Method for applying a coating to at least one electronic component, sensor assembly with a coating, coating carrier

Abstract

A method for applying a coating to an electronic component is provided. A method for applying a coating to at least one electronic component (1, 30) is described, the method comprising: A) providing a coating carrier (20), the coating carrier comprising: - Main base (21) and - a coating base (22) having a well (23), - a movable reservoir (24) having a further well (25), B) filling the wells (25) of the reservoirs (24) with a coating material (29); C) shifting the reservoir (24) along the longitudinal axis (X) of said coating carrier (20) thus filling the wells (23) of the coating base (22) with the coating material (29); D) providing at least one electronic component (1, 30); applying a coating (6) to the electronic component (1, 30) by at least partially immersing the electronic component (1, 30) in a coating material (29) provided in a well (23) of the coating base (22). Further, a sensor assembly (1) for measuring temperature is described, the sensor assembly having a coating (6) applied by the method described above. Further described is a coating carrier (20) for applying a coating (6) to at least one electronic component (1, 30).

Description

[Technical Field]

[0001] The present invention relates to a method for applying a coating to at least one, preferably a plurality of, electronic components. In particular, the coating is applied to a plurality of sensor assemblies. The present invention further relates to a sensor assembly, preferably a temperature sensor assembly, including the coating. The present invention further relates to a coating carrier for applying the coating to at least one electronic component. [Background technology]

[0002] The increasing demand for electronic components such as NTC (Negative Temperature Coefficient) temperature sensors requires cost-effective production with reduced material and energy consumption, but achieving high reliability requires a coordinated combination of new materials and manufacturing technologies.

[0003] A prerequisite for high reliability is a protective coating layer (protection against mechanical, climatic, chemical, thermal, light, etc. influences) with defined geometric dimensions (coating thickness, head diameter, coating length), usually with powder-based and resin-based coating materials.

[0004] Conventional techniques for coating wire contact electronic components include electrostatic, fluidized bed, spray gun, and dipping methods.

[0005] These techniques result in a high waste of coating material (the ratio of the coating material needed for the component to the coating material that is lost). Furthermore, the unused coating material must be recycled, resulting in the accumulation of foreign matter. The simultaneous increase in the demand for higher precision and the need for more compact designs leads to a loss of yield with these techniques. Summary of the Invention

[0006] The object of the present disclosure is to solve the above-mentioned problems, which are solved by a method and a sensor assembly according to the independent claims.

[0007] According to a first aspect, there is provided a method for applying a coating. In particular, the coating is applied to at least a portion of at least one electronic component, preferably a plurality of electronic components. Each electronic component can be any electronic component, such as a temperature sensor. However, it should be understood that the present disclosure is not limited to temperature sensors.

[0008] This procedure includes the following steps:

[0009] In a first step A), a coating carrier is provided, which comprises a main base, which comprises a flat, e.g. rectangular, base, adapted and arranged to receive further components of the coating carrier.

[0010] The coating carrier further comprises a coating base, which is disposed on the main base and has a well or recess, which is adapted and disposed to receive and hold the coating material, and which forms a coating material bed for the coating base.

[0011] The coating carrier further comprises a reservoir, which is at least partially mounted on the coating base. The reservoir extends perpendicular to the main extension direction of the coating base. The reservoir is movable, in particular movable along the longitudinal axis of the coating carrier / main base. The reservoir has a further well, which is also adapted and arranged to receive and hold a coating material. This well represents a coating material bed of the reservoir.

[0012] In the next step B), the wells of the reservoir are filled with the coating material. This is done without overflowing, so that no coating material is wasted. The coating material can be a powder or a resin.

[0013] In the next step C), the reservoirs are shifted along the longitudinal axis of the coating carrier so that the wells of the coating base are filled with the coating material. This is done without spillage. The shifting or displacement of the reservoirs can be done manually or automatically.

[0014] In a next step D), at least one electronic component, preferably several electronic components, are provided. Each electronic component is placed above a well filled with the coating base. Each electronic component is at least partially immersed in the coating material provided in the well of the coating base, thereby forming (at least partially) a coating on the electronic component. The formation of the coating layer by immersion in the coating material is carried out without leakage or splashing.

[0015] The spatter-free coating process can produce a coating protection layer with defined geometric dimensions without the need to include additional machine features in the process. Product costs can be minimized by: a) Reduce powder materials by up to 80% and resin materials by up to 20%; b) Reduce the accumulation of foreign matter; c) Fewer mechanical functions (no recycling, dosing, spraying, leveling, or stirring in the machine); d) Reduce / eliminate coating splash. Overall, a highly effective and cost-effective method of applying coating layers is provided.

[0016] According to one embodiment, the well of the reservoir has a cavity, which is arranged at the bottom of the well. The cavity forms an opening at the bottom of the well of the reservoir. The cavity extends perpendicular to the longitudinal axis. The cavity is adapted and arranged to transfer the coating material into the well of the coating base.

[0017] In step C), the reservoir is moved through the coating base, in particular through the upper surface of the coating base, until the cavity is located directly above the well of the coating base.

[0018] In step C), the reservoir is shifted from the start position to the end position. In the start position, the cavity of the well of the reservoir is closed. In particular, the cavity is closed via the upper surface of the coating base to which the reservoir is at least partially attached. In the end position, the cavity is no longer closed. In particular, in the end position, the cavity is located directly above the well of the coating base. Thus, the coating material is transferred or falls from the well of the reservoir via the cavity into the well of the coating base.

[0019] In this way, the coating material can be transferred easily and without overflow from the reservoir to the wells of the coating base.

[0020] According to one embodiment, after filling the wells of the coating base with the coating material, the reservoir is returned to the starting position. This can be done manually or automatically. During the reservoir movement, the remaining coating material is reliably retained in the reservoir wells. This prevents waste of coating material.

[0021] According to one embodiment, the coating carrier comprises at least two guide elements. The guide elements have rails (e.g., metal rails) fixed to the upper surface of the main base. The guide elements are arranged at least partially along the main base. The guide elements extend parallel to one another along the longitudinal axis of the main base. In step D), the reservoir is shifted along the guide elements. In this way, the reservoir with the coating material is reliably moved along the main base. Spilling or waste of the coating material can be effectively prevented.

[0022] According to one embodiment, the variation in the total coating length is reduced compared to conventional coating techniques, by which we mean the total extent of the coating along the main longitudinal axis of the respective electronic component, i.e. the coated length of the electronic component.

[0023] It can be concluded that the use of coating material, i.e. the amount of coating material, is reduced by the above-mentioned method. Furthermore, very well-defined geometric dimensions of the coating can be achieved by the splash-free coating process.

[0024] According to another aspect of the present disclosure, there is provided a sensor assembly. The sensor assembly can be configured to measure temperature. The sensor assembly can be a wire contact. For example, the sensor assembly can be an NTC temperature sensor assembly.

[0025] The sensor assembly includes a sensor element having a ceramic substrate and at least two electrodes disposed on an outer surface of the ceramic substrate. The sensor assembly also includes at least two contact elements for electrically contacting the sensor element, the contact elements being connected to the electrodes at connection regions.

[0026] The sensor assembly further includes a coating. The material of the coating is a powder or a resin. The coating is applied to the sensor assembly, and in particular to parts of the sensor assembly, by the method described above. All features described in relation to the method also apply to the sensor assembly, and vice versa.

[0027] At least the ceramic substrate and the connection area are completely covered by the coating, which provides a protective layer for the sensor assembly, effectively protecting at least part of the sensor assembly from environmental influences.

[0028] According to one embodiment, the sensor assembly comprises a sensor head, which forms an upper region of the sensor arrangement, the sensor head comprising a sensor element with electrodes and connection regions and at least a partial region of a contact element, and the coating forms a sleeve of the sensor head.

[0029] The variation in sensor head length is smaller than with conventional coating techniques, and the variation in overall coating length is also smaller than with conventional coating techniques, thus providing a very compact sensor assembly with well-defined dimensions.

[0030] The present invention has the following particular aspects: 1. A method of applying a coating to at least one electronic component, the method comprising: A) providing a coating carrier, the coating carrier comprising: - Main bass and - a coating base having a well; - a movable reservoir having a further well; B) filling the wells of the reservoir with a coating material; C) shifting the reservoir along the longitudinal axis of the coating carrier, thus filling the wells of the coating base with the coating material; D) providing at least one electronic component and applying a coating to the electronic component by at least partially immersing the electronic component in a coating material provided in a well of the coating base; Includes.

[0031] 2. A method according to embodiment 1, wherein the well of the reservoir has a cavity located at the bottom of the well, and in step C), the reservoir is moved through the coating base until the cavity is located above the well of the coating base.

[0032] 3. A method according to aspect 1 or 2, wherein the well of the reservoir has a cavity located at the bottom of the well, and in step C) the reservoir is shifted from a start position in which the cavity of the well is closed to an end position in which the cavity of the well is no longer closed, thus transferring the coating material from the well of the reservoir through the cavity of the well and into the well of the coating base.

[0033] 4. The method according to embodiment 3, wherein after filling the wells of the coating base with the coating material, the reservoir is returned to the starting position.

[0034] 5. A method according to any one of aspects 1 to 4, wherein the coating carrier has at least two guide elements arranged at least partially along the main base, and in step D) the reservoir is shifted along the guide elements.

[0035] 6. The method according to any one of aspects 1 to 5, wherein the coating material does not spill when the reservoir is moved along the longitudinal axis and / or when the well is filled with the coating material.

[0036] 7. The method according to any one of Aspects 1 to 6, wherein the coating material comprises a coating powder or a resin.

[0037] 8. The method according to any one of aspects 1 to 7, wherein at least one electronic component includes a sensor assembly for measuring temperature.

[0038] 9. The method according to any one of Aspects 1 to 8, wherein the variation in the overall length of the coating is smaller than that of existing coating techniques.

[0039] 10. A sensor assembly for measuring temperature: a sensor element having a ceramic substrate and at least two electrodes, the electrodes being arranged on an outer surface of the ceramic substrate; - at least two contact elements for electrical contact of the sensor element, the contact elements being connected to the electrodes in connection regions; a coating completely covering at least the ceramic substrate and the connection area, the coating being applied by a method according to any one of aspects 1 to 9.

[0040] 11. A sensor assembly according to aspect 10, comprising a sensor head, the sensor head including a sensor element and at least a portion of a contact element, and the coating forming a sleeve of the sensor head.

[0041] 12. A sensor assembly according to aspect 11, wherein the sensor head length and the total coating length have less variation compared to conventional coating techniques.

[0042] 13. The sensor assembly according to any one of Aspects 10 to 12, wherein the coating material includes a powder or a resin.

[0043] 14. The sensor assembly according to any one of aspects 10 to 13, wherein the sensor assembly is an NTC temperature sensor assembly. [Brief explanation of the drawings]

[0044] Further features, improvements and advantages will become apparent from the following description of exemplary embodiments taken in conjunction with the drawings. [Figure 1] FIG. 1 shows a process diagram of a method for applying a coating to at least one electronic component. [Figure 2] FIG. 2 is a perspective view of a coating carrier. [Figure 3A] 3A-3G illustrate various steps in a process for applying a coating to at least one electronic component. [Figure 3B] 3A-3G illustrate various steps in a process for applying a coating to at least one electronic component. [Figure 3C] 3A-3G illustrate various steps in a process for applying a coating to at least one electronic component. [Figure 3D] 3A-3G illustrate various steps in a process for applying a coating to at least one electronic component. [Figure 3E] 3A-3G illustrate various steps in a process for applying a coating to at least one electronic component. [Figure 3F] 3A-3G illustrate various steps in a process for applying a coating to at least one electronic component. [Figure 3G] 3A-3G illustrate various steps in a process for applying a coating to at least one electronic component. [Figure 4] FIG. 4 is a side view schematically showing a coated electronic component. [Figure 5] FIG. 5 is a perspective view schematically illustrating the electronic component shown in FIG. [Figure 6A]6A and 6B are diagrams illustrating the length of the coating applied by the method of the present invention and the length of the coating applied by the prior art. [Figure 6B] 6A and 6B are diagrams illustrating the length of the coating applied by the method of the present invention and the length of the coating applied by the prior art. [Figure 7A] 7A and 7B are diagrams illustrating the head length of a sensor assembly having a coating applied by the method of the present invention and a coating applied by the prior art. [Figure 7B] 7A and 7B are diagrams illustrating the head length of a sensor assembly having a coating applied by the method of the present invention and a coating applied by the prior art. DETAILED DESCRIPTION OF THE INVENTION

[0045] In the drawings, elements having the same structure and / or the same function may be designated with the same reference numerals. It should be understood that the embodiments shown in the drawings are illustrative representations and are not necessarily drawn to scale.

[0046] 1 shows a process diagram of a method for applying a coating 6 to at least one, and preferably a plurality of, electronic components 30. Each electronic component 30 can be a wire-contact type electronic component. Each electronic component 30 can be a sensor assembly 1 for measuring temperature, such as an NTC temperature assembly (see also the description associated with FIGS. 4 and 5).

[0047] In a first step A) of the method, a coating carrier 20 is provided (see also Figures 2 and 3A). The coating carrier 20 comprises a main base 21. The main base 21 has a rectangular basic shape.

[0048] The coating carrier 20 further comprises a coating base 22. The coating base 22 has a rectangular shape and is provided in the central region of the upper surface of the main base 21. In other words, the coating base 22 does not reach the side edges of the main base 21. The extent of the coating base 22 along the longitudinal axis X of the main base 21 is greater than the extent of the coating base 22 along an axis perpendicular to the longitudinal axis X. In other words, the main extent direction of the coating base 22 extends along the (main) longitudinal axis X of the main base 21 / coating carrier 20.

[0049] The coating base 22 can be glued or screwed to the main base 21, for example. The coating base 22 has a well 23, which is adapted and arranged to receive a coating material 29 in the further course of the described method. The well 23 can be arranged in a side region of the upper surface of the coating base 22 (FIG. 2: left region of the upper surface) and can extend perpendicular to the longitudinal axis X. The well 23 can be milled into the upper surface of the coating base 22, for example.

[0050] The coating carrier 20 further comprises a reservoir 24. The reservoir 24 has a rectangular shape and, in the starting position, is arranged in a side region (here, in the right region) of the upper surface of the main base 21. The reservoir 24 is at least partially supported on the upper surface of the coating base 22 (starting position: in the right region of the upper surface of the coating base 22). The extent of the reservoir 24 along the longitudinal axis X of the main base 21 is smaller than the extent of the reservoir 24 along an axis perpendicular to the longitudinal axis X. In other words, the main direction of extent of the reservoir 24 is perpendicular to the (main) longitudinal axis X / coating base 22.

[0051] The reservoir 24 has a well 25. The well 25 is adapted and arranged to receive the coating material 29. The well 25 is located in a central region of the upper surface of the reservoir 24 and extends perpendicular to the longitudinal axis X. The well 25 can be, for example, milled into the upper surface of the reservoir 24. The reservoir 24 is constructed and arranged such that the well 25 is located directly above the upper surface of the coating base 22.

[0052] Well 25 includes a cavity 28 disposed in the bottom surface of well 25. Cavity 28 allows for the transfer of coating material 29 from well 25 of reservoir 24 to well 23 of coating base 22, as described below. In the starting position, the upper surface of coating base 22 forms the lower boundary of cavity 28, i.e., closes cavity 28.

[0053] The reservoir 24 is movable along the longitudinal axis X. To this end, the reservoir 24 is arranged on two sliders 26, which are arranged opposite each other. In a top view of the coating carrier 20, one slider 26 is arranged above the coating base 22, and the other slider 26 is arranged below the coating base 22.

[0054] The coating carrier 20 further comprises two guide elements 31. Each slider 26 surrounds a guide element 31 and can shift along the respective guide element 31. The guide elements 31 extend along the longitudinal axis X and are screwed to the main base 21.

[0055] The reservoir 24 can be moved manually or automatically from the start position (where the reservoir 24 is located in the right side region of the main base 21; the upper surface of the coating base 22 forms the lower boundary of the cavity 28) to the end position (where the reservoir 24 is located in the left side region of the main base 21; the reservoir 23 (particularly the bottom of the reservoir 23) of the coating base 22 forms the lower boundary of the cavity 28).

[0056] The coating carrier 20 further comprises two stops 27. The stops 27 are screwed to the main base 21. The stops 27 extend perpendicular to the longitudinal axis X. The stops 27 have thin rails or strips. The rails or strips may, for example, comprise metal. The stops 27 separate the upper surface of the main base 21 into two opposite side surfaces (FIG. 2: left and right sides of the main base 21). In particular, the stops 27 are adapted and arranged to limit the movement of the reservoir 24 along the longitudinal axis X. The stops 27 ensure that the reservoir 24 can only move between the start and end positions described above.

[0057] After the coating carrier 20 is provided, it is first thoroughly cleaned (see FIG. 3A) to remove any contaminants that may be present in the coating material 29 described above.

[0058] In step B) of the method, coating material 29 is filled into well 25 of reservoir 24 (see also FIG. 3B). Coating material 29 may comprise a powder or a resin. Coating material 29 may be filled up to the top of well 25. Leakage of coating material 29 from cavity 28 is prevented by the upper surface of coating base 22, which is located below cavity 28.

[0059] In step C) of the method, the reservoir 24 is shifted along the longitudinal axis X (i.e., along the guide element 31). The reservoir 24 is moved from a start position to an end position, with the well 25 of the reservoir 24 being positioned above the well 23 of the coating base 22. During the movement from the start position to the end position, leakage of the coating material 29 from the cavity 28 through the upper surface of the coating base 22 is prevented. Furthermore, no overflow, e.g., over the edge of the well 25, occurs during the movement of the reservoir 24.

[0060] At the end position, the coating material 29 drops through the cavity 28 into the well 23 of the coating base 22, i.e., the well 23 of the coating base 22 is filled with the coating material 29 (see FIG. 3C). This prevents leakage of the coating material 29. The reservoir 24 is then returned (automatically or manually) to its start position.

[0061] In method step D), at least one electronic component 30, preferably several electronic components 30, are provided (see FIG. 3D). The electronic components 30 are positioned directly above the wells 23 of the coating base 22, i.e., directly above the coating material 29. The electronic components 30 are moved toward the wells 23 of the coating base 22 and at least partially immersed in the coating material 29 provided in the wells 23 of the coating base 22 (see FIG. 3E), forming a coating 6 (at least partially) on each electronic component 30 without splashing or overflowing. The electronic components 30 are then returned to their starting position above the wells 23 (FIG. 3F).

[0062] After coating the electronic components 30, the wells 25 of the reservoirs 24 (and subsequently the wells 23 of the coating base 22) are refilled with the coating material 29 as described above (see FIG. 3G).

[0063] This occurs without spillage due to the special design of the coating carrier 20. In particular, the above-described method is a spill-free coating technique. It allows the production of a protective coating layer (coating 6) with defined geometric dimensions without additional machine functions in the process. Product costs can be minimized in the following ways: a) Reduce powder materials by up to 80% and resin materials by up to 20%; b) Reduce the accumulation of foreign matter; c) Fewer mechanical functions (no recycling, dosing, spraying, leveling, or stirring in the machine); d) Reduce coating splash.

[0064] 4 and 5 show an example of a coated electronic component 30. FIG.

[0065] Each electronic component 30 has a wire contact type electronic component. Each electronic component 30 can include a sensor assembly 1 designed to measure temperature, such as an NTC temperature sensor assembly. The sensor assembly 1 can be designed for use at high temperatures.

[0066] The sensor assembly 1 comprises a sensor element or sensor chip. The sensor element is preferably an NTC thermistor chip. The sensor element comprises a ceramic substrate 2. The ceramic substrate 2 has oppositely disposed side surfaces 2a. The sensor element further comprises two electrodes 3. The electrodes 3 are formed on the outer surface of the sensor element. In particular, the electrodes 3 are formed on opposite side surfaces 2a of the ceramic substrate 2.

[0067] The sensor assembly 1 further comprises two contact elements 4 for electrical contact of the sensor elements. The contact elements 4 preferably comprise wires. The contact elements 4 are electrically and mechanically connected to the electrodes 3 at connection regions 7. The electrodes 3 and the contact elements 4 can be in contact with each other via a contact paste 5, for example.

[0068] The sensor assembly 1 further comprises a coating 6, i.e., a coating 6 obtained by the process described above. The coating 6 completely surrounds both the ceramic substrate 2 and the connection area 7 of the sensor element. In particular, the coating 6 completely surrounds the head 8 (sensor head 8) of the sensor assembly 1. The sensor head 8 comprises the sensor element and at least a partial area of ​​the contact element 4, as can be seen in Figures 4 and 5. The coating 6 forms a sleeve for the sensor head 8 and protects it from environmental influences.

[0069] The underside of the coating 6 has depressions 6a in the coating 6, which are caused by the immersion of the electronic component 30 or the sensor assembly 1 in the coating material 29 as described above.

[0070] The sensor head 8 extends from the top end of the sensor arrangement 1 to the apex of the recess 6a (i.e., the overall length L1 of the sensor head 8). The overall length L1 of the sensor head 8, i.e., the overall extent of the sensor head 8 along the major longitudinal axis of the electronic component 30 / sensor assembly 1 (see FIG. 7A), is small compared to conventional coating techniques (see FIG. 7B).

[0071] More precisely, the deviation of the total length L1 is lower compared to conventional coating techniques (see FIG. 7A). In other words: the variation of the total head length achieved by conventional coating methods is statistically significantly higher compared to the method according to the invention (see FIG. 7B).

[0072] Furthermore, the total length L2 of the coating 6, i.e. the complete extent of the coating 6 along the main longitudinal axis of the electronic component 30 / sensor assembly 1 (see FIG. 6A), is smaller compared to conventional coating techniques (see FIG. 6B).

[0073] The variation in the total length L2 of the coating 6 is low compared to conventional coating techniques (see FIG. 6A). In other words, the variation in the total length of the coating achieved by the conventional coating method is statistically significantly higher compared to the method according to the present invention (FIG. 6B).

[0074] Overall, the spill-free coating method described above results in statistically significant reductions in sensor head length and overall length variations compared to conventional coating techniques. Furthermore, coating splatter can be avoided. In this way, the spill-free coating method provides compact, cost-effective electronic components with well-defined geometric dimensions. [Explanation of symbols]

[0075] 1 Sensor assembly 2 Base (Grundkoerper) 2a Side of the base (Seitenflaeche des Grundkoerpers) 3 Electrode 4 Contact element 5. Contact paste 6 Coating 6a Depression (Einbuchtung) 7 Connecting Areas (Anschlussbereich) 8 Sensor head (Sensorkopf) 20 Coating carrier 21 Main Bass (Hauptsockel) 22 Coating base 23 Coating-based wells (Vertiefung des Beschichtungssockels) 24 Reservoir 25 Reservoir wells (Vertiefung des Vorratsbehaelters) 26 Slider (Schieber) 27 Stopper 28 Vacant Space (Aussparung) 29 Coating materials 30 Electronic Components 31 Guide element L1 Overall length of the sensor head L2 Total coating length X Longitudinal Axis (Laengsachse)

Claims

1. 1. A method of applying a coating to at least one electronic component, comprising: A) providing a coating carrier, said coating carrier comprising: - Main bass and a coating base having a well, which is placed on the main base; a movable reservoir having a further well; B) filling the further well of the reservoir with a coating material; C) shifting the reservoir along the longitudinal axis of the coating carrier, thus filling the wells of the coating base with the coating material, the further wells of the reservoir having a cavity arranged at the bottom of the further well, and in step C) the reservoir is shifted from a start position, in which the cavity of the further well is closed, to an end position, in which the cavity of the further well is no longer closed, thus transferring the coating material from the further well of the reservoir through the cavity of the well into the well of the coating base; D) providing at least one electronic component and applying a coating to the electronic component by at least partially immersing the electronic component in the coating material provided in the well of the coating base; A method comprising:

2. the further well of the reservoir has a cavity disposed at the bottom of the further well; In step C), the reservoir is moved through the coating base until the cavity is positioned above the well of the coating base. The method of claim 1.

3. The coating base is glued or screwed to the main base.

3. The method according to claim 1 or 2.

4. The reservoir is movable manually or automatically. The method of claim 1.

5. After filling the wells of the coating base with coating material, the reservoir is returned to the starting position. The method of claim 1.

6. the coating carrier has at least two guide elements arranged at least partially along the main base, In step D), the reservoir is shifted along the guide element; The method of claim 1.

7. the coating material does not spill when the reservoir is moved along the longitudinal axis and / or when the well and / or the further well is filled with coating material. The method of claim 1.

8. The coating material includes a coating powder or a resin. The method of claim 1.

9. the at least one electronic component includes a sensor assembly for measuring temperature; The method of claim 1.

10. The at least one electronic component is positioned directly above the well of the coating base. The method of claim 1.

11. The at least one electronic component is moved toward the well of the coating base and is at least partially immersed in the coating material provided in the well of the coating base. The method of claim 1.

12. 1. A coating carrier for applying a coating to at least one electronic component, comprising: - Main bass and a coating base disposed on said main base and having a well, said well adapted and arranged to receive and hold a coating material; a movable reservoir mounted at least partially on said coating base, the reservoir having a further well adapted and arranged to receive and hold a coating material; Equipped with A coating carrier, wherein the further well of the reservoir has a cavity disposed at the bottom of the further well, and the coating material is transferred from the further well of the reservoir through the cavity of the well into the well of the coating base.

13. the reservoir extends perpendicular to the main extension direction of the coating base; The coated carrier according to claim 12.

14. The reservoir moves along the longitudinal axis of the coating carrier. The coated carrier according to claim 12 or 13.

15. The coating base has a rectangular shape and is provided in the central region of the upper surface of the main base. The coated carrier according to claim 12.

16. The coating base does not extend to the side edges of the main base. The coated carrier according to claim 12.

17. The coating base is glued or screwed to the main base. The coated carrier according to claim 12.

18. The reservoir is movable manually or automatically. The coated carrier according to claim 12.

19. the reservoir is shiftable between a start position and an end position; In the starting position, an upper surface of the coating base forms a lower boundary of the cavity; In the final position, the further well of the reservoir is positioned above the well of the coating base. The coated carrier according to claim 12.

20. the coating carrier has at least two guide elements arranged at least partially along the main base; the reservoir is shiftable along the guide element; The coated carrier according to claim 12.

21. the at least one electronic component includes a sensor assembly for measuring temperature; The coated carrier according to claim 12.

22. The at least one electronic component is moved toward the well of the coating base and is at least partially immersed in the coating material provided in the well of the coating base. The coated carrier according to claim 12.

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