Inductor Components

Abstract

To stabilize the attitude of an inductor component relative to a substrate when mounting the inductor component on the substrate.SOLUTION: An inductor component 10 comprises: a rectangular parallelepiped element assembly 11, and inductor wiring that extends inside the element assembly 11. The element assembly 11 has a first electrode 40. The first electrode 40 is exposed to the outside of the element assembly 11 in an area from a bottom face 11E to a first end face 11C. The inductor wiring has a first wiring part that extends in parallel to a first principal surface 11A from a first end, and a via that extends in a direction perpendicular to the first principal surface 11A from the first wiring part. When a layer where the first wiring part is present in the direction perpendicular to the first principal surface 11A is defined as a first wiring layer LW1, and a layer where the via extending from the first wiring part is present is defined as a first via layer LV1, a first wiring layer height WH1 that is the maximum height dimension of the first electrode 40 in the first wiring layer LW1 is larger than a first via layer height VH1 that is the maximum height dimension of the first electrode 40 in the first via layer LV1.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to an inductor component. [Background technology]

[0002] The inductor component of Patent Document 1 includes a rectangular parallelepiped element body having six outer surfaces. The six outer surfaces of the element body include a first main surface which is the surface with the largest area, a second main surface parallel to the first main surface, a first end surface perpendicular to the first main surface, a second end surface parallel to the first end surface, a bottom surface perpendicular to the first main surface and the first end surface, and a top surface parallel to the first side surface. The inductor component also includes inductor wiring. The inductor wiring is located inside the element body. The element body has a first electrode and a second electrode. A first end of the inductor wiring is connected to the first electrode. A second end of the inductor wiring is connected to the second electrode. The first electrode is exposed to the outside of the element body in a region from the first end surface to the bottom surface. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-79870 Summary of the Invention [Problem to be solved by the invention]

[0004] In an inductor component such as that described in Patent Document 1, it is preferable that the area of ​​the first electrode exposed to the outside of the element body is small in order to reduce the stray capacitance that occurs between the first electrode and the inductor wiring. On the other hand, if the area of ​​the first electrode exposed to the outside of the element body is small, the inductor component may not be stable when mounted on a substrate, and may end up being mounted on the substrate in an inclined state. [Means for solving the problem]

[0005] In order to solve the above problems, the present invention provides a rectangular parallelepiped element body having six outer surfaces, and an inductor wiring extending inside the element body, wherein the element body has a first electrode connected to a first end of the inductor wiring and a second electrode connected to a second end of the inductor wiring, and wherein one of the six outer surfaces of the element body is a main surface, one of the surfaces perpendicular to the main surface is a first end surface, a surface parallel to the first end surface is a second end surface, and a surface perpendicular to both the main surface and the first end surface is a second end surface. When one of the electrodes is a bottom surface, the first electrode is exposed to the outside of the element body in a region from the first end surface to the bottom surface, and the second electrode is exposed to the outside of the element body in a region from the second end surface to the bottom surface, the inductor wiring has a wiring portion extending from the first end in parallel to the main surface and a via extending from the wiring portion in a direction perpendicular to the main surface, a layer in which the wiring portion exists in the direction perpendicular to the main surface is called a wiring layer, and a layer in which the via exists is called a via layer, In the part exposed to the outside of the element body When the dimension in the direction perpendicular to the bottom surface is taken as the height dimension, the maximum height dimension of the first electrode in the wiring layer is greater than the maximum height dimension of the first electrode in the via layer.

[0006] According to the above configuration, for example, the exposed area of ​​the first electrode can be made larger than when the maximum height dimension of the first electrode in the wiring layer is equal to the maximum height dimension of the first electrode in the via layer. Therefore, when the inductor component is mounted on a substrate or the like, the solder or the like spreads over the surface of the first electrode, stabilizing the position of the inductor component relative to the substrate. [Effects of the Invention]

[0007] When the inductor component is mounted on a substrate, the position of the inductor component relative to the substrate is stable. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view of an inductor component according to a first embodiment. [Figure 2] FIG. 2 is an exploded perspective view of the inductor component of the first embodiment. [Figure 3]FIG. 2 is a diagram showing a first layer of the inductor component of the first embodiment. [Figure 4] FIG. 2 is a view showing a first end face of an element body of the inductor component of the first embodiment. [Figure 5] FIG. 10 is a view showing a first end face of an element body of an inductor component according to a second embodiment. [Figure 6] FIG. 10 is a view showing a first end face of an element body of an inductor component according to a third embodiment. [Figure 7] FIG. 10 is a view showing a first end face of an element body of an inductor component according to a fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] First Embodiment A first embodiment of the inductor component will be described below. Note that the drawings may show components enlarged to facilitate understanding. The dimensional ratios of the components may differ from the actual ones or from those in other drawings.

[0010] (Overall structure) 1, the inductor component 10 includes a rectangular parallelepiped element body 11. As shown in Fig. 3, the inductor component 10 includes an inductor wiring 30 extending inside the element body 11, a first electrode 40 connected to a first end of the inductor wiring 30, and a second electrode 50 connected to a second end of the inductor wiring 30.

[0011] As shown in FIG. 2, the inductor component 10 has an overall structure in which multiple plate-like layers are stacked. Each layer has a rectangular shape in a plan view. The element body 11 has a rectangular parallelepiped shape and thus has six outer surfaces. As shown in FIG. 1, of these six outer surfaces, a specific surface parallel to the main surfaces of each layer is designated as a first main surface 11A. A surface parallel to the first main surface 11A is designated as a second main surface 11B. A specific surface perpendicular to the first main surface 11A is designated as a first end surface 11C. A surface parallel to the first end surface 11C is designated as a second end surface 11D. A specific surface perpendicular to both the first main surface 11A and the first end surface 11C is designated as a bottom surface 11E. A surface parallel to the bottom surface 11E is designated as a top surface 11F.

[0012] In the following description, the axis along the stacking direction of multiple layers, i.e., the axis perpendicular to the first main surface 11A, is referred to as the first axis X. The axis perpendicular to the first end surface 11C is referred to as the second axis Y. The axis perpendicular to the bottom surface 11E is referred to as the third axis Z. The direction along the first axis X in which the first main surface 11A faces is referred to as the first positive direction X1, and the direction opposite to the first positive direction X1 is referred to as the first negative direction X2. The direction along the second axis Y in which the first end surface 11C faces is referred to as the second positive direction Y1, and the direction opposite to the second positive direction Y1 is referred to as the second negative direction Y2. The direction along the third axis Z in which the top surface 11F faces is referred to as the third positive direction Z1, and the direction opposite to the third positive direction Z1 is referred to as the third negative direction Z2.

[0013] As shown in FIG. 2, the inductor component 10 has a first layer L1 to a ninth layer L9. The first layer L1 to the ninth layer L9 are arranged in this order in the first negative direction X2. The first layer L1 to the ninth layer L9 all have substantially the same thickness, i.e., the dimension along the X-axis. As shown in FIG. 3, the first layer L1 is composed of a first electrode portion 41, a second electrode portion 51, a first wiring portion 31, and a first insulating portion 21.

[0014] The first electrode portion 41 is made of a conductive material such as silver. When the first layer L1 is viewed in the first negative direction X2, the first electrode portion 41 has an L-shape as a whole. When the first layer L1 is viewed in the first negative direction X2, the first electrode portion 41 is located closer to the second positive direction Y1 and the third negative direction Z2 than the center of the first layer L1. In other words, when the first layer L1 is viewed in the first negative direction X2, the first electrode portion 41 is located at a position including a corner closer to the second positive direction Y1 and the third negative direction Z2 than the center of the first layer L1.

[0015] The maximum dimension of the first electrode unit 41 in the direction along the third axis Z is greater than half the dimension of the first layer L1 in the direction along the third axis Z. The maximum dimension of the first electrode unit 41 in the direction along the third axis Z is the dimension of a portion of the first electrode unit 41 extending along the first end surface 11C in the direction along the third axis Z. In other words, the end of the first electrode unit 41 on the third positive direction Z1 side is located closer to the third positive direction Z1 than the center of the first layer L1 in the direction along the third axis Z. The maximum dimension of the first electrode unit 41 in the direction along the second axis Y is less than half the dimension of the first layer L1 in the direction along the second axis Y. The maximum dimension of the first electrode unit 41 in the direction along the second axis Y is the dimension of a portion of the first electrode unit 41 extending along the bottom surface 11E in the direction along the second axis Y. That is, the end of the first electrode portion 41 on the second negative direction Y2 side is located on the second positive direction Y1 side of the center of the first layer L1 in the direction along the second axis Y.

[0016] The second electrode portion 51 is made of a conductive material such as silver. When the first layer L1 is viewed in the first negative direction X2, the second electrode portion 51 has an L-shape as a whole. When the first layer L1 is viewed in the first negative direction X2, the second electrode portion 51 is located on the second negative direction Y2 side and the third negative direction Z2 side of the center of the first layer L1. In other words, when the first layer L1 is viewed in the first negative direction X2, the second electrode portion 51 is located at a position including a corner on the second negative direction Y2 side and the third negative direction Z2 side of the center of the first layer L1.

[0017] The maximum dimension of the second electrode unit 51 in the direction along the third axis Z is greater than half the dimension of the first layer L1 in the direction along the third axis Z. The maximum dimension of the second electrode unit 51 in the direction along the third axis Z is the dimension of a portion of the second electrode unit 51 extending along the second end surface 11D in the direction along the third axis Z. In other words, the end of the second electrode unit 51 on the third positive direction Z1 side is located closer to the third positive direction Z1 than the center of the first layer L1 in the direction along the third axis Z. The maximum dimension of the second electrode unit 51 in the direction along the second axis Y is less than half the dimension of the first layer L1 in the direction along the second axis Y. The maximum dimension of the second electrode unit 51 in the direction along the second axis Y is the dimension of a portion of the second electrode unit 51 extending along the bottom surface 11E in the direction along the second axis Y. That is, the end of the second electrode portion 51 on the second positive direction Y1 side is located on the second negative direction Y2 side of the center of the first layer L1 in the direction along the second axis Y.

[0018] The first wiring portion 31 is made of a conductive material such as silver. When the first layer L1 is viewed in the first negative direction X2, the first wiring portion 31 as a whole extends in a spiral shape centered on the center of the first layer L1. Specifically, a first end portion 31A of the first wiring portion 31 is connected to an end portion of the first electrode portion 41 on the third positive direction Z1 side in the direction along the third axis Z. In other words, the first end portion 31A is a first end of the inductor wiring 30. The wiring width of the first wiring portion 31 is substantially constant except for the second end portion 31B. The position of the second end portion 31B of the first wiring portion 31 in the direction along the third axis Z is closer to the third positive direction Z1 than the center in the direction along the third axis Z and closer to the third negative direction Z2 than the first end portion 31A. The position of the second end 31B of the first wiring portion 31 in the direction along the second axis Y is closer to the second positive direction Y1 than the center in the direction along the second axis Y. When the first wiring portion 31 is viewed in the first negative direction X2, the first wiring portion 31 extends clockwise from the first end 31A toward the second end 31B.

[0019] The second end 31B of the first wiring portion 31 functions as a pad for connection to a via 32, which will be described later. When the first layer L1 is viewed in the first negative direction X2, the second end 31B has a substantially circular shape. The second end 31B of the first wiring portion 31 has a wiring width greater than that of the other portions of the first wiring portion 31.

[0020] In the first layer L1, the portion excluding the first electrode portion 41, the second electrode portion 51, and the first wiring portion 31 is the first insulating portion 21. The first insulating portion 21 is made of a non-magnetic insulator such as glass, resin, or alumina.

[0021] 2, the second layer L2 is laminated on the main surface of the first layer L1 facing the first negative direction X2. When the second layer L2 is viewed in the first negative direction X2, the second layer L2 has the same rectangular shape as the first layer L1. The second layer L2 is composed of a third electrode portion 42, a fourth electrode portion 52, a via 32, and a second insulating portion 22.

[0022] The third electrode unit 42 is made of the same material as the first electrode unit 41. When the second layer L2 is viewed in the first negative direction X2, the third electrode unit 42 has an L-shape as a whole. When the second layer L2 is viewed in the first negative direction X2, the third electrode unit 42 is located closer to the second positive direction Y1 and the third negative direction Z2 than the center of the second layer L2. In other words, when the second layer L2 is viewed in the first negative direction X2, the third electrode unit 42 is located at a position including a corner closer to the second positive direction Y1 and the third negative direction Z2 than the center of the second layer L2. Therefore, the third electrode unit 42 is stacked on the surface of the first electrode unit 41 facing the first negative direction X2.

[0023] The maximum dimension of the third electrode portion 42 in the direction along the third axis Z is smaller than the dimension of the first electrode portion 41 in the direction along the third axis Z. The maximum dimension of the third electrode portion 42 in the direction along the third axis Z is the dimension of a portion of the third electrode portion 42 extending along the first end surface 11C in the direction along the third axis Z. Specifically, the position of the end of the third electrode portion 42 on the third positive direction Z1 side is the center of the second layer L2 along the third axis Z. The maximum dimension of the third electrode portion 42 in the direction along the second axis Y is equal to the maximum dimension of the first electrode portion 41 in the direction along the second axis Y.

[0024] The fourth electrode unit 52 is made of the same material as the second electrode unit 51. When the second layer L2 is viewed in the first negative direction X2, the fourth electrode unit 52 has an overall L-shape. When the second layer L2 is viewed in the first negative direction X2, the fourth electrode unit 52 is located closer to the second negative direction Y2 and the third negative direction Z2 than the center of the second layer L2. In other words, when the second layer L2 is viewed in the first negative direction X2, the fourth electrode unit 52 is located at a position including a corner closer to the second negative direction Y2 and the third negative direction Z2 than the center of the second layer L2. Therefore, the fourth electrode unit 52 is stacked on the surface of the second electrode unit 51 facing the first negative direction X2.

[0025] The maximum dimension of the fourth electrode portion 52 in the direction along the third axis Z is smaller than the dimension of the second electrode portion 51 in the direction along the third axis Z. The maximum dimension of the fourth electrode portion 52 in the direction along the third axis Z is the dimension of a portion of the fourth electrode portion 52 extending along the second end surface 11D in the direction along the third axis Z. Specifically, the position of the end of the fourth electrode portion 52 on the third positive direction Z1 side is the center of the second layer L2 along the third axis Z. The maximum dimension of the fourth electrode portion 52 in the direction along the second axis Y is equal to the maximum dimension of the second electrode portion 51 in the direction along the second axis Y.

[0026] The via 32 is made of the same material as the first wiring portion 31. The via 32 has a cylindrical shape extending in a direction along the first axis X. The via 32 is laminated on a surface of the second end portion 31B of the first wiring portion 31 facing the first negative direction X2. Therefore, the via 32 is electrically connected to the second end portion 31B of the first wiring portion 31. The via 32 extends from the second end portion 31B of the first wiring portion 31 in the first negative direction X2.

[0027] In the second layer L2, the portion excluding the third electrode portion 42, the fourth electrode portion 52, and the via 32 is the second insulating portion 22. The second insulating portion 22 is made of the same non-magnetic insulator material as the first insulating portion 21.

[0028] The third layer L3 is stacked on the main surface of the second layer L2 facing the first negative direction X2. When the third layer L3 is viewed in the first negative direction X2, the third layer L3 has the same rectangular shape as the first layer L1. The third layer L3 is composed of a fifth electrode portion 43, a sixth electrode portion 53, a second wiring portion 33, and a third insulating portion 23.

[0029] The fifth electrode portion 43 is made of the same material as the first electrode portion 41. When the third layer L3 is viewed in the first negative direction X2, the fifth electrode portion 43 has an L-shape with the same dimensions as the third electrode portion 42 and is located in the same position as the third electrode portion 42. Therefore, the fifth electrode portion 43 is stacked on the surface of the third electrode portion 42 facing the first negative direction X2. Note that, because the dimensions of the fifth electrode portion 43 are the same as those of the third electrode portion 42, the maximum dimension of the fifth electrode portion 43 in the direction along the third axis Z is smaller than the maximum dimension of the first electrode portion 41 in the direction along the third axis Z.

[0030] The sixth electrode portion 53 is made of the same material as the second electrode portion 51. When the third layer L3 is viewed in the first negative direction X2, the sixth electrode portion 53 has an L-shape with the same dimensions as the fourth electrode portion 52 and is located in the same position as the fourth electrode portion 52. Therefore, the sixth electrode portion 53 is stacked on the surface of the fourth electrode portion 52 facing the first negative direction X2. Note that, because the sixth electrode portion 53 has the same dimensions as the fourth electrode portion 52, the maximum dimension of the sixth electrode portion 53 in the direction along the third axis Z is smaller than the maximum dimension of the second electrode portion 51 in the direction along the third axis Z.

[0031] The second wiring portion 33 is made of the same material as the first wiring portion 31. When the third layer L3 is viewed in the first negative direction X2, the second wiring portion 33 extends in a spiral shape centered on the center of the third layer L3. Specifically, the first end 33A of the second wiring portion 33 is located on a surface of the via 32 facing the first negative direction X2. Therefore, the first end 33A of the second wiring portion 33 is connected to the via 32. The wiring width of the second wiring portion 33 is substantially constant except for the first end 33A and the second end 33B. The position of the second end 33B of the second wiring portion 33 in the direction along the third axis Z is closer to the third negative direction Z2 than the center in the direction along the third axis Z. The position of the second end 33B of the second wiring portion 33 in the direction along the second axis Y is closer to the second positive direction Y1 than the center in the direction along the second axis Y, and is closer to the center in the direction along the second axis Y than the position of the second end 31B of the first wiring portion 31 in the direction along the second axis Y. When the second wiring portion 33 is viewed in the first negative direction X2, the second wiring portion 33 extends clockwise from the first end 33A toward the second end 33B.

[0032] In the third layer L3, the portion excluding the fifth electrode portion 43, the sixth electrode portion 53, and the second wiring portion 33 is the third insulating portion 23. The third insulating portion 23 is made of the same non-magnetic insulator material as the first insulating portion 21.

[0033] The fourth layer L4 is stacked on the main surface of the third layer L3 facing the first negative direction X2. When the fourth layer L4 is viewed in the first negative direction X2, the fourth layer L4 has the same rectangular shape as the first layer L1. The fourth layer L4 is composed of a seventh electrode portion 44, an eighth electrode portion 54, a via 34, and a fourth insulating portion 24.

[0034] The seventh electrode portion 44 is made of the same material as the first electrode portion 41. When the fourth layer L4 is viewed in the first negative direction X2, the seventh electrode portion 44 has an L-shape with the same dimensions as the fifth electrode portion 43 and is located in the same position as the fifth electrode portion 43. Therefore, the seventh electrode portion 44 is stacked on the surface of the fifth electrode portion 43 facing the first negative direction X2. Note that, because the dimensions of the seventh electrode portion 44 are the same as those of the fifth electrode portion 43, the maximum dimension of the seventh electrode portion 44 in the direction along the third axis Z is smaller than the maximum dimension of the first electrode portion 41 in the direction along the third axis Z.

[0035] The eighth electrode portion 54 is made of the same material as the second electrode portion 51. When the fourth layer L4 is viewed in the first negative direction X2, the eighth electrode portion 54 has an L-shape with the same dimensions as the sixth electrode portion 53 and is located in the same position as the sixth electrode portion 53. Therefore, the eighth electrode portion 54 is stacked on the surface of the sixth electrode portion 53 facing the first negative direction X2. Note that, because the eighth electrode portion 54 has the same dimensions as the sixth electrode portion 53, the maximum dimension of the eighth electrode portion 54 in the direction along the third axis Z is smaller than the maximum dimension of the second electrode portion 51 in the direction along the third axis Z.

[0036] The via 34 is made of the same material as the first wiring portion 31. The via 34 has a cylindrical shape extending in a direction along the first axis X. The via 34 is laminated on a surface of the second end portion 33B of the second wiring portion 33 facing the first negative direction X2. Therefore, the via 34 is electrically connected to the second end portion 33B of the second wiring portion 33. The via 34 extends from the second end portion 33B of the second wiring portion 33 in the first negative direction X2.

[0037] In the fourth layer L4, the portion excluding the seventh electrode portion 44, the eighth electrode portion 54, and the via 34 is the fourth insulating portion 24. The fourth insulating portion 24 is made of the same non-magnetic insulator material as the first insulating portion 21.

[0038] The fifth layer L5 is stacked on the main surface of the fourth layer L4 facing the first negative direction X2. When the fifth layer L5 is viewed in the first negative direction X2, the fifth layer L5 has the same rectangular shape as the first layer L1. The fifth layer L5 is composed of a ninth electrode portion 45, a tenth electrode portion 55, a third wiring portion 35, and a fifth insulating portion 25.

[0039] The ninth electrode portion 45 is made of the same material as the first electrode portion 41. When the fifth layer L5 is viewed in the first negative direction X2, the ninth electrode portion 45 has an L-shape with the same dimensions as the seventh electrode portion 44 and is located in the same position as the seventh electrode portion 44. Therefore, the ninth electrode portion 45 is stacked on the surface of the seventh electrode portion 44 facing the first negative direction X2. Note that, because the dimensions of the ninth electrode portion 45 are the same as those of the seventh electrode portion 44, the maximum dimension of the ninth electrode portion 45 in the direction along the third axis Z is smaller than the maximum dimension of the first electrode portion 41 in the direction along the third axis Z.

[0040] The tenth electrode unit 55 is made of the same material as the second electrode unit 51. When the fifth layer L5 is viewed in the first negative direction X2, the tenth electrode unit 55 has an L-shape with the same dimensions as the eighth electrode unit 54 and is located in the same position as the eighth electrode unit 54. Therefore, the tenth electrode unit 55 is stacked on the surface of the eighth electrode unit 54 facing the first negative direction X2. Note that, because the tenth electrode unit 55 has the same dimensions as the eighth electrode unit 54, the maximum dimension of the tenth electrode unit 55 in the direction along the third axis Z is smaller than the maximum dimension of the second electrode unit 51 in the direction along the third axis Z.

[0041] The third wiring portion 35 is made of the same material as the first wiring portion 31. When the fifth layer L5 is viewed in the first negative direction X2, the third wiring portion 35 extends in a spiral shape centered on the center of the fifth layer L5. Specifically, the first end 35A of the third wiring portion 35 is located on the surface of the via 34 facing the first negative direction X2. Therefore, the first end 35A of the third wiring portion 35 is connected to the via 34. The wiring width of the third wiring portion 35 is substantially constant except for the first end 35A and the second end 35B. The position of the second end 33B of the third wiring portion 35 in the direction along the third axis Z is closer to the third negative direction Z2 than the center in the direction along the third axis Z. Furthermore, the position of the second end 33B of the second wiring portion 33 in the direction along the second axis Y is closer to the second negative direction Y2 than the center in the direction along the second axis Y. When the third wiring portion 35 is viewed in the first negative direction X2, the third wiring portion 35 extends clockwise from the first end portion 35A to the second end portion 35B.

[0042] In the fifth layer L5, the portion excluding the ninth electrode portion 45, the tenth electrode portion 55, and the third wiring portion 35 is the fifth insulating portion 25. The fifth insulating portion 25 is made of the same non-magnetic insulator material as the first insulating portion 21.

[0043] The sixth layer L6 is stacked on the main surface of the fifth layer L5 facing the first negative direction X2. When the sixth layer L6 is viewed in the first negative direction X2, the sixth layer L6 has the same rectangular shape as the first layer L1. The sixth layer L6 is composed of an eleventh electrode portion 46, a twelfth electrode portion 56, a via 36, ​​and a sixth insulating portion 26.

[0044] The eleventh electrode portion 46 is made of the same material as the first electrode portion 41. When the sixth layer L6 is viewed in the first negative direction X2, the eleventh electrode portion 46 has an L-shape with the same dimensions as the ninth electrode portion 45 and is located in the same position as the ninth electrode portion 45. Therefore, the eleventh electrode portion 46 is stacked on the surface of the ninth electrode portion 45 facing the first negative direction X2. Note that, because the dimensions of the eleventh electrode portion 46 are the same as those of the ninth electrode portion 45, the maximum dimension of the eleventh electrode portion 46 in the direction along the third axis Z is smaller than the maximum dimension of the first electrode portion 41 in the direction along the third axis Z.

[0045] The twelfth electrode portion 56 is made of the same material as the second electrode portion 51. When the sixth layer L6 is viewed in the first negative direction X2, the twelfth electrode portion 56 has an L-shape with the same dimensions as the tenth electrode portion 55 and is located in the same position as the tenth electrode portion 55. Therefore, the twelfth electrode portion 56 is stacked on the surface of the tenth electrode portion 55 facing the first negative direction X2. Note that, because the dimensions of the twelfth electrode portion 56 are the same as those of the tenth electrode portion 55, the dimension of the twelfth electrode portion 56 in the direction along the third axis Z is smaller than the dimension of the second electrode portion 51 in the direction along the third axis Z.

[0046] The via 36 is made of the same material as the first wiring portion 31. The via 36 has a cylindrical shape extending in a direction along the first axis X. The via 36 is laminated on a surface of the second end portion 35B of the third wiring portion 35 facing the first negative direction X2. Therefore, the via 36 is electrically connected to the second end portion 35B of the third wiring portion 35. The via 36 extends from the second end portion 35B of the third wiring portion 35 in the first negative direction X2.

[0047] In the sixth layer L6, the portion excluding the eleventh electrode portion 46, the twelfth electrode portion 56, and the via 36 is the sixth insulating portion 26. The sixth insulating portion 26 is made of the same non-magnetic insulator material as the first insulating portion 21.

[0048] The seventh layer L7 is stacked on the main surface of the sixth layer L6 facing the first negative direction X2. When the seventh layer L7 is viewed in the first negative direction X2, the seventh layer L7 has the same rectangular shape as the first layer L1. The seventh layer L7 is composed of a thirteenth electrode portion 47, a fourteenth electrode portion 57, a fourth wiring portion 37, and a seventh insulating portion 27.

[0049] The thirteenth electrode portion 47 is made of the same material as the first electrode portion 41. When the seventh layer L7 is viewed in the first negative direction X2, the thirteenth electrode portion 47 has an L-shape with the same dimensions as the eleventh electrode portion 46 and is located in the same position as the eleventh electrode portion 46. Therefore, the thirteenth electrode portion 47 is stacked on the surface of the eleventh electrode portion 46 facing the first negative direction X2. Note that, because the dimensions of the thirteenth electrode portion 47 are the same as those of the eleventh electrode portion 46, the maximum dimension of the thirteenth electrode portion 47 in the direction along the third axis Z is smaller than the maximum dimension of the first electrode portion 41 in the direction along the third axis Z.

[0050] The fourteenth electrode portion 57 is made of the same material as the second electrode portion 51. When the seventh layer L7 is viewed in the first negative direction X2, the fourteenth electrode portion 57 has an L-shape with the same dimensions as the twelfth electrode portion 56 and is located in the same position as the eleventh electrode portion 46. Therefore, the fourteenth electrode portion 57 is stacked on the surface of the twelfth electrode portion 56 facing the first negative direction X2. Note that, because the dimensions of the fourteenth electrode portion 57 are the same as those of the twelfth electrode portion 56, the maximum dimension of the fourteenth electrode portion 57 in the direction along the third axis Z is smaller than the maximum dimension of the second electrode portion 51 in the direction along the third axis Z.

[0051] The fourth wiring portion 37 is made of the same material as the first wiring portion 31. When the seventh layer L7 is viewed in the first negative direction X2, the fourth wiring portion 37 extends in a spiral shape centered at the center of the seventh layer L7. Specifically, the first end 37A of the fourth wiring portion 37 is located on the surface of the via 36 facing the first negative direction X2. Therefore, the first end 37A of the fourth wiring portion 37 is connected to the via 36. The wiring width of the fourth wiring portion 37 is substantially constant except for the first end 37A and the second end 37B. The position of the second end 37B of the fourth wiring portion 37 in the direction along the third axis Z is closer to the third positive direction Z1 than the center in the direction along the third axis Z. The position of the second end 37B of the fourth wiring part 37 in the direction along the second axis Y is closer to the second negative direction Y2 than the center in the direction along the second axis Y and is closer to the second negative direction Y2 than the position of the first end 37A in the direction along the second axis Y. When the fourth wiring part 37 is viewed in the first negative direction X2, the fourth wiring part 37 extends clockwise from the first end 37A to the second end 37B. The fourth wiring part 37 is rotationally symmetric with the second wiring part 33 about an axis along the third axis Z that passes through the center in the extension direction of the inductor wiring 30.

[0052] In the seventh layer L7, the portion excluding the thirteenth electrode portion 47, the fourteenth electrode portion 57, and the fourth wiring portion 37 is the seventh insulating portion 27. The seventh insulating portion 27 is made of the same non-magnetic insulator material as the first insulating portion 21.

[0053] The eighth layer L8 is stacked on the main surface of the seventh layer L7 facing the first negative direction X2. When the eighth layer L8 is viewed in the first negative direction X2, the eighth layer L8 has the same rectangular shape as the first layer L1. The eighth layer L8 is composed of a fifteenth electrode portion 48, a sixteenth electrode portion 58, a via 38, and an eighth insulating portion 28.

[0054] The fifteenth electrode unit 48 is made of the same material as the first electrode unit 41. When the eighth layer L8 is viewed in the first negative direction X2, the fifteenth electrode unit 48 has an L-shape with the same dimensions as the thirteenth electrode unit 47 and is located in the same position as the thirteenth electrode unit 47. Therefore, the fifteenth electrode unit 48 is stacked on the surface of the thirteenth electrode unit 47 facing the first negative direction X2. Note that, because the dimensions of the fifteenth electrode unit 48 are the same as those of the thirteenth electrode unit 47, the maximum dimension of the fifteenth electrode unit 48 in the direction along the third axis Z is smaller than the maximum dimension of the first electrode unit 41 in the direction along the third axis Z.

[0055] The sixteenth electrode unit 58 is made of the same material as the second electrode unit 51. When the eighth layer L8 is viewed in the first negative direction X2, the sixteenth electrode unit 58 has an L-shape with the same dimensions as the fourteenth electrode unit 57 and is located in the same position as the fourteenth electrode unit 57. Therefore, the sixteenth electrode unit 58 is stacked on the surface of the fourteenth electrode unit 57 facing the first negative direction X2. Note that, because the dimensions of the sixteenth electrode unit 58 are the same as those of the fourteenth electrode unit 57, the maximum dimension of the sixteenth electrode unit 58 in the direction along the third axis Z is smaller than the maximum dimension of the second electrode unit 51 in the direction along the third axis Z.

[0056] The via 38 is made of the same material as the first wiring portion 31. The via 38 has a cylindrical shape extending in a direction along the first axis X. The via 38 is laminated on a surface of the second end portion 37B of the fourth wiring portion 37 facing the first negative direction X2. Therefore, the via 38 is electrically connected to the second end portion 37B of the fourth wiring portion 37. The via 38 extends from the second end portion 37B of the fourth wiring portion 37 in the first negative direction X2.

[0057] In the eighth layer L8, the portion excluding the fifteenth electrode portion 48, the sixteenth electrode portion 58, and the via 38 is the eighth insulating portion 28. The eighth insulating portion 28 is made of the same non-magnetic insulator material as the first insulating portion 21.

[0058] The ninth layer L9 is stacked on the main surface of the eighth layer L8 facing the first negative direction X2. When the ninth layer L9 is viewed in the first negative direction X2, the ninth layer L9 has the same rectangular shape as the first layer L1. The ninth layer L9 is composed of a seventeenth electrode portion 49, an eighteenth electrode portion 59, a fifth wiring portion 39, and a ninth insulating portion 29.

[0059] The seventeenth electrode unit 49 is made of the same material as the first electrode unit 41. When the ninth layer L9 is viewed in the first negative direction X2, the seventeenth electrode unit 49 has an L-shape with the same dimensions as the first electrode unit 41 and is located in the same position as the first electrode unit 41. Therefore, the seventeenth electrode unit 49 is stacked on the surface of the fifteenth electrode unit 48 facing the first negative direction X2.

[0060] The eighteenth electrode unit 59 is made of the same material as the second electrode unit 51. When the ninth layer L9 is viewed in the first negative direction X2, the eighteenth electrode unit 59 has an L-shape with the same dimensions as the second electrode unit 51 and is located in the same position as the second electrode unit 51. Therefore, the eighteenth electrode unit 59 is stacked on the surface of the sixteenth electrode unit 58 facing the first negative direction X2.

[0061] The fifth wiring portion 39 is made of the same material as the first wiring portion 31. When the ninth layer L9 is viewed in the first negative direction X2, the fifth wiring portion 39 extends in a spiral shape centered on the center of the ninth layer L9. Specifically, the first end 39A of the fifth wiring portion 39 is located on the surface of the via 38 facing the first negative direction X2. Therefore, the first end 39A of the fifth wiring portion 39 is connected to the via 38. The wiring width of the fifth wiring portion 39 is substantially constant except for the first end 39A. The second end 39B of the fifth wiring portion 39 is connected to the end of the eighteenth electrode portion 59 on the third positive direction Z1 side in the direction along the third axis Z. When the fifth wiring portion 39 is viewed in the first negative direction X2, the fifth wiring portion 39 extends clockwise from the first end 39A to the second end 39B. The second end 39B of the fifth wiring part 39 is the second end of the inductor wiring 30. The fifth wiring part 39 is rotationally symmetric with the first wiring part 31, with the axis extending along the third axis Z passing through the center of the inductor wiring 30 in the extension direction as the axis of rotation.

[0062] In the ninth layer L9, the portion excluding the seventeenth electrode portion 49, the eighteenth electrode portion 59, and the fifth wiring portion 39 is the ninth insulating portion 29. The ninth insulating portion 29 is made of the same insulator material as the first insulating portion 21.

[0063] The element body 11 has a first covering insulating layer 61 and a second covering insulating layer 62. When the first covering insulating layer 61 is viewed in the first negative direction X2, the first covering insulating layer 61 has the same rectangular shape as the first layer L1. The first covering insulating layer 61 is laminated on a main surface of the first layer L1 facing the first positive direction X1. When the second covering insulating layer 62 is viewed in the first positive direction X1, the second covering insulating layer 62 has the same rectangular shape as the first layer L1. The second covering insulating layer 62 is laminated on a main surface of the ninth layer L9 facing the first negative direction X2.

[0064] The first and second covering insulating layers 61 and 62 are different in color from the first to ninth insulating portions 21 to 29. For example, the first and second covering insulating layers 61 and 62 contain a pigment such as blue or black. This makes it possible to distinguish the orientation of the inductor component 10 from the outer surface of the element body 11.

[0065] The above-described first insulating portion 21 to ninth insulating portion 29, first covering insulating layer 61, and second covering insulating layer 62 are integrated together. Hereinafter, when there is no need to distinguish between them, they will be collectively referred to as insulating portion 20.

[0066] The first wiring portion 31, the second wiring portion 33, the third wiring portion 35, the fourth wiring portion 37, the fifth wiring portion 39, the vias 32, 34, 36, and 38 are integrated together. Hereinafter, when there is no need to distinguish between them, they will be collectively referred to as the inductor wiring 30. The inductor wiring 30 as a whole is wound in a spiral shape. The central axis of the inductor wiring 30 when wound is an axis extending in a direction along the first axis X.

[0067] Furthermore, the first electrode portion 41, the third electrode portion 42, the fifth electrode portion 43, the seventh electrode portion 44, the ninth electrode portion 45, the eleventh electrode portion 46, the thirteenth electrode portion 47, the fifteenth electrode portion 48, and the seventeenth electrode portion 49 are integrated together to form the first electrode 40.

[0068] Similarly, the second electrode portion 51, the fourth electrode portion 52, the sixth electrode portion 53, the eighth electrode portion 54, the tenth electrode portion 55, the twelfth electrode portion 56, the fourteenth electrode portion 57, the sixteenth electrode portion 58, and the eighteenth electrode portion 59 are integrated together to form the second electrode 50.

[0069] In this embodiment, the insulating portion 20, the first electrode 40, and the second electrode 50 form the element body 11 of the inductor component 10. The inductor wiring 30 extends inside the element body 11. The inductor wiring 30, the first electrode 40, and the second electrode 50 may be integrated. In other words, there may not be a physical boundary between the inductor wiring 30 and the first electrode 40.

[0070] As a result of stacking the first layer L1 to the ninth layer L9, the first covering insulating layer 61, and the second covering insulating layer 62, the element body 11 has an overall rectangular shape, as shown in Fig. 1. As shown in Fig. 3, the first electrode 40 is exposed to the outside of the element body 11 in a region from the first end face 11C to the bottom face 11E. Furthermore, the second electrode 50 is exposed to the outside of the element body 11 in a region from the second end face 11D to the bottom face 11E.

[0071] 1, the inductor component 10 includes a first covered electrode 71 and a second covered electrode 72. The first covered electrode 71 covers the surface of the first electrode 40 that is exposed to the outside from the element body 11. Although not shown, the first covered electrode 71 has a two-layer structure of nickel plating and tin plating.

[0072] The second covered electrode 72 covers the surface of the second electrode 50 that is exposed to the outside from the element body 11. Although not shown, the second covered electrode 72 has a two-layer structure of nickel plating and tin plating. Note that the first covered electrode 71 and the second covered electrode 72 are not shown in Fig. 2.

[0073] (Regarding the height of the first electrode) As described above, the first wiring portion 31 extends parallel to the first main surface 11A from the first end of the inductor wiring 30. The via 32 extends from the first wiring portion 31 in the direction along the first axis X, which is perpendicular to the first main surface 11A.

[0074] 4, the first layer L1 on which the first wiring portion 31 exists in the direction along the first axis X is defined as the first wiring layer LW1. The second layer L2 on which the via 32 extending from the first wiring portion 31 in the direction along the first axis X exists is defined as the first via layer LV1. The dimension in the direction perpendicular to the bottom surface 11E is defined as the height dimension.

[0075] The range of the first wiring layer LW1 in the direction along the first axis X ranges from the end of the first wiring portion 31 on the first positive direction X1 side to the end on the first negative direction X2 side. In other words, the range of the first wiring layer LW1 in the direction along the first axis X coincides with the size of the first wiring portion 31 in the direction along the first axis X. Similarly, the range of the first via layer LV1 in the direction along the first axis X ranges from the end of the first wiring portion 31 on the first negative direction X2 side to the end of the second wiring portion 33 on the first positive direction X1 side. In other words, the range of the first via layer LV1 in the direction along the first axis X ranges from the end of the via 32 on the first positive direction X1 side to the end of the via 32 on the first negative direction X2 side. Therefore, the range of the first via layer LV1 in the direction along the first axis X coincides with the size of the via 32 in the direction along the first axis X.

[0076] The maximum height dimension of the first electrode 40 on the first wiring layer LW1 is defined as the first wiring layer height WH1. That is, the first wiring layer height WH1 is the dimension of the portion of the first electrode portion 41 on the first wiring layer LW1 extending along the first end face 11C in the direction along the third axis Z. The maximum height dimension of the first electrode 40 on the first via layer LV1 is defined as the first via layer height VH1. That is, the first via layer height VH1 is the dimension of the portion of the third electrode portion 42 on the first via layer LV1 extending along the first end face 11C in the direction along the third axis Z. The first wiring layer height WH1 is greater than the first via layer height VH1. The value obtained by dividing the first wiring layer height WH1 by the first via layer height VH1 is 1.05 times or more and 1.95 times or less. Specifically, the value obtained by dividing the first wiring layer height WH1 by the first via layer height VH1 is 1.8.

[0077] 2, the distance from the bottom surface 11E to the end of the via 32 on the third negative direction Z2 side in the direction along the third axis Z is defined as a first via height D1. The first wiring layer height WH1 is greater than the first via height D1. Also, as shown in FIG. 2, the first via layer height VH1 is smaller than the first via height D1.

[0078] As shown in FIG. 4 , the first axis of symmetry AX1 is an axis that passes through the center of the first electrode 40 in the direction along the first axis X and is parallel to the third axis Z. The ninth layer L9, which is a layer positioned symmetrically to the first wiring layer LW1 across the first axis of symmetry AX1, is defined as the first symmetric layer LS1. In this case, the maximum height dimension of the first electrode 40 in the first symmetric layer LS1 is defined as the first symmetric layer height SH1. Therefore, the first symmetric layer height SH1 is the dimension, along the third axis Z, of the portion of the seventeenth electrode portion 49 in the first symmetric layer LS1 that extends along the first end face 11C. The first symmetric layer height SH1 is greater than the first via layer height VH1 and is equal to the first wiring layer height WH1. In other words, in this embodiment, the shape of the portion of the first electrode 40 exposed to the outside of the element body 11 is symmetrical about the first axis of symmetry AX1.

[0079] As described above, the fifth wiring portion 39 extends parallel to the first main surface 11A from the second end of the inductor wiring 30. The via 38 extends from the fifth wiring portion 39 in the direction along the first axis X, which is perpendicular to the first main surface 11A.

[0080] 2, in the direction along the first axis X, the ninth layer L9 on which the fifth wiring portion 39 exists is defined as the second wiring layer LW2. Also, the eighth layer L8 on which the via 38 extending from the fifth wiring portion 39 in the direction along the first axis X exists is defined as the second via layer LV2.

[0081] In this case, the maximum height dimension of the first electrode 40 on the second wiring layer LW2 is the dimension of the portion of the 17th electrode portion 49 on the second wiring layer LW2 that extends along the first end face 11C in the direction along the third axis Z. In this embodiment, the maximum height dimension of the first electrode 40 on the second wiring layer LW2 coincides with the first symmetric layer height SH1. The maximum height dimension of the first electrode 40 on the second wiring layer LW2 is greater than the first via layer height VH1.

[0082] (Regarding the height of the second electrode) The maximum height dimension of the second electrode 50 on the second wiring layer LW2 is defined as the second wiring layer height WH2. That is, the second wiring layer height WH2 is the dimension of the portion of the 18th electrode portion 59 on the second wiring layer LW2 that extends along the second end face 11D in the direction along the third axis Z. Also, the maximum height dimension of the second electrode 50 on the second via layer LV2 is defined as the second via layer height VH2. That is, the second via layer height VH2 is the dimension of the portion of the 16th electrode portion 58 on the second via layer LV2 that extends along the second end face 11D in the direction along the third axis Z. The second wiring layer height WH2 is greater than the second via layer height VH2. The value obtained by dividing the second wiring layer height WH2 by the second via layer height VH2 is 1.05 times or more and 1.95 times or less. Specifically, the value obtained by dividing the second wiring layer height WH2 by the second via layer height VH2 is 1.8. The second wiring layer height WH2 is the distance from the bottom surface 11E along the third axis Z to the end of the via 38 in the third negative direction Z2, which is defined as the second via height D2. The second wiring layer height WH2 is greater than the second via height D2. Furthermore, the second via layer height VH2 is smaller than the second via height D2.

[0083] Here, the axis passing through the center of the second electrode 50 in the direction along the first axis X and parallel to the third axis Z is defined as the second axis of symmetry. The first layer L1, which is a layer positioned symmetrically to the second wiring layer LW2 across the second axis of symmetry, is defined as the second symmetric layer LS2. In this case, the second symmetric layer height SH2, which is the height dimension of the second electrode 50 in the second symmetric layer LS2, is greater than the second via layer height VH2. The second symmetric layer height SH2 is also equal to the second wiring layer height WH2. In other words, in this embodiment, the shape of the portion of the second electrode 50 exposed to the outside of the element body 11 is symmetrical with respect to the second axis of symmetry.

[0084] The rotation axis is an axis that passes through the center of the element body 11 when the element body 11 is viewed in the third negative direction Z2 and is parallel to the third axis Z. In this case, the first electrode 40 and the second electrode 50 have a two-fold symmetric shape with respect to the rotation axis.

[0085] The maximum height dimension of the second electrode 50 in the first wiring layer LW1 is the dimension of the portion of the second electrode portion 51 in the first wiring layer LW1 that extends along the second end face 11D in the direction along the third axis Z. In this embodiment, the maximum height dimension of the second electrode 50 in the first wiring layer LW1 coincides with the second symmetric layer height SH2. The maximum height dimension of the second electrode 50 in the first wiring layer LW1 is greater than the second via layer height VH2.

[0086] (Height of the coated electrode) When the inductor component 10 is viewed in the second negative direction Y2, a portion of the first covered electrode 71 located within the range where the first wiring layer LW1 exists in the direction along the first axis X is defined as the position corresponding to the first wiring layer LW1. In this case, the maximum height of the first covered electrode 71 at the position corresponding to the first wiring layer LW1 is greater than the maximum height of the first covered electrode 71 at the position corresponding to the first via layer LV1. Furthermore, the maximum height of the first covered electrode 71 at the position corresponding to the first wiring layer LW1 is smaller than the maximum height of the first end face 11C of the element body 11.

[0087] When the inductor component 10 is viewed in the second positive direction Y1, a portion of the second covered electrode 72 located within the range where the second wiring layer LW2 exists in the direction along the first axis X is defined as the position corresponding to the second wiring layer LW2. In this case, the maximum height of the second covered electrode 72 is greater than that of the second wiring layer LW2 at the position corresponding to the second wiring layer LW2. Furthermore, the maximum height of the second covered electrode 72 at the position corresponding to the second wiring layer LW2 is smaller than the maximum height of the second end face 11D of the element body 11.

[0088] Suppose the first electrode portion 41 and the seventeenth electrode portion 49 have the same shape as the third electrode portion 42, and the second electrode portion 51 and the eighteenth electrode portion 59 have the same shape as the fourth electrode portion 52. That is, the first electrode 40 and the second electrode 50 are assumed to have an overall L-shape, like a rectangular plate bent at a right angle. In this case, the height dimension of the first electrode 40 is the same regardless of its position along the first axis X. If the height dimension of the first electrode 40 is small, the area of ​​the first electrode 40 exposed to the outside of the element body 11 will be small. In this case, when the inductor component 10 is mounted on a substrate, the amount of solder adhering to the first electrode 40 will be small, or solder may adhere locally to the first electrode 40. As a result, the inductor component 10 will be mounted on the substrate in an inclined state due to an unstable posture relative to the substrate. The same applies to the second electrode 50.

[0089] (Effects of the first embodiment) The first embodiment provides the following advantages: The advantages common to the first electrode 40 and the second electrode 50 will be explained using the first electrode 40 as a representative, and an explanation of the second electrode 50 will be omitted.

[0090] (1-1) According to the first embodiment, the first wiring layer height WH1 is greater than the first via layer height VH1. Therefore, for example, compared to when the first wiring layer height WH1 is equal to the first via layer height VH1, the area of ​​the first electrode 40 exposed to the outside of the element body 11 can be made larger. Therefore, when the inductor component 10 is mounted on a substrate or the like, the solder or the like spreads over the surface of the first electrode 40, stabilizing the posture of the inductor component 10 relative to the substrate.

[0091] (1-2) According to the first embodiment, the first via layer height VH1 is smaller than the first wiring layer height WH1. Therefore, compared to when the first via layer height VH1 is the same as the first wiring layer height WH1, the stray capacitance generated between the first electrode 40 and the via 32 in the first via layer LV1 can be reduced.

[0092] (1-3) According to the first embodiment, the first via layer height VH1 is smaller than the first via height D1. Therefore, when the inductor component 10 is viewed in the second negative direction Y2, the first electrode 40 does not overlap the via 32. Therefore, the stray capacitance generated between the first electrode 40 and the via 32 can be reduced.

[0093] (1-4) According to the first embodiment, the first symmetric layer height SH1 is greater than the first via layer height VH1. That is, the height dimension of the first electrode 40 in the first wiring layer LW1 and the height dimension of the first electrode 40 in the first symmetric layer LS1, which are layers positioned symmetrically to each other, are both greater than the first via layer height VH1. That is, there are portions of the first electrode 40 that are largely exposed to the outside of the element body 11 at positions symmetrical to each other across the first axis of symmetry AX1. Therefore, the inductor component 10 can be firmly fixed to the substrate at both sides of the first axis of symmetry AX1.

[0094] (1-5) According to the first embodiment, the first symmetrical layer height SH1 is equal to the first via layer height VH1. Therefore, it is easy to fix the inductor component 10 to the substrate equally firmly on both sides of the first axis of symmetry AX1. Furthermore, since the height dimensions of the first electrode 40 are the same on both sides of the first axis of symmetry AX1, the amount of solder is made uniform on the first positive direction X1 side and the first negative direction X2 side, which contributes to stabilizing the posture of the inductor component 10.

[0095] (1-6) According to the first embodiment, the value obtained by dividing the first wiring layer height WH1 by the first via layer height VH1 is 1.05 to 1.95 times. Because the first wiring layer height WH1 is 5% or more larger than the first via layer height VH1, the area of ​​the first electrode 40 exposed to the outside of the element body 11 at the first wiring layer LW1 can be more ensured. Furthermore, because the first wiring layer height WH1 is not larger than 95% of the first via layer height VH1, the area of ​​the first electrode 40 exposed to the outside of the element body 11 at the first via layer LV1 does not need to be excessively small.

[0096] (1-7) According to the first embodiment, the first electrode 40 and the second electrode 50 have a two-fold symmetric shape about the rotation axis, which passes through the center of the element body 11 when the element body 11 is viewed in the third negative direction Z2 and is parallel to the third axis Z. Therefore, when the inductor component 10 is mounted on a substrate, tilting of the first electrode 40 side and the second electrode 50 side can be suppressed when viewed from the rotation axis.

[0097] (1-8) According to the first embodiment, the maximum height of the first electrode 40 in the second wiring layer LW2 is greater than the first via layer height VH1. That is, the maximum height of the first electrode 40 in the first wiring layer LW1, which is the layer at both ends in the direction along the first axis X, and the maximum height of the first electrode 40 in the second wiring layer LW2 are both greater than the first via layer height VH1. On both sides of the first via layer LV1, there are portions of the first electrode 40 that are largely exposed to the outside of the element body 11. Therefore, the inductor component 10 can be firmly fixed to the substrate on both sides of the first axis of symmetry AX1.

[0098] (1-9) According to the first embodiment, the maximum height of the first covered electrode 71 at the position corresponding to the first wiring layer LW1 is greater than the maximum height of the first covered electrode 71 at the position corresponding to the first via layer LV1. Therefore, even if the first covered electrode 71 covers the first electrode 40, when the inductor component 10 is mounted on a substrate or the like, the posture of the inductor component 10 relative to the substrate is stable.

[0099] (1-10) According to the first embodiment, the maximum height of the first covered electrode 71 at the position corresponding to the first wiring layer LW1 is smaller than the maximum height of the first end face 11C of the element body 11. Therefore, the first covered electrode 71 does not reach the top surface 11F. This prevents electrical leakage from the first covered electrode 71 to the top surface 11F side of the inductor component 10. For example, when the inductor component 10 is mounted on a substrate or the like, it is possible to prevent a short circuit between the inductor component 10 and components arranged on the top surface 11F side.

[0100] Second Embodiment An inductor component according to a second embodiment will be described below with reference to the drawings. An inductor component 110 according to the second embodiment differs from the inductor component 10 according to the first embodiment in the shape of the portion of the first electrode 40 that is exposed to the outside of the element body 11. The following description will focus on the differences from the inductor component 10 according to the first embodiment, and descriptions of the same points will be simplified or omitted.

[0101] As shown in FIG. 5 , the inductor wiring 30 of the inductor element 110 differs from the first embodiment in the position of the first wiring layer LW1 in the direction along the first axis X. More specifically, the first wiring layer LW1 is located closer to the center in the direction along the first axis X than the inductor wiring 30 of the first embodiment. Similarly, the inductor wiring 30 of the inductor element 110 differs from the first embodiment in the position of the first symmetric layer LS1 in the direction along the first axis X than the inductor wiring 30 of the first embodiment. More specifically, the first symmetric layer LS1 is located closer to the center in the direction along the first axis X than the inductor wiring 30 of the first embodiment. Note that, although not shown, the inductor wiring 30 of the second embodiment has fewer windings than the inductor wiring 30 of the first embodiment. Therefore, the positions of the first wiring layer LW1 and the first symmetric layer LS1 are closer to the center in the direction along the first axis X than the first embodiment.

[0102] In addition, in the direction along the first axis X, the end of the first electrode 40 on the first main surface 11A side is located on the first main surface 11A side when viewed from the first wiring layer LW1. In addition, in the direction along the first axis X, the end of the first electrode 40 on the second main surface 11B side is located on the second main surface 11B side when viewed from the first symmetrical layer LS1. In other words, the dimension of the first electrode 40 in the direction along the first axis X is greater than the distance from the end of the first wiring layer LW1 on the first main surface 11A side to the end of the first symmetrical layer LS1 on the second main surface 11B side. The second electrode 50 has a configuration similar to that of the first electrode 40.

[0103] (Effects of the second embodiment) According to the second embodiment, in addition to the effects (1-1) to (1-10) of the first embodiment, the following effects are achieved.

[0104] (2-1) According to the second embodiment, the dimension of the first electrode 40 in the direction along the first axis X can be increased compared to when the end of the first electrode 40 on the first main surface 11A side coincides with the end of the first wiring layer LW1 on the first main surface 11A side. Therefore, it is easy to increase the area of ​​the first electrode 40 exposed to the outside of the element body 11.

[0105] <Third embodiment> A second embodiment of the inductor component will be described below with reference to the drawings. An inductor component 210 of the third embodiment differs from the inductor component 10 of the first embodiment in a first symmetric layer height SH1 and a second symmetric layer height SH2. The following description will focus on the differences from the inductor component 10 of the first embodiment, and descriptions of the same points will be simplified or omitted.

[0106] As shown in FIG. 6, the first symmetric layer height SH1 is smaller than the first wiring layer height WH1. In particular, the seventeenth electrode portion 49 has the same dimensions and the same L-shape as the third electrode portion 42. Therefore, the height dimensions of the first electrodes 40 are all the same except for the first wiring layer LW1. Therefore, the maximum height dimension of the first electrode 40 in the portion excluding the first wiring layer LW1 is smaller than the first wiring layer height WH1. Similarly, the maximum height dimension of the second electrode 50 in the portion excluding the second wiring layer LW2 is smaller than the second wiring layer height WH2.

[0107] (Effects of the third embodiment) According to the third embodiment, in addition to the effects (1-1) to (1-3) and (1-6) to (1-10) of the first embodiment, the following effects are achieved.

[0108] (3-1) According to the third embodiment, the area of ​​the first electrode 40 that is exposed to the outside of the element body 11, excluding the first wiring layer LW1, is relatively small. This reduces the stray capacitance that occurs between the inductor wiring 30 and the first electrode 40.

[0109] <Other embodiments> The above-described embodiments can be modified as follows. The above-described embodiments and the following modifications can be combined to the extent that they are not technically inconsistent. Note that the points common to the first electrode 40 and the second electrode 50 will be described using the first electrode 40 as a representative, and a description of the second electrode 50 will be omitted.

[0110] The thicknesses of the first layer L1 to the ninth layer L9, i.e., the dimensions along the X-axis, do not all have to be the same. All thicknesses may be different from one another, or the thickness of some layers may be different from the thickness of the other layers.

[0111] The element body 11 may be a rectangular parallelepiped that is elongated in the direction along the first axis X, or may be a rectangular parallelepiped that is elongated in the direction along the third axis Z. Alternatively, the element body 11 may be a rectangular parallelepiped whose dimensions along the first axis X, the second axis Y, and the third axis Z are equal. For example, with regard to the dimensions along each axis of the element body 11, the dimension along the first axis X may be equal to the dimension along the third axis Z, and the dimension along the second axis Y may be larger than the dimension along the first axis X. Alternatively, with regard to the dimensions along each axis of the element body 11, the dimension along the second axis Y may be larger than the dimension along the third axis Z, and the dimension along the third axis Z may be larger than the dimension along the first axis X. Further, for example, the dimension along the second axis Y may be greater than the dimension along the first axis X, and the dimension along the first axis X may be greater than the dimension along the third axis Z.

[0112] The material of the insulating portion 20 is not limited to the example of the above embodiment, and may be any insulating material. For example, the material of the insulating portion 20 may be a magnetic insulator. Furthermore, a portion of the insulating portion 20 may be made of a different insulating material from the other portions.

[0113] The dimensions of the first covered electrode 71 are not limited to those of the above-described embodiments. For example, the maximum height of the first covered electrode 71 may be greater than the maximum height of the first electrode 40. Furthermore, the maximum height of the first covered electrode 71 may be greater than the height of the first end surface 11C of the element body 11.

[0114] The first covering electrode 71 and the second covering electrode 72 can be omitted. When the first covering electrode 71 is provided on the first electrode 40 by plating, the first covering electrode 71 may extend onto the top surface 11F during the process of forming the first covering electrode 71. To prevent this from happening, it is preferable that the first wiring layer height WH1 be smaller than the height dimension of the element body 11 by 5 μm or more.

[0115] The value obtained by dividing the first wiring layer height WH1 by the first via layer height VH1 may be greater than 1 and less than 1.05, or may be greater than 1.95. Preferably, the value obtained by dividing the first wiring layer height WH1 by the first via layer height VH1 is greater than or equal to 1.10 and less than or equal to 1.90. More preferably, the value obtained by dividing the first wiring layer height WH1 by the first via layer height VH1 is greater than or equal to 1.20 and less than or equal to 1.80.

[0116] The second and third embodiments may be combined. That is, in the inductor component 310 shown in FIG. 7, the height dimension of the first electrode 40 excluding the first wiring layer LW1 is a constant height that is smaller than the first wiring layer height WH1. Additionally, in the inductor component 310 of this modified example, the first wiring layer LW1 is located on the first negative direction X2 side when viewed from the end of the first electrode 40 on the first positive direction X1 side.

[0117] Regarding the height dimension of the first electrode 40, it is sufficient that the first wiring layer height WH1 is greater than the first via layer height VH1, and the heights of other parts can be changed as appropriate. For example, in the first embodiment, the height dimension of the first electrode 40 on the fourth layer L4 including the via 34 and on the sixth layer L6 including the via 36 may be smaller than the distance from the bottom surface 11E to each via.

[0118] Here, when the inductor wiring 30 has multiple vias, the shortest distance in the direction along the third axis Z is the distance from the bottom surface 11E to the via closest to the bottom surface 11E among the multiple vias. In this case, the height dimension of the first electrode 40 in the portion excluding the first wiring layer LW1 is equal to the first via layer height VH1 at every point, and the first via layer height VH1 may be smaller than the shortest distance. In these cases, when the inductor component 10 is viewed in the second negative direction Y2, the first electrode 40 does not overlap any of the vias. Therefore, the stray capacitance generated between the first electrode 40 and each via can be reduced.

[0119] In the first embodiment, the first symmetric layer height SH1 does not have to be equal to the first wiring layer height WH1. If the first symmetric layer height SH1 is greater than the first via layer height VH1, it is possible to increase the area of ​​the first electrode 40 exposed to the outside of the element body 11 on both sides of the first axis of symmetry AX1. Furthermore, the first symmetric layer height SH1 may be less than or equal to the first via layer height VH1.

[0120] In the first embodiment, the first symmetrical layer LS1 and the second wiring layer LW2 coincide with the ninth layer L9, but the second wiring layer LW2 does not have to coincide with the first symmetrical layer LS1. In other words, the second wiring layer LW2 may be a layer that is not symmetrical to the first wiring layer LW1 with respect to the first axis of symmetry AX1.

[0121] The first via layer height VH1 may be equal to or greater than the distance from the bottom surface 11E to the via 32 in the direction along the third axis Z. It is sufficient that at least the first wiring layer height WH1 is greater than the first via layer height VH1.

[0122] Although the via 32 has a cylindrical shape, this is not limited to the examples in the above embodiments. The cross-sectional shape of the via 32 is not limited to a substantially circular shape, but may also be a substantially elliptical shape, a substantially sector shape, a substantially polygonal shape, or a combination thereof. Furthermore, the above-mentioned cylindrical shape includes not only shapes whose cross-sectional area and shape are constant along the third axis Z, but also shapes whose cross-sectional area and shape change along the third axis Z, such as a substantially truncated cone shape.

[0123] Furthermore, the end of each wiring portion that functions as a pad, for example, the second end 31B of the first wiring portion 31, is a substantially circular pad, but is not limited to this. These end portions may be, for example, substantially circular, substantially fan-shaped, substantially polygonal, or a combination thereof.

[0124] In each embodiment, the second electrode 50 has the same configuration as the first electrode 40, but the second electrode 50 is not limited to this. For example, in the first embodiment, the second symmetric layer height SH2 of the second electrode 50 does not have to be equal to the second wiring layer height WH2. In other words, the first electrode 40 and the second electrode 50 do not have to have a two-fold symmetric shape around the central axis of rotation.

[0125] In the second embodiment, the number of turns of the inductor wiring 30 is smaller than in the first embodiment, but this is not limited to this. For example, in the second embodiment, even if the number of turns of the inductor wiring 30 is the same as in the first embodiment, the dimension of the element body 11 in the direction along the first axis X may be larger than in the first embodiment. Also, even if the size of the element body 11 is the same, only the dimension of the first electrode 40 may be larger. [Explanation of symbols]

[0126] 10, 110, 210, 310...Inductor components 11...Base body 20...Insulation part 30...Inductor wiring 31...1st wiring section 32, 34, 36, 38... Via 33...Second wiring section 35...Third wiring section 37…4th wiring section 39…5th wiring section 40...1st electrode 50…Second electrode 61...First insulating coating layer 62...Second insulating coating layer 71...First coated electrode 72...Second coated electrode

Claims

[Claim 1] a rectangular parallelepiped element body having six outer surfaces; an inductor wiring extending inside the element body; Equipped with the element body has a first electrode connected to a first end of the inductor wiring and a second electrode connected to a second end of the inductor wiring; One specific surface among six outer surfaces of the element body is designated as a main surface, one of the surfaces perpendicular to the main surface is a first end surface; a surface parallel to the first end surface is defined as a second end surface; one of the surfaces perpendicular to both the main surface and the first end surface is defined as a bottom surface; When the surface parallel to the bottom surface is the top surface, the first electrode is exposed to the outside of the element body in a region from the first end surface to the bottom surface, the second electrode is exposed to the outside of the element body in a region extending from the second end surface to the bottom surface, the inductor wiring includes a first wiring portion extending from the first end in parallel to the main surface, a second wiring portion extending from the second end in parallel to the main surface, a first via extending from the first wiring portion in a direction perpendicular to the main surface toward the second wiring portion, a second via extending from the second wiring portion in a direction perpendicular to the main surface toward the first wiring portion, and a third wiring portion extending between the first wiring portion and the second wiring portion in parallel to the main surface, When a layer in which the first wiring portion exists in a direction perpendicular to the main surface is defined as a first wiring layer, a layer in which the second wiring portion exists in a direction perpendicular to the main surface is defined as a second wiring layer, and the dimension in the direction perpendicular to the bottom surface of a portion exposed to the outside of the element body is defined as a height dimension, a maximum height dimension of the first electrode in a portion excluding the first wiring layer and the second wiring layer is smaller than a maximum height dimension of the first electrode in the first wiring layer, is smaller than a maximum height dimension of the first electrode in the second wiring layer, and is equal to or larger than half of a dimension of the element body in a direction perpendicular to the bottom surface; When the end of the first wiring portion to which the first via is connected is a pad, The pad is located closer to the first end surface than the center of the element body in a direction perpendicular to the first end surface, and is located closer to the top surface than an end of the first electrode on the top surface side in a portion excluding the first wiring layer and the second wiring layer. Inductor components.

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