Contactless communication media

Abstract

A non-contact communication medium (100) according to the present disclosure comprises an electronic component (1), a housing (3), a lid (4), and a fixture (5). The electronic component (1) performs non-contact communication. The housing (4) has an opening (33) through which the electronic component (1) can be inserted, and a position that opposes the opening (33) is closed. The lid (4) has a higher radio wave transparency than the lid (3) and covers the opening (33). The fixture (5) fixes the lid (4) to the housing (3) while exposing a part of the lid (4).

Description

[Technical Field]

[0001] The present disclosure relates to contactless communication media. [Background technology]

[0002] Conventionally, goods are managed using RFID (Radio Frequency Identifier) tags and the like.

[0003] Patent Document 1 discloses a housing made of a metal case filled with a heat insulating material that covers an RFID tag, in order to enable the RFID tag to be used in high-temperature environments such as hot-dip galvanizing processes.

[0004] The metal case has a cylindrical shape with both ends open. One of the two openings in the metal case is closed by a metal lid. The metal lid is detachable from the metal case and is removed when replacing the internal insulation. The other opening of the metal case exposes the internal insulation so that contactless communication (transmission and reception of radio waves) between the RFID tag and the outside is not impeded. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-35693 Summary of the Invention

[0006] A contactless communication medium according to one aspect of the present disclosure includes an electronic component, a housing, a lid, and a fixing device. The electronic component performs contactless communication. The housing has an opening through which the electronic component can be inserted, and a position opposite the opening is blocked. The lid has higher radio wave transparency than the housing and covers the opening. The fixing device fixes the lid to the housing while leaving a portion of the lid exposed. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic cross-sectional view of a contactless communication medium according to an embodiment. [Figure 2] FIG. 2 is a schematic cross-sectional view of a housing according to the embodiment. [Figure 3] FIG. 3 is a schematic plan view of the housing according to the embodiment. [Figure 4] FIG. 4 is a schematic cross-sectional view of a fixture according to an embodiment. [Figure 5] FIG. 5 is a schematic bottom view of the fixture according to the embodiment. [Figure 6] FIG. 6 is a schematic enlarged view showing an example of the VI portion shown in FIG. [Figure 7] FIG. 7 is a schematic enlarged view showing another example of the VI portion shown in FIG. [Figure 8] FIG. 8 is a schematic enlarged cross-sectional view of a non-contact communication medium according to a first modified example. [Figure 9] FIG. 9 is a schematic enlarged cross-sectional view of a non-contact communication medium according to a second modification. [Figure 10] FIG. 10 is a schematic enlarged cross-sectional view of a non-contact communication medium according to a third modified example. [Figure 11] FIG. 11 is a schematic enlarged cross-sectional view of a non-contact communication medium according to a fourth modified example. [Figure 12] FIG. 12 is a schematic enlarged cross-sectional view of a non-contact communication medium according to a fifth modified example. [Figure 13] FIG. 13 is a schematic enlarged cross-sectional view of a non-contact communication medium according to a sixth modified example. [Figure 14] FIG. 14 is a schematic enlarged cross-sectional view of a non-contact communication medium according to a seventh modification. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, a form for implementing a contactless communication medium according to the present disclosure (hereinafter referred to as an "embodiment") will be described in detail with reference to the drawings. Note that the contactless communication medium according to the present disclosure is not limited to this embodiment. Furthermore, each embodiment can be appropriately combined within a range that does not cause contradiction in processing content. Furthermore, the same components in each of the following embodiments will be given the same reference numerals, and duplicated explanations will be omitted.

[0009] Furthermore, in the following embodiments, expressions such as "constant," "orthogonal," "perpendicular," or "parallel" may be used, but these expressions do not necessarily mean "constant," "orthogonal," "perpendicular," or "parallel" in the strict sense. In other words, the above expressions allow for deviations due to, for example, manufacturing precision, installation precision, etc.

[0010] The drawings referred to below are schematic diagrams for the convenience of explanation, and therefore some details may be omitted and the dimensional proportions may not necessarily correspond to those of the actual objects.

[0011] In addition, in the drawings referred to below, for ease of understanding, an orthogonal coordinate system may be shown in which the X-axis, Y-axis, and Z-axis directions are defined as being perpendicular to each other, and the positive Z-axis direction is the vertically upward direction.

[0012] The above-mentioned conventional techniques have room for further improvement in terms of preventing the intrusion of liquid or gas from the outside. Therefore, it is desired to provide a non-contact communication medium that can prevent the intrusion of liquid or gas from the outside.

[0013] <Overall configuration of contactless communication media> First, the overall configuration of the non-contact communication medium according to the embodiment will be described with reference to Fig. 1. Fig. 1 is a schematic cross-sectional view of the non-contact communication medium according to the embodiment.

[0014] 1, a contactless communication medium 100 according to an embodiment includes an electronic component 1, a housing 3, a cover 4, and a fixing device 5. The electronic component 1 is housed inside the housing 3. The electronic component 1 may be surrounded by a heat insulating material 6, for example.

[0015] The electronic component 1 may be, for example, an RFID tag. The electronic component 1 as RFID has, on a substrate made of, for example, LTCC (Low Temperature Co-fired Ceramics), an antenna for contactless communication, an IC chip that performs contactless communication via the antenna, and a memory that stores identification information. The electronic component 1 as RFID can transmit the identification information stored in the memory to an external device (for example, an RFID reader) by contactless communication using electromagnetic induction, radio waves, or the like.

[0016] As an example, the non-contact communication medium 100 according to the embodiment is used in a high-temperature environment that exceeds the heat-resistant temperature of the electronic component 1. For example, the non-contact communication medium 100 according to the embodiment is attached to a component to be plated, and is immersed together with the component in a plating solution. The temperature of the plating solution, such as hot-dip galvanizing, is, for example, 75°C to 500°C.

[0017] Furthermore, the non-contact communication medium 100 according to the embodiment may be treated with acidic or alkaline chemicals together with the electronic component 1. In this manner, the non-contact communication medium 100 according to the embodiment may be used in an acidic or alkaline environment that exceeds the chemical resistance of the electronic component 1.

[0018] Therefore, the contactless communication medium 100 according to the embodiment may have a heat insulating material 6 that protects the electronic component 1 from a high-temperature environment and an acidic / alkaline environment, and a protector 2 having a storage space 25. The electronic component 1 may be located in the storage space 25 of the protector 2 having the storage space 25. Note that a heat insulating material may also be disposed in the storage space 25.

[0019] If the protective body 2 made of ceramic or heat-resistant resin has issues with durability when used repeatedly, the non-contact communication medium 100 of the embodiment may seal the protective body 2 using a housing 3, a lid 4 and a fixing device 5.

[0020] The protector 2 may have a first substrate 21, a second substrate 22, and an adhesive layer 23. The first substrate 21 and the second substrate 22 may be bonded together via the adhesive layer 23.

[0021] The first substrate 21 and the second substrate 22 may have, for example, a cylindrical shape. Specifically, the first substrate 21 and the second substrate 22 may have two flat surfaces (upper end surface and lower end surface) that are circular in plan view, and may also have a curved surface (outer peripheral surface) connecting these two flat surfaces. The upper end surface of the first substrate 21 and the lower end surface of the second substrate 22 may face each other with approximately the same diameter, and the adhesive layer 23 may be located between them.

[0022] The first substrate 21 may have an accommodating recess 251 that accommodates the electronic component 1. The accommodating recess 251 may be open at the center of the upper end surface of the first substrate 21. For example, the first substrate 21 and the second substrate 22 are joined together via the adhesive layer 23 to close the accommodating recess 251, thereby forming the accommodating space 25.

[0023] The first substrate 21 and the second substrate 22 may be made of, for example, ceramics. For example, cordierite can be used as the ceramic forming the first substrate 21 and the second substrate 22. Cordierite has a small thermal expansion coefficient and therefore excellent thermal shock resistance, and also has low thermal conductivity and therefore does not easily transfer heat to the electronic component 1. In this way, by using cordierite, the electronic component 1 can be appropriately protected from high-temperature environments.

[0024] The adhesive layer 23 may be located between the upper end surface of the first substrate 21 and the lower end surface of the second substrate 22, and may bond the first substrate 21 and the second substrate 22. The adhesive layer 23 only needs to have heat resistance that can withstand the usage environment of the non-contact communication medium 100. For example, an inorganic adhesive can be used as such an adhesive layer 23.

[0025] The ceramics constituting the first substrate 21 and the second substrate 22 do not necessarily have to be cordierite. For example, the ceramics constituting the first substrate 21 and the second substrate 22 may be Al2O3 (alumina), Si3N4 (silicon nitride), SiC (silicon carbide), or Al2TiO5 (aluminum titanate). Furthermore, the ceramics constituting the first substrate 21 and the second substrate 22 may be crystallized glass such as Li2O-Al2O3-SiO2.

[0026] Furthermore, the first substrate 21 and the second substrate 22 do not necessarily need to be made of ceramics. For example, the first substrate 21 and the second substrate 22 may be made of a heat-resistant resin. Examples of the heat-resistant resin that can be used to form the first substrate 21 and the second substrate 22 include PEEK (polyether ether ketone), PBO (polyparaphenylene benzobisoxazole), and PBI (polybenzimidazole). The first substrate 21 and the second substrate 22 only need to be heat-resistant and radio wave-transmitting.

[0027] The configuration of the protective body 2 is not limited to that shown in the figure, and any configuration may be used as long as it is made of a heat-resistant and radio wave-transmitting material and has an internal space for accommodating the electronic component 1. The protective body 2 may also be a cylindrical body without a bottom or lid. In this case, the electronic component 1 may be wrapped in, for example, rock wool and fixed inside the protective body 2.

[0028] <About the case> Fig. 2 is a schematic cross-sectional view of the housing 3 according to the embodiment, and Fig. 3 is a schematic plan view of the housing 3 according to the embodiment.

[0029] 2 and 3, the housing 3 is a cylindrical member with a bottom. Specifically, the housing 3 may have a bottom 31 that is circular in plan view, and a side wall 32 that extends from the peripheral edge of the bottom 31 perpendicularly to the bottom 31 (vertically upward in FIG. 2). The side wall 32 may have an annular shape in plan view. That is, the side wall 32 may have an outer peripheral surface 321 that is circular in plan view, and an inner peripheral surface 322 that is circular in plan view. An upper end surface 323 of the side wall 32 may be, for example, a flat surface.

[0030] The housing 3 has an opening 33 on the upper end side, i.e., on the side opposite to the bottom 31. The opening 33 may be circular in plan view and may be able to receive the electronic component 1. Furthermore, when the electronic component 1 is housed in the protective body 2, the housing 3 may have a size that allows the protective body 2 to be inserted therethrough. Furthermore, the housing 3 may have a flange (not shown) located on the upper side of the housing 3, outside the side wall portion 32.

[0031] In this manner, the housing 3 has the opening 33 through which the electronic component 1 can be inserted, and the position opposite the opening 33 is closed by the bottom portion 31 .

[0032] The housing 3 may be made of, for example, metal. A housing 3 made of metal has better thermal shock resistance than a ceramic housing. Examples of metals that can be used to form the housing 3 include stainless steel and titanium. Stainless steel and titanium are suitable for use in plating processes because plating does not easily adhere to them.

[0033] As shown in Fig. 1, a protective body 2 and a heat insulating material 6 may be located inside a housing 3. The heat insulating material 6 may be filled between the protective body 2 and the housing 3. The heat insulating material 6 has heat resistance and radio wave transmittance. Examples of such heat insulating material 6 that may be used include rock wool, glass wool, PBO, PBI, cellulose fiber, and ceramic powder.

[0034] <About the lid> The lid 4 is a member that covers the opening 33 of the housing 3, and may be detachable from the housing 3. The lid 4 may be a plate-like member that is circular in plan view. The outer diameter of the lid 4 may be larger than the inner diameter of the housing 3 and smaller than the outer diameter of the housing 3. In the example shown in FIG. 1, the outer periphery of the lid 4 abuts against the upper end surface 323 of the housing 3 (see FIG. 2).

[0035] The lid 4 has higher radio wave transmittance than the housing 3. The lid 4 can be formed of ceramics or heat-resistant resin, for example, similar to the first base material 21 and the second base material 22. As the ceramics forming the lid 4, for example, cordierite, Al2O3, Si3N4, SiC, Al2TiO5, Li2O-Al2O3-SiO2, etc. may be used. Furthermore, as the heat-resistant resin forming the lid 4, for example, PEEK, PBO, PBI, etc. may be used.

[0036] <About the fixings> Fixing device 5 is a member that fixes lid body 4 to housing 3. Fixing device 5 has exposure opening 512 that exposes a portion of lid body 4 so as not to interfere with non-contact communication between electronic component 1 and the outside (see FIG. 1 ). Non-contact communication between electronic component 1 and the outside is performed through this exposure opening 512. Protector 2, heat insulating material 6, and lid body 4, which are positioned between electronic component 1 and exposure opening 512, are all radio wave transparent and do not interfere with non-contact communication between electronic component 1 and the outside.

[0037] The fixture 5 may be made of, for example, a metal. The metal constituting the fixture 5 may be, for example, stainless steel, titanium, or the like.

[0038] Next, a specific configuration of fixture 5 will be described with reference to Figures 4 and 5. Figure 4 is a schematic cross-sectional view of fixture 5 according to the embodiment. Figure 5 is a schematic bottom view of fixture 5 according to the embodiment.

[0039] 4 and 5, fixture 5 according to the embodiment may be a cap-shaped member that covers the top of housing 3. Specifically, fixture 5 may have a ceiling portion 51 that is circular in plan view, and a cylindrical side wall portion 52 that extends perpendicularly to ceiling portion 51 from the periphery of ceiling portion 51 (vertically downward in FIG. 4). Fixing device 5 may also be disk-shaped with exposure opening 512, without side wall portion 52. When fixture 5 is disk-shaped, for example, the flange of housing 3 described above and fixture 5 may be arranged so as to overlap one above the other.

[0040] The ceiling portion 51 has a ceiling surface 511 facing the lid 4. The above-mentioned exposure opening 512 may be located in the center of the ceiling portion 51. The side wall portion 52 has an inner peripheral surface 521 that abuts against the outer peripheral surface 321 of the housing 3.

[0041] <How to fix the lid> Next, an example of a method for fixing the lid 4 using the fixing device 5 will be described with reference to Fig. 6. Fig. 6 is a schematic enlarged view showing an example of the VI portion shown in Fig. 1.

[0042] 6, the housing 3 may have a spiral first groove 325 on the outer peripheral surface 321 of the side wall 32. Furthermore, the fixing device 5 may have a spiral second groove 523 on the inner peripheral surface 521 of the side wall 32, which threadably engages with the first groove 325 of the housing 3. In this case, the fixing device 5 is fixed to the housing 3 by threading the first groove 325 and the second groove 523. Accordingly, the cover 4, which is located between the housing 3 and the fixing device 5, is fixed to the housing 3 by being sandwiched between the housing 3 and the fixing device 5.

[0043] In this way, when the housing 3 and the fixing device 5 are fixed by screwing, the fixing device 5 can be removed from the housing 3. Therefore, if the fixing device 5, for example, of the housing 3 and the fixing device 5, is damaged, the fixing device 5 can be replaced with a new one, allowing the undamaged housing 3 to continue to be used. The same applies if the housing 3 is damaged. Furthermore, it is also possible to replace not only the housing 3 and the fixing device 5, but also the protector 2, the lid 4, and the heat insulating material 6.

[0044] Fig. 7 is a schematic enlarged view showing another example of section VI shown in Fig. 1. As shown in Fig. 7, inner peripheral surface 521 of side wall portion 52 of fixture 5 may be inclined at a first inclination angle θ1 with respect to a direction (vertically downward in Fig. 7) in which ceiling surface 511 of ceiling portion 51 approaches lid 4. Furthermore, outer peripheral surface 321 of housing 3 may be inclined at a second inclination angle θ2 larger than the first inclination angle θ1 with respect to a direction in which ceiling surface 511 of ceiling portion 51 approaches lid 4.

[0045] In this case, by press-fitting fixture 5 into housing 3, outer peripheral surface 321 of housing 3 and inner peripheral surface 521 of fixture 5 are plastically deformed, and housing 3 and fixture 5 are physically integrated. This fixes fixture 5 to housing 3. Accordingly, cover 4, which is located between housing 3 and fixture 5, is fixed to housing 3 by being sandwiched between housing 3 and fixture 5.

[0046] With this configuration, the cover 4 can be fixed to the housing 3 with a relatively simple structure.

[0047] As described above, the non-contact communication medium 100 according to the embodiment has a cylindrical housing 3 with a bottom. In other words, the housing 3 according to the embodiment has a single opening 33. Such a housing 3 has fewer points through which liquid or gas can enter, compared to a housing 3 that is open at both ends, such as the metal case described in Patent Document 1. Therefore, the non-contact communication medium 100 according to the embodiment can prevent liquid or gas from entering the housing 3 from the outside. Furthermore, by providing the exposure opening 512 in the fixing device 5, the cover 4 can be fixed to the housing 3 while enabling transmission and reception of radio waves between the electronic component 1 and the outside via the cover 4.

[0048] <Manufacturing method> Next, an example of a manufacturing method for the non-contact communication medium 100 according to the embodiment will be described. Here, an example will be described in which the first base material 21, the second base material 22, and the lid body 4 are made of ceramics. Also, here, the description will be given assuming that the housing 3 and the fixing device 5 made of metal are obtained in advance.

[0049] First, cordierite powder and sintering aid powder are prepared. Examples of sintering aids include rare earth oxides (yttrium oxide, cerium oxide, etc.), alkali metal oxides (lithium oxide, sodium oxide, etc.), and alkaline earth metals (calcium oxide). Instead of cordierite powder, a mixture of magnesium oxide, aluminum oxide, and silicon oxide in the desired cordierite composition ratio may also be used. Next, the prepared powder is placed in a vibration mill together with water as a solvent, and pulverized and mixed to obtain the raw material.

[0050] Next, organic components such as binders, plasticizers, and release agents are added to the raw materials obtained by grinding and mixing, and then these are stirred to produce a slurry.The slurry is then spray-dried using a spray dryer to produce ceramic granules.

[0051] Next, the produced ceramic granules are subjected to powder press molding to obtain the molded bodies of the first substrate 21, the second substrate 22 and the lid 4.

[0052] Next, the molded body is degreased by heat treating it in an air atmosphere, a vacuum atmosphere, or a nitrogen gas atmosphere, and then the molded body is fired to obtain the first substrate 21, the second substrate 22, and the lid body 4.

[0053] Next, after the electronic component 1 is accommodated in the accommodation recess 251, the first base material 21 and the second base material 22 are joined together using an adhesive.

[0054] Next, the protector 2 is placed inside the housing 3, and the insulating material 6 is filled in. At this time, it is preferable to fill the insulating material 6 so that the protector 2 and the housing 3 do not come into direct contact with each other. For example, first, about 1 / 3 to 1 / 2 of the inside of the housing 3 is filled with the insulating material 6, and then the protector 2 is placed in the center inside the housing 3, and the remaining gap is filled with the insulating material 6. In this way, by preventing the protector 2 and the housing 3 from coming into direct contact with each other, heat transfer to the electronic component 1 can be more reliably suppressed.

[0055] Next, the lid 4 is placed on the top surface 323 of the housing 3, thereby closing the opening 33 of the housing 3 with the lid 4. Then, the lid 4 is fixed to the housing 3 with the fixing device 5. For example, in the configuration shown in FIG. 6, the lid 4 is fixed to the housing 3 by screwing the second groove portion 523 of the fixing device 5 into the first groove portion 325 of the housing 3. Also, in the configuration shown in FIG. 7, the lid 4 is fixed to the housing 3 by press-fitting the fixing device 5 into the housing 3. In this way, the contactless communication medium 100 is obtained.

[0056] <First Modification> Fig. 8 is a schematic enlarged cross-sectional view of a non-contact communication medium 100 according to a first modification. As shown in Fig. 8, the non-contact communication medium 100 may have a first sealing portion 101 between the ceiling surface 511 of the fixture 5 and the upper surface 41 of the lid 4. The first sealing portion 101 may be made of, for example, glass paste, brazing material, or heat-resistant resin.

[0057] The first sealing portion 101 is located around the entire periphery of the opening 33. That is, the first sealing portion 101 seals the gap between the ceiling surface 511 of the fixture 5 and the upper surface 41 of the lid 4 around the entire periphery of the opening 33.

[0058] In this way, by sealing the gap between the ceiling surface 511 of the fixing device 5 and the upper surface 41 of the lid body 4, which may be a point of entry for liquid or gas, with the first sealing portion 101, it is possible to further prevent liquid or gas from entering the inside of the housing 3 from the outside.

[0059] The lid 4 may be bonded to the ceiling surface 511 via the first sealing portion 101 while being spaced apart from the ceiling surface 511 of the fixing device 5. By spaced apart the lid 4 and the fixing device 5 in this way, it is possible to alleviate stress caused by the difference in thermal expansion coefficients between the lid 4 and the fixing device 5. This makes it possible to improve the heat cycle resistance of the non-contact communication medium 100.

[0060] The lid 4 may be bonded to the ceiling surface 511 of the fixture 5 via the first sealing portion 101 while being spaced apart from the housing 3. By separating the lid 4 from the housing 3 in this way, it is possible to alleviate stress caused by the difference in thermal expansion coefficients between the lid 4 and the housing 3. This makes it possible to improve the heat cycle resistance of the non-contact communication medium 100.

[0061] Non-contact communication medium 100 may have space S1 between side wall portion 52 of fixing device 5 and lid 4. In this way, space S1 is located midway along the intrusion path from between ceiling surface 511 of fixing device 5 and upper surface 41 of lid 4 to the inside of housing 3. Even if liquid infiltrates through the gap between ceiling surface 511 of fixing device 5 and first sealing portion 101 or the gap between upper surface 41 of lid 4 and first sealing portion 101, capillary action tends to cause the liquid to remain in the gap, making it difficult for the liquid to infiltrate into housing 3. Therefore, intrusion of liquid from the outside into housing 3 can be more reliably prevented.

[0062] The first sealing portion 101 may protrude from between the ceiling surface 511 of the fixing device 5 and the upper surface 41 of the lid 4 into the exposed opening 512. In other words, a part of the first sealing portion 101 may be located in a region spanning the inner peripheral surface 513 of the ceiling portion 51, which corresponds to the peripheral surface of the exposed opening 512, and the portion of the upper surface 41 of the lid 4 that is exposed through the exposed opening 512. This can increase the bonding strength between the lid 4 and the fixing device 5. It can also increase the sealing performance between the upper surface 41 of the lid 4 and the ceiling surface 511 of the fixing device 5.

[0063] A part of the first sealing portion 101 described above, i.e., the portion protruding into the exposed opening 512, may have a meniscus shape. Specifically, the first sealing portion 101 protruding into the exposed opening 512 may have a concavely curved surface. With this configuration, the contact area between the inner circumferential surface 513 of the fixing member 5 and the upper surface 41 of the lid 4 is larger than when the surface shape is a convexly curved surface, and therefore the bonding strength between the lid 4 and the fixing member 5 can be increased.

[0064] When manufacturing the non-contact communication medium 100 according to the first modification, for example, an active metal brazing material is heated at a predetermined temperature (for example, a temperature of 600°C or higher) to form a first sealing portion 101 between the ceiling surface 511 of the fixing device 5 and the upper surface 41 of the lid 4, thereby joining the fixing device 5 and the lid 4. Thereafter, the fixing device 5 is fixed to the housing 3 that houses the electronic component 1, the protective body 2, and the heat insulating material 6. In this way, by joining the lid 4 and the fixing device 5 in advance with the first sealing portion 101, and then fixing the housing 3 to the fixing device 5, it is possible to prevent the electronic component 1 from being damaged by the high temperature that occurs when the first sealing portion 101 is formed.

[0065] <Second Modification> Fig. 9 is a schematic enlarged cross-sectional view of a non-contact communication medium 100 according to a second modification. As shown in Fig. 9, a second sealing portion 102 may be provided between the lower surface 42 of the cover 4 and the housing 3. As the second sealing portion 102, for example, a ring-shaped gasket made of heat-resistant resin may be used.

[0066] The second sealing portion 102 is sandwiched between the lower surface 42 of the lid 4 and the upper end surface 323 of the housing 3, thereby sealing the gap between the lower surface 42 of the lid 4 and the upper end surface 323 of the housing 3. In this way, by sealing the gap between the lower surface 42 of the lid 4 and the upper end surface 323 of the housing 3, which may be a point through which liquid or gas may enter, with the second sealing portion 102, it is possible to further prevent liquid or gas from entering the inside of the housing 3 from the outside.

[0067] Corner 327 between upper end surface 323 and inner circumferential surface 322 of housing 3 may be embedded in second sealing portion 102. In other words, second sealing portion 102 may be in contact with both upper end surface 323 and inner circumferential surface 322 of housing 3. With this configuration, it is possible to more reliably prevent liquid or gas from entering the interior of housing 3.

[0068] 9 shows an example in which not only the second sealing portion 102 but also the first sealing portion 101 is annular gasket made of heat-resistant resin. In this case, as shown in FIG. 9, the first sealing portion 101 may be in contact with both the inner circumferential surface 513 and the top surface 41 of the ceiling portion 51 of the fixing device 5. With this configuration, the intrusion of liquid or gas into the interior of the housing 3 can be more reliably prevented.

[0069] <Third Modification> 10 is a schematic enlarged cross-sectional view of a non-contact communication medium 100 according to a third modified example. As shown in FIG. 10, the non-contact communication medium 100 may have a space S2 between the second sealing portion 102 and the heat insulating material 6.

[0070] With this configuration, even if liquid seeps in through the gap between the underside 42 of the lid 4 and the second sealing portion 102 or the gap between the housing 3 and the second sealing portion 102, the liquid tends to remain in the gap due to capillary action, making it difficult for the liquid to seep into the housing 3. Therefore, it is possible to more reliably prevent liquid from seeping into the housing 3 from the outside.

[0071] <Fourth Modification> FIG. 11 is a schematic enlarged cross-sectional view of a non-contact communication medium 100 according to a fourth modification. As shown in FIG. 11, the non-contact communication medium 100 may have an inner lid 8 between the space S2 and the heat insulating material 6. The inner lid 8 has higher radio wave transmittance than the housing 3. The inner lid 8 may be formed of ceramics or heat-resistant resin, similar to the lid body 4. Examples of ceramics that can be used to form the inner lid 8 include cordierite, Al2O3, Si3N4, SiC, Al2TiO5, Li2O-Al2O3-SiO2, and the like. Examples of heat-resistant resins that can be used to form the inner lid 8 include PEEK, PBO, and PBI.

[0072] In this way, when the inner lid 8 is provided between the space S2 and the insulating material 6, even if a liquid or gas enters the inside of the housing 3, the entering liquid or gas is less likely to come into contact with the insulating material 6. In other words, the entering liquid or gas is less likely to reach the electronic component 1. Therefore, according to the non-contact communication medium 100 of the fourth modification, even if a liquid or gas enters the inside of the housing 3, damage to the electronic component 1 can be suppressed.

[0073] The non-contact communication medium 100 may also have a third sealing portion 103 between the inner circumferential surface 322 of the housing 3 and the inner lid 8. The third sealing portion 103 has an annular shape. The outer diameter of the third sealing portion 103 is larger than the outer diameter of the inner lid 8. The inner diameter of the third sealing portion 103 is smaller than the outer diameter of the inner lid 8. The third sealing portion 103 is made of, for example, a heat-resistant resin. Examples of the heat-resistant resin that can be used to make the third sealing portion 103 include PEEK, PBO, and PBI.

[0074] In this way, by sealing the gap between the inner surface 322 of the housing 3 and the inner lid 8 with the third sealing portion 103, even if liquid or gas enters the inside of the housing 3, the entering liquid or gas can be prevented from reaching the electronic component 1.

[0075] <Fifth Modification> FIG. 12 is a schematic enlarged cross-sectional view of a non-contact communication medium 100 according to a fifth modification. As shown in FIG. 12, the non-contact communication medium 100 may have a fourth sealing portion 104 in a region spanning an end surface 522 of the side wall portion 52, specifically, the end surface 522 of the fixture 5 in a direction in which the ceiling surface 511 of the fixture 5 approaches the lid 4 (vertically downward in FIG. 12), and the outer peripheral surface 321 of the housing 3. The fourth sealing portion 104 is located in the region over the entire periphery of the outer peripheral surface 321 of the housing 3. Examples of the fourth sealing portion 104 that can be used include glass paste, brazing material, heat-resistant resin, and inorganic adhesive. Examples of the heat-resistant resin that can be used include polyimide resin and polybenzimidazole resin. Among these resins, it is preferable to use thermosetting polybenzimidazole resin. Examples of the inorganic adhesive that can be used include magnesium silicate and sodium silicate. Furthermore, the fourth sealing portion 104 may be a welded portion between the housing 3 and the fixing device 5. A welded portion is a portion where the housing 3 and the fixing device 5 are melted and integrated by welding. The fourth sealing portion 104 may be disposed around the entire side wall portion 32 of the housing 3. Furthermore, the fourth sealing portion 104 may be located in a part of the side wall portion 32 of the housing 3.

[0076] This configuration can prevent liquid or gas from entering the housing 3 from the outside. This configuration can also prevent the housing 3 and the fixing device 5 from becoming loose.

[0077] 12 , a portion of the fourth sealing portion 104 may be located between the outer peripheral surface 321 of the side wall portion 32 of the housing 3 and the inner peripheral surface 521 of the side wall portion 52 of the fixing device 5. This configuration can prevent liquid or gas from entering the housing 3 from the outside. This configuration can also prevent the housing 3 and the fixing device 5 from loosening. Although not shown, the non-contact communication medium 100 may have a fifth sealing portion located only between the outer peripheral surface 321 of the side wall portion 32 of the housing 3 and the inner peripheral surface 521 of the side wall portion 52 of the fixing device 5.

[0078] <Sixth Modification> Fig. 13 is a schematic enlarged cross-sectional view of a non-contact communication medium 100 according to a sixth modified example. As shown in Fig. 13, the housing 3 may have a first protrusion 35 that protrudes outward from the outer peripheral surface 321. The first protrusion 35 has a first through-hole 351 that penetrates the first protrusion 35. Furthermore, the fixing device 5 may have a second protrusion 55 that protrudes outward from the outer peripheral surface 525. The second protrusion 55 has a second through-hole 551 that penetrates the second protrusion 55.

[0079] In this way, the non-contact communication medium 100 may have a first through hole 351 located in the housing 3 and a second through hole 551 located in the fixture 5. In this case, for example, a wire can be inserted through the first through hole 351 and the second through hole 551, and the non-contact communication medium 100 can be attached to an article to be managed via the wire.

[0080] The non-contact communication medium 100 may have only one of the first protrusion 35 and the second protrusion 55. In other words, the non-contact communication medium 100 may have only one of the first through-hole 351 and the second through-hole 551.

[0081] <Seventh Modification> 14 is a schematic enlarged cross-sectional view of a non-contact communication medium 100 according to a seventh modification. As shown in FIG. 14, the non-contact communication medium 100 may have a housing 3 and a fixing device 5 fastened together by a bolt 201 and a nut 202.

[0082] For example, the housing 3 may have a plurality of first through holes 351. Fig. 14 shows an example in which the plurality of first through holes 351 are located in a flange-shaped first protruding portion 35. However, the present invention is not limited to this, and the housing 3 may have a plurality of first protruding portions 35, and each first protruding portion 35 may have a first through hole 351.

[0083] Furthermore, the fixing device 5 may have a plurality of second through holes 551. Fig. 14 shows an example in which a plurality of second through holes 551 are located in a flange-shaped second protruding portion 55. However, the fixing device 5 may have a plurality of second protruding portions 55, and each second protruding portion 55 may have a second through hole 551.

[0084] In the non-contact communication medium 100 according to the seventh modification, the fixing device 5 can be fixed to the housing 3 by inserting the bolt 201 into the first through-hole 351 and the second through-hole 551 and tightening it with the nut 202. Furthermore, by fixing the fixing device 5 to the housing 3, the cover 4 located between the housing 3 and the fixing device 5 can be fixed to the housing 3.

[0085] <Other variations> The electronic component is not limited to an RFID tag, but may be any other electronic component that performs contactless communication. For example, the electronic component may be a sensor with contactless communication capabilities. The sensor may be, for example, a temperature sensor that measures the processing environment of the component to be monitored.

[0086] The component to which the non-contact communication medium is attached is not limited to a component to be plated. For example, the non-contact communication medium may be attached to a component such as a cast piece produced in a foundry of a metal material.

[0087] As described above, a contactless communication medium according to an embodiment (for example, contactless communication medium 100) includes an electronic component (for example, electronic component 1), a housing (for example, housing 3), a cover (for example, cover 4), and a fixture (for example, fixture 5). The electronic component performs contactless communication. The housing has an opening (for example, opening 33) through which the electronic component can be inserted, and the position opposite the opening is blocked. The cover has higher radio wave transparency than the housing and covers the opening. The fixture secures the cover to the housing while leaving a portion of the cover exposed.

[0088] Therefore, the contactless communication medium according to the embodiment can prevent the intrusion of liquid or gas from the outside.

[0089] Further advantages and modifications will readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents. [Explanation of symbols]

[0090] 1;Electronic components 2; Protective body 3. Housing 4; Lid 5; Fixtures 6. Heat insulation 8; Inner lid 21;1st base material 22;Second base material 23; Adhesive layer 25;Containment space 31;bottom 32: Side wall 33;Aperture 35;1st protrusion 51; Ceiling 52: Side wall 55;Second protrusion 100; Contactless communication medium 101: First sealing portion 102: Second sealing portion 103: Third sealing portion 104: Fourth sealing portion 325; First groove 511;Ceiling surface 512; exposed mouth 523: Second groove

Claims

1. An electronic component that performs contactless communication; a housing having an opening through which the electronic component can be inserted, the housing having a position opposite the opening closed; a lid (excluding a transparent lid) made of ceramic and covering the opening, the lid having higher radio wave permeability than the housing; a fixing tool that fixes the lid to the housing while leaving a portion of the lid exposed; A contactless communication medium having:

2. The fixture is a ceiling portion having a ceiling surface facing the lid body; a sidewall portion having an inner peripheral surface facing the outer peripheral surface of the housing; and The contactless communication medium according to claim 1 , wherein the ceiling portion has an exposure opening through which the lid body is exposed.

3. the housing has a spiral first groove on the outer circumferential surface, The non-contact communication medium according to claim 2 , wherein the fixture has a second groove portion on the inner circumferential surface of the side wall portion, the second groove portion being threadably engaged with the first groove portion.

4. the inner circumferential surface of the fixing tool is inclined at a first inclination angle with respect to a direction in which the ceiling surface approaches the lid body, The contactless communication medium according to claim 2 , wherein the outer peripheral surface of the housing is inclined at a second inclination angle greater than the first inclination angle with respect to a direction in which the ceiling surface approaches the lid.

5. The contactless communication medium according to claim 2 , further comprising a first sealing portion between the ceiling surface and the lid.

6. The non-contact communication medium according to claim 5 , wherein the lid is joined to the ceiling surface via the first sealing portion in a state separated from the ceiling surface.

7. The non-contact communication medium according to claim 5 , wherein the lid is joined to the ceiling surface via the first sealing portion while being spaced apart from the housing.

8. The non-contact communication medium according to claim 5 , further comprising a space between the lid and the side wall.

9. The non-contact communication medium described in claim 5, wherein a portion of the first sealing portion is located in an area spanning the inner surface of the ceiling portion corresponding to the peripheral surface of the exposure opening and the portion of the lid body exposed to the outside through the exposure opening.

10. The contactless communication medium according to claim 9 , wherein a portion of the first sealing portion has a meniscus shape.

11. The contactless communication medium according to claim 2 , further comprising a second sealing portion between the lid and the housing.

12. The contactless communication medium according to claim 11 , wherein the second sealing portion is in contact with an end face and an inner peripheral surface of the housing on the opening side.

13. A heat insulating material is filled inside the housing, The non-contact communication medium according to claim 12 , wherein a space is provided between the second sealing portion and the heat insulating material.

14. The contactless communication medium according to claim 13 , further comprising an inner lid between the space and the insulating material.

15. The contactless communication medium according to claim 14 , further comprising a third sealing portion between the inner circumferential surface of the housing and the inner lid.

16. The non-contact communication medium according to claim 2 , further comprising a fourth sealing portion in a region spanning an end face of the side wall portion in a direction in which the ceiling surface approaches the lid body and an outer peripheral surface of the housing.

17. The contactless communication medium according to claim 16 , wherein a portion of the fourth sealing portion is located between an outer peripheral surface and the inner peripheral surface of the housing.

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