Two-stage cooling module and photonic beauty device

Abstract

The present invention relates to a two-stage cooling module and a photonic beauty device. The two-stage cooling module includes a primary semiconductor cooling member, a secondary semiconductor cooling member, and a cooling conduction member. The primary semiconductor cooling member and the secondary semiconductor cooling member each include an electric double layer in the middle, and a high-temperature surface and a low-temperature surface at both ends. The cooling conduction member is connected between the primary semiconductor cooling member and the secondary semiconductor cooling member to rapidly conduct cooling. The cooling conduction member is a heat transfer structure member. The photonic beauty device uses the two-stage cooling module. The primary semiconductor cooling member is used as the front end working surface of the photonic beauty device as it is, or is used to cool the front end working surface of the photonic beauty device. The two-stage cooling module can solve the problem that the primary semiconductor cooling member has uneven heat transfer efficiency, slow heat transfer, and reduced aging of heat transfer when heat is dissipated by the heat transfer structure member, which causes the cooling speed to slow down, and the problem that the heat is conducted to the heat dissipation member and causes heat variations at the front and rear ends, left and right ends, or upper and lower ends of the heat dissipation member, and the problem that the heat dissipation effect of the fan is affected.

Description

[Technical Field]

[0001] The present invention relates to the field of beauty devices, and in particular to a two-stage cooling module and a photonic beauty device. [Background technology]

[0002] Photonic beauty devices that use pulsed light, lasers, halogen lamps, other light sources, or radio frequencies to achieve beauty functions generate light waves in a light source module and emit them from a light output window in the working head of the device to perform beauty treatments on the skin surface that is in direct contact with (or not in direct contact with) the end face of the working head, such as hair removal, skin rejuvenation, blemish removal, anti-inflammation, vascular softening, wrinkle removal, skin redness removal, acne treatment, vascular lesion treatment, pigmented lesion treatment, or single or combined high-frequency physical therapy. Currently, some portable beauty devices on the market have insufficient internal heat dissipation, which affects the function of the beauty device and prevents the desired beauty effect from being achieved. In addition, their internal structure is complex, which does not provide significant cooling to the working surface, or the working surface is too hot, causing skin burns and a poor user experience. Summary of the Invention [Problem to be solved by the invention]

[0003] The technical problem that the present invention aims to solve is to provide a two-stage cooling module and a photonic beauty device, thereby solving the heat dissipation and working surface cooling problems of conventional beauty devices. [Means for solving the problem]

[0004] In order to solve the above technical problems, the technical solutions provided by the present invention are as follows: The two-stage cooling module includes a primary semiconductor cooling element, a secondary semiconductor cooling element, and a cooling conduction element. The primary semiconductor cooling element and the secondary semiconductor cooling element each include an electric double layer in the middle and hot and cold surfaces at both ends. The cooling conduction element is connected between the primary semiconductor cooling element and the secondary semiconductor cooling element for rapid cooling conduction. The cooling conduction element is a heat transfer structural element.

[0005] Furthermore, both ends of the cooling conductive member are connected to the high temperature surface of the primary semiconductor cooling member and the low temperature surface of the secondary semiconductor cooling member, respectively, for rapid heat transfer. The heat transfer structural member is one or a combination of a heat transfer member made of a thermally conductive material, a heat pipe, a vapor chamber, a superheat conduction pipe, and a superheat conduction plate.

[0006] In some embodiments, the superheat conducting tube is an aluminum superconducting tube. The superheat conducting plate is an aluminum superconducting plate. Both ends of the aluminum superconducting plate or aluminum superconducting tube are sealed, and a working liquid is sealed inside. When the aluminum material is formed, two or more microgrooves are formed on the inner wall of the aluminum superconducting plate or aluminum superconducting tube. When the aluminum material is formed, a microporous structure is formed within the aluminum superconducting plate or aluminum superconducting tube material.

[0007] In some embodiments, the cooling module includes a heat conduction structure and a heat dissipation plate. The heat conduction structure is one or a combination of a heat conduction member made of a heat conduction material, a heat pipe, a vapor chamber, a superheat conduction tube, and a superheat conduction plate. The heat conduction structure is connected to the heat dissipation plate for rapid heat transfer. The heat conduction structure is connected to the high-temperature surface of the secondary semiconductor cooling member for rapid heat transfer, or the high-temperature end circuit of the secondary semiconductor cooling member is installed in the heat conduction structure and welded or electrically connected to the electric double layer of the secondary semiconductor cooling member, thereby making the heat conduction structure the high-temperature surface of the secondary semiconductor cooling member, thereby rapidly dissipating heat from the high-temperature surface of the secondary semiconductor cooling member. The cooling module further includes a fan. The fan includes a housing and an impeller within the housing. The heat conduction structure and / or the heat dissipation plate may be installed in the fan's air vent or formed as part of the fan housing.

[0008] In some embodiments, the heat conduction structure includes a plurality of aluminum superconducting plates or aluminum superconducting tubes. The aluminum superconducting plates or aluminum superconducting tubes are single tubes with a single passage formed therein. The aluminum superconducting plates or aluminum superconducting tubes are flat-bent or specially shaped 3D-bent to accommodate the installation space. The heat conduction structure further includes a heat conduction plate. The plurality of aluminum superconducting plates or aluminum superconducting tubes are fitted into the heat conduction plate. The plurality of aluminum superconducting plates or aluminum superconducting tubes are arranged to include at least two different directions or angles, thereby reducing the disadvantage of reduced heat conduction efficiency due to the anti-gravity effect. The heat dissipation plate includes one or more sets of heat conduction material fins. The heat conduction plate is installed in a groove of the heat dissipation plate or on top of the heat dissipation plate, or the heat dissipation plate and the heat conduction plate are installed on another heat conduction member.

[0009] In some embodiments, the heat conduction plate has a plurality of opening grooves. The plurality of aluminum superconducting plates or aluminum superconducting tubes are fitted into the opening grooves and correspondingly mounted within the opening grooves, with their wall surfaces contacting each other to accelerate heat transfer. The aluminum superconducting plates or aluminum superconducting tubes are welded or crimped to the opening grooves to increase the contact area. The secondary semiconductor cooling element is mounted on the heat conduction plate. The high-temperature surface of the secondary semiconductor cooling element is attached by bonding to the outer wall of the heat conduction plate to directly conduct heat from the high-temperature surface to the heat conduction plate, or the high-temperature surface of the secondary semiconductor cooling element is attached to the outer wall of the heat conduction plate by a heat conduction member, which rapidly conducts heat from the high-temperature surface to the heat conduction plate, or the heat conduction plate functions as the high-temperature surface, and a high-temperature end circuit of the secondary semiconductor cooling element is mounted on the heat conduction plate and welded and electrically connected to the PN galvanic particles of the electric double layer. The plurality of aluminum superconducting plates or aluminum superconducting tubes are designed in two different directions or angles in the XY plane, or in a form of intersection at a fixed angle, or in a circular, staggered, or circulating manner.

[0010] In some embodiments, the secondary semiconductor cooling member dissipates heat through a heat dissipation fan module. The heat dissipation fan module includes a fan housing and an impeller. The interior of the fan housing is a cavity. The impeller is mounted within the cavity. The fan housing has multiple vents. The cavity communicates with a gas path outside the fan through the vents. At least a portion of the fan housing comprises a thermally conductive outer housing. The thermally conductive outer housing is formed as a whole or by butt-joining multiple components selected from the group consisting of a thermally conductive member, a heat pipe, a vapor chamber, a superheat conductive tube, and a superheat conductive plate, all made of a thermally conductive material. The high-temperature surface of the secondary semiconductor cooling member is connected to the thermally conductive outer housing for heat transfer, or the thermally conductive outer housing itself serves as the high-temperature surface of the secondary semiconductor cooling member.

[0011] In some embodiments, the superheat conducting tube is an aluminum superconducting tube. The superheat conducting plate is an aluminum superconducting plate. The heat dissipation fan module includes a heat dissipation plate. The heat dissipation plate is connected to the heat conducting outer housing for rapid heat transfer. The air passage of the heat dissipation plate is connected to the fan vent and the cavity. A side housing of the fan housing includes the heat conducting outer housing.

[0012] In some embodiments, the side housing of the fan housing includes the heat-conducting outer housing made of a single-passage or multi-passage aluminum superconducting tube or aluminum superconducting plate, and the heat sink is installed on the inner wall of the side housing of the fan housing, with the airflow direction of the heat sink being in the rotational direction or axial direction of the impeller.

[0013] The present invention further relates to a photonic beauty device, including a body having a plurality of ventilation openings. A light source module, a power supply module, and a control circuit board are installed inside the body. The light source module and the power supply module are electrically connected to the control circuit board. The plurality of ventilation openings on the body serve as air intake and exhaust ports, forming a ventilation passage together with the space inside the body. The front end of the body is a work surface. A two-stage cooling module according to any of the above embodiments is further installed inside the body. The primary semiconductor cooling piece serves as the work surface itself or cools the work surface.

[0014] Furthermore, when the primary semiconductor cooling piece is used as the work surface, the transparent crystal serves as the cold surface, and the cold surface serves as the work surface. The hot surface and the electric double layer of the primary semiconductor cooling piece are provided with a light-transmitting window, making the primary cooling element light-transmitting, or the cold surface, the hot surface, and the electric double layer of the primary semiconductor cooling piece jointly define a light-transmitting window, allowing photonics generated in the light source module to be transmitted through the light-transmitting window to the outside of the work surface. When the primary semiconductor cooling piece cools the work surface, the cold surface of the primary semiconductor cooling piece contacts the work surface for heat transfer, or the cold surface of the primary cooling element is connected to the work surface by a thermal conductive member for rapid heat transfer to the work surface.

[0015] In some embodiments, the two-stage cooling module includes a fan and is located within the ventilation passage of the body. The light source module includes a lamp tube and a reflecting cup. The ventilation passage inside the reflecting cup communicates with the ventilation passage of the fan and with the ventilation passage of the body to form a heat dissipation ventilation passage for the light source module, and the fan promotes heat dissipation from the light source module. A heat dissipation piece or a heat conductive member is installed on one side of the reflecting cup. The fan housing is formed with multiple ventilation holes. One ventilation hole is fitted with a heat dissipation piece or a heat conductive member of the reflecting cup, and the ventilation passage of the fan communicates with the ventilation passage of the body to form a first ventilation passage for dissipating heat from the reflecting cup. The other ventilation hole of the fan communicates with the ventilation passage inside the reflecting cup and communicates with the ventilation passage of the fan to form a second ventilation passage for dissipating heat from the reflecting cup and the lamp tube.

[0016] In some embodiments, the photonic beauty device is a hair removal device, a photonic skin regeneration device, an import / export beauty device, or a radio frequency beauty device.

[0017] The two-stage cooling module of the present invention achieves the effect of rapid cooling and heat dissipation.

[0018] The present invention will now be described in more detail with reference to the drawings. [Brief explanation of the drawings]

[0019] [Figure 1] 1 is a perspective view of a cosmetic device according to a first embodiment of the present invention. [Figure 2] 1 is a perspective view of a cosmetic device according to a first embodiment of the present invention with an upper housing removed. [Figure 3] 1 is a diagram showing the internal structure of a cosmetic device according to a first embodiment of the present invention. [Figure 4] 1 is a diagram showing a ventilation passage of a beauty device according to a first embodiment of the present invention. [Figure 5] 10A and 10B are diagrams showing another embodiment of the ventilation opening of the beauty device according to the present invention. [Figure 6]6 is a diagram showing ventilation passages inside the cosmetic device according to the embodiment shown in FIG. 5. FIG. [Figure 7] FIG. 2 is an exploded view of the cosmetic device according to the embodiment shown in FIG. [Figure 8] 1 is a diagram showing the configuration of a first embodiment of a cooling module according to the present invention. [Figure 9] 1 is a perspective view of a first embodiment of a cooling module according to the present invention; [Figure 10] 1 is an exploded view of a portion of a cooling module according to the present invention; [Figure 11] 1 is a perspective view of a cooling module according to the present invention; [Figure 12] 1 is an exploded view of a portion of a cooling module according to the present invention; [Figure 13] 1 is a diagram showing a configuration of a part of a cooling module according to the present invention; [Figure 14] 14(a) and 14(b) are diagrams showing a modified configuration of the first embodiment of the cooling module according to the present invention, and are diagrams showing the configuration when viewed from different directions. [Figure 15] 15(a) and 15(b) are diagrams showing the configuration of an alternative embodiment of a semiconductor cooling module according to the present invention, and are different embodiments. [Figure 16] FIG. 10 is a perspective view of a cosmetic device according to a second embodiment of the present invention. [Figure 17] FIG. 10 is a perspective view of a cosmetic device according to a second embodiment of the present invention with an upper housing removed. [Figure 18] FIG. 4 is a diagram showing the internal structure of a cosmetic device according to a second embodiment of the present invention. [Figure 19] FIG. 10 is an exploded view of a cosmetic device according to a second embodiment of the present invention. [Figure 20] FIG. 4 is a diagram showing a configuration of a second embodiment of a cooling module according to the present invention. [Figure 21] FIG. 10 is a diagram showing another configuration of the cooling module according to the second embodiment of the present invention. [Figure 22] FIG. 10 is a diagram showing another configuration of the second embodiment of the cooling module according to the present invention. [Figure 23]23(a) and 23(b) are diagrams showing the configuration of an aluminum superconducting plate or an aluminum superconducting tube of a cooling module according to an embodiment of the present invention, where FIG. 23(a) is an oblique view of one aluminum superconducting plate or one aluminum superconducting tube, and FIG. 23(b) is a cross-sectional view along AA in FIG. 23(a). [Figure 24] FIG. 10 is a diagram showing a configuration of a cooling module according to a third embodiment of the present invention. [Figure 25] FIG. 10 is a diagram showing another configuration of the cooling module according to the third embodiment of the present invention. [Figure 26] FIG. 10 is a diagram showing another configuration of the cooling module according to the third embodiment of the present invention. [Figure 27] FIG. 10 is a perspective view of a cosmetic device according to a third embodiment of the present invention with the front housing removed. [Figure 28] FIG. 10 is a perspective view of a cosmetic device according to a fourth embodiment of the present invention with the front housing removed. [Figure 29] FIG. 10 is an exploded view of a fourth embodiment of a cooling module according to the present invention. [Figure 30] FIG. 10 is a perspective view of a fourth embodiment of a cooling module according to the present invention. [Figure 31] FIG. 10 is a diagram showing the internal configuration of a cosmetic device according to a fifth embodiment of the present invention. [Figure 32] FIG. 10 is an exploded view of a cosmetic device according to a fifth embodiment of the present invention. [Figure 33] 1 is a perspective view of a heat-dissipating fan module according to an embodiment of the present invention; [Figure 34] FIG. 10 is a perspective view of the heat-dissipating fan module according to the embodiment of the present invention, viewed from another direction. [Figure 35] 1 is an exploded view of a heat-dissipating fan module according to an embodiment of the present invention; [Figure 36] 1 is a cross-sectional view of a heat-dissipating fan module according to an embodiment of the present invention; [Figure 37] 1 is a diagram showing the configuration of a side volute case of a heat dissipation fan module according to an embodiment of the present invention; [Figure 38] FIG. 38 is a diagram showing a replacement configuration for the embodiment shown in FIG. 37. [Figure 39] FIG. 38 shows another alternative configuration for the embodiment shown in FIG. 37. [Figure 40] FIG. 38 shows another alternative configuration for the embodiment shown in FIG. 37. [Figure 41] 35 is a diagram showing the configuration of an embodiment in which the heat dissipation fan module shown in FIGS. 33 and 34 is replaced; FIG. [Figure 42] 35 is a diagram showing the configuration of an embodiment in which the heat dissipation fan module shown in FIGS. 33 and 34 is replaced; FIG. [Figure 43] FIG. 10 is a perspective view of a heat-dissipating fan module according to a modified example of the present invention. [Figure 44] FIG. 34 is a diagram showing the configuration of a replacement embodiment of FIG. 33. [Figure 45] FIG. 10 is a cross-sectional view of a heat-dissipating fan module according to a modified example of the present invention. [Figure 46] FIG. 46 is a perspective view of the heat-dissipating fan module shown in FIG. 45 with the outer wall of the housing removed. [Figure 47] FIG. 46 is an exploded view of the heat-dissipating fan module shown in FIG. [Figure 48] FIG. 10 is a perspective view of a heat-dissipating fan module according to another modified example of the present invention, viewed from another direction. [Figure 49] FIG. 10 is a perspective view of a heat-dissipating fan module according to another modified example of the present invention, viewed from another direction. [Figure 50] 49. FIG. 50 is a cross-sectional view of the heat-dissipating fan module shown in FIGS. 48 and 49 at another position. [Figure 51] 49. FIG. 50 is a cross-sectional view of the heat-dissipating fan module shown in FIGS. 48 and 49 at another position. [Figure 52] FIG. 50 is an exploded view of a portion of the heat-dissipating fan module shown in FIGS. 48 and 49. [Figure 53] FIG. 50 is an exploded view of the heat-dissipating fan module shown in FIGS. 48 and 49. [Figure 54] FIG. 50 is an exploded view of the heat-dissipating fan module shown in FIGS. 48 and 49. DETAILED DESCRIPTION OF THE INVENTION

[0020] Hereinafter, several specific embodiments of the present invention will be described with reference to the drawings. Note that the embodiments of the present invention and the characteristic configurations of the embodiments may be used in combination with each other as long as there is no contradiction.

[0021] 1 to 54, the present invention provides a cooling module 1, a heat dissipation fan module 200, and a photonic beauty device 100 using the cooling module / heat dissipation fan module 200. The cooling module 1 includes a semiconductor cooling member 10 / 10'. The semiconductor cooling member 10 / 10' includes an electric double layer 12 in the middle and a high-temperature surface 11' and a low-temperature surface 13 at both ends. The cooling module 1 further includes a cooling conduction member 15. One end of the cooling conduction member 15 is connected to the low-temperature surface 13 of the semiconductor cooling member for rapid heat transfer, and the other end is connected to a surface to be cooled for rapid cooling conduction. The cooling conduction member 15 is a heat transfer structural member, a heat pipe, a VC vapor chamber, a superheat conduction tube, or a superheat conduction plate. Preferably, the superheat conduction tube is an aluminum superconducting tube, and the superheat conduction plate is an aluminum superconducting plate. In some embodiments, the cooling conduction member 15 is a first cooling conduction member, and the cooling module 1 further includes a second cooling conduction member 15', which is installed between the first cooling conduction member 15 and the surface to be cooled and connected to rapidly conduct cooling, and is a heat conductive material pipe, a heat conductive material plate, an aluminum superconducting pipe, an aluminum superconducting plate, a heat pipe, or a VC.

[0022] A preferred embodiment of the present invention relates to a two-stage cooling module 1 including a primary semiconductor cooling member 10', a secondary semiconductor cooling member 10, and a cooling conduction member 15. The primary semiconductor cooling member 10' and the secondary semiconductor cooling member 10 each include an intermediate electric double layer 12 and a hot surface 11' and a cold surface 13 at their ends. The cooling conduction member 15 is a heat-conducting member connected between the primary semiconductor cooling member 10' and the secondary semiconductor cooling member 10 for rapid cooling conduction. Both ends of the cooling conduction member 15 are connected between the hot surface 11' of the primary semiconductor cooling member 10' and the cold surface 13 of the secondary semiconductor cooling member 10 for rapid heat transfer, respectively. The heat-conducting structural member is one or a combination of a heat-conducting member made of a thermally conductive material, a heat pipe, a vapor chamber, a superheat-conducting pipe, and a superheat-conducting plate. The cooling module 1 further includes a heat-conducting structure 19 and a heat-dissipating plate 16. The heat conduction structure 19 is one or a combination of a heat conduction element made of a heat conductive material, a heat pipe, a vapor chamber, a superheat conduction tube, and a superheat conduction plate. The heat conduction structure 19 is connected to the heat dissipation plate 16 for rapid heat transfer. The heat conduction structure 19 is connected to the high-temperature surface 11' of the secondary semiconductor cooling member 10 for rapid heat transfer, or the high-temperature end circuit of the secondary semiconductor cooling member 10 is installed on the heat conduction structure 19 and welded or electrically connected to the electric double layer 12 of the secondary semiconductor cooling member 10, so that the heat conduction structure 19 directly serves as the high-temperature surface 11' of the secondary semiconductor cooling member 10. The two-stage cooling module 1 further includes a fan 18 or a heat dissipation fan module 200. The fan 18 or the heat dissipation fan module 200 includes a fan housing 180 / 210 and an impeller 181 / 220 within the housing. The heat conducting structure 19 and / or heat dissipating piece 16 may be located at the fan vent 182 / 201 or may be part of the fan housing 180 / 210.

[0023] 33 to 53, in another preferred embodiment of the present invention, the secondary semiconductor cooling member 10 of the two-stage cooling module 1 dissipates heat using a heat dissipation fan module 200. The heat dissipation fan module 200 includes a fan housing 210 and an impeller 220. The interior of the fan housing 210 is a cavity. The impeller 220 is mounted within the cavity. The fan housing 210 is provided with a plurality of vent holes 201. The cavity communicates with a gas path external to the fan through the vent holes 201. At least a portion of the housing of the fan housing 210 is made of a heat conductive outer housing 211. The heat conductive outer housing 211 is formed as a whole, or by butt-joining a plurality of components selected from a heat conductive member, a heat pipe, a vapor chamber, a superheat conductive tube, and a superheat conductive plate, all made of a heat conductive material. The high temperature surface 11' of the secondary semiconductor cooling member 10 is connected to the heat conductive outer housing 210 so as to conduct heat thereto, or the high temperature end circuit of the secondary semiconductor cooling member 10 is installed in the heat conductive outer housing 211 and is welded and electrically connected to the electric double layer of the secondary semiconductor cooling member 10, so that the heat conductive outer housing 211 itself serves as the high temperature surface of the secondary semiconductor cooling member 10.

[0024] A preferred embodiment of the present invention relates to a photonic beauty device 100, including a body having multiple ventilation openings 101. A cooling module 1, a light source module 2, a power supply module 3, and a control circuit board 4 are installed inside the body. The light source module 2 and the power supply module 3 are electrically connected to the control circuit board 4. The body's multiple ventilation openings 111 serve as air intakes and exhausts, forming ventilation paths (paths indicated by arrows in Figures 4 to 6) with the space within the body, thereby achieving heat dissipation within the body. The front end of the body is a work surface 113 that can directly contact the skin. Light generated by the light source module 2 is transmitted to and emitted from the work surface 113, thereby providing cosmetic treatment to the skin. A two-stage cooling module 1 according to the above embodiment is also installed inside the body. A primary semiconductor cooling piece 10' serves as the work surface 113 itself or cools the work surface 113. Specifically, when the primary semiconductor cooling piece 10' is used as the work surface 113, the transparent crystal is used as the cold surface 13, and the cold surface 13 is used as the work surface 113. A light-transmitting window is installed on the hot surface 11' and the electric double layer 12 of the primary semiconductor cooling piece 10', so that the primary cooling member 10' is light-transmitting, or the cold surface 13, the hot surface 11' and the electric double layer 12 of the primary semiconductor cooling piece 10' jointly define the light-transmitting window, so that the photonics generated by the light source module are transmitted through the light-transmitting window to the outside of the work surface 113 and act on the skin outside the work surface. When the primary semiconductor cooling piece 10' cools the work surface 113, the cold surface 13 of the primary semiconductor cooling piece 10' contacts the work surface 113 to transfer heat, or the cold surface 13 of the primary semiconductor cooling member 10' is connected to the work surface by a heat-transfer structural member to rapidly transfer heat to the work surface. The two-stage cooling module 1 includes a fan 18 or a heat-dissipating fan module 200 and is located in the ventilation passage within the body. The light source module 2 includes a lamp tube 20 and a light-reflecting cup 21. The ventilation passage within the light-reflecting cup 21 communicates with the ventilation passage of the fan 18 or the heat-dissipating fan module 200 and also communicates with the ventilation passage within the body to form a heat-dissipating ventilation passage for the light source module 2, and the fan 18 or the heat-dissipating fan module 200 promotes heat dissipation from the light source module. A heat-dissipating piece or heat-conducting member 22 is installed on one side of the light-reflecting cup 21.The fan housing 180 / 210 of the fan 18 / heat dissipating fan module 200 is formed with a plurality of ventilation holes 182 / 201. A heat dissipation piece or heat conduction member 22 of the light reflecting cup is attached to one of the ventilation holes, and a first ventilation path 101 is formed by connecting the ventilation path of the fan 18 / heat dissipating fan module 200 to the ventilation passage inside the body, thereby dissipating heat from the light reflecting cup 21. The other ventilation hole of the fan 18 / heat dissipating fan module 200 is connected to the ventilation passage inside the light reflecting cup 21, and a second ventilation path 102 is formed by connecting the ventilation path of the fan 18 / heat dissipating fan module 200 to the ventilation passage inside the body, thereby dissipating heat from the light reflecting cup 21 and the lamp tube 20.

[0025] In the present invention, the two-stage cooling module solves the problems that when the primary semiconductor cooling member dissipates heat through the heat transfer structural member, the heat conduction efficiency is uneven, the heat conduction is slow, and the aging of the heat conduction decreases, which slows down the cooling rate and causes heat variations at the front and rear ends, left and right ends, or top and bottom ends of the heat dissipation plate when the heat is conducted to the heat dissipation plate, and affects the heat dissipation effect of the fan.

[0026] Hereinafter, with reference to the drawings, several specific embodiments of the cooling module, the heat dissipation fan module 200, and the photonic cosmetic device 100 will be described. It is possible to obtain many more embodiments by combining some of the configurations of the various specific embodiments, and all of these are within the scope of the disclosure of the present invention.

[0027] 1 to 28, the present invention provides a cooling module 1 and a cosmetic device. The cooling module 1 includes a semiconductor cooling member 10 for cooling the cosmetic device. The semiconductor cooling member 10 includes an electric double layer in the middle and a high-temperature surface 11' and a low-temperature surface 13 at both ends. The cooling module further includes a heat-conducting structure 19 and a heat-dissipating plate 16. The heat-conducting structure 19 includes a VC vapor chamber, an aluminum superconducting plate, or an aluminum superconducting tube. The heat-conducting structure is connected to the heat-dissipating plate 16 and the high-temperature surface 11' of the semiconductor cooling member 10 for rapid heat transfer, thereby rapidly dissipating heat from the high-temperature surface.

[0028] Both ends of the aluminum superconducting plate or aluminum superconducting tube are sealed, a working liquid is enclosed inside, and two or more bone-like microgrooves 1911 are formed on the inner wall. A microporous structure 1912 is formed within the material of the aluminum superconducting plate or aluminum superconducting tube.

[0029] As shown in FIGS. 1 to 19, a cosmetic device 100 according to an embodiment of the present invention includes a body having multiple ventilation openings 111. The ventilation openings 111 may be located at different positions on the housing 110 or at the same position, and may be located in different forms, such as, but not limited to, honeycomb-shaped holes, gaps, or notches formed in the housing 110. The ventilation openings may be one or more, and function to allow cool air or ambient air to flow into the body through the ventilation openings, absorb heat from the inside of the body, and then be expelled from the body through the ventilation openings. A cooling module 1, a light source module 2, a power supply module 3, and a control circuit board 4 are installed inside the body. The light source module 2 and the power supply module 3 are electrically connected to the control circuit board 4. The multiple ventilation openings 111 on the body function as air intakes and exhausts, forming ventilation passages (paths indicated by arrows in FIGS. 4 to 6) with the space within the body, thereby dissipating heat from within the body. The front end of the body is a work surface 113 that can come into direct contact with the skin. The light generated by the light source module 2 is transmitted to and emitted from the work surface 113, and then performs a cosmetic treatment on the skin.

[0030] 8 to 14, a cooling module 1 according to an embodiment of the present invention primarily cools the working surface 113 of a cosmetic device to achieve a cooling effect on the skin. The cooling module 1 includes a semiconductor cooling element 10. The semiconductor cooling element 10 includes an intermediate electric double layer 12, a high-temperature surface 11′ at both ends, and a low-temperature surface 13. The intermediate electric double layer 12 has PN galvanic particles arranged and electrically connected to a high-temperature circuit installed on the high-temperature surface and a low-temperature circuit installed on the low-temperature surface, thereby forming an internal circuit of the semiconductor cooling element. The positive and negative poles are electrically connected to a control circuit board 4 to control the operation of the semiconductor cooling element, or the operation of the semiconductor cooling element is controlled by independent circuit control. In a specific embodiment, the cooling element 10 (specifically, the low-temperature surface 13) may be used directly as the working surface 113 or may be used to cool the working surface 113. When the cooling element 10 is used directly as the working surface 113, those skilled in the art may form the cooling element 10 into an appropriate shape, such as a transparent crystal or a ring, as needed. When the cooling member 10 is used to cool a work surface 113, the cold surface 13 of the cooling member 10 contacts the work surface 113, for example, by placing it around the work surface. Alternatively, the cold surface 13 of the cooling member 10 contacts the work surface 113 via a heat transfer member (or thermal conduction member). The cooling conduction member (first cooling conduction member) 15 is a heat transfer structural member that rapidly transfers heat from the work surface to the semiconductor cooling member, thereby achieving a cooling effect on the work surface. The heat transfer structural member may be a thermally conductive material, such as, but not limited to, a metal thermal conduction member (e.g., copper pipe or copper plate). The heat transfer structural member may also be another heat transfer module capable of heat conduction, such as a heat pipe, vapor chamber, superheat conduction tube, superheat conduction plate, or other type of heat transfer module, connected between the semiconductor cooling member (cold surface) and the work surface. The cooling conduction member (first cooling conduction member) 15 may be designed to have an appropriate shape based on the principle of rapid heat dissipation, depending on the shape of the semiconductor cooling member 10, particularly the shape of the cold surface 13 and the shape of the working surface 113. The working surface 113 may be made of transparent crystal or other light-transmitting material. The working surface 113 may be annular, with a central annular through-hole allowing light to pass through. In this case, the material is not limited.

[0031] A heat pipe or vapor chamber rapidly transfers heat from a heat-generating object to the outside using the principle of thermal conduction and the rapid heat transfer characteristics of the cooling medium. Heat is transferred by evaporation and condensation of a liquid inside a completely sealed vacuum tube or vacuum plate, and the cooling effect is achieved through fluid principles such as capillary action, offering a number of advantages including high thermal conductivity, excellent heat uniformity, heat flux variability, and reversible heat flow direction. Heat exchangers consisting of heat pipes or vapor chambers offer advantages such as high heat transfer efficiency, compact structure, and low fluid resistance loss.

[0032] 7 to 11 , in a preferred embodiment, the cold surface 13 and working surface 113 of the cooling member 10 are connected to a heat pipe, which is a cooling conduction member 15, to rapidly conduct heat from the working surface 113 or the environment surrounding the working surface to the cooling member 10 (cold surface 13) for heat dissipation, and then rapidly conduct heat to the cooling piece. Depending on the shape of the working surface 113 and the desired cooling effect, one end of the cooling conduction member (heat pipe) 15 that contacts the working surface 113 may be designed in an annular shape so as to be in close contact with the periphery of the working surface and rapidly absorb heat from the working surface 113 or the environment surrounding the working surface 113. Depending on the shape of the cooling member 10 or the cold surface 13, one end of the cooling conduction member (heat pipe) 15 that contacts the cooling member 10 may be designed to extend a predetermined length from the annular bend and be positioned on the cold surface 13 of the cooling member for close contact with the cold surface 13.

[0033] Heat generated on the high-temperature surface 11' of the semiconductor cooling element 10 is discharged to the outside of the device through the ventilation passage within the device. Preferably, the semiconductor cooling element 10 is equipped with a heat dissipation unit to enhance its heat dissipation effect. The heat dissipation unit includes a VC vapor chamber 11 and a heat dissipation piece 16 installed on the VC vapor chamber 11. The high-temperature surface 11' of the semiconductor cooling element is installed on the outer wall of the VC vapor chamber 11, or the VC vapor chamber 11 itself serves as the high-temperature surface of the semiconductor cooling element. The VC vapor chamber 11 is used to dissipate heat from the cooling element 10. The VC vapor chamber 11 is located within the ventilation passage of the device. The cooling element 10 is installed in the VC vapor chamber 11, and the high-temperature surface 11' of the semiconductor cooling element is attached to the outer wall of the VC vapor chamber by bonding it to the VC vapor chamber's exterior wall, thereby directly conducting heat from the high-temperature surface to the VC vapor chamber 11. Alternatively, the high-temperature surface 11' of the semiconductor cooling element is attached to the outer wall of the VC vapor chamber by a thermally conductive element, which rapidly conducts heat from the high-temperature surface 11' to the VC vapor chamber 11. Alternatively, the VC vapor chamber 11 is equipped with a high-temperature end circuit of the semiconductor cooling element that is welded and electrically connected to the PN galvanic particles of the electric double layer 12. In the VC vapor chamber 11, a sealed flat cavity is formed by the bottom plate, frame, and cover plate, and a capillary structure is installed within the cavity to contain the working fluid. As a non-limiting example, an extension stage is formed at one end of the VC vapor chamber 11 to accommodate or mount the semiconductor cooling element 10. The area of the VC vapor chamber 11 is larger than that of the electric double layer 12 and the cold surface 13, so that the hot surface 11' of the semiconductor cooling element has an extended VC vapor chamber 11, increasing the heat dissipation area.

[0034] The heat dissipation unit further includes a heat dissipation piece 16 attached to the VC vapor chamber 11 to increase the VC heat dissipation area. Depending on the heat dissipation needs of the product, heat dissipation pieces 16 may be attached to the top, bottom, or both sides of the VC vapor chamber 11. Preferably, the VC vapor chamber 11 is located behind the ventilation opening of the device, and the heat dissipation piece of the VC vapor chamber 11 faces the ventilation opening 111 of the device. The heat dissipation piece 16 is one or more sets of thermally conductive fins, and the position, number, and arrangement of the heat dissipation piece are determined according to the internal space of the cosmetic device. 10 to 15, the surface of the VC vapor chamber 11 is provided with a heat dissipation piece 16, which is a set of parallel linear heat dissipation fins arranged in a matrix, or the VC vapor chamber 11 is a fan frame, and the heat dissipation piece 16 is a set of curved heat dissipation fins on the inner wall of the spiral fan frame (Fig. 15(a)), with the airflow direction aligned with the spiral of the fan frame. Alternatively, the heat dissipation piece 16 is a set of heat dissipation fins arranged in an annular matrix. The heat dissipation fins are installed along a linear radial direction or rotated at a certain angle (Fig. 15(b)).

[0035] The cooling module 1 according to the present invention further includes a fan 18 positioned within the ventilation passage of the aircraft body to improve heat dissipation (cooling) efficiency. The fan 18 includes a fan housing 180 and an impeller 181 mounted within the housing's internal cavity. The fan housing 180 is provided with a plurality of openings serving as a plurality of ventilation holes 182 for the fan 18. The ventilation holes 182 for the fan 18 communicate with the internal cavity of the fan housing 180 to form a ventilation passage for the fan 18 and communicate with the ventilation passage within the aircraft body. The VC vapor chamber 11 may be part of the fan housing 180 or may be attached to the fan housing 180. The VC vapor chamber 11 and heat sink 16 dissipate heat through the ventilation passage of the fan 18. The fan promotes airflow to improve heat dissipation efficiency.

[0036] The VC vapor chamber 11 may be installed as part of the housing of the fan 18. The fan 18 housing includes an upper housing, a lower housing 184, and a middle frame 183. Heat dissipation teeth may be installed on the inner wall of the frame 183 to increase the heat dissipation area of the VC vapor chamber 11. As shown in Figures 12 to 14, the VC vapor chamber 11 is installed as the upper housing (or lower housing) of the fan housing, covering the top (or bottom) of the annular frame. The VC vapor chamber 11 may be installed as an annular flat plate. A central through-hole of the annular flat plate forms one ventilation hole for the fan 18. The heat dissipation piece 16 is installed as a pair of parallel heat dissipation fins covering the central through-hole, and the ventilation path between the heat dissipation fins communicates with the central through-hole of the VC vapor chamber 11 and the internal cavity of the fan housing.

[0037] The heat dissipation fins shown in Figure 15(b) are arranged on the annular edge of the central through-hole of the VC vapor chamber 1, and differ from the structures shown in Figures 12 to 14 in that they are arranged radially or rotated at a certain angle and arranged in a circle.

[0038] As shown in FIG. 15(a), the VC vapor chamber 11 may be a frame outside the blade, with the heat dissipation piece 16 installed on the inner wall of the frame, and the semiconductor cooling member 10 installed on the outer wall of the frame.

[0039] The cooling module of the present invention is also used to dissipate heat from the light source module 2. The light source module 2 includes a lamp tube 20, a light-reflecting cup 21 outside the lamp tube, and electrode pieces 23 on both ends of the lamp tube. Preferably, the lamp tube 20 is an IPL lamp tube, a halogen lamp, or other suitable light source that generates IPL photons. The ventilation passage of the light source module 2 communicates with the ventilation passage of the fan 18 and also communicates with the ventilation passage inside the body to form a heat-dissipation ventilation passage for the light source module 2, thereby facilitating heat dissipation from the light source module 2 by the fan 18. A heat-conducting member 22 may be installed on one side of the light-reflecting cup. For example, the heat-conducting member 22 may be a pair of heat-conducting pieces (made of a heat-conducting material) with one end connected to the outer wall of the light-reflecting cup and the other end extending to the ventilation holes 182 of the fan 18. A plurality of ventilation holes 182 are formed in the housing of the fan 18, specifically, in the outer frame of the blades. As shown in Figure 13, three ventilation holes 182 are installed in the frame, and the heat conduction member of the light reflecting cup is attached to one of the ventilation holes (first ventilation hole), and the ventilation path of the fan 18 is connected to the ventilation passage inside the body of the device, forming a first ventilation path 101 (the line indicated by the arrow in Figure 4) for dissipating heat from the heat conduction member 22 of the light reflecting cup and the VC vapor chamber 11. In this case, external air or cold air flows in through the housing ventilation port 111 (including, but not limited to, a set of honeycomb holes and gaps in the housing) facing the heat dissipation piece 16, passes through the heat dissipation piece 16 and the VC vapor chamber 11, and flows into the fan 18 through the central through-hole of the VC vapor chamber 11. The airflow circulates in the internal cavity of the fan due to the rotating blades, passes through the heat conduction member 22 of the light reflecting cup and the VC vapor chamber 11, absorbs heat from the light reflecting cup 21 and the VC vapor chamber 11, and is discharged from the fan through another ventilation port 182 (second ventilation port) in the fan frame, and is discharged to the outside of the main body through a ventilation passage inside the body and through a ventilation port (including, but not limited to, a set of honeycomb holes and gaps in the housing) 111 at the end of the body, thereby achieving heat dissipation from the heat conduction member 22 of the light reflecting cup and the VC vapor chamber 11.Another ventilation opening 182 (third ventilation opening) in the fan frame is connected to the air passage inside the lamp tube, and also connects the ventilation passage of the fan 18 to the ventilation passage inside the body of the machine, forming a second ventilation passage 102, which is used for heat dissipation of the light reflecting cup 21 and the lamp tube 20. In this case, external air or cold air flows in through the housing ventilation port 111 facing the heat dissipation piece 16, passes through the heat dissipation piece 16 and the VC vapor chamber 11, and flows into the fan 18 through the central through-hole of the VC vapor chamber 11. The airflow circulates through the internal cavity of the fan via the impeller, passes through the light reflecting cup 21 and the VC vapor chamber 11, absorbs the heat of the light reflecting cup 21 and the VC vapor chamber 11, and is discharged from the fan through another ventilation port 182 (second ventilation port) in the fan frame, and is discharged to the outside of the main body through a ventilation passage inside the body and through ventilation ports 111 at the end of the body (including, but not limited to, a set of honeycomb holes and gaps in the housing), thereby realizing heat dissipation from the heat conduction member 22 of the light reflecting cup and the VC vapor chamber 11. Another ventilation hole 182 (third ventilation hole) of the fan frame communicates with the air passage inside the lamp tube, and also communicates the ventilation path of the fan 18 with the ventilation passage inside the body, forming a second ventilation passage 102 for dissipating heat from the light reflecting cup 21 and the lamp tube 20. In this case, external air or cool air flows in through the housing ventilation hole 111 facing the heat dissipation piece 16, passes through the heat dissipation piece 16 and the VC vapor chamber 11, and flows into the fan 18 from the central through-hole of the VC vapor chamber 11. Part of the airflow is exhausted from the fan through another ventilation hole 182 of the fan frame by the impeller and flows into the inside of the light reflecting cup 21, absorbs heat from the lamp tube 20 and the light reflecting cup inside the reflector lamp, and discharges it from the lamp tube, passes through the ventilation passage inside the body, and is discharged to the outside of the body from the ventilation hole 111 at the end of the body, further promoting heat dissipation from the lamp tube 20 and the light reflecting cup 21.

[0040] The ventilation openings 111 of the cosmetic device body housing may be installed in different positions or with different hole structures. For example, as shown in Figures 5 and 6, they may be installed on the lower housing and side of the body, respectively, with the side ventilation openings serving as outlets for the first ventilation passage 101 and the second ventilation passage 102, and the ventilation passages within the body corresponding to and connected to the side ventilation openings 111.

[0041] The beauty device 100 according to the present invention uses the semiconductor cooling module 1 according to the above-described embodiments to cool the working surface 113 of the head of the device. The fan of the cooling module 1 also dissipates heat from the light source module 2. The photonic beauty device may be a hair removal device, a photonic skin regeneration device, an import / export beauty device, or a radio frequency beauty device, and any of these may employ the cooling module according to the above-described embodiments.

[0042] The beauty device 100 shown in Figures 1 to 7 will be described with a straight body as an example, and may be used as an IPL photonic hair removal device. As shown in Figures 1 to 19, the beauty device 100 according to the embodiment of the present invention includes a housing 110 in which a plurality of ventilation holes 111 are installed. The housing 110 includes an upper housing 112 and a lower housing 118 that engage with each other to form a cavity inside the device. An upper bracket 114 and a lower bracket 115 that fit into the upper housing 112 and the lower housing 118, respectively, are also installed inside the device. A base bracket 24 is installed inside the front end of the device to mount the cooling module 1, the light source module 2, the power supply module 3, and the control circuit board 4.

[0043] The multiple ventilation openings 111 may be installed at different positions or the same position on the housing 110 with different hole structures. The illustrated ventilation openings 110 are installed on the lower housing 118, side, or end of the housing. A ventilation passage is formed in the empty space inside the machine body. Cool air or ambient air flows into the machine body through the ventilation openings, absorbs heat inside the machine body, and then is exhausted outside the machine body through ventilation openings 111 at the same or different positions. The multiple ventilation openings 111 on the machine body function as air intake and exhaust, forming a ventilation passage (path indicated by arrows in Figures 4 to 6) together with the space inside the machine body to dissipate heat inside the machine body. The front end of the machine body is a work surface 113 that can directly contact the skin. Light generated by the light source module 2 is transmitted to and emitted from the work surface 113, where it is used to perform cosmetic treatment on the skin.

[0044] The light source module 2 is attached to the front end of the aircraft body by a base bracket 24. An output light path and an output light window are formed within the base bracket 24 for propagating light generated by the light source module. The work surface 113 is attached to the output light window, and the lamp tube 20 is attached to the rear of the base bracket by a light reflecting cup 21, located behind the output light path, with a filter 25 installed in the direction of light emitted from the light source module. The heat conducting member 22 of the light reflecting cup extends rearward to the fan ventilation port. If necessary, the base bracket 24 may be provided with an air duct that communicates with the ventilation duct inside the light reflecting cup to facilitate air-cooling and heat dissipation.

[0045] The inside of the front end where the upper bracket 114 and lower bracket 115 inside the body engage is formed as a fan accommodating chamber, and the cooling module 1 is attached correspondingly. A window is formed at the front end of the lower bracket 115, facing and communicating with the ventilation hole 111 formed in the lower bracket 118. The heat dissipation piece 16 of the VC vapor chamber 11 is located in the window and faces the ventilation hole 111 of the lower housing 118. A semiconductor cooling element 10 is installed on a stage extending from the front end of the VC vapor chamber 11. A heat transfer element (heat pipe) 15, which is a cooling conduction element, is supported by a base bracket, and its front end (annular) is connected to the work surface 113 in rapid heat transfer contact, and its rear end (the end of a parallel straight pipe) covers the low-temperature surface of the semiconductor cooling element in close contact for rapid heat transfer. The fan is mounted in the fan housing, with the ventilation opening 182 at the front end of the frame corresponding to the heat conducting member 22 of the light reflecting cup, and the ventilation opening at the rear end communicating with the ventilation passage formed after the upper and lower brackets are mated. For the ventilation passage of the fan, refer to the air intake and exhaust symbols shown in Figure 8.

[0046] A power module housing is formed inside the rear portion of the device where the upper bracket 114 and the lower bracket 115 are engaged. The power module 3 may generally be a battery, such as a rechargeable battery or a capacitor cell. The power module further includes a charging stand 31 for connecting to an external power source to charge the battery or directly power the beauty device. The charging stand 31 is electrically connected to the control circuit board 4 and is attached to the housing and can be connected to a cable.

[0047] On one side of the power module housing chamber, ventilation passages 101 / 102 are further defined inside the upper bracket 114 and the lower bracket 115. The ventilation passages 101 / 102 communicate with the ventilation passage of the fan, communicate with the ventilation passage of the light reflecting cup, and communicate with the ventilation ports (air intake and air exhaust) of the housing, forming a ventilation passage inside the body of the machine.

[0048] Control circuit board 4 is attached to the cavity formed by the engagement of upper bracket 114 and upper housing 112, and control circuit board 4 is protected by upper bracket 114 and upper housing 112. The housing is further fitted with switch push keys 117 electrically connected to control circuit board 4, and a corresponding switch wiring board 116 attached thereto, for use in on / off control, etc.

[0049] Referring to the embodiment shown in Figures 16 to 19, the cooling module 1 according to the above embodiment is applied to an L-shaped beauty device, whose function and structure are the same or similar to those of the straight-shaped device shown in Figures 1 to 7. The size, shape, and positional fit of the housing, bracket, power supply module 3, light source module 2, cooling module 1, and control circuit board 4 are appropriately arranged to fit only the overall shape of the device. The L-shaped beauty device includes a handle 120 and a base 130. The base 130 is rotatably connected to the top of the handle 120 by a knob 150, a knob holder 140, and a knob retainer plate 151 at the top of the handle. The rotational connection structure between the base 130 and the handle and the handle structure may be conventional. The rear of the handle is a DC line 31', inside which a handle bracket 160 is installed and to which the power supply module 3 is attached. A cavity on one side of the top of the handle bracket 160 communicates with the interior of the base 130, and the base housing is rotatably attached. The base housing includes a front housing 131 and a front housing cover 132, and the front housing cover 132 is fitted with a knob 150, a knob holder 140, and a rotary presser plate 151, thereby rotatably connecting the base 130. A bracket 133 inside the base is attached to the front housing cover 132 and fitted into the front housing 131, with the cooling module 1 attached to one side and the control circuit board 4 attached to the other side. The front end of the base 130 is a working surface 113, which may be a transparent crystal, an annular working surface, an annular semiconductor cooling element, or a semiconductor cooling element with a transparent crystal cold surface, all of which are conventional structures. 1 to 7, a base bracket 24 is installed at the front end inside the base 130, and the light source module 2 is attached thereto, similar to the structure of the embodiment in Figures 1 to 7. One side of the heat conduction member 22 of the light reflecting cup of the light source module 2 is installed with a heat pipe and heat dissipation piece unit 26 that protrudes into the ventilation hole 182 of the fan 18, and a ventilation hole is installed in the front housing 131 opposite the heat dissipation piece unit 26. In this embodiment, the cooling module 1 cools the work surface 113 and also dissipates heat from the light source module 2.

[0050] In this invention, a semiconductor cooling element 10 is installed in the VC vapor chamber 11, and a heat transfer element (heat pipe) 15, which is a cooling conduction element, connects the low-temperature surface 13 of the cooling element to the working surface 113 of the beauty device for rapid cooling conduction, providing a cooling or cooling effect to the working surface. A heat sink 16 is installed in the VC vapor chamber 11 to increase the heat dissipation area. Furthermore, the VC vapor chamber 11 is installed on the upper housing, lower housing, or frame of the fan, depending on the fan, utilizing the transformation effect of evaporation and condensation of the VC vapor chamber. This significantly improves the heat dissipation efficiency and speed during fan rotation. Adding a heat sink on the upper surface of the VC increases the VC's heat dissipation area, effectively increasing the contact area between the air and the heat sink during airflow. Adding a heat sink made of thermally conductive material on the lower surface of the upper housing of the VC fan (the inner wall of the frame) significantly increases the contact area between the air and the heat sink, further improving the heat dissipation effect. Heat sinks may be installed on the upper, lower, or both surfaces of the VC vapor chamber depending on the product's heat dissipation needs.

[0051] 20 to 23, a second embodiment of the cooling module 1 according to the present invention is primarily used to cool the working surface 113 (see the above-described embodiment) of a cosmetic device, thereby achieving a cooling effect on the skin. The cooling module 1 includes a semiconductor cooling member 10. The semiconductor cooling member 10 (see the above-described embodiment) includes an electric double layer 12 in the middle, a high-temperature surface 11' at both ends, and a low-temperature surface 13. In a specific embodiment, the cooling member 10 (specifically, the low-temperature surface 13) may be used directly as the working surface 113 or may be used to cool the working surface 113. When the cooling member 10 is used directly as the working surface 113, those skilled in the art may configure the cooling member 10 in an appropriate shape, such as a transparent crystal or a ring, as needed. When the cooling member 10 is used to cool the working surface 113, the low-temperature surface 13 of the cooling member 10 contacts the working surface 113, for example, is configured around the periphery of the working surface. Alternatively, the cold surface 13 of the cooling element 10 contacts the working surface 113 via a heat transfer element (or thermal conductive element). The cooling conductive element 15 is a heat transfer structural element that rapidly transfers heat from the working surface to the semiconductor cooling element, thereby achieving a cooling effect on the working surface. The heat transfer structural element may be a thermal conductive element made of a thermally conductive material, such as, but not limited to, a metal material (e.g., copper / aluminum tube or copper / aluminum plate) or other thermally conductive material (e.g., silicone grease, silicon wafer, elastomer, or soft thermal conductive material). It may also be a heat pipe, a vapor chamber (VC), a superconducting tube, a superconducting plate, or other heat transfer module. A heat pipe or vapor chamber utilizes the principle of heat conduction and the rapid heat transfer characteristics of the cooling medium to rapidly transfer heat from a heat-generating object to the outside of the heat source. The superconducting tube or plate is preferably an aluminum superconducting tube or plate. (Aluminum) superheat conducting tubes or (aluminum) superheat conducting plates, also known as ALVC superconducting tubes (plates), rapidly conduct heat by evaporative cooling and gas-liquid phase change.Referring also to FIG. 23, compared to conventional heat pipes and VC vapor chambers, aluminum superconducting heat conducting tubes / plates are fabricated using an aluminum processing and forming process, with microgrooves, microtooths, or micropores formed on the surface of the superconducting heat conducting tube or plate, forming a capillary structure inside the superconducting tube or plate. The interior of the aluminum superconducting tube (plate) may contain aluminum powder or aluminum silicon powder instead of copper powder, or an aluminum mesh may be added to the tube and sealed after adding the coolant. The cooling conduction member 15 is connected between the semiconductor cooling element (cold surface) and the working surface and may be designed to have an appropriate shape based on the principle of rapid heat dissipation, depending on the shape of the semiconductor cooling element 10, particularly the shapes of the cold surface 13 and the working surface 113. In this embodiment, the cooling conduction member 15 is a copper tube, an ALVC aluminum superconducting tube (plate), a heat pipe, or VC.

[0052] Depending on the shape of the working surface 113 and the desired cooling effect, the end of the cooling conduction member 15 that contacts the working surface 113 may be formed in a ring shape so as to be in direct and close contact with the periphery of the working surface to rapidly absorb heat from the working surface 113 or the surrounding environment. Alternatively, a cooling conduction member (second cooling conduction member) 15' for contact heat transfer is further installed on the working surface 113 and the cooling conduction member 15. The cooling conduction member 15' may be a copper tube, an ALVC superconducting tube (plate), a heat pipe, or VC, and may be designed in a ring shape so as to be attached to the periphery of the working surface 113 and the ring end of the cooling conduction member 15 to rapidly transfer heat. Depending on the shape of the cooling member 10 or the cold surface 13, the end of the cooling conduction member 15 that contacts the cooling member 10 may be designed to extend a predetermined length from the ring bend and be positioned on the cold surface 13 of the cooling piece to be in close contact with the cold surface 13.

[0053] Heat generated at the high-temperature surface 11' of the semiconductor cooling member 10 is discharged to the outside of the device through the ventilation passage within the device. Specifically, the semiconductor cooling member 10 has a heat dissipation unit to enhance its heat dissipation effect. The heat dissipation unit includes a heat conduction structure 19 and a heat dissipation plate 16. It is located in the ventilation passage of the cosmetic device and is used to rapidly dissipate heat from the high-temperature surface 11' of the semiconductor cooling member 10. The heat conduction structure 19 includes a heat conduction plate 190 and a plurality of aluminum VC / ALVC superconducting tubes 191, each of which is a single tube. The high-temperature surface 11' of the semiconductor cooling member is installed on the outer wall of the heat conduction plate 190, or the heat conduction plate 190 itself serves as the high-temperature surface 11' of the semiconductor cooling member 10. The semiconductor cooling member 10 is installed on one side of the outer wall of the heat conduction plate 190, and a plurality of opening grooves 192 are installed on the other side. The plurality of open grooves 192 engage with the plurality of aluminum VC / ALVC superconducting tubes 191. The aluminum VC / ALVC superconducting tubes 191 are housed in the open grooves 192. The open grooves 192 of the heat conduction plate are connected to the aluminum VC / ALVC superconducting tubes 191 by, for example, crimping or welding, thereby increasing the contact area between them and realizing rapid heat transfer.

[0054] Referring also to Figure 23, aluminum VC / ALVC superconducting tube 191 is formed by processing aluminum material to form microgrooves, microdentations, or micropores on the inner wall surface of the aluminum VC / ALVC superconducting tube, thereby creating capillary action inside the aluminum VC / ALVC superconducting tube. As shown in Figure 23(b), when aluminum material is extruded to form an aluminum VC / ALVC superconducting tube, a single passage 1910 is formed inside the tube, and two or more bone-like microgrooves 1911 are formed on the inner wall of the tube. A large number of micropore structures 1912 may also be formed inside the tube wall of the aluminum VC / ALVC superconducting tube. Once the aluminum material is formed into a tube shape, aluminum powder or aluminum silicon powder may be added by injecting or extracting liquid into or from the tube. An aluminum mesh may be added, and the sealed ends may be sintered after vacuuming to obtain an aluminum VC / ALVC superconducting tube with super thermal conductivity. Preferably, each aluminum VC / ALVC superconducting tube is a single passage 1910, which has the advantage that it can be bent in a plane or 3D into a special shape, allowing the shape to be changed according to changes in the product's spatial shape. Multiple aluminum VC / ALVC superconducting tubes can be combined in a staggered pattern to eliminate the influence of gravity. In the example shown in Figure 23(a), the aluminum VC / ALVC superconducting tube 191 is bent into an L shape, and the corresponding opening groove 192 of the heat conduction plate 190 is also formed in an L shape. The aluminum VC / ALVC superconducting tube 191 fits exactly into the opening groove 192 and is integrally formed into the L-shaped heat conduction structure 19. One end of the L shape is placed on the high-temperature surface 11' of the semiconductor cooling element 10 for close contact and rapid heat transfer, and the other end of the L shape is attached to the heat dissipation plate 16. Heat generated on the high-temperature surface 11' of the semiconductor cooling element 10 is rapidly conducted by the heat conduction structure 19 to the heat dissipation plate 16 for heat dissipation.

[0055] The cooling element 10 is installed on one side of the thermally conductive plate 190, and the high-temperature surface 11' of the semiconductor cooling element is attached to the outer wall of the thermally conductive plate 190, thereby directly conducting heat from the high-temperature surface to the thermally conductive plate 190. Alternatively, the high-temperature surface 11' of the semiconductor cooling element 10 is attached to the outer wall of the thermally conductive plate 190 via a thermally conductive member, which rapidly conducts heat from the high-temperature surface 11' to the thermally conductive plate 190. Alternatively, the high-temperature end circuit of the semiconductor cooling element is installed on the thermally conductive plate 190 and is welded and electrically connected to the PN galvanic particles of the electric double layer 12. The thermally conductive plate 190 is a thermally conductive member made of a thermally conductive material, such as, but not limited to, a metal material (e.g., copper or aluminum) or other thermally conductive material (e.g., but not limited to, silicone grease, silicon wafer, elastomer, or soft thermally conductive material). Preferably, the thermally conductive plate 190 is made of a thermally conductive material, such as a copper or aluminum plate.

[0056] The heat sink 16 is mounted on the heat conduction plate 190 to increase the heat dissipation area. Preferably, the heat sink 16 is located behind the ventilation opening of the cosmetic device body, facing the ventilation opening 111 of the body (see FIGS. 16, 27, and 28). The heat sink 16 is made of one or more sets of heat-conducting fins, and the position, quantity, and arrangement of the heat sink 16 are determined according to the internal space of the cosmetic device. The one or more sets of heat sinks are integrally formed or fixed by welding, crimping, or other fastening mechanisms to form the integral heat sink 16, or the one or more sets of heat-conducting fins are mounted on the heat conduction plate to form the integral heat sink 16. A groove 161 is formed on the top surface of the heat sink 16, and one end of the heat conduction structure 19 is inserted into the groove 161. The contact area between the two is increased by crimping / welding, thereby achieving rapid heat transfer.

[0057] In other embodiments, the heat-conducting structure 19 may be disposed directly on the heat-dissipating plate 16 or may be coupled to one side of the heat-conducting plate of the heat-dissipating plate 16 (see FIG. 28).

[0058] 24-26, the third embodiment of the cooling module 1 is primarily used to cool the working surface 113 of a cosmetic device (as in the above-described embodiment) to achieve a cooling effect on the skin. The cooling module 1 includes a semiconductor cooling member 10, a first cooling conductive member 15, a second cooling conductive member 15', a heat dissipation plate 16, and a heat conduction structure 19. The structures of the first cooling conductive member 15, the second cooling conductive member 15', and the heat dissipation plate 16 are the same as or similar to those of the second embodiment of the cooling module 1 described above, and the above embodiment is quoted here without modification. The heat conduction structure 19 includes a heat conduction plate 190 and multiple aluminum VC / ALVC superconducting tubes 191. Preferably, each aluminum VC / ALVC superconducting tube 191 is a single tube with a single passage within the tube. The high-temperature surface 11' of the semiconductor cooling member 10 is installed on the outer wall of the heat conduction plate 190, or the heat conduction plate 190 itself serves as the high-temperature surface 11' of the semiconductor cooling member 10. The semiconductor cooling element 10 is installed on one side of the outer wall of the heat conduction plate 190, and a plurality of opening grooves 192 are installed on the other side. The plurality of opening grooves 192 are fitted with a plurality of aluminum VC / ALVC superconducting tubes 191. The aluminum VC / ALVC superconducting tubes 191 are accommodated in the opening grooves 192. The opening grooves 192 of the heat conduction plate are connected to the aluminum VC / ALVC superconducting tubes 191 by, for example, crimping or welding, thereby increasing the contact area between them and achieving rapid heat transfer. In this embodiment, the heat conduction plate 190 includes a circular (not limited to circular) area and a stage extending from one side, and the semiconductor cooling element 10 is installed on the stage. A plurality of opening grooves 190 are installed through the circular area, extending from the center to the periphery, and are uniformly spaced at equal intervals across the circular area. One aluminum VC / ALVC superconducting tube 191 is installed in each opening groove 190. The open grooves 190 and aluminum VC / ALVC superconducting tubes 191 may be arranged at a constant curvature or radian. In a non-limiting example, multiple aluminum VC / ALVC superconducting tubes 191 may be installed and then arranged radially along a radius or approximately along a radial direction to eliminate the effects of gravity. In another embodiment, multiple aluminum VC / ALVC superconducting tubes 191 may be arranged in a staggered arrangement to eliminate the effects of gravity.The open groove 190 of the heat conduction plate is connected to the aluminum VC / ALVC superconducting tube 191, and the contact area between them is increased by crimping / welding, accelerating heat transfer.

[0059] As in the above-described embodiment, the aluminum VC / ALVC superconducting tube 191 employs a single passageway, and fine grooves, fine teeth, or fine holes are formed on the inner wall surface of the aluminum VC / ALVC superconducting tube through an aluminum processing and forming process, and a coolant is sealed inside, and aluminum powder or aluminum silicon powder, etc. may also be added, and an aluminum mesh may also be added.

[0060] The cooling element 10 is mounted on one side of the heat conduction plate 190, and the high temperature surface 11' of the semiconductor cooling element is attached to the outer wall of the heat conduction plate 190, thereby directly transferring heat from the high temperature surface to the heat conduction plate 190; alternatively, the high temperature surface 11' of the semiconductor cooling element is attached to the outer wall of the heat conduction plate 190 by a heat conduction member, which quickly transfers heat from the high temperature surface 11' to the heat conduction plate 190; alternatively, the high temperature end circuit of the semiconductor cooling element is mounted on the heat conduction plate 190, and is welded and electrically connected to the PN galvanic particles of the electric double layer 12. The heat conduction plate 190 is preferably made of a heat conductive material, such as a copper / aluminum plate.

[0061] The heat sink 16 is mounted on the heat conduction plate 190 to increase the heat dissipation area. As a non-limiting example, the circular area of the heat conduction structure 19 can be directly mounted on the top of the heat sink 16 or fixed to the top of the heat sink 16 by welding or crimping to rapidly transfer heat. The heat sink 16 protrudes from a stage on one side of the heat conduction plate 190, and the semiconductor cooling element 10 is mounted on the stage.

[0062] Referring to FIG. 27, the cooling module 1 of the third embodiment described above is applied to a cosmetic device, for example, the cosmetic device having the shape shown in FIGS. 16 to 19. Other structural components of the cosmetic device are the same as or similar to those of the embodiments shown in FIGS. 16 to 19, and are hereby incorporated by reference. The heat conduction structure 19 is installed in the vent hole at the top of the fan 18. Specifically, the circular area of the heat conduction plate 190 is arranged to cover the top opening of the fan. An aluminum VC / ALVC superconducting tube 191 is attached to the heat conduction plate, facing the fan. The heat dissipation piece 16 is located in the vent hole 111, the exterior of which faces the side of the front housing 131. The heat conduction structure 19, fan 18, and heat dissipation piece 16 are all located within the ventilation passages of the device, and the ventilation passages are connected to each other. Cool air is drawn in through the vent hole 111 of the device, absorbs heat within the ventilation passage, and then discharges to the outside of the device through another vent hole 111.

[0063] A semiconductor cooling member 10 is installed on one side of the heat conduction plate 190, and a cooling conduction member (copper / ALVC / heat pipe / VC) 15 (and a second cooling conduction member 15') connects the low-temperature surface of the cooling member 10 to the working surface 113 of the cosmetic device, thereby rapidly conducting cooling and achieving a cooling or temperature-reducing effect on the working surface.

[0064] The cosmetic device shown in FIG. 27 operates on the same principle as the above-described embodiment, so details thereof will be omitted here.

[0065] The cosmetic device of the embodiment shown in Figure 28 uses the cooling module 1 of the third embodiment described above to cool the working surface 113 of the cosmetic device, and other structural components of the cosmetic device are the same as or similar to those of the embodiments shown in Figures 16 to 19, and are therefore quoted as they are. The heat conduction structure 19 is L-shaped, and one end attached to the heat dissipation piece 16 is installed to cover the ventilation hole at the top of the fan 18, and an aluminum VC / ALVC superconducting tube 191 is attached to the heat conduction plate 190 with its inside facing the fan, and the semiconductor cooling member 10 is installed at the other end of the heat conduction plate 190, located outside the ventilation hole at the top of the fan 18. The heat dissipation piece 16 is located in a ventilation port 111 whose outside faces the side of the front housing 131, and the heat conduction structure 19, fan 18, and heat dissipation piece 16 are all located in ventilation passages inside the body of the machine, and each ventilation passage is connected to each other, so that cool air is drawn in through the ventilation port 111 of the body, absorbs heat in the ventilation passage inside the body, and then discharged to the outside of the main body through another ventilation port 111.

[0066] A semiconductor cooling element 10 is installed on one side of the heat conduction plate 190. A cooling conduction element (copper / ALVC / heat pipe / VC) 15 (and cooling conduction element 15') connects the low-temperature side of the cooling element 10 to the working surface 113 of the cosmetic device for rapid cooling conduction, achieving a cooling or temperature-reducing effect on the working surface. In this embodiment, the heat pipe and heat dissipation element unit 26 installed on one side of the heat conduction element 22 of the light-reflecting cup of the light source module 2 may be omitted. A groove 161 (FIG. 22) opened in the heat dissipation element 16 is attached to one end of the heat conduction plate 190 and forms a ventilation passage, which communicates with the air passage between adjacent fins of the heat dissipation element 16 and the air passage of the fan, and also with the light-reflecting cup of the light source module 2 and its internal ventilation passage. The heat conduction element 22 of the light-reflecting cup of the light source module 2 is located within the ventilation opening of the fan 18 or the ventilation passage within the device body, achieving air-cooled heat dissipation to the light-reflecting cup 21 and the lamp tube 20. In this embodiment, the cooling module 1 cools the work surface 113 and also dissipates heat from the light source module 2.

[0067] In the heat conduction structure 19 of the above embodiment of the present invention, by aligning multiple aluminum superconducting plates or a single tube of aluminum superconducting pipes 191 with the heat conduction plate (copper plate) 190, the gravity direction of the product can be effectively resolved. The pipes can be installed in two or more different directions / angles in the XY plane or in the XYZ three-dimensional space. As is known, heat and steam flow from bottom to top. Therefore, when the beauty device is used from bottom to top, the gravity effect of the heat conduction structure is relatively obvious. The anti-gravity effect reduces the heat conduction effect in this state, making it difficult to achieve the desired heat dissipation effect. In the present invention, the heat dissipation problem can be better resolved by installing the pipes in a horizontal / vertical relative configuration, a crossing configuration at a certain angle, a circular configuration (Figures 24-26), a zigzag configuration, or a circulating configuration. The heat conduction structure 19 significantly improves the heat dissipation effect.

[0068] 29-30, a fourth embodiment of the cooling module 1 of the present invention uses a two-stage cooling configuration, primarily for cooling the working surface of the photonic beauty device and dissipating heat from within, to enhance cooling efficiency. In a specific example, a primary cooling member is installed on the working surface, which is the end that contacts the skin, to cool the skin. Heat from the primary cooling member 10' is absorbed by the evaporation end of the cooling conduction member (heat pipe / vapor chamber / (aluminum) superheat conduction tube / (aluminum) superheat conduction plate) 15, flows into the internal passage of the heat pipe / vapor chamber / (aluminum) superheat conduction tube / (aluminum) superheat conduction plate, and is transferred to the condensation end. A secondary cooling member 10 is installed at the condensation end to perform active cooling. In this case, the temperature of the condensation end is determined by the power of the secondary cooling member 10. Because the temperature of the condensing end is much lower than the ambient air temperature, the condensation rate and aging time at the condensing end are significantly improved, accelerating the internal phase transformation and circulation of the cooling conduction member (heat pipe / VC / (aluminum) superheat conduction tube or (aluminum) superheat conduction plate) 15, thereby achieving beneficial effects of improving cooling to the front end. The heat dissipation surface (high-temperature surface) 13 of the secondary cooling member 10 is close to the fan's air inlet or outlet. For heat dissipation by the secondary cooling member 10, a copper / aluminum heat conduction plate can be used directly to absorb heat through the fan, or a heat pipe / vapor chamber / (aluminum) superheat conduction tube / (aluminum) superheat conduction plate can conduct heat from the secondary cooling member's heat dissipation surface 13 to the fan housing, and the heat can be absorbed by the fan's air blowing or suction through a heat dissipation plate 16 installed on the fan housing wall. Compared to the embodiment of the cooling module 1 shown in Figures 8 to 15, in this embodiment (Figures 29 and 30), the installation of secondary cooling corresponds to using the cooling member 10 of the cooling module 1 shown in Figures 8 to 15 as a secondary cooling member to cool the primary cooling member 10' connected to the low-temperature end. Two-stage cooling mainly cools the working surface 113 of the cosmetic device to achieve a cooling effect on the skin. The primary cooling member 10' is connected to the working surface 113 or serves as the working surface 113 itself. The secondary cooling member 10 is connected to a heat-dissipating fan module or is directly installed in the fan housing. The primary cooling member and the secondary cooling member are preferably semiconductor cooling members.The semiconductor cooling element 10 / 10' includes an intermediate electric double layer 12, a high-temperature surface 11' at each end, and a low-temperature surface 13. The intermediate electric double layer 12 has PN galvanic particles arranged and electrically connected according to a high-temperature end circuit installed on the high-temperature surface and a low-temperature end circuit installed on the low-temperature surface, thereby forming an internal circuit of the semiconductor cooling element, and the positive and negative poles are electrically connected to the control circuit board 4 to control the operation of the semiconductor cooling element, or the operation of the semiconductor cooling element is controlled by independent circuit control.

[0069] In a specific embodiment, the primary cooling member 10' (specifically, the cold surface 13) may be used directly as the work surface 113 or may be used to cool the work surface 113. When the primary cooling member 10' is used directly as the work surface 113, those skilled in the art can determine the appropriate shape of the primary cooling member 10' as needed. For example, the entire transparent crystal may be used as the cold surface 13, or the cold surface 13 may be used as the work surface 113. Light-transmitting windows may be provided in the hot surface 11' and the electric double layer 12, making the primary cooling member 10' optically transparent. For example, the cold surface 13, the hot surface 11', and the electric double layer 12 may be arranged in a circular shape or may jointly define the light-transmitting window. In this case, the material is not limited. When the primary cooling member 10' is connected to the work surface 113 to perform cooling, the cold surface 13 is in contact with the work surface 113, for example, located around the periphery of the work surface. Alternatively, the cold surface 13 of the primary cooling member 10' is in contact with the working surface 113 by a heat transfer member (or a heat conduction member).

[0070] The cooling conduction member (first cooling conduction member) 15 is connected between the primary semiconductor cooling member 10′ (specifically, its high-temperature surface 11′) and the secondary semiconductor cooling member 10 (specifically, its low-temperature surface 13) for rapid cooling conduction, and rapidly transfers heat from the primary semiconductor cooling member 10′ to the secondary semiconductor cooling member 10 to achieve a cooling effect on the work surface. The cooling conduction member 15 is a heat transfer structural member. The heat transfer structural member may be, but is not limited to, a heat transfer member made of a thermally conductive material, for example, a metal material (e.g., copper pipe, copper plate, other heat transfer structure, etc.). Preferably, the heat transfer structural member is a heat pipe, vapor chamber, (aluminum) superheat conduction tube, or (aluminum) superheat conduction plate. The cooling conduction member 15 may be designed to have an appropriate shape based on the principle of rapid heat dissipation, depending on the shapes of the primary semiconductor cooling member 10′ and the secondary semiconductor cooling member 10. When the primary semiconductor cooling member 10' is used as the work surface 113, it is optically transparent or has a light-transmitting window. One end of the cooling conduction member (heat pipe) 15 that contacts the work surface 113 is designed to be annular so as to be in close contact with the periphery of the high-temperature surface 11' of the primary semiconductor cooling member 10' and rapidly absorb heat from the primary semiconductor cooling member 10' or the ambient environment of the primary semiconductor cooling member 10'. One end of the cooling conduction member (heat pipe) 15 that contacts the secondary cooling member 10 may be designed to extend a predetermined length from the annular bend and be positioned on the low-temperature surface 13 of the secondary cooling member 10 and be in close contact with the low-temperature surface 13.

[0071] The secondary semiconductor cooling member 10 enhances its heat dissipation effect by using a heat dissipation unit. The heat dissipation unit includes a heat conductive outer housing 11, which may be formed as a single unit or by butt-joining multiple heat pipes, (aluminum) superheat conductive tubes, (aluminum) superheat conductive plates, or vapor chambers, and a heat dissipation piece 16 attached to the heat conductive outer housing 11. The high temperature surface 11' of the secondary semiconductor cooling member is attached to the outer wall of the heat conductive outer housing 11, or the heat conductive outer housing 11 itself serves as the high temperature surface of the semiconductor cooling member. The heat conductive outer housing 11 is used to dissipate heat from the secondary cooling member 10. When applied to a beauty device, the heat-conducting outer housing 11 is positioned within the ventilation passage of the device, the secondary cooling member 10 is installed in the heat-conducting outer housing 11, and the high-temperature surface 11' of the secondary semiconductor cooling member is attached by bonding it to the outer wall of the heat-conducting outer housing 11, thereby conducting the heat of the high-temperature surface directly to the heat-conducting outer housing 11; alternatively, the high-temperature surface 11' of the secondary semiconductor cooling member 10 is attached to the outer wall of the (heat pipe / vapor chamber / (aluminum) superheat-conducting tube / (aluminum) superheat-conducting plate) heat-conducting member, and the heat of the high-temperature surface 11' is conducted to the (heat pipe / vapor chamber / (aluminum) superheat-conducting tube / (aluminum) superheat-conducting plate) heat-conducting outer housing 11 via the heat-conducting member; alternatively, the high-temperature end circuit of the semiconductor cooling member is installed in the (heat pipe / vapor chamber / (aluminum) superheat-conducting tube / (aluminum) superheat-conducting plate) heat-conducting outer housing 11 and welded and electrically connected to the PN galvanic particles of the electric double layer 12. Preferably, the vapor chamber / (aluminum) superheat conductive plate is used as a single unit to form the heat conductive outer housing 11, or multiple units are butt-joined to form the heat conductive outer housing 11. The heat conductive outer housing 11 is a sealed flat cavity formed by a base plate, a frame, and a cover plate, and a capillary structure is installed within the cavity to accommodate a working fluid. As a non-limiting example, one end of the heat conductive outer housing 11 is formed with an extension stage used for installing or mounting the secondary semiconductor cooling member 10.The heat conducting outer housing 11 has a larger area than the electric double layer 12 and the cold surface 13, thereby increasing the heat dissipation area of the hot surface 11' of the secondary semiconductor cooling member 10.

[0072] The heat-conducting outer housing 11 is provided with a heat-dissipating piece 16 to increase the heat-dissipating area. Depending on the heat-dissipating needs of the product, the heat-dissipating piece 16 may be provided on the top, bottom, or both surfaces of the heat-conducting outer housing 11. Preferably, the heat-conducting outer housing 11 is located behind the ventilation openings of the body of the cosmetic device. The heat-dissipating piece of the heat-conducting outer housing 11 faces the ventilation openings 111 of the body. The heat-dissipating piece 16 is one or more sets of heat-conducting fins.

[0073] The heat dissipation unit of the secondary cooling member 10 further includes a fan 18 positioned within the ventilation passage of the cosmetic device body to enhance heat dissipation (cooling) efficiency. The arrangement of the heat dissipation fan 180, secondary cooling member 10, (heat pipe / vapor chamber / (aluminum) superheat conduction tube / (aluminum) superheat conduction plate) heat conductive outer housing 11, and heat dissipation piece 16 in this embodiment is directly quoted in this embodiment with reference to the embodiment shown in Figures 10 to 15 and the above description, and detailed description will be omitted. The fan 18 includes a fan housing 180 and an impeller 181 mounted within the housing's internal cavity. The fan housing 180 has multiple openings as multiple ventilation holes 182 for the fan 18. The multiple ventilation holes 182 for the fan 18 are connected to the internal cavity of the fan housing 180 to form a ventilation path for the fan 18 and communicate with the ventilation passage within the device body for air intake and exhaust. The heat-conducting outer housing 11 (heat pipe / vapor chamber / (aluminum) superheat-conducting tube / (aluminum) superheat-conducting plate) may be a part of the fan housing 180 or may be attached to the fan housing 180 .

[0074] The two-stage cooling module 1 of this embodiment is applied to cooling and heat dissipation of the photonic beauty device 100. Referring to FIGS. 31 and 32, the heat dissipation unit of the two-stage cooling module 1 is also used to dissipate heat from the light source module 2. The light source module 2 includes a lamp tube 20 and a light-reflecting cup 21 outside the lamp tube. The lamp tube 20 is an IPL lamp tube, a halogen lamp, or other suitable light source that generates IPL photons. The ventilation passage of the light source module 2 communicates with the ventilation passage of the fan 18 and also communicates with the ventilation passage inside the device body, forming a heat-dissipating ventilation passage for the light source module 2, and the fan 18 facilitates heat dissipation from the light source module 2. A heat-conducting member 22 may be installed on one side of the light-reflecting cup. For example, the heat-conducting member 22 may be, but is not limited to, a pair of heat-conducting pieces (made of a heat-conducting material). One end of the heat-conducting member is connected to the outer wall of the light-reflecting cup, and the other end extends to the ventilation opening 182 of the fan 18. A plurality of ventilation holes 182 are formed in the housing of the fan 18, specifically in the frame outside the blades. As shown in Fig. 13, three ventilation holes 182 are provided in the frame, and the heat conductive member of the light reflecting cup is attached to one of the ventilation holes (first ventilation hole), and the ventilation path of the fan 18 communicates with the ventilation passage inside the machine body, forming a first ventilation path 101 (see arrows in Fig. 4) for dissipating heat from the heat conductive member 22 of the light reflecting cup and the heat conductive outer housing 11 (heat pipe / vapor chamber / (aluminum) superheat conductive tube / (aluminum) superheat conductive plate).In this case, external air or cool air flows in through the housing ventilation openings 111 (including, but not limited to, a set of honeycomb holes and gaps in the housing) facing the heat dissipation piece 16, passes through the heat dissipation piece 16 and the (heat pipe / vapor chamber / (aluminum) superheat conduction tube / (aluminum) superheat conduction plate) heat conduction outer housing 11, and flows into the fan 18 through the central through-hole of the (heat pipe / vapor chamber / (aluminum) superheat conduction tube / (aluminum) superheat conduction plate) heat conduction outer housing 11. The airflow circulates in the internal space of the fan due to the impeller, and is then blown through the heat conduction member 22 of the light reflecting cup and the (heat pipe / vapor chamber / (aluminum) superheat conduction tube The heat of the light reflecting cup 21 and the (heat pipe / vapor chamber / (aluminum) super heat conduction tube / (aluminum) super heat conduction plate) heat conductive outer housing 11 is absorbed through the heat pipe / vapor chamber / (aluminum) super heat conduction tube / (aluminum) super heat conduction plate) heat conductive outer housing 11, and is discharged from the fan through another ventilation port 182 (second ventilation port) in the fan frame, and is also discharged to the outside of the body through a ventilation passage inside the body and through ventilation ports (including, but not limited to, a set of honeycomb holes and gaps in the housing) 111 at the end of the body, thereby realizing heat dissipation from the heat conductive member 22 of the light reflecting cup and the (heat pipe / vapor chamber / (aluminum) super heat conduction tube / (aluminum) super heat conduction plate) heat conductive outer housing 11. Another ventilation opening 182 (third ventilation opening) in the fan frame is connected to the air passage inside the lamp tube and also connects the ventilation passage of the fan 18 to the ventilation passage inside the body of the machine, forming a second ventilation passage 102 for dissipating heat from the light reflecting cup 21 and the lamp tube 20.In this case, external air or cool air flows in through the housing ventilation port 111 facing the heat dissipation piece 16, passes through the heat dissipation piece 16 and the heat conductive outer housing 11 (heat pipe / vapor chamber / (aluminum) super thermal conduction tube / (aluminum) super thermal conduction plate), and flows into the fan 18 through the central through-hole of the vapor chamber 11. A portion of the airflow is exhausted from the fan through another ventilation port 182 in the fan frame by the impeller and flows into the interior of the light reflecting cup 21, absorbing heat from the lamp tube 20 inside the reflector lamp and the light reflecting cup, discharging it from the lamp tube, passing through a ventilation passage inside the body, and discharging it to the outside of the body through the ventilation port 111 at the end of the body, further promoting heat dissipation from the lamp tube 20 and the light reflecting cup 21. The heat dissipation unit and heat dissipation principle are the same as those in the embodiment shown in Figures 1 to 14.

[0075] In the beauty device 100 of the present invention, similar to the embodiments shown in FIGS. 1 to 14, the working surface 113 is formed by the transparent crystalline low-temperature surface of the primary cooling member 10'. The photonic beauty device may be a hair removal device, a photonic skin regeneration device, an import / export beauty device, or a photonic high-frequency beauty device, and any of these may employ the cooling module according to the above-described embodiments. A primary cooling member 10 for cooling the skin is installed on the working surface, which is the end of the photonic beauty device that comes into contact with the skin. Heat from the primary cooling member 10' (specifically, the high-temperature surface 11') is absorbed by the evaporating end of the cooling conduction member (heat pipe / vapor chamber / (aluminum) superheat conduction tube / (aluminum) superheat conduction plate) 15, enters the internal passage, and is conducted to the condensing end. A secondary cooling member 10 is installed at the condensing end to provide active cooling to the condensing end. In this case, the temperature of the condensing end is determined by the power of the secondary cooling member 10. Because the temperature of the condensing end is much lower than the ambient air temperature, the condensation rate and aging time at the condensing end are significantly improved, accelerating the internal phase transformation and circulation of the cooling conduction element (heat pipe / vapor chamber / (aluminum) superheat conduction tube / (aluminum) superheat conduction plate), thereby achieving beneficial effects of improving cooling to the front end. The high-temperature surface 11' of the secondary cooling element 10 is located near the fan's air inlet or outlet. For heat dissipation from the secondary cooling element 10, the copper / aluminum heat conduction plate 16 can be used to directly absorb heat through the fan, or the heat from the high-temperature surface 11' of the secondary cooling element 10 can be conducted to the fan housing through the heat pipe / vapor chamber / (aluminum) superheat conduction tube / (aluminum) superheat conduction plate, and the heat can be absorbed by the fan's air blowing or suction through the heat dissipation plate 16 installed on the fan housing wall.

[0076] The cosmetic device 100 of the embodiment shown in Figures 31 and 32 has the same configuration as the cosmetic device of the embodiment shown in Figures 1 to 7, and the description of the corresponding embodiment is directly quoted in this embodiment, so detailed description will be omitted. According to the principle of a heat pipe, after the evaporation end of the cooling conductive member 15 is heated, the heat is transferred to the heat dissipation plate 16 via the condensation end wall and absorbed by the fan 18. Condensation is classified as active or passive heat dissipation. The heat dissipation effect of the condensation end is determined by the ambient temperature of the air drawn in by the fan. For example, the aging and speed of condensation are reduced, adversely affecting the internal circulation effect of the heat pipe. When cooling the skin using only the primary cooling member 10', the heat conduction efficiency is uneven, the heat conduction is slow, and the aging of heat conduction is poor. Furthermore, when heat is conducted to the heat dissipation plate, there are problems such as uneven heat distribution at the front and rear ends, left and right ends, or top and bottom ends of the heat dissipation plate, which maximizes the amount of air drawn in or blown out by the fan, thereby affecting the heat dissipation effect. In this embodiment, the two-stage cooling module 1 transmits heat from the primary cooling member 10' to the secondary cooling member 10 through the cooling conduction member 15, effectively solving the above-mentioned problems caused by the primary cooling member 10' alone.

[0077] In another embodiment, the secondary cooling member 10 rapidly dissipates heat using the heat dissipation unit of the cooling module embodiment shown in Figures 20 to 26. That is, the primary cooling member 10' (specifically, the high-temperature surface 11') is connected to the secondary cooling member 10 (specifically, the low-temperature surface 13) by a cooling conduction member 15 (15') for rapid heat transfer, thereby achieving rapid cooling conduction. Heat generated at the high-temperature surface 11' of the secondary cooling member 10 is rapidly dissipated by a heat conduction structure 19 and a heat dissipation plate 16. The heat conduction structure 19 includes a heat conduction plate 190 and a plurality of aluminum VC / ALVC superconducting tubes 191, each of which is a single tube. The high-temperature surface 11' of the secondary semiconductor cooling member 10 is attached to the outer wall of the heat conduction plate 190, or the heat conduction plate 190 itself serves as the high-temperature surface 11' of the secondary semiconductor cooling member 10. The secondary semiconductor cooling member 10 is installed on one side of the outer wall of the heat conduction plate 190, and a plurality of opening grooves 192 are installed on the other side. The plurality of opening grooves 192 are fitted with a plurality of aluminum VC / ALVC superconducting tubes 191. The aluminum VC / ALVC superconducting tubes 191 are accommodated in the opening grooves 192. The opening grooves 192 of the heat conduction plate are connected to the aluminum VC / ALVC superconducting tubes 191 by, for example, crimping or welding, thereby increasing the contact area between them and achieving rapid heat transfer. The heat dissipation unit further includes a heat dissipation fan module. The heat dissipation fan may be implemented using the configuration of each of the above embodiments or a regular fan.

[0078] The following embodiments refer to FIGS. 33 to 54. The secondary cooling element 10 of the above-described embodiment rapidly dissipates heat using a heat dissipation fan module 200. In this embodiment, the heat dissipation fan module 200 includes a fan housing 210 and an impeller 220. The interior of the fan housing 210 is a cavity. The impeller 220 is mounted within the cavity. The fan housing 210 is provided with a plurality of vents 201. The cavity communicates with the gas path outside the fan through the vents 201. At least a portion of the fan housing 210 is made of a heat pipe, a superheat conduction tube, a superheat conduction plate, or VC 211. The fan housing 210 includes side fins. An upper fin and a bottom fin may be selectively installed on the top and bottom of the fan housing 210 depending on the needs of a specific product. The upper fin and the bottom fin may be formed from the upper fin or the lower fin of the heat dissipation plate described below, without being separately installed. The side housing may be the volute case on the outside of the circumference around which the impeller rotates, or may be a housing that is part of the volute case.

[0079] Preferably, the superheat conducting tube is an aluminum superconducting tube, and the superheat conducting plate is an aluminum superconducting plate. The through passage 2110 inside the aluminum superconducting tube or plate is a single passage or multiple passages, and the single passage or multiple passages are porous microgroove passages that communicate with the passage 2110 and the porous microgrooves 2111 on its inner wall. Both ends of the single passage or multiple passages are sealed, and a working liquid is sealed inside.

[0080] The fan housing includes a volute case around the impeller, which encloses and defines a cavity inside the fan. An upper housing may be installed on the top of the volute case, or a ventilation hole 201 may be formed on the top. The bottom of the volute case may be a bottom housing, or may have a ventilation hole 201 formed on it. The ventilation hole on the top may be a plurality of through-holes installed in the upper housing, and the ventilation hole on the bottom may be a plurality of through-holes installed in the bottom housing. All or part of the volute case, upper housing, or bottom housing may be made of a heat pipe, a superheat conducting tube, a superheat conducting plate, or VC211. The entire structure is formed by butt-joining one or more heat pipes, superheat conducting tubes, superheat conducting plates, or VC211.

[0081] The heat dissipating fan module 200 includes a heat dissipating plate 212. The heat dissipating plate 212 is connected to a heat pipe, a superheat conducting tube, a superheat conducting plate, or a VC 211 for rapid heat transfer. The heat dissipating plate 212 is located in a cavity within the fan housing. The heat dissipating plate 212 includes one or more sets of thermally conductive fins. The air passages between adjacent fins of the heat dissipating plate communicate with the fan vent and the cavity.

[0082] Preferably, a heat pipe, a superheat conductive tube, a superheat conductive plate, or a VC 211 is installed on the volute case, which is the side of the fan housing. The heat dissipation piece 212 is installed on the inner wall of the side at a predetermined distance from the impeller 220 and does not affect the rotation of the impeller 220. More preferably, a heat conductive outer housing is formed on the side of the volute case using an aluminum superconducting tube or aluminum superconducting plate with a single passage or multiple passages. The heat dissipation piece 212 is installed on the inner wall of the heat conductive outer housing. The fins are arranged radially around the center of rotation of the impeller. The air passage between adjacent fins is in the same direction as the airflow generated by the rotation of the impeller.

[0083] Two or more fine bone-like microgrooves 2111 are formed on the inner wall of a single passage or multiple passages 2110 in an aluminum superconducting tube or plate. The groove direction of the microgrooves 2111 is along the radial circumference of the rotation center of the impeller, in the same direction as the airflow generated by the rotation of the impeller. A porous structure is formed inside the wall material of the microgrooves 2111. The passages 2110, the microgrooves 2111, and the porous structure inside the material are formed in a primary process by extrusion molding the aluminum material.

[0084] Preferably, the heat dissipation fan module 200 of the present invention includes a secondary semiconductor cooling member 10. The heat dissipation surface (high-temperature surface) of the secondary semiconductor cooling member 10 is connected to a heat pipe, a superheat conduction tube, a superheat conduction plate, or a VC211 for rapid heat transfer. The heat dissipation surface of the secondary semiconductor cooling member 10 and the heat pipe, the superheat conduction tube, the superheat conduction plate, or the VC211 are attached to each other and contact each other for heat transfer, or are attached to each other and contact each other via a heat conduction plate. Alternatively, the heat dissipation surface of the secondary semiconductor cooling member 10 and the heat pipe, the superheat conduction tube, the superheat conduction plate, or the VC211 are respectively installed at different positions on the fan housing for rapid heat transfer.

[0085] The heat dissipation fan module 200 includes a drive control circuit board 240 and a drive module 250. The drive control circuit board 240 is electrically connected to the drive module 250. The drive control circuit board 240 and the drive module 250 are electrically connected to an external power supply via a power line or a power module. The drive module 250 drives the impeller 220 to rotate. The electrodes of the secondary semiconductor cooling member 10 are electrically connected to the drive control circuit board 240 or the external circuit board.

[0086] In some embodiments, the drive control circuit board 240 is installed outside the fan housing to provide waterproofing. The ventilation openings 201 are provided with a waterproof seal. The drive module 250 is installed on the drive control circuit board 240 and attached to the outside of the fan's bottom housing 214. The drive control circuit board 240, the drive module 250, and the fan impeller 220 are respectively installed inside and outside the fan's bottom housing 214. When water is drawn into or supplied to the fan, the drive control circuit board 240 and the drive module 250 are not affected. The drive module 250 includes a motor. The motor's output shaft is axially connected to the impeller 220 to rotate the impeller 220. Alternatively, the drive module 250 includes a motor stator winding, and a magnetic ring 25 is fitted inside the impeller and fixedly connected to the impeller 220. When energized, the drive module 250 generates a magnetic field, which rotates the fan's impeller.

[0087] The heat dissipation fan module 200 is either a radial fan or an axial fan. In a radial fan, the airflow generated by the rotation of the impeller 220 circulates along the radial circumference of the impeller's rotation center and is then exhausted through a vent in the volute case. In an axial fan, the airflow generated by the rotation of the impeller 220 is exhausted along the central axis from a vent in the volute case or a vent at the bottom.

[0088] In some embodiments, a heat sink 212 is installed in the fan vent 201, and the air passage of the heat sink connects the fan cavity to the outside environment.

[0089] The heat pipe or vapor chamber (VC) of the present invention rapidly transfers heat from a heat-generating object to the outside of the heat source through the heat pipe, utilizing the principles of thermal conduction and the rapid heat transfer characteristics of the cooling medium. Heat is transferred through the evaporation and condensation of liquid within a completely sealed vacuum tube or vacuum plate, and the cooling effect is achieved through fluid principles such as capillary action, offering a number of advantages, including high thermal conductivity, excellent heat uniformity, heat flux variability, and reversible heat flow direction. Heat exchangers constructed with heat pipes or vapor chambers offer advantages such as high heat transfer efficiency, compact structure, and low fluid resistance loss.

[0090] The superheat conducting tube or plate of the present invention is preferably an aluminum superheat conducting tube / plate. (Aluminum) superheat conducting tubes or plates, also known as ALVC superconducting tubes or plates, rapidly conduct heat through evaporative cooling and gas-liquid phase transformation. Unlike conventional heat pipes and VC vapor chambers, aluminum superheat conducting tubes / plates are fabricated by extrusion molding of aluminum material, forming microgrooves, microdents, or micropores on the surface of the superheat conducting tube or plate as a capillary structure inside the superconducting tube or plate. The interior of the ALVC aluminum superconducting tube or plate may contain aluminum powder or aluminum silicon powder instead of copper powder, and an aluminum mesh is added to seal the tube after adding the coolant.

[0091] Specific embodiments will be described below with reference to the drawings. The following embodiments are not intended to limit the present invention, but are intended to help those skilled in the art understand and implement the technical solutions of the present invention. The scope of protection of the present invention is governed by the claims. The configurations of the heat dissipation fan module 200 in the following embodiments may be replaced, combined, or improved, and all such modifications are within the scope of the present disclosure.

[0092] 33 to 40, a heat dissipation fan module 200 according to a first embodiment of the present invention is a blower module and includes a fan housing 210 having a cavity formed therein, an impeller 220 mounted within the cavity, and a secondary semiconductor cooling element 10 mounted on the fan housing. The fan housing 210 includes a volute case on the side. A volute case cover is provided on the outside of the impeller 220. The volute case is a heat-conducting outer housing, and a heat-dissipating plate 212 is mounted on its inner wall. The entire volute case is made up of a heat pipe, a superconducting tube, a superconducting plate, or a VC 211. In this embodiment, the entire volute case is an aluminum superconducting tube or an aluminum superconducting plate.

[0093] Vents 201 are provided on the side volute case and top of the fan housing 210. The vents 201 connect the cavity to the gas path outside the fan. For example, air is taken in through the vent at the top, flows into the cavity, and then circulates through the impeller 220 to absorb heat from the surface of the heat sink 212, before finally being discharged through the vent at the side. Referring to FIG. 34 , the bottom housing 214, which is the bottom of the fan housing 210, may be provided with multiple vents 201 to assist air intake. The fan of this embodiment has a radial flow, and air is taken in through the vents at the top and bottom of the impeller or fan in the axial direction and discharged through the vent at the side. The air intake and air discharge may be interchanged, and are not limited to this.

[0094] In this embodiment, the fan housing 210 includes a side volute case and a bottom housing, the top of which is open to form a vent. The side volute case has a thermally conductive outer housing entirely formed of a single heat pipe, superheat conduction tube, superheat conduction plate, or VC211 (see FIGS. 35 to 37 and 39), or a plurality of heat pipes, superheat conduction tubes, superheat conduction plates, or VC211 (see FIG. 38). The heat pipe, superheat conduction tube, superheat conduction plate, or VC211 is closely connected to the inner heat dissipation plate 212 for heat conduction, and the heat pipe, superheat conduction tube, superheat conduction plate, or VC211 is connected to the heat dissipation plate 212 by welding, crimping, adhesive, or other means to rapidly transfer heat.

[0095] Preferably, the side volute case is a heat-conducting outer housing formed as a single unit or by butt-joining multiple aluminum superconducting tubes or aluminum superconducting plates 11. Each aluminum superconducting tube or aluminum superconducting plate 11 has a single or multiple through-passages 2110 running longitudinally therethrough, each sealed at both ends and filled with a working liquid. A plurality of bone-like microgrooves 2111 are formed on the inner wall of each passage 2110. The microgrooves 2111 pass through the passage 2110 in which they are located and allow the working liquid to circulate. A porous structure is formed inside the material. The pores and microgrooves 2111 create capillary action within the passage 2110. Instead of adding copper powder, aluminum powder, aluminum silicon powder, or the like may be added to the passage 2110. An aluminum mesh is then added, and the coolant is added, before sealing. The perforations, microgrooves 2111, and passages 2110 are all manufactured synchronously when the aluminum material is formed into a tubular shape by a processing (extrusion) molding process, and are formed as a capillary structure inside the aluminum superconducting tube or aluminum superconducting plate 11. The groove direction of the microgrooves 2111 and the longitudinal direction of the passages 2110 may be the rotation direction of the impeller (as shown in Figures 36 to 39), or may be installed vertically along the axial direction as shown in Figure 40.

[0096] The heat dissipating plate 212 is one or more sets of thermally conductive fins, and the position, number, and arrangement of the heat dissipating plate are determined according to the cavity space of the fan. The one or more sets of thermally conductive fins may be integrally formed, or may be fixed to the entire heat dissipating plate 212 by welding, crimping, or other fastening mechanisms. Alternatively, one or more sets of thermally conductive fins (e.g., aluminum / copper / graphene or other thermally conductive fins) may be attached to a thermally conductive plate to form the heat dissipating plate 212 as an integral structure. The shape of the heat dissipating plate 212 corresponds to the shape of a volute case, heat pipe, superheat conduction tube, superheat conduction plate, or VC211. In this embodiment, the entire heat dissipating plate 212 is cylindrical or annular and is fitted into the inner wall of a thermally conductive outer housing made of an annular heat pipe, superheat conduction tube, superheat conduction plate, or VC211, and is attached directly or attached to each other using a thermally conductive member to rapidly transfer heat. The side vents may be formed by an air passage between the fins of the heat sink 212, penetrating the outside and the inside of the cavity. The heat sink 212 may be fixed to the outside of the vents by a heat conductive plate, or may be fixed to the inner wall of a heat conductive outer housing made of a heat pipe, a superheat conductive tube, a superheat conductive plate, or VC211 by a fixing member. Furthermore, the fins at the side vents are disconnected from the heat pipe, the superheat conductive tube, the superheat conductive plate, or VC211, forming a passage connecting the fan cavity to the outside. In this embodiment, the top heat sink is the upper housing of the fan, and the heat sink forms an air passage together with the bottom housing and impeller group of the fan, and the top is open to form the air passage without the need for a separate upper housing of the fan.

[0097] The secondary semiconductor cooling member 10 includes a middle electric double layer and high-temperature (heat dissipation) and low-temperature surfaces at both ends. The high-temperature surface of the secondary semiconductor cooling member is connected to the heat pipe, superheat conduction tube, superheat conduction plate, or VC211 for rapid heat transfer. The heat dissipation surface of the secondary semiconductor cooling member 10 is bonded to the heat pipe, superheat conduction tube, superheat conduction plate, or VC211 for heat transfer through contact, or is bonded to the heat pipe, superheat conduction tube, superheat conduction plate, or VC211 for heat transfer through contact. The outer wall of the heat pipe, superheat conduction tube, superheat conduction plate, or VC211 serves as the high-temperature surface of the secondary semiconductor cooling member. A high-temperature end circuit is installed and electrically connected to the electric double layer by welding, forming an internal circuit of the secondary semiconductor cooling member. In this embodiment, the high-temperature surface of the secondary semiconductor cooling member 10 is bonded to the outer wall of the heat pipe, superheat conduction tube, superheat conduction plate, or VC211.

[0098] The impeller 220, drive control circuit board 240, and drive module 250 are mounted on the bottom housing 214 of the fan. The drive module 250 uses a motor. The output shaft of the motor is axially connected to the central shaft 221 of the impeller, and the impeller rotates when the motor is rotated forward or backward.

[0099] 41 and 42 for an alternative embodiment. The secondary semiconductor cooling member 10 is installed on the outer wall of the bottom housing 214 of the fan, for example, by being attached to and in contact with the bottom housing 214. The bottom housing 214 of the fan is a heat-conducting member made of a heat-conducting material, which may be, for example, a metal plate, a heat pipe, VC, or a superconducting plate. The bottom housing 214 of the fan is connected to the heat pipe, superconducting pipe, superconducting plate, or VC 211 on the side for rapid heat transfer.

[0100] 33 to 47, a heat dissipation fan module 200 according to a second embodiment of the present invention is an axial fan module. The fan housing 210 includes a fan housing 210 having a cavity formed therein, an impeller 220 mounted within the cavity, and a secondary semiconductor cooling element 10 mounted within the fan housing. The fan housing 210 includes a side volute case. The entire volute case is made up of a heat pipe, a superheat conduction tube, a superheat conduction plate, or a VC 211. The heat pipe, the superheat conduction tube, the superheat conduction plate, or the VC 211 is installed in the volute case, which is the side of the fan housing. More preferably, a heat conduction outer housing is formed on the side of the volute case by a single-passage or multi-passage aluminum superconducting tube or aluminum superconducting plate. A heat dissipation plate 212 is installed on the inner wall of the side. The fins of the heat dissipation plate 212 are arranged in a circular pattern along the diameter direction, and air passages between the fins extend along the axial direction. Within the cavity, fins are arranged around the top heat sink 212 above the impeller 220, and fins are arranged around the bottom heat sink 212 below it, and the air passages of the upper and lower heat sinks are preferably aligned, with vents at the top and bottom of the fan serving as air intake and air exhaust, respectively. The impeller 220 rotates to draw air through the air passage (air intake vent) of the top heat sink and exhaust it axially downward along the air passage (air exhaust vent) of the bottom heat sink 212, and the directions of the air intake and air exhaust may be reversed.

[0101] Similar to the first embodiment, the second embodiment of the heat dissipation fan module 200 has a volute case, which is a side housing, that is a heat conductive outer housing formed by butt-joining a heat pipe, superheat conductive tube, superheat conductive plate, or VC 211 as a whole or in multiple pieces. The heat dissipation plates on the inner wall are connected by welding, crimping, adhesive, or other fastening methods for rapid heat transfer. Preferably, the side volute case is a heat conductive outer housing made of an aluminum superconducting tube or aluminum superconducting plate with a single or multiple passages. Two or more fine microgrooves 2111 are formed on the inner wall of the single or multiple passages 2110 of the aluminum superconducting tube or aluminum superconducting plate. A plurality of micropores are formed in the material within the wall of the microgroove 2111. The groove direction of the passages 2110 and the porous microgrooves 2111 is aligned along the axial direction of the impeller's rotation center, in the same direction as the airflow generated by the rotation of the impeller.

[0102] The secondary semiconductor cooling member 10 is installed on the outer wall of the side heat conduction outer housing, and its heat dissipation surface (high temperature surface) is connected to the side heat pipe, superheat conduction tube, superheat conduction plate or VC211 to rapidly conduct heat, or the heat pipe, superheat conduction tube, superheat conduction plate or VC211 itself serves as the heat dissipation surface (high temperature surface) of the secondary semiconductor cooling member 10, and a high temperature end circuit that is electrically connected and welded to the semiconductor electric double layer is installed on its outer wall.

[0103] A fixing bracket 223 and a snap ring 222 are installed in the cavity and rotated to attach the impeller 220. The fixing bracket 223 is provided with a central shaft of the impeller, and is inserted into the central shaft hole of the impeller 220. The top of the bracket is locked and fixed by the snap ring 222.

[0104] A drive control circuit board 240 and a drive module 250 are installed outside the bottom of the volute case. In this embodiment, the drive module 250 uses a motor, and the output shaft of the motor is axially connected to the central shaft 221 of the impeller, so that the impeller rotates when the motor is rotated forward or backward.

[0105] The heat dissipation fan module 200 of the present invention uses a heat pipe / VC / (aluminum) superheat conduction tube / (aluminum) superheat conduction plate as the fan housing (which may be the side, top cover, bottom cover, or volute case). Its phase transformation thermal conductivity allows it to rapidly conduct heat into the fan cavity, where it dissipates heat through the airflow generated by the rotation of the fan impeller. The present invention effectively utilizes the fan's internal space to make the product more compact, achieve higher heat dissipation efficiency, and more effectively integrate with the application product, thereby reducing the cost of the fan's original housing material. The contact area between the heat dissipation plate and the airflow is increased. For the same heat dissipation needs, the present invention improves heat dissipation efficiency and reduces fan speed, current, noise, etc.

[0106] Another technical feature of the heat dissipation fan module 200 of the present invention is that when used in an application to cool a semiconductor, the heat dissipation surface of the cooling component is directly attached (contacted) to the fan housing (i.e., the thermal conductive component: heat pipe / VC / (aluminum) super thermal conductive tube / (aluminum) super thermal conductive), which effectively shortens the heat transfer distance and accelerates heat transfer, further improving the effectiveness of the application.

[0107] 48 to 54, the heat dissipation fan module 200 of the third embodiment of the present invention may be a waterproof fan, preferably a magnetic fan module, and includes a fan housing 210 having an internal cavity, an impeller 220 mounted in the cavity, and a secondary semiconductor cooling element 10 mounted on the fan housing. The fan housing 210 includes a volute case on the side, an upper housing 215 at the top of the volute case, and a bottom housing 214 at the bottom. The volute case on the side, the upper housing 215 at the top of the volute case, and the bottom housing 214 at the bottom enclose and form a cavity inside the fan. The arc-shaped portion of the volute case is made of a heat pipe, a superheat conduction tube, a superheat conduction plate, or VC 211. More preferably, the volute case on the side of the volute case includes an arc-shaped heat conduction outer housing made of a single-passage or multi-passage aluminum superheat conduction tube or aluminum superheat conduction plate. The heat sink 212 is mounted on the inner wall of the side arc-shaped heat-conducting outer housing, with the fins of the heat sink 212 arranged along a diametrical arc, and the air passages between the fins run radially through. In this embodiment, the fan vent 201 is mounted on the side volute case for air intake and exhaust. The upper and lower housings do not have vents for waterproofing.

[0108] The third embodiment of the heat dissipation fan module 200 is similar to the first and second embodiments. The arc-shaped heat-conducting outer housing of the side volute case is made of a heat pipe, a superheat-conducting tube, a superheat-conducting plate, or VC 211. The entire heat-conducting outer housing is formed by butt-jointing one or more components, and the heat-dissipating plates on the inner wall are connected by welding, crimping, adhesive, or other fastening methods for rapid heat transfer. Preferably, the arc-shaped heat-conducting outer housing of the side volute case is made of a single-passage or multiple-passage aluminum superconducting tube or aluminum superconducting plate. The inner wall of the single or multiple passages 2110 of the aluminum superconducting tube or aluminum superconducting plate is formed with two or more rib-like microgrooves 2111. A plurality of micropores are formed within the wall material of the microgrooves 2111. The groove direction of the passages 2110 and the porous microgrooves 2111 is arranged along an arc radially from the rotation center of the impeller, in the same direction as the airflow generated by the rotation of the impeller.

[0109] The secondary semiconductor cooling member 10 is installed on the outer wall of the side heat conduction outer housing, and its heat dissipation surface (high temperature surface) is connected to the side heat pipe, superheat conduction tube, superheat conduction plate, or VC211 for rapid heat transfer, or the heat pipe, superheat conduction tube, superheat conduction plate, or VC211 itself serves as the heat dissipation surface (high temperature surface) of the secondary semiconductor cooling member 10, and a high-temperature end circuit that is electrically connected and welded to the semiconductor electric double layer is installed on its outer wall. Alternatively, the secondary semiconductor cooling member 10 is installed on the top housing 215 or bottom housing 214, and the top housing 215 or bottom housing 214 is connected to the arc-shaped heat conduction outer housing for rapid heat transfer. The high temperature surface of the secondary semiconductor cooling member is installed in contact with and bonded to the fan housing.

[0110] The impeller 220 is located within the cavity and attached to the bottom housing 214. An axial hole is provided in the center of the impeller 220. A sleeve 229 is fixedly installed within the axial hole. A convex ring is formed on the inner wall of the sleeve 229. An upper bearing 228 and a lower bearing 226 are installed within the sleeve 229 and are located above and below the convex ring, respectively. A magnetic ring is fitted within the impeller 220; specifically, an annular chamber is formed outside the sleeve 229. The magnetic ring is fitted onto the inner wall of the outer ring of the annular chamber inside the impeller and fixed to the impeller 220.

[0111] The bottom housing 214 is provided with a central shaft 221 for the impeller. A hollow annular boss is formed in the bottom housing. A central shaft is attached to the center of the boss and is elastically locked to the bottom of the central shaft 221 by a spring 227. The central shaft 221 is inserted into a sleeve in the central shaft hole of the impeller 220 and engages with a bearing and a convex ring. A locking groove is formed at the top of the central shaft 221 and is locked by a snap ring 222 to prevent it from coming loose. The top of the hollow annular boss of the bottom housing 214 is inserted into the annular chamber inside the impeller 220. A drive module 250 is attached to the bottom housing 214 and installed in the hollow cavity defined by the hollow annular boss. A drive control circuit board 240 is located outside the bottom housing 214. In this embodiment, the drive control circuit board 240 and drive module 250 are installed outside the bottom of the volute case. The drive module 250 includes a motor stator winding 251. When energized, the drive module generates a magnetic field, causing the fan impeller 220 to rotate. The drive module 250, drive control circuit board 240, and fan impeller 220 are respectively located inside and outside the fan bottom housing 214. Therefore, the drive module 250 and drive control circuit board 240 are not affected when water is sucked into or supplied to the fan. In this embodiment, the drive module 250 and drive control circuit board 240 are separated from the fan module. The drive control circuit board 240 is located outside the fan housing 210 to achieve waterproofing. When wind passes through the air passage, water does not affect the drive control circuit board 240. When applied to a product, a sealing ring may be installed in the ventilation hole of this embodiment. This provides waterproofing between the product and the fan module 200.

[0112] In the above embodiments, the term "cooling conduction" may be interpreted as meaning the same as "heat conduction," "heat transfer," or "heat conduction," and may be used interchangeably. The symbol " / " represents "or."

[0113] It should be understood that the directional terms used in the above-described embodiments, such as "upper," "lower," "top," "bottom," "left," "right," "vertical," "horizontal," "lateral," "front," and "rear," refer to the relative positions of components shown in the drawings and are not intended to limit absolute geographical orientations.

[0114] The technical features of each of the above embodiments can be combined, transformed, or substituted to obtain different embodiments, and all of these embodiments belong to the disclosure scope of the embodiments of the present invention. Some common or similar structures in the above embodiments are described in some embodiments but not in other embodiments, and these common or similar structures can also be applied to these embodiments, and all of these belong to the disclosure scope of the embodiments of the present invention.

[0115] In the present invention, unless otherwise clearly specified or limited, terms such as "attached," "coupled," "connected," and "fixed" should be understood to have a broad meaning, and may refer to, for example, fixed connection, detachable connection, or integral connection, mechanical connection, electrical connection or connection capable of transmitting data, direct connection, indirect connection via an intermediate medium, internal communication between two modules, or a mutual interaction relationship between two modules. Those skilled in the art will be able to understand the meaning of the above terms in the present invention according to specific cases.

[0116] Although the embodiments of the present invention have been illustrated and described, those skilled in the art will recognize that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention, all of which fall within the scope of the present invention, which is understood to be defined by the appended claims and their equivalents.

Claims

1. 1. A two-stage cooling module including a primary semiconductor cooling element, further comprising a secondary semiconductor cooling member and a cooling conduction member; The primary semiconductor cooling element and the secondary semiconductor cooling element each include an electric double layer in the middle and a high-temperature surface and a low-temperature surface at both ends; the cooling conduction member is coupled between the primary semiconductor cooling member and the secondary semiconductor cooling member for rapid cooling conduction; the cooling conduction member is a heat transfer structural member, the ends of the cooling conduction member are connected to the hot surface of the primary semiconductor cooling member and the cold surface of the secondary semiconductor cooling member, respectively, for rapid heat transfer; the heat transfer structural member is one or a combination of a plurality of members selected from a heat transfer member made of a heat conductive material, a heat pipe, a vapor chamber, a super heat conduction pipe, and a super heat conduction plate; the superconducting heat tube is an aluminum superconducting tube; the superconducting plate is an aluminum superconducting plate; Both ends of the aluminum superconducting plate or aluminum superconducting tube are sealed, and a working liquid is sealed inside; When the aluminum material is formed, two or more fine grooves are formed on the inner wall of the aluminum superconducting plate or aluminum superconducting tube, A two-stage cooling module, characterized in that a microporous structure is formed in said aluminum superconducting plate or aluminum superconducting tube material when said aluminum material is formed.

2. The two-stage cooling module includes a heat conduction structure and a heat dissipation piece; the heat conduction structure is one or a combination of a plurality of heat conduction members made of a heat conduction material, a heat pipe, a vapor chamber, a super heat conduction pipe, and a super heat conduction plate; The heat-conducting structure is connected to the heat-dissipating piece for rapid heat transfer; The heat conduction structure is connected to the high temperature surface of the secondary semiconductor cooling member so as to rapidly transfer heat, or a high temperature end circuit of the secondary semiconductor cooling member is installed in the heat conduction structure and is welded and electrically connected to the electric double layer of the secondary semiconductor cooling member, so that the heat conduction structure serves as the high temperature surface of the secondary semiconductor cooling member; the two-stage cooling module further includes a fan; the fan includes a housing and an impeller within the housing; 2. The two-stage cooling module according to claim 1, wherein the heat conducting structure and / or heat dissipating piece is installed at the air outlet of the fan or is a part of the fan housing.

3. the heat-conducting structure includes a plurality of aluminum superconducting plates or aluminum superconducting tubes; The aluminum superconducting plate or aluminum superconducting tube is a single tube unit, and a single passage is formed therein; The aluminum superconducting plate or aluminum superconducting tube can be flat-bent or specially shaped 3D-bent to fit the installation space. the heat conduction structure further includes a heat conduction plate; The plurality of aluminum superconducting plates or aluminum superconducting tubes are fitted to a heat conductive plate; The plurality of aluminum superconducting plates or aluminum superconducting tubes are arranged to include at least two different directions or angles, thereby suppressing the drawback that the heat conduction effect is reduced due to the effect of the anti-gravity direction; The heat dissipation piece includes one or more sets of thermally conductive fins; 3. The two-stage cooling module of claim 2, wherein the heat conduction plate is installed in the groove of the heat dissipation plate or on the top of the heat dissipation plate, or the heat dissipation plate and the heat conduction plate are installed on another heat conduction member.

4. The heat conduction plate is provided with a plurality of opening grooves; the plurality of aluminum superconducting plates or aluminum superconducting tubes are fitted into the plurality of opening grooves and correspondingly attached thereto, and their wall surfaces come into contact with each other to accelerate heat transfer; The aluminum superconducting plate or aluminum superconducting tube is welded or caulked to the opening groove to increase the contact area; The secondary semiconductor cooling member is mounted on a heat conduction plate; The high temperature surface of the secondary semiconductor cooling element is attached to the outer wall of the heat conduction plate by pasting it, so that the heat of the high temperature surface is directly conducted to the heat conduction plate; or the high temperature surface of the secondary semiconductor cooling element is attached to the outer wall of the heat conduction plate by a heat conduction member, so that the heat of the high temperature surface is rapidly conducted to the heat conduction plate by the heat conduction member; or the heat conduction plate functions as the high temperature surface, and the high temperature end circuit of the secondary semiconductor cooling element is installed on it, and is welded and electrically connected to the PN galvanic particles of the electric double layer; 4. The two-stage cooling module of claim 3, wherein the plurality of aluminum superconducting plates or aluminum superconducting tubes are designed in a circular, staggered, or circulating manner, in a form of crossing at two different directions or angles, or at a fixed angle in the XY plane.

5. 1. A two-stage cooling module including a primary semiconductor cooling element, further comprising a secondary semiconductor cooling member and a cooling conduction member; The primary semiconductor cooling element and the secondary semiconductor cooling element each include an electric double layer in the middle and a high-temperature surface and a low-temperature surface at both ends; the cooling conduction member is coupled between the primary semiconductor cooling member and the secondary semiconductor cooling member for rapid cooling conduction; the cooling conduction member is a heat transfer structural member, the secondary semiconductor cooling member dissipates heat by a heat dissipation fan module; The heat-dissipating fan module includes a fan housing and an impeller; The interior of the fan housing is a cavity, The impeller is mounted within a cavity; The fan housing is provided with a plurality of ventilation openings, The cavity communicates with a gas passage outside the fan through a ventilation hole; At least a portion of the fan housing is made of a thermally conductive outer housing, the heat conductive outer housing is formed as a single unit or by butt-joining a plurality of units selected from a heat conductive member, a heat pipe, a vapor chamber, a superheat conductive tube, and a superheat conductive plate made of a heat conductive material; a high-temperature surface of the secondary semiconductor cooling member connected to the heat-conducting outer housing for heat transfer; or a high-temperature end circuit of the secondary semiconductor cooling member installed in the heat-conducting outer housing and welded and electrically connected to the electric double layer of the secondary semiconductor cooling member, thereby allowing the heat-conducting outer housing to serve as the high-temperature surface of the secondary semiconductor cooling member.

6. the superconducting heat tube is an aluminum superconducting tube; the superconducting plate is an aluminum superconducting plate; The heat-dissipating fan module includes a heat-dissipating piece; the heat dissipation piece is connected to the heat conductive outer housing for rapid heat transfer; The air passage of the heat sink communicates with the fan vent and the cavity; The two-stage cooling module of claim 5 , wherein a side housing of a fan housing includes the heat-conducting outer housing.

7. The side housing of the fan housing includes the heat-conducting outer housing made of a single-passage or multi-passage aluminum superconducting tube or aluminum superconducting plate; The heat dissipation piece is installed on the inner wall of the side housing of the fan housing, The two-stage cooling module according to claim 6, wherein the airflow direction of the heat dissipating plate is the rotation direction or axial direction of the impeller.

8. Including aircraft in which multiple ventilation openings are installed, A light source module, a power supply module and a control circuit board are installed inside the body; the light source module and the power supply module are electrically connected to the control circuit board; The plurality of ventilation openings of the fuselage form a ventilation passage together with the space within the fuselage as air intakes and air exhausts, The front end of the body is a photonic beauty device that is a working surface, a two-stage cooling module including a primary semiconductor cooling element, a secondary semiconductor cooling element, and a cooling conduction element is further installed in the fuselage; The primary semiconductor cooling element and the secondary semiconductor cooling element each include an electric double layer in the middle and a high-temperature surface and a low-temperature surface at both ends; the cooling conduction member is coupled between the primary semiconductor cooling member and the secondary semiconductor cooling member for rapid cooling conduction; the cooling conduction member is a heat transfer structural member, the ends of the cooling conduction member are connected to the hot surface of the primary semiconductor cooling member and the cold surface of the secondary semiconductor cooling member, respectively, for rapid heat transfer; the heat transfer structural member is one or a combination of a plurality of members selected from a heat transfer member made of a heat conductive material, a heat pipe, a vapor chamber, a super heat conduction pipe, and a super heat conduction plate; the superconducting heat tube is an aluminum superconducting tube; the superconducting plate is an aluminum superconducting plate; Both ends of the aluminum superconducting plate or aluminum superconducting tube are sealed, and a working liquid is sealed inside; When the aluminum material is formed, two or more fine grooves are formed on the inner wall of the aluminum superconducting plate or aluminum superconducting tube, When the aluminum material is formed, a microporous structure is formed in the aluminum superconducting plate or aluminum superconducting tube material, The photonic beauty device is characterized in that the primary semiconductor cooling member serves as the work surface as it is, or cools the work surface.

9. When the primary semiconductor cooling member is used as a working surface, the transparent crystal is used as a low-temperature surface, and the low-temperature surface is used as a working surface; a light-transmitting window is provided on the high-temperature surface and the electric double layer of the primary semiconductor cooling member, so that the primary semiconductor cooling member has light transmittance; or the low-temperature surface, the high-temperature surface and the electric double layer of the primary semiconductor cooling member jointly define a light-transmitting window, so that photonics generated in the light source module are transmitted through the light-transmitting window to the outside of the working surface; 9. The photonic cosmetic device according to claim 8, wherein when the primary semiconductor cooling member cools the working surface, the low-temperature surface of the primary semiconductor cooling member contacts the working surface to transfer heat, or the low-temperature surface of the primary semiconductor cooling member is connected to the working surface by a heat transfer structural member to rapidly transfer heat to the working surface.

10. The two-stage cooling module includes a fan and is located in an air passage within the aircraft body; The light source module includes a lamp tube and a light reflector cup; the ventilation passage inside the light reflecting cup communicates with the ventilation passage of the fan and also communicates with the ventilation passage inside the machine body to form a heat dissipation ventilation passage for the light source module, and the fan promotes heat dissipation from the light source module; A heat sink or a heat conductive member is provided on one side of the light reflecting cup; The fan housing has multiple ventilation holes, a heat dissipation piece or a heat conduction member of the light reflecting cup is attached to one of the ventilation holes, and a first ventilation path is formed by connecting the ventilation path of the fan to a ventilation passage in the machine body to dissipate heat from the light reflecting cup; Another ventilation port of the fan communicates with the air passage inside the light reflecting cup, and the air passage of the fan communicates with the ventilation passage inside the machine body, forming a second ventilation passage for dissipating heat from the light reflecting cup and the lamp tube; The photonic beauty device according to claim 8, wherein the photonic beauty device is a hair removal device, a photonic skin regeneration device, an import / export beauty device, or a high frequency beauty device.

11. Including aircraft in which multiple ventilation openings are installed, A light source module, a power supply module and a control circuit board are installed inside the body; the light source module and the power supply module are electrically connected to the control circuit board; The plurality of ventilation openings of the fuselage form a ventilation passage together with the space inside the fuselage as air intakes and air exhausts, The front end of the body is a photonic beauty device that is a working surface, a two-stage cooling module including a primary semiconductor cooling element, a secondary semiconductor cooling element, and a cooling conduction element is further installed in the fuselage; The primary semiconductor cooling element and the secondary semiconductor cooling element each include an electric double layer in the middle and a high-temperature surface and a low-temperature surface at both ends; the cooling conduction member is coupled between the primary semiconductor cooling member and the secondary semiconductor cooling member for rapid cooling conduction; the cooling conduction member is a heat transfer structural member, the secondary semiconductor cooling member dissipates heat by a heat dissipation fan module; The heat-dissipating fan module includes a fan housing and an impeller; The interior of the fan housing is a cavity, an impeller mounted within the cavity; The fan housing is provided with a plurality of ventilation openings, The cavity communicates with a gas passage outside the fan through a ventilation hole; At least a portion of the fan housing is made of a thermally conductive outer housing, the heat conductive outer housing is formed as a single unit or by butt-joining a plurality of units selected from a heat conductive member, a heat pipe, a vapor chamber, a superheat conductive tube, and a superheat conductive plate made of a heat conductive material; The photonic beauty device is characterized in that the high-temperature surface of the secondary semiconductor cooling member is connected to the heat-conducting outer housing so as to transfer heat to the secondary semiconductor cooling member, or a high-temperature end circuit of the secondary semiconductor cooling member is installed in the heat-conducting outer housing and is welded and electrically connected to the electric double layer of the secondary semiconductor cooling member, thereby making the heat-conducting outer housing the high-temperature surface of the secondary semiconductor cooling member.

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