Electronic devices equipped with pressure sensors

Abstract

An apparatus (201) for use in assembling an electronic device (101, FIG. 1), such as a mobile phone, includes a pressure sensor (202). The pressure sensor is embedded in an inner elastic layer (203), which is embedded in an outer elastic layer (204). The inner elastic layer has a modulus of elasticity greater than that of the outer elastic layer.

Description

[Technical Field]

[0001] [CROSS-REFERENCE TO RELATED APPLICATIONS] This application claims priority to Chinese Utility Model Patent No. ZL2020 2 0134930.7, filed on January 21, 2020, the entire contents of which are incorporated herein by reference. [Background technology]

[0002] The present invention relates to apparatus for use in assembling electronic devices, touchscreens and electronics including such apparatus, and methods of assembling electronic devices. With the development of touchscreen home appliances, micro pressure sensors are increasingly applied to electronic devices such as mobile phones. In the manufacture of electronic assemblies in this field, parts are usually assembled with tolerance control. Summary of the Invention [Problem to be solved by the invention]

[0003] During manufacturing, process conditions and cost constraints can significantly impact the tolerances of various parts and components. This is particularly relevant when dealing with small, thin-film pressure sensors, where the tolerances of various components can add up when the pressure sensor is included in an assembly. [Means for solving the problem]

[0004] [Brief description of the invention] According to a first aspect of the present invention, a pressure sensor; side An apparatus for use in assembling electronic devices is provided, comprising: an elastic layer; and an outer elastic layer, wherein the pressure sensor is embedded in the inner elastic layer and the inner elastic layer is embedded in the outer elastic layer; wherein the inner elastic layer has a greater elastic modulus than the outer elastic layer, and the outer elastic layer includes a plurality of grooves; and wherein the inner elastic layer includes a plurality of protrusions, the same number as the plurality of grooves; wherein each of the plurality of protrusions is interconnected and cooperates with each of the plurality of grooves.

[0005] According to a second aspect of the present invention, there is provided an inner surface having an elastic modulus and a plurality of protrusions. side a pressure sensor embedded in an elastic layer; an outer elastic layer having a modulus of elasticity lower than that of the inner elastic layer and including the pressure sensor embedded in an outer elastic layer including a plurality of grooves equal in number to the plurality of protrusions; connecting the plurality of protrusions to each other and cooperating with each of the plurality of grooves; and disposing the pressure sensor between a first component and a second component of an electronic device. The aforementioned an inner elastic layer; and The aforementioned A method of assembling an electronic device is provided that includes disposing an outer resilient layer.

[0006] In the claimed device, the pressure sensor is embedded in the inner elastic layer, which is embedded in the outer elastic layer. When the pressure sensor is assembled, the elasticity of the elastic layer is used to overcome assembly tolerances. This therefore solves the problem of large tolerance accumulation of various parts when assembling the pressure sensor, overcomes the accumulation of assembly tolerances between parts, and enables the pressure sensor to be assembled accurately in mass production. Furthermore, since the elastic moduli and Poisson's ratios of the two elastic layers are different, it is useful to adjust the force conditions of the elastic layers and the pressure sensor to optimize the response of the pressure sensor upon contact. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a diagram showing an electronic device in the form of a mobile phone according to the present invention; [Figure 2] FIG. 2 is a structural schematic diagram of an apparatus according to one embodiment of the present invention; [Figure 3] FIG. 3 is a structural schematic diagram of an alternative device according to an alternative embodiment of the present invention; [Figure 4] FIG. 4 is a further structural schematic diagram of a further alternative device according to a further embodiment of the present invention; [Figure 5] FIG. 5 is yet another structural schematic diagram of yet another device according to yet another embodiment of the present invention; [Figure 6] FIG. 6 is a structural schematic diagram of a further alternative device according to a fifth embodiment of the present invention; [Figure 7] FIG. 7 is a schematic diagram of a touch screen incorporating the device of the present invention; and [Figure 8] FIG. 8 is a diagram showing a method for assembling an electronic device. DETAILED DESCRIPTION OF THE INVENTION

[0008] Embodiments of the present invention will now be described, by way of example only, with reference to the drawings. The detailed embodiments illustrate the best mode known to the inventors and support the invention as claimed. However, they are merely exemplary and should not be used to interpret or limit the scope of the claims. Their purpose is to provide instruction to those skilled in the art. Components and processes distinguished by ordinal phrases such as "first" and "second" do not necessarily define any order or ranking.

[0009] [Detailed Description of the Invention] (Figure 1) An apparatus for use with electronic devices according to the present invention can be incorporated into electronic devices such as mobile phones, as shown in FIG. In the embodiment of FIG. 1, a user 101 is shown using an electronic device 102, where the electronic device 102 is a mobile phone. In an embodiment, the mobile phone 102 comprises a touch screen 103. Thus, the user 101 can use the mobile phone 102 in a conventional manner by applying pressure with a finger to operate the mobile phone 102.

[0010] In a mobile phone 102 according to the present invention, the mobile phone 102 and device includes a pressure sensor embedded in an elastomer. The configuration described herein ensures that tolerances can be overcome during assembly of the mobile phone 102 due to the improved elastomer resulting from the present invention and the placement of the pressure sensor within the elastomer. This addresses a problem commonly encountered during assembly due to the large tolerance buildup when assembling multiple components into an electronic device. Thus, an improved assembly is provided that aids in the mass production of devices of this type.

[0011] (Figure 2) 2, in one embodiment of the present invention, device 201 includes a pressure sensor 202, an inner elastic layer 203, and an outer elastic layer 204. Pressure sensor 202 is embedded in inner elastic layer 203. Inner elastic layer 203 is further embedded in outer elastic layer 204. In an embodiment, the inner elastic layer 203 and the outer elastic layer 204 have different moduli of elasticity. The moduli of elasticity of the inner elastic layer 203 are greater than the moduli of elasticity of the outer elastic layer 204.

[0012] Thus, in the illustrated example, pressure sensor 202 is embedded in elastic layer 203, which is embedded in elastic layer 204. When pressure sensor 202 is assembled, the elasticity of the elastic layer is used to overcome assembly tolerances, which occur during manufacturing, as will be further explained with respect to Figures 7 and 8. This structure therefore solves the problem of large accumulations of tolerances of the various components when assembling a pressure sensor, and also overcomes the accumulation of assembly tolerances between parts. Furthermore, the Poisson's ratios are different between the elastic layers 203 and 204. This facilitates tuning the force characteristics of the elastic layers and therefore the pressure sensor, thereby optimizing the response performance of the pressure sensor during contact.

[0013] In one embodiment, the pressure sensor 202 can be considered to be embedded in the center of the inner elastic layer 203 and embedded in the edge of the inner elastic layer 203. Similarly, the inner elastic layer 203 can be considered to be embedded in the center of the outer elastic layer 204 or embedded in the edge of the outer elastic layer 204. Pressure sensor 202 and side If both elastic layers 203 are embedded in the edges, the recognition accuracy of the pressure sensor can be improved. Furthermore, the size of the inner elastic layer 203 can be adjusted appropriately depending on the size of the pressure sensor 202. In one embodiment, the inner elastic layer 203 is slightly larger than the pressure sensor 202.

[0014] (Figure 3) 3, another device 301 includes a pressure sensor 302, an inner elastic layer 303 in which the pressure sensor 302 is embedded, and an outer elastic layer 304. In this embodiment, the outer elastic layer 304 includes an elastic layer that has a viscous effect by itself, and may be, for example, an elastic layer formed of a substantially viscous adhesive. 3, in addition to the above-described outer elastic layer 304 having a viscous effect, an adhesive layer 305 is provided on the surface of the outer elastic layer 304. The adhesive layer 305 provides an enhanced adhesive force to the surface 306 of the outer elastic layer 304, so that during assembly, the adhesive layer 305 helps the outer elastic layer 304 adhere to other components. Furthermore, the outer elastic layer 304 can be stretched even when there is a large tolerance between two components, thereby overcoming the effect of the tolerance on assembly.

[0015] For example, during assembly, an outer elastic layer 304 is disposed between two components (as will be further described with respect to FIG. 7 ), and the tolerance of the two components is greater than the thickness of the outer elastic layer 304. In this example, the outer elastic layer 304 is provided with an adhesive layer 305 on its surface 306. Therefore, when the outer elastic layer 304 is installed with the components, the adhesive layer 305 can be used to adhere the outer elastic layer 304 to these components. In this way, due to the large tolerance between the two components, when a given outer elastic layer 304 is disposed between the two components, it will exhibit a stretched state, thereby overcoming the problem of installation tolerance between the components. While the previous example provided an outer elastic layer with a viscous effect, it will be appreciated that in an alternative embodiment, the outer elastic layer 304 may comprise an elastic layer without a viscous effect, such as a rubber material, for example, but this embodiment may further comprise a substantially similar outer adhesive layer 305.

[0016] In this embodiment, the surface 306 of the outer elastic layer 304 is viscous or has an adhesive layer 305 on the surface thereof, so that the outermost surface of the outer elastic layer has an adhesive effect. Therefore, the outer elastic layer 304 is used for attachment between components. Therefore, the outer elastic layer 304 can be stretched to overcome tolerance problems between components or part assemblies, so that the installation of the sensor will not be affected by tolerances between parts.

[0017] (Figure 4) 4, device 401 comprises a pressure sensor 402, an inner elastic layer 403 in which pressure sensor 402 is embedded, and an outer elastic layer 404. In an embodiment, device 401 further comprises an adhesive layer 405. In this embodiment, a second adhesive layer 406 is provided between the inner elastic layer 403 and the outer elastic layer 404 . An adhesive layer 407 is also provided between the inner elastic layer 403 and the pressure sensor 402. In this way, the connection between the inner elastic layer 403 and the outer elastic layer 404, and between the inner elastic layer 403 and the pressure sensor 402, is improved and stronger, so that the device retains its structure.

[0018] It will be understood that variations on any of the embodiments of Figures 2-4 may also be included within the scope of the claimed invention. Thus, any of devices 201, 301, and 401 may include any of the features from the other embodiments, as appropriate. For example, an embodiment may include an adhesive layer between the pressure sensor and the inner elastic layer, but no adhesive layer on the outer elastic layer. In the embodiment of Figure 4, outer elastic layer 404 may or may not be substantially viscous, as in device 201. Other variations are also contemplated by the present invention.

[0019] (Figure 5) Figure 5 shows a further device 501 according to a further embodiment of the invention. Device 501 comprises a pressure sensor 502, an inner elastic layer 503 and an outer elastic layer 504. Figure 5 shows a schematic exploded view of device 501, in which elastic layers 503 and 504 are separated from each other. It can be seen that in use, elastic layers 503 and 504 are in contact with each other. In the embodiment of FIG. 5, a plurality of grooves 505 are provided in the outer elastic layer 504 and a plurality of protrusions 506 are provided in the inner elastic layer 503 .

[0020] In the embodiment, the number of the protrusions 506 is the same as the number of the grooves 505. Furthermore, the protrusions 506 and the grooves 505 have shapes corresponding to each other. In this way, the inner elastic layer 503 can be embedded in the outer elastic layer 504 by inserting the multiple protrusions 506 into the corresponding grooves 505. In this way, the arrangement between the elastic layer 503 and the elastic layer 504 can improve the strength of the connection.

[0021] (Figure 6) Figure 6 shows a further device 601 according to a further embodiment of the invention. Device 601 comprises a pressure sensor 602, an inner elastic layer 603 and an outer elastic layer 604. Figure 6 shows a schematic exploded view of device 601 with elastic layers 603 and 604 separated from one another in a manner substantially similar to Figure 5. It can be seen that in use, elastic layers 603 and 604 are in contact with one another. 6, the outer elastic layer 604 is provided with grooves 605. In an embodiment, the shape of the grooves 605 is the same as the shape of the inner elastic layer 603 so that the elastic layer 603 and the grooves 605 can cooperate with each other.

[0022] In an embodiment, the groove 605 is slightly larger than the inner elastic layer 603, allowing the inner elastic layer 603 to rest within the groove 605 and be secured in place within the groove 605. In this way, the connection between the inner elastic layer 603 and the outer elastic layer is stronger and more reliably maintained during use. It should be understood that the examples shown in Figures 5 and 6 are preferred examples according to the present invention, and that any other alternative shapes may be used.

[0023] In the embodiments described herein, the inner and outer elastic layers are substantially square or rectangular in shape. In this manner, the shape of the device ensures that the device can meet the design needs, especially since the area where the pressure sensor can be applied between components is often elongated in nature. However, in further embodiments, the shape of the layers may be any other suitable shape that meets the design requirements.

[0024] (Figure 7) Any of the devices 201, 301, 401, 501 or 601 described with respect to Figures 2 to 6 may be implemented and incorporated into a touchscreen as shown in Figure 1. As shown in Figure 7, touchscreen 701 includes a screen 702 and a screen frame 703 in which screen 702 fits. Touchscreen 701 further includes device 704, which may be substantially similar to any of devices 201, 301, 401, 501, or 601 described above. Device 704 thus includes a pressure sensor, an inner elastic layer, and an outer elastic layer. An apparatus 704 is disposed between the screen 702 and the screen frame 703. When the screen 702 and the screen frame 703 are assembled, a gap 705 exists between the screen 702 and the screen frame 703. The gap 705 provides a tolerance.

[0025] When the gap 705 between the screen 702 and the screen frame 703 is relatively large, and therefore the tolerance is considered large, the device 704 is in reduced compression and is considered to be in a free or tension state. Conversely, when the gap 705 between the screen 702 and the screen frame 703 is relatively small, i.e., the tolerance is small, the device 704 is in a compressed state. Therefore, the device 704 reduces the effect of tolerances when the pressure sensor is installed on the touchscreen, thereby overcoming the tolerance issues therein while providing accurate installation of the pressure sensor. Furthermore, the different elastic moduli and Poisson's ratios between the two elastic layers allow for easier adjustment of the force conditions of the elastic layers and the pressure sensor, thereby optimizing the response of the pressure sensor during touch operations.

[0026] In the example touchscreen of FIG. 7, because the touchscreen includes the device of the present invention, the force sensor can be effectively embedded in the elastic body. That is, it is the elastic body itself that is used during assembly. The elasticity of the device overcomes tolerance issues during assembly, thereby solving the problem of component tolerance accumulation when assembling multiple microsensors into a given electronic device. This arrangement further ensures accurate implementation of the pressure sensor during the mass assembly process, while the differences in the elastic modulus and Poisson's ratio of the elastic layer facilitate adjustment of the force conditions of the elastic layer and the pressure sensor. Therefore, as described above, the response of the pressure sensor during touch can be optimized.

[0027] (Figure 8) FIG. 8 shows a schematic flow chart illustrating a method for assembling an electronic device such as a mobile phone 102 and how said device may be implemented in such an electronic device. A suitable pressure sensor is obtained in step 801. In one embodiment, the pressure sensor is a conventional thin film pressure sensor, although it will be appreciated that any suitable pressure sensor may be utilized. Next, in step 802, a pressure sensor is embedded in an inner elastic layer having a predetermined elastic modulus. side An elastic layer is provided, the inner layer having a first elastic modulus. side The elastic layer is made of an outer material having a second elastic modulus. side The elastic layer is embedded in the elastic layer. In particular, the elastic modulus of the outer elastic layer is lower than that of the inner elastic layer. Conversely, the elastic modulus of the inner elastic layer is higher than that of the outer elastic layer. This step forms the device of the present invention.

[0028] In step 804, the device including the pressure sensor and the inner and outer elastic layers is placed between a first and second component of an electronic device, such as the example described with respect to Figure 7, where the two components are a touchscreen and a screen frame that receives the touchscreen, respectively. This process is completed by assembling components such as a screen and a screen frame into an electronic device such as the mobile phone 102 of FIG.

[0029] It should be understood that in certain embodiments, additional steps may be included to provide additional layers, such as adhesive layers described herein. For example, as part of step 802, an adhesive layer may be provided between the pressure sensor and the inner elastic layer. Additionally, following step 803, an adhesive layer may be provided on the outer surface of the outer elastic layer. It should further be understood that an adhesive layer may be provided on the outer surface of the outer elastic layer prior to step 803, in which the outer elastic layer is embedded.

Claims

1. pressure sensors; an inner elastic layer and an outer elastic layer; Including, the pressure sensor is embedded within the inner elastic layer, and the inner elastic layer is embedded within the outer elastic layer; wherein the inner elastic layer has a modulus of elasticity greater than a modulus of elasticity of the outer elastic layer; the outer elastic layer including a plurality of grooves; the inner elastic layer including a plurality of protrusions equal in number to the plurality of grooves; The plurality of protrusions are interconnected and cooperate with each of the plurality of grooves. A device incorporated into electronic equipment.

2. 10. The device of claim 1, wherein said outer resilient layer comprises a substantially viscous resilient material.

3. 3. The device of claim 1 or claim 2, wherein the outer resilient layer includes a surface having a first adhesive layer disposed thereon.

4. 4. The device of claim 1, further comprising a second adhesive layer between the inner and outer elastic layers.

5. 5. The device of claim 1, further comprising a third adhesive layer between the inner elastic layer and the pressure sensor.

6. 6. The device of claim 1, wherein the inner and outer elastic layers each comprise a generally rectangular structure.

7. A screen; a screen frame configured to receive the screen; and Apparatus according to any one of claims 1 to 6. Including touch screen.

8. The touch screen of claim 7, wherein the device is disposed between the screen and the screen frame.

9. 9. An electronic device comprising the touch screen according to claim 7 or 8.

10. 10. The electronic device according to claim 9, wherein the electronic device is a mobile phone.

11. embedding a pressure sensor within an inner elastic layer having an elastic modulus and having a plurality of protrusions; the inner elastic layer including the pressure sensor is embedded in an outer elastic layer having a modulus of elasticity lower than that of the inner elastic layer and including a plurality of grooves in the same number as the plurality of protrusions; interconnecting and cooperating with each of the plurality of grooves; and The pressure sensor, the inner elastic layer, and the outer elastic layer are disposed between a first component and a second component of an electronic device. A method for assembling an electronic device, comprising the steps of:

12. 12. The method of claim 11, wherein the first component is a screen of a touchscreen and the second component is a screen frame that receives the screen.

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