Substrate Cleaning Equipment

Abstract

To provide a technique for cleaning a substrate cleaning tool while limiting contamination of a substrate.SOLUTION: A substrate cleaning device is configured to clean a substrate using a cleaning tool. The substrate cleaning device includes: a moving mechanism for moving the cleaning tool between a cleaning position where the substrate is cleaned and a retracted position where the tool is retracted from the substrate; and a spray nozzle for injecting a one-fluid spray of a cleaning solution onto the cleaning tool in the retracted position.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The technology disclosed in this specification relates to a substrate cleaning technology. Substrates to be treated include, for example, semiconductor wafers, glass substrates for liquid crystal displays, substrates for flat panel displays (FPDs) such as organic electroluminescence (EL) displays, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, glass substrates for photomasks, ceramic substrates, substrates for field emission displays (FEDs), and substrates for solar cells. [Background technology]

[0002] Scrub brushes are available as cleaning tools for cleaning substrates, and a technique for properly cleaning a substrate by applying a brush to the substrate has been disclosed (see, for example, Patent Document 1).

[0003] When the above brush is used to clean a substrate, the dirt on the substrate is transferred to the brush, and therefore it becomes necessary to clean the brush. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-332287 Summary of the Invention [Problem to be solved by the invention]

[0005] For example, in Patent Document 1, a two-fluid spray is sprayed onto a brush, which is a cleaning tool for a substrate, to clean the brush.

[0006] However, in such a cleaning method, the two-fluid spray used to clean the cleaning tool may reach the substrate and cause contamination of the substrate.

[0007] The technology disclosed in the present specification has been made in consideration of the problems described above, and is a technology for cleaning a substrate cleaning tool while suppressing contamination of the substrate. [Means for solving the problem]

[0008] A substrate cleaning apparatus according to a first aspect of the technology disclosed in the present specification is a substrate cleaning apparatus that cleans a substrate using a cleaning tool, and includes a movement mechanism for moving the cleaning tool between a cleaning position where the cleaning tool cleans the substrate and a retracted position where the cleaning tool is retracted from the substrate, and a spray nozzle for spraying a single fluid spray of a cleaning liquid onto the cleaning tool located at the retracted position. The cleaning tool is a brush, and the spray nozzle sprays the one fluid spray at a pressure of 0.1 MPa or more and 0.5 MPa or less. .

[0010] The first technology disclosed in the present specification 2 The substrate cleaning apparatus according to the present invention is 1 of In the substrate cleaning apparatus according to the embodiment, the spray nozzle injects the one fluid spray onto the cleaning tool that is positioned at the retracted position and rotating.

[0011] The first technology disclosed in the present specification 3 The substrate cleaning apparatus according to the embodiment is or 2 The substrate cleaning apparatus according to the present invention further comprises a pod that is positioned at the retracted position and that can accommodate the cleaning tool, the moving mechanism accommodates the cleaning tool in the pod at the retracted position, and the spray nozzle injects the one fluid spray onto the cleaning tool accommodated in the pod.

[0012] The first technology disclosed in the present specification 4 The substrate cleaning apparatus according to the embodiment includes first to 3 In the substrate cleaning apparatus according to any one of the above aspects, the surface of the cleaning tool that comes into contact with the substrate is a cleaning surface, and the spray nozzle sprays the one-fluid spray from a direction inclined with respect to the cleaning surface.

[0013] The first technology disclosed in the present specification5 The substrate cleaning apparatus according to the present invention is 4 In the substrate cleaning apparatus of the embodiment, the spray nozzle has an elliptical hole for ejecting the one-fluid spray, and the long axis of the hole is oriented along the cleaning surface. A substrate cleaning apparatus according to a sixth aspect of the technology disclosed in the present specification is related to the substrate cleaning apparatus according to the first aspect, and the spray nozzle sprays the cleaning liquid at a flow rate of 100 ml / min or more and 200 ml / min or less. A substrate cleaning apparatus according to a seventh aspect of the technology disclosed in the present specification is related to the substrate cleaning apparatus according to the first aspect, and the spray nozzle sprays the cleaning liquid at a flow rate of 125 ml / min or more and 175 ml / min or less. [Effects of the Invention]

[0014] According to at least the first aspect of the technology disclosed in the present specification, a single fluid spray is sprayed to clean the cleaning tool, which prevents the spray used to clean the cleaning tool from reaching the substrate, thereby cleaning the substrate cleaning tool while preventing contamination of the substrate.

[0015] Furthermore, objects, features, aspects, and advantages associated with the technology disclosed herein will become more apparent from the detailed description and accompanying drawings set forth below. [Brief explanation of the drawings]

[0016] [Figure 1] 1 is a plan view schematically showing an example of the configuration of a substrate processing apparatus according to an embodiment of the present invention; [Figure 2] 1 is a side view schematically showing an example of the configuration of a substrate processing apparatus according to an embodiment of the present invention; [Figure 3] FIG. 10 is a diagram for explaining a spray nozzle in a waiting pod. [Figure 4] FIG. 2 is a cross-sectional view of a spray nozzle. [Figure 5] 1A and 1B are diagrams showing examples of the shape of an injection hole of a spray nozzle. [Figure 6] FIG. 10 is a diagram showing the relationship between the flow rate of pure water supplied to the injection hole of the spray nozzle and the amount of particles remaining on the brush. DETAILED DESCRIPTION OF THE INVENTION

[0017] Hereinafter, embodiments will be described with reference to the accompanying drawings. In the following embodiments, detailed features will be shown for the purpose of explaining the technology, but these are merely examples and are not necessarily essential features for enabling the embodiments to be implemented.

[0018] The drawings are schematic, and for the sake of convenience, components may be omitted or simplified as appropriate. The relative sizes and positions of components shown in different drawings are not necessarily accurately depicted and may be changed as appropriate. Hatching may also be used in drawings such as plan views that are not cross-sectional views to facilitate understanding of the embodiments.

[0019] In the following description, the same components are denoted by the same reference numerals, and their names and functions are also the same. Therefore, detailed descriptions of them may be omitted to avoid duplication.

[0020] Furthermore, in the description given in this specification, when a certain component is described as "comprising," "including," or "having," unless otherwise specified, this is not an exclusive expression that excludes the presence of other components.

[0021] Furthermore, although ordinal numbers such as "first" or "second" may be used in the descriptions in this specification, these terms are used for convenience to facilitate understanding of the contents of the embodiments, and the contents of the embodiments are not limited to the order that may result from these ordinal numbers.

[0022] Furthermore, in the description given in this specification, expressions such as "positive direction of the ... axis" or "negative direction of the ... axis" refer to the direction along the arrow of the ... axis shown in the figure as the positive direction, and the direction opposite to the arrow of the ... axis shown in the figure as the negative direction.

[0023] Furthermore, in the description provided in this specification, terms that indicate specific positions or directions, such as "top," "bottom," "left," "right," "side," "bottom," "front," or "back," may be used, but these terms are used for convenience to facilitate understanding of the contents of the embodiments and have no relation to the positions or directions when the embodiments are actually implemented.

[0024] <Embodiment> The substrate cleaning apparatus according to this embodiment will be described below.

[0025] <Configuration of substrate cleaning equipment> Fig. 1 is a plan view schematically showing an example of the configuration of a substrate processing apparatus 100 according to the present embodiment, and Fig. 2 is a side view schematically showing an example of the configuration of the substrate processing apparatus 100 according to the present embodiment.

[0026] 1, the substrate processing apparatus 100 is a single-wafer processing apparatus that processes substrates W one by one. In a substrate processing system including a plurality of substrate processing apparatuses 100, the substrates W may be transported to each of the substrate processing apparatuses 100 via a robot or the like and processed in each of the substrate processing apparatuses 100.

[0027] The substrate processing apparatus 100 according to this embodiment performs substrate processing on a substrate W, which is a circular, thin silicon substrate, using a chemical solution and a rinse liquid such as pure water, and then performs a drying process.

[0028] In the following description, the chemical liquid and rinse liquid used to process the substrate W are collectively referred to as the "processing liquid." Note that the processing liquid also includes a coating liquid such as a photoresist liquid for film formation processing on the substrate W, a chemical liquid for removing an unnecessary film on the substrate W, or a chemical liquid for etching the substrate W.

[0029] The substrate W to be processed is supported in a horizontal position by the spin chuck 20 in the substrate processing apparatus 100, and is processed in that position.

[0030] The spin chuck 20 is a vacuum chuck that vacuum-sucks the substrate W, but other methods for holding the substrate W may be used. For example, the spin chuck 20 may be a so-called mechanical chuck that has a plurality of chuck pins that support the peripheral edge of the substrate W.

[0031] The spin chuck 20 is connected to a rotation shaft of a motor 22. The spin chuck 20 rotates around the rotation axis P1 by being driven by the motor 22. The motor 22 is surrounded by a cover member 23 having a cylindrical shape.

[0032] A cup 5 is arranged around the spin chuck 20 to prevent the processing liquid from scattering.

[0033] Further to the side of the cup 5, there are provided a cleaning mechanism 7 for cleaning the substrate W, and nozzles 30 and 60 for supplying a processing liquid to the upper surface of the substrate W held by the spin chuck 20. The substrate processing apparatus 100 also functions as a substrate cleaning apparatus equipped with a cleaning mechanism for cleaning the substrate W.

[0034] The nozzle 30 is configured by attaching a discharge head 31 to the tip of a nozzle arm 32. The base end side of the nozzle arm 32 is fixedly connected to a nozzle base 33. The nozzle arm 32 is rotatable about an axis along the vertical direction by a motor 132 provided on the nozzle base 33. The processing liquid is supplied from the nozzle 30 to the substrate W, whereby the substrate W is processed.

[0035] The nozzle 60 is configured by attaching a discharge head 61 to the tip of a nozzle arm 62. The base end side of the nozzle arm 62 is fixedly connected to a nozzle base 63. The nozzle arm 62 is rotatable about an axis along the vertical direction by a motor (not shown here) provided on the nozzle base 63. A processing liquid (which may be the same processing liquid as the processing liquid supplied from the nozzle 30, or may be a different processing liquid) is supplied from the nozzle 60 to the substrate W, whereby substrate processing is performed on the substrate W.

[0036] By rotating the nozzle base 33 (or the nozzle base 63), the nozzle 30 (or the nozzle 60) can move in an arc along the horizontal direction between a position above the spin chuck 20 and a position outside the cup 5 in the direction of the arrow 31A (or the arrow 61A) in Figure 1.

[0037] The cleaning mechanism 7 has a tip end that can swing around a swing axis P2 at its base end. A brush 9 is attached to the tip end of the cleaning mechanism 7, and the rotation of the substrate W and the swing of the cleaning mechanism 7 allow the brush 9 to come into contact with any position on the top surface of the substrate W. The substrate W is cleaned by applying the brush 9 to the substrate W (i.e., the cleaning mechanism 7 moves the brush 9 in the Z-axis direction to bring the brush 9 into contact with the top surface of the substrate W). During the cleaning process of the substrate W, a predetermined processing liquid is supplied to the substrate W from the nozzle 30 or nozzle 60 as needed. The position of the brush 9 during the cleaning process (i.e., the position where the brush 9 faces the substrate W) is referred to as the cleaning position.

[0038] The cleaning mechanism 7 is swung about the swing axis P2 by a motor 10. This swing allows the brush 9 to move between the above-mentioned cleaning position and a position where the brush 9 is retracted from the substrate W (for example, a position where the brush 9 does not overlap with the substrate W in a plan view; hereinafter, referred to as the retracted position).

[0039] Furthermore, the brush 9, which faces downward so as to face the upper surface of the substrate W, can not only be oscillated by the cleaning mechanism 7 but also rotate about a rotation axis P3. The rotation speed of the brush 9 is, for example, about 125 rpm. The brush 9 can rotate both in the cleaning position and in the retracted position. The brush 9 is made of, for example, PVA (polyvinyl alcohol) and has a diameter of about 20 mm.

[0040] When the brush 9 is in the retracted position where it is not acting on the substrate W, the brush 9 is stored in the waiting pod 11 arranged at the retracted position in order to clean the brush 9 itself. A spray nozzle 15 for cleaning the brush 9 is provided in the waiting pod 11.

[0041] Of the above configurations, the operation of the motor 22, the supply from the nozzle 30, the supply from the nozzle 60, the operation of the motor 10, the operation of the spin chuck 20, the supply from the spray nozzle 15, and the like are appropriately controlled by the control unit 13.

[0042] The control unit 13 may be configured by a general computer having an electric circuit. Specifically, the control unit 13 may include a central processing unit (CPU) and a recording device configured by a nonvolatile recording device such as a flash memory or a hard disk drive. The CPU executes a processing program recorded in the recording device, thereby controlling each of the above components.

[0043] <About spray nozzles> FIG. 3 is a diagram for explaining the spray nozzle 15 in the waiting pod 11. As shown in FIG.

[0044] The spray nozzle 15 is a single-fluid spray nozzle that sprays pure water (DIW) supplied from a pure water supply source 19 in the form of a spray. The spray nozzle 15 cleans the brush 9 by spraying a single-fluid spray 15A, which is a spray consisting of a single fluid, pure water (DIW), onto the brush 9.

[0045] An operating valve 133 is provided on the supply pipe 29 connected to the pure water supply source 19. The operating valve 133 is adjusted in advance so that the flow rate is a predetermined value, and the control unit 13 controls the opening and closing of the operating valve 133. Note that the spray sprayed from the spray nozzle 15 onto the brush 9 is not limited to pure water (DIW), and may be, for example, CO2 water or ammonia.

[0046] As shown in FIG. 3, the standby pod 11 has an opening 131 at the top, into which the brush 9 having dirt or particles attached thereto due to the cleaning process of the substrate W is inserted.

[0047] The above-mentioned spray nozzle 15 is provided on the side wall of the waiting pod 11. The spray nozzle 15 injects a fluid spray 15A onto the brush 9 inside the waiting pod 11. The distance between the spray nozzle 15 and the brush 9 inside the waiting pod 11 is, for example, not less than 15 mm and not more than 20 mm.

[0048] The spray nozzle 15 is attached in an inclined position in the waiting pod 11 so that the injection holes 25 face upward (positive direction of the Z axis). The upward angle of the spray nozzle 15 with respect to the brush 9 is, for example, not less than 30° and not more than 90°. In this embodiment, the upward angle is set to 30°. The upward angle of the spray nozzle 15 with respect to the brush 9 is preferably such that the injected single-fluid spray 15A covers the lower surface 9a and peripheral edge 9b of the brush 9.

[0049] The lower surface 9a and the peripheral portion 9b are surfaces (i.e., cleaning surfaces) that come into contact with the substrate W when the brush 9 performs a cleaning process on the substrate W, and the cleaning surface is not limited to the lower surface of the brush 9, but may be, for example, the upper surface or side surface of the brush 9.

[0050] The single fluid spray 15A ejected from the spray nozzle 15 is preferably ejected from a direction inclined relative to the surface to be cleaned. When the surface to be cleaned is the upper surface, the spray nozzle 15 may be ejected from the positive Z-axis direction side (the side facing the surface to be cleaned) so as to be inclined relative to the surface to be cleaned. By ejecting the single fluid spray 15A from a direction inclined relative to the surface to be cleaned, fewer droplets collide head-on (at a small angle of incidence) with the surface to be cleaned of the brush 9, and therefore the liquid splash is less likely to diffuse outside the waiting pod 11.

[0051] Furthermore, when the brush 9 housed in the standby pod 11 is rotating, the one fluid spray 15A may be sprayed onto the lower surface 9a at least up to the center thereof.

[0052] Furthermore, the control unit 13 controls the opening and closing of the operating valve 133 so that deionized water (DIW) is supplied to the spray nozzle 15 while the brush 9 is housed in the standby pod 11.

[0053] In this way, by cleaning the brush 9 within the waiting pod 11, even if the ejected one-fluid spray 15A reaches the brush 9 and causes liquid splashing around it, it is possible to sufficiently prevent the liquid from reaching the substrate W.

[0054] It is possible to save pure water (DIW) by supplying pure water (DIW) to the spray nozzle 15 only while the brush 9 is housed in the standby pod 11. Also, by constantly spraying the single fluid spray 15A onto the brush 9 while the brush 9 is housed in the standby pod 11, it is possible to prevent the brush 9 from drying out and also to prevent particles from adhering to the brush 9.

[0055] The drained liquid of the single fluid spray 15A, which has been sprayed onto the brush 9 and is now contaminated, is discharged from a drain port 134 formed on the bottom surface of the standby pod 11.

[0056] Fig. 4 is a cross-sectional view of spray nozzle 15. As shown in Fig. 4, single-fluid spray nozzle 15 includes upstream supply pipe 151 and supply pipe 152 that is downstream of supply pipe 151 and has a smaller diameter than supply pipe 151. Supply pipe 151 and supply pipe 152 are in communication with each other.

[0057] The deionized water (DIW) supplied from the deionized water supply source 19 is supplied to the supply pipe 151 via the supply pipe 29, and further supplied to the supply pipe 152, and then sprayed from the spray holes 25.

[0058] At this time, since the supply pipes 151 and 152 have a tapered shape as a whole, the supplied pure water (DIW) is accelerated at the portion of the supply pipe 152 where the diameter is reduced, and is sprayed from the injection holes 25. The diameter of the tip of the supply pipe 152 is formed slightly smaller than the diameter of the injection holes 25.

[0059] The shape of the single fluid spray 15A sprayed from the spray nozzle 15 is, for example, a fan shape with an opening angle of about 115°. However, the shape is not limited to this, and other shapes such as a cone shape may also be used.

[0060] The pressure (water pressure) of the single fluid spray 15A ejected from the spray nozzle 15 when it is output from the spray nozzle 15 is, for example, 0.1 MPa or more and 0.5 MPa or less, and preferably 0.1 MPa or more and 0.3 MPa or less. In this embodiment, the water pressure is 0.15 MPa. As described above, the distance between the spray nozzle 15 and the brush 9 is approximately 20 mm, and therefore the single fluid spray 15A ejected from the spray nozzle 15 reaches the brush 9 while maintaining the pressure at which it was output from the spray nozzle 15.

[0061] By spraying the single fluid spray 15A onto the brush 9 at the pressure described above, the cleaning liquid can be sprayed at a higher liquid velocity than when the cleaning liquid is ejected from a normal nozzle, thereby improving the cleaning power. Also, since the pressure of the single fluid spray 15A is not too high, it is possible to prevent dirt or particles adhering to the brush 9 from getting into the brush 9 (the gaps between the bristles of the brush 9).

[0062] Fig. 5 is a diagram showing an example of the shape of the injection hole 25 of the spray nozzle 15. As shown in the example in Fig. 5, the injection hole 25 has an elliptical shape with its major axis direction aligned with the Y-axis direction. The length of the major axis of the injection hole 25 is, for example, 2 mm.

[0063] In Figures 3 and 5, when the long axis direction of the injection hole 25 is arranged along the Y axis direction (i.e., when the long axis direction of the injection hole 25 is arranged along the cleaning surface), the single fluid spray 15A injected from the spray nozzle 15 will be injected so as to have a spread in the Y axis direction (i.e., the depth direction of the paper).

[0064] On the other hand, because the spray nozzle 15 sprays the single fluid spray 15A at an angle in the X-axis direction with respect to the cleaning surface of the brush 9, the single fluid spray 15A is also sprayed with a spread in the X-axis direction. Therefore, the single fluid spray 15A is sprayed onto the cleaning surface of the brush 9 with a moderate spread in the X-axis and Y-axis directions, and the entire cleaning surface can be cleaned more effectively than when cleaning liquid is sprayed from a normal nozzle.

[0065] The flow rate of the pure water (DIW) supplied to the injection holes 25 of the spray nozzle 15 is, for example, 150 ml / min.

[0066] FIG. 6 is a diagram showing the relationship between the flow rate of pure water supplied to the injection holes 25 of the spray nozzle 15 and the amount of particles remaining on the brush 9. In FIG. 6, the vertical axis represents the amount of particles (relative value), and the horizontal axis represents the flow rate of pure water supplied. The graph shown on the left side of FIG. 6 shows the amount of particles on the brush 9 in the initial state (i.e., before contamination). The second graph from the left in FIG. 6 shows the amount of particles on the brush 9 when pure water is supplied using a normal liquid supply nozzle (for example, nozzle 30 or nozzle 60) instead of a spray nozzle.

[0067] As shown in the example in FIG. 6, by using a spray nozzle 15 to spray pure water onto the brush 9, a higher cleaning effect can be obtained than when pure water is supplied to the brush 9 using a normal liquid supply nozzle.

[0068] It can also be seen that the amount of particles remaining on the brush 9 decreases as the flow rate of the supplied pure water increases until the flow rate reaches 150 ml / min, but conversely, the amount of particles increases when the flow rate of the supplied pure water increases beyond 150 ml / min. This is thought to be because the cleaning effect of the cleaning liquid (pure water) increases in accordance with the flow rate until it exceeds a certain flow rate, but once the certain flow rate is exceeded, the particles are pushed (pushed) into the brush 9 by the high flow rate of the cleaning liquid (pure water), reducing the cleaning effect (particle removal effect).

[0069] The flow rate of the pure water supplied to the injection holes 25 can be changed as appropriate depending on the degree of contamination of the brush 9.

[0070] <Effects of the above-described embodiments> Next, examples of effects obtained by the above-described embodiments will be described. Note that in the following description, the effects will be described based on the specific configurations exemplified in the above-described embodiments, but these may be replaced with other specific configurations exemplified in the present specification as long as the same effects are obtained. In other words, for convenience, only one of the corresponding specific configurations may be described as a representative below, but the representatively described specific configuration may be replaced with another corresponding specific configuration.

[0071] According to the embodiment described above, the substrate cleaning apparatus includes a moving mechanism and a spray nozzle 15. Here, the moving mechanism corresponds to, for example, the cleaning mechanism 7. The cleaning mechanism 7 moves a cleaning tool between a cleaning position where the substrate W is cleaned and a retracted position where the cleaning tool is retracted from the substrate W. Here, the cleaning tool corresponds to, for example, the brush 9. The spray nozzle 15 injects a single fluid spray 15A of cleaning liquid onto the brush 9 positioned at the retracted position.

[0072] With this configuration, the cleaning tool is cleaned by spraying a single-fluid spray 15A, preventing the spray used to clean the cleaning tool from reaching the substrate W. Specifically, because minute droplets, such as those produced by a two-fluid spray, are not generated, the spray is prevented from floating and reaching the substrate W. Therefore, the cleaning tool for the substrate W can be cleaned while preventing contamination of the substrate W. Furthermore, the single-fluid spray 15A can be sprayed onto the brush 9 with a greater spread than when the cleaning liquid is sprayed from a normal nozzle, thereby efficiently cleaning the entire brush 9. Furthermore, the cleaning liquid can be sprayed at a higher liquid velocity than when the cleaning liquid is sprayed from a normal nozzle, thereby improving cleaning power. Furthermore, the brush 9 can be maintained clean, thereby extending the replacement life of the brush 9. Furthermore, because the brush 9 is cleaned in the retracted position, processing of the substrate W can be continued even while the brush 9 is being cleaned.

[0073] Furthermore, even if other configurations shown as examples in this specification are appropriately added to the above configuration, that is, even if other configurations in this specification that were not mentioned as the above configuration are appropriately added, the same effect can be achieved.

[0074] Furthermore, according to the embodiment described above, the spray nozzle 15 sprays the single fluid spray 15A at a pressure of 0.1 MPa or more and 0.5 MPa or less. This configuration makes it possible to effectively remove dirt or particles adhering to the brush 9. Furthermore, since the pressure of the single fluid spray 15A is not too high, it is possible to prevent dirt or particles adhering to the brush 9 from getting into the brush 9 (between the bristles of the brush 9) and making them difficult to remove.

[0075] Furthermore, according to the embodiment described above, the spray nozzle 15 is positioned at the retracted position and sprays the single fluid spray 15A onto the rotating brush 9. With this configuration, the single fluid spray 15A can be sprayed uniformly over the entire cleaning surface.

[0076] Furthermore, according to the embodiment described above, the substrate cleaning apparatus includes a pod that is located at a retracted position and that can accommodate the brush 9. Here, the pod corresponds to, for example, the standby pod 11. The cleaning mechanism 7 accommodates the brush 9 in the standby pod 11 at the retracted position. Then, the spray nozzle 15 sprays the single fluid spray 15A onto the brush 9 accommodated in the standby pod 11. According to this configuration, by cleaning the brush 9 in the standby pod 11, even if the sprayed single fluid spray 15A reaches the brush 9 and then splashes around, it is possible to sufficiently prevent the single fluid spray 15A from reaching the substrate W.

[0077] Furthermore, according to the embodiment described above, the surface of the brush 9 that comes into contact with the substrate W is the cleaning surface. The spray nozzle 15 then sprays the single fluid spray 15A from a direction inclined relative to the cleaning surface. With this configuration, fewer droplets collide head-on (at a small angle of incidence) with the cleaning surface of the brush 9, making it less likely that liquid splashes will diffuse outside the standby pod 11. Furthermore, even if some droplets pass through the brush 9 without properly reaching it, the droplets are less likely to leak outside the standby pod 11.

[0078] Furthermore, according to the embodiment described above, the spray nozzle 15 is formed with an elliptical hole for spraying the single-fluid spray 15A. Here, the hole corresponds to, for example, the injection hole 25. The long axis of the injection hole 25 is oriented along the cleaning surface. With this configuration, the single-fluid spray 15A is sprayed onto the cleaning surface of the brush 9 with an appropriate spread in the tilt direction of the spray nozzle 15 (the X-axis direction) and in the direction along the cleaning surface (the Y-axis direction), thereby effectively cleaning the entire cleaning surface.

[0079] <Modifications of the above-described embodiments> In the embodiment described above, one fluid spray 15A is sprayed onto the brush 9 from one spray nozzle 15 within the waiting pod 11, but there may be multiple spray nozzles spraying one fluid spray 15A onto the brush 9.

[0080] Further, other cleaning methods for the brush 9 (for example, a method of discharging a rinse liquid onto the brush 9) may be used in combination.

[0081] Moreover, the spray-like pure water (DIW) sprayed onto the brush 9 may be hot water.

[0082] Furthermore, the pressure of the deionized water (DIW) supplied to the spray nozzle 15 may be changed while the one-fluid spray 15A is being sprayed.

[0083] The arrangement of the spray nozzle 15 within the standby pod 11 may be changeable in the Z-axis direction. With this configuration, even when the brush 9 does not rotate, the single fluid spray 15A can be sprayed so as to scan the entire cleaning surface. Furthermore, even when the brush 9 rotates, the entire cleaning surface can be efficiently cleaned.

[0084] Furthermore, in the above-described embodiment, the standby pod 11 is described as having an opening 131 at the top, but the standby pod 11 may also be provided with a lid for appropriately closing the opening 131 when the brush 9 is housed therein.

[0085] In the embodiments described above, the material, composition, dimensions, shape, relative positional relationship, or implementation conditions of each component may also be described, but these are merely examples in all aspects and are not limiting.

[0086] Thus, numerous variations and equivalents not shown are contemplated within the scope of the technology disclosed herein, including, for example, the modification, addition, or omission of at least one component.

[0087] Furthermore, in the embodiments described above, when a material name is mentioned without any particular specification, it is assumed that the material may contain other additives, such as an alloy, unless a contradiction arises. [Explanation of symbols]

[0088] 9 Brushes 15 spray nozzle 15A 1 fluid spray 30 nozzles 60 nozzles

Claims

1. A substrate cleaning device that cleans a substrate using a cleaning tool, a moving mechanism for moving the cleaning tool between a cleaning position where the cleaning tool cleans the substrate and a retracted position where the cleaning tool retracts from the substrate; a spray nozzle for spraying a single fluid spray of cleaning liquid onto the cleaning tool positioned at the retracted position, the cleaning tool is a brush; The spray nozzle injects the one-fluid spray at a pressure of 0.1 MPa or more and 0.5 MPa or less. Substrate cleaning equipment.

2. 2. The substrate cleaning apparatus according to claim 1, the spray nozzle injects the one fluid spray at the cleaning tool while the cleaning tool is positioned in the retracted position and rotating; Substrate cleaning equipment.

3. 3. The substrate cleaning apparatus according to claim 1, a pod that is positioned at the retracted position and that can accommodate the cleaning tool; the moving mechanism stores the cleaning tool in the pod at the retracted position; the spray nozzle directs the one fluid spray at the cleaning tool contained within the pod; Substrate cleaning equipment.

4. 4. The substrate cleaning apparatus according to claim 1, a surface of the cleaning tool that comes into contact with the substrate as a cleaning surface; The spray nozzle sprays the one-fluid spray from a direction inclined with respect to the cleaning surface. Substrate cleaning equipment.

5. 5. The substrate cleaning apparatus according to claim 4, The spray nozzle has an elliptical hole formed therein for injecting the one-fluid spray, The direction of the long axis of the hole is along the cleaning surface. Substrate cleaning equipment.

6. A substrate cleaning apparatus according to claim 1, The spray nozzle sprays the cleaning liquid at a flow rate of 100 ml / min or more and 200 ml / min or less. Substrate cleaning equipment.

7. A substrate cleaning apparatus according to claim 1, The spray nozzle sprays the cleaning liquid at a flow rate of 125 ml / min or more and 175 ml / min or less. Substrate cleaning equipment.

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