PCB Inspection Equipment

Abstract

To conduct inspection without applying a large electrical stress to the board being inspected.SOLUTION: This board inspection device comprises: an electrode part having each electrode 24 for connection that is connected to each probe 23 and disposed on a base 21 and a plurality of electrodes 34 for connection which are disposed on a base 31 so as to be capable of contacting each electrode 24 and connected to a measurement part; and a static elimination part (switch 42 and resistor 43) which is disposed between each electrode 34 and the measurement part and releases charges on each electrode 34 to a reference potential. The electrode part is formed to such a structure that the electrodes 24, 34 are stretchable, and, while an upper test fixture 2 is separated from a lower test fixture 3, the electrodes 24, 34 are placed in a non-contactable state. When the base 21 is brought close to the base 31, the electrodes 24, 34 are contacted before each probe 23 comes into contact with the board X being inspected, and when the base 21 is brought further close to the base 31, come into contact with the board X being inspected by each probe 23.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a substrate inspection device that electrically inspects a substrate by moving at least one of a substrate holding part and a probe unit relative to the other using a moving mechanism, thereby bringing each probe of the probe unit into contact with a substrate to be inspected held by the substrate holding part. [Background technology]

[0002] For example, the following Patent Document discloses a fixture including a unit (hereinafter also referred to as an "upper unit") in which a plurality of upper probe pins (hereinafter also referred to as "upper probes") are embedded in a press plate, and a unit (hereinafter also referred to as a "lower unit") in which a plurality of lower probe pins (hereinafter also referred to as "lower probes") are embedded in a pin board. This fixture is configured so that, with a printed circuit board to be inspected (hereinafter also referred to as "board to be inspected") disposed between the upper and lower units, the press plate of the upper unit and the pin board of the lower unit are brought relatively close to each other, thereby enabling each upper probe to contact one surface (top surface) of the board to be inspected and each lower probe to contact the other surface (bottom surface) of the board to be inspected.

[0003] In this case, the lower unit has guide pins for positioning the substrate to be inspected embedded in the pin board, and a lower positioning base plate (hereinafter also referred to as the "lower base plate") having small holes through which the lower probes and guide pins can be inserted is disposed so as to be movable toward or away from the pin board, and the lower base plate is urged in the direction away from the pin board by a lower board pressure spring (hereinafter also referred to as the "lower spring") disposed between the pin board and the lower base plate. Also, the upper unit has positioning pins for positioning the upper unit with respect to the lower unit embedded in the press plate, and an upper positioning base plate (hereinafter also referred to as the "upper base plate") having small holes through which the upper probes and positioning pins can be inserted is disposed so as to be movable toward or away from the press plate, and the upper base plate is urged in the direction away from the press plate by an upper board pressure spring (hereinafter also referred to as the "upper spring") disposed between the press plate and the upper base plate.

[0004] When testing a board to be tested using this fixture, the board is supported by the guide pins of the lower unit, and the press plate of the upper unit is lowered toward the pin board of the lower unit. First, the upper base plate abuts the board to be tested. Then, the board is pressed by the upper base plate and lowered together with the press plate until it abuts against the lower base plate. When the press plate is further lowered in this state, as the upper springs contract, the tips of the upper probes inserted through the small holes in the upper base plate come into contact with the top surface of the board to be tested, and as the lower springs contract, the tips of the lower probes inserted through the small holes in the lower base plate come into contact with the bottom surface of the board to be tested. This allows electrical testing of the board to be performed via the upper and lower probes. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 9-138257 (pages 2-3, Figures 1-2) Summary of the Invention [Problem to be solved by the invention]

[0006] However, the following problems exist when inspecting a substrate to be inspected using the fixture disclosed in the above-mentioned patent document. Specifically, as clearly stated in the prior art of the above-mentioned patent document, this type of fixture has each probe implanted in accordance with each probe point (probe contact position) defined on the substrate to be inspected. Therefore, when inspecting a substrate with different defined probe contact positions using this type of fixture, it is necessary to attach to the inspection device a fixture in which multiple probes are implanted in accordance with the probe contact positions defined on the substrate.

[0007] In this case, when installing this type of fixture, it is necessary to remove the connection cables connecting the probes of another fixture already installed in the inspection equipment to the measurement unit of the inspection equipment, remove the upper and lower units of the other fixture from the inspection equipment, fix the upper and lower units of the newly installed fixture to the inspection equipment, and connect the probes of both fixed units to the measurement unit with the connection cables. Therefore, for those who inspect multiple types of circuit boards, the fixture replacement work is complicated.

[0008] Furthermore, in a configuration in which the upper unit and the lower unit are connected to the measurement unit via connection cables, the connection cables must be long enough to avoid excessive stress when the moving mechanism moves the unit. Furthermore, to prevent the cables from getting caught on components of the testing device, the PCB under test, or the operator's hands or tools, flat cables or multi-core cables, or cables with multiple thin wires bundled together, must be used. For this reason, long connection cables tend to have multiple connection wires (core wires) densely packed together, resulting in a somewhat large stray capacitance between each connection wire.

[0009] Meanwhile, the applicant has developed, as an example, a fixture that allows each upper probe to be connected to a measurement unit via a lower unit without using a connection cable to connect each upper probe to a measurement unit. In the fixture developed by the applicant, multiple electrodes (hereinafter also referred to as "upper electrodes") connected to each upper probe are arranged on the surface of the upper unit facing the lower unit, and multiple electrodes (hereinafter also referred to as "lower electrodes") are arranged on the surface of the lower unit facing the upper unit at positions where each upper electrode can contact. Each lower electrode and each lower probe are connected to the measurement unit via a connection cable, so that the upper probe is connected to the measurement unit via the upper electrodes, lower electrodes, and connection cable. This eliminates the need for a long connection cable to connect the upper electrodes to the measurement unit, resulting in no stray capacitance between each connection line. This simplifies the fixture replacement process by eliminating the need to attach and detach connection cables when attaching or detaching the upper unit.

[0010] In this case, in the fixture developed by the applicant, the electrodes are arranged so that the upper and lower electrodes are not in contact when the upper unit is separated from the lower unit (such as when a test substrate is being loaded between the upper and lower units, when a test substrate is being unloaded from between the units, or when the test substrate is not being tested). Furthermore, in this fixture, when the upper unit is lowered toward the lower unit with the test substrate disposed between the upper and lower units, the upper probes come into contact with the test substrate, and as the upper unit is further lowered, the upper electrodes come into contact with the lower electrode probes and the lower probes come into contact with the test substrate. This makes it possible to electrically test the test substrate via the upper and lower probes, just as when testing is performed using the fixture disclosed in the above-mentioned patent document.

[0011] However, the fixture developed by the applicant has the following problem. Specifically, the fixture developed by the applicant is configured to be attached to an inspection device so that the upper electrode is spaced apart from the lower unit and is not in contact with the lower electrode. In this case, a large number of upper probes are arranged in close proximity to the upper unit. As a result, the number of upper electrodes and the connection wires connecting the upper probes to the upper electrodes are also very large. To avoid an increase in the size of the upper unit, these many upper electrodes and many connection wires are arranged in close proximity. As a result, a certain amount of stray capacitance exists between each upper probe, between each connection wire, and between each upper electrode. When the upper unit is spaced apart from the lower unit (when the upper electrode is not in contact with the lower electrode), charges generated by surrounding electronic devices and the like may accumulate in each stray capacitance.

[0012] Here, if charge is accumulated in each stray capacitance in the upper unit, when the upper unit is lowered relative to the lower unit, the charge accumulated in each stray capacitance will be released to the test target board via each upper probe when each upper probe contacts the test target board before each upper electrode contacts each lower electrode. Therefore, if the charge accumulated in each stray capacitance is large, a large electrical stress will be applied to the test target board (various elements and circuits arranged on the test target board). Therefore, it is desirable to improve this point.

[0013] The present invention has been made in view of the above-mentioned problems to be solved, and has as its main object to provide a board inspection apparatus that can inspect a board to be inspected without applying a large electrical stress to the board. [Means for solving the problem]

[0014] A substrate inspection apparatus according to the present invention comprises a substrate holding section that holds a substrate to be inspected, a probe unit having a plurality of probes that can each be brought into contact with the substrate to be inspected held by the substrate holding section, a movement mechanism that moves at least one of the probe unit and the substrate holding section toward or away from the other, a measurement section that measures a predetermined amount to be measured of the substrate to be inspected via each of the probes, and a processing section that controls the relative movement of at least one of the probes toward or away from the other by the movement mechanism and the measurement of the amount to be measured by the measurement section, and inspects the substrate to be inspected based on the measured amount to be measured, and the substrate inspection apparatus comprises a plurality of first electrodes that are connected to the probes respectively and arranged on a first base section of the probe unit, and a plurality of second electrodes that are arranged on a second base section of the substrate holding section so as to be able to come into contact with the first electrodes and are connected to the measurement section. The device comprises an electrode unit and a charge removal unit disposed between each of the second electrodes and the measurement unit, which discharges the charge on each of the second electrodes to a reference potential. The electrode unit is formed in an extendable structure in which at least one of the first electrodes and the second electrodes is constantly biased in an extension direction, and the first electrodes and the second electrodes are in a non-contact state when the moving mechanism separates the at least one electrode relative to the other electrode. When the moving mechanism moves the first base portion closer to the second base portion, the first electrodes come into contact with the second electrodes before the probes contact the substrate to be inspected. When the moving mechanism moves the first base portion closer to the second base portion further, the at least one electrode is contracted to allow the probes to contact the substrate to be inspected.

[0015] Therefore, this circuit board inspection device, like the conventional circuit board inspection device developed by the applicant, does not require a long connection cable for connecting the probes to the measurement unit, eliminating stray capacitance between the connection lines of the long connection cable. Furthermore, since the work of attaching and detaching the connection cable is not required when attaching and detaching the probe unit, the replacement work can be simplified. Furthermore, when the probe unit is brought relatively close to the board holder holding the test target board, the first electrodes contact the second electrodes before the probes contact the test target board. Therefore, even if charges accumulate in the stray capacitances between the probes, the first electrodes, and the connection lines connecting the probes to the first electrodes, these charges are discharged to the reference potential via the second electrodes and the charge neutralizing unit, thereby neutralizing the charge on the first electrodes. This allows the charge to be discharged to the test target board via the probes, thereby enabling the test target board to be suitably inspected without applying significant electrical stress to the test target board.

[0016] Further, a substrate inspection apparatus according to the present invention is a substrate inspection apparatus comprising: a substrate holding section that holds a substrate to be inspected; a probe unit having a plurality of probes that can be brought into contact with the substrate to be inspected held by the substrate holding section; a first movement mechanism that moves at least one of the probe unit and the substrate holding section toward and away from the other relatively; a measurement section that measures a predetermined amount to be measured of the substrate to be inspected via each of the probes; and a processing section that controls the relative movement of at least one of the probes toward and away from the other by the first movement mechanism and the measurement of the amount to be measured by the measurement section, and inspects the substrate to be inspected based on the measured amount, and a second electrode unit having a plurality of second electrodes arranged to be in contact with each of the first electrodes and connected to the measurement unit; a second moving mechanism that moves at least one of the first electrode unit and the second electrode unit toward or away from the other relative to the other; and a charge removal unit that is arranged between each of the second electrodes and the measurement unit and releases charge on each of the second electrodes to a reference potential, and the processing unit controls the second moving mechanism to bring at least one of the first electrodes toward or away from the other to bring each of the probes into contact with the test substrate, before using the first moving mechanism to bring at least one of the first electrodes toward or away from the other to bring each of the probes into contact with the test substrate.

[0017] Therefore, as with the conventional substrate inspection apparatus developed by the applicant, this substrate inspection apparatus does not require a long connection cable for connecting the probes to the measurement unit, and stray capacitance between the connection lines in the long connection cable can be eliminated. Furthermore, before the first movement mechanism brings the probes into contact with the substrate under test, the second movement mechanism moves at least one of the first electrode unit and the second electrode unit closer to the other so that the first electrodes come into contact with the second electrodes. Therefore, even if charges have accumulated in the stray capacitance between the probes, the first electrodes, and the connection lines connecting the probes to the first electrodes, these charges are discharged to the reference potential via the second electrodes and the charge neutralizing unit, thereby neutralizing the charge on the first electrodes. As a result, the charges are discharged to the substrate under test via the probes, and the substrate under test can be suitably inspected without applying significant electrical stress to the substrate.

[0018] In addition, the substrate inspection device according to the present invention includes a scanner that selectively connects a specified one of the second electrodes to the charge elimination unit and the measurement unit, and the charge elimination unit includes a series circuit of a switch circuit and a resistive element, one end of which is connected to the second electrode selected by the scanner and the other end of which is connected to the reference potential, and the processing unit controls the scanner so that all of the second electrodes are connected to the charge elimination unit when the first electrodes and the second electrodes are in contact with each other, and controls the switch circuit to an on state, and when the measured quantity is measured by the measurement unit, controls the switch circuit to an off state and controls the scanner so that only the second electrodes connected to the probe that is to measure the measured quantity are connected to the measurement unit.

[0019] Therefore, with this substrate inspection device, even if electric charges are accumulated in the floating capacitances between each probe, between each first electrode, and between each connecting wiring connecting each probe and each first electrode, these electric charges can be reliably released to the reference potential, and the influence of the reference potential when measuring the quantity to be measured using each probe can be preferably avoided. [Effects of the Invention]

[0020] According to the substrate inspection device of the present invention, the charge on each first electrode is discharged to the reference potential by the charge removal unit before each probe comes into contact with the substrate to be inspected, so that the substrate to be inspected can be suitably inspected via each probe without applying large electrical stress to the substrate. [Brief explanation of the drawings]

[0021] [Figure 1] 1 is a diagram showing the configuration of a substrate inspection device 1. FIG. [Figure 2] 1 is an explanatory diagram for explaining the positional relationship between an upper test fixture 2 and a lower test fixture 3 in a substrate inspection device 1, and the connection state of each switch 41, 42 in a scanner 5. FIG. [Figure 3] 10 is another explanatory diagram for explaining the positional relationship between the upper test fixture 2 and the lower test fixture 3 in the substrate inspection apparatus 1, and the connection state of each switch 41, 42 in the scanner 5. FIG. [Figure 4] 10 is yet another explanatory diagram for explaining the positional relationship between the upper test fixture 2 and the lower test fixture 3 in the substrate inspection apparatus 1, and the connection state of each switch 41, 42 in the scanner 5. FIG. [Figure 5] 10 is yet another explanatory diagram for explaining the positional relationship between the upper test fixture 2 and the lower test fixture 3 in the substrate inspection apparatus 1, and the connection state of each switch 41, 42 in the scanner 5. FIG. [Figure 6] FIG. 1 is a diagram showing the configuration of a substrate inspection device 1A. [Figure 7] 1 is a configuration diagram showing the configuration of an upper test fixture 2a and an electrode unit 2b in a substrate inspection apparatus 1A. [Figure 8] FIG. 2 is a diagram showing the configuration of a substrate inspection device 1B. [Figure 9] 10 is a configuration diagram showing the configuration of a lower test fixture 3a and an electrode unit 3b in a substrate inspection apparatus 1B. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0022] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a substrate inspection device according to the present invention will be described with reference to the accompanying drawings.

[0023] 1 is an example of a "board inspection device" and includes an upper test fixture 2, a lower test fixture 3, a moving mechanism 4, a scanner 5, a measuring unit 6, an operation unit 7, a display unit 8, a processing unit 9, and a memory unit 10, and is configured to measure "predetermined measurement quantities (current value, voltage value, resistance value, etc.)" of an inspection target board X to inspect the quality of the inspection target board X. In this case, the inspection target board X is an example of an "inspection target board," and probe contact positions for electrically inspecting the quality of the inspection target board X are specified on one surface Fa (top surface) and the other surface Fb (bottom surface), respectively.

[0024] The upper test fixture 2 is an example of a "probe unit" and includes a base 21, pressing pins 22, 22··, probes 23, 23··, connection electrodes 24, 24··, and connection wires 25, 25··, as shown in FIGS. 2 to 5. The base 21 is an example of a "first base" and functions as a support for positioning the components 22 to 25 at predetermined positions, and also functions as an attachment member for attaching the upper test fixture 2 to the movement mechanism 4. The pressing pin 22 is a member embedded in the base 21 that presses the test target board X supported (held) by the lower test fixture 3 and moves it together with the base 21 when the base 21 is moved toward the lower test fixture 3 by the movement mechanism 4 (when the base 21 is brought close to the lower test fixture 3), as will be described later.

[0025] The probe 23 corresponds to a "probe" and, as an example, is configured as an extendable pin-shaped probe that is constantly biased in the extension direction by a built-in biasing member, and is embedded in the base 21 so as to be able to contact each probe point according to the position of each probe point defined on one surface Fa of the test target substrate X. The connection electrode 24 is an example of a "first electrode" and, as an example, is configured as an extendable pin-shaped electrode that is constantly biased in the extension direction by a built-in biasing member (an example of an "extendable structure constantly biased in the extension direction") and is embedded in the base 21. The connection electrode 24 is connected to the probe 23 via a connection wiring 25. The connection wiring 25 is wiring for electrically connecting the probe 23 and the connection electrode 24 to each other, and, as an example, is configured as an insulating-coated shielded wire.

[0026] The lower test fixture 3 is a probe unit that functions as a "board holder" and includes a base 31, support pins 32, 32···, probes 33, 33···, connection electrodes 34, 34···, connection wires 35a, 35a···, and connection wires 35b, 35b···. The base 31 is an example of a "second base" and functions as a support for positioning the above-mentioned components 32 to 34, 35a, 35b at predetermined positions, as well as a fixing member for fixing the lower test fixture 3 at a predetermined position in the board inspection apparatus 1. The support pin 32 functions as a "support member" for supporting the test target board X and as a "positioning member" for positioning the test target board X relative to the lower test fixture 3. For example, the support pin 32 is an extendable pin-shaped member that is constantly biased in the extension direction by a built-in biasing member and is embedded in the base 31.

[0027] The probe 33 is, for example, an extendable pin-shaped probe that is constantly biased in the extension direction by a built-in biasing member, similar to each probe 23 of the upper test fixture 2, and is embedded in the base 31 so as to be able to contact each probe point according to the position of each probe point defined on the other surface Fb of the test target board X. The connection electrode 34 corresponds to the "second electrode" and, for example, is an extendable pin-shaped electrode that is constantly biased in the extension direction by a built-in biasing member, similar to the connection electrode 24 of the upper test fixture 2 (an example of an "extendable structure constantly biased in the extension direction"), and is embedded in the base 31 so as to be able to contact the connection electrode 24, as will be described later. The connection electrode 34 is connected to the scanner 5 via a connection wiring 35a when the lower test fixture 3 is attached to the board inspection apparatus 1, and is then connected to the measurement unit 6 via the scanner 5.

[0028] The connecting wire 35a is a wire for electrically connecting the connecting electrode 34 to the scanner 5, and is configured, for example, by an insulating shielded wire. The connecting wire 35b is a wire for electrically connecting the probe 33 to the scanner 5, and is configured, for example, by an insulating shielded wire. Note that, in FIGS. 2 to 5, to facilitate understanding of the configuration of the circuit board inspection apparatus 1, the connecting wires 35a and 35b are shown directly connected to the scanner 5; however, signal cables may be interposed between the connecting wire 35a connected to the connecting electrode 34 and the connecting wire 35b connected to the probe 33 and the scanner 5 via connecting connectors. In addition, in the circuit board inspection apparatus 1 of this example, the connecting electrode 24 of the upper test fixture 2 and the connecting electrode 34 of the lower test fixture 3 together form an "electrode section."

[0029] The moving mechanism 4 is an example of a "moving mechanism," and in the substrate inspection device 1 of this example, as an example, a configuration is adopted in which the moving mechanism 4 lowers or raises the upper test fixture 2 relative to the fixedly installed lower test fixture 3 under the control of the processing unit 9, thereby moving the upper test fixture 2 closer to or farther away from the lower test fixture 3 (an example configuration in which "at least one of the probe unit and the substrate holding unit" is the upper test fixture 2 and "the other of the probe unit and the substrate holding unit" is the lower test fixture 3).

[0030] The scanner 5 includes switches 41a, 41a..., 41b, 41b..., a switch 42, and a resistor 43. The switches 41a connect the connecting wires 35a connected to the switches 42 and the measurement unit 6, thereby connecting the probes 23 connected to the connecting wires 35a via the connecting wires 25 and the connecting electrodes 24 and 34 to the switches 42 and the measurement unit 6. The switches 41b connect the connecting wires 35b connected to the switches 42 and the measurement unit 6, thereby connecting the probes 33 connected to the connecting wires 35b to the switches 42 and the measurement unit 6. In the circuit board inspection device 1 of this example, the switches 41a, 41a..., 41b, 41b... correspond to the "scanner." Hereinafter, when there is no need to distinguish between the switches 41a and 41b, they will also be referred to as "switches 41."

[0031] The switch 42 is an example of a "switch circuit," and together with a resistor 43, which is an example of a "resistive element," constitutes a "series circuit of a switch circuit and a resistive element," and also connects the connection wirings 35a and 35b connected by the switch 41 to a reference potential (ground potential) via the resistor 43. In this case, in the substrate inspection device 1 (scanner 5) of this example, the switch 42 and resistor 43 together constitute a "static elimination unit that is disposed between each second electrode and the measurement unit and that releases the charge on each second electrode to the reference potential."

[0032] The measurement unit 6 is an example of a "measurement unit" and, as will be described later, measures "predetermined measured quantities" for the inspection target substrate X via probes 23, 33 connected by the scanner 5 under the control of the processing unit 9, and outputs the measurement values to the processing unit 9. The operation unit 7 has a plurality of operation switches for setting the operating conditions (inspection conditions for the inspection target substrate X) of the substrate inspection apparatus 1 and for instructing the start / stop of inspection, and outputs operation signals in response to switch operations to the processing unit 9. The display unit 8 displays, under the control of the processing unit 9, a setting screen for the operating conditions (inspection conditions) of the substrate inspection apparatus 1, an inspection screen showing the progress status of the inspection process for the inspection target substrate X, and the inspection results.

[0033] The processing unit 9 comprehensively controls the substrate inspection apparatus 1. Specifically, the processing unit 9 is an example of a "processing unit" and controls the movement of the upper test fixture 2 toward and away from the lower test fixture 3 by the moving mechanism 4, the connection switching of the switches 41 and 42 in the scanner 5, and the measurement of the "measurement quantity" by the measurement unit 6. The processing unit 9 also inspects the quality of the inspection target substrate X based on the "measurement quantity" measured by the measurement unit 6 and the inspection reference value. The memory unit 10 stores the operation program of the processing unit 9, the inspection reference value, the measurement results of the "measurement quantity" by the measurement unit 6, the inspection results of the inspection target substrate X by the processing unit 9, etc.

[0034] In this case, as shown in FIG. 2, in the substrate inspection apparatus 1 of this example, when the lower test fixture 3 is fixed at a specified position and the upper test fixture 2 is fixed to a moving mechanism 4 and moved by the moving mechanism 4 to a position spaced apart from the lower test fixture 3 (an example of a "state in which the probe unit is spaced apart relative to the substrate holding part by the moving mechanism"; hereinafter, also referred to simply as the "spaced state"), the upper test fixture 2 and the lower test fixture 3 are configured so that the distance between the tip of each connection electrode 24 and the tip of each connection electrode 34 is shorter than the distance between the tip of each probe 23 and the tip of each probe 33, and the difference between the two distances is greater than the thickness of the substrate X to be inspected.

[0035] Next, the operation of the substrate inspection apparatus 1 when inspecting the substrate X to be inspected will be described with reference to the accompanying drawings. In practice, a substrate transport mechanism may be used to carry the substrate X to the inspection position (between the upper test fixture 2 and the lower test fixture 3) by the substrate inspection apparatus 1 and to carry the substrate X to a predetermined carry-out position after the inspection is completed, but in order to make it easier to understand the "substrate inspection apparatus," illustrations and descriptions of devices other than the substrate inspection apparatus 1 will be omitted.

[0036] When inspecting the inspection target board X using this board inspection apparatus 1, an upper test fixture 2 and a lower test fixture 3, in which the probes 23 and 33 are implanted, are prepared corresponding to the inspection target board X and attached to the board inspection apparatus 1. When attaching the prepared upper test fixture 2 or lower test fixture 3, if another upper test fixture 2 or lower test fixture 3 corresponding to another "inspection target board" is attached, they are removed in advance by following the procedure reverse to the attachment procedure described below.

[0037] On the other hand, when mounting the upper test fixture 2 and the lower test fixture 3 corresponding to the test target board X, for example, first, the base 21 of the upper test fixture 2 is fixed to the moving mechanism 4 with the surface on which the pressing pins 22, the probes 23, and the connection electrodes 24 are implanted facing downward. Next, the base 31 of the lower test fixture 3 is fixed in a specified position with the surface on which the support pins 32, the probes 33, and the connection electrodes 34 are implanted facing upward. This completes the fixation of the upper test fixture 2 and the lower test fixture 3 in a state where the tips of the connection electrodes 24 of the upper test fixture 2 and the tips of the connection electrodes 34 of the lower test fixture 3 face each other at a distance (an example of a "non-contact state between the first electrodes and the second electrodes"). Next, the connection wiring 35a and 35b of the lower test fixture 3 are connected to the scanner 5. With the above steps, the installation of the upper test fixture 2 and the lower test fixture 3 is completed.

[0038] Next, the inspection of the substrate X to be inspected begins. Specifically, the substrate X to be inspected is carried in between the upper test fixture 2 and the lower test fixture 3, and is placed on the support pins 32 of the lower test fixture 3 with one surface Fa facing upward (with the one surface Fa facing the upper test fixture 2), as shown by the dashed line in FIG. 2. At this time, in the substrate inspection apparatus 1 (lower test fixture 3) of this example, the lengths of the support pins 32 and the probes 33 (the protruding lengths from the bases 31) are specified so that, when the substrate X to be inspected is placed on the support pins 32, a gap is generated between the tip of each probe 33 and the other surface Fb of the substrate X to be inspected. Therefore, the probes 33 are not in contact with the substrate X to be inspected, and the substrate X to be inspected is supported only by the support pins 32.

[0039] Next, when the processing unit 9 determines that the setting of the inspection target substrate X is complete based on the operation of the operation unit 7 or a signal output from the transport mechanism or the like, it controls all switches 41 of the scanner 5 to the on state and controls switch 42 to the on state, as shown in Fig. 3. As a result, all connection wires 35a, 35b are connected to the reference potential via resistor 43. Therefore, even if electric charges have accumulated in the stray capacitances between the connection electrodes 34 and the connection wires 35a, or between the probes 33 and the connection wires 35b before the switches 41, 42 are controlled to the on state, these electric charges are discharged to the reference potential by the "charge elimination unit (in this example, switch 42 and resistor 43)" and are thus neutralized.

[0040] Next, the processing unit 9 controls the moving mechanism 4 to lower the upper test fixture 2 (base 21) (bringing the base 21 closer to the base 31 of the lower test fixture 3). At this time, as shown in the figure, the probes 23 and the pressing pins 22 are out of contact with the surface Fa of the test target board X, and the tip end (lower end) of each connecting electrode 24 is in contact with the tip end (upper end) of each connecting electrode 34 (this is an example of the state where "when the first base is moved closer relative to the second base by the moving mechanism, each first electrode is in relative contact with each second electrode before each probe comes into contact with the test target board").

[0041] At this time, each probe 23, each connection wire 25, and each connection electrode 24 of the upper test fixture 2 is connected to the reference potential via each connection electrode 34, each connection wire 35a, each switch 41, switch 42, and resistor 43. Therefore, even if charges have accumulated in the stray capacitances between each probe 23, each connection wire 25, and each connection electrode 24 before each connection electrode 24 comes into contact with each connection electrode 34, these charges (charges on each connection electrode 24) are released to the reference potential by the "charge elimination unit (in this example, switch 42 and resistor 43)" and are thus neutralized.

[0042] Next, when the base 21 is further lowered by the movement mechanism 4, the connection electrodes 24, 34 are retracted while still in contact with each other, and each probe 23 of the upper test fixture 2 comes into contact with one surface Fa of the test target board X, as shown in Fig. 4 (this is an example of a state in which "when the first base is brought further closer relative to the second base by the movement mechanism, at least one of the first electrodes and the second electrodes is retracted to allow each probe to come into contact with the test target board"). At this time, since the stray capacitances are neutralized before the probes 33 come into contact with the one surface Fa, it is possible to avoid a situation in which a large electrical stress is applied to the test target board X via the probes 23 in contact with the one surface Fa (a situation in which the charge accumulated in the stray capacitance flows into the test target board X).

[0043] Subsequently, when the base 21 is further lowered by the movement mechanism 4, the connection electrodes 24, 34 are retracted while in contact with each other, and the probes 23 are retracted while in contact with one surface Fa of the test target board X, and the pressing pin 22 of the upper test fixture 2 comes into contact with the one surface Fa of the test target board X. When the base 21 is further lowered in this state, the probes 23 are not retracted but remain in contact with the one surface Fa of the test target board X, and the connection electrodes 24, 34 are retracted while in contact with each other, and the test target board X, whose one surface Fa has been pressed downward by the pressing pin 22, is lowered together with the base 21 (pressing pin 22).

[0044] 5, the support pins 32 of the lower test fixture 3 are retracted, and the probes 33 are brought into contact with the other surface Fb of the test target substrate X. Thereafter, when the base 21 is lowered until the probes 33 are sufficiently retracted and pressed against the other surface Fb of the test target substrate X with sufficient pressing force, the processing unit 9 stops the lowering of the base 21 (upper test fixture 2) by the moving mechanism 4.

[0045] After this, the processing unit 9 controls the switch 42 of the scanner 5 to the OFF state, controls only the switch 41 connected to the probes 23, 33 whose "measurement quantities" are to be measured to the ON state, and controls the other switches 41 to the OFF state, thereby repeatedly executing the process of having the measurement unit 6 measure the "measurement quantities." The processing unit 9 also determines whether the inspection target substrate X is good or bad based on the measured "measurement quantities" and the inspection reference values stored in the memory unit 10. Furthermore, when the processing unit 9 has completed measuring all the "measurement quantities" to be measured, it controls the moving mechanism 4 to raise the upper test fixture 2 (base 21) (moves the base 21 away from the base 31 of the lower test fixture 3). After this, the inspection target substrate X, which has completed the inspection, is removed from between the upper test fixture 2 and the lower test fixture 3, thereby completing the inspection process for one inspection target substrate X.

[0046] As described above, this substrate inspection device 1 includes the upper test fixture 2, the lower test fixture 3, the moving mechanism 4, the measuring unit 6, and the processing unit 9, and also includes an "electrode unit" having a plurality of connection electrodes 24 connected to each probe 23 and disposed on the base 21 of the upper test fixture 2, and a plurality of connection electrodes 34 disposed on the base 31 of the lower test fixture 3 so as to be able to come into contact with each connection electrode 24 and connected to the measuring unit 6, and a "charge elimination unit (switch 42 and resistor 43 in this example)" disposed between each connection electrode 34 and the measuring unit 6 to discharge the charge on each connection electrode 24 to a reference potential, and the "electrode unit" constantly urges at least one of each connection electrode 24 and each connection electrode 34 (both in this example) in the extension direction. and when the upper test fixture 2 is spaced relatively from the lower test fixture 3 by the moving mechanism 4, the connection electrodes 24 and the connection electrodes 34 are out of contact with each other, and when the base 21 is moved relatively closer to the base 31 by the moving mechanism 4, the connection electrodes 24 come into contact with the connection electrodes 34 before the probes 23 come into contact with the substrate X to be inspected, and when the base 21 is moved further closer to the base 31 by the moving mechanism 4, at least one of the connection electrodes 24 and the connection electrodes 34 (in this example, both) is contracted to allow the probes 23 to come into contact with the substrate X to be inspected.

[0047] Therefore, according to this substrate inspection device 1, similar to the conventional substrate inspection device developed by the applicant, a "long connection cable" for connecting the probe 23 to the measurement unit 6 is not required, and it is possible to eliminate stray capacitance between the connection lines of this "long connection cable." In addition, when attaching or detaching the upper test fixture 2, the replacement work can be simplified by not requiring the work of attaching or detaching the "connection cable." Furthermore, when the upper test fixture 2 is brought close to the lower test fixture 3 that holds (supports) the test target board X, the connection electrodes 24 come into contact with the connection electrodes 34 before the probes 23 come into contact with the test target board X, so even if charges have accumulated in the stray capacitance between the probes 23, between the connection wires 25, and between the connection electrodes 24, these charges are discharged to the reference potential via the connection electrodes 34, the connection wires 35a, the switch 41, and the "charge elimination unit (in this example, the switch 42 and the resistor 43)," thereby discharging the charges on the connection electrodes 24. As a result, the charges are discharged to the test target board X via the probes 23, and the test target board X can be suitably tested without applying a large electrical stress to the test target board X.

[0048] In addition, this substrate inspection device 1 is provided with a scanner 5 that selectively connects a connection electrode 34 selected by a processing unit 9 from among the connection electrodes 34 to a "charge elimination unit" and a measurement unit 6, and the "charge elimination unit" has a "series circuit" of a switch 42 and a resistor 43, and is configured so that one end of the "series circuit" is connected to the connection electrode 34 selected by the scanner 5 and the other end of the "series circuit" is connected to a reference potential, and the processing unit 9 controls the scanner 5 (switch 41) so that when each connection electrode 24 and each connection electrode 34 are in contact with each other, each connection electrode 34 is connected to the "charge elimination unit," and controls the switch 42 to an on state, and when the "measured quantity" is measured by the measurement unit 6, it controls the switch 42 to an off state and controls the scanner 5 so that only each connection electrode 34 connected to the probe 23 that is to measure the "measured quantity" is connected to the measurement unit 6.

[0049] Therefore, with this substrate inspection device 1, even if electric charges are accumulated in the floating capacitances between each probe 23, between each connection wiring 25, and between each connection electrode 24, these electric charges can be reliably released to the reference potential, and the influence of the reference potential can be preferably avoided when measuring the "quantity to be measured" using each probe 23.

[0050] Next, another embodiment of the "circuit board inspection device" will be described. Note that components in the circuit board inspection device 1A shown in Fig. 6 that have the same functions as those in the circuit board inspection device 1 described above will be assigned the same reference numerals and redundant explanations will be omitted.

[0051] The substrate inspection apparatus 1A shown in Figure 6 is another example of a "substrate inspection apparatus", and is equipped with an upper test fixture 2a and an electrode unit 2b instead of the upper test fixture 2 in the substrate inspection apparatus 1, and is equipped with moving mechanisms 4a and 4b instead of the moving mechanism 4 in the substrate inspection apparatus 1.

[0052] The upper test fixture 2a is another example of a "probe unit," and as shown in Fig. 7, includes pressing pins 22 and probes 23. The electrode unit 2b is an example of a "first electrode unit," and includes a plurality of connection electrodes 24 connected to the probes 23 of the upper test fixture 2a via connection wiring 25. In other words, in this circuit board inspection apparatus 1A, the upper test fixture 2 in the circuit board inspection apparatus 1 is divided into two parts: a portion (upper test fixture 2a) where the pressing pins 22 and probes 23 are implanted, and a portion (electrode unit 2b) where the connection electrodes 24 are implanted, and the probes 23 of the upper test fixture 2a and the connection electrodes 24 of the electrode unit 2b are interconnected by connection wiring 25.

[0053] The moving mechanism 4a is an example of a "first moving mechanism," and in the substrate inspection apparatus 1A of this example, as an example, a configuration is adopted in which the moving mechanism 4a lowers or raises the upper test fixture 2a relative to the fixedly installed lower test fixture 3 under the control of the processing unit 9, thereby moving the upper test fixture 2a closer to or farther away from the lower test fixture 3 (an example configuration in which "at least one of the probe unit and the substrate holding unit" is the upper test fixture 2a, and "the other of the probe unit and the substrate holding unit" is the lower test fixture 3).

[0054] The moving mechanism 4b is an example of a "second moving mechanism," and in the circuit board inspection apparatus 1A of this example, as an example, the moving mechanism 4b lowers or raises the electrode unit 2b under the control of the processing unit 9 relative to the fixedly installed lower test fixture 3, thereby moving the electrode unit 2b closer to or farther away from the lower test fixture 3 (an example configuration in which "at least one of the first electrode unit and the second electrode unit" is the electrode unit 2b, and "the other of the first electrode unit and the second electrode unit" is the lower test fixture 3). Note that in this circuit board inspection apparatus 1A, the locations where the connection electrodes 34 are arranged in the lower test fixture 3 correspond to the "second electrode unit" (an example in which the "circuit board holding unit" and the "second electrode unit" are integrally configured).

[0055] When inspecting a substrate X to be inspected using this substrate inspection apparatus 1A, an upper test fixture 2a and a lower test fixture 3, in which probes 23, 33 are implanted corresponding to the substrate X to be inspected, and an electrode unit 2b, in which connection electrodes 24 are implanted corresponding to the connection electrodes 34 of the lower test fixture 3, are prepared and mounted on the substrate inspection apparatus 1A. Note that when the prepared upper test fixture 2a, electrode unit 2b, and lower test fixture 3 are mounted, if other upper test fixtures 2a, electrode units 2b, and lower test fixtures 3 corresponding to other "substrates to be inspected" are mounted, they are removed beforehand by performing the reverse procedure of the mounting procedure described below.

[0056] On the other hand, when attaching the upper test fixture 2a, the electrode unit 2b, and the lower test fixture 3, for example, first, the upper test fixture 2a is fixed to the moving mechanism 4a with the surface on which the pressing pins 22 and the probes 23 are implanted facing downward, and the electrode unit 2b is fixed to the moving mechanism 4b with the surface on which the connection electrodes 24 are implanted facing downward. Next, the base 31 of the lower test fixture 3 is fixed in a specified position with the surface on which the support pins 32, the probes 33, and the connection electrodes 34 are implanted facing upward. This completes the fixation of the upper test fixture 2a, the electrode unit 2b, and the lower test fixture 3 in a state where the tip ends of the connection electrodes 24 of the electrode unit 2b and the tip ends of the connection electrodes 34 of the lower test fixture 3 face each other at a distance (an example of a "non-contact state between the first electrodes and the second electrodes"). Next, the connection wires 35a and 35b of the lower test fixture 3 are connected to the scanner 5. With the above, the installation work of the upper test fixture 2a, the electrode unit 2b and the lower test fixture 3 is completed.

[0057] Next, the inspection of the test target substrate X begins. Specifically, the test target substrate X is carried in between the upper test fixture 2a and the lower test fixture 3, and is placed on the support pins 32 of the lower test fixture 3 with one surface Fa facing upward (so that the one surface Fa faces the upper test fixture 2a). At this time, the test target substrate X is supported only by the support pins 32 with the probes 33 not in contact with the test target substrate X.

[0058] Next, when the processing unit 9 determines that the setting of the inspection target substrate X is complete based on the operation of the operation unit 7 or a signal output from the transport mechanism or the like, it controls all switches 41 of the scanner 5 to the on state and also controls switch 42 to the on state. As a result, all connection wires 35a, 35b are connected to the reference potential via resistor 43. Therefore, even if electric charges have accumulated in the stray capacitances between the connection electrodes 34 and the connection wires 35a, or between the probes 33 and the connection wires 35b before the switches 41, 42 are controlled to the on state, these electric charges are discharged to the reference potential by the "charge elimination unit (in this example, switch 42 and resistor 43)" and are thus neutralized.

[0059] Next, the processing unit 9 controls the moving mechanism 4a to maintain the upper test fixture 2a spaced apart from the lower test fixture 3, while controlling the moving mechanism 4b to lower the electrode unit 2b (bringing the electrode unit 2b closer to the lower test fixture 3). At this time, the tip (lower end) of each connection electrode 24 comes into contact with the tip (upper end) of each connection electrode 34 (an example of a process in which "prior to using the first moving mechanism to bring the probe unit closer relative to the substrate holding part so that each probe comes into contact with the substrate to be inspected, the second moving mechanism is controlled to bring at least one of the first and second electrode units (in this example, the first electrode unit) closer relative to the other (in this example, the second electrode unit) so that each first electrode comes into contact with each second electrode").

[0060] At this time, each probe 23, each connection wire 25, and each connection electrode 24 is connected to the reference potential via each connection electrode 34, each connection wire 35a, each switch 41, switch 42, and resistor 43. Therefore, even if charges have accumulated in the stray capacitances between each probe 23, each connection wire 25, and each connection electrode 24 before each connection electrode 24 comes into contact with each connection electrode 34, these charges (charges on each connection electrode 24) are released to the reference potential by the "charge elimination unit (in this example, switch 42 and resistor 43)" and are thus neutralized.

[0061] Next, the processing unit 9 controls the moving mechanism 4a to lower the upper test fixture 2a (bring the upper test fixture 2a closer to the lower test fixture 3). At this time, each probe 23 of the upper test fixture 2a comes into contact with one surface Fa of the test target substrate X. At this time, since each of the stray capacitances is neutralized before the probes 33 come into contact with the one surface Fa, it is possible to avoid a situation in which a large electrical stress is applied to the test target substrate X via the probes 23 in contact with the one surface Fa (a situation in which the charge accumulated in the stray capacitance flows into the test target substrate X).

[0062] Subsequently, when the upper test fixture 2a is further lowered by the moving mechanism 4a, the probes 23 are retracted while in contact with the surface Fa of the test target substrate X, and the pressing pins 22 of the upper test fixture 2a come into contact with the surface Fa of the test target substrate X. When the upper test fixture 2a is further lowered in this state, the probes 23 are not retracted but remain in contact with the surface Fa of the test target substrate X, and the test target substrate X, whose surface Fa has been pressed downward by the pressing pins 22, is lowered together with the base 21 (pressing pins 22).

[0063] As a result, the support pins 32 of the lower test fixture 3 are retracted, and each probe 33 is brought into contact with the other surface Fb of the test target substrate X. Thereafter, when the upper test fixture 2a has been lowered until each probe 33 has been sufficiently retracted and is pressed against the other surface Fb of the test target substrate X with sufficient pressing force, the processing unit 9 stops the lowering of the upper test fixture 2a by the moving mechanism 4a.

[0064] After this, the processing unit 9 controls the switch 42 of the scanner 5 to the OFF state, controls only the switch 41 connected to the probes 23, 33 whose "measurement quantities" are to be measured to the ON state, and controls the other switches 41 to the OFF state, repeatedly executing a process of causing the measurement unit 6 to measure the "measurement quantities." The processing unit 9 also determines whether the inspection target substrate X is good or bad based on the measured "measurement quantities" and the inspection reference values stored in the memory unit 10. Furthermore, when the processing unit 9 has completed measuring all the "measurement quantities" to be measured, it controls the moving mechanism 4a to lift the upper test fixture 2a and the moving mechanism 4b to lift the electrode unit 2b (moving the upper test fixture 2a and the electrode unit 2b away from the lower test fixture 3). After this, the inspection target substrate X, which has completed the inspection, is removed from between the upper test fixture 2a and the electrode unit 2b and the lower test fixture 3, thereby completing the inspection process for one inspection target substrate X.

[0065] As described above, this substrate inspection device 1A includes the upper test fixture 2a, the lower test fixture 3, the moving mechanism 4a, the measuring section 6, and the processing section 9, and also includes an electrode unit 2b having a plurality of connection electrodes 24 connected to each of the probes 23, and a "second electrode unit (in this example, the implantation site of each connection electrode 34 in the lower test fixture 3)" having a plurality of connection electrodes 34 arranged so as to be able to come into contact with each of the connection electrodes 24 and connected to the measuring section 6, and a mechanism for connecting at least one of the electrode unit 2b and the "second electrode unit (lower test fixture 3)" (in this example, the electrode unit 2b) to the other (lower test fixture 3). and a "discharge section (a switch 42 and a resistor 43 in this example)" that is disposed between each connecting electrode 34 and the measuring section 6 and that discharges the charge on each connecting electrode 24 to the reference potential. Before the processing section 9 uses the moving mechanism 4a to bring the upper test fixture 2a relatively close to the lower test fixture 3 and bring each probe 23 into contact with the test target substrate X, the processing section 9 controls the moving mechanism 4b to bring the electrode unit 2b relatively close to the "second electrode unit (lower test fixture 3)" and bring each connecting electrode 24 into contact with each connecting electrode 34.

[0066] Therefore, according to this board inspection apparatus 1A, similar to the conventional board inspection apparatus developed by the applicant, a "long connection cable" for connecting the probes 23 to the measurement unit 6 is not required, and it is possible to eliminate stray capacitance between the connection lines of this "long connection cable." Furthermore, before the movement mechanism 4a brings each probe 23 into contact with the inspection target board X, the movement mechanism 4b moves the electrode unit 2b closer to the lower test fixture 3, causing each connection electrode 24 to contact each connection electrode 34. Therefore, even if charges have accumulated in the stray capacitance between each probe 23, each connection wire 25, and each connection electrode 24, these charges are released to the reference potential via each connection electrode 34, each connection wire 35a, switch 41, and the "charge elimination unit (in this example, switch 42 and resistor 43)," and the charge on the connection electrode 24 is eliminated. As a result, the electric charges are not discharged to the inspection target substrate X via the probe 23, and large electrical stress is not applied to the inspection target substrate X, so that the inspection target substrate X can be suitably inspected.

[0067] In addition, this substrate inspection device 1A is provided with a scanner 5 that selectively connects a connection electrode 34 selected by a processing unit 9 from among the connection electrodes 34 to a "charge elimination unit" and a measurement unit 6, and the "charge elimination unit" has a "series circuit" of a switch 42 and a resistor 43, and is configured so that one end of the "series circuit" is connected to the connection electrode 34 selected by the scanner 5 and the other end of the "series circuit" is connected to a reference potential, and the processing unit 9 controls the scanner 5 (switch 41) so that when each connection electrode 24 and each connection electrode 34 are in contact with each other, each connection electrode 34 is connected to the "charge elimination unit," and controls the switch 42 to an on state, and when the "measured quantity" is measured by the measurement unit 6, it controls the switch 42 to an off state and controls the scanner 5 so that only each connection electrode 34 connected to the probe 23 that is to measure the "measured quantity" is connected to the measurement unit 6.

[0068] Therefore, with this substrate inspection device 1A, even if electric charges are accumulated in the floating capacitances between each probe 23, between each connection wiring 25, and between each connection electrode 24, these electric charges can be reliably released to the reference potential, and the influence of the reference potential can be preferably avoided when measuring the "quantity to be measured" using each probe 23.

[0069] 8 is yet another example of the "board inspection apparatus," and includes a lower test fixture 3a and an electrode unit 3b instead of the lower test fixture 3 in the board inspection apparatus 1A, and includes a movement mechanism 4c instead of the movement mechanism 4b in the board inspection apparatus 1A. Note that components in the board inspection apparatus 1B shown in the figure that have the same functions as those in the above-mentioned board inspection apparatuses 1 and 1A are assigned the same reference numerals, and redundant explanations will be omitted.

[0070] The lower test fixture 3a is another example of a "board holding portion," and as shown in Fig. 9, includes support pins 32, probes 33, and connection wires 35b. The electrode unit 3b is an example of a "second electrode unit," and includes connection electrodes 34 and connection wires 35a. In other words, in this board inspection apparatus 1B, the lower test fixture 3 in the board inspection apparatuses 1 and 1A is divided into two parts: a part where the support pins 32 and probes 33 are implanted (lower test fixture 3a), and a part where the connection electrodes 34 are implanted (electrode unit 3b).

[0071] The moving mechanism 4c is an example of a "second moving mechanism", and in the substrate inspection apparatus 1B of this example, as an example, a configuration is adopted in which the moving mechanism 4c raises or lowers the electrode unit 3b under the control of the processing unit 9 relative to the fixedly installed electrode unit 2b, thereby moving the electrode unit 3b closer to or farther away from the electrode unit 2b (an example configuration in which "at least one of the first electrode unit and the second electrode unit" is the electrode unit 3b, and "the other of the first electrode unit and the second electrode unit" is the electrode unit 2b). Note that in this substrate inspection apparatus 1B, the electrode unit 2b is fixed at a specified position.

[0072] When inspecting the inspection target board X using this board inspection apparatus 1B, an upper test fixture 2a and a lower test fixture 3a, in which the probes 23, 33 are implanted, corresponding to the inspection target board X, and electrode units 2b, 3b, in which the connection electrodes 24, 34 are arranged so that they can come into contact with each other, are prepared and mounted on the board inspection apparatus 1B. Note that when the prepared upper test fixture 2a, electrode unit 2b, lower test fixture 3a, and electrode unit 3b are mounted, if other upper test fixtures 2a, electrode units 2b, lower test fixtures 3a, and electrode units 3b corresponding to other "inspection target boards" are mounted, they are first removed in the reverse order of the mounting procedure described below.

[0073] On the other hand, when attaching the upper test fixture 2a, electrode unit 2b, lower test fixture 3a, and electrode unit 3b, for example, first, the upper test fixture 2a is fixed to the moving mechanism 4a with the surface on which the pressing pins 22 and probes 23 are implanted facing downward, and the electrode unit 2b is fixed in a specified position with the surface on which the connecting electrodes 24 are implanted facing downward. Next, the lower test fixture 3a is fixed in a specified position with the surface on which the support pins 32 and probes 33 are implanted facing upward, and the electrode unit 3b is fixed to the moving mechanism 4c with the surface on which the connecting electrodes 34 are implanted facing upward. This completes the fixing of the upper test fixture 2a, electrode unit 2b, lower test fixture 3a, and electrode unit 3b in a state in which the tip ends of the connection electrodes 24 of electrode unit 2b and the tip ends of the connection electrodes 34 of electrode unit 3b are spaced apart and face each other (an example of a "non-contact state between each first electrode and each second electrode"). Next, the connection wiring 35a of electrode unit 3b and the connection wiring 35b of lower test fixture 3a are connected to the scanner 5. This completes the installation of the upper test fixture 2a and electrode unit 2b and the lower test fixture 3a and electrode unit 3b.

[0074] Next, the inspection of the test target substrate X begins. Specifically, the test target substrate X is carried in between the upper test fixture 2a and the lower test fixture 3a, and is placed on the support pins 32 of the lower test fixture 3a with one surface Fa facing upward (so that the one surface Fa faces the upper test fixture 2a). At this time, the test target substrate X is supported only by the support pins 32 with the probes 33 not in contact with the test target substrate X.

[0075] Next, when the processing unit 9 determines that the setting of the inspection target substrate X is complete based on the operation of the operation unit 7 or a signal output from the transport mechanism or the like, it controls all switches 41 of the scanner 5 to the on state and also controls switch 42 to the on state. As a result, all connection wires 35a, 35b are connected to the reference potential via resistor 43. Therefore, even if electric charges have accumulated in the stray capacitances between the connection electrodes 34 and the connection wires 35a, or between the probes 33 and the connection wires 35b before the switches 41, 42 are controlled to the on state, these electric charges are discharged to the reference potential by the "charge elimination unit (in this example, switch 42 and resistor 43)" and are thus neutralized.

[0076] Next, the processing unit 9 controls the moving mechanism 4c to raise the electrode unit 3b (bring the electrode unit 3b closer to the electrode unit 2b) while causing the moving mechanism 4a to maintain the upper test fixture 2a spaced apart from the lower test fixture 3a. At this time, the tip (upper end) of each connection electrode 34 comes into contact with the tip (lower end) of each connection electrode 24 (this is another example of the process of "before the first moving mechanism moves the probe unit closer to the substrate holder so that each probe comes into contact with the substrate to be inspected, the second moving mechanism is controlled to move at least one of the first and second electrode units (in this example, the second electrode unit) closer to the other (in this example, the first electrode unit) so that each first electrode comes into contact with each second electrode").

[0077] At this time, each probe 23, each connection wire 25, and each connection electrode 24 is connected to the reference potential via each connection electrode 34, each connection wire 35a, each switch 41, switch 42, and resistor 43. Therefore, even if charges have accumulated in the stray capacitances between each probe 23, each connection wire 25, and each connection electrode 24 before each connection electrode 24 comes into contact with each connection electrode 34, these charges (charges on each connection electrode 24) are released to the reference potential by the "charge elimination unit (in this example, switch 42 and resistor 43)" and are thus neutralized.

[0078] Next, the processing unit 9 controls the moving mechanism 4a to lower the upper test fixture 2a (bring the upper test fixture 2a closer to the lower test fixture 3a). At this time, each probe 23 of the upper test fixture 2a comes into contact with one surface Fa of the test target substrate X. At this time, since each of the stray capacitances is neutralized before the probes 33 come into contact with the one surface Fa, it is possible to avoid a situation in which a large electrical stress is applied to the test target substrate X via the probes 23 in contact with the one surface Fa (a situation in which the charge accumulated in the stray capacitance flows into the test target substrate X).

[0079] Subsequently, when the upper test fixture 2a is further lowered by the moving mechanism 4a, the probes 23 are retracted while in contact with the surface Fa of the test target substrate X, and the pressing pins 22 of the upper test fixture 2a come into contact with the surface Fa of the test target substrate X. When the upper test fixture 2a is further lowered in this state, the probes 23 are not retracted but remain in contact with the surface Fa of the test target substrate X, and the test target substrate X, whose surface Fa has been pressed downward by the pressing pins 22, is lowered together with the base 21 (pressing pins 22).

[0080] As a result, the support pins 32 of the lower test fixture 3a are retracted, and the probes 33 are brought into contact with the other surface Fb of the test target substrate X. Thereafter, when the upper test fixture 2a has been lowered until the probes 33 have been sufficiently retracted and are pressed against the other surface Fb of the test target substrate X with sufficient pressure, the processing unit 9 stops the lowering of the upper test fixture 2a by the moving mechanism 4a.

[0081] After this, the processing unit 9 controls the switch 42 of the scanner 5 to the OFF state, controls only the switch 41 connected to the probes 23 and 33 to measure the "measurement quantity" to the ON state, and controls the other switches 41 to the OFF state, repeatedly executing the process of having the measurement unit 6 measure the "measurement quantity." The processing unit 9 also determines the quality of the inspection target substrate X based on the measured "measurement quantity" and the inspection reference value stored in the memory unit 10. Furthermore, when the processing unit 9 has completed measuring all the "measurement quantities" to be measured, it controls the moving mechanism 4a to lift the upper test fixture 2a and the moving mechanism 4c to lift the electrode unit 2b (moving the upper test fixture 2a and the electrode unit 2b away from the lower test fixture 3a). After this, the inspection target substrate X, which has completed the inspection, is removed from between the upper test fixture 2a and the electrode unit 2b and the lower test fixture 3a, thereby completing the inspection process for one inspection target substrate X.

[0082] As described above, this substrate inspection device 1B includes the upper test fixture 2a, the electrode unit 2b, the lower test fixture 3a, the moving mechanism 4a, the measurement section 6, and the processing section 9, as well as the electrode unit 3b having a plurality of connection electrodes 34 that are arranged to be able to come into contact with each of the connection electrodes 24 and are connected to the measurement section 6, the moving mechanism 4c that moves at least one of the electrode units 2b, 3b (in this example, the electrode unit 3b) relatively toward or away from the other (electrode unit 2b), and the movement mechanism 4c that moves each of the connection electrodes 34 and the measurement section 6. and a "discharge section (in this example, a switch 42 and a resistor 43)" disposed between the upper test fixture 2a and the lower test fixture 3a and discharging the charge on each connection electrode 24 to the reference potential, and before the processing section 9 uses the moving mechanism 4a to bring the upper test fixture 2a relatively closer to the lower test fixture 3a and bring each probe 23 into contact with the test target substrate X, it controls the moving mechanism 4c to bring the electrode unit 3b relatively closer to the electrode unit 2b and bring each connection electrode 24 and each connection electrode 34 into contact with each other.

[0083] Therefore, according to this substrate inspection apparatus 1B, similar to the conventional substrate inspection apparatus developed by the applicant, a "long connection cable" for connecting the probes 23 to the measurement unit 6 is not required, and stray capacitance between the connection lines of this "long connection cable" can be eliminated. Furthermore, before the movement mechanism 4a brings the probes 23 into contact with the substrate X under test, the movement mechanism 4c moves the electrode unit 3b closer to the electrode unit 2b, bringing the connection electrodes 34 into contact with the connection electrodes 24. Therefore, even if electric charges have accumulated in the stray capacitance between the probes 23, the connection wires 25, and the connection electrodes 24, these electric charges are discharged to the reference potential via the connection electrodes 34 and the connection wires 35a, the switch 41, and the "charge elimination unit (in this example, the switch 42 and the resistor 43)," thereby eliminating the electric charge on the connection electrode 24. As a result, the electric charges are discharged to the substrate X under test via the probes 23, and the substrate X under test can be suitably inspected without applying a large electrical stress to the substrate X.

[0084] In addition, this substrate inspection device 1B is provided with a scanner 5 that selectively connects a connection electrode 34 selected by a processing unit 9 from among the connection electrodes 34 to a "charge elimination unit" and a measurement unit 6, and the "charge elimination unit" has a "series circuit" of a switch 42 and a resistor 43, and is configured so that one end of the "series circuit" is connected to the connection electrode 34 selected by the scanner 5 and the other end of the "series circuit" is connected to a reference potential, and the processing unit 9 controls the scanner 5 (switch 41) so that when each connection electrode 24 and each connection electrode 34 are in contact with each other, each connection electrode 34 is connected to the "charge elimination unit," and controls the switch 42 to an on state, and when the "measured quantity" is measured by the measurement unit 6, it controls the switch 42 to an off state and controls the scanner 5 so that only each connection electrode 34 connected to the probe 23 that is to measure the "measured quantity" is connected to the measurement unit 6.

[0085] Therefore, with this substrate inspection device 1B, even if electric charges are accumulated in the floating capacitances between each probe 23, between each connection wiring 25, and between each connection electrode 24, these electric charges can be reliably released to the reference potential, and the influence of the reference potential can be preferably avoided when measuring the "quantity to be measured" using each probe 23.

[0086] The configuration of the "board inspection apparatus" is not limited to the above-described examples of the board inspection apparatuses 1, 1A, and 1B. For example, in the board inspection apparatus 1, the switches 41 and 42 are controlled to be on to connect the connecting wires 35a to the reference potential before the movement mechanism 4 moves the upper test fixture 2 closer to the lower test fixture 3, but the switches 41 and 42 can also be controlled to be on at any timing between when the movement mechanism 4 moves the upper test fixture 2 closer to the lower test fixture 3 and when the connecting electrodes 24 come into contact with the connecting electrodes 34, and before the probes 23 come into contact with the surface Fa of the test target board X, to connect the connecting wires 35a to the reference potential.

[0087] Furthermore, in the substrate inspection apparatus 1A, an example has been described in which each switch 41 and switch 42 are controlled to the on state to connect each connecting wire 35a to the reference potential before the moving mechanism 4b brings the electrode unit 2b close to the lower test fixture 3, but each switch 41 and switch 42 can also be controlled to the on state to connect each connecting wire 35a to the reference potential at any timing between when the moving mechanism 4b brings the electrode unit 2b close to the lower test fixture 3 so that each connecting electrode 24 comes into contact with each connecting electrode 34, and when the moving mechanism 4a brings the upper test fixture 2a close to the lower test fixture 3 so that each probe 23 comes into contact with one surface Fa of the substrate X to be inspected.

[0088] Similarly, in the example described above, in substrate inspection apparatus 1B, each switch 41 and switch 42 are controlled to the ON state to connect each connecting wire 35a to the reference potential before electrode unit 3b is brought close to electrode unit 2b by moving mechanism 4c. However, each switch 41 and switch 42 can also be controlled to the ON state at any timing between when electrode unit 3b is brought close to electrode unit 2b by moving mechanism 4c and each connecting electrode 34 comes into contact with each connecting electrode 24, and when upper test fixture 2a is brought close to lower test fixture 3a by moving mechanism 4a and each probe 23 comes into contact with one surface Fa of substrate X to be inspected, thereby connecting each connecting wire 35a to the reference potential.

[0089] Although the example in which the switch 42 and resistor 43 work together to form the "static elimination unit" has been described, the configuration of the "static elimination unit" is not limited to this. Specifically, the "switch circuit" can be formed of an electronic switch or a mechanical switch. Furthermore, the "resistance element" may be a resistor, or a transistor or a unidirectional element such as a diode. Furthermore, the "series circuit of the switch circuit and resistance element" can be integrally formed of one or more semiconductor elements. Furthermore, the "static elimination unit" can be formed only of a "resistor" that does not affect the measurement of the "quantity to be measured" by the "measurement unit" and has a resistance value that allows the charge accumulated in the "second electrode" to be released to the "reference potential" and is always connected to the "reference potential" (the "static elimination unit" can be formed without a "switch circuit").

[0090] Furthermore, a "moving mechanism" that moves the lower test fixture 3 toward the upper test fixture 2 can be added to the configuration of the board inspection apparatus 1, a "moving mechanism" that moves the lower test fixture 3 toward the upper test fixture 2a and the electrode unit 2b can be added to the configuration of the board inspection apparatus 1A, and a "moving mechanism" that moves the electrode unit 2b toward the electrode unit 3b and a "moving mechanism" that moves the lower test fixture 3a toward the upper test fixture 2a can be added to the configuration of the board inspection apparatus 1B. Furthermore, a configuration can be adopted in which the "board holder" moves toward and away from the "probe unit" fixed at a specified position.

[0091] It is also possible to adopt a configuration in which a "member for pressing a test target board" such as the pressing pin 22 in the upper test fixture 2, 2a is moved separately from the probe 23, or a configuration in which a "member for holding (supporting) a test target board" such as the support pin 32 in the lower test fixture 3, 3a is moved separately from the probe 33. In addition, although the configuration in which the probe 33 is arranged in the lower test fixture 3, 3a corresponding to the "board holding portion" separately from the probe 23 corresponding to the "probe" arranged in the "probe unit" has been described as an example, a configuration in which the probe 33 is not present can also be adopted. [Explanation of symbols]

[0092] 1,1A,1B PCB inspection equipment 2,2a Upper test fixture 2b, 3b electrode unit 3,3a Lower test fixture 4,4a~4c Moving mechanism 5. Scanner 6 Measuring section 7 Control section 8 Display 9 Processing section 10 Storage section 21,31 base 22 Pressing pin 23,33 Probe 24,34 Connection electrodes 25, 35a, 35b Connection wiring 32 Support pin 32 41,42 Switch 43 Resistance Fa one side Fb other side X Test target board

Claims

1. a substrate holding unit that holds a substrate to be inspected; a probe unit having a plurality of probes each of which is brought into contact with the test target substrate held by the substrate holding section; a movement mechanism that moves at least one of the probe unit and the substrate holding unit toward and away from the other; a measurement unit that measures a predetermined measurement quantity of the inspection target substrate via each of the probes; a processing unit that controls the relative approach and separation movement of the at least one element with respect to the other element by the moving mechanism and the measurement of the measured quantity by the measurement unit, and inspects the inspection target substrate based on the measured measured quantity, an electrode section including a plurality of first electrodes connected to the respective probes and disposed on a first base of the probe unit, and a plurality of second electrodes disposed on a second base of the substrate holder so as to be able to come into contact with the respective first electrodes and connected to the measurement section; a charge removal unit disposed between each of the second electrodes and the measurement unit, and configured to discharge charges on each of the second electrodes to a reference potential; the electrode section is formed in an extendable structure in which at least one of the first electrodes and the second electrodes is constantly biased in an extension direction, and when the moving mechanism separates the at least one electrode relative to the other, the first electrodes and the second electrodes are in a non-contact state, and when the moving mechanism moves the first base portion closer to the second base portion, the first electrodes come into contact with the second electrodes before the probes contact the substrate to be inspected, and when the moving mechanism moves the first base portion further closer to the second base portion, the at least one electrode is contracted to allow the probes to contact the substrate to be inspected.

2. a substrate holding unit that holds a substrate to be inspected; a probe unit having a plurality of probes each of which is brought into contact with the test target substrate held by the substrate holding section; a first moving mechanism that moves at least one of the probe unit and the substrate holding unit toward and away from the other; a measurement unit that measures a predetermined measurement quantity of the inspection target substrate via each of the probes; a processing unit that controls the relative approaching and separating movement of the at least one of the components with respect to the other component by the first moving mechanism and the measurement of the measured quantity by the measurement unit, and inspects the inspection target substrate based on the measured measured quantity, a first electrode unit having a plurality of first electrodes connected to each of the probes, and a second electrode unit having a plurality of second electrodes arranged to be in contact with each of the first electrodes and connected to the measurement unit; a second moving mechanism that moves at least one of the first electrode unit and the second electrode unit toward and away from the other; a charge removal unit disposed between each of the second electrodes and the measurement unit, and configured to discharge charges on each of the second electrodes to a reference potential; The processing unit controls the second moving mechanism to bring at least one of the electrodes relatively close to the other of the electrodes and bring each of the probes into contact with the substrate to be inspected, before using the first moving mechanism to bring at least one of the electrodes relatively close to the other of the electrodes and bring each of the probes into contact with the substrate to be inspected.

3. a scanner that selectively connects a designated one of the second electrodes to the static eliminator and the measuring unit; the static eliminator includes a series circuit of a switch circuit and a resistor element, one end of the series circuit is connected to the second electrode selected by the scanner, and the other end of the series circuit is connected to the reference potential; 3. The substrate inspection device according to claim 1, wherein the processing unit controls the scanner so that all of the second electrodes are connected to the charge removal unit when the first electrodes and the second electrodes are in contact with each other, and controls the switch circuit to an on state, and when the measurement unit measures the measured quantity, controls the switch circuit to an off state and controls the scanner so that only the second electrodes connected to the probe that is to measure the measured quantity are connected to the measurement unit.

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