Multilayer ceramic electronic components

Abstract

To provide a multilayer ceramic electronic component.SOLUTION: A multilayer ceramic electronic component according to one embodiment of the present invention includes a ceramic main body including a dielectric layer and first and second internal electrodes stacked on each other with the dielectric layer therebetween, a first external electrode connected to the first internal electrode of the ceramic main body, and a second external electrode connected to the second internal electrode. The first external electrode includes a first base electrode layer disposed in contact with the ceramic main body, a first glass layer disposed on the first base electrode layer, and a first resin electrode layer disposed on the first glass layer. The second external electrode includes a second base electrode layer disposed in contact with the ceramic main body, a second glass layer disposed on the second base electrode layer, and a second resin electrode layer disposed on the second glass layer.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a multilayer ceramic electronic component. [Background technology]

[0002] In recent years, with the trend toward miniaturization of electronic products, there has been a demand for multilayer ceramic electronic components to be smaller and have higher capacitance. To meet the demand for smaller and higher capacitance multilayer ceramic electronic components, the external electrodes of the multilayer ceramic electronic components are also becoming thinner.

[0003] In order to form the external electrodes, a conventional method is to prepare an external electrode paste by mixing a conductive metal with glass, a base resin, and an organic solvent, and then apply the external electrode paste to both end surfaces of the ceramic body. The ceramic body is then fired to sinter the metal in the external electrodes. The external electrode paste uses a conductive metal as a main material to ensure chip hermeticity and electrical connectivity with the chip, and uses glass as a secondary material to fill voids when the metal shrinks during sintering and to provide bonding strength between the external electrodes and the chip.

[0004] However, as multilayer ceramic electronic components become smaller and larger in capacity, the thickness of external electrodes is gradually decreasing, and when thin external electrodes are used, there are problems such as vulnerability to external moisture penetration, etc. Furthermore, multilayer ceramic electronic components using multilayer external electrodes have a structure that is vulnerable to external physical and chemical shocks, which is a major cause of deterioration in product quality due to reduced mechanical strength. Summary of the Invention [Problem to be solved by the invention]

[0005] One of the various objects of the present invention is to provide a multilayer ceramic electronic component with improved moisture resistance reliability.

[0006] One of the various objects of the present invention is to improve mechanical strength by increasing the bonding strength between external electrodes of a multi-layer structure even when the external electrodes are formed thin.

[0007] Another object of the present invention is to provide a multilayer ceramic electronic component that has a low ESR while preventing defects such as lifting between external electrodes and delamination. [Means for solving the problem]

[0008] A multilayer ceramic electronic component according to one embodiment of the present invention includes a ceramic body including a dielectric layer and first and second internal electrodes arranged to be stacked on top of each other with the dielectric layer sandwiched therebetween; a first external electrode connected to the first internal electrode of the ceramic body; and a second external electrode connected to the second internal electrode, wherein the first external electrode includes a first base electrode layer arranged in contact with the ceramic body, a first glass layer arranged on the first base electrode layer, and a first resin electrode layer arranged on the first glass layer, and the second external electrode includes a second base electrode layer arranged in contact with the ceramic body, a second glass layer arranged on the second base electrode layer, and a second resin electrode layer arranged on the second glass layer. [Effects of the Invention]

[0009] One of the various effects of the present invention is that it can improve the moisture resistance reliability of multilayer ceramic electronic components.

[0010] One of the various advantages of the present invention is that the mechanical strength of the multilayer ceramic electronic component is improved by increasing the bonding strength between the external electrodes while forming the external electrodes thin.

[0011] One of the various effects of the present invention is to provide a multilayer ceramic electronic component that achieves low ESR while preventing the floating phenomenon between external electrodes and delamination.

[0012] However, the various beneficial advantages and effects of the present invention are not limited to the above, and will be more easily understood in the course of describing specific embodiments of the present invention. [Brief explanation of the drawings]

[0013] [Figure 1] 1 is a perspective view schematically showing a multilayer ceramic electronic component according to one embodiment of the present invention. [Figure 2] FIG. 2 is a perspective view schematically illustrating the ceramic body of FIG. [Figure 3] FIG. 2 is a cross-sectional view taken along line II' of FIG. [Figure 4] FIG. 4 is an enlarged view of region A in FIG. [Figure 5] FIG. 5 is an enlarged view of region B in FIG. [Figure 6] 1 is an SEM image of the surface of the conductive glass according to the present invention. [Figure 7] 1 is a SEM image of a cross section of an external electrode according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0014] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. This is not intended to limit the technology described in this specification to specific embodiments, but should be understood to include various modifications, equivalents, and / or alternatives of the embodiments of the present invention. Similar reference numerals are used for similar components in the description of the drawings.

[0015] In order to clearly explain the present invention, parts not relevant to the explanation are omitted in the drawings, thicknesses are enlarged to clearly show various layers and regions, and components having the same function within the same concept are described using the same reference symbols.

[0016] In this specification, the terms "have," "can have," "include," or "can include" refer to the presence of a given feature (e.g., a value, function, operation, or component such as a part) and do not exclude the presence of additional features.

[0017] As used herein, phrases such as "A or B," "at least one of A and / or B," or "one or more of A and / or B" may include all possible combinations of the listed items. For example, "A or B," "at least one of A and B," or "at least one of A or B" may refer to (1) at least one A, (2) at least one B, or (3) both at least one A and at least one B.

[0018] In the drawings, the X direction may be defined as the first direction, L direction or length direction, the Y direction may be defined as the second direction, W direction or width direction, and the Z direction may be defined as the third direction, T direction or thickness direction.

[0019] Hereinafter, a multilayer ceramic electronic component according to one embodiment of the present invention will be described in detail with reference to FIGS.

[0020] FIG. 1 is a perspective view schematically showing a multilayer ceramic electronic component 100 according to one embodiment of the present invention, FIG. 2 is a perspective view schematically showing the ceramic body of FIG. 1, FIG. 3 is a perspective view of II' in FIG. 1, FIG. 4 is an enlarged view of region A in FIG. 3, and FIG. 5 is an enlarged view of region B in FIG. 4. 1 to 5, a multilayer ceramic electronic component 100 according to an embodiment of the present invention includes a dielectric layer 111 and first and second internal electrodes 121 and 122 arranged to be stacked on top of each other in a third direction (Z direction) with the dielectric layer 111 sandwiched therebetween, and includes a ceramic body 110 having first and second surfaces S1 and S2 facing the first direction (X direction), third and fourth surfaces S3 and S4 facing the second direction (Y direction), and fifth and sixth surfaces S5 and S6 facing the third direction (Z direction), a first external electrode 131 arranged on the first surface S1 of the ceramic body 110 and connected to the first internal electrode 121, and a second external electrode 132 arranged on the second surface S2 of the ceramic body 110 and connected to the second internal electrode 122.

[0021] In this case, the first external electrode 131 may include a first base electrode layer 131a disposed in contact with the ceramic body 110, a first glass layer 131b disposed on the first base electrode layer 131a, and a first resin electrode layer 131c disposed on the first glass layer 131b. In addition, the second external electrode 132 may include a second base electrode layer 132a disposed in contact with the ceramic body 110, a second glass layer 132b disposed on the second base electrode layer 132a, and a second resin electrode layer 132c disposed on the second glass layer 132b.

[0022] In the multilayer ceramic electronic component 100 according to the present invention, the first glass layer 131b and the second glass layer 132b are disposed between the first base electrode layer 131a and the first resin electrode layer 131c and between the second base electrode layer 132a and the second resin electrode layer 132c, respectively, thereby improving the bonding strength between the base electrode layers and the resin electrode layers and thereby improving the mechanical strength of the multilayer ceramic electronic component 100. In addition, the first glass layer 131b and the second glass layer 132b can function as a moisture barrier layer, thereby improving the moisture resistance reliability of the multilayer ceramic electronic component 100. The improvement in bonding strength will be described in detail below.

[0023] The ceramic body 110 of the multilayer ceramic electronic component 100 according to the present invention may include a dielectric layer 111 and first and second internal electrodes 121, 122 arranged to be stacked in the third direction (Z direction) with the dielectric layer 111 sandwiched therebetween.

[0024] The specific shape of the ceramic body 110 is not particularly limited, but as shown in the drawing, the ceramic body 110 may have a hexahedral shape or a shape similar thereto. Due to shrinkage of the ceramic powder contained in the ceramic body 110 during the firing process, the ceramic body 110 may have a substantially hexahedral shape, but not a hexahedral shape with perfectly straight lines. The ceramic body 110 may be rounded, if necessary, to remove sharp corners. The rounding may be performed by, for example, barrel polishing, but is not limited thereto.

[0025] The ceramic body 110 may include dielectric layers 111, first internal electrodes 121, and second internal electrodes 122 stacked one on top of the other. The dielectric layers 111, the first internal electrodes 121, and the second internal electrodes 122 may be stacked in a third direction (Z direction). The plurality of dielectric layers 111 are in a fired state, and boundaries between adjacent dielectric layers 111 may be integrated to such an extent that they are difficult to identify without using a scanning electron microscope (SEM).

[0026] According to an embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as it can provide a sufficient capacitance. For example, a barium titanate-based material, a lead complex perovskite-based material, or a strontium titanate-based material may be used. 1-x Ca x )(Ti 1-y (Zr, Sn, Hf) y )O3 (where 0≦x≦1, 0≦y≦0.5), or the like, can be used. The material for forming the dielectric layer 111 can be a powder of barium titanate (BaTiO3) or the like, to which various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc. can be added according to the object of the present invention.

[0027] The dielectric layer 111 may be formed by adding additives as needed to a slurry containing the above-mentioned materials, coating the slurry on a carrier film, and drying the coating to prepare a plurality of ceramic sheets. The ceramic sheets may be formed by cutting the slurry into sheets having a thickness of several μm using a doctor blade method, but are not limited thereto.

[0028] The first and second internal electrodes 121 and 122 may be stacked such that their cross sections are exposed at opposite ends of the ceramic body 110. Specifically, the first and second internal electrodes 121 and 122 may be exposed at both surfaces of the ceramic body 110 in a first direction (X direction), and the first internal electrode 121 may be exposed in a first surface S1 direction of the ceramic body 110, and the second internal electrode 122 may be exposed in a second surface S2 direction.

[0029] The material for forming the first and second internal electrodes 121 and 122 is not particularly limited, and may be formed using a conductive paste containing one or more conductive metals, for example, silver (Ag), palladium (Pd), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0030] The ceramic body 110 may be formed by alternately stacking ceramic green sheets, each having a dielectric layer 111 on which a first internal electrode 121 is printed, and ceramic green sheets, each having a dielectric layer 111 on which a second internal electrode 122 is printed, in a third direction (Z direction). The first and second internal electrodes 121 and 122 may be printed by screen printing, gravure printing, or the like, but are not limited thereto.

[0031] In the multilayer ceramic electronic component 100 according to the present invention, a first external electrode 131 and a second external electrode 132 may be disposed on both surfaces of the ceramic body 110 in a first direction (X direction). The first external electrode 131 may be connected to the first internal electrode 121, and the second external electrode 132 may be connected to the second internal electrode 122. The first external electrode 131 and the second external electrode 132 may be disposed on a first surface S1 and a second surface S2 of the ceramic body 110, respectively. The first external electrode 131 may include a first base electrode layer 131a, a first glass layer 131b, and a first resin electrode layer 131c, and the second external electrode 132 may include a second base electrode layer 132a, a second glass layer 132b, and a second resin electrode layer 132c.

[0032] In one embodiment of the present invention, the first and second base electrode layers 131a and 132a connected to the first and second internal electrodes 121 and 122, respectively, of the multilayer ceramic electronic component 100 may be fired electrodes containing a first conductive metal. The first conductive metal included in the first base electrode layer 131a and the second base electrode layer 132a may be any of a variety of metals having excellent contact with the internal electrodes, such as one or more metal components selected from the group consisting of copper (Cu), nickel (Ni), tin (Sn), palladium (Pd), platinum (Pt), iron (Fe), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), and alloys thereof. When the first and second base electrode layers 131a and 132a are formed from fired electrodes containing the first conductive metal, as in this embodiment, connectivity with the internal electrodes can be improved, thereby enhancing the mechanical strength of the multilayer ceramic electronic component 100.

[0033] The method for forming the first base electrode 131 a and the second base electrode 132 a is not particularly limited, and may be, for example, by printing or applying a conductive paste containing a first conductive metal on the surface of the ceramic body 110 by screen printing or gravure printing, dipping the ceramic body 110 in the conductive paste, or transferring a dried film obtained by drying the conductive paste onto the ceramic body 110, but is not limited thereto.

[0034] In one embodiment of the present invention, the first and second glass layers disposed on the first and second base electrode layers 131a and 132a, respectively, may comprise conductive glass. The term "conductive glass" as used herein may refer to glass having electrical conductivity, e.g., 1×10 -13 S / cm or more, or 1×10 -9 It may refer to glass having an electrical conductivity of 5 S / cm or more. Examples of the conductive glass include, but are not limited to, ion-conductive glass, electron-conductive glass, and / or mixed-conductive glass.

[0035] In one embodiment of the present invention, the conductive glass used in the multilayer ceramic electronic component 100 of the present invention may include, for example, at least one selected from the group consisting of silicon (Si), boron (B), aluminum (Al), transition metals, alkali metals, alkaline earth metals, and oxides, nitrides, carbides, and carbonates thereof. The transition metal may be at least one selected from the group consisting of zinc (Zn), titanium (Ti), copper (Cu), vanadium (V), manganese (Mn), iron (Fe), and nickel (Ni). The alkali metal may be at least one selected from the group consisting of lithium (Li), sodium (Na), and potassium (K). The alkaline earth metal may be at least one selected from the group consisting of magnesium (Mg), calcium (Ca), strontium (Sr), and barium (Ba), but is not limited thereto.

[0036] The method for manufacturing the conductive glass is not particularly limited. FIG. 6 is an SEM image of the surface of the conductive glass used in the present invention. Referring to FIG. 6, the conductive glass of the multilayer ceramic electronic component according to the present invention may have a structure in which a metal is disposed on the surface of the glass particles. The method for manufacturing the conductive glass may include, but is not limited to, a method in which a metal layer is coated on the surface of the glass particles by reacting glass containing a metal component such as Ba, Ca, Zn, Al, B, Si, Li, or W with a component such as Cu or Ag that has a higher standard reduction potential than the metal component.

[0037] In one embodiment of the present invention, the first and second glass layers 131b and 132b of the multilayer ceramic electronic component 100 according to the present invention may be formed by coating a second conductive metal on the surface of a glass component. The second conductive metal may be dissolved from the conductive glass. The first and second glass layers 131b and 132b of the multilayer ceramic electronic component 100 according to the present invention may be formed by applying a paste containing the conductive glass to the first and second base electrode layers 131a and 132a, drying the paste, and then heat-treating the resulting paste. At this time, the solvent contained in the paste evaporates, and the conductive glass particles form a glass layer. During this process, some metal components, such as the second conductive metal contained in the conductive glass, may be dissolved out, and the dissolved metal components may form a metal coating layer on the first and second glass layers 131b and 132b. The metal coating layer may be irregularly arranged, and the metal coating layer may not necessarily be arranged to cover the entire surface of the first and second base electrode layers 131a and 132a. That is, the metal coating layers may be randomly disposed on the first and second base electrode layers 131a and 132a.

[0038] In one embodiment of the present invention, the second conductive metal applied to the first and second conductive layers 131b and 132b is not particularly limited as long as it has good compatibility with glass. Non-limiting examples of the second conductive metal include silver (Ag), platinum (Pt), gold (Au), tin (Sn), and / or iron (Fe), but are not limited thereto.

[0039] In another embodiment of the present invention, the average surface roughness (Ra) of the first glass layer 131b and the second glass layer 132b may be 0.1 μm or more. In this specification, the average surface roughness (Ra) of a surface may be measured using an optical surface profiler such as Zygo Corporation's 7300 Optical Surface Profiler or a surface roughness measuring instrument such as Mitutoyo's SV-3200. The upper limit of the average surface roughness (Ra) of the first glass layer 131b and the second glass layer 132b is not particularly limited, but may be, for example, 100 μm or less or 50 μm or less. When the average surface roughness (Ra) of the first glass layer 131b and the second glass layer 132b satisfies the above range, the bonding strength between the first and second base electrode layers 131a, 132a and the first and second resin electrode layers 131c, 132c may be improved. The surface roughness of the first and second glass layers 131b and 132b may be formed by the metal coating layer described above, and the surface roughness within the above range may be formed by controlling the amount of metal components dissolved by adjusting the heat treatment temperature during the formation of the first and second glass layers 131b and 132b.

[0040] In one example, the average thickness of the first glass layer 131b and the second glass layer 132b of the multilayer ceramic electronic component 100 according to the present invention may be 1 μm or more and / or 20 μm or less. The average thickness of the first glass layer 131b and the second glass layer 132b may be a value measured at the cross-sectional thickness of the center of both surfaces of the first and second external electrodes 131 and 132 in the first direction (X direction) of the multilayer ceramic electronic component 100 according to the present invention, and may refer to the arithmetic average of values measured at any five points within a 1 μm radius from the center of both surfaces of the first and second external electrodes 131 and 132 in the first direction (X direction). When the average thickness of the first glass layer 131b and the second glass layer 132b according to this example satisfies the above range, external electrodes having low ESR and excellent bonding strength can be formed.

[0041] In one embodiment of the present invention, the first and second glass layers 131b and 132b of the multilayer ceramic electronic component 100 may be arranged to cover the first and second base electrode layers 131a and 132a, respectively. As used herein, "a layer being arranged to "cover" another layer" may refer to a structure in which the inner layer is not exposed to the outside, or a structure in which the inner layer is arranged inside the outer layer, such that only the outer layer is visible when viewed from the outside. When the first and second glass layers 131b and 132b are arranged to cover the first and second base electrode layers 131a and 132a, respectively, the first and second glass layers 131b and 132b may function as moisture barrier layers that prevent the penetration of external moisture, etc.

[0042] In one embodiment of the present invention, the first and second resin electrode layers 131c and 132c of the multilayer ceramic electronic component 100 according to the present invention may include a conductivity imparting agent and a base resin. That is, the first and second resin electrode layers 131c and 132c of this embodiment may be resin-based electrodes. The resin-based electrodes have a structure in which a conductivity imparting agent is dispersed within a base resin. Because they are manufactured in a lower temperature environment than sintered electrodes, the conductivity imparting agent may be present in particulate form within the base resin. Furthermore, when the first and second resin electrode layers 131c and 132c are disposed outside the first and second glass layers 131b and 132b, respectively, they can insulate against physical stress, such as external impact.

[0043] The conductivity-imparting agent may include a third conductive metal and / or a conductive polymer. The third conductive metal may be, but is not limited to, one or more selected from the group consisting of calcium (Ca), titanium (Ti), molybdenum (Mo), tungsten (W), iron (Fe), cobalt (Co), nickel (Ni), palladium (Pd), platinum (Pt), copper (Cu), silver (Ag), gold (Au), zinc (Zn), aluminum (Al), tin (Sn), lead (Pb), and alloys thereof.

[0044] Non-limiting examples of the conductive polymer include sulfur (S) and / or nitrogen (N)-containing compounds such as PT (poly(thiophene)), PEDOT (poly(ethylenedioxy)thiophene), PPS (poly(p-phenylene sulfide)), PANI (polyanilines), P3HT (poly(3-hexylthiophene-2,5-diyl)), PolyTPD (poly(4-butylphenyldiphenylamine)), PSS (poly(4-butylphenyldiphenylamine)), PVK (poly(9-vinylcarbazole)), PDBT (poly(4,4'-dimethoxy bithophene)), polyaniline, and polypyrrole, and heteroatom-free compounds such as poly(fluorine), polyphenylene, polypyrene, polyazulene, polynaphthalene, PAC (poly(acetylene)), and PPV (poly(p-phenylene vinylene), but are not limited thereto.

[0045] The first and second resin electrode layers 131c and 132c may contain, if necessary, a carbon filler such as a carbon nanotube, graphene, or fullerene, and / or a conductive filler such as a spherical, oval, flake-type, fibrous, or dendritic alloy filler, but are not limited thereto.

[0046] The base resin contained in the first and second resin electrode layers 131c and 132c may be, for example, a thermosetting resin. Specific examples of the thermosetting resin include, but are not limited to, phenolic resin, urea resin, diallyl phthalate resin, melamine resin, guanamine resin, unsaturated polyester resin, polyurethane resin, epoxy resin, aminoalkyd resin, melamine-urea co-condensation resin, silicon resin, and polysiloxane resin. When a thermosetting resin is used, a crosslinking agent, a curing agent such as a polymerization initiator, a polymerization accelerator, a solvent, a viscosity modifier, and the like may be further added as needed.

[0047] In one example, the first and second resin electrode layers 131c and 132c of the multilayer ceramic electronic component 100 of the present invention may be disposed to cover the first and second glass layers 131b and 132b, respectively. When the first and second resin electrode layers 131c and 132c are disposed to cover the first and second glass layers 131b and 132b, respectively, the first and second resin electrode layers 131c and 132c may function to block external contaminants and to block external shocks from being transmitted to the interior.

[0048] The first and second resin electrode layers 131c and 132c may be formed by, but not limited to, various methods, such as dipping the ceramic body in a conductive paste containing a base resin and a conductivity imparting agent, printing the conductive paste on the surface of the ceramic body by screen printing or gravure printing, coating the conductive paste on the surface of the ceramic body, or transferring a dried film of the conductive paste onto the ceramic body.

[0049] In one embodiment of the present invention, the multilayer ceramic electronic component 100 according to the present invention may include a first plating layer (not shown) disposed on the first resin electrode layer 131c and a second plating layer (not shown) disposed on the second resin electrode layer 132c. The first and second plating layers may be formed by sputtering or electrolytic deposition, but are not limited thereto. The material for forming the first and second plating layers is not particularly limited and may include nickel (Ni), copper (Cu), tin (Sn), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), or the like, alone or in alloys thereof.

[0050] <Experimental Example> Tests were conducted on the moisture resistance reliability and ESR using Samsung Electro-Mechanics' mass-produced chip (temperature characteristics X7R and capacitance 220.0nF) of 1005 size (length x width: 1.0mm x 0.5mm) with external electrodes formed on the longitudinal surface of the ceramic body.

[0051] Conductive glass was produced by reacting glass containing BaO, CaO, ZnO, Al2O3, B2O3, and SiO2 with a silver nitrate (AgNO3) aqueous solution with a molar concentration of 0.02 M. Then, first and second glass layers were formed on a ceramic body on which fired electrodes containing copper (Cu) were formed as first and second base electrode layers, and a resin electrode layer containing epoxy and copper was formed to produce a prototype chip.

[0052] For moisture resistance reliability, a voltage of 37.5V was applied to 100 chips for 12 hours under conditions of 85°C and 85% relative humidity (8585), and then a determination was made as to whether defects occurred. If defects occurred, the result was displayed as NG, and if no defects occurred, the result was displayed as OK.

[0053] Figure 7 is an SEM image of a cross section of the fabricated prototype chip. Referring to Figure 7, it can be seen that the chip has a structure in which a base electrode layer is formed on a ceramic body, a glass layer is formed on the base electrode layer, and a resin electrode layer is formed on the glass layer.

[0054] Table 1 below shows the test results for prototype chips with different glass layer thicknesses under the same conditions.

[0055] [Table 1]

[0056] Referring to Table 1, it can be seen that when the glass layer thickness is 20 μm, it exhibits low ESR and has excellent moisture resistance reliability. However, when the glass layer thickness exceeds 20 μm, the internal stress of the chip cannot be smoothly relieved, which may cause defects, and the thick glass layer may increase the ESR.

[0057] Furthermore, if the thickness of the glass layer is less than 1 μm, sufficient roughness cannot be formed, and the interfacial bonding strength cannot be imparted.

[0058] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments and the accompanying drawings, but is limited only by the appended claims. Therefore, various substitutions, modifications, and alterations can be made by those skilled in the art without departing from the technical spirit of the present invention as set forth in the claims, and these also fall within the scope of the present invention. [Explanation of symbols]

[0059] 100: Multilayer ceramic electronic components 110: Ceramic body 111: Dielectric layer 121, 122: First and second internal electrodes 131, 132: First and second external electrodes 131a, 132a: First and second base electrode layers 131b, 132b: first and second glass layers 131c, 132c: First and second resin electrode layers

Claims

1. a ceramic body including a dielectric layer and first and second internal electrodes arranged to be stacked on each other with the dielectric layer sandwiched therebetween; a first external electrode connected to the first internal electrode of the ceramic body, and a second external electrode connected to the second internal electrode, the first external electrode includes a first base electrode layer disposed in contact with the ceramic body, a first glass layer disposed on the first base electrode layer, and a first resin electrode layer disposed on the first glass layer; the second external electrode includes a second base electrode layer disposed in contact with the ceramic body, a second glass layer disposed on the second base electrode layer, and a second resin electrode layer disposed on the second glass layer; the first and second glass layers comprise conductive glass; The first and second glass layers are disposed with a conductive metal coating on the surface of the glass component.

2. 2. The multilayer ceramic electronic component according to claim 1, wherein the first and second base electrode layers are fired electrodes.

3. 3. The multilayer ceramic electronic component according to claim 2, wherein the first and second base electrodes contain one or more metal components selected from the group consisting of copper (Cu), nickel (Ni), tin (Sn), palladium (Pd), platinum (Pt), iron (Fe), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), and alloys thereof.

4. 2. The multilayer ceramic electronic component according to claim 1, wherein the conductive glass contains at least one selected from the group consisting of silicon (Si), boron (B), aluminum (Al), transition metals, alkali metals, alkaline earth metals, and oxides, nitrides, carbides, and carbonates thereof.

5. 5. The multilayer ceramic electronic component according to claim 1, wherein the first and second glass layers have an average surface roughness (Ra) of 1.0 [mu]m or more.

6. 6. The multilayer ceramic electronic component according to claim 1, wherein the first and second glass layers each have a thickness of 1 [mu]m or more and 20 [mu]m or less.

7. The multilayer ceramic electronic component according to claim 1 , wherein the first and second glass layers are disposed so as to cover the first and second base electrode layers.

8. The multilayer ceramic electronic component according to claim 1 , wherein the first and second resin electrode layers contain a conductivity imparting agent and a base resin.

9. The multilayer ceramic electronic component according to claim 1 , wherein the first and second resin electrode layers are disposed so as to cover the first and second glass layers.

10. The multilayer ceramic electronic component according to claim 1 , further comprising first and second plating layers disposed on the first and second resin electrode layers.

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