Busbar assembly and manufacturing method thereof

Abstract

To provide a framed planar busbar assembly.SOLUTION: A busbar assembly according to the present invention comprises: a plurality of busbars arranged in the same plane; a busbar side insulating layer including a gap filling portion and an upper surface side laminate portion, in which the upper surface side laminate portion is provided with an upper surface opening exposing the upper surfaces of the plurality of busbars; and a frame body having an annular frame body main body with a central hole and a frame body side insulating layer covering the outer peripheral surface of the frame body main body, and fixed via the upper surface side laminate portion to the upper surface of a busbar connected body formed by the plurality of busbars with the upper surface opening positioned within the central hole in a plan view.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a bus bar assembly in which a plurality of bus bars are electrically insulated and mechanically connected, and to a method for manufacturing the same. [Background technology]

[0002] 2. Description of the Related Art Busbar assemblies having a plurality of busbars that are electrically insulated from one another but mechanically connected to one another have been proposed and are used in various fields.

[0003] For example, a stacked busbar assembly has been proposed in which one flat busbar and another flat busbar are stacked one on top of the other in a parallel state (see Patent Documents 1 and 2 below).

[0004] In the laminated bus bar assembly, the opposing flat surfaces of one flat bus bar and the opposing flat surfaces of another flat bus bar are arranged to face each other across an insulating layer, which makes it difficult to ensure sufficient reliability in terms of insulation. In particular, if the thickness of the insulating layer between the one flat bus bar and the other flat bus bar is reduced in order to reduce the size in the vertical direction, there is a risk of leakage current flowing between the two bus bars.

[0005] In order to solve the problems with the laminated busbar assembly, the applicant of the present application has filed an application for and received a patent for a planar busbar assembly in which first and second busbars made of conductive metal flat plates are arranged side by side in the same plane (see Patent Documents 3 and 4 below).

[0006] FIG. 22(a) shows a plan view of the flat bus bar assembly 500, and FIG. 22(b) shows a cross-sectional view taken along line XXII(b)-XXII(b) in FIG. 22(a). FIG. 23 shows a vertical cross-sectional view of a semiconductor module 600 in which semiconductor elements 110 such as LEDs are mounted on the flat bus bar assembly 500.

[0007] As shown in Figures 22(a) and (b) and Figure 23, the planar busbar assembly 500 is formed from a conductive flat plate-like member and includes a plurality of busbars 510 arranged in the same plane with gaps 519 between opposing side surfaces, a busbar side insulating layer 520 including gap filling portions 529 filled in the gaps 519 and an upper surface side laminated portion 521 extending integrally from the gap filling portions 529 so as to cover the upper surface on one side in the plate thickness direction of the busbar connected body formed by the gap filling portions 529, and a frame body 530 having an annular frame body main body 531 with a central hole 537 penetrating vertically and a frame body side insulating layer 540 covering the outer peripheral surface of the frame body main body 531.

[0008] In the illustrated embodiment, the bus bar assembly 500 has first to third bus bars 510(1) to (3) as the plurality of bus bars 510, and the first and second bus bars 510(1), (2) are arranged side by side with a first gap 519(1) interposed therebetween, and the second and third bus bars 510(2), (3) are arranged side by side with a second gap 519(2) interposed therebetween. The busbar side insulating layer 520 has, as the gap filling portion 529, first and second gap filling portions 529(1), (2) that fill the first and second gaps 519(1), (2), respectively.

[0009] In the planar bus bar assembly 500, some of the first to third bus bars 510(1) to (3) act as anodes, and the remaining act as cathodes.

[0010] The upper surface laminated portion 521 is provided with first to third upper surface openings 522(1) to (3) that expose at least a portion of the upper surface of each of the first to third bus bars 510(1) to (3).

[0011] The portion of the upper surface of the first bus bar 510(1) that is exposed through the first upper surface opening 522(1) forms the upper surface connection portion 512 of the first bus bar 510(1), the portion of the upper surface of the second bus bar 510(2) that is exposed through the second upper surface opening 522(2) forms the upper surface connection portion 512 of the second bus bar 510(2), and the portion of the upper surface of the third bus bar 510(3) that is exposed through the third upper surface opening 522(3) forms the upper surface connection portion 512 of the third bus bar 510(3).

[0012] In the semiconductor module 600 shown in FIG. 23, the first and second bus bars 510(1), (2) are used as one of the anode and cathode (e.g., the anode), and the third bus bar 510(3) is used as the other of the anode and cathode (e.g., the cathode), and first and second semiconductor elements 110(1), 110(2) such as LEDs are attached to the upper surface side connection portions 512 of the first and second bus bars 510(1), (2), respectively.

[0013] In detail, each of the first and second semiconductor elements 110 has an element body 115 and an upper electrode layer 111 and a lower electrode layer 112 arranged on one side and the other side of the element body 115 in the thickness direction, respectively.

[0014] The lower electrode layer 112 of the first semiconductor element 110(1) is fixed to the upper surface connection portion 512 of the corresponding first bus bar 510(1), and the lower electrode layer 112 of the second semiconductor element 110(2) is fixed to the upper surface connection portion 112 of the corresponding second bus bar 110(2).

[0015] The upper electrode layer 111 of the first semiconductor element 110(1) is electrically connected to the upper surface connection portion 512 of the third bus bar 510(3) via an electrical connection member such as a first wire 120(1), and the upper electrode layer 111 of the second semiconductor element 110(2) is electrically connected to the upper surface connection portion 512 of the third bus bar 510(3) via an electrical connection member such as a second wire 120(2).

[0016] In the illustrated embodiment, the busbar-side insulating layer 520 further includes a lower-surface-side laminated portion 523 that covers the lower surface of the busbar connected body on the other side in the plate thickness direction, and a side-surface-side laminated portion 525 that covers the side surface of the busbar connected body, and the lower-surface-side laminated portion 523 is provided with first to third lower-surface-side openings 524(1) to (3) that expose at least a portion of the lower surface of each of the first to third busbars 510(1) to 510(3).

[0017] The portion of the underside of the first bus bar 510(1) that is exposed through the first lower-side opening 524(1) forms a lower-side connection portion 513 that acts as an external connection terminal for the first bus bar 510(1), the portion of the underside of the second bus bar 510(2) that is exposed through the second lower-side opening 524(2) forms a lower-side connection portion 513 that acts as an external connection terminal for the second bus bar 510(2), and the portion of the underside of the third bus bar 510(3) that is exposed through the third lower-side opening 524(3) forms a lower-side connection portion 513 that acts as an external connection terminal for the third bus bar 510(2).

[0018] As shown in FIG. 23, the frame body 530 is a member for preventing the outflow and detachment of the sealing resin body 130 that protects the first and second semiconductor elements 110(1), (2) and the first and second wires 120(1), (2), and is fixed to the upper surface of the bus bar connector with the first to third upper surface openings 522(1) to (3) positioned within the central hole 537 in a plan view.

[0019] That is, the sealing resin body 130 is formed by pouring insulating resin onto the upper surface of the bus bar connector so as to surround the first and second semiconductor elements 110(1), (2) and the first and second wires 120(1), (2) and then hardening the insulating resin, and the frame body 530 prevents the insulating resin from flowing out before hardening and also prevents the sealing resin body 130 from detaching from the bus bar assembly 500 after hardening.

[0020] The above-mentioned Patent Document 4 describes a manufacturing method (hereinafter referred to as a conventional manufacturing method) that can efficiently manufacture the frame-attached planar busbar assembly 500. A conventional manufacturing method will be described below.

[0021] The conventional manufacturing method includes a frame forming process for forming the frame 530. FIG. 24(a) shows a plan view of a frame plate 700 used in a conventional manufacturing method. The frame body forming process includes a step of preparing a frame body flat plate 700 made of a conductive metal including a frame body forming region 710 having a planar external shape and thickness corresponding to the frame body main body 531, and a central hole forming step of forming the central hole 537 in the frame body forming region 710 to form a ring-shaped body 720 corresponding to the frame body main body 531. FIG. 24(a) shows the state after the central hole forming step.

[0022] As shown in FIG. 24(a), the frame body flat plate 700 has a frame body row 705 along a first direction (Y direction in FIG. 24) of the XY plane on which the frame body flat plate 700 is located.

[0023] The frame body row 705 has a plurality of (five in the illustrated embodiment) frame body forming regions 710 arranged in series along a first direction of the XY plane, and a plurality of (six in the illustrated embodiment) frame body side connecting pieces 730 that integrally connect the plurality of frame body forming regions 710.

[0024] FIG. 24(b) shows a cross-sectional view taken along line XXIV(b)-XXIV(b) in FIG. 24(a). As shown in Figure 24(b), in the conventional manufacturing method, the central hole 537 formed by the central hole forming process has the same opening diameter (same opening width) throughout the entire thickness direction of the frame body forming region 710.

[0025] The frame forming process further includes a frame side coating step of coating the outer peripheral surface of the annular body 720 with a frame side insulating resin paint 740 that forms the frame side insulating layer 540 . FIG. 25 shows a plan view of the frame plate 700 after the frame side coating step.

[0026] Conventional manufacturing methods include a bus bar forming process that is performed before or after the frame forming process, or in parallel with the frame forming process.

[0027] FIG. 26 shows a plan view of a bus bar plate 650 used in a conventional manufacturing method. The bus bar forming process includes a step of preparing the bus bar flat plate 650 made of a conductive metal. FIG. 26 shows the state after the slit forming step described below.

[0028] As shown in FIG. 26, the bus bar plate 650 has a bus bar row 655 extending along a first direction (Y direction in FIG. 26 below) of the XY plane on which the bus bar plate 650 is located.

[0029] The busbar row 655 has an outer shape in a plan view corresponding to the busbar connecting body and has the same thickness as the busbars 510 (the first to third busbars 510(1) to (3)). The busbar row 655 has a plurality of (five in the illustrated form) busbar forming regions 660 arranged in series at the same pitch as the frame body forming regions 710 along the same direction as the frame body row 705 (the Y direction in the XY plane), and a plurality of (six in the illustrated form) busbar side connecting pieces 680 that integrally connect the plurality of busbar forming regions 660.

[0030] The busbar forming process includes a slit forming step. The slit forming step is configured to form first and second slits 669(1), 669(2) that penetrate the busbar forming region 660 in the plate thickness direction and have the same width as the first and second gaps 519(1), (2), thereby dividing the busbar forming region 660 into a plurality of first to third busbar forming portions 670(1) to (3) that correspond to the first to third busbars 510(1) to (3).

[0031] As shown in FIG. 26, the first and second slits 669(1), (2) formed in one busbar forming region 660 in the slit forming process have one longitudinal end extending into a busbar side connecting piece 680 connected to one side (e.g., the lower side in FIG. 26) of the one busbar forming region 660 in the first direction (the Y direction in the illustrated form), and the other longitudinal end extending into a busbar side connecting piece 680 connected to the other side (e.g., the upper side in FIG. 26) of the one busbar forming region 660 in the first direction.

[0032] The busbar forming process further includes a busbar side application process for applying a busbar side insulating resin paint 690 to the inside of the first and second slits 669 and the outer peripheral surface of the busbar forming area 660, which forms the busbar side insulating layer 520. FIG. 27 shows a plan view of the bus bar plate 650 after the bus bar side coating step.

[0033] The conventional manufacturing method further includes a flat plate fixing process in which the bus bar flat plate 650 and the frame flat plate 700 are fixed together in a state in which the frame body forming region 710 is overlapped with the bus bar forming region 660. FIG. 28 shows a plan view of the bus bar forming plate 650 and the frame forming plate 700 after the plate fixing step.

[0034] The conventional manufacturing method further includes a laser light irradiation step that is carried out after the flat plate fixing step. FIG. 29 shows a plan view of the frame body flat plate 700 and the bus bar flat plate 650 after the laser light irradiation step.

[0035] As shown in Figure 29, the laser light irradiation process is configured to irradiate laser light 290 onto areas where the first to third upper surface openings 522(1) to (3) are to be formed (first to third upper surface opening formation areas 522a(1) to (3) in Figures 30(a) and (b) below) of the busbar side insulating resin paint 690, which is applied to the upper surface of the busbar forming area 660 to form the upper surface side laminated portion 521 (see Figures 22(a), (b) and 23).

[0036] However, in the conventional bus bar assembly 500 , there is a risk that part of the bus bar side insulating resin paint 690 that should be removed may remain as residue 695 inside the upper surface opening 522 .

[0037] The laser light irradiation process also includes a process of irradiating laser light 290 onto areas where the first to third lower surface openings 524(1) to (3) should be formed (first to third lower surface opening formation areas 524a(1) to (3) in Figures 30(a) and (b) below) of the busbar side insulating resin paint 690, which is applied to the underside of the busbar forming area 660 to form the lower surface side laminated portion 523 (see Figures 22(a), (b) and 23).

[0038] FIG. 30(a) shows a vertical cross-sectional view of the frame body forming region 710 and the bus bar forming region 660 after the flat plate fixing step, taken along the line XXX(a)-XXX(a) in FIG.

[0039] The flat plate fixing process is configured to fix the frame body flat plate 700 and the bus bar flat plate 650 together by pressing the frame body forming region 710 against the bus bar forming region 660 while the frame body side insulating resin paint 740 is fully cured and the bus bar side insulating resin paint 690 is semi-cured, and then completely curing the semi-cured bus bar side insulating resin paint 690.

[0040] Therefore, as shown in Figure 30(a), when the frame body forming region 710 is pressed against the upper surface of the busbar forming region 660, a part of the semi-cured busbar side insulating resin paint 690 located directly below the frame body forming region 710 protrudes toward the inner surface of the frame body forming region 710 (i.e., toward the central hole 537), and as a result, the thickness of the busbar side insulating layer 520 may become locally thick in the lower end region of the inner surface of the frame body forming region 710 (hereinafter, this thickened portion will be referred to as the large thickness portion 527).

[0041] FIG. 30(b) shows a vertical cross-sectional view of the frame body forming region 710 and the bus bar forming region 660 in a state where the laser light 290 is schematically displayed in the laser light irradiation step. Furthermore, FIG. 30(c) shows a vertical cross-sectional view of the frame body forming region 710 and the bus bar forming region 660 after the laser light irradiation step, taken along the line XXX(c)-XXX(c) in FIG.

[0042] Here, if the large-thickness portion 527 extends into the closely opposing upper surface opening formation regions (the first and third upper surface opening formation regions 522a(1), (3)), as shown in Figures 22(a), 22(b), 23 and 30(c), a problem may occur in which part of the bus bar side insulating resin paint 690 in the first and third upper surface openings 522a(1), (3), which should be removed in the laser light irradiation process, is left behind as residue 695.

[0043] In particular, it is desirable to reduce the size of the busbar assembly 500 in the planar direction as well, and in order to reduce the size in the planar direction as much as possible, it is desirable to narrow the planar distance between the inner surface of the frame main body 531 and the opposing top surface opening 522. However, when the distance in the planar direction between the inner surface of the frame body main body 531 and the opposing upper surface opening 522 is narrowed, the above-mentioned inconvenience is likely to occur.

[0044] Figure 30(d) shows a vertical cross-sectional view of the frame body forming region 710 and the busbar forming region 660 with the first and second semiconductor elements 110(1), (2) attached to the upper surface side connection portion 512 exposed by the upper surface side opening 522. FIG. 31 shows an enlarged view of part XXXI in FIG. 30(d).

[0045] As shown in FIGS. 30(d) and 31, if the residue 695 exists, there is a risk of poor contact of the semiconductor element 110(1) attached to the upper surface side connecting portion 512. [Prior art documents] [Patent documents]

[0046] [Patent Document 1] Patent No. 4432913 [Patent Document 2] Patent No. 6487769 [Patent Document 3] Patent No. 6637002 [Patent Document 4] Patent No. 6637003 Summary of the Invention [Problem to be solved by the invention]

[0047] An object of the present invention is to provide a busbar assembly including: a plurality of busbars arranged in parallel on the same plane; gap fillers filled in gaps between adjacent busbars; and a top laminated portion covering an upper surface of a busbar connected body formed by connecting the plurality of busbars by the gap fillers, wherein the top laminated portion has a busbar-side insulating layer provided with one or more top openings exposing at least a portion of the top surface of each of the plurality of busbars; and a frame body having an annular frame body main body provided with a central hole penetrating in the plate thickness direction and a frame-side insulating layer covering the outer peripheral surface of the frame body, the frame body being fixed to the periphery of the upper surface of the busbar connected body so that the top opening is located within the central hole in a plan view; and a method for manufacturing the busbar assembly. [Means for solving the problem]

[0048] In order to achieve the above object, the present invention provides a frame body including: a plurality of bus bars formed of a conductive flat plate member and arranged in the same plane with gaps between opposing side surfaces; gap filling portions filled in the gaps; and a top surface laminate portion covering an upper surface on one side in a plate thickness direction of a bus bar connected together by the gap filling portions, the top surface laminate portion having a bus bar side insulating layer with one or more top surface openings that expose at least a part of the upper surface of each of the plurality of bus bars; a frame body having an annular frame body main body with a central hole penetrating in the plate thickness direction and a frame body side insulating layer covering an outer peripheral surface of the frame body, the frame body being fixed to the upper surface of the bus bar connected together via the top surface laminate portion with the one or more top surface openings positioned within the central hole in a plan view; the frame body main body having upper and lower surfaces facing one and the other side in the plate thickness direction, an inner surface facing the central hole, and an outer surface positioned opposite to the central hole; Adjacent to the lower surface The busbar assembly has a lower end portion on the other side in the plate thickness direction that is farther away from the center position of the busbar connecting body in a plan view in the planar direction than other portions in the plate thickness direction over the entire periphery.

[0049] The present invention also provides a method for manufacturing a busbar connecting body including a busbar-side insulating layer, the busbar-side insulating layer having one or more upper surface openings formed by laser beam irradiation to expose at least a portion of the upper surface of each of the plurality of busbars ... a frame body having an annular frame body main body with a central hole of an inverted tapered hole whose diameter increases toward the other side, and a frame body side insulating layer covering an outer peripheral surface of the frame body, the frame body being fixed to an upper surface of the busbar connected body via the upper surface side laminated portion in a state in plan view where the one or more upper surface side openings are located within the central hole, the method comprising the steps of: preparing a busbar flat plate made of a conductive metal including a busbar forming region having an outer shape in plan view corresponding to the busbar connected body; and inserting a conductive metal plate through the busbar forming region in a plate thickness direction and having the same width as the gap. a busbar-side coating step of applying a busbar-side insulating resin paint to form the busbar-side insulating layer at least in the slits and on an upper surface of the busbar-forming region; and a frame-forming process performed from the step of preparing a busbar plate to before or after the busbar-side coating step, or in parallel with these steps, the frame-forming process including a step of preparing a frame-forming plate including a frame-forming region having an outer shape in a plan view corresponding to the frame body; a frame forming process including a central hole forming step of forming the central hole in a forming region to form an annular body corresponding to the frame main body, and a frame side coating step of coating a frame side insulating resin paint on the outer peripheral surface of the annular body to form the frame side insulating layer; and a plate fixing step of pressing the lower surface of the frame forming region to the upper surface of the busbar forming region while at least one of the busbar side insulating resin paint and the frame side insulating resin paint is in a semi-cured state, and completely curing the semi-cured insulating resin paint, thereby fixing the busbar forming plate and the frame body flat plate together; Complete constructionThe present invention provides a method for manufacturing a busbar assembly, which is configured to prepare a tapered punch corresponding to the inverted tapered hole and press the punch from the lower surface side of the frame body forming area toward the upper surface side. [Effects of the Invention]

[0050] A busbar assembly according to the present invention includes a plurality of busbars arranged in parallel on the same plane, gap filling portions filled in gaps between adjacent busbars, and a top surface laminated portion covering an upper surface of a busbar connected body formed by connecting the plurality of busbars by the gap filling portions, the top surface laminated portion including a busbar side insulating layer provided with one or more top surface openings that expose at least a portion of the top surface of each of the plurality of busbars, and a frame body having an annular frame body main body provided with a central hole penetrating in a plate thickness direction and a frame body side insulating layer that covers an outer peripheral surface of the frame body, the frame body being fixed to a periphery of the upper surface of the busbar connected body so that the top surface opening is located within the central hole in a plan view, and Adjacent to the lower surface The lower end portion on the other side in the plate thickness direction is farther away in the planar direction from the center position of the busbar connector in a planar view than other portions in the plate thickness direction around the entire circumference. This effectively prevents or reduces the large thickness portion of the insulating layer that may occur at the lower end portion of the inner surface of the frame body from extending into the upper surface opening, thereby effectively preventing or reducing the formation of residue of the insulating layer in the upper surface opening. [Brief explanation of the drawings]

[0051] [Figure 1] 1(a) to 1(c) are respectively a plan view of a busbar assembly according to one embodiment of the present invention, a cross-sectional view taken along line I(b)-I(b) in FIG. 1(a), and a cross-sectional view taken along line I(c)-I(c) in FIG. 1(a). [Figure 2] FIG. 2 is a vertical cross-sectional view of a semiconductor module in which semiconductor elements such as LEDs are mounted on the bus bar assembly. [Figure 3]FIG. 3 is an enlarged view of part III in FIG. [Figure 4] 4(a) to 4(c) are respectively a plan view of a busbar assembly according to a first modified example of the embodiment, and cross-sectional views taken along line IV(b)-IV(b) in FIG. 4(a) and line IV(c)-IV(c) in FIG. 4(a). [Figure 5] FIG. 5 is a plan view of a busbar plate used in a first manufacturing method for manufacturing the busbar assembly according to the embodiment. [Figure 6] FIG. 6 is a plan view of the bus bar forming plate after the slit forming step in the first manufacturing method. [Figure 7] 7(a) and (b) are a plan view of the busbar plate after the busbar-side coating step in the first manufacturing method and a cross-sectional view taken along line VII(b)-VII(b) in FIG. 7(a), respectively. [Figure 8] 8 is a plan view of a frame plate used in the first manufacturing method. [Figure 9] 9(a) and 9(b) are a plan view of the frame plate after the central hole forming step in the first manufacturing method and a cross-sectional view taken along line IX(b)-IX(b) in FIG. 9(a), respectively. [Figure 10] 10(a) to 10(c) are schematic process diagrams of the central hole forming step. [Figure 11] FIG. 11 is a plan view of the frame plate after the frame-side coating step in the first manufacturing method. [Figure 12] Figure 12(a) is a plan view of the frame body flat plate and the bus bar flat plate after the flat plate fixing step in the first manufacturing method, and Figure 12(b) is a cross-sectional view taken along line XII(b)-XII(b) in Figure 12(a). [Figure 13] FIG. 13 is a plan view of the frame-forming plate and the busbar-forming plate after the laser light irradiation step in the first manufacturing method. [Figure 14]14(a) and (b) are an enlarged view of part XIV(a) in FIG. 13 and a cross-sectional view taken along line XIV(b)-XIV(b) in FIG. 14(a), respectively. [Figure 15] Fig. 15(a) is a longitudinal cross-sectional view of the frame body plate and the busbar plate after the plate fixing step and before the laser light irradiation step, and corresponds to Fig. 12(b). Fig. 15(b) is a longitudinal cross-sectional view of the frame body plate and the busbar plate in a state in which the laser light in the laser light irradiation step is schematically displayed. Fig. 15(c) is a longitudinal cross-sectional view of the frame body plate and the busbar plate after the laser light irradiation step. Fig. 15(d) is a longitudinal cross-sectional view of the frame body plate and the busbar plate in a state in which first and second semiconductor elements are mounted. [Figure 16] FIG. 16 is a vertical cross-sectional view of a busbar assembly according to a second modified example of the embodiment. [Figure 17] Figures 17(a) and (b) are, respectively, a plan view of a frame body flat plate used in a second manufacturing method for manufacturing a busbar assembly relating to the second modified example, and a cross-sectional view along line XVII(b)-XVII(b) in Figure 17(a). [Figure 18] 18(a) to 18(c) are schematic process diagrams of the center hole forming step in the second manufacturing method. [Figure 19] FIG. 19 is a vertical cross-sectional view of a busbar assembly according to a third modified example of the embodiment. [Figure 20] Figures 20(a) and (b) are a plan view and a cross-sectional view along the line XX(b)-XX(b) in Figure 20(a), respectively, of a frame body flat plate used in a third manufacturing method for manufacturing a busbar assembly relating to the third modified example. [Figure 21] 21(a) to 21(c) are schematic process diagrams of the central hole forming step in the third manufacturing method. [Figure 22] 22(a) and 22(b) are a plan view of a conventional busbar assembly and a cross-sectional view taken along line XXII(b)-XXII(b) in FIG. 22(a), respectively. [Figure 23]FIG. 23 is a vertical cross-sectional view of a semiconductor module in which semiconductor elements such as LEDs are mounted on a conventional bus bar assembly. [Figure 24] Fig. 24(a) is a plan view of a frame plate used in a conventional manufacturing method for manufacturing a conventional busbar assembly, after a central hole forming step in the conventional manufacturing method, and Fig. 24(b) is a cross-sectional view taken along line XXIV(b)-XXIV(b) in Fig. 24(a). [Figure 25] FIG. 25 is a plan view of the frame plate after the frame-side coating step in the conventional manufacturing method. [Figure 26] FIG. 26 is a plan view of a bus bar forming plate used in a conventional manufacturing method, showing the state after the slit forming step in the conventional manufacturing method. [Figure 27] FIG. 27 is a plan view of the bus bar forming plate after the bus bar side coating step in the conventional manufacturing method. [Figure 28] FIG. 28 is a plan view of the bus bar forming plate and the frame forming plate after the plate fixing step in the conventional manufacturing method. [Figure 29] FIG. 29 is a plan view of the frame-forming plate and the busbar-forming plate after the laser light irradiation step in the conventional manufacturing method. [Figure 30] Fig. 30(a) is a longitudinal cross-sectional view of the frame body forming region of the frame body plate and the busbar forming region of the busbar forming plate after the flat plate fixing step, taken along line XXX(a)-XXX(a) in Fig. 28. Fig. 30(b) is a longitudinal cross-sectional view of the frame body forming region and the busbar forming region, with the laser light in the laser light irradiation step being schematically displayed. Fig. 30(c) is a longitudinal cross-sectional view of the frame body forming region and the busbar forming region after the laser light irradiation step, taken along line XXX(c)-XXX(c) in Fig. 29. Fig. 30(d) is a longitudinal cross-sectional view of the frame body forming region and the busbar forming region with first and second semiconductor elements mounted thereon. [Figure 31] FIG. 31 is an enlarged view of part XXXI in FIG. 30(d). DETAILED DESCRIPTION OF THE INVENTION

[0052] Hereinafter, an embodiment of a busbar assembly according to the present invention will be described with reference to the accompanying drawings. FIG. 1(a) shows a plan view of a busbar assembly 1 according to this embodiment. 1(b) and 1(c) are cross-sectional views taken along lines I(b)-I(b) and I(c)-I(c) in FIG. 1(a), respectively. Furthermore, FIG. 2 shows a vertical cross-sectional view of a semiconductor module 101 in which a semiconductor element 110 such as an LED is mounted on the bus bar assembly 1.

[0053] As shown in Figures 1(a) to 1(c) and 2, the busbar assembly 1 includes: a plurality of busbars 10 formed of a conductive flat plate member and arranged in parallel in the same plane with gaps 19 between opposing side surfaces 15; a busbar-side insulating layer 20 including gap-filling portions 29 filled in the gaps 19 and an upper surface-side laminated portion 21 arranged on the upper surface of a busbar connected body formed by connecting the plurality of busbars 10 via the gap-filling portions 29; and a frame body 30 fixed to the upper surface of the busbar connected body via the upper surface-side laminated portion 21, the frame body 30 having an annular frame body main body 31 with a central hole 37 penetrating in the plate thickness direction and a frame body-side insulating layer 40 covering the outer peripheral surface of the frame body main body 31.

[0054] The bus bar 10 is made of a conductive metal such as Cu. The busbar assembly 1 according to this embodiment has three busbars, namely, first to third busbars 10(1) to 10(3), as the plurality of busbars 10, and has first and second gaps 19(1) and 19(2) as the gaps 19.

[0055] That is, the busbar assembly 1 has the first busbar 10(1), a second busbar 10(2) arranged adjacent to the first busbar 10(1) via a first gap 19(1), and a third busbar 10(3) arranged adjacent to the second busbar 10(2) via a second gap 19(2).

[0056] Each of the bus bars 10(1) to 10(3) has an upper surface 11 and a lower surface 12 facing one side and the other side in the thickness direction, respectively, and a side surface 15 connecting the upper surface 11 and the lower surface 13, and the side surfaces 15 of adjacent bus bars 10 face each other via the gap 19.

[0057] The busbar side insulating layer 20 is formed by an insulating resin coating film having heat resistance and insulating properties, such as polyamideimide, polyimide, polyamide, or epoxy, and is preferably formed using Insulead (registered trademark).

[0058] The upper surface side laminated portion 21 is provided with one or more upper surface side openings 22 that expose at least a portion of the upper surface of each of the first to third bus bars 10(1), 10(2). In this embodiment, as shown in Figures 1 and 2, the upper surface side laminated portion 21 is provided with first to third upper surface side openings 22(1) to 22(3) that expose portions of the upper surfaces of the first to third bus bars 10(1) to 10(3), respectively.

[0059] Alternatively, the upper surface laminated portion 21 may be provided with a single upper surface opening that integrally exposes a portion of the upper surfaces 11 of the plurality of bus bars 10 (the first to third bus bars 10(1) to (3)).

[0060] The portions of the upper surfaces 11 of the first to third bus bars 10(1) to (3) that are exposed through the upper surface openings (in this embodiment, the first to third upper surface openings 22(1) to (3)) form upper surface connection portions 12.

[0061] As shown in FIG. 2, the upper surface side connection portion 12 functions as an element connection portion to which a semiconductor element 110 such as an LED to be mounted on the bus bar assembly 1 is mounted or electrically connected.

[0062] A part of the first to third bus bars 10(1) to 10(3) acts as a first electrode (e.g., an anode) that is one of an anode and a cathode, and the rest of the first to third bus bars 10(1) to 10(3) acts as a second electrode (e.g., a cathode) that is the other of an anode and a cathode.

[0063] In the semiconductor module 101 shown in FIG. 2, the first and second bus bars 10(1), 10(2) act as first electrodes, and the third bus bar 10(3) acts as a second electrode.

[0064] That is, in the semiconductor module 101, first and second semiconductor elements 110(1) and 110(2) are mounted on the first and second bus bars 10(1) and 10(2), respectively, which act as first electrodes.

[0065] In detail, each of the first and second semiconductor elements 110(1), 110(2) has an upper electrode layer 111 and a lower electrode layer 112 on the upper surface on one side in the thickness direction and on the lower surface on the other side in the thickness direction, respectively, and has an element body 115 between the upper electrode layer 111 and the lower electrode layer 112.

[0066] In the semiconductor module 101, the lower electrode layer 112 of the first semiconductor element 110(1) is fixed in an electrically connected state to the upper surface connection portion 12 of the first bus bar 10(1), and the lower electrode layer 112 of the second semiconductor element 110(2) is fixed in an electrically connected state to the upper surface connection portion 12 of the second bus bar 10(2).

[0067] The upper electrode layers 111 of the first and second semiconductor elements 110(1), 110(2) are electrically connected to the upper surface connection portion 12 of the third bus bar 10(3), which acts as a second electrode, via first and second wires 120(1), 120(2), respectively.

[0068] Preferably, a plating layer (not shown) is provided on the upper surfaces of the first to third bus bars 10(1) to 10(3).

[0069] In this case, the lower electrode layers 112 of the first and second semiconductor elements 110(1) and 110(2) are die-bonded to the plating layers of the upper surface connection portions 12 of the first and second bus bars 10(1) and 10(2), respectively, and the upper electrode layers 111 of the first and second semiconductor elements 110(1) and 110(2) are wire-bonded to the plating layers (not shown) of the upper surface connection portions 12 of the third bus bar 10(3) by the first and second wires 120(1) and 120(2), respectively.

[0070] At least a part of the lower surface 13 of each of the first to third bus bars 10(1), 10(2) is exposed to form a lower surface side connection portion .

[0071] In this embodiment, as shown in FIG. 1(b), the busbar side insulating layer 20 has a lower surface side laminated portion 23 that covers the lower surface of the busbar connected body, and the lower surface side laminated portion 23 is provided with first to third lower surface side openings 24(1) to (3) that expose portions of the lower surfaces 13 of the first to third busbars 10(1) to (3), respectively.

[0072] Alternatively, the lower surface laminated portion 23 may be provided with a single lower surface opening that integrally exposes a portion of the lower surfaces 13 of the plurality of bus bars 10 (the first to third bus bars 10(1) to (3)).

[0073] The portions of the lower surfaces 13 of the first to third bus bars 10(1) to 10(3) that are exposed through the lower surface openings (in this embodiment, the first to third lower surface openings 24(1) to (3)) form the lower surface connection portions 14. The lower surface side connection portions 14 function as external connection terminals for electrically connecting the corresponding bus bars 10(1) to 10(3) to the outside.

[0074] In this embodiment, the busbar-side insulating layer 20 integrally includes, in addition to the gap-filling portion 29, the upper surface-side laminated portion 21, and the lower surface-side laminated portion 23, a side surface-side laminated portion 25 that covers the side surfaces of the busbar connected body.

[0075] The frame body 30 is a member for holding the sealing resin body 130 that protects the semiconductor element 110 (in this embodiment, the first and second semiconductor elements 110(1), 110(2)) and the wire 120 (in this embodiment, the first and second wires 120(1), 120(2)) mounted on the busbar assembly 1.

[0076] As shown in Figures 1 and 2, the frame body 30 is fixed to the upper surface of the busbar connecting body via the upper surface laminated portion 21 in a state where the upper surface openings 22 (in this embodiment, the first to third upper surface openings 22(1) to 22(3)) are located within the central hole 37 in a plan view.

[0077] The frame body 31 can be made of various materials. For example, the frame body 31 is formed of a conductive metal member (preferably the same member as the bus bar 10).

[0078] The frame-side insulating layer 40 is formed of an insulating resin coating having heat resistance and insulating properties, such as polyamideimide, polyimide, polyamide, or epoxy, and is preferably formed using Insulead (registered trademark).

[0079] The sealing resin layer 130 is made of a transparent insulating resin material such as polyimide, polyamide, or epoxy.

[0080] Specifically, the insulating resin material that forms the sealing resin layer 130 is poured into the storage space defined by the frame body 30 so as to surround the first and second semiconductor elements 110(1), 110(2) and the first and second wires 120(1), 120(2). The frame 30 prevents the insulating resin material from flowing out before hardening, and prevents the sealing resin layer 130 from detaching from the bus bar assembly 1 after hardening.

[0081] FIG. 3 shows an enlarged view of part III in FIG. 1(b). As shown in Figures 1 to 3, the frame body main body 31 has an upper surface 32 and a lower surface 33 facing one side and the other side in the plate thickness direction, respectively, an inner surface 34 facing the central hole 37, and an outer surface 35 located on the opposite side of the central hole 37.

[0082] At least in the opening-facing portion 34a of the inner surface 34 that faces the upper surface opening 22, the lower end portion on the other side in the plate thickness direction is farthest in the planar direction from the center position S (see Figure 1(a)) of the busbar connector in a planar view than other portions in the plate thickness direction.

[0083] In this embodiment, as shown in FIG. 3, at least the opening-facing portion 34a of the inner surface 34 is an inclined surface whose planar distance from the center position S (see FIG. 1(a)) of the busbar connector in a plan view increases from one side to the other side in the plate thickness direction.

[0084] With the busbar assembly 1 having such a configuration, when the insulating layer in a predetermined region of the upper surface side laminate portion 21 is removed with laser light to form the upper surface side opening 22, it is possible to effectively prevent or reduce the situation in which part of the insulating layer to be removed is left behind as residue. Such effects will be described in detail in the description of the manufacturing method below.

[0085] In this embodiment, as shown in Figures 1(a) to (c), the inner surface 34 of the frame body main body 31 is made into the inclined surface around the entire circumference, and the central hole 37 is made into an inverted tapered hole whose diameter increases from the upper surface 32 on one side in the thickness direction of the frame body main body 31 to the lower surface 33 on the other side, but various modifications are possible as long as at least the opening-facing portion 34a of the inner surface 34 is made into the inclined surface.

[0086] FIG. 4(a) shows a plan view of a busbar assembly 2A according to a first modified example of the present embodiment. 4(b) and (c) show cross-sectional views taken along lines IV(b)-IV(b) and IV(c)-IV(c) in FIG. 4(a), respectively. In the drawings, the same components as those in this embodiment are given the same reference numerals, and the description thereof will be omitted as appropriate.

[0087] The busbar assembly 2A according to the first modification has a frame body 60A instead of the frame body 30, as compared with the busbar assembly 1 according to the present embodiment.

[0088] The frame 60A includes a frame main body 31A and the frame-side insulating layer 40.

[0089] In the frame body main body 31A, only the opening-facing portion 34a of the inner surface 34 that faces the central hole 37 is the inclined surface (see FIG. 4(b)) whose distance from the central position S (see FIG. 4(a)) in a plan view of the busbar connector increases from one side to the other in the plate thickness direction, and the other portions 34b other than the opening-facing portion 34a are vertical surfaces (see FIG. 4(c)) along the plate thickness direction.

[0090] A method for manufacturing the busbar assembly 1 according to this embodiment (hereinafter referred to as a first manufacturing method) will be described below.

[0091] FIG. 5 shows a plan view of a bus bar plate 200 used in the first manufacturing method. The first manufacturing method includes a step of preparing the bus bar plate 200 made of a conductive metal.

[0092] The busbar flat plate 200 has a planar shape corresponding to the busbar connected body formed by connecting multiple busbars 10 (the first to third busbars 10(1) to 10(3)) by the busbar side insulating layer 20, and is provided with a busbar assembly forming region 210 having the same thickness as the busbars 10.

[0093] That is, the length of the busbar assembly forming region 210 in a first direction (Y direction in FIG. 5) in the plane in which the busbar flat plate 200 is located is the same as the length in the direction parallel to the gap 19 of the busbar assembly 1, and the length in a second direction (X direction length in FIG. 5) perpendicular to the first planar direction in the plane is the same as the length in the direction perpendicular to the longitudinal direction of the gap 19 of the busbar assembly 1.

[0094] As shown in Figure 5, in this embodiment, the busbar flat plate 200 has a busbar row 205 including a plurality of (five in the illustrated configuration) busbar assembly forming areas 210 arranged in series along a first direction (Y direction) in the plane in which the flat plate 200 is located, and a connecting area 230 connecting adjacent busbar assembly forming areas 210 in the first direction, so that processing can be performed simultaneously on the plurality of busbar assembly forming areas 210.

[0095] In this embodiment, the busbar flat plate 200 has a pair of gripping pieces 207 connected to one side and the other side of the busbar row 205 in the longitudinal direction (Y direction), and alignment holes 208 are provided in the pair of gripping pieces 207.

[0096] It is also possible to arrange multiple busbar rows 205 in parallel in the second direction (X direction) in the plane, and hold the multiple busbar rows 205 arranged in parallel in the X direction integrally by the pair of gripping pieces 207, 207. According to this modified configuration, more bus bar assemblies 1 can be manufactured at the same time.

[0097] The first manufacturing method further includes a slit forming step. FIG. 6 shows a plan view of the bus bar forming plate 200 after the slit forming step.

[0098] The slit forming process is configured to form one or more slits 219 (first and second slits 219(1), 219(2)) that penetrate the busbar assembly forming area 210 in the thickness direction and have the same width as the gap 19 (the first and second gaps 19(1), 19(2)), thereby dividing the busbar assembly forming area 210 into a plurality of busbar forming regions 220 (first to third busbar forming regions 220(1) to 220(3)) that correspond to the plurality of busbars 10 (the first to third busbars 10(1) to 10(3)).

[0099] In the busbar assembly 1, the first gap 19(1) is located between the first and second busbars 10(1), 10(2) and the second gap 19(2) is located between the second and third busbars 10(2), 10(3). Therefore, the slit forming process is configured to form first and second slits 219(1), 219(2) having the same width as the first and second gaps 19(1), 19(2).

[0100] As shown in FIG. 6, in this embodiment, the first and second slits 219(1), 219(2) formed in one busbar assembly forming area 210A extend at one longitudinal side (Y direction) into one connecting area 230A connected to one longitudinal side (Y direction) of the one busbar assembly forming area 210A, and extend at the other longitudinal side (Y direction) into another connecting area 230B connected to the other longitudinal side (Y direction) of the one busbar assembly forming area 230.

[0101] After the slit forming step, the first to third busbar forming regions 220(1) to 220(3), which are adjacent to each other via the first and second slits 219(1), 219(2) formed in the one busbar assembly forming region 210A, are configured to be maintained in a connected state with each other via the one connecting region 230A and the other connecting region 230B. By providing such a configuration, the first and second slits 219(1), 219(2) (the first and second gaps 19(1), 19(2)) can be formed with high precision.

[0102] The first manufacturing method includes a bus bar side coating step that is performed after the slit forming step. 7(a) and (b) show a plan view of the busbar plate 200 after the busbar-side coating step and a cross-sectional view taken along line VII(b)-VII(b) in FIG. 7(a), respectively.

[0103] The busbar side coating process is configured to apply a busbar side insulating resin paint 240 that forms the busbar side insulating layer 20 to at least the inside of the first and second slits 219(1), 219(2) and the entire upper surface 211 of the busbar assembly forming area 210.

[0104] The bus bar side insulating resin coating material can be applied by, for example, electrodeposition coating, electrostatic powder coating, or spray coating.

[0105] As described above, in the busbar assembly, the busbar-side insulating layer 20 has a gap filling portion 29 filled in the gap 19 and an upper surface side laminate portion 21 provided on the upper surface of the busbar connected body, as well as a lower surface side laminate portion 21 and a side surface side laminate portion 25 provided on the lower surface and side surface, respectively, of the busbar connected body.

[0106] Therefore, the busbar side coating process is configured to apply the busbar side insulating resin paint 240 not only to the upper surface of the busbar assembly forming area 210 but also to the lower surface 213 and side surface 215, as shown in Figures 7(a) and (b).

[0107] The first manufacturing method further includes a frame forming process that is performed from the step of preparing the busbar plate 200 to the busbar side coating step, before or after the busbar side coating step, or in parallel with these steps.

[0108] FIG. 8 shows a plan view of a frame plate 300 used in the first manufacturing method. The frame forming process includes a step of preparing the frame plate 300 .

[0109] The frame-forming plate 300 includes a frame-forming region 310 having an outer shape and plate thickness in plan view corresponding to the frame main body 31 .

[0110] The frame plate 300 is made of various materials having rigidity. The frame plate 300 is formed, for example, from a conductive metal plate, and is preferably formed from the same material as the bus bar plate 200 from the viewpoint of manufacturing efficiency.

[0111] The frame-forming plate 300 is configured so that the frame-forming region 310 is aligned with the busbar assembly-forming region 210 when the frame-forming plate 300 is placed on the busbar-forming plate 200 .

[0112] In detail, as described above, the busbar plate 200 has a busbar row 205 including a plurality of the busbar assembly forming areas 210 arranged in series along the Y direction and a connecting area 230 connecting adjacent busbar assembly forming areas 210 in the Y direction.

[0113] Therefore, as shown in Figure 8, the frame body flat plate 300 has a frame body row 305 including a plurality of frame body forming regions 310 arranged in series in the Y direction at the same pitch as the plurality of busbar assembly forming regions 210, and a connecting region 330 connecting adjacent frame body forming regions 310 in the Y direction.

[0114] As mentioned above, the busbar flat plate 200 has a pair of gripping pieces 207 connected to one side and the other side of the busbar row 205 in the longitudinal direction (Y direction), and alignment holes 208 are provided in the pair of gripping pieces 207.

[0115] Accordingly, as shown in Figure 8, the frame body flat plate 300 is also provided with a pair of gripping pieces 307 connected to one side and the other side of the frame body row 305 in the longitudinal direction (Y direction), and the pair of gripping pieces 307 are provided with alignment holes 308 corresponding to the alignment holes 208.

[0116] The frame forming process further includes a central hole forming step of forming the central hole 37 in the frame forming region 310 to form an annular body 320 corresponding to the frame main body 31. FIG. 9(a) shows a plan view of the frame plate 300 after the central hole forming step. FIG. 9(b) shows a cross-sectional view taken along line IX(b)-IX(b) in FIG. 9(a).

[0117] As described above, in this embodiment, the central hole 37 is an inverted tapered hole whose diameter increases from the upper surface 311 on one side of the thickness direction of the frame body 310 to the lower surface 313 on the other side (see Figure 9(b)).

[0118] 10(a) to 10(c) are schematic process diagrams showing the central hole forming step. As shown in Figures 10(a) to (c), the central hole forming process is configured to prepare a tapered punch 380 corresponding to the inverted tapered hole, and to press the punch 380 from the lower surface 313 side of the frame main body 310 toward the upper surface 311 side. 10(a) to 10(c) denote fixing members that provide a passage for the punch 380 and fix the frame forming region 310. As shown in FIG.

[0119] The frame forming process further includes a frame side coating step of coating the outer peripheral surface of the annular body 320 with a frame side insulating resin paint 340 that forms the frame side insulating layer 40 . FIG. 11 shows a plan view of the frame plate 300 after the frame side coating step.

[0120] The frame-side insulating resin coating material 340 can be applied by, for example, electrodeposition coating, electrostatic powder coating, or spray coating.

[0121] The first manufacturing method further includes a flat plate fixing step. FIG. 12(a) shows a plan view of the frame-forming plate 300 and the bus bar-forming plate 200 after the plate fixing step. FIG. 12(b) shows a cross-sectional view taken along line XII(b)-XII(b) in FIG. 12(a).

[0122] As shown in Figures 12(a) and (b), the flat plate fixing process is configured to fix the busbar flat plate 200 and the frame flat plate 300 together by pressing the lower surface of the frame forming region 310 against the upper surface of the busbar forming region 210 while at least one of the busbar side insulating resin paint 240 and the frame side insulating resin paint 340 is in a semi-cured state, and completely curing the semi-cured insulating resin paint.

[0123] The first manufacturing method further includes a laser light irradiation step that is carried out after the flat plate fixing step. FIG. 13 shows a plan view of the frame-forming plate 300 and the busbar-forming plate 200 after the laser light irradiation step. 14(a) is an enlarged view of part XIV(a) in FIG. 13, and FIG. 14(b) is a cross-sectional view taken along line XIV(b)-XIV(b) in FIG. 14(a).

[0124] As shown in Figures 13 and 14, the laser light irradiation process is configured to irradiate laser light onto areas of the upper surface side laminated portion 21 of the busbar side insulating layer 20 where the first to third upper surface side openings 22(1) to 22(3) are to be formed (first to third upper surface side opening formation areas 22a(1) to 22a(3) in Figures 15(a) and (b) below), to form the first to third upper surface side openings 22(1) to 22(3).

[0125] As described above, in this embodiment, the busbar side insulating layer 20 includes the lower surface side laminated portion 23, and the lower surface side laminated portion 23 is provided with the first to third lower surface side openings 24(1) to 24(3).

[0126] Therefore, the laser light irradiation process is configured to irradiate laser light onto areas of the lower surface stack 23 where the first to third lower surface openings 24(1) to 24(3) are to be formed (first to third lower surface opening formation areas 24a(1) to 24a(3) in Figures 15(a) and (b) below), thereby forming the first to third lower surface openings 24(1) to 24(3).

[0127] Here, the effects of the busbar assembly according to this embodiment will be described with reference to FIGS. 15(a) to 15(d). FIG. 15(a) is a vertical cross-sectional view of the frame-forming plate 300 and the busbar-forming plate 200 after the plate fixing step and before the laser light irradiation step, and corresponds to FIG. 12(b). FIG. 15(b) is a vertical cross-sectional view of the frame-forming plate 300 and the busbar-forming plate 200 in a state where a laser beam 290 is schematically shown in the laser beam irradiation step. FIG. 15(c) is a vertical cross-sectional view of the frame body flat plate 300 and the bus bar flat plate 200 in a state in which the first to third upper surface openings 22(1) to 22(3) and the first to third lower surface openings 24(1) to 25(3) have been formed by the laser light irradiation process. FIG. 15(d) is a vertical cross-sectional view of the frame body flat plate 300 and the bus bar flat plate 200 with the first and second semiconductor elements 110(1), 110(2) attached to the areas exposed by the first and second upper surface openings 22(1), 22(2).

[0128] As described above, in the flat plate fixing process, the process of pressing the lower surface 313 of the frame body forming region 310 (the annular body 320) to the upper surface 211 of the busbar forming region 210 is performed when at least one of the frame body side insulating resin paint 340 and the busbar side insulating resin paint 240 is in a semi-cured state (in this embodiment, the frame body side insulating resin paint 340 is in a fully cured state and the busbar side insulating resin paint 240 is in a semi-cured state).

[0129] Therefore, as shown in Figure 15(a), a part of the busbar side insulating resin paint 240 located directly below the frame body forming region 310 (the annular body 320) will protrude toward the inner surface of the annular body 320 (i.e., toward the central hole 37), which may result in a situation where the thickness of the busbar side insulating layer 20 becomes locally thick in the lower end region of the inner surface of the annular body 320 (hereinafter, this thickened portion will be referred to as the thick-thickness portion 27).

[0130] On the other hand, as shown in Figures 14(a) and (b) and Figure 15(a), in the busbar assembly 1 according to this embodiment, as described above, in at least the opening-facing portion 34a of the inner surface 34 of the frame body main body 31 formed by the annular body 320, the lower end portion is farthest in the planar direction from the center position S of the busbar connecting body in a planar view than other portions in the plate thickness direction of the inner surface 34.

[0131] According to this configuration, as shown in Figures 15(b) and (c), it is possible to effectively prevent or reduce the large-thickness portion 27 from reaching the first to third upper surface opening formation regions 22a(1) to 22a(3), and it is possible to effectively prevent or reduce the amount of part of the busbar-side insulating layer 20 remaining as residue in the first to third upper surface opening formation regions 22a(1) to 22a(3) when the first to third upper surface openings 22(1) to 22(3) are formed by the laser light irradiation process.

[0132] Therefore, as shown in FIG. 15(d), in the semiconductor element mounting process that is performed after the flat plate fixing process, the semiconductor elements 110(1), 110(2) can be reliably mounted in the correct posture on the upper surface side connection portions 12 exposed by the upper surface side openings (in this embodiment, the first and second upper surface side openings 22(1), 22(2)).

[0133] The first manufacturing method further includes a cutting process for cutting the busbar forming region 210 and the frame body forming region 310 in a fixed state from the busbar forming plate 200 and the frame body forming plate 300 after the semiconductor element mounting process. The cutting step is configured to cut the boundary between the busbar forming region 210 and the connecting region 230, and the boundary between the frame body forming region 310 and the connecting region 330, with a dicing blade.

[0134] In this embodiment, the central hole 37 of the frame body main body 31 (the annular body 320) is an inverted tapered hole whose diameter increases as it moves from one side to the other side in the thickness direction of the frame body main body 31, but the present invention is not limited to this form.

[0135] FIG. 16 shows a vertical cross-sectional view of a busbar assembly 2B according to a second modified example of the present embodiment. In the drawings, the same members as those in this embodiment are given the same reference numerals, and the description thereof will be omitted as appropriate.

[0136] The busbar assembly 2B according to the second modification differs from the busbar assembly 1 according to the present embodiment only in that the frame body 31 is changed to a frame body 71.

[0137] As shown in Figure 16, the frame body main body 71 is configured so that at least the opening-facing portion of the inner surface 74 has an upper thickness-direction extending surface 77 extending from the top surface 72 of the frame body main body 71 toward the other side in the thickness direction, a plate surface direction extending surface 78 extending from the other thickness-direction end of the upper thickness-direction extending portion 77 along the plate surface direction toward the opposite side from the central position of the busbar connector in a planar view, and a lower thickness-direction extending surface 79 extending from the end of the thickness-direction extending surface 78 opposite the central position in a planar view toward the other side in the thickness direction.

[0138] The bus bar assembly 2B according to the second modified example having such a configuration can also achieve the same effects as in this embodiment.

[0139] In the busbar assembly 2B according to the second modified example, the inner surface of the frame body main body 71 has the upper thickness-direction extending surface 77, the plate surface-direction extending surface 78, and the lower thickness-direction extending surface 79 around the entire periphery, and the central hole 37 formed in the frame body main body 71 is a stepped hole having a small-diameter hole 37a that extends from the upper surface 72 of the frame body main body 71 toward the other side in the thickness direction and terminates within the thickness of the frame body main body 71, and a large-diameter hole 37b that extends from the other end of the small-diameter hole 37a in the thickness direction toward the other side in the thickness direction and reaches the lower surface 73 of the frame body main body 71.

[0140] The busbar assembly 2B according to the second modified example can be efficiently manufactured by the second manufacturing method.

[0141] FIG. 17(a) shows a plan view of a frame body flat plate 350 used when manufacturing the frame body 71 of the bus bar assembly 2B according to the second modified example. FIG. 17(b) shows a cross-sectional view taken along line XVII(b)-XVII(b) in FIG. 17(a). In the drawings, the same members as those in this embodiment are given the same reference numerals, and the description thereof will be omitted as appropriate.

[0142] The second manufacturing method differs from the first manufacturing method only in that the central hole forming step is changed.

[0143] 18(a) to 18(c) are process diagrams showing the central hole forming step in the second manufacturing method. In the drawings, the same components as those in this embodiment are given the same reference numerals, and the description thereof will be omitted as appropriate.

[0144] As shown in Figures 18(a) to (c), the central hole forming process in the second manufacturing method is configured to prepare a two-stage punch 385 having a large diameter portion 386 with an outer diameter corresponding to the large diameter hole 37b and a small diameter portion 387 extending from the large diameter portion 386 toward the tip side and having an outer diameter corresponding to the small diameter hole 37a, and to press the two-stage punch 385 from the side of the lower surface 313 of the frame body forming region 320 toward the side of the upper surface 311.

[0145] FIG. 19 shows a vertical cross-sectional view of a busbar assembly 2C according to a third modified example of the present embodiment. In the drawings, the same components as those in this embodiment are given the same reference numerals, and the description thereof will be omitted as appropriate.

[0146] The busbar assembly 2C according to the third modified example differs from the busbar assembly 1 according to the present embodiment only in that the frame body 31 is changed to a frame body 81.

[0147] As shown in Figure 19, the frame body main body 81 is configured so that at least the opening-facing portion of the inner surface 84 has an upper thickness-direction extending surface 87 that extends along the thickness direction from the top surface 82 of the frame body main body 81 to the other side in the thickness direction, and an inclined surface 88 whose planar distance from the other end of the upper thickness-direction extending portion 87 to the center position of the busbar connector in a plan view increases as the inclined surface 88 moves toward the other side in the thickness direction.

[0148] The bus bar assembly 2C according to the third modified example having such a configuration can also achieve the same effects as in this embodiment.

[0149] In the busbar assembly 2C according to the third modified example, the entire inner surface of the frame body main body 81 has the upper thickness-direction extending surface 87 and the inclined surface 88, and the central hole 37 formed in the frame body main body 81 is a composite hole having a small-diameter hole 37c that extends from the upper surface 82 of the frame body main body 81 toward the other side in the thickness direction and terminates within the thickness of the frame body main body 81, and an inverted tapered hole 37d that increases in diameter from the other end of the small-diameter hole 37c in the thickness direction toward the other side in the thickness direction and reaches the lower surface 83.

[0150] The busbar assembly 2C according to the third modified example can be efficiently manufactured by the third manufacturing method.

[0151] FIG. 20( a ) shows a plan view of a frame plate 360 ​​used when manufacturing the frame 81 of the bus bar assembly according to the third modified example. Also, FIG. 20(b) shows a cross-sectional view taken along line XX(b)-XX(b) in FIG. 20(a). In the drawings, the same members as those in this embodiment are given the same reference numerals, and the description thereof will be omitted as appropriate.

[0152] The second manufacturing method differs from the first manufacturing method only in that the central hole forming step is changed.

[0153] 21(a) to 21(c) are process diagrams showing the central hole forming step in the third manufacturing method. In the drawings, the same members as those in this embodiment are given the same reference numerals, and the description thereof will be omitted as appropriate.

[0154] As shown in Figures 21(a) to (c), the central hole forming process in the third manufacturing method is configured to prepare a two-stage punch 390 having a tapered taper portion 391 corresponding to the reverse tapered hole 37d and a small diameter portion 392 extending from the tapered taper portion 391 toward the tip side, the small diameter portion 392 having an outer diameter corresponding to the small diameter hole 37c, and to press the two-stage punch 390 from the side of the lower surface 313 of the frame body forming region 310 toward the side of the upper surface 311. [Explanation of symbols]

[0155] 1, 2A~2C Busbar Assembly 10(1)~10(3) 1st~3rd bus bars 19(1), 19(2) First gap and second gap 20 Busbar side insulation layer 21 Upper surface layer 22(1)~22(3) 1st~3rd top side opening 22a(1)~22a(3) 1st~3rd upper surface side opening formation area 24(1)~24(3) 1st~3rd bottom side opening 24a(1)~24a(3) 1st~3rd lower surface side opening formation area 29 Gap filling part 30 Frame 31 Frame body 32 Top surface of frame body 33 Underside of frame body 34 Inner surface of frame body 35 Outer surface of frame body 37 Central hole 40 Frame side insulation layer 71 Frame body 72 Top surface of frame body 73 Underside of frame body 74 Inner surface of frame body 200 Busbar Plate 210 Busbar forming area 219(1), 219(2) First slit, second slit 220(1)~220(3) 1st to 3rd busbar forming areas 230 Consolidation area 240 Busbar side insulating resin paint 300 Frame plate 310 Frame forming area 320 Annular 330 Consolidation Area 340 Frame side insulating resin paint

Claims

1. a plurality of bus bars formed of conductive flat plate-like members and arranged in the same plane with gaps between opposing side surfaces; a busbar-side insulating layer including a gap filling portion filled in the gap and an upper surface laminate portion covering an upper surface on one side in the plate thickness direction of a busbar connected body formed by the gap filling portion and the busbar connected by the gap filling portion, the upper surface laminate portion having one or more upper surface openings that expose at least a part of an upper surface of each of the plurality of busbars; a frame having an annular frame body having a central hole penetrating in a plate thickness direction and a frame body side insulating layer covering an outer peripheral surface of the frame body, the frame being fixed to an upper surface of the bus bar connector via the upper surface side laminated portion in a state in which the one or more upper surface side openings are located within the central hole in a plan view, The frame body has an upper surface and a lower surface facing one side and the other side in the plate thickness direction, an inner surface facing the central hole, and an outer surface located on the opposite side to the central hole, a lower end portion of the inner surface on the other side in the thickness direction, adjacent to the lower surface, is farther away from the center position of the busbar connector in a plan view in the planar direction than other portions in the thickness direction over the entire circumference.

2. a busbar assembly including: a plurality of busbars formed of a conductive flat plate member and arranged in the same plane with gaps between opposing side surfaces; gap filling portions filling the gaps; and a top laminate portion covering an upper surface on one side in a plate thickness direction of a busbar connected body formed by the gap filling portions, the upper surface laminate portion having one or more top openings formed by laser light irradiation in the top laminate portion to expose at least a portion of the top surface of each of the plurality of busbars; and a frame body including: an annular frame body main body and a frame-side insulating layer covering an outer peripheral surface of the frame body, the frame body main body having a central hole that penetrates the top surface on one side in the plate thickness direction and the bottom surface on the other side in the plate thickness direction and is an inversely tapered hole whose diameter increases from one side to the other side in the plate thickness direction; preparing a busbar plate made of a conductive metal, the busbar plate including a busbar forming region having an outer shape in a plan view corresponding to the busbar connected body; a slit forming step of forming one or more slits in the busbar forming region, the slits penetrating the busbar forming region in a plate thickness direction and having the same width as the gap, to divide the busbar forming region into a plurality of busbar forming portions corresponding to the plurality of busbars; a busbar-side coating step of applying a busbar-side insulating resin paint to at least the interior of the slits and the upper surface of the busbar-forming region to form the busbar-side insulating layer; a frame forming process carried out from the busbar plate preparing process to before or after the busbar side coating process, or in parallel with these processes, the frame forming process including: a frame plate preparing process including a frame forming region having an outer shape in a plan view corresponding to the frame main body; a central hole forming process of forming the central hole in the frame forming region to form an annular body corresponding to the frame main body; and a frame side coating process of applying a frame side insulating resin paint to an outer peripheral surface of the annular body, the frame side insulating layer being formed thereon; a plate fixing step of pressing the lower surface of the frame-forming region against the upper surface of the busbar-forming region while at least one of the busbar-side insulating resin paint and the frame-side insulating resin paint is in a semi-cured state, and completely curing the semi-cured insulating resin paint, thereby fixing the busbar-forming plate and the frame-forming plate together, a central hole forming step of forming a central hole by preparing a punch having a tapered shape corresponding to the inverted tapered hole and pressing the punch from the lower surface side of the frame body forming area toward the upper surface side of the frame body forming area;

Images