On-package signal launch and antenna structure

Abstract

A device comprising a circuit board (808) including a top surface and a bottom surface, a package (810) including a bottom surface attached to the top surface of the circuit board, and an antenna structure (802) attached to the bottom surface of the circuit board. The antenna structure extends through an opening in the circuit board.

Description

Technical Field

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[0001] A high-frequency integrated circuit (IC) generates millimeter-wave signals, such as those used in automotive radar, in the range of approximately 76 GHz to 81 GHz. In conventional IC packaging, these signals are transitioned to planar transmission lines on a circuit board, for example, via a ball grid array. The planar transmission line conveys the signal from one location to another on the circuit board, such as from a signal ball pad to an external waveguide launch. The external waveguide can be used to feed a three-dimensional antenna.

[0002] Examples that can improve the above considerations will be described.

Summary of the Invention

[0003] In one example, there is a device comprising a circuit board including a top surface and a bottom surface, a package including a bottom surface attached to the top surface of the circuit board, and an antenna structure attached to the bottom surface of the circuit board. The antenna structure extends through an opening in the circuit board.

[0004] Other aspects are also described and claimed.

Brief Description of the Drawings

[0005] [Figure 1] It is a diagram of a circuit board 100.

[0006] [Figure 2] A cross-sectional side view of a circuit board 200 is shown.

[0007] [Figure 3] It is a perspective view of a package 310.

[0008] [Figure 4] It is a diagram of a circuit board 400.

[0009] [Figure 5]This is a cross-sectional side view of package 502.

[0010] [Figure 6A] This is a plan view of the signal launch in the form of a slot antenna 602. [Figure 6B] This is a perspective view of the signal launch in the form of a slot antenna 602.

[0011] [Figure 6C] Figures 6A and 6B show additional partial perspective views of the selected slot antenna 602. [Figure 6D] Figures 6A and 6B show additional partial perspective views of the selected slot antenna 602.

[0012] [Figure 7] This is a diagram of a single ridge aperture for a slot antenna 700.

[0013] [Figure 8A] This is a cross-sectional side view of antenna structure 802. [Figure 8B] This is an exploded perspective view of antenna structure 802.

[0014] [Figure 8C] This shows a plan view of the interface area between the structures in Figures 8A and 8B. [Modes for carrying out the invention]

[0015] Specific examples will be described in detail below with reference to the attached drawings. These examples are not intended to be limiting, and it should be understood that, unless otherwise noted, no particular features are required in any given example. Furthermore, the formation of a first feature on or over a second feature in the following description may include examples where the first and second features are formed in direct contact, and examples where an additional feature is formed between the first and second features so that they do not come into direct contact.

[0016] Routing high-frequency signals via planar transmission lines increases the complexity and cost of manufacturing circuit boards and often results in signal power loss. Depending on the integrated circuit (IC), some use a direct interface between a packaged IC device and an external waveguide rather than a planar transmission line. The direct interface should have low coupling loss between signal channels and high insulation. Also, the direct interface should be robust to manufacturing tolerances and assembly tolerances.

[0017] The device of the present disclosure may include a direct interface between an antenna structure and one or more slot antennas on an IC package. To achieve this direct interface, means can be taken to remove a notch portion of the circuit board or otherwise enable an extension of the antenna structure to protrude through the notch of the circuit board toward one or more slot antennas on the IC package. Thus, when the IC package is mounted on the circuit board, the slot antenna on the package can be in direct contact with or very close to the extension of the antenna structure protruding through the circuit board notch.

[0018] This design can enable any one or more of a smaller antenna, a smaller circuit board notch, and fewer ball grid array (BGA) balls in the system. In some examples, the system can be any one or more of less complex, easier to manufacture, and easier to assemble due to this design. Also, the system can have improved frequency characteristics and lower signal loss than other designs. Of course, these advantages are merely examples and there are no advantages that are essential to any particular example.

[0019] An example of a launch coupling mechanism will be described hereinafter with reference to the figures. In this regard, FIG. 1 is a diagram of a circuit board 100 such as a printed circuit board (PCB). The circuit board 100 includes a plurality (e.g., eight) of waveguide launches 102 disposed between BGAs formed by BGA balls 104. In FIG. 1 and subsequent figures, the x-y (or x-y-z) coordinate directions are also shown, and in FIG. 1, the circuit board 100 generally lies along the x-y plane (and may have a z-dimensional thickness extending in the direction into the image). The direction references are for the purpose of relative placement, but such terms are not intended to be limiting as the device can be rotated within space, thereby changing the absolute but not relative reference.

[0020] Additional exemplary details of waveguide launches and BGAs can be found in U.S. Patent No. 11,196,146, titled "Grounded BGA Waveguide Interface between On-Package Signal Launch and External Waveguide," assigned to the same assignee as this application and registered on December 7, 2021, and U.S. Patent Application No. 18 / 091,295, titled "Wireless System Package," filed on December 29, 2022, each of which is incorporated herein by reference in its entirety.

Patent Document 1

Patent Document 2

[0021] The majority of the area on the circuit board 100 is occupied by waveguide launches 102 and surrounding BGA balls 104, as shown by the black dashed outer outline 106. Each waveguide launch 102 on the circuit board 100 occupies the area of ​​2 × 4 balls 104 relative to the total area of ​​8 balls. The outer perimeter of the rectangle of 16 balls 104 surrounds each waveguide launch 102, and the 16 balls 104 are arranged in a 4 × 6 rectangle, with the inner 12 balls being omitted because the area of ​​the launches 102 surrounded by the balls is occupied. Each of these 16 balls 104, and all balls within the black dashed outer outline 106, can be grounded to provide isolation for signals transmitted or received by their respective waveguide launches 102. The ball 104 outside the black dashed outer outline 106 may be grounded, coupled to a power supply, coupled to a digital converter within the package, or used for signal transmission (e.g., general-purpose or application-specific input / output).

[0022] It may be desirable to reduce the area occupied by each waveguide launch 102 and the surrounding balls 104 on the circuit board 100. Each waveguide launch 102 and the surrounding balls 104 on the circuit board 100 occupy an area of ​​4 × 6 for the equivalent space corresponding to a total of 24 balls. This disclosure describes techniques that may be used to reduce the area of ​​each waveguide launch 102, and the surrounding balls 104 may be reduced to, for example, 4 × 5 (20 balls), 3 × 6 (18 balls), or 3 × 5 balls (15 balls).

[0023] Reducing this area may enable any one or more of the following: reducing the size of the circuit board 100, increasing the number of waveguide launches on the circuit board 100, and / or adding other functionality to the circuit board 100. For example, smaller waveguides with a smaller BGA footprint may free up space on the circuit board 100 for other functionality. While the techniques described herein are described in relation to reducing the area on the circuit board 100, the techniques of this disclosure may also be used with larger area waveguide launches, such as the 4×6 array shown in Figure 1.

[0024] Figure 2 shows a cross-sectional side view of the circuit board 200, the IC package 210, and the antenna structure 220. The IC package 210 is mounted to the circuit board 200 via a BGA that includes four conductive balls 230 as shown in Figure 2. There are two apertures 240 and 250 (or openings) extending through the circuit board 200, each of which is aligned with the gap between the conductive balls 230. The antenna structure 220 also includes two channels 260 and 270, each of which is aligned with the two apertures 240 and 250 extending through the circuit board 200, respectively. The two channels 260 and 270 may further include a first portion having a first uniform shape (e.g., cylindrical) in the z-dimension and being closer to the circuit board 200, while having a second shape (e.g., frustoconical) in the z-dimension and being further away from the circuit board 200.

[0025] As an example, IC package 210 may include a signal launch in the form of a transmitter antenna 280, configured to communicate (e.g., transmit) a signal via a corresponding aperture (e.g., 240) in a circuit board 200 and a corresponding channel (e.g., 260) in an antenna structure 220. The transmitted signal may pass through an area enclosed by some of the balls 230 in the xy plane (some are shown in Figure 2, others are not shown in the x dimension). As another example, IC package 210 may include a signal launch in the form of a receiver antenna 290, configured to communicate (e.g., receive) a signal after it has passed through a corresponding channel (e.g., 270) in an antenna structure 220, an aperture (e.g., 250) in a circuit board 200, and an area enclosed by the balls 230 in the xy plane.

[0026] Figure 3 is a perspective view of package 310 incorporating two signal launches, shown as patch antennas 312 and 314. Each of the patch antennas 312 and 314 is provided by their respective xy-plane conductive plates within their respective areas 312A and 314A. Each of areas 312A and 312B is surrounded by their respective sets of 4 × 5 BGA balls 316. Each conductive plate functioning as a patch antenna 312 and 314 is coplanar (in the xy plane) with the first metal surface 318. Thus, areas 312A and 314A can be openings (e.g., squares or rectangles) penetrating the first metal surface 318. Also, each of areas 312A and 314A may consume an area where a 2 × 3 BGA pattern would otherwise be laid, i.e., an area accommodating 6 BGA balls. Below the first metal surface 318 (in the z-dimension), there are signal communication feeds 320 and 322, each coupled to one of the patch antennas 312 and 314, respectively, by, for example, conductive vias (not visible in the perspective view). For example, the signal communication feed 320 can transmit a signal to the patch antenna 312 via its respective z-dimension vias (not shown), and from the patch antenna 312, the signal can be communicated in a z-dimension surrounded by an array of 4x5 BGA balls. In another example, the signal may be received by the patch antenna 314, isolated by a surrounding array of 4x5 BGA balls, and the signal may be coupled to the signal communication feed 322 via a z-dimension conductive via (not shown). The signal communication feeds 320 and 322 may be coplanar (in the xy-plane) and, in some cases, may be formed during the same process as the second metal surface 340. The second metal plane 340 is substantially parallel to the first metal plane 318, and the first and second metal planes 318 and 340 are separated from each other by, for example, one or more (e.g., dielectric) layers.

[0027] Figure 3 also shows the antenna structure 330 through which the aforementioned signal can pass in shadow form. The antenna structure 330 includes channel 320A located within the signal path of the first patch antenna 312. The antenna structure 330 also includes channel 320B located within the signal path of the second patch antenna 314. In the illustrated example, each of channels 320A and 320B has a roughly H-shaped cross-section in the xy-plane and forms a double-ridge waveguide in the z-dimension. In both Figures 2 and 3, a circuit board (not shown) is placed between the package and the antenna structure, leaving an air gap between the package and the antenna structure.

[0028] Figure 4 shows a circuit board 400 including a double-ridge aperture 402. The aperture 402 has two ridges 404 and 406, which are formed from portions of the circuit board 400 that extend inward toward the center of the aperture 402 to the outer perimeter of the outermost rounded-corner rectangle of the aperture 402. Thus, the combination of the outermost rounded-corner rectangle and the inwardly extending ridges 404 and 406 gives the aperture 402 a dogbone or dumbbell shape in the xy plane. The aperture 402 is also surrounded by 14 balls 408 in a 5x4 array.

[0029] The aperture 402 has an outer boundary that forms a wall 410 in the z dimension, and the wall 410 may be electroplated with copper or another conductive material 412 or otherwise coated. Each of the balls 408 can be attached to the circuit board 400 by solder, and it may be desirable to prevent the solder from coming into contact with the conductive material 412 on the wall 410 of the aperture 402. To prevent the solder from coming into contact with the conductive material 412, the assembly process may include applying a solder mask to the circuit board 400 between the aperture 402 and the balls 408. After applying the solder mask to the circuit board 400, the assembly process may include attaching each ball 408 to its respective pad on the circuit board 400 (not visible from the viewpoint in Figure 4) using solder. After the balls 408 are attached to the circuit board 400, the solder mask may be removed.

[0030] To maintain a sufficiently large distance between the ball 408 (or BGA pad) and the conductive material 412 of the aperture 402, it may be desirable for the area of ​​the aperture 402 within the circuit board 400 to be small. This distance is represented as D1 in Figure 4. The minimum design value of D1 (solder mask distance) may be limited by the BGA perimeter surrounding each aperture 402. The difficulty and cost of milling and drilling small apertures (especially apertures with ridge features) may impose a lower limit on the size of each aperture 402.

[0031] Furthermore, the cutoff frequency of a signal waveguide can be inversely proportional to its cross-sectional area. Therefore, a decrease in the cross-sectional area of ​​aperture 402 can increase the cutoff frequency of the waveguide, which can act as a high-pass filter. If the cutoff frequency is higher than the frequency of the signal conducted by the waveguide, the waveguide may prevent the signal from passing through. It may be desirable to design the aperture to be sufficiently large so that the cutoff frequency is much lower than the lowest RF frequency.

[0032] Figure 5 is a cross-sectional side view of an IC package 502 coupled to a circuit board 504 (e.g., a PCB) via a ball 506. In some examples, the IC package 502 includes a signal launch (e.g., a slot antenna or patch antenna) on or associated with the bottom surface of the IC package 502. Signals transmitted or received by the launch travel through an area (e.g., a gap) enclosed by the ball 506, through an aperture 508 in the circuit board 504, and below the gap in the ball 506. Although not shown in Figure 5, signals may also pass through an antenna structure mounted on the bottom surface of the circuit board 504. For the signal to travel between the launch and the antenna structure, the signal must pass through the gap enclosed by the ball 506 and the aperture 508 of the circuit board 504 in the z-dimension of Figure 5.

[0033] As will be explained in more detail later, reducing the distance between the launch and the antenna structure can improve the performance of the sensor device. For example, a direct (or nearly direct) physical coupling between the launch and the antenna structure can improve any one or more of the following: cost, manufacturing and assembly complexity, and the frequency characteristics of the device.

[0034] Figures 6A and 6B are plan and perspective views, respectively, of a signal launch in the form of a slot antenna 602, which can be integrated into an IC package. Figures 6C and 6D show additional partial perspective views of selected slot antennas 602 from Figures 6A and 6B to help illustrate various hierarchies.

[0035] Figures 6A to 6C include a first plane 604 which can be considered a bottom surface view in that it is located along the bottom of the IC package, the bottom of which faces the first surface of the circuit board, and the antenna structure is located on a second surface of the circuit board opposite to the first surface, as will be shown later in Figure 8A. The first plane 604 may be a metal incorporated into the IC package, and only a portion of the package is shown to illustrate the slot antenna 602.

[0036] The slot antenna 602 includes a radiating aperture 606. The radiating aperture 606 is formed as a void, opening, or other passage through the first plane 604 so that a wave signal can pass through it in the z-dimensional plane. The radiating aperture 606 may, for example, have a rectangular or square outer perimeter shape. The radiating structure 606 may consume an area where a 1×3 BGA pattern would otherwise be laid, i.e., an area to accommodate three BGA balls. Thus, for similar ball and pitch sizes compared to Figure 3, the antenna area in Figure 6A is approximately 50% smaller. The radiating aperture 606 may be isolated by one or more structures. For example, a pattern of conductive vias 608 may be formed to generally surround most of the radiating aperture 606 and extend in the z-dimensional plane. In another example, several BGA balls 610 may surround the radiating aperture 606. However, the BGA balls 610 extend upward in Figures 6A and 6B, while the vias 608 extend downward. Thus, the layout of the BGA balls 610 above the first plane 604 can completely enclose the radiating aperture 606, while the vias 608 below the first plane 604 extend partially around the radiating aperture 606, but also form paths 612 away from the radiating aperture 606, as will be explained further later.

[0037] The slot antenna 602 also includes a slot radiator 614. The slot radiator 614 is a conductor in a second planar position and may be formed simultaneously with a second plane 616 (Figure 6D), which is different from the first plane 604 (Figures 6A-6C) and possibly parallel to the first plane 604. The second plane 616 may be metallic and may be below the first plane 604 in the z dimension. The slot radiator 614 extends through path 612 (and receiving signal protection by via 608 in path 612) into and out of the area of ​​the radiating aperture 606. The slot radiator 614 extends along the path 612 and has a predetermined shape in the xy-plane, such as a rectangle, and this shape is uniform (continuous and invariant) in a first direction until the slot radiator 614 terminates at the radiator tip 614T, and in the opposite direction as the slot radiator 614 extends into the xy-plane beyond the xy boundary of the radiating aperture 606. This is in contrast to other signal launches, which may include radiating elements on one plane and radiating patches having a larger area than radiating elements on another plane (when considered in the z-dimension within the boundary of the surrounding radiating aperture 606), and vias between them. Away from the radiating aperture 606, the slot radiator 614 may be connected to an additional structure (not shown) which provides a signal to be transmitted or further receives a signal from the slot radiator 614 that is received within the radiating aperture 606. The radiator tip 614T provides a termination located within the radiating aperture 606 in a first dimension (e.g., z-dimension), and the tip 614T is also located within the outer boundary of the radiating aperture 606 in second and third dimensions (x-dimension and y-dimension). Thus, the slot antenna 614, including the combination of the radiator tip 614T and the radiating aperture 606, can transmit or receive electromagnetic signals via the z-dimension, which is generally bounded by the outer periphery of the xy-plane of the radiating aperture 606. Finally, a third plane 618 may be included in this configuration as part of or in connection with the slot antenna 602. The third plane 618 may function as a back reflector for the cavity provided by the radiating aperture 606.In one example, the third plane 618 is a conductive surface that acts as a reflector, and is located at a distance from the first plane 604 (and radiating aperture 606) of one-quarter of the wavelength of the wave signal to be communicated by the slot antenna 602, in order to obtain appropriate performance from the system. Deviation from the exact distance results in a reduction in bandwidth and gain in performance. Via 608 may extend to each of the first plane 604, the second plane 616, and the third plane 618. Thus, each of these planes may have the same potential (e.g., ground).

[0038] From the above, it can be understood that the slot antenna 602 may occupy the area of ​​approximately three balls 610. Because of their small size, the balls 610 may be arranged around a 3x5 perimeter surrounding the radiating aperture 606. Despite their smaller size, the slot antenna 602 may also offer one or more of several other desirable attributes. The slot antenna 602 may have a larger bandwidth of reflection loss below the threshold level compared to a patch antenna of similar size. As just one example, the slot antenna 602 may have a bandwidth of approximately 6.0 GHz with a reflection loss of less than -20 dB, while the patch antenna may have a bandwidth of 2.5 GHz with a reflection loss of less than -20 dB. The insertion loss of both types of antennas may be approximately -1 dB across the relevant bandwidth.

[0039] Figure 7 shows a single ridge aperture of the slot antenna 700. Figure 7 also shows a circuit board 702 including the ridge 704, and Figure 7 also shows an IC package 706 including the slot antenna 700. The slot antenna 700 is small enough to fit within the perimeter of a 3x5 BGA. Given the relationship between size and cutoff frequency, the slot antenna 700 may have a relatively low cutoff frequency. The ridge 704 can reduce this cutoff frequency to a more acceptable level.

[0040] As shown in Figure 7, the aperture of the circuit board 702 is surrounded by the outer perimeter of a 3x5 BGA ball 708. Depending on the BGA pitch, the dimensions of this aperture can be less than 2 mm x 1 mm. Creating an aperture of this size on the circuit board 702 by milling, for example, can be difficult and costly, especially if the manufacturing involves metal deposition within the aperture. In contrast, and as will be shown later, ridgeless, single-ridge, or double-ridge shapes can be designed within the antenna structure rather than milling that shape onto the circuit board 702. Also, metal deposition (e.g., electroplating) can be performed on the antenna structure rather than on the circuit board.

[0041] Figure 8A is a cross-sectional side view of the antenna structure 802 including the bottom flat surface 802PS, and Figure 8B is an exploded perspective view thereof. The antenna structure 802 includes an extension 804 (Figure 8B: outlined generally with dashed lines in Figure 8A) that protrudes away from the flat surface 802PS (e.g., in the z dimension). In Figure 8B, the extension 804 is shown as a roughly square or rectangular, but the extension 804 may have different shapes such as circular or elliptical, and / or the extension 804 may have rounded corners. When the three exploded view components of Figure 8B are assembled as shown in Figure 8A, the extension 804 may extend through an opening 806 in the circuit board 808. The opening 806 may be formed as an aperture or notch by removing or avoiding the formation of material in a desired area. The circuit board 808 is located between the IC package 810 and the antenna structure 802. For example, the IC package 810 may be larger than the aperture 806 in the x and y dimensions and may be mounted on a first surface of the circuit board 808, while the antenna structure 802 may be mounted on a second surface of the circuit board 808 opposite to the first surface. The IC package 810 includes one or more launches 812 (Figure 8A) on or near its bottom surface. Each of the launches 812 can take various forms, including, for example, the slot antenna 602 shown in the previous figure, but not limited to these. The extension 804 fits through the aperture 806 and extends to a position touching or near the bottom of the package 810 (e.g., in the range of 100 μm to 200 μm). The antenna structure 802 includes one or more waveguide channels 814 or passages / apertures through the material forming the antenna structure 802, matched in one-to-one correspondence with each of the one or more launches 812. Accordingly, in Figure 8A, each waveguide channel 814 generally provides a z-dimensional radio frequency (RF) path or electromagnetic coupling mechanism for signals radiated to or from each launch 812. Furthermore, the cross-sectional shape of each waveguide channel 814 in the xy plane can be a rectangle with 0, 1, 2, or more ridges. By directly coupling to the bottom surface of the IC package 810, the antenna structure 802 can be configured to eliminate any gaps between the IC package 810 and the antenna structure 802.By eliminating such gaps, leakage that may occur when signals are communicated between the launch 812 on the IC package 810 and the antenna structure 802 can be reduced.

[0042] Figure 8C shows a plan view of a portion of the interface area between the antenna structure extension 804 and the bottom surface of the IC package 810. From the perspective view in Figure 8C, it can be seen that each waveguide channel 814 is surrounded by BGA contact pads 816 to which BGA balls can be connected. However, these BGA balls are absent in part of the bottom surface of the IC package 810, so that the extension 804 can be positioned to contact or approach the bottom surface of the IC package 810. In other cases, outside the boundary of the antenna structure extension 804, the corresponding BGA ball 818 is positioned adjacent to the BGA contact pad (which is not visible as it is beneath the BGA ball in each instance). Also, from Figures 8A and 8B, it should be understood by referring to Figure 8C that each waveguide channel 814 aligns with one of the corresponding package launches 812. Also, in the illustrated example, the surrounding BGA contact pads 816 form a 4x3 pattern surrounding each waveguide channel 814. Furthermore, the waveguide channel 814 is missing only three BGA contact pads 816.

[0043] As a mere example, if the bottom surface of the IC package 810 has eight launches 812, the antenna structure 802 may include a single extension 804 having eight waveguide channels 814, or the antenna structure 802 may include two or more extensions 804, in which case each extension 804 has one or more waveguide channels 814. Also, if the antenna structure 802 has multiple extensions 804, the circuit board 808 may include a single aperture 806 through which the multiple extensions fit, or the circuit board 808 may have multiple apertures corresponding one-to-one with each extension from the antenna structure, for example. It may be easier to create an antenna structure 802 having a single extension 804 and a circuit board 808 having a single aperture 806 compared to creating multiple extensions on the antenna structure 802 and multiple apertures on the circuit board 808. In examples where the antenna structure 802 has two or more waveguide channels 814, each waveguide channel 814 may be electrically isolated from other waveguide channels. In some examples, the waveguide channels extend laterally outward from a single projection to route signals to and from the antenna aperture and / or other interfaces.

[0044] By using an aperture 806 instead of a waveguide constructed within the circuit board 808, the process of milling the waveguide into the circuit board 808 can be eliminated, thus potentially reducing cost and complexity. Compared to constructing the waveguide within the circuit board 808, constructing the waveguide channel within the antenna structure 802 may be easier and less expensive. Furthermore, the designs shown in Figures 8A to 8C can reduce signal loss, particularly when there is no gap between the bottom surface of the package 810 and the antenna structure 802 (including its extension 804).

[0045] Furthermore, the antenna structure 802 may be designed to prevent solder from forming bridges from the BGA pads to the waveguide channels within the antenna structure 802. For example, the antenna structure 802 may include one or more waveguide channels that are coated or plated with metal. During the process of mounting the IC package 810 to the other components shown, solder is not near these waveguide channels. Alternatively, the antenna structure 802 may be mounted to the bottom surface of the circuit board 808 after the bottom surface of the IC package 810 has been soldered to the top surface of the circuit board 808. Therefore, compared to electroplating the waveguides via the circuit board 808, the risk of solder forming bridges between the BGA pads and the waveguide channels is reduced or negligible. Also, the risk of solder mask unintentionally entering the waveguide channels of the antenna structure 802 is reduced or negligible.

[0046] The antenna structure 802 may include materials such as nylon, aluminum, polymer, or plastic, and such materials may include deposited metals such as copper. The deposited metal may be formed on the outline of each waveguide channel 814 using electroplating or any other means for metal deposition. In the example where the antenna structure 802 is metallic, the antenna structure 802 may not include additional metal deposition and / or metal plating. Figures 8A and 8B depict waveguide channels generally as in the z dimension, but channels may be routed through the antenna structure 802 in any direction. Each waveguide channel in the antenna structure 802 may have a single-ridge design (see, e.g., Figure 7) or a double-ridge design (see, e.g., Figure 4) to improve the frequency characteristics of each waveguide channel. The improved frequency characteristics may allow the substrate aperture 806 to be designed to be smaller without degrading performance.

[0047] In this description, the term “to connect” may include connections, communications, or signaling paths that enable a functional relationship consistent with this description. For example, if device A generates a signal to control device B in order to perform a certain action, then (a) in the first example, device A is connected to device B by a direct connection, or (b) in the second example, if the intervening component C does not alter the functional relationship between device A and device B, device A is connected to device B via the intervening component C so that device B is controlled by device A via the control signal generated by device A.

[0048] This disclosure provides numerous illustrative examples, and it is understood that these examples can be modified. Such modifications are clearly within the scope of this disclosure. Furthermore, applying these teachings to other environments, applications, and / or purposes is consistent with and contemplated by this disclosure.

Claims

1. It is a device, A circuit board including the top surface and the bottom surface, A package including a bottom surface attached to the top surface of the circuit board, An antenna structure attached to the bottom surface of the circuit board, Includes, A package in which the antenna structure extends through an opening in the circuit board.

2. A device according to claim 1, wherein the bottom surface of the package is coupled to the top surface of the circuit board, and the antenna structure is coupled to the bottom surface of the circuit board.

3. A device according to claim 1, wherein the package includes at least one signal launch, and the antenna structure includes at least one waveguide channel arranged for signal communication with the at least one signal launch.

4. A device according to claim 3, wherein the antenna structure is in physical contact with the package.

5. The device according to claim 3, wherein the at least one waveguide channel is a metal-clad waveguide channel.

6. A device according to claim 5, wherein the metal-coated waveguide channel has a rectangular cross-section with a ridge.

7. The device according to claim 5, The metal-coated waveguide channel is the first metal-coated waveguide channel, The antenna structure includes a second metal-clad waveguide channel arranged for signal communication with the additional signal launch of the package. device.

8. The device according to claim 7, wherein each of the at least one signal launch and the additional signal launch includes a slot antenna.

9. The device according to claim 8, wherein the slot antenna is A first plane having an aperture, A radiating element parallel to the first plane and aligned to a plane away from the first plane, Includes, A device in which the radiating element has a tip that is aligned in the second and third dimensions to a position in the first dimension within the boundary of the aperture.

10. A device according to claim 9, wherein the radiating element has a uniform shape at the position and in the area extending beyond the boundary of the aperture in the second and third dimensions.

11. The device according to claim 3, wherein the at least one signal launch includes a slot antenna.

12. The device according to claim 11, wherein the slot antenna is A first plane having an aperture, A radiating element parallel to the first plane and aligned to a plane away from the first plane, Includes, A device in which the radiating element has a tip that is aligned in the second and third dimensions to a position in the first dimension within the boundary of the aperture.

13. A device according to claim 12, wherein the radiating element has a uniform shape at the position and in the area extending beyond the boundary of the aperture in the second and third dimensions.

14. A device according to claim 1, further comprising a ball grid array (BGA) coupled to the top surface of the circuit board, wherein the bottom surface of the package is coupled to the top surface of the circuit board via the BGA.

15. The device according to claim 1, wherein the opening of the circuit board is a first opening, and the antenna structure is A first extension portion protruding through the first opening of the circuit board, A second extension protrudes through the second opening of the circuit board and is coupled to the bottom surface of the package, A device that includes this.

16. The device according to claim 1, wherein the antenna structure is An extended portion protruding through the opening of the circuit board, The extension includes at least two waveguide channels, A device that includes this.

17. The device according to claim 16, The package includes at least two signal launches, A device in which each of the at least two waveguide channels is arranged for signal communication with each of the at least two signal launches.

18. The device according to claim 1, A circuit board including a surface and a notch through the surface, An antenna structure coupled to the surface of the circuit board, Includes, The antenna structure includes an extended portion that protrudes through the notch of the circuit board, The antenna structure further includes a waveguide channel extending through the extension portion. device.

19. The device according to claim 18, further comprising a package including a bottom surface coupled to the circuit board, A device in which the bottom surface of the package is also coupled to the extension of the antenna structure.

20. A device according to claim 19, wherein the package includes a slot antenna on the bottom surface of the package, and the slot antenna is coupled to the waveguide channel.

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