Wireless device with substrate-to-antenna coupling

Abstract

The device includes an integrated circuit (IC) die (205), a substrate (210), a printed circuit board (PCB) (250), an antenna (260), and a waveguide stub (270A). The IC die is attached to the substrate and includes a signal launch (220A) on a surface of the substrate that is configured to emit or receive a signal. The substrate and antenna are attached to the PCB so that the signal launch and the antenna's waveguide opening are aligned and contain a signal channel (230A). The waveguide stub is positioned as a boundary around the signal channel. In some implementations, the waveguide stub has a height of λ / 4, where λ represents the wavelength of the signal. In some implementations, the antenna includes the waveguide stub, and in other implementations, the substrate includes the waveguide stub.

Description

[Technical Field]

[0001] Many wireless communication systems, such as millimeter-wave radar systems, transmit signals from a packaged integrated circuit (IC) to an external antenna via a waveguide. Some ICs use a direct interface between the packaged device and the external waveguide rather than a planar transmission line. Bottom-side launch-on-package assemblies can be manufactured with fewer steps and higher manufacturing reliability compared to top-side launch-on-package assemblies, but can be more difficult to implement at the system level. Alternatively, top-side launch-on-package assemblies can be manufactured without additional steps to add a barrier between the signal channels, but they suffer from poor channel isolation due to the air gap between the device and the waveguide used to feed the three-dimensional (3D) antenna. Known approaches, such as electromagnetic bandgap structures, improve channel isolation but do not result in compact channel placement. Summary of the Invention

[0002] The device includes an integrated circuit (IC) die attached to a substrate, a printed circuit board (PCB), an antenna including a waveguide aperture, and a waveguide stub. The substrate includes a signal launch on a surface of the substrate, the signal launch configured to transmit or receive a signal, and attached to the PCB. The antenna is also attached to the PCB, and the signal launch and the waveguide aperture are aligned and include a signal channel. The waveguide stub is positioned as a boundary around the signal channel.

[0003] In some implementations, the waveguide stub has a height of λ / 4, where λ represents the wavelength of the signal. In some implementations, the center of the waveguide stub is less than λ from the center of the signal channel. The waveguide stub can be integrated into an antenna or a substrate, depending on the particular implementation. The waveguide stub can be straight within the substrate in a direction perpendicular to the surface of the substrate, such that the thickness of the substrate is at least as thick as the height of the waveguide stub. Alternatively, the waveguide stub is L-shaped, having a first arm straight within the substrate in a direction perpendicular to the surface of the substrate and a second arm disposed perpendicular to the first arm. The first arm has a first height, the second arm has a second height, and the thickness of the substrate is at least as thick as the first height. The sum of the first height and the second height is λ / 4.

[0004] In some implementations, the device further includes a second signal channel having a second signal launch on the surface of the substrate and a second waveguide opening in the antenna. A second waveguide stub forms a boundary around the second waveguide channel. In some implementations, the first and second signal channels are positioned proximate to one another such that the first and second waveguide stubs form a waveguide stub structure. The center of the waveguide stub structure is less than λ from the center of the first signal channel and less than λ from the center of the second signal channel, where λ represents the wavelength of the first and second signals.

[0005] In some implementations, the stub waveguide structure includes a dead space section that occupies the space between the first signal channel and the second signal channel. The dead space section is positioned so that the center of the first signal channel is less than λ from the center of the first section of the stub waveguide structure between the first signal channel and the dead space section. The dead space section is also positioned so that the center of the second signal channel is less than λ from the center of the second section of the stub waveguide structure between the second signal channel and the dead space section. [Brief explanation of the drawings]

[0006] [Figure 1A] 1 illustrates an exemplary bottom side launch-on package assembly. [Figure 1B] 1 illustrates an exemplary top side launch-on-package assembly.

[0007] [Figure 2] 1 illustrates an exemplary top-side launch-on-package assembly with a waveguide stub within the waveguide of an associated 3D antenna.

[0008] [Figure 3A] 1 illustrates an exemplary top-side launch-on package assembly with a waveguide stub in the substrate of the package. [Figure 3B] 1 illustrates an exemplary top-side launch-on package assembly with a waveguide stub in the substrate of the package. [Figure 3C] 1 illustrates an exemplary top-side launch-on package assembly with a waveguide stub in the substrate of the package.

[0009] [Figure 4] 1 illustrates an exemplary bottom-side launch-on package assembly with waveguide stubs in the printed circuit board to which the assembly is mounted.

[0010] [Figure 5] 1 illustrates a perspective view of a top-side launch-on-package assembly with a waveguide stub within the waveguide of an associated 3D antenna.

[0011] [Figure 6A] 6 illustrates a graph of channel isolation for the exemplary assembly shown in FIG. 5. [Figure 6B] 6 illustrates a graph of insertion loss for the exemplary assembly shown in FIG. 5. [Figure 6C] 6 illustrates a graph of return loss for the exemplary assembly shown in FIG. 5.

[0012] [Figure 7A] 1 illustrates a cross-sectional view of an exemplary top-side launch-on-package assembly with a circular waveguide stub within the waveguide of an associated 3D antenna. [Figure 7B] 1 illustrates a top view of an exemplary top-side launch-on-package assembly with a circular waveguide stub within the waveguide of an associated 3D antenna. [Figure 7C] 10 illustrates a simulation plot of a signal through an exemplary top-side launch-on-package assembly with a circular waveguide stub within the associated 3D antenna waveguide. [Figure 7D] 1 illustrates a graph of channel isolation for an exemplary top-side launch-on-package assembly with a circular waveguide stub within the associated 3D antenna waveguide.

[0013] [Figure 8A] 1 illustrates a cross-sectional view of a waveguide with a waveguide stub. [Figure 8B] 1 illustrates a top view of a waveguide with a waveguide stub. [Figure 8C] 10 illustrates a simulation plot of a signal through a waveguide. DETAILED DESCRIPTION OF THE INVENTION

[0014] The described device provides an interface to an external antenna that is robust to manufacturing and assembly tolerances, relatively easy to implement at a system level, and has improved channel isolation. The described device includes an integrated circuit (IC) die attached to a substrate having a surface with a signal launch configured to emit or receive a signal. The substrate and the external antenna are attached to a printed circuit board (PCB). The external antenna includes a waveguide aperture. The waveguide aperture and the signal launch are aligned to form a signal channel.

[0015] A waveguide stub is arranged as a boundary around the signal channel to reflect signal leakage from the signal channel. The reflected signal actively interferes with the signal leakage, effectively reducing signal leakage from the signal channel and improving signal isolation. The waveguide stub has a height of λ / 4, where λ is the wavelength of the signal, and is arranged around the signal channel so that the center of the waveguide stub is less than λ away from the center of the signal channel.

[0016] The waveguide stub can be located within an external antenna, a substrate, or a PCB. For a waveguide stub implemented within a substrate, the waveguide stub can be positioned straight within the substrate, in which case the thickness of the substrate is at least as thick as the height of the waveguide stub, λ / 4. Alternatively, the waveguide stub can be L-shaped, with a first arm positioned straight within the substrate and a second arm positioned perpendicular to the first arm. The height of the first arm and the height of the second arm add up to a total height of the waveguide stub, λ / 4. For an L-shaped waveguide stub, the thickness of the substrate is at least as thick as the height of the first arm positioned straight within the substrate.

[0017] For devices with multiple channels, the waveguide stubs surrounding each signal channel can be coupled together into a single cutout around the signal channel. For channel configurations where a single cutout around a signal channel can result in a distance between the center of a particular signal channel and the center of the surrounding waveguide stub being greater than λ, dead space sections can be optionally placed within the waveguide stub to ensure that the distance is less than λ. Any suitable manufacturing technique can be used to create the waveguide stubs based on the desired implementation and feature size.

[0018] 1A illustrates an example of a bottom-side launch-on-package assembly 100A that includes a semiconductor die 105 attached to a package substrate 110 and encapsulated in molding compound 135. The package substrate 110 is coupled to a waveguide-interface side of a PCB substrate 150 by an array of solder balls 115 and 125. A 3D antenna waveguide 160 is coupled to a secondary waveguide side of the PCB substrate 150, opposite the package substrate 110. Signal launches 120A-B are aligned with PCB through-holes 155A-B and waveguides 130A-B of the waveguide 160. The BGA includes open spaces for the signal launches 120A-B and does not include solder balls.

[0019] The solder balls 125 around the antenna launches 120A-B are grounded and act as a waveguide structure between the signal launches 120A-B and the PCB through holes 155A-B. The waveguide structure, including the solder balls 125, separates the signal channels for the signal launches 120A-B and improves impedance matching between the signal launches 120A-B and the waveguide 160. The solder balls 125 also reduce insertion loss between the signal launches 120A-B and the waveguide openings 130A-B of the waveguide 160. However, the reliance on BGA balls 125 and PCB through holes 155A-B adds manufacturing complexity, variability, and cost. Additional grounded BGA balls 125 may be required, which increases overall package size and manufacturing costs. Bottom-side launch-on-package assemblies can also be difficult to use at the system level.

[0020] 1B illustrates an example of a top-side launch-on-package assembly 100B that is similar to the bottom-side launch-on-package assembly 100A shown in FIG. 1A. The assembly 100B includes a semiconductor die 105 attached to a package substrate 110, which is coupled to a PCB substrate 150 by an array of solder balls 115. A 3D antenna waveguide 160 is coupled to the PCB substrate 150 over and around the package substrate 110 and is separated from the signal launches 120A-C and the package substrate 110 by a distance d 185. The signal launches 120A-C are aligned with the waveguide openings 130A-C of the 3D antenna waveguide 160.

[0021] Signal launch 120A launches and / or receives a signal from waveguide opening 130A. However, gap 185 of distance d can create an electric field leakage path 180 between signal launch 120A and signal launch 120B, causing assembly 100 to have poor channel isolation and insertion loss due to high electric field leakage through path 180. The width of gap 185 can vary due to manufacturing tolerances, increasing the reliability degradation of assembly 100B.

[0022] FIG. 2 illustrates an exemplary top-side launch-on-package assembly 200 including a waveguide stub 270 within a waveguide 260 of an associated 3D antenna. Assembly 200 is similar to assembly 100B shown in FIG. 1B and further includes waveguide stubs 270A-D. Waveguides 270A-B flank waveguide opening 230A, waveguide stubs 270B-C flank waveguide opening 230B, and waveguides 270C-D flank waveguide opening 230C. In the cross-sectional view shown in FIG. 2, waveguides 270A-D flank waveguide openings 230A-C, while in a top-down view, waveguides 270A-D surround waveguide openings 230A-C.

[0023] The distance d280 from the center of waveguide opening 230A to the center of waveguide stub 270A is less than the wavelength of interest, λ. The other waveguide stubs 270B-D are similarly spaced apart from the centers of waveguide openings 230B-C. The height h290 of each waveguide 270A-D is approximately λ / 4. Waveguide stubs 270A-D are placed on top of gap 285, which acts as a parallel-plate waveguide, reflecting signals due to the high impedance discontinuity. The reflected signals actively interfere with the electric field leakage between signal launches 220A-C in gap 285, improving insertion loss and reducing leakage between adjacent signal channels.

[0024] The distance d 280 and height h 290 of the waveguide stubs 270A-D in the waveguide 260 can be tuned to the frequency and wavelength λ of the signal of interest. In some implementations of millimeter-wave signals, the height h 290, which is approximately λ / 4, can be on the order of hundreds of micrometers. An appropriate fabrication scheme for the waveguide 260 and the waveguide stubs 270A-D can be selected based on the desired feature size for the particular implementation and wavelength of interest.

[0025] 3A-3C illustrate an example top-side launch-on package assembly 300 including a waveguide stub 370 within the package substrate. Assembly 300 is similar to assembly 200 shown in FIG. 2, except that waveguide stub 370 is located within substrate 310 rather than within waveguide 360. In FIG. 3A, waveguide stub 370 is located vertically within substrate 310. By locating waveguide stub 370 within substrate 310 rather than within waveguide 360, a 3D antenna including waveguide 360 ​​can be selected or modified without the need for waveguide stub 370. As with waveguide stubs 270A-D, the distance d 380 from the center of each waveguide opening 330 to the center of each waveguide stub 370 is less than the wavelength of interest, λ, and the height h 390 of each waveguide stub 370 is approximately λ / 4.

[0026] Including the waveguide stubs 370 in the substrate 310 makes the substrate 310 at least as thick as the height h390, which may be thicker than if the substrate 310 did not include the waveguide stubs 370. In FIG. 3B, the waveguide stubs 370 are L-shaped and are included in the substrate 310. Each L-shaped waveguide stub 370 in assembly 300B has a total depth h390 of approximately λ / 4, divided between the two arms of the L-shape. FIG. 3C shows waveguide stub 370D in more detail, with the total depth h390 divided into a vertical arm h1 394 and a horizontal arm h2 398. Lengths h1 394 and h2 398 add up to the total depth h390. The required thickness of the substrate 310 is reduced from the height 390 of assembly 300A in FIG. 3A to the partial length H1 394. The appropriate fabrication scheme for substrate 310 and waveguide stubs 370A-D can be selected based on the desired feature size for a particular implementation and wavelength of interest.

[0027] FIG. 4 illustrates an exemplary bottom-side launch-on package assembly 400 that includes a waveguide stub 470 within a printed circuit board 450 to which the assembly is mounted. Assembly 400 is similar to assembly 100A shown in FIG. 1A and further includes waveguide stubs 470A-D. Waveguides 470A-B flank waveguide opening 430A, waveguides 470B-C flank waveguide opening 430B, and waveguides 470C-D flank waveguide opening 430C. While waveguide stubs 470A-D flank waveguide openings 430A-C in the cross-sectional view shown in FIG. 4, in a top view, waveguide stubs 470A-D surround waveguide openings 430A-C.

[0028] Similar to waveguide stubs 270A-D and 370A-D, the distance d 480 from the center of each waveguide opening 430 to the center of each waveguide stub 470 is less than the wavelength of interest, λ, and the height h 490 of each waveguide stub 470 is approximately λ / 4. Including waveguide stubs 470 within PCB 450 reduces the required thickness of substrate 410 and allows waveguide stubs to be used in bottom-side assemblies as well as top-side assemblies. An appropriate manufacturing scheme for PCB 450 and waveguide stubs 470A-D can be selected based on the desired feature size for a particular implementation and wavelength of interest.

[0029] FIG. 5 illustrates a perspective view of a top-side launch-on-package assembly 500 with a waveguide stub structure 570 within a waveguide 560 of an associated 3D antenna, similar to the waveguide stub 270 within the waveguide 260 shown in FIG. 2. The angled view of the assembly 500 illustrates a perspective view depicting the side of the waveguide 560 facing the 3D antenna and the waveguide stub structure 570 surrounding the waveguide openings 530A-G. Any number or shape of signal launches on the substrate 510 and corresponding waveguide openings 530A-G can be surrounded by the waveguide stub structure 570. The waveguide stub structures 570 surrounding each waveguide opening 530 can be coupled together into a single cutout section, allowing the signal launches and waveguide openings 530 to be placed closely together, further compacting the channel placement within the assembly 500.

[0030] As shown in the cross section of waveguide 260 in FIG. 2 , the depth of waveguide stub structure 570 need not extend completely from the IC-facing side of waveguide 560 to the 3D antenna-facing side. Gaps 585 act as parallel-plate waveguides between signal launches, causing signal leakage between channels. To counteract signal leakage through gaps 585, waveguide stub structures 570 surrounding each waveguide opening 530 reflect the signal leakage, and the reflected signals actively interfere with the signal leakage to improve channel isolation. The active interference between the reflected signals from waveguide stub structures 570 and the signal leakage through gaps 585 significantly reduces the amount of signal leakage reaching adjacent channels.

[0031] 6A-6C illustrate graphs of channel isolation, insertion loss, and return loss for the example top-side launch package assembly 500 shown in FIG. The channel isolation, insertion loss, and return loss graphs are included for illustrative purposes only and do not necessarily represent an optimized assembly. Additionally, the channel isolation, insertion loss, and return loss graphs correspond to a particular implementation of specific parameters; other implementations with other parameters will result in different channel isolation, insertion loss, and return loss.

[0032] Figure 6A shows a graph of channel isolation 600A for assembly 500 with waveguide stub 570 and channel isolation 650A for a similar assembly without the waveguide stub. Channel isolation 600A is approximately 20 decibels (dB) better than channel isolation 650A at frequencies of interest, shown as Frequency A, Frequency B, and Frequency C. Figure 6B shows a graph of insertion loss 600B for assembly 500 with waveguide stub 570 and insertion loss 650B for a similar assembly without the waveguide stub. Insertion loss 600B is approximately 2 dB better than insertion loss 650B at frequencies of interest.

[0033] 6C shows a graph of return loss comparing the return loss 600C at the signal launch 520 relative to the return loss 610 at the waveguide aperture 530 with the waveguide stub 570 with the return loss 650C at the signal launch relative to the return loss 660 at the waveguide aperture without the waveguide stub. The waveguide stub 570 improves the return loss of the assembly 500 by more than 16 dB, compared to approximately 11 dB for a similar assembly without the waveguide stub. The inclusion of the waveguide stub in the launch package assembly improves insertion and return loss, as well as channel isolation.

[0034] 7A-7D show top and cross-sectional views of an exemplary top-side launch-on-package assembly 700 with a circular waveguide stub 770 within the waveguide of an associated 3D antenna, as well as simulation plots of a signal through assembly 700 and a graph of channel isolation for assembly 700. The circular waveguide opening 730 and circular waveguide stub 770 within assembly 700 illustrate that signal launches, waveguide openings, and waveguide stubs of any shape can be implemented as long as the center of waveguide stub 770 is a distance d780 from the center of waveguide opening 730. Distance d780 is less than the wavelength λ of interest.

[0035] FIG. 7A shows a cross-sectional view 700A of assembly 700. Signal launches 720A-B are aligned with waveguide apertures 730A-B, respectively, and separated from waveguide apertures 730A-B by gaps 785, which act as parallel plate waveguides. Waveguide stubs 770A-B have heights 790h, which are approximately λ / 4. FIG. 7B shows a top view 700B of assembly 700. Waveguide apertures 730A-B are surrounded by waveguide stubs 770A and 770B, respectively. The centers of waveguide stubs 770A-B are a distance d 780 from the centers of waveguide apertures 730A-B.

[0036] FIG. 7C shows a simulation plot 700C of a signal through gap 785, waveguide apertures 730A-B, and waveguides 770A-B. A signal is transmitted from launch 720A through waveguide aperture 730A. The reflected signal from waveguide stub 770A blocks signal leakage from signal launch 720A, significantly reducing the signal leakage experienced by signal launch 720B and waveguide aperture 730B and improving channel isolation. FIG. 7D shows a graph of channel isolations 792, 794, 796, and 798 for four channels with circular waveguide aperture 730 and circular waveguide stub 770. Channel isolations 792, 794, 796, and 798 are greater than 120 dB.

[0037] 8A-8C illustrate top and perspective views of a waveguide 800 with a waveguide stub structure 870, and a simulated plot 800C of a signal through the waveguide. Similar to the circular waveguide opening 730 and waveguide stub 770 shown in FIGS. 7A-B, the rectangular waveguide opening 830 illustrates that signal launches, waveguide openings, and waveguide stubs of any shape can be implemented.

[0038] FIG. 8A shows a top view 800A of the IC-facing side of waveguide 800. Waveguide openings 830A-G expose locations through which corresponding signal launches 820A-G can transmit and receive signals. Each waveguide opening 830 is surrounded by a cutout of a waveguide stub structure 870. A compact channel arrangement of waveguide openings 830A-G couples the individual waveguide stubs together around each waveguide opening to form waveguide stub structure 870. Dead space sections 850 are bumps or space-filling sections optionally positioned between waveguide openings 830A-G to occupy the space of waveguide stub 870, so that the centers of cutout waveguide stub structures 870 are no greater than a wavelength of interest from the centers of adjacent waveguide openings 830.

[0039] Dead space section 850A occupies the space between waveguide openings 830A and 830G, thereby ensuring that the distance d880 between the center of waveguide opening 830A and the center of the section of waveguide stub structure 870 between waveguide opening 830A and dead space section 850A is less than λ. The remaining dead space sections 850B-F are similarly positioned to divide notched waveguide stub structure 870, keeping the distance d880 between the center of waveguide opening 830 and the center of the neighboring section of waveguide stub structure 870 less than λ. FIG. 8B shows a perspective view 800B of the IC-facing side of waveguide 800 and illustrates that height h890 of waveguide stub structure 870 is approximately λ / 4. Dead space sections 850 divide the space between notched waveguide stub structures 870.

[0040] 8C shows a simulation plot 800C of a signal through gap 885 between waveguide 800 and signal launch 820, waveguide openings 830A-G, and waveguide stub structure 870. A signal is transmitted from signal launch 820D through waveguide opening 830D. The reflected signal from the section of waveguide stub structure 870 around waveguide opening 830D actively interferes with the signal leakage from signal launch 820D through gap 895 between signal launch 820D and waveguide 800. The leakage occurring at adjacent waveguide openings 830C and 830E is significantly reduced, so that corresponding signal launches 820C and 820E are isolated from signal launch 820D.

[0041] The term "couple" is used throughout this specification. This term may encompass a connection, communication, or signal path that enables a functional relationship consistent with the description herein. For example, in a first example, device A is coupled to device B if device A generates a signal to control device B to perform a certain action, or in a second example, device A is coupled to device B via an intervening component C such that device B is controlled by device A via a control signal generated by device A, where intervening component C does not substantially change the functional relationship between device A and device B.

[0042] Modifications may be made to the exemplary embodiments described, and other embodiments are possible, within the scope of the claims of the invention.

Claims

1. A device, a printed circuit board (PCB); a substrate attached to the PCB, the substrate including a signal launch on a surface of the substrate configured to emit or receive a signal; an integrated circuit (IC) die attached to the substrate; an antenna mounted on the PCB, the antenna including a waveguide aperture aligned to the signal launch to form a signal channel; a waveguide stub disposed as a boundary around the signal channel; Including, the antenna is separated from the substrate by a gap, the signal launch is within the gap; A device wherein the center of the waveguide stub is at a distance less than λ from the center of the signal channel, where λ represents the wavelength of the signal.

2. 10. The device of claim 1, The device wherein the waveguide stub has a height of λ / 4.

3. 10. The device of claim 1, A device wherein the antenna includes the waveguide stub disposed as a boundary around the waveguide opening.

4. 10. The device of claim 1, The device wherein the substrate includes the waveguide stub disposed as a boundary around the signal launch.

5. A device, a printed circuit board (PCB); a substrate attached to the PCB, the substrate including a signal launch on a surface of the substrate configured to emit or receive a signal; an integrated circuit (IC) die attached to the substrate; an antenna mounted on the PCB, the antenna including a waveguide aperture aligned to the signal launch to form a signal channel; a waveguide stub disposed as a boundary around the signal channel, the waveguide stub being straight in the substrate in a direction perpendicular to a surface of the substrate; Including, A device wherein the substrate is at least as thick as the height of the waveguide stub.

6. A device, a printed circuit board (PCB); a substrate attached to the PCB, the substrate including a signal launch on a surface of the substrate configured to emit or receive a signal; an integrated circuit (IC) die attached to the substrate; an antenna mounted on the PCB, the antenna including a waveguide aperture aligned to the signal launch to form a signal channel; a waveguide stub disposed as a boundary around the signal channel, the waveguide stub being L-shaped; a first arm that is straight within the substrate in a direction perpendicular to the surface of the substrate and has a first height; a second arm disposed perpendicular to the first arm and having a second height; the waveguide stub, Including, A device wherein the sum of the first and second heights is λ / 4, where λ represents the wavelength of the signal, and the thickness of the substrate is at least as thick as the first height.

7. A device, a printed circuit board (PCB) including a waveguide stub and an opening from a first surface of the PCB to a second surface of the PCB opposite the first surface, the waveguide stub being disposed as a boundary around the opening; a substrate including a surface attached to a first surface of the PCB and a signal launch on the surface configured to emit or receive a signal; an integrated circuit (IC) die attached to the substrate; an antenna including a waveguide aperture aligned with the signal launch to form a signal channel, the antenna being mounted on the second surface of the PCB such that the signal launch, the aperture, and the waveguide aperture are aligned; Including, The device wherein the waveguide stub is disposed as a boundary around the signal channel.

8. A device, a printed circuit board (PCB); a substrate attached to the PCB, the substrate including first and second signal launches on a surface of the substrate configured to emit or receive first and second signals, respectively; an integrated circuit (IC) die attached to the substrate; an antenna mounted on the PCB, the antenna including first and second waveguide apertures, the first waveguide aperture aligned to the first signal launch to form a first signal channel, and the second waveguide aperture aligned to the second signal launch to form a second signal channel; a first waveguide stub disposed as a boundary around the first signal channel; a second waveguide stub disposed as a boundary around the second signal channel; Including, the first waveguide stub and the second waveguide stub sandwich the first signal channel.

9. 9. The device of claim 8, the first and second signal channels are arranged such that the first waveguide stub and the second waveguide stub form a waveguide stub structure; A device wherein the center of the waveguide stub structure is less than λ from the center of the first signal channel and the center of the second signal channel, where λ represents the wavelength of the first and second signals.

10. 9. The device of claim 8, the first waveguide stub and the second waveguide stub form a waveguide stub structure, the device further includes a dead space section disposed between the first signal channel and the second signal channel within the waveguide stub structure, such that: a center of the first signal channel is at a distance of less than λ from a center of a first section of the waveguide stub structure between the first signal channel and the dead space section; a center of the second signal channel is at a distance less than λ from a center of a second section of the waveguide stub structure between the second signal channel and the dead space section, where λ represents a wavelength of the first and second signals.

11. 1. A printed circuit board (PCB), comprising: a PCB substrate; a package substrate attached to the PCB substrate, the package substrate including a signal launch on a surface of the package substrate configured to emit or receive a signal; an integrated circuit (IC) die attached to the package substrate; a waveguide to an antenna, the waveguide being attached to the PCB substrate above the package substrate, the waveguide being separated from a surface of the package substrate by a gap and including a waveguide opening aligned to the signal launch; a signal channel between the signal launch and the antenna, the signal channel including the gap and the waveguide opening; a waveguide stub disposed as a boundary around the signal channel; Including, the signal launch is within the gap; A PCB wherein the center of the waveguide stub is at a distance of less than λ from the center of the signal channel, and the waveguide stub has a height of λ / 4, where λ is the wavelength of the signal.

12. 12. The PCB of claim 11, The PCB, wherein the waveguide includes the waveguide stub disposed as a boundary around the waveguide opening.

13. 12. The PCB of claim 11, The PCB, wherein the package substrate includes the waveguide stub disposed as a boundary around the signal launch.

14. 1. A printed circuit board (PCB), comprising: a PCB substrate; a package substrate attached to the PCB substrate, the package substrate including a signal launch on a surface of the package substrate configured to launch or receive a signal, and a waveguide stub disposed as a boundary around the signal launch; an integrated circuit (IC) die attached to the package substrate; a waveguide to an antenna, the waveguide being attached to the PCB substrate above the package substrate, the waveguide being separated from a surface of the package substrate by a gap and including a waveguide opening aligned to the signal launch; a signal channel between the signal launch and the antenna, the signal channel including the gap and the waveguide opening; Including, the waveguide stub is straight within the package substrate in a direction perpendicular to a surface of the package substrate and is disposed as a boundary around the signal channel; A PCB, wherein the thickness of the package substrate is at least λ / 4, where λ is the wavelength of the signal.

15. 1. A printed circuit board (PCB), comprising: a PCB substrate; a package substrate attached to the PCB substrate, the package substrate including a signal launch on a surface of the package substrate configured to launch or receive a signal, and a waveguide stub disposed as a boundary around the signal launch; an integrated circuit (IC) die attached to the package substrate; a waveguide to an antenna, the waveguide being attached to the PCB substrate above the package substrate, the waveguide being separated from a surface of the package substrate by a gap and including a waveguide opening aligned to the signal launch; a signal channel between the signal launch and the antenna, the signal channel including the gap and the waveguide opening; Including, the waveguide stub is L-shaped and positioned as a boundary around the signal channel; The waveguide stub is a first arm that is straight within the package substrate in a direction perpendicular to a surface of the package substrate and has a first height; a second arm disposed perpendicular to the first arm and having a second height; Including, a sum of the first height and the second height is λ / 4, where λ is a wavelength of the signal, and a thickness of the package substrate is at least as thick as the first height.

16. A device, a printed circuit board (PCB); A substrate attached to the PCB, a first signal launch on a surface of the substrate configured to emit or receive a first signal; a second signal launch on a surface of the substrate configured to emit or receive a second signal; the substrate, an integrated circuit (IC) die attached to the substrate; a waveguide to an antenna, the waveguide being attached to the PCB and including a first opening aligned with the first signal launch to form a first signal channel and a second opening aligned with the second signal launch to form a second signal channel; a first waveguide stub disposed as a boundary around the first signal channel; a second waveguide stub disposed as a boundary around the second signal channel; Including, the first waveguide stub and the second waveguide stub sandwich the first signal channel.

17. 17. The device of claim 16, a device, wherein the waveguide includes the first waveguide stub disposed as a boundary around the first opening and the second waveguide stub disposed as a boundary around the second opening.

18. 17. The device of claim 16, a device, wherein the substrate includes the first waveguide stub disposed as a boundary around the first signal launch and the second waveguide stub disposed as a boundary around the second signal launch.

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