RFID label manufacturing method

Abstract

To provide an RFID label and an RFID recording medium that can use thermal paper as a base material.SOLUTION: The present invention relates to an RFID label formed by laminating a label base material, an RFID antenna, an IC chip, and an adhesive layer in this order. The label base material is a piece of thermal paper having a heat-sensitive light-presenting layer in one surface. The RFID antenna is provided in the other surface of the label base material. The IC chip is connected to the RFID antenna with an ultraviolet curing-type anisotropic conductive adhesive agent.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to an RFID label, an RFID recording medium, and a method for manufacturing an RFID label. [Background technology]

[0002] In recent years, RFID (Radio Frequency Identification) labels have become popular as labels attached to goods for their manufacture, management, and distribution. RFID labels incorporate an RFID inlay, which is a base film laminated with an RFID-compatible IC chip and a predetermined antenna pattern, and the IC chip can store various information about the goods.

[0003] Conventional RFID labels generally consist of adhesive paper with a label base material, adhesive layer, and separator laminated in that order, with a PET film-based RFID inlay placed between the adhesive layer and the separator.The label base material is typically paper, film, or thermal paper that can be thermally transferred. However, in conventional RFID label manufacturing methods, the label and inlay, each consisting of a label substrate, adhesive layer, and separator, are manufactured separately and then combined, which requires a large number of constituent materials and production steps, hindering mass production and cost reduction.In addition, the finished RFID label, made of many constituent materials and thick, is thicker and stronger than general-purpose labels, making it difficult to stick to curved surfaces.

[0004] Therefore, an RFID label with a structure in which the antenna is formed directly on the surface opposite the printed surface of the label substrate (i.e., an RFID label without an inlay) has been proposed (Patent Document 1). With this structure, the label substrate also serves as the base film for the inlay, reducing the amount of constituent materials and contributing to resource conservation. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] International Publication No. 2017 / 159222 Summary of the Invention [Problem to be solved by the invention]

[0006] However, thermal paper cannot be used as the label substrate for RFID labels that do not include an inlay. This is because a heat-curing anisotropic conductive adhesive is used to attach the IC chip to the antenna formed on the back of the label substrate. If thermal paper is used as the label substrate, the thermal paper near the IC will discolor due to the heat-curing process of the adhesive. In addition, a conventional method for manufacturing RFID labels involves printing a resist layer of an antenna pattern on a metal foil laminated to a label substrate, and then using chemical etching to melt and remove everything except the antenna pattern. However, when thermal paper is used as the label substrate, chemical etching cannot be applied. For these reasons, RFID labels without inlays are currently only used in limited applications such as labels for thermal transfer printing or inkjet printing, or display stickers with pre-printed surfaces.

[0007] Therefore, an object of one aspect of the present invention is to provide an RFID label and an RFID recording medium that can use thermal paper as the substrate. [Means for solving the problem]

[0008] One aspect of the present invention is an RFID label comprising a label substrate, an RFID antenna, an IC chip, and an adhesive layer laminated in this order, wherein the label substrate is thermal paper having a heat-sensitive color former layer on one side, the RFID antenna is provided on the other side of the label substrate, and the IC chip is connected to the RFID antenna with an ultraviolet-curable anisotropic conductive adhesive.

[0009] Another aspect of the present invention is an RFID recording medium in which thermal paper, an RFID antenna, an IC chip, an adhesive layer, and a base material are laminated in this order, wherein the RFID antenna is provided on the side of the thermal paper opposite to the side having the thermosensitive colorant layer, and the IC chip is connected to the RFID antenna by an ultraviolet-curable anisotropic conductive adhesive.

[0010] Yet another aspect of the present invention is a thermal paper having a heat-sensitive color former layer, an RFID antenna, an IC chip, P A method for manufacturing an RFID label laminated in this order includes the steps of: forming an RFID antenna on the surface of the thermal paper opposite to the surface having the thermosensitive color former layer; arranging an ultraviolet-curable anisotropic conductive adhesive at a predetermined position on the RFID antenna formed on the thermal paper; arranging an IC chip on the ultraviolet-curable anisotropic conductive adhesive arranged at the predetermined position on the RFID antenna; and irradiating ultraviolet light onto the ultraviolet-curable anisotropic conductive adhesive on which the IC chip is arranged to cure. In the thermal paper a step of adhering and electrically connecting the RFID antenna and the IC chip; of The present invention relates to a method for manufacturing an RFID label. [Effects of the Invention]

[0011] According to an embodiment of the present invention, thermal paper can be used as the substrate in the RFID label or RFID recording medium. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 10 is a plan view of a plurality of RFID labels temporarily attached to a separator. [Figure 2] 2 is an enlarged view of the XX cross section of FIG. 1. FIG. [Figure 3] 1 is a schematic diagram of a manufacturing apparatus for carrying out a method of manufacturing an antenna pattern according to an embodiment. [Figure 4] FIG. 2 is a partially enlarged, partially cutaway view showing a main part of an RFID label according to an embodiment in the process of being manufactured. [Figure 5] FIG. 10 is a cross-sectional view of an RFID label according to another embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0013] (1) RFID labels An RFID label 1 according to one embodiment will be described below with reference to FIGS. Fig. 1 is a plan view of a plurality of RFID labels 1 temporarily attached to a separator 7 with an adhesive. Fig. 2 is an enlarged view of a cross section taken along line XX in Fig. 1. An arrow F in Fig. 1 corresponds to the conveying direction in a manufacturing apparatus 100, which will be described later. As shown in FIG. 2, an RFID label 1 according to one embodiment is a label in which thermal paper 2 as a label substrate, an antenna 3, an IC chip 4, and an adhesive 6 for an adherend are laminated in this order.

[0014] The thermal paper 2 includes a substrate 21 and a heat-sensitive color former layer 22 provided on one surface of the substrate 21 . In the present disclosure, the "thermal paper" may be any material having a thermosensitive color former layer on one side, and is not limited to paper substrates. For example, a film may be used as the substrate of the thermal paper 2. For example, materials that can be used as the substrate 21 of the thermal paper 2 shown in Figure 2 include paper such as high-quality paper and coated paper, and resin films such as polyvinyl chloride, polyethylene terephthalate, polypropylene, polyethylene, and polyethylene naphthalate, or multilayer films made by laminating multiple of these resin films.

[0015] An undercoat layer (an easy-adhesion layer or a barrier layer) may be provided between the thermosensitive color former layer 22 and the substrate 21. An overcoat layer (a protective layer, a lubricating layer or an ultraviolet-resistant layer) may be provided on the surface of the thermosensitive color former layer 22.

[0016] The thickness of the thermal paper 2 (the same as the thickness of the continuum C described below) is preferably 25 μm or more and 300 μm or less. When paper is used as the substrate 21, it can be 50 μm or more and 260 μm or less within the above range. When a resin film is used as the substrate 21, it can be 16 μm or more and 200 μm or less within the above range. The thickness of the thermal paper 2 can be selected appropriately depending on the application.

[0017] The antenna 3 is made of a conductive material and has a predetermined shape, as shown in Fig. 1. The shape of the antenna 3 is not limited to the antenna pattern shown in Fig. 1, and can be set appropriately depending on the application of the RFID label 1. For example, the antenna 3 is designed to have a pattern compatible with a specific frequency band, such as the UHF band (300 MHz to 3 GHz, particularly 860 MHz to 960 MHz), microwaves (1 to 30 GHz, particularly around 2.4 GHz), and the HF band (3 MHz to 30 MHz, particularly around 13.56 MHz).

[0018] An example of a conductive material that forms the antenna 3 is metal foil, but the invention is not limited to this and any conductive material can be used. When a metal foil is used as the antenna 3, examples of the material include copper and aluminum. From the viewpoint of reducing manufacturing costs, it is preferable to use aluminum. Furthermore, from the viewpoint of the overall thickness of the RFID label 1 and manufacturing costs, it is preferable that the thickness of the antenna 3 (the same as the thickness of the metal sheet continuum M described below) be 3 μm or more and 25 μm or less.

[0019] Examples of the adhesive A include acrylic adhesives, urethane adhesives, silicone adhesives, rubber adhesives, etc. Among them, ultraviolet curable acrylic adhesives are preferred. The adhesive strength of the adhesive A is preferably 500 gf / 25 mm or more, more preferably 800 gf / 25 mm or more, and even more preferably 1000 gf / 25 mm or more, in a 180° peel test (JIS Z 0237). The upper limit of the adhesive strength is preferably 2000 gf / 25 mm.

[0020] 2, which shows a further enlarged view of the vicinity of the IC chip 4, an anisotropic conductive paste (hereinafter simply referred to as "ACP"), which is an ultraviolet-curable anisotropic conductive adhesive, is disposed in the center of the antenna 3. The IC chip 4 is disposed on the ACP. The ultraviolet-curing anisotropic conductive adhesive is an adhesive that hardens when exposed to ultraviolet (UV) light, and contains conductive particles that are uniformly dispersed in the adhesive, connecting the IC chip 4 to the designated position on the antenna 3 while ensuring conductivity between the IC chip 4 and the antenna 3.

[0021] The size of the conductive particles contained in the ACP can be determined appropriately depending on, for example, the surface roughness of the antenna 3. The size of the conductive particles is preferably 10 μm or more and 30 μm or less for stable electrical connection.

[0022] 2, an adhesive 6 for an adherend for adhering the RFID label 1 to a separator 7 is provided on the entire surface of the substrate 21 of the thermal paper 2 opposite to the surface on which the thermosensitive color former layer 22 is provided. An undercoat layer may be provided on the surface of the substrate 21 of the thermal paper 2 on which the adhesive 6 for an adherend is provided in order to improve the adhesion of the adhesive 6 for an adherend. A barrier layer may also be provided to prevent the penetration of the adhesive 6 for an adherend.

[0023] The adhesive that forms the adhesive 6 for the adherend can be, for example, an emulsion type (adhesive dispersed in water), a solvent type (adhesive dissolved in a solvent), or a hot melt type (using thermoplasticity). Adhesive materials include synthetic rubber materials, natural rubber materials, acrylic resin materials, polyvinyl ether resin materials, urethane resin materials, and silicone resin materials. The adhesive strength of the adhesive can be set appropriately depending on the application of the RFID label 1.

[0024] The separator 7 may be made of paper or film coated with ultraviolet curable silicone, heat curable silicone, solvent type silicone, alkyl pendant polymer, or a fluorine-based release agent, for example.

[0025] (2) RFID label manufacturing method Next, a method for manufacturing an RFID label 1 according to one embodiment will be described with reference to Fig. 3. Fig. 3 is a schematic diagram of a manufacturing apparatus 100 that executes part of the method for manufacturing an RFID label 1 according to one embodiment. The manufacturing apparatus 100 is an apparatus that executes a step of forming an antenna 3 on thermal paper 2 (hereinafter referred to as an "antenna forming step") when manufacturing an RFID label 1.

[0026] 3, the antenna formation process includes an adhesive placement process P1 in which adhesive A is placed on the continuous body C of thermal paper 2 while transporting the continuous body C of thermal paper 2, a metal sheet placement process P2 in which a continuous body M of metal sheet is placed on the surface of the continuous body C on which adhesive A is placed, a cutting process P3 in which a cut for the antenna 3 is formed in the continuous body M of metal sheet, a removal process P4 in which an unnecessary portion Mb of the continuous body M of metal sheet that does not constitute the antenna 3 is removed, and a pressure application process P5 in which pressure is applied to the antenna 3 remaining on the continuous body C. Arrow F in FIG. 3 indicates the transport direction.

[0027] The adhesive placement step P1 is performed by an adhesive placement unit 110. The adhesive placement unit 110 has an adhesive tank 111 that stores adhesive, a pumping roller 112 that pumps up the adhesive from the adhesive tank 111, a plate roller 113 that receives adhesive A from the pumping roller 112 and prints it on the continuous body C, and an impression cylinder 114. The adhesive placement unit 110 also has a UV lamp 115 that irradiates the adhesive A with ultraviolet light.

[0028] The printing roller 113 is a printing cylinder on which a printing plate is formed, on which a raised pattern 113a corresponding to the shape of the adhesive A to be placed on the continuous body C of thermal paper 2 is wound. Multiple raised patterns 113a are formed on the printing roller 113. The multiple raised patterns 113a are imposed side by side in the feed direction and width direction of the printing roller 113. This allows adhesive for multiple antenna patterns to be printed simultaneously on the continuous body C. Each raised pattern 113a is shaped to fit inside the outer periphery of the antenna 3 to be placed on the continuous body C of thermal paper 2.

[0029] As described above, examples of adhesive A that can be used in the adhesive application step P1 include acrylic adhesives, urethane adhesives, silicone adhesives, and rubber adhesives. In this antenna formation step, it is preferable to use an ultraviolet-curing acrylic adhesive, from the viewpoint of applying the adhesive to the conveyed continuous body C by flexographic printing or letterpress printing. Screen printing is also applicable.

[0030] The thickness of the adhesive A disposed on the continuum C is preferably 3 μm or more and 25 μm or less. If it is 3 μm or more, sufficient adhesive strength for adhering the antenna 3 can be obtained, and if it is 25 μm or less, the adhesive A will not protrude beyond the outer periphery of the antenna 3 when pressure is applied. From this viewpoint, the thickness of the adhesive A is more preferably 3 μm or more and 10 μm or less.

[0031] Fig. 4 is a partially enlarged, partially cutaway view showing a main portion of the back side of the RFID label 1 during production in the antenna forming step. In the enlarged portion of the RFID label 1 during production shown in Fig. 4, the portion of the adhesive A located below the antenna 3 is indicated by a dashed line. In Fig. 4, the margins between the outer periphery of the antenna 3 and the adhesive A located inside the outer periphery of the antenna 3 are indicated by mu, md, w1, and w2.

[0032] The adhesive A is positioned so that the margin mu on the upstream side in the conveying direction is wider than the margin md on the downstream side in the conveying direction. That is, the margin mu shown in FIG. 4 is larger than the margin md.

[0033] If the margin is too wide, the edge of the antenna 3 may lift up or peel off. If the margin is too narrow, the adhesive A may protrude from the outer periphery of the antenna 3. From this viewpoint, the margin mu is preferably 50 μm or more and 300 μm or less, and the margin md is preferably 30 μm or more and 100 μm or less (provided that mu>md is satisfied).

[0034] In addition, before the adhesive placement process P1, a process may be carried out to print reference marks that can be used as a reference for positioning the adhesive when printing it on the continuum C and for positioning the incision position when forming the incision for the antenna pattern.

[0035] The metal sheet placement step P2 is performed by the metal sheet placement unit 120. The metal sheet placement unit 120 has a pressure roller 121 and a support roller 122. In the metal sheet placement step P2, a metal sheet continuum M transported by a transport path separate from the transport path of the continuum C is superimposed on the surface of the continuum C on which the adhesive A has been applied, and is inserted between the pressure roller 121 and the support roller 122 to be bonded together. Because no adhesive is present outside the outer periphery of the antenna 3, the metal sheet continuum M is not adhered to the continuum C except in the region where the antenna 3 is formed.

[0036] The cutting step P3 is performed by a cutting unit 130. The cutting unit 130 has a die roll 131 that forms a cut for the antenna 3 in the continuous body M of metal sheets arranged on the continuous body C, and an anvil roller 132 that backs up the die roll 131. A convex blade 131a having the shape of the outer circumferential line of the antenna 3 is formed on the surface of the die roll 131. The convex blade 131a may be a flexible die. Alternatively, it may be composed of a carving blade, an embedding blade, or the like.

[0037] The cutting unit 130 sandwiches and continuously transports the workpieces made of the continuum C and the continuum M, while cutting the convex blade portion 131a into the metal sheet continuum M to define the antenna 3. This allows cutting into the metal sheet continuum M.

[0038] The removal step P4 is performed by the removal unit 140. The removal unit 140 includes peel rollers 141 and 142. The unnecessary portion Mb of the metal sheet is placed along a portion of the peel roller 141 to change the conveying direction, and the workpiece is placed along a portion of the peel roller 142 to be conveyed in a direction different from the conveying direction of the unnecessary portion Mb, thereby separating the unnecessary portion Mb of the metal sheet from the workpiece made up of the continuum C and the continuum M. After being collected, the unnecessary portion Mb is subjected to a recycling process and is reused as the continuum M of the metal sheet.

[0039] The pressurizing step P5 is performed by the pressurizing unit 150. The pressurizing unit 150 includes a pressure roller 151 and a support roller 152. In the pressurizing unit 150, the work is sandwiched between the pressure roller 151 and the support roller 152 and pressurized while being transported, so that the adhesive A is spread over the entire surface of the antenna 3 arranged on the continuum C. The pressure is preferably 2 kg / cm or more and 6 kg / cm or less.

[0040] After the pressing step P5, the workpiece with the antenna 3 arranged on the continuum C is taken up by the take-up roller 102. The antenna 3 can be formed on the continuous body C of thermal paper 2 by the antenna forming process consisting of the above steps P1 to P5.

[0041] In the antenna forming process, in the pressurizing step P5, the pressurizing unit 150 sandwiches the workpiece between the pressure roller 151 and the support roller 152 and presses the workpiece, thereby spreading the adhesive A over the entire surface of the antenna 3 arranged on the continuum C. Furthermore, the pressure is applied to cause the adhesive A to adhere, allowing the antenna 3 to be tightly attached to the continuum C.

[0042] Furthermore, in the pressurizing step P5, when the workpiece, on which the antenna 3 is arranged on the continuum C, is pressed by the pressure roller 151 and the support roller 152 while being transported, the adhesive A arranged between the continuum C and the antenna 3 is stretched upstream in the transport direction. In contrast, in the method for manufacturing an antenna pattern according to this embodiment, the position of the adhesive A is positioned so that the margin between the outer periphery of the antenna 3 and the adhesive A arranged inside the outer periphery of the antenna 3 is wider on the upstream side in the transport direction than on the downstream side in the transport direction, and therefore the adhesive A stretched upstream in the transport direction is contained within the margin mu that is set wide on the upstream side in the transport direction.

[0043] In the antenna forming process, because the adhesive A is not attached to the unnecessary portion Mb of the metal sheet, when winding up the unnecessary portion Mb, there is no need to apply a peeling force to the winding roller (not shown in FIG. 3) for the unnecessary portion Mb to peel the unnecessary portion Mb from the workpiece. Therefore, the conveying speed of the workpiece can be set without considering the peeling force of the unnecessary portion Mb of the metal sheet or breakage due to the peeling force. Furthermore, because the adhesive A is not attached to the unnecessary portion Mb of the metal sheet, and because the adhesive A is attached, other foreign matter is not attached, there are advantages in that the unnecessary portion Mb of the metal sheet is easy to handle after recovery and has excellent reusability.

[0044] In the antenna forming process, in the removal step P4, in addition to separating the workpiece from the unnecessary portion Mb of the metal sheet by the peel rollers 141 and 142, a suction mechanism may be provided to remove the unnecessary portion Mb by suction. This makes it possible to reliably remove metal sheet pieces that are likely to remain on the workpiece when only separating them by the peel rollers 141 and 142.

[0045] Although not shown, after the antenna forming step, an easy adhesion step, an ACP discharging step, an IC chip placement step, and an ACP curing step are performed in this order. The easy-adhesion process is a process in which a laser is irradiated onto the surface of the antenna where the IC chip is placed to roughen the surface. In the ACP ejection step, ACP is ejected from a dispenser toward a predetermined position of each antenna 3 formed on the thermal paper continuum C in the antenna formation step. In the IC chip placement step, the IC chip 4 is placed while being pressed against the ACP that was placed on the antenna 3 in the ACP discharge step. In the ACP curing process, the IC chip 4 placed on the antenna 3 is pressed by a pressing unit while the ACP on the antenna 3 is irradiated with ultraviolet light to cure it. The ultraviolet irradiator may be built into the pressing unit, or may be placed diagonally above and irradiate the ACP with ultraviolet light from diagonally above. An LED lamp that generates little heat is suitable as the ultraviolet irradiator.

[0046] Through the ACP ejection step, IC chip placement step, and ACP curing step, the antenna 3 and the IC chip 4 are bonded and electrically connected together. Next, an adhesive 6 for an adherend is applied to the entire surface of the substrate 21 on which the antenna 3 and IC chip 4 are laminated, and the substrate 21 is temporarily attached to the separator 7, thereby completing the RFID label 1 shown in Fig. 1. Alternatively, an adhesive may be applied to the release layer side of the separator 7, and the substrate 21 (and the antenna 3 and IC chip 4) may be attached to the separator 7. Thereafter, the substrate 21 is punched out into the desired shape of the RFID label 1.

[0047] In the RFID label 1 manufactured as described above, the antenna 3 and IC chip 4 are directly disposed on the surface of the thermal paper 2 opposite the surface on which the thermosensitive color former layer 22 is provided, eliminating the need for an inlay base film, thereby reducing the amount of constituent materials and contributing to resource conservation. Furthermore, in this RFID label 1, the antenna 3 and IC chip 4 are bonded by irradiating the ACP with ultraviolet light. Unlike conventional bonding methods using thermosetting adhesives, no heat is applied when bonding the antenna 3 and IC chip 4, and therefore no discoloration occurs in the thermal paper 2 near the IC chip 4. This allows the RFID label 1 to be used in a wide range of applications where printing is performed on the thermal paper 2 using a thermal printer.

[0048] 5 shows another embodiment of the RFID label 10. Similar to FIG. 2, FIG. 5 shows a cross section of the RFID label 10. This RFID 10 uses double-sided tape 16 instead of the adhesive 6 for the adherend of RFID label 1 described above with reference to Figure 2. Double-sided tape 16 is made by laminating adhesive layer 26a, core material 25 made of paper or film, and adhesive layer 26b in this order. The separator on the adhesive layer 26a side is peeled off from a tape roll (not shown) with separators temporarily attached to each of adhesive layers 26a and 26b of double-sided tape 16, and the exposed adhesive layer 26a is laminated on the antenna 3 side of thermal paper 2, thereby obtaining the cross-sectional configuration shown in Figure 5. In this case, separator 17 may be the separator of the double-sided tape as is, or it may be replaced with a separate separator suitable for the label. It is also possible to use a tape roll of double-sided tape 16 wound with a double-sided release separator having release agent layers on both sides of the substrate. The laminate of double-sided tape 16 and double-sided release separator can be laminated on the antenna side of thermal paper 2. 5, the core material 25 provides cushioning properties, which is effective in protecting the IC chip 4. In the cross-sectional configuration shown in FIG. The double-sided tape may have no core material. In this case, the cross-sectional structure will be as shown in Figure 2. The separator 17 may be the separator of the double-sided tape, or may be replaced with a separator suitable for the label roll during lamination.

[0049] (3) RFID recording media In the RFID recording medium according to one embodiment, an outer base material is disposed on the adhesive 6 for the adherend of the RFID label 1 instead of the separator 7 . The RFID recording medium can be used as, for example, a tag, a card, a wristband, a ticket, etc., and the external shape of the thermal paper 2 and the outer substrate is determined depending on the application. The method for producing the RFID recording medium can be the same as the method for producing the RFID label, except that the outer base material is attached to the adhesive 6 for adherend instead of the separator 7.

[0050] Although the embodiments of the RFID label, RFID recording medium, and RFID label manufacturing method have been described above, the present invention is not limited to the above-described embodiments. Furthermore, the above-described embodiments can be improved or modified in various ways without departing from the spirit and scope of the present invention. [Explanation of symbols]

[0051] 1,10...RFID labels 2...Thermal paper 21...Base material 22...Thermal color former layer 3...Antenna pattern 4. IC chip 6...Adhesive for adherend 7,17...Separator 16...Double-sided tape 25...Core material 26a, 26b...Adhesive layer 100...Manufacturing equipment 101...Feed roller 102...winding roller 110...Adhesive placement unit 111...Adhesive tank 112...Suction roller 113...Printing roller 113a...Convex pattern 114...impression cylinder 115...UV lamp 120...Metal sheet placement unit 121...Pressing roller 122...Support roller 130...Cutting unit 131...Die Roll 131a...Convex blade part 132...Anvil Roller 140…Removal unit 141, 142...Peel roller 150...Pressure unit 151...Pressing roller 152...Support roller P1: Adhesive placement process P2: Metal sheet placement process P3…Cutting process P4…Removal process P5: Pressurization process A: Adhesive ACP: Anisotropic conductive paste C...Continuous thermal paper F...Transport direction M...continuous metal sheet Mb: Unnecessary part of the metal sheet S...area mu,md,w1,w2...margin

Claims

1. A method for manufacturing an RFID label in which a thermal paper having a heat-sensitive color former layer, an RFID antenna, and an IC chip are laminated in this order, comprising: forming an RFID antenna on a surface of the thermal paper opposite to a surface having the thermosensitive color former layer; a step of placing an ultraviolet-curing anisotropic conductive adhesive at a predetermined position of the RFID antenna formed on the thermal paper; a step of placing the IC chip on the ultraviolet-curable anisotropic conductive adhesive placed at a predetermined position on the RFID antenna; a step of irradiating the ultraviolet-curable anisotropic conductive adhesive on which the IC chip is disposed with ultraviolet light to cure the adhesive, thereby bonding and electrically connecting the RFID antenna and the IC chip on the thermal paper; A method for manufacturing an RFID label, comprising:

2. The method further includes providing an adhesive layer on the surface of the thermal paper on which the RFID antenna is formed. A method for manufacturing the RFID label according to claim 1.

3. In the step of providing the adhesive layer, an adhesive layer, a sheet-like core material, and another adhesive layer are provided in this order on the surface of the thermal paper on which the RFID antenna is formed. A method for manufacturing the RFID label according to claim 2.

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