Method for manufacturing electronic structure and electronic circuit

Abstract

To improve productivity of a composite film.SOLUTION: In an electronic structure 1, a formation substrate 10 and a support layer 11 consist of inorganic materials while a base film 12 and a cover layer 17 of a composite film 2 consist of organic materials, and an outer shape of the support layer 11 is formed smaller than an outer shape of the base film 12. Therefore, in the electronic structure 1, an adsorption force acting between a composite film rear face 2B and a support layer front face 11A can be appropriately adjusted in such a manner that they are not peeled during storage or transfer and can be easily peeled using a stamp 81 before mounting. Thus, in the electronic structure 1, the composite film rear face 2B can be easily stored or transferred while maintaining smoothness thereof, and the composite film 2 can also be easily peeled from the support layer 11 or mounted onto a wiring board 90.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an electronic structure and an electronic circuit The manufacturing method is suitable for use in manufacturing a film having a plurality of electronic elements and attaching the film to a wiring board. [Background technology]

[0002] Generally, electronic circuits are manufactured by mounting electronic elements (also called devices) with various functions on a wiring board. In recent years, a method has been developed to simplify the mounting process by configuring multiple types of different electronic elements as a single film and attaching the film to a wiring board.

[0003] For example, in a micro LED (Light Emitting Diode) display panel incorporated into a display device, one pixel is made up of light emitting elements (LEDs) of three colors, for example, red, green, and blue, and a large number of light emitting elements are arranged in a grid pattern on a circuit board. This micro LED display panel can be manufactured by, for example, configuring the red, green, and blue light emitting elements corresponding to one pixel as a single thin-film composite film and attaching the composite film in a grid pattern on a wiring board.

[0004] A method for manufacturing such a composite film has been proposed in which a sacrificial layer is formed on a substrate, a composite film including electronic elements is formed on this sacrificial layer, and then part of the sacrificial layer is removed (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Publication No. 2017-108160 (Figures 1 to 9, etc.) Summary of the Invention [Problem to be solved by the invention]

[0006] However, in this method, protruding anchors are formed on the underside of the composite film to keep the composite film on the substrate during etching, which necessitates a process to flatten the mounting surface of the composite film after peeling it from the substrate, resulting in poor productivity.

[0007] The present invention has been made in consideration of the above points, and provides an electronic structure and an electronic device that can increase the productivity of composite films. circuit The present invention proposes a manufacturing method for the above. [Means for solving the problem]

[0008] In order to solve the above problem, the electronic structure of the present invention includes a substrate having a first surface, a functional unit having a functional part with an electronic function and a protective member for protecting the functional part, the functional unit having a second surface formed on the first surface side, and a support layer provided at a position in contact with the first surface and having a third surface in contact with the second surface of the functional unit, the area of ​​the third surface being smaller than the area of ​​the second surface, At least a portion of the protective member that forms the second surface is primarily composed of an organic material, at least a portion of the support layer that forms the third surface is primarily composed of an inorganic material, and at least a portion of the substrate that forms the first surface is primarily composed of an inorganic material. I did so. In addition, the electronic structure of the present invention comprises a substrate having a first surface, a functional element having an electronic function, and a protective member that protects the functional element, a functional unit having a second surface formed on the first surface side, a support layer that is arranged in contact with the first surface and has a third surface that contacts the second surface of the functional unit, the area of ​​the third surface being smaller than the area of ​​the second surface, and a base film that is part of the protective member and forms part of the second surface, wherein either the portion of the protective member of the functional unit that forms the second surface or the portion of the support layer that forms the third surface is primarily composed of an organic material, and the other is primarily composed of an inorganic material, and the functional element is arranged on the surface of the base film opposite the second surface.

[0009] moreover The electron circuit In the manufacturing method of a support layer having a third surface; a substrate having a first surface The relevant On the first surface to Formation 1 a step of forming a functional unit on the support layer, the functional unit having a functional part having an electronic function and a protective member for protecting the functional part, the second surface being formed on the third surface side. 2 a step of removing a part of the support layer and making the area of ​​the third surface in contact with the functional unit in the remaining part of the support layer smaller than the area of ​​the second surface; 3 Steps and a fourth step of applying a force to the functional unit in a direction away from the substrate to peel the second surface of the functional unit from the third surface of the support layer;One of the portion of the protective member of the functional unit that forms at least the second surface and the portion of the support layer that forms at least the third surface is made of an organic material as a main component, and the other is made of an inorganic material as a main component. Furthermore, in the method for manufacturing an electronic circuit of the present invention, in an electronic structure having a support layer and a functional unit formed on a substrate having a first surface, a step of applying a force to the functional unit in a direction away from the substrate to peel the functional unit from the support layer, wherein the functional unit has a functional part having an electronic function and a protective member that protects the functional part, a second surface is formed on the first surface side, the support layer is positioned in contact with the first surface and has a third surface that contacts the second surface of the functional unit, the area of ​​the third surface is smaller than the area of ​​the second surface, and either the portion of the protective member of the functional unit that forms at least the second surface or the portion of the support layer that forms at least the third surface is primarily composed of an organic material, and the other is primarily composed of an inorganic material.

[0010] The present invention provides a functional unit The second surface is made mainly of organic materials. and supporters The third surface is made up mainly of inorganic materials. The properties of the constituent materials are different at the contact points with each other, and Applicable The third side Applicable Since the area of ​​the first surface is smaller than that of the second surface, the adhesive force acting between them can be kept relatively small. As a result, the present invention can prevent the functional unit from being inadvertently separated from the support layer during transportation or storage of the electronic component, and can easily peel the functional unit from the support layer when mounting the functional unit on a circuit board or the like. [Effects of the Invention]

[0011] According to the present invention, an electronic structure and an electronic device capable of increasing the productivity of a composite film are provided. circuit This manufacturing method can be realized. [Brief explanation of the drawings]

[0012] [Figure 1] 1A and 1B are a schematic plan view and a schematic cross-sectional view showing a configuration of an electronic structure according to a first embodiment. [Figure 2] 10 is a flowchart showing a manufacturing peel-and-mount processing procedure according to the first embodiment. [Figure 3] 1 is a schematic cross section showing the manufacture of an electronic component according to a first embodiment. [Figure 4] 3A to 3C are schematic cross-sectional views illustrating the manufacture of an electronic assembly according to the first embodiment, and the peeling and mounting of a composite film. [Figure 5] 5A and 5B are a schematic plan view and a schematic cross-sectional view showing the configuration of an electronic structure according to a second embodiment. [Figure 6] 10 is a flowchart showing a manufacturing peel-and-mount processing procedure according to the second embodiment. [Figure 7] 6 is a schematic cross section showing the manufacture of an electronic component according to a second embodiment. [Figure 8] 6 is a schematic cross section showing the manufacture of an electronic assembly according to a second embodiment, and the peeling and mounting of a composite film. [Figure 9] 10A and 10B are a schematic plan view and a schematic cross-sectional view showing the configuration of an electronic structure according to a third embodiment. [Figure 10] 10 is a schematic cross section showing the mounting of a composite film according to a third embodiment. [Figure 11] FIG. 10 is a schematic cross-sectional view showing the configuration of an electronic structure according to another embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, modes for carrying out the invention (hereinafter referred to as embodiments) will be described with reference to the drawings.

[0014] 1. First Embodiment [1-1. Configuration of electronic structure and composite film] Fig. 1(A) is a schematic plan view showing the configuration of an electronic structure 1 and a composite film 2 according to a first embodiment. Fig. 1(B) is a schematic cross-sectional view showing the A1-A2 cross section of Fig. 1(A). The electronic structure 1 has a support layer 11 provided on a formation substrate 10, and a composite film 2 attached to the upper side of the support layer 11.

[0015] 1A, the direction from left to right is referred to as the X direction, the direction from top to bottom is referred to as the Y direction, and the direction from the back to the front of the page is referred to as the Z direction. Furthermore, for convenience, the Z direction side and the opposite side of each part are also referred to as the front side and back side, respectively.

[0016] The composite film 2 has, for example, sides each measuring approximately 30 to 50 μm in the X and Y directions, and a side measuring approximately 1 to 15 μm in the Z direction. The composite film 2 has light-emitting elements of three colors, red (R), green (G), and blue (B), arranged in sequence along the X direction, each connected to a wiring member and a connection terminal, and assembled into a single film-like package. Specifically, the composite film 2 is composed of a base film 12, light-emitting elements 13 (13R, 13G, and 13B), connection pads 14, an insulating film 15, wiring portions 16, and a cover layer 17.

[0017] For convenience of explanation, hereinafter, the composite film 2 will also be referred to as a functional unit, the light-emitting element 13 as a functional element, and the connection pad 14 as a conductive member. Furthermore, since the light-emitting element 13, the wiring portion 16, and the connection pad 14 have an electronic function of "emitting light in response to the supply of current," they will also be collectively referred to as a functional portion. Furthermore, in the composite film 2, the portions related to the light-emitting elements 13 of each color are configured in the same manner. Therefore, hereinafter, the portions related to the red light-emitting element 13R will be mainly described, and some descriptions of the green light-emitting element 13G and the blue light-emitting element 13B will be omitted.

[0018] As shown in FIG. 1(B), the composite film 2 is overlaid on the Z-direction side (i.e., the front side) of the formation substrate 10 and the support layer 11, and as a whole constitutes the electronic structure 1. The formation substrate 10 is a plate-shaped member made of an inorganic material and has sufficient strength. Specifically, the formation substrate 10 can be a plate-shaped member made of various inorganic materials, such as a silicon (Si) substrate, a glass substrate, or a sapphire substrate. The formation substrate surface 10A, which is the surface of the formation substrate 10, is formed to be extremely flat, with a surface roughness of 10 nm or less. Hereinafter, the formation substrate surface 10A will also be referred to as the first surface.

[0019] The support layer 11 is formed as a thin film from an inorganic material such as silicon oxide (SiO2) or silicon nitride (SiN). The surface of the support layer 11, that is, the support layer surface 11A, is formed to be extremely flat, similar to the surface of the formation substrate 10, and its surface roughness is 10 nm or less.

[0020] The composite film 2 has its rear surface, the composite film rear surface 2B, in contact with the support layer surface 11A over a relatively wide area. Because the composite film rear surface 2B is formed in contact with the support layer surface 11A, it is extremely smooth, just like the support layer surface 11A, with a surface roughness of 10 nm or less. Hereinafter, the composite film rear surface 2B will also be referred to as the second surface, and the support layer surface 11A will also be referred to as the third surface.

[0021] Furthermore, both the formation substrate 10 and the support layer 11 are used in the manufacturing stage of the composite film 2, and the composite film 2 is completed by peeling the composite film 2 from the support layer 11. The completed composite film 2 is mounted on a wiring board, which will be described later.

[0022] That is, the electronic structure 1 is almost completed, with the composite film 2 attached to the support layer 11 and the formation substrate 10. By configuring the electronic structure 1 in this manner, the rear surface 2B of the composite film is protected, and the composite film 2 can be easily handled as a single unit with the formation substrate 10 during transportation, storage, and the like.

[0023] The base film 12 is made of an organic material such as polyimide resin, acrylic resin, or epoxy resin, and has insulating properties. The base film 12 is formed into a flat rectangular parallelepiped or thin plate shape overall, with the length of the side along the Z direction being significantly shorter than the sides along the X direction and the Y direction. Hereinafter, the back surface of the base film 12 will be referred to as the base film back surface 12B. The base film back surface 12B is formed extremely flat, with a surface roughness of 10 nm or less.

[0024] The base film 12 is larger than the support layer 11 in the X and Y directions and protrudes from the support layer 11 in the X and -X directions, and the Y and -Y directions. In other words, the support layer 11 is formed slightly smaller than the base film 12 in the X and Y directions. Specifically, on the XY plane, the outer shape of the support layer 11 is located approximately 5 μm inward from the outer shape of the base film 12. Accordingly, a support gap SG is formed in the electronic structure 1 at a location that is outside the support layer 11 and inside the base film 12 in the XY plane, and that is between the formation substrate 10 and the base film 12 in the Z direction.

[0025] Furthermore, square connection holes 12H penetrating in the Z direction are drilled at three positions spaced apart along the X direction in the base film 12 closer to the overall Y direction (towards the bottom in FIG. 1(A)). Also, square connection holes 12H penetrating in the Z direction are drilled at three positions spaced apart along the X direction in the base film 12 closer to the overall -Y direction (towards the top in FIG. 1(A)).

[0026] The red light-emitting element 13R is an electronic element made of, for example, a gallium arsenide (GaAs)-based material, and is a functional element that constitutes a red light-emitting diode. This red light-emitting element 13R is provided on the -X direction side of the surface of the base film 12, near the center in the Y direction. Incidentally, the Z direction surface of the light-emitting element 13R has an anode terminal on the -Y direction side and a cathode terminal on the Y direction side.

[0027] The green light-emitting element 13G is an electronic element made of, for example, a gallium nitride (GaN)-based material, and is a functional element that constitutes a green light-emitting diode. The light-emitting element 13G is configured in the same shape as the light-emitting element 13R, and is located on the surface of the base film 12 at a position slightly away from the light-emitting element 13R in the X direction.

[0028] Blue light-emitting element 13B is an electronic element made of, for example, a gallium nitride (GaN)-based material, and is a functional element that constitutes a blue light-emitting diode. Light-emitting element 13B is configured in the same shape as light-emitting element 13R, and is located on the surface of base film 12, slightly away from light-emitting element 13G in the X direction. In this way, composite film 2 is provided with two or more different types of functional elements.

[0029] Each connection pad 14 is a thin film, i.e., a metal film, made of a conductive metal material such as gold (Au) or platinum (Pt). The connection pad 14 fills the inside of the connection hole 12H in the base film 12 and is provided so as to extend onto the surface side of the base film 12 near its periphery. That is, one connection pad 14 is disposed on each of the Y-direction side and the -Y-direction side of the light-emitting element 13R. The connection pad back surface 14B, which is the surface on the -Z-direction side of the connection pad 14, is formed extremely flat, similar to the base film back surface 12B, and its surface roughness is 10 nm or less. Hereinafter, the connection pad back surface 14B will also be referred to as the fourth surface.

[0030] In the composite film 2, the base film back surface 12B and the connection pad back surface 14B form a nearly continuous plane, which is the composite film back surface 2B. In the composite film back surface 2B, the distance in the Z direction between the base film back surface 12B and the connection pad back surface 14B, i.e., the "height of the step," is extremely small. Specifically, the height of the step in the composite film back surface 2B is 1 / 1000 or less of the shortest side in the XY plane of the outer shape of the composite film 2, i.e., the shorter of the length of the side along the X direction or the length of the side along the Y direction.

[0031] The insulating film 15 is made of an insulating material such as silicon oxide (SiO2), etc. Two insulating films 15 are provided for the light emitting element 13R, specifically, one on the Y direction side and one on the −Y direction side of the light emitting element 13R, and they mainly cover the side surfaces and vicinities thereof on the −Y direction side and Y direction side of the light emitting element 13R, respectively.

[0032] The wiring portion 16 is made of a conductive metal material such as gold (Au), aluminum (Al), copper (Cu), titanium (Ti), platinum (Pt), etc. The wiring portion 16 is provided on each of the −Y direction side and the Y direction side of the light emitting element 13R, and electrically connects the light emitting element 13R to each connection pad 14.

[0033] Like the base film 12, the cover layer 17 is made of an organic material such as polyimide resin, and is provided so as to cover the upper portions of the base film 12, the light-emitting element 13, the connection pads 14, the insulating film 15, and the wiring portion 16. The surface of the cover layer 17, i.e., the surface of the composite film 2 (hereinafter also referred to as the composite film surface 2A), is formed to be approximately flat. Hereinafter, the base film 12 and the cover layer 17 will also be referred to as protective members.

[0034] Thus, the composite film 2 has three color light-emitting elements 13 arranged side by side on the surface side of the base film 12, and the back surfaces 14B of the connection pads 14 electrically connected to each of them form substantially the same plane as the back surface 12B of the base film.

[0035] In the electronic structure 1, the base film 12 and the cover layer 17 are both made of organic materials. Therefore, the base film 12 and the cover layer 17 form relatively strong bonds, such as covalent bonds and hydrogen bonds, at the molecular level. In the electronic structure 1, the formation substrate 10 and the support layer 11 are both made of inorganic materials. Therefore, the formation substrate 10 and the support layer 11 form relatively strong bonds, such as covalent bonds and hydrogen bonds, at the molecular level.

[0036] On the other hand, in the electronic structure 1, the support layer 11 is made of an inorganic material, while the base film 12 is made of an organic material. Therefore, the support layer 11 and the base film 12 form a relatively weak bond at the molecular level, such as van der Waals forces. Also, in the electronic structure 1, the outer shape of the support layer 11 is formed slightly smaller than the outer shape of the base film 12 on the XY plane. Therefore, the contact area between the support layer 11 and the base film 12 is slightly smaller than the total area of ​​the base film 12.

[0037] That is, in the electronic structure 1, of the forces acting between the stacked layers, the force acting between the support layer 11 and the base film 12 is the smallest. For this reason, in the electronic structure 1, if a sufficiently large force in the Z direction is applied to the cover layer 17 while the formation substrate 10 is fixed, the support layer 11 and the base film 12 will separate, and the composite film 2 will peel off from the formation substrate 10, etc. and the support layer 11.

[0038] [1-2. Manufacturing of electronic structures and peeling and mounting of composite films] Next, the manufacture of the electronic structure 1 and the peeling and mounting of the composite film 2 will be described with reference to Figures 2, 3, and 4. Figure 2 is a flowchart showing the manufacturing, peeling, and mounting process steps involved in the manufacture of the electronic structure 1 and the peeling and mounting of the composite film 2. Figures 3 and 4 are schematic cross-sectional views showing the steps of the electronic structure 1 and the composite film 2. Here, the Z direction side will also be referred to as "upper," and the -Z direction side will also be referred to as "lower."

[0039] The electronic component 1 is manufactured by stacking layers stepwise on a formation substrate 10 using a predetermined manufacturing, peeling, and mounting apparatus 80 in accordance with various processes similar to those used in manufacturing a general semiconductor. The composite film 2, which is a part of the electronic component 1, is subsequently peeled from the support layer 11 by the manufacturing, peeling, and mounting apparatus 80, and then mounted on a wiring substrate 90 (described later) in accordance with various processes similar to those used in manufacturing and mounting a general semiconductor.

[0040] Specifically, when the manufacturing, peel-and-mounting apparatus 80 starts the manufacturing, peel-and-mounting processing procedure RT1 (FIG. 2), it proceeds to the first step SP1, where it forms a support layer 11 on the formation substrate surface 10A of the formation substrate 10, as shown in FIG. 3(A), and then proceeds to the next step SP2. Specifically, the manufacturing, peel-and-mounting apparatus 80 forms a thin-film support layer 11 made of an inorganic material, for example, by using CVD (Chemical Vapor Deposition, not shown). At this time, the support layer surface 11A is formed to be extremely flat, just like the formation substrate surface 10A.

[0041] 3(B), the manufacturing peel-and-mounting apparatus 80 forms the base film 12, and then proceeds to the next step SP3. Specifically, the manufacturing peel-and-mounting apparatus 80 performs a well-known patterning process, such as lithography, to form the thin-film base film 12 made of an organic material on the support layer surface 11A, and also form the connection holes 12H. At this time, the base film back surface 12B of the base film 12 is formed in contact (close contact) with the support layer surface 11A, and is therefore formed extremely flat, just like the support layer surface 11A.

[0042] In step SP3, the manufacturing, peeling, and mounting apparatus 80 provides the light-emitting element 13 on the base film 12, as shown in FIG. 3(C), and then proceeds to the next step SP4. The light-emitting element 13 is separately manufactured by a predetermined LED manufacturing device (not shown) or the like. The manufacturing, peeling, and mounting apparatus 80 transfers the light-emitting element 13 to a predetermined location on the base film 12 by using a well-known transfer technique.

[0043] 3(D), the manufacturing peel-and-mounting apparatus 80 forms connection pads 14 in the vicinity of each connection hole 12H in the base film 12, and then proceeds to the next step SP5. Specifically, the manufacturing peel-and-mounting apparatus 80 deposits a thin film of a metal material such as gold (Au) or platinum (Pt) by, for example, lithography and vapor deposition in an area surrounding each connection hole 12H in the base film 12, to form the connection pads 14. At this time, the connection pad back surface 14B of the connection pad 14 is formed in contact (adheres tightly) with the support layer surface 11A, similar to the base film back surface 12B of the base film 12, and therefore is extremely smooth.

[0044] In step SP5, the manufacturing peel-and-mount apparatus 80 forms an insulating film 15 from an insulating material so as to overlap a portion of the light-emitting element 13 and a portion of the base film 12, as shown in Fig. 3(E), and then proceeds to the next step SP6. In step SP6, the manufacturing peel-and-mount apparatus 80 forms a wiring portion 16 from a conductive material so as to overlap a portion of the light-emitting element 13, a portion of the insulating film 15, and a portion of the connection pad 14, as shown in Fig. 3(F), and then proceeds to the next step SP7. Incidentally, the manufacturing peel-and-mount apparatus 80 can use techniques such as photolithography and vapor deposition in steps SP5 and SP6.

[0045] 3(B), the manufacturing peel-and-mounting apparatus 80 forms a cover layer 17 of an organic material so as to cover the upper side of the base film 12, etc., to complete the composite film 2, and then proceeds to the next step SP8. At this time, the composite film 2 is attached to the support layer surface 11A of the support layer 11.

[0046] 4(A), the manufacturing peel-and-mounting apparatus 80 removes a portion of the support layer 11 to form a support gap SG, and then proceeds to the next step SP9. Specifically, the manufacturing peel-and-mounting apparatus 80 performs an etching process using a predetermined chemical solution to remove a portion of the support layer 11 near the outer periphery of the composite film 2 and outside of that, thereby forming the support gap SG.

[0047] In this way, the manufacturing peel-and-mount apparatus 80 can manufacture the electronic structure 1 through steps SP1 to SP8. Hereinafter, these steps will be referred to as a manufacturing process group Q1.

[0048] 4(B), the manufacturing peel-and-mount device 80 adsorbs a stamp 81 having an adsorption function onto the composite film surface 2A, and then proceeds to the next step SP10. Here, the electronic structure 1 adsorbed by the stamp 81 is roughly divided into four types of objects, namely, the formation substrate 10, the support layer 11, the composite film 2, and the stamp 81, which are stacked in order in the Z direction.

[0049] Of these, the magnitude of the adsorptive forces at three adjacent locations is different. As described above, a relatively large adsorptive force F10 acts between the formation substrate 10 and the support layer 11, both of which are inorganic materials. Furthermore, a relatively large adsorptive force F81 acts between the stamp 81 and the composite film surface 2A because the stamp 81 is in contact with the composite film surface 2A over almost the entire area.

[0050] On the other hand, a relatively small adsorptive force F11 acts between the support layer 11 made of an inorganic material and the base film 12 made of an organic material due to the relatively small area of ​​the support layer 11, the action of van der Waals forces, etc. In other words, the adsorptive force F11 is smaller than both the adsorptive force F10 and the adsorptive force F81.

[0051] In step SP10, the manufacturing peeling and mounting apparatus 80 displaces the stamp 81 in the Z direction while the formation substrate 10 is fixed by a predetermined fixing jig (not shown), and proceeds to the next step SP11. As a result, in the electronic structure 1 to which the stamp 81 is attached, the area with the weakest adhesive force, i.e., the base film 12 and the support layer 11, is peeled off, as shown in FIG. 4(C), and the composite film 2 is separated from the support layer 11 and the formation substrate 10.

[0052] The molecules of the base film 12 and the support layer 11 form a structure with sufficient strength. Therefore, in the composite film 2, a part of the base film 12 does not separate and remain on the support layer 11 side, and a part of the support layer 11 does not separate and remain attached to the base film 12 side, and the back surface 12B of the base film can be made extremely flat.

[0053] In this way, the manufacturing peeling and mounting apparatus 80 can peel the composite film 2 of the electronic structure 1 from the formation substrate 10 and the support layer 11 through steps SP9 and SP10. Hereinafter, these steps will be referred to as a peeling step group Q2.

[0054] In step SP11, the manufacturing peeling and mounting apparatus 80 displaces the stamp 81 as shown in FIG. 4(D) to position the composite film 2 above the wiring board 90 (on the Z direction side), and then proceeds to the next step SP12.

[0055] Here, wiring board 90 is separately manufactured as a circuit board mainly made of, for example, glass epoxy, and has mounting locations 91 where composite film 2 is to be mounted on wiring board surface 90A (hereinafter also referred to as wiring board surface), which is the surface on the Z direction side. Electrodes 92 are respectively arranged on mounting locations 91 at locations corresponding to each connection pad rear surface 14B on composite film rear surface 2B of composite film 2, and wiring patterns are appropriately formed using wiring material (not shown). Furthermore, wiring board surface 90A, which is the surface of wiring board 90, is formed extremely flat, with a surface roughness of 10 nm or less.

[0056] The manufacturing peeling and mounting device 80 appropriately moves the stamp 81 to position the rear surface 2B of the composite film at a location slightly away in the Z direction from the mounting location 91 on the surface 90A of the wiring board, and aligns the rear surface 14B of each connection pad with each electrode 92.

[0057] In step SP12, the manufacturing peeling and mounting apparatus 80 displaces the stamp 81 as shown in FIG. 4(E) to attach the composite film 2 to the wiring board 90, and then proceeds to the next step SP13.

[0058] Specifically, the manufacturing peel-and-mount device 80 first moves the stamp 81 in the -Z direction to bring the rear surface 2B of the composite film into contact with the mounting location 91 on the front surface 90A of the wiring board. This allows an intermolecular force to act between the composite film 2 and the wiring board 90, and the composite film 2 can be attached to the mounting location 91 of the wiring board 90.

[0059] At this time, both the rear surface 2B of the composite film 2 and the front surface 90A of the wiring board are extremely flat, and the entire area of ​​the rear surface 2B of the composite film 2 is in contact with the front surface 90A of the wiring board. Therefore, the suction force F90 acting between the composite film 2 and the wiring board 90 becomes relatively large and exceeds the suction force F81 of the stamp 81.

[0060] Thereafter, the manufacturing peel-and-mounting apparatus 80 moves the stamp 81 in the Z direction. At this time, the stamp 81 is pulled away from the composite film 2 because the suction force F81 is smaller than the suction force F90. As a result, the manufacturing peel-and-mounting apparatus 80 can attach the composite film back surface 2B of the composite film 2 to the wiring board front surface 90A of the wiring board 90, that is, mount the composite film 2 on the wiring board 90.

[0061] In this way, the manufacturing peel-and-mount apparatus 80 can mount the composite film 2 on the wiring substrate 90 through the processes of step SP11 and step SP12. Hereinafter, these processes will be referred to as a mounting process group Q3.

[0062] In step SP13, the manufacturing, peeling, and mounting apparatus 80 ends the manufacturing, peeling, and mounting processing procedure RT1. For ease of explanation, hereinafter, the manufacturing process group Q1 from step SP1 to step SP8, the peeling process group Q2 from step SP9 and step SP10, and the mounting process group Q3 from step SP11 and step SP12 are collectively referred to as the manufacturing, peeling, and mounting process group Q10.

[0063] Incidentally, the manufacturing process group Q1, peeling process group Q2, and mounting process group Q3 of the manufacturing peeling and mounting processing procedure RT1 have been described as being all performed by a single manufacturing peeling and mounting apparatus 80, i.e., the manufacturing of the electronic component 1 and the peeling and mounting of the composite film 2 are all performed.

[0064] However, in this embodiment, for example, the manufacturing process group Q1 can be performed by a predetermined manufacturing apparatus, and the peeling process group Q2 and the mounting process group Q3 can be performed by a mounting apparatus installed in a different location from the manufacturing apparatus. In this case, after the electronic structure 1 is completed by the manufacturing process group Q1, the electronic structure 1 can be transported from the manufacturing apparatus to the mounting apparatus.

[0065] [1-3. Effects, etc.] In the above-described configuration, the electronic structure 1 according to the first embodiment has the formation substrate 10 and support layer 11 laminated on the lower side made of inorganic materials, while the base film 12 and cover layer 17 of the composite film 2 laminated on the upper side made of organic materials. Furthermore, the electronic structure 1 is formed such that the outer shape of the support layer 11 is slightly smaller than the outer shape of the base film 12 (FIG. 1).

[0066] Therefore, in the electronic structure 1, the adhesive force acting between the rear surface 2B of the composite film and the front surface 11A of the support layer can be made smaller than the adhesive force at other locations. As a result, when a force is applied to the composite film 2 in a direction away from the formation substrate 10, the electronic structure 1 can easily separate and peel off the composite film 2 from the support layer 11 (FIGS. 4(B) and (C)).

[0067] In particular, the electronic structure 1 is made by sequentially laminating the formation substrate 10, support layer 11, and composite film 2, and then removing the outer periphery of the support layer 11 by etching, thereby adjusting the adhesive force acting between the composite film 2 and the support layer 11 ( FIG. 1(B) ). This allows the composite film 2 to be kept attached to the formation substrate 10 and support layer 11 during storage or transportation, and the rear surface 2B of the composite film can be kept smooth and not scratched. Meanwhile, when a stamp 81 is used, the electronic structure 1 allows the composite film 2 to be easily peeled from the formation substrate 10 and support layer 11, and the extremely smooth rear surface 2B of the composite film allows it to be attached to the wiring board 90 with ease.

[0068] Here, it is assumed that in a hypothetical electronic structure, the outer shape of support layer 11 is equal to or larger than the outer shape of composite film 2, and that an adhesive action occurs between support layer 11 and the entire area of ​​back surface 2B of the composite film. In this hypothetical electronic structure, if the area of ​​composite film 2 is relatively large due to the size of light-emitting element 13 or the like, the adhesive force acting on the entire composite film 2 may become excessive, and there is a risk that stamp 81 will not be able to peel composite film 2 from support layer 11.

[0069] In contrast, in the electronic structure 1 according to the present embodiment, the vicinity of the periphery of the support layer 11 is removed by etching, thereby reducing the contact area between the support layer 11 and the composite film 2 and intentionally reducing the suction force. Therefore, in the electronic structure 1, even if the area of ​​the light-emitting element 13, the connection pad 14, etc. is large and therefore the overall area of ​​the composite film 2 is also large, the magnitude of the suction force can be appropriately adjusted by appropriately reducing the area of ​​the support layer 11.

[0070] Furthermore, in the electronic structure 1, the base film 12 and cover layer 17 of the composite film 2, which will ultimately be required, are made of organic materials, while the formation substrate 10 and support layer 11, which will ultimately be unnecessary, are made of inorganic materials. Therefore, by using an appropriate etching solution in the etching process, the electronic structure 1 can remove the inorganic material without causing much damage to the organic material, i.e., it is possible to ensure the etching selectivity.

[0071] From another perspective, in the electronic structure 1, the organic material and the inorganic material are brought into contact with each other at the boundary between the support layer 11 and the base film 12, which will be peeled off in a later step, making the adhesive force between them relatively small. Therefore, in the electronic structure 1, in the peeling step group Q2 (FIGS. 2 and 4), simply by displacing the composite film front surface 2A away from the formation substrate 10, the support layer 11 and the base film 12 can be satisfactorily separated, and the composite film back surface 2B can be made extremely flat.

[0072] Furthermore, in the manufacturing process of the electronic structure 1, the surface of the formation substrate 10 is formed extremely smooth, and the support layer surface 11A of the support layer 11 superimposed on it is also formed extremely smooth, so that the base film back surface 12B of the base film 12 laminated on it is also formed extremely smooth.

[0073] That is, the rear surface 2B of the composite film 2 of the electronic structure 1 can be made extremely flat when the composite film 2 is peeled off from the formation substrate 10 and the support layer 11. As a result, the composite film 2 peeled off from the electronic structure 1 can generate a sufficiently large adsorptive force and obtain the necessary electrical continuity simply by being attached to the wiring board surface 90A of the wiring board 90.

[0074] Furthermore, in the manufacturing process, the composite film 2 is manufactured by sequentially laminating each portion on the surface of the formation substrate 10, which has been formed to be extremely flat (FIGS. 3 and 4). Therefore, the composite film 2 can be easily manufactured so that the rear surface 2B of the composite film is extremely flat, i.e., so that both the rear surface 12B of the base film and the rear surface 14B of the connection pads are extremely flat, without the need for a process for flattening the rear surface 2B of the composite film.

[0075] In other words, the electronic structure 1 can form an extremely smooth back surface 2B of the composite film through a much easier process than when an anchor is formed on the underside of the composite film and then removed to flatten it, as in Patent Document 1.

[0076] During the etching process of the electronic structure 1, the surfaces of the connection pads 14 exposed in the support gaps SG may react with the etching solution, resulting in the formation of irregularities (i.e., roughness). However, when the outer portions of the support layer 11 are removed by the etching process, the electronic structure 1 is designed so that at least a portion of the connection pads 14 remains in contact with the support layer 11 (see, for example, FIG. 1(B)). Therefore, when the composite film 2 is separated from the electronic structure 1, at least a portion of the connection pads 14 can be kept flat, allowing a sufficiently large suction force to act between the connection pads 14 and the electrodes 92 of the wiring board 90, ensuring good electrical conduction.

[0077] Furthermore, the connection pads 14 of the electronic structure 1 are made of a metal material that has an extremely low ionization tendency and is conductive, such as gold (Au) or platinum (Pt). Therefore, even if the etching solution comes into contact with the connection pads 14 during an etching process that removes a portion of the support layer 11, the electronic structure 1 can minimize the degree of damage to the surface and maintain good smoothness.

[0078] Adhesives are sometimes used to bond two objects together. Some adhesives utilize intermolecular forces to achieve adhesion. Generally, adhesives are liquid and are applied to the surfaces of the two objects to be bonded, and are then cured while sandwiched between them to form a bond. When using such adhesives, in order to separate the bonded objects, the cured adhesive must be physically destroyed, which can damage the objects.

[0079] Furthermore, in many cases where electrical connection is required, such as between electrodes on a wiring board and electrodes on a device, a eutectic alloy is formed between the electrodes by bump connection. In this case, it is possible to remove the bump connection by, for example, laser removal, but this will cause considerable damage, especially to the electrodes on the wiring board.

[0080] In contrast, in the present embodiment, such adhesive is not used, and physical and electrical bonding is achieved by directly contacting composite film back surface 2B of composite film 2 with wiring board front surface 90A of wiring board 90, and allowing intermolecular force to act directly between them. Therefore, in the present embodiment, if a defective portion is detected after composite film 2 is mounted on wiring board 90, composite film 2 can be peeled off extremely easily with almost no damage to wiring board 90, and a new composite film 2 can be attached to the same location.

[0081] According to the above configuration, in the electronic structure 1 according to the first embodiment, the formation substrate 10 and support layer 11 are made of inorganic materials, while the base film 12 and cover layer 17 of the composite film 2 are made of organic materials, and the outer shape of the support layer 11 is formed to be smaller than the outer shape of the base film 12. As a result, the adhesive force acting between the rear surface 2B of the composite film and the front surface 11A of the support layer of the electronic structure 1 can be appropriately adjusted so that they do not peel off during storage or transportation, and can be easily peeled off using a stamp 81 before mounting. As a result, the electronic structure 1 can be easily stored and transported while maintaining the smoothness of the rear surface 2B of the composite film, and the composite film 2 can also be easily peeled off from the support layer 11 and mounted on a wiring board 90.

[0082] 2. Second Embodiment [2-1. Configuration of electronic structure and composite film] 5(A), which corresponds to FIG. 1(A), is a schematic plan view showing the configuration of an electronic structure 201 and a composite film 202 according to a second embodiment. FIG. 5(B), which corresponds to FIG. 1(B), is a schematic cross-sectional view showing the B1-B2 cross section of FIG. 5(A). In this second embodiment, the X, Y, and Z directions are defined in the same manner as in the first embodiment.

[0083] The electronic structure 201 has a configuration in which a support layer 211 configured similarly to the support layer 11 is provided on a formation substrate 210 configured similarly to the formation substrate 10, and a composite film 202 is attached to the upper side of the support layer 211. The support layer surface 211A is formed to be extremely smooth, similar to the support layer surface 11A.

[0084] The composite film 202 has a configuration similar to that of the composite film 2 according to the first embodiment (FIG. 1, etc.). That is, the composite film 202 has light-emitting elements of three colors, red (R), green (G), and blue (B), arranged in sequence along the X direction, each connected to wiring members and connection terminals, and assembled into a single film-like package. Specifically, the composite film 202 is composed of light-emitting elements 213 (213R, 213G, and 213B), connection pads 214, an insulating film 215, a wiring portion 216, a cover layer 217, and a lower electrode 224.

[0085] The lower electrode 224 replaces the connection pads 14 provided on the Y-direction sides of the light-emitting elements 13 of each color in the first embodiment, and is made of the same material as the connection pads 14. A lower electrode back surface 224B, which is the back surface of this lower electrode 224, is in contact with the support layer front surface 211A and is formed in the shape of a thin plate in the Z direction. Furthermore, the portions of the lower electrode 224 corresponding to the light-emitting elements 213 of each color are interconnected along the X direction, forming an integrated shape.

[0086] The light-emitting elements 213 (213R, 213G, and 213B) are made of the same material as the light-emitting elements 13 (13R, 13G, and 13B) according to the first embodiment, but have a partially different shape. The light-emitting elements 213 are disposed on the Z-direction side of the lower electrode 224. The connection pads 214 are made of the same material as the connection pads 14 according to the first embodiment, but have a partially different shape. A connection pad back surface 214B, which is the back surface of the connection pad 214, is formed extremely smoothly, similar to the connection pad back surface 14B. Only one connection pad 214 is provided for each light-emitting element 213, on the -Y-direction side of the light-emitting element 213.

[0087] The insulating film 215 is made of the same material as the insulating film 15 according to the first embodiment, but its shape is partially different. Only one insulating film 215 is provided for each light-emitting element 213, on the -Y direction side of the light-emitting element 213. The wiring portion 216 is made of the same material as the wiring portion 16 according to the first embodiment, but its shape is partially different. Only one wiring portion 216 is provided for each light-emitting element 213, on the -Y direction side of the light-emitting element 213.

[0088] Cover layer 217 is made of the same material as cover layer 17 according to the first embodiment, but has a partially different shape. Cover layer 217 is also provided in a portion corresponding to base film 12 in the first embodiment. That is, in composite film 202, connection pad back surface 214B, lower electrode back surface 224B, and the back surface of cover layer 217 form composite film back surface 202B.

[0089] In the electronic structure 201, similarly to the electronic structure 1 according to the first embodiment, the outer shape of the support layer 11 is slightly smaller than the outer shape of the cover layer 217 (i.e., the outer shape of the composite film 202) in the X and Y directions.

[0090] [2-2. Manufacturing of electronic structures and peeling and mounting of composite films] Next, the manufacture of the electronic structure 201 and the peeling and mounting of the composite film 202 will be described with reference to FIGS. 6, 7, and 8, which correspond to FIGS. 2, 3, and 4, respectively. FIG. 6 is a flowchart showing the manufacturing, peeling, and mounting process steps involved in the manufacture of the electronic structure 201 and the peeling and mounting of the composite film 202. FIGS. 7 and 8 are schematic cross-sectional views showing the manufacturing process of the electronic structure 201 and the composite film 202 step by step. Here, as in the first embodiment, the Z direction side will also be referred to as "upper" and the -Z direction side will also be referred to as "lower."

[0091] As in the first embodiment, the electronic structure 201 is manufactured by a manufacturing peel-and-mounting apparatus 280, which replaces the manufacturing peel-and-mounting apparatus 80, by stacking layers in stages on a forming substrate 210 according to various processes similar to those used in manufacturing general semiconductors.

[0092] Specifically, when the manufacturing, peeling, and mounting apparatus 280 starts the manufacturing, peeling, and mounting processing procedure RT201 (FIG. 6), it proceeds to the first step SP201. In step SP201, the manufacturing, peeling, and mounting apparatus 280 forms a support layer 211 on the surface of the formation substrate 210, as in the first embodiment, as shown in FIG. 7(A), and then proceeds to the next step SP202.

[0093] 7(B), the manufacturing peel-and-mounting apparatus 280 forms the lower electrode 224, and then proceeds to the next step SP203. Specifically, the manufacturing peel-and-mounting apparatus 280 deposits a metal material such as gold (Au) or platinum (Pt) in a thin film by, for example, lithography and vapor deposition to form the lower electrode 224. At this time, the lower electrode back surface 224B of the lower electrode 224 is formed in contact (close contact) with the support layer front surface 211A, and is therefore formed extremely flat.

[0094] Thereafter, in steps SP203 to SP208, the manufacturing peel-and-mount apparatus 280 performs the same processes as steps SP3 to SP8 (FIG. 2), respectively, to manufacture the electronic structure 201 as shown in FIGS. 7(C) to 7(G) and 8(A). Hereinafter, these steps will be referred to as a manufacturing process group Q201.

[0095] 8(B), in step SP209, the manufacturing peel-and-mount apparatus 280 adsorbs the stamp 281 having an adsorption function onto the composite film surface 202A, as in step SP9 (FIG. 2), and proceeds to the next step SP210. Here, in the electronic structure 201 to which the stamp 281 is adsorbed, a force magnitude relationship is established among the four types of objects, namely, the formation substrate 210, the support layer 211, the composite film 202, and the stamp 281, which are stacked in order in the Z direction, as in the first embodiment.

[0096] That is, a relatively large adsorptive force F210 acts between the formation substrate 210 and the support layer 211, both of which are inorganic materials. Also, a relatively large adsorptive force F281 acts between the stamp 281 and the composite film surface 202A, since the stamp 281 is in contact with the composite film surface 202A over almost the entire area.

[0097] On the other hand, a relatively small adsorptive force F211 acts between the support layer 211 made of an inorganic material and the cover layer 217 made of an organic material due to the relatively small area of ​​the support layer 211, the action of van der Waals forces, etc. In other words, the adsorptive force F211 is smaller than both the adsorptive force F210 and the adsorptive force F281.

[0098] In step SP210, the manufacturing peeling and mounting apparatus 280 displaces the stamp 281 in the Z direction while the formation substrate 210 is fixed by a predetermined fixing jig (not shown), as in step SP10 (FIG. 2), and proceeds to the next step SP211. As a result, in the electronic structure 201 to which the stamp 281 is adsorbed, the portion with the weakest adsorption force, i.e., the cover layer 217 and the support layer 211, are peeled off, and the composite film 202 is separated from the support layer 211 and the formation substrate 210, as shown in FIG.

[0099] In this way, the manufacturing peeling and mounting apparatus 280 can peel the composite film 202 of the electronic structure 201 from the formation substrate 210 and the support layer 211 through the processes of step SP209 and step SP210, similarly to the first embodiment. Hereinafter, these processes will be referred to as a peeling process group Q202.

[0100] Next, in steps SP211 and SP212, the manufacturing peel-and-mount apparatus 280 performs the same processes as steps SP11 and SP12 (FIG. 2), respectively. As a result, as shown in FIGS. 8(D) and 8(E), the manufacturing peel-and-mount apparatus 280 attaches and mounts the composite film 202 to mounting locations 291 provided on the wiring board surface 290A of the wiring board 290, and then peels the stamp 281 away from the composite film 202. As a result, the composite film back surface 202B of the composite film 202 is attached to the mounting locations 291 on the wiring board surface 290A, and the connection pads 214 and the lower electrodes 224 are each electrically connected to the electrodes 292 of the wiring board 290. Hereinafter, these steps will be referred to as a mounting step group Q203.

[0101] In step SP213, the manufacturing, peeling, and mounting apparatus 280 ends the manufacturing, peeling, and mounting processing procedure RT201. For ease of explanation, the manufacturing process group Q201 from step SP201 to step SP208, the peeling process group Q202 from step SP209 and step SP210, and the mounting process group Q203 from step SP211 and step SP212 will hereinafter be collectively referred to as the manufacturing, peeling, and mounting process group Q210.

[0102] [2-3. Effects, etc.] In the above-described configuration, the electronic structure 201 according to the second embodiment has a formation substrate 210 and a support layer 211 laminated on the lower side made of inorganic materials, while the cover layer 217 of the composite film 202 laminated on the upper side made of organic material. In addition, the electronic structure 1 is formed such that the outer shape of the support layer 211 is slightly smaller than the outer shape of the cover layer 217 (FIG. 5).

[0103] Therefore, in the electronic structure 201, as in the first embodiment, the adhesive force acting between the composite film rear surface 202B and the support layer front surface 211A can be made smaller than the adhesive forces at other locations. As a result, when a force is applied to the composite film 202 in a direction away from the formation substrate 210, the electronic structure 201 can easily separate and peel off the composite film 202 from the support layer 211 (FIGS. 8(B) and (C)).

[0104] In particular, in the electronic structure 201, the light emitting element 213 is disposed above the lower electrode 224, and only one connection pad 214 is provided for each light emitting element 213. As a result, in the electronic structure 201, the area occupied by one composite film 202 on the XY plane can be reduced compared to the electronic structure 1 according to the first embodiment, and production efficiency can be improved.

[0105] In other respects as well, the electronic structure 201 according to the second embodiment can achieve the same effects as the first embodiment.

[0106] According to the above configuration, in the electronic structure 201 according to the second embodiment, the formation substrate 210 and the support layer 211 are made of inorganic materials, while the cover layer 217 of the composite film 202 is made of an organic material, and the outer shape of the support layer 211 is formed to be smaller than the outer shape of the cover layer 217. Therefore, in the electronic structure 201, the adhesive force acting between the rear surface 202B of the composite film and the front surface 211A of the support layer can be appropriately adjusted so that the electronic structure 201 does not peel during storage or transportation, and can be easily peeled using the stamp 281 before mounting. As a result, the electronic structure 201 can be easily stored and transported while maintaining the smoothness of the rear surface 202B of the composite film, and the composite film 202 can also be easily peeled from the support layer 211 and mounted on the wiring board 290.

[0107] 3. Third Embodiment Fig. 9(A) is a schematic plan view showing the configuration of an electronic structure 301 according to a third embodiment. Fig. 9(B) is a schematic cross-sectional view showing the C1-C2 cross section of Fig. 9(A). The electronic structure 301 has a configuration in which a plurality of support layers 311 are provided on a formation substrate 310, and a plurality of composite films 302 are respectively attached to the upper surfaces of the support layers 311.

[0108] The formation substrate 310 is similar to the formation substrate 210 in the second embodiment (FIG. 5, etc.) in that it is made of the same material and has an extremely smooth surface on the Z direction side. However, the formation substrate 310 is significantly larger than the formation substrate 210 in the X and Y directions.

[0109] A plurality of composite films 302 are arranged in a grid pattern along the X and Y directions on the upper side (Z direction side) of the formation substrate 310. The composite films 302 form a film gap FG at adjacent locations in the X and Y directions, and the distance between the film gaps FG is a distance d.

[0110] Each composite film 302 and each support layer 311 is configured in the same manner as the composite film 202 and support layer 211 according to the second embodiment. That is, composite film back surface 302B, which is the back surface of each composite film 302, and support layer front surface 311A ​​of support layer 311 are formed to be extremely flat. Furthermore, the outer shape of support layer 311 on the XY plane is slightly smaller than that of composite film 302. Therefore, a support gap SG is formed around support layer 311.

[0111] This electronic structure 301 is manufactured in multiple locations on the upper side of the formation substrate 310 through the same procedures as the manufacturing process group Q201 (FIGS. 6, 7, and 8) in the second embodiment, in parallel. At this time, the electronic structure 301 is manufactured in stages by a manufacturing, peel-and-mounting apparatus 380 (described in detail later) that replaces the manufacturing, peel-and-mounting apparatus 280.

[0112] Next, the manufacturing peeling and mounting apparatus 380 performs the same procedures as the peeling process group Q202 (Figures 6 and 8) in the second embodiment in parallel for each composite film 302 of the electronic structure 301, as shown in Figure 10(A) corresponding to Figure 8(C).

[0113] Specifically, the manufacturing peeling and mounting device 380 adsorbs each composite film 302 onto a stamp 381 and peels them in parallel from each support layer 311. At this time, each composite film 302 maintains a state of being aligned in a lattice pattern on the XY plane, and the distance between each composite film 302 is maintained at distance d.

[0114] 8(E) and corresponding to FIG. 10(B), the manufacturing, peeling, and mounting apparatus 380 then performs the same procedures as the mounting process group Q203 (FIGS. 6 and 8) in the second embodiment in parallel on each composite film 302. Specifically, the manufacturing, peeling, and mounting apparatus 380 attaches and mounts each composite film 302 to a plurality of mounting locations 391 provided on the wiring board surface 390A of the wiring board 390, and then peels the stamp 381 away from each composite film 302.

[0115] As a result, each composite film 302 has its rear surface 302B mounted on a mounting location 391 on the front surface 390A of the wiring board, and the connection pads 214 and the lower electrodes 224 are electrically connected to the electrodes 392 of the wiring board 390. At this time, the composite films 302 remain aligned in a grid pattern on the XY plane, and the distance between the composite films 302 remains at distance d. Incidentally, the wiring board 390 on which the composite films 302 are mounted is, for example, a display panel incorporated into an LED display device, and one composite film 302 corresponds to one pixel.

[0116] In the above configuration, electronic structure 301 according to the third embodiment has a plurality of support layers 311 and composite films 302 arranged in a grid pattern on the surface of formation substrate 310 (FIG. 9). Manufacturing peeling and mounting apparatus 380 adsorbs each composite film 302 onto stamp 381, peels them off simultaneously from each support layer 311, and attaches each composite film to each mounting location 391 on wiring substrate 390 (FIG. 10).

[0117] In other words, the electronic structure 301 allows multiple composite films 302 to be mounted on the wiring board 390 by performing only one peeling process and mounting process, thereby significantly improving work efficiency compared to the second embodiment.

[0118] Furthermore, the manufacturing peel-and-mounting device 380 adheres the multiple composite films 302 to the stamp 381, and maintains the arrangement of the composite films 302 until the composite films 302 are attached to the wiring substrate 390. That is, the composite films 302 are maintained in a grid-like arrangement, and the distance d between the composite films 302 is also maintained.

[0119] If the manufacturing, peeling, and mounting device uses stamp 281 (FIG. 8) according to the second embodiment, the device will repeatedly peel off each composite film 302 from formation substrate 310 one by one and attach it to mounting location 391 on wiring board 390. At this time, the manufacturing, peeling, and mounting device needs to align the position of composite film 302 with mounting location 391 on wiring board 390.

[0120] In particular, when wiring substrate 390 is a display panel and each composite film 302 represents one pixel, extremely high accuracy is required for alignment when mounting composite film 302. However, in the mounting process using a manufacturing peel-and-mount device, misalignment may occur, and alignment may take time.

[0121] In this regard, electronic structure 301 according to the present embodiment can appropriately set the positions of each composite film 302 and support layer 311 on formation substrate 310 in advance, in accordance with the arrangement and spacing of each mounting location 391 on wiring board 390. In other words, electronic structure 301 can optimize the spacing between each composite film 302 on formation substrate 310 using the positional accuracy of exposure processing or the like in the semiconductor manufacturing process, and can mount each composite film 302 on wiring board 390 while maintaining this spacing.

[0122] In other words, by using the stamp 381 (Figure 10) of the manufacturing peeling and mounting device 380, the electronic structure 301 can mount each composite film 302 to the wiring board 390 with extremely high positional accuracy in an extremely short time required for a single peeling and mounting process.

[0123] In other respects as well, the electronic structure 301 according to the third embodiment can achieve the same effects as the second embodiment.

[0124] According to the above configuration, electronic structure 301 according to the third embodiment is formed with a plurality of support layers 311 and composite films 302 aligned on formation substrate 310. Then, electronic structure 301 is peeled off by stamp 381 of manufacturing peel-and-mount device 380 while maintaining the mutual positional relationship of the plurality of composite films 302, and mounted on wiring substrate 390 while maintaining this positional relationship. This allows electronic structure 301 to be easily stored and transported while maintaining the smoothness of composite film rear surface 302B, and also allows the plurality of composite films 302 to be mounted on mounting locations 391 of wiring substrate 390 in a short time with high positional accuracy.

[0125] 4. Other Embodiments In the first embodiment described above, a silicon substrate made of silicon (Si), a glass substrate, a sapphire substrate, or the like is used as the formation substrate 10. However, the present invention is not limited to this, and substrates made of various other inorganic materials may also be used as the formation substrate 10. In this case, it is sufficient that the surface of the formation substrate 10 is formed extremely smooth, for example, with a surface roughness of 10 nm or less. The same applies to the second and third embodiments.

[0126] In the first embodiment described above, the support layer 11 is described as being formed as an oxide or nitride film made of silicon oxide (SiO2) or silicon nitride (SiN). However, the present invention is not limited to this, and the support layer 11 may be formed as a thin film made of various oxides, nitrides, or other inorganic materials. In this case, it is sufficient that the support layer surface 11A can be formed extremely smooth and that a portion of it can be removed by etching in step SP8 of the manufacturing peel-and-mount process procedure RT1 (FIG. 2) to form the support gap SG. The same applies to the second and third embodiments.

[0127] Furthermore, in the first embodiment described above, the length of each side of the composite film 2 along the X and Y directions is approximately 30 to 50 μm, and the outer shape of the support layer 11 is positioned approximately 5 μm inward from the outer shape of the composite film 2. However, the present invention is not limited to this, and various other sizes may be used, for example, the length of each side of the composite film 2 along the X and Y directions is approximately 1 to 2 mm, and the outer shape of the support layer 11 may be positioned approximately 20 μm inward from the outer shape of the composite film 2. The same applies to the second and third embodiments.

[0128] Furthermore, in the first embodiment described above, the connection pads 14 are described as being made of gold (Au) or platinum (Pt). However, the present invention is not limited to this. For example, the connection pads 14 may be made of a conductive metal material such as copper (Cu) or aluminum (Al), or an alloy of multiple materials. In these cases, it is desirable to select an etching solution that minimizes damage to the surfaces of the connection pads 14 in step SP8 of the manufacturing peel-mounting process procedure RT1 (FIG. 2). The same applies to the connection pads 214 and lower electrodes 224 in the second embodiment, and also to the third embodiment.

[0129] Furthermore, in the first embodiment described above, the base film 12 and cover layer 17 of the composite film 2 are made of an organic material, the support layer 11 is made of an inorganic material, and a portion of the support layer 11 is removed by etching. However, the present invention is not limited to this, and for example, the composite film may be protected by an inorganic material, the support layer may be made of an organic material, and a portion of the support layer may be removed by etching.

[0130] Specifically, an electronic structure 401 can be configured as shown in FIG. 11, which corresponds to FIG. 5(B). This electronic structure 401 has a configuration in which a formation substrate 410, a support layer 411, and a composite film 402 are sequentially laminated. The formation substrate 410 is made of an inorganic material similar to that of the formation substrate 210. The support layer 411 is made of an organic material such as polyimide resin. The composite film 402 is mostly configured similarly to the composite film 202, except that the outer periphery of the cover layer 217 is covered with a protective film 431 made of an inorganic material. In the etching process of the electronic structure 401, a support gap SG can be formed by removing a portion of the support layer 411 using an etchant that is highly reactive to organic materials but less reactive to inorganic materials.

[0131] Furthermore, in the first embodiment described above, the base film 12 is described as being made solely of an organic material such as polyimide resin. However, the present invention is not limited to this. For example, the base film 12 may be made of a mixed material containing an organic material as the main component and an inorganic filler, etc., for the purpose of improving various properties. In this case, the ratio of inorganic material to organic material is preferably about 10% or less by volume. The same applies to the cover layer 17. Furthermore, the support layer 11 and the formation substrate 10 may be made solely of an inorganic material, or may be made of a mixed material containing an inorganic material as the main component and an organic filler, etc., in addition to being made solely of an inorganic material. The same applies to the second and third embodiments.

[0132] Furthermore, in the first embodiment described above, the formation substrate 10 is described as being made solely of inorganic materials. However, the present invention is not limited to this. For example, various processing treatments, such as coating, may be applied to the surface of the inorganic material to improve various properties, such as smoothness. Furthermore, the formation substrate 10 may have a multi-layer structure in which multiple types of materials are appropriately laminated, rather than a single-layer structure made of one type of material. Alternatively, various processing treatments may be applied to the surfaces of organic materials, such as the base film 12 and the cover layer 17. The same applies to the second and third embodiments.

[0133] Furthermore, in the first embodiment described above, a liquid etching solution is used to remove a portion of the support layer 11 in step SP8 of the manufacturing peel-and-mount processing procedure RT1 (FIG. 2). However, the present invention is not limited to this, and a gaseous etching gas may be used to remove a portion of the support layer 11. The same applies to the second and third embodiments.

[0134] Furthermore, in the first embodiment described above, the composite film 2 is provided with three light-emitting elements 13, each emitting a different light color. However, the present invention is not limited to this, and for example, the composite film 2 may be provided with two or fewer or four or more light-emitting elements 13. In this case, the light-emitting elements may emit different light colors, or at least some of them may emit the same light color. Furthermore, the arrangement of the light-emitting elements 13 is not limited to a straight line along the X direction, and various arrangements may be used. The same applies to the second and third embodiments.

[0135] Furthermore, in the first embodiment described above, the case where light-emitting elements 13 (i.e., LEDs) are provided on the composite film 2 has been described. However, the present invention is not limited to this, and the composite film 2 may be provided with various elements having various electronic functions, such as resistors, capacitors, or electronic elements such as light-receiving elements, piezoelectric elements, and various sensor elements, or semiconductor elements such as transistors and ICs (Integrated Circuits). In this case, multiple electronic elements may be provided on one composite film 2, and electronic elements of the same or different types may be appropriately combined. The same applies to the second and third embodiments.

[0136] Furthermore, in the first embodiment described above, a case has been described in which two connection pads 14 correspond to one light emitting element 13 in the composite film 2. Furthermore, in the second embodiment, a case has been described in which one connection pad 14 and one lower electrode 224 correspond to one light emitting element 213, and three light emitting elements 213 correspond to one lower electrode 224. However, the present invention is not limited to this, and one electronic element may correspond to any number of connection pads and lower electrodes.

[0137] Furthermore, in the first embodiment described above, the wiring board 90 is a circuit board mainly made of glass epoxy. However, the present invention is not limited to this, and various circuit boards, such as a film-like flexible circuit board, may be used as the wiring board 90. In this case, it is sufficient that the surface of the circuit board is formed extremely smooth so that the composite film 2 can be adsorbed. The same applies to the second and third embodiments.

[0138] Furthermore, in the first embodiment described above, the suction force F81 acting on the composite film 2 of the stamp 81 is constant. Then, this suction force F81 is set to be greater than the suction force F11 in step SP9 (FIG. 4B) and less than the suction force F90 in step SP12 (FIG. 4E) of the manufacturing peel-and-mount procedure RT1 (FIG. 2). However, the present invention is not limited to this. For example, the magnitude of the suction force F81 of the stamp 81 may be variable. In this case, for example, the suction force F81 may be increased in step SP9 and decreased in step SP12. This significantly relaxes the constraints on the suction forces that the support layer 11 and the composite film 2 must satisfy, thereby increasing the degree of design freedom. The same applies to the second and third embodiments.

[0139] Furthermore, in the third embodiment described above, the composite films 302 in the electronic structure 301 are arranged in a grid pattern on the XY plane (FIG. 9). However, the present invention is not limited to this, and the composite films 302 may be arranged in various patterns, such as a staggered pattern. The key is that each composite film 302 is arranged at a position corresponding to each mounting location 391 on the wiring board 390.

[0140] Furthermore, in the third embodiment described above, the spacing between adjacent composite films 302 is set to distance d in both the X and Y directions. However, the present invention is not limited to this. For example, the spacing in the X direction and the spacing in the Y direction may be different, or composite films 302 may be arranged at irregular intervals. In this case, too, it is essential that each composite film 302 is arranged at a position corresponding to each mounting location 391 on wiring board 390.

[0141] Furthermore, the present invention is not limited to the above-described embodiments and other embodiments, and the scope of application of the present invention extends to embodiments in which the above-described embodiments and other embodiments are combined in part or in whole, or in which only a part of the above-described embodiments is extracted.

[0142] Furthermore, in the above-described embodiment, the electronic structure 1 is configured as an electronic structure using the formation substrate 10 as a substrate, the composite film 2 as a functional unit, and the support layer 11 as a support layer. However, the present invention is not limited to this, and the electronic structure may be configured using a substrate, a functional unit, and a support layer having various other configurations. [Industrial Applicability]

[0143] The present invention can be used, for example, when manufacturing a display panel to be incorporated into an LED display device. [Explanation of symbols]

[0144] 1, 201, 301...Electronic structure, 2, 202, 302...Composite film, 2A, 202A...Composite film surface, 2B, 202B, 302B...Composite film back surface, 10, 210, 310...Formed substrate, 10A...Formed substrate surface, 11, 211, 311...Support layer, 11A, 211A, 311A...Support layer surface, 12...Base film, 12B...Base film back surface, 13, 213...Light emitting element, 14, 214...Connection pad, 14B, 214B...Connection pad back surface, 17, 217...Cover layer, 80, 280, 380...Manufacturing peel-and-mount device Placement, 81, 281, 381...Stamp, 90, 290, 390...Wiring board, 90A, 290A, 390A...Surface of wiring board, 91, 291, 391...Mounting location, 92, 292, 392...Electrode, 224...Lower electrode, 224B...Back side of lower electrode, F10, F11, F81, F90, F210, F211, F281...Adsorption force, FG...Film gap, SG...Support gap, d...Distance, Q1, Q201...Manufacturing process group, Q2, Q202...Peeling process group, Q3, Q203...Mounting process group, Q10, Q210...Manufacturing peeling and mounting process group.

Claims

1. a substrate having a first surface; a functional unit including a functional part having an electronic function and a protective member for protecting the functional part, the functional unit having a second surface formed on the first surface side; a support layer provided at a position in contact with the first surface, the support layer having a third surface in contact with the second surface of the functional unit, the area of ​​the third surface being smaller than the area of ​​the second surface; and At least a portion of the protection member of the functional unit that forms the second surface contains an organic material as a main component, At least a portion of the support layer that forms the third surface contains an inorganic material as a main component, At least the portion of the substrate that forms the first surface is made of an inorganic material as a main component. An electronic structure comprising:

2. At least a portion of the protective member that forms the second surface is made of resin, At least a portion of the support layer that forms the third surface is made of an oxide or a nitride.

2. The electronic structure of claim 1.

3. At least a portion of the protection member that forms the second surface is made of polyimide, At least a portion of the support layer that forms the third surface is made of silicon oxide.

3. The electronic structure according to claim 1 or claim 2.

4. the functional unit has a functional element and a conductive member, the conductive member has a fourth surface that forms a part of the second surface; The third surface of the support layer contacts at least a portion of the fourth surface.

4. The electronic structure according to claim 1, wherein the first and second electrodes are electrically connected to each other.

5. The functional element is electrically connected to the conductive member by a conductive wiring member.

5. The electronic structure of claim 4.

6. The conductive member is a metal film.

5. The electronic structure of claim 4.

7. The metal film is made of gold, platinum, or an alloy containing at least one of these metals.

7. The electronic structure of claim 6.

8. a base film that is part of the protective member and forms part of the second surface; Further comprising: the functional unit has a functional element, The functional element is provided on a surface of the base film opposite to the second surface.

8. The electronic structure according to claim 1, wherein the first and second electrodes are electrically connected to each other.

9. the functional unit has a functional element and a conductive member, the conductive member forms a portion of the second surface; The functional element is provided on a surface of the conductive member opposite to the second surface.

9. The electronic structure according to claim 1, wherein the first and second electrodes are electrically connected to each other.

10. a plurality of functional units are arranged at positions facing the first surface of the substrate, The support layer is provided at a position corresponding to each of the functional units on the first surface of the substrate.

10. The electronic structure according to claim 1.

11. a substrate having a first surface; a functional unit including a functional element having an electronic function and a protective member for protecting the functional element, the functional unit having a second surface formed on the first surface side; a support layer provided at a position in contact with the first surface, the support layer having a third surface in contact with the second surface of the functional unit, the third surface having an area smaller than an area of ​​the second surface; a base film that is part of the protective member and forms part of the second surface; and one of a portion of the protective member of the functional unit that forms at least the second surface and a portion of the support layer that forms at least the third surface is made of an organic material as a main component, and the other is made of an inorganic material as a main component; The functional element is provided on a surface of the base film opposite to the second surface. An electronic structure comprising:

12. The functional unit has a conductive member, the conductive member has a fourth surface that forms a part of the second surface; The third surface of the support layer contacts at least a portion of the fourth surface.

12. The electronic structure of claim 11.

13. The functional element is electrically connected to the conductive member by a conductive wiring member.

13. The electronic structure of claim 12.

14. a first step of forming a support layer having a third surface on a first surface of a substrate having a first surface; a second step of forming, on the support layer, a functional unit having a functional part having an electronic function and a protective member for protecting the functional part, the functional unit having a second surface formed on the third surface side; a third step of removing a portion of the support layer and making the area of ​​the third surface in contact with the functional unit in the remaining portion of the support layer smaller than the area of ​​the second surface; a fourth step of applying a force to the functional unit in a direction away from the substrate to peel the second surface of the functional unit from the third surface of the support layer; and One of the portion of the protective member of the functional unit that forms at least the second surface and the portion of the support layer that forms at least the third surface is made of an organic material as a main component, and the other is made of an inorganic material as a main component. A method for manufacturing an electronic circuit, comprising:

15. a fifth step of, after the fourth step, abutting the second surface of the functional unit against a wiring first surface of a wiring board and attaching the functional unit to the wiring board; 15. The method of claim 14, further comprising:

16. In an electronic structure having a support layer formed on a substrate having a first surface and a functional unit formed on the support layer, a step of applying a force to the functional unit in a direction away from the substrate to peel the functional unit from the support layer. and the functional unit has a functional part having an electronic function and a protective member for protecting the functional part, and a second surface is formed on the first surface side; the support layer is provided at a position in contact with the first surface and has a third surface in contact with the second surface of the functional unit, the area of ​​the third surface being smaller than the area of ​​the second surface; One of the portion of the protective member of the functional unit that forms at least the second surface and the portion of the support layer that forms at least the third surface is made of an organic material as a main component, and the other is made of an inorganic material as a main component. A method for manufacturing an electronic circuit, comprising:

17. bonding the second surface of the functional unit peeled off from the support layer to a wiring substrate; 17. The method of claim 16, further comprising:

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