Support mechanism, method, program, and non-transitory recording medium

Abstract

To make it possible to determine if the size of a support table mounted on a table base is appropriate without increasing the manufacturing cost of a support mechanism.SOLUTION: By referring to information on the temperature of the support table obtained on the basis of the temperature of the support table measured in a state in which the support table is heated, an alert is issued when the size of this support table is inappropriate. Thereby, it makes it possible to determine whether the support table mounted on the table base is appropriate without providing additional configurations such as photoelectric sensors on a support mechanism, i.e., without increasing the manufacturing cost of the support mechanism.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a support mechanism comprising a table base and a support table attached to the table base, a method for determining whether the size of the support table is appropriate, a program for causing a computer to execute this method, and a non-transitory recording medium on which this program is recorded. [Background technology]

[0002] Chips for devices such as integrated circuits (ICs) are essential components in various electronic devices such as mobile phones and personal computers. These chips are manufactured, for example, by dividing a wafer on which a large number of devices are formed into regions containing individual devices.

[0003] This wafer is often thinned before being divided in order to reduce the size and weight of the chips, etc. One method for thinning the wafer is to grind the back side of the wafer in a grinding device equipped with a chuck table that holds the front side of the wafer by suction and a grinding wheel that includes a plurality of grinding stones that are arranged discretely in an annular shape.

[0004] Furthermore, prior to grinding the backside of the wafer, a protective member such as adhesive tape is often applied to the front side of the wafer. This prevents damage to devices formed on the front side of the wafer during grinding of the backside of the wafer. Such a protective member includes, for example, a flexible film-like tape substrate and an adhesive applied to one side of the tape substrate.

[0005] However, the surface of a wafer often has an uneven shape due to the presence of bumps and the like that function as electrodes included in devices. When a protective member is attached to the surface of such a wafer, there may be areas (gaps) where the protective member and the wafer surface are not attached, and the surface of the protective member may also have an uneven shape.

[0006] If the backside of the wafer is ground in this state, the backside of the wafer may be ground unevenly. That is, the backside of the wafer may become uneven after grinding. Furthermore, when the protective member is removed from the front side of the wafer after grinding, some of the adhesive contained in the protective member may remain as a residue on the front side of the wafer.

[0007] In view of this, a method has been proposed in which a protective member that does not contain an adhesive is provided on the surface of a wafer (see, for example, Patent Document 1). In this method, a protective film is first adhered to the surface of the wafer so as to conform to the uneven shape of the wafer surface. Next, a liquid resin that hardens when subjected to an external stimulus is supplied to the surface side of the wafer through the protective film. Next, an external stimulus is applied to the liquid resin to harden it, thereby forming the protective member. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Publication No. 2018-187695 Summary of the Invention [Problem to be solved by the invention]

[0009] In the above-described method, the protective film may be heated and softened to adhere to the front surface of the wafer so as to conform to the uneven shape of the front surface of the wafer. For example, the protective film may be adhered to the front surface of the wafer by using a support mechanism having a support table on which the back side of the wafer is placed, a table base on which the support table is attached, and a heater for heating the support table.

[0010] Specifically, when the support table attached to the table base is heated by a heater, the wafer placed on its backside on the support table and the protective film placed on the front side of the wafer are also heated. Then, the entire protective film is pressed against the wafer using a pressure roller or the like. This makes it easy to make the protective film adhere to the front surface of the wafer, following the uneven shape of the wafer surface.

[0011] Wafers come in a wide range of sizes. Therefore, a support table of a size appropriate for the size of the wafer to be supported is selected and attached to the table base. However, because the support table is attached to the table base manually, there is a risk that the wafer will be heated if an inappropriate size support table is attached to the table base.

[0012] If a wafer is heated while it is placed on a support table of an inappropriate size, various problems may occur, for example, if a wafer is heated while it is placed on a support table of a size smaller than the appropriate size, the wafer may be damaged.

[0013] Furthermore, if a wafer is heated while it is placed on a support table that is larger than the appropriate size, a large amount of heat is dissipated that does not contribute to heating the wafer, resulting in poor energy efficiency.Furthermore, in a support mechanism that holds the wafer by suction on the surface of the support table, it may become difficult to hold the wafer by suction.

[0014] On the other hand, these problems can be solved by providing the support mechanism with additional components, such as a photoelectric sensor, to determine the size of the support table attached to the table base, but providing such additional components to the support mechanism increases the manufacturing cost of the support mechanism.

[0015] In view of this, an object of the present invention is to make it possible to determine whether the size of a support table attached to a table base is appropriate without increasing the manufacturing cost of the support mechanism. [Means for solving the problem]

[0016] According to one aspect of the present invention, there is provided a support mechanism including a table base, a support table attached to the table base, a heater for heating the support table, a measurement unit for measuring the temperature of the support table, an output unit for outputting information relating to the support table, a control unit for controlling the heater, the measurement unit and the output unit, and an input unit for inputting information relating to the support table to the control unit, wherein the control unit determines a correspondence relationship between information relating to the temperature of the support table when the support table attached to the table base is heated by the heater and a size of the support table, and the information relating to the support table input to the control unit from the input unit. a determination unit that determines the size of the support table actually attached to the table base by referring to information on the temperature of the support table obtained based on the temperature of the support table measured by the measurement unit when the support table actually attached to the table base is heated by the heater and the correspondence stored in the memory unit; and a warning unit that controls the output unit to warn that the size of the support table attached to the table base is inappropriate when the appropriate size of the support table stored in the memory unit differs from the size of the support table determined by the determination unit.

[0017] According to another aspect of the present invention, there is provided a method for determining whether the size of a support table attached to a table base is appropriate, the method comprising: a storage step of storing an appropriate size of the support table to be attached to the table base; a determination step of determining the size of the support table actually attached to the table base by referring to information on the temperature of the support table obtained based on the temperature of the support table measured when the support table actually attached to the table base is heated, and a correspondence between the information on the temperature of the support table when the support table attached to the table base is heated and the size of the support table; and a warning step of issuing a warning that the size of the support table attached to the table base is inappropriate if the appropriate size of the support table stored in the storage step differs from the size of the support table determined in the determination step.

[0018] According to yet another aspect of the present invention, there is provided a program for causing a computer to execute a method for determining whether a size of a support table attached to a table base is appropriate, the program comprising: an output unit for outputting information about the support table; a control unit including a storage device and a central processing unit for controlling the output unit; and an input unit for inputting information about the support table to the control unit, the method including a storage step in which the storage device stores an appropriate size of the support table to be attached to the table base, which is determined based on information about the support table input to the control unit from the input unit; and a step in which the support table actually attached to the table base is measured in a heated state. a determination step in which the central processing unit determines the size of the support table actually attached to the table base by referring to information on the temperature of the support table obtained based on the temperature of the support table that is heated and a correspondence relationship, which is pre-stored in the storage device, between information on the temperature of the support table when the support table attached to the table base is heated and the size of the support table; and a warning step in which, if the appropriate size of the support table stored in the storage device differs from the size of the support table determined by the central processing unit, the central processing unit controls the output unit to warn that the size of the support table attached to the table base is inappropriate.

[0019] The program of the present invention may be recorded on a non-transitory recording medium. [Effects of the Invention]

[0020] In the present invention, a warning can be issued if the size of the support table is inappropriate by referring to information about the temperature of the support table obtained based on the temperature of the support table measured while the support table is heated. This makes it possible to determine whether the support table attached to the table base is appropriate without providing an additional component such as a photoelectric sensor in the support mechanism, i.e., without increasing the manufacturing cost of the support mechanism. [Brief explanation of the drawings]

[0021] [Figure 1] FIG. 1(A) is a perspective view showing a schematic example of a support mechanism having a support table for supporting small-sized wafers, and FIG. 1(B) is a perspective view showing a schematic example of a support mechanism having a support table for supporting large-sized wafers. [Figure 2] FIG. 2 is an exploded perspective view schematically showing an example of a table base. [Figure 3] FIG. 3 is a graph showing a schematic diagram of the change in temperature over time during which the support table is heated. [Figure 4] FIG. 4 is a block diagram schematically showing hardware included in the computer. [Figure 5] FIG. 5 is a block diagram schematically showing functional units included in the control unit. [Figure 6] FIG. 6 is a flowchart that schematically shows an example of a method for determining whether the size of the support table attached to the table base is appropriate. [Figure 7] FIG. 7 is an exploded perspective view schematically showing another example of a support table for supporting small-sized wafers. [Figure 8] FIG. 8 is an exploded perspective view schematically showing another example of a support table for supporting a large-sized wafer. DETAILED DESCRIPTION OF THE INVENTION

[0022] An embodiment of the present invention will be described with reference to the accompanying drawings. Fig. 1(A) is a perspective view showing a typical example of a support mechanism equipped with a support table for supporting small-sized wafers, and Fig. 1(B) is a perspective view showing a typical example of a support mechanism equipped with a support table for supporting large-sized wafers.

[0023] In the support mechanism 2 shown in Fig. 1(A), a support table 4 for supporting a wafer having a diameter of, for example, approximately 200 mm (8 inches) is mounted on a table base 6. The support table 4 has a frame 4a made of silicon carbide (SiC) or the like. The frame 4a has a disk-shaped bottom wall and an annular side wall extending upward from the periphery of the bottom wall.

[0024] Therefore, a recess defined by a bottom wall and side walls exists in the upper part of the frame 4a. A disk-shaped porous plate 4b made of porous silicon carbide and having a diameter roughly the same as the inner diameter of the recess is fixed in this recess. Furthermore, a communication passage (not shown) is formed inside the frame 4a, which communicates with the lower surface of the porous plate 4b and opens at the lower surface of the frame 4a.

[0025] Furthermore, a positioning pin (not shown) is provided on the underside of the frame body 4a to be used for positioning the support table 4 attached to the table base 6. Furthermore, a plurality of screw holes (not shown) are formed on the underside of the frame body 4a. Each screw hole is threadedly engaged with a bolt (not shown) for attaching the support table 4 to the table base 6.

[0026] In the support mechanism 2 shown in Fig. 1(B), a support table 8 for supporting a wafer having a diameter of, for example, approximately 300 mm (12 inches) is attached to the table base 6. This support table 8 has the same structure as the support table 4 shown in Fig. 1(A) except for the size.

[0027] That is, the support table 8 has a frame 8a and a porous plate 8b fixed to a recessed portion present in the upper part of the frame 8a. Furthermore, a communication passage (not shown) is formed inside the support table 8, which communicates with the lower surface of the porous plate 8b and opens at the lower surface of the frame 8a.

[0028] Furthermore, a positioning pin (not shown) used to position the support table 8 attached to the table base 6 is provided on the underside of the frame body 8a, and a plurality of screw holes (not shown) are formed on the underside of the frame body 8a. Each screw hole is threadedly engaged with a bolt (not shown) for attaching the support table 8 to the table base 6.

[0029] 2 is an exploded perspective view showing a typical example of the table base 6 on which the support tables 4 and 8 are mounted. The table base 6 has a cylindrical support pillar 10. A disk-shaped heater base 12 is fixed to the top of the support pillar 10.

[0030] The heater base 12 has a disk-shaped bottom wall 12a and an annular side wall 12b extending upward from the periphery of the bottom wall 12a. Therefore, a recess 12c defined by the bottom wall 12a and the side wall 12b exists in the upper part of the heater base 12. The depth of the recess 12c is 1 mm to 2 mm (e.g., 1.5 mm).

[0031] Furthermore, a plurality of communication passages 12d, each opening on the upper surface of the bottom wall 12a, are formed inside the heater base 12. Each communication passage 12d is connected to a suction source (not shown) such as a vacuum pump via a communication passage (not shown) formed inside the support column 10.

[0032] Furthermore, a through-hole 12e is formed inside the heater base 12. A thermocouple (not shown) included in a measurement unit for measuring the temperatures of the support tables 4 and 8 attached to the table base 6 is passed through this through-hole 12e.

[0033] A plurality of screw holes 12f are formed in the upper surface of the bottom wall 12a. Each screw hole 12f is threadedly fitted with a bolt (not shown) for fixing a gasket 14, a heater 16, and a mount 18 (described later) to the heater base 12.

[0034] A disk-shaped gasket 14 is provided in the recess 12c present in the upper part of the heater base 12. The gasket 14 is made of, for example, expanded polytetrafluoroethylene (ePTFE). The diameter of the gasket 14 is approximately equal to the inner diameter of the recess 12c, and the thickness of the gasket 14 is approximately equal to the depth of the recess 12c.

[0035] Furthermore, when the gasket 14 is fitted into the recess 12c, the gasket 14 is formed with a plurality of communicating passages 14a, each of which overlaps with the communicating passage 12d, a through hole 14b, which overlaps with the through hole 12e, and a plurality of through holes 14c, each of which overlaps with the screw hole 12f.

[0036] A disc-shaped heater 16 is provided above the gasket 14. The heater 16 is a planar heating element such as a polyimide heater having a structure in which a meandering metal foil is sandwiched between a pair of polyimide (PI) films.

[0037] The diameter of the heater 16 is approximately equal to the inner diameter of the recess 12c, and the thickness thereof is, for example, 0.1 mm to 0.3 mm (for example, 0.2 mm). The heater 16 is provided with a terminal portion (not shown) for generating a current in the metal foil, and this terminal portion is connected to a power source via wiring or the like.

[0038] Furthermore, when the heater 16 is placed on the heater base 12 via the gasket 14, the heater 16 is formed with a plurality of through holes 16a each overlapping with the communicating passage 12d, a through hole 16b overlapping with the through hole 12e, and a plurality of through holes 16c each overlapping with the screw hole 12f.

[0039] A disk-shaped mount 18 is provided above the heater 16. The mount 18 is made of, for example, stainless steel, etc. The diameter of the mount 18 is greater than the outer diameter of the recess 12c.

[0040] Furthermore, when the mount 18 is placed on the heater base 12 via the heater 16 and the gasket 14, the mount 18 is formed with a plurality of communicating passages 18a, each of which overlaps with the communicating passage 12d, a through hole 18b, which overlaps with the through hole 12e, and a plurality of through holes 18c, each of which overlaps with the screw hole 12f.

[0041] In the table base 6, the mount 18, heater 16, gasket 14, and heater base 12 are integrated by threading bolts passing through the through holes 18c, 16c, and 14c into the screw holes 12f.

[0042] When the mount 18, heater 16, gasket 14, and heater base 12 are integrated in this manner, the gasket 14 is compressed, and the gasket 14 and heater 16 fit into the recess 12c present in the upper part of the heater base 12. In this case, the lower surface of the mount 18 contacts the upper surface of the heater base 12.

[0043] Furthermore, the upper portion of each of the multiple through holes 18c formed in the mount 18 is wide enough to accommodate the head of a bolt. Therefore, when the mount 18, heater 16, gasket 14, and heater base 12 are integrated, the upper surface of the bolt that screws into the screw hole 12f is positioned below the upper surface of the mount 18.

[0044] Furthermore, a positioning hole 18d is formed on the upper surface of the mount 18. When the support tables 4, 8 are attached to the table base 6, a positioning pin provided on the lower surface of the support tables 4, 8 is inserted into this positioning hole 18d.

[0045] Furthermore, a plurality of through holes 18e are formed near the side surface of the mount 18. A bolt (not shown) for attaching the support tables 4, 8 to the mount 18 (table base 6) is passed through each through hole 18e. The support tables 4, 8 can be attached to the table base 6 by screwing the bolts that pass through these through holes 18e into a plurality of screw holes formed on the undersides of the support tables 4, 8.

[0046] In the support mechanism 2, the support tables 4 and 8 attached to the table base 6 are heated by the heater 16, and the size of the support tables 4 and 8 actually attached to the table base 6 can be determined by utilizing the temperature measured by a measurement unit including a thermocouple passing through the through holes 12e, 14b, 16b, and 18b.

[0047] This point will be explained with reference to Fig. 3. Fig. 3 is a graph that schematically shows the change in temperature measured by the measurement unit over time as the heater 16 heats the support table 4 or 8 at room temperature (RT) when the support table 4 or 8 is attached to the table base 6.

[0048] Here, since the size of support table 4 is smaller than the size of support table 8, the heat capacity of support table 4 is smaller than the heat capacity of support table 8. Therefore, as shown in Fig. 3, the time (t1) taken for support table 4 to reach a predetermined temperature (T1) from room temperature (RT) is shorter than the time (t2) taken for support table 8 to reach a predetermined temperature (T1) from room temperature (RT).

[0049] In other words, the temperature rise rate ((T1-RT) / t1) of the support table 4 from room temperature (RT) to the predetermined temperature (T1) is faster than the temperature rise rate ((T1-RT) / t2) of the support table 8 from room temperature (RT) to the predetermined temperature (T1). Also, the temperature (T2) reached when the support table 4 is heated for a predetermined time (t3) is higher than the temperature (T3) reached when the support table 8 is heated for a predetermined time (t3).

[0050] Therefore, with the correspondence between the temperature information and the size of such support tables 4, 8 known in advance, the size of the support tables 4, 8 actually mounted on the table base 6 can be determined by heating the support tables 4, 8 of any size actually mounted on the table base 6 with the heater 16 and referring to the temperature measured by the measurement unit.

[0051] Furthermore, the support mechanism 2 is equipped with a computer that can determine whether the sizes of the support tables 4, 8 actually attached to the table base 6 are appropriate, and issue a warning if they are inappropriate. Figure 4 is a block diagram that schematically shows the hardware included in this computer.

[0052] The computer 20 shown in FIG. 4 includes an output unit 24, a control unit 26, an input unit 28, and a communication interface 30, which are connected via a bus 22 so as to be able to exchange electrical signals with one another.

[0053] The output unit 24 outputs information relating to the support tables 4, 8 attached to the table base 6. The output unit 24 includes at least one of a display, a printer, a speaker, and a warning light (pilot lamp), and is used, for example, to issue a warning that the sizes of the support tables 4, 8 attached to the table base 6 are inappropriate.

[0054] The control unit 26 controls the components (heater 16, measurement unit, and output unit 24) of the support mechanism 2. The control unit 26 includes a central processing unit (CPU) 32 and a storage device 34. The storage device 34 further includes a main storage device 34a with a high rewrite speed and an auxiliary storage device 34b with a large storage capacity.

[0055] The main memory device 34a stores data that is frequently rewritten by the CPU 32. The auxiliary memory device 34b stores programs for causing the CPU 32 to execute specific processes, data used in the calculations of the CPU 32, and the like. For example, the auxiliary memory device 34b stores data used to determine the size of the support tables 4, 8 actually attached to the table base 6.

[0056] The data used for the judgment includes, for example, information regarding the temperature of the support tables 4, 8 when the support tables 4, 8 mounted on the table base 6 are heated (for example, the time or rate of temperature rise required to reach a predetermined temperature, or the temperature after a predetermined time has elapsed) and the correspondence between the size of the support tables 4, 8.

[0057] 3 are stored in the auxiliary storage device 34b as information about the temperature of the support table 4 corresponding to the size of the support table 4. Also, the time (t2), the temperature rise rate ((T1-RT) / t2), and / or the temperature (T3) shown in FIG. 3 are stored in the auxiliary storage device 34b as information about the temperature of the support table 8 corresponding to the size of the support table 8.

[0058] This determination is made, for example, by referring to information about the temperature of the support tables 4, 8 (for example, the time or rate of temperature rise required to reach a predetermined temperature, or the temperature after a predetermined time has elapsed) obtained based on the temperature of the support tables 4, 8 measured by the measurement unit when the support tables 4, 8 actually mounted on the table base 6 are heated by the heater 16, and the corresponding relationship stored in the auxiliary memory device 34b.

[0059] The CPU 32 reads out and executes various programs stored in the auxiliary storage device 34b. For example, the CPU 32 determines whether the sizes of the support tables 4, 8 attached to the table base 6 are appropriate, and if they are inappropriate, reads out and executes a program for warning the user.

[0060] The main storage device 34a is configured with a volatile memory such as a dynamic random access memory (DRAM) or a static random access memory (SRAM), while the auxiliary storage device 34b is configured with a nonvolatile memory such as a solid state drive (SSD) (NAND flash memory) or a hard disk drive (HDD) (magnetic storage device).

[0061] The input unit 28 inputs information about the support tables 4, 8, etc. to the control unit 26. The input unit 28 includes at least one of a keyboard, a mouse, a touchpad, and a microphone. The computer 20 may also include an input / output unit (e.g., a touch panel) in which the output unit 24 and the input unit 28 are integrated.

[0062] The size of the support tables 4, 8 to be mounted on the table base 6 is determined according to the size of the wafers held on the support tables 4, 8. Therefore, the information about the support tables 4, 8 input from the input unit 28 to the control unit 26 includes the size of the wafers held on the support tables 4, 8.

[0063] The communication interface 30 includes at least one of a communication circuit (such as an analog-to-digital converter (ADC) and a digital-to-analog converter (DAC)), an input / output (I / O) port, etc. The communication interface 30 is used, for example, when inputting a program recorded on a non-transitory recording medium such as a portable Universal Serial Bus (USB) flash drive into the control unit 26.

[0064] In addition, this non-temporary recording medium stores a program for determining whether the size of the support tables 4, 8 attached to the table base 6 is appropriate or not, and issuing a warning if it is inappropriate.

[0065] Fig. 5 is a block diagram that schematically shows functional units included in the control unit 26. Fig. 5 also shows components of the support mechanism 2 that are related to each functional unit of the control unit 26. As shown in Fig. 5, the control unit 26 has a memory unit 26a, a determination unit 26b, and a warning unit 26c.

[0066] The memory unit 26a stores data and the like used to determine the size of the support tables 4, 8 actually attached to the table base 6. For example, the memory unit 26a stores appropriate sizes of the support tables 4, 8 to be attached to the table base 6, which are determined based on information about the support tables 4, 8 input from the input unit 28.

[0067] The storage unit 26a may also store in advance a correspondence relationship between information about the temperature of the support tables 4, 8 when the support tables 4, 8 attached to the table base 6 are heated (for example, the time required to reach a predetermined temperature or the rate of temperature rise, or the temperature after a predetermined time has elapsed) and the size of the support tables 4, 8. Furthermore, the correspondence relationship stored in the storage unit 26a may be rewritten with data input from the input unit 28 or the communication interface 30.

[0068] The determination unit 26b operates the heater 16 to heat the support tables 4, 8 that are actually mounted on the table base 6, and also operates the measurement unit 36 ​​to measure the temperatures of the support tables 4, 8.

[0069] Furthermore, the judgment unit 26b judges the size of the support tables 4, 8 actually attached to the table base 6 by referring to information regarding the temperature of the support tables 4, 8 measured by the measurement unit 36 ​​(for example, the time or rate of temperature rise until a predetermined temperature is reached, or the temperature after a predetermined time has elapsed) and the corresponding relationship stored in the memory unit 26a.

[0070] When the appropriate size of the support tables 4, 8 stored in the memory unit 26a differs from the size of the support tables 4, 8 determined by the determination unit 26b, the warning unit 26c controls the output unit 24 to operate so as to warn that the size of the support tables 4, 8 attached to the table base 6 is inappropriate.

[0071] For example, if the output unit 24 includes a display and a warning light, the warning unit 26c displays a message indicating the presence of an abnormality on the display and turns on or flashes the warning light.

[0072] 6 is a flowchart showing a typical example of a method for determining whether the sizes of the support tables 4, 8 attached to the table base 6 are appropriate. In this method, first, the appropriate sizes of the support tables 4, 8 to be attached to the table base 6 are stored (storage step: S1).

[0073] In this storage step (S1), for example, an operator operates the input unit 28 to input the size of a wafer to be supported by the support mechanism 2 into the control unit 26. Then, the CPU 32 stores the appropriate sizes of the support tables 4 and 8 determined based on this wafer size in the storage device 34. That is, the appropriate sizes of the support tables 4 and 8 are stored in the storage unit 26a of the control unit 26.

[0074] Next, the temperatures of the support tables 4, 8 are measured while heating the support tables 4, 8 that are actually mounted on the table base 6 (measurement step: S2). In this measurement step (S2), the CPU 32 operates the heater 16 to heat the support tables 4, 8 that are actually mounted on the table base 6, and also operates the measurement unit 36 ​​to measure the temperatures of the support tables 4, 8.

[0075] Then, the CPU 32 stores information about the temperatures of the support tables 4, 8 (for example, the time or temperature rise rate until a predetermined temperature is reached, or the temperature when a predetermined time has elapsed) obtained based on the temperatures measured by the measurement unit 36 ​​in the main memory device 34a or the auxiliary memory device 34b of the memory device 34. That is, the information is stored in the memory section 26a of the control unit 26.

[0076] Next, the sizes of the support tables 4, 8 actually attached to the table base 6 are determined (determination step: S3). In this determination step (S3), the CPU 32 (determination section 26b of the control unit 26) determines the sizes of the support tables 4, 8 by referring to the information stored in the main memory device 34a or the auxiliary memory device 34b of the memory device 34 in the measurement step (S2) and the above-mentioned correspondence relationship stored in advance in the auxiliary memory device 34b of the memory device 34.

[0077] Then, if the appropriate size of the support tables 4, 8 stored in the storage step (S1) differs from the size of the support tables 4, 8 determined in the determination step (S3) (S4: YES), a warning is issued that the size of the support tables 4, 8 attached to the table base 6 is inappropriate (warning step: S5). In this warning step (S5), the CPU 32 (warning section 26c of the control unit 26) controls the output unit 24 to issue a warning that the size of the support tables 4, 8 attached to the table base 6 is inappropriate.

[0078] 6, a warning can be issued if the size of the support tables 4, 8 is inappropriate, by referring to information about the temperatures of the support tables 4, 8 obtained based on the temperatures of the support tables 4, 8 measured while the support tables 4, 8 are heated. This makes it possible to determine whether the support tables 4, 8 attached to the table base 6 are appropriate, without providing additional components such as photoelectric sensors in the support mechanism 2, that is, without increasing the manufacturing cost of the support mechanism 2.

[0079] The above-described content is one aspect of the present invention, and the present invention is not limited to the above-described content. For example, the support table included in the support mechanism of the present invention may have any structure as long as it is capable of applying a suction force to the wafer. Specifically, in the support mechanism of the present invention, the support table may be formed only by a frame body having a through-hole formed therein that can communicate with a suction source.

[0080] In the support mechanism of the present invention, a heater may be built into the support table. Figures 7 and 8 are exploded perspective views showing an example of such a support table. Note that the support table 38 shown in Figure 7 is a support table including a frame 38a and a porous plate 38b having the same structure as the frame 4a and the porous plate 4b shown in Figure 1(A).

[0081] 8 is a support table including a frame 40a and a porous plate 40b having the same structure as the frame 8a and the porous plate 8b shown in Fig. 1(B). The support table 38 and the support table 40 have the same components except for the frame 38a, 40a and the porous plates 38b, 40b.

[0082] Specifically, the support tables 38, 40 include a disk-shaped bottom cover 42. The bottom cover 42 has a disk-shaped bottom wall 42a and an annular side wall 42b extending upward from the periphery of the bottom wall 42a. Therefore, a recess 42c defined by the bottom wall 42a and the side wall 42b exists in the upper part of the bottom cover 42. The depth of the recess 42c is 1 mm to 2 mm (e.g., 1.5 mm).

[0083] Furthermore, a plurality of communication passages 42d are formed inside the bottom cover 42. Each communication passage 42d is connected to a suction source (not shown) such as a vacuum pump when the support tables 38, 40 are attached to a heater base (not shown). Also, a through hole 42e is formed inside the bottom cover 42. A thermocouple (not shown) included in a measurement unit for measuring the temperature of the support tables 38, 40 is passed through this through hole 42e.

[0084] A plurality of through holes 42f are formed inside the bottom cover 42. A bolt (not shown) is passed through each through hole 42f to integrate a gasket 44, a heater 46, and frames 38a, 40a (described later) with the bottom cover 42. Positioning pins (not shown) are provided on the underside of the bottom cover 42 to position the support tables 38, 40 attached to the table base. A plurality of screw holes (not shown) are formed on the underside of the bottom cover 42. Each screw hole is threadedly engaged with a bolt (not shown) to attach the support tables 38, 40 to the table base.

[0085] 2 is provided in recess 42c present in the upper part of bottom cover 42. Gasket 44 is formed with a plurality of communicating passages 44a each overlapping with communicating passage 42d, a through hole 44b overlapping with through hole 42e, and a plurality of through holes 44c each overlapping with through hole 42f when gasket 44 is fitted in recess 42c.

[0086] 2 is provided above the gasket 44. When the heater 46 is placed on the bottom cover 42 with the gasket 44 interposed therebetween, the heater 46 is provided with a plurality of communicating passages 46a, each overlapping with the communicating passage 42d, a through hole 46b, each overlapping with the through hole 42e, and a plurality of through holes 46c, each overlapping with the through hole 42f.

[0087] 7, a frame 38a and a porous plate 38b are provided above the heater 46 of the support table 38. The frame 38a is formed with a plurality of communication paths (not shown) that overlap with the communication paths 42d and a plurality of screw holes (not shown) that overlap with the through-holes 42f when the frame 38a is placed on the bottom cover 42 with the heater 46 and the gasket 44 interposed therebetween.

[0088] Furthermore, each communication passage formed in the frame 38a communicates with the underside of the porous plate 38b. Also, each screw hole formed in the frame 38a is threadedly fitted with a bolt (not shown) for integrating the bottom cover 42, gasket 44, heater 46, and frame 38a.

[0089] Similarly, a frame 40a and a porous plate 40b are provided above a heater 46 included in the support table 40 shown in Fig. 8. The frame 40a is formed with a plurality of communication paths (not shown) that overlap with the communication paths 42d and a plurality of screw holes (not shown) that overlap with the through-holes 42f when the frame 40a is placed on the bottom cover 42 with the heater 46 and the gasket 44 interposed between them.

[0090] Furthermore, each communication passage formed in the frame 40a communicates with the underside of the porous plate 40b. Also, each screw hole formed in the frame 40a is threadedly engaged with a bolt (not shown) for integrating the bottom cover 42, the gasket 44, the heater 46, and the frame 40a.

[0091] In addition, the structures and methods according to the above-described embodiments can be modified as appropriate without departing from the scope of the present invention. [Explanation of symbols]

[0092] 2: Support mechanism 4: Support table (4a: frame, 4b: porous plate) 6: Table base 8: Support table (8a: frame, 8b: porous plate) 10: Support pillar 12: heater base (12a: bottom wall, 12b: side wall, 12c: recess) (12d: communication passage, 12e: through hole, 12f: screw hole) 14: Gasket (14a: communication passage, 14b: through hole, 14c: through hole) 16: heater (16a: communication passage, 16b: through hole, 16c: through hole) 18: Mount (18a: communication passage, 18b: through hole, 18c: through hole) (18d: positioning hole, 18e: through hole) 20: Computer 22: Bus 24: Output unit 26: Control unit (26a: memory unit, 26b: judgment unit, 26c: warning unit) 28: Input unit 30: Communication interface 32: Central Processing Unit (CPU) 34: Storage device (34a: Main storage device, 34b: Auxiliary storage device) 36: Measurement unit 38: Support table (38a: frame, 38b: porous plate) 40: Support table (40a: frame, 40b: porous plate) 42: bottom cover (42a: bottom wall, 42b: side wall, 42c: recess) (42d: communication passage, 42e: through hole, 42f: through hole) 44: Gasket (44a: communication passage, 44b: through hole, 44c: through hole) 46: heater (46a: communication passage, 46b: through hole, 46c: through hole)

Claims

1. A table base and a support table attached to the table base; a heater for heating the support table; a measuring unit for measuring the temperature of the support table; an output unit for outputting information about the support table; a control unit for controlling the heater, the measurement unit, and the output unit; an input unit for inputting information about the support table to the control unit, The control unit a storage unit that stores a correspondence relationship between information about the temperature of the support table when the support table attached to the table base is heated by the heater and the size of the support table, and an appropriate size of the support table to be attached to the table base that is determined based on information about the support table input from the input unit to the control unit; a determination unit that determines the size of the support table actually attached to the table base by referring to information about the temperature of the support table obtained based on the temperature of the support table measured by the measurement unit in a state in which the support table actually attached to the table base is heated by the heater, and the correspondence relationship stored in the storage unit; a warning unit that controls the output unit to warn that the size of the support table attached to the table base is inappropriate when the appropriate size of the support table stored in the storage unit differs from the size of the support table determined by the determination unit; and A support mechanism comprising:

2. 1. A method for determining whether a support table mounted on a table base is of an appropriate size, comprising: a storing step of storing an appropriate size of the support table to be mounted on the table base; a determination step of determining the size of the support table actually attached to the table base by referring to information about the temperature of the support table obtained based on the temperature of the support table measured when the support table actually attached to the table base is heated, and a correspondence relationship between the information about the temperature of the support table when the support table attached to the table base is heated and the size of the support table; a warning step of issuing a warning that the size of the support table attached to the table base is inappropriate when the appropriate size of the support table stored in the storing step differs from the size of the support table determined in the determining step; A method for providing the above.

3. A program for causing a computer to execute a method for determining whether a size of a support table attached to a table base is appropriate, the program comprising: an output unit for outputting information about the support table; a control unit including a storage device and a central processing unit for controlling the output unit; and an input unit for inputting information about the support table to the control unit, The method comprises: a storage step in which the storage device stores an appropriate size of the support table to be attached to the table base, the appropriate size being determined based on information about the support table input from the input unit to the control unit; a determination step in which the central processing unit determines the size of the support table actually attached to the table base by referring to information on the temperature of the support table obtained based on the temperature of the support table measured when the support table actually attached to the table base is heated, and a correspondence relationship between information on the temperature of the support table when the support table attached to the table base is heated and the size of the support table, which is stored in advance in the storage device; a warning step in which, when the appropriate size of the support table stored in the storage device differs from the size of the support table determined by the central processing unit, the central processing unit controls the output unit to warn that the size of the support table attached to the table base is inappropriate; A program that includes:

4. A non-transitory recording medium on which the program according to claim 3 is recorded.

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