Resin composition, prepreg, laminate, resin film, multilayer printed wiring board, antenna device and antenna module

Abstract

To provide a resin composition which is thermally expand at a low level while suppressing the change of a specific dielectric constant (Dk), a prepreg using the resin composition, a laminated plate, a resin film, a multilayer printed wiring board, an antenna device and an antenna module.SOLUTION: There are provided a resin composition which contains (A) a thermosetting resin, (B) a titanium-based inorganic filler, and (C) an inorganic filler having a specific dielectric constant (Dk) lower than that of (B) the titanium-based inorganic filler; a prepreg using the resin composition; a laminated plate; a resin film; a multilayer printed wiring board; an antenna device; and an antenna module.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present embodiment relates to a resin composition, a prepreg, a laminate, a resin film, a multilayer printed wiring board, an antenna device, and an antenna module. [Background technology]

[0002] In recent years, the spread of mobile devices such as smartphones and technological innovations such as the Internet of Things (IoT) have led to an increase in the number of home appliances and electronic devices with wireless communication capabilities. This has led to an increase in communication traffic on wireless networks, raising concerns about a decline in communication speed and quality. To solve this problem, the fifth-generation mobile communication system (hereinafter sometimes referred to as "5G") is being developed and is already being used. 5G uses multiple antenna elements to perform advanced beamforming and spatial multiplexing, and also uses millimeter-wave signals with higher frequencies of tens of GHz in addition to the conventional 6 GHz band signals. This is expected to increase communication speeds and improve communication quality. On the other hand, because mobile devices such as smartphones are required to be miniaturized, the antenna modules also need to be miniaturized, and it is widely known that in order to achieve this miniaturization of the antenna module, the dielectric constant (Dk) of the substrate needs to be increased.

[0003] Furthermore, various components such as metal layers are arranged on the substrate for the antenna module. In this case, warping may occur due to the difference in thermal expansion coefficient between the substrate and the metal layers. Warping can cause poor connections between materials, so it is desirable to suppress it.

[0004] Patent Document 1 discloses a resin composition containing a liquid crystal polymer and a filler made of a composite oxide containing Ba, Sm, and Ti, which can produce molded articles with excellent dielectric properties and dimensional stability. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-031256 Summary of the Invention [Problem to be solved by the invention]

[0006] The technology of Patent Document 1 uses a liquid crystal polymer, which has excellent heat resistance, processability, etc., as a resin for an antenna substrate, and also uses a complex oxide containing Ba, Sm, and Ti, which is a high dielectric filler, to increase the dielectric constant of the substrate. Furthermore, it is shown that the linear expansion coefficient of a cured product of a resin composition obtained using the complex oxide is smaller than the linear expansion coefficient of a cured product of a resin composition obtained using other complex oxides.

[0007] Possible methods for further reducing the thermal expansion of substrates for antenna modules include, for example, changing the type of high dielectric filler as in the technology of Patent Document 1, or increasing the amount of high dielectric filler used. However, substrates for antenna modules are designed with a specific dielectric constant (Dk) that takes into account the balance of various physical properties, and the product is constructed based on that design value. In a product designed in this way, changing the type or amount of high-dielectric filler will cause the resulting substrate's dielectric constant (Dk) to deviate from the design value. In that case, the material cannot be applied to existing products. Furthermore, changing the design value of the dielectric constant (Dk) requires a complete reassessment of the product's configuration to suit the new dielectric constant (Dk), significantly increasing development costs.

[0008] In view of the current situation, an object of the present embodiment is to provide a resin composition that has low thermal expansion while suppressing changes in the relative dielectric constant (Dk), and a prepreg, a laminate, a resin film, a multilayer printed wiring board, an antenna device, and an antenna module that use the resin composition. [Means for solving the problem]

[0009] The present inventors have conducted research to solve the above problems and have found that the problems can be solved by the present embodiment described below. That is, this embodiment relates to the following [1] to

[15] . [1] (A) a thermosetting resin; (B) a titanium-based inorganic filler; (C) an inorganic filler having a lower dielectric constant (Dk) than the titanium-based inorganic filler (B); A resin composition comprising: [2] (B) Average particle size of titanium-based inorganic filler (D 50 ) is 0.1 to 20 μm. [3] The resin composition according to the above [1] or [2], wherein the relative dielectric constant (Dk) of the titanium-based inorganic filler (B) at 10 GHz is 10 to 3,000. [4] The resin composition according to any one of the above [1] to [3], wherein the titanium-based inorganic filler (B) is a titanate. [5] The resin composition according to [4] above, wherein the titanate is at least one selected from the group consisting of barium titanate, potassium titanate, calcium titanate, strontium titanate, lead titanate, and aluminum titanate. [6] The resin composition according to any one of the above [1] to [5], wherein the (A) thermosetting resin is one or more selected from the group consisting of maleimide compounds having one or more N-substituted maleimide groups and derivatives thereof. [7] (C) The resin composition according to any one of the above [1] to [6], wherein the inorganic filler (C) having a lower dielectric constant (Dk) than the titanium-based inorganic filler (B) is at least one selected from the group consisting of silica and alumina. [8] The resin composition according to any one of the above [1] to [7], wherein the cured product has a relative dielectric constant (Dk) of 2 to 50 at 20 GHz. [9] The resin composition according to any one of the above [1] to [8], which is for an antenna module.

[10] A prepreg containing the resin composition according to any one of [1] to [9] above.

[11] A laminate comprising the prepreg according to

[10] above and a metal foil.

[12] A resin film comprising the resin composition according to any one of the above [1] to [9].

[13] A multilayer printed wiring board comprising one or more members selected from the group consisting of the prepreg described in

[10] above, the laminate described in

[11] above, and the resin film described in

[12] above.

[14] An antenna device comprising the multilayer printed wiring board according to

[13] above.

[15] An antenna module including the antenna device according to

[14] above and a power supply circuit. [Effects of the Invention]

[0010] According to the present embodiment, it is possible to provide a resin composition that has low thermal expansion while suppressing a change in the relative dielectric constant (Dk), and a prepreg, a laminate, a resin film, a multilayer printed wiring board, an antenna device, and an antenna module that use the resin composition. DETAILED DESCRIPTION OF THE INVENTION

[0011] In this specification, a numerical range indicated using "to" indicates a range that includes the numerical values ​​before and after "to" as the minimum and maximum values, respectively. For example, the expression "X to Y" (X and Y are real numbers) means a range of values ​​equal to or greater than X and equal to or less than Y. In this specification, the expression "equal to or greater than X" means X and a value greater than X. In this specification, the expression "equal to or less than Y" means Y and a value less than Y. The lower and upper limits of any numerical range described herein may be combined with any lower or upper limit of any other numerical range. In the numerical ranges described in this specification, the lower or upper limit of the numerical range may be replaced with values ​​shown in the examples.

[0012] Unless otherwise specified, each of the components and materials exemplified in this specification may be used alone or in combination of two or more. In this specification, the content of each component in a resin composition means the total amount of the multiple substances present in the resin composition, unless otherwise specified, when multiple substances corresponding to each component are present in the resin composition. In this specification, the term "resin composition" includes a mixture of the components described below and a semi-cured product of the mixture.

[0013] In this specification, the term "solid content" refers to non-volatile content excluding volatile substances such as solvents, and refers to components that remain without volatilization when the resin composition is dried, including those that are liquid, syrup-like, or waxy at room temperature. Here, in this specification, room temperature refers to 25°C.

[0014] The mechanism of action described in this specification is speculation and does not limit the mechanism by which the resin composition according to this embodiment exhibits its effects. Any combination of the features described in this specification is also included in this embodiment.

[0015] [Resin composition] The resin composition of the present embodiment is (A) a thermosetting resin; (B) a titanium-based inorganic filler; (C) an inorganic filler having a lower dielectric constant (Dk) than the titanium-based inorganic filler (B); The resin composition contains:

[0016] In the following description, the thermosetting resin (A) may be referred to as "component (A)." Furthermore, the titanium-based inorganic filler (B) may be referred to as "component (B)." Furthermore, (C) an inorganic filler having a lower relative dielectric constant (Dk) than the (B) titanium-based inorganic filler may be referred to as "(C) low-dielectric inorganic filler" or "(C) component."

[0017] The reason why the resin composition of this embodiment has low thermal expansion while suppressing changes in the relative dielectric constant (Dk) is presumed to be as follows. The resin composition of the present embodiment contains (B) a titanium-based inorganic filler having a high dielectric constant (Dk), and (C) a low-dielectric inorganic filler having a lower dielectric constant (Dk) than the (B) titanium-based inorganic filler. Because the (C) low-dielectric inorganic filler is an inorganic compound, it contributes to reducing the thermal expansion coefficient of the resin composition. Furthermore, because the (C) low-dielectric inorganic filler has a lower dielectric constant (Dk) than the (B) titanium-based inorganic filler, the change in the dielectric constant (Dk) of the entire resin composition due to its addition can be kept small. Therefore, it is believed that the resin composition of this embodiment containing the (C) low-dielectric inorganic filler effectively reduces the thermal expansion coefficient without causing the dielectric constant (Dk) to fluctuate significantly from the designed value. Hereinafter, each component that may be contained in the resin composition of the present embodiment will be described in order.

[0018] <(A) Thermosetting resin> (A) Examples of thermosetting resins include epoxy resins, phenolic resins, maleimide resins, cyanate resins, isocyanate resins, benzoxazine resins, oxetane resins, amino resins, unsaturated polyester resins, allyl resins, dicyclopentadiene resins, silicone resins, triazine resins, and melamine resins. The (A) thermosetting resin may be used alone or in combination of two or more kinds. Among these, as the (A) thermosetting resin, from the viewpoints of heat resistance, low thermal expansion, and being less susceptible to unintended curing-accelerating effects of the (B) titanium-based inorganic filler, and being excellent in moldability for embedding circuits, etc., maleimide resins are preferred, and one or more types selected from the group consisting of maleimide compounds having one or more N-substituted maleimide groups and derivatives thereof are more preferred. In the following description, "one or more members selected from the group consisting of maleimide compounds having one or more N-substituted maleimide groups and derivatives thereof" may be referred to as "maleimide resin." In the following description, a maleimide compound having one or more N-substituted maleimide groups may be referred to as a "maleimide compound (AX)" or a "(AX) component." Furthermore, a derivative of a maleimide compound having one or more N-substituted maleimide groups may be referred to as a "maleimide compound derivative (AY)" or "(AY) component."

[0019] (Maleimide compound (AX)) The maleimide compound (AX) is not particularly limited as long as it is a maleimide compound having one or more N-substituted maleimide groups. As the maleimide compound (AX), from the viewpoints of dielectric properties, conductor adhesion, and heat resistance, a maleimide compound (A1) having two or more N-substituted maleimide groups [hereinafter, sometimes referred to as "maleimide compound (A1)" or "component (A1)"] is preferred, an aromatic maleimide compound having two or more N-substituted maleimide groups is more preferred, and an aromatic bismaleimide compound having two N-substituted maleimide groups is even more preferred. In this specification, the term "aromatic maleimide compound" refers to a compound having an N-substituted maleimide group directly bonded to an aromatic ring, and the term "aromatic bismaleimide compound" refers to a compound having two N-substituted maleimide groups directly bonded to an aromatic ring.

[0020] [Maleimide compound (A1)] The maleimide compound (A1) is preferably a maleimide compound represented by the following general formula (A1-1).

[0021] [ka] (In the formula, X a11 is a divalent organic group.

[0022] X in the above general formula (A1-1) a11 is a divalent organic group. X in the above general formula (A1-1) a11Examples of the divalent organic group represented by the formula (A1-2) include a divalent group represented by the formula (A1-3) below, a divalent group represented by the formula (A1-4) below, a divalent group represented by the formula (A1-5) below, and a divalent group represented by the formula (A1-6) below.

[0023] [ka] (In the formula, R a11 is an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. a11 is an integer from 0 to 4. * represents a binding site.

[0024] R in the above general formula (A1-2) a11 Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by include alkyl groups having 1 to 5 carbon atoms, such as methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, and n-pentyl; alkenyl groups having 2 to 5 carbon atoms, and alkynyl groups having 2 to 5 carbon atoms. The aliphatic hydrocarbon group having 1 to 5 carbon atoms may be either linear or branched. The aliphatic hydrocarbon group having 1 to 5 carbon atoms is preferably an aliphatic hydrocarbon group having 1 to 3 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and even more preferably a methyl group. Examples of halogen atoms include fluorine atoms, chlorine atoms, bromine atoms, and iodine atoms. n in the above general formula (A1-2) a11 is an integer of 0 to 4, and from the viewpoint of availability, is preferably an integer of 0 to 2, more preferably 0 or 1, and even more preferably 0. n a11 is an integer equal to or greater than 2, multiple R a11 They may be the same or different.

[0025] [ka] (In the formula, R a12 and Ra13 are each independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. a12 is an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, a single bond, or a divalent group represented by the following general formula (A1-3-1): a12 and n a13 are each independently an integer of 0 to 4. * represents a binding site.

[0026] R in the above general formula (A1-3) a12 and R a13 Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by include alkyl groups having 1 to 5 carbon atoms, such as methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, and n-pentyl; alkenyl groups having 2 to 5 carbon atoms, and alkynyl groups having 2 to 5 carbon atoms. The aliphatic hydrocarbon group having 1 to 5 carbon atoms may be either linear or branched. The aliphatic hydrocarbon group having 1 to 5 carbon atoms is preferably an aliphatic hydrocarbon group having 1 to 3 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and even more preferably a methyl group or an ethyl group. Examples of halogen atoms include fluorine atoms, chlorine atoms, bromine atoms, and iodine atoms.

[0027] X in the above general formula (A1-3) a12 Examples of the alkylene group having 1 to 5 carbon atoms represented by include a methylene group, a 1,2-dimethylene group, a 1,3-trimethylene group, a 1,4-tetramethylene group, a 1,5-pentamethylene group, etc. The alkylene group having 1 to 5 carbon atoms is preferably an alkylene group having 1 to 3 carbon atoms, more preferably an alkylene group having 1 or 2 carbon atoms, and even more preferably a methylene group.

[0028] X in the above general formula (A1-3) a12Examples of the alkylidene group having 2 to 5 carbon atoms represented by include an ethylidene group, a propylidene group, an isopropylidene group, a butylidene group, an isobutylidene group, a pentylidene group, an isopentylidene group, etc. Among these, an alkylidene group having 2 to 4 carbon atoms is preferred, an alkylidene group having 2 or 3 carbon atoms is more preferred, and an isopropylidene group is even more preferred.

[0029] In the above general formula (A1-3), n a12 and n a13 are each independently an integer of 0 to 4. n a12 or n a13 is an integer equal to or greater than 2, multiple R a12 R a13 They may be the same or different from each other.

[0030] X in the above general formula (A1-3) a12 The divalent group represented by general formula (A1-3-1) is as follows:

[0031] [ka] (In the formula, R a14 and R a15 are each independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. a13 is an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, or a single bond. a14 and n a15 are each independently an integer of 0 to 4. * represents a binding site.

[0032] R in the above general formula (A1-3-1) a14 and R a15Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by include alkyl groups having 1 to 5 carbon atoms, such as methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, and n-pentyl; alkenyl groups having 2 to 5 carbon atoms, and alkynyl groups having 2 to 5 carbon atoms. The aliphatic hydrocarbon group having 1 to 5 carbon atoms may be either linear or branched. The aliphatic hydrocarbon group having 1 to 5 carbon atoms is preferably an aliphatic hydrocarbon group having 1 to 3 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and even more preferably a methyl group. Examples of halogen atoms include fluorine atoms, chlorine atoms, bromine atoms, and iodine atoms.

[0033] X in the above general formula (A1-3-1) a13 Examples of the alkylene group having 1 to 5 carbon atoms represented by include a methylene group, a 1,2-dimethylene group, a 1,3-trimethylene group, a 1,4-tetramethylene group, a 1,5-pentamethylene group, etc. The alkylene group having 1 to 5 carbon atoms is preferably an alkylene group having 1 to 3 carbon atoms, more preferably an alkylene group having 1 or 2 carbon atoms, and even more preferably a methylene group.

[0034] X in the above general formula (A1-3-1) a13 Examples of the alkylidene group having 2 to 5 carbon atoms represented by include an ethylidene group, a propylidene group, an isopropylidene group, a butylidene group, an isobutylidene group, a pentylidene group, an isopentylidene group, etc. Among these, an alkylidene group having 2 to 4 carbon atoms is preferred, an alkylidene group having 2 or 3 carbon atoms is more preferred, and an isopropylidene group is even more preferred.

[0035] X in the above general formula (A1-3-1) a13 Among the above options, alkylidene groups having 2 to 5 carbon atoms are preferred, alkylidene groups having 2 to 4 carbon atoms are more preferred, and an isopropylidene group is even more preferred.

[0036] n in the above general formula (A1-3-1) a14 and n a15are each independently an integer of 0 to 4, and from the viewpoint of availability, are each preferably an integer of 0 to 2, more preferably 0 or 1, and even more preferably 0. n a14 or n a15 is an integer equal to or greater than 2, multiple R a14 R a15 They may be the same or different from each other.

[0037] X in the above general formula (A1-3) a12 Among the above options, alkylene groups having 1 to 5 carbon atoms, alkylidene groups having 2 to 5 carbon atoms, and divalent groups represented by the above general formula (A1-3-1) are preferred, alkylene groups having 1 to 5 carbon atoms are more preferred, and methylene groups are even more preferred.

[0038] [ka] (In the formula, n a16 is an integer between 0 and 10. * represents a binding site.

[0039] n in the above general formula (A1-4) a16 is preferably an integer of 0 to 5, more preferably an integer of 0 to 4, and even more preferably an integer of 0 to 3, from the viewpoint of availability.

[0040] [ka] (In the formula, n a17 is a number between 0 and 5. * represents a binding site.

[0041] [ka] (In the formula, R a16 and R a17 are each independently a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms. a18 is an integer from 1 to 8. * represents a binding site.

[0042] R in the above general formula (A1-6) a16 and R a17 Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by include alkyl groups having 1 to 5 carbon atoms, such as methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, and n-pentyl groups; alkenyl groups having 2 to 5 carbon atoms; and alkynyl groups having 2 to 5 carbon atoms. The aliphatic hydrocarbon group having 1 to 5 carbon atoms may be either linear or branched. n in the above general formula (A1-6) a18 is an integer of 1 to 8, preferably an integer of 1 to 5, more preferably an integer of 1 to 3, and even more preferably 1. a18 is an integer equal to or greater than 2, multiple R a16 R a17 They may be the same or different from each other.

[0043] Examples of the maleimide compound (A1) include aromatic bismaleimide compounds, aromatic polymaleimide compounds, and aliphatic maleimide compounds. Specific examples of the maleimide compound (A1) include N,N'-ethylene bismaleimide, N,N'-hexamethylene bismaleimide, N,N'-(1,3-phenylene) bismaleimide, N,N'-[1,3-(2-methylphenylene)] bismaleimide, N,N'-[1,3-(4-methylphenylene)] bismaleimide, N,N'-(1,4-phenylene) bismaleimide, bis(4-maleimidophenyl)methane, bis(3-methyl-4-maleimidophenyl)methane, 3,3'-dimethyl-5,5'-diethyl -4,4'-diphenylmethane bismaleimide, bis(4-maleimidophenyl) ether, bis(4-maleimidophenyl) sulfone, bis(4-maleimidophenyl) sulfide, bis(4-maleimidophenyl) ketone, bis(4-maleimidocyclohexyl)methane, 1,4-bis(4-maleimidophenyl)cyclohexane, 1,4-bis(maleimidomethyl)cyclohexane, 1,4-bis(maleimidomethyl)benzene, 1,3-bis(4-maleimidophenoxy)benzene, 1,3-bis(3-maleimidophenyl) 1,1-bis[4-(3-maleimidophenoxy)phenyl]ethane, 1,1-bis[4-(4-maleimidophenoxy)phenyl]ethane, 1,2-bis[4-(3-maleimidophenoxy)phenyl]ethane, 1,2-bis[4-(4-maleimidophenoxy)phenyl]ethane, 2,2-bis[4-(3-maleimidophenoxy)phenyl]propane , 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane, 2,2-bis[4-(3-maleimidophenoxy)phenyl]butane, 2,2-bis[4-(4-maleimidophenoxy)phenyl]butane, 2,2-bis[4-(3-maleimidophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, 2,2-bis[4-(4-maleimidophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, 4,4-bis(3-maleimidophenoxy)biphenyl, 4,4-bis(4-maleimidophenoxy)biphenyl, bis[4-(3-maleimidophenoxy)phenyl]ketone, bis[4-(4-maleimidophenoxy)phenyl]ketone, bis(4-maleimidophenyl)disulfide, bis[4-(3-maleimidophenoxy)phenyl]sulfide, bis[4-(4-maleimidophenoxy)phenyl]sulfide, bis[4-(3-maleimidophenoxy)phenyl]sulfoxide, bis[4-(4-maleimidophenoxy)phenyl]sulfoxide, bis[4-(3-maleimidophenoxy)phenyl]sulfone, bis[4-(4-maleimidophenoxy)phenyl]sulfone, bis[4-(3-maleimidophenoxy)phenyl]ether, bis[4-(4-maleimidophenoxy)phenyl]ether, 1,4-bis[4-(4-maleimidophenoxy)-α,α -dimethylbenzyl]benzene, 1,3-bis[4-(4-maleimidophenoxy)-α,α-dimethylbenzyl]benzene, 1,4-bis[4-(3-maleimidophenoxy)-α,α-dimethylbenzyl]benzene, 1,3-bis[4-(3-maleimidophenoxy)-α,α-dimethylbenzyl]benzene, 1,4-bis[4-(4-maleimidophenoxy)-3,5-dimethyl-α,α-dimethylbenzyl]benzene, 1,3-bis[4-(4-maleimidophenoxy)-3,5-dimethyl-α,α-dimethylbenzyl]benzene, 1,4-bis[4-(3-maleimidophenoxy)-3,5-dimethyl-α,α-dimethylbenzyl]benzene, 1,3-bis[4-(3-maleimidophenoxy)-3,5-dimethyl-α,α-dimethylbenzyl]benzene, polyphenylmethane maleimide, and the like. Among these, 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane is preferred.

[0044] (Maleimide compound derivatives (AY)) The maleimide compound derivative (AY) is preferably an aminomaleimide compound having a structural unit derived from the above-mentioned maleimide compound (AX) and a structural unit derived from a diamine compound [hereinafter, sometimes referred to as "aminomaleimide compound (A2)" or "component (A2)"].

[0045] [Aminomaleimide compound (A2)] The aminomaleimide compound (A2) has a structural unit derived from the maleimide compound (AX) and a structural unit derived from a diamine compound (hereinafter, sometimes referred to as "diamine compound (a)" or "component (a)").

[0046] <Structural units derived from maleimide compounds (AX)> An example of a structural unit derived from the maleimide compound (AX) is a structural unit formed by a Michael addition reaction between at least one N-substituted maleimide group of the maleimide compound (AX) and an amino group of the diamine compound. The structural unit derived from the maleimide compound (AX) contained in the aminomaleimide compound (A2) may be of one type alone or of two or more types.

[0047] The content of the structural unit derived from the maleimide compound (AX) in the aminomaleimide compound (A2) is not particularly limited, but is preferably 5 to 95 mass%, more preferably 30 to 93 mass%, and even more preferably 60 to 90 mass%. When the content of the structural unit derived from the maleimide compound (AX) in the aminomaleimide compound (A2) is within the above range, the dielectric properties and film handling properties tend to be better.

[0048] <Structural units derived from diamine compound (a)> Examples of the structural unit derived from the diamine compound (a) include a structural unit formed by a Michael addition reaction between one or both of the two amino groups contained in the diamine compound (a) and an N-substituted maleimide group contained in the maleimide compound (AX). The structural unit derived from the diamine compound (a) contained in the aminomaleimide compound (A2) may be of one type alone or may be of two or more types.

[0049] The amino group contained in the diamine compound (a) is preferably a primary amino group. Examples of the structural unit derived from the diamine compound (a) having two primary amino groups include a group represented by the following general formula (a-1) and a group represented by the following general formula (a-2).

[0050] [ka] (In the formula, X a21 is a divalent organic group, and * represents a bonding site.

[0051] X in the above general formula (a-1) and the above general formula (a-2) a21 is a divalent organic group, and corresponds to the divalent group obtained by removing two primary amino groups from diamine compound (a).

[0052] X in the above general formula (a-1) and the above general formula (a-2) a21 is preferably a divalent group represented by the following general formula (a-3).

[0053] [ka] (In the formula, R a21 and R a22 are each independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, a hydroxyl group, or a halogen atom. a22 is an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, a fluorenylene group, a single bond, or a divalent group represented by the following general formula (a-3-1) or (a-3-2): a21 and n a22 are each independently an integer of 0 to 4. * represents a binding site.

[0054] [ka] (In the formula, R a23 and R a24are each independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. a23 represents an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, an m-phenylenediisopropylidene group, a p-phenylenediisopropylidene group, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, or a single bond. a23 and n a24 are each independently an integer of 0 to 4. * represents a binding site.

[0055] [ka] (In the formula, R a25 is an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. a24 and X a25 are each independently an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, or a single bond. a25 is an integer from 0 to 4. * represents a binding site.

[0056] R in the above general formula (a-3), the above general formula (a-3-1), and the above general formula (a-3-2) a21 , R a22 , R a23 , R a24 and R a25 Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by include alkyl groups having 1 to 5 carbon atoms, such as methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, and n-pentyl; alkenyl groups having 2 to 5 carbon atoms, and alkynyl groups having 2 to 5 carbon atoms. The aliphatic hydrocarbon group having 1 to 5 carbon atoms may be either linear or branched. The aliphatic hydrocarbon group having 1 to 5 carbon atoms is preferably an aliphatic hydrocarbon group having 1 to 3 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and even more preferably a methyl group or an ethyl group. Examples of halogen atoms include fluorine atoms, chlorine atoms, bromine atoms, and iodine atoms.

[0057] X in the above general formula (a-3) a22 , X in the above general formula (a-3-1) a23 and X in the above general formula (a-3-2) a24 and X a25 Examples of the alkylene group having 1 to 5 carbon atoms represented by include a methylene group, a 1,2-dimethylene group, a 1,3-trimethylene group, a 1,4-tetramethylene group, a 1,5-pentamethylene group, etc. The alkylene group having 1 to 5 carbon atoms is preferably an alkylene group having 1 to 3 carbon atoms, more preferably an alkylene group having 1 or 2 carbon atoms, and even more preferably a methylene group.

[0058] X in the above general formula (a-3) a22 , X in the above general formula (a-3-1) a23 and X in the above general formula (a-3-2) a24 and X a25 Examples of the alkylidene group having 2 to 5 carbon atoms represented by include an ethylidene group, a propylidene group, an isopropylidene group, a butylidene group, an isobutylidene group, a pentylidene group, an isopentylidene group, etc. The alkylidene group having 2 to 5 carbon atoms is preferably an alkylidene group having 2 to 4 carbon atoms, more preferably an alkylidene group having 2 or 3 carbon atoms, and even more preferably an isopropylidene group.

[0059] n in the above general formula (a-3) a21 and n a22 are each independently an integer of 0 to 4, and from the viewpoint of availability, are each preferably an integer of 0 to 3, more preferably an integer of 0 to 2, and even more preferably 0 or 2. n a21 or n a22 is an integer equal to or greater than 2, multiple R a21 R a22 They may be the same or different from each other.

[0060] n in the above general formula (a-3-1) a23 and n a24are each independently an integer of 0 to 4, and from the viewpoint of availability, are each preferably an integer of 0 to 2, more preferably 0 or 1, and even more preferably 0. n a23 or n a24 is an integer equal to or greater than 2, multiple R a23 R a24 They may be the same or different from each other.

[0061] n in the above general formula (a-3-2) a25 is an integer of 0 to 4, and from the viewpoint of availability, is preferably an integer of 0 to 2, more preferably 0 or 1, and even more preferably 0. n a25 is an integer equal to or greater than 2, multiple R a25 They may be the same or different from each other.

[0062] The content of the structural units derived from the diamine compound (a) in the aminomaleimide compound (A2) is not particularly limited, but is preferably 5 to 95 mass%, more preferably 7 to 70 mass%, and even more preferably 10 to 40 mass%. When the content of the structural units derived from the diamine compound (a) in the aminomaleimide compound (A2) is within the above range, the dielectric properties, heat resistance, flame retardancy, and glass transition temperature tend to be better.

[0063] Examples of the diamine compound (a) include 4,4'-diaminodiphenylmethane, 3,3'-dimethyl-4,4'-diaminodiphenylmethane, 3,3'-diethyl-4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl ketone, 4,4'-diaminobiphenyl, 3,3' -dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxybenzidine, 2,2-bis(3-amino-4-hydroxyphenyl)propane, 3,3'-dimethyl-5,5'-diethyl-4,4'-diaminodiphenylmethane, 2,2-bis(4-aminophenyl)propane, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 1,3 -bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyl, 1,3-bis[1-[4-(4-aminophenoxy)phenyl]-1-methylethyl]benzene, 1,4-bis[1-[4-(4-aminophenoxy)phenyl]-1-methylethyl]benzene, 4,4'-[1, [3-phenylenebis(1-methylethylidene)]bisaniline, 4,4'-[1,4-phenylenebis(1-methylethylidene)]bisaniline, 3,3'-[1,3-phenylenebis(1-methylethylidene)]bisaniline, bis[4-(4-aminophenoxy)phenyl]sulfone, bis[4-(3-aminophenoxy)phenyl]sulfone, 9,9-bis(4-aminophenyl)fluorene, and the like.

[0064] Among these, 4,4'-diaminodiphenylmethane, 3,3'-dimethyl-4,4'-diaminodiphenylmethane, 3,3'-diethyl-4,4'-diaminodiphenylmethane, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 4,4'-[1,3-phenylenebis(1-methylethylidene)]bisaniline, and 4,4'-[1,4-phenylenebis(1-methylethylidene)]bisaniline are preferred as the diamine compound (a) from the viewpoints of excellent solubility in organic solvents, reactivity, and heat resistance.

[0065] In the aminomaleimide compound (A2), the equivalent ratio (Ta2 / Ta1) of the total equivalent (Ta2) of groups (including -NH2) derived from the -NH2 group of the diamine compound (a) to the total equivalent (Ta1) of groups derived from the N-substituted maleimide group of the maleimide compound (AX) is not particularly limited, but from the viewpoints of dielectric properties, heat resistance, and glass transition temperature, it is preferably 0.05 to 10, more preferably 0.5 to 7, and even more preferably 1 to 5. The group derived from the -NH2 group of the diamine compound (a) is intended to include -NH2 itself. Furthermore, the group derived from the N-substituted maleimide group of the maleimide compound (AX) is intended to include the N-substituted maleimide group itself.

[0066] The weight average molecular weight (Mw) of the aminomaleimide compound (A2) is not particularly limited, but is preferably 400 to 10,000, more preferably 1,000 to 5,000, and even more preferably 1,500 to 4,000. The weight average molecular weight (Mw) of the aminomaleimide compound (A2) can be measured by the method described in the Examples.

[0067] (Method for producing aminomaleimide compound (A2)) The aminomaleimide compound (A2) can be produced, for example, by reacting the maleimide compound (AX) with the diamine compound (a) in an organic solvent. By reacting the maleimide compound (AX) with the diamine compound (a), an aminomaleimide compound (A2) is obtained through a Michael addition reaction between the maleimide compound (AX) and the diamine compound (a).

[0068] When the maleimide compound (AX) is reacted with the diamine compound (a), a reaction catalyst may be used as needed. Examples of the reaction catalyst include acidic catalysts such as p-toluenesulfonic acid, amines such as triethylamine, pyridine, and tributylamine, imidazoles such as methylimidazole and phenylimidazole, and phosphorus-based catalysts such as triphenylphosphine. These may be used alone or in combination of two or more. The amount of the reaction catalyst to be added is not particularly limited, but from the viewpoint of the reaction rate and reaction uniformity, it is preferably 0.01 to 5 parts by mass, more preferably 0.05 to 3 parts by mass, and even more preferably 0.1 to 2 parts by mass, relative to 100 parts by mass of the total amount of the maleimide compound (AX) and the diamine compound (a).

[0069] The reaction temperature for the Michael addition reaction is preferably 50 to 160°C, more preferably 60 to 150°C, and even more preferably 70 to 140°C, from the viewpoints of workability such as reaction rate, and suppression of gelation of the product during the reaction. The reaction time for the Michael addition reaction is preferably 0.5 to 10 hours, more preferably 1 to 8 hours, and even more preferably 2 to 6 hours, from the viewpoints of productivity and allowing the reaction to proceed sufficiently. However, these reaction conditions can be appropriately adjusted depending on the types of raw materials used, and are not particularly limited.

[0070] In the Michael addition reaction, the solids concentration and solution viscosity of the reaction solution may be adjusted by adding or concentrating an organic solvent. The solids concentration of the reaction solution is not particularly limited, but is preferably 10 to 90% by mass, more preferably 15 to 85% by mass, and even more preferably 20 to 80% by mass. When the solids concentration of the reaction raw materials is equal to or greater than the lower limit, a good reaction rate is obtained, and productivity tends to be improved. Furthermore, when the solids concentration of the reaction raw materials is equal to or less than the upper limit, better solubility is obtained, stirring efficiency is improved, and gelation of the product during the reaction tends to be more effectively suppressed.

[0071] In the resin composition of the present embodiment, the content of the (A) thermosetting resin is not particularly limited, but is preferably 5 to 100 mass %, more preferably 10 to 99.8 mass %, and even more preferably 20 to 99.5 mass %, relative to the total (100 mass %) of the resin components in the resin composition of the present embodiment. When the content of the (A) thermosetting resin is equal to or greater than the lower limit, the heat resistance, moldability, processability, and conductor adhesion tend to be better. When the content of the (A) thermosetting resin is equal to or less than the upper limit, the dielectric properties tend to be better.

[0072] The content of the maleimide resin in the (A) thermosetting resin is not particularly limited, but is preferably 80 to 100 mass %, more preferably 90 to 100 mass %, and even more preferably 95 to 100 mass %, relative to the (A) thermosetting resin (100 mass %). When the content of the maleimide resin is equal to or greater than the lower limit, the heat resistance, moldability, processability, and conductor adhesion tend to be better, whereas when the content of the maleimide resin is equal to or less than the upper limit, the dielectric properties tend to be better.

[0073] In this specification, the term "resin component" refers to a resin and a compound that forms a resin through a curing reaction. For example, in the resin composition of this embodiment, the (A) thermosetting resin corresponds to the resin component. When the resin composition of the present embodiment contains, as an optional component, a resin or a compound that forms a resin by a curing reaction other than the above components, these optional components are also included in the resin component, and the curing accelerator described below is included in the resin component. On the other hand, inorganic fillers and flame retardants are not included in the resin components.

[0074] In the resin composition of this embodiment, the content of the resin component is not particularly limited, but is preferably 5 to 80 mass %, more preferably 10 to 50 mass %, and even more preferably 15 to 30 mass %, relative to the total solid content of the resin composition. When the content of the resin component is equal to or greater than the lower limit, the heat resistance, moldability, processability, and conductor adhesion tend to be better, whereas when the content of the resin component is equal to or less than the upper limit, the dielectric properties tend to be better.

[0075] <(B) Titanium-based inorganic filler> The resin composition of the present embodiment contains (B) a titanium-based inorganic filler. The (B) titanium-based inorganic filler may be used alone or in combination of two or more.

[0076] (B) Examples of titanium-based inorganic fillers include titanium dioxide, titanates, etc. Among these, titanates are preferred from the viewpoint of facilitating an increase in the dielectric constant (Dk) of the cured resin composition. Examples of titanates include alkali metal titanates, alkaline earth metal titanates, etc. Among these, from the viewpoint of easily increasing the dielectric constant (Dk) of the cured product of the resin composition, one or more selected from the group consisting of barium titanate, potassium titanate, calcium titanate, strontium titanate, lead titanate, and aluminum titanate are preferred, and calcium titanate and strontium titanate are more preferred.

[0077] (B) Average particle size of titanium-based inorganic filler (D 50) is not particularly limited, but is preferably 0.1 to 20 μm, more preferably 0.5 to 15 μm, and even more preferably 0.7 to 10 μm. (B) Average particle size of titanium-based inorganic filler (D 50 If the average particle diameter (D) of the (B) titanium-containing inorganic filler is equal to or greater than the above lower limit, the specific surface area of ​​the (B) titanium-containing inorganic filler becomes small, and the promotion of an unintended curing reaction of the (A) thermosetting resin by the solid surface of the (B) titanium-containing inorganic filler tends to be easily suppressed. 50 When the value of (a) is equal to or less than the upper limit, the homogeneity of the cured product of the resin composition tends to be improved. (B) Average particle size of titanium-based inorganic filler (D 50 ) can be measured by the method described in the Examples.

[0078] The relative dielectric constant (Dk) of (B) titanium-based inorganic filler at 10 GHz is not particularly limited, but is preferably 10 to 3,000, more preferably 13 to 2,500, and even more preferably 15 to 2,000. When the (B) titanium-based inorganic filler has a dielectric constant (Dk) at 10 GHz equal to or greater than the lower limit, the dielectric constant (Dk) of the cured product of the resin composition tends to be higher. When the (B) titanium-based inorganic filler has a dielectric constant (Dk) at 10 GHz equal to or less than the upper limit, the titanium-based inorganic filler tends to be more easily available and to maintain a good balance with other physical properties. (B) The relative dielectric constant (Dk) at 10 GHz of the titanium-based inorganic filler can be measured by the method described in the Examples.

[0079] The content of (B) titanium-based inorganic filler in the resin composition of this embodiment is not particularly limited, but is preferably 10 to 70 mass %, more preferably 15 to 60 mass %, and even more preferably 20 to 50 mass %, relative to the total solid content of the resin composition. When the content of the (B) titanium-based inorganic filler is equal to or greater than the lower limit, the dielectric constant (Dk) of the cured product of the resin composition tends to be higher, whereas when the content of the (B) titanium-based inorganic filler is equal to or less than the upper limit, the moldability tends to be better.

[0080] <(C) Low-dielectric inorganic filler> The resin composition of the present embodiment contains (C) a low dielectric inorganic filler. The (C) low dielectric inorganic filler is an inorganic filler having a lower dielectric constant (Dk) than the (B) titanium-based inorganic filler, and is a component that contributes to a lower thermal expansion coefficient of the resin composition of this embodiment. The (C) low dielectric inorganic filler may be used alone or in combination of two or more.

[0081] The (C) low dielectric inorganic filler is not particularly limited as long as it is an inorganic filler having a lower dielectric constant (Dk) than the (B) titanium-based inorganic filler, and examples thereof include silica, alumina, mica, beryllia, aluminum carbonate, magnesium hydroxide, aluminum hydroxide, aluminum silicate, calcium carbonate, calcium silicate, magnesium silicate, silicon nitride, boron nitride, clay, talc, aluminum borate, silicon carbide, etc. Among these, from the viewpoint of low thermal expansion, one or more selected from the group consisting of silica, alumina, mica, and talc are preferred, one or more selected from the group consisting of silica and alumina are more preferred, and silica is even more preferred.

[0082] (C) Average particle size of low dielectric inorganic filler (D 50 ) is not particularly limited, but is preferably 0.1 to 20 μm, more preferably 0.2 to 15 μm, and even more preferably 0.3 to 12 μm. (C) Average particle size of low dielectric inorganic filler (D 50 When the average particle diameter (D 50 When (C) is equal to or less than the upper limit, sedimentation of the low dielectric inorganic filler (C) tends to be more easily suppressed. (C) Average particle size of low dielectric inorganic filler (D 50 ) can be measured by the method described in the Examples.

[0083] The dielectric constant (Dk) at 10 GHz of the (C) low dielectric inorganic filler is not particularly limited, but it is preferably at least one order of magnitude lower than that of the (B) titanium-based inorganic filler. For example, the dielectric constant (Dk) at 10 GHz of the (C) low dielectric inorganic filler may be in the range of 1 / 1000 to 1 / 5, 1 / 500 to 1 / 8, or 1 / 100 to 1 / 10 of the dielectric constant (Dk) at 10 GHz of the (B) titanium-based inorganic filler. When the dielectric constant (Dk) at 10 GHz of the (C) low dielectric inorganic filler is within the above range, the fluctuation in the dielectric constant (Dk) of the cured product of the resin composition due to the addition of the (C) low dielectric inorganic filler tends to be smaller. (C) The relative dielectric constant (Dk) at 10 GHz of the low dielectric inorganic filler can be measured by the method described in the Examples.

[0084] The content of the (C) low dielectric inorganic filler in the resin composition of this embodiment is not particularly limited, but is preferably 10 to 60 mass %, more preferably 20 to 50 mass %, and even more preferably 25 to 40 mass %, relative to the total solid content of the resin composition. When the content of the (C) low dielectric inorganic filler is equal to or greater than the above lower limit, the coefficient of thermal expansion of the cured product of the resin composition tends to be smaller. On the other hand, when the content of the (C) low dielectric inorganic filler is equal to or less than the above upper limit, the fluctuation in the relative dielectric constant (Dk) of the cured product of the resin composition due to the addition of the (C) low dielectric inorganic filler tends to be smaller.

[0085] The total content of (B) titanium-based inorganic filler and (C) low dielectric inorganic filler in the resin composition of this embodiment is preferably 20 to 95 mass %, more preferably 50 to 90 mass %, and even more preferably 70 to 85 mass %, based on the total solid content of the resin composition. When the total content of the (B) titanium-based inorganic filler and the (C) low dielectric inorganic filler is equal to or greater than the lower limit, a higher dielectric constant (Dk) and a lower coefficient of thermal expansion tend to be easily obtained. When the total content of the (B) titanium-based inorganic filler and the (C) low dielectric inorganic filler is equal to or less than the upper limit, the moldability tends to be more easily improved.

[0086] The proportion of the total content of (B) titanium-based inorganic filler and (C) low dielectric inorganic filler relative to the total amount of inorganic fillers contained in the resin composition of this embodiment is not particularly limited, but is preferably 80 to 100 mass%, more preferably 90 to 100 mass%, and even more preferably 95 to 100 mass%.

[0087] <(D) Curing accelerator> From the viewpoint of accelerating the curing reaction of the resin composition, the resin composition of the present embodiment preferably further contains (D) a curing accelerator. The (D) curing accelerator may be used alone or in combination of two or more.

[0088] Examples of the (D) curing accelerator include acidic catalysts such as p-toluenesulfonic acid; amine compounds such as triethylamine, pyridine, tributylamine, and dicyandiamide; imidazole compounds such as methylimidazole, phenylimidazole, and 1-cyanoethyl-2-phenylimidazole; isocyanate-masked imidazole compounds such as the addition reaction product of hexamethylene diisocyanate resin and 2-ethyl-4-methylimidazole; tertiary amine compounds; quaternary ammonium compounds; phosphorus compounds such as triphenylphosphine; organic peroxides such as dicumyl peroxide, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexyne-3, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexane, t-butylperoxyisopropyl monocarbonate, and α,α'-bis(t-butylperoxy)diisopropylbenzene; and carboxylates of manganese, cobalt, zinc, and the like. Among these, from the viewpoint of curing acceleration effect and storage stability, amine compounds and imidazole compounds are preferred, and dicyandiamide and 1-cyanoethyl-2-phenylimidazole are more preferred.

[0089] When the resin composition of this embodiment contains (D) a curing accelerator, the content thereof is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 5 parts by mass, and even more preferably 0.5 to 2 parts by mass, relative to 100 parts by mass of (A) the thermosetting resin. When the content of the (D) curing accelerator is equal to or greater than the lower limit, a sufficient curing acceleration effect tends to be easily obtained, and when the content of the (D) curing accelerator is equal to or less than the upper limit, storage stability tends to be better.

[0090] <Other ingredients> The resin composition of the present embodiment may or may not contain other components in addition to the above components, as necessary. Examples of other components include (A) resins other than the thermosetting resin, flame retardants, organic solvents, and other additives. These may be used singly or in combination of two or more.

[0091] (A) Examples of resins other than thermosetting resins include thermoplastic resins. Examples of thermoplastic resins include polyphenylene ether resins; thermoplastic elastomers such as styrene-based thermoplastic elastomers, olefin-based thermoplastic elastomers, urethane-based thermoplastic elastomers, polyester-based thermoplastic elastomers, polyamide-based thermoplastic elastomers, acrylic-based thermoplastic elastomers, silicone-based thermoplastic elastomers, and derivatives thereof.

[0092] Examples of the flame retardant include phosphorus-based flame retardants, metal hydrates, halogen-based flame retardants, etc. Among these, from the viewpoint of environmental issues, phosphorus-based flame retardants and metal hydrates are preferred. The phosphorus-based flame retardant may be an inorganic phosphorus-based flame retardant, but from the viewpoints of dielectric properties, adhesion to conductors, heat resistance, glass transition temperature, low thermal expansion, and flame retardancy, an organic phosphorus-based flame retardant is preferred. Examples of inorganic phosphorus-based flame retardants include red phosphorus; ammonium phosphates such as monoammonium phosphate, diammonium phosphate, triammonium phosphate, and ammonium polyphosphate; inorganic nitrogen-containing phosphorus compounds such as phosphoric acid amide; phosphoric acid; and phosphine oxide. Examples of organic phosphorus-based flame retardants include aromatic phosphate esters, mono-substituted phosphonic acid diesters, di-substituted phosphinic acid esters, metal salts of di-substituted phosphinic acids, organic nitrogen-containing phosphorus compounds, cyclic organic phosphorus compounds, phosphine oxide compounds, etc. Here, examples of metal salts of di-substituted phosphinic acids include lithium salts, sodium salts, potassium salts, calcium salts, magnesium salts, aluminum salts, titanium salts, zinc salts, etc.

[0093] Examples of organic solvents include acetone, methyl ethyl ketone, toluene, xylene, cyclohexanone, 4-methyl-2-pentanone, ethyl acetate, ethylene glycol monoethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, tripropylene glycol monomethyl ether, N,N-dimethylformamide, and N,N-dimethylacetamide.

[0094] Examples of other additives include ultraviolet absorbers such as benzotriazoles; antioxidants such as hindered phenol antioxidants and styrenated phenol antioxidants; photopolymerization initiators such as benzophenones, benzil ketals and thioxanthone; fluorescent brightening agents such as stilbene derivatives, adhesion improvers such as urea compounds and silane coupling agents; and crosslinking agents such as cyanamide crosslinking agents.

[0095] The content of other components is not particularly limited, and they may be used as needed within a range that does not impair the effects of this embodiment.

[0096] <Method of manufacturing resin composition> The resin composition of the present embodiment can be produced by mixing the above components. When mixing the components, the components may be dissolved or dispersed while being stirred. The mixing order of the raw materials, the mixing temperature, the mixing time, and other conditions are not particularly limited and may be set arbitrarily depending on the types of raw materials, etc.

[0097] <Relative dielectric constant (Dk) of the cured product> The relative dielectric constant (Dk) at 20 GHz of the cured product of the resin composition of this embodiment is not particularly limited, but is preferably 2-50, more preferably 4-40, and even more preferably 6-35. When the dielectric constant (Dk) at 20 GHz of the cured product is equal to or greater than the lower limit, the antenna module tends to be more easily miniaturized. On the other hand, when the dielectric constant (Dk) at 20 GHz of the cured product is equal to or less than the upper limit, the antenna module tends to be more easily balanced with other physical properties. The relative dielectric constant (Dk) at 20 GHz of the cured product of the resin composition of this embodiment can be measured by the method described in the Examples.

[0098] <Thermal expansion coefficient of the cured product> The coefficient of thermal expansion of the cured product of the resin composition of the present embodiment is not particularly limited, but from the viewpoint of making it easier to suppress the occurrence of warping, it is preferably 35 ppm / °C or less, more preferably 30 ppm / °C or less, and even more preferably 25 ppm / °C or less. There is no particular restriction on the lower limit of the coefficient of thermal expansion of the cured product of the resin composition of the present embodiment, but from the viewpoint of maintaining a good balance with other physical properties, it may be 5 ppm / °C or more, 10 ppm / °C or more, or 15 ppm / °C or more. The coefficient of thermal expansion of the cured product of the resin composition of this embodiment can be measured by the method described in the examples.

[0099] <Applications of resin composition> The resin composition of this embodiment is a resin composition that has low thermal expansion while suppressing changes in the relative dielectric constant (Dk) of the cured product, and is therefore suitable as a resin composition for antenna modules.

[0100] [Prepreg] The prepreg of this embodiment is a prepreg containing the resin composition of this embodiment. The prepreg of this embodiment is suitable as a prepreg for an antenna module. The prepreg of this embodiment is preferably obtained by impregnating or coating a sheet-like fiber substrate with the resin composition of this embodiment and then B-staging the composition. In this specification, B-staging refers to bringing the composition into a B-stage state as defined in JIS K 6900:1994, and is also called semi-curing.

[0101] As the sheet-like fiber base material contained in the prepreg of this embodiment, for example, a known sheet-like fiber base material used in various laminates for electrical insulating materials can be used. Examples of materials for the sheet-like fiber substrate include inorganic fibers such as E-glass, D-glass, S-glass, and Q-glass; organic fibers such as polyimide, polyester, and tetrafluoroethylene; and mixtures thereof. These sheet-like fiber substrates have shapes such as woven fabric, nonwoven fabric, roving, chopped strand mat, and surfacing mat. The thickness of the sheet-like fiber base material is not particularly limited, but from the viewpoint of mechanical strength and thinning of the prepreg, it is preferably 0.01 to 0.5 mm, more preferably 0.02 to 0.3 mm, and even more preferably 0.03 to 0.1 mm. The sheet-like fiber substrate may be surface-treated with a coupling agent or the like, or may be mechanically opened, from the viewpoints of impregnation with the resin composition, heat resistance, moisture absorption resistance, and processability when made into a laminate.

[0102] The prepreg of this embodiment can be produced, for example, by impregnating or applying the resin composition of this embodiment to a sheet-like fiber substrate, and then drying it as necessary. As a method for impregnating or applying the resin composition of this embodiment to a sheet-like fiber substrate, for example, a hot melt method, a solvent method, or the like can be used.

[0103] The hot melt method is a method in which a resin composition containing no organic solvent is impregnated into or coated on a sheet-like fiber substrate. One aspect of the hot melt method is to first coat the resin composition of this embodiment, which does not contain an organic solvent, onto coated paper with good peelability, and then laminate the coated resin composition onto a sheet-like fiber substrate. Another embodiment of the hot melt method is a method in which the resin composition of the present embodiment, which does not contain an organic solvent, is directly applied to a sheet-like fiber substrate using a die coater or the like.

[0104] The solvent method is a method of impregnating or coating a sheet-like fiber substrate with a resin composition containing an organic solvent. Specifically, for example, a method of immersing a sheet-like fiber substrate in the resin composition of this embodiment containing an organic solvent and then drying it can be mentioned. By drying, the organic solvent in the resin composition can be removed and the resin composition can be brought into a B-stage. The drying temperature is not particularly limited, but from the viewpoints of productivity and appropriately bringing the resin composition of this embodiment into a B-stage, it is preferably 50 to 200°C, more preferably 100 to 190°C, and even more preferably 150 to 180°C. The drying time is not particularly limited, but from the viewpoint of productivity and appropriately bringing the resin composition of this embodiment into a B-stage, it is preferably 1 to 30 minutes, more preferably 2 to 15 minutes, and even more preferably 3 to 10 minutes.

[0105] The solid content concentration derived from the resin composition in the prepreg of this embodiment is not particularly limited, but from the viewpoint of easily obtaining better moldability when made into a laminate, it is preferably 20 to 90 mass%, more preferably 25 to 80 mass%, and even more preferably 30 to 75 mass%.

[0106] The thickness of the prepreg of this embodiment is not particularly limited, but from the viewpoint of enabling moldability and high-density wiring, it is preferably 0.01 to 0.5 mm, more preferably 0.02 to 0.3 mm, and even more preferably 0.03 to 0.1 mm.

[0107] [Resin film] The resin film of the present embodiment is a resin film containing the resin composition of the present embodiment. The resin film of this embodiment is suitable as a resin film for an antenna module. The resin film of this embodiment can be produced, for example, by applying the resin composition of this embodiment containing an organic solvent, that is, a resin varnish, to a support and then drying it by heating.

[0108] Examples of the support include a plastic film, a metal foil, and a release paper. Examples of plastic films include polyolefin films such as polyethylene, polypropylene, and polyvinyl chloride; polyester films such as polyethylene terephthalate (hereinafter sometimes referred to as "PET") and polyethylene naphthalate; polycarbonate films; and polyimide films. Among these, polyethylene terephthalate films are preferred from the viewpoints of economy and ease of handling. Examples of metal foils include copper foil and aluminum foil. When copper foil is used as the support, the copper foil itself can be used as a conductor layer to form a circuit. In this case, rolled copper foil, electrolytic copper foil, etc. can be used as the copper foil. When a thin copper foil is used, a copper foil with a carrier may be used from the viewpoint of improving workability. The support may be subjected to a surface treatment such as a matte treatment or a corona treatment, or may be subjected to a release treatment using a silicone resin-based release agent, an alkyd resin-based release agent, a fluororesin-based release agent, or the like. The thickness of the support is not particularly limited, but from the viewpoints of ease of handling and economy, it is preferably 10 to 150 μm, more preferably 20 to 100 μm, and even more preferably 25 to 50 μm.

[0109] The coating device for applying the resin varnish may be any coating device known to those skilled in the art, such as a comma coater, bar coater, kiss coater, roll coater, gravure coater, die coater, etc. These coating devices may be appropriately selected depending on the film thickness to be formed. The drying conditions after applying the resin varnish may be appropriately determined depending on the content, boiling point, etc. of the organic solvent, and are not particularly limited. For example, in the case of a resin varnish containing 40 to 60 mass % of an aromatic hydrocarbon solvent, the drying temperature is not particularly limited, but from the viewpoints of productivity and appropriately bringing the resin composition of the present embodiment into a B-stage, it is preferably 50 to 200°C, more preferably 100 to 190°C, and even more preferably 150 to 180°C. Furthermore, in the case of the above-mentioned resin varnish, the drying time is not particularly limited, but from the viewpoints of productivity and appropriately bringing the resin composition of this embodiment into a B-stage, it is preferably 1 to 30 minutes, more preferably 2 to 15 minutes, and even more preferably 3 to 10 minutes.

[0110] The thickness of the resin film of this embodiment can be determined appropriately depending on the application of the resin film, but from the viewpoint of formability and enabling high-density wiring, it is preferably 5 to 150 μm, more preferably 10 to 100 μm, and even more preferably 15 to 60 μm.

[0111] The resin film of this embodiment may have a protective film. The protective film is provided on the surface of the resin film of this embodiment opposite to the surface on which the support is provided, and is used for the purpose of preventing adhesion of foreign matter and scratches to the resin film. The protective film is peeled off before the resin film of this embodiment is laminated, heat pressed, or the like onto a circuit board or the like.

[0112] The resin film of this embodiment is preferably used to form an insulating layer when producing a multilayer printed wiring board. For example, when a multilayer printed wiring board is produced, the resin film of this embodiment is a layer that melts and flows when laminated onto a circuit board, thereby serving to embed the circuit board. Furthermore, when a circuit board has through holes, via holes, etc., the resin film of this embodiment flows into the holes and fills them.

[0113] [Laminate] The laminate of this embodiment is a laminate containing the prepreg of this embodiment and a metal foil. Note that a laminate having a metal foil is sometimes called a metal-clad laminate. The laminate of this embodiment is suitable as a laminate for an antenna module.

[0114] The metal of the metal foil is not particularly limited, and examples thereof include copper, gold, silver, nickel, platinum, molybdenum, ruthenium, aluminum, tungsten, iron, titanium, chromium, and alloys containing one or more of these metal elements. Examples of alloys include copper-based alloys, aluminum-based alloys, and iron-based alloys. Examples of copper-based alloys include copper-nickel alloys. Examples of iron-based alloys include iron-nickel alloys. Among these, from the viewpoints of conductivity and availability, copper, nickel, aluminum, and iron-nickel alloys are preferred, copper and aluminum are more preferred, and copper is even more preferred. The thickness of the metal foil is not particularly limited, but is preferably 1 to 200 μm, more preferably 2 to 100 μm, and even more preferably 3 to 50 μm.

[0115] The laminate of this embodiment can be produced, for example, by placing metal foil on one or both sides of the prepreg of this embodiment and then molding it under heat and pressure. Usually, the prepreg in a semi-cured state is cured by this heat and pressure molding to obtain the laminate of this embodiment. In the heat and pressure molding, only one prepreg may be used, or two or more prepregs may be laminated together. In addition to the prepreg and metal foil, a substrate with inner layer circuitry may also be included in the heat and pressure molding. For the hot pressure molding, for example, a multi-stage press, a multi-stage vacuum press, a continuous molding machine, an autoclave molding machine, or the like can be used. The heating temperature for hot pressing is not particularly limited, but is preferably 100 to 300°C, more preferably 150 to 280°C, and even more preferably 200 to 250°C. The heating and pressing time for the hot and pressure molding is not particularly limited, but is preferably 10 to 300 minutes, more preferably 30 to 200 minutes, and even more preferably 80 to 150 minutes. The pressure for the hot pressing is not particularly limited, but is preferably 1.5 to 5 MPa, more preferably 1.7 to 3 MPa, and even more preferably 1.8 to 2.5 MPa. However, these conditions can be adjusted appropriately depending on the type of raw material used, and are not particularly limited.

[0116] [Multilayer printed wiring board] The multilayer printed wiring board of the present embodiment comprises one or more members selected from the group consisting of the prepreg of the present embodiment, the resin film of the present embodiment, and the laminate of the present embodiment. That is, the multilayer printed wiring board of this embodiment includes at least a multilayer structure containing a cured product of the prepreg of this embodiment, a cured product of the resin film of this embodiment, or a laminate of this embodiment, and a conductor circuit layer. The multilayer printed wiring board of this embodiment is suitable as a multilayer printed wiring board for an antenna module. A method for producing a multilayer printed wiring board of this embodiment using the resin film of this embodiment will be described below.

[0117] When a multilayer printed wiring board is manufactured using the resin film of this embodiment, the resin film of this embodiment is first laminated onto one or both sides of a circuit board. After the resin film of this embodiment is placed so as to be in contact with the circuit board, the resin film of this embodiment can be laminated onto the circuit board by, for example, pressing the circuit board while applying pressure and heat using a vacuum laminator. Examples of circuit boards used in multilayer printed wiring boards include glass epoxy, metal, polyester, polyimide, BT resin, and thermosetting polyphenylene ether substrates, each having a patterned conductor layer (circuit) formed on one or both sides thereof. From the viewpoint of adhesiveness, the surface of the conductor layer of the circuit board may be previously roughened by blackening or the like.

[0118] Next, after peeling off the support of the resin film as necessary, the resin film is cured by heating to form an insulating layer. The heating temperature during heat curing is not particularly limited, but is preferably 100 to 300°C, more preferably 120 to 280°C, and even more preferably 150 to 250°C. The heating time for heat curing is not particularly limited, but is preferably 2 to 300 minutes, more preferably 5 to 200 minutes, and even more preferably 10 to 150 minutes.

[0119] After forming the insulating layer by the above method, drilling may be carried out as needed. Drilling is a process in which holes are drilled in the circuit board and the formed insulating layer by, for example, a drill, a laser, plasma, or a combination of these methods to form via holes, through holes, etc. Examples of lasers used for drilling include carbon dioxide lasers, YAG lasers, UV lasers, and excimer lasers.

[0120] Next, the surface of the insulating layer may be roughened with an oxidizing agent. Furthermore, if via holes, through holes, etc. are formed in the insulating layer and the circuit board, the so-called "smear" that occurs when these holes are formed may be removed with an oxidizing agent. The roughening treatment and smear removal can be performed simultaneously. The roughening treatment can form uneven anchors on the surface of the insulating layer. Examples of the oxidizing agent include permanganates such as potassium permanganate and sodium permanganate, dichromates, ozone, hydrogen peroxide, sulfuric acid, nitric acid, etc. Among these, preferred are aqueous solutions of sodium hydroxide of potassium permanganate and aqueous solutions of sodium hydroxide of sodium permanganate, which are oxidizing agents commonly used in the manufacture of multilayer printed wiring boards by the build-up method.

[0121] Next, a conductor layer is formed on the roughened surface of the insulating layer. The conductor layer can be formed by, for example, plating. Examples of plating methods include electroless plating and electrolytic plating. Examples of metals for plating include copper, gold, silver, nickel, platinum, molybdenum, ruthenium, aluminum, tungsten, iron, titanium, chromium, and alloys containing at least one of these metal elements. Among these, copper and nickel are preferred, and copper is more preferred. Alternatively, a plating resist having a reverse pattern to the wiring pattern may be formed first, and then the wiring pattern may be formed only by electroless plating. Furthermore, after the conductor layer is formed, an annealing treatment may be carried out, which tends to further improve and stabilize the adhesive strength between the interlayer insulating layer and the conductor layer.

[0122] Methods that can be used to pattern the conductor layer and form a circuit include known methods such as a subtractive method, a full-additive method, a semi-additive method (SAP: Semi-Additive Process), and a modified semi-additive method (m-SAP: modified Semi-Additive Process).

[0123] [Antenna device] The antenna device of this embodiment is an antenna device including the multilayer printed wiring board of this embodiment. The antenna device of this embodiment can be manufactured by, for example, mounting an antenna element on the multilayer printed wiring board of this embodiment. There is no particular limitation on the method of installing the antenna elements, but for example, it is preferable to arrange them in a two-dimensional array. There is no particular limitation on the configuration of the antenna device, but for example, reference can be made to Japanese Patent No. 6777273.

[0124] [Antenna module] The antenna module of this embodiment includes the antenna device of this embodiment and a power supply circuit. The antenna module of this embodiment can be manufactured by a method including, for example, installing a feed circuit and the antenna device of this embodiment. The power supply circuit is not particularly limited, but may be an RFIC (Radio Frequency Integrated Circuit), etc. The RFIC includes a switch, a power amplifier, a low-noise amplifier, an attenuator, a phase shifter, a signal combiner / demultiplexer, a mixer, an amplifier circuit, etc. A high frequency signal supplied from the RFIC is transmitted to the feeding point of the feeding conductor via a short-circuiting conductor formed in a via of the antenna module laminate. The configuration of the antenna module is not particularly limited, but reference can be made to, for example, Japanese Patent No. 6777273. [Example]

[0125] The present embodiment will be specifically described below with reference to examples, although the present embodiment is not limited to the following examples.

[0126] (Method for measuring weight average molecular weight (Mw)) The weight-average molecular weight (Mw) was calculated by gel permeation chromatography (GPC) using a calibration curve prepared using standard polystyrene. The calibration curve was approximated by a cubic equation using standard polystyrene: TSKstandard POLYSTYRENE (Types: A-2500, A-5000, F-1, F-2, F-4, F-10, F-20, F-40) [manufactured by Tosoh Corporation, trade name]. The GPC measurement conditions are shown below. [GPC measurement conditions] Equipment: High-speed GPC equipment HLC-8320GPC Detector: UV-8320 ultraviolet absorption detector [manufactured by Tosoh Corporation] Column: Guard column: TSK Guardcolumn SuperHZ-L + Column: TSKgel SuperHZM-N + TSKgel SuperHZM-M + TSKgel SuperH-RC (all manufactured by Tosoh Corporation, product names) Column dimensions: 4.6 x 20 mm (guard column), 4.6 x 150 mm (column), 6.0 x 150 mm (reference column) Eluent: tetrahydrofuran Sample concentration: 10mg / 5mL Injection volume: 25μL Flow rate: 1.00mL / min Measurement temperature: 40℃

[0127] (Average particle diameter of inorganic filler (D 50 ) Measurement method) Average particle diameter of inorganic filler (D 50 ) 0.1 g of the inorganic filler to be measured was diluted with 20 g of solvent (type: methyl ethyl ketone), and then dispersed by vibrating it for 5 to 20 minutes with a 100 W ultrasonic homogenizer to prepare the measurement sample. One to two drops of the measurement sample were poured into the measurement cell, and the particle size distribution was measured at 25°C and a refractive index of 1.38 in accordance with the international standard ISO 13321 using a particle size distribution analyzer (Microtrac MT3000, manufactured by Microtrac Bell Corporation). The particle size corresponding to 50% of the cumulative value (volume basis) in the obtained particle size distribution was defined as the average particle size (D 50) was decided.

[0128] (Method for measuring the relative dielectric constant (Dk) of inorganic fillers at 10 GHz) The relative dielectric constant (Dk) of the inorganic filler at 10 GHz was measured by the following procedure. The inorganic filler and polyphenylene ether resin to be measured were blended in a ratio of 20% by volume of inorganic filler to 80% by volume of polyphenylene ether resin, and the resulting mixture was press-molded at 230°C for 30 minutes under 3 MPa to form a test piece measuring 50 mm wide, 130 mm long, and 0.5 mm thick to measure the relative dielectric constant (Dk). Next, the dielectric constant (Dk) of the test piece obtained above was measured by the cavity resonator perturbation method under the conditions of a frequency of 10 GHz and 25° C. using the following device and program. Measurement equipment: Agilent Technologies Vector Network Analyzer "N5227A" Cavity resonator: "CP129" (10 GHz band resonator) manufactured by Kanto Electronics Application Development Co., Ltd. Measurement program: "CPMA-V2" manufactured by Kanto Electronics Application Development Co., Ltd. The dielectric constant (Dk) of the test piece measured above was defined as Dk1, and the dielectric constant (Dk) of the polyphenylene ether resin alone measured in advance under the above measurement conditions was defined as Dk2, and the dielectric constant (Dk) of the inorganic filler alone was calculated based on the following formula. Relative permittivity (Dk) = (Dk1 - Dk2 × 0.2) / 0.8

[0129] Production Example 1: Production of aminomaleimide compound 195 parts by mass of 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane, 34 parts by mass of 3,3'-diethyl-4,4'-diaminodiphenylmethane, and 229 parts by mass of propylene glycol monomethyl ether were added to a 5-liter reaction vessel equipped with a thermometer, a stirrer, a reflux condenser, and a moisture content monitor, and the mixture was refluxed for 2 hours. The mixture was concentrated at reflux temperature for 3 hours to produce an aminomaleimide compound solution with a solids concentration of 65% by mass. The weight-average molecular weight (Mw) of the resulting aminomaleimide compound was approximately 2,000.

[0130] [Production of resin composition] Examples 1 to 3, Comparative Examples 1 to 2 The components shown in Table 1 were blended in the amounts shown in Table 1, and then stirred and mixed at 25°C to prepare a resin composition. In Table 1, the blend amount of each component is expressed in parts by mass. The aminomaleimide compound was blended as the aminomaleimide compound solution obtained in Production Example 1, and the amounts shown in Table 1 are expressed in parts by mass calculated as solid content.

[0131] [Manufacturing resin film and resin boards with double-sided copper foil] The resin composition obtained above was applied to a 38 μm thick PET film (Teijin Limited, product name: G2-38), and then heated and dried for 5 minutes at 170° C. to produce a B-stage resin film. The resin film was peeled off from the PET film and then pulverized to obtain a B-stage resin powder. The resin powder obtained above was placed on a Teflon® sheet die-cut to a size of 0.5 mm thick x 50 mm long x 35 mm wide, and 18 μm thick low-profile copper foil (manufactured by Mitsui Mining & Smelting Co., Ltd., product name: 3EC-VLP-18) was placed on top and bottom of the sheet. The M side of the low-profile copper foil was placed on the resin powder side. Next, this pre-heat-pressure-molded laminate was subjected to heat-pressure molding at a temperature of 230°C, a pressure of 2.0 MPa, and a time of 120 minutes, forming the resin powder into a resin plate and curing it, thereby producing a resin plate with double-sided copper foil. The thickness of the resin plate portion of the resulting double-sided copper foil-molded resin plate was 0.5 mm.

[0132] [Measurement and evaluation methods] The resin compositions and resin sheets with copper foil on both sides obtained in the above examples and comparative examples were subjected to measurements and evaluations according to the following methods. The results are shown in Table 1.

[0133] (1. Measurement of gel time) 0.1 g of the resin powder in the B-stage state obtained above was placed on a hot plate at 160°C to measure the time it took for the resin to harden (gel time). The measured value was the average value of n = 2, rounded to the nearest whole number, and the measurement was performed using a gelation tester "GT-D-JIS" manufactured by Nissin Scientific Co., Ltd. From the viewpoint of moldability, the gel time is preferably 450 seconds or longer.

[0134] (2. Measurement of relative dielectric constant (Dk)) The outer copper foil of the double-sided copper foil-covered resin board obtained above was removed by immersion in a copper etching solution (a 10% by mass solution of ammonium persulfate, manufactured by Mitsubishi Gas Chemical Company, Inc.), and then cut into a length of 60 mm and a width of 0.5 mm to serve as a test piece for measuring the dielectric constant (Dk).The dielectric constant (Dk) of this test piece was measured by the cavity resonator perturbation method using the following apparatus and program under conditions of a frequency of 20 GHz and 25°C. Measurement equipment: Agilent Technologies Vector Network Analyzer "N5227A" Cavity resonator: "CP129" (10 GHz band resonator) manufactured by Kanto Electronics Application Development Co., Ltd. Measurement program: "CPMA-V2" manufactured by Kanto Electronics Application Development Co., Ltd.

[0135] (3. Measurement of thermal expansion coefficient) The outer copper foil of the double-sided copper foil-covered resin board obtained above was removed by immersion in a copper etching solution (a 10% by mass solution of ammonium persulfate, manufactured by Mitsubishi Gas Chemical Company, Inc.) to prepare 5 mm square test pieces. The thermal expansion coefficient of the test pieces was then measured using a thermomechanical analyzer (TMA) (manufactured by TA Instruments Japan, product name: Q400) in accordance with the IPC (The Institute for Interconnecting and Packaging Electronic Circuits) standard. The thermal expansion coefficient was the thermal expansion coefficient in the thickness direction of the resin board, and was the average thermal expansion coefficient over a temperature range of 30 to 120°C.

[0136] [Table 1]

[0137] The details of the components (B) and (C) shown in Table 1 are as follows. [(B) Component] Calcium titanate 1: Kyoritsu Material Co., Ltd., product name "CT-3", average particle diameter (D 50 ): 2μm, relative permittivity (Dk) (10GHz): 175 Calcium titanate 2: Sakai Chemical Industry Co., Ltd., product name "CT-03", average particle diameter (D 50 ): 0.3μm, relative permittivity (Dk) (10GHz): 175 Strontium titanate: manufactured by Sakai Chemical Industry Co., Ltd., product name "ST-03", average particle diameter (D 50 ): 0.3μm, relative permittivity (Dk) (10GHz): 220 [(C) component] Silica: Admatechs Co., Ltd., product name "SC-05", average particle size (D 50 ): 1.5μm, relative dielectric constant (Dk) (10GHz): 4

[0138] From Table 1, it can be seen that the resin compositions of Examples 1 to 3 of this embodiment are able to significantly reduce the thermal expansion coefficient without significantly changing the dielectric constant (Dk) of the cured product compared to the resin compositions of Comparative Examples 1 and 2, which do not contain component (C). [Industrial Applicability]

[0139] The resin composition of this embodiment is a resin composition that exhibits low thermal expansion while suppressing changes in the dielectric constant (Dk) of the cured product. Therefore, the resin composition of this embodiment is useful for applications such as multilayer printed wiring boards used in fifth-generation mobile communication system (5G) antennas that use radio waves in a frequency band exceeding 6 GHz and millimeter-wave radars that use radio waves in a frequency band of 30 to 300 GHz.

Claims

1. (A) a thermosetting resin; (B) a titanium-based inorganic filler; (C) an inorganic filler having a lower dielectric constant (Dk) than the titanium-based inorganic filler (B); A resin composition comprising: the thermosetting resin (A) is at least one selected from the group consisting of maleimide compounds having at least one N-substituted maleimide group and derivatives thereof, (B) A resin composition in which the relative dielectric constant (Dk) at 10 GHz of the titanium-based inorganic filler is 10 to 3,000.

2. (B) Average particle diameter of the titanium-based inorganic filler (D ５０ 2. The resin composition according to claim 1, wherein the particle size is 0.1 to 20 μm.

3. The resin composition according to claim 1 or 2, wherein the titanium-based inorganic filler (B) is a titanate.

4. 4. The resin composition according to claim 3, wherein the titanate is at least one selected from the group consisting of barium titanate, potassium titanate, calcium titanate, strontium titanate, lead titanate, and aluminum titanate.

5. The resin composition according to any one of claims 1 to 4, wherein (C) the inorganic filler having a lower dielectric constant (Dk) than the titanium-based inorganic filler (B) is at least one selected from the group consisting of silica and alumina.

6. The resin composition according to any one of claims 1 to 5, wherein the cured product has a relative dielectric constant (Dk) at 20 GHz of 2 to 50.

7. The resin composition according to any one of claims 1 to 6, which is for an antenna module.

8. A prepreg comprising the resin composition according to any one of claims 1 to 7.

9. A laminate comprising the prepreg according to claim 8 and a metal foil.

10. A resin film comprising the resin composition according to any one of claims 1 to 7.

11. A multilayer printed wiring board comprising at least one member selected from the group consisting of the prepreg according to claim 8, the laminate according to claim 9, and the resin film according to claim 10.

12. An antenna device comprising the multilayer printed wiring board according to claim 11.

13. An antenna module comprising the antenna device according to claim 12 and a feeder circuit.

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