Information processing device and information processing method

Abstract

To shorten time of factor analysis of abnormality in a semiconductor manufacturing apparatus.SOLUTION: An information processor has: an acquisition part which acquires processing information including processing data regarding substrate processing and processing conditions; and a display control part which controls display on a display device on the basis of the processing information acquired by the acquisition part, where the display control part allows the display device to display a first screen displaying processing data of a plurality of lots severally in a lot unit, and allows the display device to display a second screen displaying processing data of a first lot specified by a user out of the plurality of lots displayed on the first screen and processing data of a second lot processed by processing conditions which includes at least one same processing condition as the processing conditions where the data of the first lot is processed severally in a substrate unit.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to an information processing device and an information processing method. [Background technology]

[0002] Semiconductor manufacturing factories are typically equipped with semiconductor manufacturing equipment, such as semiconductor exposure equipment, which exposes substrates to light, and are required to process substrates efficiently by understanding the operating status of each equipment.Furthermore, if an abnormality occurs in a semiconductor manufacturing equipment, immediate action must be taken.

[0003] Patent Document 1 discloses a method for detecting abnormalities in semiconductor manufacturing equipment by statistically processing the processing results of the semiconductor manufacturing equipment for each lot containing multiple substrates, and displaying the results of this statistical processing in a graph, allowing the user to immediately recognize which lot has an abnormality. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-170612 Summary of the Invention [Problem to be solved by the invention]

[0005] However, while displaying a graph for each lot containing multiple substrates makes it possible to see that differences exist between lots, it is not possible to immediately determine the cause. In order to determine the cause of the differences between lots, it is necessary to make a judgment from data for each wafer belonging to the lot. Unless the user performs the above-mentioned data collection and analysis, it will be impossible to determine the cause of the differences between lots, and it will take a lot of time to resolve the abnormality that has occurred.

[0006] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a technique that is advantageous in shortening the time required for analyzing the causes of abnormalities in semiconductor manufacturing equipment. [Means for solving the problem]

[0007] In order to achieve the above object, an information processing apparatus according to one aspect of the present invention includes an acquisition unit that acquires processing information including processing data and processing conditions related to substrate processing, and a display control unit that controls display on a display device based on the processing information acquired by the acquisition unit, wherein the display control unit causes the display device to display a first screen that displays processing data for a plurality of lots, each on a lot-by-lot basis; after that, The display device displays a second screen that displays, on a substrate-by-substrate basis, processing data of a first lot designated by a user from among the plurality of lots displayed on the first screen, and processing data of a second lot processed under processing conditions that include one or more of the same processing conditions as those under which the first lot was processed. In order to achieve the above-mentioned object, an information processing apparatus as one aspect of the present invention is an information processing apparatus that processes information related to a processing apparatus that processes substrates, and has an acquisition unit that acquires processing information including processing data and processing conditions related to substrate processing, and a display control unit that controls display on a display device based on the processing information acquired by the acquisition unit, wherein the display control unit selectively displays on the display device a first screen that displays processing data for multiple lots, each on a lot-by-lot basis, and a second screen that displays, each on a substrate-by-substrate basis, the processing data for the first lot and the processing data for a second lot that was processed under processing conditions that include one or more of the same processing conditions as the processing conditions used to process the first lot, and the processing data includes at least one of synchronization accuracy data that indicates the error in the relative positions of the first stage and the second stage when the first stage and the second stage of the processing apparatus are driven synchronously, and alignment accuracy data that indicates the measurement results of a mark formed on the substrate measured by the processing apparatus. In order to achieve the above-mentioned object, an information processing apparatus as one aspect of the present invention is an information processing apparatus that processes information related to a processing apparatus that processes substrates, and has an acquisition unit that acquires processing information including processing data and processing conditions related to substrate processing, and a display control unit that controls display on a display device based on the processing information acquired by the acquisition unit, wherein the display control unit displays on the display device a first screen that displays processing data for multiple lots, each on a lot-by-lot basis, and a second screen that displays, each on a substrate-by-substrate basis, the processing data for the first lot and the processing data for a second lot that was processed under processing conditions that include one or more of the processing conditions used to process the first lot, and the processing data includes at least one of synchronization accuracy data that indicates the error in the relative positions of the first stage and the second stage when the first stage and the second stage of the processing apparatus are driven synchronously, and alignment accuracy data that indicates the measurement results of measuring a mark formed on the substrate by the processing apparatus. [Effects of the Invention]

[0008] An object of the present invention is to provide a technique that is advantageous for shortening the time required for analyzing the causes of abnormalities in semiconductor manufacturing equipment, for example. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 illustrates a system for manufacturing an article. [Figure 2] FIG. 1 is a diagram illustrating an exposure apparatus as an example of a pattern forming apparatus. [Figure 3] FIG. 1 is a diagram illustrating a hardware configuration of an information processing device. [Figure 4] FIG. 2 illustrates a configuration of a CPU of a management device. [Figure 5] 10 is a flowchart of a display process in the display device. [Figure 6] FIG. 2 is a diagram showing lot data in the first embodiment. [Figure 7] FIG. 2 is a diagram showing processing data in the first embodiment. [Figure 8] FIG. 10 is a diagram in which the processing conditions of a specified lot are highlighted. [Figure 9] FIG. 10 is a diagram showing lot data and processing data displayed on the same screen. [Figure 10] FIG. 10 is a diagram showing lot data in the second embodiment. [Figure 11] FIG. 10 is a diagram showing processing data in the second embodiment. [Figure 12] FIG. 11 is a diagram showing lot data in the third embodiment. [Figure 13] FIG. 11 is a diagram showing processing data in the third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0011] First Embodiment In this embodiment, an article manufacturing system including a plurality of apparatuses and a management apparatus that manages the plurality of apparatuses will be described. FIG. 1 is a diagram showing the article manufacturing system. The article manufacturing system 100 of this embodiment includes a pattern forming apparatus 200 that forms a pattern on a wafer (substrate), a processing apparatus 201, an inspection apparatus 202, and a management apparatus 300 that manages these apparatuses. In the article manufacturing system 100, the pattern forming apparatus 200, the processing apparatus 201, and the inspection apparatus 202 each include one or more apparatuses.

[0012] The pattern formation apparatus 200 includes an exposure apparatus that irradiates a reticle (mask, original) on which a pattern is formed with light and projects the pattern onto a shot area on a wafer using the light from the reticle. The pattern formation apparatus 200 also includes an imprint apparatus that, for example, brings an imprint material supplied on a wafer into contact with a mold (original, mold) and applies energy for curing to the imprint material to form a composition onto which the shape of the mold is transferred. The pattern formation apparatus 200 also includes a drawing apparatus that draws on a substrate using a charged particle beam such as an electron beam or an ion beam via a charged particle optical system to form a pattern on the substrate. The pattern formation apparatus 200 performs substrate processing using these methods.

[0013] The processing equipment 201 includes manufacturing equipment that performs processes other than those performed by an exposure apparatus or other apparatus in the manufacture of an article such as a device, such as a coating apparatus that coats a photosensitive medium or the like on the surface of a substrate, a developing apparatus that develops a substrate onto which a pattern has been transferred, etc. In addition, the processing equipment 201 includes an etching apparatus, a film forming apparatus, etc.

[0014] The inspection device 202 includes, for example, an overlay inspection device, a line width inspection device, a pattern inspection device, an electrical characteristics inspection device, etc. Here, the overlay inspection device is a device that inspects the accuracy of misalignment between an upper layer pattern and a lower layer pattern on a substrate on which multiple patterns are formed. The line width inspection device is a device that inspects the accuracy of dimensions such as the line width of a pattern formed on a substrate. The pattern inspection device is a device that inspects the presence or absence of a pattern that does not meet the required accuracy due to foreign matter adhering to the substrate on which a pattern is formed or insufficient filling of an imprint material, etc. The electrical characteristics inspection device is a device that inspects the accuracy of the electrical characteristics of a semiconductor device or the like manufactured from a substrate on which a pattern is formed.

[0015] Next, as an example of a pattern formation apparatus 200, an exposure apparatus that exposes a wafer with light from a reticle on which a pattern is formed will be described. FIG. 2 is a diagram showing an exposure apparatus as an example of a pattern formation apparatus. The exposure apparatus 204 according to this embodiment will be described as a step-and-scan exposure apparatus that performs exposure while synchronously driving a reticle stage and a wafer stage. Furthermore, the exposure apparatus 204 is not limited to a scanner, and may also be a step-and-repeat exposure apparatus that performs exposure while the wafer stage is stationary. In the example of FIG. 2, the exposure apparatus 204 includes a light source 7, an illumination optical system 8, a reticle stage 2, a projection optical system 3, a wafer stage 6, a wafer chuck 5, and a controller 13. The exposure apparatus 204 also includes a laser interferometer 9, a laser interferometer 10, a focus sensor, a wafer transport unit 12, a reticle transport unit 14, and an alignment scope 15. In FIG. 2, the direction parallel to the optical axis of the projection optical system 3 is defined as the Z-axis direction, and two mutually orthogonal directions in a plane perpendicular to the Z-axis direction are defined as the X-axis direction and the Y-axis direction.

[0016] Examples of light source 7 include a high-pressure mercury lamp, an ArF excimer laser, and a KrF excimer laser. Light source 7 does not necessarily have to be located inside the chamber of the exposure tool, but may be externally attached. Light emitted from light source 7 illuminates reticle 1 via illumination optical system 8. Reticle 1 carries a pattern to be transferred onto wafer 4, which is coated with a photosensitive material, and is mounted on reticle stage 2. Reticle stage 2 holds the reticle by suction via a reticle chuck and is movable by, for example, a linear motor.

[0017] The projection optical system 3 projects an image of the pattern drawn on the reticle 1 onto the wafer 4 placed on the wafer chuck 5. When the pattern image is projected onto the wafer 4, an inverted and reduced image is projected onto the wafer 4 at a projection magnification (for example, 1 / 4) via the projection optical system 3. If the area onto which the pattern image is projected is referred to as a shot area, multiple shot areas are set on the wafer 4, and projection onto the shot areas is repeated in sequence.

[0018] The wafer stage 6 is driven by a linear motor actuator or the like, and is thus movable in the X and Y directions. The wafer chuck 5 is mounted on the wafer stage 6 and holds the wafer 4. The wafer stage 6 positions the wafer chuck 5 in the Z, θ, ωX, and ωY directions. In this way, the wafer 4 held by the wafer chuck 5 is moved by driving the wafer stage 6 and the wafer chuck 5.

[0019] Laser interferometer 9 measures the position of reticle stage 2 in the Y direction, and also measures the attitude of reticle stage 2. Laser interferometer 9 similarly includes a laser interferometer for measuring the position of reticle stage 2 in the X direction. Laser interferometer 10 also measures the position of wafer stage 6, which carries wafer 4, in the Y direction, and measures the attitude of wafer stage 6. Laser interferometer 10 also includes a laser interferometer that similarly measures the position of wafer stage 6 in the X direction. The positions of reticle stage 2 and wafer stage 6 are controlled by control unit 13, which will be described later, based on the positions measured by laser interferometer 9 and laser interferometer 10.

[0020] The focus sensor includes a light projection system 11a that projects light onto the wafer 4, a light receiving system 11b that receives light reflected from the wafer, and a detection unit that detects the light from the light receiving system and outputs a detection signal to a control unit 13. The light projection system 11a and the light receiving system 11b are installed on either side of the exit unit of the projection optical system 3, with the light projection system 11a irradiating the wafer with obliquely incident light and the light receiving system 11b capturing the light reflected on the opposite side. The control unit 13, described below, measures the position of the wafer 4 in the Z direction based on the detection signal detected by the focus sensor and controls the movement of the wafer 4 by the wafer stage 6.

[0021] The wafer transfer unit 12 transfers the wafer 4. The wafer transfer unit 12 transfers the wafer 4 from a wafer storage container or the like that stores the wafer 4 to the wafer stage 6. The wafer transfer unit 12 also transfers the wafer 4 from the wafer stage 6 to the wafer storage container or the like.

[0022] The reticle transport unit 14 transports the reticle 1. The reticle transport unit 14 transports the reticle 1 from a reticle storage container or the like that stores the reticle 1 to the reticle stage 2. The reticle transport unit 14 also transports the reticle 1 from the reticle stage 2 to the reticle storage container or the like.

[0023] The alignment scope 15 acquires digital image signals obtained by capturing images of marks formed on the wafer 4 in order to position (align) the wafer 4 held by the wafer chuck 5. The alignment scope 15 includes an image sensor that outputs grayscale image signals corresponding to the brightness of the light reflected from the wafer 4, i.e., grayscale, and an A / D converter that converts the grayscale image signal obtained from the image sensor into a digital image signal. The control unit 13, which will be described later, uses the acquired digital image signal to detect the positions of the marks formed on the wafer 4, and controls the wafer stage 6 based on the detected positions of the marks to position the wafer 4.

[0024] The control unit 13 controls the exposure process on the wafer 4 by controlling the operation and adjustment of each part of the exposure apparatus 204. The control unit 13 is configured, for example, by a PLD (abbreviation for Programmable Logic Device) such as an FPGA (abbreviation for Field Programmable Gate Array), an ASIC (abbreviation for Application Specific Integrated Circuit), a computer with an embedded program, or a combination of all or part of these. The control unit 13 may be configured integrally with other parts of the exposure apparatus 204 (in a common housing), or may be configured separately from other parts of the exposure apparatus 204 (in a different housing). The control unit 13 also applies information acquired from a storage device, etc., described below, to control the execution of the exposure process (pattern formation process) on the wafer 4.

[0025] Next, the management device 300 will be described. FIG. 3 is a diagram showing the hardware configuration of the information processing device. The information processing device includes a CPU 301, a ROM 302, a RAM 303, a storage device 304, an input device 305, a display device 306, and a communication device 307. Each hardware component of the information processing device functions according to a program. In the example of FIG. 3, the CPU 301 is a processing device that performs calculations for control according to a program and controls each component connected to a bus 308. The ROM 302 is a memory dedicated to reading data, and stores programs and data. The RAM 303 is a memory for reading and writing data, and is used to store programs and data. The RAM 303 is used for temporarily storing data such as the results of calculations by the CPU 301. The storage device 304 is also used for storing programs and data. The storage device 304 is also used as a temporary storage area for programs and data of the operating system (OS) of the information processing device.

[0026] The storage device 304 is slower in data input / output than the RAM 303, but is capable of storing large amounts of data. The storage device 304 is preferably a non-volatile storage device that can store data as permanent data so that the data can be referenced over a long period of time. The storage device 304 is mainly composed of a magnetic storage device (HDD), but may also be a device that reads and writes data by loading external media such as CDs, DVDs, and memory cards.

[0027] The input device 305 is a device for inputting characters and data into the information processing device, and corresponds to various keyboards and mice. The display device 306 serves as a user interface for the management device 300 and is a device for displaying information necessary for operating the information processing device, processing results, and the like, and corresponds to a CRT or LCD monitor. If the display device 306 can be operated by touching the screen, for example, like a touch panel, it also serves as the input device 305. Furthermore, the input device 305 and the display device 306 have been described as parts of the management device 300, but are not limited to this and may be parts of the pattern forming device 200, for example.

[0028] The communication device 307 is used when connecting to a network and performing data communication using a communication protocol such as TCP / IP, and when communicating with other devices. The information processing device may also be configured with a GPU (abbreviation for Graphics Processor Unit) to enable high-speed arithmetic processing. The management device 300 is an information processing device, and is connected to multiple exposure tools 204 via the communication device 307 to communicate data with them.

[0029] Fig. 4 is a diagram showing the configuration of CPU 301 in management apparatus 300. CPU 301 includes an acquisition unit 401, a storage unit 402, a calculation unit 403, and a display control unit 404. Fig. 5 is a flowchart showing the display processing of display device 306 for analyzing an abnormality occurring in the exposure apparatus.

[0030] 4 and 5, the display processing of the display device 306 in the management device 300 of this embodiment will be described below. In this embodiment, the display on the display device 306 makes it possible to shorten the time required to analyze the cause of an abnormality in the exposure apparatus 204. An abnormality in this embodiment includes an abnormality that is so serious that it causes the exposure apparatus 204 to stop, or an abnormality that affects productivity such that the accuracy of the exposure apparatus 204 decreases.

[0031] The flowchart in FIG. 5 will be described. In step S501, the acquisition unit 401 acquires processing information of the exposure apparatus 204. The processing information of the exposure apparatus 204 includes processing data of the exposure apparatus 204 and processing conditions applied during the exposure process. The processing data of the exposure apparatus 204 is information including the operation results of the exposure apparatus 204 and the state of the wafer exposed by the exposure apparatus 204, and specifically includes synchronization accuracy data, alignment accuracy data, etc. The synchronization accuracy data is data indicating the relative position error between the reticle stage 2 and the wafer stage 6 during a period in which the reticle stage 2 and the wafer stage 6 are driven synchronously, for example, in the Y-axis direction, to expose a target shot area. The alignment accuracy data is data indicating waveform data of a digital image signal obtained by capturing an image of a mark formed on the target wafer 4, and an evaluation of the digital image signal (symmetry of the waveform data, contrast of the digital image signal).

[0032] The processing conditions applied during exposure processing include recipes determined for each wafer to be produced and equipment parameters determined for each exposure tool 204. Recipes are processing conditions that are shared among multiple exposure tools, while equipment parameters are processing conditions that are not shared among multiple exposure tools. Examples of recipes include the exposure dose used when exposing a wafer, and the selection of individual correction values ​​and correction algorithms for tracking the exposed pattern. Examples of equipment parameters include correction values ​​for the projection optical system and wafer stage control methods and control parameters. Furthermore, the processing conditions displayed in table 702 are not limited to these, and parameters that define other processing conditions may also be displayed.

[0033] Next, in step S502, the processing data and processing conditions of the exposure tool 204 acquired in step S501 are stored in the storage unit 402. The processing data stored in the storage unit 402 is, for example, processing data on a wafer-by-wafer (substrate-by-substrate) basis.

[0034] In step S503, the calculation unit 403 calculates lot data, which is processing data for each lot, based on the processing data for each wafer accumulated by the accumulation unit 402. The lot data is calculated using statistical values ​​(e.g., maximum value, minimum value, average value, median, standard deviation) of the processing data for each wafer. The lot data may also be calculated in the exposure tool 304, rather than by the calculation unit 403. For example, the acquisition unit 401 may acquire the lot data calculated in the exposure tool 304 from the exposure tool 204, and the process may proceed to step S504.

[0035] In step S504, the display control unit 404 outputs the lot data to the display device 306 and controls the display device 306 to display it as shown in Fig. 6. Fig. 6 shows a screen on which the lot data is displayed. The horizontal axis of the graph 601 represents the name of the lot executed by the exposure tool 204, and the vertical axis represents the lot data value, which is the value of the processing data for each lot.

[0036] In the setting field 602, the user can input or select the content to be displayed on the graph 601. The user inputs or selects the name of the semiconductor manufacturing line in which the exposure tool 204 is installed, information identifying the tool (e.g., an ID indicating the tool), the data to be displayed, and a statistical method for calculating statistical values ​​(e.g., maximum value, minimum value, average value, median, standard deviation). The display device 306 updates the display content of the graph 601 based on the input or selected content. The color or shape of the graph 601 may be changed depending on the recipe used when each lot was executed.

[0037] In step S505, the display control unit 404 determines whether a lot has been designated by the user. If a lot has been designated, the process proceeds to step S506. The lot is designated by the user selecting the lot data plotted on the graph 601 or by inputting the lot name. The method of designating a lot is realized by a computer input device such as a mouse, keyboard, or touch panel, and a program that controls the device. By designating the lot in which an abnormality has occurred, the user can identify the cause of the abnormality using a method described below.

[0038] In step S506, the display control unit 404 outputs the processing data for the lot specified in step S505 to the display device 306, and the display device 306 displays Fig. 7. Fig. 7 is a diagram showing a screen on which a graph 701 representing the processing data and a table 702 showing the processing conditions for the exposure process are displayed. The horizontal axis of the graph 701 represents the wafer number, and the vertical axis represents the wafer data value, which is the value of the processing data for each wafer.

[0039] Table 702 shows the name of each lot and the processing conditions of the exposure tool 204. The processing conditions to be displayed may be all processing conditions, or may be limited to processing conditions related to the processing data. The relationship between the processing data and the associated processing conditions can be saved in the storage device 304, and the user may statically or dynamically specify the relationship between the processing data and the associated processing conditions.

[0040] Graph 701 also displays processing data belonging to lots that have been exposed using the same recipe as the lot specified by the user, as a comparison target for the display of the lot specified in step S506. Table 702 displays the processing conditions of the specified lot and the lot to be compared. In the following description, a lot that has been exposed using the same recipe as the lot specified by the user will be described as a comparison target lot, but this is not limiting, and the lot may also be a lot that has been exposed using processing conditions that include one or more of the same processing conditions as the lot specified by the user.

[0041] The user checks the content displayed on display device 306 in step S506 and analyzes the differences and trends in processing data for each wafer between the specified lot and other lots, as well as differences in processing conditions, etc. From the analysis results, the user identifies the cause of the abnormality occurring in exposure tool 204 and takes action to resolve the abnormality.

[0042] In step S507, if the user selects to close the screen, the display on the display device 306 is terminated.

[0043] The above-mentioned process of resolving an abnormality occurring in exposure tool 204 will be explained in more detail below, linking the screen displayed on display device 306 with the user's actions. The user first displays the screen shown in FIG. 6 to check whether an abnormality has occurred in the exposure tool. By checking graph 601, the user can see that the lot data for lot BBB is larger than the data for the other lots. Therefore, the user specifies lot BBB on the screen of graph 601 to analyze the cause of this difference. The screen display on display device 306 switches from graph 601 to graph 701 and table 702 in FIG. 7. At this time, the process data and process conditions for each wafer for lots CCC and EEE, which were exposed using the same recipe as lot BBB, are also displayed.

[0044] The processing data for each wafer displayed in graph 701 is the processing data that was used to calculate the lot data displayed in graph 601. By checking graph 701, the user can see that of the 10 wafers belonging to lot BBB, the processing data value for the first wafer is greater than the processing data values ​​for the second to tenth wafers and wafers belonging to other lots. Furthermore, of the processing condition setting values ​​1 to 4 displayed in table 702, it can be seen that setting values ​​1 to 3 are different from those of the other lots. Furthermore, since setting values ​​1 and 2 are almost the same numerical value, it is considered that the impact is small, and therefore it can be determined that the difference in setting value 3 is the cause of the abnormality that has occurred.

[0045] From these results, the user can determine that the difference between the lots is due to setting value 3 and quickly take appropriate action, such as changing the processing conditions to the same as those of the other lots. To further streamline this analysis, processing conditions that differ between the lots may be highlighted. FIG. 8 shows an example of highlighting processing conditions. When the user selects lot BBB and lot EEE, only setting values ​​1 and 3, which are different processing conditions among the displayed processing conditions, are highlighted. This makes it easier for the user to visually determine the differences in processing conditions between the lots. In the example of FIG. 8, the table display is highlighted by changing the text to white. However, other methods may be used, such as changing the text color, thickness, font, etc., to match other content, changing the frame color or thickness, or blinking the parts with different content. Furthermore, as described above, the displays of FIGS. 6 and 7 may be selectively displayed on the display device 306. Alternatively, as shown in FIG. 9, the graph 601, setting field 602, graph 701, and table 702 may be displayed on the same screen.

[0046] As described above, in this embodiment, processing data for each wafer of a specified lot can be displayed graphically on the display device 306, making it easy to analyze which wafer has developed an abnormality. On the other hand, since the processing conditions are also displayed, the processing conditions that are the cause of the abnormality can be immediately analyzed, thereby shortening the time required to resolve the abnormality.

[0047] Second Embodiment In this embodiment, a more specific situation will be described compared to the first embodiment. In this embodiment, a method for analyzing an abnormality related to the synchronization accuracy of the stage of the exposure apparatus 204 will be described. The synchronization accuracy of the stage is data indicating the error in the relative position between the reticle stage 2 and the wafer stage 6 during the period when the reticle stage 2 and the wafer stage 6 are driven synchronously, for example, in the Y-axis direction, in order to expose the target shot area. Note that matters not mentioned in this embodiment will follow the first embodiment.

[0048] 10, which corresponds to step S504 in FIG. 5 in the first embodiment, the user inputs a line name (e.g., an ID indicating a factory, building, production line, etc.) and an equipment name (e.g., an ID indicating an equipment) in the setting unit 602. In FIG. 10, the line name and equipment name are input as "L1" and "T1," respectively. The user also inputs display data in the setting unit 602. In FIG. 10, "synchronization accuracy measurement result" is input as display data. The user also inputs a statistical method in the setting unit 602. The statistical method is a statistical method (e.g., maximum value, minimum value, average value, median, standard deviation) used by the calculation unit 403 to calculate lot data. In FIG. 10, in order to compare the wafer with the worst accuracy in the synchronization accuracy measurement result among the wafers belonging to the lot, the user inputs "MAX," which is a setting for calculating the maximum value, into the statistical method. The display device 306 displays a graph 601 based on the settings input in the setting unit 602.

[0049] By checking graph 601, the user can see that the statistical value of lot BBB is larger than that of other lots. Furthermore, the user can also see that the values ​​of lots CCC and EEE, which were exposed using the same recipe as lot BBB, are smaller than that of lot BBB. The user specifies lot BBB to analyze this difference in detail.

[0050] Display device 306 displays a graph of the synchronization accuracy measurement results for wafers exposed in lot BBB, the processing conditions for lot BBB, and the synchronization accuracy measurement results and processing conditions for lots CCC and EEE, which were exposed using the same recipe as lot BBB, as shown in FIG. 11 . At this time, table 702 can also display only the processing conditions related to synchronization accuracy. Processing conditions related to stage synchronization accuracy include, for example, the scan speed of the wafer stage, settings for controlling the linear motor that drives the wafer stage using FeedForward (FF) technology, and the illuminance of the light source during exposure. By examining graph 701, the user can see that the synchronization accuracy measurement results for all wafers exposed in lot BBB are higher than those for wafers in other lots. By examining table 702 and comparing the processing conditions for each lot, the user can see that the scan speed of lot BBB is higher than that of the other lots.

[0051] Therefore, the user can analyze that the difference in the synchronization accuracy measurement results is due to the difference in the scan speed, and can immediately take measures to resolve the abnormality occurring in the exposure tool 204.

[0052] Third Embodiment In this embodiment, a case where an abnormality different from that in the second embodiment occurs will be described. In this embodiment, a method for analyzing an abnormality related to the alignment measurement result of the exposure tool 204 will be described. The alignment measurement result is data indicating waveform data of a digital image signal obtained by capturing an image of a mark formed on the target wafer 4, and an evaluation of the digital image signal (symmetry of the waveform data, contrast of the digital image signal). Note that matters not mentioned in this embodiment follow the first embodiment.

[0053] 12, which corresponds to step S504 in FIG. 5 in the first embodiment, the user inputs a line name (e.g., an ID indicating a factory, building, production line, etc.) and an equipment name (e.g., an ID indicating an equipment) in the setting unit 602. In FIG. 12, the line name and equipment name are input as "L2" and "T2," respectively. The user also inputs display data in the setting unit 602. In FIG. 12, "alignment measurement result" is input as display data. The user also inputs a statistical method in the setting unit 602. The statistical method is a statistical method (e.g., maximum value, minimum value, average value, median, standard deviation) used by the calculation unit 403 to calculate lot data. In FIG. 12, in order to compare average values ​​of wafers belonging to a lot, "AVE," which is a setting for calculating an average value, is input as the statistical method. The display device 306 displays a graph 601 based on the settings input in the setting unit 602.

[0054] By checking graph 601, the user can see that the lot data of lot GGG is larger than the other lot data. Furthermore, the user can also see that the lot data of lots HHH and JJJ, which were exposed using the same recipe as lot GGG, are smaller than the lot data of lot GGG. The user specifies lot GGG to analyze this difference in detail.

[0055] Display device 306 displays a graph of the alignment measurement results of lot GGG exposed, the processing conditions for lot GGG, and the alignment measurement results and processing conditions for lots HHH and JJJ, which were exposed using the same recipe as lot GGG, as shown in FIG. 13 . At this time, table 702 can also display only the processing conditions related to alignment measurement. Examples of processing conditions related to alignment measurement include the illumination mode, a setting specifying whether to perform a retry if an abnormality occurs, the type of mark formed on the wafer, and the offset value during alignment measurement. By examining graph 701, the user can see that, among the wafers belonging to lot GGG, there is a large difference in the alignment measurement results for the first wafer exposed, while the alignment measurement results for the other wafers are only slightly different from those of wafers in other lots. By examining table 702 and comparing the processing conditions for each lot, the user can see that the offset value for lot GGG is larger than that of the other lots.

[0056] Therefore, the user can analyze that the difference in the alignment measurement result is due to the difference in the offset value, and can immediately take measures to resolve the abnormality occurring in the exposure tool 204.

[0057] <Embodiments of manufacturing methods of articles> The article manufacturing method according to the present embodiment is suitable for manufacturing articles such as microdevices, such as semiconductor devices, and elements having microstructures. The article manufacturing method according to the present embodiment may include a forming step of forming a master pattern on a substrate using the article manufacturing system described above, and a processing step of processing the substrate on which the pattern has been formed in the forming step. Furthermore, such an article manufacturing method may include other well-known processes (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The article manufacturing method according to the present embodiment is advantageous over conventional methods in at least one of article performance, quality, productivity, and production cost.

[0058] <Other embodiments> The present invention can also be realized by supplying a program that realizes one or more functions of the above-described embodiments to a system or device via a network or a storage medium, and having one or more processors in the computer of the system or device read and execute the program. It can also be realized by a circuit (e.g., ASIC) that realizes one or more functions.

[0059] Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist of the present invention. [Explanation of symbols]

[0060] 200 Pattern forming device 300 Management device 306 Display device 401 Acquisition Department 404 Display control unit

Claims

1. an acquisition unit that acquires processing information including processing data and processing conditions related to substrate processing; a display control unit that controls display on a display device based on the processing information acquired by the acquisition unit; the display control unit causes the display device to display a first screen that displays processing data for a plurality of lots, each on a lot-by-lot basis, and then causes the display device to display a second screen that displays, on a substrate-by-substrate basis, processing data for a first lot designated by a user from among the plurality of lots displayed on the first screen, and processing data for a second lot that has been processed under processing conditions that include one or more of the same processing conditions as those used for processing the first lot.

2. 2 . The information processing apparatus according to claim 1 , wherein the display control unit, when causing the display device to display the second screen, does not cause the display device to display the first screen.

3. 2 . The information processing apparatus according to claim 1 , wherein the display control unit, when causing the display device to display the second screen, causes the display device to display the second screen while keeping the first screen displayed.

4. The information processing device processes information related to a processing device that processes a substrate, 4. An information processing device according to claim 1, wherein the processing data includes at least one of synchronization accuracy data indicating a relative position error between the first stage and the second stage of the processing device when the first stage and the second stage are driven synchronously, and alignment accuracy data indicating a measurement result of a mark formed on the substrate measured by the processing device.

5. An information processing device that processes information related to a processing device that processes a substrate, an acquisition unit that acquires processing information including processing data and processing conditions related to substrate processing; a display control unit that controls display on a display device based on the processing information acquired by the acquisition unit; the display control unit selectively displays on the display device a first screen displaying processing data of a plurality of lots on a lot-by-lot basis, and a second screen displaying processing data of a first lot and processing data of a second lot processed under processing conditions including one or more processing conditions identical to the processing conditions under which the first lot was processed, on a substrate-by-substrate basis; An information processing device characterized in that the processing data includes at least one of synchronization accuracy data indicating the relative position error between the first stage and the second stage of the processing device when the first stage and the second stage are driven synchronously, and alignment accuracy data indicating the measurement results of a mark formed on the substrate measured by the processing device.

6. An information processing device that processes information related to a processing device that processes a substrate, an acquisition unit that acquires processing information including processing data and processing conditions related to substrate processing; a display control unit that controls display on a display device based on the processing information acquired by the acquisition unit; the display control unit displays on the display device a first screen displaying processing data of a plurality of lots on a lot-by-lot basis, and a second screen displaying processing data of a first lot and processing data of a second lot processed under processing conditions including one or more processing conditions identical to the processing conditions under which the first lot was processed, on a substrate-by-substrate basis; An information processing device characterized in that the processing data includes at least one of synchronization accuracy data indicating the relative position error between the first stage and the second stage of the processing device when the first stage and the second stage are driven synchronously, and alignment accuracy data indicating the measurement results of a mark formed on the substrate measured by the processing device.

7. The information processing device according to any one of claims 1 to 6, characterized in that the display control unit displays on the display device a second screen that displays, on a substrate-by-substrate basis, the processing data of the first lot and the processing data of the second lot that was processed using the same recipe as the recipe used to process the first lot.

8. 8. The information processing apparatus according to claim 1, wherein the processing data is information including an operation result of a processing apparatus that performs substrate processing and a state of the substrate after the substrate processing.

9. 9. The information processing apparatus according to claim 1, wherein the processing conditions include a recipe, which is a processing condition shared and used among a plurality of apparatuses, and apparatus parameters, which is a processing condition not shared among a plurality of apparatuses.

10. 10. The information processing apparatus according to claim 1, wherein the display control unit displays information about the processing conditions on the display device.

11. 11. The information processing apparatus according to claim 10, wherein the display control unit displays on the display device processing conditions that are different from the processing conditions of a plurality of lots in a highlighted manner.

12. 12. The information processing apparatus according to claim 1, wherein at least one of the first screen and the second screen displays processing data in a graph.

13. 13. The information processing apparatus according to claim 1, further comprising a calculation unit that calculates processing data for each lot based on a plurality of processing data for each substrate acquired by the acquisition unit.

14. 14. The information processing apparatus according to claim 13, wherein the calculation unit calculates the processing data for each lot based on statistical processing of one of a maximum value, a minimum value, an average value, a median value, and a standard deviation of a plurality of processing data for each substrate.

15. an acquiring step of acquiring processing information including processing data and processing conditions related to substrate processing; a display control step of controlling a display on a display device based on the processing information acquired in the acquisition step; The information processing method is characterized in that the display control step causes the display device to display a first screen that displays processing data for a plurality of lots, each on a lot-by-lot basis, and then causes the display device to display a second screen that displays, on a substrate-by-substrate basis, processing data for a first lot designated by a user from among the plurality of lots displayed on the first screen, and processing data for a second lot that has been processed under processing conditions that include one or more of the same processing conditions as those used for processing the first lot.

16. 16. The information processing method according to claim 15, wherein the display control step causes the display device not to display the first screen when causing the display device to display the second screen.

17. 16. The information processing method according to claim 15, wherein the display control step, when causing the display device to display the second screen, causes the display device to display the second screen while keeping the first screen displayed.

18. 1. An information processing method for processing information related to a processing apparatus for processing a substrate, comprising: an acquiring step of acquiring processing information including processing data and processing conditions related to substrate processing; a display control step of controlling a display on a display device based on the processing information acquired in the acquisition step; the display control step selectively displays on the display device a first screen displaying processing data for a plurality of lots on a lot-by-lot basis, and a second screen displaying processing data for a first lot and processing data for a second lot processed under processing conditions including one or more processing conditions identical to the processing conditions under which the first lot was processed, on a substrate-by-substrate basis; The processing data includes at least one of synchronization accuracy data indicating a relative position error between the first stage and the second stage of the processing device when the first stage and the second stage are driven synchronously, and alignment accuracy data indicating a measurement result obtained by measuring a mark formed on the substrate by the processing device. An information processing method comprising:

19. 1. An information processing method for processing information related to a processing apparatus for processing a substrate, comprising: an acquiring step of acquiring processing information including processing data and processing conditions related to substrate processing; a display control step of controlling a display on a display device based on the processing information acquired in the acquisition step; the display control step displays, on the display device, a first screen that displays processing data of a plurality of lots on a lot-by-lot basis, and a second screen that displays, on a substrate-by-substrate basis, processing data of a first lot and processing data of a second lot that has been processed under processing conditions that include one or more of the same processing conditions as those used for the first lot; The processing data includes at least one of synchronization accuracy data indicating a relative position error between the first stage and the second stage of the processing device when the first stage and the second stage are driven synchronously, and alignment accuracy data indicating a measurement result obtained by measuring a mark formed on the substrate by the processing device. An information processing method comprising:

20. A program for causing a computer to execute each step of the information processing method according to any one of claims 15 to 19.

21. An information processing device according to any one of claims 1 to 14; a patterning device for forming a pattern on a substrate; The information processing device controls a plurality of devices including the pattern forming device.

22. forming a pattern on a substrate using the manufacturing system of claim 21; a processing step of processing the substrate on which the pattern has been formed in the forming step, A method for manufacturing an article, comprising manufacturing an article from the substrate processed in the processing step.

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