Electronic device and imaging device

Abstract

To efficiently radiate heat that is generated in a heat-generating element without increasing the size of an electronic apparatus.SOLUTION: An electronic apparatus 1 comprises: a first substrate 4 on which a heat-generating element 400 is mounted; a second substrate 5; a support member 701 having a fixing part to which the second substrate is fixed, for supporting the second substrate so as to be superposed on the first substrate with a space therebetween; and a heat radiation member 705 arranged so as to be superposed on the second substrate with a space therebetween, on the side opposite the first substrate across the second substrate and the support member. The support member includes a heat receiving part thermally connected to the heat-generating element, a first heat transfer part 701b for conveying the heat received by the heat receiving part to the heat radiation member, and a second heat transfer part 701c for conveying the heat received by the fixing part to the heat radiation member. The support member has a shape that reduces heat transfer from the heat receiving part to the fixing part.SELECTED DRAWING: Figure 9

Description

[Technical Field]

[0001] The present invention relates to an electronic device such as an imaging device having a heat dissipation structure. [Background technology]

[0002] Electronic devices including imaging devices are provided with a heat dissipation structure to suppress temperature increases in the housing. Patent Document 1 discloses a heat dissipation structure in which a heat conductive member is sandwiched between stacked substrates so that heat from the substrates that has become hot during operation of the imaging device is transferred to the substrates with lower temperatures. Patent Document 2 also discloses an imaging device in which a heat transfer member is arranged in an area avoiding the substrates and a heat insulating member is provided around the heat transfer member.

[0003] Furthermore, Patent Document 3 discloses an imaging device having a first housing unit that holds a board on which a heat-generating element is mounted, and a second housing unit that is disposed at a distance from the first housing unit. The space formed by the distance forms an air flow path that connects to the outside via a top opening exposed on the top surface of the imaging device and a rear opening exposed on the rear surface of the imaging device. The rear portion of the first housing unit has a heat dissipation structure that increases the surface area of the face facing the second housing unit, and by thermally connecting the electronic components to the heat dissipation structure, it is possible to dissipate heat from the heated circuit board to the outside. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-187083 [Patent Document 2] Japanese Patent Application Publication No. 2017-11711 [Patent Document 3] Japanese Patent Publication No. 2020-10237 Summary of the Invention [Problem to be solved by the invention]

[0005] The heat dissipation structure of Patent Document 1 allows heat to be transferred from the heat source to the exterior component via the intermediate component, and then dissipated from the exterior component to the outside air. However, if the intermediate component has low heat transfer efficiency, the heat transfer efficiency to the exterior component decreases. Therefore, if the intermediate component is a component that is sensitive to heat, the heat from the heat source cannot be transferred to the exterior component.

[0006] In the heat dissipation structure of Patent Document 2, the heat transfer member is held in place by screwing the tip (thermal connection part) of the heat transfer member into the heat insulating member, which is partially filled with air. Therefore, without screwing, the heat transfer member cannot be positioned relative to the heat insulating member.

[0007] Furthermore, the heat dissipation structure of Patent Document 3 utilizes natural convection from the back surface of the image pickup device to the top surface to dissipate heat. However, if the amount of heat generated by the circuit board is large, it is difficult to efficiently dissipate heat from the circuit board to the outside using natural convection alone. Moreover, because a heat dissipation opening is provided on the top surface of the image pickup device, the thickness of the top surface of the image pickup device increases, resulting in an increase in the size of the entire image pickup device.

[0008] The present invention provides an electronic device that can efficiently dissipate heat generated by a heat generating element without increasing the size. [Means for solving the problem]

[0009] One aspect of the present invention provides an electronic device comprising: a first substrate having a heat-generating element mounted thereon; a second substrate; a support member having a fixing portion to which the second substrate is fixed, the support member supporting the second substrate so as to overlap the first substrate with a gap therebetween; and a heat dissipation member disposed on the opposite side of the second substrate and the support member from the first substrate so as to overlap the second substrate with a gap therebetween. The support member has a heat-receiving portion thermally connected to the heat-generating element, a first heat-transfer portion that transfers heat received by the heat-receiving portion to the heat-dissipation member, and a second heat-transfer portion that transfers heat received by the fixing portion to the heat-dissipation member. The support member is characterized by having a shape that reduces heat transfer from the heat-receiving portion to the fixing portion.

[0010] Another aspect of the present invention provides an electronic device comprising: a first substrate on which a heat generating element is mounted; a second substrate; a support member to which the second substrate is fixed and which supports the second substrate so as to overlap the first substrate with a gap therebetween; a heat dissipation member disposed on the opposite side of the second substrate from the first substrate with the second substrate and support member interposed therebetween so as to overlap the second substrate with a gap therebetween; a heat transfer member thermally connected to the heat generating element and extending toward the heat dissipation member through an opening provided in the second substrate; and a heat insulating member disposed between the heat transfer member and the second substrate and having a thermal conductivity lower than that of the heat transfer member. The heat dissipating member forms at least a part of a duct through which the refrigerant flows, and the heat transfer member penetrates an opening provided in the heat dissipating member and protrudes into the duct or is thermally connected to the heat dissipating member. It is characterized by the following.

[0011] Another aspect of the present invention provides an imaging device comprising a viewfinder through which a user looks, a substrate on which a heat generating element is mounted, and a heat dissipation member to which the heat generating element is thermally connected and which forms at least a part of a duct through which a coolant flows. The duct has an inlet through which the coolant flows, and first and second outlets through which the coolant flows. The inlet is provided on the bottom surface of the imaging device. The first outlet is provided on a side surface of the imaging device. The second outlet is provided on the upper back surface of the imaging device, to the side of the viewfinder. The imaging device is characterized in that the opening area of the second outlet is smaller than the opening area of the first outlet. [Effects of the Invention]

[0012] According to the present invention, heat generated by a heat generating element can be efficiently dissipated without increasing the size of an electronic device including an imaging device or the like. [Brief explanation of the drawings]

[0013] [Figure 1] 1A and 1B are front and rear perspective views of an imaging apparatus according to a first embodiment. [Figure 2] FIG. 2 is a bottom perspective view of the imaging device of the first embodiment. [Figure 3] FIG. 2 is a perspective view of the imaging device of the first embodiment with a fan accessory attached. [Figure 4] FIG. 2 is a cross-sectional view of the imaging device of the first embodiment with a fan accessory attached. [Figure 5] FIG. 1 is an exploded perspective view of an imaging device according to a first embodiment. [Figure 6] FIG. 2 is an exploded perspective view of the periphery of a substrate in the imaging device of the first embodiment. [Figure 7] FIG. 2 is an exploded perspective view of a rear cover of the imaging device according to the first embodiment. [Figure 8] FIG. 1 is a cross-sectional view of an imaging device according to a first embodiment. [Figure 9] FIG. 2 is an enlarged cross-sectional view of the vicinity of a heat source in the imaging device of the first embodiment. [Figure 10] FIG. 3 is a cross-sectional view of a duct of the imaging device according to the first embodiment. [Figure 11] FIG. 3 is a schematic diagram of a duct of the imaging device of the first embodiment. [Figure 12] FIG. 10 is an exploded perspective view of the periphery of a substrate of the imaging device according to the second embodiment. [Figure 13] FIG. 10 is a perspective view showing the inside of an imaging device according to a second embodiment. [Figure 14] FIG. 10 is another perspective view showing the inside of the imaging device according to the second embodiment. [Figure 15] FIG. 10 is an enlarged cross-sectional view of the vicinity of a heat source in the imaging device of the second embodiment. [Figure 16] FIG. 11 is yet another perspective view showing the inside of the imaging device according to the third embodiment. [Figure 17] FIG. 11 is a rear view of the imaging device according to the third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0014] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. [Example]

[0015] FIG. 1(a) shows a camera body (imaging device) 1 as an electronic device as seen from the diagonal front side, and FIG. 1(b) shows the camera body 1 as seen from the diagonal rear side.

[0016] Display unit 101, provided on the rear surface (back) of camera body 1, is attached to camera body 1 so as to be openable, closable, and rotatable, and displays images generated by capturing images and various information related to capturing images. Display unit 101 is equipped with a touch panel and can detect touch operations by the user on its display surface (operation surface). Display unit 102 outside the viewfinder, provided on the top surface of camera body 1, displays setting values for various capturing parameters such as shutter speed and aperture.

[0017] The shutter button 103 is an operating member that the user operates to instruct the camera body 1 to capture an image. The mode selector switch 104 is an operating member that the user operates to switch between various modes. The terminal cover 105 is a cover that protects a connector (not shown) to which a connection cable extending from an external device is connected. The main electronic dial 106 is an operating member that the user rotates to change the setting values of the imaging parameters. The power switch 107 is an operating member that the user operates to turn the power of the camera body 1 ON / OFF.

[0018] The sub electronic dial 108 is an operation member that the user operates when moving a selection frame such as an AF frame or when switching between images.

[0019] A multi-controller 109 is provided on the back of the camera body 1. The multi-controller 109 is configured to allow input by pressing the key tops and tilting them up, down, left, right, and diagonally. By operating the multi-controller 109, the user can move a selection frame and select items in various menus.

[0020] The rear electronic dial 110 is also an operating member that the user operates to move the selection frame or to advance through images. The rear electronic dial 110 is located in a position that allows the user to operate it intuitively while playing back captured images on the display unit 101, and is also easy to operate even when the user holds the camera body 1 vertically. A SET button 111 is provided in the center of the rear electronic dial 110. The SET button 111 is an operating member that functions as a push button that the user operates to confirm a selection item, etc.

[0021] The video button 112 is an operating member that the user operates to start and stop video capture (recording). The button group 113 is an operating member related to focus and exposure, and includes an AF start button, an AE lock button, and an AF frame selection button, which are arranged horizontally. When the camera is in a standby state for capturing video, the user can start AF, change the AF frame, or fix the exposure by pressing these buttons 113.

[0022] The button group 114 includes an L-shaped zoom button, an information display button, and a quick setting button. In the live view display state in the imaging mode, the user can switch ON / OFF the zoom in of the live view display image by operating the zoom in / out button. In the playback mode, the user can switch ON / OFF the zoom in of the captured image being played back by operating the zoom in / out button. The user can switch the display method of the information displayed on the display unit 101 by operating the information display button. The user can immediately transition the display on the display unit 101 to a screen for changing the setting values of the imaging parameters by operating the quick setting button.

[0023] The button group 115 includes a play button and a delete button. The user can switch between image capture mode and playback mode by operating the play button. When the play button 115 is operated in image capture mode, the mode switches to playback mode, and the most recent captured image among the captured images recorded on a recording card (not shown) can be displayed on the display unit 101. When a user selects a captured image in playback mode, the selected captured image can be deleted by operating the delete button.

[0024] The button group 116 includes a menu button and a rating button. When the user operates the menu button, a menu screen displaying configurable items is displayed on the display unit 101. The user can intuitively select and set items by touching the menu screen displayed on the display unit 101 or by operating the multi-controller 109, rear electronic dial 110, and SET button 111. When the user operates the rating button in playback mode, the user can rate (rank) the playback image.

[0025] An interchangeable lens (not shown) is removably attached to the mount section 122. A communication terminal 117 provided inside the mount section 122 is used for communication between the camera body 1 and the interchangeable lens. An image sensor IS configured by a CMOS sensor or the like is provided at the back of the mount section 122. The direction in which the mount section 122 and the image sensor IS are arranged is referred to as the front-to-rear direction in the following explanation. The front-to-rear direction can also be referred to as the optical axis direction parallel to the optical axis of the interchangeable lens attached to the mount section 122.

[0026] Finder 118, located on the upper back surface of camera body 1, is an electronic viewfinder that allows a user to view a live view display image and the like when looking through it. Eyepiece detection window 119 is a detection window for an eyepiece detection sensor that detects when a user is looking through (places their eye close to) finder 118. Eyepiece cover 123 is a rubber member that comes into contact with the face around the eyes of a user looking through finder 118.

[0027] Grip section 120 is a gripping section shaped to be easily gripped with the right hand of a user holding camera body 1. Grip section 120 is provided with front rubber 121 to prevent the hand from slipping.

[0028] The card cover 300 is a cover that covers a slot (not shown) for storing a recording card, and is provided at a portion of the grip section 120 where the palm of the user's hand comes into contact.

[0029] Fig. 2 shows the camera body 1 as seen from the bottom side. As shown in Figs. 1(b) and 2, openings 611 and 612 are provided on both sides of the viewfinder 118 at the upper rear surface of the rear cover 600 so as to be exposed, and serve as second outlets (exhaust ports) for heat dissipation. In rear view, opening 611 is provided on the left side of the viewfinder 118, and opening 612 is provided on the right side of the viewfinder 118. Opening 611 is provided at a position lower than the key tops (convex surfaces) of button group 116 between button group 116 and viewfinder 118. Opening 612 is provided at a position lower than the key tops of multi-controller 109 between multi-controller 109 and viewfinder 118.

[0030] An opening 603 serving as an inlet (air intake) for heat dissipation is provided so as to be exposed at the bottom of the rear cover 600. The opening 603 is provided only on the right half in rear view, at a position adjacent to the storage section for the display unit 101.

[0031] Openings 604 and 605 are provided on the left side of rear cover 600 as seen from the rear side, as first outlets (exhaust ports) for heat dissipation. Openings 604 and 605 are adjacent to the storage compartment for display unit 101 and are provided above the center as seen from the rear side. Opening 605 is located behind hinge cover 606 that covers the opening and closing shaft of display unit 101.

[0032] The rear cover 600 is formed with a recess 608 into which a user's finger fits when opening or closing the display unit 101. The recess 608 makes it easy for the user to open or close the display unit 101. In addition, an opening 617 is provided on the surface of the rear cover 600 facing the recess 608 (the surface facing the right in FIG. 1(b)) as a third outlet (exhaust port) for heat dissipation.

[0033] FIG. 3 shows the camera body 1 with accessory 900 attached. FIG. 4 shows a side cross-section of the camera body 1 and accessory 900. Accessory 900 is a fan unit that can send air as a refrigerant from fan 901 provided inside it to camera body 1. Accessory 900 has air intake 902 on the front surface and air outlet 903 on the top surface that faces the aforementioned opening 603 of camera body 1. Accessory 900 is fixed to camera body 1 by screwing tripod screw member 904 provided on accessory 900 into a tripod socket provided on the bottom surface of camera body 1. Accessory 900 also has a power supply (not shown), and the fan can be driven by power supplied from this power supply without using power from the camera body 1.

[0034] An elastic member 906 is provided around air outlet 903 in accessory 900, and this elastic member 906 connects air outlet 903 and opening 603 of camera body 1 so that no gaps are formed around them. When fan 901 rotates, air (outside air) taken in through air intake 902 is sent to air outlet 903. The air from air outlet 903 flows from opening 603, which serves as an air intake (inlet), into duct 601, which is provided on the rear side of camera body 1. The air that flows into duct 601 flows while absorbing heat from inside camera body 1, and is discharged to the outside of camera body 1 through openings 604, 605, 611, 612, and 617, which serve as exhaust ports shown in FIG. 2.

[0035] 5 shows the camera body 1 with the rear cover 600 and card cover 300 removed. Inside the camera body 1, there are arranged a main board 4 as a first board and a power supply board 5 as a second board. The power supply board 5 is smaller than the main board 4, and is supported by a plate 701 as a support member bent into a U-shape so as to overlap the main board 4 at a predetermined distance in the front-to-rear direction. However, the power supply board 5 is arranged in a position that does not overlap with the wiring 201, 202, 203, 204, 205, and 206 connected to the main board 4.

[0036] 6 shows the camera body 1 with the top cover, bottom cover, etc. removed and the area around the power supply board 5 disassembled. An image processing IC (image processing element) 400 is mounted on the main board 4, which performs various image processing on signals output from the imaging element IS to generate image data. A DRAM 403 is mounted on the main board 4 near the image processing IC 400. The DRAM 403 temporarily stores data required for image processing. The main board 4 also has connection sections 404a, 404b, 404c, 404d, 404e, and 404f for the wiring 201 to 206 described above.

[0037] A first card slot 401 is disposed on the rear side near the grip side of the image processing IC 400, and a second card slot 402 is disposed on the front side. The first card slot 401 is a slot into which a first card (for example, an XQD card or a CF express card) is inserted. The second card slot 402 is a slot into which a second card (for example, an SD card) is inserted. Note that the card slots do not have to be dual slots into which different types of cards are inserted as described above, and may be a single slot or dual slots into which the same type of card is inserted.

[0038] The image processing IC 400 is a heat-generating element that is the main heat source on the main board 4. Under high load, for example, when capturing video with a high pixel count or high frame rate, the image processing IC 400 consumes a large amount of power and performs high-speed processing, generating a large amount of heat and reaching a high temperature.

[0039] Some power supply related components cannot be mounted on the main board 4 due to size and component layout restrictions of the main board 4. Power supply board 5 is mounted with power supply related components that cannot be mounted on the main board 4. By arranging power supply board 5 on top of main board 4, the size of camera body 1 can be reduced when viewed from the front.

[0040] Power supply board 5 is inserted into plate 701 before being connected to main board 4, and in this state is positioned so that it overlaps main board 4 in the front-to-rear direction. Connector 501 provided on power supply board 5 engages with connector 405 provided on main board 4, thereby connecting power supply board 5 to main board 4. The position of power supply board 5 relative to main board 4 is also determined by the engagement of connectors 501, 405. Power supply board 5 and plate 701 are fastened together to camera body 1 with screws.

[0041] A heat-conducting rubber 406 is attached to the image processing IC 400 on the main board 4. When the power supply board 5 and the plate 701 are assembled, the plate 701 and the heat-conducting rubber 406 come into contact (close contact).

[0042] The plate 701 is a member formed from a metal material, such as aluminum, copper, or stainless steel sheet metal, which has high thermal conductivity. As shown in FIG. 6, the plate 701 has a first heat transfer portion 701b and a second heat transfer portion 701c, each of which is bent into a U-shape, and a heat receiving surface 701a, which is one side of the heat receiving portion. The heat receiving surface 701a is in contact with the heat conductive rubber 406 and is thermally connected to the image processing IC 400. Heat generated by the image processing IC 400 is transferred from the heat receiving surface 701a to the plate 701.

[0043] Furthermore, the plate 701 has a fixing surface 701d with which the power supply board 5 comes into contact at the fixing portion where the power supply board 5 is fixed, and a clearance surface 701e which is the other surface of the heat receiving portion. The clearance surface 701e is recessed relative to the fixing surface 701d so as to be spaced away from the power supply board 5, and is formed by half-blanking or the like. The first heat transfer portion 701b is connected to the heat receiving portion which has the clearance surface 701e and the heat receiving surface 701a. The second heat transfer portion 701c is connected to the fixing portion which has the fixing surface 701d.

[0044] Heat-conducting rubber 702 and heat-conducting rubber 703 are attached to the first heat-transfer portion 701b and the second heat-transfer portion 701c of the plate 701, respectively. These heat-conducting rubbers 702 and 703 are used for thermal connection, which will be described later. By using the plate 701 in this manner, it is possible to arrange the main board 4 and the power supply board 5 so that the image processing IC 400, the power supply board 5, and the portion of the first heat-transfer portion 701b that is thermally connected to the duct heat sink 705 (where the heat-conducting rubber 702 is attached) overlap with a gap in the front-to-back direction.

[0045] 7 shows an exploded view of the components that form duct 601. Rear cover 600 has a duct forming section that includes a partition wall separating the display unit 101 from the storage section and wall portions (ribs) 607 surrounding the four sides of the partition wall. Wall portions 607 protrude forward from the partition wall. Duct heat dissipation plate 705, which serves as a heat dissipation member, is attached to wall portion 607 so as to cover this duct forming section, thereby forming duct 601.

[0046] The size (width) of duct 601 is set to be as wide as possible to minimize ventilation resistance, and is set to be approximately the same as the width of display unit 101. The size of the space inside duct 601 does not need to be maximum depending on the ventilation resistance and the position of the heat source, and can be changed according to the balance with exhaust heat. Wall portion 607 has a shape that has no openings other than openings 603, 604, 605 and openings 611, 612, 617 described above to maintain an airtight seal.

[0047] Duct heat sink 705 is a component made by drawing a metal plate such as aluminum, which has high thermal conductivity, so that its center is convex toward the duct. The shape of the center of duct heat sink 705, which is convex toward the duct, makes it possible to align it as a lid with the duct-forming portion of rear cover 600 and to ensure space for arranging thin heat sink component 707, which will be described later. When an aluminum plate is used as duct heat sink 705, it is preferably black anodized for heat dissipation and corrosion resistance.

[0048] Duct heat sink 705 is attached and fixed to the inner surface of wall 607 with rectangular frame-shaped double-sided tape 704. By attaching double-sided tape 704 to the inner surface of wall 607 of rear cover 600 without any gaps, air can flow through duct 601 without pressure loss due to air leakage, and it is also possible to prevent water and dust from entering the interior of camera body 1.

[0049] A thin heat dissipation component 707 for improving heat diffusion efficiency is attached to the surface of duct heat sink 705 opposite the duct side of the above-mentioned convex portion with extremely thin double-sided tape 706. Thin heat dissipation component 707 is provided for the purpose of supplementing the heat diffusion of duct heat sink 705, and in this embodiment, a vapor chamber is used. Note that the vapor chamber may be replaced with a graphite sheet, or heat conductive rubber 702 may be brought into direct contact with duct heat sink 705 without providing thin heat dissipation component 707.

[0050] Furthermore, even if the double-sided tape 706 is replaced with a tight fixation using thermally conductive grease, the wide fixing surface makes it possible to hold the thin heat dissipation component 707 and is expected to improve heat transfer efficiency.

[0051] Fig. 8(a) shows the camera body 1 as seen from the rear side, and Fig. 8(b) shows a portion of the cross section taken along line AA in Fig. 8(a). As shown in Fig. 8(b), various units are stacked in the front-to-rear direction inside the camera body 1, with the main board 4 located closer to the rear of the camera body 1. The duct heat sink 705 is located on the opposite side of the power supply board 5 from the main board 4, with the power supply board 5 and plate 701 in between, so as to overlap with the power supply board 5 at a distance.

[0052] As described above, the function of duct 601 formed by duct heat sink 705 and the duct forming portion of rear cover 600 is to use airflow to cool the inside of camera body 1. Specifically, cooling is achieved by the airflow sending heat generated by image processing IC 400 mounted on main board 4, which is transmitted through plate 701 and duct heat sink 705 and released into the space within duct 601, to the outside.

[0053] Furthermore, the portion of the main board 4 on which the image processing IC 400 is mounted is thermally connected to a heat sink 408 via heat-conducting rubber 407 provided on the back surface of the main board 4. This allows heat from the image processing IC 400 to be transferred to the heat sink 408 from the back surface of the main board 4, and dispersed throughout the entire camera body 1. The heat sink 408 is a component made by press-molding an aluminum plate. 8(b), a power supply board 5 is disposed between the main board 4 and the duct 601, and heat-conducting rubber 409 is disposed between the first card slot 401 and the plate 701. The heat generated when writing in the first card slot 401, which is another heat source, is transferred to the plate 701 and further to the duct 601 by bringing the heat-conducting rubber 409 into contact with the first card slot 401, and is then dissipated.

[0054] 9 shows an enlarged view of the image processing IC 400 and its vicinity in the cross section of FIG. 8(b), illustrating the layered configuration from the image processing IC 400 to the duct 601. As described above, heat-conducting rubber 406 is attached to the surface (top surface in the figure) of the image processing IC 400 mounted on the main board 4. The heat-conducting rubber 406 is in pressure contact with the plate 701, and is thermally connected to the thin heat dissipation component 707 and further to the duct heat sink 705 via heat-conducting rubber 702 attached to the first heat transfer portion 701b of the plate 701. This forms the main heat transfer path from the image processing IC 400, which is the heat source, to the duct 601.

[0055] As described above, in the thin heat dissipation component 707 fixed to the duct heat sink 705 over a wide surface, heat diffuses in the in-plane direction and also propagates in the thickness direction, resulting in heat being transferred to the duct heat sink 705. When the heat is transferred to the duct heat sink 705, the heat is released from the surface 705a of the duct heat sink 705 into the air in the duct 601. The air in the duct 601, whose temperature has risen due to this heat, is pushed out of the duct 601 by the airflow from the accessory 900 and is discharged to the outside through the opening 605 shown in FIG. 8(b) and the openings 604, 611, 612, and 617 shown in FIGS. 1(b) and 2, etc.

[0056] Next, the heat transfer path of heat generated in the power supply board 5 will be described. The plate 701, which is pressed against the heat-conducting rubber 406 attached to the surface of the image processing IC 400, is fixed to the camera body 1 by screws together with the main board 4. The power supply board 5 is fixed to the plate 701 with screws. The power supply board 5 contacts the plate 701 only at the fixing surface 701d shown in FIG. 9. The portion of the plate 701 adjacent to the fixing surface 701d is a relief surface 701e where the heat-conducting rubber 406 contacts the surface on the image processing IC side. In other words, a step is provided between the fixing portion of the plate 701 where the fixing surface 701d is provided and the heat-receiving portion where the heat-receiving surface 701a and relief surface 701e are provided. This forms a gap between the power supply board 5 and the plate 701.

[0057] By providing a step between the heat receiving portion and the fixed portion of the plate 701 as described above, the thickness of the connecting portion 701g connecting the step is smaller than the thickness of the other portions (heat receiving portion, fixed portion, first heat transfer portion 701b, and second heat transfer portion 701c). As a result, the heat transfer cross-sectional area of the portion between the heat receiving portion and the fixed portion is smaller than the heat transfer cross-sectional area of the other portions, making it difficult for heat generated in the image processing IC 400 to transfer from the heat receiving portion to the fixed portion (heat transfer is reduced). Furthermore, multiple through-holes 701f are provided near the connecting portion 701g in the fixed portion of the plate 701 (at a position on the heat receiving portion side). This reduces the heat transfer cross-sectional area from the heat receiving portion side to the fixed portion side of the plate 701, making it difficult for heat generated in the image processing IC 400 to transfer to the fixed portion. Note that the through-holes 701f may be provided between the heat receiving portion and the fixed portion of the plate 701.

[0058] The power supply substrate 5 is mounted with non-heat resistant elements 502 that should be protected from high temperatures, and in order to protect these non-heat resistant elements 502, it is necessary to configure the power supply substrate 5 so that heat is less likely to be transmitted to the entire power supply substrate 5. For this reason, a step (relief surface 701e) is provided in the plate 701 so that the plate 701 does not come into contact with the power supply substrate 5 in the area of the power supply substrate 5 where the non-heat resistant elements 502 are mounted, and so that heat is less likely to be transmitted from the heat receiving part of the plate 701 to the fixing part.

[0059] Furthermore, the second heat transfer portion 701c, which is bent into a U-shape from the fixing surface 701d of the plate 701 as described above, is thermally connected to the thin heat dissipation component 707 via the heat conduction rubber 703. As a result, the heat generated in the power supply board 5 is transferred to the thin heat dissipation component 707.

[0060] Fig. 10(a) shows the camera body 1 as seen from the bottom side, and Fig. 10(b) shows a cross section taken along line BB in Fig. 10(a). In Fig. 10(b), the position where the first heat transfer section 701b (heat conduction rubber 702) and the second heat transfer section 701c (heat conduction rubber 703) in the duct 601 (duct heat sink 705) are thermally connected is shown by a two-dot chain line.

[0061] 10(b), air sent from accessory 900 to opening 603 flows mainly through duct 601 as indicated by arrows C1 and C2 and flows out to the outside through openings 604 and 605 in rear cover 600. Rear cover 600 is also provided with openings 611, 612, and 617, but the opening areas of these openings are considerably smaller than the opening areas of openings 604 and 605, so most of the air flows out through openings 604 and 605.

[0062] A feature of this embodiment is that the first heat transfer portion 701b is thermally connected to the duct 601 (duct heat sink 705) at a position (upstream of the airflow) closer to the opening 603 than the openings 604 and 605. The second heat transfer portion 701c is thermally connected to the duct 601 downstream of the first heat transfer portion 701b.

[0063] 11 schematically shows the relationship between the thermal connection positions of first heat transfer section 701b and second heat transfer section 701c to duct 601 and the flow rate (or flow speed) of air flowing out from fan 901 in accessory 900. In reality, fan 901 is arranged parallel to the bottom surface of camera body 1 as shown in FIG. 4, but for the sake of explanation, fan 901 is arranged perpendicular to the bottom surface of camera body 1 in FIG. 11. Also, in FIG. 11, fan 901 is shown as a centrifugal fan.

[0064] When rotating blades 901a of fan 901 are rotated around the axis in the direction of arrow D, air sucked in from the axial direction is blown out in the radial direction by the centrifugal force exerted by rotating blades 901a. The blown-out air is guided by the wall of fan case 901b and flows into duct 601 through air outlet 903 of accessory 900 and opening 603 of camera body 1.

[0065] The flow velocity of air flowing into duct 601 is not uniform in the width direction of duct 601 (the direction along opening 603), as indicated by the lengths of arrows F1 to F5. Specifically, the flow velocity indicated by arrow F1 of air flowing into a region on one end of duct 601 farthest from the axis of fan 901 is the fastest, and the flow velocities indicated by arrows F2, F3, and F4 of air flowing into regions closer to the axis become slower in that order. Furthermore, the flow velocity indicated by arrow F5 of air flowing into a region on the other end of duct 601 is the slowest.

[0066] A feature of this embodiment is that the first heat transfer portion 701b is thermally connected to the duct heat sink 705 via the heat conductive rubber 702 in a first region indicated by an arrow C1 in FIG. 10(b) where air flows into the duct 601 at a first flow velocity (F1 to F3). The first flow velocity (F1 to F3) is faster than the second flow velocity (F4, F5). The air flowing into the duct 601 at the second flow velocity flows through a second region indicated by an arrow C2 in FIG. 10(b). Furthermore, the first heat transfer portion 701b is arranged so that the longitudinal direction of the region where it is thermally connected to the duct heat sink 705 is aligned with the direction of the air flowing into the duct 601 at the first flow velocity.

[0067] On the other hand, the second heat transfer part 701c is located downstream of the position where the first heat transfer part 701b is thermally connected in the first region of the duct 601, and is thermally connected to the duct heat sink 705 via heat conductive rubber 703 in a region where the flow rate is faster than the position where the first heat transfer part 701b is thermally connected.

[0068] With this arrangement, the heat transferred from the first heat transfer portion 701b and the second heat transfer portion 701c to the duct 601 can be efficiently released to the outside.

[0069] As described above, in this embodiment, another heat source such as the power supply board 5 is provided between the image processing IC 400, which is a heat source, and the duct 601 formed by the rear cover 600 and the duct heat sink 705. Even in this case, heat can be transferred from the image processing IC 400 to the duct 601 without passing through many components. Furthermore, by thermally connecting the first heat transfer section 701b and the second heat transfer section 701c to an area where the flow rate of air flowing into the duct 601 is high due to the characteristics of the fan 901, heat generated by the image processing IC 400 can be efficiently dissipated, and the image processing IC 400 can be cooled well. [Example]

[0070] Next, a second embodiment will be described. Fig. 12 shows an exploded view of the power supply board 15 and its periphery in a camera body 1' of the second embodiment. The top cover, bottom cover, etc. are not shown. In this embodiment, components common to the first embodiment are assigned the same reference numerals as in the first embodiment, and a description thereof will be omitted.

[0071] The power supply board 15 in this embodiment differs from the power supply board 5 in the first embodiment in the arrangement of elements and wiring. Two circular through-holes (openings) 15a are provided in the power supply board 15 at a position that overlaps the image processing IC 400 on the main board 4 in the front-rear direction. The number of through-holes 15a may be one, or may be a hole of a shape other than a circular hole, such as a square. Furthermore, a part of the through-hole 15a may be open at the outer edge of the power supply board 15.

[0072] In the first embodiment, the heat conductive rubber 406 attached to the image processing IC 400 on the main board 4 was in contact with the plate 701, but in this embodiment, an opening 1701a is provided in the center of the plate 1701, and the heat conductive rubber 406 does not come into contact with the plate 1701. However, if the opening 1701a cannot be made larger due to restrictions on the strength of the plate 1701 or the like, the contact area between the heat conductive rubber 406 and the plate 1701 may be made smaller than in the first embodiment. In this embodiment as well, the plate 1701 is made of a metal material (sheet metal) such as aluminum, copper, or stainless steel.

[0073] In this embodiment, a heat transfer block 1702 is provided, which is disposed inside the through-hole 15a of the power supply substrate 15 and the opening 1701a of the plate 1701. The heat transfer block 1702 includes a heat-conducting portion (heat transfer member) made of a metal such as copper with high thermal conductivity, and a heat-insulating portion (heat-insulating member) that surrounds the heat-conducting portion and is made of a resin, rubber, or the like with lower thermal conductivity than the heat-conducting portion. The heat transfer block 1702 also includes a cylindrical portion that contacts the heat-conducting rubber 406, penetrates the through-hole 15a of the power supply substrate 15, and extends toward the duct heat sink 1705. A flange portion 1702c is provided near the end of the cylindrical portion on the heat-conducting rubber 406 side and has a diameter too small to be inserted into the through-hole 15a. A more detailed configuration of the heat transfer block 1702 will be described later.

[0074] Duct heat sink 1705 is similar to duct heat sink 705 in the first embodiment, but differs from duct heat sink 705 in that it is provided with two through holes (openings) 1705a. As in the first embodiment, duct heat sink 1705 is attached and fixed to the wall of rear cover 600 with double-sided tape 704 so as to cover the duct-forming portion of rear cover 600. Through hole 1705a is provided so that a portion of heat transfer block 1702 protrudes from duct heat sink 1705 into the duct. Thin heat sink component 707 and double-sided tape 706 described in the first embodiment (FIG. 7) are not used in this embodiment.

[0075] O-ring 1703, which is a rubber member, is placed between heat transfer block 1702 and duct heat sink 1705. By sandwiching O-ring 1703 between heat transfer block 1702 and duct heat sink 1705, it seals the air, water, and dust inside the duct so that they do not enter the interior of camera body 1′.

[0076] Before being connected to the main board 4, the power supply board 15 is fixed to the plate 1701 with screws to form a sub-unit, which is then arranged so as to overlap the main board 4 in the front-to-rear direction. The power supply board 15 is connected to the main board 4 by engaging a connector 1501 provided on the power supply board 15 with a connector 405 provided on the main board 4. The position of the power supply board 15 relative to the main board 4 is also determined by the engagement of the connectors 1501 and 405. The sub-unit of the power supply board 15 and plate 1701 is fastened together with the main board 4 with screws and fixed to the camera body 1'.

[0077] The heat transfer block 1702 is positioned by fitting its cylindrical portion into the inner periphery of the through-hole 15a of the power supply substrate 15, and the heat conductive portion comes into contact with the heat conductive rubber 406 attached to the image processing IC 400. When the connectors 1501, 405 are engaged, a flange 1702c that is part of the heat insulating portion 1702b of the heat transfer block 1702 comes into contact with the periphery of the through-hole 15a in the power supply substrate 15 and is pressed against the heat conductive rubber 406. As a result, the heat transfer block 1702, part of which protrudes from the through-hole 15a of the power supply substrate 15, is held (sandwiched) by the heat conductive rubber 406 and the power supply substrate 15 sandwiching the flange 1702c, as shown in FIG.

[0078] An O-ring 1703 is placed around the portion of heat transfer block 1702 that protrudes from through-hole 15a of power supply board 15, and duct heat sink 1705 is placed on top of that. As shown in FIG. 14 , protruding portion 1702d of heat transfer block 1702 passes through through-hole 1705a of duct heat sink 1705 and protrudes into the duct formed by the duct forming portion of the rear cover (not shown) and duct heat sink 1705. Protruding portion 1702d of heat transfer block 1702 comes into direct contact with the air flowing through the duct, and grooves 1702e are formed at the tips of protruding portion 1702d to further increase the heat dissipation area. The extension direction of grooves 1702e can be changed to match the direction of air flow through the duct.

[0079] Figure 15 shows an enlarged view of a portion of the cross section taken along line E-E of the camera body 1' shown in Figure 14. As mentioned above, heat-conducting rubber 406 is attached to the surface of the image processing IC 400 mounted on the main board 4, and heat-transfer block 1702 is pressed against the heat-conducting rubber 406.

[0080] The heat transfer block 1702 has a stepped cylindrical heat transfer portion 1702a that extends from the contact surface with the heat conduction rubber 406 into the duct 601, and an insulating portion 1702b that surrounds the large-diameter portion of the heat conduction portion 1702a between the heat conduction rubber 406 and the O-ring 1703. A flange 1702c is formed near the end of the insulating portion 1702b that faces the heat conduction rubber 406. A protruding portion 1702d, which is the small-diameter portion of the heat conduction portion 1702a, protrudes into the duct 601 through a through-hole 1705a in the duct heat sink 1705. As described above, forming grooves 1702e at the tip of the protruding portion 1702d (heat conduction portion 1702a) increases the surface area and improves heat dissipation efficiency. If the surface area can be increased, fine irregularities may be provided instead of the grooves 1702e.

[0081] Furthermore, the position at which the protruding portion 1702d protrudes into the duct 601 is closer to the opening 603 than the openings 604 and 605, similar to the position at which the first heat transfer portion 701b of the plate 701 is thermally connected to the duct heat sink 705 in Example 1.

[0082] In this embodiment as well, another heat source such as the power supply board 15 is provided between the image processing IC 400, which is a heat source, and the duct 601 formed by the rear cover 600 and the duct heat sink 1705. Even in this case, heat can be transferred from the image processing IC 400 to the duct 601 without passing through many components. In particular, in this embodiment, the heat generated in the image processing IC 400 is guided to the duct 601 via the shortest and widest heat transfer path formed by a small number of components, namely the heat conductive rubber 406 and the heat transfer block 1702, thereby making it possible to quickly suppress a temperature rise in the image processing IC 400.

[0083] In this embodiment, the configuration has been described in which the heat transfer block 1702 passes through the through-hole 1705a in the duct heat sink 1705 and protrudes into the duct 601. However, even in the configuration in which the heat transfer block without the protruding portion 1702d is brought into contact with the duct heat sink 705 that does not have a through-hole, as in the first embodiment, it is possible to efficiently transfer the heat generated by the image processing IC 400 to the duct. [Example]

[0084] Next, a third embodiment will be described. Fig. 16 shows the camera body 1" of the third embodiment with the rear cover removed, as viewed from the rear side. Fig. 17 shows the rear of the camera body 1" with the rear cover 600 attached and the display unit (101) removed. The configuration of the rear cover 600 and the duct heat sink 705 attached thereto to form the duct 601 are the same as those shown in the first embodiment (Fig. 7). Other than the rear cover 600 and the duct heat sink 705, components in this embodiment that are common to the first embodiment are given the same reference numerals as in the first embodiment and will not be described here. In this embodiment, the position of the image processing IC 1400 and the configuration of the main board 14 differ from those in the first and second embodiments.

[0085] When accessory 900 shown in FIGS. 3 and 4 is attached to the bottom surface of camera body 1" and internal fan 901 is rotated, air flowing out of accessory 900 flows into duct 601 from opening 603 in rear cover 600. The air that has passed through duct 601 is exhausted from openings 611, 612, 604, and 605 that serve as exhaust ports.

[0086] The relationship between openings 611, 612, 604, and 605 will now be described. As explained in the first embodiment, the opening areas of openings 611 and 612 provided on the side surfaces of camera body 1" are both significantly smaller than the opening areas of openings 604 and 605 provided on both sides of viewfinder 118. Due to this difference in opening area, air that flows into duct 601 from opening 603 is mainly discharged from openings 604 and 605, and the amount of air discharged from openings 611 and 612 is less than the amount of air discharged from openings 604 and 605.

[0087] In the vertical direction of camera body 1" (the up and down direction in FIG. 17), openings 611 and 612 are arranged at positions offset to both sides of viewfinder 118. This arrangement makes it possible to prevent air being discharged from openings 611 and 612 from hitting the user's eyes when the user looks through viewfinder 118.

[0088] Furthermore, the opening area of opening 611 is smaller than the opening area of opening 612. The opening areas of openings 611 and 612 are made different so that the amount of air that flows into duct 601 from opening 603 and is discharged from openings 611 and 612 is approximately the same. By discharging the amount of air from openings 611 and 612 the same, the user can feel the air hitting their face in approximately the same way whether they look through viewfinder 118 with their right eye or their left eye.

[0089] Furthermore, opening 611 is provided closer to openings 604 and 605 than opening 612, and is provided on a different side of camera body 1" from the side on which openings 604 and 605 are provided. Furthermore, opening 611 is located on the upper part of the back surface of camera body 1", on a plane that connects opening 612 with openings 604 and 605.

[0090] As described in the first embodiment, opening 617 is provided as a third outlet (exhaust port) on the surface of rear cover 600 facing recess 608 (the surface facing the right in FIG. 17). Opening 617 opens toward the right side, opposite the left side surface on which openings 604 and 605 are provided. The opening area of opening 617 is smaller than the opening areas of openings 604 and 605.

[0091] In addition, the duct 601 has a constant thickness in the front-to-rear direction, and the width or height of the openings 611, 612, 603, 604, and 605 is set to be equal to or greater than the thickness of the duct 601 so as to reduce resistance to the air flowing into the duct 601 and being discharged out of the duct 601.

[0092] 16, an image processing IC 1400 is mounted on the main board 14, and further, a first card slot 401 and a second card slot 402 described in the first embodiment are attached closer to the grip than the image processing IC 1400. An eject button 401a is provided in the first card slot 401. When a user inserts the first card described in the first embodiment into the first card slot 401, a lever 401b rotates and the eject button 401a protrudes to the right in the figure. When the user presses the protruding eject button 401a, the lever 401b rotates in the opposite direction to when the card was inserted, and the first card is pushed outward.

[0093] Due to restrictions on arranging the image processing IC 1400 on the main board 14, the position of the first card slot 401 in the width direction of the camera body 1" may be restricted. A battery storage section 124 is provided on the front side of the main board 14, and when the card cover 300 described in the first embodiment is not present, part of the battery storage section 124 is exposed to the outside of the camera body 1".

[0094] 17, the area where the image processing IC 1400 is thermally connected to the duct 601 (duct heat sink 705) is indicated by a dashed line. A heat-conducting rubber (not shown) is attached to the surface of the image processing IC 1400, and heat generated by the image processing IC 1400 is transferred to the duct heat sink 705 via the heat-conducting rubber.

[0095] As shown in FIG. 17, the image processing IC 1400 is arranged so as to be thermally connected to the duct heat sink 705 on the inside of a line extending upward from both ends of the opening 603. Also, an opening 612 is arranged on the inside of a line extending upward from both ends of the opening 603. In other words, when viewed from the rear of the camera body 1", the opening 603 as an air intake, the thermal connection area of the image processing IC 1400 as a heat source to the duct heat sink 705, and the opening 612 as an exhaust port are aligned in the vertical direction (up and down direction).

[0096] In particular, in this embodiment, the position of the center of the opening 612 in the horizontal direction (left and right direction) when viewed from the back of the camera body 1" coincides with the position of the center of the thermal connection area of the image processing IC 1400. In other words, the center of the opening 612 and the center of the thermal connection area of the image processing IC 1400 are located on the same straight line 800 extending in the vertical direction.

[0097] Furthermore, when viewed from the back of the camera body 1", the thermal connection area of the image processing IC 1400 to the duct heat sink 705 and the opening 617, which is the third outlet, are aligned horizontally. In particular, in this embodiment, the position of the center of the opening 617 and the position of the center of the thermal connection area of the image processing IC 1400 coincide in the vertical direction when viewed from the back of the camera body 1". In other words, the center of the opening 617 and the center of the thermal connection area of the image processing IC 1400 are located on the same straight line 801 extending horizontally.

[0098] By adopting the above-described arrangement, the image processing IC 1400 can be efficiently cooled using the airflow from the accessory 900.

[0099] Also, there are cases where the accessory 900 is not attached to the camera body 1". In this case, when the user holds the camera body 1" in the upright position as shown in FIG. 17, the opening 603 and the thermal connection area of the image processing IC 1400 in the duct 601 are positioned on the same straight line 800 extending vertically. Therefore, air heated by heat from the image processing IC 1400 inside the duct 601 is smoothly discharged from the opening 612 by natural convection. Furthermore, when the user holds the camera body 1 in the vertical position with the grip part 120 facing up, the opening 617 and the thermal connection area of the image processing IC 1400 in the duct 601 are positioned on the same straight line 801 extending vertically. Therefore, air heated by heat from the image processing IC 1400 inside the duct 601 is smoothly discharged from the opening 617 by natural convection.

[0100] In this way, by providing the opening 603 as an intake port and the openings 612 and 617 as exhaust ports, it is possible to cool the image processing IC 1400 using natural convection even if the accessory 900 is not attached to the camera body 1″.

[0101] As described above, eyepiece cover 123 is attached to rear cover 600 around viewfinder 118, with openings 611 and 612 provided on both sides. Openings 611 and 612 are provided so as not to overlap eyepiece cover 123 when viewed from the rear side. However, at least a portion of openings 611 and 612 may overlap eyepiece cover 123 when viewed from the rear side. By partially overlapping openings 611 and 612 with eyepiece cover 123, it is possible to make it difficult for a user looking through viewfinder 118 to feel air being discharged from openings 611 and 612.

[0102] In the above embodiments, an imaging device has been described as an example of an electronic device, but the heat dissipation (cooling) structure described in the embodiments may be used in other electronic devices. Also, in the embodiments, air is used as the refrigerant flowing through the duct, but other refrigerants (gases other than air or liquids such as water) may also be used.

[0103] The embodiments described above are merely representative examples, and various modifications and alterations are possible to each embodiment when implementing the present invention. [Explanation of symbols]

[0104] 4,14 Main board (first board) 5,15 Power supply board (second board) 118 Finder 400,1400 Image processing IC 406,407 Thermal conductive rubber 603,604,605,611,612,617 aperture 601 Duct 701,1701 Plate (support member) 705, Duct heat sink 900 Accessories 901 Fan 1702 Heat Transfer Block

Claims

1. a first substrate on which a heat generating element is mounted; a second substrate; a support member having a fixing portion to which the second substrate is fixed, and supporting the second substrate so as to overlap the first substrate with a gap therebetween; a heat dissipation member disposed on the opposite side of the first substrate with the second substrate and the support member interposed therebetween so as to overlap the second substrate with a gap therebetween, the support member has a heat receiving portion thermally connected to the heat generating element, a first heat transfer portion that transfers the heat received by the heat receiving portion to the heat dissipation member, and a second heat transfer portion that transfers the heat received by the fixing portion to the heat dissipation member, The electronic device, wherein the support member has a shape that reduces heat transfer from the heat receiving portion to the fixed portion.

2. 2. The electronic device according to claim 1, wherein the support member has a shape in which the heat transfer cross-sectional area of the portion between the heat receiving portion and the fixed portion is smaller than the heat transfer cross-sectional areas of the heat receiving portion, the fixed portion, the first heat transfer portion, and the second heat transfer portion.

3. the support member is formed from a metal plate and has a step between the heat receiving portion and the fixing portion, 3. The electronic device according to claim 2, wherein the thickness of the connecting portion of the step is smaller than the thickness of each of the heat receiving portion, the fixing portion, the first heat transfer portion, and the second heat transfer portion.

4. 4. The electronic device according to claim 2, wherein a through hole is provided in the fixing portion at a position on the heat receiving portion side or in the support member between the heat receiving portion and the fixing portion.

5. 5. The electronic device according to claim 1, wherein the support member has a shape that does not contact the second substrate in an area where a non-heat-resistant element is mounted on the second substrate.

6. The electronic device according to any one of claims 1 to 5, characterized in that the first substrate and the second substrate are arranged so that the heat-generating element, the second substrate, and the portion of the first heat transfer section that is thermally connected to the heat dissipation member are overlapped with a gap therebetween.

7. the heat dissipation member forms at least a part of a duct through which a refrigerant flows, 6. The electronic device according to claim 1, wherein the first heat transfer portion is thermally connected to the heat dissipation member at a position closer to an inlet through which the refrigerant flows into the duct than to an outlet through which the refrigerant flows out of the duct.

8. 8. The electronic device according to claim 7, wherein the first heat transfer portion is thermally connected to the heat dissipation member at a position upstream of the second heat transfer portion in a direction in which the coolant flows through the duct.

9. The duct has a first region in which the refrigerant flows at a high speed and a second region in which the refrigerant flows at a slower speed than the first region, 9. The electronic device according to claim 7, wherein the first heat transfer portion and the second heat transfer portion are thermally connected to the heat dissipation member in the first region.

10. a first substrate on which a heat generating element is mounted; a second substrate; a support member to which the second substrate is fixed, the support member supporting the second substrate so as to overlap the first substrate with a gap therebetween; a heat dissipation member disposed on the opposite side of the first substrate with the second substrate and the support member interposed therebetween, the heat dissipation member being spaced apart from the second substrate and overlapping the second substrate; a heat transfer member thermally connected to the heat generating element and extending toward the heat dissipation member through an opening provided in the second substrate; a heat insulating member disposed between the heat transfer member and the second substrate and having a thermal conductivity lower than that of the heat transfer member; the heat dissipation member forms at least a part of a duct through which a refrigerant flows, The electronic device, characterized in that the heat transfer member passes through an opening provided in the heat dissipation member and protrudes into the duct or is thermally connected to the heat dissipation member.

11. The position where the heat transfer member protrudes into the duct or is thermally connected to the heat dissipation member is:

11. The electronic device according to claim 10, wherein the coolant is disposed closer to an inlet through which the coolant flows into the duct than to an outlet through which the coolant flows out of the duct.

12. 12. The electronic device according to claim 10, wherein the heat transfer member is made of metal, and the heat insulating member is made of resin or rubber.

13. The heat insulating member is a portion surrounding the outside of the heat transfer member and passing through the opening of the second substrate; 13. The electronic device according to claim 12, further comprising a portion of the second substrate that is sandwiched between the periphery of the opening and the heat generating element.

14. 14. The electronic device according to claim 1, wherein the electronic device is an imaging device having an imaging element, and the heating element performs image processing on a signal output from the imaging element.

15. An imaging device having a finder through which a user looks, a substrate on which a heat generating element is mounted, and a heat dissipation member to which the heat generating element is thermally connected and which forms at least a part of a duct through which a coolant flows, the duct has an inlet through which the refrigerant flows, and a first outlet and a second outlet through which the refrigerant flows, the inlet is provided on a bottom surface of the imaging device, the first outlet is provided on a side surface of the imaging device, the second outlet is provided to the side of the viewfinder at an upper part of the rear surface of the imaging device, An imaging device, wherein an opening area of the second outlet is smaller than an opening area of the first outlet.

16. 16. The imaging device according to claim 15, wherein, in a rear view of the imaging device, the inlet, the area of the heat dissipation member to which the heat generating element is thermally connected, and the second outlet are aligned in the vertical direction of the imaging device.

17. The second outlet comprises two outlets provided on both sides of the finder, 17. The imaging device according to claim 15, wherein the opening areas of the two outlets are different from each other.

18. the duct has a third outlet opening toward the opposite side to the first outlet, 18. The imaging device according to claim 15, wherein, when viewed from behind, the third outlet and the area of the heat dissipation member to which the heat-generating element is thermally connected are aligned laterally with respect to the imaging device.

19. 19. The imaging device according to claim 18, wherein an opening area of the third outlet is smaller than an opening area of the first outlet.

20. An imaging element is included, 20. The imaging device according to claim 15, wherein the heat generating element performs image processing on a signal output from the imaging element.

Images