Ceramic heater

By positioning a resistance heating element above the thermocouple insertion hole in the ceramic heater design, the issue of temperature non-uniformity is resolved, achieving improved temperature uniformity and reliable temperature measurement on the wafer mounting surface.

JP7727114B1Active Publication Date: 2025-08-20NGK CORP
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Patent Information

Application Number
JP2024533040
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2023-11-29
Publication Date
2025-08-20
Estimated Expiration
2043-11-29

AI Technical Summary

Technical Problem

Conventional ceramic heaters experience cool spots directly above the thermocouple insertion hole due to the resistance heating elements not overlapping with it, leading to temperature non-uniformity on the wafer mounting surface.

Method used

The ceramic heater design includes at least one resistance heating element positioned above the thermocouple insertion hole, with a portion overlapping it in a plan view, and is surrounded by terminal holes, ensuring improved temperature uniformity on the wafer mounting surface.

Benefits of technology

This configuration minimizes the occurrence of cool spots, enhancing temperature uniformity and stability of temperature measurements, while allowing for a wide spacing between terminal holes to prevent short-circuiting.

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Abstract

The ceramic heater 10 comprises a ceramic plate 20 having a wafer mounting surface 21 on its upper surface 20a, inner and outer resistance heating elements 25, 26 embedded in the ceramic plate 20 and wired to zones Z1, Z2 that divide the wafer mounting surface 21 into two, a cylindrical shaft 40 supporting the ceramic plate 20 from its lower surface 20b, a thermocouple insertion hole 30 provided in an inner-shaft region 27 of the lower surface 20b of the ceramic plate 20, and four resistance heating element terminal holes provided in the inner-shaft region 27 corresponding to the terminals 25a, 25b, 26a, 26b of the inner and outer resistance heating elements 25, 26, respectively. The inner resistance heating element 25 is located above a bottom surface 31 of the thermocouple insertion hole 30 and has a portion that overlaps with the thermocouple insertion hole 30 in a plan view.
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