adhesive film

Abstract

To provide an adhesive composition which is excellent in adhesion between a semiconductor chip and a flexible printed circuit board, and enables wire bonding performed after the semiconductor chip and the flexible printed circuit board have been bonded to be suitably performed.SOLUTION: An adhesive composition has melt viscosity at 130°C of 13,000-20,000 Pa s, and contains at least a thermoplastic resin. An adhesive composition has melt viscosity at 130°C of 3,500-20,000 Pa s, and contains at least a thermoplastic resin and a thermosetting resin, wherein when a content of the thermoplastic resin is 100 pts.mass, a content of a thermosetting resin is 70-240 pts.mass, a weight average molecular weight of the thermoplastic resin is 100,000 or more and 2,000,000 or less, and the thermosetting resin is at least one selected from the group consisting of an epoxy resin, an acrylic resin, a silicone resin, a phenol resin, a thermosetting polyimide resin, a polyurethane resin, a melamine resin, and a urea resin.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present disclosure relates to adhesive compositions and adhesive films. [Background technology]

[0002] Conventionally, semiconductor devices are manufactured through the following steps. First, a semiconductor wafer is attached to a dicing adhesive sheet, and in this state, the semiconductor wafer is divided into semiconductor chips. Then, a pick-up step, a mounting step, a reflow step, a die bonding step, etc. are carried out. Patent Document 1 discloses an adhesive sheet (die bond dicing sheet) that has both the function of fixing a semiconductor wafer in a dicing step and the function of bonding a semiconductor chip to a substrate in a die bonding step. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-288170 Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, with the evolution of semiconductor devices for small devices such as smartphones, conventional semiconductor device manufacturing processes have also changed significantly. For example, processes that do not involve dicing or die bonding processes, or processes that do not involve reflow processes, using adhesive sheets (die-bond dicing sheets) described in Patent Document 1, are being put into practical use. Accordingly, new types of adhesive films are being sought for use in semiconductor device manufacturing processes. In addition to this situation, the present inventors have been developing an adhesive film that is easy to use for adhering semiconductor chips of corresponding shapes to specific, limited areas of a substrate, in order to respond to the increasing functionality and thinning of small devices on which semiconductor devices are mounted.

[0005] One aspect of the present disclosure provides an adhesive composition that has excellent adhesion between a semiconductor chip and a flexible printed circuit board and that allows for suitable wire bonding to be performed after bonding the semiconductor chip to the flexible printed circuit board. Another aspect of the present disclosure provides an adhesive film that includes a plurality of adhesive pieces made of this adhesive composition, and a method for producing a connection structure. [Means for solving the problem]

[0006] An adhesive composition according to one aspect of the present disclosure is used for bonding a semiconductor chip and a flexible printed circuit board, and has a melt viscosity of 3,500 to 20,000 Pa·s at 130°C. The adhesive composition according to one aspect of the present disclosure has a melt viscosity of 13,000 to 20,000 Pa·s at 130°C and contains at least a thermoplastic resin. The adhesive composition according to one aspect of the present disclosure has a melt viscosity of 3,500 to 20,000 Pa·s at 130°C and contains at least a thermoplastic resin and a thermosetting resin, wherein the thermosetting resin content is 70 to 240 parts by mass per 100 parts by mass of the thermoplastic resin, the thermosetting resin has a weight-average molecular weight of 100,000 or more and 2,000,000 or less, and the thermosetting resin is at least one selected from the group consisting of epoxy resin, acrylic resin, silicone resin, phenolic resin, thermosetting polyimide resin, polyurethane resin, melamine resin, and urea resin.

[0007] The adhesive composition has a melt viscosity at 130°C of 3500 to 20,000 Pa·s, which allows for both excellent adhesion in the bonding step between a semiconductor chip and a flexible printed circuit board (hereinafter referred to as "FPC board") and excellent wire bondability in the subsequent wire bonding step between the semiconductor chip and the FPC board to be achieved at a sufficiently high level. When the adhesive composition has a melt viscosity at 130°C of 20,000 Pa·s or less (the adhesive composition is appropriately soft at 130°C), excellent adhesion can be achieved in the bonding step between the semiconductor chip and the FPC board. On the other hand, when the adhesive composition has a melt viscosity at 130°C of 3500 Pa·s or more (the adhesive composition is appropriately hard at 130°C), changes in the thickness of the adhesive layer (the adhesive composition interposed between the semiconductor chip and the FPC board) can be sufficiently suppressed in the wire bonding step performed after the bonding step, thereby achieving excellent wire bondability. In the wire bonding process, the positions (e.g., height positions) at which the semiconductor chip and the FPC substrate should be connected are set in advance, so if the thickness of the adhesive layer is uneven or excessively thick (see Figure 8(b)), wire bonding cannot be performed properly.

[0008] The adhesive composition contains at least a thermoplastic resin and a thermosetting resin, and the content of the thermosetting resin is preferably 70 to 240 parts by mass relative to 100 parts by mass of the thermoplastic resin. Having the content of the thermosetting resin within the above range makes it easy to achieve both excellent adhesiveness and wire bonding properties. From the viewpoint of adjusting the melt viscosity (hardness) of the adhesive composition at 130°C, the adhesive composition may further contain a filler, and the content of the filler is preferably 10 to 450 parts by mass relative to 100 parts by mass of the thermoplastic resin.

[0009] An adhesive film according to one aspect of the present disclosure comprises a strip-shaped carrier film having a width of 100 mm or less and a plurality of adhesive pieces arranged on the carrier film in the longitudinal direction of the carrier film, the adhesive pieces being made of the above-mentioned adhesive composition.

[0010] This adhesive film allows the adhesive pieces arranged in a line on the carrier film to be picked up one by one and then placed in a predetermined area on the adherend (semiconductor chip or FPC board), thereby efficiently carrying out the bonding process between the semiconductor chip and the FPC board. For example, if the strip-shaped adhesive film is wound on a reel, the bonding process can be carried out even more efficiently using a roll-to-roll method. The shape of the adhesive piece can be appropriately set depending on the shape of the area on the FPC board where the semiconductor chip is to be bonded or the shape of the semiconductor chip.

[0011] The size and number of adhesive pieces to be placed on the carrier film may be appropriately determined depending on the design of the connection body to be manufactured. For example, the area of one adhesive piece is 10 to 200 mm 2 The adhesive layer may be formed by die-cutting an adhesive layer formed to cover the surface of the carrier film.

[0012] The adhesive film according to the present disclosure may further include a protective member having the same shape as the adhesive piece, covering a second surface opposite to the first surface facing the carrier film. Covering the adhesive piece with the protective member can prevent dust and the like from adhering to the adhesive piece until use. The adhesive piece and the protective member can be formed by die-cutting an adhesive layer formed to cover the surface of the carrier film and a protective film arranged to cover the adhesive layer. [Effects of the Invention]

[0013] According to one aspect of the present disclosure, there is provided an adhesive composition that has excellent adhesion between a semiconductor chip and an FPC board and that allows for suitable wire bonding to be performed after bonding the semiconductor chip and the FPC board. According to one aspect of the present disclosure, there are provided an adhesive film including a plurality of adhesive pieces made of this adhesive composition, and a method for producing a connection body. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 is a perspective view schematically illustrating one embodiment of an adhesive film according to the present disclosure. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II shown in FIG. [Figure 3] FIG. 3 is a cross-sectional view that schematically shows a laminate in which a carrier film, an adhesive layer, and a protective film are laminated in this order. [Figure 4] FIG. 4 is a perspective view showing how a plurality of adhesive pieces are formed on a carrier film by die cutting. [Figure 5] FIG. 5 is a cross-sectional view that schematically shows how the adhesive piece and the protective member covering it are picked up from the carrier film. [Figure 6] 6(a) and 6(b) are cross-sectional views that schematically show the state of the adhesive piece before the step of adhering the tip of the FPC board to the semiconductor chip is carried out. [Figure 7] FIG. 7 is a cross-sectional view that schematically shows how the adhesive piece between the tip of the FPC board and the semiconductor chip is cured while the FPC board is held by applying an upward force to the FPC board. [Figure 8] Figure 8(a) is a cross-sectional view showing a module in which the tip of the FPC substrate could be properly attached to the semiconductor chip, and Figure 8(b) is a cross-sectional view showing a module in which the tip of the FPC substrate could not be properly attached to the semiconductor chip. DETAILED DESCRIPTION OF THE INVENTION

[0015] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings as appropriate. Note that the present invention is not limited to the following embodiments. In this specification, (meth)acrylic means acrylic or methacrylic.

[0016] <Adhesive film> Fig. 1 is a perspective view schematically showing an adhesive film according to this embodiment. Fig. 2 is a cross-sectional view taken along line II-II in Fig. 1. The adhesive film 10 shown in these figures comprises a strip-shaped carrier film 1 having a width of 100 mm or less, a plurality of adhesive pieces 3p arranged on the carrier film 1 in the longitudinal direction (the direction of arrow X in Fig. 1) of the carrier film 1, and a protective member 5p covering the surface F2 of the adhesive pieces 3p and having the same shape as the adhesive pieces 3p. As shown in Fig. 2, the surface F2 (second surface) of the adhesive pieces 3p is the surface opposite the surface F1 (first surface) of the adhesive pieces 3p facing the carrier film 1.

[0017] The adhesive film 10 is used to bond a semiconductor chip to an FPC board. The adhesive film 10 allows the adhesive pieces 3p arranged in a line on the carrier film 1 to be picked up in order, and then each adhesive piece 3p can be placed in a predetermined area on the board, allowing the bonding process between the semiconductor chip and the FPC board to be carried out efficiently.

[0018] The adhesive piece 3p is made of an adhesive composition having a melt viscosity of 3500 to 20000 Pa·s at 130°C. The melt viscosity of this adhesive composition at 130°C is preferably 4000 to 19000 Pa·s, more preferably 4000 to 15000 Pa·s, and even more preferably 4000 to 13000 Pa·s. When the adhesive composition has a melt viscosity of 3500 to 20000 Pa·s at 130°C, it is possible to achieve a sufficiently high level of both excellent adhesion in the step of bonding the semiconductor chip to the FPC board and excellent wire bondability in the subsequent step of wire bonding the semiconductor chip to the FPC board.

[0019] Specifically, when the melt viscosity of the adhesive composition at 130°C is 20,000 Pa·s or less, excellent adhesion can be achieved in the bonding process between the semiconductor chip and the FPC substrate. On the other hand, when the melt viscosity of the adhesive composition at 130°C is 3,500 Pa·s or more, changes in the thickness of the adhesive layer (the adhesive composition interposed between the semiconductor chip and the FPC substrate) can be sufficiently suppressed in the wire bonding process performed after the bonding process, thereby achieving excellent wire bonding properties. In the wire bonding process, the positions (e.g., height positions) of the semiconductor chip and the FPC substrate to be connected are predetermined. Therefore, if the thickness of the adhesive layer becomes uneven or excessively thick in the bonding process performed prior to this (see FIG. 8(b)), wire bonding cannot be performed properly.

[0020] In this specification, the melt viscosity of the adhesive composition at 130°C is a value measured by the following method. First, a 25 μm thick adhesive piece (adhesive layer) is laminated to a Teflon (registered trademark) sheet and pressed with a roll (temperature 60°C, linear pressure 0.2 MPa, feed rate 0.5 m / min). The PET film is then peeled off, and another 25 μm thick adhesive layer is placed on the adhesive piece and laminated under pressure. This process is repeated to obtain an adhesive sample with a thickness of approximately 200 μm. The melt viscosity of the obtained adhesive sample is measured using a viscoelasticity measuring device (manufactured by Rheometrics Scientific F.E., Inc., product name: ARES) using 25 mm diameter parallel plates as measurement plates at a heating rate of 10°C / min and a frequency of 1 Hz in the temperature range of 20 to 200°C. The melt viscosity at 130°C is determined from the measurement results.

[0021] In this embodiment, as shown in Fig. 1, an adhesive piece 3p shaped like a thick T is exemplified, but the shape of the adhesive piece may be set appropriately depending on the shape of the area of the FPC board to which the semiconductor chip is to be attached or the shape of the semiconductor chip. Also, although Figs. 1 and 2 illustrate a case in which a single row 3A consisting of a plurality of adhesive pieces 3p is provided on the carrier film 1, two or more rows 3A may be provided on the carrier film 1.

[0022] The adhesive pieces 3p in this embodiment are assumed to be sufficiently small in size, and the area of one adhesive piece 3p is, for example, 10 to 200 mm 2 The proportion of the surface of the carrier film 1 that is covered by the plurality of adhesive pieces 3p (adhesive piece area ratio) is, for example, 10 to 60%, and may be 10 to 35%, based on the area of the carrier film 1. This area ratio may be calculated by dividing the area A of one adhesive piece 3p by the product of the pitch (pitch P in FIG. 1) of the adhesive pieces 3p provided on the carrier film 1 and the width (width W in FIG. 1) of the carrier film 1. In other words, this area ratio R may be a value calculated by the following formula: Area ratio R(%)=A / (P×W)×100

[0023] The structure of the adhesive film 10 will be described below. [Carrier film] As described above, the carrier film 1 is strip-shaped and has a width of 100 mm or less. The width of the carrier film 1 may be set appropriately depending on the size of the adhesive pieces 3p to be arranged thereon and the number of rows 3A. For example, as shown in FIG. 1, when there is one row 3A, the width of the carrier film 1 is preferably 10 to 50 mm, and may be 10 to 30 mm or 10 to 20 mm. When the width of the carrier film 1 is 10 mm or more, it is easy to prevent deterioration in workability due to twisting of the carrier film 1 when a roll-to-roll method is adopted.

[0024] The material of the carrier film 1 is not particularly limited as long as it can sufficiently withstand the tension applied in the manufacturing process of the adhesive film 10 and the manufacturing process of the semiconductor device. The carrier film 1 is preferably transparent from the viewpoint of visibility of the adhesive piece 3p and / or the protective member 5p placed thereon. Examples of the carrier film 1 that can be used include polyester films such as polyethylene terephthalate film, polytetrafluoroethylene film, polyethylene film, polypropylene film, polymethylpentene film, polyvinyl acetate film, poly-4-methylpentene-1, homopolymers or copolymers such as ethylene-vinyl acetate copolymer and ethylene-ethyl acrylate copolymer, and mixtures thereof, as well as plastic films such as polyvinyl chloride film and polyimide film. The carrier film 1 may have a single-layer structure or a multilayer structure.

[0025] The thickness of the carrier film 1 may be appropriately selected within a range that does not impair workability, and may be, for example, 10 to 200 μm, 20 to 100 μm, or 25 to 80 μm. These thickness ranges are practically acceptable and economically effective.

[0026] In order to increase the adhesion of the adhesive piece 3p to the carrier film 1, the surface of the carrier film 1 may be subjected to a chemical or physical surface treatment such as corona treatment, chromic acid treatment, ozone exposure, flame exposure, high-voltage shock exposure, or ionizing radiation treatment. A film made of fluororesin with low surface energy can also be used as the carrier film 1. Examples of such films include A-63 (release treatment agent: modified silicone-based) manufactured by Teijin DuPont Films Co., Ltd., and A-31 (release treatment agent: Pt-based silicone-based) manufactured by Teijin DuPont Films Co., Ltd.

[0027] In order to prevent the adhesive force of the adhesive piece 3p to the carrier film 1 from becoming excessively high, a release layer composed of a release agent such as a silicone-based release agent, a fluorine-based release agent, or a long-chain alkyl acrylate-based release agent may be formed on the surface of the carrier film 1.

[0028] The adhesion strength between the carrier film 1 and the adhesive piece 3p is preferably 0.5 to 18 N / m, more preferably 2 to 10 N / m, and may be 2 to 6 N / m or 2 to 4 N / m. An adhesion strength of 0.5 N / m or more makes it easier to prevent the adhesive piece 3p from accidentally peeling off from the carrier film 1 during the process of producing the adhesive film 10, while an adhesion strength of 18 N / m or less makes it easier to stably pick up the adhesive piece 3p and the protective member 5p covering it from the carrier film 1 when using the adhesive film 10. The adhesion strength of the adhesive piece 3p to the carrier film 1 means the 90° peel strength, and specifically means the peel strength measured when a sample is prepared in which a 20 mm wide adhesive layer made of the same composition as the adhesive piece 3p is formed on the carrier film 1, and this adhesive layer is peeled off from the carrier film at an angle of 90° at a peeling speed of 50 mm / min.

[0029] [adhesive strip] The adhesive piece 3p is formed together with the protective member 5p by simultaneously die-cutting the adhesive layer 3 formed to cover the surface of the carrier film 1 and the protective film 5 arranged to cover the adhesive layer 3 (see FIG. 4). The thickness of the adhesive piece 3p may be selected appropriately as long as it does not impair workability, and may be, for example, 1 to 200 μm, 3 to 150 μm, or 5 to 150 μm. When the thickness of the adhesive piece 3p is 1 μm or more or 5 μm or more, sufficient adhesion is easily ensured, while when the thickness is 200 μm or less or 150 μm or less, it is easy to prevent the adhesive composition constituting the adhesive piece 3p from spilling out of the protective member 5p.

[0030] The adhesive composition constituting the adhesive piece 3p preferably has both appropriate softness (adhesion) and the property of not stretching excessively at 130° C. The adhesive piece 3p preferably contains a thermoplastic resin, a thermosetting resin, a curing accelerator, and a filler, and may contain a photoreactive monomer, a photopolymerization initiator, and the like, as necessary.

[0031] (thermoplastic resin) The thermoplastic resin may be a resin having thermoplasticity, or a resin that has thermoplasticity at least in an uncured state and forms a crosslinked structure after heating. As the thermoplastic resin, a (meth)acrylic copolymer having a reactive group (hereinafter sometimes referred to as a "reactive group-containing (meth)acrylic copolymer") is preferred from the viewpoint of excellent shrinkability, heat resistance, and peelability as a semiconductor processing tape. When the thermoplastic resin contains a reactive group-containing (meth)acrylic copolymer, the adhesive piece 3p may be in an embodiment that does not contain a thermosetting resin, i.e., may be in an embodiment that contains a reactive group-containing (meth)acrylic copolymer, a curing accelerator, and a filler. The thermoplastic resins may be used alone or in combination of two or more.

[0032] Examples of the (meth)acrylic copolymer include (meth)acrylic acid ester copolymers such as acrylic glass and acrylic rubber, and acrylic rubber is preferred. The acrylic rubber is preferably formed by copolymerizing an acrylic acid ester as the main component and a monomer selected from a (meth)acrylic acid ester and acrylonitrile.

[0033] Examples of (meth)acrylic acid esters include methyl acrylate, ethyl acrylate, propyl acrylate, isopropyl acrylate, butyl acrylate, isobutyl acrylate, hexyl acrylate, cyclohexyl acrylate, 2-ethylhexyl acrylate, lauryl acrylate, methyl methacrylate, ethyl methacrylate, propyl methacrylate, isopropyl acrylate, butyl methacrylate, isobutyl methacrylate, hexyl methacrylate, cyclohexyl methacrylate, 2-ethylhexyl methacrylate, and lauryl methacrylate. As the (meth)acrylic acid ester copolymer, a copolymer containing butyl acrylate and acrylonitrile as copolymerization components, and a copolymer containing ethyl acrylate and acrylonitrile as copolymerization components are preferred.

[0034] The reactive group-containing (meth)acrylic copolymer is preferably a reactive group-containing (meth)acrylic copolymer containing a (meth)acrylic monomer having a reactive group as a copolymerization component. Such a reactive group-containing (meth)acrylic copolymer can be obtained by copolymerizing a monomer composition containing a (meth)acrylic monomer having a reactive group and the above-mentioned monomer.

[0035] As the reactive group, from the viewpoint of improving heat resistance, an epoxy group, a carboxyl group, an acryloyl group, a methacryloyl group, a hydroxyl group, and an episulfide group are preferred, and among them, from the viewpoint of crosslinkability, an epoxy group and a carboxyl group are more preferred.

[0036] In this embodiment, the reactive group-containing (meth)acrylic copolymer is preferably an epoxy group-containing (meth)acrylic copolymer containing an epoxy group-containing (meth)acrylic monomer as a copolymerization component. In this case, examples of the epoxy group-containing (meth)acrylic monomer include glycidyl acrylate, 4-hydroxybutyl acrylate glycidyl ether, 3,4-epoxycyclohexylmethyl acrylate, glycidyl methacrylate, 4-hydroxybutyl methacrylate glycidyl ether, and 3,4-epoxycyclohexylmethyl methacrylate. From the viewpoint of heat resistance, the reactive group-containing (meth)acrylic monomer is preferably glycidyl acrylate or glycidyl methacrylate.

[0037] The Tg of the thermoplastic resin is preferably -50°C to 50°C. When the Tg of the thermoplastic resin is 50°C or less, the flexibility of the adhesive piece 3p is easily ensured. Furthermore, when attaching to an adherend, if there are irregularities, the adhesive piece 3p can easily conform to the irregularities, resulting in appropriate adhesiveness. On the other hand, when the Tg of the thermoplastic resin is -50°C or more, it is easy to prevent the flexibility of the adhesive piece 3p from becoming too high, and excellent handleability, adhesiveness, and releasability can be achieved.

[0038] The Tg of a thermoplastic resin is the midpoint glass transition temperature obtained by differential scanning calorimetry (DSC). Specifically, the Tg of a thermoplastic resin is the midpoint glass transition temperature calculated by a method in accordance with JIS K 7121:1987, by measuring the change in calorific value under conditions of a temperature rise rate of 10°C / min and a measurement temperature of -80 to 80°C.

[0039] The weight-average molecular weight of the thermoplastic resin is preferably 100,000 or more and 2,000,000 or less. If the weight-average molecular weight is 100,000 or more, heat resistance is easily ensured when used for temporary fixation. On the other hand, if the weight-average molecular weight is 2,000,000 or less, deterioration in flow and adhesion is easily suppressed when used for temporary fixation. From the above-mentioned viewpoints, the weight-average molecular weight of the thermoplastic resin is more preferably 500,000 or more and 2,000,000 or less, and even more preferably 1,000,000 or more and 2,000,000 or less. The weight-average molecular weight is a polystyrene-equivalent value obtained by gel permeation chromatography (GPC) using a calibration curve with standard polystyrene.

[0040] When the (meth)acrylic copolymer having a reactive group contains glycidyl acrylate or glycidyl methacrylate as a copolymerization component, the total content of these is preferably 0.1 to 20 mass %, more preferably 0.5 to 15 mass %, and even more preferably 1.0 to 10 mass %, based on the total amount of the copolymerization components. When the content is within the above range, it is easy to achieve higher levels of all of the flexibility, adhesion, and releasability of the adhesive piece 3p.

[0041] The (meth)acrylic copolymer having the reactive group as described above may be one obtained by a polymerization method such as pearl polymerization or solution polymerization, or may be a commercially available product such as HTR-860P-3CSP (trade name, manufactured by Nagase ChemteX Corporation).

[0042] (thermosetting resin) The thermosetting resin can be any resin that is cured by heat without any particular limitation. Examples of the thermosetting resin include epoxy resin, acrylic resin, silicone resin, phenolic resin, thermosetting polyimide resin, polyurethane resin, melamine resin, urea resin, etc. These can be used alone or in combination of two or more.

[0043] The epoxy resin is not particularly limited as long as it has heat resistance when cured. Examples of the epoxy resin that can be used include bifunctional epoxy resins such as bisphenol A epoxy, phenol novolac epoxy resins, and novolac epoxy resins such as cresol novolac epoxy resins. Conventional epoxy resins can also be used, such as multifunctional epoxy resins, glycidylamine epoxy resins, heterocycle-containing epoxy resins, and alicyclic epoxy resins.

[0044] Examples of bisphenol A type epoxy resins include Epikote 807, Epikote 815, Epikote 825, Epikote 827, Epikote 828, Epikote 834, Epikote 1001, Epikote 1004, Epikote 1007, and Epikote 1009 (all manufactured by Mitsubishi Chemical Corporation), DER-330, DER-301, and DER-361 (all manufactured by The Dow Chemical Company), YD8125, and YDF8170 (all manufactured by Tohto Kasei Co., Ltd.). Examples of phenol novolac type epoxy resins include Epicoat 152 and Epicoat 154 (both manufactured by Mitsubishi Chemical Corporation), EPPN-201 (manufactured by Nippon Kayaku Co., Ltd.), and DEN-438 (manufactured by The Dow Chemical Company). Examples of o-cresol novolac epoxy resins include YDCN-700-10 (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), EOCN-102S, EOCN-103S, EOCN-104S, EOCN-1012, EOCN-1025, and EOCN-1027 (all manufactured by Nippon Kayaku Co., Ltd.), and YDCN701, YDCN702, YDCN703, and YDCN704 (all manufactured by Tohto Kasei Co., Ltd.). Examples of polyfunctional epoxy resins include Epon 1031S (manufactured by Mitsubishi Chemical Corporation), Araldite 0163 (manufactured by BASF Japan Ltd.), Denacol EX-611, EX-614, EX-614B, EX-622, EX-512, EX-521, EX-421, EX-411, and EX-321 (all manufactured by Nagase ChemteX Corporation). Examples of amine-type epoxy resins include Epicoat 604 (manufactured by Mitsubishi Chemical Corporation), YH-434 (manufactured by Tohto Kasei Co., Ltd.), TETRAD-X, TETRAD-C (all manufactured by Mitsubishi Gas Chemical Company, Inc.), and ELM-120 (manufactured by Sumitomo Chemical Co., Ltd.). Examples of heterocycle-containing epoxy resins include Araldite PT810 (manufactured by BASF Japan Ltd.), ERL4234, ERL4299, ERL4221, and ERL4206 (all manufactured by Union Carbide Corporation). These epoxy resins can be used alone or in combination of two or more.

[0045] As the epoxy resin curing agent, which is a part of the thermosetting resin component, a commonly used known resin can be used. Specific examples include amines, polyamides, acid anhydrides, polysulfides, boron trifluoride, bisphenols having two or more phenolic hydroxyl groups per molecule, such as bisphenol A, bisphenol F, and bisphenol S, and phenolic resins, such as phenol novolac resin, bisphenol A novolac resin, and cresol novolac resin. As the epoxy resin curing agent, phenolic resins, such as phenol novolac resin, bisphenol A novolac resin, and cresol novolac resin, are particularly preferred from the viewpoint of excellent resistance to electrolytic corrosion when absorbing moisture. The epoxy curing agent may be used simultaneously with the epoxy resin or may be used alone.

[0046] Among the above phenolic resin curing agents, it is preferable to use Phenolite LF2882, Phenolite LF2822, Phenolite TD-2090, Phenolite TD-2149, Phenolite VH-4150, Phenolite VH4170 (all trade names manufactured by DIC Corporation), H-1 (trade name manufactured by Meiwa Kasei Co., Ltd.), Epicure MP402FPY, Epicure YL6065, Epicure YLH129B65, Milex XL, Milex XLC, Milex XLC-LL, Milex RN, Milex RS, Milex VR (all trade names manufactured by Mitsubishi Chemical Corporation).

[0047] The content of the thermosetting resin in the adhesive piece 3p is preferably 70 to 240 parts by mass, more preferably 70 to 180 parts by mass, and even more preferably 70 to 120 parts by mass, per 100 parts by mass of the thermoplastic resin. When the content of the thermosetting resin is within the above range, shrinkage of the adhesive piece 3p due to thermal curing can be suppressed, and excellent adhesion after thermal curing can be easily achieved.

[0048] (curing accelerator) Examples of the curing accelerator include imidazoles, dicyandiamide derivatives, dicarboxylic acid dihydrazides, triphenylphosphine, tetraphenylphosphonium tetraphenylborate, 2-ethyl-4-methylimidazole-tetraphenylborate, 1,8-diazabicyclo[5,4,0]undecene-7-tetraphenylborate, etc. These may be used alone or in combination of two or more.

[0049] When the adhesive piece 3p contains a (meth)acrylic copolymer having epoxy groups, it preferably contains a curing accelerator that accelerates the curing of the epoxy groups contained in the acrylic copolymer. Examples of curing accelerators that accelerate the curing of epoxy groups include phenol-based curing agents, acid anhydride-based curing agents, amine-based curing agents, imidazole-based curing agents, imidazoline-based curing agents, triazine-based curing agents, and phosphine-based curing agents. Among these, imidazole-based curing agents are preferred, as they are expected to shorten processing time and improve workability from the standpoints of fast curing, heat resistance, and peelability. These compounds can be used alone or in combination of two or more.

[0050] The content of the curing accelerator in the adhesive piece 3p is preferably 0.01 to 2.0 parts by mass, more preferably 0.02 to 1.5 parts by mass, and even more preferably 0.03 to 1.0 part by mass, relative to 100 parts by mass of the thermoplastic resin. When the content of the curing accelerator is within the above range, there is a tendency that the curing property of the adhesive piece 3p can be improved while sufficiently suppressing a decrease in storage stability.

[0051] (inorganic filler) The adhesive piece 3p preferably contains an inorganic filler. Examples of inorganic fillers include metal fillers such as silver powder, gold powder, and copper powder, and non-metallic inorganic fillers such as silica, alumina, boron nitride, titania, glass, iron oxide, and ceramic. The inorganic filler can be selected depending on the desired function.

[0052] The inorganic filler preferably has an organic group on its surface. By modifying the surface of the inorganic filler with an organic group, it is possible to improve dispersibility in an organic solvent when preparing a varnish for forming the adhesive piece 3p, and to suppress shrinkage due to thermal curing of the adhesive piece 3p, while also making it easier to achieve both a high elastic modulus and excellent releasability of the adhesive piece 3p.

[0053] An inorganic filler having an organic group on its surface can be obtained, for example, by mixing a silane coupling agent represented by the following formula (B-1) with an inorganic filler and stirring the mixture at a temperature of 30° C. or higher. Modification of the surface of the inorganic filler with an organic group can be confirmed by UV measurement, IR measurement, XPS measurement, etc.

[0054] [ka]

[0055] In formula (B-1), X represents an organic group selected from the group consisting of a phenyl group, a glycidoxy group, an acryloyl group, a methacryloyl group, a mercapto group, an amino group, a vinyl group, an isocyanate group, and a methacryloxy group; s represents 0 or an integer of 1 to 10; R 11 , R 12 and R 13 each independently represents an alkyl group having 1 to 10 carbon atoms. Examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, a decyl group, an isopropyl group, and an isobutyl group. The alkyl group having 1 to 10 carbon atoms is preferably a methyl group, an ethyl group, or a pentyl group from the viewpoint of easy availability. From the viewpoint of heat resistance, X is preferably an amino group, a glycidoxy group, a mercapto group, or an isocyanate group, and more preferably a glycidoxy group or a mercapto group. In formula (B-1), s is preferably an integer of 0 to 5, and more preferably an integer of 0 to 4, from the viewpoint of suppressing film fluidity at high temperatures and improving heat resistance.

[0056] Silane coupling agents include trimethoxyphenylsilane, dimethyldimethoxyphenylsilane, triethoxyphenylsilane, dimethoxymethylphenylsilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris(2-methoxyethoxy)silane, N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, and 3-glycidoxypropyltrimethoxysilane. Examples of suitable silanes include propylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-isocyanatepropyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, N-(1,3-dimethylbutylidene)-3-(triethoxysilyl)-1-propanamine, N,N'-bis(3-(trimethoxysilyl)propyl)ethylenediamine, polyoxyethylenepropyltrialkoxysilane, and polyethoxydimethylsiloxane. Among these, 3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-isocyanatepropyltriethoxysilane, and 3-mercaptopropyltrimethoxysilane are preferred, and trimethoxyphenylsilane, 3-glycidoxypropyltrimethoxysilane, and 3-mercaptopropyltrimethoxysilane are more preferred. The silane coupling agents can be used alone or in combination of two or more.

[0057] The content of the coupling agent is preferably 0 to 10 parts by mass, more preferably 0 to 5 parts by mass, relative to 100 parts by mass of the thermoplastic resin from the viewpoint of achieving a balance between heat resistance and storage stability, and is even more preferably 0 to 3 parts by mass from the viewpoint of storage stability.

[0058] The content of the inorganic filler in the adhesive piece 3p is preferably 450 parts by mass or less, more preferably 400 parts by mass or less, and even more preferably 350 parts by mass or less, per 100 parts by mass of the thermoplastic resin. There is no particular lower limit to the content of the inorganic filler, but it is preferably 10 parts by mass or more, more preferably 50 parts by mass or more, per 100 parts by mass of the thermoplastic resin. By keeping the content of the inorganic filler within the above range, it is possible to suppress shrinkage associated with thermal curing, and it is easy to achieve both high melt viscosity and excellent releasability of the adhesive piece 3p.

[0059] (organic filler) The adhesive piece 3p may contain an organic filler. Examples of organic fillers include carbon, rubber-based fillers, silicone-based fine particles, polyamide fine particles, and polyimide fine particles. The content of the organic filler is preferably 450 parts by mass or less, more preferably 400 parts by mass or less, and even more preferably 350 parts by mass or less, per 100 parts by mass of the thermoplastic resin. There is no particular lower limit for the content of the organic filler, but it is preferably 10 parts by mass or more per 100 parts by mass of the thermoplastic resin.

[0060] (organic solvent) The adhesive piece 3p may be diluted with an organic solvent if necessary. The organic solvent is not particularly limited, but can be selected based on its boiling point, taking into account factors such as volatility during film formation. Specifically, solvents with relatively low boiling points, such as methanol, ethanol, 2-methoxyethanol, 2-ethoxyethanol, 2-butoxyethanol, methyl ethyl ketone, acetone, methyl isobutyl ketone, toluene, and xylene, are preferred because they prevent the film from hardening during film formation. Furthermore, for purposes such as improving film formability, it is preferable to use solvents with relatively high boiling points, such as dimethylacetamide, dimethylformamide, N-methylpyrrolidone, and cyclohexanone. These solvents can be used alone or in combination.

[0061] [Protective material] The protective member 5p is formed together with the adhesive piece 3p by simultaneously die-cutting the adhesive layer 3 formed to cover the surface of the carrier film 1 and the protective film 5 arranged to cover the adhesive layer 3 (see FIG. 4). The protective member 5p according to this embodiment is formed simultaneously with the adhesive piece 3p by die-cutting, and therefore has substantially the same shape as the adhesive piece 3p. The protective film 5 may be any material that can be punched in the manufacturing process of the adhesive film 10 and that allows the protective member 5p to be easily peeled from the adhesive piece 3p in the manufacturing process of the semiconductor device.

[0062] The adhesion strength between the adhesive piece 3p and the protective member 5p is preferably 16 N / m or less, more preferably 10 N / m or less, and may be 5 N / m or less or 4.5 N / m or less. In particular, when the adhesive piece 3p is made of a thermosetting resin composition, it is preferable that the adhesion strength of the protective member 5p to the adhesive piece 3p be within the above range after heat treatment at 90°C for 1 second. When this adhesion strength is 16 N / m or less, the adhesive piece 3p covered with the protective member 5p can be temporarily pressure-bonded to an adherend (e.g., a substrate) at 90°C for 1 second, and then the protective member 5p can be easily peeled from the semi-cured adhesive piece 3p with adhesive tape or the like. The adhesion strength of the protective member 5p to the adhesive piece 3p means the 90° peel strength, and specifically means the peel strength measured when a sample is prepared in which a protective film of the same width is placed on an adhesive layer of the same composition as the adhesive piece 3p and has a width of 20 mm, and this protective film is peeled off from the adhesive layer at an angle of 90° and at a peeling speed of 300 mm / min.

[0063] Examples of the protective film 5 that can be used include polyester films such as polyethylene terephthalate film, polytetrafluoroethylene film, polyethylene film, polypropylene film, polymethylpentene film, polyvinyl acetate film, poly-4-methylpentene-1, homopolymers or copolymers such as ethylene-vinyl acetate copolymer and ethylene-ethyl acrylate copolymer, and polyolefin films such as mixtures thereof, and plastic films such as polyvinyl chloride film and polyimide film. The protective film 5 may have a single-layer structure or a multi-layer structure.

[0064] The thickness of the protective film 5 may be appropriately selected within a range that does not impair workability, and may be, for example, 10 to 200 μm, 20 to 100 μm, or 25 to 80 μm. These thickness ranges are practically acceptable and economically effective.

[0065] The light transmittance of the protective member 5p is preferably lower than that of the carrier film 1. By adopting such a configuration, the position and orientation of the adhesive piece 3p can be recognized by a device such as a camera, which facilitates automating the bonding process in the manufacturing process of the semiconductor device. For example, it is preferable to use a protective member 5p that is colored so that the transmittance of light with a wavelength of 500 nm is less than 10% (more preferably less than 7%).

[0066] <Method of manufacturing adhesive film> Next, a description will be given of a method for manufacturing the adhesive film 10. The manufacturing method of this embodiment includes the following steps. (A) A step of preparing a laminate 20 having a strip-shaped carrier film 1 having a width of 100 mm or less, an adhesive layer 3 formed to cover the surface of the carrier film 1, and a protective film 5 arranged to cover the adhesive layer 3. (B) A step of obtaining a plurality of adhesive pieces 3p arranged on the carrier film 1 in the longitudinal direction of the carrier film 1 by die-cutting the adhesive layer 3 and the protective film 5 in the laminate 20.

[0067] FIG. 3 is a cross-sectional view schematically illustrating the laminate 20 prepared in step (A). The laminate 20 can be produced as follows. First, a coating liquid is prepared by dissolving the raw resin composition of the adhesive layer 3 in a solvent such as an organic solvent to form a varnish. This coating liquid is then coated on a carrier film 1, and the solvent is then removed to form the adhesive layer 3. Coating methods include knife coating, roll coating, spray coating, gravure coating, bar coating, and curtain coating. Next, a protective film 5 is bonded to the surface of the adhesive layer 3 at room temperature to 60°C. This allows the laminate 20 to be obtained. Alternatively, the adhesive layer 3 may be formed on a wide carrier film, and then the protective film 5 is bonded to cover the adhesive layer 3 to produce a laminate film, which is then cut (slit) to a width of 100 mm or less to obtain the laminate 20.

[0068] 4 is a perspective view showing how a plurality of adhesive pieces 3p and a protective member 5p covering the adhesive pieces 3p are formed on a carrier film 1 by die-cutting in step (B). As shown in FIG. 4, the laminate 20 passes between a rotor 51 having a plurality of blades 51c on its outer circumferential surface for performing die-cutting, and a roll 52 paired with the rotor 51, whereby adhesive pieces 3p and protective members 5p corresponding to the shapes of the blades 51c are continuously formed on the carrier film 1. At this time, the surface of the laminate 20 facing the protective film 5 faces the rotor 51, and the surface facing the carrier film 1 faces the roll 52. The depth of the cuts made in the laminate 20 by the blades 51c can be adjusted by adjusting the distance between the rotation axis 51a of the rotor 51 and the rotation axis 52a of the roll 52.

[0069] The laminate 20 that has passed between the rotor 51 and the roll 52 is separated into the adhesive film 10 and the unnecessary portion 30, which are then wound onto respective reels (not shown), as shown in Fig. 4. The unnecessary portion 30 consists of the adhesive layer 3 and the protective film 5, from which the adhesive piece 3p and the protective member 5p have been cut out.

[0070] <How to use adhesive film> Next, a method for using the adhesive film 10 will be described using a method for manufacturing a connection assembly including a semiconductor chip and an FPC board as an example. FIG. 5 is a cross-sectional view schematically illustrating the process of picking up the adhesive piece 3p and the protective member 5p covering it from the carrier film 1. With a certain tension applied to the adhesive film 10, the surface of the adhesive film 10 facing the carrier film 1 is brought into contact with a wedge-shaped member 60, and the adhesive film 10 is moved in the direction of the arrow shown in FIG. 5. As a result, as shown in the figure, the front of the adhesive piece 3p and the protective member 5p are lifted from the carrier film 1. In this state, the adhesive piece 3p and the protective member 5p are picked up, for example, by a pickup device 65 with suction power. For example, by using a pickup device 65 equipped with a camera or the like for visually observing the protective member 5p, it is possible to determine information such as the presence and orientation of the adhesive piece 3p and the protective member 5p. Based on this information, the subsequent bonding process can be carried out appropriately.

[0071] Next, the adhesive piece 3p covered with the protective member 5p is placed in a predetermined position and orientation on the surface C1 of the semiconductor chip C (see FIG. 6(a)). In this state, the adhesive piece 3p is pre-pressurized and bonded to the semiconductor chip C. The pre-pressurization may be performed, for example, at a temperature of 60 to 100°C and with a pressure of 0.1 to 0.8 MPa for 0.1 to 10 seconds. The pre-pressurization semi-cures the adhesive piece 3p, thereby improving its adhesive strength to the surface C1. Thereafter, the protective member 5p is peeled off from the adhesive piece 3p using adhesive tape or the like (see FIG. 6(b)).

[0072] The process of adhering the tip portion S1 of the FPC board S to the semiconductor chip C includes a step of pressure-bonding the semiconductor chip C and the tip portion S1 of the FPC board S via the adhesive piece 3p, and then a step of curing the adhesive piece 3p. Specifically, first, the tip portion S1 of the FPC board S is placed on the surface of the adhesive piece 3p exposed by peeling off the protective member 5p, and then the tip portion S1 of the FPC board S is pressure-bonded to the semiconductor chip C. The pressure-bonding may be performed, for example, at a temperature of 90 to 150°C and a pressure of 0.1 to 1 MPa for 0.1 to 10 seconds. Next, as shown in FIG. 7, the adhesive piece 3p between the tip portion S1 of the FPC board S and the semiconductor chip C is cured while the FPC board S is held in place by applying an upward force F to the FPC board S. The curing may be performed, for example, at a temperature of 100 to 175°C for 0.5 to 6 hours.

[0073] 8(a) is a cross-sectional view schematically showing a module 50 (connected body) in which the tip portion S1 of the FPC substrate S was successfully bonded to the semiconductor chip C. FIG. 8(b) is a cross-sectional view schematically showing a module in which the tip portion S1 of the FPC substrate S was not successfully bonded to the semiconductor chip C. As shown in FIG. 8(b), a portion of the adhesive piece 3p stretches due to a force F when the adhesive piece 3p is cured, and as a result, the portion of the adhesive piece 3p becomes thicker, and the position at which wire bonding should be performed on the top surface S2 of the FPC substrate S shifts from the top surface C1 of the semiconductor chip C, making it impossible to perform wire bonding properly.

[0074] In a preferred module 50 shown in Figure 8(a), by wire bonding from the surface C1 of the semiconductor chip C to the upper surface S2 of the FPC substrate S, a module (not shown) in which the semiconductor chip C and the FPC substrate S are electrically connected is obtained.

[0075] Although the embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the above embodiments. For example, in the above embodiments, a colored protective film 5 is used so that the presence and orientation of the protective member 5p can be determined using a camera or the like. However, instead, a mark may be attached to a predetermined position on the protective member 5p. Also, if the adhesive piece 3p is colored, the protective member 5p may not be provided. Note that if the orientation of the adhesive piece 3p does not matter (for example, if the adhesive piece 3p is circular), there is no need to identify the orientation.

[0076] Furthermore, in the above embodiment, an example was given of a case where an adhesive piece 3p made of an adhesive composition was prepared in advance by die cutting, but it is also possible to prepare a coating liquid containing the adhesive composition and apply it to a predetermined area of the semiconductor chip C or FPC substrate S to form an adhesive layer in that area. [Example]

[0077] The present disclosure will be described below based on examples, but the present disclosure is not limited to the following examples.

[0078] Example 1 (Preparation of adhesive varnish) An adhesive varnish was obtained by mixing the following materials and vacuum degassing (see Example 1 in Table 1). Thermoplastic resin: HTR-860P-3 (trade name, Nagase ChemteX Corporation, glycidyl group-containing acrylic rubber, molecular weight 1 million, Tg -7°C) 100 parts by mass Thermosetting resin: YDCN-700-10 (trade name, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., o-cresol novolac epoxy resin, epoxy equivalent 210) 30 parts by mass Thermosetting resin: PSM-4326 (trade name, manufactured by Gunei Chemical Industry Co., Ltd., phenolic resin, functional group equivalent weight 105) 95 parts by weight Thermosetting resin: YDF-8170C (trade name, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., bisphenol F type epoxy resin, epoxy equivalent weight 157), 100 parts by mass Curing accelerator: 2PZ-CN (trade name, manufactured by Shikoku Chemicals Corporation, imidazole compound) 0.3 parts by mass Surface treatment filler: SC-2050-HLG (product name, manufactured by Admatechs Co., Ltd.) 330 parts by weight Silane coupling agent: A-189 (trade name, manufactured by NUC Corporation, γ-mercaptopropyltrimethoxysilane) 0.9 parts by mass Silane coupling agent: A-1160 (trade name, manufactured by NUC Corporation, γ-ureidopropyltriethoxysilane) 2 parts by mass

[0079] (Preparation of adhesive film) The adhesive varnish was applied to a 50 μm thick polyethylene terephthalate film with a release-treated surface (manufactured by Teijin DuPont Films Co., Ltd., product name: Teijin Tetron Film A-63). After a drying process, a film was obtained in which a 25 μm thick adhesive layer was formed on one side of the polyethylene terephthalate film (carrier film). This film was bonded to a 50 μm thick colored polyethylene film (manufactured by Tama Poly Co., Ltd., TDM-1) to obtain a laminated film. This laminated film was slit into a width of 15 mm to obtain a strip-shaped laminate.

[0080] The laminate obtained as described above was subjected to die cutting using an apparatus having the configuration shown in Fig. 4 to obtain an adhesive film according to this example. The shape of the adhesive piece was a rectangle of approximately 7 mm length x 6 mm width with some corners missing (area: 29 mm 2) The pitch P was approximately 9 mm. The area ratio R of the adhesive pieces was 23%. The melt viscosity of the adhesive composition constituting the adhesive pieces at 130°C was 3500 Pa·s.

[0081] (Module fabrication) A 3.2 mm × 3.2 mm adhesive strip and a protective covering were placed on the top surface of a semiconductor chip (approximately 15 mm long × 15 mm wide × 0.4 mm thick) (see Figure 6(a)). A 10 N pressure was applied to the adhesive strip for 0.5 seconds at 90°C, temporarily bonding the adhesive strip to the semiconductor chip. The protective covering was then peeled off to expose the adhesive strip (see Figure 6(b)). The tip of the FPC board was then pressed against the exposed adhesive strip. The pressure was applied at 130°C with a 15 N pressure for 1 second. After the pressure-bonding, the FPC board was held in place by applying a 250 g upward force to the FPC board, and the adhesive strip was cured at 130°C for 1 hour, as shown in Figure 7, to produce a module (connector). These steps were repeated to fabricate a total of 10 modules.

[0082] <Example 2> Except for using an adhesive varnish having the composition shown in Example 2 in Table 1, adhesive strips according to this example were prepared in the same manner as in Example 1, and a total of 10 modules were fabricated using these. The melt viscosity at 130°C of the adhesive composition constituting the adhesive strip was 6500 Pa s.

[0083] Example 3 Adhesive strips according to this example were prepared in the same manner as in Example 1, except that an adhesive varnish having the composition shown in Example 3 in Table 1 was used, and a total of 10 modules were fabricated using these adhesive strips. The melt viscosity at 130°C of the adhesive composition constituting the adhesive strip was 13,000 Pa s.

[0084] Example 4 Adhesive strips according to this example were prepared in the same manner as in Example 1, except that an adhesive varnish having the composition shown in Example 4 in Table 1 was used, and a total of 10 modules were fabricated using these adhesive strips. The melt viscosity at 130°C of the adhesive composition constituting the adhesive strip was 20,000 Pa s.

[0085] <Comparative Example 1> Except for using an adhesive varnish having the composition shown in Comparative Example 1 in Table 1, adhesive strips according to this comparative example were prepared in the same manner as in Example 1, and a total of 10 modules were fabricated using these adhesive strips. The melt viscosity at 130°C of the adhesive composition constituting the adhesive strip was 24,000 Pa s.

[0086] <Comparative Example 2> Except for using an adhesive varnish having the composition shown in Comparative Example 2 in Table 1, adhesive strips according to this comparative example were prepared in the same manner as in Example 1, and a total of 10 modules were fabricated using these adhesive strips. The melt viscosity at 130°C of the adhesive composition constituting the adhesive strip was 1700 Pa s.

[0087] The adhesive strips according to the above Examples and Comparative Examples were evaluated for the following items. The results are shown in Table 1.

[0088] (1) Elongation of adhesive strip The adhesive properties of the 10 modules obtained as described above were evaluated as follows. Specifically, the thickness of the side where tension was applied to the adhesive strip during the curing process (the left side in Figure 7) was measured using an optical microscope image. The thickness of each of the above locations was measured for four modules, and the average value was calculated. The thickness of the adhesive strip before use was 25 μm. The evaluation was based on the following criteria. A: The average thickness is less than 30 μm. B: The average value of the thickness is 30 to 250 μm. C: The average value of the thickness is more than 250 μm. D: Of the four modules, the number of modules in which the FPC board peeled off during the adhesive piece curing process was three or more.

[0089] (2) Adhesion of adhesive strips The adhesion of the 10 modules obtained in this manner was evaluated as follows. The semiconductor chip was attached to the surface of a table and fixed in place. A gradual upward force was applied to the FPC board in this state. When a force of 0.5 N was applied to the FPC board, it was confirmed whether the FPC board peeled off from the semiconductor chip. The evaluation was based on the following criteria. A: Of the total of 10 modules, the number of modules with peeled FPC boards is 2 or less. B: Of a total of 10 modules, the number of modules in which the FPC board peeled off was 3 to 8. C: Of a total of 10 modules, the number of modules in which the FPC board peeled off was 9 or more. D: Of the total 10 modules, the number of modules in which the FPC board peeled off during the adhesive piece curing process was 5 or more.

[0090] (3) Voids in adhesive strips The voids in the two modules obtained as described above were evaluated as follows. The obtained modules were inspected using an ultrasonic imaging system SAT (FS200II, manufactured by Hitachi Construction Machinery) to check for the presence or absence of voids. The evaluation criteria for the presence or absence of voids are as follows: A: Void ratio is less than 10%. D: Void ratio is 10% or more.

[0091] [Table 1] [Industrial Applicability]

[0092] According to one aspect of the present disclosure, there is provided an adhesive composition that has excellent adhesion between a semiconductor chip and an FPC board and that allows for suitable wire bonding to be performed after bonding the semiconductor chip and the FPC board. According to one aspect of the present disclosure, there are provided an adhesive film including a plurality of adhesive pieces made of this adhesive composition, and a method for producing a connection body. [Explanation of symbols]

[0093] 1...carrier film, 3...adhesive layer, 3p...adhesive piece (adhesive composition), 5...protective film, 5p...protective member, 10...adhesive film, 50...module (connection body), C...semiconductor chip, F1...surface of adhesive piece (first surface), F2...surface of adhesive piece (second surface), S...flexible printed circuit board

Claims

1. An adhesive film used to bond a semiconductor chip to a substrate in a manufacturing process of a semiconductor device, A strip-shaped carrier film having a width of 100 mm or less; a plurality of adhesive pieces arranged on the carrier film so as to be aligned in the longitudinal direction of the carrier film; Equipped with The area of the adhesive piece is 10 to 200 mm ２ and the adhesive piece is made of an adhesive composition having a melt viscosity of 13,000 to 20,000 Pa s at 130°C and containing at least a thermoplastic resin, a thermosetting resin, and a filler; An adhesive film in which the content of the filler is 10 to 450 parts by mass when the content of the thermoplastic resin in the adhesive piece is 100 parts by mass.

2. An adhesive film used to bond a semiconductor chip to a substrate in a manufacturing process of a semiconductor device, A strip-shaped carrier film having a width of 100 mm or less; a plurality of adhesive pieces arranged on the carrier film so as to be aligned in the longitudinal direction of the carrier film; Equipped with The area of the adhesive piece is 10 to 200 mm ２ and the adhesive piece is made of an adhesive composition having a melt viscosity of 3500 to 20000 Pa s at 130°C and containing at least a thermoplastic resin and a thermosetting resin; the content of the thermosetting resin in the adhesive piece is 70 to 240 parts by mass relative to 100 parts by mass of the thermoplastic resin; The weight average molecular weight of the thermoplastic resin is 100,000 or more and 2,000,000 or less, The adhesive film, wherein the thermosetting resin is at least one selected from the group consisting of epoxy resin, acrylic resin, silicone resin, phenolic resin, thermosetting polyimide resin, polyurethane resin, melamine resin, and urea resin.

3. the adhesive composition further comprises a thermosetting resin; 2. The adhesive film according to claim 1, wherein the content of the thermosetting resin is 70 to 240 parts by mass relative to 100 parts by mass of the thermoplastic resin.

4. the adhesive composition further comprises a filler; 3. The adhesive film according to claim 2, wherein the content of the filler is 10 to 450 parts by mass relative to 100 parts by mass of the thermoplastic resin.

5. The adhesive film according to any one of claims 1 to 4, wherein the adhesive piece is formed by die-cutting an adhesive layer formed to cover the surface of the carrier film.

6. The adhesive film according to any one of claims 1 to 5, further comprising a protective member covering a second surface opposite to the first surface on the carrier film side of the adhesive piece and having the same shape as the adhesive piece.

7. The adhesive film according to claim 6, wherein the adhesive piece and the protective member are formed by die-cutting an adhesive layer formed to cover the surface of the carrier film and a protective film arranged to cover the adhesive layer.

Images