Packaging materials and packaging items

Abstract

To prevent a cushioning sheet arranged on a cushioning material from being peeled.SOLUTION: A cushioning material includes a packaging box which can house an electronic apparatus, and a cushioning material which is housed in the packaging box and buffers external force applied on the electronic apparatus by contacting with the electronic apparatus housed in the packaging box. The cushioning material includes a plurality of cushioning sheets laminated along a direction intersecting an insertion direction which is a direction in which the electronic apparatus is inserted in the packaging box.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a packaging material and a packaged product. [Background technology]

[0002] There is known a cushioning material that is housed in a packaging box capable of housing an electronic device and that cushions external forces applied to the electronic device. For example, Patent Document 1 discloses a technology for holding corners of an electronic device with a cushioning material. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-209229 Summary of the Invention [Problem to be solved by the invention]

[0004] In conventional technology, a cushioning material is sometimes formed by stacking multiple buffer sheets. However, if the direction in which the electronic device is inserted and removed when it is housed in a packaging box is the same as the stacking direction of the multiple buffer sheets, there is a risk that the buffer sheets will peel off due to friction between the electronic device and the buffer sheets. [Means for solving the problem]

[0005] In order to solve the above problems, the packaging material of the present invention comprises a packaging box capable of containing an electronic device, and a cushioning material contained in the packaging box and in contact with the electronic device contained in the packaging box to cushion external forces applied to the electronic device, wherein the cushioning material includes a plurality of cushioning sheets stacked along a direction intersecting an insertion direction in which the electronic device is inserted into the packaging box.

[0006] In addition, the packaging product of the present invention comprises an electronic device, a packaging box capable of housing the electronic device, and a cushioning material housed in the packaging box, in contact with the electronic device housed in the packaging box, and cushioning external forces applied to the electronic device housed in the packaging box, and is characterized in that the cushioning material includes a plurality of cushioning sheets stacked along a direction intersecting an insertion direction in which the electronic device is inserted into the packaging box. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is an exploded perspective view showing an example of the configuration of a packaging material 1 according to a first embodiment of the present invention. [Figure 2] 1 is a perspective view showing an example of the structure of a cushioning material S. FIG. [Figure 3] 2 is a cross-sectional view showing an example of the structure of the cushioning material S. FIG. [Figure 4] FIG. 10 is a plan view showing an example of the shape of a flat plate member HH. [Figure 5] 1 is a cross-sectional view showing an example of the structure of a cushioning material SV according to Reference Example 1. FIG. [Figure 6] FIG. 10 is a perspective view showing an example of the configuration of a buffer material SJ according to a second embodiment of the present invention. [Figure 7] FIG. 10 is a cross-sectional view showing an example of the structure of a buffer material SJ. [Figure 8] FIG. 10 is a perspective view showing an example of the configuration of a buffer material SW according to Reference Example 2. [Figure 9] FIG. 2 is a cross-sectional view showing an example of the configuration of a buffer material SW. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, in each drawing, the dimensions and scale of each part are appropriately different from those of the actual parts. Furthermore, since the embodiments described below are preferred examples of the present invention, various technically preferable limitations are applied, but the scope of the present invention is not limited to these embodiments unless otherwise specified in the following description to the effect that the present invention is limited.

[0009] <<1. First Embodiment>> A first embodiment of the present invention will be described below.

[0010] <<1.1. Overall package overview>> An example of the configuration of the packaging material 1 according to this embodiment will be described below with reference to FIG.

[0011] FIG. 1 is an exploded perspective view showing an example of the configuration of a packaging material 1. As shown in FIG.

[0012] 1, the packaging material 1 contains an electronic device 100. Specifically, the packaging material 1 includes a packaging box 2 capable of containing the electronic device 100, and a plurality of cushioning materials S for cushioning external forces applied to the electronic device 100 contained in the packaging box 2. Here, the electronic device 100 is, for example, a printing device such as an inkjet printer. However, in this embodiment, the electronic device 100 may also be a device other than a printing device, such as a television, a refrigerator, a washing machine, a microwave oven, or a personal computer. In the following description, the packaging material 1 and the electronic device 100 housed in the packaging material 1 may be referred to as a "packaged item."

[0013] 1, in this embodiment, it is assumed that the packaging material 1 has four cushioning materials S-1 to S-4. In this embodiment, the electronic device 100 and the four cushioning materials S-1 to S-4 are housed in the packaging box 2 by being inserted into the packaging box 2 through an opening 20 that the packaging box 2 has.

[0014] For ease of explanation, a packaging box coordinate system ΣW fixed to the packaging box 2 will be introduced below. The packaging box coordinate system ΣW is a three-axis coordinate system having a Zw axis extending in the +Zw direction, which is the direction from the bottom surface of the packaging box 2 toward the opening 20, an Xw axis extending in the +Xw direction perpendicular to the +Zw direction, and a Yw axis extending in the +Yw direction perpendicular to the +Zw direction and the +Xw direction. Hereinafter, the direction opposite to the +Xw direction will be referred to as the -Xw direction, the direction opposite to the +Yw direction will be referred to as the -Yw direction, and the direction opposite to the +Zw direction will be referred to as the -Zw direction.

[0015] In the following, we will introduce a buffer coordinate system ΣS fixed to the buffer S. The buffer coordinate system ΣS is a three-axis coordinate system having a Zs axis extending in the +Zs direction, an Xs axis extending in the +Xs direction perpendicular to the +Zs direction, and a Ys axis extending in the +Ys direction perpendicular to the +Zs and +Xs directions. In the following, the direction opposite to the +Xs direction will be referred to as the -Xs direction, the direction opposite to the +Ys direction will be referred to as the -Ys direction, and the direction opposite to the +Zs direction will be referred to as the -Zs direction.

[0016] 1, when the electronic device 100 and four cushioning materials S-1 to S-4 are housed in the packaging box 2, the cushioning material S-1 is a cushioning material S that holds the lower end of the electronic device 100 in the -Zw direction and the -Xw direction of the electronic device 100. Here, the cushioning material coordinate system ΣS-1 fixed to the cushioning material S-1 is set so that the +Zs direction coincides with the +Zw direction, the +Xs direction coincides with the +Yw direction, and the +Ys direction coincides with the -Xw direction.

[0017] Furthermore, when the electronic device 100 and the four cushioning materials S-1 to S-4 are housed in the packaging box 2, the cushioning material S-2 is a cushioning material S that holds the lower end of the electronic device 100 in the -Zw direction and +Xw direction of the electronic device 100. Here, the cushioning material coordinate system ΣS-2 fixed to the cushioning material S-2 is set so that the +Zs direction coincides with the +Zw direction, the +Xs direction coincides with the -Yw direction, and the +Ys direction coincides with the +Xw direction.

[0018] Furthermore, when the electronic device 100 and the four cushioning materials S-1 to S-4 are housed in the packaging box 2, the cushioning material S-3 is a cushioning material S that holds the lower end of the electronic device 100 in the +Zw direction and the -Xw direction of the electronic device 100. Here, the cushioning material coordinate system ΣS-3 fixed to the cushioning material S-3 is set so that the +Zs direction coincides with the -Zw direction, the +Xs direction coincides with the -Yw direction, and the +Ys direction coincides with the -Xw direction.

[0019] Furthermore, when the electronic device 100 and the four cushioning materials S-1 to S-4 are housed in the packaging box 2, the cushioning material S-4 is a cushioning material S that holds the lower end of the electronic device 100 in the +Zw direction and the +Xw direction of the electronic device 100. Here, the cushioning material coordinate system ΣS-4 fixed to the cushioning material S-4 is set so that the +Zs direction coincides with the -Zw direction, the +Xs direction coincides with the +Yw direction, and the +Ys direction coincides with the -Xw direction.

[0020] <<1.2. Overview of cushioning materials>> An example of the configuration of the cushioning material S according to this embodiment will be described below with reference to FIGS.

[0021] FIG. 2 is a perspective view showing an example of the configuration of the cushioning material S. As shown in FIG.

[0022] As illustrated in FIG. 2, the cushioning material S includes a plurality of cushioning blocks R for cushioning external forces applied to the electronic device 100, and a holding material H for holding each of the cushioning blocks R.

[0023] Of these, the holding material H includes a plate-shaped portion P1 that forms the side surface on the -Xs side of the cushioning material S, a plate-shaped portion P2 that forms the side surface on the +Xs side of the cushioning material S, a plate-shaped portion Pd that forms the back surface of the cushioning material S, and a plate-shaped portion Ph that forms the bottom surface of the cushioning material S. More specifically, the plate-shaped portion P1 is located at the end of the cushioning material S in the -Xs direction and is a side surface portion of the cushioning material S with the +Xs direction as its normal direction. The plate-shaped portion P2 is located at the end of the cushioning material S in the +Xs direction and is a side surface portion of the cushioning material S with the +Xs direction as its normal direction. The plate-shaped portion Pd is located at the end of the cushioning material S in the +Ys direction and is a back surface portion of the cushioning material S with the +Ys direction as its normal direction. The plate-shaped portion Ph is located at the end of the cushioning material S in the -Zs direction and is a bottom surface portion of the cushioning material S with the +Zs direction as its normal direction. Hereinafter, the plate-shaped portion P1, the plate-shaped portion P2, the plate-shaped portion Pd, and the plate-shaped portion Ph may be collectively referred to as the plate-shaped portion P. In this embodiment, it is assumed, as an example, that each of the plurality of plate-shaped portions P that make up the holding material H is made of cardboard.

[0024] 2, in this embodiment, it is assumed that the cushioning material S includes six buffer blocks R: buffer block R1 held by plate-shaped portion P1, buffer block R2 held by plate-shaped portion P2, buffer blocks R3 and R4 held by plate-shaped portion Pd, and buffer blocks Rh1 and Rh2 held by plate-shaped portion Ph. Here, buffer block R4 is a buffer block R located on the +Xs side of buffer block R3. Also, buffer block Rh2 is a buffer block R located on the +Xs side of buffer block Rh1.

[0025] In this embodiment, it is assumed that the buffer block R is made of a material having lower elasticity than polystyrene foam. In addition, in this embodiment, as an example, a case is assumed in which an object such as paper or clothing containing various fibers such as animal fibers, plant fibers, or chemical fibers is decomposed to obtain the fibers contained in the object, and the obtained fibers are processed to form the buffer block R. More specifically, in this embodiment, a case is assumed in which paper is decomposed to obtain the fibers contained in the paper, and the obtained fibers are solidified to form the buffer block R. As described above, in this embodiment, the buffer block R is formed by obtaining fibers from an object containing fibers, such as paper or clothing. In other words, in this embodiment, when an object containing fibers, such as paper or clothing, is discarded, the buffer block R can be formed by reusing the object. Therefore, according to this embodiment, it is possible to reduce the environmental impact associated with the manufacturing and disposal of the buffer block R.

[0026] FIG. 3 is a cross-sectional view showing an example of a cross section of the cushioning material S when the cushioning material S is cut along line Ee in FIG.

[0027] As illustrated in FIG. 3, the plate-shaped portion P1, which is the end portion of the cushioning material S in the −Xs direction, includes a plate member P1-A, a plate member P1-B, and a plate member P1-C.

[0028] Of these, the plate member P1-A is located at the end of the plate-shaped portion P1 in the +Xs direction, is a flat plate-shaped member with the +Xs direction as its normal direction, and faces the electronic device 100 when the cushioning material S and the electronic device 100 are housed in the packaging box 2. An opening K1-A is formed in the plate member P1-A. In this embodiment, the plate member P1-A is an example of a "first plate," and the opening K1-A is an example of a "first opening." Furthermore, the plate member P1-B is located at the end of the plate-shaped portion P1 in the -Xs direction, is a flat plate-shaped member with its normal direction in the +Xs direction, and faces the packaging box 2 when the cushioning material S and the electronic device 100 are housed in the packaging box 2. An opening K1-B is formed in the plate member P1-B. In this embodiment, the plate member P1-B is an example of a "second plate," and the opening K1-B is an example of a "second opening." The plate member P1-C is located at the end of the plate-shaped portion P1 in the +Zs direction, is a flat portion with the +Zs direction as its normal direction, and connects the plate members P1-A and P1-B. In this embodiment, the plate member P1-C is an example of a "first connecting plate."

[0029] As illustrated in FIG. 3 , the buffer block R1 is held between plate members P1-A and P1-B by the plate-shaped portion P1. Specifically, the buffer block R1 includes a buffer portion QA that protrudes in the +Xs direction from an opening K1-A provided in the plate member P1-A, a buffer portion QB that protrudes in the −Xs direction from an opening K1-B provided in the plate member P1-B, and a connecting portion QC that is provided between the plate members P1-A and P1-B and connects the buffer portion QA and the buffer portion QB. Note that in this embodiment, the buffer block R1 is an example of a “first buffer block,” the buffer portion QA is an example of a “first buffer portion,” the buffer portion QB is an example of a “second buffer portion,” and the connecting portion QC is an example of a “first connecting portion.” Also, in this embodiment, the +Xs direction is an example of a “first direction,” the −Xs direction is an example of a “second direction,” and the +Zs direction is an example of a “first holding direction.”

[0030] In the following, the length of buffer portion QA in the +Zs direction will be referred to as length LQ-A, the length of buffer portion QB in the +Zs direction will be referred to as length LQ-B, and the length of connection portion QC in the +Zs direction will be referred to as length LQ-C. In the following, the length of opening K1-A in the +Zs direction will be referred to as length LK-A, and the length of opening K1-B in the +Zs direction will be referred to as length LK-B. In the following, the length in the +Zs direction from plate member P1-C to buffer portion QA will be referred to as length LQ-At, and the length in the +Zs direction from plate member P1-C to buffer portion QB will be referred to as length LQ-Bt.

[0031] In this embodiment, it is assumed that the lengths LQ-A and LK-A are approximately the same. Also, in this embodiment, it is assumed that the lengths LQ-B and LK-B are approximately the same. Here, "approximately the same" is a concept that includes not only cases where they are completely the same, but also cases where they contain an error of about 5% or less and can be considered the same if the error is removed, and cases where there is a manufacturing error but they are the same by design.

[0032] In this embodiment, the length LQ-C is longer than the length LK-A, and the length LQ-C is longer than the length LK-B. That is, in this embodiment, in the +Zs direction, the connection portion QC is longer than the opening K1-A, and the connection portion QC is longer than the opening K1-B. Therefore, in this embodiment, it is possible to prevent the buffer block R1 from falling off from the opening K1-A in the +Xs direction, and it is also possible to prevent the buffer block R1 from falling off from the opening K1-B in the -Xs direction. Note that this embodiment assumes an embodiment in which the buffer block R1 is held by the plate-shaped portion P1 without using adhesive. However, the present invention is not limited to this embodiment, and the buffer block R1 may be fixed to the plate-shaped portion P1 with adhesive.

[0033] In the following description, the length of the buffer block R1 in the +Xs direction is referred to as length LR, and the length of the plate member P1-C in the +Xs direction is referred to as length LP.

[0034] In this embodiment, the length LR is longer than the length LP. That is, in this embodiment, the buffer block R1 is longer than the plate member P1-C in the +Xs direction. Therefore, in this embodiment, even if an external force is applied to the packaging box 2, the external force can be buffered by the buffer block R1, and the external force transmitted to the electronic device 100 can be weakened.

[0035] As illustrated in FIG. 3, the plate-shaped portion P2, which is the end portion of the cushioning material S in the +Xs direction, includes a plate member P2-A, a plate member P2-B, and a plate member P2-C.

[0036] Of these, the plate member P2-A is located at the end of the plate-shaped portion P2 in the -Xs direction, is a flat-plate member whose normal direction is the +Xs direction, and faces the electronic device 100 when the cushioning material S and the electronic device 100 are contained in the packaging box 2. An opening K2-A is formed in the plate member P2-A. The plate member P2-B is located at the end of the plate-shaped portion P2 in the +Xs direction, is a flat-plate member whose normal direction is the +Xs direction, and faces the packaging box 2 when the cushioning material S and the electronic device 100 are contained in the packaging box 2. An opening K2-B is formed in the plate member P2-B. The plate member P2-C is located at the end of the plate-shaped portion P2 in the +Zs direction, is a flat-plate member whose normal direction is the +Zs direction, and connects the plate members P2-A and P2-B. In this embodiment, the plate-shaped portion P2 has substantially the same shape as the plate-shaped portion P1. That is, the plate member P2-A has substantially the same shape as the plate member P1-A, the plate member P2-B has substantially the same shape as the plate member P1-B, and the plate member P2-C has substantially the same shape as the plate member P1-C.

[0037] As illustrated in FIG. 3, the buffer block R2 is held by the plate-shaped portion P2 between the plate members P2-A and P2-B. In this embodiment, the buffer block R2 is made of the same material as the buffer block R1 and has substantially the same shape as the buffer block R1. Specifically, the buffer block R2 includes a buffer portion QA that protrudes in the −Xs direction from an opening K2-A provided in the plate member P2-A, a buffer portion QB that protrudes in the +Xs direction from an opening K2-B provided in the plate member P2-B, and a connection portion QC that is provided between the plate members P2-A and P2-B and connects the buffer portion QA and the buffer portion QB.

[0038] That is, in this embodiment, in the +Zs direction, the connection portion QC of the buffer block R2 is longer than the opening K2-A, and the connection portion QC of the buffer block R2 is longer than the opening K2-B. Therefore, in this embodiment, it is possible to prevent the buffer block R2 from falling off from the opening K2-A in the -Xs direction, and it is also possible to prevent the buffer block R2 from falling off from the opening K2-B in the +Xs direction.

[0039] As illustrated in FIG. 3, the plate-shaped portion Ph, which is the end portion of the cushioning material S in the −Zs direction, includes a plate member Ph-A and a plate member Ph-B.

[0040] Of these, the plate member Ph-A is located at the end of the plate-shaped portion Ph in the +Zs direction, is a flat plate-shaped member with the +Zs direction as its normal direction, and faces the electronic device 100 when the cushioning material S and the electronic device 100 are housed in the packaging box 2. An opening Kh1-A is formed in the plate member Ph-A. In addition, an opening Kh2-A is formed in the plate member Ph-A on the +Xs side of the opening Kh1-A. In this embodiment, the plate member Ph-A is an example of a "third plate," and the opening Kh1-A is an example of a "third opening." Furthermore, the plate member Ph-B is located at the end of the plate-shaped portion P1 in the -Zs direction, is a flat plate-shaped member with the +Zs direction as its normal direction, and faces the packaging box 2 when the cushioning material S and the electronic device 100 are housed in the packaging box 2. An opening Kh1-B is formed in the plate member Ph-B. Furthermore, an opening Kh2-B is formed in the plate member Ph-B on the +Xs side of the opening Kh1-B. In this embodiment, the plate member Ph-B is an example of a "fourth plate," and the opening Kh1-B is an example of a "fourth opening."

[0041] 3, the buffer block Rh1 is held by the plate-shaped portion Ph between the plate members Ph-A and Ph-B. Specifically, the buffer block Rh1 includes a buffer portion Qh-A that protrudes in the +Zs direction from an opening Kh1-A provided in the plate member Ph-A, a buffer portion Qh-B that protrudes in the -Zs direction from an opening Kh1-B provided in the plate member Ph-B, and a connecting portion Qh-C that is provided between the plate members Ph-A and Ph-B and connects the buffer portion Qh-A and the buffer portion Qh-B. In this embodiment, the buffer block Rh1 is an example of a "second buffer block," the buffer portion Qh-A is an example of a "third buffer portion," the buffer portion Qh-B is an example of a "fourth buffer portion," and the connecting portion Qh-C is an example of a "second connecting portion." In addition, in this embodiment, the +Zs direction is an example of a "third direction," the -Zs direction is an example of a "fourth direction," and the +Xs direction is an example of a "second holding direction."

[0042] Note that, hereinafter, the length of buffer portion Qh-A in the +Xs direction will be referred to as length HQ-A, the length of buffer portion Qh-B in the +Xs direction will be referred to as length HQ-B, and the length of connection portion Qh-C in the +Xs direction will be referred to as length HQ-C. Also, hereinafter, the length of opening Kh1-A in the +Xs direction will be referred to as length HK-A, and the length of opening Kh1-B in the +Xs direction will be referred to as length HK-B. Also, hereinafter, the length in the +Xs direction from the end of connection portion Qh-C in the -Xs direction to buffer portion Qh-A will be referred to as length HQ-At1, and the length in the +Xs direction from the end of connection portion Qh-C in the +Xs direction to buffer portion Qh-A will be referred to as length HQ-At2. In addition, below, the length in the +Xs direction from the end of the connection portion Qh-C in the -Xs direction to the buffer portion Qh-B will be referred to as length HQ-Bt1, and the length in the +Xs direction from the end of the connection portion Qh-C in the +Xs direction to the buffer portion Qh-B will be referred to as length HQ-Bt2.

[0043] In this embodiment, it is assumed that the length HQ-A and the length HK-A are substantially the same, and that the length HQ-B and the length HK-B are substantially the same.

[0044] Furthermore, in this embodiment, the length HQ-C is longer than the length HK-A, and the length HQ-C is longer than the length HK-B. That is, in this embodiment, in the +Xs direction, the connection portion Qh-C is longer than the opening Kh1-A, and the connection portion Qh-C is longer than the opening Kh1-B. Therefore, in this embodiment, it is possible to prevent the buffer block Rh1 from falling off from the opening Kh1-A in the +Zs direction and to prevent the buffer block Rh1 from falling off from the opening Kh1-B in the -Zs direction. Note that this embodiment assumes a configuration in which the buffer block Rh1 is held by the plate-shaped portion Ph without using adhesive. However, the present invention is not limited to this configuration, and the buffer block Rh1 may be fixed to the plate-shaped portion Ph with adhesive.

[0045] In this embodiment, at least one of the length HQ-At1 and the length HQ-Bt1 is longer than the length LQ-At and longer than the length LQ-Bt. In other words, in this embodiment, at least one of the length in the +Xs direction from the end of the connection portion Qh-C in the -Xs direction to the opening Kh1-A and the length in the +Xs direction from the end of the connection portion Qh-C in the -Xs direction to the opening Kh1-B is longer than the length in the +Zs direction from the plate member P1-C to the opening K1-A and longer than the length in the +Zs direction from the plate member P1-C to the opening K1-B. In this embodiment, at least one of the length HQ-At2 and the length HQ-Bt2 is longer than the length LQ-At and longer than the length LQ-Bt. In other words, in this embodiment, at least one of the length in the +Xs direction from the end of the connection portion Qh-C in the +Xs direction to the opening Kh1-A and the length in the +Xs direction from the end of the connection portion Qh-C in the +Xs direction to the opening Kh1-B is longer than the length in the +Zs direction from the plate member P1-C to the opening K1-A and longer than the length in the +Zs direction from the plate member P1-C to the opening K1-B. For this reason, in this embodiment, it is possible to prevent the buffer block Rh1 from being mistakenly placed between the plate members P1-A and P1-B instead of the buffer block R1, and to prevent the buffer block Rh1 from being mistakenly placed between the plate members P2-A and P2-B instead of the buffer block R2. In other words, in this embodiment, it is possible to prevent the buffer block Rh1 from being mistakenly placed with the buffer block R1 or the buffer block R2 when manufacturing the buffer material S.

[0046] Furthermore, in this embodiment, at least one of the length LQ-A and the length LQ-B is longer than the length HK-A and longer than the length HK-B. Therefore, this embodiment can prevent the buffer block R1 from being mistakenly placed between the plate members Ph-A and Ph-B instead of the buffer block Rh1, and can prevent the buffer block R2 from being mistakenly placed between the plate members Ph-A and Ph-B instead of the buffer block Rh1. In other words, this embodiment can prevent the buffer block Rh1 from being mistakenly placed with the buffer block R1 or the buffer block R2 when manufacturing the buffer material S.

[0047] As illustrated in FIG. 3, the buffer block Rh2 is held by the plate-shaped portion Ph between the plate members Ph-A and Ph-B. In this embodiment, the buffer block Rh2 is made of the same material as the buffer block Rh1 and has substantially the same shape as the buffer block Rh1. Furthermore, in this embodiment, the opening Kh2-A has substantially the same shape as the opening Kh1-A, and the opening Kh2-B has substantially the same shape as the opening Kh1-B. The buffer block Rh2 includes a buffer portion Qh-A that protrudes in the +Zs direction from the opening Kh2-A provided in the plate member Ph-A, a buffer portion Qh-B that protrudes in the -Zs direction from the opening Kh2-B provided in the plate member Ph-B, and a connecting portion Qh-C that is provided between the plate members Ph-A and Ph-B and connects the buffer portion Qh-A and the buffer portion Qh-B.

[0048] Therefore, in this embodiment, it is possible to prevent the buffer block Rh2 from falling off in the +Zs direction from the opening Kh2-A, and it is also possible to prevent the buffer block Rh2 from falling off in the -Zs direction from the opening Kh2-B. Note that this embodiment assumes a mode in which the buffer block Rh2 is held by the plate-shaped portion Ph without using adhesive. However, the present invention is not limited to this mode, and the buffer block Rh2 may be fixed to the plate-shaped portion Ph with adhesive.

[0049] In this embodiment, at least one of the length in the +Xs direction from the end of the connection portion Qh-C in the +Xs direction to the opening Kh2-A and the length in the +Xs direction from the end of the connection portion Qh-C in the +Xs direction to the opening Kh2-B is longer than the length in the +Zs direction from the plate member P1-C to the opening K1-A and longer than the length in the +Zs direction from the plate member P1-C to the opening K1-B. In this embodiment, at least one of the length in the +Xs direction from the end of the connection portion Qh-C in the -Xs direction to the opening Kh2-A and the length in the +Xs direction from the end of the connection portion Qh-C in the -Xs direction to the opening Kh2-B is longer than the length in the +Zs direction from the plate member P1-C to the opening K1-A and longer than the length in the +Zs direction from the plate member P1-C to the opening Kh2-B. For this reason, in this embodiment, it is possible to prevent the buffer block Rh2 from being mistakenly placed between the plate members P1-A and P1-B instead of the buffer block R1, and to prevent the buffer block Rh2 from being mistakenly placed between the plate members P2-A and P2-B instead of the buffer block R2. In other words, in this embodiment, it is possible to prevent the buffer block Rh2 from being mistakenly placed with the buffer block R1 or the buffer block R2 when manufacturing the buffer material S.

[0050] Furthermore, as described above, in this embodiment, at least one of the length LQ-A and the length LQ-B is longer than the length HK-A and longer than the length HK-B. Therefore, this embodiment can prevent the buffer block R1 from being mistakenly placed between the plate members Ph-A and Ph-B instead of the buffer block Rh2, and can prevent the buffer block R2 from being mistakenly placed between the plate members Ph-A and Ph-B instead of the buffer block Rh2. In other words, this embodiment can prevent the buffer block Rh2 from being mistakenly placed with the buffer block R1 or the buffer block R2 when manufacturing the buffer material S.

[0051] <<1.3. Overview of Retaining Materials>> FIG. 4 is a plan view showing an example of the shape of the flat plate member HH when the holding material H is developed.

[0052] In this embodiment, as an example, it is assumed that the holding material H is formed by bending the flat plate member HH illustrated in Fig. 4 along the folding lines θ11 to θ35 illustrated in Fig. 4. As described above, in this embodiment, as an example, it is assumed that the flat plate member HH is made of cardboard.

[0053] As illustrated in Fig. 4, the flat plate member HH includes plate members P1-D, P1-E, P2-D, P2-E, Ph-C, Pd-A, Pd-B, and Pd-C in addition to the plate members P1-A, P1-B, P1-C, P2-A, P2-B, P2-C, Ph-A, and Ph-B described in Fig. 3. Note that Fig. 4 illustrates, as an example, a case in which the buffer coordinate system ΣS is a coordinate system fixed to the plate member Ph-B, and the flat plate member HH is obtained by unfolding the holding material H in a state in which the buffer coordinate system ΣS is fixed to the plate member Ph-B.

[0054] As illustrated in FIG. 4, plate members P1-D and P1-A are connected via a bent line θ11, plate members P1-A and P1-C are connected via a bent line θ12, plate members P1-C and P1-B are connected via a bent line θ13, and plate members P1-B and P1-E are connected via a bent line θ14. Plate members P2-D and P2-A are connected via a bent line θ21, plate members P2-A and P2-C are connected via a bent line θ22, plate members P2-C and P2-B are connected via a bent line θ23, and plate members P2-B and P2-E are connected via a bent line θ24. Plate members P1-B and Pd-B are connected via a bent line θ15, and plate members P2-B and Pd-B are connected via a bent line θ25. In addition, plate members Pd-A and Pd-C are connected via a broken line θ31, plate members Pd-C and Pd-B are connected via a broken line θ32, plate members Pd-B and Ph-B are connected via a broken line θ33, plate members Ph-B and Ph-C are connected via a broken line θ34, and plate members Ph-C and Ph-A are connected via a broken line θ35.

[0055] In this embodiment, the fold lines θ11 and θ21 are mountain folds, and the fold lines other than the fold lines θ11 and θ21 are valley folds. Here, the valley folds are fold lines for bending the plate members on both ends of the fold line in the +Zs direction, which is the front side in the figure, around the fold line when forming the holding material H from the flat plate members HH. Also, the mountain folds are fold lines for bending the plate members on both ends of the fold line in the -Zs direction, which is the back side in the figure, around the fold line when forming the holding material H from the flat plate members HH.

[0056] 4, an opening K1-D is formed in the plate member P1-D, an opening K1-A is formed in the plate member P1-A, an opening K1-B is formed in the plate member P1-B, and a protrusion T1-E is formed in the plate member P1-E. Also, an opening K2-D is formed in the plate member P2-D, an opening K2-A is formed in the plate member P2-A, an opening K2-B is formed in the plate member P2-E, and a protrusion T2-E is formed in the plate member P2-E. Furthermore, the plate member Pd-A has openings K3-A, K4-A, and Kd-G, the plate member Pd-B has openings K3-B and K4-B, the plate member Pd-B has openings Kd1-F, Kd2-F, and Kh-H on the broken line θ33 that is the boundary between the plate members Pd-B and Ph-B, the plate member Ph-B has openings Kh1-B, Kh2-B, Kh1-E, and Kh2-E, and the plate member Ph-A has openings Kh1-A, Kh2-A, protrusions Th1-D, and Th2-D. The plate member Pd-A has a protrusion Td-H that protrudes in the +Ys direction in FIG. 4, and the plate member Ph-A has protrusions Th-G, Th1-F, and Th2-F that protrude in the -Ys direction in FIG. 4.

[0057] Then, by bending the flat plate member HH in mountain folds along the fold lines θ11 and θ21, and also by bending the flat plate member HH in valley folds along the fold lines θ12 to θ15, θ22 to θ25, and θ31 to θ35, the protrusion Th1-D is fitted into the opening K1-D, the protrusion Th2-D is fitted into the opening K2-D, the protrusion T1-E is fitted into the opening Kh1-E, the protrusion T2-E is fitted into the opening Kh2-E, the protrusion Th1-F is fitted into the opening Kd1-F, the protrusion Th2-F is fitted into the opening Kd2-F, the protrusion Th-G is fitted into the opening Kd-G, and the protrusion Td-H is fitted into the opening Kh-H. Furthermore, when the flat plate member HH is bent along the bending lines θ11 to θ35, the buffer block R1 is fitted into the openings K1-A and K1-B so that the buffer block R1 is held between the plate members P1-A and P1-B, the buffer block R2 is fitted into the openings K2-A and K2-B so that the buffer block R2 is held between the plate members P2-A and P2-B, and the buffer block R3 is fitted into the openings K3-A and K3-B so that the buffer block R3 is held between the plate members Pd-A and Pd-B. The buffer block R4 is fitted into the opening K4-A and the opening K4-B so that the buffer block R4 is held between the plate members Pd-A and Pd-B, the buffer block Rh1 is fitted into the opening Kh1-A and the opening Kh1-B so that the buffer block Rh1 is held between the plate members Ph-A and Ph-B, and the buffer block Rh2 is fitted into the opening Kh2-A and the opening Kh2-B so that the buffer block Rh2 is held between the plate members Ph-A and Ph-B.

[0058] In this embodiment, the buffer blocks R3 and R4 are made of the same material as the buffer block R1. Similarly to the buffer blocks R1 and R2, the buffer blocks R3 and R4 are formed in a shape that prevents the buffer blocks R3 and R4 from being mixed up with the buffer blocks Rh1 and Rh2 when manufacturing the buffer material S. In this embodiment, the buffer blocks R3 and R4 have a different shape from the buffer blocks R1 and R2, but may have a similar shape to the buffer blocks R1 and R2.

[0059] <<1.4. Reference example 1>> FIG. 5 is a cross-sectional view showing an example of a cross section of the cushioning material SV according to Reference Example 1. As shown in FIG.

[0060] As illustrated in Figure 5, the cushioning material SV of reference example 1 differs from the cushioning material S of the first embodiment in that it has a retaining material HV instead of a retaining material H, and has multiple buffer blocks RV instead of multiple buffer blocks R. Here, the holding material HV differs from the holding material H according to the first embodiment in that it includes plate-shaped portions PV1, PV2, and PhV instead of plate-shaped portions P1, P2, and Ph. The multiple buffer blocks RV provided on the buffer material SV include buffer block RV1, buffer block RV2, buffer block RhV1, and buffer block RhV2.

[0061] In Reference Example 1, the buffer block RV is formed of the same material as the buffer block R according to the first embodiment. Also, in Reference Example 1, the buffer block RV is attached to the holding material HV with an adhesive.

[0062] As described above, in Reference Example 1, the buffer block RV is attached to the holding material HV with adhesive. Therefore, in Reference Example 1, when disassembling the buffer material SV, it is time-consuming to remove the buffer block RV from the holding material HV. Furthermore, in Reference Example 1, when disassembling the buffer material SV, it is difficult to completely remove the buffer block RV from the holding material HV, and even after disassembling the buffer material SV, a portion of the buffer block RV may remain attached to the plate-shaped portion PhV. Therefore, in Reference Example 1, if the buffer block RV is formed of a material different from the holding material HV, the recyclability of the buffer material SV will be low.

[0063] In contrast, according to this embodiment, the buffer block R is attached to the holding material H without using adhesive. Therefore, according to this embodiment, it is possible to reduce the effort required to remove the buffer block R from the holding material H when disassembling the buffer material S, compared to Reference Example 1. Furthermore, according to this embodiment, it is easier to completely remove the buffer block R from the holding material H when disassembling the buffer material S, compared to Reference Example 1, and therefore it is possible to increase the recyclability of the buffer material S.

[0064] Furthermore, when an external force is buffered by the buffer material SV as in Reference Example 1, the external force applied to the electronic device 100 is buffered not only by the buffer block RV but also by the holding material HV. Therefore, in Reference Example 1, to achieve effective buffering of the external force by the buffer material SV, it is necessary to consider not only the buffering of the external force applied to the electronic device 100 by the buffer block RV, but also the buffering of the external force applied to the electronic device 100 by the holding material HV. That is, in Reference Example 1, it is difficult to accurately suppress the external force applied to the electronic device 100 by the buffer material SV.

[0065] In contrast, according to this embodiment, when an external force is buffered by the buffer material S, the external force applied to the electronic device 100 is buffered only by the buffer block R. Therefore, in this embodiment, in order to achieve effective buffering of the external force by the buffer material S, it is only necessary to consider the buffering of the external force applied to the electronic device 100 by the buffer block R, which makes it easier to design the buffer material S compared to Reference Example 1.

[0066] <<1.5. Conclusion of the First Embodiment>> As described above, the cushioning material S according to this embodiment is a cushioning material S that is housed in a packaging box 2 that can house an electronic device 100, and that cushions external forces acting on the electronic device 100 housed in the packaging box 2, and includes a holding material H that has a plate member P1-A formed therein that faces the electronic device 100 when the cushioning material S and the electronic device 100 are housed in the packaging box 2, and an opening K1-A, and a plate member P1-B that faces the inner wall surface of the packaging box 2 when the cushioning material S and the electronic device 100 are housed in the packaging box 2; and a cushioning block held by the holding material H between the plate member P1-A and the plate member P1-B. The buffer block R1 comprises a buffer portion QA that protrudes from the opening K1-A in the +Xs direction from the plate member P1-A toward the electronic device 100 and is capable of contacting the electronic device 100, a buffer portion QB that protrudes from the opening K1-B in the -Xs direction from the plate member P1-B toward the inner wall surface of the packaging box 2 and is capable of contacting the inner wall surface of the packaging box 2, and a connection portion QC that is provided between the plate members P1-A and P1-B and connects the buffer portion QA and the buffer portion QB, and the connection portion QC is longer than the opening K1-A and the opening K1-B in the +Zs direction that intersects the +Xs direction and the -Xs direction.

[0067] Therefore, in this embodiment, it is possible to prevent the buffer block R1 from falling off in the +Xs direction from the opening K1-A, and it is also possible to prevent the buffer block R1 from falling off in the -Xs direction from the opening K1-B. Therefore, in this embodiment, the buffer block R1 maintains a state in which it can buffer external forces applied to the electronic device 100, and it is possible to reduce the possibility that the buffer block R1 will become unable to protect the electronic device 100. Furthermore, in this embodiment, it is possible to hold the buffer block R1 between the plate members P1-A and P1-B with the holding material H without using adhesive.

[0068] In addition, in this embodiment, the retaining material H is characterized by having a plate member P1-C that connects the plate members P1-A and P1-B, and in the +Xs direction, the width of the buffer block R1 is larger than the width of the plate member P1-C.

[0069] Therefore, in this embodiment, even if an external force is applied to the packaging box 2, the external force can be buffered by the buffer block R1, and the external force transmitted to the electronic device 100 can be weakened.

[0070] Furthermore, the cushioning material S according to this embodiment includes a cushioning block Rh1, and the holding material H has an opening Kh1-A formed therein and a plate member Ph-A that faces the electronic device 100 when the cushioning material S and the electronic device 100 are housed in the packaging box 2, and an opening Kh1-B formed therein and a plate member Ph-B that faces the inner wall surface of the packaging box 2 when the cushioning material S and the electronic device 100 are housed in the packaging box 2, and the cushioning block Rh1 has a cushioning portion Qh-A that protrudes from the opening Kh1-A in the +Zs direction from the plate member Ph-A toward the electronic device 100 and can come into contact with the electronic device 100, and an opening Kh1-B that protrudes from the plate member Ph-A in the -Zs direction from the plate member Ph-B toward the inner wall surface of the packaging box 2. B and capable of contacting the inner wall surface of the packaging box 2, and a connecting portion Qh-C provided between the plate members Ph-A and Ph-B and connecting the buffer portion Qh-A and the buffer portion Qh-B, wherein the connecting portion Qh-C is longer than the openings Kh1-A and Kh1-B in the +Xs direction intersecting the +Zs direction and the -Zs direction, and at least one of the length LQ-A of the buffer portion QA in the +Zs direction and the length LQ-B of the buffer portion QB in the +Zs direction is longer than the length HK-A of the opening Kh1-A in the +Xs direction and is longer than the length HK-B of the opening Kh1-B in the +Xs direction.

[0071] Therefore, in this embodiment, it is possible to prevent the buffer block R1 from being mistakenly placed between the plate member Ph-A and the plate member Ph-B instead of the buffer block Rh1. In other words, in this embodiment, it is possible to prevent the buffer block Rh1 from being mistakenly placed for the buffer block R1 when manufacturing the buffer material S.

[0072] Furthermore, the cushioning material S according to this embodiment includes a cushioning block Rh1, and the holding material H includes a plate member P1-C that connects the plate members P1-A and P1-B, a plate member Ph-A that has an opening Kh1-A formed therein and faces the electronic device 100 when the cushioning material S and the electronic device 100 are housed in the packaging box 2, and a plate member Ph-B that has an opening Kh1-B formed therein and faces the inner wall surface of the packaging box 2 when the cushioning material S and the electronic device 100 are housed in the packaging box 2, and the cushioning block Rh1 includes a cushioning portion Qh-A that protrudes from the opening Kh1-A in the +Zs direction from the plate member Ph-A toward the electronic device 100 and is capable of coming into contact with the electronic device 100, and a cushioning portion that protrudes from the opening Kh1-B in the -Zs direction from the plate member Ph-B toward the inner wall surface of the packaging box 2 and is capable of coming into contact with the inner wall surface of the packaging box 2. and a connecting portion Qh-C provided between the plate members Ph-A and Ph-B and connecting the buffer portion Qh-A and the buffer portion Qh-B, wherein the connecting portion Qh-C is longer than the openings Kh1-A and Kh1-B in the +Xs direction which intersects with the +Zs direction and the -Zs direction, and at least one of the length HQ-At2 in the +Xs direction from the end of the connecting portion Qh-C in the +Xs direction to the opening Kh1-A and the length HQ-Bt2 in the +Xs direction from the end of the connecting portion Qh-C in the +Xs direction to the opening Kh1-B is longer than the length LQ-At in the +Zs direction from the plate member P1-C to the opening K1-A and is longer than the length LQ-Bt in the +Zs direction from the plate member P1-C to the opening K1-B.

[0073] For this reason, in this embodiment, it is possible to prevent the buffer block Rh1 from being mistakenly placed between the plate members P1-A and P1-B instead of the buffer block R1. In other words, in this embodiment, it is possible to prevent the buffer block Rh1 from being mistaken for the buffer block R1 when manufacturing the buffer material S.

[0074] <<2. Second Embodiment>> A second embodiment of the present invention will be described below. Note that, in each of the following exemplary embodiments, for elements whose actions and functions are similar to those of the first embodiment, the reference numerals used in the description of the first embodiment will be used and detailed descriptions of each element will be omitted as appropriate.

[0075] <<2.1. Overview of cushioning materials>> The cushioning material SJ according to this embodiment will be described below with reference to FIGS.

[0076] Fig. 6 is a perspective view showing an example of the configuration of a cushioning material SJ used in a packaging material according to the second embodiment. Fig. 7 is a cross-sectional view showing an example of a cross section of the cushioning material SJ when the cushioning material SJ is cut along line Ee in Fig. 6. The packaging material according to the second embodiment is similar to the packaging material 1 according to the first embodiment, except that it includes a cushioning material SJ instead of the cushioning material S.

[0077] 6, the cushioning material SJ differs from the cushioning material S according to the first embodiment in that it includes buffer blocks RJ1, RJ2, RJ3, and RJ4 instead of buffer blocks R1, R2, R3, and R4. Note that hereinafter, buffer blocks RJ1, RJ2, RJ3, and RJ4 may be collectively referred to as buffer blocks RJ.

[0078] In this embodiment, it is assumed, as an example, that buffer blocks RJ1, RJ2, RJ3, and RJ4 have the same shape. However, the present invention is not limited to this example, and among the multiple buffer blocks RJ provided in the buffer material SJ, some of the buffer blocks RJ may have a different shape from the other buffer blocks RJ. Also, in this embodiment, it is assumed, as an example, that the buffer blocks RJ are formed from the same material as the buffer blocks R in the first embodiment described above.

[0079] The buffer block RJ will be described below with reference to FIGS. 6 and 7, taking the buffer block RJ1 as an example.

[0080] In this embodiment, buffer block RJ1 differs from buffer block R1 in that it includes buffer portion QJ-A instead of buffer portion QA and buffer portion QJ-B instead of buffer portion QB. Note that buffer block RJ1 is another example of a "first buffer block."

[0081] The buffer portion QJ-A provided in the buffer block RJ1 comes into contact with the electronic device 100 when the electronic device 100 and the buffer material SJ are housed in the packaging box 2. In this embodiment, the buffer portion QJ-A provided in the buffer block RJ1 includes a plurality of buffer sheets JA stacked in the +Ys direction. The buffer portion QJ-A provided in the buffer block RJ1 is another example of a "first buffer portion." As described above, the +Zw direction and the -Zw direction are parallel to the +Zs direction and the -Zs direction. The +Ys direction intersects with the +Zs direction. Therefore, the +Ys direction intersects with the -Zw direction, which is the direction in which the electronic device 100 and the cushioning material SJ are inserted into the packaging box 2, and also intersects with the +Zw direction, which is the direction in which the electronic device 100 and the cushioning material SJ are removed from the packaging box 2.

[0082] In this embodiment, the buffer sheet JA has a so-called "vertically elongated shape" in which the length in the +Zs direction is longer than the lengths in the +Xs direction and the +Ys direction. The buffer sheet JA also has an inclined surface SL-A. In this embodiment, in the buffer sheet JA provided in the buffer block RJ1, the inclined surface SL-A is a plane whose normal direction is between the +Xs direction and the +Zs direction.

[0083] Furthermore, the buffer portion QJ-B provided in the buffer block RJ1 comes into contact with the inner wall surface of the packing box 2 when the electronic device 100 and the buffer material SJ are housed in the packing box 2. The buffer portion QJ-B provided in the buffer block RJ1 is another example of a "second buffer portion." In this embodiment, the buffer portion QJ-B provided in the buffer block RJ1 includes a plurality of buffer sheets JB stacked in the +Ys direction.

[0084] In this embodiment, the buffer sheet JB has a so-called "vertically elongated shape" in which the length in the +Zs direction is longer than the lengths in the +Xs direction and the +Ys direction. The buffer sheet JB also has an inclined surface SL-B. In this embodiment, the inclined surface SL-B of the buffer sheet JB provided in the buffer block RJ1 is a plane whose normal direction is between the -Xs direction and the +Zs direction.

[0085] In this embodiment, buffer blocks RJ2, RJ3, and RJ4 each include a buffer portion QJ-A including multiple buffer sheets JA, a buffer portion QJ-B including multiple buffer sheets JB, and a connection portion QC, similar to buffer block RJ1. Of these, buffer block RJ2 has a buffer portion QJ-A composed of multiple buffer sheets JA stacked in the +Ys direction, and a buffer portion QJ-B composed of multiple buffer sheets JB stacked in the +Ys direction. Furthermore, buffer blocks RJ3 and RJ4 have a buffer portion QJ-A composed of multiple buffer sheets JA stacked in the +Xs direction, and a buffer portion QJ-B composed of multiple buffer sheets JB stacked in the +Xs direction. The +Xs direction is a direction that intersects with the -Zw direction, which is the direction in which the electronic device 100 and cushioning material SJ are inserted into the packaging box 2, and is also a direction that intersects with the +Zw direction, which is the direction in which the electronic device 100 and cushioning material SJ are removed from the packaging box 2.

[0086] <<2.2.Reference example 2>> Hereinafter, the cushioning material SW according to Reference Example 2 will be described with reference to FIGS.

[0087] Fig. 8 is a perspective view showing an example of the configuration of cushioning material SW used in the packaging material according to Reference Example 2. Fig. 9 is a cross-sectional view showing an example of the cross section of cushioning material SW when the cushioning material SW is cut along line Ee in Fig. 8. The packaging material according to Reference Example 2 differs from the packaging material according to the second embodiment in that it includes cushioning material SW instead of cushioning material SJ.

[0088] 8, the buffer material SW differs from the buffer material SJ according to the second embodiment in that it includes buffer blocks RW1, RW2, RW3, and RW4 instead of buffer blocks RJ1, RJ2, RJ3, and RJ4. Hereinafter, buffer blocks RW1, RW2, RW3, and RW4 may be collectively referred to as buffer blocks RW. In addition, in Reference Example 2, it is assumed as an example that buffer blocks RW1, RW2, RW3, and RW4 have the same shape.

[0089] The buffer block RW will be described below with reference to FIGS. 8 and 9, taking the buffer block RW1 as an example.

[0090] In this embodiment, buffer block RW1 differs from buffer block RJ1 in that it includes buffer portion QW-A instead of buffer portion QJ-A and buffer portion QW-B instead of buffer portion QJ-B.

[0091] The buffer portion QW-A provided in the buffer block RW1 comes into contact with the electronic device 100 when the electronic device 100 and the buffer material SW are housed in the packaging box 2. In this embodiment, the buffer portion QW-A provided in the buffer block RW1 includes a plurality of buffer sheets WA stacked in the +Zs direction. In this embodiment, the buffer sheets WA provided in the buffer block RW1 have a so-called "horizontally elongated shape" in which the length in the +Ys direction is longer than the length in the +Xs direction and the length in the +Zs direction.

[0092] The buffer portion QW-B provided in the buffer block RW1 comes into contact with the inner wall surface of the packing box 2 when the electronic device 100 and the buffer material SW are housed in the packing box 2. In this embodiment, the buffer portion QW-B provided in the buffer block RW1 includes a plurality of buffer sheets WB stacked in the +Zs direction. In this embodiment, the buffer sheets WB provided in the buffer block RW1 have a so-called "horizontally elongated shape" in which the length in the +Ys direction is longer than the lengths in the +Xs direction and the +Zs direction.

[0093] In addition, in reference example 2, each of buffer blocks RW2, RW3, and RW4, like buffer block RW1, has a buffer portion QW-A having a plurality of buffer sheets WA stacked in the +Zs direction, a buffer portion QW-B having a plurality of buffer sheets WB stacked in the +Zs direction, and a connection portion QC.

[0094] As shown in FIG. 9 , when inserting the electronic device 100 into the packaging material according to Reference Example 2, the electronic device 100 moving in the −Zs direction comes into contact with the buffer portion QW-A of the buffer block RW provided in the buffer material SW of the packaging material according to Reference Example 2. As a result, as shown in region Ar1 of FIG. 9 , the electronic device 100 may ride up onto the +Zs-side end of the buffer portion QW-A, making it impossible to fit the electronic device 100 into the packaging material. Furthermore, as shown in region Ar2 of FIG. 9 , the electronic device 100 moving in the −Zs direction applies a strong force to the buffer sheet WA located at the +Zs-side end of the buffer portion QW-A, which may cause the buffer sheet WA to peel off from the buffer block RW. Furthermore, when inserting the buffer material SW into the packaging box 2, friction generated between the packaging box 2 and the buffer material SW may cause some of the multiple buffer sheets WB constituting the buffer portion QW-B of the buffer block RW to peel off from the buffer block RW.

[0095] In contrast, according to the present embodiment, when inserting the electronic device 100 into the packaging material, the electronic device 100 moving in the -Zs direction comes into contact with the buffer portion QJ-A of the buffer block RJ provided in the buffer material SJ of the packaging material according to the second embodiment. Each buffer sheet JA constituting the buffer portion QJ-A has an inclined surface SL-A at its end in the +Zs direction. Therefore, according to the present embodiment, compared to Reference Example 2, the possibility that the electronic device 100 moving in the -Zs direction will run over the +Zs side end of the buffer portion QJ-A can be reduced. Furthermore, according to the present embodiment, the buffer portion QJ-A includes a buffer sheet JA with its longitudinal direction in the +Zs direction, rather than a buffer sheet WA with its longitudinal direction in the +Ys direction. Therefore, according to the present embodiment, the possibility that the buffer sheet JA will peel off from the buffer block RJ due to the influence of the electronic device 100 moving in the -Zs direction can be reduced compared to Reference Example 2. Furthermore, according to the present embodiment, the buffer portion QJ-B includes a buffer sheet JB with its longitudinal direction in the +Zs direction, rather than a buffer sheet WB with its longitudinal direction in the +Ys direction. Therefore, according to this embodiment, compared to reference example 2, the possibility of the buffer sheet JB peeling off from the buffer block RJ due to the friction generated between the packaging box 2 and the buffer material SJ can be reduced.

[0096] <<2.3. Conclusion of the Second Embodiment>> As described above, the packaging material of this embodiment comprises a packaging box 2 capable of containing an electronic device 100, and a cushioning material SJ that is contained in the packaging box 2 and comes into contact with the electronic device 100 contained in the packaging box 2 to cushion external forces applied to the electronic device 100, and is characterized in that the cushioning material SJ includes a plurality of cushioning sheets JA stacked along the +Ys direction that intersects with the -Zs direction, which is the direction in which the electronic device 100 is inserted into the packaging box 2.

[0097] Therefore, in this embodiment, the possibility that the buffer sheet JA will peel off from the buffer material SJ can be reduced compared to an embodiment in which the buffer sheet JA is stacked along the +Zs direction.

[0098] Furthermore, the packaging material according to this embodiment is characterized in that the buffer sheet JA has an inclined surface SL-A at its end in the +Zs direction opposite to the -Zs direction.

[0099] Therefore, in this embodiment, it is possible to reduce the possibility that the electronic device 100 will ride up on the end of the buffer sheet JA in the +Zs direction.

[0100] Furthermore, in the packaging material according to this embodiment, the cushioning material SJ includes a plate member P1-A having an opening K1-A formed therein and facing the electronic device 100 when the cushioning material SJ and the electronic device 100 are housed in the packaging box 2, and a holding material H having a plate member P1-B having an opening K1-B formed therein and facing the inner wall surface of the packaging box 2 when the cushioning material SJ and the electronic device 100 are housed in the packaging box 2, and a buffer block RJ1 held by the holding material H between the plate member P1-A and the plate member P1-B, and the buffer block RJ1 is made up of a plurality of buffer sheets JA, and the plate member a buffer portion QJ-A that protrudes from the opening K1-A in the +Xs direction from the plate member P1-A toward the electronic device 100 and is capable of contacting the electronic device 100; a buffer portion QJ-B that protrudes from the opening K1-B in the -Xs direction from the plate member P1-B toward the inner wall surface of the packaging box 2 and is capable of contacting the inner wall surface of the packaging box 2; and a connection portion QC that is provided between the plate members P1-A and P1-B and connects the buffer portion QJ-A and the buffer portion QJ-B, and the connection portion QC is longer than the opening K1-A and the opening K1-B in the +Zs direction that intersects the +Xs direction and the -Xs direction.

[0101] Therefore, in this embodiment, it is possible to prevent the buffer block RJ1 from falling off in the +Xs direction from the opening K1-A, and it is also possible to prevent the buffer block RJ1 from falling off in the -Xs direction from the opening K1-B. Also, in this embodiment, it is possible to hold the buffer block RJ1 between the plate members P1-A and P1-B by the holding material H without using adhesive.

[0102] In addition, in this embodiment, the retaining material H is characterized by having a plate member P1-C that connects the plate members P1-A and P1-B, and the width of the buffer block RJ1 in the +Xs direction is larger than the width of the plate member P1-C.

[0103] Therefore, in this embodiment, even if an external force is applied to the packaging box 2, the external force can be buffered by the buffer block RJ1, and the external force transmitted to the electronic device 100 can be weakened.

[0104] In this embodiment, the cushioning material SJ includes a cushioning block Rh1, and the holding material H includes a plate member Ph-A having an opening Kh1-A formed therein and facing the electronic device 100 when the cushioning material SJ and the electronic device 100 are housed in the packaging box 2, and an opening Kh1-B formed therein and facing the inner wall surface of the packaging box 2 when the cushioning material SJ and the electronic device 100 are housed in the packaging box 2. The cushioning block Rh1 includes a cushioning portion Qh-A that protrudes from the opening Kh1-A in the +Zs direction from the plate member Ph-A toward the electronic device 100 and can come into contact with the electronic device 100, and an opening Kh1-B that protrudes from the plate member Ph-A in the -Zs direction from the plate member Ph-B toward the inner wall surface of the packaging box 2. B and capable of contacting the inner wall surface of the packaging box 2, and a connecting portion Qh-C provided between the plate members Ph-A and Ph-B and connecting the buffer portion Qh-A and the buffer portion Qh-B, wherein the connecting portion Qh-C is longer than the openings Kh1-A and Kh1-B in the +Xs direction intersecting the +Zs direction and the -Zs direction, and at least one of the length LQ-A of the buffer portion QJ-A in the +Zs direction and the length LQ-B of the buffer portion QJ-B in the +Zs direction is longer than the length HK-A of the opening Kh1-A in the +Xs direction and is longer than the length HK-B of the opening Kh1-B in the +Xs direction.

[0105] For this reason, in this embodiment, it is possible to prevent the buffer block RJ1 from being mistakenly placed between the plate member Ph-A and the plate member Ph-B instead of the buffer block Rh1. In other words, in this embodiment, it is possible to prevent the buffer block Rh1 from being mistaken for the buffer block RJ1 when manufacturing the buffer material SJ.

[0106] Moreover, in this embodiment, the cushioning material SJ includes a cushioning block Rh1, and the holding material H includes a plate member P1-C that connects the plate members P1-A and P1-B, a plate member Ph-A that has an opening Kh1-A formed therein and that faces the electronic device 100 when the cushioning material SJ and the electronic device 100 are housed in the packaging box 2, and a plate member Ph-B that has an opening Kh1-B formed therein and that faces the inner wall surface of the packaging box 2 when the cushioning material SJ and the electronic device 100 are housed in the packaging box 2, and the cushioning block Rh1 includes a cushioning portion Qh-A that protrudes from the opening Kh1-A in the +Zs direction from the plate member Ph-A toward the electronic device 100 and is capable of coming into contact with the electronic device 100, and a cushioning portion Qh-B that protrudes from the opening Kh1-B in the -Zs direction from the plate member Ph-B toward the inner wall surface of the packaging box 2 and is capable of coming into contact with the inner wall surface of the packaging box 2. The plate member P1-C includes a buffer portion Qh-B and a connecting portion Qh-C provided between the plate members Ph-A and Ph-B and connecting the buffer portion Qh-A and the buffer portion Qh-B, wherein the connecting portion Qh-C is longer than the openings Kh1-A and Kh1-B in the +Xs direction which intersects with the +Zs direction and the -Zs direction, and at least one of the length HQ-At2 in the +Xs direction from the end of the connecting portion Qh-C in the +Xs direction to the opening Kh1-A and the length HQ-Bt2 in the +Xs direction from the end of the connecting portion Qh-C in the +Xs direction to the opening Kh1-B is longer than the length LQ-At in the +Zs direction from the plate member P1-C to the opening K1-A and is longer than the length LQ-Bt in the +Zs direction from the plate member P1-C to the opening K1-B.

[0107] For this reason, in this embodiment, it is possible to prevent the buffer block Rh1 from being mistakenly placed between the plate members P1-A and P1-B instead of the buffer block RJ1. In other words, in this embodiment, it is possible to prevent the buffer block Rh1 from being mistaken for the buffer block RJ1 when manufacturing the buffer material SJ.

[0108] <<3. Modifications>> Each of the above embodiments can be modified in various ways. Specific modified embodiments are exemplified below. Two or more embodiments arbitrarily selected from the following examples can be combined as appropriate within a range that does not contradict each other. In the modified examples exemplified below, elements whose actions and functions are equivalent to those of the embodiments will be designated by the same reference numerals as in the above description, and detailed descriptions of each will be omitted as appropriate.

[0109] <<3.1. Variation 1>> In the second embodiment described above, the buffer block RJ includes a buffer portion QJ-A made up of multiple buffer sheets JA, a buffer portion QJ-B made up of multiple buffer sheets JB, and a connection portion QC. However, the present invention is not limited to this configuration. That is, the buffer block RJ may include at least the buffer portion QJ-A. For example, the buffer block RJ may include a buffer portion QB instead of the buffer portion QJ-B.

[0110] <<3.2. Variation 2>> In the first and second embodiments and Modification 1 described above, the Xw-axis, Yw-axis, and Zw-axis of the packing box coordinate system ΣW are perpendicular to each other, but the present invention is not limited to this. The Xw-axis, Yw-axis, and Zw-axis of the packing box coordinate system ΣW may extend in different directions. In the first and second embodiments and Modification 1 described above, the Xs, Ys, and Zs axes of the buffer material coordinate system ΣS are perpendicular to one another, but the present invention is not limited to this. The Xs, Ys, and Zs axes of the buffer material coordinate system ΣS may extend in different directions.

[0111] <<3.3. Variation 3>> In the above-described first and second embodiments and modifications 1 and 2, the packaging material has four cushioning materials S or SJ, but the present invention is not limited to such an embodiment. The packaging material according to the present invention may have one to three cushioning materials S or SJ, or may have five or more cushioning materials S or SJ. [Explanation of symbols]

[0112] 1...packaging material, 2...packaging box, 100...electronic device, H...holding material, P...plate-shaped portion, P1...plate-shaped portion, P1-A...plate member, P1-B...plate member, P1-C...plate member, Ph...plate-shaped portion, Ph-A...plate member, Ph-B...plate member, QA...buffer portion, QB...buffer portion, QC...connection portion, R...buffer block, R1...buffer block, Rh1...buffer block, S...buffer material.

Claims

1. a packaging box capable of accommodating electronic devices; The electronic device is housed in the packaging box and comes into contact with the electronic device housed in the packaging box. a buffer material that buffers external forces applied to the Equipped with The buffer material is The electronic devices are stacked in a direction intersecting an insertion direction, which is a direction in which the electronic devices are inserted into the packaging box. a plurality of layered buffer sheets; The buffer material is a first opening is formed, and when the cushioning material and the electronic device are housed in the packaging box, a first plate facing the electronic device; and a second opening is formed, and when the cushioning material and the electronic device are housed in the packaging box, a second plate facing the inner wall surface of the packaging box; A retaining material comprising: a first buffer block held by the holding material between the first plate and the second plate; Equipped with The first buffer block is The buffer sheets are composed of the plurality of buffer sheets, a first plate extending from the first opening in a first direction toward the electronic device; a first buffer portion capable of contacting the vessel; a second plate protruding from the second opening in a second direction toward an inner wall surface of the packaging box; a second buffer portion that can come into contact with an inner wall surface of the packaging box; The first buffer portion and the second buffer portion are provided between the first plate and the second plate. a first connection portion for connecting; Equipped with The first connection portion is In a first holding direction that intersects the first direction and the second direction, the first opening and the front longer than the second opening; A packaging material characterized by:

2. The buffer sheet is an inclined surface is provided at an end portion in a removal direction opposite to the insertion direction; 2. The packaging material according to claim 1 .

3. The retaining material is a first connecting plate that connects the first plate and the second plate; In the first direction, The width of the first buffer block is greater than the width of the first connecting plate. The cushioning material according to claim 1 or 2, characterized in that

4. The buffer material is a second buffer block; The retaining material is a third opening is formed, and when the cushioning material and the electronic device are housed in the packaging box, a third plate facing the electronic device; a fourth opening is formed, and when the cushioning material and the electronic device are housed in the packaging box, a fourth plate facing the inner wall surface of the packaging box; Equipped with The second buffer block is a third plate protruding from the third opening in a third direction toward the electronic device, a third buffer portion capable of contacting the vessel; a fourth plate protruding from the fourth opening in a fourth direction toward an inner wall surface of the packaging box; a fourth buffer portion that can come into contact with an inner wall surface of the packaging box; The third buffer portion and the fourth buffer portion are provided between the third plate and the fourth plate. a second connection portion for connecting the Equipped with The second connection portion is In a second holding direction that intersects with the third direction and the fourth direction, the third opening and the front longer than the fourth opening, The length of the first buffer portion in the first holding direction, and At least one of the lengths of the second buffer portion in the first holding direction is The length of the third opening in the second holding direction is longer than the length of the third opening in the second holding direction, and a length longer than the length of the fourth opening in the second holding direction; The cushioning material according to any one of claims 1 to 3, characterized in that

5. The buffer material is a second buffer block; The retaining material is a first connecting plate connecting the first plate and the second plate; a third opening is formed, and when the cushioning material and the electronic device are housed in the packaging box, a third plate facing the electronic device; a fourth opening is formed, and when the cushioning material and the electronic device are housed in the packaging box, a fourth plate facing the inner wall surface of the packaging box; Equipped with The second buffer block is a third plate protruding from the third opening in a third direction toward the electronic device, a third buffer portion capable of contacting the vessel; a fourth plate protruding from the fourth opening in a fourth direction toward an inner wall surface of the packaging box; a fourth buffer portion that can come into contact with an inner wall surface of the packaging box; The third buffer portion and the fourth buffer portion are provided between the third plate and the fourth plate. a second connection portion for connecting the Equipped with The second connection portion is In a second holding direction that intersects with the third direction and the fourth direction, the third opening and the front longer than the fourth opening, The second holding portion extends from an end of the second connection portion in the second holding direction to the third opening. Length in the holding direction, and The second holding portion extends from an end of the second connection portion in the second holding direction to the fourth opening. At least one of the lengths in the holding direction is a length from the first connecting plate to the first opening in the first holding direction, and 1, a length from the first connecting plate to the second opening in the first holding direction, The cushioning material according to any one of claims 1 to 4, characterized in that

6. Electronic devices and a packaging box capable of housing the electronic device; The electronic device is housed in the packaging box and comes into contact with the electronic device housed in the packaging box. a cushioning material that cushions external forces applied to the electronic device housed in the packaging box; Equipped with The buffer material is The electronic devices are stacked in a direction intersecting an insertion direction, which is a direction in which the electronic devices are inserted into the packaging box. a plurality of layered buffer sheets; The buffer material is a first opening is formed, and when the cushioning material and the electronic device are housed in the packaging box, a first plate facing the electronic device; and a second opening is formed, and when the cushioning material and the electronic device are housed in the packaging box, a second plate facing the inner wall surface of the packaging box; A retaining material comprising: a first buffer block held by the holding material between the first plate and the second plate; Equipped with The first buffer block is The buffer sheets are composed of the plurality of buffer sheets, a first plate extending from the first opening in a first direction toward the electronic device; a first buffer portion capable of contacting the vessel; a second plate protruding from the second opening in a second direction toward an inner wall surface of the packaging box; a second buffer portion that can come into contact with an inner wall surface of the packaging box; The first buffer portion and the second buffer portion are provided between the first plate and the second plate. a first connection portion for connecting; Equipped with The first connection portion is In a first holding direction that intersects the first direction and the second direction, the first opening and the front longer than the second opening; A package characterized by:

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