Semiconductor Devices

Abstract

This semiconductor device comprises: one or more semiconductor modules aligned in one row; a pair of cooling members that are arranged such that the semiconductor modules are interposed therebetween and that cool the semiconductor modules; a pair of sandwiching members that are arranged so as to face the sides of the pair of cooling members that are opposite the sides thereof that face the semiconductor modules; and a connection part that connects the pair of sandwiching members to each other and that pushes on each of the cooling members facing the sandwiching members. At least one of the pair of sandwiching members includes: a plurality of support parts that are arranged at both ends of the aligned semiconductor modules and so as to oppose each other between the semiconductor modules; and spring parts that extend from the respective support parts in the alignment direction of the semiconductor modules and that contact the cooling members. The connection part connects the support part provided to one of the sandwiching members to the other of the sandwiching members.

Description

[Technical Field]

[0001] The present invention relates to a semiconductor device including a semiconductor module. [Background technology]

[0002] Patent Document 1 discloses a configuration in which a power module having a stack of a semiconductor device including a semiconductor element and a cooler is clamped between a pair of clamping members having curved portions, and the stack is pressed in the stacking direction by the reaction force of the elastic deformation of the curved portions. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2021-005603 Summary of the Invention [Problem to be solved by the invention]

[0004] In the technology of Patent Document 1, the clamping members are fixed to each other with fixing members on both sides of the direction perpendicular to the stacking direction of the laminate, in the direction in which the terminals are not pulled out. The clamping members have two curved portions between three base portions, and the curved portions are elastically deformed by biasing the base portions at both ends toward the cooler with the fixing members. However, of the three base portions, the base portion located in the center connecting the curved portions is not biased toward the cooler by the fixing member, so there is a risk that the curved portions will not be able to sufficiently deform elastically. In other words, the earthquake resistance in holding the cooler is insufficient. [Means for solving the problem]

[0005] The present invention 1stA semiconductor device according to an aspect includes one or more semiconductor modules arranged in a row, a pair of cooling members arranged to sandwich the one or more semiconductor modules arranged in a row and cool the semiconductor modules, a pair of clamping members arranged opposite to the side of the pair of cooling members facing the semiconductor modules, and a connecting portion connecting the pair of clamping members to each other and pressing them against the opposing cooling members, Each of the pair of clamping members has a plurality of support parts respectively arranged opposite both ends of the one or more semiconductor modules arranged in a row and between the semiconductor modules, and a spring part extending from each of the plurality of support parts in the arrangement direction of the semiconductor modules and abutting against the cooling member, and the connecting part is provided with a connecting member for each support part that connects the mutually opposing support parts of the pair of clamping members, and the support parts extend in a direction perpendicular to the arrangement direction, and one end in the extension direction of the support part provided on one of the pair of clamping members is connected to an end opposite to the one end of the support part provided on the other of the pair of clamping members by one of the plurality of connecting members, and the other end in the extension direction of the support part provided on one of the pair of clamping members is connected to an end opposite to the other end of the support part provided on the other of the pair of clamping members by another of the plurality of connecting members. . A semiconductor device according to a second aspect of the present invention comprises one or more semiconductor modules arranged in a row, a pair of cooling members arranged to sandwich the one or more semiconductor modules arranged in a row and cool the semiconductor modules, a pair of clamping members arranged opposite to the side of the pair of cooling members facing the semiconductor modules, and a connecting portion connecting the pair of clamping members to each other and pressing them against the opposing cooling member, each of the pair of clamping members having a plurality of support portions respectively arranged opposite to both ends of the one or more semiconductor modules arranged in a row and between the semiconductor modules, and a spring portion extending from each of the plurality of support portions in the arrangement direction of the semiconductor modules and abutting against the cooling member, and the connecting portion Each support part of the pair of clamping members is provided with a connecting member that connects the opposing support parts of the pair of clamping members, and the support parts are each provided with the spring part at both ends of the support part in the arrangement direction, one of the pair of cooling members has a first refrigerant flow path formed therein and a first flow path connection part provided at a position opposite the other cooling member, and the other cooling member has a second refrigerant flow path formed therein and a second flow path connection part connected to the first flow path connection part, and at least one of the clamping member facing surface in the area where the first flow path connection part of the one cooling member is provided and the clamping member facing surface in the area where the second flow path connection part of the other cooling member is provided is abutted by any one of the multiple spring parts of the opposing clamping members. A semiconductor device according to a third aspect of the present invention comprises one or more semiconductor modules arranged in a row, a pair of cooling members arranged to sandwich the one or more semiconductor modules arranged in a row and cool the semiconductor modules, a pair of clamping members arranged opposite each other on the side of the pair of cooling members opposite the semiconductor modules, and a connecting portion that connects the pair of clamping members to each other and presses them against the opposing cooling member, wherein at least one of the pair of clamping members has a plurality of support portions respectively arranged opposite both ends of the one or more semiconductor modules arranged in a row and between the semiconductor modules, and a spring portion extending from each of the plurality of support portions in the arrangement direction of the semiconductor modules and abutting the cooling member, and the connecting portion connects the support portion provided on one of the clamping members to the other clamping member, and each of the pair of cooling members has an opposing portion opposite to the semiconductor modules and a flexible portion provided at both ends of the opposing portion in the arrangement direction. [Effects of the Invention]

[0006] According to the present invention, earthquake resistance can be improved. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a circuit diagram illustrating the circuit configuration of a semiconductor module provided in a semiconductor device. [Figure 2] FIG. 2 is a perspective view of the appearance of the semiconductor module. [Figure 3] FIG. 3 is a cross-sectional view taken along line AA in FIG. [Figure 4] FIG. 4 is a perspective view of the appearance of the semiconductor device. [Figure 5] FIG. 5 is an exploded perspective view of the semiconductor device. [Figure 6] FIG. 6 is a cross-sectional view showing a part of cross section B of FIG. [Figure 7] FIG. 7 is a cross-sectional view taken along line CC in FIG. [Figure 8] FIG. 8 is a cross-sectional view taken along line DD in FIG. [Figure 9] FIG. 9 is a diagram showing the assembly procedure of the cooling unit. [Figure 10] FIG. 10 is a diagram illustrating the attachment of the connecting member in the assembly procedure of the cooling unit. [Figure 11] FIG. 11 is a diagram showing Modification 1, and is a perspective view of a semiconductor device. [Figure 12]FIG. 12 is a cross-sectional view showing the E cross section of FIG. [Figure 13] FIG. 13 is a diagram showing Modification 2, and is a perspective view of a semiconductor device. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, an embodiment of a semiconductor device according to the present invention will be described with reference to the drawings. The following description and drawings are examples for explaining the present invention, and appropriate omissions and simplifications have been made for clarity of explanation. Furthermore, in the following description, identical or similar elements and processes are given the same reference numerals, and duplicate explanations may be omitted. Note that the content described below merely shows an example of an embodiment of the present invention, and the present invention is not limited to the following embodiment, and can be implemented in various other forms.

[0009] FIG. 1 is a circuit diagram illustrating the circuit configuration of a semiconductor module 300 provided in a semiconductor device. The semiconductor device of this embodiment is provided in, for example, an inverter circuit of a power conversion device mounted on an electric vehicle, a hybrid vehicle, or the like. The power conversion device performs power conversion between a DC power source and a motor generator (for example, a three-phase AC rotating electric machine) for vehicle operation. The power conversion device includes a smoothing capacitor and an inverter circuit which is a power converter. The inverter circuit converts input DC power into three-phase AC power of a predetermined frequency and outputs it to the motor generator. The inverter circuit includes, for example, semiconductor modules for three phases. FIG. 1 shows a circuit diagram of a semiconductor module 300 for one phase.

[0010] The circuit of the semiconductor module 300 is composed of an upper arm 300U and a lower arm 300L connected in series. The upper arm 300U includes a power semiconductor element 321U and a diode 322U. The lower arm 300L includes a power semiconductor element 321L and a diode 322L. The power semiconductor elements 321U, 321L are composed of, for example, an insulated gate bipolar transistor (IGBT) or an FET. The power semiconductor element 321U of the upper arm 300U is on / off controlled by a control signal input to an upper arm control terminal 314. Similarly, the power semiconductor element 321L of the lower arm 300L is on / off controlled by a control signal input to a lower arm control terminal 315.

[0011] An external connection P terminal 311 of the upper arm 300U is connected to a high-potential power line of a DC power supply, and an external connection N terminal 312 of the lower arm 300L is connected to a low-potential power line of the DC power supply. An external connection AC terminal 313 is provided at the connection point between the upper arm 300U and the lower arm 300L, and AC current is output from the external connection AC terminal 313 to an external device (e.g., a motor). A capacitor or the like is connected to the DC power supply line in parallel with the upper and lower arms 300U and 300L.

[0012] 2 is an external perspective view of the semiconductor module 300. The power semiconductor elements 321U, 321L and diodes 322U, 322L of the semiconductor module 300 are sealed with sealing resin 330 made of an electrically insulating material. The external connection P terminal 311, the external connection N terminal 312, the external connection AC terminal 313, the upper arm control terminal 314, and the lower arm control terminal 315 are exposed from the sealing resin 330. Heat conduction members 350 are provided on both sides of the semiconductor module 300, which is a circuit molded body.

[0013] 3 is a cross-sectional view taken along the line AA in FIG. 2. The main surfaces of the power semiconductor elements 321U, 321L and the diodes 322U, 322L are bonded to a heat sink 341 via a bonding material 345. The surfaces opposite to the main surfaces of the power semiconductor elements 321U, 321L and the diodes 322U, 322L are bonded to a heat sink 342 via a bonding material 346. Solder or a sintered material is used for the bonding materials 345, 346. Metal such as copper or aluminum, or an insulating substrate with copper wiring is used for the heat sinks 341, 342. The sealing resin 330 seals the power semiconductor elements 321U, 321L and the diodes 322U, 322L, the heat sinks 341, 342, and the bonding materials 345, 346.

[0014] A heat dissipation surface 343 is provided on the side of the heat dissipation plate 341 opposite the surface bonded to the bonding material 345. A heat dissipation surface 344 is provided on the side of the heat dissipation plate 342 opposite the surface bonded to the bonding material 346. The heat dissipation surfaces 343 and 344 are exposed from the sealing resin 330. A thermally conductive member 350 is provided in close contact with each of the heat dissipation surfaces 343 and 344. An insulating resin, ceramic, or the like is used for the thermally conductive member 350. When ceramic is used for the thermally conductive member 350, grease or the like is used to provide close contact between the heat dissipation surfaces 343 and 344 of the circuit molded body and the cooling members 110 and 210 (described later). Although not shown, grease is used as the thermally conductive member 350 in a configuration in which an insulating substrate or a resin insulating member is provided in close contact with the heat dissipation plates 341 and 342. The heat generated in the semiconductor module 300 is dissipated to the cooling members 110 and 210 via the heat conduction member 350 .

[0015] The overall configuration of the semiconductor device 100 will be described with reference to Figures 4 to 8. Figure 4 is an external perspective view of the semiconductor device 100. Figure 5 is an exploded perspective view of the semiconductor device 100. As shown in Figure 5, in the semiconductor device 100, three semiconductor modules 300 that constitute a three-phase inverter circuit are arranged in a line in the x direction, and a cooling unit for cooling the semiconductor modules 300 is provided. The cooling unit includes a pair of cooling members 110, 210, a pair of clamping members 410, 420, and a plurality of connecting members 430. The semiconductor device 100 shown in Figure 4 includes semiconductor modules 300 for three phases, but may also be configured to include only one phase, for example.

[0016] The cooling members 110 and 210 are arranged to sandwich the semiconductor modules 300 arranged in the x direction from both the front and back sides in the z direction. As will be described later, a flow path through which a coolant flows is formed inside the cooling members 110 and 210. Although not shown, the cooling members 110 and 210 are provided with a coolant inlet and outlet through which a coolant is supplied from the outside. As shown in FIG. 5, flow path connectors 111 that connect to the flow path connectors 211 of the cooling member 210 are provided on both end surfaces of the cooling member 110 facing the cooling member 120. By connecting the flow path connectors 111 and 211, the flow paths in the cooling member 110 and the cooling member 210 are connected. A flange 270 is provided on the bottom surface of the cooling member 210 in the figure for connecting to a case (not shown) that supplies a coolant. The flange 270 is formed with mounting holes 272 for passing fasteners such as screws.

[0017] 4, the external connection P terminal 311, the external connection N terminal 312, the external connection AC terminal 313, the upper arm control terminal 314, and the lower arm control terminal 315 of each semiconductor module 300 are drawn out in the y direction perpendicular to the arrangement direction of the semiconductor modules 300. A clamping member 410 is arranged on the opposite side of the semiconductor module 300 across the cooling member 110, i.e., on the positive side of the cooling member 110 in the z direction, so as to face the cooling member 110. Meanwhile, a clamping member 420 is arranged on the opposite side of the semiconductor module 300 across the cooling member 210, i.e., on the negative side of the cooling member 210 in the z direction, so as to face the cooling member 210.

[0018] The clamping member 410 is formed from a single plate member (e.g., a metal plate) and includes multiple support portions 411, a frame portion 414, and spring portions 412 and 413. The multiple support portions 411 extending in the y direction are arranged side by side in the arrangement direction (x direction) of the semiconductor modules 300, and are arranged so as to face both ends of the arrangement of three semiconductor modules 300 arranged in the x direction and between the modules. Both ends of each support portion 411 are connected to each other by a frame portion 414 extending in the x direction. Each support portion 411 has spring portions 412 and 413 formed on both ends in the arrangement direction (x direction). The spring portions 412 and 413 extend from the support portion 411 in the x direction and abut against the cooling member 110. The spring portions 413 are provided only on the two support portions 411 arranged on the most negative side and the most positive side in the x direction of the module arrangement. In the arrangement of the plurality of spring portions 412, 413, the two spring portions 413 are arranged on the most negative side in the x direction and the most positive side in the x direction in the module arrangement.

[0019] The clamping member 420 has almost the same configuration as the clamping member 410. That is, it has a plurality of support portions 421 in the arrangement direction (x direction) of the semiconductor modules 300, and both ends of each support portion 421 are connected to each other by a frame portion 424 extending in the x direction. The support portions 421 are formed with spring portions 422 that extend in the x direction and come into contact with the cooling member 210. However, only one spring portion 412 is formed on the two support portions 421 that are arranged on the most negative side and the most positive side of the module arrangement of the clamping member 420 in the x direction. Of course, as with the support portion 411 of the clamping member 410, it may also be configured with two spring portions.

[0020] The multiple connecting members 430 press the pair of clamping members 410, 420 against the opposing cooling members 110, 210. As a result, the cooling members 110, 210 are held so as to be pressed against both the front and back surfaces of the multiple semiconductor modules 300. The connecting members 430 are arranged on the sides of the clamping members 410, 420 in the short direction (y direction), and are arranged at approximately equal intervals in the long direction (x direction) of the clamping members 410, 420.

[0021] 6 is a diagram showing a part of cross section B taken along plane B in FIG. 5, and is a cross-sectional view of a portion including flow path connecting portion 111, flow path connecting portion 211, and adjacent semiconductor module 300. Three semiconductor modules 300 are arranged side by side in the left-right direction (x direction) in the figure, and cooling members 110, 210 are arranged above and below them to sandwich them. A clamping member 410 is arranged above cooling member 110 in the figure, and a clamping member 420 is arranged below cooling member 210 in the figure. By attaching a plurality of connecting members 430, the clamping members 410, 420 are pressed against the opposing cooling members 110, 210.

[0022] The cooling member 110 has a base 112 to which a cover 113 is joined to form a flow path 114. Fins 115 are provided in the flow path 114 in an area of the cooling member 110 facing the semiconductor module 300. Heat from the semiconductor module 300 is released to the coolant in the flow path 114 via the base 112, which is in close contact with the upper surface of the module. By providing the fins 115 in an area of the flow path 114 facing the semiconductor module 300, heat transfer from the semiconductor module 300 to the coolant is more effective. Note that the area where the flow path connection part 111 is provided does not require cooling, so by not providing the fins 115 as shown in FIG. 6, it is possible to reduce pressure loss of the coolant.

[0023] The above-described flow path connecting portion 111 is provided on the underside of the end region on the left side of the base 112 in the figure. The flow path connecting portion 111, base 112, cover 113, and fins 115 are formed of aluminum, aluminum alloy, copper, copper alloy, or the like, and are joined by brazing. Adhesion with an adhesive may be used instead of brazing. The cover 113 is formed with a facing portion 113b on which the fins 115 are provided and which faces the semiconductor module 300, and recesses 113a provided in regions on both sides of the facing portion 113b. By providing the recesses 113a in the region where the fins 115 are not provided, the bending rigidity of the cooling member 110 can be made smaller in the region of the recesses 113a than in the region of the facing portion 113b where the fins 115 are provided.

[0024] The cooling member 210 has a similar configuration to the cooling member 110, and includes a base 212 and a cover 213 that form a flow path 214. A plurality of fins 215 are provided within the flow path 214, and a recess 213a and an opposing portion 213b are formed in the cover 213. A flow path connecting portion 211 is provided on the upper surface of the base 212 in the figure, at a position opposing the flow path connecting portion 111 of the cooling member 110. The flow path connecting portion 211, on which a sealant 400 is provided, is inserted into the flow path connecting portion 111 in a watertight manner. This allows the flow path 114 of the cooling member 110 and the flow path 214 of the cooling member 210 to communicate with each other. Flanges 270 are fixed to the lower surfaces of both the left and right ends of the cover 213 (see FIG. 5). The base 212 is in close contact with the lower surface of the semiconductor module 300 in the figure. In the case of the cooling member 210 as well, the fins 215 are not provided in the region where the flow path connection portion 211 that does not require cooling is provided, so that the pressure loss of the refrigerant can be reduced.

[0025] A clamping member 410 is disposed above the cooling member 110 in the figure, and a clamping member 420 is disposed below the cooling member 210 in the figure. In Fig. 6, the support portion 411 disposed on the leftmost side of the clamping member 410 and the support portion 411 adjacent thereto are illustrated, and the support portion 421 disposed on the leftmost side of the clamping member 420 is illustrated. The support portions 411, 421 disposed on the leftmost side in the figure are support portions disposed opposite the left ends of the multiple semiconductor modules 300 arranged in a row. Furthermore, the adjacent support portion 411 on the right side in the figure is a support portion disposed opposite the space between the two semiconductor modules 300.

[0026] In the support portions 411 and 421 disposed opposite the left end of the module array, the support portion 411 is provided with a spring portion 412 extending toward the positive x-direction and a spring portion 413 extending toward the negative x-direction. On the other hand, the support portion 421 is formed with only the spring portion 412 extending toward the positive x-direction. The support portions 411 and 421 disposed opposite between the modules in the module array are provided with a pair of spring portions 412 and 422 extending toward the positive and negative x-direction. Note that the spring portions 412 and 422 extending toward the positive x-direction are not shown in FIG. 6.

[0027] The spring portion 412 abuts against a portion of the cover 113 where the fins 115 are provided, i.e., a position of the cooling member 110 facing the semiconductor module 300. As can be seen from FIGS. 5 and 6 , two spring portions 412 extending from the support portions 411 on both sides abut against the region of the cooling member 110 facing the semiconductor module 300. On the other hand, the spring portion 413 abuts against the cover 113 at a portion where the flow path connection portion 111 is provided. The spring portions 412 and 413 have different spring constants. In the case of the clamping member 420 facing the cooling member 210, two spring portions 422 extending from the support portions 421 on both sides abut against the region of the cooling member 210 facing the semiconductor module 300. The spring constant of the spring portion 422 is set to be approximately the same as the spring constant of the spring portion 412, for example.

[0028] The regions of the cooling members 110 and 210 facing the semiconductor modules 300 are pressed against the semiconductor modules 300 by the reaction forces of the spring portions 412, 413, and 422. In this manner, the clamping members 410 and 420 press each region of the cooling members 110 and 210 facing the semiconductor modules 300 toward the semiconductor modules 300. Therefore, even if the cooling members 110 and 210 or the semiconductor modules 300 are warped or have thickness variations, the respective semiconductor module-facing regions of the cooling members 110 and 210 are pressed against the respective semiconductor modules 300 in a manner that accommodates the warpage and thickness variations. In other words, the cooling members 110 and 210 are pressed against the respective semiconductor modules 300 evenly. Furthermore, the semiconductor modules 300 tend to deform when they generate heat due to differences in the linear expansion coefficients of their constituent members. However, because a pressing force is applied to each semiconductor module 300, deformation is suppressed, thereby improving product reliability.

[0029] Furthermore, as described above, the regions of cooling members 110, 210 where recesses 113a, 213a are provided have lower rigidity and are more likely to bend than the regions where opposing portions 113b, 213b are provided. Therefore, even if there are variations in thickness or warpage among multiple semiconductor modules 300, the regions of recesses 113a, 213a are more likely to bend and come into close contact with each semiconductor module 300, thereby improving cooling performance.

[0030] As shown in FIG. 6 , the spring portion 413 extending from the support portion 411 on the left side of the figure toward the negative x-direction abuts against the cover 113 in the area where the flow path connection portion 111 is provided. When the refrigerant flows, the pressure of the refrigerant acts on the cooling members 110 and 210 that sandwich the semiconductor module 300, causing a force that pulls the cooling members 110 and 210 away from the semiconductor module 300. The pressing force of the spring portion 413 can reduce this pulling action. The pressing force of the spring portion 412 that presses the portion where the fins 115 are provided against the semiconductor module 300 is set differently from the pressing force of the spring portion 413. By setting the spring constants of the spring portions 412 and 413 to be different, it is possible to easily accommodate different pressing forces.

[0031] The clamping members 410 and 420 are connected by a connecting member 430, which is a separate member, and are pressed against the opposing cooling members 110 and 210 by the connecting member 430. FIG. 7 is a CC cross-sectional view of FIG. 6. The CC cross-section is taken in the short-side direction (y direction) of the clamping members 410 and 420 and the cooling members 110 and 210, and multiple connecting members 430 are arranged on either side of the clamping members 410 and 420 and the cooling members 110 and 210 in the short-side direction. The connecting member 430 includes engaging portions 430a that engage with the support portions 411 and 421, and connecting portions 430b that connect the two engaging portions 430a. The engaging portions 430a provided at the upper and lower ends of the connecting portion 430b extend from the connecting portions 430b located on the sides in the y direction toward the clamping members 410 and 420.

[0032] A protrusion 431 is formed on each of the two engaging portions 430a on the surfaces facing the support portions 411, 421. The protrusions 431 are formed by press working or the like. The protrusion 431 of the engaging portion 430a on the upper side in the figure engages with a hole 411a formed in the support portion 411 of the clamping member 410. The protrusion 431 of the engaging portion 430a on the lower side in the figure engages with a hole 421a formed in the support portion 421 of the clamping member 420. Note that the holes 411a, 421a may be recesses into which the protrusions 431 can engage. In this way, the engagement of the protrusions 431 with the holes 411a, 421a can prevent the connecting member 430 from falling off the clamping members 410, 420.

[0033] Fig. 8 is a DD cross-sectional view of Fig. 6. Fins 115 are not provided inside cover 113 in the region where spring portion 413 abuts, unlike the cover region where spring portion 412 abuts in Fig. 7. However, because spring portion 413 has a larger dimension in the y direction than spring portion 412 as shown in Fig. 5, spring portion 413 also abuts against a portion of side wall 113c erected in the z direction of cover 113. Therefore, deformation of cover 113 is suppressed by side wall 113c.

[0034] 9 and 10 are diagrams showing the procedure for assembling the clamping members 410, 420 and the connecting member 430. First, cooling members 110, 210 are arranged on both the front and back sides in the thickness direction (z direction in FIG. 9) of a plurality of semiconductor modules 300 arranged in a row in the x direction, and the plurality of semiconductor modules 300 are sandwiched between the cooling members 110, 210 in a stacked state. Then, clamping member 410 is arranged above cooling member 110 in the figure, and cooling member 420 is arranged below cooling member 210 in the figure, to form a stack S as shown in FIG.

[0035] Next, as shown in FIG. 10 , a pair of pressing jigs 500 is used to compress the stack S in the vertical direction, and multiple connecting members 30 are attached. At this time, the support portions 411 and 421 of the clamping members 410 and 420 are pressed toward the opposing cooling members 110 and 210, and the spring portions 412, 413, and 422 provided on the support portions 411 and 421 are elastically deformed. As a result, the thickness dimension a (i.e., the dimension in the z direction) of the stack S is reduced. Here, the stack S is compressed by the pressing jigs 500 so that the thickness dimension a of the stack S is approximately the same as or slightly smaller than the distance b between the pair of engaging portions 430a of the connecting member 430, and the connecting members 430 are attached so as to sandwich the stack S from the sides in the short direction of the stack S, as shown in FIG.

[0036] When the connecting member 430 is attached, the protrusions 431 of the upper and lower engaging portions 430a engage with the holes 411a of the support portion 411 and the holes 421a of the support portion 421, respectively (see FIG. 7). Thereafter, the jig 500 is removed from the stack S. When the jig 500 is removed, the supporting portions 411 and 421 are pressed against the engaging portions 430a by the reaction force of the elastically deformed spring portions 412 and 422. As a result, the cooling members 110 and 210 are held in a state in which they sandwich the semiconductor module 300.

[0037] The rigidity of the connecting member 430 is set higher than the rigidity of the support portions 411 and 421 on which the spring portions 412, 413, and 422 are provided so that the connecting member 430 is not deformed by the reaction force of the spring portions 412, 413, and 422. For example, the connecting member 430 and the clamping members 410 and 420 are formed from metal plate material. As shown in FIG. 6 , when the plate thicknesses of the clamping members 410 and 420 are t2 and t3, the plate thickness t1 of the connecting member 430 is set to be thicker than t2 and t3. In this way, by pressing the support portions 411 and 421 with the connecting member 430 having high rigidity, the pressing force of the spring portions 412, 413, and 422 on the cooling members 110 and 210 can be increased. As a result, the pressing force of the cooling members 110 and 210 on the semiconductor module 300 can be increased, thereby improving the reliability of the cooling performance.

[0038] In the embodiment described above, the opposing support parts 411 provided with spring parts 412 and the opposing support parts 421 provided with spring parts 422 are connected to each other by connecting members 430. As a result, the pressing force of spring parts 412 and 422 that presses cooling members 110 and 210 toward semiconductor module 300 can be increased, and the earthquake resistance of holding cooling members 110 and 210 can be improved.

[0039] In the above-described embodiment, the semiconductor device 100 includes multiple semiconductor modules 300. However, the present invention can also be applied to a single semiconductor module 300. Although not shown, in this case, the clamping members 410 and 420 have support portions 411 and 421 disposed on both sides of the semiconductor module 300 in the x direction perpendicular to the y direction along which the terminals 311 and the like of the semiconductor module 300 in FIGS. 4 and 5 are drawn. Each support portion 411 has spring portions 412 and 413, and each support portion 421 has spring portions 422. The cooling members 110 and 210 have a pair of recesses 113a on both sides of the facing portion 113b, and a pair of recesses 213a on both sides of the facing portion 213b. The area of the facing portion 113b of the cooling member 110 is pressed against the semiconductor module 300 by the two spring portions 412. Similarly, the area of the facing portion 213b of the cooling member 210 is pressed against the semiconductor module 300 by two spring portions 422.

[0040] (Variation 1) 11 and 12 are diagrams showing a first modification of the above-described embodiment. FIG. 11 is a perspective view of semiconductor device 100A, and FIG. 12 is a cross-sectional view taken along plane E in FIG. 11. Modification 1 differs from the above-described embodiment in that clamping member 420A is used instead of clamping member 420, and connecting member 440 is used instead of connecting member 430. The multiple semiconductor modules 300, cooling members 110 and 210, and clamping member 410 have the same configurations as those in the above-described embodiment. The following mainly describes the different configurations.

[0041] A clamping member 420A is fixed to the negative side in the z direction of cooling member 210 (the lower side in FIG. 12). It is also possible to simply dispose clamping member 420A below cooling member 210 without fixing it to it. Flanges 427 with mounting holes 428 are formed on both ends of clamping member 420A in the x direction. Linking member 440 has a pair of engaging portions 440a and a connecting portion 440b that connects them. An engaging protrusion 441 is formed on each engaging portion 440a.

[0042] In this way, in Modification 1, a single clamping member 420A serves as both the pair of flanges 270 and clamping member 420 in the above-described embodiment, and clamping member 420A is a simple plate-like member. In other words, Modification 1 can be said to be a configuration in which clamping member 420 is eliminated and replaced with a plate-like member (clamping member 420A) that extends in the x direction and has flanges 270 on both ends.

[0043] When attaching the connecting members 440, the multiple connecting members 440 are brought into contact with the respective support portions 411, and a pressing jig is used to press all of the connecting members 440 downward as shown in the figure. As a result, the spring portions 412 are deformed, and the inclined surfaces of the protrusions 441 are pressed against the end surfaces of the clamping members 420A in the y direction, widening the gap between the pair of engaging portions 440a. When the connecting members 440 are pressed further downward, the protrusions 441 engage with the lower surface of the clamping member 420A.

[0044] As described above, in the first modification, the regions of cooling member 110 facing semiconductor modules 300 are pressed against semiconductor modules 300 by spring portions 412 of clamping member 410, so that cooling member 110 is appropriately pressed against each semiconductor module 300. Furthermore, since each support portion 411 is pressed toward cooling member 10 by connection portion 440b of linking member 440, deformation of support portion 411 due to the reaction force of spring portion 412 is prevented, and the pressing force of spring portion 412 can be increased. Furthermore, in the first modification, the pair of flanges 270 and clamping member 420 having a complex shape are replaced with clamping member 420A, which is a plate-like member having a simple shape, so that costs can be reduced.

[0045] 11, the clamping member 420A may not be fixed to the cooling member 210, and the clamping member 420 shown in FIGS. 4 and 5 may be disposed between the clamping member 420A and the cooling member 210. The connecting member 440 of the first modification can also be applied to the embodiment shown in FIGS. 4 and 5. That is, the connecting member 440 of FIG. 13 is used instead of the connecting member 430 in FIGS. 4 and 5. The engaging portions 440a of each connecting member 440 are engaged with the short-side end portions of the clamping member 420. In this case, both ends of the support portion 421 of the clamping member 420 are extended to the outside in the short-side direction of the cooling member 110, 210, and the engaging portions 440a are engaged therewith.

[0046] (Variation 2) FIG. 13 is a diagram showing Modification 2 and is a perspective view of the semiconductor device 100B. In Modification 2, the connecting member is configured to be formed integrally with the clamping member 410A. Note that the other configurations are the same as those of Modification 1 described above, and therefore description thereof will be omitted. As indicated by dashed lines R, both ends of the support portion 411 extending in the y direction extend to the outside in the short direction of the cooling members 110 and 210. Each support portion 411 has a connecting portion 415 extending in the z direction formed on both ends of the extension direction of the support portion 411. The shape of the connecting portion 415 is the same as the shape of the engaging portion 440a of the connecting member 440 of Modification 1. When sandwiching member 420A, cooling member 210, multiple semiconductor modules 300, cooling member 110, and sandwiching member 410B are stacked and sandwiching member 410B is pressed toward cooling member 110 with a pressing jig, each connecting portion 415 engages with a short-side end portion of sandwiching member 420A. In Modification 2, because connecting portions 415 and sandwiching member 410B are integrally formed, the number of parts can be reduced compared to Modification 1, and assembly workability is also improved.

[0047] In the case of Modification 2, the clamping member 420 shown in FIGS. 4 and 5 may be disposed between the clamping member 420A and the cooling member 210 without fixing the clamping member 420A to the cooling member 210. The clamping member 410B of Modification 2 can also be applied to the embodiment shown in FIGS. 4 and 5. That is, the clamping member 410B of FIG. 13 is used instead of the clamping member 410 and the connecting member 430 in FIGS. 4 and 5. Then, each connecting portion 415 of the clamping member 410B is engaged with the short-side end portion of the clamping member 420. In this case, similar to the case of the supporting portion 411 of FIG. 13, both ends of the supporting portion 421 of the clamping member 420 are extended to the outside in the short-side direction of the cooling member 110, 210.

[0048] According to the embodiment and modified examples of the present invention described above, the following advantageous effects are achieved.

[0049] (C1) As shown in Figures 11 and 12, the semiconductor device 100A includes a plurality of semiconductor modules 300 arranged in a row, a pair of cooling members 110, 210 arranged to sandwich the plurality of semiconductor modules 300 arranged in a row and cool the semiconductor modules 300, a pair of clamping members 410, 420A arranged opposite to the semiconductor module-facing side of the pair of cooling members 110, 210, and a plurality of connecting members 440 as connecting parts that connect the pair of clamping members 410, 420A to each other and press them against the opposing cooling members 110, 210, respectively. The clamping member 410, which is one of the pair of clamping members 410, 420A, has a plurality of support portions 411 that are respectively arranged opposite both ends of the plurality of semiconductor modules 300 arranged in a row and between the semiconductor modules 300, and spring portions 412, 413 that extend from each of the plurality of support portions 411 in the arrangement direction (x direction) of the semiconductor modules 300 and abut against the cooling member 110, and a plurality of connecting members 440 connect the support portions 411 provided on the clamping member 410 to the other clamping member 420A.

[0050] For each of the support parts 411 on which the spring parts 412, 413 are formed, a connecting member 440 is provided that presses the support part 411 against the cooling member 110. Therefore, by pressing each of the support parts 411 that receive the reaction force from the spring parts 412, 413 with the connecting member 440, it is possible to increase the pressing force due to the elastic deformation of the spring parts 412, 413. As a result, it is possible to improve the earthquake resistance in terms of holding the cooling members 110, 210.

[0051] 11 and 12, the spring portions 412 extend in the arrangement direction (x direction) of the semiconductor modules 300 from support portions 411 that are respectively arranged at both ends of the semiconductor modules 300 and between the semiconductor modules 300. The spring portions 412 extending from the support portions 411 come into contact with areas of the cooling member 110 that face each semiconductor module 300, and press those areas toward the semiconductor modules 300. As a result, the cooling member 110 is pressed more evenly against each of the semiconductor modules 300, and each semiconductor module 300 is cooled more effectively.

[0052] In the above-described embodiment and modifications 2 and 3, the semiconductor device is provided with a plurality of semiconductor modules 300, but the present invention can also be applied to a single semiconductor module 300 as described above.

[0053] 4, 5, and 6, each of the pair of clamping members 410, 420 has a plurality of support portions 411, 421 that are respectively arranged facing both ends of the plurality of semiconductor modules 300 arranged in a row and between the semiconductor modules 300, and spring portions 412, 413, 422 that extend from each of the plurality of support portions 411, 421 in the arrangement direction (x direction) of the semiconductor modules 300 and come into contact with the cooling members 110, 210, and each connecting member 430 connects the mutually facing support portions 411, 421 of the pair of clamping members 410, 420. As a result, it is possible to press both cooling members 110, 210 more uniformly against each of the semiconductor modules 300.

[0054] (C3) In (C2) above, as shown in Figures 4 and 6, the support portion 411 has spring portions 412 and 413 at both ends of the support portion 411 in the x direction, which is the module arrangement direction. By providing a plurality of support portions 411 with such spring portions 412 and 413 in the module arrangement direction, even when there are a plurality of semiconductor modules 300, it is possible to apply a pressing force from the spring portions 412 to each semiconductor module 300. As a result, even when there is warping of the cooling member 110 or variations in the thickness of the semiconductor modules 300, it is possible to uniformize the pressing force applied to each semiconductor module.

[0055] (C4) In (C2) above, as shown in Figures 4 to 6, the support parts 411, 421 extend in the y direction perpendicular to the module arrangement direction, and one end of the support part 411 provided on the clamping member 410 in the extension direction is connected to an end of the support part 421 provided on the clamping member 420 that faces the one end by a connecting member 430, and the other end of the support part 411 provided on the clamping member 410 in the extension direction is connected to an end of the support part 421 provided on the clamping member 420 that faces the other end by another connecting member 430. Because both ends of the support parts 411, 421 in the extension direction are connected by the connecting member 430, bending of the support parts 411, 421 due to the reaction force of the spring parts is suppressed, and the pressing force can be strengthened and equalized.

[0056] (C5) In (C4) above, as shown in Figures 4 to 6, the connecting member 430 is formed as a separate member from the pair of clamping members 410, 420. By forming the connecting member 430 as a separate member, the connecting portion does not interfere with other members during assembly, as would occur if the connecting member were an integrated member, and this provides excellent workability.

[0057] 7, the connecting member 430 includes an engaging portion 430a that engages with a support portion 411 provided on the clamping member 410, an engaging portion 430a that engages with a support portion 421 provided on the clamping member 420, and a connecting portion 430b that connects the two engaging portions 430a. With this configuration, by engaging the engaging portion 430a with the clamping members 410 and 420, the connecting member 430 can be easily attached to the semiconductor device 100, thereby improving the ease of assembly.

[0058] (C7) In (C5) above, the rigidity of the connecting member 430 is higher than the rigidity of the support portions 411, 421 provided on the clamping members 410, 420. For example, as shown in Fig. 6, the thickness t1 of the connecting member 430 is made thicker than the thicknesses t2, t3 of the clamping members 410, 420. Since the reaction forces of the spring portions 412, 413, 422 are applied to the connecting member 430 via the support portions 411, 421, by increasing the rigidity of the connecting member 430, it is possible to further increase the pressing force of the spring portions 412, 413, 422 on the cooling members 110, 210.

[0059] 6, cooling member 110 has flow path 114 formed therein and has flow path connection portion 111 provided at a position opposite cooling member 210, cooling member 210 has flow path 214 formed therein and has flow path connection portion 211 connected to flow path connection portion 111, and spring portion 413 of opposing clamping member 410 abuts against the clamping member-facing surface (cover 113) of cooling member 110 in the region where flow path connection portion 111 is provided. By configuring spring portion 413 to abut against the clamping member-facing surface (cover 113) of cooling member 110, the pressing force of spring portion 413 appropriately maintains the connection state between flow path connection portion 111 and flow path connection portion 211 against the refrigerant pressure.

[0060] (C9) In (C8) above, as shown in FIG. 6, in the plurality of spring portions 412, 413 of the clamping member 410 provided with the spring portion 413 that abuts against the clamping member opposing surface (cover 113), the spring constant of the abutting spring portion 413 is set to a value different from the spring constant of the other spring portions 412. By making the spring constant of the spring portion 413 different from the spring constant of the spring portion 412, it is possible to individually set the pressing force on the region of the opposing portion 113b of the cooling member 110 and the pressing force on the region where the flow path connecting portion 111 is provided. In the example shown in FIG. 6, the region where the flow path connecting portion 111 is provided has low rigidity because the fins 115 are not provided inside the cover 113, and by reducing the spring constant of the abutting spring portion 413, it is possible to prevent deformation of the cover 113.

[0061] 5 and 6, each of the cooling members 110, 210 includes a facing portion 113b, 213b that faces the semiconductor module 300, and recesses 113a, 213a as flexible portions provided at both ends of the facing portion 113b, 213b in the module arrangement direction (x direction). The cooling members 110, 210 bend at the recesses 113a, 213a in accordance with thickness variations in the multiple semiconductor modules 300, and this allows the cooling members 110, 210 to press evenly against each semiconductor module 300.

[0062] The above-described embodiments and various modifications are merely examples, and the present invention is not limited to these details as long as the features of the invention are not impaired. Furthermore, although various embodiments and modifications have been described above, the present invention is not limited to these details. Other aspects conceivable within the scope of the technical idea of the present invention are also included within the scope of the present invention. [Explanation of symbols]

[0063] 100, 100A, 100B... semiconductor device, 110, 210... cooling member, 111, 211... flow path connecting portion, 113... cover, 113a, 213a... recess, 113b, 213b... opposing portion, 300... semiconductor module, 410, 410A, 420, 420A... clamping member, 411, 421... support portion, 412, 413, 422... spring portion, 415... connecting portion, 430, 440... connecting member, 430a, 440a... engagement portion, 430b, 440b... connecting portion

Claims

1. one or more semiconductor modules arranged in a row; a pair of cooling members arranged to sandwich one or more of the semiconductor modules arranged in a row and to cool the semiconductor modules; a pair of clamping members disposed opposite to the cooling members on the opposite sides from the semiconductor module; a connecting portion that connects the pair of clamping members to each other and presses them against the opposing cooling members, each of the pair of clamping members has a plurality of support portions respectively arranged opposite both ends of the one or more semiconductor modules arranged in a row and between the semiconductor modules, and a spring portion extending from each of the plurality of support portions in the arrangement direction of the semiconductor modules and abutting against the cooling member; the connecting portion includes a connecting member for each of the support portions that connects the opposing support portions of the pair of clamping members, the support portion extends in a direction perpendicular to the arrangement direction, One end in the extension direction of the support portion provided on one of the pair of clamping members and an end portion of the support portion provided on the other of the pair of clamping members that faces the one end are connected by one of the plurality of connecting members, A semiconductor device in which the other end in the extension direction of the support portion provided on one of the pair of clamping members and the end portion opposite to the other end of the support portion provided on the other of the pair of clamping members are connected by another one of the multiple connecting members.

2. 2. The semiconductor device according to claim 1, The semiconductor device, wherein the connecting member is formed separately from the pair of clamping members.

3. 3. The semiconductor device according to claim 2, The connecting member is a first engaging portion that engages with the support portion provided on one of the pair of clamping members; a second engaging portion that engages with the support portion provided on the other of the pair of clamping members; a connecting portion that connects the first engaging portion and the second engaging portion.

4. 3. The semiconductor device according to claim 2, The semiconductor device, wherein the rigidity of the connecting member is higher than the rigidity of the support portions provided on the pair of clamping members.

5. One or more semiconductor modules arranged in a row; a pair of cooling members arranged to sandwich one or more of the semiconductor modules arranged in a row and to cool the semiconductor modules; a pair of clamping members disposed opposite to the cooling members on the opposite sides from the semiconductor module; a connecting portion that connects the pair of clamping members to each other and presses them against the opposing cooling members, each of the pair of clamping members has a plurality of support portions respectively arranged opposite both ends of the one or more semiconductor modules arranged in a row and between the semiconductor modules, and a spring portion extending from each of the plurality of support portions in the arrangement direction of the semiconductor modules and abutting against the cooling member; the connecting portion includes a connecting member for each of the support portions that connects the opposing support portions of the pair of clamping members, the support portion includes the spring portion at each end of the support portion in the arrangement direction, one of the pair of cooling members has a first refrigerant flow path formed therein and a first flow path connecting portion provided at a position opposite to the other cooling member; the other cooling member has a second refrigerant flow path formed therein and a second flow path connecting portion connected to the first flow path connecting portion, A semiconductor device in which one of the plurality of spring portions of the opposing clamping member abuts against at least one of the clamping member facing surface in the region where the first flow path connection portion of one of the cooling members is provided and the clamping member facing surface in the region where the second flow path connection portion of the other cooling member is provided.

6. 6. The semiconductor device according to claim 5, A semiconductor device, wherein in a plurality of spring portions of the clamping member provided with spring portions that abut against the opposing surface of the clamping member, the spring constant of the abutting spring portion is set to a value different from the spring constant of the other spring portions.

7. One or more semiconductor modules arranged in a row; a pair of cooling members arranged to sandwich one or more of the semiconductor modules arranged in a row and to cool the semiconductor modules; a pair of clamping members disposed opposite to the cooling members on the opposite sides from the semiconductor module; a connecting portion that connects the pair of clamping members to each other and presses them against the opposing cooling members, At least one of the pair of clamping members has a plurality of support parts respectively arranged opposite both ends of the one or more semiconductor modules arranged in a row and between the semiconductor modules, and a spring part extending from each of the plurality of support parts in the arrangement direction of the semiconductor modules and coming into contact with the cooling member, the connecting portion connects the support portion provided on one of the clamping members to the other of the clamping members, Each of the pair of cooling members includes an opposing portion with which the semiconductor modules face each other, and flexible portions provided on both ends of the opposing portion in the arrangement direction.

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