Semiconductor substrate transport container having enlarged diameter purge port

Abstract

A semiconductor substrate transfer container is provided that includes one or more enlarged purge ports extending through a bottom wall. The purge port(s) allow for a purge fluid conditioning element to be inserted into an interior space of the container by mounting the purge fluid conditioning element through the purge port from outside the container. The purge port(s) are sized and positioned such that at least a portion of a rear wall of the container is disposed forward of a portion of the purge port(s). Additionally, a portion of the rear wall is in communication with a portion of the periphery of the purge port(s).

Description

[Technical Field]

[0001] TECHNICAL FIELD The present disclosure relates to semiconductor substrate transport containers used, for example, in semiconductor manufacturing. [Background technology]

[0002] Substrate transport pods are used to transport substrates during semiconductor manufacturing and typically include a shell that defines an interior space for holding the substrates and plates that are used to interface with various conveyors and other devices, for example, to move the pod around a processing facility. Summary of the Invention

[0003] Described herein is a semiconductor substrate transport container having one or more purge ports extending through its bottom wall. The purge port(s) are sized to allow a purge fluid conditioning element to be inserted into the container's interior space by attaching the purge fluid conditioning element through the purge port from outside the container. This eliminates the need to attach the purge fluid conditioning element from inside the container, which is required in conventional containers with conventionally sized purge port(s), and can result in personnel contamination of the container's interior environment.

[0004] A semiconductor substrate transport container may be any type of container used to hold and transport semiconductor substrates during semiconductor manufacturing. Examples of semiconductor substrate transport containers include, but are not limited to, front-opening integrated pods (FOUPs).

[0005] The semiconductor substrates held in the containers may be any substrates used in semiconductor manufacturing. Examples of semiconductor substrates that may be placed in the containers described herein may include, but are not limited to, wafers and panels (such as flat panels), and combinations thereof.

[0006] In one embodiment, the vessel may include a shell defining an interior space, an opening in the shell, such as, but not limited to, a front opening, through which a semiconductor substrate can be inserted into and removed from the interior space, and a bottom wall having at least one purge port as described herein, through which a purge fluid adjustment element can be mounted from outside the vessel into the interior space. A plate may be secured to the bottom wall for connection to various conveyors and other devices to enable movement of the vessel around the processing facility. The plate may be considered part of the bottom wall of the vessel or separate from the bottom wall. If present and separate from the bottom wall, the plate may also include an opening aligned with the purge port in the bottom wall.

[0007] The purge fluid conditioning element may be any type of element that can be inserted into the interior space of the vessel for use in conditioning the environment within the interior space. Examples of purge fluid conditioning elements include, but are not limited to, diffusers, getters, filters, elements combining one or more of these functions, or others.

[0008] In one embodiment, a semiconductor substrate-transport container described herein may include a container shell having an interior space defined by first and second side walls, a top wall, a bottom wall, and a rear wall at a rear position of the container shell, the interior space being sized to accommodate multiple semiconductor substrates. A front opening is located at a front side of the container shell opposite the rear wall, through which semiconductor substrates can be removed from and inserted into the interior space. Furthermore, at least one purge port extends through the bottom wall and opens completely into the interior space. The purge port is sized so that a purge fluid adjustment element can be installed into the interior space from outside the container through the purge port. Furthermore, in one embodiment, at least a portion of the rear wall may be located forward of a portion of the purge port.

[0009] In another embodiment, the FOUP described herein may include a shell having a front opening and an interior space sized to accommodate multiple semiconductor substrates. At least one purge port extends through a bottom wall of the shell and opens completely into the interior space. Additionally, at least a portion of the rear wall of the shell is contiguous with a portion of the periphery of the at least one purge port. As used herein, the term "contiguous" means that at least a portion of the rear wall and at least a portion of the purge port share a common edge or that at least a portion of the rear wall forms a portion of the periphery of the opening that forms the at least one purge port. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a front perspective view of a semiconductor substrate transport container having an enlarged purge port. [Figure 2] FIG. 2 is a rear perspective view of the semiconductor substrate transport pod of FIG. [Figure 3] 3 is a partial cross-sectional top view of the semiconductor substrate transport pod taken along line 3-3 of FIG. 2. FIG. [Figure 4] 2 is a view similar to FIG. 1 showing the beginning of installation of the purge fluid regulation element into the vessel; [Figure 5] 10A-10C show examples of purge fluid regulation elements installed in the semiconductor substrate transport container through purge ports from outside the container. [Figure 6] 10 is a schematic top view of the outer peripheral contour of the base portion of the purge fluid adjusting element. FIG. [Figure 7] 1 is a diagram showing an example of a conventional semiconductor substrate transport pod having a conventional purge port; DETAILED DESCRIPTION OF THE INVENTION

[0011] 1 and 2, an example of a semiconductor substrate transport container 10 is shown. In one embodiment, the container 10 may be referred to as a FOUP. The container 10 comprises a container shell 12 having multiple walls, including a first sidewall 14, a second sidewall 16 opposite the first sidewall 14, a top wall 18, a bottom wall 20 (not visible in FIG. 2) opposite the top wall 18, and a rear wall 22. The walls define an interior space 24 (not visible in FIG. 2) sized to accommodate multiple semiconductor substrates 26 (one semiconductor substrate 26 is shown in dashed lines in FIG. 3), the substrates 26 arranged in a vertical stack, the substrates 26 vertically spaced apart from one another, and each substrate 26 oriented horizontally and substantially parallel to the top wall 18 and the bottom wall 20. In one embodiment, the container 10 may be configured to accommodate and hold 24 substrates 26, although the container 10 may be configured to hold more or fewer substrates 26. Substrates 26 may be held within container 10 in any suitable manner. Techniques for holding substrates in semiconductor substrate transport containers such as FOUPs are well known in the art.

[0012] 1 and 2, the container 10 further includes a front surface 28 having a front opening 30 (seen in FIG. 1) through which each of the semiconductor substrates 26 can be removed from and inserted into the interior space 24. Additionally, a mechanical coupling plate 32 (seen in FIG. 2) is secured to the bottom wall 20 of the shell 12. The plate 32 may be considered part of the bottom wall 20 or separate from the bottom wall 20.

[0013] The semiconductor substrate 26 may be any substrate used in semiconductor manufacturing. Examples of semiconductor substrates 26 that may be placed in the enclosure 10 described herein may include, but are not limited to, wafers and panels (such as flat panels), as well as combinations thereof. Figure 3 illustrates the substrate 26 as being a wafer.

[0014] The substrate container 10 can be formed from one or more polymeric materials, including, but not limited to, injection-moldable polymeric materials. The polymeric material(s) can include, but are not limited to, one or more polyolefins, one or more polycarbonates, one or more thermoplastic polymers, etc. In one embodiment, a portion or all of the substrate container 10 can be injection molded. The one or more polymeric materials can form a matrix that includes a carbon filler. In one embodiment, the one or more polymeric materials can be selected to minimize particle shedding during handling and use of the substrate container 10.

[0015] 1 and 3, at least one purge port 40 extends through bottom wall 20 and opens completely into interior space 24. In the illustrated example, vessel 10 is shown with two purge ports 40. However, vessel 10 may include only one purge port 40 or more than two purge ports 40. If plate 32 is present, similar openings aligned with purge ports 40 are formed in plate 32. Purge ports 40 are shown as circular in shape. However, purge ports 40 may have any shape, including, but not limited to, rectangular, square, triangular, and the like.

[0016] 7, in a conventional semiconductor substrate transfer container 100, a purge fluid adjusting element 102 is manually installed and loaded into a conventional purge port 104 from inside the interior space of the container 100. In other words, a person installing the element 102 reaches into the interior space of the container 100 and installs the element 102 into the purge port 104. However, this may result in personnel contamination of the internal environment of the container 100.

[0017] In contrast, the purge port 40 of the vessel 10 is configured such that one or more purge fluid conditioning elements 42 can be installed within the interior space 24 (as seen in FIGS. 4 and 5) by inserting the purge fluid conditioning elements 42 from outside the vessel 10. This eliminates the need for human access and entry into the interior space 24 of the vessel 10 to install the purge fluid conditioning elements 42, thereby eliminating the possibility of introducing a human source of contamination into the interior environment, and the like.

[0018] Specifically, with reference to FIGS. 1 and 3 , the purge ports 40 of the vessel 10 are larger than those of conventional vessels, such as the vessel 100 of FIG. 6 . The purge ports 40 are located at the rear of the vessel 10. As best seen in FIG. 3 , the size and location of the purge ports 40 are such that at least a portion of the rear wall 22 is disposed forward of a respective portion of the purge ports 40. In the illustrated example, the rear wall 22 is shown as having a central portion 44 disposed between two purge ports 40. A plane P, indicated by a dashed line, of the central portion 44 of the rear wall 22 extends through each purge port 40 and is located forward of the rearmost portions of the outer periphery of each purge port 40, indicated by dashed lines R1 and R2. Thus, at least the central portion 44 of the rear wall 22 is disposed forward of a portion of each purge port 40, e.g., the rearmost portion of the outer periphery. Alternatively, one could say that a portion of the rear wall 22, such as the central portion 44, is positioned closer to the front face 28 of the vessel 10, or closer to the front opening 30 of the vessel 10, than the rearmost portion of the outer periphery of each purge port 40.

[0019] 1-3, the purge ports 40 are sized and positioned such that at least a portion of the rear wall 22 of the shell 12 connects with a portion of the perimeter of each purge port 40. This is shown for the left purge port 40 in FIG. 3, although the right purge port 40 may have a similar structure. In other words, at least a portion of the rear wall 22 and at least a portion of each purge port 40 share a common edge, or at least a portion of the rear wall 22 forms a portion of the perimeter of the opening defining the purge port 40. For example, with reference to FIGS. 1-3, the rear portion of the perimeter of each purge port 40 forms a portion of the rear wall 22 from position x to position y. As best seen in FIGS. 1 and 2, between positions x and y, the rear wall 22 curves or bulges outward such that portions 46, 48 of the rear wall 22 follow the curvature of the rear perimeter of each purge port 40. In another embodiment, shown in the right purge port 40 in Figure 3, the purge port 40 can be slightly offset from the rear wall, so that a small lip 41 is formed between the rear wall and a portion of the periphery of the purge port 40, between locations x and y. In this embodiment, the left purge port 40 can have a similar structure to the right purge port 40.

[0020] 1 and 2, the outwardly curved / outwardly bulging portions 46, 48 of the rear wall 22 extend a height H above the purge port 40. In one embodiment, the bulging portions 46, 48 may extend a portion of the height of the shell 12 (as shown in FIGS. 1 and 2), or the bulging portions 46, 48 may extend the entire height of the shell 12, such that the height H extends substantially the entire distance from the bottom wall 20 to the top wall 18. The configuration of the portions 46, 48 (e.g., the curved shape and the height H) helps to direct the flow of purge gas exiting the purge port 40.

[0021] 4 and 5, examples of installing a purge fluid conditioning element 42 are described. The purge fluid conditioning element 42 may be any type of element that can be inserted into the interior space 24 for use in conditioning the environment within the interior space 24. Examples of purge fluid conditioning elements 42 include, but are not limited to, diffusers, getters, filters, combinations thereof, and the like. Examples of purge fluid conditioning elements are disclosed in U.S. Patent Nos. 9,054,144 and 10,347,517.

[0022] 4 , assuming purge ports 40 are empty, purge fluid adjustment elements 42 are placed in position beneath bottom wall 20, allowing for insertion of elements 42 in the direction of the arrows through purge ports 40 in bottom wall 20. If mechanical linkage plate 32 is present, openings in that plate are aligned with purge ports 40, also allowing for insertion of elements 42 through plate 32. Each element 42 may include a base portion 50 that removably mounts element 42 within purge port 40 and an adjustment portion 52 that extends into interior space 24.

[0023] 5, when each element 42 is fully installed, the base portion 50 is disposed within the purge port 40, thereby removably mounting the element 42 in place, and the adjustment portion 52 extends upward into the interior space 24. In one embodiment, if the element 42 is configured as a diffuser, when the element 42 is installed, purge fluid can be directed into the element 42, which distributes the purge fluid within the interior space 24.

[0024] Referring to FIG. 6 , the base portion 50 is shown in a top view having an outer peripheral edge 54, which may be circular or have any other shape. In one embodiment, no portion of the adjustment portion 52 (shown in FIGS. 4 and 5 ) protrudes beyond the outer peripheral edge 54 of the base portion 50. Because no portion of the adjustment portion protrudes beyond the outer peripheral edge 54, it is easier to insert the element 42 through the purge port. However, in another embodiment, a portion of the adjustment portion 52 may protrude beyond the outer peripheral edge 54 in a top view, as long as the element 42 can still be installed through the purge port from outside the vessel. In one embodiment, the central vertical axis X of the adjustment portion (extending through the plane of FIG. 6 ) is disposed within the perimeter of the outer peripheral edge 54. As shown in FIG. 6 , the central vertical axis X can be located in various positions, including a central position aligned with the central vertical axis of the base portion 50.

[0025] The examples disclosed herein are to be considered in all respects as illustrative and not limiting. The scope of the invention is indicated by the appended claims, rather than by the foregoing description, and all variations that come within the meaning and range of equivalents of the claims are intended to be embraced therein.

Claims

1. a container shell having an interior space defined by first and second side walls, a top wall, a bottom wall, and a rear wall at a rear location of the container shell, the interior space being sized to accommodate a plurality of semiconductor substrates; a front opening in a front surface of the container shell opposite the rear wall, through which a semiconductor substrate can be removed from and inserted into the interior space; at least one purge port extending through the bottom wall and opening completely into the interior space, wherein at least a portion of the rear wall is disposed forward of a portion of the purge port; Equipped with an aft portion of at least one periphery of the at least one purge port forms a portion of the aft wall, the aft wall following the curvature of the aft portion of the periphery of the at least one purge port; The semiconductor substrate transport container, wherein the purge ports are dimensioned such that a purge fluid control element can be installed into the interior space from outside the container shell through at least one of the purge ports.

2. 10. The semiconductor substrate transport container of claim 1, further comprising a diffuser, a getter, or a filter disposed in the at least one purge port.

3. 2. The semiconductor substrate transport container of claim 1, further comprising at least two purge ports, each of said purge ports extending through said bottom wall, each of said purge ports opening completely into said interior space, and at least a portion of said rear wall being positioned forward of a portion of each purge port.

4. a shell having a front opening and an interior space sized to accommodate a plurality of semiconductor substrates; at least one purge port extending through a bottom wall of the shell and opening completely into the interior space; Equipped with At least a portion of the rear wall of the shell communicates with a portion of the periphery of the at least one purge port; an aft portion of at least one periphery of the at least one purge port forms a portion of the aft wall, the aft wall following the curvature of the aft portion of the periphery of the at least one purge port; the purge ports are dimensioned such that a purge fluid adjusting element can be installed from outside the shell through at least one of the purge ports into the interior space; Front opening integrated pod.

5. The front-opening integrated pod of claim 4 , further comprising a diffuser, getter, or filter disposed in the at least one purge port.

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