Adhesive layer and metal mask using this adhesive layer

Abstract

To provide an adhesion layer that can bond two plate bodies to a desired thickness dimension accurately by resolving formation of bubbles and a gas layer at the time of bonding.SOLUTION: An adhesion layer 1 comprising a photocurable resin for bonding two plate bodies 2 and 3 into a laminate state includes: an uncured region 4 having tackiness derived from a material; and a curable region 5 in which the tackiness derived from a material is eliminated. The uncured region 4 includes a plurality of unit uncured regions 4a. The curable region 5 is formed into a continuous shape while facing an outer peripheral edge part 6 of the adhesion layer. The unit uncured regions 4a is surrounded by the curable region 5.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention is a photo-curable or thermosetting adhesive for bonding two plates together in a laminated state. The present invention relates to an adhesive layer made of resin and a metal mask such as a deposition mask using this adhesive layer. [Background technology]

[0002] An adhesive layer made of a photocurable resin is disclosed in Patent Document 1 of the present applicant. In Reference 1, the reinforcing frame of the deposition mask (metal mask) is formed in the same shape. It consists of an upper frame (plate) and a lower frame (plate), and the upper and lower frames are bonded together with a photo-curing resin. The adhesive layer is a sheet-shaped photosensitive dry film resist. The entire layer is uncured. .

[0003] The adhesive layer of the present invention is a photocurable or thermosetting resin having an uncured region and a cured region. An adhesive layer having such a structure is disclosed in Patent Document 2. In the electroforming process, the base plate and the conductive layer are integrated with an adhesive layer to form a matrix. The base is made of a metal plate, and the conductive layer is a sheet made of multiple metal layers stacked together. The adhesive layer is a sheet-shaped photosensitive dry film resist (ultraviolet curing resin). The first resist layer on the base side is made of a two-layer structure of a first resist and a second resist. The resist has a frame-shaped area within a predetermined range from the outer periphery that is left unexposed and unhardened. The inner region of the second resist is a partially exposed and partially hardened region. The portion of the first resist corresponding to the uncured region is left as an unexposed uncured region, and the uncured region The inner region is the exposed hardened region.

[0004] Uncured dry film resist has inherent adhesiveness and its volume changes over time. This is a property that is likely to occur, and the adhesiveness inherent in the material disappears in the cured dry film resist. The volume hardly changes over time. The stickiness and volume change over time of the material are both reduced. In the adhesive layer of Patent Document 1, the volume of the layer changes over time, causing distortion in the frame. It is difficult to maintain the positional accuracy of the mask body supported by the frame for a long period of time. The adhesive layer in Patent Document 2 mainly adheres to the uncovered portions of the outer peripheries of the first and second resists. The cured region exerts adhesive force to bond the base portion and the conductive layer, and the first and second resists In this way, the change in volume over time is suppressed in the inner region of the cavity. In the adhesive layer, the change in volume over time is suppressed in the inner region of the adhesive layer, thereby The adhesive layer is more effective in suppressing dimensional changes due to shrinkage, etc., than the adhesive layer in Patent Document 1. The base portion and the conductive layer can be stably integrated. Therefore, the conductive layer is not displaced and the mold is not formed on the electroforming matrix. This eliminates misalignment of the electroformed layer (electrodeposited layer) and allows for deposition masks to be manufactured using the same master mold. Furthermore, the adhesive layer in Patent Document 2 can be attached to the frame in Patent Document 1. By applying this to the adhesive layer, the upper and lower frames that make up the frame body can be stably integrated. This can prevent distortion of the frame body. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2017-210633 [Patent Document 2] Japanese Patent Application Publication No. 2019-39054 Summary of the Invention [Problem to be solved by the invention]

[0006] Since adhesion is usually performed in the atmosphere, the electroforming master of Patent Document 2 has a first resist. There is a risk that air may get trapped between the semi-hardened area and the base portion, forming bubbles. Air is interposed between the hardened area of ​​the resist of 2 and the conductive layer, i.e., an air layer is formed. In the adhesive layer structure of Patent Document 2, adhesive strength is exerted in the uncured area of ​​the outer periphery. Therefore, in order to eliminate the air bubbles or air layers, it is necessary to peel off the adhesive layer. The thickness of the base and conductive layer is thin, so the adhesive layer is not easy to peel off. By pressing and moving a squeegee or roller against the electroforming mold, as if pushing it out towards the edge, It is not impossible to eliminate air bubbles or air layers, but it is recommended to push out the air bubbles that occur near the center of the adhesive layer. It is difficult to remove the air bubbles from the adhesive surface. The distance between the base part and the conductive layer becomes large, and the flatness of the electroforming mold deteriorates. When the air layer is formed, the thickness of the electroforming matrix increases by the thickness of the air layer, and the desired thickness is obtained. The deterioration of the dimensional accuracy of these electroforming masters is This leads to a decrease in the accuracy of metal masks such as evaporation masks manufactured in this way.

[0007] The object of the present invention is to eliminate the formation of bubbles or air layers during bonding and to bond two plates to a desired thickness. The object of the present invention is to obtain an adhesive layer that can adhere to a desired dimension with high precision. An object of the present invention is to provide a meta-sensor that has good positional accuracy and can maintain the positional accuracy for a long period of time. The aim is to obtain a mask. [Means for solving the problem]

[0008] The present invention is a photo-curable resin for bonding two plates 2 and 3 together in a laminated state. Fat? The adhesive layer 1 is composed of an uncured region 4, which is an unexposed portion and retains the adhesiveness inherent to the material, and a cured region 5, which is an exposed portion and has lost the adhesiveness inherent to the material. At the outer peripheral edge 6 of the adhesive layer, a plurality of edge uncured regions 4b are formed, extending along the outer peripheral edge 6. In the internal region of the adhesive layer surrounded by the edge uncured regions 4b, a plurality of unit uncured regions 4a and cured regions 5 are formed, and the unit uncured regions 4a are surrounded by the cured regions 5. Between the edge uncured regions 4b, the cured regions 5 are continuously arranged in contact with the outer peripheral edge 6 of the adhesive layer. It is characterized by being formed.

[0009] A cured region 5 consisting of a dividing portion 7 is formed between adjacent edge uncured regions 4b, and the dividing portion 7 forms the cured region 5 so as to face the outer peripheral edge portion 6 of the adhesive layer.

[0010] The unit uncured regions 4a are formed in the same shape, and the scattered unit uncured regions 4a are arranged regularly. It is preferable that the electrodes are arranged in a matrix or staggered pattern.

[0011] The present invention also relates to a metal mask comprising a mask body 22 having a mask pattern consisting of a large number of independent through-holes 29, and a reinforcing support frame 23 or frame bonded to the outer periphery of the mask body 22. The mask body 22 and the support frame 23 or frame are bonded via the adhesive layer described above. [Effects of the Invention]

[0013] In the adhesive layer 1 of the present invention made of a photocurable or thermosetting resin, the unexposed portion and an uncured area 4 having adhesiveness derived from the material, and an exposed area having adhesiveness derived from the material. The cured area 5 is formed in a state where it faces the outer peripheral edge 6 of the adhesive layer 1. Such adhesive layer 1 allows the adhesive layer 1 and the plate body 2 to adhere to each other during bonding. The air between the adhesive layer 1 and the plate body 3 (hereinafter referred to as "between layers") is The air can be released from the outer peripheral edge 6 to the outside of the adhesive layer 1 along the surface of the hardened region 5 that is not covered by the adhesive. This prevents air bubbles and air layers from being formed between the layers. Compared with the adhesive layer of a conventional electroforming mother mold, the two plates 2 and 3 can be bonded to the desired thickness with high precision. It can be an adhesive layer 1 that can be attached.

[0014] The uncured region 4 has a plurality of unit uncured regions 4a scattered therein, and the cured region 5 is continuous. When the unit uncured region 4a is surrounded by the cured region 5, the ski By using a tool, roller, or pressure jig to push out the air between the layers, The air in the hardened area 4a is easily pushed out to the hardened area 5 surrounding the hardened area 4a, and the outer peripheral edge 6 to the outside of the adhesive layer 1, so that the unit uncured region 4a The formation of bubbles or air layers can be reliably prevented. Since the change in volume over time can be suppressed throughout the adhesive layer 1, the adhesive layer 1 can stably hold both plates 2 and 3 together. can be consistently integrated.

[0015] The unit uncured regions 4a are formed in the same shape, and the scattered unit uncured regions 4a are arranged regularly. When the adhesive layers are arranged in a matrix or staggered pattern, a uniform adhesive strength is obtained throughout the adhesive layer 1. This allows plates 2 and 3 to be integrated more stably.

[0016] The uncured region 4 has a plurality of edge uncured regions 4b extending along the outer periphery 6 of the adhesive layer. In this case, the edges of the plates 2 and 3 can be sufficiently bonded in the uncured edge region 4b. The air between the layers can be prevented from peeling off between the uncured edge areas 4b. Since the air can be released from the outer peripheral edge 6 to the outside of the adhesive layer 1 through the region 5, the air can be easily removed between the layers. No bubbles or air pockets are formed.

[0017] According to the metal mask 21 of the present invention, the thickness dimension of the support frame 23 can be made highly accurate, so that the support The support frame 23 can improve the positional accuracy of the mask body 22 supported by the metal layer 24. For example, the metal mask 21 can be used as a deposition mask for manufacturing an organic EL display. In this case, the light-emitting layer of the display can be formed with high precision. Since the deterioration is suppressed, the positional accuracy of the mask body 22 can be maintained for a long period of time. [Brief explanation of the drawings]

[0018] [Figure 1] 1A and 1B are conceptual diagrams of a laminate having an adhesive layer according to Example 1 of the present invention, in which (a) is a longitudinal front view of the laminate, and (b) is a cross-sectional plan view of the AA line portion in (a). [Figure 2] 10A to 10C are explanatory views showing a method for forming an adhesive layer. [Figure 3] FIG. 10 is a conceptual diagram of a cross-sectional view of an adhesive layer according to Example 2 of the present invention. [Figure 4] FIG. 10 is a conceptual diagram of a cross-sectional view of an adhesive layer according to Example 3 of the present invention. [Figure 5] FIG. 10 is a conceptual diagram of a cross-sectional view of an adhesive layer according to Example 4 of the present invention. [Figure 6] FIG. 10 is a conceptual diagram of a cross-sectional view of an adhesive layer according to Example 5 of the present invention. [Figure 7] FIG. 1 is a perspective view showing an example of use of the adhesive layer of the present invention in a metal mask, showing the entire metal mask. [Figure 8] FIG. 2 is a vertical sectional front view of the metal mask. [Figure 9] FIG. 2 is a partially enlarged plan view of the metal mask. [Figure 10] FIG. 2 is a plan view of a pattern film for exposure of a dry film resist. [Figure 11] FIG. 1 is a perspective view of a dry film resist. [Figure 12] 10A to 10C are explanatory diagrams showing a method for forming a support frame. [Figure 13]FIG. 2 is an explanatory diagram showing the first stage of a method for manufacturing a metal mask. [Figure 14] 10A to 10C are explanatory views showing the latter stage of the method for manufacturing a metal mask. [Figure 15] FIG. 10 is an explanatory diagram showing a fixing process by a vacuum pressure bonding device. [Figure 16] FIG. 1 is a diagram showing a use form in which the adhesive layer of the present invention is used in an electroforming mold, and is a longitudinal sectional front view of the electroforming mold. [Figure 17] 17 is a cross-sectional view taken along line BB in FIG. 16. [Figure 18] FIG. 2 is an explanatory diagram showing the first stage of a method for manufacturing an electroforming matrix. [Figure 19] FIG. 10 is an explanatory diagram showing the latter stage of the method for manufacturing an electroforming matrix. DETAILED DESCRIPTION OF THE INVENTION

[0019] Example 1 Example 1 of the adhesive layer according to the present invention is shown in Figures 1 and 2. In this example, The thickness direction of the adhesive layer is defined as up and down. Also, the dimensions of thickness and width in each figure are based on the actual dimensions. The figures do not show the actual conditions, but are merely schematic representations.

[0020] As shown in FIG. 1(a), the adhesive layer 1 of this embodiment is made up of a first sheet (plate) 2 on the upper layer side and a lower The sheet is sandwiched between the second sheet (plate) 3 on the layer side and the two sheets 2 and 3 are bonded together in a laminated state. The adhesive layer 1 is an ultraviolet curable adhesive that is cured by irradiation with ultraviolet light. The uncured area is made of resin (photo-curable resin) and has adhesiveness inherent to the material in the unexposed area. The exposed area is made up of a hardened area 4 and an exposed area 5 where the inherent adhesiveness of the material has disappeared.

[0021] The uncured region 4 is a plurality of uncured unit regions formed in a state where they are not in contact with the outer peripheral edge 6 of the adhesive layer 1. In the plan view of the adhesive layer 1 shown in FIG. The particles 4a are formed into circles of the same diameter and are arranged in a regular staggered pattern on the adhesive layer 1. The cured region 5 is formed continuously, and the unit uncured region 4 is a is enclosed.

[0022] The uncured region 4 also includes a plurality of edge uncured regions 4b extending along the outer peripheral edge 6 of the adhesive layer 1. The edge uncured region 4b is formed in a strip shape except for the dividing portion 7 in the center of each side. The cured region 5 faces the outer peripheral edge 6 of the adhesive layer 1 at the divided portion 7. It is also possible to shorten the length of the edge uncured region 4b to form a plurality of dividing portions 7 on each side. The dividing portion 7 may be formed at a corner. The ratio of the uncured region 4a can be changed by changing the ratio. By increasing the proportion of the uncured region 4a, the adhesive strength is strengthened, and the unit uncured region 4a In this embodiment, the adhesive strength is weakened by reducing the proportion of the unit uncured region 4 The shape of a is formed to be circular, but is not limited to this, and may be elliptical or polygonal. The unit uncured regions 4a may be formed regularly over the entire adhesive layer 1, and The unit uncured region 4a may be formed so as to overlap the edge uncured region 4b.

[0023] The adhesive layer 1 in this embodiment is a sheet-like dry film resist that hardens when irradiated with ultraviolet light. The dry film resist 11 is made of a resist (ultraviolet curable resin) having a uniform thickness. Before bonding, the surface of each sheet of the dry film resist 11 is transparent. The base film 12 is made of a material having a property of blocking ultraviolet rays (semi-transparent). The cover film 13 is made of a material having light-transmitting or light-blocking properties. The dry film resist 11 in the exposed state (uncured state) has adhesiveness inherent to the material. However, this adhesiveness disappears when exposed to ultraviolet light (cured state). The dry film resist 11 in this state may shrink slightly due to the release of volatile components contained in the material. The volume of the exposed dry film resist 11 changes over time. The adhesive layer 1 of this embodiment is a purple adhesive that hardens when irradiated with ultraviolet light. Although UV-curable resin (photo-curable resin) is used, it is not suitable for use with infrared radiation or heat sources such as heaters. The adhesive layer 1 can also be made of a thermosetting resin that hardens when more heat is applied. The properties of thermosetting resin in the cured and hardened state are similar to those of ultraviolet curing resin. do.

[0024] Next, an example of a method for forming the adhesive layer 1 will be described with reference to FIG. 2. First, as shown in FIG. The dry film resist 11, which is still covered with both films 12 and 13, is then applied to the adhesive layer 1. This is placed on the exposure table 14 with the base film 12 facing upward. Furthermore, a pattern film 15 made of a glass mask is adhered to the base film 12. The pattern film 15 has light-transmitting holes 15a formed therein that correspond to the curing regions 5. Next, as shown in FIG. 2(b), an ultraviolet lamp 16 is irradiated from above the pattern film 15. By irradiating ultraviolet light at 1000 W, the dry film resist is formed through the pattern film 15. As a result, as shown in FIG. 2(c), the dry film resist 11 is exposed to light. The unexposed portions corresponding to the unit uncured regions 4a and the edge uncured regions 4b and the cured regions 5 are An exposed portion is formed.

[0025] An example of a method for forming a laminate with an adhesive layer 1 made of a dry film resist 11 will be described. First, the base film 12 is peeled off, and the exposed dry film resist 11 and the second sheet Place both 3 and 11 on top of each other so that they face each other. In this state, The sheet 11 and the second sheet 3 are pressed together, but at this time, the dry The film resist 11 is pressed from the center toward the outside so as to push out the air. Next, the cover film 13 is peeled off to expose the first sheet 2 and the exposed dry film resist. Place the two 2 and 11 together so that they face each other. The shim 11 and the first sheet 2 are pressed together, but as before, the driver is (b) Press the film resist 11 from the center toward the outside so as to push out the air. In this way, the first sheet 2 and the second sheet 3 are integrated by the adhesive layer 1.

[0026] In the above, first, the adhesive layer 1 is formed, and the first sheet 2 and the second sheet 3 are bonded to each other by the adhesive layer 1. However, the adhesive layer 1 may be formed during the process of integrating the two sheets 2 and 3. In this case, either the first sheet 2 or the second sheet 3, for example, the first sheet 2 is dry The film resist 11 and the base film 12 are overlapped. After the pattern film 15 is superimposed on the film 12, an ultraviolet light is irradiated from above the film 15. The exposed portion is formed by irradiating ultraviolet light from the lamp 16. After this, the cover film 13 is peeled off. The first sheet 3 is then separated and the second sheet 3 is placed on top of it. This method can also be used to form a laminate. .

[0027] As described above, in the adhesive layer 1 made of the ultraviolet curable resin of this embodiment, the unexposed portion The uncured area 4 has adhesiveness derived from the material, and the exposed area has adhesiveness derived from the material. The cured area 5 is formed in a state where it faces the outer peripheral edge 6 of the adhesive layer 1. Therefore, when the first sheet 2 and the second sheet 3 are bonded together, the air present between the layers is absorbed by the adhesive. The air is removed from the outer peripheral edge 6 to the outside of the adhesive layer 1 along the surface of the cured region 5 which does not have the adhesive property. This can prevent air bubbles and air layers from being formed between the layers. Compared to the adhesive layer of a conventional electroforming master, the two sheets 2 and 3 can be precisely aligned to the desired thickness. The adhesive layer 1 can be made to adhere to the substrate.

[0028] The uncured region 4 includes a plurality of unit uncured regions 4a scattered therein, and the cured region 5 is The unit uncured region 4a is formed continuously so that the unit uncured region 4a is surrounded by the cured region 5. By using a squeegee, roller, or pressure tool to push out the air between the layers, The air in the unit uncured region 4a is easily pushed out to the cured region 5 surrounding the region 4a. The air can be removed from the peripheral portion 6 to the outside of the adhesive layer 1, and the unit uncured region 4a The formation of bubbles and air layers can be reliably eliminated. In addition, the hardened area 5 is formed continuously, so the adhesion The adhesive layer 1 stabilizes both sheets 2 and 3 because it can suppress the change in volume over time throughout the entire layer 1. It can be integrated effectively.

[0029] In addition, the unit uncured regions 4a are formed in the same shape, and the scattered unit uncured regions 4a are arranged regularly. The adhesive layer 1 is arranged in a staggered pattern, so that the adhesive strength is uniform across the entire adhesive layer 1, and both sheets 2 and 3 This allows for more stable integration of the cow.

[0030] The uncured region 4 includes a plurality of edge uncured regions 4b extending along the outer peripheral edge 6 of the adhesive layer 1. Therefore, the edges of both sheets 2 and 3 can be sufficiently bonded in the uncured edge region 4b. This prevents the edges of sheets 2 and 3 from curling up and peeling off.

[0031] In the above embodiment, the uncured edge regions 4b are formed on each side of the adhesive layer 1. An uncured edge region 4b is formed over the entire area of ​​one of the pair of sides, and the remaining opposing sides It is also possible to prevent the formation of the edge uncured region 4b on the opposite side.

[0032] (Example 2) Figure 3 shows Example 2 of the adhesive layer according to the present invention. The cured region 4b is omitted, and the unit uncured region 4a is disposed over the entire surface of the adhesive layer 1. 1. A part of the unit uncured region 4a is formed facing the outer peripheral edge portion 6. The unit uncured region 4a facing the portion 6 exhibits the same function as the edge uncured region 4b. The forming method of 1 has a light-transmitting hole 15a formed corresponding to the hardened region 5. In other words, A pattern having mask portions corresponding to the unit uncured regions 4a formed in a regular staggered pattern. The dry film resist 11 is exposed using the film 15. The other steps are the same as in Example 1. Therefore, the same members are designated by the same reference numerals and the description thereof will be omitted. The adhesive layer 1 of this example also eliminates the formation of bubbles or air layers between layers, and The adhesive layer 1 exerts uniform adhesive strength throughout the entire surface, stably uniting the two sheets 2 and 3 together. Furthermore, the unit uncured regions 4a formed adjacent to the outer peripheral edge 6 allow the edges of the sheets 2 and 3 to be uniformly bonded. This can prevent the film from rolling up and peeling off.

[0033] Example 3 Figure 4 shows Example 3 of the adhesive layer according to the present invention. The difference from Example 2 is that the unit uncured regions 4a are arranged in a regular matrix. The adhesive layer 1 is formed by forming a light-transmitting hole 15a corresponding to the hardened region 5. Then, the mask portions corresponding to the unit uncured regions 4a formed in a regular matrix are The dry film resist 11 is exposed using the pattern film 15 provided. In the adhesive layer 1, the unit uncured region 4a was formed so as not to contact the outer peripheral edge portion 6. The adhesive layer 1 of this embodiment may be formed so as to contact the outer peripheral edge 6. Even if the adhesive is heated, it eliminates the formation of bubbles or air layers between layers and provides uniform adhesive strength throughout the adhesive layer. This allows the two sheets 2 and 3 to be stably integrated together.

[0034] Example 4 Fig. 5 shows Example 4 of the adhesive layer according to the present invention. The unit unhardened area 4a corresponds to a brick in the brickwork pattern, and the hardened area 5 corresponds to a brickwork pattern. The uncured area 4 and the cured area 5 are arranged so as to form a pattern corresponding to the same joint. Some of the unit uncured regions 4a are formed facing the outer peripheral edge portion 6. The unit uncured regions 4a function similarly to the edge uncured regions 4b. The method is to form a light-transmitting hole in a shape corresponding to the joint of the brickwork pattern corresponding to the hardened region 5. The dry film resist 11 is exposed using the pattern film 15 having the pattern 15a. In the adhesive layer 1 of this embodiment, the formation of bubbles or air layers between layers is also eliminated. The adhesive strength is uniform throughout, allowing the two sheets 2 and 3 to be stably integrated together.

[0035] In the above Examples 1 to 4, the unit uncured regions 4a were arranged regularly with the same shape. The unit uncured regions 4a having various shapes can also be arranged randomly.

[0036] (Example 5) Fig. 6 shows Example 5 of the adhesive layer according to the present invention. The cured region 4 is made up of a plurality of band-shaped unit uncured regions 4a, and similarly, the cured region 5 is made up of a plurality of band-shaped unit uncured regions 4a. The unit uncured region 4a and the unit cured region 5a are arranged in a stripe pattern. The adhesive layer 1 is formed in such a manner that it corresponds to the unit curing region 5a. The pattern film 15 having the striped light transmitting holes 15a is used to form a dry film. The resist 11 is exposed to light. In the adhesive layer 1 of this embodiment, the formation of bubbles or air layers between layers is also prevented. It can be erased.

[0037] The uncured area 4 in each of the above examples is a dry film resist that has not been exposed to light at all. The exposure was less than the amount required for complete curing. The uncured region 4 is made of the dry film resist 11 in a light (not completely cured) state. Specifically, a pattern film 15 having light transmitting holes 15a formed therein is used. After the dry film resist 11 is exposed to light, the pattern film 15 is peeled off. The dry film resist 11 is exposed again for a time period that does not completely harden the entire dry film resist 11, or A pattern filter in which the transmittance of ultraviolet light in the area other than the light-transmitting holes 15a is limited more than that of the light-transmitting holes 15a. By exposing the uncured area 4 to light using the exposure lamp 15, the uncured area 4 is made into a semi-exposed state. The film resist 11 has improved adhesion and The change in volume over time is small. This makes it possible to suppress dimensional changes and provide an adhesive layer 1 that can maintain higher precision. In this case, the adhesive strength of the uncured region 4 is reduced, and the occupancy of the uncured region 4 in the adhesive layer 1 is increased accordingly. It is preferable to increase the proportion of the cured area 5 exposed to the air to ensure sufficient adhesive strength. It can also be made of a dry film resist 11 in a light state. In this case, the gap between the layers In order to obtain the degassing effect, the dry film resist 11 in the semi-exposed hardened area 5 is extremely It is preferable to bring the cured area 5 in the partially exposed state close to the hardened state. Therefore, the proportion of the uncured region 4 can be reduced.

[0038] (First Usage Form) FIGS. 7 to 15 show a method of applying the adhesive layer of the present invention to a deposition mask, which is a metal mask. 7 and 8 show a first mode of use in which the deposition mask is applied to a support frame provided in the deposition mask. 21 is a mask body 22 arranged in a matrix (eight in this embodiment), and each A reinforcing support frame 23 is arranged to surround the mask body 22, and the two 22 and 23 are inseparably connected. The support frame 23 includes a metal layer 24 that is physically bonded to the mask body 22. The support frame 23 has the same number of mask openings as the mask body 22. Each mask opening 25 is formed slightly larger than the mask body 22, One mask body 22 is disposed in each mask opening 25 .

[0039] As shown in FIG. 9, each mask body 22 is formed in a rectangular shape with rounded corners. The patterned region 27 has an inner patterned region and an outer bonding region . A deposition pattern (mask pattern) consisting of a large number of independent deposition through holes (through holes) 29 is formed on the In the vicinity of the outer periphery of the bonding area 28, there are two rows of multiple adhesive tape along each side of the mask body 22. Several connecting holes 30 are formed. The length corresponds to the size of the organic EL display to be manufactured, for example.

[0040] The mask body 22 is made of nickel electrodeposited metal by electroforming (plating). The thickness of the mask body 22 in this embodiment is set to 10 μm. The body 22 may contain nickel alloys such as nickel-cobalt, copper, or other electrodeposited metals in addition to nickel. Furthermore, the mask body 22 may have a laminated structure of two or more layers. That's fine.

[0041] The metal layer 24 joins the mask body 22 and the support frame 23, and is an electrodeposited metal made of nickel. Specifically, the metal layer 24 is formed by electroforming (plating) the support frame 23. a covering portion 24a that covers the upper surface and side surfaces of the mask, and a mask opening 25 that is continuous with the covering portion 24a. The mask body 22 has a connecting portion 24b extending from the periphery toward the center of the opening. The upper surface of the outer periphery of the joint area 28 is covered with the tip of the joint portion 24b. The mask body 22 and the metal layer 24 are joined at the overlapping portion, so that the mask body 22 is a metal The layer 24 is supported by the support frame 23. Also, a part of the joint portion 24b is connected to the joint through-hole 30. The penetration improves the bonding strength between the two 28 and 24b. The metal layer 24 may have a configuration in which the covering portion 24a on the upper surface of the support frame 23 is omitted. In this case, the upper surface of the support frame 23 is exposed to the outer surface of the deposition mask 21 .

[0042] The support frame 23 is made of Invar material, and as shown in FIG. 7, it has a rectangular outer frame 33 and an outer frame 33 and a lattice frame 34 that defines the mask openings 25. As shown enlarged in FIG. The support frame 23 has a laminated structure, and is made up of an upper frame (first frame body) 35 and a lower frame (second frame body) of the same shape. The upper frame 35 and the lower frame 36 are bonded together with an adhesive layer 37. That is, it is preferable to bond the frames 35 and 36 so that their warping directions face each other. The adhesive layer 1 has the same structure as that of the adhesive layer 1 of Example 1. and adhesive layer 37 are the first sheet (plate) 2 and the second sheet (plate) 3 of Example 1, respectively. , and adhesive layer 1. The thickness dimensions of upper frame 35 and lower frame 36 in this embodiment are each 0. 5 mm (the thickness of the support frame 23 is 1.0 mm), and the support frame 23 is It was also made thick enough.

[0043] The upper frame 35 and the lower frame 36 are made of nickel-iron-cobalt alloy in addition to the above-mentioned Invar material. The upper frame 35 and the lower frame 36 may be made of a material such as super invar, which is a material that is suitable for the upper frame 35 and the lower frame 36, and the thickness dimensions of the upper frame 35 and the lower frame 36 may be different. The width dimensions of the outer frame 33 and the lattice frame 34 in the upper frame 35 and the lower frame 36 may be In this case, the width of the outer frame 33 and the lattice frame 34 in the upper frame 35 is The width of the outer frame 33 and the lattice frame 34 of the lower frame 36 is smaller than that of the outer frame 33 and the lattice frame 34 of the upper frame 35. It is preferable to set the width dimension of the lower frame 36 so that the width dimension of the lower frame 36 is smaller than the width dimension of the frames 33 and 34. The support frame 23 may have a two-layer structure of an upper frame 35 and a lower frame 36, a laminated structure of three or more layers, or a single layer structure. Alternatively, a four-layer structure may be adopted in which two support frames 23 each having an upper frame 35 and a lower frame 36 are stacked and bonded together. It may also be used.

[0044] An example of a method for forming the support frame 23 according to this embodiment will be described with reference to FIGS. 10 to 12. First, the adhesive layer 37 (adhesive layer 1) is formed in the same manner as in Example 1 described above. The dry film resist is still covered with the base film 12 and the cover film 13. The cut of the support frame 23 is slightly larger than the outer shape of the support frame 23. The difference is that a dry film 38 is used. The size of the film 38 is almost the same. The pattern film 38 made of a glass mask has , a light transmitting hole 38a corresponding to the hardened region 5 and the mask opening 25 is formed. In FIG. 10, the two-dot chain line indicates the planar shape of the support frame 23, and the edge unhardened region 4b is The planar outer shape of 23 is formed in such a manner that it is crossed over. 1 shows a state in which an uncured region 4 and a cured region 5 are formed in a sheet 11.

[0045] In the adhesive layer 37 applied to the deposition mask (metal mask) 21, the unit uncured area The diameter of the uncured edge region 4a is preferably 0.2 mm or more and 0.6 mm or less. The width of the adhesive layer in this embodiment is preferably 0.1 mm or more and 0.5 mm or less. In the example shown in FIG. 37, the diameter of the unit uncured region 4a is set to 0.4 mm, and the edge uncured region 4b The width of the unit uncured region 4a is set to 0.2 mm, which is half the diameter of the unit uncured region 4a. The proportion of the uncured region 4 in the adhesive layer 37 is preferably less than 50%, and more preferably less than 20%. It is more preferable that the ratio of the uncured region 4 is less than 50%. By doing so, it is possible to expect a sufficient air removal effect in the curing region 5, and the shape of the air bubbles and air layers can be reduced. On the other hand, the ratio of the uncured region 4 is set to 20% or more. If the ratio is less than 20%, the adhesive strength of the adhesive layer 37 cannot be sufficiently ensured. For this reason, the ratio of the hardened region 5 in the adhesive layer 37 is 50%. It is preferable that the ratio is 80% or more.

[0046] The upper frame 35 and the lower frame 36 are, for example, for wire electric discharge machining, which has little thermal influence on the workpiece. It is cut out from a metal plate using a machine or the like, and as shown in Figure 12(a), it has a rectangular shape. Eight openings corresponding to the mask openings 25 are formed in the plate material. 6 and the dry film resist from which the base film 12 and the cover film 13 have been peeled off. At this time, the edge formed in a state spanning the planar outer shape of the support frame 23 is adhered to the support frame 23. The uncured region 4b allows the dry film resist 11 to adhere to the upper frame 35 and the lower frame 36. Even if the position is slightly misaligned, the uncured edge region 4b and the divided region 4c are formed on the outer peripheral edge 6 of the adhesive layer 37. Then, as shown in FIG. 12(b), the cut portion 7 is precisely formed. The upper frame 35 and the lower frame 36 are passed through the upper and lower rolling rolls 39, 39. The dry film resist 11 is fixed. Fixation is carried out in order from one end to the other end. Therefore, the air between the upper frame 35 and the unhardened region 4 and between the lower frame 36 and the unhardened region 4 flows through the rolling rollers. At the roller 39, the air is pushed out to the upstream side (the unprocessed side) of the movement direction of the upper and lower frames 35 and 36. The air that is pushed out passes through the hardened region 5 in the divided portion 7. Then, the air is removed from the outer peripheral edge 6 to the outside. Finally, the unnecessary dry film resist 11 (the part that protrudes from the outer edge of the support frame 23 and the part of each mask opening 25) Gain 23 support slots.

[0047] An example of a method for manufacturing the deposition mask 21 according to this embodiment is shown in FIGS. As shown in 13(a), an electroforming matrix 41 made of conductive material, for example, stainless steel or brass, is used. A negative photoresist layer 42 is then formed on the surface of the photoresist layer 4. A pattern film 43 made of a glass mask is attached to the surface of the substrate 2. The pattern film 43 has the deposition holes 29 of the mask body 22 and the body 22 The connecting through-hole 30 and the outer periphery of the mask body 22 are provided with corresponding light transmitting holes 43a. It is being done.

[0048] Next, the resulting patterning precursor 44 is exposed to ultraviolet light provided with an ultraviolet lamp 45. It is placed in the furnace of the device (exposure device) and preheated to the furnace temperature during exposure work, and After the layer 44 is allowed to acclimate to the furnace temperature, it is irradiated with ultraviolet light from an ultraviolet lamp 45. The photoresist layer 42 is exposed through the pattern film 43. The cleaning precursor 44 is taken out, and the pattern film 43 is removed from the photoresist layer 42. The unexposed portions of the photoresist layer 42 are dissolved and removed (developed), resulting in the pattern shown in FIG. 13(b). As shown in FIG. 1, a primary pattern resist 46 is formed on the electroforming matrix 41. The resist 46 is formed in the deposition holes 29, the joining holes 30 of the mask body 22, and the outside of the mask body 22. The resist body 46a is formed on the periphery of the substrate 40. The resist body 46a corresponds to each of the periphery.

[0049] Next, as shown in FIG. 13(c), the electroforming matrix 41 that is not covered with the resist layer 46a is By performing electroforming (plating) on ​​the surface of the resist body 46a, The primary electroforming layer 47 is formed. The primary electroforming layer 47 is made of a plurality of layers constituting the finished product of the deposition mask 21. The mask body 22 is made up of a frame 48 which is removed before completion. After the formation of the pattern resist 7, the primary pattern resist 46 is dissolved and removed, as shown in FIG. As a result, the deposition holes 29 and the bonding holes 30 of the mask body 22 appear. In order to increase the bonding strength (adhesion) of the metal layer 24 to the mask body 22, The upper and outer surfaces of the region 28 and the inner surface of the joining through-hole 30 are subjected to activation treatment such as acid immersion or electrolysis. Chemical treatment (adhesion treatment) can be performed, or an adhesion plating layer can be formed. The layer is made of nickel or copper, and is plated by strike plating or matte plating. It is preferable to form it sufficiently thinner than the casting layer 47 .

[0050] In the next step, the support frame 23 is bonded to the mask body 22 of the primary electroforming layer 47 with the metal layer 24. Specifically, first, as shown in FIG. 14(a), a negative pattern is applied to the entire surface of the primary electroformed layer 47. A photoresist layer 51 of this type is formed, and a pattern film 52 is adhered thereon. The pattern film 52 has rounded corners corresponding to the pattern forming region 27 of the mask body 22. The light transmitting hole 52a has a rectangular shape.

[0051] Next, ultraviolet light is irradiated from an ultraviolet lamp 45 in the furnace of the ultraviolet irradiation device, and the pattern is The photoresist layer 51 is exposed through the film 52. After exposure, the photoresist layer The pattern film 52 is removed from the photoresist layer 51, and the unexposed portions of the photoresist layer 51 are dissolved and removed. By removing (developing), a secondary pattern resist 53 shown in FIG. 14(b) is formed. The secondary pattern resist 53 covers the surface of the pattern forming region 27 of the mask body 22. The deposition holes 29 in the turn formation region 27 are covered with the secondary pattern resist 53, so During the electroforming process, the electroforming liquid (plating liquid) does not infiltrate into the through holes 29 .

[0052] Next, as shown in FIG. 14(c), the primary electroforming layer 47 is The support frame 23 is placed on the frame base 48 to obtain the intermediate laminate 54. The support frame 23 supported by the frame base portion 48 is formed slightly larger than the An adhesive layer 56 is laminated on the surface of the support frame 23A with a release layer 55 interposed therebetween, thereby forming the support frame 23A with an adhesive layer. By placing the adhesive layer-attached support frame 23A on the top surface of the frame base 48, the support frame 23A is The adhesive layer 56 of the support frame 23A prevents the support frame 23 from moving out of alignment with the frame base 48. In this embodiment, the peeling layer 55 is made of nickel, and the adhesive layer 56 is made of the support frame 23. The same as the dry film resist 11 (adhesive layer 37) that bonds the upper frame 35 and the lower frame 36 The dry film resist 11 protruding from the support frame 23 was removed. After the support frame 23 is temporarily fixed to the upper surface of the frame base 48, the peeling layer 55 (support frame 23) and the adhesive layer 5 6, and a fixing treatment is performed between the frame portion 48 and the adhesive layer 56. The fixing treatment will be described later. do.

[0053] Next, as shown in FIG. 14(d), electroforming is performed to remove the mask body from the surface of the support frame 23. A continuous secondary electroformed layer, i.e., metal layer 24, is formed across body 22. The metal layer 24 on the surface is formed within the height range of the secondary pattern resist 53. At this time, by forming the metal layer 24 in the bonding through-hole 30, the mask body 22 The bonding strength of the metal layer 24 is further improved. Then, the frame portion 48 of the primary electroforming layer 47 is peeled off together with the adhesive layer 56. The second pattern resist 5 is then peeled off from the support frame 23 and the metal layer 24 together with the layer 55. By removing the mask 3, the completed deposition mask 21 shown in FIG. 14(e) can be obtained. The removal of the secondary pattern resist 53 is performed after the peeling off of the primary electroformed layer 47 and the metal layer 24. This may be done before the frame 48, adhesive layer 56, and release layer 55 are peeled off. After removing the portions other than the release layer 55, the release layer 55 can also be removed last. The separation layer 55 is not essential and can be omitted.

[0054] The fixing process will be described below. When the support frame 23 is temporarily fixed to the upper surface of the frame base 48, That is, when the intermediate laminate 54 is obtained, air is trapped between the frame 48 and the adhesive layer 56. If the support frame 23 is temporarily fixed in a distorted state, the manufactured deposition mask may be damaged. The dimensional accuracy of 21 is reduced. In order to prevent this reduction in dimensional accuracy, a fixing treatment is performed. 15(a) shows the disassembled state of each component in the fixing process, and FIG. 15(b) shows the disassembled state of each component. The figure shows the state in which the components are stacked. The fixing process is carried out by using a stainless steel base as a pre-process. The intermediate laminate 54 is placed on a holder 61 having a base 59 on the upper surface of which a magnet sheet 60 is arranged. Then, a pressing jig 62 for pressing the support frame 23 is placed on the support frame 23. Then, the upper surfaces of the intermediate laminate 54 and the pressing jig 62 are covered with a protective film 63. A pre-processed body 64 is obtained. The upper surface of the pressing jig 62 is covered with a protective film 63. To facilitate the release of air between the exhaust groove 62a and the exhaust port, a brick-like groove is formed in the exhaust groove 62a. (See FIG. 15(a)). The exhaust groove 62a is also formed on the bottom surface of the pressing jig 62. Good too.

[0055] The magnet sheet 60 is provided to attract and hold the intermediate laminate 54 . The pressing jig 62 is formed in a planar shape that is slightly smaller than the planar shape of the support frame 23. A release sheet 65 is interposed between the members 23 and 62. The release sheet 65 is in surface contact with the upper surface of the support frame 23 after the fixing process. This is provided to facilitate separation of the pressure jig 62 and to protect the upper surface of the support frame 23 . The pressing jig 62 and the release sheet 65 are integrated with adhesive tape 66, and after the fixing process, both 6 The protective film 63 is attached to the protective film 65 by a vacuum pressure bonding device 67. The pressure-bonding film 68 is prevented from contacting the intermediate laminate 54 and the pressing jig 62, and the pressure-bonding film 68 is prevented from contacting the intermediate laminate 54 and the pressing jig 62. This is provided to prevent damage to the film 68.

[0056] After the above-mentioned pre-processing is completed, the upper cover 69 of the vacuum crimping device 67 is opened, and the vacuum chamber 70 The pre-processed body 64 is placed on the chamber stage 71 inside the chamber, and the upper lid 69 is closed. The pump 72 is driven to suck air from the vacuum chamber 70 and increase the degree of vacuum. While removing the air between the support frame 23 and the adhesive layer 56, and between the frame base portion 48 and the adhesive layer 56, The pressure jig 62 is pressed against the support frame 23 by the pressure-sensitive adhesive film 68 and adhered to the support frame 23. Since the support frame 23 and the pressing jig 62 are in surface contact with each other, the pressing force is concentrated on a part of the support frame 23. This can prevent the support frame 23 from being damaged. This allows the air between the layers to be removed accurately.

[0057] The adhesive layer 37 and the adhesive layer 56 of this embodiment have the same structure as the adhesive layer 1 of Example 1. The adhesive layers 37 and 56 have the same structure as the adhesive layer 1 in Examples 2 to 5. may be.

[0058] As described above, according to the deposition mask 21 used in the above manner, the thickness dimension of the support frame 23 can be precisely adjusted. The mask body 22 is supported by a support frame 23 that is free from distortion and has a metal layer 24 interposed therebetween. Therefore, the positional accuracy of the mask body 22 can be improved, and for example, an organic EL display The light-emitting layer of the spray can be formed with high precision. In addition, deterioration of the support frame 23 over time is suppressed. Therefore, the positional accuracy of the mask body 22 can be maintained for a long period of time.

[0059] In the method for forming the support frame 23, the adhesive layer 37 is first formed, and then the adhesive layer 37 is The frame 35 and the lower frame 36 are integrated, but the adhesive layer 37 is formed during the integration of the two frames 35 and 36. Specifically, either the upper frame 35 or the lower frame 36, for example, the upper frame 3 The dry film resist 11 and the base film 12 are then laid on the base film 5. After the pattern film 38 is superimposed on the glass film 12, Then, the exposed portion is formed by irradiating the cover film 1 with ultraviolet light from an ultraviolet lamp. The lower frame 36 is then placed on top of the upper and lower rolling rolls 39, 39. The support frame 23 can also be formed by such a method. Although the mask body 22 and the frame 48 are included, the frame 48 may be omitted. In this case, the support frame 23 is attached to the electroforming matrix 41 via a release layer 55 and an adhesive layer 56. The adhesive layer 56 may be laminated in advance on the lower surface of the support frame 23. Alternatively, the primary electroforming layer 47 may be laminated on the upper surface of the electroforming matrix 41 after it has been formed.

[0060] Here, the support frame 23 in the metal mask according to the above-described usage form can be expressed as follows: do.

[0061] A mask pattern consisting of a large number of independent through holes 29 is provided around the mask body 22. The mask body 22 is supported by a reinforcing support frame 23 made of a metal plate material, and the first frame The frame 35 and the second frame 36 are joined together via an adhesive layer 37. A support frame that is integrated into the frame.

[0062] The adhesive layer-attached support frame 23A in the metal mask according to the above-described usage form is as follows: It can be expressed as:

[0063] A support frame with an adhesive layer, in which an adhesive layer 56 is formed on one surface of the support frame 23. A release layer 55 is formed between the surface of the support frame 23 and the adhesive layer 56 . The adhesive layer-attached support frame 23A has a two-layer structure consisting of an upper frame 35 and a lower frame 36. In addition to the support frame 23, a support frame 23 having a laminated structure of three or more layers or a single layer structure can be used. do.

[0064] The intermediate laminate 54 obtained in the manufacturing process of the metal mask according to the above-mentioned usage form is as follows: It can be expressed as follows.

[0065] An electroforming mold 41, and a mask body 22 and a frame base 48 formed on the electroforming mold 41. and a support frame 23 placed on a frame base 48 of the primary electroforming layer 47. An adhesive layer 56 is formed on the underside of the support frame 23, and the support frame 23 is attached to the frame base portion 48 by the adhesive layer 56. An intermediate laminate temporarily fixed to the A release layer 55 is provided between the support frame 23 and the adhesive layer 56 . The mask body 22 has a patterned structure in which a mask pattern consisting of a number of independent through holes 29 is formed. A pattern resist (secondary pattern resist) is formed on the upper surface of the pattern forming region 27. There are 53 stations.

[0066] The adhesive layer 3 in the support frame 23, the support frame 23A with the adhesive layer, and the intermediate laminate 54 7·56 is made of photo-curable or thermosetting resin, and the unexposed area is made of the material. The uncured area 4 has the adhesive property of the uncured area 4, and the cured area 5 has the adhesive property of the uncured area 4. The cured area 5 is formed in a state facing the outer peripheral edge 6 of the adhesive layer. do.

[0067] In the above-described usage form, the mask body 22 and the support frame 23 are integrally joined via the metal layer 24. However, the support frame 23 and the frame are attached to the outer periphery of the mask body 22 in the same manner as in Examples 1 to 5. In this case, the mask body 22 may be joined together via (37). In addition to forming by electroforming (plating), it can also be formed by etching, machining, laser processing, etc. The support frame 23 and the frame may be made of aluminum, iron, invar, etc. Furthermore, the surface (top and side surfaces) of the support frame 23 and the exposed portion (side portion) of the adhesive layer can be A metal layer may be formed to cover the surface. The adhesive layer of the invention is a metal mask for screen printing or a metal mask for solder ball transfer. This can also be applied to sc

[0068] (Second Use Form) As shown in Figs. 16 to 19, the adhesive layer of the present invention is applied to a mask having a large number of through holes. and an electroforming base used for manufacturing a metal mask such as a deposition mask integrally provided with the mask body. The electroforming master 80 of this embodiment is the same as the electroforming master 80 of the first embodiment. It corresponds to the casting mold 41, and as shown in FIG. 16, it has a conductive base portion 81 and A conductive layer 82 is laminated on the base portion 81, and a conductive layer 83 is interposed between the base portion 81 and the conductive layer 82. The adhesive layer 83 is formed by bonding the two parts 81 and 82 together. The adhesive layer 1 of the first embodiment has the same structure as the base portion 81 and the conductive layer 82 of the first embodiment. , and adhesive layer 83 are the second sheet (plate) 3 and the first sheet (plate) of Example 1, respectively. The adhesive layer 83 corresponds to the adhesive layer 1 in Examples 2 to 5. The composition may be the same as that of the conventional method.

[0069] The base portion 81 is made of a metal plate material such as stainless steel or brass, and has a thickness of about 1 mm. The base portion 81 is preferably made of 42 alloy (42% nickel-iron alloy). ), Invar (36% nickel-iron alloy), SUS430, and other metal plates with low thermal expansion coefficients. It is preferable to form a chromium or titanium layer on the surface of an insulating substrate such as a glass plate or a resin plate. Alternatively, the base portion 81 may be formed by forming a metal film made of a conductive metal such as silicon.

[0070] The conductive layer 82 is a laminate of thin films 82a, 82b, and 82c made of metal such as nickel. The thin films 82a, 82b, and 82c that make up the conductive layer 82 are thicker on the base portion 81 side, The thin films 82a, 82b, and 82c are set thinner as they move away from the portion 81. The thicknesses c and c are set to 60 μm, 40 μm, and 20 μm, respectively. Although the present invention has a laminated structure consisting of three thin films, it is not limited to this, and may have two thin films or four or more thin films. The conductive layer 82 may be a single layer. stomach.

[0071] As shown in FIG. 17, the adhesive layer 83 (adhesive layer 1) has unit micro-particles formed in the shape of circles of the same diameter. The hardened regions 4a are formed in a scattered state, and each unit unhardened region 4a is arranged in a regular staggered pattern. The hardened region 5 is formed continuously, and the hardened region 5 is arranged in a unit unhardened region. The uncured region 4a is surrounded by the adhesive layer 83. The edge uncured area 4b is provided with a plurality of edge uncured areas 4b. The edge uncured area 4b is formed by dividing the edge 7 at each side. The hardened region 5 faces the outer peripheral edge 6 of the adhesive layer 83 at the divided portion 7. .

[0072] 18 and 19, a method for manufacturing the electroforming matrix 80 will be described. A conductive flat substrate 87 is prepared on which a non-conductive dam 86 is formed. , can be formed by photolithography using ultraviolet curing resin, and the substrate 87 Alternatively, a synthetic resin frame that matches the outer shape of the substrate 87 may be bonded to the substrate 87. As shown in FIG. 8(a), the surface of a substrate 87 surrounded by a dam 86 is subjected to electroforming (plating). As a result, a primary electroforming layer 89 that will become the thin film 82c is formed. As shown in FIG. 1, by performing electroforming (plating) on ​​the surface of the primary electroformed layer 89, a thin film 82b Next, as shown in FIG. 18(c), the secondary electroformed layer 90 is formed. By performing electroforming (plating) on ​​the surface, a third electroforming layer 91 that becomes a thin film 82a is formed. The secondary electroformed layer 90 is thicker than the primary electroformed layer 89, and the tertiary electroformed layer 91 is thicker than the secondary electroformed layer 90. After the formation of the first to third electroforming layers 89, 90, and 91, the thickness is increased as shown in FIG. 18(d). The dam 86 is removed as shown in FIG. For example, after forming the adhesive layer 83 described later, The dam 86 can be removed after the base portion 81 is bonded or after the substrate 87 is peeled off.

[0073] Next, a dry film layer covered with a base film 12 and a cover film 13 is The resist 11 is cut to the contour of the tertiary electroformed layer 91, and the cover film 13 is peeled off. As shown in FIG. 19(a), the tertiary electroforming layer 91 and the exposed dry film resist 11 are In this state, the dry film resist 11 is pressed against the third electroforming layer 91. At this time, the dry film resist 11 is applied from the center to the outside through the base film 12. Then, a glass mask is placed on the base film 12. The pattern film 92 is adhered to the curing region 5. Then, ultraviolet light is applied from above the pattern film 92. By irradiating ultraviolet light from the ray lamp 93, the dry film is irradiated through the pattern film 92. The film resist 11 is exposed to light. As a result, as shown in FIG. 19(b), The resist 11 has an uncured portion corresponding to the uncured region 4 and a cured portion corresponding to the cured region 5. The adhesive layer 83 is formed in the same manner as in Example 1, and the adhesive layer 83 is formed as the third electroforming layer 9. It may be superimposed on the surface of 1.

[0074] Next, as shown in FIG. 19(c), the base film 12 is peeled off, and the substrate 87 is turned over. The upper surface of the base portion 81 is aligned with the exposed dry film resist 11, and the base is then In this state, from above, from one end of the substrate 87, Press the other end in order, pushing out the air as you adhere the pieces together. 16, by peeling the substrate 87 from the conductive layer 82 (primary electroformed layer 89), Thus, an electroforming matrix 80 is obtained.

[0075] As described above, the electroforming matrix 80 used in the above manner provides good thickness dimensional accuracy and flatness. Since a preferable electroforming mold 80 can be obtained, the electroforming mold 80 can be used to produce, for example, a deposition mask. Any metal mask can be formed with high precision. [Explanation of symbols]

[0076] 1 Adhesive layer 2 Plate (first sheet) 3 Plate (second sheet) 4 Uncured area 4a Unit uncured area 4b Edge uncured area 5 Cured area 6 Outer edge of adhesive layer 22 Mask body 23 Support Frame 24 metal layer 29 Through hole (evaporation through hole) 35 First frame (upper frame) 36 Second frame (lower frame)

Claims

1. An adhesive layer made of a photocurable resin for bonding two plates (2, 3) together in a laminated state, The film is composed of an uncured region (4) that is an unexposed portion and has adhesiveness inherent to the material, and a cured region (5) that is an exposed portion and has lost adhesiveness inherent to the material, A plurality of uncured edge regions (4b) are formed on the outer peripheral edge portion (6) of the adhesive layer, extending along the outer peripheral edge portion (6), In the internal region of the adhesive layer surrounded by the edge uncured region (4b), a plurality of unit uncured regions (4a) and cured regions (5) are formed, and the unit uncured regions (4a) are surrounded by the cured regions (5); An adhesive layer characterized in that a cured region (5) is formed continuously between edge uncured regions (4b) in a state of contact with the outer peripheral edge (6) of the adhesive layer.

2. A hardened region (5) consisting of a dividing portion (7) is formed between adjacent edge unhardened regions (4b), 2. The adhesive layer according to claim 1, wherein the hardened region (5) is formed by the dividing portion (7) so as to face the outer peripheral edge (6) of the adhesive layer.

3. The adhesive layer according to claim 1 or 2, characterized in that the unit uncured regions (4a) are formed in the same shape and are arranged in a regular matrix or staggered pattern.

4. A mask body (22) having a mask pattern consisting of a large number of independent through holes (29); A reinforcing support frame (23) or frame is attached to the outer periphery of the mask body (22), A metal mask characterized in that a mask body (22) and a support frame (23) or a frame are joined via the adhesive layer according to any one of claims 1 to 3.

Images