramic body 110 and may be arranged to cover at least the entire width direction of the ceramic body 110.

[0033] In one example, the maximum value of the height of the first extraction electrode 141a and / or the second extraction electrode 142a in the third direction (Z direction) according to the present invention may be smaller than the maximum value of the height of the ceramic body 110 in the third direction (Z direction). Referring to FIGS. 1 and 6, the maximum value (H2) of the height of the first extraction electrode 141a of the first connection portion 141 and / or the second extraction electrode 142a of the second connection portion 142 in the third direction (Z direction) may be smaller than the maximum value (H1) of the height of the ceramic body 110 in the third direction (Z direction). That is, the relationship of H2 < H1 can be satisfied. When the maximum value of the height of the first extraction electrode 141a and / or the second extraction electrode 142a in the third direction (Z direction) is smaller than the maximum value of the height of the ceramic body 110 in the third direction (Z direction), by exposing the first extraction electrode 141a and / or the second extraction electrode 142a only on one surface of the multilayer ceramic electronic component 100 in the third direction (Z direction) according to the present invention, the possibility of moisture penetration can be reduced.

[0034] As described above, when the first ceramic layer 141b is arranged to cover the first extraction electrode 141a and the second ceramic layer 142b is arranged to cover the second extraction electrode 142a, the height in the third direction (Z direction) of the first ceramic layer 141b and / or the second ceramic layer 142b may be the same as the maximum value (H1) of the height of the ceramic body 110 in the third direction (Z direction). That is, the first ceramic layer 141b and the second ceramic layer 142b may be arranged on both surfaces of the ceramic body 110 in the first direction and may be arranged to cover at least the entire thickness direction of the ceramic body 110.

[0035] Also, in one example of the present invention, when the first ceramic layer 141b is arranged to cover the first extraction electrode 141a and the second ceramic layer 142b is arranged to cover the second extraction electrode 142a, the first ceramic layer 141b and the second ceramic layer 142b may be arranged to cover both surfaces of the ceramic body 110 in the first direction entirely.

[0036] In one embodiment of the present invention, the ceramic body 110 of the multilayer ceramic electronic component 100 according to the present invention may include a laminate 120 , a first margin portion 131 and a second margin portion 132 .

[0037] The specific shape of the ceramic body 110 is not particularly limited, but as shown in the drawing, the ceramic body 110 may have a hexahedral shape or a similar shape. During the firing process, due to shrinkage of the ceramic powder contained in the ceramic body 110, the ceramic body 110 may have a substantially hexahedral shape, but not a hexahedral shape with perfectly straight lines. The ceramic body 110 may be rounded to remove sharp corners, if necessary. The rounding may be performed by, for example, barrel polishing, but is not limited thereto.

[0038] The laminate 120 of the multilayer ceramic electronic component 100 according to the present invention may be formed by alternately stacking dielectric layers 111, first internal electrodes 121, and second internal electrodes 122. The dielectric layers 111, first internal electrodes 121, and second internal electrodes 122 may be stacked in a third direction (Z direction). The plurality of dielectric layers 111 forming the laminate 120 are in a fired state, and the boundaries between adjacent dielectric layers 111 may be integrated to the extent that they are difficult to identify without using a scanning electron microscope (SEM).

[0039] According to an embodiment of the present invention, the material for forming the dielectric layer 111 is not particularly limited as long as it can provide sufficient capacitance. For example, a barium titanate-based material, a lead complex perovskite-based material, or a strontium titanate-based material may be used. 1-x Ca x )(Ti 1-yA component expressed by (Zr, Sn, Hf)y)O3 (where 0≦x≦1, 0≦y≦0.5) can be used. Furthermore, the material for forming the dielectric layer 111 may be a powder such as barium titanate (BaTiO3) to which various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc. may be added depending on the purpose of the present invention.

[0040] The dielectric layer 111 can be formed by adding additives as needed to a slurry containing the above-mentioned materials, applying the slurry to a carrier film, and drying the applied slurry to form a plurality of ceramic sheets. The ceramic sheets can be formed by cutting the slurry into sheets having a thickness of several μm by a doctor blade method, but are not limited to this.

[0041] The first and second internal electrodes 121 and 122 may be laminated such that their cross sections are exposed at opposite ends of the ceramic body 110. Specifically, the first and second internal electrodes 121 and 122 may be exposed at both surfaces of the ceramic body 110 in a first direction (X direction), and the first internal electrode 121 may be exposed in a first surface (S1) direction of the ceramic body 110, and the second internal electrode 122 may be exposed in a second surface (S2) direction.

[0042] The material for forming the first and second internal electrodes 121, 122 is not particularly limited, and may be formed using a conductive paste containing one or more conductive metals such as silver (Ag), palladium (Pd), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0043] The laminate 120 may be formed by alternately stacking ceramic green sheets, each having a dielectric layer 111 on which a first internal electrode 121 is printed, and ceramic green sheets, each having a dielectric layer 111 on which a second internal electrode 122 is printed, in a third direction (Z direction). The printing method of the first and second internal electrodes may be, but is not limited to, a screen printing method or a gravure printing method.

[0044] The first margin portion 131 and the second margin portion 132 may include a ceramic material, for example, a barium titanate (BaTiO3)-based ceramic material. The first margin portion 131 and the second margin portion 132 may be formed by applying a slurry including a ceramic material in the second direction (Y direction) of the laminate 120, or by attaching a single dielectric layer or two or more dielectric layers in the second direction (Y direction). The first margin portion 131 and the second margin portion 132 may essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0045] In the multilayer ceramic electronic component 100 according to an embodiment of the present invention, a first connecting portion 141 and a second connecting portion 142 may be disposed on both surfaces of the ceramic body 110 in a first direction (X direction). The first connecting portion 141 and the second connecting portion 142 may have dimensions and areas corresponding to both surfaces of the ceramic body 110 in the first direction (X direction). The first connecting portion 141 may be disposed to cover the first surface of the laminate 120, and the second connecting portion 142 may be disposed to cover the second surface of the laminate 120.

[0046] The first connection part 141 may include a first extraction electrode 141a, and the second connection part 142 may include a second extraction electrode 142a. The first extraction electrode 141a may be connected to the first internal electrode 121, and the second extraction electrode 142a may be connected to the second internal electrode 122. The material for forming the first extraction electrode 141a and the second extraction electrode 142a is not particularly limited, and may be formed using a conductive paste including at least one conductive metal selected from the group consisting of silver (Ag), palladium (Pd), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0047] In this case, desired characteristics can be achieved by adjusting the conductive metal components contained in the first and second extraction electrodes 141a and 142a. For example, when the first and second extraction electrodes 141a and 142a contain the same metal components as the first and second internal electrodes 121 and 122, the connectivity between each extraction electrode and each internal electrode can be improved. Furthermore, the first and second extraction electrodes 141a and 142a may contain a different component from the first and second internal electrodes 121 and 122, as needed, to adjust the shrinkage rate during sintering or to adjust the internal stress after sintering.

[0048] The first connecting part 141 includes a first ceramic layer 141b, and the second connecting part 142 includes a second ceramic layer 142b. The first ceramic layer 141b and the second ceramic layer 142b may include a ceramic material, for example, a barium titanate (BaTiO3)-based ceramic material. The barium titanate (BaTiO3)-based ceramic material may be, for example, (Ba 1-x Ca x )(Ti 1-y (Zr, Sn, Hf) y )O3 (where 0≦x≦1, 0≦y≦0.5).

[0049] In this case, in order to achieve desired properties, the first ceramic layer 141b and / or the second ceramic layer 142b may contain the same or different ceramic components as the dielectric layer 111 of the laminate 120. For example, when the first ceramic layer 141b and the second ceramic layer 142b contain the same ceramic components as the dielectric layer 111 of the laminate 120, they may exhibit similar sintering behavior, thereby reducing internal stress in the finished part.

[0050] In another embodiment of the present invention, the first ceramic layer 141b and / or the second ceramic layer 142b of the first connecting portion 141 and / or the second connecting portion 142 of the multilayer ceramic electronic component 100 according to the present invention may contain ceramic components with a different composition from that of the dielectric layer 111 of the multilayer body 120. The first and second extraction electrodes 142a and 142a of the first and second connecting portions 141 and 142 are connected to the first internal electrode 121 and the second internal electrode 122, respectively. Meanwhile, the first ceramic layer 141b and the second ceramic layer 142b of the first and second connecting portions 141 and 142 do not contribute to capacitance formation and only function to block external physical or chemical stress. Therefore, the components of the first ceramic layer 141b and / or the second ceramic layer 142b can be adjusted to adjust the density, average grain size, etc., thereby effectively preventing moisture penetration. When the first ceramic layer 141b and / or the second ceramic layer 142b contain ceramic components with a composition different from that of the dielectric layer 111 of the laminate 120, the presence or absence and content of components such as Na, Li, B and / or Mg can be adjusted, but this is merely an example and is not limited thereto.

[0051] The method for manufacturing the multilayer ceramic electronic component according to the present invention is not particularly limited, and may be, for example, by forming the first margin portion 131 on the third surface (S3) of the laminate 120, forming the second margin portion 142 on the fourth surface (S4), and then forming the first connecting portion 141 and the second connecting portion 142. The first connecting portion 141 and the second connecting portion 142 may be formed by applying and drying a conductive paste to both surfaces of the ceramic body 110 in the first direction (X direction) to form the first extraction electrode 141a and the second extraction electrode 142a, applying and drying a conductive paste to form the first ceramic layer 141b and the second ceramic layer 142b on the dried conductive paste, and then sintering the applied conductive paste. Alternatively, the method may be by transferring a ceramic sheet to form the first ceramic layer 141b and the second ceramic layer 142b on the dried conductive paste, and then sintering the applied conductive paste. Alternatively, to manufacture the first connecting part 141 and the second connecting part 142, lead electrodes may be printed on a ceramic sheet, and then the lead electrodes may be attached to both sides of the ceramic body 110 in the first direction (X direction) and sintered. In this manner, the multilayer ceramic electronic component 100 according to the present invention can be manufactured by a single sintering process after forming the first connecting part 141 and the second connecting part 142 on the ceramic body 110, and thus a separate firing process for forming external electrodes is not required, which may simplify the process.

[0052] According to one modified example of the present invention, the first connecting unit 141 of the multilayer ceramic electronic component 100 may include a first auxiliary electrode 141c arranged in contact with the first extension electrode 141a', and the second connecting unit 142 may include a second auxiliary electrode 142c arranged in contact with the second extension electrode 142a'. In this case, the first auxiliary electrode 141c may be extended together with the first extension electrode 141a', and the second auxiliary electrode 142c may be extended together with the second extension electrode 142a'. FIG. 7b is an enlarged view showing the first connecting unit 141 of this modified example. The details shown in FIG. 7b can also be applied to the second connecting unit 142. Referring to FIG. 7b, the first auxiliary electrode 141c may be arranged in contact with the first extension electrode 141a', and a first ceramic layer 141b' may be arranged to cover the first extension electrode 141a' and the first auxiliary electrode 141c. When an auxiliary electrode is arranged as shown in FIG. 7b, the electrical characteristics can be improved by increasing the contact area with the external plating layer, which will be described later, in proportion to the size of the auxiliary electrode.

[0053] The method for forming the auxiliary electrode is not particularly limited, but may be, for example, a method in which a step is formed on the lower end sides of the first ceramic layer 141b and the second ceramic layer 142b and a lead electrode paste is applied to the step. Furthermore, an example of a method for forming the auxiliary electrode may be, but is not limited to, a method in which the first ceramic layer 141b and the second ceramic layer 142b are printed in a two-layer structure, a conductive paste is applied to one of the layers, the paste is dried, and then the paste is attached to the laminate.

[0054] According to another modified embodiment of the present invention, the multilayer ceramic electronic component 100 may include a first terminal electrode 151a connected to the first extension electrode 141a and a second terminal electrode 152a connected to the second extension electrode 142a. The first terminal electrode 151a and the second terminal electrode 152a may be spaced apart from each other on the surface from which the first extension electrode 141a and the second extension electrode 142a are extended. FIG. 8a is an enlarged view of a first connection part 141 according to this modified embodiment. The same applies to the second connection part 142. Referring to FIG. 8a, a first terminal electrode 151a connected to the first extension electrode 141a is disposed, and an external plating layer, which will be described later, may be disposed on the first terminal electrode 151aa. When the terminal electrodes are disposed as shown in FIG. 8a, the external plating layer may be large, resulting in excellent adhesion when mounted on a substrate.

[0055] The terminal electrodes may be formed, for example, by applying a terminal electrode paste onto the lead-out portions of the first lead-out electrode 141a and the second lead-out electrode 142a, or by applying a terminal electrode paste or powder onto the first lead-out electrode 141a and the second lead-out electrode 142a of the sintered ceramic body 110 and firing the resultant by a method such as induction heating, but are not limited thereto.

[0056] According to yet another modified example of the present invention, the first connecting portion 141 of the multilayer ceramic electronic component 100 may include a first auxiliary electrode 141c disposed in contact with the first extension electrode 141a', and the second connecting portion 142 may include a second auxiliary electrode 142c disposed in contact with the second extension electrode 142a', a first terminal electrode 151a connected to the first extension electrode 141a', and a second terminal electrode 152a connected to the second extension electrode 142a'. In this case, the first terminal electrode 151a and the second terminal electrode 152a may be spaced apart from each other on a surface from which the first extension electrode 141a' and the second extension electrode 142a' are extended. FIG. 8B is an enlarged view of the first connecting portion 141 of this modified example. The content illustrated in FIG. 8B can also be applied to the second connecting portion 142. 8b, the first connecting portion 141 includes a first auxiliary electrode 141c disposed in contact with the first extension electrode 141a', and the first extension electrode 141a' and the first auxiliary electrode 141c may be extended to the same surface of the multilayer ceramic electronic component 100. A first terminal electrode 151a may be disposed to cover the first extension electrode 141a' and the first auxiliary electrode 141c. When the auxiliary electrode and the terminal electrode are disposed together as in FIG. 7b, electrical characteristics and board mountability may be improved.

[0057] In one example, a multilayer ceramic electronic component 100 according to the present invention may include a first plating layer 151 disposed on the first extension electrode 141a and a second plating layer 152 disposed on the second extension electrode 142a. FIGS. 1, 2, and 7a-8b show a multilayer ceramic electronic component 100 according to this example. In the multilayer ceramic electronic component 100 according to the above example, the first connecting portion 141 and the second connecting portion 142 may have the same structure so as to be symmetrical to each other. Referring to FIGS. 1, 2, and 7a-8b, the first plating layer 151 may be disposed on the first extension electrode 141a. In this case, if a first auxiliary electrode 141c or a first terminal electrode 151a is formed, the first plating layers 151, 151b may be disposed to cover the first extension electrode 141a, the first auxiliary electrode, and / or the first terminal electrode. The plating layer may include, but is not limited to, one or more selected from the group consisting of copper (Cu), nickel (Ni), tin (Sn), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), and alloys thereof. The plating layer may be formed in a single layer or multiple layers and may be formed by sputtering or electroplating (electrodeposition), but is not limited to these.

[0058] In one modified embodiment of the present invention, the multilayer ceramic electronic component 100 according to the present invention may include a first connection electrode 141d arranged to cover at least a portion of the first extraction electrode 141a' and the second extraction electrode 142a' in a first direction (X direction), the first connection electrode 141d arranged to cover at least a portion of the first extraction electrode 141a' and the first ceramic layer 141b', and a second connection electrode 142d arranged to cover the second extraction electrode 142b' and the second ceramic layer 142b'. FIG. 9 is a diagram showing a first connection part 141 according to this modified embodiment. The content shown in FIG. 9 can also be applied to the second connection part 142. Referring to FIG. 9, a portion of the first ceramic layer 141a' is removed, and the first extraction electrode 141a may be exposed in the first direction (X direction) at a position where the first ceramic layer 141a' was removed. In this modified embodiment, the first connection electrode 141d may be disposed so as to completely cover the exposed first extraction electrode 141a' and the first ceramic layer 141b' from which the partial region has been removed. When the multilayer ceramic electronic component 100 has the configuration shown in FIG. 9, the multilayer ceramic electronic component 100 according to the present invention can also be applied to a structure that requires side mounting.

[0059] The first connection electrode 141d and the second connection electrode 142d may be formed before or after sintering the ceramic body 110. A method for forming the connection electrodes before sintering the ceramic body 110 includes, but is not limited to, a method in which the first ceramic layer 141b and the second ceramic layer 142b are only partially formed on the first extraction electrode 141a and the second extraction electrode 142a and then sintered. A method for forming the connection electrodes after sintering the ceramic body 110 includes, but is not limited to, a method in which a high-carbon binder material is applied to a portion of the first ceramic layer 141b and the second ceramic layer 142b so that it is naturally removed during the sintering process, and then the connection electrodes are formed on the exposed extraction electrodes.

[0060] According to another embodiment of the present invention, the first and second extraction electrodes 241a and 242a of the multilayer ceramic electronic component 200 of the present invention may be extended to both surfaces of the ceramic body 210 in the third direction (Z direction). FIGS. 10 to 15 are diagrams schematically illustrating a multilayer ceramic electronic component 200 according to this embodiment. Referring to FIGS. 10 to 15, the multilayer ceramic electronic component 200 according to this embodiment has a first margin portion 231 and a second margin portion 232 disposed on both surfaces in the second direction (Y direction) of a laminate 220. A first connecting portion 241 and a second connecting portion 242 are disposed on both surfaces in the first direction (X direction) of the laminate 220. Here, the first connecting portion 241 includes a first extraction electrode 241a and a first ceramic layer 241b, and the second connecting portion 242 includes a second extraction electrode 242a and a second ceramic layer 242b, and the first extraction electrode 241a and the second extraction electrode 242a are extended to both surfaces in the third direction (Z direction). That is, the multilayer ceramic electronic component 200 according to this embodiment may have a structure in which lead electrodes of the same polarity are led out to two locations, or a structure in which lead electrodes are led out to a total of four locations.

[0061] In this embodiment, the maximum width (W4) of the first extraction electrode 241a and / or the second extraction electrode 242a of the multilayer ceramic electronic component 200 in the second direction (Y direction) may be smaller than the maximum width (W3) of the ceramic body 210 in the second direction (Y direction).

[0062] In one example, the maximum height (H4) of the first and second lead electrodes 241a and 242a in the third direction (Z direction) of the multilayer ceramic electronic component 200 according to the present invention may be the same as the maximum height (H3) of the ceramic body 210 in the third direction (Z direction). In this specification, "same" in length, width, and / or height is intended to include a margin of error. Here, the margin of error may be, but is not limited to, ±3 mm or less, ±2 mm or less, or ±1 mm or less. The maximum width (W4) of the first extraction electrode 241a and / or the second extraction electrode 242a in the second direction (Y direction), the maximum width (W3) of the ceramic body 210 in the second direction (Y direction), the maximum height (H4) of the first extraction electrode 241a and the second extraction electrode 242a in the third direction (Z direction), the maximum height (H3) of the ceramic body 210 in the third direction (Z direction), and the height (Z direction) and width (Y direction) of the first ceramic layer 241b and the second ceramic layer 242b in the third direction will not be described as they are the same as those described above.

[0063] The above-described modified embodiments can also be applied to this embodiment. Figures 13a to 15 are diagrams schematically illustrating modified embodiments of the first connecting portion 241. The shape and structure of the first connecting portion 241 illustrated in Figures 13a to 15 can be similarly applied to all four connecting portions of this embodiment. Referring to Figures 13a to 15, the first connecting portion 241 of the multilayer ceramic electronic component 200 according to this modified embodiment includes a first auxiliary electrode 241c arranged in contact with the first extension electrode 241a', and the second connecting portion 242 includes a second auxiliary electrode 242c arranged in contact with the second extension electrode 242a'.

[0064] According to another modified embodiment, the multilayer ceramic electronic component 200 of the present invention may include a first terminal electrode 251a connected to the first lead electrode 241a, and a second terminal electrode 252a connected to the second lead electrode 242a.

[0065] According to yet another modified embodiment of the present invention, the first connecting unit 241 of the multilayer ceramic electronic component 200 may include a first auxiliary electrode 241c arranged in contact with the first extension electrode 241a', the second connecting unit 242 may include a second auxiliary electrode 242c arranged in contact with the second extension electrode 242a', a first terminal electrode 251a connected to the first extension electrode 141a', and a second terminal electrode 252a connected to the second extension electrode 142a'. In this case, the first terminal electrode 251a and the second terminal electrode 252a may be arranged spaced apart from each other on a surface from which the first extension electrode 141a' and the second extension electrode 142a' are extended.

[0066] In yet another variant of the present invention, the multilayer ceramic electronic component 200 of the present invention may include a first connection electrode 241d arranged to cover the first extraction electrode 241a and the first ceramic layer 241b, and a second connection electrode 242d arranged to cover the second extraction electrode 242a and the second ceramic layer 242b, at least a portion of which is exposed in a first direction (X direction).

[0067] Furthermore, the multilayer ceramic electronic component 200 according to the present invention may include plating layers 251 and 252 disposed on the respective extraction electrodes. The extraction electrodes, ceramic layers, auxiliary electrodes, terminal electrodes, plating layers, and connection electrodes are the same as those described above and will not be described further.

[0068] In one example, the length of a multilayer ceramic electronic component 100 according to the present invention may be longer in a first direction (X direction) than in a second direction (Y direction). FIGS. 1 to 15 illustrate a multilayer ceramic electronic component 100 based on the structure of this example. The structure of the above example is a structure in which the length in the first direction (X direction) is longer than the width in the second direction (Y direction), and electrodes for connection to the outside are disposed at both ends in the first direction (X direction), which corresponds to a so-called MLCC structure. When a multilayer ceramic electronic component according to the present invention has the above structure, it is possible to maximize capacitance while improving moisture resistance reliability.

[0069] In another example of the present invention, the length of a multilayer ceramic electronic component 300 in the first direction (X direction) may be shorter than its width in the second direction (Y direction). FIGS. 16 to 23 are diagrams showing a multilayer ceramic electronic component 300 in accordance with this example. Referring to FIGS. 16 to 23, the multilayer ceramic electronic component 300 in accordance with this example may have a structure in which the length in the first direction (X direction) is shorter than its width in the second direction (Y direction). The first connecting portion 341 includes a first auxiliary electrode 341c arranged in contact with the first extension electrode 341a, and the second connecting portion 342 includes a second auxiliary electrode 342c arranged in contact with the second extension electrode 342a. This configuration corresponds to a so-called LICC structure, in which the distance between electrodes connected to the outside is relatively short. When a multilayer ceramic electronic component in accordance with the present invention has the above structure, a chip having excellent moisture resistance reliability and low ESL can be realized.

[0070] In this example, the maximum width (W6) of the first extraction electrode 341a and / or the second extraction electrode 342a of the multilayer ceramic electronic component 300 in the second direction (Y direction) may be smaller than the maximum width (W5) of the ceramic body 310 in the second direction (Y direction).

[0071] In one example, the maximum height (H6) of the first extension electrode 341a and / or the second extension electrode 342a in the third direction (Z direction) according to the present invention may be smaller than the maximum height (H5) of the ceramic body 310 in the third direction (Z direction). When the maximum height (H6) of the first extension electrode 341a and / or the second extension electrode 342a in the third direction (Z direction) is smaller than the maximum height (H5) of the ceramic body 310 in the third direction (Z direction), the first extension electrode 341a and / or the second extension electrode 342a are exposed only on one surface in the third direction (Z direction) of the multilayer ceramic electronic component 300 according to the present invention, thereby reducing the possibility of moisture penetration.

[0072] The maximum width (W6) of the first extraction electrode 341a and / or the second extraction electrode 342a in the second direction (Y direction), the maximum width (W5) of the ceramic body 310 in the second direction (Y direction), the maximum height (H6) of the first extraction electrode 341a and the second extraction electrode 342a in the third direction (Z direction), the maximum height (H5) of the ceramic body 210 in the third direction (Z direction), the height (Z direction) and width (Y direction) of the first ceramic layer 341b and the second ceramic layer 342b in the third direction, etc. will not be described as they have been described above.

[0073] In the above example, the multilayer ceramic electronic component 300 of the present invention may include a first terminal electrode 351a connected to the first extension electrode 341a, and may also include a second terminal electrode 352a connected to the second extension electrode 342a.

[0074] According to a modified example of the above example, the first connecting portion 341 of the multilayer ceramic electronic component 300 of the present invention may include a first auxiliary electrode 341c arranged in contact with the first extension electrode 341a, the second connecting portion 342 may include a second auxiliary electrode 342c arranged in contact with the second extension electrode 342a, a first terminal electrode 351a connected to the first extension electrode 341a, and a second terminal electrode 352a connected to the second extension electrode 342a. In this case, the first terminal electrode 351a and the second terminal electrode 352a may be arranged spaced apart from each other on a surface from which the first extension electrode 341a and the second extension electrode 342a are extended.

[0075] In yet another variation of the above example, the multilayer ceramic electronic component 300 of the present invention may include a first connection electrode 341d arranged to cover the first extraction electrode 341a and the first ceramic layer 341b, and a second connection electrode 342d arranged to cover the second extraction electrode 342a and the second ceramic layer 342b, with at least a portion of the first extraction electrode 341a and the second extraction electrode 342a exposed in a first direction (X direction).

[0076] Furthermore, the multilayer ceramic electronic component 300 according to the present invention may include plating layers 351, 352, 351b, and 352b disposed on the respective extraction electrodes. The extraction electrodes, ceramic layers, auxiliary electrodes, terminal electrodes, plating layers, and connection electrodes are the same as those described above and will not be described further.

[0077] In another modified embodiment of this example, the first extraction electrode 441a and the second extraction electrode 442a of the multilayer ceramic electronic component 400 of the present invention may be extracted to both sides of the ceramic body 410 in the third direction (Z direction). Figures 24 to 29 are diagrams schematically showing a multilayer ceramic electronic component 400 according to this example. Referring to Figures 24 to 29, in the multilayer ceramic electronic component 400 according to this embodiment, a first margin portion 431 and a second margin portion 432 are respectively arranged on both sides in the second direction (Y direction) of the ceramic body 410, and a first connecting portion 441 and a second connecting portion 442 are arranged on both sides in the first direction (X direction). Here, the first connecting portion 441 includes a first extraction electrode 441a and a first ceramic layer 441b, and the second connecting portion 441 includes a second extraction electrode 442a and a second ceramic layer 442b, and the first extraction electrode 441a and the second extraction electrode 442a may be extracted to both sides in the third direction (Z direction), respectively.

[0078] In this example, the maximum width (W8) of the first extraction electrode 441a and / or the second extraction electrode 442a of the multilayer ceramic electronic component 400 in the second direction (Y direction) may be smaller than the maximum width (W7) of the ceramic body 410 in the second direction (Y direction).

[0079] In one example, the maximum height (H8) of the first and second extension electrodes 441a and 442a in the third direction (Z direction) of the multilayer ceramic electronic component 400 according to the present invention may be the same as the maximum height (H7) of the ceramic body 410 in the third direction (Z direction). Descriptions of the maximum width (W8) of the first and / or second extension electrodes 441a and 442a in the second direction (Y direction), the maximum width (W7) of the ceramic body 410 in the second direction (Y direction), the maximum height (H8) of the first and second extension electrodes 441a and 442a in the third direction (Z direction), the maximum height (H7) of the ceramic body 410 in the third direction (Z direction), and the height (Z direction) and width (Y direction) of the first and second ceramic layers 441b and 442b in the third direction and the second direction are omitted here as they have been described above.

[0080] The above-described modified embodiments can also be applied to this embodiment. Figures 27a to 29 are diagrams schematically illustrating modified embodiments of the first connecting portion 441. The shape and structure of the first connecting portion 441 illustrated in Figures 27a to 29 can be applied to all four connecting portions of this embodiment. Referring to Figures 27a to 29, the first connecting portion 441 of the multilayer ceramic electronic component 400 according to this modified embodiment can include a first auxiliary electrode 441c arranged in contact with the first extension electrode 441a, or a first terminal electrode 451a connected to the first extension electrode 441a, or both the first auxiliary electrode 441c and the first terminal electrode 451a.

[0081] Furthermore, the multilayer ceramic electronic component 400 may include a first connection electrode 451d arranged to cover the first extraction electrode 441a and the first ceramic layer 441b, and a second connection electrode 452d arranged to cover the second extraction electrode 442a and the second ceramic layer 442b, with at least a portion of the first extraction electrode 441a and the second extraction electrode 442a exposed in the first direction (X direction).

[0082] In addition, the multilayer ceramic electronic component 400 according to the present invention may include a plating layer disposed on each of the extraction electrodes. The extraction electrodes, ceramic layers, auxiliary electrodes, terminal electrodes, plating layers, and connection electrodes are the same as those described above, and therefore will not be described further.

[0083] According to yet another embodiment of the present invention, a multilayer ceramic electronic component 500 according to the present invention may have first internal electrodes 521 and second internal electrodes 522 stacked in the second direction (Y direction). FIGS. 30 to 37 are views showing a multilayer ceramic electronic component 500 according to this embodiment. Referring to FIGS. 30 to 37, a first margin portion 531 and a second margin portion 532 may be arranged on both surfaces of a laminate 520 of the multilayer ceramic electronic component 500 in the third direction (Z direction), and the laminate 520 may have dielectric layers and first and second internal electrodes 521, 522 sequentially stacked in the second direction (Y direction). A first connecting portion 541 and a second connecting portion 542 may be arranged on both surfaces of the ceramic body 510 in the first direction (X direction). The first connection part 541 may include a first extension electrode 541a and a first ceramic layer 541b, and the second connection part 542 may include a second extension electrode 542a and a second ceramic layer 542b. In this case, the first extension electrode 541a and the second extension electrode 542a may be extended to one side in a third direction (Z direction).

[0084] In this embodiment, the maximum width (W10) of the first extraction electrode 541a and / or the second extraction electrode 542a of the multilayer ceramic electronic component 500 in the second direction (Y direction) may be smaller than the maximum width (W9) of the ceramic body 510 in the second direction (Y direction).

[0085] In one example, the maximum height (H10) of the first extension electrode 541a and / or the second extension electrode 542a in the third direction (Z direction) according to the present invention may be smaller than the maximum height (H9) of the ceramic body 510 in the third direction (Z direction). When the maximum height (H10) of the first extension electrode 541a and / or the second extension electrode 542a in the third direction (Z direction) is smaller than the maximum height (H9) of the ceramic body 510 in the third direction (Z direction), the first extension electrode 541a and / or the second extension electrode 542a are exposed only on one surface in the third direction (Z direction) of the multilayer ceramic electronic component 500 according to the present invention, thereby reducing the possibility of moisture penetration.

[0086] The maximum width (W10) of the first extension electrode 541a and / or the second extension electrode 542a in the second direction (Y direction), the maximum width (W9) of the ceramic body 510 in the second direction (Y direction), the maximum height (H10) of the first extension electrode 541a and the second extension electrode 542a in the third direction (Z direction), the maximum height (H9) of the ceramic body 510 in the third direction (Z direction), the height (Z direction) and width (Y direction) of the first ceramic layer 541b and the second ceramic layer 542b in the third direction, etc. will not be described as they have been described above.

[0087] The above-described modified embodiments can also be applied to the above-described embodiment. The above-described modified embodiments can also be applied to the present embodiment. FIGS. 35a to 37 are diagrams schematically illustrating modified embodiments of a first connecting portion 541. The shape and structure of the first connecting portion 541 illustrated in FIGS. 35a to 37 can also be applied to the second connecting portion 542. Referring to FIGS. 35a to 37, the first connecting portion 541 of the multilayer ceramic electronic component 500 according to this modified embodiment can include a first auxiliary electrode 541c arranged in contact with the first extension electrode 541a, a first terminal electrode 551a connected to the first extension electrode 541a, or both the first auxiliary electrode 541c and the first terminal electrode 551a.

[0088] Furthermore, the multilayer ceramic electronic component 500 may include a first connection electrode 541d arranged to cover the first extraction electrode 541a and the first ceramic layer 541b, and a second connection electrode 542d arranged to cover the second extraction electrode 542a and the second ceramic layer 542b, with at least a portion of the first extraction electrode 541a and the second extraction electrode 542a exposed in the first direction (X direction).

[0089] In addition, the multilayer ceramic electronic component 500 according to the present invention may include a plating layer disposed on each of the extraction electrodes. The extraction electrodes, ceramic layers, auxiliary electrodes, terminal electrodes, plating layers, and connection electrodes are the same as those described above, and therefore will not be described further.

[0090] In another variation of this example, the first extraction electrode 641a and the second extraction electrode 642a of the multilayer ceramic electronic component 600 of the present invention may be extracted to both sides in the third direction (Z direction) of the ceramic body 610. Figures 38 to 43 are drawings that schematically show the multilayer ceramic electronic component 600 according to this example. With reference to Figures 38 to 43, the multilayer ceramic electronic component 600 according to this embodiment has a first margin portion 631 and a second margin portion 632 arranged on both sides in the third direction (Z direction) of the laminate 620, and a first connecting portion 641 and a second connecting portion 642 arranged on both sides in the first direction (X direction). Here, the first connecting portion 641 includes a first extraction electrode 641a and a first ceramic layer 641b, and the second connecting portion 642 includes a second extraction electrode 642a and a second ceramic layer 642b, and the first extraction electrode 641a and the second extraction electrode 642a may be extracted to both sides in the third direction (Z direction), respectively.

[0091] In this example, the maximum width (W12) of the first extraction electrode 641a and / or the second extraction electrode 642a of the multilayer ceramic electronic component 600 in the second direction (Y direction) may be smaller than the maximum width (W11) of the ceramic body 610 in the second direction (Y direction).

[0092] In one example, the maximum height (H12) of the first and second lead electrodes 641a and 642a in the third direction (Z direction) of the multilayer ceramic electronic component 600 according to the present invention may be the same as the maximum height (H11) of the ceramic body 610 in the third direction (Z direction). In this specification, "same" in length, width, and / or height is intended to include a margin of error. Here, the margin of error may be, but is not limited to, ±3 mm or less, ±2 mm or less, or ±1 mm or less. The maximum width (W12) of the first extension electrode 641a and / or the second extension electrode 642a in the second direction (Y direction), the maximum width (W11) of the ceramic body 610 in the second direction (Y direction), the maximum height (H12) of the first extension electrode 641a and the second extension electrode 642a in the third direction (Z direction), the maximum height (H11) of the ceramic body 610 in the third direction (Z direction), the height (Z direction) and width (Y direction) of the first ceramic layer 641b and the second ceramic layer 642b in the third direction, etc. are as described above and will not be described further.

[0093] The above-described modified embodiments can also be applied to this embodiment. Figures 41a to 43 are diagrams schematically illustrating modified embodiments of a first connecting portion 641. The shape and structure of the first connecting portion 641 illustrated in Figures 41a to 43 can be applied to all four connecting portions of this embodiment. Referring to Figures 41a to 43, the first connecting portion 641 of the multilayer ceramic electronic component 600 according to this modified embodiment can include a first auxiliary electrode 641c arranged in contact with the first extension electrode 641a, or a first terminal electrode 651a connected to the first extension electrode 641a, or both the first auxiliary electrode 641c and the first terminal electrode 651a.

[0094] In addition, the multilayer ceramic electronic component 600 may include a first connection electrode 641d arranged to cover the first extension electrode 641a and the first ceramic layer 641b, and a second connection electrode 642d arranged to cover the second extension electrode 642a and the second ceramic layer 642b, with at least a portion of the first extension electrode 641a and the second extension electrode 642a being exposed in a first direction (X direction). The multilayer ceramic electronic component 600 according to the present invention may also include plating layers 651, 652, 651b, and 652b arranged on each extension electrode. The description of the extension electrodes, ceramic layers, auxiliary electrodes, terminal electrodes, plating layers, and connection electrodes is omitted as they have been described above.

[0095] In one example, a multilayer ceramic electronic component 600 according to the present invention may have a length in a first direction (X direction) longer than a width in a second direction (Y direction). Figures 30 to 43 show multilayer ceramic electronic components 600 based on the structure of this example. The structure of the above example is a structure in which the length in the first direction (X direction) is longer than the width in the second direction (Y direction), and electrodes for connection to the outside are disposed at both ends in the first direction (X direction), which corresponds to a so-called MLCC structure.

[0096] In another example of the present invention, the length of a multilayer ceramic electronic component 700 according to the present invention in the first direction (X direction) may be shorter than its width in the second direction (Y direction). FIGS. 44 to 57 are diagrams showing a multilayer ceramic electronic component 700 according to this example. Referring to FIGS. 43 to 57, the multilayer ceramic electronic component 700 of this example may have a structure in which the length in the first direction (X direction) is shorter than its width in the second direction (Y direction), and the first connecting portion 741 may include a first auxiliary electrode 741c arranged in contact with the first extension electrode 741a, and the second connecting portion 742 may include a second auxiliary electrode 742c arranged in contact with the second extension electrode 742a. This type of structure has a relatively short distance between electrodes connected to the outside, and corresponds to a so-called LICC structure.

[0097] In this example, the maximum width (W14) of the first extraction electrode 741a and / or the second extraction electrode 742a of the multilayer ceramic electronic component 700 in the second direction (Y direction) may be smaller than the maximum width (W13) of the ceramic body 710 in the second direction (Y direction).

[0098] In one example, the maximum height (H14) of the first extension electrode 741a and / or the second extension electrode 742a in the third direction (Z direction) according to the present invention may be smaller than the maximum height (H13) of the ceramic body 710 in the third direction (Z direction). When the maximum height (H14) of the first extension electrode 741a and / or the second extension electrode 742a in the third direction (Z direction) is smaller than the maximum height (H13) of the ceramic body 710 in the third direction (Z direction), the first extension electrode 741a and / or the second extension electrode 742a are exposed only on one surface in the third direction (Z direction) of the multilayer ceramic electronic component 700 according to the present invention, thereby reducing the possibility of moisture penetration.

[0099] The maximum width (W14) of the first extension electrode 741a and / or the second extension electrode 742a in the second direction (Y direction), the maximum width (W13) of the ceramic body 710 in the second direction (Y direction), the maximum height (H14) of the first extension electrode 741a and the second extension electrode 742a in the third direction (Z direction), the maximum height (H13) of the ceramic body 710 in the third direction (Z direction), the height (Z direction) and width (Y direction) of the first ceramic layer 741b and the second ceramic layer 742b in the third direction, etc. will not be described as they have been described above.

[0100] In the above example, the multilayer ceramic electronic component 700 of the present invention may include a first terminal electrode 751a connected to the first extension electrode 741a, and may also include a second terminal electrode 752a connected to the second extension electrode 742a.

[0101] According to a modified example of the above example, the first connecting portion 741 of the multilayer ceramic electronic component 700 of the present invention may include a first auxiliary electrode 741c arranged in contact with the first extension electrode 741a, the second connecting portion 742 may include a second auxiliary electrode 742c arranged in contact with the second extension electrode 742a, a first terminal electrode 751a connected to the first extension electrode 741a, and a second terminal electrode 752a connected to the second extension electrode 742a. In this case, the first terminal electrode 751a and the second terminal electrode 752a may be arranged spaced apart from each other on a surface from which the first extension electrode 741a and the second extension electrode 742a are extended.

[0102] In another variation of the above example, the multilayer ceramic electronic component 700 of the present invention may include a first terminal electrode 751a arranged to cover the first extraction electrode 741a and the first ceramic layer 741b, at least a portion of which is exposed in a first direction (X direction), and a second terminal electrode 752a arranged to cover the second extraction electrode 742a and the second ceramic layer 742b.

[0103] In addition, the multilayer ceramic electronic component 700 according to the present invention may include a plating layer disposed on each of the lead electrodes. The lead electrodes, ceramic layers, auxiliary electrodes, terminal electrodes, and plating layers are the same as those described above, and therefore will not be described further.

[0104] In another modified embodiment of this example, the first extraction electrode 841a and the second extraction electrode 842a of the multilayer ceramic electronic component 800 of the present invention may be extracted to both sides in the third direction (Z direction) of the ceramic body 810. Figures 52 to 57 are drawings that schematically show the multilayer ceramic electronic component 800 according to this example. With reference to Figures 52 to 57, in the multilayer ceramic electronic component 800 according to this embodiment, the first margin portion 831 and the second margin portion 832 are respectively arranged on both sides in the third direction (Z direction) of the ceramic body 810, and the first connecting portion 841 and the second connecting portion 842 are arranged on both sides in the first direction (X direction). Here, the first connecting portion 841 includes a first extraction electrode 841a and a first ceramic layer 841b, and the second connecting portion 842 includes a second extraction electrode 842a and a second ceramic layer 842b, and the first extraction electrode 841a and the second extraction electrode 842a may be extracted to both sides in the third direction (Z direction).

[0105] In this example, the maximum width (W16) of the first extraction electrode 841a and / or the second extraction electrode 842a of the multilayer ceramic electronic component 800 in the second direction (Y direction) may be smaller than the maximum width (W15) of the ceramic body 810 in the second direction (Y direction).

[0106] In one example, the maximum height (H16) of the first and second lead electrodes 841a and 842a in the third direction (Z direction) of the multilayer ceramic electronic component 800 according to the present invention may be the same as the maximum height (H15) of the ceramic body 810 in the third direction (Z direction). In this specification, "same" in length, width, and / or height is assumed to include a margin of error. Here, the margin of error may mean, but is not limited to, ±3 mm or less, ±2 mm or less, or ±1 mm or less. The maximum width (W16) of the first extraction electrode 841a and / or the second extraction electrode 842a in the second direction (Y direction), the maximum width (W15) of the ceramic body 810 in the second direction (Y direction), the maximum height (H16) of the first extraction electrode 841a and the second extraction electrode 842a in the third direction (Z direction), the maximum height (H15) of the ceramic body 810 in the third direction (Z direction), and the height (Z direction) and width (Y direction) of the first ceramic layer 841b and the second ceramic layer 842b in the third direction will be omitted as they are as described above.

[0107] The above-described modified embodiments can also be applied to this embodiment. Figures 55a to 57 are diagrams schematically illustrating modified embodiments of first connecting portion 841. The shapes and structures of first connecting portion 841 shown in Figures 55a to 57 can be applied to all four connecting portions of this embodiment. Referring to Figures 55a to 57, first connecting portion 841 of multilayer ceramic electronic component 800 according to this modified embodiment can include a first auxiliary electrode arranged in contact with first extension electrode 841a, a first terminal electrode connected to first extension electrode 841a, or both the first auxiliary electrode and the first terminal electrode.

[0108] In addition, the multilayer ceramic electronic component 800 may include a first terminal electrode disposed to cover the first extension electrode 841a and the first ceramic layer, and a second terminal electrode disposed to cover the second extension electrode 842a and the second ceramic layer, with at least a portion of the first extension electrode 841a and the second extension electrode 842a being exposed in a first direction (X direction). The multilayer ceramic electronic component 800 according to the present invention may also include a plating layer disposed on each extension electrode. The description of the extension electrode, ceramic layer, auxiliary electrode, terminal electrode, and plating layer is omitted as they have been described above.

[0109] 58 shows the results of a moisture resistance test of a multilayer ceramic electronic component according to the present invention and a component with a conventional MLCC structure. The moisture resistance was evaluated by measuring the weight change rate, which was defined as the moisture absorption rate, after 300 minutes or more in an environment at a temperature of 85°C and a relative humidity of 85%. The comparative example used a mass-produced 1005-size chip from Samsung Electro-Mechanics with external electrodes formed on the longitudinal surfaces of the ceramic body (temperature characteristics X7R and capacitance 220.0 nF). The embodiment used a prototype chip manufactured by forming first and second connectors without external electrodes on the ceramic body of the 1005-size chip and sintering it once.

[0110] 58, the moisture absorption rate of the component of the comparative example was 0.013 wt%, but that of the multilayer ceramic electronic component of the present invention was 0.004 wt%, which is less than one-third of the previous rate. This demonstrates that the moisture resistance of the multilayer ceramic electronic component of the present invention has been significantly improved. [Explanation of symbols]

[0111] 100: Multilayer ceramic electronic components (100) 110: Ceramic body (110) 111: Dielectric layer 121, 122: First and second internal electrodes 131: First margin 132: Second margin 141, 142: First and second connecting parts

Claims

1. a ceramic body including a laminate including first and second surfaces facing each other in a first direction, third and fourth surfaces facing each other in the second direction, and fifth and sixth surfaces facing each other in the third direction, the laminate including dielectric layers and first internal electrodes and second internal electrodes arranged alternately with the dielectric layers sandwiched therebetween, a first margin portion arranged on the third surface of the laminate, and a second margin portion arranged on the fourth surface of the laminate; a first connecting portion disposed on a first surface of the laminate; and a second connecting portion disposed on a second surface of the laminate, the first connection part includes a first lead electrode connected to the first internal electrode and a first ceramic layer disposed on the first lead electrode; the second connection part includes a second lead electrode connected to the second internal electrode and a second ceramic layer disposed on the second lead electrode; the first and second extraction electrodes are extracted to one side of the first and second connection parts in a third direction, A multilayer ceramic electronic component, wherein the maximum height of the first lead electrode and / or the second lead electrode in the third direction is smaller than the maximum height of the ceramic body in the third direction.

2. the first ceramic layer is disposed so as to cover at least a portion of the first extraction electrode; The multilayer ceramic electronic component according to claim 1 , wherein the second ceramic layer is disposed so as to cover at least a portion of the second lead electrode.

3. the first ceramic layer is disposed so as to cover the first extraction electrode; The multilayer ceramic electronic component according to claim 1 , wherein the second ceramic layer is disposed so as to cover the second lead electrode.

4. The multilayer ceramic electronic component according to claim 1 , wherein the maximum width of the first lead electrode and / or the second lead electrode in the second direction is smaller than the maximum width of the ceramic body in the second direction.

5. The multilayer ceramic electronic component according to claim 2 , wherein the maximum width of the first lead electrode and / or the second lead electrode in the second direction is smaller than the maximum width of the ceramic body in the second direction.

6. 6. The multilayer ceramic electronic component according to claim 1, wherein the first internal electrodes and the second internal electrodes contain one or more conductive metals selected from the group consisting of silver (Ag), palladium (Pd), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

7. 7. The multilayer ceramic electronic component according to claim 1, wherein the first and second extraction electrodes contain one or more conductive metals selected from the group consisting of silver (Ag), palladium (Pd), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

8. 8. The multilayer ceramic electronic component according to claim 1, wherein the first internal electrode, the second internal electrode, the first extraction electrode, and the second extraction electrode contain one or more conductive metals selected from the group consisting of silver (Ag), palladium (Pd), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

9. The first ceramic layer and / or the second ceramic layer are (Ba １－ｘ Ca ｘ ) (Ti １－ｙ (Zr, Sn, Hf) ｙ ) O ３ 9. The multilayer ceramic electronic component according to claim 1, comprising a component expressed by the formula (where 0≦x≦1, 0≦y≦0.5).

10. the first connection portion includes a first auxiliary electrode disposed in contact with the first extraction electrode, the second connection portion includes a second auxiliary electrode disposed in contact with the second extraction electrode, the first auxiliary electrode is extracted together with the first extraction electrode, The multilayer ceramic electronic component according to claim 1 , wherein the second auxiliary electrode is led out together with the second lead electrode.

11. The first auxiliary electrode is disposed between the first extraction electrode and the first ceramic layer, contacts a part of the first extraction electrode, and is extracted together with the first extraction electrode; The multilayer ceramic electronic component according to claim 10 , wherein the second auxiliary electrode is disposed between the second lead electrode and the second ceramic layer, contacts a part of the second lead electrode, and is led out together with the second lead electrode.

12. A multilayer ceramic electronic component as described in Claim 11, further comprising a first terminal electrode arranged to cover the first extraction electrode and the first auxiliary electrode, and a second terminal electrode arranged to cover the second extraction electrode and the second auxiliary electrode.

13. the first terminal electrode is connected to the first lead electrode and the second terminal electrode is connected to the second lead electrode, 11 . The multilayer ceramic electronic component according to claim 1 , wherein the first terminal electrode and the second terminal electrode are arranged spaced apart from each other on a surface from which the first lead electrode and the second lead electrode are led out.

14. The semiconductor device further includes a first terminal electrode connected to the first lead electrode and a second terminal electrode connected to the second lead electrode, The multilayer ceramic electronic component according to claim 10 , wherein the first terminal electrode and the second terminal electrode are disposed spaced apart from each other on a surface from which the first lead electrode and the second lead electrode are led.

15. The semiconductor device further includes a first terminal electrode connected to the first lead electrode and a second terminal electrode connected to the second lead electrode, 6. The multilayer ceramic electronic component according to claim 5, wherein the first terminal electrode and the second terminal electrode are disposed spaced apart from each other on a surface from which the first lead electrode and the second lead electrode are led out.

16. a first plating layer disposed on the first extraction electrode; and The multilayer ceramic electronic component according to claim 1 , further comprising a second plating layer disposed on the second lead electrode.

17. a first plating layer disposed on the first extraction electrode; and The multilayer ceramic electronic component according to claim 15 , further comprising a second plating layer disposed on the second extraction electrode.

18. At least a portion of the first extraction electrode and the second extraction electrode is exposed in a first direction, a first connection electrode disposed to cover the first extraction electrode and the first ceramic layer; 2. The multilayer ceramic electronic component according to claim 1, further comprising a second connection electrode disposed so as to cover the second lead electrode and the second ceramic layer.

19. 2. The multilayer ceramic electronic component according to claim 1, wherein the length in the first direction is longer than the width in the second direction.

20. 2. The multilayer ceramic electronic component according to claim 1, wherein the length in the first direction is shorter than the width in the second direction.

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