Heat dissipation structure and electronic device

Abstract

The application provides a heat dissipation structure and an electronic device. The heat dissipation structure can include a circuit board, a magnetic device, a heat sink and a heat conducting medium, and the magnetic device can be located between the circuit board and the heat sink. The magnetic device can include a magnetic core and a film-wrapped wire, the magnetic core includes a fixedly connected stopper and a center magnetic column, the film-wrapped wire is wound around the center magnetic column, and the film-wrapped wire is electrically connected with the circuit board. In the heat dissipation structure, at least part of the side surface of the stopper can be provided with a heat conducting film, which can effectively improve the temperature uniformity of the magnetic device to solve the problem of local high temperature of the magnetic device. In addition, the heat conducting medium can be arranged between the magnetic device and the heat sink, and the heat conducting medium is in heat conducting contact with at least part of the magnetic device and the heat sink, so that the heat generated by the magnetic device can be conducted to the heat conducting medium and then transmitted to the heat sink for heat dissipation, which can effectively improve the heat dissipation efficiency of the heat dissipation structure, thereby improving the performance of the electronic device provided with the heat dissipation structure.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation, and in particular to a heat dissipation structure and an electronic device. BACKGROUND

[0002] With the development of electronic technology, the density of power devices in electronic devices continues to increase, and the layout of power devices on the circuit board is becoming more and more compact, which makes the heat flux density on the circuit board also larger and larger. Without good heat dissipation measures, the application scenarios of power devices will be limited, and the performance of electronic device products will also be limited.

[0003] Taking magnetic devices such as inductors and transformers as examples, they are important devices for realizing power conversion. These magnetic devices usually can include a magnetic core and a copper wire wound on the magnetic core. In order to realize the insulation of the copper wire, an insulating film is often added to the copper wire, so that the overall thickness of the copper wire wrapped on the magnetic core is large, thereby making the heat dissipation path from the magnetic core to the heat sink longer. In addition, since the thermal conductivity of the magnetic material is low, the heat generated at the magnetic core is difficult to diffuse outward. This results in a large temperature difference between the inner and outer layers of the copper wire of the magnetic device in the windless scene, and the heat dissipation of the magnetic core often becomes the bottleneck of the heat dissipation of these magnetic devices. SUMMARY

[0004] The present application provides a heat dissipation structure and an electronic device to improve the heat dissipation efficiency of the heat dissipation structure, thereby improving the performance of the electronic device.

[0005] In a first aspect, the present application provides a heat dissipation structure, which can include a circuit board, a magnetic device, a heat sink, and a heat-conducting medium, and the magnetic device can be located between the circuit board and the heat sink. The magnetic device can include a magnetic core and a film-wrapped wire, the magnetic core includes a fixedly connected stopper and a center magnetic column, the film-wrapped wire is wound on the center magnetic column, and the film-wrapped wire is electrically connected with the circuit board. In the heat dissipation structure, at least part of the side surface of the stopper can be provided with a heat-conducting film. By providing the heat-conducting film on the side surface of the stopper, the temperature uniformity of the magnetic device can be effectively improved, thereby solving the problem of local high temperature of the magnetic device to reduce the risk of over-temperature of the magnetic core. In addition, the heat-conducting medium can be arranged between the magnetic device and the heat sink, and the heat-conducting medium is in heat-conducting contact with at least part of the magnetic device and the heat sink, so that the heat generated by the magnetic device can be conducted to the heat-conducting medium and then transmitted to the heat sink for heat dissipation, which can effectively improve the heat dissipation efficiency of the heat dissipation structure.

[0006] In addition to being provided on the side surface of the stopper, the heat-conducting film can also be provided on the surface of the center magnetic column in a possible implementation manner of the present application, and the film-wrapped wire is in heat-conducting contact with the heat-conducting film. In this way, the heat generated by the film-wrapped wire and the center magnetic column can be conducted to the heat-conducting film, which can further improve the temperature uniformity of the magnetic device.

[0007] In addition, when the heat-conducting film is arranged between the center magnetic column and the film-wound wire, the film-wound wire and the heat-conducting film can be alternately wound on the center magnetic column. This can increase the contact area of the film-wound wire and the heat-conducting film, thereby improving the temperature uniformity of the center magnetic column and effectively improving the heat dissipation efficiency of the heat dissipation structure.

[0008] In the present application, the specific type of the heat-conducting medium is not limited, and an example thereof can be a heat-conducting glue. By filling the heat-conducting glue between the magnetic device and the heat sink, the heat-conducting glue can at least partially wrap the heat-conducting film, thereby facilitating the heat conduction between the heat-conducting film and the heat-conducting glue. It can be understood that, since the heat-conducting film arranged on the magnetic core can improve the temperature uniformity of the magnetic core, the heat dissipation efficiency of the heat dissipation structure can be improved, and the amount of the heat-conducting glue can be effectively reduced, thereby reducing the cost of the heat dissipation structure.

[0009] The heat-conducting glue can at least partially wrap the heat-conducting film, the magnetic core, and the film-wound wire, thereby facilitating the improvement of the temperature uniformity of the magnetic device.

[0010] In a possible implementation manner of the present application, the heat-conducting film can also be arranged on the side surface of the stop portion facing the heat sink. In this way, the area of the heat-conducting film arranged on the magnetic core can be effectively increased, thereby improving the temperature uniformity of the magnetic core.

[0011] The present application does not limit the specific type of the heat-conducting film, and an example thereof can be a metal thin film such as a copper foil having good heat-conducting performance. Alternatively, the heat-conducting film can also be a non-metal thin film such as a graphite film having good heat-conducting performance.

[0012] In a second aspect, the present application further provides a heat dissipation structure, which can include a circuit board, a magnetic device, a heat sink, and a heat-conducting medium. The magnetic device can be located between the circuit board and the heat sink. The magnetic device can include a magnetic core and a film-wound wire. The magnetic core includes a stop portion and a center magnetic column fixedly connected. The film-wound wire is wound on the center magnetic column, and the film-wound wire is electrically connected to the circuit board. In the heat dissipation structure, at least part of the surface of the center magnetic column is provided with a heat-conducting film. By arranging the heat-conducting film on the surface of the center magnetic column, the temperature uniformity of the magnetic device can be effectively improved, thereby solving the problem of local high temperature of the magnetic device and reducing the risk of over-temperature of the magnetic core. In addition, the heat-conducting medium can be arranged between the magnetic device and the heat sink, and the heat-conducting medium is in heat-conducting contact with at least part of the magnetic device and the heat sink. The heat generated by the magnetic device can be conducted to the heat-conducting medium and then transmitted to the heat sink for heat dissipation, thereby effectively improving the heat dissipation efficiency of the heat dissipation structure.

[0013] In addition, when the heat-conducting film is arranged between the center magnetic column and the film-wound wire, the film-wound wire and the heat-conducting film can be alternately wound on the center magnetic column. This can increase the contact area between the film-wound wire and the heat-conducting film, thereby improving the temperature uniformity of the center magnetic column and effectively improving the heat dissipation efficiency of the heat dissipation structure.

[0014] In a third aspect, the present application further provides a heat dissipation structure, which can include a circuit board, a magnetic device, a heat sink and a heat-conducting medium. The magnetic device can be located between the circuit board and the heat sink. The magnetic device can include a magnetic core and a film-wound wire. The magnetic core includes a fixedly connected stopper and a center magnetic column. The film-wound wire is wound on the center magnetic column and electrically connected to the circuit board. In the heat dissipation structure, a heat-conducting film is arranged between the film-wound wire and the center magnetic column. The film-wound wire and the heat-conducting film are alternately wound on the center magnetic column. By alternately winding the film-wound wire and the heat-conducting film on the center magnetic column, the contact area between the heat-conducting film and the film-wound wire can be increased. This can effectively improve the temperature uniformity of the magnetic device, thereby solving the problem of local high temperature of the magnetic device and reducing the risk of over-temperature of the magnetic core. In addition, the heat-conducting medium can be arranged between the magnetic device and the heat sink. The heat-conducting medium is in thermal contact with at least part of the magnetic device and the heat sink. The heat generated by the magnetic device can be conducted to the heat-conducting medium and then transferred to the heat sink for heat dissipation. This can effectively improve the heat dissipation efficiency of the heat dissipation structure.

[0015] In a fourth aspect, the present application further provides an electronic device, which can include a shell and a heat dissipation structure according to the first aspect. The heat dissipation structure can be arranged in the shell. The heat dissipation structure of the electronic device has good heat dissipation performance, thereby improving the performance of the electronic device and enhancing the product competitiveness of the electronic device. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 A layout structure of a magnetic device provided by the present application is shown in the figure;

[0017] Figure 2 A heat dissipation structure of a magnetic device provided by the present application is shown in the figure;

[0018] Figure 3 A heat dissipation structure of a magnetic device provided by the present application is shown in the figure;

[0019] Figure 4 A structure of a heat dissipation structure provided by an embodiment of the present application is shown in the figure;

[0020] Figure 5 A structure of a heat dissipation structure provided by an embodiment of the present application is shown in the figure; Figure 4 A local structure of a magnetic device is shown in the figure;

[0021] Figure 6 A cross-sectional view of a heat dissipation structure provided by another embodiment of the present application is shown in the figure;

[0022] Figure 7 A cross-sectional view of a heat dissipation structure provided for another embodiment of the present application;

[0023] Figure 8 A partial structure schematic view of a magnetic device provided for another embodiment of the present application; Figure 7 A cross-sectional view of a heat dissipation structure provided for another embodiment of the present application;

[0024] Figure 9 A partial structure schematic view of a magnetic device provided for another embodiment of the present application;

[0025] Figure 10 A cross-sectional view of a heat dissipation structure provided for another embodiment of the present application; Figure 9 A partial structure schematic view of a magnetic device provided for another embodiment of the present application.

[0026] Reference signs:

[0027] 1 - magnetic device; 101 - magnetic core; 1011 - stop; 1012 - center magnetic column; 1013 - heat conduction film; 102 - film-wound wire;

[0028] 103 - heat conduction medium; 103a - heat conduction pad; 103b - heat conduction glue; 104 - magnetic air gap;

[0029] 2 - circuit board; 3 - heat sink. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solutions and advantages of the present application clearer, the following will combine the drawings to further describe the embodiments of the present application in detail. In the present description, the reference to “one embodiment” or “some embodiments” means that the specific features, structures or characteristics described in connection with the embodiment are included in one or more embodiments of the present application. Therefore, the statements “in one embodiment”, “in some embodiments”, “in other some embodiments”, “in further some embodiments” and the like appearing in different places in the present description are not necessarily all referring to the same embodiment, but mean “one or more but not all embodiments”, unless otherwise specifically emphasized. In addition, the “first”, “second” and the like referred to in the present description are only for the purpose of distinguishing the description, and cannot be understood as indicating or implying relative importance, nor can be understood as indicating or implying sequence.

[0031] In order to facilitate the understanding of the heat dissipation structure provided by the embodiments of the present application, the following first describes the application scenario thereof. The heat dissipation structure can be but is not limited to applied in a magnetic device for realizing power conversion such as an inductor and a transformer. The magnetic device can generally include a magnetic core and a film-wound wire, and the film-wound wire is wound on the magnetic core. Among them, the film-wound wire can be a cable with copper wire in the middle and insulating film wrapped outside.

[0032] Referring to Figure 1 , Figure 1A layout structure diagram of a magnetic device is provided in the embodiments of the present application. The magnetic device 1 can be arranged on a circuit board 2 and electrically connected with the circuit board 2. The circuit board 2 can be a printed circuit board (PCB) for example, so that the circuit board 2 can stably bear the magnetic device 1. With the increase of the power density of electronic devices, the layout on the circuit board 2 is more and more compact, which leads to the increase of the heat flow density of the circuit board 2. Good heat dissipation measures will be beneficial to the realization of the function of the magnetic device 1, so as to effectively improve the performance of the electronic device and improve the competitiveness of the product.

[0033] There are some solutions for the heat dissipation of the magnetic device 1. Referring to Figure 2 , Figure 2 A heat dissipation structure diagram of an existing magnetic device 1 is provided in the embodiments of the present application. In the heat dissipation structure, the magnetic device 1 can be located between the circuit board 2 and the heat sink 3, and the magnetic device 1 is attached to the heat sink 3 through the heat-conducting pad 103a. The heat-conducting pad 103a has good heat conduction performance and can also absorb assembly tolerances. The heat dissipation scheme has simple process and low cost. However, due to the low thermal conductivity of the magnetic core 101 and the film-wrapped wire 102 of the magnetic device 1, the temperature difference of the magnetic device 1 is large in the direction from the circuit board 2 to the heat sink 3, mainly reflected in that the temperature of the part of the magnetic device 1 close to the circuit board 2 is greater than the temperature of the part of the magnetic device 1 close to the heat sink 3. Therefore, only relying on single-sided heat dissipation, the heat dissipation capacity is poor.

[0034] In order to reduce the temperature difference of the magnetic device 1, referring to Figure 3 , Figure 3 Another heat dissipation structure diagram of an existing magnetic device 1 is provided in the embodiments of the present application. In the heat dissipation structure, the heat dissipation of the magnetic device 1 is improved by filling the heat-conducting glue 103b in the gap between the film-wrapped wire 102 and the magnetic core 101 of the magnetic device 1 and the gap between the magnetic device 1 and the heat sink 3, and the thermal resistance between the magnetic device 1 and the heat sink 3 can be effectively reduced, so as to meet the heat dissipation requirement of the magnetic device 1. However, the heat-conducting glue 103b itself has low thermal conductivity, and in the application scenario of high heat consumption, the temperature difference of the magnetic device 1 is still large, and the circuit board 2 is still prone to over-temperature.

[0035] The heat dissipation structure provided in the present application aims to solve the above problems, so as to improve the temperature uniformity of the whole magnetic device by increasing the heat-conducting film in the magnetic device, so as to improve the heat dissipation efficiency of the magnetic device, which is beneficial to improving the product performance of the electronic device with the heat dissipation structure. The present application will be described in further detail below in combination with the drawings and specific embodiments.

[0036] Referring to Figure 4 ,Figure 4 This is a schematic diagram of the heat dissipation structure provided in one embodiment of the present application. The heat dissipation structure may include a circuit board 2, a magnetic device 1, and a heat sink 3. The circuit board 2 may be a PCB. The magnetic device 1 is electrically connected to the circuit board 2 and positioned between the circuit board 2 and the heat sink 3. The magnetic device 1 may include a magnetic core 101 and a film-coated wire 102. In this application, the magnetic core 101 refers to a structure formed of a magnetic material. For example, it may be a magnetic metal oxide structure formed by sintering a mixture of various iron oxides.

[0037] Please refer to Figure 5 , Figure 5 for Figure 4 Schematic diagram of the partial structure of the magnetic device 1. In the present application, the magnetic core 101 may include a stopper 1011 and a central magnetic column 1012, and the stopper 1011 is fixedly connected to the central magnetic column 1012. In the present application, the shape and size of the stopper 1011 and the central magnetic column 1012 are not limited. The shapes of the two may be the same or different, and the sizes of the two may be the same or different, and are not specifically limited in the present application. Exemplarily, the stopper 1011 may be a cylindrical structure, and the central magnetic column 1012 may also be a cylindrical structure, and the cross-sectional radius of the stopper 1011 is greater than the cross-sectional radius of the central magnetic column 1012. In addition, in the direction perpendicular to the stopper 1011 and the central magnetic column 1012, the cross-sectional shape of the magnetic core 101 may be, but is not limited to, T-shaped. The stopper portion 1011 and the central magnetic column 1012 may be structures with regular cross-sections such as cylindrical shapes, or may be structures with irregular cross-sections, which are not specifically limited in this application.

[0038] In one possible embodiment, the magnetic core 101 can be an integrally formed structure, that is, the central magnetic column 1012 and the stopper 1011 are formed in a single process. This can make the structure of the magnetic core 101 more stable and simplify the molding process of the magnetic core 101. In other possible embodiments, the central magnetic column 1012 and the stopper 1011 can also be two separately formed structures that are then fixedly connected by sintering or other methods.

[0039] The film-wrapped wire 102 can be wound around the central magnetic column 1012, and the stopper 1011 of the magnetic core 101 can serve as a limit stop for the film-wrapped wire 102, thereby limiting the position of the film-wrapped wire 102 on the magnetic core 101 and preventing the film-wrapped wire 102 from falling off the magnetic core 101. In the present application, in order to enable the stopper 1011 to limit the film-wrapped wire 102, the cross-sectional area of ​​the stopper 1011 can be made larger than the cross-sectional area of ​​the central magnetic column 1012. In addition, each magnetic core 101 can be wound with one or at least two film-wrapped wires 102, which can be set according to the specific application scenario and is not limited here.

[0040] It is understandable that after the film-covered wire 102 is wound around the magnetic core 101, the two ends of each film-covered wire 102 can serve as interfaces for the power device for electrical connection to the circuit board 2. In addition, the connection between the two ends of each film-covered wire 102 and the circuit board 2 can achieve a fixed connection between the power device and the circuit board 2, so there is no need to provide an additional structure for the fixed connection between the power device and the circuit board 2, which can simplify the overall structure of the heat dissipation structure.

[0041] In the present application, in order to improve the temperature uniformity of the heat dissipation structure, a thermally conductive film 1013 may be provided on the surface of the magnetic core 101. The thermally conductive film 1013 may be in direct contact with the surface of the magnetic core 101, or a thermally conductive material may be filled between the thermally conductive film 1013 and the surface of the magnetic core 101 so that the thermally conductive film 1013 and the surface of the magnetic core 101 are in indirect contact.

[0042] When the heat conductive film 1013 is specifically arranged on the magnetic core 101, please continue to refer to Figure 4 and Figure 5 ,exist Figure 4 and Figure 5 In the illustrated embodiment, the thermally conductive film 1013 can be disposed on the stopper portion 1011 of the magnetic core 101, illustratively, on at least a portion of a side surface of the stopper portion 1011. The side surface of the stopper portion 1011 is the surface of the stopper portion 1011 facing away from the central magnetic column 1012. Disposing the thermally conductive film 1013 on the side surface of the stopper portion 1011 facilitates placement of the thermally conductive film 1013.

[0043] In the present application, the specific material of the thermal conductive film 1013 is not limited. For example, it can be a metal film with good thermal conductivity such as copper foil, or a non-metallic film with good thermal conductivity such as graphite film. In addition, in a possible embodiment of the present application, the thermal conductive film 1013 can be set on the entire side of the stopper 1011 to make the temperature uniformity of the magnetic device 1 better. In some other possible embodiments of the present application, the thermal conductive film 1013 can also be set on a part of the side of the stopper 1011. For example, a continuous sheet-like thermal conductive film 1013 can be set on a part of the side of the stopper 1011 in the direction from the radiator 3 to the circuit board 2; or the thermal conductive film 1013 can be set as a strip structure, and the strip-like thermal conductive film 1013 can extend along the direction from the radiator 3 to the circuit board 2. In addition, the thermal conductive film 1013 can be a plurality of strips, and the plurality of thermal conductive films 1013 are arranged side by side at intervals. By partially disposing a thermally conductive film 1013 on the side of the stopper 1011 , the uniform temperature requirement of the magnetic device 1 can be met while reducing the amount of the thermally conductive film 1013 used, thereby reducing the cost of the heat dissipation structure.

[0044] The application can continue to refer to Figure 4 And Figure 5 In the application, the heat-conducting film 1013 can be arranged on the top surface of the stop portion 1011 in addition to the side surface of the stop portion 1011. The top surface of the stop portion 1011 can be the surface of the stop portion 1011 facing the heat sink 3. When the heat-conducting film 1013 is arranged on the top surface of the stop portion 1011, in one possible embodiment of the application, the heat-conducting film 1013 can be arranged on the entire top surface of the stop portion 1011 to effectively improve the temperature uniformity of the magnetic core 101. In some other possible embodiments of the application, the heat-conducting film 1013 can be arranged on a part of the top surface of the stop portion 1011. In this case, the heat-conducting film 1013 can be in the form of a sheet or a strip, which is not limited in the application. The heat-conducting film 1013 can be used to improve the temperature uniformity of the magnetic core 101 while reducing the amount of the heat-conducting film 1013, thereby reducing the cost of the heat dissipation structure.

[0045] It can be understood that the heat-conducting film 1013 arranged on the side surface and the top surface of the stop portion 1011 can be of the same type or different types. In addition, the heat-conducting film 1013 arranged on the side surface and the top surface of the stop portion 1011 can be connected or not connected, which is not limited in the application.

[0046] In order to enable the heat generated by the magnetic core 101 to be conducted to the heat sink 3, a heat-conducting medium 103 can be further arranged in the heat dissipation structure. The heat-conducting medium 103 can be arranged between the magnetic device 1 and the heat sink 3 and in heat-conducting contact with at least part of the magnetic device 1 and the heat sink 3. The specific type of the heat-conducting medium 103 is not limited in the application as long as it has good heat-conducting performance. For example, in the embodiment shown in the application, the heat-conducting medium 103 can be heat-conducting glue 103b. Figure 4 The heat-conducting medium 103 can be heat-conducting glue 103b, which can be filled in the gap between the magnetic device 1 and the heat sink 3, so that the heat-conducting glue 103b can cover at least part of the magnetic core 101, at least part of the heat-conducting film 1013, and at least part of the film-wound wire 102 while achieving the adhesion of the entire surface of the magnetic device 1 and the heat sink 3.

[0047] With the heat dissipation structure provided in the embodiment of the application, the heat generated by the magnetic device 1 can be conducted to the heat-conducting glue 103b through the heat-conducting film 1013 and then conducted to the heat sink 3 for heat dissipation. Since the heat-conducting film 1013 has good heat-conducting performance, the heat dissipation structure can effectively improve the heat-conducting efficiency of the magnetic device 1. In addition, the heat-conducting glue 103b filled between the magnetic device 1 and the heat sink 3 can effectively reduce the thermal resistance between the magnetic device 1 and the heat sink 3, which can meet the heat dissipation requirements of the magnetic device 1.

[0048] It can be understood that the filling amount of the heat-conducting glue 103b in the heat dissipation structure is not limited in the present application, and can be adjusted according to the structure of the magnetic device 1, the heat dissipation requirement of the magnetic device 1, and the space between the magnetic device 1 and the heat sink 3. As long as the heat generated by the magnetic device 1 can be conducted to the heat-conducting glue 103b and then transferred to the heat sink 3 for heat dissipation, it is acceptable. In addition, since the heat-conducting film 1013 is arranged on the magnetic core 101, the temperature uniformity of the magnetic core 101 is improved, so that the amount of the heat-conducting glue 103b can be effectively reduced, thereby reducing the cost of the heat dissipation structure.

[0049] In a possible embodiment of the present application, the heat-conducting medium 103 can also be a heat-conducting pad 103a. In specific implementation, reference can be made to Figure 6 Figure 6 A structure diagram of a heat dissipation structure provided by another embodiment of the present application is shown. The heat-conducting pad 103a can be arranged between the magnetic device 1 and the heat sink 3, and at least part of the magnetic device 1 and the heat sink 3 are attached to the heat-conducting pad 103a. In this embodiment, the heat-conducting film 1013 arranged on the stop portion 1011 of the magnetic core 101, especially the heat-conducting film 1013 arranged on the side surface of the stop portion 1011, is in heat-conducting contact with the heat-conducting pad 103a, so that the heat generated by the magnetic device 1 can be conducted to the heat-conducting pad 103a through the heat-conducting film 1013, and then conducted to the heat sink 3 through the heat-conducting pad 103a for heat dissipation, thereby improving the heat dissipation efficiency of the magnetic device 1.

[0050] As can be known from the above embodiments, by arranging the heat-conducting film 1013 with good heat-conducting performance on the surface of the magnetic core 101, the temperature uniformity of the magnetic device 1 can be effectively improved, thereby facilitating the heat dissipation of the magnetic device 1. Based on this, the heat-conducting film 1013 can be arranged on other parts of the magnetic core 101 in addition to the stop portion 1011 of the magnetic core 101. For reference Figure 7 and Figure 8 Figure 7 A sectional view of a heat dissipation structure provided by another possible embodiment of the present application is shown, Figure 8 Figure 7 A local structure diagram of a magnetic device 1 in the above embodiment is shown. In this embodiment, the heat-conducting film 1013 can be arranged on at least part of the surface of the center magnetic column 1012. The material of the heat-conducting film 1013 can be, but is not limited to, a metal thin film with good heat-conducting performance such as copper foil, or a non-metal thin film with good heat-conducting performance such as graphite film. It is worth noting that in order to enable the magnetic device 1 to work normally, when the heat-conducting film 1013 is a metal thin film, the heat-conducting film 1013 should be arranged away from the magnetic air gap 104 of the magnetic device 1.

[0051] In Figure 7 and Figure 8 ​​​In the shown embodiment, the heat-conducting film 1013 can be arranged on the entire surface of the center magnetic column 1012, so that the temperature uniformity of the magnetic device 1 is better. In other possible embodiments of the present application, the heat-conducting film 1013 can also be arranged on a part of the surface of the center magnetic column 1012. For example, the heat-conducting film 1013 can be arranged in the form of a continuous strip on a part of the surface of the center magnetic column 1012 in the axial direction of the center magnetic column 1012, and the strip-shaped heat-conducting film 1013 can be arranged in the circumferential direction of the center magnetic column 1012.

[0052] It can be understood that, Figure 7 and Figure 8 The heat dissipation structure shown in the embodiment can be arranged as follows: first, the heat-conducting film 1013 is formed on the surface of the center magnetic column 1012, and then the film-wound wire 102 is wound on the center magnetic column 1012. At this time, the film-wound wire 102 can also be in heat-conducting contact with the heat-conducting film 1013, so that the heat generated at the film-wound wire 102 can also be conducted to the heat-conducting film 1013.

[0053] Continuing to refer to Figure 7 The heat-conducting medium 103, which can be heat-conducting glue 103b for example, can also be arranged between the magnetic device 1 and the heat sink 3. The heat-conducting glue 103b can be arranged in the manner described above with reference to Figure 4 The embodiment shown in the above description, for example, the heat-conducting glue 103b is in heat-conducting contact with at least part of the magnetic device 1 and the heat sink 3, and will not be described here again. In addition, the heat-conducting medium 103 can also be heat-conducting pads 103a, which can be arranged in the manner described above with reference to Figure 6 The embodiment shown in the above description, and will not be described here again.

[0054] The heat dissipation structure provided by the embodiments shown in Figure 7 and Figure 8 can effectively improve the temperature uniformity of the center magnetic column 1012, and can conduct the heat generated by the magnetic device 1 to the heat-conducting glue 103b through the heat-conducting film 1013, and then conduct the heat to the heat sink 3 through the heat-conducting glue 103b for heat dissipation, which can effectively improve the heat dissipation efficiency of the heat dissipation structure. In addition, the heat-conducting film 1013 arranged on the center magnetic column 1012 can improve the temperature uniformity of the magnetic core 101, which can effectively reduce the amount of heat-conducting glue 103b used, thereby reducing the cost of the heat dissipation structure. In addition, the heat dissipation structure provided by the embodiment can also be beneficial to reducing the local high temperature of the magnetic device 1, such as the temperature on the side of the magnetic device 1 close to the circuit board 2, thereby reducing the risk of over-temperature at the circuit board 2.

[0055] It is understood that in some possible embodiments of the present application, a heat-conducting film 1013 may be provided on the surfaces of the stopper 1011 and the central magnetic column 1012 of the magnetic core 101. Figure 4 The embodiment shown is configured as shown, and the heat conductive film 1013 on the surface of the central magnetic column 1012 can refer to Figure 7 By providing the thermal conductive film 1013 on both the stopper 1011 and the central magnetic column 1012 of the magnetic core 101 , the temperature uniformity of the magnetic core 101 can be effectively improved, thereby facilitating the improvement of the heat dissipation efficiency of the entire magnetic device 1 .

[0056] Considering that the film-wrapped wire 102 may generally include metal wires, and during the operation of the magnetic device 1, the metal wires in the film-wrapped wire 102 may serve as channels for current flow, thus generating a large amount of heat. Based on this, the heat generated by the film-wrapped wire 102 can be quickly conducted away to improve the heat dissipation efficiency of the magnetic device 1. Figure 9 and Figure 10 , Figure 9 A cross-sectional view of a heat dissipation structure provided in another possible embodiment of the present application is shown. Figure 10 for Figure 9 Schematic diagram of the partial structure of the magnetic device 1. In this embodiment, the film-wrapped wire 102 and the thermally conductive film 1013 are interlaced and wound around the central magnetic column 1012. There are many specific implementation methods. For example, a circle of thermally conductive film 1013 can be first wound along the circumference of the central magnetic column 1012, and then a circle of film-wrapped wire 102 can be wound, wherein the thermally conductive film 1013 can be located between the film-wrapped wire 102 and the central magnetic column 1012. The above winding sequence is then repeated until the thermally conductive film 1013 and the film-wrapped wire 102 are wound on the entire central magnetic column 1012. In some other possible embodiments of the present application, a circle of film-wrapped wire 102 can also be wound around the central magnetic column 1012 first, and then the thermally conductive film 1013 can be wound. The winding sequence of the film-wrapped wire 102 and the thermally conductive film 1013 is not limited in this application.

[0057] You can continue to refer to Figure 9 A heat conducting medium 103 may also be provided between the magnetic device 1 and the heat sink 3. The heat conducting medium 103 may be, for example, a heat conducting adhesive 103b. Figure 4 In the embodiment shown, for example, the thermal conductive adhesive 103b is in thermal contact with at least part of the magnetic device 1 and the heat sink 3, which will not be described in detail here. In addition, the thermal conductive medium 103 can also be a thermal pad 103a, which can refer to the above Figure 6 The embodiment shown is specifically configured and will not be described in detail here.

[0058] use Figure 9 and Figure 10 The heat dissipation structure provided by the illustrated embodiment can enable the central magnetic column 1012 and the film-wrapped wire 102 to both be in contact with the thermally conductive film 1013. In addition, because the thermally conductive film 1013 and the film-wrapped wire 102 are interlaced and wound around the central magnetic column 1012, the contact area between the film-wrapped wire 102 and the thermally conductive film 1013 can be effectively increased. In this way, while effectively improving the temperature uniformity at the central magnetic column 1012, the heat generated by the central magnetic column 1012 and the film-wrapped wire 102 can be conducted to the thermally conductive adhesive 103b through the thermally conductive film 1013, and then conducted to the heat sink 3 through the thermally conductive adhesive 103b for dissipation, which can effectively improve the heat dissipation efficiency of the heat dissipation structure. In addition, because the thermally conductive film 1013 is provided on the central magnetic column 1012, the temperature uniformity of the magnetic core 101 can be improved, which can effectively reduce the amount of thermally conductive adhesive 103b used, thereby reducing the cost of the heat dissipation structure. In addition, the heat dissipation structure provided in this embodiment can also help reduce the local high temperature of the magnetic device 1, such as the temperature of the side of the magnetic device 1 close to the circuit board 2, thereby reducing the risk of overheating at the circuit board 2.

[0059] In some possible embodiments of the present application, while the film-wrapped wire 102 and the heat-conducting film 1013 are wound alternately around the central magnetic column 1012, a heat-conducting film 1013 may also be provided on the surface of the stopper 1011 of the magnetic core 101 and / or the surface of the central magnetic column 1012. Figure 4 The embodiment shown is configured as shown, and the heat conductive film 1013 on the surface of the central magnetic column 1012 can refer to Figure 7 The embodiment shown is configured as shown, and will not be described in detail here. In this way, the temperature uniformity of the magnetic core 101 can be effectively improved, thereby facilitating the improvement of the heat dissipation efficiency of the entire magnetic device 1. In addition, the improved temperature uniformity of the magnetic core 101 can also effectively reduce the risk of overheating of the magnetic core 101, thereby improving the reliability of the operation of the magnetic device 1. Among them, overheating of the magnetic core 101 refers to the phenomenon of temperature runaway that occurs after the magnetic core 101 is magnetically saturated at high temperature.

[0060] The heat dissipation module provided by the above-mentioned embodiments of the present application can be applied to various possible electronic devices, and the present application does not limit the specific type of the electronic device, for example, the electronic device can be a power supply device such as a charging pile or an inverter, can be a communication device such as a server or a storage, or can be other electronic devices such as a vehicle or a home device. In addition to the heat dissipation structure, the electronic device can include a shell, and the heat dissipation structure can be arranged in the shell. The heat dissipation performance of the heat dissipation structure of the electronic device is good, and the power density of the heat dissipation structure is high, so that the performance of the electronic device can be improved. In addition, since the heat dissipation structure provided by the above-mentioned embodiments of the present application is adopted, the number of devices arranged on the circuit board 2 per unit area is large, which is beneficial to realize the miniaturization design of the heat dissipation structure, so that the miniaturization design of the electronic device can be realized.

[0061] Obviously, those skilled in the art can make various modifications and variations to the present application without departing from the scope of the present application. Thus, if these modifications and variations of the present application belong to the scope of the claims of the present application and their equivalent technologies, the present application also intends to include these modifications and variations.

Claims

1. A heat dissipating structure, characterized by comprising: The application relates to a heat dissipation structure comprising a circuit board, a magnetic device, a heat sink and a heat conductive medium, wherein the magnetic device is located between the circuit board and the heat sink. The magnetic device comprises a magnetic core and a film-wound wire, the magnetic core comprises a stopper and a central magnetic column, the stopper and the central magnetic column are fixedly connected, the film-wound wire is wound on the central magnetic column, and the film-wound wire is electrically connected with the circuit board. At least part of the side surface of the stopper is provided with a heat conductive film, wherein the side surface is a surface of the stopper facing away from the central magnetic column. The heat conductive medium is arranged between the magnetic device and the heat sink, and the heat conductive medium is in heat conductive contact with at least part of the magnetic device and the heat sink.

2. The heat dissipating structure according to claim 1, wherein At least part of the surface of the central magnetic column is provided with the heat conductive film, and the film-wound wire is in heat conductive contact with the heat conductive film.

3. The heat dissipating structure according to claim 1 or 2, wherein The heat conductive film is arranged between the film-wound wire and the central magnetic column, and the film-wound wire and the heat conductive film are wound on the central magnetic column in an interlaced manner.

4. The heat dissipating structure according to claim 1 or 2, wherein The heat conductive medium is heat conductive glue, and the heat conductive glue covers at least part of the heat conductive film.

5. The heat dissipating structure according to claim 4, wherein The heat conductive glue covers at least part of the magnetic core and at least part of the film-wound wire.

6. The heat dissipating structure according to claim 1 or 2, wherein The surface of the stopper facing the heat sink is provided with the heat conductive film.

7. The heat dissipating structure according to claim 1 or 2, wherein The heat conductive film is a copper foil or a graphite film.

8. A heat dissipating structure characterized by comprising: The application relates to a heat dissipation structure comprising a circuit board, a magnetic device, a heat sink and a heat conductive medium, wherein the magnetic device is located between the circuit board and the heat sink. The magnetic device comprises a magnetic core and a film-wound wire, the magnetic core comprises a stopper and a central magnetic column, the stopper and the central magnetic column are fixedly connected, at least part of the surface of the central magnetic column is provided with a heat conductive film; the film-wound wire is wound on the central magnetic column, and the film-wound wire is in heat conductive contact with the heat conductive film. The heat conductive medium is arranged between the magnetic device and the heat sink, and the heat conductive medium is in heat conductive contact with at least part of the magnetic device and the heat sink.

9. The heat dissipating structure according to claim 8, wherein The heat conductive film is arranged between the film-wound wire and the central magnetic column, and the film-wound wire and the heat conductive film are wound on the central magnetic column in an interlaced manner.

10. A heat dissipating structure characterized by comprising: The application relates to a heat dissipation structure comprising a circuit board, a magnetic device, a heat sink and a heat conductive medium, wherein the magnetic device is located between the circuit board and the heat sink. The magnetic device comprises a magnetic core and a film-wound wire, the magnetic core comprises a stopper and a central magnetic column, the stopper and the central magnetic column are fixedly connected, a heat conductive film is arranged between the film-wound wire and the central magnetic column, and the film-wound wire and the heat conductive film are wound on the central magnetic column in an interlaced manner. The heat conductive medium is arranged between the magnetic device and the heat sink, and the heat conductive medium is in heat conductive contact with at least part of the magnetic device and the heat sink.

11. An electronic device, comprising: The application relates to a heat dissipation structure comprising a circuit board, a magnetic device, a heat sink and a heat conductive medium, wherein the magnetic device is located between the circuit board and the heat sink. The heat conductive medium is arranged between the magnetic device and the heat sink, and the heat conductive medium is in heat conductive contact with at least part of the magnetic device and the heat sink.

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