Manufacturing method for laminated molded products

Abstract

To provide a method and system for suitably manufacturing a multi-layered laminate-molded article.SOLUTION: A manufacturing method for a laminate-molded article involves laminating and flattening a laminate-molded article to which laminate films are temporarily bonded or laminated, and includes the following steps. In a step (a), a plurality of pressing plates, each having a different predetermined structural body, are prepared in advance. In a step (b), one pressing plate is selected from the plurality of pressing plates according to a state of a newly temporarily bonded or laminated base material. In a step (c), a pressing part is prepared by attaching the selected pressing plate to a flat main surface of a disc body. In a step (d), the temperature of the pressing part is controlled such that the temperature of the pressing part is within a predetermined range. In a step (e), the pressing part is pressed to a surface of the base material.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a laminated molded product and a system for manufacturing a laminated molded product. [Background technology]

[0002] 2. Description of the Related Art Laminating apparatuses and laminating methods have been developed for manufacturing circuit boards, IC boards, and the like by laminating a lamination material such as a resin film onto a substrate having irregularities.

[0003] For example, the method disclosed in Patent Document 1 involves reducing the pressure in the upper and lower lamination molding spaces of a substrate that has been brought into a vacuum lamination device together with upper and lower carrier films, and pressurizing the substrate with the carrier films by continuing to reduce the pressure in one space while pressurizing the other space.

[0004] In addition, the method disclosed in Patent Document 2 forms a chamber that can be vacuumed when the upper and lower plates are closed, and an elastic membrane provided on at least one of the plates is expanded into the chamber to pressurize the substrate.

[0005] The system disclosed in Patent Document 3 has a vacuum lamination device that pressurizes the substrate with a pressurizing body in a decompressed chamber to form an intermediate laminate, and a flattening press device that is disposed downstream of the vacuum lamination device and pressurizes the intermediate laminate. The flattening press device of this system has pressure mechanisms in the tie bar sections, and the positions of the pressure mechanisms can be controlled individually. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2004-058349 [Patent Document 2] Japanese Patent Application Laid-Open No. 2013-237230 [Patent Document 3] Patent Publication No. 2021-100802 Summary of the Invention [Problem to be solved by the invention]

[0007] However, in processes for producing multilayered laminated molded products by repeatedly laminating a laminate film, such as a thermosetting resin film, onto a substrate whose surface has been processed with fine irregularities, as exemplified by the manufacturing process of build-up substrates, the above-mentioned techniques alone are difficult to adequately address because geometric factors such as the thickness of the substrate and the distribution of irregularities, physical properties such as the density and hardness of the laminated molded product, and defects such as warpage and twisting of the laminated molded product vary from one lamination stage to another and from lot to lot. In particular, in recent high-performance manufacturing processes for build-up substrates, the irregularity patterns applied to the substrate tend to become finer, deeper, and more complexly distributed in three dimensions. As a result, the above-mentioned factors interact with each other in an overlapping and uncertain manner, resulting in problems such as increased quality variation in the laminated molded products. Therefore, from the perspective of improving the yield of laminated molded products, there is a strong demand for quality stabilization at each lamination stage and from lot to lot of laminated molded products.

[0008] The present disclosure has been made to solve such problems, and provides a method and system for suitably manufacturing a multilayered laminate molded product. [Means for solving the problem]

[0009] The method for manufacturing a laminated molded product according to the present disclosure includes a lamination step of pressurizing a substrate to which at least a portion of a laminate film has been temporarily bonded or laminated, and by repeating this lamination step multiple times, a laminated molded product is manufactured in which a predetermined number of layers of laminate film are laminated, and includes the following steps: In step (a), a plurality of pressure plates each having a different predetermined structural component are prepared in advance. The pressure plates may include a heater. In step (b), when the number of layers of the laminated film pre-laminated on the substrate is predetermined, one pressing plate is selected from a plurality of pressing plates depending on the state of the substrate to which at least a portion of the laminated film has been newly temporarily adhered or laminated. In step (c), a pressing portion is prepared by attaching a pressing plate to the main surface of each of the pair of disks having flat main surfaces. In step (d), the temperature of the pressing part is controlled so that the temperature of the pressing part is within a predetermined range. In step (e), a clamping part is pressed against the surface of the substrate to which at least a portion of the laminated film is temporarily adhered or laminated.

[0010] The manufacturing method for a laminated molded product according to the present disclosure includes a lamination step of pressurizing a substrate to which at least a portion of a laminate film is temporarily bonded or laminated, and repeating the lamination step multiple times to produce a laminated molded product having a predetermined number of laminate film layers. The manufacturing method includes a container, a selector, a disk, a pressure plate, and a temperature control device. The container contains multiple pressure plates each having a different structural component. The selector selects one of the multiple pressure plates depending on the state of the substrate to which at least a portion of the laminate film has been newly temporarily bonded or laminated, at a predetermined stage of the number of layers of the laminate film previously laminated on the substrate. The disk has one pressure plate replaceably installed on its flat main surface, thereby forming a pressing unit that presses the substrate to which at least a portion of the laminate film has been temporarily bonded or laminated. The temperature control device controls the temperature of the pressing unit so that the temperature of the pressing unit is within a predetermined range. [Effects of the Invention]

[0011] According to the present disclosure, a method and system for suitably manufacturing a multilayered laminate molded product can be provided. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a block diagram of a laminated molded product manufacturing system according to an embodiment. [Figure 2] 1 is a flowchart showing a method for manufacturing a laminated molded product performed by the laminated molded product manufacturing system. [Figure 3] FIG. 10 is a configuration diagram showing a specific example of a stacking process block. [Figure 4] FIG. 1 is a configuration diagram showing a specific example of a planarization device. [Figure 5] FIG. 2 is a configuration diagram showing a specific example of the configuration of a processing region in a planarization device. [Figure 6] FIG. 10 is a structural diagram showing a specific example of a clamping unit. [Figure 7] FIG. 1 is a structural diagram showing a specific example of a laminated molded product. [Figure 8] 10 is a table showing an example of a correspondence pattern between a pressing plate and a lamination process. [Figure 9] FIG. 1 is a diagram showing a specific example of a laminated molded product manufacturing system. [Figure 10] 10A and 10B are diagrams showing specific examples of a container and a selector. [Figure 11] FIG. 10 is a first diagram showing the operation of the presser plate supply block. [Figure 12] FIG. 10 is a second diagram showing the operation of the presser plate supply block. DETAILED DESCRIPTION OF THE INVENTION

[0013] The present invention will be described below through embodiments of the invention, but the invention according to the claims is not limited to the following embodiments. Furthermore, not all of the configurations described in the embodiments are necessarily essential means for solving the problems. For clarity of explanation, the following description and drawings have been omitted and simplified as appropriate. In each drawing, the same elements are assigned the same reference numerals, and duplicate explanations are omitted as necessary.

[0014] <Embodiment> Referring to FIG. 1, a schematic configuration of a laminated molded product manufacturing system according to an embodiment will be described. FIG. 1 is a block diagram of the laminated molded product manufacturing system 1 according to the embodiment. The laminated molded product manufacturing system 1 has a function for manufacturing a laminated molded product in which multiple laminate films are laminated. A laminated molded product is formed by laminating a predetermined number of laminate films on a predetermined substrate that has been previously processed to have fine irregularities. The laminated molded product manufacturing system 1 laminates a substrate to which at least a portion of the laminate film has been temporarily bonded, at a predetermined stage, of the laminated film that has already been laminated on the substrate, and gradually flattens the surface of the laminated substrate. The laminated molded product manufacturing system 1 mainly comprises a control device 10, a pressure plate supply block 20, and a lamination process block 30.

[0015] The control device 10 is a circuit including an arithmetic device such as a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), or an MCU (Micro Controller Unit), and appropriately controls the pressure plate supply block 20 and the stacking process block 30. The control device 10 is communicatively connected to, for example, drive units such as motors and sensors that the pressure plate supply block 20 and the stacking process block 30 each have.

[0016] The control device 10 also has a memory 11. The memory 11 includes a non-volatile memory such as a flash memory. This allows the control device 10 to execute the above-mentioned control by starting a predetermined program pre-stored in the memory 11. The memory 11 also stores press plate data related to the press plate 40, which will be described later. The press plate data is data that indicates the correspondence between multiple press plates 40 and the stacking state of the substrate. This allows the laminated molded product manufacturing system 1 to select a press plate 40 that corresponds to the stacking state of the substrate.

[0017] The presser plate supply block 20 supplies or replaces presser plates to the lamination process block 30. The presser plate supply block 20 is controlled by the control device 10. The presser plate supply block 20 has a container 21, a selector 22, and an exchange device 23 as its main components.

[0018] The container 21 accommodates a plurality of interchangeable presser plates 40. The presser plates 40 are components used in the laminating device 31 or flattening device 32 of the laminating process block 30. The presser plate 40 has a presser 40' on the surface that contacts the laminated film. The presser 40' may have a heater on the side facing the plate. The presser 40' may also have various structural configurations.

[0019] For example, in a process in which a laminating apparatus 31 laminates a substrate to which at least a portion of a laminate film is temporarily bonded under reduced pressure, the pressing body 40' presses the substrate so that the temporarily bonded laminate film accurately conforms to the unevenness of the substrate. That is, the pressing body 40' has a predetermined structural component corresponding to the state of the substrate before pressing, for example, to prevent air bubbles from remaining between the unevenness of the substrate and the laminate film, to prevent a portion of the molten laminate film from flowing out beyond the edge of the substrate, to prevent wrinkles from occurring in the laminate film on the surface of the substrate, or to prevent the positional relationship between the substrate and the laminate film from shifting from a predetermined position. In this case, the pressing body 40' includes, as a selection criterion, at least two components from a group of components consisting of multiple types of elastic bodies, multiple types of rigid bodies, multiple types of fibrous bodies, multiple types of particulate bodies, and voids as components that can form the structural component, and the pressing body 40' selects the components based on this criterion. The pressing body 40' can also have a predetermined pattern structure in which these components are appropriately combined two-dimensionally and three-dimensionally.

[0020] Furthermore, the pressing body 40', for example, the flattening device 32, gradually presses the surface of the substrate laminated with the laminated film to evenly flatten the surface of the substrate. That is, the pressing body 40' has a predetermined structural component corresponding to the state of the substrate before pressing, so that the surface of the substrate has a predetermined flatness and smoothness after pressing. In this case, the pressing body 40' includes, as a selection criterion, at least two components from a group of components consisting of multiple types of elastic bodies, multiple types of rigid bodies, multiple types of fibrous bodies, multiple types of particulate bodies, and voids as components that can form the structural component, and the components are selected based on this criterion. The pressing body 40' may also have a predetermined pattern structure in which these components are appropriately combined two-dimensionally and three-dimensionally.

[0021] The above-mentioned "plural types" may mean that the respective physical properties are different. In other words, the "plural types" may mean that the material has a different component composition as a physical property. The "plural types" may also mean that the material has a different component composition as a physical property other than the component composition, that is, at least one of the following physical properties is different: thickness, weight, elastic modulus, surface hardness, cross-sectional hardness, tensile strength, compressive strength, bulk density, cross-sectional area, cross-sectional shape, projected area, projected profile shape, surface roughness, flatness, parallelism, thermal conductivity, specific heat capacity, electrical conductivity, dielectric constant, magnetic susceptibility, water absorption, reflectivity, and gloss.

[0022] For example, even in the case of a stainless steel plate having a SUS304 composition, it may be interpreted as multiple types having different surface roughnesses, such as one with a surface roughness of Ra 0.4 and one with a surface roughness of Ra 1.6. Furthermore, the above-mentioned "two-dimensionally appropriately combined" may mean, for example, that in the structural component of the pressing body 40' used in the flattening device 32, a rigid body made of a stainless steel plate having a SUS304 composition, the surface roughness near the center may be Ra 0.4 and the area near the periphery may be Ra 1.6, and the area ratio between them may be, for example, 5:1, depending on the state of the conductor placed directly below the newly laminated laminate film.

[0023] Furthermore, "appropriately combined three-dimensionally" may mean, for example, adopting the following structure inside a stainless steel plate having the above-mentioned SUS304 composition. That is, near the center inside the stainless steel plate, concentric cavities are provided so as to be parallel to the surface of the substrate. Furthermore, radial cavities are provided so as to extend from near the center toward the periphery at an angle θ with respect to the surface of the substrate. In this case, the angle θ is set depending on the state of the conductor placed directly below the laminated film, for example, so that θ = 0 degrees in the region near the center and θ = 0.2 degrees in the region near the periphery.

[0024] The above two-dimensional combination (predetermined pattern structure) can be produced, for example, by polishing using abrasive grains of appropriate size, and the above three-dimensional combination can be produced, for example, by a laser sintering 3D printer.

[0025] The multiple presser plates 40 housed in the housing 21 each have a different predetermined structural component in the presser body 40' included in each presser plate 40. Here, the structural component refers to a component selected based on a selection criterion that includes at least two components from a group of components consisting of multiple types of elastic bodies, multiple types of rigid bodies, multiple types of fibrous bodies, multiple types of particulate bodies, and voids. The structural component may have a predetermined pattern structure in which these components are appropriately combined two-dimensionally and three-dimensionally. The type of component may also include at least one of the following: chemical composition, thickness, weight, elastic modulus, surface hardness, cross-sectional hardness, tensile strength, tensile yield strength, compressive strength, bulk density, cross-sectional area, cross-sectional shape, projected area, projected profile, surface roughness, flatness, parallelism, thermal conductivity, specific heat capacity, electrical conductivity, dielectric constant, magnetic susceptibility, water absorption, reflectivity, and glossiness.

[0026] That is, the presser bodies 40' included in the multiple presser plates 40 housed in the housing 21 may have different chemical composition of the material or different thicknesses, for example. Furthermore, the presser bodies 40' may have the same chemical composition of the material and thickness, but different hardness or elastic modulus. The multiple presser plates 40 are selected according to the state of the base material and installed in the lamination process block 30. The presser plates 40 are selected by the selector 22 and then removed by the selector 22. When the lamination process block 30 requires multiple presser plates 40 at one time in the manufacturing process of the laminated molded product, the housing 21 houses the corresponding multiple presser plates 40.

[0027] The selector 22 selects and removes at least one pressure plate 40 from the multiple pressure plates 40 housed in the housing 21. The selector 22 selects at least one pressure plate 40 from the multiple pressure plates according to the state of the substrate to which the laminate film has been newly temporarily bonded or laminated. The state of the substrate to which the laminate film has been newly temporarily bonded or laminated may be, for example, the number of layers of laminate film pre-laminated on the substrate. The state of the substrate to which the laminate film has been newly temporarily bonded or laminated may also be, for example, the material or thickness of the laminate film pre-laminated on the substrate. The state of the substrate to which the laminate film has been newly temporarily bonded or laminated may also be the state of processing applied to the substrate including the pre-laminated laminate film.

[0028] The processing previously performed on the substrate includes cutting and drilling performed on the laminate film on the substrate surface. The processing previously performed on the substrate also includes, for example, the state of chemicals applied to the laminate film and the state of metal foil (plating) attached. The processing previously performed on the substrate also includes, for example, heat treatment (curing treatment) in which the substrate is heated to a predetermined temperature. If the lamination process block 30 requires multiple press plates 40 at once in the manufacturing process of the laminated molded product, the selector 22 selects multiple press plates 40. The selector 22 transfers the removed press plates 40 to the exchange device 23.

[0029] The exchange device 23 exchanges a presser plate 40 selected from the presser plates 40 housed in the container 21 with the presser plate 40 attached to the stacking process block 30. When the exchange device 23 receives the replacement presser plate 40 removed by the selector 22, it exchanges the received presser plate 40 with the presser plate 40 already attached to the stacking process block 30. The exchange device 23 also hands over the presser plate 40 removed from the stacking process block 30 due to the exchange to the selector 22.

[0030] The lamination process block 30 laminates the laminated film onto the newly temporarily bonded substrate and flattens the surface of the laminated substrate. The lamination process block 30 is controlled by the control device 10. The lamination process block 30 mainly comprises a laminator 31, a flattener 32, and a temperature control device 33.

[0031] The laminating device 31 laminates the newly temporarily bonded laminated film to the substrate. The laminating device 31 contacts the surface of the substrate via a transport film and applies pressure to perform this pressure bonding (laminating) process. The laminating device 31 preferably performs the laminating process by moving a platen up and down to press the laminated film and release the pressure. Specifically, the laminating device 31 preferably uses a rotational drive using a servo motor or torque motor as power and moves the platen up and down via a ball screw. In this case, it is even more preferable that the laminating device 31 use a heat-resistant elastic material such as silicone rubber or fluororesin on the main surface facing the substrate among the components of the structural component of the pressing body 40'.

[0032] The laminating device 31 is not limited to the above-mentioned method, and may perform lamination by pressing the laminated film using a diaphragm made of a plastic and heat-resistant resin. Alternatively, the laminating device 31 may have a roller, for example, and perform lamination by rolling the roller on the surface of the laminated molded product. The laminating device 31 may also perform lamination by a method different from the above-mentioned method.

[0033] The laminating device 31 has a clamping unit 50. The clamping unit 50 includes a pressure plate 40. The pressure plate 40 may include a heater 51 in its structural components. The laminating device 31 also holds the pressure plate 40 in a replaceable manner. To facilitate replacement, the pressure plate 40 held in a replaceable manner in the laminating device 31 desirably has a bolt fastening portion in a position and orientation accessible by a robot arm or the like. Note that, as a means for making the pressure plate 40 replaceable, in addition to the bolt fastening means described above, the pressure plate 40 may also have a mechanical fastening means such as a one-touch chuck using a hydraulic cylinder or an air cylinder, or a fastening means based on the principle of suction force using an electromagnet or a suction device.

[0034] The flattening device 32 flattens the surface of the substrate that has been laminated by the laminating device 31. The flattening device 32 mainly comprises a pressing unit 50. The pressing unit 50 flattens the surface of the substrate by applying a predetermined amount of heat and pressure to the surface of the newly laminated laminate film.

[0035] The clamping unit 50 includes a pressure plate 40. The pressure plate 40 may include a heater 51 in its structural component. The heater 51 includes a member whose temperature is controlled by a temperature control device 33. This allows the pressure plate 40 to transfer heat and pressure to the surface of the substrate. The flattening device 32 preferably performs the flattening process by moving a platen up and down to press and release the laminated film. Specifically, the flattening device 32 preferably uses a rotational drive using a servo motor or torque motor as power and moves the platen up and down via a ball screw. In this case, it is more preferable that the structural component of the pressure plate 40' be a rigid body such as a stainless steel plate whose main surface facing the substrate has different surface roughness between the center and the periphery.

[0036] The flattening device 32 also holds the presser plate 40 in a replaceable manner. To facilitate replacement, the presser plate 40 held in a replaceable manner by the flattening device 32 preferably has a bolt fastening portion in a position and orientation that is accessible by a robot arm or the like. Note that, as a means for making the presser plate 40 replaceable, in addition to the bolt fastening means as described above, the presser plate 40 may also have a mechanical fastening means such as a one-touch chuck using a hydraulic cylinder or an air cylinder, or a fastening means based on the principle of suction force using an electromagnet or a suction device.

[0037] When a laminate film is multilayered on a substrate, the structural components of the pressing body 40' suitable for laminating or flattening vary depending on the material and number of layers of the laminate film previously laminated on the substrate, the thickness, flatness, and cumulative tolerances for smoothness of the laminate film previously laminated on the substrate, and the processing conditions previously applied to the substrate and laminate film. Therefore, the laminated molded product manufacturing system 1 appropriately replaces the pressing plate 40' depending on the structural components of the pressing body 40'. This allows the laminated molded product manufacturing system 1 to perform the laminating or flattening process appropriately.

[0038] The temperature control device 33 controls the temperature of the heater 51 of the flattening device 32. For example, the temperature control device 33 includes a thermistor and a heater, and controls the heater so that the heater 51 reaches a set temperature. In this way, the laminated molded product manufacturing system 1 controls the temperature of the clamping unit 50 so that the temperature of the clamping unit 50 when flattening the base material falls within a predetermined range. The temperature control device 33 is controlled by the control device 10.

[0039] 2 is a flowchart showing a method for manufacturing a laminated molded product performed by the laminated molded product manufacturing system. The method for manufacturing a laminated molded product according to the present disclosure includes a lamination step of pressurizing a base material to which at least a portion of a laminate film has been temporarily bonded or laminated, and is a manufacturing method for manufacturing a laminated molded product in which a predetermined number of laminate films are stacked by repeating the lamination step multiple times, and is implemented by a user of the laminated molded product manufacturing system 1 described above.

[0040] First, in step (a), the user prepares in advance a plurality of pressing plates 40 each having a different predetermined structural component (step S11).

[0041] The predetermined structural component in step (a) refers to a component selected by the pressing plate 40' based on a selection criterion of at least two components from a group of components consisting of multiple types of elastic bodies, multiple types of rigid bodies, multiple types of fibrous bodies, multiple types of particulate bodies, and voids. The structural component has a predetermined pattern structure in which these components are appropriately combined in two and three dimensions. The types of components include at least one of the following: chemical composition, thickness, weight, elastic modulus, surface hardness, cross-sectional hardness, tensile strength, tensile yield strength, compressive strength, bulk density, cross-sectional area, cross-sectional shape, projected area, projected profile, surface roughness, flatness, parallelism, thermal conductivity, specific heat capacity, electrical conductivity, dielectric constant, magnetic susceptibility, water absorption, reflectivity, and gloss. The user prepares an appropriate pressing plate 40 for each substrate lamination process, from the process of manufacturing a laminated molded product.

[0042] Next, in step (b), the laminated molded product manufacturing system 1 selects at least one press plate 40 from the plurality of press plates depending on the state of the substrate to which at least a portion of the laminated film has been newly temporarily bonded or laminated (step S12).

[0043] The state of the substrate in step (b) is, for example, the number of laminate films pre-laminated on the substrate. The state of the substrate in step (b) may also be, for example, the material or thickness of the laminate film pre-laminated on the substrate. The state of the substrate in step (b) may also be, for example, the state of processing applied to the substrate including the pre-laminated laminate film. Examples of processing applied to the substrate in advance include cutting or drilling applied to the laminate film on the substrate surface. Examples of processing applied to the substrate in advance include the state, cumulative thickness, and total area of chemicals applied to the laminate film or attached metal foil (plating). Examples of processing applied to the substrate in advance include heat treatment (curing treatment) in which the substrate is heated at a predetermined temperature.

[0044] Next, in step (c), the laminated molded product manufacturing system 1 prepares the clamping unit 50 by attaching the above-mentioned press plate 40 to the main surface of the plate body (step S13).

[0045] In step (c), the laminated molded product manufacturing system 1 may prepare the clamping section 50 by attaching a pressing plate 40 including a pressing body 40' in which at least two components are selected from a group consisting of multiple types of elastic bodies, multiple types of rigid bodies, multiple types of fibrous bodies, multiple types of particulate bodies, and voids, and these components are appropriately combined in two and three dimensions.

[0046] Next, in step (d), the laminated molded product manufacturing system 1 controls the temperature of the pressing unit 50 so that the temperature of the pressing unit 50 falls within a predetermined range (step S14).

[0047] Next, in step (e), the laminated molded product manufacturing system 1 presses the clamping unit 50 against the surface of the base material to which the laminated film has been newly temporarily adhered or laminated (step S15).

[0048] Next, in step (f), the laminated molded product manufacturing system 1 executes the lamination process from step (b) to step (e) each time a new laminate film is temporarily attached or laminated to the substrate. That is, the laminated molded product manufacturing system 1 determines whether the lamination process has ended in the laminated molded product manufacturing process (step S16). If it is determined that the lamination process has ended (step S16: YES), the laminated molded product manufacturing system 1 ends the process. On the other hand, if it is determined that the lamination process has not ended (step S16: NO), the laminated molded product manufacturing system 1 returns to step (b) (step S12) and repeats the lamination process from step (b) to step (e). Note that when repeating the lamination process, a predetermined process may be performed on the substrate or the laminated film laminated on the substrate before step (b). The process performed on the substrate or the laminated film includes, for example, cutting or drilling the laminated film on the surface of the substrate. The processing applied to the substrate or laminated film includes, for example, the application of a chemical agent to the laminated film on the surface of the substrate or the attachment of a metal foil (plating). The processing applied to the substrate or laminated film also includes, for example, a heat treatment (curing treatment) in which the substrate is heated to a predetermined temperature. If the lamination process block 30 requires multiple press plates 40 at once in the manufacturing process of the laminated molded product, the selector 22 selects multiple press plates 40.

[0049] Next, a specific example of the laminated molded product manufacturing system 1 will be described. Fig. 3 is a configuration diagram showing a specific example of the lamination process block 30. The lamination process block 30 shown in Fig. 3 shows an outline of the configuration as observed from the side.

[0050] For convenience of explaining the positional relationship of the components, a right-handed Cartesian coordinate system is used in Fig. 3. Furthermore, when a Cartesian coordinate system is used in Fig. 3 and subsequent figures, the X-axis, Y-axis, and Z-axis directions in Fig. 1 coincide with the X-axis, Y-axis, and Z-axis directions of these Cartesian coordinate systems, respectively.

[0051] The lamination process block 30 shown in Figure 3 mainly comprises a laminating device 31, a flattening device 32, and a temperature control device 33. The lamination process block 30 presses the substrate A1, performs lamination processing, and then further presses the surface of the substrate A1 in stages to perform staged flattening processing. The substrate A1 is sandwiched between a lower conveying sheet 36 that supports the lower part and an upper conveying sheet 35 that covers the upper part, and is conveyed from right to left in the figure. The substrate A1 input into the lamination process block 30 is conveyed to the laminating device 31 located on the right side in Figure 3.

[0052] The upper conveying sheet 35 and the lower conveying sheet 36 are formed by molding, for example, polyethylene terephthalate into strips. The upper conveying sheet 35 and the lower conveying sheet 36 are wound up at the left and right ends of the lamination process block 30 shown in Fig. 3, and are wound up or unwound synchronously in the left and right directions, so that the base material A1 can be conveyed while sandwiched between them.

[0053] Upon receiving the substrate A1, the laminating device 31 applies pressure in the vertical direction to laminate the temporarily bonded laminated film. The laminating device 31 has, for example, an upper laminating unit 311 and a lower laminating unit 312. The laminating device 31 sandwiches the substrate A1 between the upper laminating unit 311 and the lower laminating unit 312 and applies pressure to perform lamination. The laminating device 31 may sandwich the substrate A1 between the upper laminating unit 311 and the lower laminating unit 312 to form a chamber that can be depressurized. After the laminating process is completed, the substrate A1 is transported to the flattening device 32 by upper and lower transport sheets.

[0054] The flattening device 32 shown in FIG. 3 includes a first flattening device 32A and a second flattening device 32B. The first flattening device 32A receives the substrate A1 laminated by the laminating device 31 and flattens the substrate A1. The substrate A1 flattened by the first flattening device 32A is transported to the second flattening device 32B by an upper conveying sheet 35 and a lower conveying sheet 36. The second flattening device 32B receives the substrate A1 flattened by the first flattening device 32A and further flattens the substrate A1. This step-by-step flattening process improves productivity in the manufacturing process of laminated molded products. The substrate A1 flattened by the second flattening device 32B is transported out of the flattening device 32 by the upper conveying sheet 35 and the lower conveying sheet 36.

[0055] In this disclosure, the term "planarizing apparatus 32" includes both the first planarizing apparatus 32A and the second planarizing apparatus 32B. The planarizing apparatus 32 shown in Fig. 3 is provided with two planarizing apparatuses so that the planarizing process can be performed twice in stages to increase productivity, but the planarizing apparatus 32 may have one planarizing apparatus or three or more planarizing apparatuses.

[0056] The temperature control device 33 is connected to the laminating device 31 and has the function of controlling the temperature of a predetermined portion of the laminating device 31. The temperature control device 33 is also connected to the first flattening device 32A and the second flattening device 32B and controls the temperature of the heater 51 that each of these devices has. This allows the laminating device 31, the first flattening device 32A, and the second flattening device 32B to apply predetermined heat and pressure to the substrate A1. The temperature control device 33 can control the laminating device 31, the first flattening device 32A, and the second flattening device 32B to different temperatures.

[0057] Next, the flattening device 32 will be further described with reference to Fig. 4. Fig. 4 is a configuration diagram showing a specific example of the flattening device 32. The flattening device 32 mainly includes a base 321, a pressure device 322, a fixed platen 323, a movable platen 324, a guide hole 325, and a guide shaft 326.

[0058] The base 321 supports a guide shaft 326 along which the pressure device 322 slides at the bottom of the planarizing device 32. That is, the pressure device 322 is supported by the base 321 so as to be vertically movable. The pressure device 322 has a predetermined drive unit and engages with the bottom of the movable platen 324 to move the movable platen 324 up and down. There are no particular limitations on the means for moving the movable platen 324 up and down, but in order to accurately laminate and uniformly planarize the substrate, it is desirable to move the movable platen 324 up and down via a ball screw using a rotational drive powered by a servo motor or torque motor. The means for moving the movable platen 324 up and down is not limited to the above, and a hydraulic cylinder or an air cylinder may also be used.

[0059] Fixed platen 323 is fixed to the upper end of guide shaft 326 supported by base 321, and holds pressure plate 40 at its lower surface. Movable platen 324 has guide hole 325 through which guide shaft 326 is inserted, and is supported by guide shaft 326 so as to be movable in the vertical direction. Furthermore, movable platen 324 is engaged with pressure device 322 at its lower surface. As a result, movable platen 324 moves up and down under the control of pressure device 322. Furthermore, movable platen 324 holds pressure plate 40 on its upper surface.

[0060] Guide shaft 326 is a shaft extending upward from base 321, supports fixed platen 323 at its upper end, and supports movable platen 324 between base 321 and fixed platen 323 so that the movable platen 324 can move up and down. Guide shaft 326 may include, for example, a ball spline shaft, which may guide movable platen 324 up and down. Guide shaft 326 may also be called a tie bar.

[0061] In the above-described configuration, the flattening device 32 receives the substrate A1 conveyed by the upper conveying sheet 35 and the lower conveying sheet 36 with the movable platen 324 positioned downward. Then, with the substrate A1 stopped at a predetermined position, the flattening device 32 drives the pressure device 322 to push the movable platen 324 upward. As a result, the flattening device 32 brings the pressing plate 40 of the fixed platen 323 into contact with the upper surface of the substrate A1, and also brings the pressing plate 40 of the movable platen 324 into contact with the lower surface of the substrate A1. The flattening device 32 then clamps the upper and lower surfaces of the substrate A1 with the clamping unit 50.

[0062] The flattening device 32 will be further described with reference to Fig. 5. Fig. 5 is a configuration diagram showing a specific example of the configuration of the processing area in the flattening device. The flattening device 32 shown in Fig. 5 shows the area where the base material A1 is clamped.

[0063] The pressing plate 40 includes a heat insulating portion 52, a heating element 51, and a pressing element 40'. The heat insulating portion 52 is a member provided to suppress heat transfer between the heating element 51 and the fixed platen 323 or between the heating element 51 and the movable platen 324. The heating element 51 is, for example, a rectangular parallelepiped member and is fixed to each of the fixed platen 323 and the movable platen 324. The heating element 51 also has multiple cartridge heaters 330. The output of the cartridge heaters 330 is controlled by the temperature control device 33 based on temperature information measured by a temperature measuring means. The temperature measuring means may be a means for measuring by bringing a thermocouple into contact with the measurement object, or a means for measuring using a radiation thermometer without contacting the measurement object. The temperature measuring means may also be other means. The heating element 51 preferably has relatively high rigidity and a relatively high heat storage capacity. This allows the pressing part 50 to effectively press the substrate A1.

[0064] The heating element 51 replaceably holds the pressing element 40' on the main surface closer to the substrate A1. The heating element 51 may have a rubber heater or a plate heater instead of the cartridge heater 330. Alternatively, the heating element 51 may have a flow path for circulating a heat medium such as steam or oil instead of the cartridge heater 330. The heating element 51 may have a detachable current-cartridge heater 330. Similarly, when the heating element 51 has a rubber heater or a plate heater instead of the cartridge heater 330, the current-cartridge heater 330 may have a detachable current-cartridge heater. When the heating element 51 has a flow path for circulating a heat medium such as steam or oil instead of the cartridge heater 330, the heat medium supply port and recovery port may be detachable from the heat medium supply source and recovery source using, for example, joints with valves.

[0065] The pressing body 40' is replaceably attached to the main surface of the heating body 51. The heating body 51 and the pressing body 40' may be fixed at their ends by a clamper, for example. The heating body 51 and the pressing body 40' may be fastened at their ends by a bolt, for example.

[0066] Fig. 6 is a structural diagram showing a specific example of the pressing plate 40. Fig. 6 shows a cross section of the pressing plate 40 provided on the movable platen 324. The pressing plate 40 mainly comprises, in order from the side that contacts the movable platen 324, a heat insulating part 52, a heating element 51, and a pressing element 40'.

[0067] 6 shows the pressure plate 40 provided on the movable platen 324, but the pressure plate 40 provided on the fixed platen 323 has the same configuration. The pressure plate 40 provided on the fixed platen 323 may be referred to as the upper pressure plate, and the pressure plate 40 provided on the movable platen 324 may be referred to as the lower pressure plate. Similarly, the pressure body 40' included in the upper pressure plate may be referred to as the upper pressure body, and the pressure body 40' included in the lower pressure plate may be referred to as the lower pressure body.

[0068] In the above-described configuration, the heat insulating section 52 is interposed between the heating body 51 and the movable platen 324 to suppress heat exchange between the heating body 51 and the movable platen 324. This allows the flattening device 32 to efficiently heat the heating body 51. The heat insulating section 52 can be made of, for example, a resin, metal, ceramic, or fiber material having a relatively low thermal conductivity.

[0069] The heater 51 is a rectangular parallelepiped metal member and may be made of metal such as iron, aluminum, or brass. This provides the heater 51 with sufficient rigidity to prevent distortion when the substrate A1 is pressed during lamination or planarization. The heater 51 also has sufficient heat capacity to apply a predetermined amount of heat to the surface of the substrate A1 during lamination or planarization. The heater 51 is controlled by the temperature control device 33 to maintain a temperature between approximately 80°C and 200°C.

[0070] The pressing body 40' has at least a contact layer 42 as a structural component that comes into contact with the substrate A1, which is the target of lamination or planarization, or with the conveying sheet that conveys the substrate A1. In the laminating device 31, the contact layer 42 is an elastic body such as a heat-resistant resin, and in the planarizing device 32, the contact layer 42 is a rigid body such as a metal or ceramic, or an elastic body such as a heat-resistant resin. The pressing body 40' may also have, as a structural component, a buffer layer 41 between the contact layer 42 and the heater 51 that disperses pressure when it comes into contact with the substrate A1. The buffer layer 41 is an elastic body such as a heat-resistant resin. In addition, the buffer layer 41 and the contact layer 42 may have a predetermined pattern structure in which at least two components are selected from a group of components consisting of multiple types of elastic bodies, multiple types of rigid bodies, multiple types of fibrous bodies, multiple types of particulate bodies, and voids as a selection criterion, and the components are appropriately combined in two and three dimensions based on this criterion.

[0071] The buffer layer 41 effectively distributes the pressure exerted on the contact layer 42 during the lamination and planarization processes. The buffer layer 41 may be made of, for example, resin, rubber, paper, fiber-reinforced material, or nonwoven fabric. The buffer layer 41 has a thickness of, for example, approximately 100 micrometers to 5 millimeters. In the lamination process, the contact layer 42 is a resin plate, such as a silicone resin or fluororesin, having a thickness of approximately 100 micrometers to 5 millimeters. In the planarization process, the contact layer 42 is a metal plate, such as a stainless steel plate having a thickness of approximately 100 micrometers to 5 millimeters. Even when a rigid body such as a metal plate is used for the contact layer 42, it is preferable that the rigidity be such that it can be slightly elastically deformed under the load applied during the pressing process.

[0072] The distinction between an elastic body and a rigid body may be based on, for example, the modulus of elasticity. 2 ) may be used as a standard for distinction, with materials with a modulus of elasticity less than this being considered elastic and materials with a modulus of elasticity greater than this being considered rigid. The degree of rigidity may also be expressed by the degree of modulus of elasticity. Furthermore, it is preferable that the contact layer 42 has a small surface roughness. Therefore, when using a metal or ceramic for the contact layer 42, it is preferable that it is polished to a mirror finish. Furthermore, the surface of the contact layer 42 may be coated with a ceramic coating such as titanium nitride (TiN), plating of chromium or nickel, or a lubricating coating such as diamond-like carbon (DLC).

[0073] The above has described the configuration of the clamping unit 50 of the laminating device 31 and the flattening device 32. In the case of the laminating device 31, the laminating device 31 has a vacuum chamber for performing the laminating process, and the clamping unit 50 is located within this vacuum chamber.

[0074] Next, the substrate A1 will be described with reference to FIG. 7. FIG. 7 is a structural diagram showing a specific example of the substrate. The substrate A1 shown in FIG. 7 is called a build-up substrate or a multilayer substrate. A build-up substrate or a multilayer substrate is one embodiment of a laminated molded product. The substrate A1 has laminate films A11 to A23 laminated on both sides of a substrate A10, and each layer is appropriately perforated and further has a conductive foil added. For the substrate A10, for example, an epoxy-based thermosetting resin, a composite material of an epoxy-based resin and glass fiber, or a resin such as polyethylene terephthalate is used. For the laminated film, for example, a resin such as polyethylene terephthalate or polyimide is used.

[0075] In the above-described configuration, the base material A1 is first formed as the base material A10, and then the formed base material A10 is subjected to a first lamination step, a second lamination step, and a third lamination step. An overview of these steps will be described below.

[0076] First, the sheet-like base material A10 is subjected to processes such as drilling, then copper plating, and then etching to form a wiring pattern, thereby forming, for example, via holes A30, and completing the processing of the base material A10.

[0077] Next, in a first lamination step, laminate films A11 and A21 are laminated onto the base material A10. Here, the base material A10 to which laminate films A11 and A21 are temporarily bonded is fed into a laminated molded product manufacturing system 1. In the laminated molded product manufacturing system 1, a laminating device 31 performs a laminating process on the base material A1 to which laminate films A11 and A21 are temporarily bonded, and a flattening device 32 flattens the surfaces of the laminated laminate films A11 and A21. The base material A1 removed from the laminated molded product manufacturing system 1 is then copper plated and etched to form a pattern A31, via holes A32, etc.

[0078] Next, in the second lamination step, the laminate film A12 and the laminate film A22 are temporarily attached, laminated, and flattened to the base material A1 in the same manner as in the first lamination step. Furthermore, the laminate film A12 and the laminate film A22 of the base material A1 are copper-plated and etched.

[0079] Furthermore, in the third lamination step, similar to the first and second lamination steps, the laminate film A13 and the laminate film A23 are temporarily adhered to the base material A1, laminated and flattened, and a copper foil pattern is formed by plating or the like.

[0080] The above has described the configuration of the base material A1 and an outline of the lamination process. The base material A1 shown here has three layers of laminated film laminated on each side of the base material A10. Each laminated film of the base material A1 has an individual copper foil pattern and via holes. Therefore, when performing lamination processing or flattening processing, it is preferable that the structural component of the pressing plate 40 be individually set for each lamination process.

[0081] Next, the relationship between the lamination process and the pressure plate 40 will be described with reference to Fig. 8. Fig. 8 is a table showing an example of a correspondence pattern between the pressure plate and the lamination process. The table shown in Fig. 8 shows the configuration of the pressure plate attached to each of the first flattening device 32A and the second flattening device 32B for each lamination process.

[0082] The upper pressure plate attached to the fixed platen 323 of the first flattening device 32A has configuration No. 1-11 in the first stacking process. The lower pressure plate attached to the movable platen 324 of the first flattening device 32A has configuration No. 1-12 in the first stacking process. Similarly, the upper pressure plate of the second flattening device 32B has configuration No. 1-13 in the first stacking process. The lower pressure plate of the second flattening device 32B has configuration No. 1-14 in the first stacking process.

[0083] Similarly, in the second lamination step, the upper pressure plate of the first flattening device 32A has the configuration No. 2-11, and the lower pressure plate has the configuration No. 2-12. The upper pressure plate of the second flattening device 32B has the configuration No. 2-13, and the lower pressure plate has the configuration No. 2-14.

[0084] In the third lamination step, the upper pressure plate of the first flattening device 32A has the configuration No. 3-11, and the lower pressure plate has the configuration No. 3-12. The upper pressure plate of the second flattening device 32B has the configuration No. 3-13, and the lower pressure plate has the configuration No. 3-14.

[0085] As described above, the structural configuration of the press plate 40 can be individually set depending on the lamination process for each layer. The structural configuration of the press plate 40 can also be set depending on the pressing order and arrangement in the flattening device 32. Furthermore, the structural configuration of the press plate 40 is set depending on the state of the substrate on which the laminate film is laminated on the pressing surface. Here, the state of the substrate on which the laminate film is laminated refers to, for example, the number of layers of laminate film pre-laminated on the substrate. The state of the substrate on which the laminate film is laminated may also refer to, for example, the material and thickness of the laminate film pre-laminated on the substrate. The state of the substrate on which the laminate film is laminated may also refer to, for example, the state of processing applied to the substrate including the pre-laminated laminate film. The processing previously applied to the substrate includes cutting and drilling applied to the laminate film on the substrate surface. The processing previously applied to the substrate also includes, for example, the state, cumulative thickness, and total area of the chemicals applied to the laminate film or the attached metal foil (plating) applied. The processing previously performed on the substrate includes, for example, a heat treatment (curing treatment) for heating the substrate at a predetermined temperature. When manufacturing a laminated molded product, a user of the laminated molded product manufacturing system 1 takes into consideration the lamination process in advance and determines the structural configuration of the pressing plate 40 corresponding to each process and the installation position shown in Figure 8.

[0086] In determining the above-described configuration, the user refers to the components of the buffer layer 41 and the contact layer 42. The components of the buffer layer 41 and the contact layer 42 refer to those selected based on a selection criterion that includes at least two components from a group of components consisting of multiple types of elastic bodies, multiple types of rigid bodies, multiple types of fibrous bodies, multiple types of particulate bodies, and voids. These components may also have a predetermined pattern structure appropriately combined in two and three dimensions. The "multiple types" mentioned above may refer to differences in at least one of the physical properties represented by the material's composition, thickness, weight, elastic modulus, surface hardness, cross-sectional hardness, tensile strength, tensile yield strength, compressive strength, bulk density, cross-sectional area, cross-sectional shape, projected area, projected profile shape, surface roughness, flatness, parallelism, thermal conductivity, specific heat capacity, electrical conductivity, dielectric constant, magnetic susceptibility, water absorption, reflectivity, and gloss. The combination of structural components is not limited to those described above. In consideration of these structural configurations, the user determines the most suitable configuration for each process from among various combinations.

[0087] 8, the user sets the prepared presser plates 40 in the containers 21 of the presser plate supply block 20. Furthermore, the user stores the information shown in FIG. 8 in the memory 11 of the laminated molded product manufacturing system 1. This allows the laminated molded product manufacturing system 1 to attach the presser plates 40 for each lamination process to the flattening device 32.

[0088] 8 may be the same. That is, for example, configuration No. 2-11 set on the upper pressure plate of the first flattening device 32A in the second stacking step may be the same as configuration No. 3-11 set on the upper pressure plate of the first flattening device 32A in the third stacking step. Alternatively, configurations No. 2-11 and No. 2-12 set on the first flattening device 32A in the second stacking step may be the same as configurations No. 2-13 and No. 2-14 set on the second flattening device 32B in the second stacking step. Therefore, the container 21 may store multiple pressure plates 40 of the same type.

[0089] Next, a specific configuration of the presser plate supply block 20 will be described with reference to Fig. 9. Fig. 9 is a diagram showing a specific example of a laminated molded product manufacturing system. The presser plate supply block 20 shown in Fig. 9 is installed beside the lamination process block 30, and replaces the presser plate 40 for the flattening device 32.

[0090] The exchange device 23 exchanges a selected pressure plate 40 from the plurality of pressure plates 40 housed in the housing 21 with the pressure plate 40 attached to the clamping unit 50. The exchange device 23 of the pressure plate supply block 20 mainly comprises a conveying unit 230, a mounting unit 231, a rotating shaft 232, and a rail unit 233.

[0091] The transport unit 230 supports the mounting unit 231 and is supported so as to be horizontally movable on the rail unit 233. This allows the transport unit 230 to move the mounting unit 231 along the rail unit 233.

[0092] The mounting unit 231 is supported by the transport unit 230, and is configured to be able to move linearly in the Y direction in FIG. 9 on the transport unit 230 and to be able to rotate around the Z axis centered on the rotation axis 232. The mounting unit 231 is also able to deliver the pressure plate 40 to and from the selector 22, and mounts the pressure plate 40 received from the selector 22 so that it can be transported. The mounting unit 231 attaches the transported pressure plate 40 to the clamping unit 50 of the flattening device 32. The mounting unit 231 also removes the pressure plate 40 attached to the clamping unit 50.

[0093] The rail section 233 supports the conveying section 230 so that it can move along a set rail. The rail section 233 shown in Fig. 9 has a rail extending parallel to the upper conveying sheet 35 of the stacking process block 30, and is set so that the conveying section 230 can move back and forth between the selector 22 and the flattening device 32.

[0094] The pressure plate supply block 20 will be further described with reference to Fig. 10. Fig. 10 is a diagram showing a specific example of the container 21 and the selector 22.

[0095] The housing body 21 accommodates a plurality of replaceable pressure plates 40. The housing body 21 shown in FIG. 10 is configured so that a plurality of pressure plates 40 can be stacked in the vertical direction. The pressure plates 40 accommodated in the housing body 21 are accommodated according to the information described with reference to FIG. 8. The pressure plates 40 accommodated in the housing body 21 are removed by the selector 22. The pressure plates 40 removed by the selector 22 are accommodated by the selector 22.

[0096] The selector 22 selects and removes one pressure plate 40 from the multiple pressure plates 40 stored in the storage body 21. The selector 22 hands over the pressure plate 40 removed from the storage body 21 to the exchange device 23. The selector 22 also stores the pressure plate 40 received from the exchange device 23 in a predetermined location in the storage body 21. To achieve the above-mentioned functions, the selector 22 is configured so that the tray portion on which the pressure plate 40 is mounted can move up and down. Furthermore, the selector 22 has a mechanism for transferring the pressure plate 40.

[0097] Next, the operation of the presser plate supply block 20 will be described with reference to Figures 11 and 12. Figure 11 is a first diagram showing the operation of the presser plate supply block 20. The operation of the presser plate supply block 20 shown here is an operation performed when the laminating device and flattening device 32 in the stacking process block 30 are not performing the laminating process and flattening process. As an example, the operation of replacing the presser plate 40A possessed by the first flattening device 32A with the presser plate 40S possessed by the container 21 will be described along the flow of time T.

[0098] First, at time T1, the selector 22 selects and removes a predetermined press plate 40S from the container 21. The selector 22 then hands over the removed press plate 40S to the replacement device 23. At this time, the control device 10 of the laminated molded product manufacturing system 1 refers to the memory 11 and selects a new press plate 40 to be attached to the first flattening device 32A. Once the replacement press plate 40S is loaded onto the replacement device 23, the replacement device 23 begins to move along the rail portion 233.

[0099] Next, at time T2 after time T1, the exchange device 23, which has moved on the rail portion 233 with the pressing plate 40S loaded thereon, stops near the first flattening device 32A. Furthermore, the loading portion 231 approaches the pressing plate 40A to remove it.

[0100] Next, at time T3 after time T2, the mounting unit 231 removes the pressing plate 40A, and then moves a predetermined distance in a direction away from the first flattening device 32A while mounting the removed pressing plate 40A.

[0101] Next, at time T4 after time T3, the mounting portion 231 of the exchange device 23 rotates 180 degrees about the rotation shaft 232 in order to exchange the pressing plate 40A for the pressing plate 40S.

[0102] The operation of the presser plate supply block 20 will be described below with reference to Fig. 12. At time T5 after time T4, the mounting section 231 brings the presser plate 40S for replacement closer to the first flattening device 32A.

[0103] Next, at time T6 after time T5, the exchanging device 23 attaches the pressing plate 40S to the clamping unit 50. After the pressing plate 40S is attached to the clamping unit 50, the mounting unit 231 then starts to move in a direction away from the first flattening device 32A.

[0104] Next, at time T7 after time T6, the exchange device 23 with the removed pressing plate 40A mounted thereon moves along the rail portion 233 toward the selector 22.

[0105] Next, at time T8 after time T7, the exchange device 23 hands over the pressing plate 40A to the selector 22. Then, the selector 22 receives the pressing plate 40A from the exchange device 23 and stores it in the storage body 21.

[0106] The operation of the presser plate supply block 20 has been described above. With the above-described configuration, the laminated molded product manufacturing system 1 can replace the presser plate 40 as needed depending on the lamination process for each layer of the base material. The above-described configuration and operation are merely examples of the presser plate supply block 20, and the configuration and operation of the presser plate supply block 20 are not limited thereto. For example, the container 21 may move up and down instead of the selector 22. The mechanism of the presser plate supply block 20 may use, for example, an articulated robot instead of the above-described configuration. For example, the exchange device 23 may transport the mounting unit 231 using a robot arm instead of the rail unit 233 and the transport unit 230. In the laminated molded product manufacturing system 1, the laminating device 31 in the lamination process block 30 may be separate from the laminated molded product manufacturing system 1.

[0107] The exchange device 23 may include a preheating device that preheats the selected presser plate 40 before attaching it to the clamping unit 50. The container 21 may have a heat-retaining device that controls the presser plate 40 to a predetermined temperature and keeps it warm. In particular, when the presser plate 40 includes a heater 51 with a large heat capacity or a heat insulating unit 52, it is desirable to preheat it to a predetermined temperature in order to increase productivity.

[0108] At least some of the functions of the selector 22 and the exchange device 23 may be performed by the user of the laminated molded product manufacturing system 1. In other words, instead of being fully automatically controlled, the press plate supply block 20 may be partially manually operated.

[0109] In addition, in the present embodiment, the pressure plate 40 has been described as including the buffer layer 41 and the contact layer 42, but it may be any one of these that is housed in the housing 21 and replaced by the exchange device 23. Alternatively, the pressure plate 40 that is housed in the housing 21 and replaced by the exchange device 23 may include the heating element 51 and the heat insulating part 52.

[0110] As described above, according to the embodiments, the present disclosure can provide a method and system for suitably manufacturing a multilayered laminate molded product. The above-described laminate molded product is called a buildup substrate or a multilayer substrate. Therefore, the technology of the present disclosure may also be referred to as a buildup substrate manufacturing method and a buildup substrate manufacturing system, or a multilayer substrate manufacturing method and a multilayer substrate manufacturing system.

[0111] The present invention is not limited to the above-described embodiment, and can be modified as appropriate within the scope of the invention. [Explanation of symbols]

[0112] 1. Laminated molding manufacturing system 10 Control device 11. Memory 20 Pressure plate supply block 21 Containment Unit 22 Selectors 23 Exchange device 30 Lamination Process Block 31 Laminating equipment 32 Flattening device 33 Temperature control device 35 Upper transport sheet 36 Lower transport sheet 40 Pressure plate 40' pressing body 41 Buffer layer 42 Contact layer 50 Clamping part 51 Heating body 52 Insulation section 230 Conveyor 231 Mounting section 232 Rotational Axis 233 Rail section 321 Foundation 322 Pressure Device 323 Fixed plate body 324 Movable plate body 325 Guide hole 326 Guide shaft 330 Cartridge Heater A1 Laminated molding

Claims

1. A method for producing a laminated molded product, comprising a lamination step of pressing a substrate to which at least a portion of a laminate film has been temporarily adhered or laminated by a pressing unit including a pressing body that contacts the substrate and a heating body that applies heat to the substrate, and repeating the lamination step multiple times to produce a laminated molded product in which a predetermined number of laminate films are laminated, (a) a step of accommodating a plurality of pressing bodies, each of which has at least one structural component different from the other, in a housing; (b) removing a first pressing body selected from the plurality of pressing bodies according to the state of the first substrate from the container; (c) attaching the first pressing body to the heating body to form the clamping portion; (d) controlling the temperature of the heater so that the temperature of the clamping portion is within a predetermined range; (e) pressing the clamping portion against the surface of the first base material; (f) removing a second pressing body selected from the plurality of pressing bodies according to the state of the second base material from the housing body, and replacing the first pressing body with the second pressing body. Manufacturing method for laminated molded products.

2. The structural body is formed by combining at least two of a set of components consisting of a plurality of different types of elastic bodies, a plurality of different types of rigid bodies, a plurality of different types of fibrous bodies, a plurality of different types of particulate bodies, and voids, and the step (b) includes using the combination of the components as a selection criterion for pressing the substrate so that the temporarily bonded laminated film conforms to the unevenness of the substrate. A method for producing the laminate molded product according to claim 1.

3. The structural body is formed by combining at least two of a set of components consisting of a plurality of different types of elastic bodies, a plurality of different types of rigid bodies, a plurality of different types of fibrous bodies, a plurality of different types of particulate bodies, and voids, and the step (b) includes using the combination of the components as a selection criterion for pressing the substrate so that the surface of the substrate laminated with the laminated film has a predetermined flatness. A method for producing the laminate molded product according to claim 1.

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